JP2015000263A - Heating cooker - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heating cooker capable of homogeneously performing cooking without any unevenness in baking even if performing cooking in any area on a placement surface of a cooking plate and capable of rapidly increasing or decreasing temperature.SOLUTION: A heating cooker 10 for foodstuff F includes: a cooking plate 11 including a cooking surface 11a for cooking the foodstuff F; a support plate 12 for supporting the cooking plate 11; and a heat generation part 13 that is provided between the cooking plate 11 and the support plate 12 and has at least one layer. One of the cooking plate 11 and the support plate 12 has a thermal conductivity higher than that of the other, and has a Young's modulus lower than that of the other. The heating cooker 10 may include a cooling plate 20 for cooling the cooking plate 11.

Description

  The present invention relates to a cooking device that heats and cooks food.

  Conventionally, heating cookers have been widely used in which ingredients such as sliced meat and pancake dough are placed directly on the cooking plate and cooked from the back side of the cooking plate using heating means such as a gas burner or resistance heating element. Yes. For example, Patent Document 1 discloses an electric heating type cooking device including a cooking plate on which food is placed and a planar heater such as a mica heater provided on the back side thereof. It is described that the cooking device of this patent document 1 can raise the intensity | strength of a cooking plate by providing a convex-shaped part on the back surface of a cooking plate corresponding to a mica heater.

  Patent Document 2 discloses an electric heating type cooking device including a cooking plate on which ingredients are placed and a plurality of heating elements formed in a surface shape for heating the cooking plate. The heating cooker of Patent Document 2 can suppress local heating of the cooking plate by appropriately heating all or part of the plurality of heating elements, and thus baked food such as meat placed on the cooking plate. It is described that cooking can be performed uniformly so as not to cause unevenness.

JP 2004-049505 A Japanese Patent Laid-Open No. 10-113293

  In the heating cooker as described above, in order to prevent the temperature of the cooking plate from being lowered locally when the food is placed, the cooking plate is made as thick as possible to ensure a sufficient heat capacity. . For example, an iron plate having a thickness of about 12 to 16 mm is generally used in a heating cooker for business use. However, when such a thick iron plate is used, the heat transfer performance is lowered and the temperature unevenness on the surface of the iron plate is increased. That was a problem. For example, in a heating cooker using a gas burner as a heating means, the food placed on the area of the iron plate surface exposed from the back side by the flame of the gas burner is heated more strongly than the food placed on the other areas. There was a trend.

  Therefore, in order to cook food properly, craftsmanship such as finding an area on the iron plate that has a temperature suitable for cooking the food and using only that area is required. It was difficult to cook easily. The electric heating cooker using the sheath heater has the same problem, and the portion along the sheath heater on the mounting surface on the iron plate tends to be hotter than the other portions. In addition, when the thickness of the cooking plate is increased, it takes time to raise the temperature to a predetermined temperature, and it takes time to cool it to a safe level after use, so it takes extra time to prepare and clean up before cooking. That was also a problem.

  The present invention has been made in view of the problems of such a conventional heating cooker, and can be cooked uniformly without any uneven baking regardless of the area of the mounting surface of the cooking plate. An object of the present invention is to provide a cooking device capable of quickly raising and lowering the temperature.

  In order to achieve the above object, a cooking device provided by the present invention is a cooking device for food, a cooking plate having a cooking surface for cooking food, a support plate for supporting the cooking plate, and the cooking And at least one layer of a heat generating portion provided between the plate and the support plate, and one of the cooking plate and the support plate has a higher thermal conductivity and a lower Young's modulus than the other. It is characterized by.

  ADVANTAGE OF THE INVENTION According to this invention, even if it cooks in any area of the mounting surface of the cooking plate which mounts a foodstuff, it can cook evenly without a baking unevenness, and can raise / lower temperature quickly.

It is typical sectional drawing which shows one specific example of the heating cooker of this invention. It is typical sectional drawing of the heating cooker with which the cooking plate and the support plate were couple | bonded so that relative movement was possible in the substantially parallel direction with respect to the mutually opposing surface using a screw and a bearing. It is typical sectional drawing which shows the other specific example of the heating cooker of this invention, and the state (a) in which the cooling plate is spaced apart from the support plate, and the state in which the cooling plate and the support plate are in contact ( b). It is a photograph of the surface of the pancake made in Example 1 of this invention. It is a photograph inside the pancake made in Example 1 of this invention. 2 is a photograph of the surface of a pancake made in Comparative Example 1. 4 is a photograph of the surface of a pancake made in Comparative Example 2. 4 is a photograph of the inside of a pancake made in Comparative Example 2. It is the graph which demonstrated typically the difference of the performance of the heating cooker of this invention, and the conventional heating cooker.

