JP2015014803A - Aspherical-lensed cap, manufacturing method therefor, and manufacturing method for light source module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a situation in which an electrode cannot be placed on a flange portion of a cap as intended due to manufacturing error of the cap.SOLUTION: A method of manufacturing a conductive aspherical-lensed cap 10 to be fixed on a mounting circuit board 1 is disclosed. The cap 10 includes a main body portion 11 and a flange portion 12 extending in a direction away from the main body portion 11 from a base end which is continuous with the main body portion 11. The flange portion 12 is tabular, has a flat upper surface 12a, and is provided with a recess formed in the vicinity of a boundary between the upper surface 12a of the flange portion and an outer peripheral surface of the main body part 11. The manufacturing method includes a machining process for integrally producing the main body portion 11 and the flange portion 12 by processing a base material, which is a stainless steel, using machining blades, and a step for mounting an aspherical lens 20 on the cap 10.

Description

  The present invention relates to a cap with an aspheric lens, a method for manufacturing a cap with an aspheric lens, and a method for manufacturing a light source module.

  In recent years, optical technology has been utilized in a wide range of fields as represented by optical communication. Typical key devices included in the category of optical technology are semiconductor optical elements such as semiconductor laser elements and semiconductor light receiving elements.

  Patent Document 1 discloses a structure for efficiently diffusing heat generated in a semiconductor laser element. In Patent Document 1, in order to improve the life characteristics of a semiconductor laser device, the semiconductor laser device is mounted on a mounting substrate and then hermetically sealed with a cap to protect the semiconductor laser device from the outside.

  There are various methods for fixing the cap on the mounting substrate. One of them is a method called resistance welding. When resistance welding is employed, the mounting substrate and the cap positioned with respect to each other are sandwiched between a pair of electrodes, and in this state, the electrodes are energized to join the cap to the mounting substrate. Since the cap is a cylindrical body, there is a method in which a flange is provided on the cap, the flange and the mounting substrate are sandwiched between a pair of electrodes, and the cap and the mounting substrate are energized in this state. It is common.

JP 2007-48938 A

  By the way, when the cap is fixed to the mounting substrate by resistance welding, it is important to arrange the electrodes as intended on the flange portion of the cap (this significance is more apparent from the description in the embodiment). Become).

  A cap for holding a high-performance lens is often manufactured by cutting. However, particularly in mass production, it may be difficult to bring out the outer shape of the cap as intended due to wear of the processing blade according to use. More specifically, the outer shape of the cap varies between caps due to wear of the cutting blade.

  When the outer shape of the cap becomes unintended as described above, the electrode cannot be arranged as intended on the collar of the cap even if the cap is fixed on the mounting board during resistance welding. (For example, there may be a comparative example shown in FIG. 5 described later).

  As described above, due to the manufacturing error of the cap (variation in the outer shape of the cap), the electrode may not be arranged as intended on the collar portion of the cap.

  The present invention has been made to solve such a problem, and it is possible to prevent the electrode from being arranged as intended on the collar portion of the cap due to a manufacturing error of the cap. Objective.

  A manufacturing method of a cap with an aspheric lens according to a first aspect of the present invention is a manufacturing method of a cap with an aspheric lens that is fixed to a mounting substrate, the cap comprising: a main body; A flange extending from a base end connected to the main body in a direction away from the main body, the flange is plate-shaped, and the upper surface side is a plane, and the upper surface side of the flange A recess is formed in the vicinity of the boundary of the outer peripheral surface of the main body, and a cutting process of processing a base material made of stainless steel with a cutting blade to manufacture the main body and the flange as a unit, and an aspherical surface Providing a lens on the cap.

