JP2014229820A - Manufacturing method of wiring board and mold for manufacturing wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which improves a mold release property in the case of imprint, and a mold for manufacturing the wiring board.SOLUTION: In the mold, a rugged surface on which a wiring pattern to be transferred to an insulative resin covering a board is formed is covered by a first film which disappears at a predetermined temperature and the first film is covered by a second film which is residual at the predetermined temperature. A manufacturing method of the wiring board includes the steps of: mounting the mold on the insulative resin of the board; transferring the wiring pattern formed on the rugged surface to the insulative resin with the first film and the second film interposed therebetween; heating the mold transferring the wiring pattern to the insulative resin at the predetermined temperature or higher in such a manner that the first film disappears; and releasing the mold in which the first film is caused to disappear by the heating, from the insulative resin.

Description

  The present application relates to a method for manufacturing a wiring board and a mold for manufacturing a wiring board.

  In recent years, electronic devices have been reduced in size and functionality. Along with miniaturization and high functionality of electronic equipment, the wiring pattern of a wiring board on which electronic components are mounted has been increasingly miniaturized. With the miniaturization of the wiring pattern, the width of the wiring is becoming narrower, and it is becoming difficult to manufacture a wiring substrate with a fine pattern by a conventional manufacturing technique using photolithography.

  Therefore, in recent years, a technique for manufacturing a wiring board using an imprint that forms a desired wiring pattern by pressing a mold having fine irregularities against a resin material or the like has been proposed. According to the manufacturing technique using imprinting, the wiring pattern can be miniaturized at a lower cost than the manufacturing technique using photolithography. In the case of imprinting, a mold release agent is applied to the mold. As the mold release agent, for example, a substance using a sublimable substance having a high vapor pressure and sublimating under normal pressure is used. Has also been proposed (see, for example, Patent Document 1).

JP 2002-114584 A

  In order to manufacture a wiring board with a fine pattern by imprint technology, it is desired to realize an appropriate mold release. However, conventionally used mold release agents have a limit in the width of the wiring that does not affect the yield in the manufacturing process, and it is difficult to cope with further miniaturization of the wiring pattern.

  Then, this application makes it a subject to provide the manufacturing method of a wiring board which improves the mold release property in the case of imprint, and the type | mold for wiring board manufacture.

The present application discloses the following method for manufacturing a wiring board.
An uneven surface on which a wiring pattern to be transferred to an insulating resin covering the substrate is formed is covered with a first film that disappears at a predetermined temperature, and the first film is covered with a second film that remains at the predetermined temperature. Placing the mold sealed on the insulating resin of the substrate;
Transferring the wiring pattern formed on the uneven surface to the insulating resin with the first film and the second film interposed therebetween;
Heating the mold having the wiring pattern transferred to the insulating resin to a temperature equal to or higher than the predetermined temperature, and eliminating the first film;
And a step of releasing the mold from which the first film has disappeared by heating from the insulating resin.

Moreover, this application discloses the following molds for manufacturing a wiring board.
An uneven surface on which a wiring pattern to be transferred to an insulating resin covering the substrate is formed;
A first film covering the uneven surface and disappearing at a predetermined temperature;
A second film that covers the first film and remains at the predetermined temperature,
Mold for wiring board manufacturing.

  If it is the manufacturing method of the said wiring board and the type | mold for wiring board manufacture, the mold release property in the case of imprinting will improve.