  First, embodiments of the present invention will be listed and described. The cooking device for cooking ingredients according to the present invention includes a cooking plate having a cooking surface for cooking ingredients, a supporting plate for supporting the cooking plate, and at least one layer provided between the cooking plate and the supporting plate. One of the cooking plate and the support plate has a higher thermal conductivity and a lower Young's modulus than the other. Thereby, even if it cooks in any area of the mounting surface of the cooking plate which mounts a foodstuff, it can cook uniformly without baking unevenness, and can raise / lower temperature quickly.

  In the cooking device for cooking food according to the present invention, it is preferable that the thermal conductivity of the cooking plate is higher than the thermal conductivity of the support plate, and the Young's modulus of the support plate is higher than the Young's modulus of the cooking plate. In particular, the cooking plate is preferably made of metal, and the support plate is preferably made of ceramics or a metal ceramic composite material. If the cooking plate is metal, the heat generated in the heat generating part can be transferred in the cooking plate having a high thermal conductivity and quickly spread over the entire cooking surface, so that higher heat uniformity can be obtained on the cooking surface. Because. Moreover, since the rigidity of the heating cooker can be borne by the support plate, the thickness of the cooking plate can be reduced, and as a result, the heat capacity of the cooking plate can be suppressed and placed on the cooking surface. The temperature of the food can be raised and lowered more rapidly.

  In the cooking device for cooking ingredients according to the present invention, the thickness of the support plate is preferably equal to or greater than the thickness of the cooking plate. This is because the effects of the characteristics of each material can be exhibited in a balanced manner. In addition, if the material with high rigidity is too thin, the risk of cracking or breaking increases.

  In the cooking device for cooking food according to the present invention, it is preferable that the cooking plate and the support plate are coupled so as to be relatively movable in a direction substantially parallel to the opposing surfaces. Thereby, the cooking plate and the support plate can freely expand and contract freely according to their respective thermal expansion coefficients. In particular, it is preferable that the relatively movable coupling engages a screw screwed to the lower surface of the cooking plate and a lower surface of the support plate via a bearing.

  The food cooking device of the present invention may further include a cooling plate for cooling the cooking plate. Thereby, it becomes possible to perform cooling more rapidly, and it becomes possible to quickly change the set temperature to the low temperature side and clean up after use. In particular, the cooling plate is preferably movable so that it can reciprocate between a position contacting the lower portion of the support plate and a position separating the cooling plate so that the cooling plate can be easily cooled.

  Next, a specific example of the heating cooker of the present invention will be described with reference to FIG. A cooking device 10 shown in FIG. 1 includes a plate-shaped cooking plate 11 that directly heats food F such as sliced meat and pancake dough, and a plate that supports the lower surface of the cooking plate 11 from below. And a heat generating portion 13 provided between the cooking plate 11 and the support plate 12.

  The plan view shape when the cooking plate 11 is viewed from above is not particularly limited, and may have any shape such as a circle, an ellipse, and a rectangle. The upper surface side of the cooking plate 11 is a flat cooking surface 11a, and the food F described above is placed on the cooking surface 11a. The support plate 12 positioned on the lower surface side of the cooking plate 11 supports the lower surface of the cooking plate 11 on the upper surface of the support plate 12. The plan view shape when the support plate 12 is viewed from above is preferably the same as the plan view shape of the cooking plate 11, whereby the lower surface of the cooking plate 11 can be uniformly supported over the entire surface.

  Of these cooking plates 11 and support plates 12, one of them has higher thermal conductivity and lower Young's modulus than the other. Thereby, one of the cooking plate 11 and the support plate 12 can play a role of high heat uniformity on the cooking surface 11a, and the other can play a role of high rigidity as the heating cooker 10 as a whole. That is, the cooking device 10 having both high heat uniformity and high rigidity can be provided.

  Thus, in order for one of the cooking plate 11 and the support plate 12 to have a higher thermal conductivity and a lower Young's modulus than the other, the thermal conductivity of the cooking plate 11 is equal to the thermal conductivity of the support plate 12. The materials may be combined so that the Young's modulus of the cooking plate 11 is lower than the Young's modulus of the support plate 12 and vice versa, and vice versa, the thermal conductivity of the cooking plate 11 is the heat conductivity of the support plate 12. The materials may be combined so that the Young's modulus of the cooking plate 11 is lower than the Young's modulus of the support plate 12.