  The method of manufacturing the light source module according to the second aspect of the present invention includes: a semiconductor optical device; a mounting substrate on which the semiconductor optical device is mounted; and the semiconductor optical device fixed to the mounting substrate. And a non-spherical lens held directly or indirectly by the cap, wherein the cap is separated from the main body and the main body. Extending from the base end connected to the main body in the direction, the flange is plate-shaped, the upper surface is a flat surface, and the electrode is placed on the flange when resistance welding is performed. A recess is formed in the vicinity of the boundary between the upper surface side of the flange portion and the outer peripheral surface of the main body, and a base material made of stainless steel is processed by a cutting blade, and the main body And the heel part as a unit A light source comprising: a cutting step; a step of providing the aspheric lens on the cap; and a step of sandwiching the mounting surface of the flange portion and the mounting substrate with electrodes and fixing the cap to the mounting substrate by resistance welding. Module manufacturing method.

  A cap with an aspheric lens according to a third aspect of the present invention is provided with a lens comprising a conductive cap fixed to a mounting substrate and an aspheric lens held directly or indirectly by the cap. A cap including a main body and a flange extending from a base end connected to the main body in a direction away from the main body, the flange being plate-shaped, It is a flat surface, and a recess is formed in the vicinity of the boundary between the upper surface side of the flange portion and the outer peripheral surface of the main body, and the main body and the flange portion are formed by cutting a metal base material integrally. , Cap with aspheric lens.

  By forming a recess in the vicinity of the boundary between the mounting surface and the outer peripheral surface, it is possible to prevent the electrode from being arranged as intended on the collar portion of the cap due to a manufacturing error.

  According to the present invention, it is possible to prevent the electrode from being arranged as intended on the collar portion of the cap due to a manufacturing error of the cap.

1 is a schematic diagram showing a schematic cross-sectional configuration of an optical communication module according to a first embodiment of the present invention. It is the schematic schematic diagram which looked at the light source module concerning the 1st Embodiment of this invention. It is a schematic diagram which shows schematic sectional structure of the cap concerning the 1st Embodiment of this invention. It is a schematic process drawing which shows the manufacturing method of the light source module concerning the 1st Embodiment of this invention. It is a schematic process drawing which shows the manufacturing method of the light source module concerning the 1st Embodiment of this invention. It is explanatory drawing for demonstrating the comparative example concerning the 1st Embodiment of this invention. It is a schematic diagram which shows schematic sectional structure of the cylinder concerning the 2nd Embodiment of this invention. It is a schematic diagram which shows schematic sectional structure of the cylinder concerning the 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each embodiment is simplified for convenience of explanation. Since the drawings are simple, the technical scope of the present invention should not be interpreted narrowly based on the drawings. The drawings are only for explaining the technical matters, and do not reflect the exact sizes or the like of the elements shown in the drawings. The same elements are denoted by the same reference numerals, and redundant description is omitted. Words indicating directions such as up, down, left, and right are used on the assumption that the drawing is viewed from the front.

[First Embodiment]
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic diagram illustrating a schematic cross-sectional configuration of an optical communication module. FIG. 2 is a schematic schematic view of the light source module in perspective. FIG. 3 is a schematic diagram showing a schematic cross-sectional configuration of the cap. 4A and 4B are schematic process diagrams showing a method for manufacturing a light source module. FIG. 5 is an explanatory diagram for explaining a comparative example.

  As shown in FIG. 1, the optical communication module 100 includes a connector 30, an isolator 31, an optical fiber 32, and a light source module (optical module) 50. The light source module 50 includes a mounting substrate 1, lead pins 2, a pedestal 3, a semiconductor laser element (semiconductor optical element) 4, a semiconductor light receiving element (semiconductor optical element) 5, a cap 10, a lens (optical component) 20, and a sealing glass 25. Have The cap 10 holding the lens 20 may be referred to as a lens unit (optical unit).

  The optical communication module 100 causes the laser light output from the semiconductor laser element 4 to be input to the core 32 a of the optical fiber 32 via the lens 20. The optical communication module 100 modulates and drives the semiconductor laser element 4 and inputs an optical signal corresponding to an electrical signal transmitted from the outside to the optical fiber 32.