FIG. 1 is an example of a diagram illustrating a flow of a method of manufacturing a wiring board according to the embodiment. FIG. 2 is an example of a diagram illustrating a mold used when executing the method of manufacturing the wiring board according to the embodiment. FIG. 3 is a graph showing the relationship between each step and the temperature profile in the method for manufacturing a wiring board according to the embodiment. FIG. 4A is an example of a diagram illustrating a process of placing a mold. FIG. 4B is an example of a diagram illustrating a process of transferring a wiring pattern. FIG. 4C is an example of the first diagram illustrating the step of releasing the mold. FIG. 4D is an example of a second diagram illustrating a step of releasing the mold. FIG. 4E is an example of a third diagram showing the step of releasing the mold. FIG. 5 is an example of a diagram showing a flow of a mold manufacturing method. FIG. 6A is an example of a diagram illustrating a process of forming a wiring pattern. FIG. 6B is an example of a diagram illustrating a process of forming a sealing member. FIG. 6C is an example of a diagram illustrating a process of forming the first film. FIG. 6D is an example of a diagram illustrating a process of peeling the protective film. FIG. 6E is an example of a diagram illustrating a process of forming the second film. FIG. 7 is an example of a diagram showing a flow of a method for manufacturing a wiring board according to the prior art. FIG. 8 is a diagram of a first example showing in detail the process of thermal imprinting according to the prior art. FIG. 9A is an example of a diagram showing a broken state of a mold generated by the thermal imprint process according to the first example. FIG. 9B is an example of a diagram illustrating pattern defects generated by the thermal imprint process according to the first example. FIG. 10 is a diagram of a second example showing in detail the process of thermal imprinting according to the prior art. FIG. 11 is a diagram of a third example showing in detail the process of thermal imprinting according to the prior art.

  Hereinafter, embodiments will be described. The embodiments described below are merely examples, and the technical scope of what is disclosed in the present application is not limited to the following modes.

  FIG. 1 is an example of a diagram illustrating a flow of a method of manufacturing a wiring board according to the embodiment. As shown in FIG. 1, the method for manufacturing a wiring board according to the present embodiment includes a step of placing a mold (S101), a step of transferring a wiring pattern (S102), and a step of releasing (S103). Hereinafter, the manufacturing method of the wiring board according to the embodiment will be described.

FIG. 2 is an example of a diagram showing a mold used when executing the method of manufacturing a wiring board according to the present embodiment. For example, the mold 1 includes an uneven surface 2 on which a wiring pattern to be transferred to an insulating resin covering a substrate is formed, a first film 3 that covers the uneven surface 2 and disappears at a predetermined temperature, and a first film 3. And a second film 4 that is sealed so as to remain at a predetermined temperature. The mold 1 is a sealing member that seals the first film 3 sandwiched between the concavo-convex surface 2 and the second film 4, and includes a first member along the edge of the first film 3. A sealing member 5 formed so as to surround the film 3 is provided.

  The predetermined temperature is a temperature at which the first film 3 becomes a gas, for example, a temperature at which the first film 3 is sublimated or vaporized. Moreover, the film | membrane which lose | disappears at predetermined temperature means what sublimates or vaporizes when it reaches predetermined temperature, and loses the form as a film | membrane. A film remaining at a predetermined temperature refers to a film that maintains its form as a film without sublimation or vaporization even when the temperature reaches a predetermined temperature. Sublimation is a phenomenon in which a phase changes from a solid to a gas without passing through a liquid.

  The insulating resin that covers the substrate is preferably a thermosetting resin that cures when heated. As a thermosetting resin applicable as an insulating resin, a thermosetting epoxy resin can be mentioned, for example. The sealing member 5 is a thermoplastic member that softens when heated and releases the sealing state of the first film 3 sandwiched between the uneven surface 2 and the second film 4. preferable. If the sealing member 5 is softened by heating and releases the sealed state, the disappearance of the first film 3 when the first film 3 is heated to a predetermined temperature is not inhibited. As a thermoplastic member applicable as the sealing member 5, for example, a thermoplastic resin such as polysulfone, polyarylate, polyethersulfone, polyphenylsulfone, or the like is applicable.

