JP2015012210A - Component holding mechanism, mounting circuit board and measuring apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve thinning when superposing a plurality of mounting circuit boards.SOLUTION: A component holding mechanism including the holding parts 31a, 31b for holding the tip 21b of the body 21 of a resistor 2, and supports 32a, 32b for supporting the resistor 2 projecting from the lower surface 1b of a substrate 1 by inserting the bottom 21a side into the opening 13 of the substrate 1, and configured to hold the resistor 2. The support 32a, 32b is constituted to include a first member 51 stretched at the edge of the opening 13, a second member 52 coupled with the first member 51 so as to project from the lower surface 1b of the substrate 1, a third member 53 capable of fixing the terminal 22 by projecting from the tip of the second member 52 so as to form an L-shape along with the second member 52, a fourth member 54 projecting from the first member 51 in a direction opposite from the second member 52, and a fifth member 55 projecting from the tip of the fourth member 54 in the same direction as the third member 53 and to which the holding parts 31a, 31b are attached.

Description

  The present invention relates to a component holding mechanism that holds an electronic component mounted on a substrate, a mounting substrate that includes the component holding mechanism, and a measurement apparatus that includes the mounting substrate.

  An input circuit incorporated in a voltage measuring device or the like that measures a high voltage is configured to include a resistor having a high resistance value for dividing the input high voltage. In this case, in this type of input circuit having a high resistance value, the frequency characteristics tend to deteriorate in the high frequency band. For this reason, for example, as disclosed in Japanese Patent Application Laid-Open No. 4-276561, a capacitor is connected in parallel with a resistor to prevent a decrease in frequency characteristics in a high frequency band.

  In this case, it is necessary to use a high-voltage capacitor that can withstand the high voltage for this type of input circuit that inputs a high voltage, but there are few types of high-voltage capacitors that are available in the market, and a desired capacitance. In addition to the difficulty of looking for capacitors, such capacitors are generally expensive. For this reason, this type of input circuit employs a configuration in which two metal plates processed into an arbitrary shape (size) are used as electrodes, and a capacitor in which air between the metal plates is a dielectric is incorporated. There is. When this configuration is adopted, the size and shape of the metal plate used as the electrode can be arbitrarily selected, so that the capacity of the capacitor can be easily defined to a desired capacity.

  On the other hand, as shown in FIG. 11, the high-resistance resistor (resistor 300 shown in FIG. 11) is generally formed in a rectangular plate shape, and the main surface (surface having the largest area) is the substrate 400. It is mounted on the substrate 400 in a posture that makes a right angle (or almost a right angle) with respect to the terminal 400, and a terminal (not shown) disposed at the base end is inserted into the substrate 400 and fixed. In this case, in the above configuration using the capacitor formed of the metal plate, the capacitance between the resistor disposed inside the resistor 300 and the metal plate is changed by a slight change in the posture of the resistor 300, The frequency characteristics of the input circuit change. Therefore, the applicant has developed a component holding mechanism that fixes the resistor 300 using a fixing member 500 disposed on the substrate 400 as shown in FIG. The fixing member 500 of this component holding mechanism is formed by injection molding of resin, has a side wall that surrounds the resistor 300, is formed in a frame shape, and has a fitting portion 501 on the side wall. The resistor 300 is configured to hold the resistance by fitting the side portion of the resistor 300 to the fitting portion 501.

Japanese Patent Laid-Open No. 4-276561 (2nd page, FIG. 1)

  However, the above-described component holding mechanism developed by the applicant has the following problems to be improved. In other words, the component holding mechanism is configured to hold the resistor mounted on the board with the fixing member disposed on the board. On the other hand, a mounting board configured such that electronic components such as resistors are held by such a component holding mechanism is often arranged so as to overlap a plurality of voltage measuring devices and the like, which reduces the size of the voltage measuring device. Therefore, it is indispensable to reduce the thickness when a plurality of mounting substrates are stacked (thinning). In this case, since the resistance having a high resistance value is relatively large, when such a resistance is erected on the substrate in a posture in which the main surface is perpendicular to the substrate and is held by the component holding mechanism, The height of resistance increases. For this reason, the conventional component holding mechanism has a problem that it is difficult to cope with the thinning when a plurality of mounting boards manufactured by using this component holding mechanism are stacked, and improvement thereof is desired. ing.

  The present invention has been made in view of such a problem, and a main object of the present invention is to provide a component holding mechanism, a mounting board, and a measuring apparatus that can realize a reduction in thickness when a plurality of mounting boards are stacked.