  An optical path extending along the axis AX (equal to the optical axis AX of the lens 20) is formed between the semiconductor laser element 4 and the optical fiber 32. The light emitted from the semiconductor laser element 4 propagates forward along the axis AX, is subjected to the lens action by the lens 20, passes through the isolator 31, and is optically coupled to the core 32 a of the optical fiber 32. The optical fiber 32 is a linear body extending along the y-axis, and has a structure in which a core 32a is surrounded by a clad 32b. The refractive index of the core 32a is higher than the refractive index of the clad 32b. As a result, the light input to the optical fiber 32 propagates through the core 32a while being confined in the core 32a.

  The light source module 50 is attached to the optical fiber 32 via the connector 30. The light source module 50 outputs light that is optically coupled to the core 32 a of the optical fiber 32.

  Hereinafter, a more specific description will be given with reference to FIGS. 1 to 3.

  The mounting substrate 1 is a plate-like member made of metal (for example, copper). An electrode is disposed on the back surface of the mounting substrate 1 during resistance welding. The conductive material forming the mounting substrate 1 is different from the conductive material forming the cap 10. In other words, the resistance value of the conductive material forming the mounting substrate 1 is different from the resistance value of the conductive material forming the cap 10. A pedestal 3, a semiconductor laser element 4, and a semiconductor light receiving element 5 are mounted on the mounting substrate 1.

  The lead pin 2 is a rod-shaped member made of metal. The lead pins 2 are inserted into through holes formed in the mounting substrate 1 and are held by the mounting substrate 1 in a state of being electrically insulated from the mounting substrate 1 by an insulating material (soft glass or the like).

  The semiconductor laser element 4 is fixed to the base 3. The pedestal 3 may be a metal like the mounting substrate 1 or may be another material. The pedestal 3 may be integrally formed with the mounting substrate 1.

  The semiconductor laser element 4 is a chip-shaped semiconductor optical element formed by stacking semiconductor layers. The semiconductor laser element 4 outputs a laser beam having a predetermined wavelength according to the drive current. The type of the semiconductor laser element 4 is arbitrary. The semiconductor laser element 4 may be a surface emitting laser element or an edge emitting laser element.

  The semiconductor light receiving element 5 is a chip-shaped semiconductor optical element that generates an amount of current corresponding to the amount of incident light. The semiconductor light receiving element 5 receives light leaking from the reflection end of the active layer of the semiconductor laser element 4. The driving state of the semiconductor laser element 4 can be controlled according to the output from the semiconductor light receiving element 5.

  The semiconductor laser element 4 is connected to the lead pin 2 via a bonding wire. Similarly, the semiconductor light receiving element 5 is also connected to the lead pin 2 via a bonding wire. Here, two lead pins 2 are prepared for the semiconductor laser element 4, and two lead pins 2 are prepared for the semiconductor light receiving element 5. The semiconductor laser element 4 and the semiconductor light receiving element 5 are electrically insulated from the mounting substrate 1.

  The cap 10 is fixed on the mounting substrate 1 by resistance welding. The cap 10 is manufactured by processing a base material made of stainless steel (SUS) with a cutting blade. By manufacturing the cap 10 by cutting, higher processing accuracy of the cap 10 can be maintained as compared with the case of press processing. This is particularly advantageous when the aspheric lens is held by the cap 10. In addition, you may manufacture the cap 10 by the press work of an iron nickel alloy.

  The cap 10 has a cylinder part 11 and a flange part 12. The cylinder portion 11 extends along the axis AX and surrounds an optical path along the axis AX. The outer peripheral surface of the cylinder part 11 is substantially flat. On the other hand, the inner peripheral surface of the cylinder part 11 is non-flat according to the change in the thickness of the cylinder part 11.

  As for the cylinder part 11, thickness changes to thickness W1-W5 toward a base end from a top end. Due to the difference between the wall thickness W2 and the wall thickness W3, an arrangement surface 13 on which the lens 20 is arranged is formed on the inner peripheral surface of the cylindrical portion 11.

