JP2014236082A - Test schedule creation method, testing method, test schedule creation device, and substrate processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a test schedule creation method capable of efficiently performing a test for measuring a temperature of treatment by a heat treatment plate, a testing method, a test schedule creation device and a substrate processing device.SOLUTION: The test schedule creation method is configured to create test schedule information relating to a schedule of a plurality of tests before performing the plurality of tests for measuring a temperature of treatment by a heat treatment plate while changing at least any one of the heat treatment plate and a test temperature that is a target value of the treatment temperature. The test schedule creation method includes a first test creation step (steps S12 and S13) of allocating a "first order" that is a first turn, to any one of tests, and a second and subsequent test creation step (steps S14 and S15) of allocating a "second order" and an order subsequent to the "second order" to any of non-allocated tests to which the turns have not been allocated yet, and creates the test schedule information by repeating the second and subsequent test creation step (steps S14 and S15) until the turns are allocated to all the tests.

Description

  The present invention relates to a test schedule creation method, a test method, a test schedule creation apparatus, and a substrate processing apparatus relating to a test for measuring a processing temperature by a heat treatment plate.

  Conventionally, there is a method in which a heat treatment plate and a substrate to which a temperature measuring element is attached are provided, and the temperature of the substrate is measured by placing the substrate on the heat treatment plate. The temperature measuring element is constituted by a crystal resonator or the like. The electromagnetic wave emitted from the quartz oscillator is received, and the temperature of the substrate is measured based on the frequency of the electromagnetic wave (see, for example, Patent Document 1).

JP 2007-19155 A

However, the conventional example having such a configuration has the following problems.
That is, when the heat treatment plate can process a substrate at two or more processing temperatures, a plurality of measurements may be performed at different temperatures. When the substrate processing apparatus includes a plurality of heat treatment plates, a plurality of measurements may be performed by changing the heat treatment plates. Thus, there is no conventional method for performing a plurality of measurements.

  The present invention has been made in view of such circumstances, and a test schedule creation method, a test method, a test schedule creation apparatus, and a substrate processing apparatus capable of efficiently performing a test for measuring a processing temperature by a heat treatment plate The purpose is to provide.

In order to achieve such an object, the present invention has the following configuration.
That is, according to the present invention, before performing a plurality of tests for measuring the processing temperature by the heat treatment plate by changing at least one of the heat treatment plate and the test temperature which is the target value of the processing temperature, the test schedule information regarding the schedule of the plurality of tests. In any one of the first preparation process in which the first order “first” is assigned to any test and the unassigned test in which the order is not yet assigned, And a second and subsequent creation processes for assigning the order after the “second”, and a test schedule creation method for creating test schedule information by repeating the second and subsequent creation processes until the order is assigned to all tests.

  [Operation / Effect] According to the test schedule preparation method according to the present invention, the first preparation process assigns "first" to any test. In the second and subsequent creation processes, the order after “second” is assigned to tests other than the test to which “first” is assigned. Since the first creation process and the second and subsequent creation processes are provided, the test schedule information can be created before the test is actually performed. If tests are performed according to the created test schedule information, a plurality of tests can be performed efficiently.

  In the present invention, the second and subsequent creation processes are timing estimation processes for estimating an unassigned test that can be started earliest after the assigned test ends, assuming that all assigned tests that have already been assigned an order are performed. It is preferable to include a second and subsequent allocation process in which the next order is allocated to the unallocated test estimated by the timing estimation process. Test schedule information with a relatively short total test time can be created. In particular, the timing estimation process estimates the unassigned test that can be started earliest after the assigned test ends, thereby minimizing the waiting time between tests.

  In the present invention, the timing estimation process preferably calculates the timing at which each unassigned test can be started in consideration of the performance of each heat treatment plate. The waiting time between tests caused by the performance of the heat treated plate can be minimized. Here, the performance of the heat treatment plate includes at least one of a change time required to change the plate temperature and a temperature change rate of the plate temperature.

  In the present invention, the second and subsequent creation processes further include an estimation result determination process for determining whether or not the estimation result of the timing estimation process includes a plurality of unallocated tests for different heat treatment plates. If the estimation result determination process determines that the heat treatment plate has the largest remaining load among the heat treatment plates subject to the unallocated test estimated by the timing estimation process, And when the auxiliary estimation process estimates the heat treatment plate, the second and subsequent allocation processes use the heat treatment plate estimated by the auxiliary estimation process regardless of the estimation result of the timing estimation process. The following order is assigned to the target unassigned test, and the remaining burden is a numerical value representing the burden that the unassigned test gives to each heat treatment plate. The number of remaining unassigned test for physical plate, changing time required to change the plate temperature, and is preferably a numerical value based on at least one of the temperature change rate of the plate temperature. If the timing estimation process estimates multiple unallocated tests for different heat-treated plates, the auxiliary estimation process selects unallocated tests for heat-treated plates with a larger remaining load among multiple unallocated tests. In the second and subsequent allocation processes, the next order is allocated to the selected unallocated test. For this reason, test schedule information with a shorter total test time can be created.

  In the present invention, in the second and subsequent creation processes, an unassigned test for a heat-treated plate that is different from the heat-treated plate that is the object of the assigned test that has been assigned the most recent order is designated as a different plate unassigned test. If the unassigned test determination process determines whether or not a plate unassigned test exists, and the unassigned test determination process determines that there is a plate unassigned test, the candidate for the test to be assigned the next order is designated as a different plate unassigned test. When the candidate limiting process limits candidates, it is preferable that the timing estimation process estimates a test that can be started earliest from the limited candidates. According to this, when a different plate unassigned test exists, an unassigned test other than the different plate unassigned test (referred to as “same plate unassigned test”) is excluded from the candidates. As a result, the next order is preferentially assigned to the different plate unassigned test over the same plate unassigned test. Therefore, test schedule information with a relatively short total test time can be created efficiently.

  The plate unassigned test is an unassigned test for the same heat treatment plate as the assigned test to which the order has been assigned most recently. The “assigned test assigned the most recent order” refers to the assigned test assigned the last order in the assigned tests.

  In the present invention, the second and subsequent preparation processes include a remaining load amount estimation process for estimating the heat treatment plate having the largest remaining load amount of the heat treatment plate, and an unallocated test for the heat treatment plate estimated by the remaining load amount estimation process. And the second and subsequent allocation processes for allocating the next order to the remaining number, and the remaining burden amount is a numerical value representing the burden given to each heat treatment plate by the unallocated test, and the remaining number of unallocated tests for the heat treatment plate, the plate temperature It is preferably a numerical value based on at least one of a change time required to change the temperature and a temperature change rate of the plate temperature. The test for the heat treatment plate having a relatively large remaining load is assigned the earlier order compared to the test for the heat treatment plate having a relatively small remaining load. This makes it easy to create a situation in which tests on other heat treatment plates can be performed while changing the plate temperature of some heat treatment plates. Therefore, test schedule information with a relatively short total test time can be created.

  In the present invention, when the estimation result determination process determines whether or not two or more heat treatment plates are included in the estimation result of the remaining burden amount estimation process, and the estimation result determination process determines that it is included A heat estimation plate that estimates the heat treatment plate having the largest auxiliary residual load amount among the two or more heat treatment plates estimated by the residual load estimation process, and the auxiliary estimation process estimated the heat treatment plate In this case, the second and subsequent allocation processes allocate the following order to the unallocated test for the heat-treated plate estimated by the auxiliary estimation process, regardless of the estimation result of the remaining burden estimation process. Is a numerical value that represents the burden of the unallocated test on the heat-treated plate, the remaining number of unallocated tests for the heat-treated plate, the change time required to change the plate temperature, A numerical value based on at least one of the temperature change rate of over preparative temperature, the basis of the auxiliary residual burden amount is preferably different from the basis for the remaining burden amount. When there are two or more heat treatment plates having the largest remaining burden amount, the next order is assigned to a test targeting heat treatment plates having a larger auxiliary remaining burden amount among the heat treatment plates. Therefore, test schedule information with a shorter total test time can be created.

  In the present invention, in the second and subsequent creation processes, an unassigned test for a heat-treated plate that is different from the heat-treated plate that is the object of the assigned test that has been assigned the most recent order is designated as a different plate unassigned test. If the unassigned test determination process determines whether or not a plate unassigned test exists, and the unassigned test determination process determines that there is a plate unassigned test, the candidate for the test to be assigned the next order is designated as a different plate unassigned test. If the candidate limitation process limits the candidates, the remaining burden amount estimation process has the largest remaining burden amount among the heat treatment plates that are subject to the different plate unassigned test. It is preferable to estimate the heat treated plate. According to this, the next order can be preferentially assigned to the different plate unassigned test over the same plate unassigned test. For this reason, test schedule information with a shorter total test time can be created.

  In the present invention, it is preferable that the remaining burden amount shows at least one of a tendency to increase as the remaining number increases, a tendency to increase as the change time increases, and a tendency to increase as the temperature change rate decreases. According to such a remaining load amount, the load on the heat treatment plate can be suitably determined based on the magnitude relationship of the remaining load amount.

  In the present invention, the first preparation process is “first” in a burden comparison process for identifying a heat treatment plate having the largest initial burden of the heat treatment plate and a test for the heat treatment plate identified by the burden comparison process. And the initial burden amount is a numerical value representing the burden given to each heat treatment plate by all tests, the number of tests for the heat treatment plate, the change time required to change the plate temperature, It is also preferable that the numerical value is based on at least one of the temperature change rates of the plate temperature. “First” is assigned to the test for the heat-treated plate having the largest initial burden. As a result, a situation in which a test for another heat treatment plate can be performed while changing the plate temperature of the heat treatment plate having the largest initial burden is likely to occur. Therefore, test schedule information with a relatively short total test time can be created.

  In the present invention, when the specific result determination process for determining whether or not two or more heat treatment plates are included in the processing result of the burden comparison process, and when the specific result determination process determines that it is included, When the auxiliary comparison process identifies a heat treatment plate, the auxiliary comparison process identifies the heat treatment plate having the largest auxiliary initial burden amount among the two or more heat treatment plates identified by the burden comparison process. In the first allocation process, regardless of the processing result of the burden comparison process, “first” is allocated to the unassigned test for the heat treatment plate specified by the auxiliary comparison process, and the auxiliary initial burden amount is This is a numerical value that represents the load that the test places on the heat-treated plate, including the number of tests on the heat-treated plate, the change time required to change the plate temperature, and the temperature of the plate temperature. A numerical value based on at least one of the change rate, the basis of the auxiliary load amount is preferably different from the basis for the initial load weight. When there are two or more heat treatment plates having the largest initial burden amount, “first” is assigned to a test for a heat treatment plate having a larger auxiliary initial burden amount. Therefore, test schedule information with a shorter total test time can be created.

  In the present invention, it is preferable that the initial burden amount exhibits at least one of a tendency to increase as the number of tests increases, a tendency to increase as the change time increases, and a tendency to increase as the temperature change rate decreases. According to such an initial burden amount, the burden on the heat treatment plate can be determined based on the magnitude relationship of the initial burden amount.

  Further, the present invention is a test method for performing a test for measuring a processing temperature using a heat treatment plate by changing at least one of the heat treatment plate and a test temperature which is a target value of the processing temperature, and a test related to a plurality of test schedules. A test schedule creation process that creates schedule information, and a test continuous execution process that actually performs a series of tests specified in the test schedule information created by the test schedule creation process. The second and subsequent creation processes in which the second and subsequent orders are assigned to either the first creation process in which the first order “first” is assigned to the test or the unassigned test in which the order is not yet assigned. And the second and subsequent creation processes are repeated until the order is assigned to all tests, thereby creating test schedule information.

  [Operation / Effect] Since the test method according to the present invention includes the test schedule creation process, the test schedule information can be created before the test is actually performed. Moreover, since the test continuous execution process is provided, a plurality of tests can be automatically executed according to the test schedule information. Thereby, a plurality of tests can be performed efficiently.

  Further, the present invention is a test schedule creation device, a storage unit for storing test list information in which a plurality of tests for measuring a processing temperature by a heat treatment plate are stored, and test list information before the test is actually performed. And an order setting unit for creating test schedule information related to a plurality of test schedules defined in the above.

  [Operation / Effect] The test schedule creation device according to the present invention includes the storage unit and the order setting unit, so that the test schedule information can be suitably created. According to this test schedule information, a plurality of tests can be performed efficiently.

  In this invention, it is preferable that a memory | storage part memorize | stores the plate performance information in which the information regarding the performance of a heat processing plate is prescribed | regulated, and an order setting part produces test schedule information with reference to plate performance information. By considering the performance of each heat treatment plate, it is possible to create test schedule information with a relatively short total test time.

  In addition, the present invention is a substrate processing apparatus including the above-described test schedule creation apparatus, a plurality of heat treatment plates, and a test execution unit that controls the heat treatment plates and performs a plurality of tests according to the test schedule information.

  [Operation / Effect] Since the substrate processing apparatus according to the present invention includes the test schedule creation device, the test schedule information can be suitably created. Moreover, since the test execution unit is provided, a plurality of tests can be automatically executed according to the test schedule information. Thereby, a plurality of tests can be performed efficiently.

  In the present invention, a transport unit that transports the temperature measurement substrate to a plurality of heat treatment plates, and the test execution unit controls the transport unit to transport the temperature measurement substrate to each heat treatment plate according to the test schedule information. It is preferable. Since the transfer unit is provided, the temperature measurement substrate can be smoothly transferred to the plurality of heat treatment plates.

  In the present invention, the transfer unit carries out the temperature measurement substrate from the storage space for storing the temperature measurement substrate, and loads the temperature measurement substrate into the storage space, and the test execution unit controls the transfer unit. Then, it is preferable that the temperature measurement substrate is unloaded from the storage space before the test is performed, and the temperature measurement substrate is loaded into the storage space when all the tests defined in the test schedule information are completed. As the test is performed, the temperature measurement substrate can be automatically taken out and stored.

  According to the test schedule creation method, the test method, the test schedule creation apparatus, and the substrate processing apparatus according to the present invention, the test schedule information is created before the test is performed, so that a plurality of tests can be performed efficiently.

It is a top view which shows schematic structure of the substrate processing apparatus which concerns on an Example. It is a schematic side view of the substrate processing apparatus which shows arrangement | positioning of a liquid processing unit when the inside of a substrate processing apparatus is seen from the side. It is a schematic side view of the substrate processing apparatus which shows arrangement | positioning of the heat processing unit. It is a schematic side view which shows arrangement | positioning of the conveyance mechanism when the inside of a substrate processing apparatus is seen from the side. It is a perspective view of the conveyance mechanism in a process part. It is a front view of an interface part. FIG. 7A is a plan view of the heating / cooling processing unit, and FIGS. 7B and 7C are side views of the heating / cooling unit, respectively. It is a top view of the substrate for temperature measurement mounted in the heat processing plate. FIG. 9A is a side view of the edge exposure unit, and FIG. 9B is a plan view of the edge exposure unit. It is a control block diagram of the substrate processing apparatus which concerns on an Example. It is a flowchart which shows the schematic procedure of the test of a heat processing plate. It is a flowchart which shows the detailed procedure of a test schedule preparation process. It is a schematic diagram which shows an example of test list information. It is a schematic diagram which shows an example of plate performance information. FIG. 15A shows the test list information in case 1, and FIG. 15B shows the plate performance information in case 1. FIG. 4 is a schematic diagram illustrating test schedule information in case 1. FIG. 17A is a process chart based on test schedule information created by the present embodiment, and FIG. 17B is a process chart of a comparative example. FIG. 18A shows the test list information in case 2, and FIG. 18B shows the plate performance information in case 2. 6 is a schematic diagram illustrating test schedule information in case 2. FIG. FIG. 20A is a process chart based on the test schedule information created by the present embodiment, and FIG. 20B is a process chart of a comparative example. It is a flowchart which shows the detailed procedure of the test schedule preparation process concerning a modification. It is a flowchart which shows the detailed procedure of a test continuous implementation process. It is a figure which shows typically an example of the conveyance path | route of the board | substrate for temperature measurement. It is a schematic diagram which shows an example of target direction information. 25A, 25B, and 25C are diagrams schematically showing the relationship between the direction of the temperature measurement substrate in the edge exposure unit and the direction of the temperature measurement substrate in the heat treatment plate. It is a schematic diagram which shows an example of delivery position information. 27 (a), 27 (b), and 27 (c) are diagrams schematically illustrating the relationship of the orientation of the temperature measurement substrate in the comparative example. It is a flowchart which shows the detailed procedure of a test. FIG. 29A is a graph showing the change over time of the plate temperature of the heat treatment plate, and FIG. 29B is a graph showing the change over time of the processing temperature (total average value) of the temperature measurement substrate. It is a schematic diagram which illustrates test recipe information. It is a flowchart which shows the detailed procedure of an analysis. FIG. 32A is a diagram schematically showing foreign matter adhering to the heat treatment plate, and FIG. 32B is a diagram schematically showing foreign matter adhering to the back surface of the temperature measurement substrate. It is a schematic diagram which shows an example of airflow formation installation information. FIG. 34A is a plan view of the temperature measurement substrate placed on the heat treatment plate, and FIG. 34B shows the temperature distribution. FIG. 35A is a plan view of a temperature measurement substrate placed on the heat treatment plate, and FIG. 35B is a temperature distribution. It is a figure which shows schematic structure of the substrate processing system which concerns on a modified example.

  Embodiments according to the present invention will be described below with reference to the drawings. First, after describing the basic configuration and operation of the substrate processing apparatus according to the embodiment, the configuration and operation related to the heat treatment plate test will be described.

  In the following description, “substrate” refers to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, and a magneto-optical substrate. A disk substrate or the like (hereinafter simply referred to as a substrate).

[1. Basic configuration of substrate processing apparatus]
FIG. 1 is a plan view illustrating a schematic configuration of a substrate processing apparatus according to an embodiment. FIG. 2 is a schematic side view of the substrate processing apparatus showing the arrangement of the liquid processing units when the inside of the substrate processing apparatus is viewed from the side (y direction). FIG. 3 is a schematic side view of the substrate processing apparatus showing the arrangement of the heat treatment units. FIG. 4 is a schematic side view showing the arrangement of the transport mechanism when the inside of the substrate processing apparatus is viewed from the side (y direction).

  The substrate processing apparatus 1 processes the substrate W. In the present embodiment, the substrate processing apparatus 1 performs a process of forming a resist film on the substrate W and developing the substrate W.

  The substrate processing apparatus 1 includes an indexer unit (hereinafter referred to as “ID unit”) 11, a processing unit 13, and an interface unit (hereinafter referred to as “IF unit”) 17. The processing unit 13 is in contact with the ID unit 11 and the IF unit 17. The IF unit 17 is further in contact with an exposure machine EXP that is separate from the substrate processing apparatus 1. The ID unit 11, the processing unit 13, the IF unit 17, and the exposure device EXP are arranged so as to be aligned in one horizontal direction (in the figure, “x” direction). The horizontal direction orthogonal to the x direction is the “y” direction, and the vertical direction is the “z” direction. Hereinafter, description will be made by dividing into the ID unit 11, the processing unit 13 and the IF unit 17.

[1-1 ID section 11]
The ID unit 11 includes a carrier placement unit 21 and a conveyance space 22.

  The carrier C is placed on the carrier placement unit 21. The carrier C is conveyed by an external conveyance mechanism (not shown), for example. The carrier C accommodates a plurality of substrates W. As the carrier C, FOUP (front opening unified pod) is exemplified. The carrier C corresponds to a container in the present invention.

  In the transport space 22, an ID internal transport mechanism (hereinafter abbreviated as “transport mechanism”) TA is installed. The transport mechanism TA unloads the substrate W from the carrier C and loads the substrate W into the carrier C. The transport mechanism TA passes the substrate W to the processing unit 13 and receives the substrate W from the processing unit 13.

  The transport mechanism TA is a so-called transport robot. Specifically, the transport mechanism TA includes one or more hands H that hold the substrate W and various drive mechanisms (not shown) for moving the hands H. By various drive mechanisms, the hand H can be translated in the y direction, can be moved up and down in the z direction, can be rotated around the longitudinal axis of the transport mechanism TA, and can be advanced in the radial direction of the longitudinal axis. It is possible to move backward. These movements change the position of the hand H (transport mechanism TA).

[1-2 Processing Unit 13]
The processing unit 13 is configured to be separable into a first block 14 and a second block 15. The first block 14 and the second block 15 are arranged in the x direction. The ID block 11 is in contact with the first block 14, and the IF block 17 is in contact with the second block 15. Hereinafter, the first block 14 and the second block 15 will be described separately.

[1-2-1 Processing Unit 13 to First Block 14]
The first block 14 includes a conveyance space 30, a liquid processing unit 40, and a heat treatment unit 50. The conveyance space 30 is a band-like region that extends in the x direction through the approximate center in the y direction (width direction) of the first block 14 in plan view. Both ends of the conveyance space 30 face the ID unit 11 and the second block 15, respectively. A liquid processing unit 40 is disposed on one side of the conveyance space 30 in the y direction, and a heat treatment unit 50 is disposed on the other side of the conveyance space 30 in the y direction.

