JP2014229682A - Resin film for adhesive tape base material for semiconductor manufacturing step - Google Patents
Resin film for adhesive tape base material for semiconductor manufacturing step Download PDFInfo
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- JP2014229682A JP2014229682A JP2013106898A JP2013106898A JP2014229682A JP 2014229682 A JP2014229682 A JP 2014229682A JP 2013106898 A JP2013106898 A JP 2013106898A JP 2013106898 A JP2013106898 A JP 2013106898A JP 2014229682 A JP2014229682 A JP 2014229682A
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- 229920005989 resin Polymers 0.000 title claims abstract description 56
- 239000011347 resin Substances 0.000 title claims abstract description 56
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 title claims abstract description 22
- 238000010828 elution Methods 0.000 claims abstract description 25
- 229920002397 thermoplastic olefin Polymers 0.000 claims abstract description 18
- 239000012790 adhesive layer Substances 0.000 claims abstract description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 13
- 150000001336 alkenes Chemical class 0.000 claims description 12
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 12
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 11
- 238000005194 fractionation Methods 0.000 claims description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- 239000012968 metallocene catalyst Substances 0.000 claims description 4
- 229920006285 olefinic elastomer Polymers 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 16
- 238000012360 testing method Methods 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 11
- 229920001155 polypropylene Polymers 0.000 description 8
- -1 polypropylene Polymers 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000013508 migration Methods 0.000 description 6
- 230000005012 migration Effects 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Abstract
Description
本発明は半導体ウェハのバックグラインドやダイシング等の工程において使用される半導体製造工程用粘着テープの基材として用いられる樹脂フィルムに関し、さらに詳しくは、柔軟かつ粘着剤への悪影響を低減することができる半導体製造工程用粘着テープ基材用樹脂フィルム、及びそれを用いてなる半導体製造工程用粘着テープに関する。 The present invention relates to a resin film used as a base material for an adhesive tape for a semiconductor manufacturing process used in processes such as back grinding and dicing of a semiconductor wafer. More specifically, the present invention is flexible and can reduce adverse effects on an adhesive. The present invention relates to a resin film for a pressure-sensitive adhesive tape substrate for a semiconductor manufacturing process, and a pressure-sensitive adhesive tape for a semiconductor manufacturing process using the same.
半導体ウェハの製造工程において、ウェハの表面に回路パターンを形成した後にウェハ裏面を研磨して所定の厚さにするバックグラインドが行われている。この際、ウェハ表面に回路パターンを保護するための粘着テープを貼り付けて研磨する方法が行われている。 In a semiconductor wafer manufacturing process, back grinding is performed in which a circuit pattern is formed on the front surface of the wafer and then the back surface of the wafer is polished to a predetermined thickness. At this time, a method of affixing and polishing an adhesive tape for protecting a circuit pattern on the wafer surface is performed.
さらに、バックグラインド後の半導体ウェハを個々のチップに切断分離するダイシングが行われる。この際、ウェハを固定するために粘着テープを貼り付けて切断し、その後に粘着テープを放射状にエキスパンドして個々のチップをピックアップする方法が行われている。 Further, dicing for cutting and separating the semiconductor wafer after back grinding into individual chips is performed. At this time, in order to fix the wafer, an adhesive tape is attached and cut, and then the adhesive tape is radially expanded to pick up individual chips.
このような半導体ウェハは、近年の電子機器の小型化に伴い薄型化が進んでおり、ウェハの強度が低下しているため、製造工程において破損しやすくなっている。 Such semiconductor wafers are becoming thinner with the recent miniaturization of electronic devices, and the strength of the wafers is reduced, so that they are easily damaged in the manufacturing process.
このため、半導体ウェハへの負荷を軽減し破損を防止するために、バックグラインド用粘着テープやダイシング用粘着テープといった半導体製造工程用粘着テープは、より柔軟であることが求められている。 For this reason, in order to reduce the load on the semiconductor wafer and prevent breakage, the adhesive tape for semiconductor manufacturing processes such as the backgrinding adhesive tape and the dicing adhesive tape is required to be more flexible.
柔軟な半導体製造工程用粘着テープを得るため、オレフィン系熱可塑性エラストマー等を粘着テープの基材として用いる方法が知られている。 In order to obtain a flexible pressure-sensitive adhesive tape for semiconductor manufacturing processes, a method is known in which an olefinic thermoplastic elastomer or the like is used as the base material of the pressure-sensitive adhesive tape.
