JP2015012102A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of sufficiently preventing leakage of light from a bottom face of a mounting substrate.SOLUTION: The light-emitting device comprises a mounting substrate 2, and a resin package 6 which is disposed on a top face of the mounting substrate, in which a light-emitting element 10 is accommodated, and which includes a first lead 4a and a second lead 4b. A side face of the resin package includes a cavity 8 in which the light-emitting element 10 is accommodated. The first lead and the second lead include: intra-cavity exposed parts for connecting with a positive or negative electrode of the light-emitting element within the cavity and bottom face exposed parts exposed from a bottom face of the resin package for electrically connecting a first wiring layer 12a and a second wiring layer 12b provided on a top face of the mounting substrate. In a top face view in a direction vertical to the top face of the mounting substrate, a third wiring layer 14a having a light shield property provided on the mounting substrate is disposed between the bottom face exposed part of the first lead and the bottom face exposed part of the second lead.

Description

  The present invention relates to a light emitting device, and more particularly to a side view type light emitting device capable of emitting light in a direction substantially parallel to the upper surface of a mounting substrate.

A light-emitting device using a light-emitting element such as a light-emitting diode can be easily miniaturized and can obtain high light emission efficiency.
As one of light-emitting devices using a light-emitting element, a side-view type light-emitting device that can emit light in a direction substantially parallel to the upper surface of a mounting substrate is known (Patent Document 1). In a side-view type light emitting device, a resin package having a cavity having an opening on the side surface and having a light emitting element disposed in the cavity is disposed on a mounting substrate. As a result, light emitted from the light emitting element in the cavity exits in a direction substantially parallel to the top surface of the mounting substrate from the opening on the side surface of the resin package, so that a sufficient amount of light is emitted in a direction substantially parallel to the top surface of the mounting substrate. Can emit light.

For this reason, the side-view type light emitting device is arranged by, for example, disposing its cavity so as to face the end face of the light guide plate of a small-to-medium-sized liquid crystal display used for mobile phones (including smartphones), notebook computers, tablets, and the like. It functions as a backlight light source that is small and can supply a sufficient amount of light. That is, by using a side-view type light emitting device, a small and light liquid crystal display having high luminance with low power consumption can be obtained.
In this way, sufficient luminance can be secured with low power consumption, and the device can be made smaller and / or lighter. Therefore, the side-view type light-emitting device can read various meters (or indicators) and read out in addition to the liquid crystal display. It is used in many applications such as sensors and lighting.

JP 2008-198807 A

  In recent years, light emitting elements with higher light output have been developed and used in side view type light emitting devices. For this reason, light from the light emitting element may pass through the resin package and the mounting substrate, and light may leak from the lower surface (back surface) of the mounting substrate. When light leaks from the bottom surface of the mounting board, unintended light leakage occurs from the back side of various devices using the light emitting device, or reflection or the like occurs at unintended parts and mixes with the light passing through the intended path. There is a problem of causing bleeding.

  In the apparatus using the side view type light emitting device, the end surface of the light receiving member such as the light guide plate is disposed so as to face the cavity on the side surface of the resin package as described above. Of the resin package outer surface), if the thickness on the bottom side is increased, it is necessary to raise the position of the light receiving member as a whole, resulting in an increase in the thickness of the entire apparatus using the side view type light emitting device. There is a problem of end up. For this reason, it is practically difficult to increase the thickness of the bottom surface side of the resin package for the purpose of reducing the amount of light reaching the mounting substrate. In addition, it is practically difficult to increase the thickness of the mounting substrate for the same reason in order to reduce the amount of light transmitted through the mounting substrate.

For this reason, conventionally, the leakage of light from the lower surface of the mounting substrate is suppressed by applying a resist capable of absorbing a large amount of light to the surface of the mounting substrate, for example, by making the color black.
However, in order to promote further miniaturization and weight reduction in recent years, light emitting elements with higher light output have been used, and a sufficient light shielding effect cannot be obtained even using the above resist, There are increasing cases in which leakage of light from the lower surface of the mounting substrate cannot be sufficiently suppressed.

  The present invention has been made to overcome such a situation, and an object thereof is to provide a light emitting device capable of sufficiently suppressing light leakage from the lower surface of the mounting substrate.

