JP2015008335A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2015008335A
JP2015008335A JP2014202962A JP2014202962A JP2015008335A JP 2015008335 A JP2015008335 A JP 2015008335A JP 2014202962 A JP2014202962 A JP 2014202962A JP 2014202962 A JP2014202962 A JP 2014202962A JP 2015008335 A JP2015008335 A JP 2015008335A
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phosphor
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light emitting
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red phosphor
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JP5921631B2 (en
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真也 石崎
Shinya Ishizaki
真也 石崎
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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Abstract

PROBLEM TO BE SOLVED: To provide a highly efficient light emitting device having high color rendering properties, which minimizes a decrease in luminous efficiency in a state where a general color rendering index Ra and a special color rendering index R9 are kept at high values, and which can be used for use as general lighting.SOLUTION: A light emitting device comprises: at least one light emitting element 6 which emits light having a peak emission wavelength in a near-ultraviolet or blue region; a green phosphor which is excited by primary light emitted from the light emitting element 6 and emits light having a peak emission wavelength in a green region; a first red phosphor which is excited by the primary light and has a peak emission wavelength in a red region; a second red phosphor which is excited by the primary light and has a peak emission wavelength different from that of the first red phosphor in the red region; and a domal phosphor layer 5 formed by injection of a transparent resin obtained by mixture of three kinds of phosphors such as the green phosphor, the first red phosphor and the second red phosphor on an opening 20 of a liquid-repellent layer 21, for encapsulating the light emitting element 6.

Description

本発明は、照明器具、表示装置の光源等に利用可能な発光装置に関し、特に、発光輝度を維持若しくは低下を最小限に抑制しつつ、高い演色性の実現を可能にした発光装置に関する。   The present invention relates to a light-emitting device that can be used for a light fixture, a light source of a display device, and the like, and more particularly, to a light-emitting device that can achieve high color rendering while maintaining or suppressing light emission luminance to a minimum.

半導体発光素子(以下、適宜「発光素子」と称す)を用いた照明装置等の半導体発光装置が種々開発されており、出力性能向上のための手段が種々検討されている。特に、一般照明器具用途に使用可能な発光装置では、性能として、高演色性を有すること(基本的に平均演色評価数Raが80以上、米国Energy Star規格等)が重要となっている。   Various semiconductor light emitting devices such as lighting devices using semiconductor light emitting elements (hereinafter referred to as “light emitting elements” as appropriate) have been developed, and various means for improving output performance have been studied. In particular, in a light-emitting device that can be used for general lighting equipment, it is important to have high color rendering properties (basically, the average color rendering index Ra is 80 or more, US Energy Star standard, etc.).

半導体発光装置にて白色発光を実現する代表的な方法としては、第1に、赤色、緑色、青色に発光する3種類のLED(発光ダイオード)チップを使用する方法、第2に、青色LEDチップと、黄色または橙色蛍光体を組み合わせる方法、第3に、青色LEDチップと、緑色蛍光体と赤色蛍光体を組み合わせる方法、第4に、紫外発光LEDチップと、青色蛍光体と緑色蛍光体と赤色蛍光体を組み合わせる方法が挙げられる。この内一般的には、上記第2または第3の方法が広く実用化されている。   As a typical method for realizing white light emission in a semiconductor light emitting device, first, a method using three types of LED (light emitting diode) chips that emit red, green, and blue light, and second, a blue LED chip. And a method of combining yellow or orange phosphors, third, a method of combining blue LED chips, green phosphors and red phosphors, and fourth, ultraviolet light emitting LED chips, blue phosphors, green phosphors and red A method of combining phosphors is mentioned. Of these, generally, the second or third method is widely used.

上述した方法を適用したLED発光装置の構造としては、LEDチップを配線基板のカップ部(凹部)へ実装し、蛍光体を混合した透明封止樹脂を該カップ部に流し込み、硬化させて蛍光体を含有する樹脂層を形成した構造が一般的である(例えば、下記特許文献1及び特許文献2参照)。   As the structure of the LED light emitting device to which the above-described method is applied, the LED chip is mounted on the cup portion (recessed portion) of the wiring board, and the transparent sealing resin mixed with the phosphor is poured into the cup portion and cured to phosphor. A structure in which a resin layer containing is formed is common (see, for example, Patent Document 1 and Patent Document 2 below).

特許文献1に開示の発光装置では、発光素子として青色LEDチップを使用し、ピーク発光波長が異なる2種類の黄色蛍光体と赤色蛍光体との計3種類の蛍光体を透明樹脂に混合、分散させて蛍光体層を形成した構造となっている。特に、2種類の黄色蛍光体は、540±20nmのピーク発光波長を有する第1の黄色蛍光体と、この第1の黄色蛍光体のピーク発光波長より長く且つ590nm以下のピーク発光波長を有する第2の黄色蛍光体とし、赤色蛍光体の配合比を調整することで、発光輝度の低下をできるだけ抑制し、比較的高い演色性と、高い発光輝度を同時に実現するというものである。   In the light emitting device disclosed in Patent Document 1, a blue LED chip is used as a light emitting element, and a total of three types of phosphors of two types of yellow phosphors and red phosphors having different peak emission wavelengths are mixed and dispersed in a transparent resin. Thus, a phosphor layer is formed. In particular, the two types of yellow phosphors are a first yellow phosphor having a peak emission wavelength of 540 ± 20 nm and a first emission wavelength longer than the peak emission wavelength of the first yellow phosphor and having a peak emission wavelength of 590 nm or less. By adjusting the blending ratio of the red phosphors with the yellow phosphor of No. 2, it is possible to suppress a decrease in light emission luminance as much as possible, and to realize relatively high color rendering properties and high light emission luminance at the same time.

特許文献2に開示の発光装置では、赤色蛍光体を構成する窒化物蛍光体にAlとBを含有させることでピーク発光波長の長波長化により深い赤色の発光を実現し、他の蛍光体(例えば、緑色蛍光体、黄色蛍光体等)と組み合わせて蛍光体層を構成して、白色発光を実現している。   In the light emitting device disclosed in Patent Document 2, deep red light emission is realized by increasing the peak emission wavelength by adding Al and B to the nitride phosphor constituting the red phosphor, and other phosphors ( For example, a phosphor layer is configured in combination with a green phosphor, a yellow phosphor, etc., to realize white light emission.

特開2007−116117号公報JP 2007-116117 A 国際公開2006−077740号International Publication No. 2006-077740

しかしながら、特許文献1に開示の蛍光体層の構成では、LEDからの青色発光と蛍光体層からの黄色と赤色発光の組合せとなり、緑色領域の発光が少ないことより、特に緑色領域の色再現性が効率良くできず、演色評価数(Ri:i=1〜15)に偏りが発生するという問題があった。   However, the configuration of the phosphor layer disclosed in Patent Document 1 is a combination of blue light emission from the LED and yellow and red light emission from the phosphor layer, and less color emission in the green region. However, there is a problem that the color rendering index (Ri: i = 1 to 15) is biased.

また、平均演色評価数Ra、及び、特に特殊演色評価数R9(赤色)を向上させるためには、比較的波長の長い領域(630nm以上)にピーク発光波長を有する赤色蛍光体を含有させる必要があるが、赤色蛍光体の効率は、ピーク発光波長が長波長領域へシフトすると、ヒトの比視感度の影響により蛍光体自体の効率が急激に低下するため、結果として、半導体発光装置の効率低下を引き起こすという問題があった。発光効率の指標は幾つか存在するが、通常用いられているものは、投入電力に対する視感効率(単位:lm/W)であり、本願明細書においても同様である。比視感度は、国際的にはCIE(国際照明委員会)の標準比視感度曲線に、国内では経済産業省令第189号計量単位規則別表第8に分光視感効率として定義されている。つまり、ヒトの比視感度の影響とは、ヒトは、明るい所では555nm付近の光を最も強く感じ、暗い所では507nm付近の光を最も強く感じるとされるため、上記ピーク波長から離れて波長が長く或いは短くなった光に対して感度が低下し、より暗くなったと感じることを意味する。赤色の場合の視感効率は、波長が長くなると低下する。   Further, in order to improve the average color rendering index Ra and particularly the special color rendering index R9 (red), it is necessary to include a red phosphor having a peak emission wavelength in a relatively long wavelength region (630 nm or more). However, the efficiency of red phosphors is that when the peak emission wavelength is shifted to the long wavelength region, the efficiency of the phosphor itself is drastically reduced due to the effect of human relative visibility. There was a problem of causing. There are several indicators of luminous efficiency, but what is usually used is the luminous efficiency (unit: lm / W) with respect to the input power, and the same applies to the present specification. The specific luminous efficiency is internationally defined as the standard luminous efficiency curve of the CIE (International Commission on Illumination), and is defined as the spectral luminous efficiency in the Ministry of Economy, Trade and Industry Ordinance No. 189 Measurement Unit Regulations Appendix 8 in Japan. In other words, the effect of human visual acuity is that humans feel the strongest light near 555 nm in a bright place and the strongest light near 507 nm in a dark place. Means that the sensitivity is lowered with respect to light that is longer or shorter, and it is felt darker. The luminous efficiency in the case of red color decreases as the wavelength increases.

また、特許文献2に開示の発光装置では、深い赤色を実現する赤色蛍光体の具体的な実現方法及び当該赤色蛍光体と他の蛍光体を組み合わせた発光装置について複数の実施例が開示されているものの、同じ蛍光体の組み合わせにおいて、高い演色性を実現するために、如何なる蛍光体をどのような配合比で調整すべきかの指標までは開示されていない。   Further, in the light emitting device disclosed in Patent Document 2, a plurality of embodiments are disclosed regarding a specific method of realizing a red phosphor that realizes deep red and a light emitting device that combines the red phosphor and another phosphor. However, in order to achieve high color rendering in the same combination of phosphors, there is no disclosure of an index as to what phosphor should be adjusted and what mixing ratio.

本発明は、上記の問題点に鑑みてなされたものであり、その目的は、平均演色評価数Ra及び特殊演色評価数R9を高い数値で維持した状態で、発光効率の低下をできるだけ抑制した、一般照明用途で使用可能な高演色、高効率の発光装置を提供することにある。   The present invention has been made in view of the above problems, and its purpose is to suppress the decrease in luminous efficiency as much as possible while maintaining the average color rendering index Ra and the special color rendering index R9 at high values. An object of the present invention is to provide a high color rendering and high efficiency light emitting device that can be used in general lighting applications.

上記目的を達成するため、本願発明者の鋭意研究により、近紫外乃至青色領域にピーク発光波長を有するLEDと、緑色蛍光体と赤色蛍光体を含有する蛍光体層を備えて構成される発光装置において、赤色蛍光体として、比視感度のピークに近く、発光強度維持乃至改善への寄与の大きい短波長域とにピーク発光波長を有する赤色蛍光体と、演色性改善への寄与の大きい長波長域にピーク発光波長を有する赤色蛍光体の2種類を使用し、その配合比を調整することで、演色性と発光強度を制御できることを見出した。   In order to achieve the above object, a light emitting device comprising an LED having a peak emission wavelength in the near-ultraviolet to blue region and a phosphor layer containing a green phosphor and a red phosphor, as a result of diligent research by the present inventors. As a red phosphor, a red phosphor having a peak emission wavelength in the short wavelength region that is close to the peak of specific luminous sensitivity and greatly contributes to maintaining or improving the emission intensity, and a long wavelength that greatly contributes to improving color rendering It was found that the color rendering properties and the emission intensity can be controlled by using two types of red phosphors having a peak emission wavelength in the region and adjusting the blending ratio.

即ち、本発明は、上記目的を達成するため、近紫外乃至青色領域にピーク発光波長を有する光を放射する少なくとも1つの発光素子と、前記発光素子から放射された1次光によって励起され緑色領域にピーク発光波長を有する光を放射する緑色蛍光体と、前記1次光によって励起され赤色領域にピーク発光波長を有する光を放射する第1赤色蛍光体と、前記1次光によって励起され赤色領域に前記第1赤色蛍光体と異なるピーク発光波長を有する光を放射する第2赤色蛍光体を含有する蛍光体層と、を備えることを特徴とする発光装置を提供する。   That is, in order to achieve the above object, the present invention provides at least one light emitting element that emits light having a peak emission wavelength in the near ultraviolet to blue region, and the green region excited by the primary light emitted from the light emitting device. A green phosphor that emits light having a peak emission wavelength, a first red phosphor that is excited by the primary light and emits light having a peak emission wavelength in the red region, and a red region excited by the primary light. And a phosphor layer containing a second red phosphor that emits light having a peak emission wavelength different from that of the first red phosphor.

更に、上記特徴の発光装置において、前記緑色蛍光体のピーク発光波長が、510nm以上550nm以下の波長範囲内にあり、前記第1赤色蛍光体のピーク発光波長が、610nm以上625nm未満の波長範囲内にあり、前記第2赤色蛍光体のピーク発光波長が、625nm以上670nm以下の波長範囲内にあることが好ましく、更に、前記発光素子が、350nm以上490nm以下の波長範囲内にピーク発光波長を有する光を放射するLEDチップであることが好ましい。   Furthermore, in the light emitting device having the above characteristics, a peak emission wavelength of the green phosphor is in a wavelength range of 510 nm or more and 550 nm or less, and a peak emission wavelength of the first red phosphor is in a wavelength range of 610 nm or more and less than 625 nm. Preferably, the second red phosphor has a peak emission wavelength in a wavelength range of 625 nm to 670 nm, and the light emitting element has a peak emission wavelength in a wavelength range of 350 nm to 490 nm. LED chips that emit light are preferred.