  Such a combination of materials can be realized by using, for example, a metal on one side and ceramics or a composite containing ceramics on the other side. Since the metal is general-purpose, the cost can be suppressed, and since the heat conductivity is high, the temperature uniformity in the cooking surface can be improved. Conventional cooking plates need to be thicker to maintain flatness depending on the size and cooking temperature, but they can be used even with thin metal plates when used in combination with ceramic plates with excellent rigidity described later. Can be maintained.

  On the other hand, ceramics have a high Young's modulus, so that they are excellent in rigidity and do not deform even when the plate thickness is reduced. Therefore, it is possible to reduce the heat capacity as compared with the conventional cooking plate using thick iron-based material, and it is possible to increase the temperature raising / lowering speed. In particular, by selecting a material having relatively high thermal conductivity among ceramics, it is possible to achieve good temperature uniformity within the cooking surface while maintaining a small heat capacity.

  For example, when it is desired to increase the thermal conductivity on the cooking plate 11 side and lower the Young's modulus compared to the support plate 12, a metal may be used for the cooking plate 11 and a ceramic or a composite containing ceramics may be used for the support plate 12. . In this case, the thickness of the support plate 12 is preferably equal to or greater than the thickness of the cooking plate 11. This is because the effects of the characteristics of each material can be exhibited in a balanced manner. In addition, if the material with high rigidity is too thin, the risk of cracking or breaking increases. In particular, it is more preferable that the thickness of the cooking plate 11 is 2 to 5 mm and the thickness of the support plate 12 is 6 to 8 mm. Conversely, when it is desired to lower the thermal conductivity on the cooking plate 11 side and to increase the Young's modulus compared to the support plate 12, ceramic or a composite containing ceramics is used for the cooking plate 11 and metal is used for the support plate 12. Good. In this case, it is more preferable that the thickness of the cooking plate 11 is 6 to 8 mm and the thickness of the support plate 12 is 2 to 5 mm.

  In the combination of these materials, it is more preferable to use a metal for the cooking plate 11 and to use ceramics or a composite containing ceramics for the support plate 12. The reason is that if the cooking plate 11 is a metal, the heat generated in the heat generating portion 13 can be transferred in the cooking plate 11 having a high thermal conductivity and quickly spread over the entire cooking surface 11a. This is because higher soaking properties can be obtained in 11a. In this case, since the rigidity of the heating cooker 10 can be borne by the support plate 12, the thickness of the cooking plate 11 can be reduced. As a result, the heat capacity of the cooking plate 11 can be suppressed, and the temperature of the food placed on the cooking surface 11a can be increased and lowered more rapidly.

  A specific metal used for one of the cooking plate 11 and the support plate 12 preferably has a thermal conductivity of 100 W / mK or more. Examples of such a metal include copper, aluminum, tungsten, and molybdenum. Specific ceramics used for the other of the cooking plate 11 and the support plate 12 can include, for example, silicon carbide, alumina, aluminum nitride, silicon nitride, etc. Examples thereof include Si—SiC (composite of Si and SiC) and Al—SiC (composite of Al and SiC) which are composites of ceramics, aluminum, and silicon.

  When the material of the cooking plate 11 is a ceramic or a metal ceramic composite and the material of the support plate 12 is a metal, the ceramic or the composite including the same is excellent in machining accuracy. Can be easily formed, and even if the heat cycle is repeated, the flat state can be maintained. In addition, even when an instrument such as a knife, fork, or trowel is used during cooking, the cooking surface 11a is less likely to be scratched, so that a cooking device excellent in hygiene and aesthetics can be produced. Can also be obtained. Further, by using ceramics or a composite containing the same for the cooking plate 11, an effect of cooking with far infrared rays can be expected.

  When a cooling plate is provided below the support plate 12 as will be described later, it is preferable that the thermal conductivity of the support plate 12 is high to some extent. This is because the heat of the cooking device 10 can be transferred to the cooling plate without taking much time. From this point of view, the material of the support plate 12 is preferably a metal, but in the case of ceramics, silicon carbide, aluminum nitride, or silicon nitride, and in the case of a metal ceramic composite, aluminum or silicon, and silicon carbide or nitride. Good thermal conductivity can be obtained by using a composite with aluminum.