  One aspect of the present invention includes a mounting substrate, and a resin package that is disposed on the upper surface of the mounting substrate, accommodates a light-emitting element therein, and has a first lead and a second lead. A side surface of the package has a cavity in which the light emitting element is accommodated, and the first lead is a cavity for electrically connecting to one of the positive electrode and the negative electrode of the light emitting element inside the cavity. An internal exposed portion, and a bottom exposed portion that is exposed from the bottom surface of the resin package and is electrically connected to a first wiring layer provided on the top surface of the mounting substrate, and the second lead is A second exposed portion that is exposed from the bottom surface of the resin package and is provided on the upper surface of the mounting substrate. The second exposed portion has an exposed portion in the cavity for electrical connection with the other of the positive electrode and the negative electrode of the light emitting element. A bottom exposed portion for electrically connecting to the wiring layer, and a bottom exposed portion of the first lead and a bottom exposed portion of the second lead in a top view from a direction perpendicular to the top surface of the mounting substrate; The light emitting device is characterized in that a third wiring layer provided on the mounting substrate is disposed between the portions.

  In the light emitting device according to the present invention, the wiring layer provided on the mounting substrate is disposed so as to satisfy a specific condition, and light leakage from the lower surface of the mounting substrate can be sufficiently suppressed by the light shielding effect by the wiring layer. .

FIG. 1 is a perspective view of a light emitting device 100 according to the present invention. FIG. 2 is a cross-sectional view of the light emitting device 100 in a cross section perpendicular to the upper surface of the mounting substrate 2 and crossing the light emitting element 10. FIG. 3 is a cross-sectional view of the light emitting device 100A according to Embodiment 2 of the present invention in a cross section perpendicular to the upper surface of the mounting substrate 2 and crossing the light emitting element 10. FIG. 4 shows a cross-sectional view of the light-emitting device 100B according to Embodiment 3 of the present invention in a cross-section perpendicular to the top surface of the mounting substrate 2 and crossing the light-emitting element 10.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a specific direction and position (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. These terms are used for easy understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Moreover, the part of the same code | symbol which appears in several drawing shows the same part or member, unless there is particular notice.

FIG. 1 is a perspective view of a light emitting device 100 according to the present invention. FIG. 2 is a cross-sectional view of the light emitting device 100 in a cross section perpendicular to the upper surface of the mounting substrate 2 and crossing the light emitting element 10. The light emitting device 100 is a side view type light emitting device.
The light emitting device 100 includes a mounting substrate 2, leads 4 a and 4 b, a resin package 6, and a light emitting element 10.
The leads 4a and 4b are respectively exposed to the bottom exposed portion exposed from the bottom surface (XY plane in FIGS. 1 and 2) of the resin package 6 and the side surface (XZ plane in FIGS. 1 and 2) of the resin package 6. And an in-cavity exposed portion exposed at the bottom of the provided cavity 8. Further, each of the leads 4a and 4b has a side surface exposed portion located on another side surface (YZ plane in FIGS. 1 and 2) of the resin package as shown in FIGS. It's okay.

The light emitting element 10 is accommodated inside the cavity 8 (specifically, at the bottom). (In the embodiment of FIGS. 1 and 2, the lead 4b is disposed on the exposed portion in the cavity.)
For example, a light-transmitting sealing resin 18 may be filled in the cavity 8 so as to seal the light emitting element 10. The sealing resin 18 may include a phosphor that absorbs light emitted from the light emitting element 10 and emits light having a longer wavelength than the absorbed light.

The exposed portion in the cavity of the lead 4a (first lead 4a) is electrically connected to one of the positive electrode and the negative electrode of the light emitting element 10 (electrically connected via the wire 20a in FIG. 1).
The bottom exposed portion of the lead 4a is electrically connected to the wiring layer 12a (first wiring layer 12a) disposed on the top surface of the mounting substrate 2 via the solder 22. Further, when the lead 4a has a side surface exposed portion, this side surface exposed portion may be electrically connected to the wiring layer 12a via the solder 22 as shown in FIG. The description of the solder 22 is omitted to illustrate the shape of the exposed portion).

The exposed portion in the cavity of the lead 4b (second lead 4b) is electrically connected to the other of the positive electrode and the negative electrode of the light emitting element 10 (electrically connected via a wire 20b in FIG. 1).
The bottom exposed portion of the lead 4b is electrically connected to the wiring layer 12b (second wiring layer 12b) disposed on the top surface of the mounting substrate 2 via the solder 22. Further, when the lead 4b has a side surface exposed portion, the side surface exposed portion may be electrically connected to the wiring layer 12b via the solder 22 as shown in FIG.