更に、前記発光素子が、430nm以上490nm以下の波長範囲内にピーク発光波長を有する光を放射するLEDチップであることが好ましい。或いは、前記発光素子が、350nm以上430nm未満の波長範囲内にピーク発光波長を有する光を放射するLEDチップであり、前記蛍光体層が、前記発光素子から放射された1次光によって励起され、430nm以上490nm以下の波長範囲内にピーク発光波長を有する光を放射する青色蛍光体を更に含有することが好ましい。   Furthermore, the light emitting element is preferably an LED chip that emits light having a peak emission wavelength within a wavelength range of 430 nm or more and 490 nm or less. Alternatively, the light-emitting element is an LED chip that emits light having a peak emission wavelength in a wavelength range of 350 nm or more and less than 430 nm, and the phosphor layer is excited by primary light emitted from the light-emitting element, It is preferable to further contain a blue phosphor that emits light having a peak emission wavelength within a wavelength range of 430 nm to 490 nm.

更に、上記特徴の発光装置において、上記LEDチップは、InGaN系LEDチップであることが好ましく、前記緑色蛍光体が、AlLu:Ce系蛍光体、Ca(Sc,Mg)Si12:Ce系蛍光体、及び、Al12:Ce系蛍光体の何れか1つを含むことが好ましく、更に、前記第1及び第2赤色蛍光体の夫々が、(Sr,Ca)AlSiN:Eu系蛍光体、または、CaAlSiN:Eu系蛍光体であることが好ましい。 Furthermore, in the light emitting device having the above characteristics, the LED chip is preferably an InGaN-based LED chip, and the green phosphor is an Al 5 Lu x O y : Ce phosphor, Ca 3 (Sc, Mg) 2. It is preferable to include any one of Si 3 O 12 : Ce phosphor and Al 5 O 12 Y 3 : Ce phosphor, and each of the first and second red phosphors may include ( Sr, Ca) AlSiN 3 : Eu-based phosphors or CaAlSiN 3 : Eu-based phosphors are preferable.

上記特徴の発光装置によれば、光色の3原色である青、緑、赤の全ての光成分の発光スペクトルを備えるとともに、赤色蛍光体を2種類使用することで、赤色成分の発光スペクトルを広帯域化できるので、高い演色性が実現可能となる。赤色の発光スペクトルが長波長側にシフトすると、視感効率が低下するため、1種類の赤色蛍光体で高い演色性を実現しようとすれば、発光効率の大幅な低下を招くところ、赤色蛍光体を2種類使用することで、発光効率の維持したまま高い演色性が実現可能となる。   According to the light emitting device having the above characteristics, the light emission spectrum of the red component can be obtained by using two types of red phosphors as well as the light emission spectra of all three light components of blue, green, and red. Since the bandwidth can be increased, high color rendering can be realized. When the emission spectrum of red shifts to the longer wavelength side, the luminous efficiency decreases. Therefore, if high color rendering properties are to be realized with one type of red phosphor, the luminous efficiency is greatly reduced. By using two types, it is possible to realize high color rendering properties while maintaining the luminous efficiency.

更に、上記特徴の発光装置において、平均演色評価数Raが80≦Ra≦97となるように、前記第1及び第2赤色蛍光体の合計重量に対する夫々の重量配分が調整されていることが好ましい。特に、平均演色評価数Raが80≦Ra≦85となるように、前記第1及び第2赤色蛍光体の合計重量に対する第2赤色蛍光体の重量比が25%以下に調整されていること、或いは、平均演色評価数Raが85≦Ra≦90となるように、前記第1及び第2赤色蛍光体の合計重量に対する第2赤色蛍光体の重量比が25%以上75%以下に調整されていること、或いは、平均演色評価数Raが90≦Ra≦97となるように、前記第1及び第2赤色蛍光体の合計重量に対する第2赤色蛍光体の重量比が75%以上に調整されていることが好ましい。   Further, in the light emitting device having the above characteristics, it is preferable that the respective weight distribution with respect to the total weight of the first and second red phosphors is adjusted so that the average color rendering index Ra is 80 ≦ Ra ≦ 97. . In particular, the weight ratio of the second red phosphor to the total weight of the first and second red phosphors is adjusted to 25% or less so that the average color rendering index Ra is 80 ≦ Ra ≦ 85. Alternatively, the weight ratio of the second red phosphor to the total weight of the first and second red phosphors is adjusted to 25% to 75% so that the average color rendering index Ra is 85 ≦ Ra ≦ 90. Or the weight ratio of the second red phosphor to the total weight of the first and second red phosphors is adjusted to 75% or more so that the average color rendering index Ra is 90 ≦ Ra ≦ 97. Preferably it is.

上記特徴の発光装置では、赤色蛍光体を2種類使用することで、照明用光源として使用される場合に、高演色照明として使用可能とされる平均演色評価数Raが80以上の領域において、所望の平均演色評価数Raを選択することが可能となる。CIEでは、平均演色評価数Raが、80≦Ra<90では、住宅、ホテル、店舗、学校等で使用可能、Ra≧90では、美術館等で使用可能と定義されており、第1及び第2赤色蛍光体の配合比を調整することで、使用環境に応じた演色性と発光効率の調整が可能となる。尚、第2赤色蛍光体の配合比を大きくすることで、平均演色評価数Raが向上する一方、発光効率は相対的に低下する。しかし、上記特徴の発光装置では、80≦Ra≦97の範囲内で、第1及び第2赤色蛍光体の配合比を調整できるため、演色性を優先する場合は、第2赤色蛍光体の配合比を大きく、逆に、発光効率を優先する場合には、小さくすることで、多様な用途に適用可能となる。   In the light emitting device having the above characteristics, when two types of red phosphors are used, the average color rendering index Ra that can be used as high color rendering illumination when used as a light source for illumination is desired in an area of 80 or more. It is possible to select the average color rendering index Ra. In the CIE, the average color rendering index Ra is defined as being usable at homes, hotels, stores, schools, etc. when 80 ≦ Ra <90, and usable at art museums, etc. when Ra ≧ 90. By adjusting the mixing ratio of the red phosphor, it is possible to adjust the color rendering properties and the light emission efficiency according to the use environment. In addition, by increasing the blending ratio of the second red phosphor, the average color rendering index Ra is improved, but the light emission efficiency is relatively lowered. However, in the light emitting device having the above characteristics, since the blending ratio of the first and second red phosphors can be adjusted within the range of 80 ≦ Ra ≦ 97, the blending of the second red phosphor is prioritized when color rendering is prioritized. When the ratio is large and, conversely, when the luminous efficiency is prioritized, it can be applied to various applications by decreasing the ratio.

更に、赤色蛍光体を2種類使用することで、特殊演色評価数R9についても、赤色蛍光体が1種類の場合と比較して、発光効率の維持したまま高い演色性が実現可能となる。更に、演色性を優先する場合は、第2赤色蛍光体の配合比を大きく、逆に、発光効率を優先する場合には、小さくすることで、多様な用途に適用可能となる。   Furthermore, by using two types of red phosphors, it is possible to achieve a high color rendering property while maintaining luminous efficiency as compared with the case of using only one type of red phosphor for the special color rendering index R9. Furthermore, when priority is given to color rendering, the blending ratio of the second red phosphor is increased, and conversely, when priority is given to light emission efficiency, it can be applied to various applications by decreasing it.

更に、上記特徴の発光装置において、前記蛍光体層が、透明樹脂に粒状の前記緑色蛍光体と粒状の前記第1赤色蛍光体と粒状の前記第2赤色蛍光体を混合して形成されるか、或いは、透明樹脂に粒状の前記緑色蛍光体を混合した緑色蛍光体層と、透明樹脂に粒状の前記第1赤色蛍光体を混合した第1赤色蛍光体層と、透明樹脂に粒状の前記第2赤色蛍光体を混合した第2赤色蛍光体層を積層した積層構造として形成されるか、または、前記蛍光体層が、透明樹脂に粒状の前記緑色蛍光体を混合した緑色蛍光体層と、透明樹脂に粒状の前記第1赤色蛍光体と粒状の前記第2第1赤色蛍光体赤色蛍光体を混合した赤色蛍光体層を積層した積層構造として形成されることが好ましい。   Furthermore, in the light emitting device having the above characteristics, is the phosphor layer formed by mixing the granular green phosphor, the granular first red phosphor and the granular second red phosphor in a transparent resin? Alternatively, a green phosphor layer in which the granular green phosphor is mixed in a transparent resin, a first red phosphor layer in which the granular first red phosphor is mixed in a transparent resin, and the granular first in a transparent resin. Formed as a laminated structure in which a second red phosphor layer in which two red phosphors are mixed is laminated, or the phosphor layer is a green phosphor layer in which a granular green phosphor is mixed in a transparent resin; It is preferable to form a laminated structure in which a red phosphor layer obtained by mixing the granular first red phosphor and the granular second first red phosphor red phosphor on a transparent resin is laminated.

更に、前記発光素子が、前記蛍光体層、前記蛍光体層の最下層、または、前記蛍光体層より前記発光素子側に設けられた蛍光体を含まない透明樹脂層によって封止されていることが好ましい。また、前記緑色蛍光体層が、前記第1赤色蛍光体と前記第2赤色蛍光体が存在する層より上層に位置することが好ましい。   Further, the light emitting element is sealed with the phosphor layer, the lowermost layer of the phosphor layer, or a transparent resin layer not including a phosphor provided on the light emitting element side from the phosphor layer. Is preferred. Moreover, it is preferable that the said green fluorescent substance layer is located in the upper layer from the layer in which the said 1st red fluorescent substance and the said 2nd red fluorescent substance exist.

これにより、蛍光体層の構造及び発光素子の封止構造として、実装形態に応じた多様な構造が可能となる。特に、緑色蛍光体層を蛍光体層の上層部に設けることで、緑色蛍光体から放射される緑色光が、第1または第2赤色蛍光体で吸収されるのを抑制できるため、結果として、高い発光効率が実現できる。   Thereby, various structures according to the mounting form are possible as the structure of the phosphor layer and the sealing structure of the light emitting element. In particular, by providing the green phosphor layer on the upper part of the phosphor layer, it is possible to suppress the green light emitted from the green phosphor from being absorbed by the first or second red phosphor, High luminous efficiency can be realized.

更に、前記緑色蛍光体の粒径のメジアン値が8μm以上20μm以下であること、前記第1赤色蛍光体と前記第2赤色蛍光体の粒径の各メジアン値が5μm以上15μm以下であることが、夫々好ましい。これにより、各蛍光体の発光効率の高い領域での使用が可能となり、結果として、高い発光効率が実現できる。更に、前記蛍光体層の各層の前記透明樹脂が、硬化前粘度が3Pa・s以上20Pa・s以下のシリコーン樹脂であることが好ましい。これにより、粒状の各蛍光体を透明樹脂内に一様に分散させて混合する工程を量産性良く実現できる。   Furthermore, the median value of the particle size of the green phosphor is 8 μm or more and 20 μm or less, and the median value of the particle size of the first red phosphor and the second red phosphor is 5 μm or more and 15 μm or less. Each is preferable. As a result, each phosphor can be used in a region where the luminous efficiency is high, and as a result, high luminous efficiency can be realized. Furthermore, it is preferable that the transparent resin of each layer of the phosphor layer is a silicone resin having a viscosity before curing of 3 Pa · s to 20 Pa · s. Thereby, the process which disperse | distributes and uniformly each granular fluorescent substance in transparent resin is realizable with mass-productivity.

以上、上記特徴の発光装置により、平均演色評価数Ra及び特殊演色評価数R9を向上させつつ、発光効率の低下をできるだけ抑制した、一般照明用途で使用可能な高演色、高効率の発光装置の提供が可能となる。   As described above, the light emitting device having the above characteristics can improve the average color rendering index Ra and the special color rendering index R9, and suppress the decrease in the light emission efficiency as much as possible. Provision is possible.

本発明に係る発光装置の一実施形態の概略構造を模式的に示す概略断面図Schematic sectional view schematically showing a schematic structure of an embodiment of a light emitting device according to the present invention 本発明に係る発光装置の実施例1〜7の各蛍光体のピーク発光波長及び配合比と光学特性を一覧表示する図The figure which displays as a list the peak emission wavelength of each fluorescent substance of Examples 1-7 of the light-emitting device which concerns on this invention, a compounding ratio, and an optical characteristic. 比較例1,2の各蛍光体のピーク発光波長及び配合比と光学特性を一覧表示する図The figure which displays as a list the peak light emission wavelength of each phosphor of Comparative Examples 1 and 2, the compounding ratio, and the optical characteristics 実施例1〜7及び比較例1,2の発光スペクトルを示す図The figure which shows the emission spectrum of Examples 1-7 and Comparative Examples 1 and 2. 実施例1〜7における発光強度(相対値)と第2赤色蛍光体の配合比の関係を示す図The figure which shows the relationship between the emitted light intensity (relative value) in Examples 1-7, and the compounding ratio of a 2nd red fluorescent substance. 実施例1〜7における平均演色評価数Raと第2赤色蛍光体の配合比の関係を示す図The figure which shows the relationship between the average color-rendering evaluation number Ra in Examples 1-7, and the compounding ratio of 2nd red fluorescent substance. 本発明に係る発光装置の蛍光体層を多層構造とした別実施形態の概略構造を模式的に示す概略要部断面図FIG. 2 is a schematic cross-sectional view of a main part schematically showing a schematic structure of another embodiment in which the phosphor layer of the light emitting device according to the present invention has a multilayer structure. 本発明に係る発光装置の蛍光体層を多層構造とした他の別実施形態の概略構造を模式的に示す概略要部断面図FIG. 2 is a schematic cross-sectional view of a main part schematically showing a schematic structure of another embodiment in which the phosphor layer of the light emitting device according to the present invention has a multilayer structure. 本発明に係る発光装置のリードフレームパッケージに実装した別実施形態の概略構造を模式的に示す概略断面図The schematic sectional drawing which shows typically the schematic structure of another embodiment mounted in the lead frame package of the light-emitting device which concerns on this invention. 本発明に係る発光装置の蛍光体層をドーム形状とした別実施形態の概略構造を模式的に示す概略斜視図The schematic perspective view which shows typically the schematic structure of another embodiment which made the fluorescent substance layer of the light-emitting device concerning this invention the dome shape

本発明に係る発光装置(以下、適宜「本発光装置」という。)の実施の形態につき、照明用の白色光源として使用される場合を想定して、図面に基づいて説明する。尚、本発光装置の構造を示す図面においては、適宜、要部を強調し、或いは、模式的に図示している箇所が存在するため、各部の寸法比は必ずしも実際の構造と一致していない。   An embodiment of a light-emitting device according to the present invention (hereinafter referred to as “the present light-emitting device” as appropriate) will be described based on the drawings on the assumption that it is used as a white light source for illumination. Note that in the drawings showing the structure of the light emitting device, there are places where important parts are emphasized or schematically illustrated, and therefore the dimensional ratio of each part does not necessarily match the actual structure. .