  FIG. 3 is a graph showing the relationship between each step and the temperature profile in the method for manufacturing a wiring board according to the present embodiment. For example, when fumaric acid is used as the material of the first film 3 that becomes a gas at a predetermined temperature, the predetermined temperature is about 200 ° C., which is the sublimation point of fumaric acid. Therefore, for example, when the first film 3 is formed of fumaric acid, the second film 4 is formed of a material that does not disappear even when the temperature reaches about 200 ° C. But the 1st film | membrane 3 is also a part which plays the role as a type | mold in formation of the wiring pattern formed in insulating resin. Therefore, in view of ensuring the accuracy of the wiring pattern, the first film 3 is preferably one that maintains a solid state during heating when the insulating resin is cured. For example, when fumaric acid is used as the material of the first film 3, the insulating resin covering the substrate is shaped so that the concave / convex surface 2 is shaped when the mold 1 is pressed so that the wiring pattern can be transferred by the concave / convex surface 2. Therefore, it is desired to be formed of a material that has a flexibility to be deformed according to the temperature and that cures before reaching about 200 ° C. The above-described thermosetting epoxy resin has a characteristic that it softens when it reaches about 130 ° C. and causes a curing reaction when it reaches about 180 ° C. Therefore, for example, when a thermosetting epoxy resin is used as the material of the insulating resin, the insulating resin can be cured before the first film 3 using fumaric acid disappears due to the temperature rise. It is possible to prevent the first film 3 from sublimating before the curing of the functional resin. In addition, as a raw material which does not lose | disappear even if it reaches about 200 degreeC which can be applied as a raw material of the 2nd film | membrane 4, the hard thin film formed with metals, such as copper, can be mentioned, for example.

  For example, when fumaric acid is used as the material of the first film 3, the insulating resin covering the substrate is shaped so that the concave / convex surface 2 is shaped when the mold 1 is pressed so that the wiring pattern can be transferred by the concave / convex surface 2. Therefore, it is desired to be formed of a material that has a flexibility to be deformed according to the temperature and that cures before reaching about 200 ° C. By the way, the above-described thermosetting epoxy resin has a characteristic that it softens when it reaches about 130 ° C. and causes a curing reaction when it reaches about 180 ° C. Therefore, for example, when a thermosetting epoxy resin is used as the material of the insulating resin, the insulating resin can be cured before the first film 3 using fumaric acid disappears due to the temperature rise.

Examples of materials that can be used as the material of the first film 3 include fumaric acid and sublimable materials such as trimethylamine hydrochloride, 3,4,5-trihydroxybenzoic acid, and hexamethylenetetramine. be able to. The sublimation point of trimethylamine hydrochloride is about 200 ° C., the sublimation point of 3,4,5-trihydroxybenzoic acid is about 210 ° C., and the sublimation point of hexamethylenetetramine is about 260 ° C. When using 5,5-trihydroxybenzoic acid or hexamethylenetetramine, the value of the predetermined temperature is raised.

  Further, the sealing member 5 allows the first film 3 to be released from the sealed state at a predetermined temperature, and is sealed so that the first film 3 does not disappear before the insulating resin is sufficiently cured. It is desirable to maintain the state. For example, when sublimable fumaric acid is used as the material for the first film 3 and the thermosetting epoxy resin is used as the material for the insulating resin, a thermoplastic resin sheet made of polysulfone is used as the material for the sealing member 5. Is preferred. In the case of polysulfone, since the glass transition temperature is about 190 ° C., the disappearance of the first film 3 before reaching the predetermined temperature can be prevented, and the disappearance of the first film 3 reaching the predetermined temperature can be prevented. There is no hindrance. Polyarylate has a glass transition temperature of about 193 ° C, polyethersulfone has a glass transition temperature of about 204 ° C, and polyphenylsulfone has a glass transition temperature of about 220 ° C. Therefore, when polyether sulfone or polyphenyl sulfone is used as the material for the sealing member 5, the value of the predetermined temperature is raised.

  FIG. 4A is an example of a diagram illustrating a process of placing a mold. When executing the method of manufacturing the wiring board according to the present embodiment, for example, the above-described mold 1 as shown in FIG. 2 is placed on the substrate 6 covered with the insulating resin 7.

  FIG. 4B is an example of a diagram illustrating a process of transferring a wiring pattern. After the mold 1 is placed on the substrate 6, the insulating resin 7 of the substrate 6 on which the mold 1 is placed is heated to soften the insulating resin 7 and pressurize the mold 1 to form the wiring formed on the uneven surface 2. The pattern is transferred to the insulating resin 7 with the first film 3 and the second film 4 interposed therebetween. The temperature of the insulating resin 7 when transferring the wiring pattern may be any temperature as long as the insulating resin 7 is softened. If the insulating resin 7 is, for example, a thermosetting epoxy resin, the temperature of the insulating resin 7 when transferring the wiring pattern is set to about 130 ° C. or higher.