  The wall thickness W4 increases as it approaches the front. The inner peripheral surface of the cylindrical portion 11 having the wall thickness W4 is inclined inward as it approaches the front. In other words, the cylindrical portion 11 is formed with an inclined surface 14 that is inclined inward as it approaches the front.

  In addition, the injection | pouring space of the sealing glass 25 can be suitably ensured with the difference of thickness W1 and thickness W2. Further, the cap 10 is very thin (thickness W5 = about 200 μm).

  The flange portion 12 extends outward from the base end connected to the tube portion 11. The flange portion 12 is a plate-like portion having a back surface disposed opposite to the upper surface of the mounting substrate 1 and a front surface opposite to the back surface. Moreover, the top view shape of the collar part 12 is a ring shape. In addition, in the state of FIG. 1, the collar part 12 is the state joined to the mounting substrate 1, and it is difficult to visually recognize the back surface from the outside.

  In the present embodiment, a groove (depression) 15 is formed in the vicinity of the boundary between the cylindrical portion 11 and the flange portion 12. Accordingly, it is possible to prevent the electrode from being arranged as intended on the flange 12 of the cap 10 during resistance welding due to a manufacturing error of the cap 10. This point will become clear from the following description.

  The depth D of the groove 15 is preferably 0 <D <100 μm. The depth D of the groove 15 is preferably 0 <D <10 μm. That is, 0% <thickness W5 / depth D of groove 15 <50% is satisfied, and 0% <thickness W5 / depth of groove D <10% is further satisfied. The thickness of the cap 10 is preferably kept at least about 100 μm. Therefore, when W5 = 200 μm, the relief machining depth is preferably about 100 μm. About processing length, what is necessary is just to be about 200 micrometers at maximum.

  The lens 20 is a flat aspheric lens, and lens portions 22 are formed on both surfaces of the flat plate portion 21. The lens surface of each lens unit 22 is an aspherical surface. The lens 20 is completely housed inside the cap 10. The material of the lens 20 may be resin or glass.

  The lens 20 arranged on the arrangement surface 13 is fixed to the cap 10 by filling the space formed by the side surface of the lens 20 and the inner peripheral surface of the cylindrical portion 11 with a low melting point glass (fixing means) 25. Is done. By mounting the lens 20 in the cap 10, the space in which the semiconductor laser element 4 is disposed is closed. As described above, the cap 10 is manufactured by cutting a base material. Therefore, the lens 20 can be positioned with respect to the cap 10 with relatively high accuracy.

  FIG. 2 is a schematic view of the light source module 50 in perspective. In the light source module 50, the shape of the cap 10 viewed from above is circular. The top view shape of the cylinder part 11 is circular. The top view shape of the collar part 12 is a ring shape. The groove 15 extends so as to draw a circle. The top view shape of the mounting substrate 1 is also circular.

  FIG. 3 shows the cap 10 before being fixed to the mounting substrate 1 by resistance welding.

  As shown in FIG. 3, the protrusion 16 is formed in the back surface 12b of the collar part 12 before resistance welding. The protrusion 16 is formed in a range over the entire circumference of the cap 10. The rear view shape of the protrusion 16 is a ring shape. The slope forming the protrusion 16 is connected to the side surface of the flange 12. By providing the protrusions 16 in this manner, the cap 10 can be fixed onto the mounting substrate 1 while ensuring sufficient joint strength and airtightness during resistance welding. It should be noted that the hermetic sealing can suppress the characteristic deterioration of the semiconductor laser element 4.

  The protrusion 16 is melted by a large current that flows during resistance welding. Therefore, after resistance welding, the protrusion 16 does not remain on the back surface 12b of the flange 12 as shown in FIG. By setting the height and width of the protrusions 16 to desired values, it is possible to suitably hermetically seal during resistance welding.