例えば、下記特許文献１には、基材フィルムの少なくとも片面に粘着剤層が設けられてなり、当該基材フィルムが、プロピレン並びにエチレンおよび／または炭素数４〜８のα−オレフィンを重合成分として含有し、かつ融解ピーク温度が１２０℃以上であるオレフィン系熱可塑性エラストマーを含有してなるダイシング用粘着シートが開示されている。 For example, in the following Patent Document 1, an adhesive layer is provided on at least one surface of a base film, and the base film is composed of propylene and ethylene and / or an α-olefin having 4 to 8 carbon atoms as a polymerization component. A dicing pressure-sensitive adhesive sheet containing an olefin-based thermoplastic elastomer containing and having a melting peak temperature of 120 ° C. or higher is disclosed.
また、下記特許文献２には、密度０．９１０〜０．９３５の直鎖状低密度ポリエチレンからなる層と、特定の融点、重量平均分子量（Ｍｗ）、及びクロス分別法による一定の範囲の組成を有するポリプロピレン系樹脂組成物からなる層を積層させた粘着テープ基材が開示されている。 Patent Document 2 below discloses a layer composed of linear low-density polyethylene having a density of 0.910 to 0.935, a specific melting point, a weight average molecular weight (Mw), and a composition within a certain range by a cross fractionation method. A pressure-sensitive adhesive tape base material in which layers made of a polypropylene resin composition having an adhesive layer are laminated is disclosed.
このような粘着テープの基材などの柔軟な樹脂フィルムの材料として用いられるオレフィン系熱可塑性エラストマーは一般的に低分子量成分を多く含んでおり、これによって柔軟性の効果を奏している場合が多い。
例えば、上記特許文献１に開示されたオレフィン系熱可塑性エラストマーは、クロス分別法により測定した０℃における樹脂溶出量が全溶出量に対し１０〜６０重量％のものであり、０℃における樹脂溶出量が小さくなると、オレフィン系熱可塑性エラストマーを成形して得られる基材フィルムが硬く、エキスパンド時の伸び性が悪くなるほか、ピックアップもし辛くなる傾向があるとされている。
Olefinic thermoplastic elastomers used as materials for flexible resin films such as the base material of such adhesive tapes generally contain a large amount of low molecular weight components, thereby often exhibiting a flexibility effect. .
For example, the olefinic thermoplastic elastomer disclosed in Patent Document 1 has a resin elution amount at 0 ° C. measured by a cross fractionation method of 10 to 60% by weight with respect to the total elution amount, and the resin elution at 0 ° C. It is said that when the amount is small, the base film obtained by molding the olefinic thermoplastic elastomer is hard, the extensibility at the time of expansion deteriorates, and the pick-up tends to be difficult.
また、特許文献２では、ポリプロピレン系樹脂組成物における０℃以上１０℃以下の樹脂溶出量が特定範囲以下であると、柔軟性に欠けるとされている。 Moreover, in patent document 2, it is said that it is lacking in a softness | flexibility that the resin elution amount of 0 degreeC or more and 10 degrees C or less in a polypropylene resin composition is below a specific range.
しかし、低温における樹脂溶出量が多い、すなわち低分子量成分が多いと柔軟性の効果は良好であるものの、このような成分が粘着剤層に移行することで粘着剤の凝集力を低下させ、離型紙および貼付対象への糊残りが発生する等の問題が生じることがわかった。 However, if the amount of resin elution at a low temperature is large, that is, if there are many low molecular weight components, the effect of flexibility is good.However, the migration of such components to the pressure-sensitive adhesive layer reduces the cohesive force of the pressure-sensitive adhesive, and the release. It was found that problems such as the occurrence of adhesive residue on the pattern paper and the object to be applied occurred.
本発明は上記のような従来技術に伴う問題を解決しようとするものであり、柔軟性を保持しつつも粘着剤層への低分子量成分の移行による不具合を低減させる半導体製造工程用粘着テープ基材用樹脂フィルムを提供することにある。 The present invention is intended to solve the problems associated with the prior art as described above, and is an adhesive tape base for a semiconductor manufacturing process that reduces defects due to migration of low molecular weight components to an adhesive layer while maintaining flexibility. It is providing the resin film for materials.