  In order to achieve the above object, a component holding mechanism according to claim 1 is a component holding mechanism that has a main body portion and a terminal disposed on the bottom side of the main body portion and holds an electronic component mounted on a substrate. And supporting the electronic component in a state in which the bottom side is inserted into an opening formed in the substrate and the bottom side protrudes from the lower surface of the substrate, and holds the tip portion of the main body. A support portion that supports the sandwiching portion, and the support portion includes a first member that spans an edge of the opening on the upper surface of the substrate, and the first member that protrudes from the lower surface of the substrate. A second member connected to one member, and a third member capable of fixing the terminal by being connected to the second member so as to project from the tip of the second member and form an L shape with the second member And the first member is opposite to the second member A fourth member connected to the first member so as to protrude, and the clamping portion attached to the fourth member so as to protrude in the same direction as the third member from the tip of the fourth member. And a fifth member.

  The component holding mechanism according to claim 2 is the component holding mechanism according to claim 1, further comprising a pair of the clamping portions each formed of a conductive material, and any one of the clamping portions includes: The electronic component is connected to one of a high potential and a low potential to which the terminal is connected, and the other of the sandwiching portions is connected to the other of the high potential and the low potential.

  The component holding mechanism according to claim 3 is the component holding mechanism according to claim 1 or 2, wherein the support portion is made of a conductive material.

  According to a fourth aspect of the present invention, there is provided the component holding mechanism according to any one of the first to third aspects, wherein the holding portion is formed with a resistor in the body portion of the resistor as the electronic component. Clamp only the part excluding the part.

  A mounting board according to a fifth aspect includes the component holding mechanism according to any one of the first to third aspects, the board on which the opening is formed, and the electronic component mounted on the board. ing.

  A mounting board according to claim 6 includes the component holding mechanism according to claim 4, the board in which the opening is formed, and the resistor as the electronic component mounted on the board, As for the resistance, a resistor is disposed only in a portion excluding a portion corresponding to a holding region held by the holding portion.

  According to a seventh aspect of the present invention, a measuring apparatus includes the mounting substrate according to the fifth or sixth aspect, and measures a measured amount.

  In the component holding mechanism according to claim 1, the mounting substrate according to claim 5, and the measuring device according to claim 7, the first member that spans the edge of the opening of the substrate and the lower surface of the substrate protrude. The second member, the third member that protrudes from the tip of the second member so as to form an L shape together with the second member, and the terminal of the electronic component can be fixed, and the first member to the second member are in opposite directions The support portion is configured by including a fourth member that protrudes and a fifth member that protrudes from the tip of the fourth member in the same direction as the third member and to which the clamping portion is attached. For this reason, according to the component holding mechanism, the mounting substrate, and the measuring apparatus, the electronic component can be reliably held in a state where the bottom side of the main body is inserted into the opening and the bottom side protrudes from the lower surface of the substrate. As a result, in the component holding mechanism and the mounting substrate, the height from the upper surface to the tip of the main body is sufficiently low as compared with the configuration in which the main body is erected on the upper surface of the substrate and the electronic component is fixed. be able to. Therefore, according to the component holding mechanism, the mounting substrate, and the measuring apparatus, for example, the interval between the substrates when a plurality of mounting substrates using the component holding mechanism are stacked one above the other can be reduced. Thinning when a plurality of layers are stacked can be realized with certainty. In addition, according to the component holding mechanism, the mounting substrate, and the measuring device, the holding portion supported by the support portion holds the tip portion of the main body portion, whereby the electronic component is held by the fixing member that supports the side portion of the electronic component. Unlike the holding configuration, even if the type of resistor used is changed and the size (width) of the resistor is changed, the electronic component is securely held regardless of the width of the resistor. Can do.

  Moreover, according to the component holding mechanism according to claim 2, the mounting substrate according to claim 5, and the measuring device according to claim 7, one of the pair of sandwiching portions formed of a conductive material is used as a terminal of an electronic component. By connecting one of the high and low potentials to each other, and connecting the other of the holding parts to the other of the high and low potentials, each holding part is present between them. It can be made to function as a capacitor connected in parallel to the electronic component together with the insulating material (insulating material constituting the main body portion of the electronic component), and each clamping portion can be capacitively coupled to the resistor of the electronic component it can. That is, in the component holding mechanism and the mounting board, the holding portion for holding the electronic component can function as an electrode of a capacitor for adjusting frequency characteristics. Therefore, according to the component holding mechanism, the mounting board, and the measuring apparatus, it is possible to eliminate the need for a dedicated metal plate that functions as an electrode of the frequency characteristic adjusting capacitor, and to fix such a dedicated metal plate. Since the fixing member can be omitted, the manufacturing cost can be sufficiently reduced. In addition, in the conventional configuration in which the metal plate that functions as the electrode of the capacitor is fitted and held in the fixing member, it is difficult to change the size and shape of the metal plate unless the fixing member is remade. In this component holding mechanism and mounting board that do not require such a fixing member, there are few restrictions when changing the size of the clamping part, and therefore the frequency characteristic can be easily adjusted by arbitrarily changing the size of the clamping part. Can be done. In addition, by forming the sandwiching portion using a highly heat-conductive material (for example, brass) as a conductive material, the sandwiching portion can function as a heat sink, so that the heat generated by the electronic component is efficiently Heat can be released.