  As illustrated in FIG. 4, the transport space 30 includes an upper transport space 31 that is an upper portion of the transport space 30 and a lower transport space 32 that is a lower portion of the transport space 30. In the upper transfer space 31, an in-process transfer mechanism (hereinafter abbreviated as “transfer mechanism” as appropriate) TB1c is installed. In the lower transfer space 32, an in-process transfer mechanism (hereinafter abbreviated as “transfer mechanism”) TB2c is installed. The movable range of the transport mechanism TB1c is limited to the upper transport space 31, and the movable range of the transport mechanism TB2c is limited to the lower portion of the lower transport space 32.

  Between the ID part 11 and the upper conveyance space 31, placement parts P1S and P1R are installed. Between the ID unit 11 and the lower conveyance space 32, placement units P2S and P2R are installed. The placement parts P1S, P1R, P2S, and P2R are arranged in the vertical direction (z direction).

  The placement units P1S and P1R are used to send the substrate W bidirectionally between the transport mechanism TA and the transport mechanism TB1c. The placement units P2S and P2R are used to send the substrate W bidirectionally between the transport mechanism TA and the transport mechanism TB2c. For example, when the substrate W is sent from the transport mechanism TA to the transport mechanism TB1c, the transport mechanism TA places the substrate W on the placement unit P1S, and the transport mechanism TB1c receives the substrate W placed on the placement unit P1S. . Conversely, when the substrate W is sent from the transport mechanism TB1c to the transport mechanism TA, the transport mechanism TB1c places the substrate W on the placement part P1R, and the transport mechanism TA places the substrate W placed on the placement part P1R. receive.

  Please refer to FIG. The liquid processing unit 40 is provided with four coating processing chambers 41, 42, 43, and 44. These coating processing chambers 41 to 44 are arranged in the vertical direction (z direction). The atmosphere in each of the coating processing chambers 41 to 44 is blocked from each other by a partition wall or the like. Each of the upper coating processing chambers 41 and 42 faces the upper transfer space 31. The transport mechanism TB1c carries the substrate W in and out of the coating processing chambers 41 and 42. Each of the lower coating processing chambers 43 and 44 faces the lower transfer space 32. The transport mechanism TB2c carries the substrate W into and out of the coating processing chambers 43 and 44.

  In each of the coating processing chambers 41 to 44, a plurality of coating processing units 60 are installed in a line along the transfer space 30. Each coating processing unit 60 includes a holding unit 61, a cup 62, a nozzle 63, and a nozzle transport mechanism 64. The nozzle 63 and the nozzle transport mechanism 64 are shown in FIG. The transport mechanisms TB1c / TB2c place the substrate W on the holding unit 61. The holding unit 61 holds the placed substrate W in a horizontal posture. The holding part 61 is connected to a motor (not shown) and is rotatable. The cup 62 is disposed around the holding unit 61 and collects the processing liquid scattered from the substrate W. The plurality of nozzles 63 are installed at standby positions on the side of the cup 62 in plan view. Each nozzle 63 is connected in communication with a processing liquid supply source and can discharge the processing liquid. The nozzle transport mechanism 64 holds one of the nozzles 63 and transports it between the standby position and the processing position above the substrate W.

  Each coating processing unit 60 in the coating processing chambers 41 and 43 is a resist coating processing unit RE. The resist coating processing unit RE performs a process of applying a resist film processing liquid to the substrate W from the nozzle 63 and forming a resist film on the substrate W. Each coating processing unit 60 in the coating processing chambers 42 and 44 is an antireflection film material coating processing unit BA. The coating processing unit BA performs a process of applying an antireflection film processing liquid to the substrate W from the nozzle 63 and forming an antireflection film on the substrate W.

  Please refer to FIG. The heat treatment unit 50 is provided with a plurality of heat treatment units HU. Each heat treatment unit HU is arranged in a matrix (for example, three rows in the x direction and ten steps in the z direction) in a side view. Here, the plurality of heat treatment units HU arranged in the upper five stages is referred to as a heat treatment unit group 51, and the plurality of heat treatment units HU arranged in the lower five stages is referred to as a heat treatment unit group 52. The upper heat treatment unit group 51 faces the upper transfer space 31. The transport mechanism TB1c carries the substrate W into and out of the heat treatment unit group 51. The lower heat treatment unit group 52 faces the lower transfer space 32. The transport mechanism TB2c carries the substrate W into and out of the heat treatment unit group 52.

  Each heat treatment unit HU is classified into a plurality of categories (types). Some heat treatment units HU are heating / cooling units PHP, and other heat treatment units HU are cooling units CP. The heating / cooling unit PHP performs the heating process and the cooling process continuously. The cooling unit CP performs a cooling process. Between the heat treatment unit groups 51 and 52, the number and arrangement of the heating / cooling unit PHP and the cooling unit CP are substantially the same.

In this specification, when distinguishing the thermal processing unit HU, using the code shown in FIG. 3, referred to as "thermal processing unit HU _01" or the like.

  The transport mechanism TB1c will be specifically described. Please refer to FIG. FIG. 5 is a perspective view of the transport mechanism TB1c. The transport mechanism TB2c is configured similarly to the transport mechanism TB1c.

  The transport mechanism TB1c includes a pair of first guide rails 81, a second guide rail 82, a base portion 83, a turntable 84, and two hands H.

  The first guide rails 81 are respectively fixed to two corners on the liquid processing unit 40 side among the four corners of the upper conveyance space 31 (see FIG. 1). Each of the first guide rails 81 is installed so as to extend in the vertical direction (z direction). Both end portions of the second guide rail 82 are slidably connected to each first guide rail 81. The first guide rail 81 guides the second guide rail 82 in the z direction.

  The second guide rail 82 is installed so as to extend in the x direction. A base portion 83 is slidably connected to the second guide rail 82. The second guide rail 82 guides the base portion 83 in the x direction.

  A turntable 84 is connected to the base portion 83. The turntable 84 can rotate around the vertical axis Q with respect to the base portion 83.

  The two hands H are connected to the turntable 84. Each hand H can move forward and backward in one horizontal direction with respect to the turntable 84.

  The transport mechanism TB1c further includes various drive mechanisms for moving the second guide rail 82, the base portion 83, the turntable 84, and the hand H, respectively. The position of the transport mechanism TB1c is changed by these various drive mechanisms. That is, the second guide rail 82 moves up and down in the z direction, the base portion 83 moves in the x direction, and the turntable 84 rotates about the vertical axis Q. With these movements, the hand H and the substrate W held by the hand H move in parallel in the z direction and the x direction, and turn around the vertical axis Q. Further, as each hand H moves forward and backward with respect to the turntable 84, the substrate W held by the hand H moves in parallel in the radial direction of the vertical axis Q.

  Other equipment of the conveyance space 30 will be described. In the transfer space 30, air supply units 85 and 86 and exhaust units 87 and 88 are arranged. The air supply unit 85 supplies clean gas to the upper conveyance space 31. The exhaust unit 87 exhausts gas from the upper conveyance space 31. The air supply unit 86 supplies clean gas to the lower transfer space 32. The exhaust unit 88 discharges gas from the lower conveyance space 32.

  In FIG. 5, the several exhaust port eo which the exhaust unit 87 has is shown in figure. The exhaust port eo is formed on the upper surface of the exhaust unit 87. The gas above the exhaust unit 87 is sucked into the exhaust unit 87 through the exhaust port eo.

  Further, the exhaust unit 87 and the air supply unit 86 block the atmosphere of the upper transfer space 31 and the atmosphere of the lower transfer space 32.

[1-2-2 Processing Unit 13 to Second Block 15]
The configuration of the second block 15 will be described. In addition, about the same structure as the 1st block 14, detailed description is abbreviate | omitted by attaching | subjecting a same sign.

  Please refer to FIG. The second block 15 includes a conveyance space 35, a liquid processing unit 45, and a heat treatment unit 55. These layouts are basically the same as those of the first block 14.

  Please refer to FIG. The transfer space 35 has an upper transfer space 36 and a lower transfer space 37. In the upper transfer space 36, an in-process transfer mechanism (hereinafter abbreviated as “transfer mechanism”) TB1d is installed. In the lower transfer space 37, an in-process transfer mechanism (hereinafter abbreviated as “transport mechanism”) TB2d is installed. The transport mechanisms TB1d and TB2d are configured similarly to the transport mechanisms TB1c and TB2c.

  One end of the upper conveyance space 36 faces the upper conveyance space 31. Between the upper conveyance spaces 31 and 36, placement units P3S and P3R are installed. The transport mechanism TB1d passes the substrate W to the transport mechanism TB1c via the placement unit P3R. Further, the transport mechanism TB1d receives the substrate W from the transport mechanism TB1c via the placement unit P3S.

  Similarly, one end of the lower transfer space 37 faces the lower transfer space 32. Between the lower conveyance spaces 32 and 37, placement units P4S and P4R are installed. The transport mechanism TB2d passes the substrate W to the transport mechanism TB2c via the placement unit P4S / P4R, and receives the substrate W from the transport mechanism TB2c.

  Please refer to FIG. The liquid processing unit 45 includes four development processing chambers 46, 47, 48, and 49. These development processing chambers 46 to 49 are arranged in the vertical direction (z direction). The development processing chambers 46 and 47 are disposed on the upper side, and the development processing chambers 48 and 49 are disposed on the lower side. The development processing chambers 46 and 47 face the upper transfer space 36, respectively. The transport mechanism TB1d carries the substrate W into and out of the development processing chambers 46 and 47. The development processing chambers 48 and 49 each face the lower transfer space 37. The transport mechanism TB2d carries the substrate W into and out of the development processing chambers 48 and 49.

  In each of the development processing chambers 46 to 49, a plurality of development processing units 65 are installed in a line along the transport space 35. Each development processing unit 65 includes a holding unit 66, a cup 67, a nozzle 68, and a nozzle transport mechanism 69. The transport mechanisms TB1d / TB2d place the substrate W on the holding unit 66. The holding unit 66 holds the placed substrate W in a horizontal posture. The holding part 66 is connected to a motor (not shown) and is rotatable. The cup 67 is disposed around the holding unit 66 and collects the developer scattered from the substrate W. The nozzle 68 discharges the developer onto the substrate W. The nozzle 68 is connected to a nozzle moving mechanism 69 and can move in the x direction. The nozzle moving mechanism 69 moves the nozzle 68 between a position above the substrate W and a position deviated from above the substrate W.

  Please refer to FIG. In the heat treatment unit 55, a plurality of heat treatment units HU, an edge exposure unit EEW, and placement units P5S, P5R, P6S, and P6R are installed. These heat treatment units and the like are arranged in a matrix. Here, the heat treatment unit or the like disposed on the upper side is referred to as a heat treatment unit group 56. A heat treatment unit or the like disposed on the lower side is referred to as a heat treatment unit group 57.

  The heat treatment units HU included in the heat treatment unit group 56 are a heating / cooling unit PHP, a cooling unit CP, and a post-exposure heat treatment unit PEB. The transport mechanism TB1d transports the substrate W to the heating / cooling unit PHP and the cooling unit CP of the heat treatment unit group 56. The IF unit 17 carries the substrate W in and out of the post-exposure heat processing unit PEB.

  The heat treatment units HU included in the heat treatment unit group 57 are a heating / cooling unit PHP, a cooling unit CP, and a post-exposure heat treatment unit PEB. The transport mechanism TB2d transports the substrate W to the heating / cooling unit PHP and the cooling unit CP of the heat treatment unit group 57. The IF unit 17 carries the substrate W in and out of the post-exposure heat processing unit PEB.

  The post-exposure heat treatment unit PEB is arranged only in the row closest to the IF unit 17 among the rows of the heat treatment unit groups 56 and 57. The post-exposure heat treatment unit PEB has the same structure as the heating / cooling unit PHP. The post-exposure heat processing unit PEB performs post-exposure heat treatment (Post Exposure Bake) on the substrate W after the exposure processing.

The edge exposure unit EEW exposes the peripheral edge of the substrate W. For edge exposing unit _{EEW 01} of the thermal processing unit group 56, the transport mechanism TB1d transports the substrate W. For edge exposing unit _{EEW 02} of the thermal processing unit group 57, the transport mechanism TB2d transports the substrate W.

  The placement portions P5S, P5R, P6S, and P6R are stacked above the post-exposure heat treatment unit PEB, respectively. The placement units P5S / P5R are used when the substrate W is transported between the transport mechanism TB1d and the IF unit 17. The placement units P6S / P6R are used when the substrate W is transported between the transport mechanism TB2d and the IF unit 17.

  According to the structure of the processing unit 13 described above, it can be considered that the processing unit 13 includes a plurality of layers K1 and K2 for processing the substrate W. Here, the upper layer K1, which is the upper layer, includes upper transport spaces 31, 36, coating processing chambers 41, 42, development processing chambers 46, 47, heat treatment unit groups 51, 56, and the like. The lower layer K2, which is the lower layer, includes lower transfer spaces 32 and 37, coating processing chambers 43 and 44, development processing chambers 48 and 49, heat treatment unit groups 52 and 57, and the like.

[1-3 IF unit 17]
Please refer to FIG. The IF unit 17 includes an intra-IF unit transport mechanism (hereinafter abbreviated as “transport mechanism”) TC for transporting the substrate W. In the present embodiment, the transport mechanism TC includes two transport mechanisms TCa and TCb. The transport mechanism TCa can move up and down in the z direction, can rotate around the longitudinal axis of the transport mechanism TCa, and can move forward and backward in the radial direction of the longitudinal axis. The transport mechanism TCb is configured similarly to the transport mechanism TCa.

  The transport mechanism TCa receives the substrate W from the transport mechanism TB1d through the placement unit P5S, and passes the substrate W to the transport mechanism TB1d through the placement unit P5R. The transport mechanism TCa receives the substrate W from the transport mechanism TB2d through the placement unit P6S, and passes the substrate W to the transport mechanism TB2d through the placement unit P6R. Each transport mechanism TCa carries the substrate W in and out of the post-exposure heat treatment unit PEB provided in both the heat treatment unit groups 56/57. The transport mechanism TCa further transfers the substrate W to the transport mechanism TCb and receives the substrate W from the transport mechanism TCb. The transport mechanism TCb further transports the substrate W to the exposure machine EXP and receives the substrate W from the exposure machine EXP.

  Please refer to FIG. FIG. 6 is a front view of the inside of the IF unit 17 as viewed from the x direction. Between the transport mechanism TCa and the transport mechanism TCb, a placement unit PASS-CP, a placement unit P7R, and a buffer unit BF are provided. These placement parts PASS-CP and the like are stacked so as to be lined up and down. The placement unit PASS-CP places the substrate W and cools the substrate W. The placement unit PASS-CP is used when the transport mechanism TCa transfers the substrate W to the transport mechanism TCb. The placement portion P7R is used when the transport mechanism TCb passes the substrate W to the transport mechanism TCa. The buffer unit BF can mount a plurality of substrates W.

[1-4 Configuration of control system]
Please refer to FIG. The substrate processing apparatus 1 includes a control unit 91, a storage unit 93, and an input / output unit 95.

  The control unit 91 is installed in the ID unit 11, for example. The control unit 91 comprehensively controls the ID unit 11, the processing unit 13, and the IF unit 17. Specifically, operations of various transport mechanisms and various processing units are controlled.

  The storage unit 93 is also installed in the ID unit 11, for example. The storage unit 93 stores various information such as a processing recipe (processing program).

  The input / output unit 95 is attached to the outer wall surface of the ID unit 11. A user can input various commands and information into the input / output unit 95. The input / output unit 95 displays various information to the user. The input / output unit 95 is, for example, a touch panel display. The input / output unit 95 corresponds to the output unit in the present invention.

[2. Operation of substrate processing apparatus 1]
Next, the operation of the substrate processing apparatus 1 according to the embodiment will be described. In the following description, the conveyance from the ID unit 11 to the IF unit 17 and the conveyance from the IF unit 17 to the ID unit 11 will be described separately.

[2-1 Transport from ID unit 11 to IF unit 17]
The transport mechanism TA unloads the substrate W from the carrier C, and alternately transports the unloaded substrate W to the transport mechanisms TB1c and TB2c. That is, the ID unit 11 passes the substrate W alternately to the upper layer K1 and the lower layer K2.

  The upper layer K1 operates as follows. The transport mechanism TB1c receives the substrate W from the transport mechanism TA and transports the substrate W to the various processing units installed in the coating processing chambers 41 and 42 and the heat treatment unit group 51 in a predetermined order. For example, the heating / cooling unit PHP, the cooling unit CP, the coating processing unit BA (60) for the antireflection film, the heating / cooling unit PHP, the cooling unit CP, the coating processing unit RE (60) for the resist film, and the heating / cooling unit PHP. The substrates W are transferred in order. As a result, various processes are continuously performed on the substrate W, and an antireflection film and a resist film are formed on the substrate W. The transport mechanism TB1c passes the substrate W that has undergone a series of processes to the transport mechanism TB1d.

Conveying mechanism TB1d receives the substrate W from the conveying mechanism TB1c, conveys the edge exposing unit _{EEW 01} installed in the thermal processing unit group 56. Thereby, the peripheral portion of the substrate W is exposed. The transport mechanism TB1d transfers the processed substrate W to the transport mechanism TCa. That is, the upper layer K1 passes the substrate W to the IF unit 17.

The lower layer K2 operates in the same manner as the upper layer K1. The transport mechanism TB2c receives the substrate W from the transport mechanism TA and transports the substrate W to the various processing units in the coating processing chambers 43 and 44 and the heat treatment unit group 52 in a predetermined order. Thereafter, the substrate W is transferred to the transport mechanism TB2d. Conveying mechanism TB2d receives the substrate W from the conveying mechanism TB2c, conveys the edge exposing unit _{EEW 02} installed in the thermal processing unit group 57. Thereafter, the transport mechanism TB2d transfers the substrate W to the transport mechanism TCa. That is, the lower layer K <b> 2 passes the substrate W to the IF unit 17.

  The transport mechanism TCa alternately receives the substrates W from the transport mechanisms TB1d and TB2d and passes them to the transport mechanism TCb. The transport mechanism TCb receives the substrate W from the transport mechanism TCa and sends it to the exposure apparatus EXP. The exposure machine EXP performs an exposure process on the substrate W.

[2-2 Transport from ID unit 11 to IF unit 17]
The transport mechanism TCb receives the substrate W from the exposure machine EXP and passes it to the transport mechanism TCa.

  The transport mechanism TCa receives the substrate W from the transport mechanism TCb and transports it to the post-exposure heat treatment unit PEB. Thereby, the post-exposure heat treatment is performed on the substrate W. Thereafter, the transport mechanism TCa passes the substrate W on which the post-exposure heat treatment has been performed to the transport mechanisms TB1d and TB2d. That is, the IF unit 17 passes the substrate W to the upper layer K1 and the lower layer K2.

  Here, the substrate W discharged from the transport mechanism TB1d to the IF unit 17 may be processed by the post-exposure heat treatment unit PEB installed in the heat treatment unit group 56 and transferred to the transport mechanism TB1d. Further, the substrate W delivered to the IF unit 17 from the transport mechanism TB2d may be processed by the post-exposure heat processing unit PEB installed in the heat treatment unit group 57 and transferred to the transport mechanism TB2d.

  The upper layer K1 operates as follows. That is, the transport mechanism TB1d receives the substrate W from the transport mechanism TCa and transports the substrate W to the various processing units in the development processing chambers 46 and 47 and the heat treatment unit group 56 in a predetermined order. For example, the substrate W is transported in the order of the cooling unit CP, the development processing unit 65, and the heating / cooling unit PHP. Thereby, the substrate W is developed. Thereafter, the transport mechanism TB1d transfers the developed substrate W to the transport mechanism TB1c. The transport mechanism TB1c receives the substrate W from the transport mechanism TB1d and passes it to the transport mechanism TA. That is, the upper layer K1 passes the substrate W to the ID unit 11.

  The lower layer K2 operates in the same manner as the upper layer K1. The transport mechanism TB2d receives the substrate W from the transport mechanism TCa and transports the substrate W to the various processing units in the development processing chambers 48 and 49 and the heat treatment unit group 57 in a predetermined order. Then, the transport mechanism TB2d passes the developed substrate W to the transport mechanism TB2c. The transport mechanism TB2c receives the substrate W from the transport mechanism TB2d and passes it to the transport mechanism TA. That is, the lower layer K <b> 2 passes the substrate W to the ID unit 11.

  The transport mechanism TA receives the substrate W from the transport mechanisms TB1c and TB2c and loads it into the carrier C.

  Thus, the substrate W is reciprocated between the ID unit 11 and the IF unit 17. In the processing unit 13, a resist film is formed on the substrate W while the substrate W is reciprocated and the substrate W is developed.

  In particular, in the processing unit 13, the upper layer K <b> 1 and the lower layer K <b> 2 transport the substrate W independently of each other and process the substrate W. Thereby, the processing capability in the processing unit 13 can be approximately doubled.

[3. Configuration for testing heat treatment plate PL]
Next, a characteristic configuration of the present embodiment will be described.

[3-1 Configuration of heat treatment unit HU]
Even if the heat treatment units HU are in the same category, the configuration is not necessarily the same. Hereinafter, a configuration example of the heating / cooling unit PHP will be described, and then variations of the heating / cooling unit PHP will be described.