  The heat generating part 13 has a layered resistance heating element 13a that heats the food placed on the cooking surface 11a by Joule heat generated when electricity is passed through the conductor. This resistance heating element 13a is preferably applied to a foil-like member made of stainless steel, nickel-chromium or the like having a thickness substantially the same as that of the cooking plate 11 such as 0.01 to 0.1 mm. A circuit pattern such as a spiral shape or a meandering shape is formed by processing and the like, and the power supply wiring is connected to the end portion.

  In the circuit pattern formed as described above, resistance wires of uniform size may be formed at an equal pitch so that the heat generation density is uniform in the cooking surface 11a, and the type of food and the installation of cooking plates Considering the environment, heat dissipation from the member that supports the heating cooker 10, etc., the outer pitch may be narrower than the inner pitch so that the outer heat generation density is higher than the inner heat generation density, for example.

  Such locally different heat generation densities can be realized in one heat generating circuit as described above, but can also be realized by providing a plurality of heat generating circuits in the same plane. For example, when the cooking plate 11 is disc-shaped, it can be realized by providing a resistance heating element separately at the center and the peripheral part, or by providing a fan-shaped resistance heating element for each angular region divided in the circumferential direction. It is.

  The heating cooker 10 may be provided with a temperature sensor 30. When the resistance heating element is separately provided in a plurality of regions as described above, a temperature sensor is provided for each divided region and temperature control is performed for each region. May be. As a method for attaching the temperature sensor 30, for example, when a thermocouple is used, a concave portion is provided on the back surface of the cooking plate 11 so that the tip of the thermosensor reaches a predetermined position in the cooking plate 11, and the heat generating portion 13 is provided. In addition, it is preferable that a through hole is provided at a position corresponding to the recess in the support plate 12 and a temperature sensor is inserted from the through hole toward the recess. The temperature sensor may be a thermocouple or a resistance temperature detector.

  The resistance heating element 13a may be composed of a single layer or a plurality of layers. In the case of a plurality of layers, for example, in addition to a layered resistance heating element for temperature control, a layered resistance heating element that supplies power only when the set temperature is changed is provided at a different position in the thickness direction of the heating cooker 10. Can do. In this case, it is preferable to interpose an insulator for the purpose of electrical insulation between the two resistance heating elements. Moreover, when using a conductive material for the cooking plate 11 or the support plate 12, it is necessary to interpose an insulator for the purpose of electrical insulation between the resistance heating element 13a and the conductive material. Become.

  It is desirable to use an insulator having as high a thermal conductivity as possible. If the thermal conductivity of the insulator is high, the temperature distribution generated by the circuit pattern of the resistance heating element 13a, the shape of the heating cooker 10, the installation environment, and the like can be reduced, and a heating cooker with higher thermal uniformity is provided. Because it can. The insulator may be provided so as to cover one surface or both surfaces of the resistance heating element 13a, or may be integrated with the resistance heating element 13a.

  By integrating in this way, the adhesiveness is improved in all parts of the resistance heating element 13a, the thermal resistance at the interface of the resistance heating element 13a can be lowered, and local variations in thermal resistance can be suppressed. As a result, it is possible to ensure thermal uniformity in a state where the effects of the characteristics of the cooking plate 11 and the support plate 12 are maximized. Furthermore, even if the resistance heating element 13a repeats expansion and contraction due to a thermal load due to the integration, positional deviation with respect to the planar direction is less likely to occur, and a highly reliable cooking device can be manufactured. FIG. 1 shows a specific example of the heat generating portion 13 in which an insulating body 13b is integrated with a resistance heat generating body 13a.

  The material of the insulator can be selected from, for example, silicone resin, fluorine resin, polyimide resin, ceramic fiber sheet, mica, and the like. Silicone resin can further improve the thermal uniformity by making use of its flexibility, and fluororesin, polyimide resin, ceramic fiber sheet, mica and the like can be used even in a temperature range exceeding 200 ° C. In particular, mica can be used even in a temperature range exceeding 500 ° C. and is excellent in electrical insulation, and thus is suitable for use in a high temperature range. The mica and the resistance heating element 13a are also preferable in that they can be easily integrated by thermocompression bonding.

  Since a gap between adjacent lines of the heating element circuit pattern can cause thermal resistance, it is desirable to fill this gap. In this case, it may be filled with the flexible insulating sheet as described above. However, if the lines and the gaps of the heating element circuit pattern are dense, it is difficult to fill them sufficiently. In this case, it is preferable to fill the gap between the insulating sheet and the resistance heating element and between adjacent lines with an adhesive. For this adhesive, a film containing a thermosetting resin such as a thermoplastic resin or polyimide, a varnish, or the like is effective. By disposing these between the insulating sheet and the pattern and thermocompression bonding under appropriate temperature and pressure conditions, the heat generating part 13 maintaining good thermal contact can be manufactured.