  Further, according to the component holding mechanism according to claim 3, the mounting substrate according to claim 5, and the measuring device according to claim 7, the support portion is formed of a conductive material, so that no wiring is used. Since each terminal of the electronic component can be connected to the connected portion via the support portion, and the holding portion can be connected to a potential to which each terminal of the electronic component is connected without using wiring, the configuration of the mounting substrate It can be simplified.

  According to the component holding mechanism according to claim 4, the mounting substrate according to claim 6, and the measuring device according to claim 7, the sandwiching portion is formed as a resistor in the main body portion of the resistor as an electronic component. By sandwiching only the portion excluding the portion where the resistor is present, the stray capacitance between the sandwiching portion and the resistor can be reduced as compared with the configuration in which the portion where the resistor is formed is sandwiched. Therefore, according to the component holding mechanism, the mounting board, and the measuring device, for example, it is possible to prevent a decrease in amplitude in the high frequency band when measuring the measured amount of the measurement target signal. Can be possible.

  Further, according to the mounting board according to claim 6 and the measuring apparatus according to claim 7, the resistance as an electronic component in which the resistor is disposed only in a portion excluding the portion corresponding to the sandwiching region sandwiched by the sandwiching portion. By using this, it is possible to ensure a holding area of an appropriate size that can be securely held, and to measure the measured amount in a wide band while reliably holding the resistance.

2 is a perspective view illustrating configurations of a voltage measuring device 10 and a mounting substrate 100. FIG. It is a perspective view of the mounting substrate 100 in a state where the component holding mechanism 3 and the shield plate 4 are disassembled. 3 is a perspective view showing a configuration of a component holding mechanism 3. FIG. FIG. 2 is a cross-sectional view taken along the X plane in FIG. FIG. 3 is a circuit diagram of a voltage measurement circuit including a resistor 2. It is explanatory drawing explaining the holding | maintenance state of the resistance 2 by the components holding mechanism 3. FIG. FIG. 5 is a first explanatory view illustrating the method for manufacturing the mounting substrate 100. FIG. 10 is a second explanatory diagram explaining the method for manufacturing the mounting substrate 100. FIG. 10 is a third explanatory diagram explaining the method of manufacturing the mounting substrate 100. It is explanatory drawing explaining the usage pattern of the mounting substrate. It is a perspective view which shows the structure of the conventional component holding mechanism.

  Hereinafter, embodiments of a component holding mechanism, a mounting board, and a measuring device will be described with reference to the accompanying drawings.

  First, the configuration of the voltage measuring device 10 shown in FIG. 1 will be described. The voltage measuring device 10 is an example of a measuring device, and includes a mounting substrate 100 so that a voltage (an example of a measured amount) can be measured. The mounting substrate 100 is an example of a mounting substrate, and includes a substrate 1, a resistor 2 (an example of an electronic component), a component holding mechanism 3, and a shield plate 4, as shown in FIGS. The mounting substrate 100 includes various electronic components and mechanical components in addition to the above-described components. However, in order to facilitate understanding of the invention, FIG. 2 shows other components other than these components. The illustration is omitted.

  As shown in FIGS. 1 and 2, the substrate 1 is configured so that a resistor 2 and various electronic components (not shown), a component holding mechanism 3 and a shield plate 4 can be mounted (attached). 1 and 2, only a part of the substrate 1 is shown. Specifically, as shown in FIGS. 2 and 4, the substrate 1 is inserted through a bottom 21 a side of a main body 21 (described later) in the resistor 2, and the bottom 21 a is protruded downward from the lower surface 1 b of the substrate 1. An opening 13 is formed. In this case, the opening 13 has a longer side longer than the length of the main body 21 of the resistor 2, and a shorter side with support parts 32 a and 32 b (to be described later) in the component holding mechanism 3 (hereinafter referred to as “support part 32” when not distinguished). Are formed in a rectangular shape that is longer than the width of the second member 52 and the third member 53.

  In addition, as shown in FIGS. 2 to 4, the substrate 1 is formed with an insertion hole 12 b through which a fixing claw 61 provided at a lower end portion of a first member 51 (described later) constituting the support portion 32 is inserted. ing. Further, the board 1 is inserted through a fixing claw 81 provided at a base end portion of side walls 71a to 71d (to be referred to as “side wall 71” hereinafter when not distinguished) constituting the shield plate 4. A hole 12c is formed.

  In addition, as shown in FIG. 2, a plurality of conductor patterns 11 are formed on the substrate 1. In the figure, only a part of the conductor pattern 11 is shown. In this case, the base end portion of the first member 51 and the base end portion of the side wall 71 are connected to these conductor patterns 11.