  As shown in FIG. 3, the groove 15 is located at the boundary between the cylindrical portion 11 (the outer peripheral surface 11 a of the cylindrical portion 11) and the flange portion 12 (the upper surface 12 a of the flange portion 12). In other words, the groove 15 is formed between the outer peripheral surface 11 a of the cylindrical portion 11 and the upper surface 12 a of the flange portion 12. In other words, the upper surface 12 a is connected to the outer peripheral surface 11 a via the groove 15.

  The groove 15 is formed by partially cutting the outer peripheral surface 11 a of the cylindrical portion 11, and extends in a ring shape along the circumferential direction of the cylindrical portion 11.

  The cross-sectional view shape of the exposed surface 15a formed by cutting the outer peripheral surface 11a is C-shaped. The exposed surface 15a is formed with an R surface (Ru surface) that is inclined downward toward the outside and has an outer end connected to the upper surface 12a. Here, the R surface is not formed outside the imaginary line obtained by extending the outer peripheral surface 11a downward. In addition, since an electrode is mounted on the upper surface 12a of the collar part 12, this may be called a mounting surface.

  A method for manufacturing the light source module 50 will be described with reference to FIGS. 4A and 4B.

  First, as shown in FIG. 4A (a), a cap 10 is manufactured by processing a base material made of stainless steel with a cutting blade. Here, the outer peripheral surface 11a of the cylindrical portion 11 is surfaced using a common cutting blade, the base material is cut to the inner side of the outer peripheral surface 11a as the reference surface, and the groove 15 is formed. The upper surface 12a of 12 is surfaced. Thus, the outer peripheral surface 11a, the groove | channel 15, and the upper surface 12a are continuously formed by the common cutting blade. According to this manufacturing method, the mass productivity of the cap 10 can be improved.

  Next, as shown in FIG. 4A (b), the lens 20 is attached to the cap 10. Then, the sealing glass 25 is filled and the lens 20 is fixed to the cap 10. The lens 20 may be fixed to the cap 10 by fitting the lens 20 to the cap 10.

  Next, as shown in FIG. 4B (c), the cap 10 is placed on the mounting substrate 1 on which the semiconductor laser element 4 and the like are mounted in advance. In this state, alignment is performed, and the cap 10 is positioned with respect to the mounting substrate 1. It is assumed that the semiconductor laser element 4 and the like are mounted on the mounting substrate 1 in advance by a normal assembly technique (so-called post-process).

  Next, as shown in FIG. 4B (d), the stacked mounting substrate 1 and the cap 10 are sandwiched between the upper electrode 40 and the lower electrode 41 between the flange portions 12 of the cap 10. A current is passed between the upper electrode 40 and the lower electrode 41 while pressing the upper electrode 40 downward. In this way, the cap 10 is fixed to the mounting substrate 1.

  As described above, in this embodiment, the groove 15 is formed in the vicinity of the boundary between the cylindrical portion 11 and the flange portion 12 (see FIG. 3). As a result, it is possible to prevent the electrode 40 from being arranged as intended on the flange 12 of the cap 10 during resistance welding due to a manufacturing error of the cap 10.

  In order to understand the above-described effect more specifically, it will be further described with reference to the comparative example of FIGS. In the comparative example shown in FIG. 5, the groove 15 is not formed in the vicinity of the boundary between the cylindrical portion 11 and the flange portion 12. In this case, as schematically shown in FIG. 5, the upper electrode 40 may not be arranged as intended on the upper surface 12 a of the flange 12.

  Since the cap 10 is manufactured by cutting, an error may be included in the manufacture of the cap 10 due to wear of a cutting blade (cutting tool) or the like. Here, in the process of chamfering the outer peripheral surface 11a of the cylindrical portion 11 and the upper surface 12a of the flange portion 12 with a common cutting blade, an R surface (R-shaped surface) 17 is formed therebetween. From the examination by the present inventors, it has become clear that various problems are caused by the formation of the R surface 17.