図1は、本発光装置の一例を模式的に示す概略構造断面図である。図1に示すように、本発光装置1は、セラミック基板2、配線パターン3(3a,3k)、電極ランド4(4a,4k)、蛍光体層5、LEDチップ6、ワイヤー7、印刷抵抗素子8,樹脂ダム9を備えて構成される。尚、図1(a)は上面図、図1(b)は、LEDチップ6とワイヤー7を切断するXZ断面での要部断面図である。図1(a)においては、接続関係を明瞭にするために、内部を透明化して図示している。   FIG. 1 is a schematic cross-sectional view schematically showing an example of the light emitting device. As shown in FIG. 1, the light emitting device 1 includes a ceramic substrate 2, a wiring pattern 3 (3a, 3k), an electrode land 4 (4a, 4k), a phosphor layer 5, an LED chip 6, a wire 7, and a printing resistance element. 8. A resin dam 9 is provided. 1A is a top view, and FIG. 1B is a cross-sectional view of the main part in the XZ cross section for cutting the LED chip 6 and the wire 7. In FIG. 1A, in order to clarify the connection relationship, the inside is shown transparent.

セラミック基板2は上面視長方形状で、一例として、外形を24mm×20mm、厚みを1mmとする。配線パターン3a,3kは、相互に対向するようにセラミック基板2上にスクリーン印刷方法等により形成される。夫々は、本発光装置1の上面から見て円環から一部切り出された円弧形状を構成している。電極ランド4a,4kは、外部接続用(例えば電源供給用途)の電極として、材質がAg−Pt等でスクリーン印刷方法等により形成される。厚みの一例は20μmである。電極ランド4aは配線パターン3aの一端と引き出し用配線を介して接続され、電極ランド5kは配線パターン3kの一端と引き出し用配線を介して接続されている。   The ceramic substrate 2 has a rectangular shape in a top view. As an example, the outer shape is 24 mm × 20 mm and the thickness is 1 mm. The wiring patterns 3a and 3k are formed on the ceramic substrate 2 by a screen printing method or the like so as to face each other. Each of the light emitting devices 1 has an arc shape that is partly cut out from the ring as viewed from the upper surface of the light emitting device 1. The electrode lands 4a and 4k are formed of a material such as Ag-Pt by a screen printing method or the like as an electrode for external connection (for example, for power supply). An example of the thickness is 20 μm. The electrode land 4a is connected to one end of the wiring pattern 3a via a lead wire, and the electrode land 5k is connected to one end of the wiring pattern 3k via a lead wire.

蛍光体層5は、LEDチップ6から放射された光(例えば、青色光)の一部を、緑色光と2種類の赤色光に変換して、当該4色の光を混ぜ合わせ白色光として放射するものである。蛍光体層5は、透明樹脂に粒状の緑色蛍光体と粒状の第1赤色蛍光体と粒状の第2赤色蛍光体が夫々一様に分散して混合された蛍光体混合樹脂を、円環状に形成された樹脂ダム9の内側に注入し、例えば、100℃で1時間、引き続き、150℃で3〜5時間熱硬化させることで形成される。また、蛍光体層5は、LEDチップ6を封止するための封止樹脂として機能する。蛍光体層5の厚さは、樹脂ダム9の高さとほぼ同じで、LEDチップ6の厚さより大きく、例えば0.6〜1.0mm程度である。   The phosphor layer 5 converts part of the light (for example, blue light) emitted from the LED chip 6 into green light and two types of red light, and mixes the light of the four colors to emit as white light. To do. The phosphor layer 5 is made of an annular, phosphor-mixed resin in which a granular green phosphor, a granular first red phosphor and a granular second red phosphor are uniformly dispersed and mixed in a transparent resin. For example, the resin dam 9 is formed by being injected into the inside of the resin dam 9 and thermally cured at 100 ° C. for 1 hour and then at 150 ° C. for 3 to 5 hours. The phosphor layer 5 functions as a sealing resin for sealing the LED chip 6. The thickness of the phosphor layer 5 is substantially the same as the height of the resin dam 9, and is larger than the thickness of the LED chip 6, for example, about 0.6 to 1.0 mm.

透明樹脂の好適な実施形態として、硬化前粘度が3Pa・s以上20Pa・s以下のシリコーン樹脂を使用する。また、シリコーン樹脂には、各蛍光体の沈降を抑制するため、更に、LEDチップ6及び各蛍光体からの発光を効率良く拡散させるために、一例として、微細シリカ粒子が混入されている。尚、シリカ粒子等の沈降抑制剤や拡散剤は必ずしも混入する必要はない。   As a preferred embodiment of the transparent resin, a silicone resin having a viscosity before curing of 3 Pa · s to 20 Pa · s is used. In addition, fine silica particles are mixed in the silicone resin as an example in order to suppress sedimentation of each phosphor and to further diffuse light emitted from the LED chip 6 and each phosphor efficiently. In addition, it is not always necessary to mix a sedimentation inhibitor such as silica particles or a diffusing agent.

緑色蛍光体として、ピーク発光波長が510nm以上550nm以下の波長範囲内にある、AlLu:Ce系蛍光体、Ca(Sc1−x,MgSi12:Ce系蛍光体(但し、0.01≦x≦0.4が好ましい。)、または、Al12:Ce系蛍光体を使用する。更に、緑色蛍光体として、以下の一般式で表される3価のセリウム付活珪酸塩蛍光体が使用できる。
一般式: MI(MII1−x,Ce(SiO
但し、MIは、Mg,Ca,Sr及びBaの中から選択される少なくとも1種の元素であり、MIIは、Al,Ga,In,Sc,Y,La,Gd及びLuから選択される少なくとも1種の元素であり、0.01≦x≦0.4である。
As a green phosphor, the peak emission wavelength is in the wavelength range of 510 nm or more and 550 nm or less, and Al 5 Lu x O y : Ce-based phosphor, Ca 3 (Sc 1-x , Mg x ) 2 Si 3 O 12 : Ce A phosphor based on a phosphor (preferably 0.01 ≦ x ≦ 0.4) or an Al 5 O 12 Y 3 : Ce phosphor is used. Furthermore, as the green phosphor, a trivalent cerium-activated silicate phosphor represented by the following general formula can be used.
General formula: MI 3 (MII 1-x , Ce x ) 2 (SiO 4 ) 3
However, MI is at least one element selected from Mg, Ca, Sr, and Ba, and MII is at least one selected from Al, Ga, In, Sc, Y, La, Gd, and Lu. It is a seed element, and 0.01 ≦ x ≦ 0.4.

緑色蛍光体の発光スペクトルの半値幅は、緑色蛍光体が1種類であるため、広い方が好ましく、例えば95nm以上の蛍光体を使用する。上記LuAG系蛍光体、CSMS系蛍光体、及び、YAG系蛍光体は、何れもCeを付活剤とするガーネット結晶構造の蛍光体であり、Ceを付活剤として使用するので、半値幅の広い(95nm以上)の蛍光スペクトルが得られ、高い演色性を得るのに好適な緑色蛍光体である。当該半値幅は、例えば、AlLu:Ce系蛍光体では102nm、Ca(Sc,Mg)Si12:Ce系蛍光体では103nmが得られる。 The half width of the emission spectrum of the green phosphor is preferably wider because there is only one kind of green phosphor. For example, a phosphor of 95 nm or more is used. The LuAG phosphor, the CSMS phosphor, and the YAG phosphor are all phosphors having a garnet crystal structure using Ce as an activator, and Ce is used as an activator. It is a green phosphor suitable for obtaining a wide (95 nm or more) fluorescence spectrum and obtaining high color rendering properties. For example, 102 nm is obtained for the full width at half maximum for Al 5 Lu x O y : Ce phosphor, and 103 nm is obtained for Ca 3 (Sc, Mg) 2 Si 3 O 12 : Ce phosphor.

第1赤色蛍光体として、ピーク発光波長が、610nm以上625nm未満の波長範囲内にある、(Sr1−y,Ca1−xAlSiN:Eu系蛍光体(但し、0.001≦x≦0.05、0≦y<0.2が好ましい。)を使用する。 As a first red phosphor, the peak emission wavelength is within the wavelength range to less than 610nm 625nm, (Sr 1-y , Ca y) 1-x AlSiN 3: Eu x phosphor (where, 0.001 ≦ x ≦ 0.05 and 0 ≦ y <0.2 are preferred.).

第2赤色蛍光体として、ピーク発光波長が、625nm以上670nm以下の波長範囲内にある、(Sr1−y,Ca1−xAlSiN:Eu系蛍光体(但し、0.001≦x≦0.05、0.2≦y<1が好ましい。)、または、Ca1−xAlSiN:Eu系蛍光体(但し、0.001≦x≦0.05が好ましい。)を使用する。 As a second red phosphor, the peak emission wavelength is within 670nm or less in the wavelength range of 625nm, (Sr 1-y, Ca y) 1-x AlSiN 3: Eu x phosphor (where, 0.001 ≦ . x ≦ 0.05,0.2 ≦ y <1 is preferable), or, Ca 1-x AlSiN 3: Eu x phosphor (where, using the preferred) is 0.001 ≦ x ≦ 0.05. To do.

(Sr1−y,Ca1−xAlSiN:Eu系蛍光体は、Ca1−xAlSiN:Eu系蛍光体において、Caの一部または全部が、Srの置換されたものであり、ともに温度変化に対して蛍光特性の変動の少ない蛍光体である。従って、第1及び第2赤色蛍光体としてこれらを使用した場合には、発光装置として赤色領域の発光の温度依存性を小さくでき、更に、緑色蛍光体として温度依存性の小さい蛍光特性のCa(Sc,Mg)Si12:Ce系蛍光体やAlLu:Ce系蛍光体を同様に使用することで、全体の発光特性の温度依存性の小さい発光装置が実現できる。即ち、温度依存性の小さい高演色性の発光装置が実現できる。 (Sr 1-y, Ca y ) 1-x AlSiN 3: Eu x phosphor is, Ca 1-x AlSiN 3: In Eu x phosphor, which part or all of Ca was substituted for Sr Both of them are phosphors with little variation in fluorescence characteristics with respect to temperature changes. Therefore, when these are used as the first and second red phosphors, the temperature dependence of the light emission in the red region can be reduced as the light emitting device, and further, the Ca 3 having a fluorescence characteristic of less temperature dependence as the green phosphor. By using (Sc, Mg) 2 Si 3 O 12 : Ce phosphor and Al 5 Lu x O y : Ce phosphor in the same manner, a light emitting device with low temperature dependence of the entire light emission characteristics can be realized. . That is, a light-emitting device having high color rendering properties with low temperature dependence can be realized.

また、(Sr1−y,Ca1−xAlSiN:Eu系蛍光体とCa1−xAlSiN:Eu系蛍光体は、比重差が小さいので、後述するように、発光素子を封止する透明樹脂中に添加した際、比重差による沈降バラツキが小さく、演色性を含めた発光装置の発光特性のバラツキを軽減できる。尚、以下の本文中において、(Sr1−y,Ca1−xAlSiN:Eu系蛍光体、Ca1−xAlSiN:Eu系蛍光体を、適宜簡略化して、(Sr,Ca)AlSiN:Eu系蛍光体、CaAlSiN:Eu系蛍光体と記載する。 Further, (Sr 1-y, Ca y) 1-x AlSiN 3: Eu x phosphor and Ca 1-x AlSiN 3: Since Eu x phosphor has a specific gravity difference is small, as described later, the light emitting element When added to the transparent resin for sealing, the variation in sedimentation due to the difference in specific gravity is small, and the variation in the light emission characteristics of the light emitting device including the color rendering can be reduced. It is to be noted that, in the following text, (Sr 1-y, Ca y) 1-x AlSiN 3: Eu x phosphor, Ca 1-x AlSiN 3: the Eu x phosphor, and appropriately simplified, (Sr , Ca) AlSiN 3 : Eu phosphor and CaAlSiN 3 : Eu phosphor.

更に、第1及び第2赤色蛍光体として、以下の一般式で示される窒化物蛍光体が使用できる。
一般式: (MI1−x,Eu)MIISiN
但し、MIは、Mg,Ca,Sr及びBaの中から選択される少なくとも1種の元素であり、MIIは、Al,Ga,In,Sc,Y,La,Gd及びLuから選択される少なくとも1種の元素であり、0.001≦x≦0.05である。
Furthermore, nitride phosphors represented by the following general formula can be used as the first and second red phosphors.
General formula: (MI 1-x , Eu x ) MIISiN 3
However, MI is at least one element selected from Mg, Ca, Sr, and Ba, and MII is at least one selected from Al, Ga, In, Sc, Y, La, Gd, and Lu. It is a seed element, and 0.001 ≦ x ≦ 0.05.

第1及び第2赤色蛍光体の発光スペクトルの半値幅は、緑色蛍光体と同様に広い方が好ましいが、2種類使用するため、赤色全体としての発光スペクトルが特定波長でピークを有しないように制限される方が良く、例えば、半値幅が85〜110nm程度の蛍光体を使用する。例えば、(Sr,Ca)AlSiN:Eu系蛍光体では88nm、CaAlSiN:Eu系蛍光体では90nmのものを使用する。 The half width of the emission spectrum of the first and second red phosphors is preferably wider as in the case of the green phosphor. However, since two types are used, the emission spectrum as a whole red has no peak at a specific wavelength. For example, a phosphor having a half width of about 85 to 110 nm is used. For example, 88 nm is used for the (Sr, Ca) AlSiN 3 : Eu phosphor, and 90 nm is used for the CaAlSiN 3 : Eu phosphor.