  The resistor 2 is, for example, a resistor having a high resistance value (as an example, about several MΩ) arranged in the voltage measuring circuit as shown in FIG. 5, and as shown in FIGS. And a plurality (two in this example) of terminals 22 disposed on the bottom 21 a of the main body 21. The main body 21 is formed in a plate shape in which main surfaces Sa (surfaces having the largest area) facing each other form a rectangle, and a resistor 23 is disposed therein. In addition, the resistor 2 has a main body 21 erected with respect to the substrate 1 in a state where each main surface Sa is at a right angle (or almost at a right angle) with respect to the surface of the substrate 1 and the length of the main surface Sa. Substrate 1 via component holding mechanism 3 (in a state of being held by component holding mechanism 3) in a horizontally long posture in which the side is parallel to the surface of substrate 1 (hereinafter, this posture is also referred to as “mounting posture”). To be implemented. The resistor 2 is mounted on the substrate 1 such that the bottom 21 a side of the main body 21 is inserted into the opening 13 formed in the substrate 1 and the bottom 21 a protrudes downward from the lower surface 1 b of the substrate 1.

  Each terminal 22 of the resistor 2 is connected to a later-described third member 53 constituting the support portion 32 and connected (fixed) to the conductor pattern 11 of the substrate 1 through each support portion 32. In this case, as shown in FIG. 5, one terminal 22 is connected to a Hi-side input terminal for inputting a signal under measurement via the support portion 32 and the conductor pattern 11, and the other terminal 22 is connected to the support portion 32. And connected to the non-inverting input side of the operational amplifier via the conductor pattern 11.

  Further, as shown in FIG. 6, the resistor 2 is provided only in a portion excluding a region (hereinafter also referred to as “clamping region Sb”: see the same figure) sandwiched by a clamping unit 31 described later on each main surface Sa. Is arranged. That is, in this resistor 2, as shown in the figure, the resistor 23 is arranged so as to be unevenly distributed on the bottom 21a side, and the resistor 23 is arranged on the tip 21b side (the side opposite to the bottom 21a side). The part which is not provided is provided.

  The component holding mechanism 3 is a mechanism for holding the resistor 2 in the mounting posture described above (maintaining the mounting posture) and mounting it on the substrate 1, as shown in FIGS. 31 b (hereinafter also referred to as “clamping portion 31” when not distinguished) and two support portions 32 a and 32 b are provided.

  As shown in FIG. 3, the sandwiching portion 31 includes two sandwiching pieces 41, is fixed to a later-described fifth member 55 that constitutes the support portion 32, and is supported by the support portion 32. Moreover, the clamping part 31 is formed with the highly heat-conductive material (for example, brass) which has electroconductivity.

  As shown in FIGS. 4 and 6, the sandwiching portion 31 sandwiches the distal end portion 21 b side of the main body portion 21 with the sandwiching pieces 41 coming into contact with the sandwiching region Sb on the distal end portion 21 b side of each main surface Sa of the resistor 2. It is configured to be possible. In this case, as described above, the main body 21 of the resistor 2 is formed with the resistor 23 only in the portion excluding the sandwiching region Sb. For this reason, the clamping part 31 clamps only the site | part except the site | part in which the resistor 23 in the main-body part 21 is formed.

  The support portions 32a and 32b are inserted into the opening 13 formed in the substrate 1 on the bottom 21a side so that the bottom 21a portion faces downward from the lower surface 1b of the substrate 1 (from the lower surface 1b toward the lower surface 1b toward the lower surface 1b of the substrate 1). It is configured to be able to support the sandwiching portion 31 while supporting the resistor 2 in a state of protruding in the separating direction. Specifically, as shown in FIG. 3, the support portions 32 a and 32 b include a first member 51, a second member 52, a third member 53, a fourth member 54, and a fifth member 55, respectively. Yes.

  Moreover, the support part 32 is formed with the highly heat-conductive material (for example, brass) which has electroconductivity. Moreover, in this support part 32, each member 51-55 is integrally formed by performing the punching process and bending process with respect to one board | plate material (brass board) as an example.

  As shown in FIGS. 3 and 4, the first member 51 is formed in a rectangular plate shape and spans the edge of the opening 13 in the upper surface 1 a of the substrate 1. A fixing claw 61 is formed at the lower end of the first member 51, and the first member 51 is attached to the substrate 1 by inserting the claw 61 through the insertion hole 12 b formed in the substrate 1. It is done. Further, the base end portion of the first member 51 of the support portion 32 a is connected to the conductor pattern 11 formed on the substrate 1, and a Hi-side input terminal (high height) for inputting a signal to be measured through the conductor pattern 11. Potential). Further, the base end portion of the first member 51 of the support portion 32b is connected to the conductor pattern 11 formed on the substrate 1, and is connected to the non-inverting input side (low potential) of the operational amplifier via this conductor pattern 11. Is done.