  After the wiring pattern is transferred, the insulating resin 7 is further heated and cured. As described above, if the insulating resin 7 is, for example, a thermosetting epoxy resin, the insulating resin 7 to which the wiring pattern is transferred is cured by heating the insulating resin 7 to about 180 ° C. Can do.

  FIG. 4C is an example of the first diagram illustrating the step of releasing the mold. After the insulating resin 7 is cured, the sealing member 5 is heated to release the sealing state of the first film 3. As described above, if the sealing member 5 is, for example, polysulfone, the sealing member 5 can be softened by heating the sealing member 5 to about 190 ° C., which is the glass transition temperature of polysulfone. When the sealing member 5 is softened, the strength of the sealing structure that seals the first film 3 is lowered.

  FIG. 4D is an example of a second diagram illustrating a step of releasing the mold. Even after the sealing member 5 is softened, the heating is continued, and when the first film 3 reaches a predetermined temperature, the first film 3 starts to vaporize. When the first film 3 starts to vaporize, the sealing member 5 has already been softened, so that the expanded first film 3 pushes the sealing member 5 away. As a result, the first film 3 between the concave-convex surface 2 and the second film 4 diffuses away from the portion where the sealing member 5 was present and disappears, and serves as a film that covers the wiring pattern of the mold 1. Loses form. In addition, since the first film 3 expands in the process of disappearance, the mold 1 is deformed with respect to the substrate 6 by the force that the entire uneven surface 2 receives from the first film 3 when the first film 3 disappears. It floats while maintaining a generally parallel state.

  FIG. 4E is an example of a third diagram showing the step of releasing the mold. After the first film 3 disappears, the mold 1 is separated from the substrate 6 and the substrate 6 is cooled. Since the adhesive force between the mold 1 and the insulating resin 7 has already been lost due to the disappearance of the first film 3, the mold 1 can be smoothly pulled away from the substrate 6.

  The mold 1 used in the method for manufacturing a wiring board according to the embodiment can be manufactured by the following method, for example.

  FIG. 5 is an example of a diagram illustrating a flow of the manufacturing method of the mold 1. As shown in FIG. 5, the manufacturing method of the mold 1 includes a step (S201) of forming the concave / convex surface 2 of the wiring pattern, a step (S202) of forming the sealing member 5 and a step of forming the first film 3 ( S203) and a step of forming the second film 4 (S204). Hereinafter, a method for manufacturing the mold 1 will be described.

  FIG. 6A is an example of a diagram illustrating a process of forming a wiring pattern. In manufacturing the mold 1, first, a plate-shaped material is prepared. The material to be prepared may be any material, but is preferably a material having a hardness capable of transferring the wiring pattern to the insulating resin 7. Examples of the material having a hardness capable of transferring the wiring pattern to the insulating resin 7 include quartz, metal, hard resin, Si, and the like. Various processes are performed on the plate-shaped material to form the uneven surface 2 of the wiring pattern (S201).

  FIG. 6B is an example of a diagram illustrating a process of forming the sealing member 5. After the wiring pattern is formed, the sealing member 5 whose surface is covered with the protective film 8 is formed along the edge of the uneven surface 2 (S202). For example, when a thermoplastic resin sheet made of polysulfone is used as the sealing member 5, the sheet-like sealing member 5 is attached along the edge of the uneven surface 2.

  FIG. 6C is an example of a diagram illustrating a process of forming the first film 3. After forming the sealing member 5, the first film 3 is formed (S203). The first film 3 can be formed, for example, by vapor deposition. The first film 3 is formed so as to cover the uneven surface 2 of the mold 1.

  FIG. 6D is an example of a diagram illustrating a process of peeling the protective film 8. After the first film 3 is formed so as to cover the uneven surface 2 of the mold 1, the protective film 8 covering the surface of the sealing member 5 is peeled off.