本発明は、以下の半導体製造工程用粘着テープ基材用樹脂フィルムである。
（１）クロス分別法により測定した０℃における樹脂溶出量が全溶出量に対して１０重量％未満、かつ６０℃における積算樹脂溶出量が５０重量％以下であるオレフィン系熱可塑性エラストマーを含有することを特徴とする半導体製造工程用粘着テープ基材用樹脂フィルム。
（２）前記オレフィン系熱可塑性エラストマーは、ハードセグメント部がメタロセン触媒を用いて重合させたエチレン／プロピレン共重合体ブロックであって、多段重合で得られるオレフィン系エラストマーである、（１）に記載の半導体製造工程用粘着テープ基材用樹脂フィルム。
（３）前記オレフィン系熱可塑性エラストマーを５０重量％以上含有していることを特徴とする（１）または（２）に記載の半導体製造工程用粘着テープ基材用樹脂フィルム。
（４）引張弾性率が３００ＭＰａ以下である（１）〜（３）のいずれか１項に記載の半導体製造工程用粘着テープ基材用樹脂フィルム。
This invention is the following resin films for adhesive tape base materials for semiconductor manufacturing processes.
(1) An olefin-based thermoplastic elastomer having a resin elution amount at 0 ° C. of less than 10% by weight measured by a cross fractionation method and an integrated resin elution amount at 60 ° C. of 50% by weight or less is contained. A resin film for a pressure-sensitive adhesive tape substrate for a semiconductor production process.
(2) The olefinic thermoplastic elastomer is an ethylene / propylene copolymer block whose hard segment is polymerized using a metallocene catalyst, and is an olefinic elastomer obtained by multistage polymerization. Resin film for adhesive tape substrate for semiconductor manufacturing process.
(3) The resin film for a pressure-sensitive adhesive tape substrate for a semiconductor production process as described in (1) or (2), wherein the olefinic thermoplastic elastomer is contained in an amount of 50% by weight or more.
(4) The resin film for adhesive tape base materials for semiconductor manufacturing processes of any one of (1)-(3) whose tensile elastic modulus is 300 MPa or less.
また本発明は、以下の半導体製造工程用粘着テープである。
（５）（１）〜（４）のいずれか１項に記載の樹脂フィルムの少なくとも片面側に、粘着剤層を積層してなる半導体製造工程用粘着テープ。
Moreover, this invention is the following adhesive tapes for semiconductor manufacturing processes.
(5) A pressure-sensitive adhesive tape for a semiconductor production process, wherein a pressure-sensitive adhesive layer is laminated on at least one side of the resin film according to any one of (1) to (4).
本発明によれば、粘着剤層への低分子量成分の移行による不具合を低減させつつも、十分な柔軟性および機械強度に優れ、さらには透明性にも優れた半導体製造工程用粘着テープ基材用樹脂フィルムを提供することが出来る。 ADVANTAGE OF THE INVENTION According to this invention, the adhesive tape base material for semiconductor manufacturing processes which was excellent in sufficient softness | flexibility and mechanical strength, and also excellent in transparency, reducing the malfunction by transfer of the low molecular weight component to an adhesive layer. Resin film can be provided.
［クロス分別溶出量］
本発明においては、前記オレフィン系熱可塑性エラストマーは、クロス分別法により積算樹脂溶出量が１００％となるまで測定した際の０℃における樹脂溶出量が全溶出量に対して１０重量％未満であることが重要である。より好ましくは８重量％未満、特に好ましくは６重量％未満である。
０℃での樹脂溶出量が全溶出量に対して１０重量％未満であれば、基材層から粘着剤層への低分子量成分の移行により発生する粘着力の低下を抑制することができる。さらに、低分子量成分の移行によって粘着剤の凝集力が低下することを防止でき、離型紙および貼付対象への糊残りが発生するといった不具合を抑制することができる。
[Cross fraction elution volume]
In the present invention, the olefinic thermoplastic elastomer has a resin elution amount at 0 ° C. of less than 10% by weight based on the total elution amount when measured until the total resin elution amount becomes 100% by the cross fractionation method. This is very important. More preferably, it is less than 8 weight%, Most preferably, it is less than 6 weight%.
When the resin elution amount at 0 ° C. is less than 10% by weight with respect to the total elution amount, it is possible to suppress a decrease in the adhesive force generated by the migration of the low molecular weight component from the base material layer to the adhesive layer. Furthermore, it is possible to prevent the cohesive force of the pressure-sensitive adhesive from being lowered due to the migration of the low molecular weight component, and it is possible to suppress problems such as the occurrence of adhesive residue on the release paper and the pasting target.