また、各蛍光体の粒径は、夫々のメジアン値(D50)が、緑色蛍光体では8μm以上20μm以下、第1及び第2赤色蛍光体では5μm以上15μm以下であるのが好ましい。   The particle diameter of each phosphor is preferably such that the median value (D50) is 8 μm to 20 μm for the green phosphor and 5 μm to 15 μm for the first and second red phosphors.

蛍光体層5は、本発光装置1における重要な構成要素であり、各蛍光体の発光スペクトルのピーク発光波長及び各蛍光体の配合比は、発光効率及び演色性に影響を与えるため、後述する7つの実施例において詳細に説明する。   The phosphor layer 5 is an important component in the light emitting device 1, and the peak emission wavelength of the emission spectrum of each phosphor and the blending ratio of each phosphor affect the luminous efficiency and color rendering, and will be described later. Seven embodiments will be described in detail.

LEDチップ6は、青色領域(波長:430nm以上490nm以下)にピーク発光波長が存在する青色成分を含む光を放射する半導体発光素子のベアチップで、InGaN系LEDで構成される。ピーク発光波長が430未満の場合、演色性が低下し、490nmを超えると白色での明るさが低下するため、実用性の観点から上記波長範囲が好ましい。本実施形態では、一例として、ピーク発光波長が450nm近傍のものを使用する。また、本実施形態では、LEDチップ6は、基板2上にダイボンドされ、基板2の一辺(X方向)にほぼ平行になるように複数個が直線状に複数列配置されている。そして、配線パターン3で囲まれたエリア内で高密度に配置できるよう、配線パターン3と印刷抵抗素子8とで形成される円環形状の中心付近において列内のチップ数を最も多くし、中心から基板の周辺に向かうに連れて列内のチップ数が少なくなるように配置されている。図1に示す例では、LEDチップ6は12個直列に接続したものが12列並列に接続されて構成されている。また、LEDチップ6は、チップ上面から発光が出射される構造で、チップ表面に隣接するLEDチップ6または配線パターン3とワイヤー7で相互に接続するための図示しない電極パッド(アノード用、カソード用)が形成されている。尚、LEDチップ6が裏面出射タイプの場合は、ワイヤー7に相当する配線及びランドを基板2上に予め形成し、LEDチップ6を表面の電極パッドを基板2の表面に対向させてバンプを介してフリップチップ接続により搭載するようにしても構わない。   The LED chip 6 is a bare chip of a semiconductor light emitting element that emits light including a blue component having a peak emission wavelength in a blue region (wavelength: 430 nm or more and 490 nm or less), and is configured by an InGaN-based LED. When the peak emission wavelength is less than 430, the color rendering property is lowered, and when it exceeds 490 nm, the brightness in white is lowered. Therefore, the above wavelength range is preferable from the viewpoint of practicality. In the present embodiment, as an example, a peak emission wavelength near 450 nm is used. In the present embodiment, the LED chips 6 are die-bonded on the substrate 2, and a plurality of LED chips 6 are linearly arranged so as to be substantially parallel to one side (X direction) of the substrate 2. The number of chips in the column is maximized in the vicinity of the center of the annular shape formed by the wiring pattern 3 and the printed resistance element 8 so that the wiring pattern 3 and the printed resistance element 8 can be arranged at high density in the area surrounded by the wiring pattern 3. The number of chips in the row decreases as the distance from the substrate to the periphery of the substrate increases. In the example shown in FIG. 1, 12 LED chips 6 connected in series are connected in 12 rows in parallel. The LED chip 6 has a structure in which light emission is emitted from the upper surface of the chip, and an electrode pad (not shown) for anode or cathode for connecting the LED chip 6 or the wiring pattern 3 adjacent to the chip surface and the wire 7 with each other. ) Is formed. When the LED chip 6 is a back emission type, wirings and lands corresponding to the wires 7 are formed on the substrate 2 in advance, and the LED chip 6 is placed on the surface of the substrate 2 with the electrode pads facing the surface of the substrate 2 via bumps. It may be mounted by flip chip connection.

印刷抵抗素子8は、静電耐圧を高める目的で設けられており、一例として幅200μm、幅6μm、抵抗値50MΩのRhOによって形成される。図1に示すように、印刷抵抗素子8は、配線パターン3aの一端と配線パターン3kの一端に接続するように配置され、円環から一部切り出された円弧形状を構成している。本実施形態では、配線パターン3aと印刷抵抗素子8と配線パターン3kの夫々が、同一の円環の一部分を構成するように配置されている。 The printed resistance element 8 is provided for the purpose of increasing the electrostatic withstand voltage, and is formed of RhO 2 having a width of 200 μm, a width of 6 μm, and a resistance value of 50 MΩ as an example. As shown in FIG. 1, the printed resistance element 8 is disposed so as to be connected to one end of the wiring pattern 3 a and one end of the wiring pattern 3 k, and forms an arc shape partly cut out from the circular ring. In the present embodiment, each of the wiring pattern 3a, the printed resistance element 8, and the wiring pattern 3k is arranged so as to constitute a part of the same ring.

樹脂ダム9は、封止樹脂である蛍光体層5を堰き止めるための樹脂であり、有着色材料(白色や乳白色が好ましい)で構成されている。本実施形態では、樹脂ダム9を、白色シリコーン樹脂(フィラーTiO含有)の材質で、幅1mm、径9mmの円環状に形成した。樹脂ダム9は、上記シリコーン樹脂を円環状に流し込んだ後、150℃の硬化温度で1時間熱硬化させ形成した。樹脂ダム9は、図1(a)に示すように、配線パターン3と印刷抵抗素子8が形成する円弧状部分を覆うように形成されるのが好ましい。 The resin dam 9 is a resin for blocking the phosphor layer 5 that is a sealing resin, and is made of a colored material (white or milky white is preferable). In this embodiment, the resin dam 9 is made of a white silicone resin (containing filler TiO 2 ) and formed in an annular shape having a width of 1 mm and a diameter of 9 mm. The resin dam 9 was formed by pouring the silicone resin into an annular shape, followed by thermosetting at 150 ° C. for 1 hour. As shown in FIG. 1A, the resin dam 9 is preferably formed so as to cover an arc-shaped portion formed by the wiring pattern 3 and the printed resistance element 8.

次に、本発光装置1における重要な構成要素である蛍光体層5の構成と光学特性(発光強度、平均演色評価数Ra、特殊演色評価数R9、色温度)との関係について、以下の7つの実施例1〜7に基づいて説明する。各実施例では、各蛍光体の発光スペクトルのピーク発光波長及び各蛍光体の配合比の少なくとも何れか1つが相互に異なる。尚、配合比は、各蛍光体の重量比で規定される。尚、各実施例において、緑色蛍光体と第1及び第2赤色蛍光体の合計との配合比は、5:1と共通にしている。   Next, regarding the relationship between the configuration of the phosphor layer 5 which is an important component in the light emitting device 1 and the optical characteristics (emission intensity, average color rendering index Ra, special color rendering index R9, color temperature), the following 7 This will be described based on the first to seventh embodiments. In each embodiment, at least one of the peak emission wavelength of the emission spectrum of each phosphor and the blending ratio of each phosphor is different from each other. The blending ratio is defined by the weight ratio of each phosphor. In each example, the mixing ratio of the green phosphor and the sum of the first and second red phosphors is 5: 1.

また、各実施例と比較するための後述する2つの比較例1,2について上記光学特性を計測した。尚、各実施例及び比較例は、LEDチップ6として、ピーク発光波長が450nm近傍のInGaN系LEDを使用し、何れも色温度3000〜3300K近傍の白色光源としての使用を想定した。また、各実施例及び比較例では、蛍光体層5以外の構成は、上述の構成と同じであるので、重複する説明は割愛する。   Further, the optical characteristics were measured for two comparative examples 1 and 2 to be described later for comparison with each example. In each of the examples and comparative examples, an InGaN-based LED having a peak emission wavelength near 450 nm was used as the LED chip 6, and both were assumed to be used as a white light source near a color temperature of 3000 to 3300K. Moreover, in each Example and Comparative Example, since structures other than the phosphor layer 5 are the same as the above-described structures, a duplicate description is omitted.

〈実施例1〉
実施例1では、緑色蛍光体として、535nm付近にピーク発光波長を有するAlLu:Ce系蛍光体を、第1赤色蛍光体として、620nm付近にピーク発光波長を有する(Sr,Ca)AlSiN:Eu系蛍光体を、第2赤色蛍光体として、650nm付近にピーク発光波長を有するCaAlSiN:Eu系蛍光体を使用した。また、緑色蛍光体、第1赤色蛍光体、第2赤色蛍光体の配合比を、5:0.98:0.02とした。発光強度の相対値(実施例1〜7の内の最も低い発光強度を基準とする)が118.6%、平均演色評価数Raが81.65、特殊演色評価数R9が9.31、色温度が3263Kとなった。
<Example 1>
In Example 1, an Al 5 Lu x O y : Ce phosphor having a peak emission wavelength in the vicinity of 535 nm is used as the green phosphor, and a peak emission wavelength is in the vicinity of 620 nm as the first red phosphor (Sr, Ca ) AlSiN 3 : Eu phosphor was used as the second red phosphor, and CaAlSiN 3 : Eu phosphor having a peak emission wavelength in the vicinity of 650 nm was used. Further, the blending ratio of the green phosphor, the first red phosphor, and the second red phosphor was set to 5: 0.98: 0.02. The relative value of the emission intensity (based on the lowest emission intensity in Examples 1 to 7) is 118.6%, the average color rendering index Ra is 81.65, the special color rendering index R9 is 9.31, and the color The temperature became 3263K.

〈実施例2〉
実施例2では、緑色蛍光体として、520nm付近にピーク発光波長を有するCa(Sc,Mg)Si12:Ce系蛍光体を、第1赤色蛍光体として、620nm付近にピーク発光波長を有する(Sr,Ca)AlSiN:Eu系蛍光体を、第2赤色蛍光体として、650nm付近にピーク発光波長を有するCaAlSiN:Eu系蛍光体を使用した。また、緑色蛍光体、第1赤色蛍光体、第2赤色蛍光体の配合比を、5:0.98:0.02とした。実施例1との相違点は、緑色蛍光体のピーク発光波長と蛍光体材料である。
<Example 2>
In Example 2, as a green phosphor, a Ca 3 (Sc, Mg) 2 Si 3 O 12 : Ce-based phosphor having a peak emission wavelength near 520 nm is used as a first red phosphor, and a peak emission wavelength is around 620 nm. the a (Sr, Ca) AlSiN 3: Eu-based phosphors, as the second red phosphor, CaAlSiN 3 has a peak emission wavelength in the vicinity of 650 nm: using Eu phosphor. Further, the blending ratio of the green phosphor, the first red phosphor, and the second red phosphor was set to 5: 0.98: 0.02. The difference from Example 1 is the peak emission wavelength of the green phosphor and the phosphor material.

発光強度の相対値が109.3%、平均演色評価数Raが83.57、特殊演色評価数R9が12.16、色温度が3004Kとなった。実施例1と比較して、緑色蛍光体のピーク発光波長が短くなったため、発光強度は僅かに低下したが、演色性は高くなった。   The relative value of the emission intensity was 109.3%, the average color rendering index Ra was 83.57, the special color rendering index R9 was 12.16, and the color temperature was 3004K. Compared with Example 1, since the peak emission wavelength of the green phosphor was shortened, the emission intensity was slightly reduced, but the color rendering was increased.

〈実施例3〉
実施例3では、緑色蛍光体として、535nm付近にピーク発光波長を有するAlLu:Ce系蛍光体を、第1赤色蛍光体として、620nm付近にピーク発光波長を有する(Sr,Ca)AlSiN:Eu系蛍光体を、第2赤色蛍光体として、630nm付近にピーク発光波長を有する(Sr,Ca)AlSiN:Eu系蛍光体を使用した。また、緑色蛍光体、第1赤色蛍光体、第2赤色蛍光体の配合比を、5:0.83:0.17とした。実施例1との相違点は、第2赤色蛍光体のピーク発光波長と蛍光体材料、及び、第1及び第2赤色蛍光体の配合比である。
<Example 3>
In Example 3, an Al 5 Lu x O y : Ce phosphor having a peak emission wavelength in the vicinity of 535 nm is used as the green phosphor, and a peak emission wavelength in the vicinity of 620 nm is used as the first red phosphor (Sr, Ca ) AlSiN 3 : Eu-based phosphor was used as the second red phosphor, and (Sr, Ca) AlSiN 3 : Eu-based phosphor having a peak emission wavelength in the vicinity of 630 nm was used. The blending ratio of the green phosphor, the first red phosphor, and the second red phosphor was set to 5: 0.83: 0.17. The difference from Example 1 is the peak emission wavelength of the second red phosphor, the phosphor material, and the mixing ratio of the first and second red phosphors.

発光強度の相対値が115.9%、平均演色評価数Raが82.26、特殊演色評価数R9が9.44、色温度が3041Kとなった。実施例1と比較して、第2赤色蛍光体のピーク発光波長が短くなったが、配合比を大きくしたため、発光強度が僅かに低下したものの高水準を維持し、且つ、演色性も向上した。   The relative value of the emission intensity was 115.9%, the average color rendering index Ra was 82.26, the special color rendering index R9 was 9.44, and the color temperature was 3041K. Compared with Example 1, the peak emission wavelength of the second red phosphor was shortened, but since the compounding ratio was increased, the emission intensity was slightly reduced but the high level was maintained and the color rendering was also improved. .