  Please refer to FIGS. 7A to 7C. FIG. 7A is a plan view of the heating / cooling unit PHP, and FIGS. 7B and 7C are side views of the inside of the heating / cooling unit PHP as viewed from the y direction. FIG. 7B shows a time when the local transport mechanism is located above the heat treatment plate. FIG. 7C shows the case where the heat treatment plate is performing heat treatment. 7B and 7C, the heat treatment plate is shown in a sectional view.

  The heating / cooling unit PHP includes a placement part PA, a local transport mechanism TL, and a heat treatment plate PL.

  The placement part PA and the heat treatment plate PL are arranged in the y direction. The placement portion PA is installed so as to face the transfer space 30/35, and is positioned between the heat treatment plate PL and the transfer space 30/35.

  The placement portion PA includes support pins 103 that support the substrate W. The support pin 103 can move up and down. As the support pin 103 moves up and down, the support pin 103 receives the substrate W from the transport mechanism TB1c / TB2c / TB1d / TB2d (hereinafter collectively referred to as “transport mechanism TB”) or receives the substrate W from the transport mechanism TB. give. Further, when the support pins 103 move up and down, the support pins 103 pass the substrate W to the local transport mechanism TL or receive the substrate W from the local transport mechanism TL.

  The local transport mechanism TL transports the substrate W between the placement unit PA and the heat treatment plate PL. The local transport mechanism TL includes a hand H and a drive unit 104. The hand H places the substrate W thereon. The drive unit 104 translates the hand H in the y direction.

  The hand H has a flow path (not shown) formed therein. By flowing cooling water through the flow path, the local transport mechanism TL cools the substrate W placed on the hand H.

  The heat treatment plate PL has an upper surface F on which the substrate W is placed. The upper surface F is substantially flat. The upper surface F has a circular shape slightly larger than the substrate W in plan view.

  The heating / cooling unit PHP further includes an elevating pin 105, a support member 107, a heater 109, a temperature sensor 111, a unit-side antenna AU, and an upper lid 115.

  The elevating pins 105 are inserted into the through holes formed in the heat treatment plate PL so as to be movable up and down. As the elevating pins 105 move up and down, the substrate W is taken from the local transport mechanism TL and placed on the heat treatment plate PL, or the substrate W is taken from the heat treatment plate PL and transferred to the local transport mechanism TL. In FIGS. 7B and 7C, the lifting pins 105 in the retracted position are indicated by solid lines. When the elevating pin 105 is located at the retracted position, the tip of the elevating pin 105 is lower than the upper surface F of the heat treatment plate PL. In FIG.7 (b), the raising / lowering pin 105 in a protrusion position is shown with the broken line. Moreover, in FIG.7 (b), the board | substrate W supported by the raising / lowering pin 105 in a protrusion position is shown with the broken line. When the lifting pin 105 is located at the protruding position, the tip of the lifting pin 105 is higher than the hand H of the local transport mechanism TL.

  Support member 107 directly contacts the back surface of substrate W placed on heat treatment plate PL, and forms a slight gap (space) between substrate W and upper surface F of heat treatment plate PL. Heat is transferred from the heat treatment plate PL to the substrate W through this gap. Support member 107 is fixed to upper surface F of heat treatment plate PL. The support member 107 has, for example, a spherical shape.

  The heater 109 is installed inside or below the heat treatment plate PL and heats the heat treatment plate PL. The heat treatment plate PL transfers the heat of the heater 109 to the substrate W.

  The temperature sensor 111 measures the temperature of the heat treatment plate PL (hereinafter referred to as “plate temperature”). The temperature sensor 111 is embedded near the upper surface F of the heating plate PL.

  The unit side antenna AU is fixed to the heat treatment plate PL via the arm 113. The unit side antenna AU is disposed above and on the side of the heat treatment plate PL. When the substrate W is placed on the heat treatment plate PL, the side of the peripheral portion of the substrate W is close to the unit-side antenna AU.

  Please refer to FIG. FIG. 8 is a plan view of the temperature measurement substrate WT placed on the heat treatment plate PL. As illustrated, the unit-side antenna AU includes a plurality of unit-side coils UC. Each unit side coil UC is arranged in a predetermined direction at a predetermined position.

  Reference is again made to FIGS. 7 (a) to 7 (c). The upper lid 115 is installed above the heat treatment plate PL so as to be movable up and down. Upper lid 115 covers the upper part of heat treatment plate PL. The upper lid 115 has a conical shape (an umbrella shape) that extends downward.

  The heating / cooling unit PHP includes a chamber 117 for accommodating the above-described components. Further, the heating / cooling unit PHP includes an upper exhaust pipe 121, a pressure gauge 122, a side air supply duct 123, a side exhaust duct 125, and an exhaust damper 126.

  The upper exhaust pipe 121 forcibly exhausts the gas in the chamber 117 out of the chamber 117. One end of the upper exhaust pipe 121 is connected in communication with the upper center of the upper lid 115. As the upper exhaust pipe 121 discharges the gas, an air flow is formed above the heat treatment plate PL while moving upward from the peripheral portion of the heat treatment plate PL to the center portion. In FIG.7 (c), this airflow is shown with a dashed-dotted line. Even if sublimates are generated from the substrate W by the upper lid 115 and the upper exhaust pipe 121, the sublimates are accurately collected and discarded outside the chamber 117.

  The pressure gauge 122 is installed in the middle of the upper exhaust pipe 121. The pressure gauge 122 monitors the flow rate in the upper exhaust pipe 121.

  The side air supply duct 123 supplies gas into the chamber 117. The side air supply duct 123 has a supply port 123a. The supply port 123a is disposed on one side of the chamber 117 and blows gas in the lateral direction.

  The side exhaust duct 125 exhausts the gas in the chamber 117 to the outside of the chamber 117. The side exhaust duct 125 has an exhaust port 125a. The exhaust port 125a is disposed at a position facing the supply port 123a across the heat treatment plate PL in plan view. The exhaust port 125a sucks in gas from the lateral direction.

  The side air supply duct 123 and the side exhaust duct 125 form an airflow that flows in an approximately horizontal direction (x direction) above the heat treatment plate PL. In FIG. 7 (a), (c), this air flow is shown with a dashed-two dotted line. The inside of the chamber 117 is ventilated by the side air supply duct 123 and the side air exhaust duct 125, and the heat released from the heat treatment plate PL is also discharged outside the chamber 117.

  The exhaust damper 126 is installed in the middle of the side exhaust duct 125. The exhaust damper 126 adjusts the flow rate in the side exhaust duct 125.

  The above is one configuration example of the heating / cooling unit PHP. However, some heating / cooling units PHP are not provided with the upper lid 115 or the upper exhaust pipe 121. Some heating / cooling units PHP do not include the side air supply duct 123 and the side air exhaust duct 125. For this reason, even between the heating and cooling units PHP, the airflow formed above and around the heat treatment plate PL is not necessarily the same.

  Here, each of the upper exhaust pipe 121, the side air supply duct 123, and the side exhaust duct 125 is referred to as “air flow forming equipment”. The air flow forming facility forcibly forms an air flow. The pressure gauge 122 is referred to as “airflow monitoring equipment”. The airflow monitoring facility monitors the flow rate of the airflow forming facility. The exhaust damper 126 is referred to as “air flow control equipment”. The airflow adjustment facility adjusts the flow rate of the airflow monitoring facility.

  Moreover, the position of the unit side antenna AU is not necessarily the same between the heating and cooling units PHP. For example, the layout of the unit-side antenna AU may be intentionally changed between the heating and cooling units PHP. Further, even between the heating and cooling units PHP having a common layout, the position of the unit side antenna AU may be slightly shifted due to an attachment error or the like.

  The difference between the heat treatment units HU of the same category mentioned above exists not only for the heating / cooling unit PHP but also for other categories CP and PEB. Incidentally, the cooling unit CP does not include the mounting portion PA and the local transport mechanism TL described above. In addition, the cooling unit CP includes a temperature control device for cooling the heat treatment plate PL instead of the heater 109.

In the following, in order to distinguish between the placement part PA, the heat treatment plate PL, the local transport mechanism TL, or the unit side antenna AU installed in each heat treatment unit HU, a number for identifying each heat treatment unit HU (see FIG. 3). Use the same number as). For example, “heat treatment plate PL ₀₁ ” refers to the heat treatment plate PL installed in the heat treatment unit HU ₀₁ .

[3-2 Configuration of Temperature Measurement Substrate WT]
Please refer to FIG. The temperature measurement substrate WT simulates the substrate W used for normal production processing, and detects the processing temperature by the heat treatment plate PL. The temperature measurement substrate WT includes a substrate body BW, a plurality of sensor units SU, and a sensor-side antenna AS.

  The material of the substrate body BW is the same as the substrate W (for example, silicon), and has the same shape as the substrate W.

  The sensor unit SU detects the temperature of the substrate body BW. Each sensor unit SU is installed on the upper surface of the substrate body BW. Each sensor unit SU detects the temperature at each position of the substrate body BW.

  In the present embodiment, 16 sensor units SU are installed on the substrate body BW. One sensor unit SU is disposed at the center of the substrate body BW. The other eight sensor units SU have a radius that is about one half of the radius of the temperature measurement substrate WT, and have a constant interval in the circumferential direction on a circumference concentric with the central axis Pc of the substrate body BW. It is arranged in the space. The remaining seven sensor units SU are arranged on the peripheral portion of the temperature measurement substrate WT with a certain interval in the circumferential direction.

  The sensor-side antenna AS communicates with the unit-side antenna AU in a contactless manner (wirelessly). The sensor side antenna AS includes a block 131 and a plurality of sensor side coils SC.

  The block 131 is fixed to the peripheral edge of the upper surface of the substrate body BW. The material of the block 131 is, for example, quartz. In the present embodiment, the block 131 (sensor-side antenna AS) is installed not only on the entire periphery of the peripheral portion of the substrate body BW but only on a part thereof. Specifically, the length in the circumferential direction of the sensor-side antenna AS is equal to or less than a quarter of the entire circumference of the substrate body BW. Thus, the heat capacity of the sensor-side antenna AS is reduced by making the outer shape of the sensor-side antenna AS compact. As a result, the influence of the sensor-side antenna AS on the temperature of the substrate body BW can be reduced, and the reliability of the detection result of the temperature measurement substrate WT can be increased.

  Each sensor-side coil SC is installed inside the block 131. One sensor unit SU is electrically connected to each sensor-side coil SC. Each sensor-side coil SC transmits a detection signal obtained by one sensor unit SU. Each sensor-side coil SC is arranged in a predetermined direction at a predetermined position.

  When the temperature measurement substrate WT is placed on the heat treatment plate PL, if the direction of the temperature measurement substrate WT is a predetermined direction, the axis of each sensor side coil SC is the axis of one unit side coil UC. And exactly match. That is, each unit-side antenna AU faces one sensor-side antenna AS. In this specification, this predetermined direction is referred to as a “first target direction”. The direction of the temperature measurement substrate WT refers to the direction (angle) of the temperature measurement substrate WT around the central axis Pc of the temperature measurement substrate WT. There is one first target direction for 360 degrees, not a direction that exists every 90 degrees or every 180 degrees. Since the first target direction depends on the positional relationship between the heat treatment plate PL and the unit-side antenna AU, the first target direction has a unique value for each heat treatment plate PL.

  The temperature measurement substrate WT configured as described above has substantially the same outer shape as the substrate W in plan view. In other words, the temperature measurement substrate WT and the substrate W have substantially the same outline dimensions in plan view. The sensor-side antenna AS or the like is contained in the substrate body BW in a plan view and does not protrude from the substrate body BW. The temperature measurement substrate WT is a non-contact type, and no cable or device is connected to the temperature measurement substrate WT. Therefore, the temperature measurement substrate WT can be handled in the same manner as the substrate W when the temperature measurement substrate WT is transported or placed.

  In this embodiment, each sensor unit SU includes a crystal resonator and a container (both not shown). In the crystal resonator, the natural frequency of the crystal resonator changes depending on the temperature. The crystal resonator is cut at an appropriate cutting angle. The container hermetically seals the crystal unit. The material of the container is, for example, ceramic.

  When detecting the temperature, first, a current having a predetermined frequency is supplied to the unit side coil UC. An electromotive force is generated in the sensor side coil SC by electromagnetic induction. This electromotive force causes the crystal resonator to resonate. Thereafter, the current of the unit side coil UC is stopped. The quartz crystal vibrates damped. The sensor side coil SC transmits a detection signal including a frequency corresponding to the damped vibration. The unit side coil UC receives this detection signal.

  In this way, the sensor unit SU is constituted by a crystal resonator, and the unit-side antenna AU feeds power to the sensor unit SU wirelessly by electromagnetic induction. It is sufficient to supply power each time a detection signal is received. For this reason, the temperature measurement substrate WT itself may not include a power supply unit and may not include a power storage unit. Further, it is not necessary to separately prepare equipment for supplying power to or charging the temperature measurement substrate WT.

  The storage space for the temperature measurement substrate WT is, for example, in the carrier C or the substrate processing apparatus 1. In the case of the substrate processing apparatus 1, a portion of the heat treatment units 50 and 55 may be used as a storage space, or the temperature measurement substrate WT may be mounted on one shelf in the buffer unit BF. Since it is not necessary to install a charging facility in the storage space, the temperature measurement substrate WT can be appropriately stored at any location.

[3-3 Configuration of Edge Exposure Unit EEW]
Refer to FIGS. 9A and 9B. FIG. 9A is a side view of the edge exposure unit, and FIG. 9B is a plan view of the edge exposure unit.

  The edge exposure unit EEW includes a holding unit 141, a motor 143, an exposure head 145, and an edge detection unit 147 (antenna position detection sensor).

  The holding unit 141 holds the placed substrate W in a horizontal posture. 9A and 9B show a temperature measurement substrate WT. The motor 143 is connected to the holding unit 141 and rotates the holding unit 141. As a result, the substrate W held by the holding portion 141 rotates around the central axis Pc of the substrate W. An encoder and a potentiometer (both not shown) are attached to the motor 143 so that the rotational position and amount of rotation of the motor 143 can be detected.

  The exposure head 145 exposes the resist film formed on the substrate W by irradiating the periphery of the substrate W with exposure light (for example, ultraviolet rays). The exposure head 145 is disposed above the peripheral edge of the substrate W held by the holding unit 141. The exposure head 145 is movable in the horizontal direction (x direction and y direction) by an exposure head drive mechanism (not shown).

  The edge detection unit 147 detects the position of the peripheral edge (contour) of the substrate W. The edge detection unit 147 includes a light irradiation unit 148 and a light receiving unit 149.

  The light irradiation unit 148 is disposed above the peripheral edge of the substrate W held by the holding unit 141. The light receiving unit 149 is disposed at a position facing the light irradiation unit 148 across the peripheral edge of the substrate W.

  The light irradiation unit 148 emits light for edge detection downward. A part of the light of the light irradiation unit 148 is blocked by the peripheral edge of the substrate W, and the other is incident on the light receiving unit 149. That is, the periphery of the substrate W is projected onto the light receiving unit 149. The edge detection light is preferably parallel light.

  The light receiving unit 149 receives light and outputs a detection signal corresponding to the amount of light (the amount of received light). That is, the light receiving unit 149 images the peripheral edge of the substrate W. The light receiving unit 149 is, for example, a CCD (charge coupled device) line sensor.

  The holding unit 141, the motor 143, the exposure head 145, the edge detection unit 147, and the like described above are controlled by the control unit 91.

  The operation in which the edge exposure unit EEW exposes the peripheral edge of the substrate W is as follows.

  The transport mechanisms TB1d / TB2d place the substrate W on the holding unit 141. The holding unit 141 holds the substrate W in a horizontal posture. The motor 143 rotates the substrate W, and the edge detection unit 147 detects the position of the peripheral portion of the substrate W. When the edge detection unit 147 detects the position of the entire peripheral edge of the substrate W, the motor 143 stops.

  The control unit 91 calculates the position of the peripheral portion of the substrate W based on the detection result of the edge detection unit 147 (detection signal of the light receiving unit 149). Specifically, the position of the peripheral portion of the substrate W is the direction of the substrate W or the amount of eccentricity of the substrate W. Here, the orientation of the substrate W is an angle of the substrate W around the central axis Pc of the substrate W. The direction of the substrate W can be appropriately defined. For example, the direction of the substrate W may be a direction from the central axis Pc of the substrate W toward the notch V formed at the peripheral edge of the substrate W. The notch V is, for example, a notch or an orientation flat.

  The controller 91 controls the motor 143 to rotate the substrate W, and adjusts the orientation of the substrate W in a predetermined direction for edge exposure processing. Further, the controller 91 controls the exposure head drive mechanism based on the amount of eccentricity of the substrate W to adjust the position of the exposure head 145.

  Subsequently, the exposure head 145 irradiates the peripheral edge of the substrate W with the exposure light while the motor 143 rotates the substrate W. Thereby, an edge exposure process is performed on the substrate W.

  When the edge exposure process is completed, the transport mechanism TB1d / TB2d takes the substrate W held by the holding unit 141 and carries it out from the edge exposure unit EEW.

  Thus, since the edge exposure unit EEW includes the edge detection unit 147, the edge exposure processing can be performed after the orientation of the substrate W is appropriately adjusted.

[3-4 Configuration of control system]
Please refer to FIG. FIG. 10 is a control block diagram of the substrate processing apparatus according to the embodiment.

  The control unit 91 is functionally divided into an order setting unit 161, a test execution unit 163, and an analysis processing unit 169.

  The order setting unit 161 creates test schedule information related to a plurality of test schedules (schedules) before actually performing the test. The test execution unit 163 performs a plurality of tests according to the test schedule information. The analysis processing unit 169 analyzes the test result. The test execution unit 163 is further functionally divided into a transfer control unit 164, an orientation control unit 165, a heat treatment unit control unit 166, and a temperature measurement unit 167. Details will be described below.

  The order setting unit 161 creates test schedule information. Specifically, the test schedule information is a table in which a series of orders are associated with each test. Specifically, the order is “first”, “second”,..., “N”. The test schedule information is generated before the test is actually performed.

  A plurality of tests to be set in order are specified in the test list information. The test list information is stored in the storage unit 93 in advance. Also, the test list information is newly created or corrected by operating the input / output unit 95. By referring to such test list information by the order setting unit 161, the order setting unit 161 identifies a plurality of tests.

  Here, the test is to measure the temperature of the substrate W being processed by the heat treatment plate PL (hereinafter referred to as “processing temperature”). Any heat treatment plate PL installed in the heat treatment units PHP, CP and PEB can be the subject of the test.

  In the test, a temperature measurement substrate WT is used. That is, the processing temperature of the temperature measurement substrate WT placed on the heat treatment plate PL is measured, and the measured processing temperature is regarded as the processing temperature of the substrate W by the heat treatment plate PL. One test schedule information is generated for a plurality of tests using the same temperature measurement substrate WT. A plurality of tests cannot be performed simultaneously using one temperature measurement substrate WT, and another test cannot be started unless one test is completed.

  The test is performed by setting the heat treatment plate PL and the test temperature. More specifically, the test is performed in a state where the plate temperature of the heat treatment plate PL to be tested is controlled to a predetermined target value so that the treatment temperature by the heat treatment plate PL becomes the test temperature. The test temperature is a target value for the processing temperature of the substrate W, and is strictly different from the target value for the plate temperature. In this specification, the target value of the plate temperature is referred to as “set temperature” and is distinguished from the test temperature.

  There is only one test temperature per test. For example, when the test is performed at two or more test temperatures on the same heat treatment plate PL, the test is performed twice or more.

  The transport controller 164 controls the transport mechanisms TA, TB1c, TB1d, TB2c, TB2d, TC1a, TC1b, and the local transport mechanism TL, and transports the temperature measurement substrate WT.

  In this specification, the transport mechanisms TA, TB1c, TB1d, TB2c, TB2d, TC1a, TC1b, and the local transport mechanism TL are collectively referred to as a “transport section”. The transport unit transports the temperature measurement substrate WT.

  The orientation control unit 165 adjusts the orientation of the temperature measurement substrate WT. Specifically, the orientation of the temperature measurement substrate WT is adjusted so that the temperature measurement substrate WT faces the first target direction when the temperature measurement substrate WT is placed on the heat treatment plate PL. This adjustment is called “plate adjustment”.

  Further, the orientation of the temperature measurement substrate WT is adjusted so that the orientation of the temperature measurement substrate WT becomes the second target direction when the temperature measurement substrate WT is carried into the storage space. This adjustment is called “storage adjustment”. Here, the second target direction is an appropriate direction of the temperature measurement substrate WT in the storage space, and is set in advance. The second target direction will be described later.

The adjustment is performed by controlling the holding unit 141, the motor 143, and the edge detection unit 147 installed in the edge exposure unit EEW. The holding unit 141, the motor 143, and the edge detection unit 147 can change not only the orientation of the substrate W but also the orientation of the temperature measurement substrate WT. That is, the holding unit 141, the motor 143, and the edge detection unit 147 constitute an adjustment mechanism MD that changes the orientation of the temperature measurement substrate WT. Note that when the adjustment mechanisms MD installed in the edge exposure units EEW ₀₁ and EEW ₀₂ are distinguished from each other, they are described as “adjustment mechanisms MD ₀₁ ” and “adjustment mechanisms MD ₀₂ ”.