  As a first problem, when the upper electrode 40 cannot be placed on the upper surface 12a of the flange 12 by the R surface 17, resistance welding is performed from the upper electrode 40 to the cap 10 through a contact having a very small area. Need to flow.

  Thus, when the contact area of the upper electrode 40 with respect to the cap 10 cannot be secured sufficiently, the oxidation rate of the surface of the upper electrode 40 is faster than when the contact area of the upper electrode 40 with respect to the cap 10 can be secured sufficiently. I'm stuck. When the oxidation of the surface of the upper electrode 40 progresses, it is necessary to increase the electrical conductivity of the upper electrode 40 by frequently polishing the surface of the upper electrode 40 or the like.

  As a second problem, if resistance welding is performed while the upper electrode 40 cannot be placed on the upper surface 12 a of the flange 12 by the R surface 17, the force pressed from the upper electrode 40 to the R surface 17 is also applied to the cylindrical portion 11. There is a possibility that the holding state of the lens 20 changes. If the holding state of the lens 20 changes between the individual light source modules 50, the characteristics vary among the individual light source modules 50, and the uniform characteristics cannot be maintained. Specifically, the focal length and the optical coupling rate with respect to the optical fiber vary among the individual light source modules 50.

  As a third problem, if resistance welding is performed while the upper electrode 40 cannot be placed on the upper surface 12a of the flange portion 12 by the R surface 17, the airtightness due to the hermetic sealing of the cap 10 with respect to the mounting substrate 1 deteriorates. There is a risk that. This is considered to be because a sufficient current does not flow to the tip of the collar portion 12.

  In the present embodiment, as described above, the groove 15 is formed in the vicinity of the boundary between the cylindrical portion 11 and the flange portion 12. Accordingly, it is possible to prevent the electrode from being arranged as intended on the flange 12 of the cap 10 during resistance welding due to a manufacturing error of the cap 10. And it can suppress effectively that each above-mentioned problem arises.

  Specifically, an increase in labor required for maintenance of the upper electrode 40 can be suppressed. It has been confirmed that the number of times of resistance welding until the surface of the electrode needs to be polished is about three times that of the prior art. In addition, it is possible to prevent the characteristics of the light source modules 50 from becoming uneven due to variations in characteristics among the individual light source modules 50. In addition, it is possible to suppress the deterioration of the airtightness of the semiconductor laser element 4 due to the cap 10.

[Second Embodiment]
A second embodiment of the present invention will be described with reference to FIG. FIG. 6 is a schematic diagram showing a schematic cross-sectional configuration of the cylindrical body.

  In the present embodiment, the depth of the groove 15 is different from that of the first embodiment. Even in such a case, the same effect as the first embodiment can be obtained. An R surface is formed on the outer side of the imaginary line obtained by extending the outer peripheral surface 11a downward. Even in this case, since the protrusion amount of the R surface is reduced by the groove 15, the same effect as that of the first embodiment can be obtained.

[Third Embodiment]
A third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a partially enlarged view of the groove 15 of the cylindrical body. In addition to the case shown in FIG. 7A, a groove 15 may be formed as shown in FIG. Even in such a case, the same effect as that of the above-described embodiment can be obtained. In the case of FIG. 7B, the groove 15 extends downward when the paper surface is viewed from the front.

  The technical scope of the present invention should not be limited to the above-described embodiment. The cap may be manufactured by a method other than cutting. The lens is not limited to an aspheric lens. The lens may be formed integrally with the cap. Surface processing (C surface processing or the like) may be performed on the lower corner of the electrode used during resistance welding. The semiconductor optical element housed in the cap is not limited to the semiconductor laser element. The mounting board does not need to be conductive as a whole. A mounting substrate may be formed by forming a conductive layer on the surface of the insulating substrate.