Since the lead 4a and the lead 4b have such a configuration, current flows from one of the first wiring layer 12a and the second wiring layer 12b through the light emitting element 10 to the first wiring layer 12a and the second wiring layer 12b. It flows to the other side of the wiring layer 12b. Thereby, the light emitting element 10 can emit light.
Most of the light emitted from the light emitting element 10 and the phosphor (when phosphor is used) is reflected directly or by the inner surface of the cavity 8 to enter the cavity 8 (portion located on the side surface of the resin package 6 of the cavity 8). And goes out of the resin package (for example, goes out in a direction substantially parallel to the upper surface (XY plane) of the mounting substrate 2).
Note that in this specification, light emitted from the light-emitting element 10 and light emitted from the phosphor (when a phosphor is used) are collectively referred to as “light emitted from the light-emitting element 10 or the like”.
A part of the light emitted from the light emitting element 10 or the like passes through the bottom surface of the resin package (the surface facing the mounting substrate 2) and travels toward the mounting substrate 2 as indicated by an arrow 30 in FIG.

The light emitting device according to the present invention is provided on the mounting substrate so that such light is transmitted through the mounting substrate 2 and does not leak and diffuse below the mounting substrate 2 (the −Z direction in FIGS. 1 and 2). It is characterized by using a wiring layer.
More specifically, the bottom exposed portion of the first lead 4a and the bottom exposed portion of the second lead 4b in a top view from the direction perpendicular to the top surface of the mounting substrate 2 (when viewed from the Z direction in FIGS. 1 and 2). A third wiring layer provided on the mounting substrate 2 is arranged between the portions.

Since the lead 4a and the lead 4b are formed from a metal plate or the like having a certain thickness, among the light passing through the bottom surface of the resin package 6, the lead 4a (the bottom exposed portion of the lead 4a) and the lead 4b ( Most of the light hitting the bottom exposed portion of the lead 4b is absorbed or reflected by the lead 4a and the lead 4b and does not reach the top surface of the mounting substrate 2. On the other hand, light (for example, light indicated by an arrow 30 in FIG. 2) passing through the bottom surface of the resin package 6 and reaching between the bottom surface exposed portion of the lead 4a and the bottom surface exposed portion of the lead 4b is blocked by the lead 4a and the lead 4b. It reaches the upper surface of the mounting substrate 2 without being done.
In the present invention, the third wiring layer is disposed between the bottom exposed portion of the first lead 4a and the bottom exposed portion of the second lead 4b in a top view.

  The third wiring layer is made of a conductor such as metal, for example, and has a predetermined thickness in order to ensure conductivity. For this reason, it has a clearly superior light-shielding property compared to a conventionally used light-shielding resist such as a black resist. When viewed from above, the third wiring layer (at least a part thereof) is disposed between the bottom exposed portion of the first lead 4a and the bottom exposed portion of the second lead 4b as described above, thereby lowering the bottom surface of the mounting substrate 2. Light can be effectively prevented from leaking to the side (below the mounting substrate 2).

  The third wiring layer may be connected to another wiring layer, or may be arranged away from the other wiring layer. The third wiring layer preferably has electrical conductivity and bears a part of the electrical function of the mounting substrate 2, but has electrical insulation when arranged away from other wiring layers. It may be. The third wiring layer may be composed of a single layer or a plurality of layers like the other wiring layers. The third wiring layer preferably includes at least a surface made of copper, tungsten, iron, or an oxide thereof when light absorption is important, and at least the surface when light reflection is important. Is preferably made of silver, aluminum, gold or the like.

(1) Embodiment 1
A light emitting device 100 according to Embodiment 1 of the present invention will be described with reference to FIG.
In the first embodiment, the wiring layer 14 a (third wiring layer 14 a) and the wiring layer 14 b are disposed on the lower surface of the mounting substrate 2.
The wiring layer 14a and the wiring layer 14b arranged on the lower surface of the mounting substrate 2 are connected to the wiring layer 12a or the wiring layer 12b via vias (not shown) provided in the mounting substrate 2, for example, and power is supplied to the light emitting element 10. It may be a wiring layer to be supplied. Further, the wiring layer 14 a and the wiring layer 14 b may be wiring layers for supplying power to elements other than the light emitting element 10 disposed on the upper surface or the lower surface of the mounting substrate 2.