  The heat treatment unit control unit 166 controls the heater 109 and the like of each heat treatment unit HU. Note that the local transport mechanism TL is an element of the heat treatment unit HU, but in this embodiment, the transport control unit 164 controls the local transport mechanism TL instead of the heat treatment unit control unit 166.

  The temperature measurement unit 167 processes the detection signal of the temperature measurement substrate WT. Specifically, the temperature measurement unit 167 is electrically connected to the unit side antenna AU by wire. The temperature measurement unit 167 generates a plurality (for example, 16) of temperature data TD based on the detection signal received by the unit-side antenna AU.

  The analysis processing unit 169 analyzes the temperature data TD generated by the temperature measurement unit 167.

  In addition to the above-described test list information, the storage unit 93 stores in advance plate performance information, test recipe information, delivery position information, target direction information, airflow forming facility information, analysis information, and the like. In the plate performance information, information on the performance of the heat treatment plate PL is defined. In the test recipe information, information on the test procedure (conditions) is defined. In the delivery position information, information on the position of the transport unit is defined. In the target direction information, information on the first target direction and the second target direction is defined. In the airflow forming facility information, information on the airflow forming facility is defined. In the information for analysis, information on causes and countermeasures are defined.

  The storage unit 93 appropriately stores the test schedule information generated by the order setting unit 161.

  The input / output unit 95 accepts instructions related to creation and correction of test list information. At this time, the input / output unit 95 may display an edit screen for editing the test list information. The input / output unit 95 displays test results, analysis results by the analysis processing unit 169, and the like.

  The substrate processing apparatus 1 not only corresponds to the substrate processing apparatus in the present invention but also corresponds to the analysis apparatus in the present invention and corresponds to the test schedule creation apparatus in the present invention.

[4. Operation for testing the heat treatment plate PL]
Next, an operation for testing the heat treatment plate PL of the substrate processing apparatus 1 will be described. FIG. 11 is a flowchart showing a schematic procedure of the heat treatment plate test.

<Step S1> Test Schedule Creation Process Prior to conducting the test, test schedule information is generated. The test schedule creation process corresponds to the test schedule creation method in the present invention.

<Steps S2 and S3> Continuous test execution process A series of tests specified in the test schedule information is performed. Specifically, the temperature measurement substrate WT is transferred to the heat treatment plate PL according to the test schedule information, and tests are performed one by one in order from the first test. In this way, the test is continuously performed until all the series of tests are completed. In addition, the process of step S3 means only each test included in the process of step S2.

<Step S4> Analysis The result of the test is analyzed.

<Step S5> Output Output test results and / or analysis results.

  Below, each operation | movement of step S1 thru | or S4 is demonstrated in detail.

[4-1 Detailed operation example of S1 (preparation of test schedule creation process)]
FIG. 12 is a flowchart showing a detailed procedure of the test schedule creation process.

<Step S11> Test Specifying Process The order setting unit 161 refers to the test list information stored in the storage unit 93 or the test list information input to the input / output unit 95, and specifies the test to which the order should be assigned. The test list information defines a plurality of tests. The test list information includes information for specifying the heat treatment plate PL to be tested and the test temperature.

  FIG. 13 is a schematic diagram illustrating an example of test list information. The test list information shown in FIG. 13 is a table that associates test identification information, unit identification information, category identification information, plate identification information, and test temperature. In the test list information, seven tests (TeA to TeG) are defined. Here, the test identification information is information for identifying each test. The unit identification information is information for identifying the heat treatment unit HU. The category identification information is information for identifying the category of the heat treatment unit HU. The plate identification information is information for identifying the heat treatment plate PL.

<Step S12> Burden amount comparison process The order setting unit 161 compares the initial burden amount of each heat treatment plate PL, and identifies the heat treatment plate PL having the largest initial burden amount.

  The initial burden amount is obtained by quantifying the burden given to each heat treatment plate PL by all the tests specified by the test specifying process. The initial burden amount is a numerical value based on at least one of the number of tests for the heat treatment plate PL, the change time required to change the plate temperature, and the temperature change rate of the plate temperature.

The number of tests is given by the test list information. When two or more test temperatures are set for the same heat treatment plate PL, the number of tests of the heat treatment plate PL is two or more. In the test list information of FIG. 13, the number of tests of the heat treatment plates PL ₀₃ and PL ₁₁ is “2”, and the number of tests of the heat treatment plate PL ₁₈ is “3”.

  The change time and the temperature change rate are indexes indicating the performance of the heat treatment plate PL, and depend on the material of the heat treatment plate PL, the use temperature range, the use environment, or the like. Information on the performance of the heat treatment plate PL such as the change time and the temperature change rate is defined in the plate performance information. The plate performance information is stored in advance in the storage unit 93.

  FIG. 14 is a schematic diagram illustrating an example of plate performance information. The plate performance information shown in FIG. 14 is a table in which plate identification information is associated with a change time. In FIG. 14, the change time column is blank, but in reality, one value is set in each column, specifically, a value representative of the change time of each heat treatment plate PL is set. It should be noted that the relative relationship (performance ratio) of the performance of each heat treatment plate PL can be sufficiently expressed by only one change time set for each heat treatment plate PL. For this reason, even if it is a case where it is based on such change time, an appropriate initial burden amount can be calculated.

  It is preferable to define the initial burden amount so that the larger the burden, the larger the initial burden amount. Specifically, the initial burden amount preferably shows at least one of a tendency to increase as the number of tests increases, a tendency to increase as the change time increases, and a tendency to increase as the temperature change rate decreases.

  The initial burden amount may be, for example, the number of tests itself. According to this, the initial burden amount of each heat treatment plate PL can be specified based only on the test list information. The initial burden amount may be a value obtained by dividing the change time of each heat treatment plate PL by the reference time. According to this, it can be adjusted to a numerical value that is easy to handle in the subsequent arithmetic processing. Alternatively, the initial burden amount may be, for example, the product of the number of tests and the change time. In this case, the order setting unit 161 calculates the initial burden amount of each heat treatment plate PL by referring to the test list information and the plate performance information.

<Step S13> First Assignment Process The order setting unit 161 assigns the “first” order to one test for the heat treatment plate PL specified by the burden amount comparison process. “First” is the first order. The test assigned the “first” order is the assigned test. A test other than the “assigned test”, that is, a test for which the order is not yet assigned is referred to as an “unassigned test”.

  When the number of tests of the specified heat treatment plate PL is 2 or more, the order may be assigned to any test.

<Step S14> Timing Estimation Process The order setting unit 161 virtually assumes a case where all assigned tests are performed. If the time point at which this step S14 is started is used as a reference, since “first” is already assigned to any test, at least one or more assigned tests always exist. Under such an assumption, after an assigned test is performed, an unassigned test that can be started earliest among unassigned tests is estimated. When making the estimation, the order setting unit 161 refers to the plate performance information and considers the performance of each heat treatment plate PL. Then, the timing (time) at which each unassigned test can be started is calculated based on the end of the assigned test.

<Step S15> Second and subsequent allocation processes The following order is allocated to the unallocated test estimated by the timing estimation process. The “next order” is “(n + 1) th” where n is the number of assigned tests. Thereby, the order after “second” such as “second”, “third”, etc. is assigned to the unassigned test.

<Step S16> Have all the tests been assigned an order?
The order setting unit 161 determines whether or not an order has been assigned to all tests. If it is determined that the test has been assigned, the test schedule information has been completed and the process ends. If it is determined that this is not the case, the process returns to step S14. Thereby, the processes of steps S14 and S15 are repeated until the order is assigned to all the tests.

  The completed test schedule information is appropriately stored in the storage unit 93. The completed test schedule information is given to the test execution unit 163.

  Steps S12 and S13 described above correspond to the first creation process in the present invention. Steps S14 and S15 correspond to the second and subsequent creation processes in the present invention.

  Here, taking the two cases as an example, the processing of step S1 (creation of test schedule information) will be specifically described.

[Case 1]
FIG. 15A shows the test list information in case 1, and FIG. 15B shows the plate performance information in case 1. FIG. 15A illustrates simple test list information in which unit identification information and the like are omitted. The initial burden is the product of the number of tests and the change time. Assume that the test time for each test is 10 minutes.

<Step S11> Test identification process The test TeA, TeB, and TeC are identified with reference to the test list information.

<Step S12> Load comparison process The following items are specified with reference to the test list information and the plate performance information.
・ (Number of tests for heat-treated plate PL ₀₁ ) = 1
・ (Number of tests for heat-treated plate PL ₀₂ ) = 2
・ (Change time of heat treatment plate PL ₀₁ ) = 3 [min]
・ (Change time of heat treatment plate PL ₀₂ ) = 3 [min]
・ (Initial burden amount of heat treatment plate PL ₀₁ ) = 3
・ (Initial burden amount of heat treatment plate PL ₀₂ ) = 6
・ (Initial burden amount of heat treatment plate PL ₀₁ ) <(Initial burden amount of heat treatment plate PL ₀₂ )
・ (Heat treatment plate PL with the largest initial burden) = Heat treatment plate PL ₀₂

Assign "first" to the first test for <Step S13> The first allocation step heat treatment plate _{PL 02.} At this time, “first” may be assigned to either of the tests TeB and TeC. Here, it is assumed that the test TeB is assigned first. Test TeB becomes the assigned test.

<Step S14> Timing estimation process (first time)
Assuming that test TeB is performed, the following items are estimated.
・ Unassigned test = Test TeA, TeC
-(Test TeA start timing) = 0 minutes after the end of test TeB-(Test TeC start timing) = 3 minutes after the end of test TeB-(Unassigned test that can be started earliest after the end of test TeB) ) = Test TeA

Here, assuming that finishes changing the plate temperature of the thermal processing plate PL ₀₁ to about 100 degrees by the end of the test TEB, estimates the start timing of the test TEA. Also, at the end of the test TEB, as begin to change the plate temperature of the thermal processing plate _{PL 02} to about 100 degrees to about 150 degrees, and estimating the start timing of the test TeC. The time for transporting the temperature measurement substrate WT from the heat treatment plate PL ₀₂ to the heat treatment plate PL ₀₁ is ignored.

<Step S15> Second and subsequent allocation processes (first time)
Assign “second” to test TeA. Test TeA is an assigned test.

<Step S16> Have all the tests been assigned an order?
Since the unallocated test TeC remains, the process returns to step S14.

<Step S14> Timing estimation process (second time)
Assuming that tests TeB and TeA are performed, the following matters are estimated.
・ Unassigned test = Test TeC
-(Test TeC start timing) = 0 minutes after the end of test TeA-(Test TeB, unassigned test that can be started earliest after the end of TeA) = Test TeC

<Step S15> Second and subsequent allocation processes (second time)
Assign “third” to test TeC. Test TeC is an assigned test.

<Step S16> Have all the tests been assigned an order?
Since all the tests are assigned tests, the process of step S1 (test schedule creation process) is terminated.

  Thereby, test schedule information as illustrated in FIG. 16 is created. FIG. 16 is a schematic view illustrating test schedule information in case 1.

Refer to FIGS. 17A and 17B. FIGS. 17A and 17B are process charts of a series of tests in Case 1. FIG. FIG. 17A is a process chart based on the test schedule information created by the present embodiment. FIG. 17B is a process chart in the case where tests are performed in the order of tests TeA, TeB, and TeC (comparative example). In FIGS. 17A and 17B, the time for transporting the temperature measurement substrate WT between the heat treatment plates PL ₀₁ and PL ₀₂ is ignored.

  The period from the start to the end of a series of tests is the “total test time”. As shown in FIG. 17A, in this example, the total test time is 30 minutes. As shown in FIG. 17B, in the comparative example, the total test time is 33 minutes. Thus, according to this example, the total test time can be shortened by 3 minutes compared to the comparative example.

[Case 2]
FIG. 18A shows the test list information in case 2, and FIG. 18B shows the plate performance information in case 2. The initial burden is the product of the number of tests and the change time. Assume that the test time for each test is 10 minutes.

<Step S11> Test identification process The test TeA, TeB, TeC, and TeD are identified with reference to the test list information.

<Step S12> Load amount comparison process The following items are specified with reference to the list information and the plate performance information.
・ (Initial burden of heat treatment plate PL ₀₁ ) = 6
・ (Initial burden of heat treatment plate PL ₀₃ ) = 60
・ (Initial burden amount of heat treatment plate PL ₀₁ ) <(Initial burden amount of heat treatment plate PL ₀₃ )
・ (Heat treatment plate PL with the largest initial burden) = Heat treatment plate PL ₀₃

<Step S13> First Allocation Process “First” is allocated to one test for the heat treatment plate PL ₀₃ . Here, it is assumed that the test TeC is assigned to “first”. Test TeC becomes the assigned test.

<Step S14> Timing estimation process (first time)
Assuming that a test TeC is performed, the following items are estimated.
-(Test TeA start timing) = 0 minutes after the end of the test TeC-(Test TeB start timing) = 0 minutes after the end of the test TeC-(Test TeD start timing) = At the end of the test TeC 30 minutes after (unassigned test that can be started earliest after the end of test TeA) = test TeA, TeB

<Step S15> Second and subsequent allocation processes (first time)
“Second” is assigned to either test TeA or TeB. Here, it is assumed that “second” is assigned to the test TeA. Test TeA is an assigned test.

<Step S16> Have all the tests been assigned an order?
Since the unallocated tests TeB and TeD remain, the process returns to step S14.

<Step S14> Timing estimation process (second time)
Assuming that tests TeC and TeA are performed, the following matters are estimated.
-(Test TeB start timing) = 3 minutes after the end of test TeA-(Test TeD start timing) = 20 minutes after the end of test TeA-(Unassigned test that can be started earliest after test TeA ends) ) = Test TeB

<Step S15> Second and subsequent allocation processes (second time)
Assign “third” to test TeB. Test TeB is an assigned test.

<Step S16> Have all the tests been assigned an order?
Since the unallocated test TeD remains, the process returns to step S14.

<Step S14> Timing estimation process (third time)
Assuming that tests TeC, TeA, and TeB are performed, the following items are estimated.
(Start timing of test TeD) = 7 minutes after the end of test TeB (Unassigned test that can be started earliest after the end of test TeB) = Test TeD

<Step S15> Second and subsequent allocation processes (third time)
Assign "4th" to test TeD. The test TeD is an assigned test.

<Step S16> Have all the tests been assigned an order?
Since all the tests are assigned tests, the process of step S1 (test schedule creation process) is terminated.

  Thereby, test schedule information as illustrated in FIG. 19 is created. FIG. 19 is a schematic view illustrating test schedule information in case 2.

Reference is made to FIGS. 20A and 20B are process charts for a series of tests in Case 2. FIG. FIG. 20A is a process chart based on the test schedule information created by this example. FIG. 20B is a process chart in the case where tests are performed in the order of tests TeA, TeC, TeB, and TeD (comparative example). 20A and 20B, the time for transporting the temperature measurement substrate WT between the heat treatment plates PL ₀₁ and PL ₀₃ is ignored.

  As shown in FIGS. 20A and 20B, in this example, the total test time is 50 minutes. In the comparative example, the total test time is 60 minutes. Thus, according to this example, the total test time can be shortened by 10 minutes compared to the comparative example.

Effect of Step S1 (Test Schedule Creation Process) Since the test schedule creation process includes the first creation process and the second and subsequent creation processes, the test schedule information can be suitably created before the test is actually performed. That is, the optimal order for each test can be set. According to this test schedule information, a plurality of tests can be performed efficiently.

  The first preparation process includes a burden comparison process and a first allocation process, and the test for the heat treatment plate PL having the largest initial burden is defined as “first”. As a result, even when a plurality of tests are performed by changing the test temperature for the heat treatment plate PL to which the “first” is assigned, the plate temperature of the heat treatment plate PL is changed. It is easy to create a schedule for performing tests on other heat treatment plates PL in the meantime. Therefore, test schedule information with a relatively short total test time can be created.

  Further, since the second and subsequent creation processes include a timing estimation process and a second and subsequent allocation process, it is possible to create test schedule information with a relatively short total test time. In particular, since a timing estimation process is provided, the waiting time between tests can be minimized.

  Further, since the timing estimation process estimates the start timing of the unallocated test in consideration of the change time, the waiting time between tests due to the change time can be minimized.

Modified Example of Step S1 (Test Schedule Creation Process) Each process of steps S11 to S16 described above may be changed as appropriate. Hereinafter, modified embodiments will be described.

(1) About the 1st creation process Although the 1st creation process was provided with the burden amount comparison process and the 1st allocation process, it is not restricted to this. For example, the first creation process may be further modified to include a specific result determination process and an auxiliary comparison process. According to this modified embodiment, even if the burden comparison process specifies two or more heat treatment plates PL, the heat treatment plates PL can be further selected from among the heat treatment plates PL. Can be assigned.

  Refer to FIG. FIG. 21 is a flowchart showing a detailed procedure of a test schedule creation process according to the modified embodiment. In the flowchart shown in FIG. 21, steps S112 to S115 correspond to the first creation process in the present invention.

  First, in the burden amount comparison process, the heat treatment plate PL having the largest burden amount is specified (step S112). Subsequently, it is determined whether or not two or more heat treatment plates PL are included in the processing result of the burden comparison process (step S113). As a result, if it is determined that it is included, the process proceeds to the auxiliary comparison process (step S114). Otherwise, the process proceeds to the first allocation process (step S115). Step S113 is a specific result determination process.

  In the auxiliary comparison process, the heat treatment plate PL having the largest auxiliary initial burden amount is identified among the two or more heat treatment plates PL identified in the burden amount comparison process (step S114).

  Here, the auxiliary initial burden amount is obtained by quantifying the burden on the heat treatment plate PL from a viewpoint different from the initial burden amount. That is, the auxiliary initial burden amount is at least one of the number of tests for the heat treatment plate PL, the change time required to change the plate temperature, and the temperature change rate of the plate temperature, and is different from the basis of the initial burden amount. It is a numerical value based on. For example, when the initial burden amount is a numerical value based on the number of tests and the change time, an auxiliary initial burden amount based only on the number of tests may be employed.

  When the auxiliary comparison process specifies the heat treatment plate PL, the first assignment process is “1” for one test for the heat treatment plate PL specified by the auxiliary comparison process regardless of the processing result of the burden comparison process. Is assigned (step S115). On the other hand, when the auxiliary comparison process does not identify the heat treatment plate PL (that is, when it is not determined by the identification result determination process that it is included), the first allocation process is the heat treatment plate identified by the burden comparison process "First" is assigned to one test for PL (step S115).

  According to such a modified embodiment, even if there are two or more heat treatment plates PL having the largest initial burden, the auxiliary initial burden is an index different from the initial burden, and the burden is reduced. A larger heat treatment plate PL can be accurately identified. Therefore, test schedule information with a shorter total test time can be created.

(2) Regarding the second and subsequent generation processes The second and subsequent generation processes are exemplified by the timing estimation process and the second and subsequent allocation processes, but are not limited thereto. In the following, three modified embodiments will be described.

  (2-1) The second and subsequent creation processes may be further modified to include an estimation result determination process and an auxiliary estimation process. The estimation result determination process determines whether or not the estimation result of the timing estimation process includes a plurality of unassigned tests for different heat treatment plates PL. If the estimation result determination process determines that the process is included, the auxiliary estimation process is performed for each of the heat treatment plates PL among the plurality of heat treatment plates PL that are the targets of the unallocated test estimated by the timing estimation process. The heat treatment plate PL having the largest remaining burden is estimated.

  When the auxiliary estimation process estimates the heat treatment plate PL, the second and subsequent allocation processes are unallocated tests for the heat treatment plate PL estimated by the auxiliary estimation process regardless of the estimation result of the timing estimation process. Is assigned the following order: On the other hand, when the auxiliary estimation process does not estimate the heat treatment plate PL (that is, when the estimation result determination process does not determine that it is included), the second and subsequent allocation processes are estimated by the timing estimation process. Assign the following order to unassigned trials:

  Here, the remaining burden amount is a numerical value representing a burden given to each heat treatment plate PL by the unallocated test, and is a numerical value based on at least one of the remaining number, the change time, and the temperature change rate. “Remaining number” is the number of unallocated tests for the heat-treated plate.

  It is preferable to define the remaining burden amount so that the larger the burden is, the larger the value is. Specifically, the remaining burden amount preferably shows at least one of a tendency to increase as the remaining number increases, a tendency to increase as the change time increases, and a tendency to increase as the temperature change rate decreases.

  According to such a modified embodiment, even when the timing estimation process estimates a plurality of unassigned tests for different heat treatment plates PL, the plurality of unassigned tests can be further narrowed down. Specifically, the unallocated test for the heat treatment plate PL having a larger remaining load on the heat treatment plate PL can be selected. Then, the next order can be preferentially assigned to the selected unassigned test over the unassigned test not selected. For this reason, test schedule information with a shorter total test time can be created.

  (2-2) Instead of the timing estimation process, a remaining burden amount estimation process may be adopted. In the remaining load amount estimation process, the heat treatment plate PL having the largest remaining load amount is estimated. In this modified embodiment, in the second and subsequent allocation processes, the following order is allocated to the unallocated test estimated by the remaining burden amount estimation process.