  FIG. 6E is an example of a diagram illustrating a process of forming the second film 4. After the first film 3 is formed and the protective film 8 is further peeled off, the second film 4 is formed (S204). The second film 4 can be formed by sputtering, for example.

  FIG. 7 is an example of a diagram showing a flow of a method for manufacturing a wiring board according to the prior art. In the flow of the method for manufacturing a wiring board according to the prior art, as shown in FIG. 7, the insulating layer laminating step (S1), the thermal imprinting and temporary curing step (S2), the insulating layer roughening and the remaining film treatment are performed. There are a step (S3), a plating base film forming step (S4), a Cu plating step (S5), a planarization step (S6), and a main curing step (S7).

  In the flow of the method for manufacturing a wiring board according to the prior art, the following phenomenon may occur in the thermal imprint and temporary curing step (S2).

  FIG. 8 is a diagram of a first example showing in detail the process of thermal imprinting according to the prior art. In the first example, the mold 101 to which the release agent 109 is applied is placed on the substrate 106 covered with the insulating resin 107 (see FIG. 8A). After the mold 101 is placed on the substrate 106, the insulating resin 107 of the substrate 106 on which the mold 101 is placed is heated to soften the insulating resin 107, and the mold 101 is pressurized to form the wiring formed on the uneven surface 102. The pattern is transferred to the insulating resin 107 (see FIG. 8B). After the wiring pattern is transferred, the insulating resin 107 is further heated and thermoset. After the insulating resin 107 is thermally cured, the insulating resin 107 is cooled, and the mold 101 is separated from the substrate 106 to be released (see FIG. 8C).

  FIG. 9A is an example of a diagram showing a damaged state of the mold generated by the thermal imprint process according to the first example. According to the thermal imprinting process according to the first example, since the mold 101 is simply coated with the release agent 109, the adhesion between the mold 101 and the insulating resin 107 is increased. If the strength is exceeded, the mold 101 may be damaged. For example, when part or all of the surface of the mold 101 is rough, the rough portion exhibits an anchor effect, and the adhesion between the mold 101 and the insulating resin 107 increases. That is, the releasability is deteriorated due to the anchor effect, and the possibility that the mold 101 is damaged or a pattern defect is generated due to a release failure is increased. Note that the rough surface refers to a state in which the surface is rough, such as a sandblasted surface.

  FIG. 9B is an example of a diagram showing pattern defects generated by the thermal imprint process according to the first example. According to the thermal imprinting process according to the first example, since the mold 101 is simply coated with the release agent 109, the adhesion between the mold 101 and the insulating resin 107 is insulative. When the strength of the resin 107 is exceeded, a part of the insulating resin 107 is damaged, and the wiring pattern transferred to the insulating resin 107 may be damaged.

  In the case of the flow of the conventional method for manufacturing a wiring board, as described above, mold breakage or pattern defects may occur during mold release. The effects of mold breakage and pattern defects on product yield become more prominent as wiring becomes finer. Thus, it is desired to realize mold release that does not cause mold breakage or pattern defects. As a mold release that does not cause mold breakage or pattern defects, for example, a material that replaces the mold release agent 109 may be used. As a material that can replace the mold release agent 109, for example, sublimable fumaric acid used as the first film 3 of the mold 1 in the method for manufacturing a wiring board according to the above-described embodiment can be given. The replacement of the mold release agent 109 of the mold 101 with fumaric acid is intended to realize the thermal imprinting process as follows.

  FIG. 10 is a diagram of a second example showing in detail the process of thermal imprinting according to the prior art. In this second example, instead of the mold release agent 109, a mold 101 having an uneven surface 102 covered with a sublimable thin film 103 of fumaric acid is placed on a substrate 106 covered with an insulating resin 107 (FIG. 10A). reference). After the mold 101 is placed on the substrate 106, the insulating resin 107 of the substrate 106 on which the mold 101 is placed is heated to soften the insulating resin 107, and the mold 101 is pressurized to form the wiring formed on the uneven surface 102. The pattern is transferred to the insulating resin 107. After the wiring pattern is transferred, the insulating resin 107 is further heated and cured (see FIG. 10B). At the time of thermosetting, the sublimation thin film 103 is sublimated by further heating of the insulating resin 107 and disappears with volume expansion (see FIG. 10C). After the insulating resin 107 is thermally cured, the insulating resin 107 is cooled, and the mold 101 is separated from the substrate 106 to be released (see FIG. 10D).