As shown in FIG. 2, when the light emitting device 100 is viewed from above (when viewed from the Z direction), the wiring layer 14a, which is the third wiring layer, is located between the first lead 4a and the second lead 4b. Is arranged.
As a result, as shown in FIG. 2, among the light emitted from the light emitting element 10 and the like, the light indicated by the arrow 30 that has passed through the bottom surface of the resin package 6 and entered the mounting substrate 2 is further lowered from the lower surface of the mounting substrate 2. Progressing to the side can be prevented by the wiring layer 14a.

  Since the third wiring layer 14a is arranged on the lower surface of the mounting substrate 2 in this way, part of the light that travels along the arrow 30 and reaches the upper surface of the wiring layer 14a is reflected. Most of them are absorbed when passing through the mounting substrate 2 again, and light can be prevented from going out from the mounting substrate 2 in an undesirable direction.

As shown in FIG. 2, the third wiring layer 14a is preferably arranged so as to connect the bottom exposed portion of the lead 4a and the bottom exposed portion of the lead 4b when viewed from above. That is, in the top view, the lead 4a, the wiring layer 14a, and the lead 4b are continuously arranged in the longitudinal direction (width direction; X direction in FIGS. 1 and 2) of the light emitting device 100.
As a result, more light that passes through the bottom surface of the resin package 6, reaches between the first lead 4a and the second lead 4b, and enters the mounting substrate 2 can be shielded by the wiring layer 14a.

  Further, in the top view, the position of the third wiring layer 14a in the depth direction (Y direction in FIGS. 1 and 2) covers the position of the light emitting element 10 in the thickness direction (Y direction in FIGS. 1 and 2). preferable. This is because the most light passes through the bottom surface of the resin package 6 and enters the mounting substrate 2 immediately below the light emitting element 10, and therefore it is effective to dispose the third wiring layer 14a in this portion. It is. In this case, as described above, it is more preferable that the third wiring layer 14a is arranged so as to connect the bottom exposed portion of the lead 4a and the bottom exposed portion of the lead 4b. Furthermore, in a top view, the third wiring layer 14a preferably covers the cavity 8 of the resin package 6 in an area ratio of 70% or more, and more preferably covers the entire resin package 6 (that is, the mounting substrate 2). 70% or more of the area directly below the cavity 8 is preferably covered with the third wiring layer 14a, and the entire portion immediately below the cavity 8 is covered with the third wiring layer 14a. More preferred). This is because, in a side-view type light emitting device, the thickness of the wall sandwiching the cavity 8 of the resin package 6 up and down is usually smaller than the thickness of other parts, and much light is directly below the cavity 8. This is because it is effective to dispose the third wiring layer 14a in this portion in order to pass through the bottom surface of this.

Next, details of each element of the light emitting device 100 will be described. Mounting board 2
As described above, in the light emitting device according to the present invention, any mounting substrate (substrate) used in the light emitting device can be used as the mounting substrate 2 in order to obtain a light shielding effect by the third wiring layer. Examples of such mounting substrates include ceramic substrates, glass epoxy substrates, and flexible substrates such as polyimide and polyethylene terephthalate (PET).

-Light emitting element 10
The light emitting element 10 may be a light emitting diode using any kind of p-type semiconductor and n-type semiconductor.
Preferred examples of the light emitting element 10, p-type semiconductor layer and n-type semiconductor _{layer, In X Al Y Ga 1-} XY N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) nitride semiconductor such as light emitting diodes, such as Can be mentioned. In this case, the light emitting element 10 preferably has a light emitting layer (active layer) including an InGaN layer having a hand gap energy smaller than these between the p type semiconductor layer and the n type semiconductor layer. In particular, the light emitting element 10 is preferably a blue light emitting diode capable of efficiently exciting the phosphor.
However, the p-type semiconductor layer and the n-type semiconductor layer are not limited to this, and may be a layer containing any semiconductor used for a light emitting diode, including AlInGaP, AlGaAs, GaP, and the like.

-Phosphor As described above, the cavity 8 of the resin package 6 may be filled with the sealing resin 18 as necessary. In this case, the sealing resin 18 may include a phosphor.
The phosphor may be any phosphor that can be used in a light emitting device using a light emitting diode. For example, when the light emitting element 10 is a blue light emitting diode, preferred phosphors include silicate phosphors such as YAG phosphors and chlorosilicate phosphors that emit green and / or yellow, and red phosphors (Sr, Examples thereof include one or more selected from SCASN phosphors such as Ca) AlSiN ₃ : Eu and CASN phosphors such as CaAlSiN ₃ : Eu.