  Further, in this modified embodiment, the second and subsequent creation processes may be modified to include an estimation result determination process and an auxiliary estimation process. In the estimation result determination process, it is determined whether or not two or more heat treatment plates PL are included in the estimation result of the remaining load amount estimation process. When the estimation result determination process determines that the auxiliary estimation process is included, among the two or more heat treatment plates PL estimated by the residual load amount estimation process, the auxiliary residual load amount of the heat treatment plate PL is the largest. The heat treatment plate PL is estimated.

  Here, the auxiliary remaining burden amount is a numerical value of the burden on the heat treatment plate PL from a viewpoint different from the remaining burden amount. That is, the auxiliary remaining burden amount is a numerical value based on a difference from the basis of the remaining burden amount, which is at least one of the remaining number, the change time, and the temperature change rate.

  (2-3) The second and subsequent creation processes may be further modified to include an unassigned test determination process and a candidate limitation process. The unassigned test determination process determines whether or not a different plate unassigned test exists. When it is determined that there is a different plate unassigned test, the candidate limiting process limits the test candidates to be assigned the next order to the different plate unassigned test.

  Here, the “different plate non-assignment test” is an unassigned test for a heat treatment plate PL that is different from the heat treatment plate PL that is the subject of the assigned test to which the order has been assigned most recently. All of the unassigned tests except the different plate unassigned test are “same plate unassigned test”. The plate unassigned test is an unassigned test for the same heat treatment plate PL as the assigned test assigned the latest order. If the candidate limiting process limits the candidates, even if the same plate unassigned test exists, the same plate unassigned test is excluded from the candidates. The “assigned test assigned the latest order” refers to the assigned test assigned the last order in the assigned test.

  The above (2-2) and (2-3) will be specifically described with reference to FIG. In the flowchart shown in FIG. 21, steps S116 to S121 correspond to the second and subsequent creation processes in the present invention.

  Step S116 is an unallocated test determination process. In the unassigned test determination process, the heat treatment plate PL that is the subject of the assigned test to which the order has been assigned immediately before is specified. Then, it is determined whether or not there is an unassigned test for a heat treated plate PL different from the identified heat treated plate PL, that is, a different plate unassigned test (S116). As a result, if it is determined that it exists, the process proceeds to the candidate limiting process (step S117). Otherwise, the process proceeds to the remaining load amount estimation process (step S118).

  In the candidate limiting process, among all unassigned tests, only the different plate unassigned test is determined as a test candidate to be assigned the next order (step S117).

  When the candidates are limited by the candidate limiting process, the remaining load amount estimation process estimates the heat treatment plate PL having the largest remaining load amount among the heat treatment plates PL that are the targets of the different plate unassignment test (step S118). ). On the other hand, if the candidates are not limited by the candidate limiting process, the remaining burden amount estimation process estimates the heat treatment plate PL having the largest remaining burden amount among all the heat treatment plates PL (step S118).

  Step S119 is an estimation result determination process. In the estimation result determination process, it is determined whether or not two or more heat treatment plates PL are estimated in the remaining load amount estimation process (step S119). As a result, when the estimation result determination process determines that two or more heat treatment plates PL have been estimated, the process proceeds to the auxiliary estimation process (step S120). Otherwise, the process proceeds to the second and subsequent allocation processes (step S121).

  In the auxiliary estimation process, the heat treatment plate PL having the largest auxiliary remaining burden amount is estimated among the two or more heat treatment plates PL estimated in the remaining burden amount estimation process (step S120).

  When the auxiliary estimation process estimates the heat treatment plate PL, the second and subsequent allocation processes are one test for the heat treatment plate PL estimated by the auxiliary estimation process regardless of the processing result of the remaining load amount estimation process. Is assigned the next order (step S121). On the other hand, when the auxiliary estimation process does not estimate the heat treatment plate PL, the second and subsequent allocation processes assign the next order to one test for the heat treatment plate PL estimated by the remaining load amount estimation process. (Step S121).

  In step S122, it is determined whether or not an order has been assigned to all tests. If it is determined that the test has been assigned, the test schedule information has been completed and the process ends. If it is determined that this is not the case, the process returns to step S116. Thus, the processes in steps S116 to S121 are repeated until the order is assigned to all tests.

  As described above, the second and subsequent creation processes include a remaining burden amount estimation process and a second and subsequent allocation processes, and the next order is assigned to the test for the heat treatment plate PL having the largest remaining burden amount. It is easy to create a schedule for performing tests on other heat treatment plates PL while changing the plate temperature of some of the heat treatment plates PL. Therefore, test schedule information with a relatively short total test time can be created.

  Further, the second and subsequent creation processes include an estimation result determination process and an auxiliary estimation process. For this reason, even when there are two or more heat treatment plates PL having the largest remaining load, the heat treatment plate PL having a larger load can be accurately determined using the auxiliary remaining load, which is an index different from the remaining load. Can be specified. Therefore, test schedule information with a shorter total test time can be created.

  Further, since the second and subsequent creation processes include an unallocated test determination process and a candidate limiting process, the next order can be preferentially allocated to the different plate unallocated test over the same plate unallocated test. Thereby, test schedule information with a shorter waiting time between tests can be created.

(3) Test specific process Although the test specific process (steps S11 and S111) has not been described in detail, the test specific process can be appropriately selected and designed. For example, in the test specifying process, the test list information may be created / corrected based on at least one of information input to the input / output unit 95 by the user and information stored in the storage unit 93.

(4) Number of Temperature Measurement Substrates WT In the above-described embodiment, the operation in the case where a plurality of tests are performed using one temperature measurement substrate WT is illustrated, but the present invention is not limited to this. For example, even when a test is performed using a plurality of temperature measurement substrates WT, a test schedule creation process can be applied. In this case, a test schedule creation process is executed for each temperature measurement substrate WT, and one test schedule information is created for each temperature measurement substrate WT.

(5) About a plurality of tests In the example mentioned above, although a plurality of tests were tests in which both heat treatment plate PL and test temperature differ, it is not restricted to this. The plurality of tests may be tests in which only one of the heat treatment plate PL and the test temperature is different.

(6) Test target In the above-described embodiments, the test target is not particularly described, but may be changed as follows. For example, a plurality of tests are divided into an upper layer test group composed of tests for the heat treatment plate PL included in the upper layer K1, and a lower layer test group composed of tests for the heat treatment plate PL included in the lower layer K2. It is possible to classify and create one test schedule information only for tests included in the upper test group, and create another test schedule information only for tests included in the lower test group. Alternatively, one test schedule information may be created for each test included in the upper layer test group and the lower layer test group regardless of the group to which the test belongs.

(7) Plate performance information The plate performance information is a table in which plate identification information is associated with a change time, but is not limited thereto. For example, when the heat treatment plate PL can be classified into the plate category according to the performance of the heat treatment plate PL, the plate category identification information and the plate performance information (for example, information regarding the change time) may be changed to a related table. Here, the plate category identification information is information for identifying the plate category to which the heat treatment plate PL belongs. According to this, since a plurality of heat treatment plates PL can be collectively specified by one plate category identification information, the plate performance information can be further simplified.

  Further, the plate performance information may be changed so as to include at least one of information on the change time and information on the temperature change rate. According to this, it is possible to suitably calculate the timing at which the unallocated test can be started based on at least one of the information related to the change time and the information related to the temperature change rate. Moreover, various burden amounts can be suitably obtained.

[4-2 Detailed operation example of S2 (continuous test execution process)]
FIG. 22 is a flowchart showing a detailed procedure of the test continuous execution process. FIG. 23 is a diagram schematically illustrating an example of a conveyance path of the temperature measurement substrate WT.

Here, the storage space for the temperature measurement substrate WT is in the carrier C as shown in FIG. For convenience of explanation, only the heat treatment plate PL installed in the upper layer K1 (heat treatment unit groups 51 and 56) is the subject of each test. In addition, the direction of the temperature measuring substrate WT is adjusted in the edge exposure unit EEW ₀₁ installed in the upper layer K1 (heat treatment unit group 56).

<Step S <b>21> Unloading Process The transfer control unit 164 controls the transfer mechanism TA to unload the temperature measurement substrate WT from the carrier C placed on the ID unit 11. The carrier C may be a dedicated carrier for accommodating the temperature measurement substrate WT exclusively, or may be a dual-purpose carrier that can also accommodate the substrate W.

Conveyance control unit 164 for conveying the <step S22> Temperature measurement substrate edge exposure unit, transport mechanism TA, TB1c, by controlling the TB1d, conveys the temperature-measuring substrate WT to edge exposing unit _{EEW 01.} The temperature measurement substrate WT is placed on the holding unit 141.

<Step S23> Plate Adjustment The orientation control unit 165 performs plate adjustment by controlling the adjustment mechanism MD ₀₁ installed in the edge exposure unit EEW ₀₁ . Thereby, the adjusting mechanism MD ₀₁ changes the direction of the temperature measurement substrate WT.

  More specifically, the direction control unit 165 refers to the test schedule information and identifies the heat treatment plate PL that is the subject of the “first” test. Then, the direction of the temperature measurement substrate WT is changed in the edge exposure unit EEW so that the direction of the temperature measurement substrate WT becomes the first target direction when the temperature measurement substrate WT is placed on the specified heat treatment plate PL. adjust.

  The first target direction is defined in advance in the target direction information stored in the storage unit 93. The direction control unit 165 identifies the first target direction with reference to the target direction information.

  FIG. 24 is a schematic diagram illustrating an example of target direction information. The target direction information shown in FIG. 24 defines information related to the second target direction as well as the first target direction. Specifically, the target direction information includes a table that associates the plate identification information with the first target direction, and a table that associates the storage space identification information with the second target information. Here, the storage space identification information is information for identifying the storage space.

  When adjusting the orientation of the temperature measurement substrate WT, the orientation control unit 165 considers the first orientation variation amount. The first direction variation amount is an amount by which the orientation of the temperature measurement substrate WT varies while the transport unit transports the temperature measurement substrate WT from the edge exposure unit EEW (adjustment mechanism MD) to the heat treatment plate PL.

Reference is made to FIGS. 25A, 25B, and 25C. 25A, 25B, and 25C are diagrams schematically showing the relationship between the direction of the temperature measurement substrate WT in the edge exposure unit EEW and the direction of the temperature measurement substrate WT in the heat treatment plate PL. . In each figure, the left side of the figure indicate when taking a conveying mechanism TB1d temperature measuring substrate WT from the edge exposing unit EEW _01, the right figure, passes the temperature measurement substrate WT to transfer mechanism TB1d heat treatment plate PL Illustrate the time. The heat treatment plates PL ₁₅ , PL ₁₆ , and PL ₁₇ shown in FIGS. 25A, 25B, and 25C are all installed in the cooling unit CP.

  25 (a), (b), and (c), the directions DE and DH of the temperature measurement substrate WT are indicated by directions extending from the central axis Pc of the temperature measurement substrate WT to one end of the sensor side antenna AS for convenience. ing. The direction DE is the direction of the temperature measurement substrate WT in the edge exposure unit EEW. The direction DH is the direction of the temperature measurement substrate WT placed on the heat treatment plate PL. In the diagrams on the right side of FIGS. 25 (a), (b), and (c), the direction DE is overlapped.

  The first direction variation amount is an angle AC formed by the direction DE and the direction DH. In each figure, the case where the first direction variation amounts ACa, ACb, and ACc are different is shown. Thus, the first direction variation amount AC is not always uniform. That is, the first direction variation amount takes a unique value for each heat treatment plate PL.

As clearly shown in FIGS. 25A, 25B, and 25C, when the temperature measurement substrate WT is placed on the heat treatment plate PL, the sensor-side antenna AS is positioned directly in front of the unit-side antenna AU. doing. That is, the directions DHa, DHb, and DHc are first target directions in the heat treatment plates PL ₁₅ , PL ₁₆ , and PL ₁₇ , respectively, and each temperature measurement substrate WT faces the first target directions DHa, DHb, and DHc, respectively. It is placed in a state. Therefore, the directions DEa, DEb, DEc are the directions of the temperature measurement substrate WT to be adjusted in the edge exposure unit EEW. In each drawing, the first target directions DHa, DHb, and DHc are different from each other.

  As is apparent from the drawings, the directions DEa, DEb, and DEc are obtained by adding and subtracting the first direction variation amount AC to the first target direction DH.

  Here, a method for specifying the first direction variation amount AC is illustrated.

The first direction variation amount AC is determined by the delivery position of the transport unit. For example, in the case of FIG. 25 (a), the orientation variation ACa is the position of the transport mechanism TB1d when taking the temperature measurement substrate WT from the edge exposing unit EEW (adjusting mechanism MD), for temperature measurement in the thermal processing plate _{PL 15} It depends on each position of the transport mechanism TB1d when the substrate WT is transferred.

  The delivery position of the transport unit is defined in delivery position information. The delivery position information includes information on the position of the transport unit when the transport unit takes the temperature measurement substrate WT from the edge exposure unit EEW (adjustment mechanism MD), and the transport unit delivers the temperature measurement substrate WT to the heat treatment plate PL. At least information about the position of the transport unit at the time.

  FIG. 26 is a schematic diagram illustrating an example of delivery position information. The delivery position information illustrated in FIG. 26 is a table in which the conveyance unit identification information, the unit identification information, and the position information are associated with each other. The conveyance unit identification information is information for identifying the conveyance unit. The unit identification information is information for identifying a processing unit, a placement unit, a carrier C, and the like (hereinafter referred to as “unit etc.”). The position information is information regarding the position of the transport unit when the transport unit takes the temperature measurement substrate WT from the unit or the like, and is information regarding the position of the transport unit when the transport unit passes the temperature measurement substrate WT to the unit or the like. is there. The position information includes information on the position in the x direction, the position in the y direction, the position in the z direction, the angle θ, and the distance r. The position of the transport mechanism is uniquely specified by information such as the position in the x direction. The angle θ is an angle around the vertical axis of each transport mechanism. The distance r is the position of the transport mechanism (hand H) in the radial direction of the vertical axis.

  The position information is defined for all combinations of one transport unit and one unit. If the position of the transfer unit when the transfer unit delivers the temperature measurement substrate WT to the unit or the like and the position of the transfer unit when the transfer unit takes the temperature measurement substrate WT from the unit or the like are the same, It is not necessary to distinguish. For example, as shown in FIG. 26, the number of pieces of position information associated with each combination of one transport unit and one unit may be one.

  Since the transport mechanism TB1c and the like do not include a mechanism that moves in the y direction, the position of the transport mechanism TB1c and the like can be uniquely specified without giving a position in the y direction. For this reason, in FIG. 26, the “position in the y direction” is not associated with the transport mechanism TB1c and the like. Similarly, position information unnecessary for specifying the delivery position is not associated with other transport mechanisms TA and the like.

  In the present embodiment, the transport unit can handle the temperature measurement substrate WT in the same manner as the substrate W. That is, like the substrate W, the transport unit can take or pass the temperature measurement substrate WT. Therefore, so-called teaching data may be used as delivery position information. Teaching data is created by teaching work for setting and adjusting the position of the transport unit when the transport unit delivers the substrate W to the unit or the like. The teaching work is performed not only when the substrate processing apparatus 1 is shipped but also during maintenance. Along with this, teaching data is also updated as needed.

  As described above, the first direction variation amount AC basically includes the position information of the transport mechanism when the temperature measurement substrate WT is taken from the edge exposure unit EEW (adjustment mechanism MD), and the temperature measurement substrate on the heat treatment plate PL. It can be specified based on the position information of the transport mechanism when delivering the WT. However, when the temperature measurement substrate WT is transferred from the edge exposure unit EEW to the heat treatment plate PL, if one transfer mechanism passes the temperature measurement substrate WT to another transfer mechanism, each transfer mechanism at that time Consider location information as well.

For example, when the heat treatment plate PL is installed in the cooling unit CP in the heat treatment unit group 56, the first direction variation amount is given by the following information.
IP1: Position information of the transport mechanism TB1d when taking the temperature measurement substrate WT from the edge exposure unit EEW IP2: Position information of the transport mechanism TB1d when passing the temperature measurement substrate WT to the heat treatment plate PL

For example, when the heat treatment plate PL is installed in the heating / cooling unit PHP in the heat treatment unit group 56, the first direction variation amount is given by the following information.
IP1: Position information of the transport mechanism TB1d when taking the temperature measurement substrate WT from the edge exposure unit EEW IP3: Position information of the transport mechanism TB1d when passing the temperature measurement substrate WT to the placement part PA IP4: Placement part PA Information of the local transport mechanism TL when the temperature measurement substrate WT is taken from the substrate IP5: Position information of the local transport mechanism TL when the temperature measurement substrate WT is transferred to the heat treatment plate PL

For example, when the heat treatment plate PL is installed in the heating / cooling unit PHP in the heat treatment unit group 51, the direction control unit 165 is given by the first direction variation amount based on the following information.
IP1: Position information of the transport mechanism TB1d when taking the temperature measurement substrate WT from the edge exposure unit EEW IP6: Position information of the transport mechanism TB1d when passing the temperature measurement substrate WT to the placement part P3R IP7: Placement part P3R Position information of the transport mechanism TB1c when the temperature measurement substrate WT is taken from IP8: Position information of the transport mechanism TB1c when the temperature measurement substrate WT is transferred to the placement part PA IP9: Temperature measurement substrate WT from the placement part PA Information of the local transport mechanism TL when taking the temperature IP10: Position information of the local transport mechanism TL when passing the temperature measurement substrate WT to the heat treatment plate PL

  IP1 corresponds to “information relating to the position of the transport unit when the transport unit takes the temperature measurement substrate from the adjustment mechanism” in the present invention. IP2, IP5, and IP10 correspond to “information on the position of the transport unit when the transport unit passes the temperature measurement substrate to the heat treatment plate” in the present invention. IP3, IP4, IP6 to IP9 correspond to “information relating to the position of each transport mechanism when the temperature measurement substrate is transferred from one transport mechanism to another transport mechanism” in the present invention.

  Note that all information included in the position information IP1 and the like is not necessarily required to specify the first variation amount AC. If the first direction variation amount AC does not change even when the local transport mechanism TL transports the temperature measurement substrate WT as in the present embodiment, all the information included in the position information IP3, IP4, etc. is unnecessary. is there. Further, as in this embodiment, when the first direction variation amount AC does not change even when the transport mechanism TB1d transports the temperature measurement substrate WT in the z direction, some of the position information IP1 and IP2 includes Information (“position in the z direction”) is not required. As a result, in the simplest case, the first direction variation amount AC can be specified based only on the angle θ included in each enumerated position information IP.

  The direction control unit 165 performs plate adjustment based on the first target direction defined in the target direction information and considering the first direction variation amount AC. Thereby, the direction of the temperature measurement substrate WT on the heat treatment plate PL can be made to coincide with the first target direction with high accuracy.

<Step S24> Plate Transport Process The transport controller 164 refers to the test schedule information, takes the temperature measurement substrate WT from the edge exposure unit EEW (adjustment mechanism MD), and takes the temperature measurement substrate WT taken as “first”. It mounts on the heat processing plate PL which is a test object of "." At this time, although it may be routed through the mounting portion P3R, the “first” heat treatment is performed from the adjustment mechanism MD without transporting the temperature measurement substrate WT to another heat treatment plate PL or the liquid treatment units 60 and 65. The temperature measurement substrate WT is directly transferred to the plate PL.

  Here, a comparative example is illustrated with reference to FIGS. 27 (a), (b), and (c). FIGS. 27A, 27B, and 27C are diagrams schematically showing the relationship of the orientation of the temperature measurement substrate WT in the comparative example. 27 (a), 27 (b), and 27 (c) show a case where the direction of the temperature measurement substrate WT is adjusted to the uniform direction DEs in the edge exposure unit EEW.

  As shown in the figure, in this comparative example, the direction of the temperature measurement substrate WT on the heat treatment plate PL cannot be accurately adjusted to the first target direction, and the sensor-side antenna AS and the unit-side antenna AU are accurately aligned. I can't. As a result, according to the comparative example, the sensor side antenna AS and the unit side antenna AU cannot communicate appropriately.

  On the other hand, as shown in FIGS. 25A, 25B, and 25C, according to the present embodiment, even when the temperature measurement substrate WT is placed on any heat treatment plate PL. The sensor side antenna AS faces the unit side antenna AU. For this reason, according to the Example, the sensor side antenna AS and the unit side antenna AU can communicate appropriately.

<Step S3> Test The “first” test is performed. This process will be described later.

<Step S25> Have all the tests been completed?
It is determined whether a series of tests specified in the test schedule information has been completed. As a result, if it is determined that all tests have been completed, the process proceeds to step S27. Otherwise, the process proceeds to step S26.

<Step S26> Is the next test object the same heat-treated plate?
It is determined whether or not the test to which the next order is assigned in the test schedule information is a test for the same heat treatment plate PL. As a result, if it is determined that the test is for the same heat treatment plate PL, the process returns to step S3.