  As shown in FIGS. 3, 4, and 6, the second member 52 is formed in a rectangular plate shape, and is connected to the first member 51 so as to protrude downward from the lower surface 1 b of the substrate 1. The third member 53 is formed in a rectangular plate shape, and protrudes from the distal end portion of the second member 52 along a direction perpendicular to the second member 52 (that is, L together with the second member 52). It is connected to the second member 52 (in the form of a letter). Further, the third member 53 is formed with an insertion hole 62 through which the terminal 22 of the resistor 2 can be inserted and fixed, and a slit 63 connecting the distal end portion of the third member 53 and the insertion hole 62. In this case, one terminal 22 of the resistor 2 is inserted and fixed to each third member 53 of the support portions 32a and 32b.

  As shown in FIG. 3, the fourth member 54 is formed in a rectangular plate shape, and is connected to the first member 51 so as to protrude upward from the first member 51 (opposite to the second member 52). ing. The fifth member 55 is formed in a rectangular plate shape as shown in FIGS. 3 and 6, along a direction perpendicular to the fourth member 54 (parallel to the third member 53 and the third member). The fourth member 54 is connected to the fourth member 54 so as to protrude from the tip of the fourth member 54 (in the same direction as 53). Further, the sandwiching portion 31a is attached to the fifth member 55 of the support portion 32a, and the sandwiching portion 31b is attached to the fifth member 55 of the support portion 32b.

  In this component holding mechanism 3, as shown in FIG. 6, the tip portions of the third members 53 and the tip portions of the fifth members 55 in the support portions 32 are in a state where the resistance 2 is held. The members 51 to 55 are arranged so as to be opposed to each other and located outside the main body 21 when the main surface Sa of the main body 21 of the resistor 2 is viewed from the front.

  Moreover, in this component holding mechanism 3, the clamping part 31a attached to the fifth member 55 of the clamping part 31a is connected to one terminal 22 in the resistor 2 via the support part 32a, and the fifth member of the clamping part 31b. The clamping part 31b attached to 55 is connected to the other terminal 22 in the resistor 2 via the support part 32b. For this reason, in this component holding mechanism 3, as shown in FIG. 5, the sandwiching portions 31 a and 31 b are connected to the resistor 2 together with the insulating material existing between them (the insulating material constituting the main body portion 21 of the resistor 2). Functions as a capacitor connected in parallel. Further, as shown in FIG. 6, each sandwiching portion 31 a, 31 b is capacitively coupled to the resistor 23 of the resistor 2.

  As illustrated in FIG. 2, the shield plate 4 includes side walls 71 a to 71 d and a top plate 72 each formed of a conductive material (for example, brass). In this case, the side walls 71 are integrally formed. Further, as shown in FIGS. 2 and 4, each side wall 71 is configured to be able to stand (attach) to the substrate 1 so as to surround the mounted resistance 2 and the component holding mechanism 3. In this case, a fixing claw 81 is formed at the base end portion of each side wall 71, and each side wall 71 is attached to the substrate 1 by inserting the claw 81 through the insertion hole 12 c formed in the substrate 1. It is done. Each side wall 71 has a base end connected to a reference potential conductor pattern 11 formed on the substrate 1 and is connected to the reference potential via the conductor pattern 11. Further, as shown in FIG. 2, the distal ends of the side walls 71b and 71d are provided with a bent portion formed by bending a part of the distal end portion inward, and a screw hole is formed in the bent portion. .

  The top plate 72 is formed in a rectangular shape as shown in FIG. 2 and is disposed on the tip end side of each side wall 71 as shown in FIG. 4 and is screwed to each side wall 71 (the side walls 71b and 71d). It is fixed to the bent portion provided at the front end portion and is electrically connected to each side wall 71.

  Next, a method for manufacturing the mounting substrate 100 will be described with reference to the drawings, focusing on a method for mounting (attaching) the resistor 2, the component holding mechanism 3 and the shield plate 4 to the substrate 1.

  First, the resistor 2 is held by the component holding mechanism 3. Specifically, as shown in FIG. 7, the tip 21 b of the main body 21 in the resistor 2 is fitted into the gap between the two clamping pieces 41 that constitute the clamping parts 31 a and 31 b of the component holding mechanism 3. The tip 21b is clamped by the clamping parts 31a and 31b. Next, as shown in FIG. 8, the first members 51, 52, and 54 constituting the support portions 32 a, 32 b are inserted into the main body portion so that both side portions of the main body portion 21 are sandwiched between the support portions 32 a, 32 b of the component holding mechanism 3. It is made to adjoin to both sides of 21.

  At this time, the two terminals 22 arranged on the bottom 21a of the main body 21 are fitted into the slits 63 formed in the third member 53 constituting the support portions 32a and 32b, and the insertion hole 62 is inserted. To be inserted. Next, the terminal 22 of the resistor 2 is fixed to the third member 53 by soldering. Thereby, as shown in FIGS. 4 and 6, the resistor 2 is held by the component holding mechanism 3.

  In this case, in the state where the resistor 2 is held by the component holding mechanism 3, the bottom 21 a of the main body 21 in the resistor 2 is lower than the lower end of the first member 51 constituting the support portion 32, as shown in FIGS. Is also located below.