・ Resin package 6
Examples of the molding material for the resin package 6 include thermosetting resins such as epoxy resins and silicone resins, liquid crystal polymers, polyphthalamide resins, polycyclohexylenedimethylene terephthalate (PCT), and polybutylene terephthalate (PBT). These thermoplastic resins can be used. Further, a white pigment such as titanium oxide may be mixed in the molding material to increase the reflectance of light on the inner surface of the cavity 8 of the resin package 6.

・ Lead 4a, 4b
For the leads 4a and 4b, for example, a conductive material made of at least one of metals such as aluminum, iron, nickel, and copper can be used. The leads 4a and 4b may have a plated layer made of gold, silver or an alloy thereof on the surface.

(2) Embodiment 2
FIG. 3 is a cross-sectional view of the light emitting device 100A according to Embodiment 2 of the present invention in a cross section perpendicular to the upper surface of the mounting substrate 2 and crossing the light emitting element 10.
Hereinafter, the light emitting device 100 </ b> A will be described focusing on differences from the light emitting device 100. Among the configurations of the light emitting device 100 </ b> A, those that are not particularly described may have the same configuration as the light emitting device 100.

  The second embodiment is characterized in that the third wiring layer is disposed on the upper surface of the mounting substrate 2. In the embodiment shown in FIG. 3, the second wiring layer 12 b among the wiring layers arranged on the upper surface of the mounting substrate 2 also functions as the third wiring layer. That is, the second wiring layer 12b is electrically connected to the bottom surface exposed portion of the lead 4b via the solder 22, and when the light emitting device 100A is viewed from above as shown in FIG. 3 (Z in FIG. 3). (When viewed from the direction), a part thereof is disposed between the bottom exposed portion of the first lead 4a and the bottom exposed portion of the second lead 4b.

  Thereby, as shown in FIG. 3, among the light emitted from the light emitting element 10 and the like, the light indicated by the arrow 30 that has passed through the bottom surface of the resin package 6 enters the mounting substrate 2 and leaks from the lower surface of the mounting substrate 2. This can be suppressed by the second wiring layer 12b.

  By disposing the wiring layer 12b functioning as the third wiring layer on the upper surface of the mounting substrate 2 in this way, at least a part of the light from the light emitting element 10 or the like traveling along the arrow 30 is mounted on the mounting substrate 2. It has the advantage that it can be shielded from light before entering.

As shown in FIG. 3, the wiring layer 12b is preferably disposed so as to connect the bottom exposed portion of the lead 4a and the bottom exposed portion of the lead 4b when viewed from above. That is, in the top view, the lead 4a, the wiring layer 12b, and the lead 4b are continuously arranged in the longitudinal direction (width direction; X direction in FIG. 3) of the light emitting device 100A.
As a result, more of the light transmitted through the bottom surface of the resin package 6 and reaching between the first lead 4a and the second lead 4b can be shielded by the wiring layer 12b.

  Moreover, it is preferable that the position of the wiring layer 12b in the depth direction (Y direction in FIG. 3) covers the position of the light emitting element 10 in the thickness direction (Y direction in FIG. 3) when viewed from above. This is because the most light passes through the bottom surface of the resin package 6 immediately below the light emitting element 10, and therefore it is effective to dispose the wiring layer 12b in this portion. In this case, as described above, it is more preferable that the wiring layer 12b is disposed so as to connect the bottom exposed portion of the lead 4a and the bottom exposed portion of the lead 4b. Furthermore, in a top view, the wiring layer 12b preferably covers the cavity 8 of the resin package 6 in an area ratio of 50% or more, and more preferably covers the cavity 8 of the resin package 6 in an area ratio of 70% or more. (That is, 50% or more of the area immediately below the cavity 8 is preferably covered with the wiring layer 12b on the upper surface of the mounting substrate 2, and 70% or more of the area immediately below the cavity 8 is covered with the wiring layer 12b. More preferably it is covered.) This is because, in a side-view type light emitting device, the thickness of the wall sandwiching the cavity 8 of the resin package 6 up and down is usually smaller than the thickness of other parts, and much light is directly below the cavity 8. This is because it is effective to dispose the wiring layer 12b in this portion in order to transmit through the bottom surface of the substrate.