  Otherwise, the process returns to step S22. Thus, when the temperature measurement substrate WT is transferred from one heat treatment plate PL to another heat treatment plate PL, the temperature measurement substrate WT is separated from the temperature measurement substrate WT after adjusting the temperature measurement substrate WT each time. To the heat treatment plate PL.

  Then, the processes from step S22 to step S24 and step S3 are performed again. At this time, in the above description regarding steps S23, S24, and S3, “first” is appropriately read as “n” according to the number of repetitions, and the processing of steps S23 and S24 is performed.

<Step S27> Transporting the temperature measurement substrate to the edge exposure unit The transport control unit 164 transports the temperature measurement substrate WT to the edge exposure unit EEW.

<Step S28> storing adjustment direction control unit 165, by controlling the adjusting mechanism _{MD 01,} and stores this adjustment. Thereby, the adjusting mechanism MD ₀₁ changes the direction of the temperature measurement substrate WT.

  More specifically, the orientation control unit 165 adjusts the orientation of the temperature measurement substrate WT so that the orientation of the temperature measurement substrate WT becomes the second target direction when the temperature measurement substrate WT is carried into the carrier C. To do. The second target direction is defined in the target direction information. The direction control unit 165 identifies the second target direction with reference to the target direction information.

  The second target direction is preferably set in consideration of the structure of the carrier C and the like. Specifically, the structure or the like of the carrier C is an arrangement of slots (shelves) that are installed in the carrier C and on which the temperature measurement substrate WT is placed, and whether or not the temperature measurement substrate WT is placed in the slot. This is a detection area of the substrate detection sensor for detecting the above. For example, it is preferable to set the direction of the temperature measurement substrate WT so that the sensor antenna AS does not interfere with the slot as the second target direction. For example, it is preferable that the direction of the temperature measurement substrate WT such that the sensor-side antenna AS deviates from the detection region of the substrate detection sensor is the second target direction.

  When performing the storage adjustment, the direction control unit 165 considers the second direction variation amount. The second direction variation amount is an amount by which the orientation of the temperature measurement substrate WT varies while the transport unit transports the temperature measurement substrate WT from the adjustment mechanism MD to the carrier C. By considering the second direction variation amount, the direction of the temperature measurement substrate WT to be adjusted in the edge exposure unit EEW can be accurately specified.

The second direction variation amount is specified by, for example, position information IP listed below.
IP1: Position information of the transport mechanism TB1d when taking the temperature measurement substrate WT from the edge exposure unit EEW IP6: Position information of the transport mechanism TB1d when passing the temperature measurement substrate WT to the placement part P3R IP7: Placement part P3R Position information of the transport mechanism TB1c when the temperature measurement substrate WT is taken from IP11: Position information of the transport mechanism TB1c when the temperature measurement substrate WT is transferred to the placement unit P1R IP12: Temperature measurement substrate WT from the placement unit P1R Position information of the transport mechanism TA when taking IP13: Position information of the transport mechanism TA when passing the temperature measurement substrate WT to the carrier C

  IP6, IP7, IP11 to IP12 correspond to “information on the position of each transport mechanism when the transport unit passes the temperature measurement substrate from one transport mechanism to another transport mechanism” in the present invention. The IP 13 corresponds to “information regarding the position of the transport unit when the transport unit passes the temperature measurement substrate to the storage space” in the present invention.

<Step S29> Storage Process The transport controller 164 controls the transport mechanisms TB1d, TB1c, and TA to unload the temperature measurement substrate WT from the edge exposure unit EEW and load it into the carrier C.

Effect of Step S2 (Continuous Test Execution Process) According to the continuous test execution process, a plurality of tests can be performed automatically and continuously. Thereby, a plurality of tests can be executed collectively.

  A plate adjustment process and a plate conveyance process are provided, and each time the plate conveyance process is executed, the plate adjustment process is performed in advance. Thereby, the direction of the temperature measurement substrate WT can be suitably managed.

  In the plate adjustment process, the orientation of the temperature measurement substrate WT is adjusted in consideration of the orientation of the temperature measurement substrate WT when placed on the heat treatment plate PL. Therefore, the temperature measurement substrate WT can be placed on the heat treatment plate PL in an appropriate direction. Therefore, the test (step S3) for the heat treatment plate PL can be appropriately performed.

  Further, the direction control unit 165 and the conveyance control unit 164 cooperate to always execute the plate adjustment process before the plate conveyance process.

  In the plate adjustment process, the orientation of the temperature measurement substrate WT is adjusted so that the orientation of the temperature measurement substrate WT becomes the first target direction when the temperature measurement substrate WT is placed on the heat treatment plate PL. To do. Thereby, the sensor side antenna AS and the unit side antenna AU face each other accurately, and both can perform wireless communication with high quality.

  Further, in the plate adjustment process, the direction of the temperature measurement substrate WT is adjusted in consideration of the first direction variation amount, so that the direction of the temperature measurement substrate WT can be adjusted with high accuracy.

  In addition, since the direction control unit 165 specifies the first direction variation amount based on the delivery position information, the first direction variation amount can be accurately identified even when transported to any heat treatment plate PL.

  The storage adjustment process and the storage process are provided, and each time the storage process is executed, the storage adjustment process is performed in advance. Thereby, the direction of the temperature measurement substrate WT can be suitably managed.

  In the storage adjustment process, the orientation of the temperature measurement substrate WT is adjusted in consideration of the orientation of the temperature measurement substrate WT when it is carried into the carrier C. For this reason, the temperature measurement substrate WT can be carried into the carrier C in an appropriate direction. Therefore, the temperature measurement substrate WT can be properly stored.

  Further, the orientation control unit 165 and the transport control unit 164 cooperate to always execute the storage adjustment process before the storage process.

  In the storage adjustment process, the orientation of the temperature measurement substrate WT is adjusted so that the orientation of the temperature measurement substrate WT becomes the second target direction when the temperature measurement substrate WT is carried into the carrier C. Thereby, the temperature measurement substrate WT can be properly stored.

  Further, since the adjustment process for storage adjusts the direction of the temperature measurement substrate WT in consideration of the second direction fluctuation amount, the direction of the temperature measurement substrate WT can be adjusted with high accuracy.

  In addition, since the direction control unit 165 identifies the second direction variation amount based on the delivery position information, the second direction variation amount can be identified with high accuracy.

  Further, when the test specified in the test schedule information is completed, the storing process is executed, so that the temperature measuring substrate WT can be automatically stored. That is, when the test is completed, the temperature measurement substrate WT can be automatically removed.

  In addition, since the unloading process is provided, the temperature measurement substrate WT can be automatically unloaded from the storage space prior to the execution of the test specified in the test schedule information. That is, the temperature measurement substrate WT can be automatically prepared when performing the test.

  Further, since the inside of the carrier C is a storage space for the temperature measurement substrate WT, the temperature measurement substrate WT can be appropriately transferred to the outside of the substrate processing apparatus 1.

  The adjustment mechanism MD is an existing facility that is originally installed to change the orientation of the substrate W. Since such an adjustment mechanism MD is used to change the orientation of the temperature measurement substrate WT, the substrate processing apparatus 1 is not increased in size and cost.

Modified Example of Step S2 (Continuous Test Execution Process) The configuration of the adjustment mechanism MD described above and the processes of steps S21 to S29 may be appropriately changed. Hereinafter, modified embodiments will be described.

(1) Adjustment mechanism MD The adjustment mechanism MD is installed in the edge exposure unit EEW, but is not limited thereto. The adjusting mechanism installed other than the edge exposure unit EEW may be changed. For example, an adjustment mechanism that changes the orientation of the temperature measurement substrate WT may be installed in a processing unit other than the edge exposure unit EEW (for example, the liquid processing units 60 and 65 and the heat treatment unit HU). When the substrate processing apparatus 1 includes an inspection unit for inspecting the substrate W, an adjustment mechanism installed in the inspection unit may be used. Examples of the inspection unit include an inspection unit that detects foreign matter on the substrate W, measures the width of the edge rinse process, or measures the thickness of the coating film. Further, when the substrate processing apparatus 1 includes an adjustment unit for adjusting the orientation of the substrate W, the substrate processing apparatus 1 may be changed to use the adjustment unit.

(2) About storage space Although the inside of the carrier C separate from the substrate processing apparatus 1 was illustrated as a storage space of the substrate WT for temperature measurement, it is not restricted to this. For example, a storage space may be installed in the substrate processing apparatus 1. According to this, the test can be automatically performed at an arbitrary time. For example, the test can be easily performed when a normal production process (a process for manufacturing a product in which a predetermined process is performed on the substrate W) is not performed. It is also easy to carry out tests periodically. In addition, by installing a storage space in the substrate processing apparatus 1, the temperature measurement substrate WT can be easily prepared and removed. Thus, user work and user intervention associated with the test can be reduced.

(3) Identification of first direction variation and second direction variation The direction control unit 165 identifies the first direction variation and the second direction variation with reference to the delivery position information. I can't. For example, information including the value of the first direction variation amount itself may be prepared in advance, and the direction control unit 165 may specify the first direction variation amount by referring to this information. According to this, the process of the direction control part 165 can be simplified. The specification of the second direction variation amount may be similarly changed.

  Alternatively, information including the orientation of the temperature measuring substrate WT to be adjusted in the edge exposure unit EEW is prepared in advance, and the orientation control unit 165 refers to this information to perform plate adjustment and storage adjustment. Also good. According to this, the process of the direction control unit 165 can be further simplified.

(4) Regarding the heat treatment plate PL to be tested In the above-described operation example, only the heat treatment plate PL installed in the heat treatment unit groups 51 and 56 is set as the test subject, but the present invention is not limited thereto. You may change so that the arbitrary heat processing plate PL installed in the heat processing unit group 51,52,56,57 may be made into a test object.

(5) Operation of upper layer K1 and lower layer K2 In the above-described operation example, only the operation of the upper layer K1 of the processing unit 13 is illustrated, and the operation of the lower layer K2 is not particularly described, but the lower layer K2 is appropriately operated. May be. For example, the test continuous execution process may be performed in one of the upper layer K1 and the lower layer K2, and the normal production process may be performed in the other. In addition, in both the upper layer K1 and the lower layer K2, the test continuous execution process using different temperature measurement substrates WT may be performed separately and independently. Alternatively, one continuous test execution process using the same temperature measurement substrate WT may be executed in both the upper layer K1 and the lower layer K2.

(6) Number of tests The transport method according to step S2 (continuous test execution process) described above can perform a plurality of tests continuously, but can also be suitably applied to a single test. For example, even if the number of tests specified in the test schedule information is single, the transport method according to step S2 (test continuous execution process) can be executed without any trouble. Specifically, since the plate adjustment (step S23) and the plate transport process (step S24) are provided, the orientation of the temperature measurement substrate WT on the heat treatment plate PL can be managed appropriately. Further, since the storage adjustment (step S28) and the storage process (step S29) are provided, the direction of the temperature measurement substrate WT in the storage space can be suitably managed.

[4-3 Detailed operation example of S3 (test)]
FIG. 28 is a flowchart showing a detailed procedure of the test. FIG. 29A is a graph showing the change over time in the plate temperature of the heat treatment plate, and FIG. 29B shows the change over time in the processing temperature of the temperature measurement substrate WT (total average value of each temperature data TD). It is a graph to show.

<Step S30> Change of plate temperature (time t1 to time t2)
Heat treatment unit controller 166 changes the plate temperature of heat treatment plate PL before temperature measurement substrate WT is placed on heat treatment plate PL. Hereinafter, the case where the “first” test is performed will be described in detail.

  The heat treatment unit control unit 166 refers to the test schedule information and the test list information, and specifies the heat treatment plate PL and the test temperature TWe that are the targets of the “first” test. Further, the heat treatment unit control unit 166 identifies the plate temperature TPi at the time when the change of the plate temperature is started based on the detection result of the temperature sensor 111 attached to the heat treatment plate PL. Hereinafter, this plate temperature TPi is referred to as “initial temperature”.

  Subsequently, the heat treatment unit control unit 166 specifies the change time corresponding to the test temperature TWe and the initial temperature TPi with reference to the test recipe information. The test recipe information defines a change time for each heat treatment plate PL.

Refer to FIG. FIG. 30 is a schematic diagram illustrating test recipe information. The illustrated test recipe information is a table in which plate identification information, information on temperature change conditions, and information on change time and the like are associated with each other. The temperature change condition is a combination of the initial temperature range and the test temperature range. In the illustrated test recipe information, the temperature change conditions for the heat treatment plate PL ₀₁ are divided into six types according to three initial temperature ranges and two test temperature ranges. Each temperature change condition is associated with a change time or the like. The change time or the like is, for example, a waiting time, a measurement time, a fine adjustment time, a deviation width threshold, and an upper limit value of the number of measurements in addition to the change time.

  The change time is the time required to change the plate temperature. More specifically, the change time includes not only the time until the plate temperature reaches the set temperature TPr0 corresponding to the test temperature TWe from the initial temperature TPi but also the time until the plate temperature stabilizes at the set temperature TPr0. The change time is obtained in advance by experiments or the like.

  When the change time is specified, the heat treatment unit controller 166 controls the heater 109 to change the plate temperature of the heat treatment plate PL. When the change time elapses from the time when the change of the plate temperature is started, the processing of this step S30 (change of the plate temperature) is ended. Thus, the heat treatment unit controller 166 manages the plate temperature according to the change time.

  The change time defined in the test recipe information is basically synonymous with the change time defined in the plate performance information. However, since a plurality of change times are set according to the temperature change condition in the test recipe information, the process of step S30 can be performed efficiently and reliably.

  The processing in step S30 may be started before the processing in steps S21 to S24 shown in FIG. For example, it may be executed in parallel with the processes of steps S21 to S24, or may be executed before performing the processes of steps S21 to S24.

<Step S31> Place the temperature measurement substrate on the heat treatment plate (time t2).
The heat treatment unit control unit 166 controls the lifting pins 105 and the like, receives the temperature measurement substrate WT from the transfer unit, and places the substrate on the heat treatment plate PL. When the temperature measurement substrate WT is placed, the sensor side antenna AS faces the unit side antenna AU.

<Step S32> Adapt the temperature measurement substrate (time t2 to time t3).
Without starting the measurement, the temperature measurement substrate WT is kept on the heat treatment plate PL. At time t3 when the waiting time elapses from time t2 when the temperature measurement substrate WT is placed on the heat treatment plate PL, the process of step S32 is terminated. The waiting time is defined in the test recipe information.

  By the processing in step S32, the processing temperature of the temperature measurement substrate WT is sufficiently adapted to the temperature of the heat treatment plate PL, and the processing temperature of the temperature measurement substrate WT is sufficiently stabilized. Here, as a measure of “sufficiently stable”, for example, the temperature difference between the treatment temperatures before and after 1 minute is about 0.01 degrees or less. Thus, the waiting time is a time for stabilizing the processing temperature of the temperature measurement substrate WT, and is obtained in advance by experiments or the like.

<Step S33> Measurement (time t3 to time t4)
The processing temperature of the temperature measurement substrate WT is measured. More specifically, the temperature data TD is generated based on a detection signal obtained from the temperature measurement substrate WT placed on the heat treatment plate PL. Measurement takes place over the measurement time. In this step S33, temperature data TD is generated based on the detection signal obtained from the temperature measurement substrate WT placed on the heat treatment plate PL. At time t4 when the measurement time elapses from time t3 when measurement is started, the process of step S33 ends. The measurement time is specified in the test recipe information.

  Specifically, the sensor unit SU detects the temperature, and outputs a detection signal corresponding to the detection result of the sensor unit SU to the sensor-side antenna AS. The sensor side antenna AS transmits a detection signal wirelessly. The unit-side antenna AU receives the transmitted detection signal without contacting the sensor-side antenna AS (temperature measurement substrate WT). The received detection signal is sent to the temperature measurement unit 167 by wire. As a result, the temperature measurement unit 167 acquires a plurality of detection signals independent of each other, corresponding to each of the 16 sensor units SU.

  In this embodiment, the operation of causing the crystal resonator to resonate by passing a current of a predetermined frequency through the unit side coil UC and the operation of receiving the detection signal by the unit side coil UC are repeatedly switched.

  The temperature measurement unit 167 calculates a temperature based on each acquired detection signal, and generates 16 pieces of temperature data TD. Each temperature data TD is based on the result detected by one sensor unit SU. Each temperature data TD indicates the temperature at the site of the substrate body BW where one sensor unit SU is installed. Each temperature data TD is a set of a plurality of measurement values measured during the measurement time from time t3 to time t4, and is time-series data in which these measurement values are arranged in the order of measurement times.

  The measurement time is preferably long enough that the temperature data TD does not depend on the measurement time. Alternatively, it is preferable that the measurement time is long enough that variations and errors in the temperature data TD are sufficiently reduced. Thus, the measurement time is a time for measuring the processing temperature of the temperature measurement substrate WT, and is obtained in advance by experiments or the like.

  This step S33 corresponds to the measurement process in the present invention.

<Step S34> Is the deviation width equal to or greater than a threshold value?
The temperature measurement unit 167 calculates a total average value by dividing the sum of the values of each temperature data TD by the number of the temperature data TD. Note that the value of the temperature data TD is, for example, an average value of measurement values included in each temperature data TD. Further, a deviation width DF that is a difference between the total average value and the test temperature TWe is calculated.

  The temperature measurement unit 167 refers to the test recipe information, identifies a deviation width threshold value, and compares the identified threshold value with the deviation width DF. Then, the temperature measurement unit 167 determines whether or not the deviation width DF is greater than or equal to a threshold value. As a result, if it is determined that the value is equal to or greater than the threshold value, the process proceeds to step S35. Otherwise, the process proceeds to step S37.

<Step S35> Is the number of measurements less than the upper limit?
It is determined whether the number of measurements is less than or equal to the upper limit value. The upper limit value of the number of measurements is specified in the test recipe information. As a result, if it is determined that the value is less than or equal to the upper limit value, the process proceeds to step S36. Otherwise, the process proceeds to step S39.

<Step S36> Fine adjustment (time t4 to time t5)
The temperature measurement unit 167 determines the offset value OS based on the deviation width DF. The offset value OS is a value for correcting the set temperature TPr0. The offset value OS is, for example, about 2 degrees or less. The heat treatment unit controller 166 performs fine adjustment to change the plate temperature by the offset value OS from the set temperature TPr0. At time t5 when the fine adjustment time elapses from time t4 when the fine adjustment is started, the processing (fine adjustment) in step S36 is ended. Then, the process returns to step S33.

  The fine adjustment time is a time required for fine adjustment of the plate temperature. More specifically, the fine adjustment time is not limited to the time until the plate temperature reaches the set temperature after fine adjustment from the set temperature TPR0 before fine adjustment, but also until the plate temperature stabilizes at the set temperature after fine adjustment. Including time. The fine adjustment time is obtained in advance by experiments or the like.

  Incidentally, FIGS. 29A and 29B illustrate the following cases. As a result of the first measurement (time t3 to t4), the deviation width DF1 was larger than the threshold value. For this reason, fine adjustment was performed with the offset value OS1 (time t4 to t5). As a result of the second measurement (time t5 to t6), the deviation width DF2 was larger than the threshold value. For this reason, fine adjustment was performed by the offset value OS2 (time t6 to t7). As a result of the third measurement (time t7 to t8), the deviation width DF3 was less than or equal to the threshold value. For this reason, the test was terminated (time t8).

<Step S37> Has fine adjustment been made?
The temperature measurement unit 167 determines whether or not the fine adjustment has been performed at least once. If it is determined that fine adjustment has been performed, the process proceeds to step S38. Otherwise, the process proceeds to step S39.

<Step S38> Correction The set temperature TPr0 is corrected based on the offset value OS. As a result, the set temperature TPr0 is updated to the set temperature TPr1. Accordingly, the set temperature TPr1 is associated with the test temperature TWe, and the set temperature TPr1 is used for the subsequent control of the heat treatment plate PL.

<Step S39> Transfer the temperature measurement substrate to the transport section (time t8).
The heat treatment unit control unit 166 controls the elevating pins 105 and the like to deliver the temperature measurement substrate WT placed on the heat treatment plate PL to the transfer unit. Thereby, one test is completed.

  When another test with a different test temperature TWe is scheduled for the same heat treatment plate PL after time t8, the change of the plate temperature of the heat treatment plate PL is started. Incidentally, FIG. 29A shows a state in which the plate temperature is increased for another test from time t8 (that is, a state in which a new step S30 is started).

Effect of Step S3 (Test) The storage unit 93 stores test recipe information in advance, and the heat treatment unit control unit 166 executes the test while referring to the test recipe information, so that the test can be properly executed.

  Further, since the test recipe information is set in advance, the user only needs to input the heat treatment plate PL and the test temperature TWe into the input / output unit 95, and saves the trouble of inputting other test procedures (conditions). Can do. Therefore, the test can be performed easily and appropriately.

  Moreover, since the test recipe information includes each information regarding the change time, the waiting time, the measurement time, and the fine adjustment time, the test can be appropriately performed. Further, since these pieces of information are set for each of a plurality of temperature change conditions, the test can be performed more appropriately.

  Moreover, since the process of step S32 is provided, the process temperature of the temperature measurement substrate WT can be stabilized, and the process temperature can be appropriately measured.