  It is important that no gap is generated between the heat generating portion 13 and the cooking plate 11 or the support plate 12. This is because if a gap is generated, heat transfer during heating or cooling by a cooling plate, which will be described later, becomes insufficient, and the gap expands during heating, causing peeling of the resistance heating element 13a or dielectric breakdown. . As will be described later, when the cooling plate is brought into contact with the support plate or when food is placed on the cooking surface, a temperature difference or a thermal expansion difference occurs between the cooking plate and the support plate. It tends to occur.

  In order to prevent such a gap around the resistance heating element 13a, the cooking plate 11 and the support plate 12 are preferably coupled to each other by a mechanical method. Specific mechanical coupling methods include, for example, fixing by screwing and fixing by laying a spring between the cooking plate 11 and the support plate 12, and among these, in terms of stability in the fixed state. Screwing is more preferable. In screwing, one or a plurality of screw holes are provided on the lower surface of the cooking plate 11, and through holes are provided at positions corresponding to the screw holes in the support plate 12 and the heat generating portion 13. And a cooking plate 11 and the support plate 12 can be fixed by inserting a volt | bolt from the lower side of the support plate 12, and screwing it in the said screw hole.

  The screw hole provided in the cooking plate 11 is a stop process, and care is taken not to penetrate it. This is because if this screw hole is penetrated or if the tip of the bolt is exposed from the cooking surface 11a, oil or moisture enters from the portion, and problems such as a short circuit of the resistance heating element 13a may occur. In addition, it is preferable to interpose a bearing, for example in a mechanical coupling part so that the cooking plate 11 and the support plate 12 can be thermally expanded and contracted freely according to each thermal expansion coefficient.

  Specifically, as shown in FIG. 2, the head 14 a of the bolt 14 and the lower surface of the support plate 12 are preferably engaged via a bearing 15. Thereby, the cooking plate 11 and the support plate 12 can be relatively moved in a direction substantially parallel to the opposing surfaces. FIG. 2 shows an example in which a groove for the bearing 15 is provided on the head 14a side of the bolt 14, but a groove for the bearing 15 may be provided on the lower surface of the support plate 12. In addition, the inner diameter of the hole for inserting the bolt 14 provided in the support plate 12 and the heat generating portion 13 is made larger than the outer diameter of the tip end portion of the bolt 14 in consideration of the thermal expansion difference between the cooking plate 11 and the support plate 12. Is preferred.

  The heating cooker 10 may be supported by attaching a plurality of legs to the lower surface of the support plate, or a table having a slightly larger opening than the plan view shape of the heating cooker 10 at a substantially central portion is prepared. You may support the both ends and peripheral part of the heating cooker 10 with the inner edge part of an opening part. The legs and the inner edge of the table are preferably formed of a heat insulating material or covered with a heat insulating material so that the heat of the heating cooker 10 does not dissipate through this.

  A cooling plate 20 may be provided on the lower surface side of the support plate 12 as in the cooking device 10 of another specific example of the present invention shown in FIGS. 3 (a) and 3 (b). Thereby, it becomes possible to perform cooling more rapidly, and it becomes possible to quickly change the set temperature to the low temperature side and clean up after use. The cooling plate 20 is separated from the lower surface of the support plate 12 as shown in FIG. 3A when cooking food, and when the temperature is to be rapidly lowered, the support plate 12 is shown in FIG. 3B. It is made to contact with the lower surface of the.

  The cooling plate 20 is preferably capable of reciprocating between the separated position and the contact position. Thereby, rapid cooling can be performed easily. The reciprocating motion of the cooling plate 20 may be manual or automatic using a lifting device such as a motor or an air cylinder. The cooling plate 20 may be provided with a through hole or a notch for inserting a power supply wiring to the resistance heating element 13a and a temperature sensor.

  The cooling plate 20 is preferably selected from copper, aluminum, nickel, magnesium, titanium having good thermal conductivity, or an alloy such as stainless steel mainly composed of these. In particular, since copper has a large heat capacity, it takes a large amount of heat from the object to be cooled, and is suitable for cooling at high speed. However, since copper has a large specific gravity, aluminum may be used when there is a weight limitation or when it is not preferable from the viewpoint of handling. The cooling plate 20 may be subjected to a surface treatment such as Ni plating with high corrosion resistance and oxidation resistance.