DESCRIPTION OF SYMBOLS 100 Optical communication module 50 Light source module 1 Mounting board 2 Lead pin 3 Base 3 4th semiconductor laser element 5 Semiconductor light receiving element 10 Cap 11 Cylindrical part 11a Outer peripheral surface 12 Gutter part 12a Upper surface 13 Arrangement surface 14 Inclined surface 15 Groove 15a Exposed surface 16 Protrusion 20 lens 21 flat plate part 22 lens part 25 sealing glass 30 connector 31 isolator 32 optical fiber 40 upper electrode 41 lower electrode

Claims (13)

A method of manufacturing a cap with a conductive aspheric lens fixed to a mounting substrate,
The cap is
The main body,
A flange extending from a base end connected to the main body in a direction away from the main body,
With
The collar portion is plate-shaped, and the upper surface side is a plane,
A depression is formed in the vicinity of the boundary between the upper surface side of the flange and the outer peripheral surface of the main body,
Cutting a base material made of stainless steel with a cutting blade, and manufacturing the main body part and the flange part integrally;
Providing the cap with an aspheric lens;
A method for manufacturing a cap with an aspheric lens.   The method for producing a cap with an aspheric lens according to claim 1, wherein the recess is provided in the main body.   The method for manufacturing a cap with an aspheric lens according to claim 1, wherein an arrangement surface for arranging the aspheric lens is formed inside the main body of the cap in the cutting step. .   4. The method for manufacturing a cap with an aspheric lens according to claim 1, wherein in the cutting step, a protrusion is formed on a back side of the upper surface of the flange portion. 5.   2. The depth of the depression is D, and the thickness of the portion of the main body where the depression is formed is W5. 0% <D / W5 × 100% <50%. The manufacturing method of the cap with an aspherical lens as described in any one of thru | or 4.   6. The method for manufacturing a cap with an aspheric lens according to claim 1, wherein a length in which the depression is formed is 200 μm or less.   7. The method for manufacturing a cap with an aspheric lens according to claim 1, wherein 0 <D <100 μm when the depth D of the depression is set. The cutting step includes a step of chamfering the outer peripheral surface of the main body, a step of cutting the base material to the inside of the outer peripheral surface as a reference surface to form the depression, and the upper surface of the flange portion Chamfering, and
The method of manufacturing a cap with an aspheric lens according to any one of claims 1 to 7, wherein each step performs cutting using a common cutting blade. A semiconductor optical device;
A mounting substrate on which the semiconductor optical element is mounted;
A conductive cap fixed to the mounting substrate and containing the semiconductor optical element;
An aspheric lens held directly or indirectly by the cap;
A light source module manufacturing method comprising:
The cap is
The main body,
A flange extending from a base end connected to the main body in a direction away from the main body,
With
The collar portion is plate-shaped, and the upper surface side is a plane,
A depression is formed in the vicinity of the boundary between the upper surface side of the flange and the outer peripheral surface of the main body,
Cutting a base material made of stainless steel with a cutting blade, and manufacturing the main body part and the flange part integrally;
Providing the aspheric lens on the cap;
Sandwiching the upper surface of the flange and the mounting substrate with electrodes, and fixing the cap to the mounting substrate by resistance welding; and
A method of manufacturing a light source module.   The method for manufacturing a light source module according to claim 9, wherein the recess is provided in the main body.   2. The depth of the depression is D, and the thickness of the portion of the main body where the depression is formed is W5. 0% <D / W5 × 100% <50%. The manufacturing method of the cap with an aspherical lens as described in any one of thru | or 4. A conductive cap fixed to the mounting substrate;
An aspheric lens held directly or indirectly by the cap;
A cap with a lens comprising:
The cap is
The body,
A flange extending from a base end connected to the main body in a direction away from the main body,
With
The collar portion is plate-shaped, and the upper surface side is a plane,
A recess is formed in the vicinity of the boundary between the upper surface side of the flange and the outer peripheral surface of the main body,
The main body and the flange portion are formed by cutting a metal base material as a unit,
Cap with aspheric lens.   The depth of the depression is D, and the thickness of the portion of the main body where the depression is formed is W5, and 0% <D / W5 × 100% <50%. A cap with an aspheric lens described in 1.

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