  Subsequently, the resistor 2 held by the component holding mechanism 3 is mounted on (attached to) the substrate 1. Specifically, as shown in FIG. 9, the second member 52 and the third member 53 of each support portion 32 are inserted into the opening 13 formed in the substrate 1 to push down the component holding mechanism 3. At this time, the claw 61 formed at the base end portion of the first member 51 in each support portion 32 is inserted into the insertion hole 12 b formed in the substrate 1. Accordingly, the first member 51 is fixed to the substrate 1 in a state where the first member 51 is bridged over the edge of the opening 13 on the upper surface 1 a of the substrate 1. At this time, the proximal end portion of the first member 51 is connected to the conductor pattern 11 formed on the substrate 1, and the support portion 32 a inputs the signal under measurement via the conductor pattern 11. The support 32b is connected to the terminal (high potential) and the non-inverting input side (low potential) of the operational amplifier via the conductor pattern 11. Thus, mounting (attachment) of the resistor 2 and the component holding mechanism 3 is completed.

  In this case, as described above, since the clamping part 31 holds the resistor 2, the movement of the resistor 2 is prevented, and the resistor 2 is mounted (an attitude in which the main body part 21 stands on the substrate 1 (this example Then, each main surface Sa is maintained at a right angle (or a substantially right angle) with respect to the surface of the substrate 1)). Further, in the mounting substrate 100, as shown in FIG. 6, the resistor 23 is disposed only in a portion excluding a portion corresponding to the sandwiching region Sb sandwiched by the sandwiching portion 31 in each main surface Sa of the resistor 2. Therefore, the sandwiching portion 31 (the sandwiching piece 41) that sandwiches the resistor 2 and the resistor 23 are sufficiently separated from each other. For this reason, in this mounting substrate 100, the situation in which the resistor 2 causes dielectric breakdown due to the signal under measurement is reliably prevented.

  In the component holding mechanism 3, as shown in FIGS. 6 and 9, the bottom 21 a side of the body portion 21 of the resistor 2 is inserted into the opening 13 formed in the substrate 1, and the bottom 21 a side is the lower surface of the substrate 1. The resistor 2 can be supported in a state of protruding downward from 1b. For this reason, in this component holding mechanism 3, the bottom 21 a side of the resistor 2 protrudes from the lower surface 1 b of the substrate 1, as compared with a configuration in which the main body 21 is erected on the upper surface 1 a of the substrate 1 and the resistor 2 is fixed. Thus, the height from the upper surface 1a to the tip end portion 21b of the main body portion 21 can be kept low.

  On the other hand, in this component holding mechanism 3, the clamping portion 31a is connected to the high potential to which one terminal 22 of the resistor 2 is connected via the support portion 32a, and the low potential to which the other terminal 22 of the resistor 2 is connected. The clamping part 31b is connected via the support part 32b. For this reason, in this component holding mechanism 3, as shown in FIG. 5, the sandwiching portions 31 a and 31 b are connected to the resistor 2 together with the insulating material existing between them (the insulating material constituting the main body portion 21 of the resistor 2). Functions as a capacitor connected in parallel. Further, as shown in FIG. 6, each sandwiching portion 31 a, 31 b is capacitively coupled to the resistor 23 of the resistor 2.

  Subsequently, the shield plate 4 is attached to the substrate 1. Specifically, first, the side walls 71 a to 71 d are attached to the substrate 1 so as to surround the component holding mechanism 3. In this case, the claw 81 formed at the base end portion of each side wall 71 is inserted into the insertion hole 12 c formed in the substrate 1, and then the tip end portion of the claw 81 is soldered on the back surface side of the substrate 1. Thereby, each side wall 71 is fixed to the substrate 1. Further, the base end portion of each side wall 71 is connected to the conductor pattern 11 formed on the substrate 1.

  Subsequently, the top plate 72 is placed on the tip of each side wall 71. Then, as shown in FIG. 4, it fixes to the front-end | tip part (the bending part provided in the front-end | tip part of the side walls 71b and 71d) of each side wall 71 by screwing. Thus, the attachment of the shield plate 4 is completed. Next, other electronic components and mechanical components are mounted (attached) to complete the mounting substrate 100.

  Here, in the mounting substrate 100, the resistance 2 is mounted on the substrate 1 using the component holding mechanism 3, and thus the bottom 21a side of the resistance 2 protrudes from the lower surface 1b of the substrate 1 as described above. The height from the upper surface 1a of the main body 21 to the distal end portion 21b of the main body 21 is kept low. For this reason, the height from the upper surface 1a of the shield plate 4 surrounding the component holding mechanism 3 is also kept low. As a result, for example, when a plurality of the mounting boards 100 are vertically stacked and accommodated in a measuring device or the like, as shown in the left diagram of FIG. The mounting substrate 100 is overlapped so that it does not come into contact with the terminal 2 of the resistor 2, so that the conventional mounting substrate 500 shown in the right diagram of FIG. Since the distance between the substrates 1 in the two upper and lower mounting substrates 100 can be reduced as compared with the case where the substrates are similarly stacked, the overall height H (thickness) is kept low (that is, the thin type). Is possible.