〈実施例4〉
実施例4では、緑色蛍光体として、535nm付近にピーク発光波長を有するAlLu:Ce系蛍光体を、第1赤色蛍光体として、620nm付近にピーク発光波長を有する(Sr,Ca)AlSiN:Eu系蛍光体を、第2赤色蛍光体として、650nm付近にピーク発光波長を有するCaAlSiN:Eu系蛍光体を使用した。また、緑色蛍光体、第1赤色蛍光体、第2赤色蛍光体の配合比を、5:0.78:0.22とした。実施例1との相違点は、第1及び第2赤色蛍光体の配合比である。
<Example 4>
In Example 4, an Al 5 Lu x O y : Ce phosphor having a peak emission wavelength in the vicinity of 535 nm is used as the green phosphor, and a peak emission wavelength in the vicinity of 620 nm is used as the first red phosphor (Sr, Ca ) AlSiN 3 : Eu phosphor was used as the second red phosphor, and CaAlSiN 3 : Eu phosphor having a peak emission wavelength in the vicinity of 650 nm was used. The blending ratio of the green phosphor, the first red phosphor, and the second red phosphor was set to 5: 0.78: 0.22. The difference from Example 1 is the blending ratio of the first and second red phosphors.

発光強度の相対値が115.0%、平均演色評価数Raが83.58、特殊演色評価数R9が20.24、色温度が2987Kとなった。実施例1と比較して、第2赤色蛍光体の配合比が大きくなったため、発光強度は僅かに低下したものの高水準を維持し、更に高い演色性が得られ、Ra(標準値)=85或いはRa(最小値)=80をターゲットとした照明器具用途へ使用可能である。   The relative value of the emission intensity was 115.0%, the average color rendering index Ra was 83.58, the special color rendering index R9 was 20.24, and the color temperature was 2987K. Compared with Example 1, since the blending ratio of the second red phosphor was increased, the emission intensity was slightly reduced but maintained at a high level, and higher color rendering was obtained. Ra (standard value) = 85 Alternatively, it can be used for lighting fixtures targeting Ra (minimum value) = 80.

〈実施例5〉
実施例5では、緑色蛍光体として、535nm付近にピーク発光波長を有するAlLu:Ce系蛍光体を、第1赤色蛍光体として、620nm付近にピーク発光波長を有する(Sr,Ca)AlSiN:Eu系蛍光体を、第2赤色蛍光体として、650nm付近にピーク発光波長を有するCaAlSiN:Eu系蛍光体を使用した。また、緑色蛍光体、第1赤色蛍光体、第2赤色蛍光体の配合比を、5:0.5:0.5とした。実施例1との相違点は、第1及び第2赤色蛍光体の配合比である。
<Example 5>
In Example 5, an Al 5 Lu x O y : Ce phosphor having a peak emission wavelength around 535 nm is used as a green phosphor, and a peak emission wavelength is around 620 nm as a first red phosphor (Sr, Ca ) AlSiN 3 : Eu phosphor was used as the second red phosphor, and CaAlSiN 3 : Eu phosphor having a peak emission wavelength in the vicinity of 650 nm was used. The blending ratio of the green phosphor, the first red phosphor, and the second red phosphor was set to 5: 0.5: 0.5. The difference from Example 1 is the blending ratio of the first and second red phosphors.

発光強度の相対値が110.0%、平均演色評価数Raが86.41、特殊演色評価数R9が36.02、色温度が3323Kとなった。実施例1及び実施例4と比較して、第2赤色蛍光体の配合比が大きくなったため、発光強度は110%に低下したものの、更に高い演色性が得られ、Ra(最小値)=85をターゲットとした照明器具用途へ使用可能である。   The relative value of the emission intensity was 110.0%, the average color rendering index Ra was 86.41, the special color rendering index R9 was 36.02, and the color temperature was 3323K. Compared with Example 1 and Example 4, since the compounding ratio of the second red phosphor was increased, the emission intensity was reduced to 110%, but higher color rendering was obtained, and Ra (minimum value) = 85. It can be used for lighting fixtures targeting

〈実施例6〉
実施例6では、緑色蛍光体として、535nm付近にピーク発光波長を有するAlLu:Ce系蛍光体を、第1赤色蛍光体として、620nm付近にピーク発光波長を有する(Sr,Ca)AlSiN:Eu系蛍光体を、第2赤色蛍光体として、650nm付近にピーク発光波長を有するCaAlSiN:Eu系蛍光体を使用した。また、緑色蛍光体、第1赤色蛍光体、第2赤色蛍光体の配合比を、5:0.25:0.75とした。実施例1との相違点は、第1及び第2赤色蛍光体の配合比である。
<Example 6>
In Example 6, an Al 5 Lu x O y : Ce phosphor having a peak emission wavelength in the vicinity of 535 nm is used as the green phosphor, and a peak emission wavelength in the vicinity of 620 nm is used as the first red phosphor (Sr, Ca ) AlSiN 3 : Eu phosphor was used as the second red phosphor, and CaAlSiN 3 : Eu phosphor having a peak emission wavelength in the vicinity of 650 nm was used. Moreover, the blending ratio of the green phosphor, the first red phosphor, and the second red phosphor was set to 5: 0.25: 0.75. The difference from Example 1 is the blending ratio of the first and second red phosphors.

発光強度の相対値が105.0%、平均演色評価数Raが91.1、特殊演色評価数R9が55.9、色温度が3268Kとなった。実施例1及び実施例4及び実施例5と比較して、第2赤色蛍光体の配合比が大きくなったため、発光強度は105%に低下したものの、更に高い演色性が得られ、Ra(標準値)=90をターゲットとした照明器具用途へ使用可能である。   The relative value of the emission intensity was 105.0%, the average color rendering index Ra was 91.1, the special color rendering index R9 was 55.9, and the color temperature was 3268K. Compared with Example 1, Example 4, and Example 5, the compounding ratio of the second red phosphor was increased, so although the emission intensity was reduced to 105%, higher color rendering properties were obtained, and Ra (standard Value) = 90 can be used for lighting fixture applications.

〈実施例7〉
実施例7では、緑色蛍光体として、535nm付近にピーク発光波長を有するAlLu:Ce系蛍光体を、第1赤色蛍光体として、620nm付近にピーク発光波長を有する(Sr,Ca)AlSiN:Eu系蛍光体を、第2赤色蛍光体として、650nm付近にピーク発光波長を有するCaAlSiN:Eu系蛍光体を使用した。また、緑色蛍光体、第1赤色蛍光体、第2赤色蛍光体の配合比を、5:0.02:0.98とした。実施例1との相違点は、第1及び第2赤色蛍光体の配合比である。
<Example 7>
In Example 7, an Al 5 Lu x O y : Ce phosphor having a peak emission wavelength in the vicinity of 535 nm is used as the green phosphor, and a peak emission wavelength is in the vicinity of 620 nm as the first red phosphor (Sr, Ca ) AlSiN 3 : Eu phosphor was used as the second red phosphor, and CaAlSiN 3 : Eu phosphor having a peak emission wavelength in the vicinity of 650 nm was used. The blending ratio of the green phosphor, the first red phosphor, and the second red phosphor was set to 5: 0.02: 0.98. The difference from Example 1 is the blending ratio of the first and second red phosphors.

発光強度の相対値が100.0%、平均演色評価数Raが93.7、特殊演色評価数R9が82.75、色温度が3316Kとなった。実施例1、実施例4〜6と比較して、第2赤色蛍光体の配合比が更に大きくなったため、発光強度は100%まで低下したものの、更に高い演色性が得られ、Ra(最小値)=90をターゲットとした照明器具用途へ使用可能である。   The relative value of the emission intensity was 100.0%, the average color rendering index Ra was 93.7, the special color rendering index R9 was 82.75, and the color temperature was 3316K. Compared with Example 1 and Examples 4-6, since the compounding ratio of the second red phosphor was further increased, the emission intensity was reduced to 100%, but higher color rendering properties were obtained, and Ra (minimum value). ) = 90 can be used for lighting fixtures.

次に、比較例1及び比較例2について説明する。各比較例は、特許文献1に開示された青色LEDと黄色蛍光体と赤色蛍光体の組み合わせで、黄色蛍光体と赤色蛍光体は夫々1種類を使用する。   Next, Comparative Example 1 and Comparative Example 2 will be described. Each comparative example is a combination of a blue LED, a yellow phosphor and a red phosphor disclosed in Patent Document 1, and one type of yellow phosphor and one red phosphor are used.

〈比較例1〉
比較例1では、黄色蛍光体として、560nm付近にピーク発光波長を有する(Y,Gd)(Al,Ga)12:Ce系蛍光体、赤色蛍光体として、630nm付近にピーク発光波長を有する(Sr,Ca)AlSiN:Eu系蛍光体を使用した。また、黄色蛍光体、赤色蛍光体の配合比を、3.3:1とした。発光強度の相対値が124.0%、平均演色評価数Raが73.0、特殊演色評価数R9が−5.0、色温度が2950Kとなった。
<Comparative example 1>
In Comparative Example 1, the yellow phosphor has a peak emission wavelength near 630 nm as a (Y, Gd) 3 (Al, Ga) 5 O 12 : Ce phosphor having a peak emission wavelength near 560 nm and a red phosphor. The (Sr, Ca) AlSiN 3 : Eu-based phosphor having the same was used. The blending ratio of yellow phosphor and red phosphor was 3.3: 1. The relative value of the emission intensity was 124.0%, the average color rendering index Ra was 73.0, the special color rendering index R9 was -5.0, and the color temperature was 2950K.

〈比較例2〉
比較例2では、黄色蛍光体として、560nm付近にピーク発光波長を有する(Y,Gd)(Al,Ga)12:Ce系蛍光体、赤色蛍光体として、650nm付近にピーク発光波長を有するCaAlSiN:Eu系蛍光体を使用した。また、黄色蛍光体、赤色蛍光体の配合比を、3.9:1とした。発光強度の相対値が114.0%、平均演色評価数Raが77.0、特殊演色評価数R9が20.0、色温度が3000Kとなった。
<Comparative example 2>
In Comparative Example 2, the yellow phosphor has a peak emission wavelength near 650 nm as a (Y, Gd) 3 (Al, Ga) 5 O 12 : Ce phosphor having a peak emission wavelength near 560 nm and a red phosphor. CaAlSiN 3 : Eu-based phosphor having Further, the blending ratio of the yellow phosphor and the red phosphor was set to 3.9: 1. The relative value of the emission intensity was 114.0%, the average color rendering index Ra was 77.0, the special color rendering index R9 was 20.0, and the color temperature was 3000K.

次に、実施例1〜7、比較例1,2の光学特性の測定結果を、以下の図2〜図6を参照して、比較検討する。図2は、実施例1〜7の各蛍光体のピーク発光波長及び配合比と光学特性を一覧表示する図であり、図3は、比較例1,2の各蛍光体のピーク発光波長及び配合比と光学特性を一覧表示する図である。図4は、各実施例及び各比較例の発光スペクトルを示す。図5は、各実施例における発光強度(相対値)と第2赤色蛍光体の配合比の関係を示す。図6は、各実施例における平均演色評価数Raと第2赤色蛍光体の配合比の関係を示す。図5及び図6において、実施例1,4〜7の測定値を菱形(◆)で、実施例2の測定値を三角形(▲)、実施例3の測定値を丸(●)で示し、比較例1及び2の測定値を参考値として夫々破線で示す。   Next, the measurement results of the optical characteristics of Examples 1 to 7 and Comparative Examples 1 and 2 are comparatively examined with reference to the following FIGS. FIG. 2 is a table listing the peak emission wavelengths and blending ratios and optical characteristics of the phosphors of Examples 1 to 7, and FIG. 3 shows the peak emission wavelengths and blends of the phosphors of Comparative Examples 1 and 2. It is a figure which displays a list of ratios and optical characteristics. FIG. 4 shows an emission spectrum of each example and each comparative example. FIG. 5 shows the relationship between the emission intensity (relative value) and the blending ratio of the second red phosphor in each example. FIG. 6 shows the relationship between the average color rendering index Ra and the blend ratio of the second red phosphor in each example. 5 and 6, the measured values of Examples 1 and 4 to 7 are indicated by diamonds (♦), the measured values of Example 2 are indicated by triangles (▲), and the measured values of Example 3 are indicated by circles (●). The measured values of Comparative Examples 1 and 2 are indicated by broken lines as reference values.

先ず、比較例1及び2は、何れも平均演色評価数Raが80より低く、高演色照明用の白色光源として使用可能な領域に到達していないが、実施例1〜7は、全て平均演色評価数Raが80を超えており、高演色照明用の白色光源として使用可能な領域に到達している。また、同程度の発光強度の実施例3,4と比較例2を対比しても、実施例3,4の方が、高い演色性となることが分かる。   First, Comparative Examples 1 and 2 both have an average color rendering index Ra of less than 80, and have not reached an area usable as a white light source for high color rendering illumination, but Examples 1 to 7 are all average color rendering. The evaluation number Ra exceeds 80, and has reached an area usable as a white light source for high color rendering illumination. Further, even when Examples 3 and 4 and Comparative Example 2 having comparable light emission intensities are compared, it can be seen that Examples 3 and 4 have higher color rendering properties.

次に、図5及び図6より、第2赤色蛍光体の配合比が増加すると(逆に、第1赤色蛍光体の配合比が減少すると)、発光強度が低下し、逆に、平均演色評価数Raが上昇する関係にあることが分かる。つまり、第1及び第2赤色蛍光体の配合比を調整することで、平均演色評価数Raが80以上の領域において、所望の平均演色評価数Raと発光強度を得ることが可能となる。例えば、80≦Ra≦85の演色性を目標とする場合は、第2赤色蛍光体の配合比を25%以下に調整し、85≦Ra≦90の演色性を目標とする場合は、第2赤色蛍光体の配合比を25%以上75%以下に調整し、90≦Ra≦97の演色性を目標とする場合は、第2赤色蛍光体の配合比を75%以上に調整すれば良い。   Next, as shown in FIGS. 5 and 6, when the blending ratio of the second red phosphor increases (conversely, when the blending ratio of the first red phosphor decreases), the emission intensity decreases, and conversely, the average color rendering evaluation It can be seen that the number Ra increases. That is, by adjusting the blending ratio of the first and second red phosphors, it is possible to obtain a desired average color rendering index Ra and emission intensity in an area where the average color rendering index Ra is 80 or more. For example, when the color rendering property of 80 ≦ Ra ≦ 85 is targeted, the blending ratio of the second red phosphor is adjusted to 25% or less, and when the color rendering property of 85 ≦ Ra ≦ 90 is targeted, the second When the blending ratio of the red phosphor is adjusted to 25% or more and 75% or less and the color rendering property of 90 ≦ Ra ≦ 97 is targeted, the blending ratio of the second red phosphor may be adjusted to 75% or more.