  In the embodiment shown in FIG. 3, as described above, when the second wiring layer 12b is viewed from the top, a part of the bottom exposed portion of the first lead 4a and the bottom exposed portion of the second lead 4b are formed. However, instead of this, when viewed from the top so that the first wiring layer 12a functions as a third wiring layer, a part of the bottom exposed portion of the first lead 4a is formed. And the second lead 4b may be disposed so as to be positioned between the bottom exposed portion of the second lead 4b. Thus, the third wiring layer may be the same wiring layer as any one of the first wiring layer 12a and the second wiring layer 12b.

Alternatively, instead of the second wiring layer 12b, when the light emitting device 100A is viewed from the top with another wiring layer different from the first wiring layer 12a and the second wiring layer 12b as the third wiring layer, at least You may arrange | position on the upper surface of the mounting substrate 2 so that the part may be located between the bottom face exposed part of the 1st lead | read | reed 4a, and the bottom face exposed part of the 2nd lead | read | reed 4b.
In this case, the third wiring layer disposed on the upper surface of the mounting substrate 2 may be used to supply power to elements other than the light emitting element 10 (elements not shown).

(3) Embodiment 3
FIG. 4 shows a cross-sectional view of the light-emitting device 100B according to Embodiment 3 of the present invention in a cross-section perpendicular to the top surface of the mounting substrate 2 and crossing the light-emitting element 10.
Hereinafter, the light emitting device 100 </ b> B will be described focusing on differences from the light emitting device 100. Among the configurations of the light emitting device 100B, those that are not particularly described may have the same configuration as the light emitting device 100.

  The third embodiment is characterized in that the third wiring layer is arranged inside the mounting substrate 2. In the embodiment shown in FIG. 4, two wiring layers 16a and 16b are disposed inside the mounting substrate 2, and the wiring layer 16a functions as a third wiring layer. That is, as shown in FIG. 4, when the light emitting device 100B is viewed from above (as viewed from the Z direction in FIG. 4), a part of the wiring layer 16a is partially exposed to the bottom surface of the first lead 4a and the second. It arrange | positions so that it may be located between the bottom face exposed parts of the lead | read | reed 4b.

  As a result, as shown in FIG. 4, among the light emitted from the light emitting element 10 and the like, the light indicated by the arrow 30 that has passed through the bottom surface of the resin package 6 and entered the mounting substrate 2 can be blocked. The light leakage from the lower surface of the mounting substrate 2 can be sufficiently suppressed.

  By disposing the wiring layer 16a functioning as the third wiring layer in the mounting substrate 2 in this way, the deterioration of the wiring layer 16a can be suppressed, and therefore, an advantage that excellent light shielding performance can be maintained for a long period of time. Have In addition, the third wiring layer arranged inside the mounting substrate 2 is less subject to restrictions on the arrangement than in the case of the upper surface and the lower surface, so that the position and shape can be easily selected, and light can be transmitted over a wide range of the mounting substrate 2. Leakage can be suppressed.

As shown in FIG. 4, the wiring layer 16a is preferably disposed so as to connect the bottom exposed portion of the lead 4a and the bottom exposed portion of the lead 4b when the light emitting device 100B is viewed from above. That is, in the top view, the lead 4a, the wiring layer 16a, and the lead 4b are continuously arranged in the longitudinal direction (width direction; X direction in FIG. 4) of the light emitting device 100B.
As a result, more light that passes through the bottom surface of the resin package 6 and reaches between the first lead 4a and the second lead 4b and enters the mounting substrate 2 can be shielded by the wiring layer 16a.

  Further, it is preferable that the position of the wiring layer 16a in the depth direction (Y direction in FIG. 4) covers the position of the light emitting element 10 in the thickness direction (Y direction in FIG. 4) in a top view. This is because the most light passes through the bottom surface of the resin package 6 immediately below the light emitting element 10, and therefore it is effective to dispose the wiring layer 16a in this portion. In this case, as described above, the wiring layer 16a is further disposed so as to connect the bottom surface exposed portion of the lead 4a and the bottom surface exposed portion of the lead 4b in the top view of the light emitting device 100B. preferable. Furthermore, in a top view, the wiring layer 16a preferably covers the resin package 6 in an area ratio of 70% or more, and more preferably covers the entire cavity 8 of the resin package 6 (that is, inside the mounting substrate 2). On the surface on which the wiring layer 16a is formed, it is preferable that 70% or more of the area of the portion directly under the cavity 8 is covered with the wiring layer 16a, and the entire portion directly under the cavity 8 is covered with the wiring layer 16a. More preferably). This is because, in a side-view type light emitting device, the thickness of the wall sandwiching the cavity 8 of the resin package 6 up and down is usually smaller than the thickness of other parts, and much light is directly below the cavity 8. This is because it is effective to dispose the wiring layer 16a in this portion.