  In the case of the thermal imprinting process according to the second example, since the sublimable thin film 103 that expands in volume by heating is used, mold damage and pattern defects do not occur as compared with the case where the mold release agent 109 is used. Conceivable. However, when the sublimable thin film 103 is used, the thermal imprint process is actually realized as follows.

FIG. 11 is a diagram of a third example showing in detail the process of thermal imprinting according to the prior art. In this third example, a mold 101 having an uneven surface 102 covered with a fumaric acid sublimable thin film 103 is placed on a substrate 106 covered with an insulating resin 107 (see FIG. 11A). After the mold 101 is placed on the substrate 106, the insulating resin 107 of the substrate 106 on which the mold 101 is placed is heated to soften the insulating resin 107, and the mold 101 is pressurized to form the wiring formed on the uneven surface 102. The pattern is transferred to the insulating resin 107. After the wiring pattern is transferred, the insulating resin 107 is further heated and thermally cured (see FIG. 11B). At the time of thermosetting, sublimation of the sublimable thin film 103 proceeds by further heating of the insulating resin 107, and volume expansion of the sublimable thin film 103 occurs. Then, although the sublimable thin film 103 starts to sublimate, there is nothing that seals the gap between the uneven surface 102 and the insulating resin 107, and the gap between the uneven surface 102 and the insulating resin 107 is opened. Therefore, the sublimable thin film 103 eventually disappears from the gap between the mold 101 and the insulating resin 107. When the sublimable thin film 103 disappears, the insulating resin 107 that is heated and thermoset is deformed and is in close contact with the uneven surface 102 of the mold 101 (see FIG. 11C). When the insulating resin 107 is cooled after the insulating resin 107 is thermally cured, the insulating resin 107 is in close contact with the mold 101, and therefore mold breakage and pattern defects may occur due to mold release ( (See FIG. 11D).

  On the other hand, in the method for manufacturing a wiring board according to the above-described embodiment, the mold 1 is removed after the first film 3 is removed by heating, so that the releasability is improved and the wiring pattern can be miniaturized. is there. In the method for manufacturing a wiring board according to the above-described embodiment, for example, even when a part or all of the surface of the mold 1 is rough, the mold 1 is removed after the first film 3 is removed by heating. Since it is removed, the rough portion does not exhibit the anchor effect. Therefore, the releasability is deteriorated due to the anchor effect, and the possibility of the breakage of the mold 1 and the occurrence of pattern defects due to the defective release is extremely low. As a result, the product quality can be improved and the mold life can be extended.

  In addition, since the first film 3 covering the uneven surface 2 is in a sealed state by the second film 4 and the sealing member 5, for example, a case where a sublimable material is employed as the first film 3. However, sublimation of the first film 3 is suppressed, and the first film 3 can be held in a sealed state in a solid state. Therefore, when the insulating resin 7 is heat-cured, the first film 3 may disappear before the first film 3 is completely cured, and the insulating resin 7 may adhere to the mold 1 via the second film 4. Is low.

  Moreover, since the type | mold 1 used for the manufacturing method of the wiring board which concerns on the said embodiment has sealed the 1st film | membrane 3 which covers the uneven surface 2 with the 2nd film | membrane 4 and the sealing member 5, for example, normal temperature It is also possible to use a material that can disappear even as a material for the first film 3, and there are many choices of the types of substances that can be used as the material for the first film 3.

  After transferring the wiring pattern of the mold 1 to the insulating resin 7 and forming the wiring pattern on the insulating resin 7, for example, by performing Cu plating or flattening treatment to fill the unevenness of the insulating resin 7. A wiring board in which wiring is formed on the substrate 6 can be completed. Moreover, the manufacturing method and type | mold 1 of the wiring board which concern on the said embodiment are not limited to said aspect, It can change or combine suitably. For example, the concavo-convex surface 2 is not limited to an aspect in which the concavo-convex surface is entirely formed, and the concavo-convex surface may be formed in a specific region of the concavo-convex surface 2. Further, the first film 3 and the second film 4 are not limited to those provided one by one, but may be provided, for example, in a plurality of layers.