第2赤色蛍光体の配合比が同じ実施例1と実施例2を比較すると、実施例1の方が発光強度は高いが、演色性が低くなっている。一方、発光強度がほぼ同じ実施例2と実施利5を比較すると、実施利5の方が高い演色性となっている。つまり、緑色蛍光体のピーク発光波長と第1及び第2赤色蛍光体の配合比を夫々調整することで、発光強度を維持したまま演色性を改善できることが分かる。   When Example 1 and Example 2 with the same compounding ratio of the second red phosphor are compared, Example 1 has higher emission intensity but lower color rendering. On the other hand, when Example 2 and Example 5 having substantially the same emission intensity are compared, Example 5 has higher color rendering. That is, it can be seen that the color rendering can be improved while maintaining the emission intensity by adjusting the peak emission wavelength of the green phosphor and the mixing ratio of the first and second red phosphors.

実施例1、3〜5の発光強度は、比較例1の発光強度と同等レベルであるものの、比較例2の発光強度より大きい。但し、上述のように演色性は比較例1,2より改善されている。実施例2、6、7は、上述のように実施例1、3〜5より演色性改善を重視したものであるので、その発光強度は、比較例1の発光強度に比べると低下しているが、比較例2の発光強度とは同等レベルとなっている。尚、発光強度が同等レベルとは、基準の発光強度から±15%以内範囲の発光強度をいう。   The emission intensity of Examples 1 and 3 to 5 is equal to the emission intensity of Comparative Example 1, but is larger than that of Comparative Example 2. However, as described above, the color rendering is improved as compared with Comparative Examples 1 and 2. Since Examples 2, 6, and 7 place importance on improving color rendering properties than Examples 1 and 3 to 5 as described above, the emission intensity is lower than that of Comparative Example 1. However, the light emission intensity of Comparative Example 2 is at the same level. Note that the light emission intensity at the same level means a light emission intensity within a range of ± 15% from the standard light emission intensity.

図5及び図6より、第1及び第2赤色蛍光体の配合比だけが異なる実施例1,4〜7の各測定値を結ぶ線上に、第2赤色蛍光体のピーク発光波長の異なる実施例3の測定値がほぼ重なることが分かる。実施例1,4〜7では、第1及び第2赤色蛍光体の各ピーク発光波長は、620nmと650nmでその差は30nmであるが、実施例3では、第1及び第2赤色蛍光体の各ピーク発光波長は、620nmと630nmでその差は10nmである。これより、第1及び第2赤色蛍光体の各ピーク発光波長の差が10nmであっても、第1及び第2赤色蛍光体の配合比を調整すること、或いは、緑色蛍光体のピーク発光波長と第1及び第2赤色蛍光体の配合比を夫々調整することで、発光強度と演色性を制御できることが分かる。更に、第1及び第2赤色蛍光体の各ピーク発光波長は、620nmと630nmの中間値(例えば、625nm)を挟んで、第1赤色蛍光体のピーク発光波長を当該中間値より短く、第2赤色蛍光体のピーク発光波長を当該中間値より長く設定すれば良いことが分かる。試験色番号9の赤色の分光輝度放射率(0.4〜0.8)を参考にすると、第1赤色蛍光体のピーク発光波長は概ね610〜625nmの範囲内、第2赤色蛍光体のピーク発光波長は概ね625nm以上670nm以下の範囲内に設定するのが、特殊演色評価数R9の改善効果が高くなり、好ましいと考えられる。   From FIG. 5 and FIG. 6, on the lines connecting the measured values of Examples 1 and 4 to 7 that differ only in the blending ratio of the first and second red phosphors, examples in which the peak emission wavelength of the second red phosphor differs. It can be seen that the measured values of 3 almost overlap. In Examples 1 and 4 to 7, the peak emission wavelengths of the first and second red phosphors are 620 nm and 650 nm, and the difference is 30 nm. In Example 3, the first and second red phosphors have different wavelengths. Each peak emission wavelength is 620 nm and 630 nm, and the difference is 10 nm. Thus, even if the difference between the peak emission wavelengths of the first and second red phosphors is 10 nm, the mixing ratio of the first and second red phosphors can be adjusted, or the peak emission wavelength of the green phosphor It can be seen that the emission intensity and the color rendering can be controlled by adjusting the mixing ratio of the first and second red phosphors. Further, the peak emission wavelengths of the first and second red phosphors are shorter than the intermediate value with the peak emission wavelength of the first red phosphor being shorter than the intermediate value between 620 nm and 630 nm (for example, 625 nm). It can be seen that the peak emission wavelength of the red phosphor may be set longer than the intermediate value. Referring to the red spectral luminance emissivity (0.4 to 0.8) of test color number 9, the peak emission wavelength of the first red phosphor is approximately in the range of 610 to 625 nm, and the peak of the second red phosphor. It is considered preferable that the emission wavelength is set in a range of approximately 625 nm or more and 670 nm or less because the effect of improving the special color rendering index R9 is increased.

以上、本発光装置1によれば、144個のLEDチップ6を円形領域に配置した構成であるので、30Wクラスの半導体発光装置が実現可能となり、一般照明用途でも特に100Wの白熱電球、ハロゲンランプ、HIDランプ等を代替でき、広範な用途に適用可能となる。また、樹脂ダム9が円環状であるので、照明用途に使用する際に必要となる光学設計(レンズやリフレクタの設計)が比較的容易となる。更に、LEDチップ6の配置がほぼ円形で均等に分散されているため、本発光装置1から放射される光の演色性、色度、色温度等のバラツキを抑制できる。また、ピーク発光波長や配合比の異なる各蛍光体が混合された透明樹脂を予め準備しておけば、樹脂ダム9まで形成した本発光装置1の中間製品に、当該透明樹脂を樹脂ダム9内に注入し、熱硬化させるだけの工程で、種々の光学特性の本発光装置1を得ることができる。   As described above, according to the present light emitting device 1, since 144 LED chips 6 are arranged in a circular region, a 30 W class semiconductor light emitting device can be realized, and a 100 W incandescent lamp and halogen lamp are also particularly suitable for general lighting applications. , HID lamps and the like can be substituted and applied to a wide range of applications. In addition, since the resin dam 9 has an annular shape, the optical design (lens and reflector design) required for use in lighting applications is relatively easy. Furthermore, since the arrangement of the LED chips 6 is substantially circular and uniformly dispersed, variations in the color rendering properties, chromaticity, color temperature, etc. of the light emitted from the light emitting device 1 can be suppressed. In addition, if a transparent resin in which phosphors having different peak emission wavelengths and blending ratios are mixed is prepared in advance, the transparent resin is added to the intermediate product of the light emitting device 1 formed up to the resin dam 9 in the resin dam 9. The light-emitting device 1 having various optical characteristics can be obtained by simply injecting it into the substrate and thermally curing it.

〈別実施形態〉
以下、上記実施形態の別実施形態について説明する。
<Another embodiment>
Hereinafter, another embodiment of the above embodiment will be described.

〈1〉上記実施形態では、蛍光体層5には、緑色蛍光体と第1赤色蛍光体と第2赤色蛍光体の夫々が混在していた(1層構造)が、蛍光体層5を2層または3層に分離して構成しても良い。 <1> In the above embodiment, the phosphor layer 5 is a mixture of the green phosphor, the first red phosphor, and the second red phosphor (one-layer structure). It may be configured to be separated into layers or three layers.

例えば、図7に模式的に示すように、蛍光体層5を、透明樹脂に粒状の第1赤色蛍光体を混合した第1赤色蛍光体層5aと、透明樹脂に粒状の第2赤色蛍光体を混合した第2赤色蛍光体層5bと、透明樹脂に粒状の緑色蛍光体を混合した緑色蛍光体層5cをLEDチップ6側から順番に積層して構成しても良い。この場合、各蛍光体層5a〜5cの全体での各蛍光体の配合比は、蛍光体層5を1層で構成した場合と同様に決定すれば良い。   For example, as schematically shown in FIG. 7, the phosphor layer 5 includes a first red phosphor layer 5a in which a granular first red phosphor is mixed with a transparent resin, and a second red phosphor that is granular in the transparent resin. The second red phosphor layer 5b mixed with the green phosphor layer 5c obtained by mixing the transparent green resin with the granular green phosphor may be laminated in order from the LED chip 6 side. In this case, what is necessary is just to determine the compounding ratio of each fluorescent substance in each whole fluorescent substance layer 5a-5c similarly to the case where the fluorescent substance layer 5 is comprised by 1 layer.

ここで、図7(a)に示すように、蛍光体を含まない透明樹脂層10でLEDチップ6を封止した上層に、当該3層の蛍光体層5を形成するのが好ましい。この場合、透明樹脂層10の厚さは、LEDチップ6の厚さ(80〜200μm程度)と同等以上とするのが良い。また、図7(b)に示すように、透明樹脂層10を設けずに、第1赤色蛍光体層5aでLEDチップ6を封止した上層に、残り2層の第2赤色蛍光体層5bと緑色蛍光体層5cを積層しても良い。また、第1赤色蛍光体層5aと第2赤色蛍光体層5bの順番を入れ替えても良い。   Here, as shown in FIG. 7A, it is preferable to form the three phosphor layers 5 on the upper layer in which the LED chip 6 is sealed with the transparent resin layer 10 not containing the phosphor. In this case, the thickness of the transparent resin layer 10 is preferably equal to or greater than the thickness of the LED chip 6 (about 80 to 200 μm). Moreover, as shown in FIG.7 (b), without providing the transparent resin layer 10, in the upper layer which sealed the LED chip 6 with the 1st red fluorescent substance layer 5a, the remaining 2nd 2nd red fluorescent substance layers 5b. And the green phosphor layer 5c may be laminated. The order of the first red phosphor layer 5a and the second red phosphor layer 5b may be interchanged.

更に、図8に模式的に示すように、蛍光体層5を、透明樹脂に粒状の第1赤色蛍光体と第2赤色蛍光体を混合した赤色蛍光体層5dと、透明樹脂に粒状の緑色蛍光体を混合した緑色蛍光体層5cをLEDチップ6側から順番に積層して構成しても良い。この場合、各蛍光体層5c,5dの全体での各蛍光体の配合比は、蛍光体層5を1層で構成した場合と同様に決定すれば良い。   Further, as schematically shown in FIG. 8, the phosphor layer 5 includes a red phosphor layer 5 d obtained by mixing a granular first red phosphor and a second red phosphor in a transparent resin, and a granular green in the transparent resin. The green phosphor layer 5c mixed with the phosphor may be laminated in order from the LED chip 6 side. In this case, the blending ratio of the respective phosphors in the entire phosphor layers 5c and 5d may be determined in the same manner as in the case where the phosphor layer 5 is composed of one layer.

ここで、図8(a)に示すように、蛍光体を含まない透明樹脂層10でLEDチップ6を封止した上層に、当該2層の蛍光体層5を形成するのが好ましい。また、図8(b)に示すように、透明樹脂層10を設けずに、赤色蛍光体層5dでLEDチップ6を封止した上層に、緑色蛍光体層5cを積層しても良い。   Here, as shown in FIG. 8A, the two phosphor layers 5 are preferably formed on the upper layer in which the LED chip 6 is sealed with the transparent resin layer 10 not containing the phosphor. Further, as shown in FIG. 8B, the green phosphor layer 5c may be laminated on the upper layer in which the LED chip 6 is sealed with the red phosphor layer 5d without providing the transparent resin layer 10.

尚、上記実施形態で例示した第1及び第2赤色蛍光体に使用する(Sr,Ca)AlSiN:Eu系蛍光体とCaAlSiN:Eu系蛍光体は、吸収帯域が広く、緑色成分の光も吸収するため、図7または図8に示す構成において、緑色蛍光体層5cを蛍光体層5の最上層に設けることで、緑色蛍光体から放射される緑色成分の光が第1または第2赤色蛍光体で吸収されるのを抑制でき、結果として発光効率の低下を抑制でき好ましい。 The (Sr, Ca) AlSiN 3 : Eu-based phosphor and CaAlSiN 3 : Eu-based phosphor used in the first and second red phosphors exemplified in the above embodiment have a wide absorption band and have a green component light. 7 or 8, in the configuration shown in FIG. 7 or FIG. 8, by providing the green phosphor layer 5c on the uppermost layer of the phosphor layer 5, the green component light emitted from the green phosphor is first or second. Absorption by the red phosphor can be suppressed, and as a result, a decrease in luminous efficiency can be suppressed.

更に、蛍光体層5を多層構造とする場合、各層を1層ずつ注入・熱硬化させて順番に形成しても良く、或いは、一部または全ての層について、先に樹脂の注入だけを行い、後で一気に熱硬化させて形成しても良い。つまり、各層の境界は必ずしも明確に分離している必要は無い。更に、図7または図8に示す構成をミックスしても良い。例えば、上記第1赤色蛍光体層5aと、上記第2赤色蛍光体層5bと、1または複数の配合比の異なる上記赤色蛍光体層5dを適宜組み合わせて最終的に必要な第1赤色蛍光体と第2赤色蛍光体の配合比を得るようにしても構わない。従って、蛍光体層5の層数は1〜4に限定されるものではない。   Further, when the phosphor layer 5 has a multi-layer structure, each layer may be injected and thermally cured one by one, or may be formed in order, or only a part or all of the layers are first injected with a resin. Alternatively, it may be formed by thermosetting at once. In other words, the boundaries between the layers do not necessarily have to be clearly separated. Furthermore, you may mix the structure shown in FIG. 7 or FIG. For example, the first red phosphor layer 5a, the second red phosphor layer 5b, and one or a plurality of the red phosphor layers 5d having different blending ratios may be appropriately combined to finally need the first red phosphor. And the second red phosphor may be obtained. Accordingly, the number of phosphor layers 5 is not limited to 1 to 4.