As shown in FIG. 4, the mounting substrate 2 provided with the wiring layers 16 a and 16 b inside is formed, for example, by sandwiching a metal member to be a wiring layer between two or more base materials (thin substrates). It may be a laminated substrate.
The wiring layer 16 a and the wiring layer 16 b arranged inside the mounting substrate 2 are connected to the wiring layer 12 a or the wiring layer 12 b through vias (not shown) provided in the mounting substrate 2, for example, and supply power to the light emitting element 10. The wiring layer may be a wiring layer for supplying power to an element (not shown) other than the light emitting element 10 disposed on the upper surface or the lower surface of the mounting substrate 2.

In FIG. 4, there is one wiring layer disposed inside the mounting substrate 2 that functions as the third wiring layer, but the present invention is not limited to this.
For example, a plurality of wiring layers that are arranged inside the mounting substrate 2 and function as the third wiring layer are arranged in the thickness direction of the mounting substrate 2 (Z direction in FIG. 4), and the third wiring layer functions. A plurality of wiring layers may be arranged inside the mounting substrate 2.

(4) Embodiment 4
The fourth embodiment combines two or more embodiments selected from the first to third embodiments.
That is, in the top view of the light emitting device, the third wiring layer in which at least a part thereof is disposed between the bottom exposed portion of the first lead 4a and the bottom exposed portion of the second lead 4b is (1). Two or more locations (two or more of (1) to (3)) of the upper surface of the mounting substrate 2, (2) the inside of the mounting substrate 2, and (3) the lower surface of the mounting substrate 2, preferably all three locations ( (All of (1) to (3)).
By forming the third wiring layer at at least two, preferably three, of the upper surface, the inside and the lower surface of the mounting substrate 2, light leakage from the lower surface of the mounting substrate 2 can be suppressed more reliably.

2 Mounting substrate 4a, 4b Lead 6 Resin package 8 Cavity 10 Light emitting element 12a, 12b, 14a, 14b, 16a, 16b Wiring layer 18 Sealing resin 20a, 20b Wire 22 Solder

Claims (7)

A mounting board;
A resin package that is disposed on the upper surface of the mounting substrate, accommodates a light emitting element therein, and has a first lead and a second lead;
Including
The side surface of the resin package has a cavity in which the light emitting element is accommodated,
The first lead has an in-cavity exposed portion for electrically connecting to one of a positive electrode and a negative electrode of the light emitting element inside the cavity, and is exposed from the bottom surface of the resin package. A bottom exposed portion for electrically connecting to the first wiring layer provided on the top surface;
The second lead has an exposed part in the cavity for electrically connecting to the other of the positive electrode and the negative electrode of the light emitting element inside the cavity, and is exposed from the bottom surface of the resin package. A bottom exposed portion for electrically connecting to the second wiring layer provided on the top surface;
A third wiring layer provided on the mounting substrate is disposed between the bottom exposed portion of the first lead and the bottom exposed portion of the second lead in a top view from a direction perpendicular to the top surface of the mounting substrate. A light-emitting device characterized by being made.   Third wiring provided on the mounting substrate so as to connect the bottom exposed portion of the first lead and the bottom exposed portion of the second lead in a top view from a direction perpendicular to the top surface of the mounting substrate. The light emitting device according to claim 1, wherein a layer is disposed.   The light emitting device according to claim 1, wherein the third wiring layer is a wiring layer disposed on an upper surface of the mounting substrate.   The light emitting device according to claim 3, wherein the third wiring layer is the same wiring layer as any one of the first wiring layer and the second wiring layer.   The light emitting device according to claim 1, wherein the third wiring layer is a wiring layer disposed on a lower surface of the mounting substrate.   The light emitting device according to claim 1, wherein the third wiring layer is a wiring layer disposed inside the mounting substrate.   The third wiring layer is a wiring layer disposed in at least two locations selected from the group consisting of the upper surface of the mounting substrate, the lower surface of the mounting substrate, and the inside of the mounting substrate. Item 3. The light emitting device according to Item 1 or 2.

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