さらに、本発明においては、オレフィン系熱可塑性エラストマーの６０℃における積算樹脂溶出量が５０重量％以下であることが重要である。ここで、６０℃における積算樹脂溶出量とは、０℃から６０℃までの樹脂溶出量の積算値である。
６０℃における積算樹脂溶出量が５０重量％以下とすることにより、主に夏季において高温になると想定される、倉庫やコンテナ内の温度における樹脂溶出量を上記の範囲内とすることによって、長期の在庫や輸送等に耐えうる、実用的な半導体製造工程用粘着テープ基材用樹脂フィルムを得ることができる。
６０℃における積算樹脂溶出量が５０重量％を超えるオレフィン系熱可塑性エラストマーを半導体製造工程用粘着テープの基材として用いると、高温下において粘着剤層へ移行する低分子量成分が多くなるため、倉庫やコンテナでの保管や輸送中に粘着剤の凝集力が低下し、離型紙および貼付対象への糊残り等のおそれがある。
Furthermore, in the present invention, it is important that the total resin elution amount at 60 ° C. of the olefinic thermoplastic elastomer is 50% by weight or less. Here, the integrated resin elution amount at 60 ° C. is an integrated value of the resin elution amount from 0 ° C. to 60 ° C.
By setting the integrated resin elution amount at 60 ° C. to 50% by weight or less, the resin elution amount at the temperature in the warehouse or container is assumed to be high mainly in the summer, so that the long-term A practical resin film for a pressure-sensitive adhesive tape substrate for a semiconductor manufacturing process that can withstand inventory, transportation, and the like can be obtained.
When an olefin-based thermoplastic elastomer with an integrated resin elution amount at 60 ° C. exceeding 50% by weight is used as the base material of the pressure-sensitive adhesive tape for semiconductor manufacturing processes, the amount of low molecular weight components transferred to the pressure-sensitive adhesive layer increases at high temperatures. In addition, the cohesive force of the adhesive decreases during storage and transportation in containers, and there is a risk of adhesive residue remaining on the release paper and sticking target.
［オレフィン系熱可塑性エラストマー］
前記オレフィン系熱可塑性エラストマーは、ハードセグメント部がメタロセン触媒を用いて重合させたエチレン／プロピレン共重合体ブロックであって、多段重合で得られるオレフィン系熱可塑性エラストマーである。メタロセン触媒を用いて多段重合することにより、低分子量成分の生成を抑えつつ軟質ブロック（ソフトセグメント）を生成することが可能となるため、半導体工程用粘着テープの基材フィルムとして製膜した際に、粘着剤への低分子量成分の移行による不具合を抑えつつも半導体製造工程用として十分な柔軟性を持つ基材フィルムを得ることができる。
[Olefinic thermoplastic elastomer]
The olefinic thermoplastic elastomer is an ethylene / propylene copolymer block having a hard segment polymerized using a metallocene catalyst, and is an olefinic thermoplastic elastomer obtained by multistage polymerization. Multi-stage polymerization using a metallocene catalyst makes it possible to produce a soft block (soft segment) while suppressing the production of low molecular weight components, so when forming a film as a base film for an adhesive tape for semiconductor processes Thus, it is possible to obtain a base film having sufficient flexibility for a semiconductor manufacturing process while suppressing problems caused by the migration of the low molecular weight component to the pressure-sensitive adhesive.
［他の成分］
本発明の半導体製造工程用粘着テープ基材用樹脂フィルムは、前記オレフィン系熱可塑性エラストマーの他に、必要に応じて他の樹脂や各種添加剤を含有することができる。このような樹脂としては、ポリプロピレンやポリエチレン等のポリオレフィン、ポリエチレンテレフタレートやポリブチレンテレフタレート等のポリエステル、ポリ塩化ビニル、ポリウレタン、ポリアミド、エチレン・ビニルアルコール共重合体、オレフィン系エラストマー、スチレン系エラストマーなどが挙げられる。また、添加剤としては、例えば、熱安定剤、酸化防止剤、紫外線吸収剤、滑剤、アンチブロッキング剤及び着色剤等が挙げられる。
[Other ingredients]
The resin film for a pressure-sensitive adhesive tape substrate for a semiconductor production process of the present invention can contain other resins and various additives as necessary in addition to the olefin-based thermoplastic elastomer. Examples of such resins include polyolefins such as polypropylene and polyethylene, polyesters such as polyethylene terephthalate and polybutylene terephthalate, polyvinyl chloride, polyurethane, polyamide, ethylene / vinyl alcohol copolymer, olefin elastomer, and styrene elastomer. It is done. Moreover, as an additive, a heat stabilizer, antioxidant, a ultraviolet absorber, a lubricant, an antiblocking agent, a coloring agent etc. are mentioned, for example.