〈2〉上記実施形態では、LEDチップ6を、青色領域(波長:430nm以上490nm以下)にピーク発光波長(発光ピーク)が存在する青色成分を含む光を放射する半導体発光素子のInGaN系LEDで構成する場合を説明したが、LEDチップ6からの発光のピーク発光波長が、近紫外領域から紫色領域(波長:350nm以上430nm未満)に存在する場合にも、本発明は適用可能である。LEDチップ6は、上記実施形態と同様、InGaN系LEDで構成するのが好ましい。但し、LEDチップ6の発光スペクトルが短波長側にシフトすると、LEDチップ6から放射される青色成分の光が不足或いは欠如するため、蛍光体層5の透明樹脂に混合する蛍光体として、緑色蛍光体と第1赤色蛍光体と第2赤色蛍光体以外に、近紫外光または紫色光で励起され青色成分の光(例えば、ピーク発光波長を430nm以上490nm以下の範囲内に有する。)を放射する青色蛍光体を追加するのが好ましい。青色蛍光体として、例えば、以下の3つの一般式で表される2価のユーロピウム付活ハロ燐酸塩蛍光体、2価のユーロピウム付活アルミン酸塩蛍光体、2価のユーロピウム及びマンガン共付活アルミン酸塩蛍光体等が使用可能である。
一般式: (M1,Eu)10(PO・Cl
一般式: a(M2,Eu)O・bAl
一般式: a(M2,Eu,Mn)O・bAl
但し、M1は、Mg,Ca,Sr及びBaの中から選択される少なくとも1種の元素であり、M2は、Mg,Ca,Sr,Ba及びZnから選択される少なくとも1種の元素であり、a、b、c及びdは,a>0、b>0、0.1≦a/b≦1.0、0.001≦d /c≦0を満足する数である。
<2> In the above embodiment, the LED chip 6 is an InGaN-based LED of a semiconductor light emitting device that emits light containing a blue component having a peak emission wavelength (emission peak) in the blue region (wavelength: 430 nm or more and 490 nm or less). Although the case where it comprises is demonstrated, this invention is applicable also when the peak light emission wavelength of light emission from LED chip 6 exists in a purple region (wavelength: 350 nm or more and less than 430 nm) from a near ultraviolet region. The LED chip 6 is preferably composed of an InGaN-based LED, as in the above embodiment. However, when the emission spectrum of the LED chip 6 is shifted to the short wavelength side, the blue component light emitted from the LED chip 6 is insufficient or lacking. In addition to the body, the first red phosphor, and the second red phosphor, blue component light (for example, having a peak emission wavelength in the range of 430 nm to 490 nm) is excited by near ultraviolet light or violet light. It is preferable to add a blue phosphor. As the blue phosphor, for example, a divalent europium activated halophosphate phosphor represented by the following three general formulas, a divalent europium activated aluminate phosphor, a divalent europium and manganese co-activated An aluminate phosphor or the like can be used.
General formula: (M1, Eu) 10 (PO 4 ) 6 · Cl 2
General formula: a (M2, Eu) O.bAl 2 O 3
General formula: a (M2, Eu c, Mn d) O · bAl 2 O 3
However, M1 is at least one element selected from Mg, Ca, Sr and Ba, and M2 is at least one element selected from Mg, Ca, Sr, Ba and Zn, a, b, c and d are numbers satisfying a> 0, b> 0, 0.1 ≦ a / b ≦ 1.0, and 0.001 ≦ d / c ≦ 0.

青色蛍光体を使用する場合でも、青色光の放射が、LEDチップ6から青色蛍光体に交替しただけの違いであるので、第1赤色蛍光体と第2赤色蛍光体の2種類の赤色蛍光体を使用することによる本発明の効果は、上記実施形態と同様に奏し得ることは明らかである。また、青色蛍光体を含む蛍光体層5を、上記別実施形態〈1〉で示したような多層構造としても良い。この場合、青色蛍光体層を、緑色蛍光体と第1赤色蛍光体と第2赤色蛍光体を含む層より上層、つまり、最上層に設けるのが好ましい。   Even when the blue phosphor is used, since the emission of blue light is merely a change from the LED chip 6 to the blue phosphor, two types of red phosphors, the first red phosphor and the second red phosphor, are used. It is obvious that the effect of the present invention by using can be obtained in the same manner as in the above embodiment. Further, the phosphor layer 5 including the blue phosphor may have a multilayer structure as shown in the above-described another embodiment <1>. In this case, the blue phosphor layer is preferably provided in an upper layer, that is, the uppermost layer, than the layer including the green phosphor, the first red phosphor, and the second red phosphor.

〈3〉上記実施形態では、図1に示すように、セラミック基板2上に複数のLEDチップ6を搭載する実装形態を例示したが、セラミック基板2の形状、材質、及び大きさ、LEDチップ6の搭載数及び搭載エリアの形状、蛍光体層5の形状、厚み、透明樹脂の材質及び層数等は、上記実施形態に限定されるものではない。また、樹脂ダム9に代えて、特許文献1の図1に示されるような凹部を有する樹脂製フレームをセラミック基板2上に形成し、当該凹部にLEDチップ6を搭載し、各蛍光体を含む透明樹脂を当該凹部内に注入して、LEDチップ6を封止するようにしても良い。   <3> In the above embodiment, as illustrated in FIG. 1, the mounting form in which a plurality of LED chips 6 are mounted on the ceramic substrate 2 is illustrated, but the shape, material, and size of the ceramic substrate 2, the LED chip 6 The number and the shape of the mounting area, the shape and thickness of the phosphor layer 5, the material and the number of layers of the transparent resin are not limited to the above embodiment. Moreover, it replaces with the resin dam 9, and the resin-made flame | frame which has a recessed part as shown in FIG. 1 of patent document 1 is formed on the ceramic substrate 2, LED chip 6 is mounted in the said recessed part, and each phosphor is included. A transparent resin may be injected into the recess to seal the LED chip 6.

〈4〉更に、LEDチップ6をセラミック基板2上に搭載するのではなく、リードフレームを用いたパッケージに搭載する実装形態であっても良い。図9(a),(b)に、リードフレームパッケージに搭載した場合の断面構造を模式的に示す。図9(a),(b)の何れの実装例においても、一方がアノード端子、他方がカソード端子となる2つのリード端子11,12を備え、一方のリード端子にLEDチップ6を収容する凹部が形成され、LEDチップ6が当該一方のリード端子の凹部上にダイボンディングされ、LEDチップ6及びリード端子11,12の上側に、緑色蛍光体と第1赤色蛍光体と第2赤色蛍光体を含む透明樹脂が充填され、蛍光体層5が形成されている。また、リード端子11,12の下側及び上記透明樹脂が充填される領域の周囲に、不透明樹脂からなるリード端子11,12を固定するパッケージ本体部13が形成されている。   <4> Further, the LED chip 6 may be mounted on a package using a lead frame instead of being mounted on the ceramic substrate 2. 9A and 9B schematically show a cross-sectional structure when mounted on a lead frame package. 9A and 9B, each of the mounting examples includes two lead terminals 11 and 12, one of which serves as an anode terminal and the other serves as a cathode terminal, and a recess for housing the LED chip 6 in one of the lead terminals. The LED chip 6 is die-bonded on the concave portion of the one lead terminal, and the green phosphor, the first red phosphor, and the second red phosphor are placed on the LED chip 6 and the lead terminals 11 and 12. The phosphor layer 5 is formed by being filled with the transparent resin to be included. A package body 13 for fixing the lead terminals 11 and 12 made of an opaque resin is formed below the lead terminals 11 and 12 and around the area filled with the transparent resin.

図9(a)は2チップを搭載する実装例で、一方のLEDチップ6の一方の電極パッド(図示せず)と一方のリード端子がワイヤー7で相互に接続され、一方のLEDチップ6の他方の電極パッド(図示せず)と他方のLEDチップ6の一方の電極パッド(図示せず)がワイヤー7で相互に接続され、他方のLEDチップ6の他方の電極パッド(図示せず)と他方のリード端子がワイヤー7で相互に接続され、2つのLEDチップ6の直列回路が形成されている。また、図9(a)の実装例では、保護素子としてのツェナーダイオード14が、2つのリード端子11,12に介装されている。更に、図9(b)は1チップを搭載する実装例で、LEDチップ6の一方の電極パッド(図示せず)と一方のリード端子がワイヤー7で相互に接続され、LEDチップ6の他方の電極パッド(図示せず)と他方のリード端子がワイヤー7で相互に接続されている。   FIG. 9A shows a mounting example in which two chips are mounted. One electrode pad (not shown) of one LED chip 6 and one lead terminal are connected to each other by a wire 7. The other electrode pad (not shown) and one electrode pad (not shown) of the other LED chip 6 are connected to each other by a wire 7, and the other electrode pad (not shown) of the other LED chip 6 is connected. The other lead terminal is connected to each other by a wire 7 to form a series circuit of two LED chips 6. Further, in the mounting example of FIG. 9A, a Zener diode 14 as a protection element is interposed between the two lead terminals 11 and 12. Further, FIG. 9B shows a mounting example in which one chip is mounted. One electrode pad (not shown) of the LED chip 6 and one lead terminal are connected to each other by a wire 7, and the other of the LED chip 6 is connected. An electrode pad (not shown) and the other lead terminal are connected to each other by a wire 7.

尚、図9(a)の実装例においても、LEDチップ6の搭載数を3以上としても良い。また、図9(a),(b)の実装例において、蛍光体層5を上記別実施形態〈1〉で示したような多層構造としても良い。   In the mounting example of FIG. 9A, the number of LED chips 6 mounted may be three or more. Further, in the mounting examples of FIGS. 9A and 9B, the phosphor layer 5 may have a multilayer structure as shown in the above-described another embodiment <1>.

〈5〉更に、LEDチップ6をセラミック基板2上に搭載し、蛍光体層5を平板状に形成するのではなく、図10に例示するようなドーム状の蛍光体層5を備える構造としても良い。   <5> Furthermore, the LED chip 6 is mounted on the ceramic substrate 2 and the phosphor layer 5 is not formed in a flat plate shape, but a structure having a dome-like phosphor layer 5 as illustrated in FIG. good.

具体的には、セラミック基板2に代えて、絶縁性フィルム15の上面に、金属膜片からなる1対のランド部16a,16bを備え、下面に金属膜片からなる外部接続用の1対の端子部17a,17bを備え、各ランド部16a,16bは接着層18を介して絶縁性フィルム15の上面に接着し、各端子部17a,17bは接着層19を介して絶縁性フィルム15の下面に接着したフィルム状の基板を用いる。ランド部16aと端子部17aは、絶縁性フィルム15を挟んで対向し、絶縁性フィルム15を貫通する2つの貫通導電体(図示せず)により電気的に導通している。同様に、ランド部16bと端子部17bは、絶縁性フィルム15を挟んで対向し、絶縁性フィルム15を貫通する2つの貫通導電体(図示せず)により電気的に導通している。貫通導電体の個数は夫々1または3以上でも良い。1対のランド部16a,16bは、当該ランド部間をY方向に延伸する細長い間隙によって電気的に絶縁分離されている。同様に、1対の端子部17a,17bも、当該端子部間をY方向に延伸する細長い間隙によって電気的に絶縁分離されている。本別実施形態〈5〉では、絶縁性フィルム15の一例として、膜厚0.05mmのポリイミドフィルムを使用する。1対のランド部16a,16bとその間隙の上に、当該間隙の中央部分を含む円形領域を露出する開口部20を中央に有する環状の撥液層21を備え、開口部20の内側の1対のランド部16a,16b上に、LEDチップ6が搭載されている。図10に示す実装例では、LEDチップ6は、チップ表面に図示しない1対の電極パッド(アノード用、カソード用)が形成された裏面出射タイプのフリップチップ型LEDで、裏面を上向きにしてバンプを介して、各電極パッドがランド部16a,16b上に接続している。LEDチップ6が表面出射タイプの場合は、各電極パッドとランド部16a,16bを夫々ワイヤーで接続する。上記実施形態と同様の緑色蛍光体と第1及び第2赤色蛍光体の3種類の蛍光体を混合した透明樹脂を、撥液層21を覆うマスク部材を用いて、例えばスキージ印刷法等により開口部20上に注入し、マスク部材を取り外すことで、撥液層21の撥液性と透明樹脂の表面張力によりドーム状に自然に成形され、引き続き熱硬化処理することで、LEDチップ6を封止するドーム状の蛍光体層5が形成される。   Specifically, instead of the ceramic substrate 2, a pair of land portions 16 a and 16 b made of metal film pieces are provided on the upper surface of the insulating film 15, and a pair of external connection made of metal film pieces on the lower surface. Terminal portions 17a and 17b are provided, the land portions 16a and 16b are bonded to the upper surface of the insulating film 15 via the adhesive layer 18, and the terminal portions 17a and 17b are bonded to the lower surface of the insulating film 15 via the adhesive layer 19. A film-like substrate adhered to is used. The land portion 16a and the terminal portion 17a are opposed to each other with the insulating film 15 interposed therebetween, and are electrically connected by two through conductors (not shown) penetrating the insulating film 15. Similarly, the land portion 16b and the terminal portion 17b are opposed to each other with the insulating film 15 interposed therebetween, and are electrically connected by two through conductors (not shown) penetrating the insulating film 15. The number of through conductors may be 1 or 3 or more, respectively. The pair of land portions 16a and 16b are electrically insulated and separated by an elongated gap extending between the land portions in the Y direction. Similarly, the pair of terminal portions 17a and 17b is also electrically insulated and separated by an elongated gap extending between the terminal portions in the Y direction. In the present embodiment <5>, a polyimide film having a thickness of 0.05 mm is used as an example of the insulating film 15. An annular liquid-repellent layer 21 having an opening 20 at the center for exposing a circular region including the central portion of the gap is provided on the pair of land portions 16a and 16b and the gap between them. The LED chip 6 is mounted on the pair of land portions 16a and 16b. In the mounting example shown in FIG. 10, the LED chip 6 is a back-emission type flip chip type LED in which a pair of electrode pads (for anode and cathode) (not shown) is formed on the chip surface. The electrode pads are connected to the land portions 16a and 16b through the vias. When the LED chip 6 is a surface emission type, each electrode pad and the land portions 16a and 16b are connected by wires. A transparent resin obtained by mixing the same three types of phosphors as the green phosphor and the first and second red phosphors as in the above-described embodiment is opened by, for example, a squeegee printing method using a mask member that covers the liquid repellent layer 21. By injecting onto the portion 20 and removing the mask member, it is naturally formed into a dome shape by the liquid repellency of the liquid repellent layer 21 and the surface tension of the transparent resin, and the LED chip 6 is sealed by subsequent thermosetting. A dome-shaped phosphor layer 5 that stops is formed.