  The cooling plate 20 may be provided with a refrigerant flow path for more rapid cooling. A cooling plate having a coolant flow path is prepared by, for example, preparing two plate-like members such as oxygen-free copper having substantially the same shape, and forming a flow path on one side thereof by machining or the like. It is obtained by overlapping the other plate-like members so as to face each other and brazing and joining. Or you may attach the pipe | tube which flows a refrigerant | coolant to the plate-shaped member consisting of aluminum, copper, etc. In order to increase the cooling efficiency, a counterbore groove into which the pipe is partially fitted may be provided in the plate member, or a resin or ceramic having high thermal conductivity may be interposed between the pipe and the plate member.

  Further, a second cooling plate that cools the cooling module 20 by contacting the cooling plate 20 when the cooling module 20 is separated from the lower surface of the support plate 12 may be provided below the cooling plate 20. The second cooling plate is preferably made of the same material as the cooling module 20 as described above, and may be provided with a coolant channel. Thus, after the cooling plate 20 is brought into contact with the high temperature support plate 12 and the cooking plate 11 is cooled to some extent, the high temperature cooling plate 20 is separated from the support plate 12 and is preferably cooled by the refrigerant. The high temperature cooling plate 20 can be brought into contact with the second cooling plate for cooling. Therefore, the cooling plate 20 can be cooled more efficiently than in the case where there is no second cooling plate, and the cooking plate 11 is brought into contact with the support plate 12 again by bringing the cooling plate 20 cooled in this way into contact with the support plate 12. Can be cooled more rapidly.

  Since the cooking device of the present invention has the above-described characteristic configuration, extremely high heat uniformity can be obtained on the cooking surface. Therefore, the surface of the food can be baked uniformly. This exhibits an extremely excellent effect when it is important to bake the entire surface uniformly, such as pancake, hot cake, and dorayaki.

  In addition, since it has extremely high temperature uniformity as described above, it can be cooked in a short time by setting the temperature so high that it does not burn during cooking, a new one that has not been possible due to problems such as burning so far Cooking becomes possible. Specifically, in cooking meat, etc., the outer surface is baked first, and the inside can be properly baked with the meat juice and umami ingredients confined inside, so the umami increases and the so-called outside is crispy. It can be baked to the finest texture inside. In addition, pancakes and the like can be baked at a high temperature in a short time to prevent moisture evaporation during cooking, so that moisture can be confined and moistened and baked softly.

  Furthermore, since it can cook on the same conditions, even if it cooks in any area of a cooking surface, it can cook on the best conditions immediately after introduce | transducing. In general, a rectangular cooking plate tends to have a low temperature at the four corners. However, since the heating cooker of the present invention can obtain a high temperature uniformity over the entire surface even in a rectangular shape, it is possible to effectively utilize the entire cooking surface. it can.

  Moreover, since the roles of high thermal conductivity and high Young's modulus can be assigned to different members, the heat capacity can be reduced and lightened despite the high rigidity. As a result, rapid temperature rise and fall is possible, the time before cooking and the time for clean-up can be shortened, leading to energy saving. In addition, since the heat capacity can be reduced, the followability at the time of temperature control is improved, and even if the temperature is lowered once the food is placed, the temperature can be recovered immediately. Furthermore, it is possible to quickly obtain a soaking state even when the set temperature is changed. Specifically, it is possible to quickly and accurately control the temperature at which cooking is desired in units of 1 ° C.

  As mentioned above, although the specific example was given and demonstrated about the heating cooker of this invention, this invention is not limited to the specific example which concerns, Various modifications and alternative examples are within the range which does not deviate from the main point of this invention. Can think. That is, the technical scope of the present invention extends to the claims and their equivalents.

[Example 1]
A cooking device 10 including a cooking plate 11, a support plate 12, and a heat generating unit 13 as shown in FIG. 1 was produced, and cooking was performed by placing ingredients. Specifically, a rectangular rectangular copper plate having a length of 400 mm × width of 400 mm and a thickness of 3 mm was used for the cooking plate 11. On the other hand, the support plate 12 was a rectangular plate made of a Si—SiC composite having a length of 400 mm × width of 400 mm and a thickness of 6 mm.