本発明の半導体製造工程用粘着テープ基材用樹脂フィルムにおける前記オレフィン系熱可塑性エラストマーの含有量は５０重量％以上であることが好ましい。より好ましくは７０重量％以上である。オレフィン系熱可塑性エラストマーの含有量を５０重量％以上とすることにより、オレフィン系熱可塑性エラストマーの優れた特徴を活かしたフィルム設計ができ、柔軟性や透明性の点で有利な半導体製造工程用粘着テープ基材用樹脂フィルムとすることができる。 It is preferable that content of the said olefin type thermoplastic elastomer in the resin film for adhesive tape base materials for semiconductor manufacturing processes of this invention is 50 weight% or more. More preferably, it is 70 weight% or more. By making the content of the olefinic thermoplastic elastomer 50% by weight or more, it is possible to design a film that takes advantage of the excellent characteristics of the olefinic thermoplastic elastomer, and it is advantageous for semiconductor manufacturing processes in terms of flexibility and transparency. It can be set as the resin film for tape base materials.
［基材の層構成］
本発明の半導体製造工程用粘着テープ基材用樹脂フィルムは、単層フィルムでも多層フィルムでもよい。
多層フィルムとする場合は、少なくとも１層が前記オレフィン系熱可塑性エラストマーを５０重量％以上用いていればよく、表裏層からなる２種２層の積層フィルムおよび／または表裏層と中間層からなる２種３層の積層フィルムとすることもできる。
[Layer structure of substrate]
The resin film for an adhesive tape substrate for a semiconductor production process of the present invention may be a single layer film or a multilayer film.
In the case of a multilayer film, it is sufficient that at least one layer uses 50% by weight or more of the olefinic thermoplastic elastomer, and two types and two layers of laminated films composed of front and back layers and / or 2 composed of front and back layers and an intermediate layer. It can also be set as a seed 3 layer laminated film.
［フィルムの厚み］
本発明の好ましい態様においては、半導体製造工程用粘着テープ基材用樹脂フィルムの厚みは、０．０３〜０．５ｍｍであり、更に好ましくは、０．０５〜０．３ｍｍである。上記の特定値の範囲であれば、柔軟性を保持しつつも半導体製造工程用粘着テープの基材として十分な強度を保ち、また成形加工性にも優れる。
[Film thickness]
In the preferable aspect of this invention, the thickness of the resin film for adhesive tape base materials for semiconductor manufacturing processes is 0.03-0.5 mm, More preferably, it is 0.05-0.3 mm. If it is the range of said specific value, while maintaining a softness | flexibility, sufficient intensity | strength as a base material of the adhesive tape for semiconductor manufacturing processes is maintained, and it is excellent also in moldability.
［引張弾性率］
本発明の好ましい態様においては、該半導体製造工程用粘着テープ基材用樹脂フィルムの引張弾性率は３００ＭＰａ以下である。より好ましくは２５０ＭＰａ以下である。
当該粘着テープ基材用樹脂フィルムの引張弾性率が３００ＭＰａ以下であれば、柔軟性が必要とされる半導体の製造工程において好適に用いることができる。例えば、ウェハ表面のパターン面への追従性が良い、ダイシング工程においてエキスパンド性に優れる等の利点が挙げられる。
[Tensile modulus]
In the preferable aspect of this invention, the tensile elasticity modulus of this resin film for adhesive tape base materials for semiconductor manufacturing processes is 300 Mpa or less. More preferably, it is 250 MPa or less.
If the tensile elastic modulus of the adhesive tape substrate resin film is 300 MPa or less, it can be suitably used in a semiconductor manufacturing process that requires flexibility. For example, there are advantages such as good followability of the wafer surface to the pattern surface and excellent expandability in the dicing process.