絶縁性フィルム15の表裏に、1対のランド部16a,16bと1対の端子部17a,17bを夫々複数組形成することで、図10に示す構造の本発光素子1が、同時に多数形成され、必要数に応じて1対のランド部16a,16bの周囲の絶縁性フィルム15を切断することで、任意の数のドーム状の本発光素子が得られる。また、開口部20に搭載するLEDチップ6は2以上であっても良い。   By forming a plurality of sets of a pair of land portions 16a and 16b and a pair of terminal portions 17a and 17b on the front and back of the insulating film 15, a large number of the light emitting elements 1 having the structure shown in FIG. By cutting the insulating film 15 around the pair of land portions 16a and 16b according to the required number, an arbitrary number of dome-shaped main light emitting elements can be obtained. Moreover, the LED chip 6 mounted in the opening part 20 may be two or more.

〈6〉上記別実施形態〈4〉、〈5〉で、本発光装置の実装形態の変形例を説明したが、本発光装置1の実装形態は、上記実施形態及び別実施形態で例示したものに限定されるものではない。   <6> In the above-described different embodiments <4> and <5>, the modification of the mounting form of the light-emitting device has been described. The mounting form of the light-emitting device 1 is exemplified in the above-described embodiment and the other embodiments. It is not limited to.

〈7〉更に、上記実施形態では、本発光装置が照明用の白色光源として使用される場合を想定して説明したが、本発光装置は、液晶表示装置のバックライトに適した実装形態を採用することで、当該バックライトに応用可能である。   <7> Further, in the above embodiment, the case where the light emitting device is used as a white light source for illumination has been described. However, the light emitting device adopts a mounting form suitable for a backlight of a liquid crystal display device. By doing so, it can be applied to the backlight.

〈8〉更に、上記実施形態の実施例1〜7では、色温度3000〜3300K近傍の白色光源向けに蛍光体の組合せ及び配合比を規定したものであるが、例えば、色温度5000K近傍の昼光色等の色温度のより高い白色光源用に上記と同様の蛍光体の組合せで、蛍光体の配合比を適宜変更した構成としても良い。例えば、緑色蛍光体と第1及び第2赤色蛍光体の合計との配合比は、7.7:1で、第1赤色蛍光体と第2赤色蛍光体の配合比を0.85:0.15とすることで、高演色性と高い発光効率を有した発光装置の実現が可能となる。   <8> Further, in Examples 1 to 7 of the above embodiment, the phosphor combination and blending ratio are defined for a white light source in the vicinity of a color temperature of 3000 to 3300 K. For example, the daylight color in the vicinity of a color temperature of 5000 K is used. For a white light source having a higher color temperature such as the above, a combination of phosphors similar to those described above may be used, and the composition ratio of the phosphors may be appropriately changed. For example, the blending ratio of the green phosphor and the total of the first and second red phosphors is 7.7: 1, and the blending ratio of the first red phosphor and the second red phosphor is 0.85: 0. By setting the value to 15, a light emitting device having high color rendering properties and high light emission efficiency can be realized.

1: 発光装置
2: セラミック基板
3,3a,3k: 配線パターン
4,4a,4k: 電極ランド
5: 蛍光体層
5a: 第1赤色蛍光体層
5b: 第2赤色蛍光体層
5c: 緑色蛍光体層
5d: 赤色蛍光体層
6: LEDチップ
7: ワイヤー
8: 印刷抵抗素子
9: 樹脂ダム
10: 透明樹脂層
11,12: リード端子
13: パッケージ本体部
14: ツェナーダイオード
15: 絶縁性フィルム
16a,16b: ランド部
17a,17b: 端子部
18,19: 接着層
20: 開口部
21: 撥液層
1: Light emitting device 2: Ceramic substrate 3, 3a, 3k: Wiring pattern 4, 4a, 4k: Electrode land 5: Phosphor layer 5a: First red phosphor layer 5b: Second red phosphor layer 5c: Green phosphor Layer 5d: Red phosphor layer 6: LED chip 7: Wire 8: Print resistance element 9: Resin dam 10: Transparent resin layer 11, 12: Lead terminal 13: Package body 14: Zener diode 15: Insulating film 16a, 16b: Land 17a, 17b: Terminal 18, 19: Adhesive layer 20: Opening 21: Liquid repellent layer

Claims (5)

絶縁性フィルムの上面上に、夫々が金属膜片からなり、電気的に絶縁分離されて形成された一対の第1ランド部及び第2ランド部と、
前記絶縁性フィルムの下面上に、夫々が金属膜片からなり、電気的に絶縁分離されて形成された外部接続用の一対の第1端子部及び第2端子部と、
前記絶縁性フィルムを貫通し、前記第1ランド部を前記第1端子部と電気的に導通させる第1の貫通導電体と、
前記絶縁性フィルムを貫通し、前記第2ランド部を前記第2端子部と電気的に導通させる第2の貫通導電体と、
前記絶縁性フィルムの上面に、前記第1ランド部及び前記第2ランド部の少なくとも一部を露出する開口部を有して形成された撥液層と、
前記開口部内の前記第1ランド部及び前記第2ランド部上に搭載された、近紫外乃至青色領域にピーク発光波長を有する光を放射する発光素子と、を備え、
緑色蛍光体、第1赤色蛍光体、及び、前記第1赤色蛍光体とは異なるピーク発光波長を有する第2赤色蛍光体の3種の蛍光体を混合した透明樹脂を前記開口部上に注入して、前記発光素子を封止するドーム状の蛍光体層が形成されていることを特徴とする発光装置。
A pair of first land portions and second land portions each formed of a metal film piece and electrically insulated and separated on the upper surface of the insulating film;
On the lower surface of the insulating film, a pair of first and second terminal portions for external connection, each of which is made of a metal film piece and is electrically insulated and separated,
A first through conductor that penetrates the insulating film and electrically connects the first land portion to the first terminal portion;
A second penetrating conductor that penetrates the insulating film and electrically connects the second land portion to the second terminal portion;
A liquid repellent layer formed on the upper surface of the insulating film and having an opening exposing at least a part of the first land portion and the second land portion;
A light emitting element that emits light having a peak emission wavelength in the near ultraviolet to blue region, mounted on the first land portion and the second land portion in the opening,
A transparent resin in which three kinds of phosphors of a green phosphor, a first red phosphor, and a second red phosphor having a peak emission wavelength different from that of the first red phosphor are mixed is injected into the opening. And a dome-shaped phosphor layer for sealing the light emitting element.
前記第1赤色蛍光体のピーク発光波長が、610nm以上625nm未満の波長範囲内にあり、
前記第2赤色蛍光体のピーク発光波長が、625nm以上670nm以下の波長範囲内にあることを特徴とする請求項1に記載の発光装置。
The peak emission wavelength of the first red phosphor is in a wavelength range of 610 nm or more and less than 625 nm,
2. The light emitting device according to claim 1, wherein a peak emission wavelength of the second red phosphor is in a wavelength range of 625 nm or more and 670 nm or less.
前記第1赤色蛍光体が、(Sr1−y,Ca1−xAlSiN:Eu系蛍光体(但し、0.001≦x≦0.05、0≦y<0.2)であり、
前記第2赤色蛍光体が、(Sr1−y,Ca1−xAlSiN:Eu系蛍光体(但し、0.001≦x≦0.05、0.2≦y<1)、または、Ca1−xAlSiN:Eu系蛍光体(但し、0.001≦x≦0.05)であることを特徴とする請求項2に記載の発光装置。
The first red phosphor, (Sr 1-y, Ca y) 1-x AlSiN 3: In Eu x phosphor (where, 0.001 ≦ x ≦ 0.05,0 ≦ y <0.2) Yes,
The second red phosphor, (Sr 1-y, Ca y) 1-x AlSiN 3: Eu x phosphor (where, 0.001 ≦ x ≦ 0.05,0.2 ≦ y <1), or, Ca 1-x AlSiN 3: Eu x phosphor (where, 0.001 ≦ x ≦ 0.05) light emitting device according to claim 2, characterized in that a.
前記緑色蛍光体のピーク発光波長が510nm以上550nm以下の波長範囲内にあり、且つ、発光スペクトル半値幅が95nm以上であることを特徴とする請求項1〜3の何れか一項に記載の発光装置。   The light emission according to any one of claims 1 to 3, wherein a peak emission wavelength of the green phosphor is in a wavelength range of 510 nm or more and 550 nm or less and an emission spectrum half width is 95 nm or more. apparatus. 前記緑色蛍光体が、AlLu:Ce系蛍光体、または、Ca(Sc1−x,MgSi12:Ce系蛍光体(但し、0.01≦x≦0.4)、または、Al12:Ce系蛍光体、または、MI(MII1−x,Ce(SiO(但し、MIはMg,Ca,Sr及びBaの中から選択される少なくとも1種の元素であり、MIIはAl,Ga,In,Sc,Y,La,Gd及びLuから選択される少なくとも1種の元素であり、0.01≦x≦0.4)であることを特徴とする請求項4に記載の発光装置。
The green phosphor, Al 5 Lu x O y: Ce based phosphor, or, Ca 3 (Sc 1-x , Mg x) 2 Si 3 O 12: Ce phosphor (where, 0.01 ≦ x ≦ 0.4), or Al 5 O 12 Y 3 : Ce-based phosphor, or MI 3 (MII 1-x , Ce x ) 2 (SiO 4 ) 3 (where MI is Mg, Ca, Sr and Ba) MII is at least one element selected from Al, Ga, In, Sc, Y, La, Gd, and Lu, and 0.01 ≦ x ≦ 0. 4) The light-emitting device according to claim 4.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020536381A (en) * 2017-10-04 2020-12-10 オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングOSRAM OLED GmbH Fluorescent mixture, transforming elements and optoelectronic components

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332770A (en) * 2000-05-23 2001-11-30 Koha Co Ltd Resin-sealing method of led chip
JP2006147999A (en) * 2004-11-24 2006-06-08 Kyocera Corp Wiring board for light emitting device, and light emitting equipment
JP2007113019A (en) * 2004-02-18 2007-05-10 National Institute For Materials Science Method for production of phosphor
JP2007180377A (en) * 2005-12-28 2007-07-12 Sharp Corp Light emitting device
WO2009011205A1 (en) * 2007-07-19 2009-01-22 Sharp Kabushiki Kaisha Light emitting device
JP2009049000A (en) * 2007-07-26 2009-03-05 Panasonic Electric Works Co Ltd Led illumination device
JP2009164242A (en) * 2007-12-28 2009-07-23 Hitachi Ltd Light source module, lighting apparatus, and liquid-crystal display
JP2009239242A (en) * 2007-06-22 2009-10-15 Mitsubishi Chemicals Corp Member forming liquid for semiconductor light emitting device, member for semiconductor light emitting device, member for aerospace industry, semiconductor light emitting device, and phosphor composition
JP2010050235A (en) * 2008-08-20 2010-03-04 Mitsubishi Chemicals Corp Semiconductor light emitting device, and method for manufacturing the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332770A (en) * 2000-05-23 2001-11-30 Koha Co Ltd Resin-sealing method of led chip
JP2007113019A (en) * 2004-02-18 2007-05-10 National Institute For Materials Science Method for production of phosphor
JP2006147999A (en) * 2004-11-24 2006-06-08 Kyocera Corp Wiring board for light emitting device, and light emitting equipment
JP2007180377A (en) * 2005-12-28 2007-07-12 Sharp Corp Light emitting device
JP2009239242A (en) * 2007-06-22 2009-10-15 Mitsubishi Chemicals Corp Member forming liquid for semiconductor light emitting device, member for semiconductor light emitting device, member for aerospace industry, semiconductor light emitting device, and phosphor composition
WO2009011205A1 (en) * 2007-07-19 2009-01-22 Sharp Kabushiki Kaisha Light emitting device
JP2009049000A (en) * 2007-07-26 2009-03-05 Panasonic Electric Works Co Ltd Led illumination device
JP2009164242A (en) * 2007-12-28 2009-07-23 Hitachi Ltd Light source module, lighting apparatus, and liquid-crystal display
JP2010050235A (en) * 2008-08-20 2010-03-04 Mitsubishi Chemicals Corp Semiconductor light emitting device, and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020536381A (en) * 2017-10-04 2020-12-10 オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングOSRAM OLED GmbH Fluorescent mixture, transforming elements and optoelectronic components
US11611022B2 (en) 2017-10-04 2023-03-21 Osram Oled Gmbh Phosphor mixture, conversion element and optoelectronic component

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