  In the heat generating part 13, a resistance heating element 13a obtained by finely processing a rectangular metal foil made of stainless steel having a length of 360 mm × width of 360 mm and a thickness of 0.05 mm into a rectangular spiral shape is integrated with polyimide (PI) as an insulator 13b. We used what we did. The thickness of the heat generating portion 13 was set to 0.15 mm. The heat generating portion 13 was sandwiched between the cooking plate 11 and the support plate 12 and fixed by screws. As shown in FIG. 2, the used screw is provided with a groove on the entire surface of the screw head facing the support plate 12, and is smaller than the width of the groove and larger than the depth of the groove. A ball bearing having a diameter was placed in this groove, and the screw and the lower surface of the support plate 12 were engaged via the ball bearing.

  After feeding the resistance heating element 13a of the heating cooker 10 thus produced to raise the temperature from room temperature to about 230 ° C., the pancake dough was poured onto the cooking surface 11a to bake the pancake. As can be seen from the photographs shown in FIG. 4 and FIG. 5 showing the top and inside of the pancake made in this way, the surface can be baked uniformly, and the inside is moist and fluffy throughout. I was able to bake. It took about 5 minutes to raise the temperature from room temperature to about 230 ° C., and about 1 minute and 30 seconds to cook the pancake.

  After the pancake is baked, the power supply to the resistance heating element 13a is stopped, and the upper surface of the rectangular rectangular cooling plate 20 having a length of 400 mm × width of 400 mm and a thickness of 10 mm at the room temperature is applied to the lower surface of the support plate 12. Touched. After a while, the temperature of the cooking plate 11 became difficult to decrease, so the cooling plate 20 was separated from the support plate 12, the warmed cooling plate 20 was cooled, and then brought into contact with the support plate 12 again. As a result of repeating the contact and separation operations a plurality of times, it was possible to cool the cooking plate 11 to the extent that the cooking plate 11 was directly touched in about 30 minutes.

[Example 2]
Three types of heating cookers were produced in the same manner as in Example 1 except that SiC, AlN, and Al-SiC composite were used instead of the Si-SiC composite for the support plate 12, respectively. Using each of these three types of cooking devices, a pancake was made in the same manner as in Example 1 and cooled by the cooling plate 20. As a result, it was possible to bake the surface uniformly in any of the heating cookers as in the case of Example 1, and the inside was moist throughout and could be baked plumply. The temperature raising time, the cooking time, and the cooling time were as shown in Table 1 below.

[Example 3]
Two copper plates of the same shape of length 400 mm × width 400 mm × thickness 5 mm are prepared, and a flow path with a depth of 3 mm, a width of 6 mm, and a distance of 2400 mm is formed on one side of one copper plate by machining. The other copper plate was overlapped and brazed and joined so as to face the surface. Moreover, the nozzle for water supply and drainage was attached to the entrance / exit of the flow path currently formed in the side surface of the joined copper plate, respectively. In this way, a cooling plate with a flow path was produced.

  Then, the heating cooker 10 used in Example 1 is prepared again, and the resistance heating element 13a is supplied with power, heated to about 230 ° C. and maintained at this high temperature for a while, and then supplied to the resistance heating element 13a. Was stopped, and the upper surface was brought into contact with the lower surface of the support plate 12 while water at room temperature was supplied to the nozzle of the cooling plate with a flow path at room temperature. As a result, it was possible to cool the cooking plate 11 to the extent that it was directly touched by hand in about 5 minutes. In the third embodiment, since the heating cooker 10 is cooled while flowing water directly through the cooling plate, the cooling plate itself can be cooled without being heated, and the cooling plate is raised and lowered during cooling as in the first embodiment (i.e., There was no need to repeat the operation of separation and contact.

[Comparative Example 1]
A commercially available electric heating cooker (cooking plate material: iron, cooking plate size: length 400 mm x width 400 mm x thickness 16 mm) was prepared, and the temperature was raised from room temperature to about 150 ° C, which is a normal set temperature. Thereafter, the pancake dough similar to that in Example 1 was poured onto the cooking surface, and the pancake was baked. Immediately after the pancake was baked, the power was turned off and the pancake was allowed to cool as it was. A photograph of the top surface of the pancake thus made is shown in FIG. It took about 10 minutes to raise the temperature from room temperature to about 150 ° C., and about 5 minutes to cook the pancake. In addition, it took about 150 minutes for the pancake to cool to the extent that it was touched directly by hand with the iron plate.