［基材の製法］
前記半導体製造工程用粘着テープ基材用樹脂フィルムを製造する方法としては、Ｔダイ押出し成形法等の押出し成形法、インフレーション成形法及びカレンダー成形法等の一般的なポリオレフィン系樹脂フィルムの成形方法が用いられるが、特に本発明においては押出し成形法が適している。尚、押出し成形の際の樹脂組成物のメルトフローレートは、１〜２０ｇ／１０分、好ましくは、５〜１５ｇ／１０分である。樹脂組成物のメルトフローレートが１ｇ／１０分以上であれば溶融粘度が高くなり過ぎることがなく押出加工性が良好であり、２０ｇ／１０分以下であれば溶融粘度が低くなり過ぎることがなく流動性が良好で加工性に優れる。
[Manufacturing method of substrate]
As a method for producing the resin film for the adhesive tape base material for the semiconductor production process, there is a general polyolefin resin film molding method such as an extrusion molding method such as a T-die extrusion molding method, an inflation molding method or a calender molding method. Although used, the extrusion method is particularly suitable in the present invention. The melt flow rate of the resin composition during extrusion molding is 1 to 20 g / 10 minutes, preferably 5 to 15 g / 10 minutes. If the melt flow rate of the resin composition is 1 g / 10 min or more, the melt viscosity will not be too high and the extrusion processability will be good, and if it is 20 g / 10 min or less, the melt viscosity will not be too low. Excellent fluidity and processability.
［粘着剤層］
本発明の半導体製造工程用粘着テープは、本発明で得られる単層または多層フィルムからなる粘着テープ用基材フィルムが少なくとも１層含まれていればよく、粘着剤層として用いられる粘着剤は特に限定されないが、例えば、天然ゴム系樹脂、アクリル系樹脂、スチレン系樹脂、シリコーン系樹脂、ポリビニルエーテル系樹脂等の各種粘着剤が用いられる。
[Adhesive layer]
The pressure-sensitive adhesive tape for semiconductor production process of the present invention only needs to contain at least one base film for pressure-sensitive adhesive tapes composed of a single layer or a multilayer film obtained in the present invention. Although not limited, For example, various adhesives, such as a natural rubber resin, an acrylic resin, a styrene resin, a silicone resin, a polyvinyl ether resin, are used.
前記基材フィルムの少なくとも片面側は、プラズマ処理やコロナ処理、オゾン処理および火炎処理等の方法により表面処理されてもよい。また、基材フィルムと粘着層の間には、必要によりプライマー層を設けてもよい。また、本発明の目的を損なわない限り、粘着テープの粘着層が設けられた側の反対面に更に樹脂層を設けても良い。 At least one side of the base film may be surface-treated by a method such as plasma treatment, corona treatment, ozone treatment, or flame treatment. Moreover, you may provide a primer layer between a base film and an adhesion layer if needed. Moreover, as long as the object of the present invention is not impaired, a resin layer may be further provided on the opposite surface of the adhesive tape on the side where the adhesive layer is provided.
［用途］
本発明の半導体製造工程用粘着テープは、用途としては特に限定されないが、例えば、ダイシングテープ、バックグラインドテープ等に好適に用いられる。
[Usage]
Although the adhesive tape for semiconductor manufacturing processes of this invention is not specifically limited as a use, For example, it is used suitably for a dicing tape, a back grind tape, etc.
以下、本発明の実施形態を実施例を用いて詳述するが、本発明はその要旨を越えない限り、以下の実施例に限定されるものではない。 Embodiments of the present invention will be described in detail below with reference to examples. However, the present invention is not limited to the following examples unless it exceeds the gist.
＜実施例１＞
オレフィン系熱可塑性エラストマーＡ（日本ポリプロ社製オレフィン系熱可塑性エラストマー「ウェルネクスＲＦＸ４Ｖ」）を、東芝機械製単軸押出機（５０φｍｍ、Ｌ／Ｄ＝３２）のホッパーに投入し、押出機温度をＣ１：２１０℃、Ｃ２：２３０℃、Ｃ３：２３０℃、Ｃ４：２３０℃、Ｃ５：２３０℃のように設定し、５５０ｍｍ幅Ｔダイ（温度設定：２３０℃、リップ開度０．３ｍｍ）から押出した。押出された溶融樹脂は、冷却ロールを備えた巻き取り機（冷却ロール７００ｍｍ幅×φ３５０ｍｍ、ロール温度３０℃）にて冷却固化、コロナ放電処理を施し厚み０．０８ｍｍの基材フィルムを得た。
<Example 1>
Olefin-based thermoplastic elastomer A (Olefin-based thermoplastic elastomer “Wellnex RFX4V” manufactured by Nippon Polypro Co., Ltd.) is charged into the hopper of a single-screw extruder (50φ mm, L / D = 32) manufactured by Toshiba Machine, and the extruder temperature is set to C1. : 210 ° C, C2: 230 ° C, C3: 230 ° C, C4: 230 ° C, C5: 230 ° C, and extruded from a 550 mm wide T-die (temperature setting: 230 ° C, lip opening 0.3 mm) . The extruded molten resin was cooled and solidified with a winder equipped with a cooling roll (cooling roll 700 mm width × φ350 mm, roll temperature 30 ° C.) and subjected to corona discharge treatment to obtain a base film having a thickness of 0.08 mm.