  Moreover, since the process of step S34 is provided, the test regarding process temperature can be implemented suitably. In the present embodiment, in particular, a test relating to whether the total average value of the temperature data TD (that is, the in-plane average value of the processing temperature) is appropriate can be suitably performed.

  Moreover, since the test recipe information includes information on the threshold value of the deviation width, it can be accurately determined whether or not the total average value of the temperature data TD is appropriate.

  Moreover, since the process of step S35 is provided, it can avoid that a test takes a long time.

  Moreover, since the set temperature TPr0 is corrected by the offset value OS, the processing quality of the heat treatment plate PL can be automatically improved.

Modified Example of Step S3 (Test) The configuration of the test recipe information described above and the processes of steps S30 to S39 may be appropriately changed. Hereinafter, modified embodiments will be described.

(1) About test recipe information Although each information regarding the threshold value of deviation width and the upper limit value of the number of times of measurement has been set in advance in the test recipe information, it is not limited thereto. For example, you may change test recipe information so that these information may not be included. Or you may change so that a user can set and correct the threshold of deviation width, and the upper limit of the number of times of measurement.

(2) About the process of step S34 In the process of step S34, it was determined whether or not the deviation width DF is equal to or larger than the threshold value of the deviation width, but is not limited thereto. For example, it may be determined whether or not an index indicating the in-plane uniformity of the processing temperature (hereinafter referred to as “uniformity index”) is within a predetermined range. Examples of the uniformity index include statistics such as standard deviation of each temperature data TD. According to this, it can be suitably determined whether the in-plane uniformity of the processing temperature is appropriate.

  In this modification, the test recipe information may be changed to include information on the threshold value of the uniformity index or the tolerance range of the uniformity index.

(3) Correction of set temperature TPr0 Although the set temperature TPr0 is automatically corrected by the processes in steps S37 and S38, the present invention is not limited to this. For example, it may be changed so that the set temperature TPr0 is corrected only when the user gives an instruction to permit correction. Alternatively, the control unit 91 (temperature measurement unit 167) includes an automatic correction mode in which the set temperature TPr0 is automatically corrected, and a manual correction mode in which the user manually corrects the set temperature TPr0. You may change so that it may switch to either of correction | amendment modes suitably.

(4) Test recipe information In the test recipe information, the temperature change condition is a combination of the initial temperature range and the test temperature range, but is not limited thereto. For example, you may change into the combination of an initial temperature range and a plate setting temperature range.

(5) Temperature data TD and the like The temperature data TD generated by the temperature measurement unit 167 may be appropriately stored in the storage unit 93. Further, the total average value and the deviation width DF calculated by the temperature measurement unit 167 may be appropriately stored in the storage unit 93.

[4-4 Operation of S4 (analysis)]
FIG. 31 is a flowchart showing a detailed procedure of analysis.
As described above, in the measurement (step S33), the temperature measurement unit 167 generates the temperature data TD based on the detection signal obtained by the temperature measurement substrate WT placed on the heat treatment plate PL. The generated temperature data TD is sent from the temperature measurement unit 167 to the analysis processing unit 169.

  The analysis processing unit 169 performs a phenomenon determination process and an estimation process based on the temperature data TD. In the phenomenon determination process, it is determined whether or not a predetermined phenomenon has occurred. In the estimation process, the cause of the phenomenon determined to be occurring and a countermeasure for eliminating the cause are estimated. As shown in FIG. 31, the phenomenon determination process includes steps S401, S402, S411, S421, S431, and S432. The estimation process includes steps S402, S404, S412, S422, and S433. Hereinafter, processing of each step will be described.

<Step S401> Are all missing?
“All missing” means that there is no desired temperature data TD. In this embodiment, one temperature data TD should exist for each sensor unit SU. The analysis processing unit 169 determines whether or not at least one temperature data TD is missing. As a result, when it is determined that all of the temperature data is missing, it is determined that the temperature data TD of all missing is generated, and the process proceeds to step S402. Otherwise, it is determined that there is one temperature data TD for each sensor unit SU, and the process proceeds to step S403.

  Note that “all missing temperature data TD has occurred” and “one temperature data TD has existed for each sensor unit SU” are the phenomena determined in step S401. The same applies to other steps S403 included in the phenomenon determination process.

<Step S402> Cause 1, Countermeasure 1
The analysis processing unit 169 refers to the analysis information. The analysis information is information associated with each piece of information related to the phenomenon, the cause, and the countermeasure, although not shown. The analysis information is stored in advance in the storage unit 93. The analysis processing unit 169 extracts the cause 1 and the countermeasure 1 associated with the phenomenon that “all missing temperature data TD has occurred”. Then, the analysis processing unit 169 estimates that the phenomenon is caused by the extracted cause 1, and the analysis processing unit 169 estimates that the cause 1 can be eliminated by the extracted countermeasure 1.

  Hereinafter, cause 1 and countermeasure 1 specifically include the following matters.

Cause 1
A. Failure of temperature measurement substrate WT Failure of unit side antenna AU C.I. Failure of temperature measuring unit 167 Connection failure between unit side antenna AU and temperature measurement unit 167

Countermeasure 1
a. Inspection of temperature measurement substrate WT b. Inspection of unit side antenna AU c. Inspection of temperature measuring unit 167 d. Connection confirmation between unit side antenna AU and temperature measurement unit 167

  Thus, in the present specification, measures include work and inspections recommended or encouraged by the user, advice and comments useful to the user, and the like.

<Step S403> Partial missing?
“Partially missing” means that a part of the measured value included in the temperature data TD is missing. Alternatively, “partially missing” means that measured values included in the temperature data TD are missing at a certain rate or more. The analysis processing unit 169 determines whether or not at least one temperature data TD is partially missing. If it is determined that there is a partial defect, it is determined that the partially defective temperature data TD has been generated, and the process proceeds to step S404. Otherwise, it is determined that the temperature data TD has been acquired normally, and the estimation process regarding the defect is not executed.

<Step S404> Cause 2, countermeasure 2
The analysis processing unit 169 estimates the cause 2 of the phenomenon and the countermeasure 2 for eliminating the cause 2. Specifically, the following matters are estimated.

Cause 2
A. Failure of temperature measurement substrate WT Failure of unit side antenna AU C.I. Failure of temperature measuring unit 167 Connection failure between unit side antenna AU and temperature measurement unit 167

Measure 2
a. Inspection of temperature measurement substrate WT b. Inspection of unit side antenna AU c. Inspection of temperature measuring unit 167 d. Connection confirmation between unit side antenna AU and temperature measurement unit 167

  In the example described above, the items included in cause 2 are the same as the items included in cause 1, but are not limited thereto. That is, the contents of cause 2 and cause 1 may be different. The same applies to measures 1 and 2.

<Step S411> Is the temperature data outlier?
Temperature data TD whose value is significantly different from other temperature data TD is referred to as an outlier. Outliers are also referred to as “singularities”. The analysis processing unit 169 determines whether at least one of the temperature data TD is an outlier. At this time, the outlier may be detected by various tests such as a significant difference test. Further, an index indicating the relative variation of the individual temperature data TD with respect to all the temperature data TD (hereinafter referred to as “variation index”) is calculated, and the temperature data TD having an abnormal variation index is extracted as an outlier. Good. Examples of the variation index include a statistic such as a difference between the total average value and each temperature data TD and a deviation value (T Score) of each temperature data TD.

  If it is determined to be an outlier, it is determined that temperature data TD that is an outlier has occurred, and the process proceeds to step S412. Otherwise, it is determined that the temperature data TD as an outlier has not occurred, and the estimation process for the outlier is not executed.

<Step S412> Cause 3 and countermeasure 3
The analysis processing unit 169 estimates the cause 3 of the phenomenon and the countermeasure 3 for eliminating the cause 3. Specifically, the following matters are estimated.

Cause 3
E1. Fouling of heat treatment plate PL E2. Foreign matter adhering to heat treatment plate PL F1. Fouling of temperature measurement substrate WT F2. Foreign matter adhering to the temperature measurement substrate WT

Measure 3
e. Cleaning of heat treatment plate PL f. Cleaning the temperature measurement substrate WT

  Refer to FIG. FIG. 32A is a diagram schematically showing the foreign matter G1 adhering to the heat treatment plate PL, and FIG. 32B is a diagram schematically showing the foreign matter G2 adhering to the back surface of the temperature measurement substrate WT. .

  As shown in the figure, foreign substances G1 and G2 may adhere to at least one of the heat treatment plate PL and the temperature measurement substrate WT. Since both the foreign substances G1 and G2 hinder the transfer of heat from the heat treatment plate PL to the temperature measurement substrate WT, the temperature data TD at the position where the foreign substances G1 and G2 adhere is highly likely to be an outlier.

<Step S421> Abnormal value?
Temperature data TD that differs greatly from the test temperature TWe, which is the target value of the processing temperature, is called an abnormal value. The analysis processing unit 169 determines whether at least one of the temperature data TD is an abnormal value. At this time, the abnormal value may be detected by comparing each temperature data TD with a predetermined threshold value. Alternatively, an abnormal value may be detected by comparing the difference width df related to each temperature data TD with a predetermined threshold value with the difference between the one temperature data TD and the test temperature TWe as the difference width df. The deviation width df is illustrated in FIG.

  If it is determined to be an abnormal value, it is determined that temperature data TD that is an abnormal value has occurred, and the process proceeds to step S422. Otherwise, it is determined that temperature data TD that is an abnormal value has not occurred, and the estimation process for the abnormal value is not executed.

<Step S422> Cause 4 and countermeasure 4
The analysis processing unit 169 estimates the cause 4 of the phenomenon and the countermeasure 4 for eliminating the cause. Specifically, the following matters are estimated.

Cause 4
A. Failure of temperature measurement substrate WT Failure of unit side antenna AU C.I. Failure of temperature measuring unit 167 Connection failure between unit side antenna AU and temperature measurement unit 167

Measure 4
a. Inspection of temperature measurement substrate WT b. Inspection of unit side antenna AU c. Inspection of temperature measuring unit 167 d. Connection between unit side antenna AU and temperature measuring unit 167

<Step S431> Airflow?
The analysis processing unit 169 determines whether or not an airflow is forcibly formed above the heat treatment plate PL. At this time, the analysis processing unit 169 refers to the airflow forming equipment information and identifies the airflow forming equipment provided in association with the heat treatment plate PL that is the subject of the test (measurement).

  In the airflow forming facility information, information on the airflow forming facility is defined. The airflow forming equipment information is stored in the storage unit 93 in advance.

  FIG. 33 is a schematic diagram illustrating an example of airflow forming facility information. The airflow forming facility information shown in FIG. 33 is a table in which plate identification information is associated with each piece of information related to the upper exhaust pipe 121, the side air supply duct 123, and the side exhaust duct 125. In this table, information relating to the presence or absence of each airflow forming facility is defined for each heat treatment plate PL.

  For example, when it is specified that the upper exhaust pipe 121 is installed around the heat treatment plate PL, as shown in FIG. 7C, from the vicinity of the peripheral portion of the upper surface F of the heat treatment plate PL to the center portion of the upper surface F. It can be considered that an airflow rising upward is forcibly formed. Therefore, in this case, it is determined that an airflow is formed above the heat treatment plate PL.

  Further, when it is specified that at least one of the side air supply duct 123 and the side air exhaust duct 125 is installed around the heat treatment plate PL, as shown in FIGS. It can be considered that an airflow flowing in a substantially horizontal direction from one side to the other side is forcibly formed above the heat treatment plate PL. Therefore, also in this case, it is determined that an airflow is formed above the heat treatment plate PL.

  7A to 7C, it is determined that two airflows having different paths are forcibly formed above the heat treatment plate PL.

  On the other hand, when it is specified that no airflow forming facility is installed around the heat treatment plate PL, it can be considered that the airflow is not forcibly formed. Therefore, in this case, it is not determined that an airflow is formed above the heat treatment plate PL.

  If it is determined that it is forcibly formed, the process proceeds to step S432. Otherwise, it is determined that there is no relationship between the temperature distribution and the airflow (the temperature distribution was not affected by the airflow), and the estimation process regarding the relationship between the temperature distribution and the airflow is not performed. .

<Step S432> Relevance between temperature distribution and airflow?
The analysis processing unit 169 determines whether or not there is a relationship between the temperature distribution and the airflow. The temperature distribution is a distribution of the processing temperature at each position of the temperature measurement substrate WT, and shows the relationship between the temperature data TD and the measurement position.

  As a result of the determination, if it is determined that there is a relationship, it is determined that there is a relationship between the temperature distribution and the air flow, and the process proceeds to step S433. Otherwise, it is determined that there is no relationship between the temperature distribution and the airflow, and the estimation process regarding the relationship between the temperature distribution and the airflow is not executed.

  With reference to FIGS. 34 (a) and 34 (b), the determination relating to the relevance will be specifically described. FIG. 34A is a plan view of the temperature measurement substrate WT placed on the heat treatment plate PL, and FIG. 34B shows the temperature distribution in the x-axis direction.

  As shown in FIG. 34A, an airflow from the side air supply duct 123 toward the side air exhaust duct 125 is formed above the heat treatment plate PL. The direction of the airflow is substantially parallel to the x axis in plan view. More specifically, in FIG. 34A, the direction of the airflow is from the left side to the right side. In FIG. 34A, the right and left sides of the x-axis are indicated by “RIGHT” and “LEFT”, respectively.

  On the other hand, as shown in FIG. 34B, the temperature data TD changes along the x-axis direction. That is, the temperature gradient is substantially parallel to the x axis and substantially coincides with the direction of the airflow. More precisely, the temperature data TD increases from the left side to the right side in the x-axis direction.

  In this way, the direction of the airflow and the direction of the temperature gradient are specified, and when both are substantially the same, it is determined that there is a relationship between the temperature distribution and the airflow.

  Moreover, you may perform the determination regarding relevance by the following processes. That is, the surface of the temperature measurement substrate WT is divided into an upstream section JU exposed to the upstream air stream and a downstream section JD exposed to the downstream air stream. In FIG. 34A, the left portion of the temperature measurement substrate WT corresponds to the upstream area JU, and the right portion of the temperature measurement substrate WT corresponds to the downstream area JD.

  On the other hand, as shown in FIG. 34 (b), the temperature data TD in the upstream zone JU is lower than the temperature data TD in the downstream zone JD.

  Thus, when the temperature measurement substrate WT is divided into the upstream area JU and the downstream area JD, the temperature data TD of the upstream area JU is lower than the temperature data TD of the downstream area JD. It is determined that there is a relationship between distribution and airflow.

  Or you may perform the determination regarding a relationship by the following processes. That is, the temperature measurement substrate WT is divided into an upstream area JU and a downstream area JD. Here, assuming that the difference between the temperature data TD of 1 and the test temperature TWe, which is the target value of the processing temperature, is the deviation width df, as shown in FIG. 34 (b), the deviation width df in the upstream section JU is downstream. It is generally larger than the deviation width df in the side area JD.

  Thus, when the temperature measurement substrate WT is divided into the upstream area JU and the downstream area JD, when the deviation width df in the upstream area JU is larger than the deviation width df in the downstream area JD, It is determined that there is a relationship between the temperature distribution and the airflow.

  The above-described determination is performed for each airflow when a plurality of airflows are formed. Incidentally, in the case of the air flow formed by the upper exhaust pipe 121, the direction of the air flow is a direction from the peripheral edge of the upper surface F of the heat treatment plate PL (the surface of the temperature measurement substrate WT) toward the center. For this reason, the upstream section JU becomes a peripheral portion (ring shape) of the surface of the temperature measurement substrate WT, and the downstream section JD becomes a center portion (circular shape) of the surface of the temperature measurement substrate WT (FIG. 35A). )reference).

<Step S433> Cause 5 and countermeasure 5
The analysis processing unit 169 estimates the cause 5 of the phenomenon and the countermeasure 5 for eliminating the cause. Specifically, the following matters are estimated.

Possible cause 5
G1. Failure of upper exhaust pipe 121 G2. Abnormal flow rate in upper exhaust pipe 121 H1. Failure of side air supply duct 123 H2. Abnormal flow rate in side air supply duct 123 I1. Failure of side exhaust duct 125 I2. Abnormal flow rate in side exhaust duct 125

Measure 5 for recovery
g1. Inspection of upper exhaust pipe 121 g2. Confirmation of flow rate of upper exhaust pipe 121 h1. Inspection of side air supply duct 123 h2. Confirmation of flow rate of side air supply duct 123 j1. Inspection of side exhaust duct 125 j2. Check the flow rate of the side exhaust duct 125

  Note that g2, h2, and j2 may appropriately include “flow rate confirmation by the airflow monitoring facility” and “flow rate confirmation and flow rate change by the airflow adjustment facility” as appropriate. Specifically, for g2, the flow rate confirmation by the pressure gauge 122 may be included as appropriate. Further, j2 may include a flow rate confirmation and a flow rate change by the exhaust damper 126.

  Each process of step S401-, S411-, S421-, S431 mentioned above is performed in parallel with respect to the same measurement result. That is, one measurement result is analyzed from different viewpoints. As a result, multiple analysis results are obtained for one measurement result.

  Reference is made to FIGS. 35 (a) and 35 (b). FIG. 35A is a plan view of the temperature measurement substrate WT placed on the heat treatment plate PL, and FIG. 35B shows the temperature distribution of the temperature data TD in the x-axis direction.

  There is a case where it is determined that the one temperature data TDk shown in FIG. 35B is both an outlier and an abnormal value (steps S411 and S421). In this case, both causes 3 and 4 are estimated, and both measures 3 and 4 are estimated. Furthermore, it may be determined that there is a relationship between the temperature distribution illustrated in FIG. 35B and the air flow formed by the upper exhaust pipe 121 (step S432). In this case, cause 5 and countermeasure 5 are estimated together with causes 3 and 4.

  The process of step S431 corresponds to the airflow determination process in the present invention. The process of step S432 corresponds to the relevance determination process in the present invention.

[4-5 Operation of S5 (output)]
Next, the output (step S5) operation will be described.

  Please refer to FIG. The input / output unit 95 outputs the result of the test in step S3. For example, the total average value of the temperature data TD, the deviation width DF between the total average value and the test temperature TWe, and the like are displayed. The input / output unit 95 may display current temperature data TD of the temperature measurement substrate WT, an offset value OS, and the like. As the display mode, graphs, numbers, characters, and the like are appropriately adopted.

  Further, the input / output unit 95 outputs the progress status of the continuous test execution process in step S2. For example, the current position of the temperature measurement substrate WT, the current number of measurements, and the like are displayed.

  The input / output unit 95 outputs the analysis result in step S4. Specifically, a phenomenon determined to have occurred in the phenomenon determination process is displayed. Also, the cause and countermeasure estimated by the estimation process are displayed.

Effects of Step S4 (Analysis) and Step S5 (Output) Since the analysis of Step S4 includes a phenomenon determination process and an estimation process, not only the phenomenon that has occurred is determined, but also the cause and countermeasures for the phenomenon are accurately identified. Can be predicted.

  Since the information for analysis is referred to in the estimation process, the process of the estimation process can be suitably executed.

  Since step S4 includes the processing of steps S401 to S404, the cause and countermeasure can be accurately estimated for the phenomenon of occurrence of the missing temperature data TD. In addition, since the equipment where the cause and the countermeasure are hidden (that is, the location of the cause and the countermeasure) includes the temperature measurement substrate WT, the temperature measurement unit 167, and the unit side antenna AU, it can be estimated extensively and comprehensively. Therefore, accurate advice and treatment can be conveyed to the user.

  Since step S4 includes the processing of steps S411 and S412, the cause and countermeasure can be accurately estimated for the phenomenon of occurrence of temperature data TD as an outlier. Further, the location of the cause and the countermeasure can be estimated extensively and comprehensively because the location includes the temperature measurement substrate WT and the heat treatment plate PL. Therefore, accurate advice and treatment can be conveyed to the user.

  Since step S4 includes the processes of steps S421 and S422, the cause and countermeasure can be accurately estimated for the phenomenon of occurrence of abnormal temperature data TD. In addition, the location of the cause and countermeasure includes the temperature measurement substrate WT, the temperature measurement unit 167, and the unit side antenna AU, so that it can be estimated extensively and comprehensively. Therefore, accurate advice and treatment can be conveyed to the user.

  Since step S4 includes the processing of steps S431 to S433, the cause and countermeasure are accurately estimated for the phenomenon that there is a relationship between the temperature distribution and the airflow (the temperature distribution is affected by the airflow). it can. In addition, the location of the cause and countermeasure can be estimated extensively and comprehensively because it includes an airflow formation facility, an airflow monitoring facility, and an airflow adjustment facility. Therefore, accurate advice and treatment can be conveyed to the user.

  In the air flow determination process, since the air flow forming facility information is referred to, it can be suitably determined for each heat treatment plate PL whether or not the air flow is forcibly formed.

  Since the input / output unit 95 outputs information related to the determination result of the phenomenon determination process, the user can recognize the state of the substrate processing apparatus 1 in a timely manner. Further, since the input / output unit 95 outputs information related to the estimation result of the estimation process, the user can take appropriate measures promptly. Thereby, a user's initial action can be speeded up, a time loss can be reduced, and the fall of the operation rate of the substrate processing apparatus 1 can be suppressed.