  As described above, in the component holding mechanism 3, the mounting substrate 100, and the voltage measuring device 10, the first member 51 spanned on the edge of the opening 13 of the substrate 1 and the second member protruding from the lower surface 1 b of the substrate 1. The member 52, the third member 53 that protrudes from the tip of the second member 52 so as to form an L shape together with the second member 52, and can fix the terminal 22, and the first member 51 to the second member 52 are opposite to each other. The support portion 32 includes a fourth member 54 that protrudes in the direction and a fifth member 55 that protrudes from the front end portion of the fourth member 54 in the same direction as the third member 53 and to which the clamping portion 31 is attached. . For this reason, according to the component holding mechanism 3, the mounting substrate 100, and the voltage measuring device 10, the bottom 21 a side of the main body 21 is inserted into the opening 13, and the bottom 21 a side protrudes downward from the lower surface 1 b of the substrate 1. Thus, the resistor 2 can be reliably held. As a result, in the component holding mechanism 3 and the mounting substrate 100, compared to the configuration in which the main body 21 is erected on the upper surface 1a of the substrate 1 and the resistor 2 is fixed, the upper surface 1a to the tip 21b of the main body 21 Can be kept sufficiently low. Therefore, according to the component holding mechanism 3, the mounting substrate 100, and the voltage measuring apparatus 10, for example, the interval between the substrates 1 when the plurality of mounting substrates 100 using the component holding mechanism 3 are vertically stacked is reduced. As a result, it is possible to reliably realize thinning when a plurality of mounting substrates are stacked. In addition, according to the component holding mechanism 3, the mounting substrate 100, and the voltage measuring device 10, the holding portion 31 supported by the support portion 32 holds the tip portion 21 b of the main body portion 21. Unlike the configuration in which the resistor 2 is held by the supporting fixing member, even if the type of resistor used is changed and the size of the resistor (width) is changed, regardless of the length of the width of the resistor. The resistor 2 can be reliably held.

  Further, according to the component holding mechanism 3, the mounting substrate 100, and the voltage measuring device 10, a high potential and a low potential to which the terminal 22 of the resistor 2 is connected to one of the pair of sandwiching portions 31 formed of a conductive material. Are connected to one of the potentials, and the other of the sandwiching portions 31 is connected to the other potential of the high potential and the low potential. It can function as a capacitor connected in parallel to the resistor 2 together with the insulating material constituting the main body portion 21, and each clamping portion 31 can be capacitively coupled to the resistor 23 of the resistor 2. That is, in the component holding mechanism 3 and the mounting substrate 100, the holding portion 31 for holding the resistor 2 can function as an electrode of a capacitor for adjusting frequency characteristics. Therefore, according to the component holding mechanism 3, the mounting substrate 100, and the voltage measuring device 10, it is possible to eliminate the need for a dedicated metal plate that functions as an electrode of a capacitor for adjusting frequency characteristics, and to use such a dedicated metal. Since the fixing member for fixing the plate can be eliminated, the manufacturing cost can be sufficiently reduced. In addition, in the conventional configuration in which the metal plate that functions as the electrode of the capacitor is fitted and held in the fixing member, it is difficult to change the size and shape of the metal plate unless the fixing member is remade. In the component holding mechanism 3 and the mounting substrate 100 that do not require such a fixing member, since there are few restrictions when changing the size of the clamping portion 31 (the clamping piece 41), the size of the clamping portion 31 can be arbitrarily set. The frequency characteristics can be easily adjusted by changing the frequency characteristics. Moreover, since the clamping part 31 can be functioned as a heat sink by forming the clamping part 31 using the highly heat-conductive material (for example, brass) as a conductive material, the heat generated by the resistor 2 Can be efficiently dissipated.

  Further, according to the component holding mechanism 3, the mounting substrate 100, and the voltage measuring device 10, the support portion 32 is formed of a conductive material. Are connected to the connected portion (in the above example, the input terminal on the Hi side (high potential) and the non-inverting input side (low potential) of the operational amplifier), and each terminal 22 of the resistor 2 without using wiring. Since the sandwiching portion 31 can be connected to the potential to which is connected, the configuration of the mounting substrate 100 can be simplified.

  In addition, according to the component holding mechanism 3, the mounting substrate 100, and the voltage measuring device 10, the clamping unit 31 clamps only the part excluding the part where the resistor 23 is formed in the main body 21, so that the resistor The stray capacitance between the sandwiching portion 31 and the resistor 23 can be reduced as compared with the configuration in which the portion where the 23 is formed is sandwiched. For this reason, according to the component holding mechanism 3, the mounting substrate 100, and the voltage measuring device 10, it is possible to prevent a decrease in amplitude in the high frequency band when measuring the measured amount of the measurement target signal. Measurement can be possible.