＜実施例２＞
実施例１で用いたオレフィン系熱可塑性エラストマーＡとポリプロピレン（日本ポリプロ社製「ウィンテックＷＦＷ４」）を前者：後者（重量比）＝８０：２０の割合でドライブレンドし、実施例１と同条件で製膜し厚み０．０８ｍｍの基材フィルムを得た。
<Example 2>
The olefin-based thermoplastic elastomer A and polypropylene ("Wintech WFW4" manufactured by Nippon Polypro Co., Ltd.) used in Example 1 were dry blended at a ratio of the former: latter (weight ratio) = 80:20, and the same conditions as in Example 1 And a base film having a thickness of 0.08 mm was obtained.
＜実施例３＞
実施例１で用いたオレフィン系熱可塑性エラストマーＡとポリプロピレン（日本ポリプロ社製「ウィンテックＷＦＷ４」）を前者：後者（重量比）＝６０：４０の割合でドライブレンドし、実施例１と同条件で製膜し厚み０．０８ｍｍの基材フィルムを得た。
<Example 3>
The olefinic thermoplastic elastomer A and polypropylene ("Wintech WFW4" manufactured by Nippon Polypro Co., Ltd.) used in Example 1 were dry blended at a ratio of the former: latter (weight ratio) = 60:40, and the same conditions as in Example 1 And a base film having a thickness of 0.08 mm was obtained.
＜比較例１＞
オレフィン系熱可塑性エラストマーＢ（サンアロマー社製「キャタロイＣ２００Ｆ」）を実施例１と同条件で製膜し厚み０．０８ｍｍの基材フィルムを得た。
<Comparative Example 1>
Olefin-based thermoplastic elastomer B (“Cataloy C200F” manufactured by Sun Allomer Co., Ltd.) was formed under the same conditions as in Example 1 to obtain a base film having a thickness of 0.08 mm.
得られた各フィルムについて、以下の評価項目について評価を行った。 About each obtained film, the following evaluation items were evaluated.
＜凝集力の経時評価＞
粘着剤への低分子量成分の移行による凝集力の低下を評価するため、下記の通り保持力試験を実施した。作製したフィルムから試験片（寸法：長さ１２５ｍｍ、幅５０ｍｍ）を採取し、アクリル系粘着剤転写テープ（３Ｍ製 Ｆ−９４６０ＰＣ 、厚さ０．０５ｍｍ）を試験片の片側全面に転写して試験用粘着テープを作製した。作製した試験用粘着テープを６０℃下にて１週間加熱養生し、厚さ０．１ｍｍのＰＥＴフィルムを裏打ちして補強した試験用粘着テープを試験板（ＳＵＳ３０４鋼板、長さ１２５ｍｍ、幅５０ｍｍ、厚さ２ｍｍ）に貼付面積が１２ｍｍ×１２ｍｍとなるよう十分に接着した。接着した試験板を４０℃で３０分間放置した後、試験用粘着テープが鉛直に垂れ下がるように固定し、４０℃下で試験用粘着テープに１ｋｇの荷重をかけ、試験用粘着テープが試験板から落下するまでの時間を測定した。
測定結果を表２に示した。
<Aging evaluation of cohesive force>
In order to evaluate the decrease in the cohesive force due to the migration of the low molecular weight component to the pressure-sensitive adhesive, a holding force test was performed as follows. Test specimens (dimensions: length 125 mm, width 50 mm) were collected from the prepared film, and an acrylic adhesive transfer tape (3M F-9460PC, thickness 0.05 mm) was transferred to the entire surface of one side of the test specimen. An adhesive tape was prepared. The prepared test adhesive tape was heated and cured at 60 ° C. for one week, and a test adhesive tape reinforced with a 0.1 mm thick PET film was reinforced with a test plate (SUS304 steel plate, length 125 mm, width 50 mm, 2 mm thick) was sufficiently bonded so that the pasting area was 12 mm × 12 mm. After the bonded test plate is left at 40 ° C. for 30 minutes, the test pressure-sensitive adhesive tape is fixed so as to hang vertically, a load of 1 kg is applied to the test pressure-sensitive adhesive tape at 40 ° C., and the test pressure-sensitive adhesive tape is removed from the test plate. The time to fall was measured.