In addition, the present application includes the following supplementary matters.
(Appendix 1)
An uneven surface on which a wiring pattern to be transferred to an insulating resin covering the substrate is formed is covered with a first film that disappears at a predetermined temperature, and the first film is covered with a second film that remains at the predetermined temperature. Placing the mold sealed on the insulating resin of the substrate;
Transferring the wiring pattern formed on the uneven surface to the insulating resin with the first film and the second film interposed therebetween;
Heating the mold having the wiring pattern transferred to the insulating resin to a temperature equal to or higher than the predetermined temperature, and eliminating the first film;
And a step of releasing the mold from which the first film has disappeared by heating from the insulating resin. (1, Fig. 1)
(Appendix 2)
The first film is a film formed of a sublimable material.
A method for manufacturing a wiring board according to appendix 1. (2)
(Appendix 3)
The predetermined temperature is a temperature at which the first film is vaporized.
A method for manufacturing a wiring board according to appendix 1 or 2. (3)
(Appendix 4)
The second film is a metal film,
The method for manufacturing a wiring board according to any one of appendices 1 to 3. (4)
(Appendix 5)
The mold further includes a sealing member that is formed of a thermoplastic material and seals a gap between the uneven surface and the second film.
The method for manufacturing a wiring board according to any one of appendices 1 to 4. (5)
(Appendix 6)
An uneven surface on which a wiring pattern to be transferred to an insulating resin covering the substrate is formed;
A first film covering the uneven surface and disappearing at a predetermined temperature;
Sealing to cover the first film, the second film remaining at the predetermined temperature,
Mold for wiring board manufacturing. (6, Fig. 2)
(Appendix 7)
The first film is a film formed of a sublimable material.
The mold for manufacturing a wiring board according to appendix 6.
(Appendix 8)
The predetermined temperature is a temperature at which the first film is vaporized.
The mold for manufacturing a wiring board according to appendix 6 or 7.
(Appendix 9)
The second film is a metal film,
The mold for manufacturing a wiring board according to any one of appendices 6 to 8.
(Appendix 10)
The mold further includes a sealing member that is formed of a thermoplastic material and seals a gap between the uneven surface and the second film.
The mold for manufacturing a wiring board according to any one of appendices 6 to 9.

1, 101... Mold; 2, 102.. Uneven surface; 3.. First film; 4. Insulating resin; 8 .... Protective film; 109 ... Release agent; 103 ... Sublimation thin film

Claims (6)

An uneven surface on which a wiring pattern to be transferred to an insulating resin covering the substrate is formed is covered with a first film that disappears at a predetermined temperature, and the first film is covered with a second film that remains at the predetermined temperature. Placing the mold sealed on the insulating resin of the substrate;
Transferring the wiring pattern formed on the uneven surface to the insulating resin with the first film and the second film interposed therebetween;
Heating the mold having the wiring pattern transferred to the insulating resin to a temperature equal to or higher than the predetermined temperature, and eliminating the first film;
And a step of releasing the mold from which the first film has disappeared by heating from the insulating resin. The first film is a film formed of a sublimable material.
The manufacturing method of the wiring board of Claim 1. The predetermined temperature is a temperature at which the first film is vaporized.
The manufacturing method of the wiring board of Claim 1 or 2. The second film is a metal film,
The manufacturing method of the wiring board as described in any one of Claim 1 to 3. The mold further includes a sealing member that is formed of a thermoplastic material and seals a gap between the uneven surface and the second film.
The manufacturing method of the wiring board as described in any one of Claim 1 to 4. An uneven surface on which a wiring pattern to be transferred to an insulating resin covering the substrate is formed;
A first film covering the uneven surface and disappearing at a predetermined temperature;
Sealing to cover the first film, the second film remaining at the predetermined temperature,
Mold for wiring board manufacturing.

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