  Further, since the input / output unit 95 outputs the test result in step S3, the user can appropriately recognize the test result.

  Furthermore, since the input / output unit 95 displays the progress of the continuous test execution process in step S2 in real time, the user can appropriately recognize the progress of the test.

Modified Example of Step S4 (Analysis) Each process of Steps S401 to S433 described above may be appropriately changed. Hereinafter, modified embodiments will be described.

(1) Phenomenon determination process Four phenomena (defects, outliers, abnormal values, relationship between temperature distribution and airflow) are illustrated as phenomena determined by the phenomenon determination process, but are not limited thereto. For example, a change may be made to determine at least one of the four phenomena. Moreover, you may change so that phenomena other than these four phenomena may be determined.

(2) About estimation process and information for analysis The estimation process estimated both the cause and the countermeasure, but is not limited to this. A change may be made to estimate either the cause or the countermeasure. Further, the analysis information is information in which each information regarding the phenomenon, the cause, and the countermeasure is associated, but is not limited thereto. For example, information relating to at least one of a cause and a countermeasure and information relating to development may be changed to analysis information associated with each other.

(3) About the estimation process In the process of step S402, all items A to D are estimated as the cause 1, but the present invention is not limited to this. For example, you may change so that a part of A thru | or D may be estimated as the cause 1. FIG. The same applies to the other steps S404, S412, S422, and S433.

(4) About the estimation process In the process of step S402, all items a to d are estimated as the countermeasure 1, but the present invention is not limited to this. For example, you may change so that a part of a thru | or d may be estimated as the countermeasure 1. FIG. The same applies to the other steps S404, S412, S422, and S433.

(5) Object of analysis Although the analysis of step S4 was made for all the temperature data TD obtained by the measurement (step S33), it is not limited to this. For example, the temperature data TD obtained by the measurement (step S33) may be changed to be a target.

  For example, step S4 (analysis) may be changed as follows. That is, step S4 (analysis) further includes a pass / fail determination process for determining whether or not the temperature data TD satisfies a predetermined standard, and the phenomenon determination is performed only when the pass / fail determination process determines that the standard is not satisfied. Process and estimation process may be performed. Here, as the predetermined reference, for example, the deviation width DF between the total average value and the test temperature TWe is equal to or less than a threshold value. As the threshold value, a threshold value of the deviation width defined in the test recipe information may be used. According to this, it is possible to efficiently analyze a phenomenon that needs to be promptly dealt with while suppressing the processing amount of the analysis processing unit 169.

(6) Phenomenon determination process The processing in the phenomenon determination process does not change depending on the type of the heat treatment plate PL, but is not limited thereto. That is, when the direction of heat transfer between the heat treatment plate PL and the gas around the heat treatment plate PL changes depending on the treatment temperature of the heat treatment plate PL, the process in the phenomenon determination process according to the treatment temperature of the heat treatment plate PL May be changed.

  For example, in the case where the heat treatment plate PL is installed in the heating / cooling unit PHP or the post-exposure heat treatment unit PEB (the former) and in the case where the heat treatment plate PL is installed in the cooling unit CP (the latter), step S411, You may change the process of step S421 and step S432.

  Specifically, regarding the process of step S411, in the former case, it is determined that the temperature data TD that is an outlier has occurred only when the temperature data TD that is an outlier is lower than the other temperature data TD. May be. In the latter case, it may be determined that the temperature data TD that is an outlier has occurred only when the temperature data TD that is an outlier is higher than the other temperature data TD.

  Regarding the process of step S421, in the former case, it may be determined that the temperature data TD that is an abnormal value has occurred only when the temperature data TD that is an abnormal value is lower than the test temperature TWe. In the latter case, it may be determined that the abnormal temperature data TD has occurred only when the abnormal temperature data TD is higher than the test temperature TWe.

  Regarding the process of step S432, in the former case, the direction of the air flow from the upstream side to the downstream side and the direction of the temperature gradient from the measurement position where the temperature data TD is low to the measurement position where the temperature data TD is high are substantially the same. It may be determined that there is a relationship between the temperature distribution and the airflow only when it is done. In the latter case, only when the direction of the air flow from the upstream side to the downstream side and the direction of the temperature gradient from the measurement position where the temperature data TD is high to the measurement position where the temperature data TD is low substantially coincide with each other, the temperature It may be determined that there is a relationship between the distribution and the airflow.

  Alternatively, with respect to the processing of step S421, in the former case, the relationship between the temperature distribution and the airflow is related only when the temperature data TD of the upstream section JU is higher than the temperature data TD of the downstream section JD. It may be determined that there was sex. In the latter case, it may be determined that there is a relationship between the temperature distribution and the airflow only when the temperature data TD of the upstream section JU is lower than the temperature data TD of the downstream section JD. .

(7) Phenomenon determination process The process in the phenomenon determination process does not change depending on the test temperature TWe determined in the test of step S33, but is not limited thereto. When the direction in which heat moves between the heat treatment plate PL and the gas around the heat treatment plate PL changes depending on the test temperature TWe, the process in the phenomenon determination process may be changed according to the test temperature TWe.

  For example, in a case where the test temperature TWe is higher than the ambient temperature around the heat treatment plate PL (the former) and a case where the test temperature TWe is lower than the ambient temperature around the heat treatment plate PL (the latter), step S411, You may change the process of step S421 and step S432. Specifically, it can be changed in the same manner as the modified embodiment (5).

(8) Number of tests The above-described step S4 (analysis) can analyze a plurality of test results (measurement results), but can also be suitably applied to the case of analyzing a single test result (measurement result). For example, even if the number of tests specified in the test schedule information is single, step S4 (analysis) can be executed without any trouble. The same applies to step 5 (output).

(9) About temperature distribution Although the one-dimensional temperature distribution was illustrated in the relevance determination process (step S432), it is not limited to this. It may be changed to a two-dimensional temperature distribution.

(10) Airflow forming facility, airflow monitoring facility, and airflow adjusting facility As the airflow forming facility, the upper exhaust pipe 121, the side air supply duct 123, the side exhaust duct 125, and the like are illustrated, but the present invention is not limited thereto. You may change into the appropriate installation which supplies gas in the chamber 117, and the appropriate installation which discharges | emits gas from the chamber 117. Moreover, you may change into the installation which stirs the gas in the chamber 117. FIG.

  Although the pressure gauge 122 was illustrated as an airflow monitoring equipment, it is not restricted to this. You may change into suitable apparatuses, such as a flowmeter and a flowmeter. Moreover, although the exhaust damper 126 was illustrated as an airflow control installation, it is not restricted to this. You may change into appropriate apparatuses, such as an on-off valve and a flow control valve.

[5. Modified Embodiment of Substrate Processing Apparatus 1]
(1) In the above-described embodiment, the substrate processing apparatus 1 includes the temperature measuring unit 167, the analysis processing unit 169, the input / output unit 95, and the like, but is not limited thereto. The temperature measurement unit 167, the analysis processing unit 169, the input / output unit 95, and the like may be installed outside the substrate processing apparatus 1.

  Refer to FIG. FIG. 36 is a diagram showing a schematic configuration of a substrate processing system according to a modified embodiment. In addition, about the same structure as an Example, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol. As illustrated, the substrate processing system includes a substrate processing apparatus 1, an analysis apparatus 171, and a measurement apparatus 181. The analysis device 171 and the measurement device 181 are each electrically connected to the substrate processing apparatus 1.

  The analysis device 171 includes an order setting unit 161, an analysis processing unit 169, an input / output unit 173, and a storage unit 175. The input / output unit 173 receives an instruction from the user and displays an analysis result. The storage unit 175 stores test list information, plate performance information, airflow forming facility information, and the like. The order setting unit 161 creates test schedule information with reference to a command input to the input / output unit 173 and information stored in the storage unit 175. Further, the analysis processing unit 169 analyzes the test result (measurement result) received from the substrate processing apparatus 1 with reference to the information stored in the storage unit 175. The analysis device 171 is realized by, for example, a personal computer.

  The substrate processing apparatus 1 performs a test according to the test schedule information received from the analysis apparatus 171. Then, the detection signal received by the unit side antenna AU is transmitted to the measuring device 181.

  The measurement device 181 includes a temperature measurement unit 167 and a storage unit 183. The storage unit 183 stores test recipe information, test schedule information, and the like. The temperature measuring unit 167 generates temperature data TD based on the detection signal received from the substrate processing apparatus 1 with reference to the test recipe information and the like. Then, the measuring device 181 transmits the generated temperature data TD to the substrate processing apparatus 1.

  Also with such a substrate processing system, the processing in steps S1 to S4 described above can be suitably executed.

  The analyzer 171 corresponds not only to the analyzer in the present invention but also to the test schedule creation device in the present invention.

  (2) In the above-described embodiment, the input / output unit 95 having both the input function and the output function is illustrated, but the present invention is not limited to this. For example, the input unit having only the input function and the input unit may be configured separately from each other and changed to an output unit having only the output function.

  (3) In the above-described embodiment, the two transport mechanisms TB1c and TB1d are installed in the upper layer K1, but the present invention is not limited to this. For example, the number of transport mechanisms in the upper layer K1 may be changed to one, or may be changed to three or more. The lower layer K2 may be similarly changed. In the above-described embodiment, the processing unit 13 is configured by the first processing block 14 and the second processing block 15, but is not limited thereto. For example, the processing unit 13 may be configured by one processing block. Alternatively, the processing unit 13 may be configured by three or more processing blocks.

  (4) In the above-described embodiments, the various liquid processing units 60 and 65 and the heat treatment unit HU are basically processing units (so-called “single-wafer processing units”) that process the substrates W one by one. However, it is not limited to this. For example, the processing unit may be changed to a processing unit (so-called “batch processing unit”) that processes a plurality of substrates W at once.

  (5) In the above-described embodiment, the process performed on the substrate W in the upper layer K1 and the process performed on the substrate W in the lower layer K2 are the same, but are not limited thereto. That is, the processing in the upper layer K1 and the processing in the lower layer K2 may be changed so as to be different from each other.

  (6) In the above-described embodiment, the series of processes is a process of forming a resist film or the like on the substrate W and developing the substrate W, but is not limited thereto. For example, the contents of a series of processes may be appropriately changed according to the substrate W to be processed.

  (7) In the above-described embodiment, as the heat treatment unit HU, the heating / cooling unit PHP, the cooling unit CP, and the post-exposure heat treatment unit PEB are exemplified, but not limited thereto. For example, the type of the heat treatment unit HU can be selected and changed as appropriate. For example, the heat treatment unit HU may be an adhesion processing unit AHL. The adhesion processing unit AHL performs heat treatment in a steam atmosphere of HMDS (hexamethylsilazane) in order to improve the adhesion between the substrate W and the coating.

  (8) In the embodiment described above, the number of hierarchies formed in the processing unit 13 is two, but is not limited thereto. That is, the number of layers formed in the processing unit 13 may be changed to 1, or may be changed to 3 or more.

  (9) You may change so that each structure of each Example mentioned above and each modification Example may be combined suitably.

1 ... Substrate processing equipment (test schedule creation equipment, analysis equipment)
11 ... Indexer part (ID part)
13 ... Processing unit 17 ... Interface unit (IF unit)
60 ... Application processing unit (liquid processing unit, processing unit)
65. Development processing unit (liquid processing unit, processing unit)
91: Control unit 93, 175, 183 ... Storage unit 95, 173 ... Input / output unit (output unit)
161: Order setting unit 163 ... Test execution unit 164 ... Transport control unit 165 ... Direction control unit 166 ... Heat treatment unit control unit 167 ... Temperature measurement unit 169 ... Analysis processing unit 121 ... Upper exhaust pipe (air flow forming equipment)
123 ... Side air supply duct (airflow forming equipment)
125 ... Side exhaust duct (airflow forming equipment)
122 ... Pressure gauge (airflow monitoring equipment)
126 ... Damper for exhaust (air flow control equipment)
171 ... Analyzer (test schedule creation device)
TA, TB1c, TB1d, TB2c, TB2d, TC1a, TC1b, TL ... transport unit H ... hand EEW ... edge exposure unit (processing unit)
MD: Adjustment mechanism HU: Heat treatment unit (treatment unit)
PL ... Heat treatment plate AU ... Unit side antenna C ... Carrier W ... Substrate WT ... Temperature measurement substrate SU ... Sensor unit AS ... Sensor side antenna BW ... Substrate body TD ... Temperature data TWe ... Test temperature DHa, DHb, DHc ... First Target direction ACa, ACb, ACc ... First direction variation amount IP1 ... Information on the position of the transfer unit when the transfer unit takes the temperature measurement substrate from the adjustment mechanism IP2, IP5, IP10 ... The transfer unit is used for temperature measurement on the heat treatment plate Information on the position of the transfer unit when the substrate is transferred IP3, IP4, IP6 to IP9, IP11 to IP13 ... Information about the position of each transfer mechanism when the temperature measurement substrate is transferred from one transfer mechanism to another transfer mechanism

Claims (18)

Create a test schedule to create test schedule information about multiple test schedules before performing multiple tests to measure the processing temperature using the heat treatment plate by changing at least one of the heat treatment plate and the test temperature that is the target value of the processing temperature. A method,
The first creation process of assigning the first order “first” to any test,
The second and subsequent creation processes for assigning the order after “second” to any unassigned test that has not yet been assigned an order,
With
A test schedule creation method for creating test schedule information by repeating the second and subsequent creation processes until all tests are assigned an order. In the test schedule preparation method according to claim 1,
The second and subsequent creation processes are
Timing estimation process for estimating an unassigned test that can be started earliest after the assigned test ends, assuming that all assigned tests that have already been assigned an order are performed,
A second and subsequent allocation process for allocating the next order to the unallocated test estimated by the timing estimation process;
Test schedule creation method with In the test schedule preparation method according to claim 2,
The timing estimation process is a test schedule creation method that calculates the timing at which each unassigned test can be started in consideration of the performance of each heat-treated plate. In the test schedule preparation method according to claim 2 or 3,
In the second and subsequent creation processes,
An estimation result determination process for determining whether or not a plurality of unassigned tests for different heat treatment plates are included in the estimation result of the timing estimation process;
If the estimation result determination process determines that it is included, the heat treatment plate with the largest remaining load of the heat treatment plate among the plurality of heat treatment plates subject to the unallocated test estimated by the timing estimation process An auxiliary estimation process for estimating
With
When the auxiliary estimation process estimates the heat treatment plate, the second and subsequent allocation processes are performed in the following order in the unassigned test for the heat treatment plate estimated by the auxiliary estimation process, regardless of the estimation result of the timing estimation process. Assign
The remaining burden amount is a numerical value representing the burden that the unallocated test gives to each heat treatment plate. The remaining number of unallocated tests for the heat treated plate, the change time required to change the plate temperature, and the temperature change of the plate temperature Test schedule creation method that is a numerical value based on at least one of the speeds. In the test schedule preparation method in any one of Claim 2 to 4,
In the second and subsequent creation processes,
Determine whether there is a different plate unassigned test, with the unassigned test that targets a heat-treated plate that is different from the heat-treated plate that is the subject of the assigned test assigned the most recent order as a different plate unassigned test Unassigned test determination process,
If the unassigned test determination process determines that it exists, the candidate limiting process for limiting the test candidates to be assigned the next order to the different plate unassigned test, and
With
When the candidate limiting process limits candidates, the timing estimation process is a test schedule creation method for estimating a test that can be started earliest among the limited candidates. In the test schedule preparation method according to claim 1,
The second and subsequent creation processes are
A remaining load estimation process for estimating a heat treated plate with the largest remaining load of the heat treatment plate;
A second and subsequent allocation process that assigns the next order to the unallocated test for the heat-treated plate estimated by the remaining burden estimation process;
With
The remaining burden amount is a numerical value representing the burden that the unallocated test gives to each heat treatment plate. The remaining number of unallocated tests for the heat treated plate, the change time required to change the plate temperature, and the temperature change of the plate temperature Test schedule creation method that is a numerical value based on at least one of the speeds. In the test schedule preparation method according to claim 6,
An estimation result determination process for determining whether or not two or more heat treatment plates are included in the estimation result of the remaining burden estimation process;
If the estimation result determination process determines that it is included, among the two or more heat treatment plates estimated by the remaining load amount estimation process, the auxiliary estimation for estimating the heat treatment plate with the largest auxiliary remaining load amount of the heat treatment plate Process,
With
When the auxiliary estimation process estimates heat-treated plates, the second and subsequent allocation processes follow the unallocated test for heat-treated plates estimated by the auxiliary estimation process, regardless of the estimation result of the remaining load estimation process. Assign the order of
Auxiliary remaining burden amount is a numerical value that represents the burden imposed on the heat treatment plate by the unassigned test. It is a numerical value based on at least one,
The basis for the supplemental remaining burden is a test schedule creation method that is different from the basis for the remaining burden. In the test schedule preparation method according to claim 6 or 7,
In the second and subsequent creation processes,
Determine whether there is a different plate unassigned test, with the unassigned test that targets a heat-treated plate that is different from the heat-treated plate that is the subject of the assigned test assigned the most recent order as a different plate unassigned test Unassigned test determination process,
If the unassigned test determination process determines that it exists, the candidate limiting process for limiting the test candidates to be assigned the next order to the different plate unassigned test, and
With
When the candidate limitation process limits candidates, the remaining load amount estimation process is a test schedule preparation method for estimating the heat treatment plate having the largest remaining load amount from the heat treatment plates to be subjected to the different plate unassigned test. In the test schedule preparation method in any one of Claim 6 to 8,
A test schedule creation method that shows at least one of a tendency that the remaining load amount increases as the remaining number increases, tends to increase as the change time increases, and tends to increase as the temperature change rate decreases. In the test schedule preparation method in any one of Claim 1 to 9,
The first creation process is
A burden comparison process for identifying the heat treatment plate with the largest initial burden of the heat treatment plate,
A first assignment process that assigns “first” to a test for a heat-treated plate identified by a burden comparison process;
With
The initial burden amount is a numerical value representing the burden imposed on each heat treatment plate by all tests, and is at least one of the number of tests on the heat treatment plate, the change time required to change the plate temperature, and the temperature change rate of the plate temperature. A test schedule creation method, which is a numerical value based on this. In the test schedule preparation method of Claim 10,
A specific result determination process for determining whether or not two or more heat treatment plates are included in the processing result of the burden comparison process;
If the identification result determination process determines that it is included, an auxiliary comparison process for identifying a heat treatment plate having the largest auxiliary initial burden amount of the heat treatment plate among the two or more heat treatment plates identified by the burden comparison process When,
With
When the auxiliary comparison process specifies a heat treatment plate, the first assignment process is “first” in the unassigned test for the heat treatment plate specified by the auxiliary comparison process, regardless of the processing result of the burden comparison process. Assign
The auxiliary initial burden amount is a numerical value that represents the burden imposed on the heat treatment plate by all tests, and is at least one of the number of tests on the heat treatment plate, the change time required to change the plate temperature, and the temperature change rate of the plate temperature. It is a numerical value based on
The basis for the supplementary burden is a test schedule creation method that is different from the foundation for the initial burden. In the test schedule preparation method according to claim 10 or 11,
A test schedule creation method that indicates at least one of a tendency that the initial burden amount increases as the number of tests increases, a tendency that increases as the change time increases, and a tendency that increases as the temperature change rate decreases. A test method for performing a test for measuring a processing temperature by a heat treatment plate by changing at least one of a heat treatment plate and a test temperature which is a target value of the processing temperature,
A test schedule creation process for creating test schedule information for multiple test schedules;
A test continuous execution process that actually performs a series of tests specified in the test schedule information created by the test schedule creation process,
With
The test schedule creation process
The first creation process of assigning the first order “first” to any test,
The second and subsequent creation processes for assigning the order after “second” to any unassigned test that has not yet been assigned an order,
With
A test method for creating test schedule information by repeating the second and subsequent creation processes until all tests are assigned an order. A test schedule creation device,
A storage unit for storing test list information in which a plurality of tests for measuring a processing temperature by the heat treatment plate are defined;
Before actually conducting the test, an order setting unit that creates test schedule information related to a plurality of test schedules specified in the test list information,
Test schedule creation device equipped with. In the test schedule preparation device according to claim 14,
The storage unit stores plate performance information in which information on the performance of the heat-treated plate is defined,
The order setting unit is a test schedule creation device that creates test schedule information with reference to plate performance information. The test schedule creation device according to claim 14 or 15,
A plurality of heat treatment plates;
A test execution unit that controls the heat treatment plate and performs a plurality of tests according to the test schedule information;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 16, wherein
A transport unit for transporting a temperature measurement substrate to a plurality of heat treatment plates;
With
The test execution unit is a substrate processing apparatus that controls the transfer unit to transfer the temperature measurement substrate to each heat treatment plate according to the test schedule information. The substrate processing apparatus according to claim 17, wherein
The transport unit carries out the temperature measurement substrate from the storage space for storing the temperature measurement substrate, and carries the temperature measurement substrate into the storage space.
The test execution unit controls the transport unit to carry out the temperature measurement board from the storage space before performing the test. When all the tests specified in the test schedule information are completed, the temperature measurement board is carried into the storage space. A substrate processing apparatus.

Images