  Further, according to the mounting substrate 100 and the voltage measuring device 10, as an electronic component in which the resistor 23 is disposed only in a portion excluding a portion corresponding to the sandwiching region Sb sandwiched by the sandwiching portion 31 in each main surface Sa. By using the resistor 2, it is possible to ensure a holding area Sb of an appropriate size that can be securely held, and to measure the measured amount in a wide band while reliably holding the resistor 2.

  Note that the configurations of the component holding mechanism, the mounting substrate, and the voltage measuring device 10 are not limited to the above configurations. For example, the example in which the clamping unit 31 is connected to the potential to which the resistor 2 is connected via the support unit 32 and the clamping unit 31 functions as an electrode of the capacitor has been described above. It is also possible to adopt a configuration that connects to a potential. Further, a configuration in which a capacitor-dedicated electrode is provided separately from the clamping unit 31 and the clamping unit 31 is not connected to each potential, that is, a configuration in which the function of the clamping unit 31 is limited only to the function of holding the resistor 2 is employed. You can also. In this case, in this configuration, the sandwiching portion 31 and the support portion 32 can be formed of a nonconductive material.

  Moreover, although the example provided with the 2 clamping parts 31 was mentioned above, the structure provided with the 1 or 3 or more clamping parts 31 is also employable. Moreover, although the example provided with the two support parts 32 was mentioned above, the structure which supports the 1 or several clamping part 31 with one support part is also employable. Specifically, for example, one support portion that has a rectangular frame shape when viewed from the front by extending and connecting the fifth members 55 and the third members 53 of the two support portions 32 described above. Can be adopted.

  Moreover, although it described above about the example applied to the component holding mechanism 3 which hold | maintains the resistance 2 formed in the plate shape in which main surface Sa of the main-body part 21 makes | forms a rectangle, the main surface of a main-body part forms circular or an ellipse. It can also be applied to a component holding mechanism that holds a resistance formed in a shape. Further, the present invention can be applied to a component holding mechanism in which a main body portion holds a resistance formed in a cylindrical shape. Furthermore, it is needless to say that the present invention can be applied to a component holding mechanism that holds an electronic component other than the resistor 2 (for example, a capacitor or a coil).

  Further, the example applied to the voltage measuring device 10 as an example of a measuring device that measures a voltage as a measured amount has been described above. However, physical quantities such as current, power, resistance, rotation speed, and temperature, atomic weight, molecular weight, and the like The present invention can be applied to various measuring devices that measure a chemical amount as a measurement amount, and even in this case, the above-described effects can be realized.

DESCRIPTION OF SYMBOLS 1 Board | substrate 1a Upper surface 1b Lower surface 2 Resistance 3 Component holding mechanism 10 Voltage measuring device 13 Opening part 21 Main body part 21a Bottom part 21b Tip part 22 Terminal 23 Resistor 31a, 31b Holding part 32a, 32b Support part 51 1st member 52 2nd member 53 3rd member 54 4th member 55 5th member 100 Mounting board Sa Main surface Sb Clamping area

Claims (7)

A component holding mechanism for holding an electronic component mounted on a substrate having a main body and a terminal disposed on the bottom side of the main body,
A holding part that holds the tip of the main body part; and the holding part that supports the electronic component in a state in which the bottom side is inserted into an opening formed in the substrate and the bottom side protrudes from the lower surface of the substrate. And a support part for supporting
The support portion includes a first member that spans an edge of the opening on the upper surface of the substrate, a second member that is coupled to the first member so as to protrude from the lower surface of the substrate, and A third member that is connected to the second member so as to project from the tip of the second member and form an L-shape together with the second member, and the terminal can be fixed to the second member; Is connected to the fourth member so that it protrudes in the same direction as the third member from the tip of the fourth member, and is connected to the fourth member so as to protrude in the opposite direction. A component holding mechanism configured to include a fifth member to which the clamping unit is attached. A pair of the holding portions each formed of a conductive material;
Either one of the sandwiching portions is connected to one of a high potential and a low potential to which the terminal of the electronic component is connected, and the other of the sandwiching portions is the high potential and the low potential. The component holding mechanism according to claim 1, wherein the component holding mechanism is connected to the other potential.   The component holding mechanism according to claim 1, wherein the support portion is formed of a conductive material.   The component holding mechanism according to any one of claims 1 to 3, wherein the clamping unit clamps only a portion of the main body portion of the resistor as the electronic component except a portion where a resistor is formed.   A mounting substrate comprising: the component holding mechanism according to claim 1; the substrate on which the opening is formed; and the electronic component mounted on the substrate. The component holding mechanism according to claim 4, the substrate on which the opening is formed, and the resistor as the electronic component mounted on the substrate,
The mounting substrate in which the resistor is disposed only in a portion excluding a portion corresponding to a holding region held by the holding portion.   A measuring apparatus comprising the mounting substrate according to claim 5 and measuring a measured amount.

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