JP2014519039A5 - - Google Patents

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Publication number
JP2014519039A5
JP2014519039A5 JP2014513787A JP2014513787A JP2014519039A5 JP 2014519039 A5 JP2014519039 A5 JP 2014519039A5 JP 2014513787 A JP2014513787 A JP 2014513787A JP 2014513787 A JP2014513787 A JP 2014513787A JP 2014519039 A5 JP2014519039 A5 JP 2014519039A5
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JP
Japan
Prior art keywords
pocket depth
test
semiconductor device
packaged semiconductor
package size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2014513787A
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English (en)
Japanese (ja)
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JP2014519039A (ja
JP6016900B2 (ja
Filing date
Publication date
Priority claimed from US13/153,005 external-priority patent/US8829939B2/en
Application filed filed Critical
Publication of JP2014519039A publication Critical patent/JP2014519039A/ja
Publication of JP2014519039A5 publication Critical patent/JP2014519039A5/ja
Application granted granted Critical
Publication of JP6016900B2 publication Critical patent/JP6016900B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014513787A 2011-06-03 2012-06-04 複数の半導体パッケージサイズに対応するためのポケットを有するシャトルプレート Active JP6016900B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/153,005 2011-06-03
US13/153,005 US8829939B2 (en) 2011-06-03 2011-06-03 Shuttle plate having pockets for accomodating multiple semiconductor package sizes
PCT/US2012/040722 WO2012167242A2 (en) 2011-06-03 2012-06-04 Shuttle plate having pockets for accommodating multiple semiconductor package sizes

Publications (3)

Publication Number Publication Date
JP2014519039A JP2014519039A (ja) 2014-08-07
JP2014519039A5 true JP2014519039A5 (cg-RX-API-DMAC7.html) 2015-07-16
JP6016900B2 JP6016900B2 (ja) 2016-10-26

Family

ID=47260433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014513787A Active JP6016900B2 (ja) 2011-06-03 2012-06-04 複数の半導体パッケージサイズに対応するためのポケットを有するシャトルプレート

Country Status (4)

Country Link
US (1) US8829939B2 (cg-RX-API-DMAC7.html)
JP (1) JP6016900B2 (cg-RX-API-DMAC7.html)
CN (1) CN103718052B (cg-RX-API-DMAC7.html)
WO (1) WO2012167242A2 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101677709B1 (ko) * 2015-08-31 2016-11-21 (주)마이크로컨텍솔루션 Ssd 테스트용 젠더 구조
TWI615342B (zh) * 2017-03-21 2018-02-21 德律科技股份有限公司 電路板測試系統、電路板測試方法及電路板安裝裝置
US10782341B2 (en) 2018-08-21 2020-09-22 Texas Instruments Incorporated Semiconductor device handler with a floating clamp
CN116577640A (zh) * 2023-06-08 2023-08-11 中山市博测达电子科技有限公司 数字载荷硬件自动测试系统及方法
US20250201607A1 (en) * 2023-12-18 2025-06-19 Taiwan Semiconductor Manufacturing Company Limited Package shuttle for enhanced package handling reliability and methods for forming the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506213A (en) 1983-07-18 1985-03-19 Sym-Tek Systems, Inc. Electronic device handler
US5227717A (en) * 1991-12-03 1993-07-13 Sym-Tek Systems, Inc. Contact assembly for automatic test handler
JPH08179007A (ja) 1994-12-22 1996-07-12 Advantest Corp Ｉｃテスタ用ハンドラのチェンジキットの構造
JPH10227831A (ja) * 1997-02-17 1998-08-25 Advantest Corp Ｉｃ試験装置
KR100349942B1 (ko) * 1999-12-06 2002-08-24 삼성전자 주식회사 램버스 핸들러
US6718608B2 (en) 2002-01-22 2004-04-13 St Assembly Test Services Pte Ltd Multi-package conversion kit for a pick and place handler
AU2003227357A1 (en) 2003-04-23 2004-11-19 Advantest Corporation Insert and tray respectively for electronic component handling device and electronic component handling device
JP2005321242A (ja) * 2004-05-07 2005-11-17 Fujitsu Ltd Ｉｃの自動試験方法及びプログラム
KR100610778B1 (ko) 2004-12-03 2006-08-09 미래산업 주식회사 반도체 소자 테스트 핸들러용 캐리어 모듈
KR100817054B1 (ko) * 2006-07-13 2008-03-26 삼성전자주식회사 패키지 테스트용 소켓, 테스트 소켓용 러버 및 테스트소켓용 가이드
JP4967532B2 (ja) * 2006-08-25 2012-07-04 富士通セミコンダクター株式会社 半導体集積回路および半導体集積回路のテスト方法
JP2008192271A (ja) * 2007-02-08 2008-08-21 Nec Electronics Corp 半導体装置及びそのテスト方法
JP5282093B2 (ja) * 2008-07-08 2013-09-04 株式会社アドバンテスト 電子部品の試験方法及び電子部品試験システム
JP2010202392A (ja) * 2009-03-05 2010-09-16 Elpida Memory Inc Ｉｃオートハンドラ

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