The measurement results are shown in Table 2.
＜柔軟性＞
柔軟性を評価するため、ＪＩＳ Ｋ ７１２７に従い、フィルムから採取した試験片（１号ダンベル）を２３℃で湿度６０％ＲＨの雰囲気下、島津製作所製オートグラフ（引張速度：５０ｍｍ／分）にて引張弾性率を測定した。
評価は以下の基準で実施した。なお、△は実用範囲内である。
◎：引張弾性率が２５０以下
○：引張弾性率が２５０より大きく３００以下
△：引張弾性率が３００より大きく３５０以下
×：引張弾性率が３５０より大きい
測定結果を表２に示した。
<Flexibility>
In order to evaluate the flexibility, according to JIS K 7127, a test piece (No. 1 dumbbell) collected from a film was used in an autograph (tensile speed: 50 mm / min) manufactured by Shimadzu Corporation in an atmosphere of 23% at a humidity of 60% RH. Tensile modulus was measured.
Evaluation was carried out according to the following criteria. Δ is within the practical range.
A: Tensile modulus is 250 or less B: Tensile modulus is greater than 250 and less than 300 Δ: Tensile modulus is greater than 300 and less than 350 ×: Tensile modulus is greater than 350 Table 2 shows the measurement results.
なお、各実施例に使用したオレフィン系熱可塑性エラストマーのクロス分別法の測定条件は以下の通りである。
＜クロス分別測定＞
測定装置：クロス分別クロマトグラフ ＣＦＣ２（Ｐｏｌｙｍｅｒ ＣｈＡＲ社製）、検出器：赤外分光光度計 ＩＲ４（Ｐｏｌｙｍｅｒ ＣｈＡＲ社製）、検出波長：３．４２μｍ、ＧＰＣカラム：Ｓｈｏｄｅｘ ＨＴ−８０６Ｍ（昭和電工社製）、カラム温度：１４０℃、カラム校正：単分散ポリスチレン（東ソー社製）、分子量校正法：ポリスチレン換算、溶離液：ｏ−ジクロロベンゼン（ＯＤＣＢ）
流速：１．０ｍＬ／分、試料濃度：９０ｍｇ／３０ｍＬ（３ｍｇ／ｍＬ）、注入量：０．５ｍＬ、降温条件：１℃／分（１４０℃→０℃）、その後６０分間保持、溶出区分：０℃から１０℃毎に測定し、積算樹脂溶出量が１００％となるまで測定実施。
測定結果を表１に示した。
In addition, the measurement conditions of the cross fractionation method of the olefin type thermoplastic elastomer used for each Example are as follows.
<Cross separation measurement>
Measuring apparatus: Cross fractionation chromatograph CFC2 (manufactured by Polymer ChAR), detector: infrared spectrophotometer IR4 (manufactured by Polymer ChAR), detection wavelength: 3.42 μm, GPC column: Shodex HT-806M (manufactured by Showa Denko KK) ), Column temperature: 140 ° C., column calibration: monodisperse polystyrene (manufactured by Tosoh Corporation), molecular weight calibration method: polystyrene conversion, eluent: o-dichlorobenzene (ODCB)
Flow rate: 1.0 mL / min, sample concentration: 90 mg / 30 mL (3 mg / mL), injection volume: 0.5 mL, temperature drop condition: 1 ° C./min (140 ° C. → 0 ° C.), then hold for 60 min, elution category: Measure from 0 ° C to 10 ° C and measure until the total resin elution amount reaches 100%.
The measurement results are shown in Table 1.
表２から、実施例１〜３の半導体製造工程用粘着テープ基材用樹脂フィルムは経時による凝集力の低下が少なく、さらに十分な柔軟性を保持していることが認められる。
特に、実施例１、２は、実施例３に対して柔軟性の観点から優れており、特に好ましい態様であった。
From Table 2, it is recognized that the resin films for pressure-sensitive adhesive tape base materials for semiconductor manufacturing processes of Examples 1 to 3 have little decrease in cohesive force over time and still have sufficient flexibility.
In particular, Examples 1 and 2 were superior to Example 3 from the viewpoint of flexibility, and were particularly preferable embodiments.
Claims (5)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2016210898A (en) * | 2015-05-08 | 2016-12-15 | ダイヤプラスフィルム株式会社 | Substrate film used for adhesive film for semiconductive process |
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