[Comparative Example 2]
In order to make pancakes under the same temperature conditions as in Example 1, the heating cooker used in Comparative Example 1 was heated from room temperature to about 230 ° C., and then the pancake dough similar to that in Example 1 was placed on the cooking surface. The pancake was baked over about 1 minute 30 seconds. Immediately after the pancake was baked, the power was turned off and the pancake was allowed to cool as it was. FIGS. 7 and 8 show photographs of the top and inside of the pancake thus prepared, respectively. It took about 15 minutes to raise the temperature from room temperature to about 230 ° C. It took about 240 minutes for the pancake to cool down until it was touched directly by hand.

  As is apparent from the photographs in FIGS. 4 and 5, the pancakes produced by the heating cookers of Examples 1 and 2 were baked uniformly over the entire surface, and the interior was baked uniformly. It was. On the other hand, the pancake baked with the heating cooker of Comparative Example 1 has uneven baking on the surface as apparent from the photograph of FIG. 6, and as is apparent from the photographs of FIGS. 7 and 8 in Comparative Example 2, Although the center part of the surface was burnt, the inside was in a so-called burnt state that remained in a fluid state.

  Thus, the reason why a large difference occurred in the baking of pancakes in Examples 1 and 2 and Comparative Examples 1 and 2 is that the conventional heating cooker used in Comparative Example 1 is not so uniform. As shown in FIG. 9 (a), a lower temperature having a large margin with respect to the temperature (Tb) at which the food is burnt in consideration of in-plane temperature variation is set as the normal set temperature (Ts1). Therefore, it is necessary to heat and cook over time, and this causes the temperature variation to become obvious, and as a result, it is considered that the unevenness of baking occurred as in Comparative Example 1.

  Moreover, as shown in FIG. 9B, when the set temperature is set at a higher temperature (Ts2) to cook in a short time at a high temperature using a conventional heating cooker as in Comparative Example 2. The temperature (Tb) at which the food material burns at the portion where the temperature varies to the high temperature side is exceeded, and it is considered that the food material is burnt at that portion. And, since the heating temperature is high, scorching occurred in a short time, so it is not possible to cook any more, and as a result, heat can be sufficiently distributed to the inside due to the influence of the part that varies on the low temperature side As shown in FIG. 8, it is considered that the inside remained in a fluid state and could not be burned.

  On the other hand, since the heating cookers of Examples 1 and 2 had high soaking properties, as shown in FIG. 9C, a high heating temperature (Ts2) just before the burning temperature (Tb) was reached. Even if it is set to, the temperature of the cooking surface does not exceed the temperature (Tb) at which the food is scorched over the entire surface, and thus it was considered that a uniform baked pancake without baking unevenness could be made in a short time. It is done. Surprisingly, the pancakes made with the heating cookers of Examples 1 and 2 were significantly improved in texture and taste as compared with the pancakes made with the conventional heating cookers. The reason why it became so delicious is not well understood, but it is presumed that moisture and umami components were confined inside by cooking at a high temperature in a short time.

DESCRIPTION OF SYMBOLS 10 Heating cooker 11 Cooking plate 11a Cooking surface 12 Support plate 13 Heat generating part 13a Resistance heating element 13b Insulator 14 Bolt 14a Bolt head 15 Bearing 20 Cooling plate 30 Temperature sensor

Claims (8)

  A cooking device for cooking ingredients, a cooking plate having a cooking surface for cooking ingredients, a supporting plate for supporting the cooking plate, and at least one layer of heat generated between the cooking plate and the supporting plate And one of the cooking plate and the support plate has a higher thermal conductivity and a lower Young's modulus than the other.   The cooking device according to claim 1, wherein the cooking plate has a thermal conductivity higher than that of the support plate, and a Young's modulus of the support plate is higher than a Young's modulus of the cooking plate.   The cooking device according to claim 1 or 2, wherein the cooking plate is made of metal, and the support plate is made of ceramics or a metal ceramic composite material.   The cooking device according to any one of claims 1 to 3, wherein a thickness of the support plate is equal to or greater than a thickness of the cooking plate.   The cooking device according to any one of claims 1 to 4, wherein the cooking plate and the support plate are coupled so as to be relatively movable in a direction substantially parallel to the opposing surfaces.   The cooker according to claim 5, wherein the relatively movable coupling engages a screw screwed to a lower surface of the cooking plate and a lower surface of the support plate via a bearing.   The cooking device according to any one of claims 1 to 6, further comprising a cooling plate for cooling the cooking plate.   The heating cooker according to claim 7, wherein the cooling plate is movable so that it can reciprocate between a position where it abuts against a lower portion of the support plate and a position where it is separated from the support plate.