JP2014229650A - Wafer processing method - Google Patents

Wafer processing method Download PDF

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JP2014229650A
JP2014229650A JP2013105919A JP2013105919A JP2014229650A JP 2014229650 A JP2014229650 A JP 2014229650A JP 2013105919 A JP2013105919 A JP 2013105919A JP 2013105919 A JP2013105919 A JP 2013105919A JP 2014229650 A JP2014229650 A JP 2014229650A
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notch
plate
workpiece
expanded
chamfer
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JP6093650B2 (en
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正道 片岡
Masamichi Kataoka
正道 片岡
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Disco Corp
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Disco Abrasive Systems Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a wafer processing method in which, even if chamfer is removed by trimming the outer periphery of a plate-shape work-piece, a notch can be correctly detected in a step thereafter.SOLUTION: In a notch expansion step 21, the notch is expanded to the center direction of a plate-shaped work-piece. In a chamfer removal step 22, the chamfer of the plate-shaped work-piece is removed in which the notch is expanded. In a grinding step 23, the plate-shaped work-piece whose chamber is removed is ground and thinned to a predetermined thickness. In the notch expansion step 21, the notch is expanded so that a part of the expanded notch remains in the plate-shaped work-piece thinned in the grinding step 23.

Description

本発明は、板状ワークを薄化するワーク加工方法に関する。   The present invention relates to a workpiece machining method for thinning a plate workpiece.

ウェーハなどの板状ワークには、外周に表面から裏面に至る面取りが形成されているものがある。このような板状ワークを半分の厚み以下に薄化すると、いわゆるシャープエッジが外周に形成され、板状ワークが破損する可能性がある。これを防ぐため、板状ワークの外周をトリミングして面取りを除去してから、薄化する技術が知られている（例えば、特許文献１参照）。   Some plate-like workpieces such as wafers have chamfers formed from the front surface to the back surface on the outer periphery. When such a plate-like workpiece is thinned to a half thickness or less, so-called sharp edges are formed on the outer periphery, and the plate-like workpiece may be damaged. In order to prevent this, a technique for trimming the outer periphery of the plate-like workpiece to remove the chamfer and then thinning the plate-like workpiece is known (for example, see Patent Document 1).

また、板状ワークには、結晶方位を示すノッチが形成されたものがある。ノッチは、例えば板状ワークをデバイスに分割する際の目印として利用されるもので（例えば、特許文献２参照）、ノッチの形状は、例えば業界標準規格であるＳＥＭＩ規格によって定められている。ノッチが形成された板状ワークについても、その外周をトリミングして面取りを除去してから薄化が行われている。   Some plate-like workpieces have notches indicating crystal orientations. The notch is used as a mark when, for example, a plate-shaped workpiece is divided into devices (see, for example, Patent Document 2), and the shape of the notch is defined by, for example, the SEMI standard that is an industry standard. The plate-like workpiece with the notch is also thinned after trimming the outer periphery to remove the chamfer.

特開２０００−１７３９６１号公報JP 2000-173961 A 特開２００４−１９８２６４号公報JP 2004-198264 A

しかし、ノッチは、板状ワークの外周に形成されているため、板状ワークの外周をトリミングすると、ノッチが小さくなるなど規格外の形状になり、その後の工程でノッチを正しく検出することができない場合がある。   However, since the notch is formed on the outer periphery of the plate-like workpiece, trimming the outer periphery of the plate-like workpiece results in a non-standard shape, such as a notch becoming smaller, and the notch cannot be detected correctly in subsequent processes. There is a case.

本発明は、このような問題にかんがみなされたもので、板状ワークの外周をトリミングして面取りを除去しても、その後の工程で正しくノッチが検出できるようにすることを目的とする。   The present invention has been considered in view of such problems, and an object of the present invention is to make it possible to correctly detect a notch in a subsequent process even when trimming the outer periphery of a plate-like workpiece to remove chamfering.

本発明に係るワーク加工方法は、ノッチと面取りとが外周に形成された板状ワークを薄化するワーク加工方法において、ノッチを板状ワークの中心方向に拡張するノッチ拡張工程と、ノッチが拡張された板状ワークの面取りを除去する面取り除去工程と、面取りが除去された板状ワークを研削して、所定の厚さまで薄化する研削工程と、を備え、ノッチ拡張工程において、研削工程で薄化した板状ワークに拡張したノッチの一部が残るようにノッチを拡張する。   The workpiece machining method according to the present invention is a workpiece machining method for thinning a plate-like workpiece having notches and chamfers formed on the outer periphery thereof, and a notch extension step for extending the notch in the center direction of the plate-like workpiece, and the notch is expanded. A chamfering removal process for removing the chamfer of the plate-shaped workpiece, and a grinding process for grinding the plate-shaped workpiece from which the chamfering has been removed to reduce the thickness to a predetermined thickness. Extend the notch so that part of the expanded notch remains on the thin plate workpiece.

前記ノッチ拡張工程においては、ノッチの位置を検出し、検出したノッチの位置に切削砥石を切り込ませて、板状ワークの中心方向にノッチを拡張することが望ましい。   In the notch expanding step, it is desirable to detect the position of the notch, and to cut a cutting grindstone at the detected position of the notch to expand the notch in the center direction of the plate-like workpiece.

本発明に係るワーク加工方法によれば、ノッチを中心方向に拡張してから、面取り部を除去するので、拡張したノッチが残り、その後の工程で正しくノッチを検出することができる。
また、ノッチの位置を検出して、板状ワークの中心に向かう方向に検出したノッチを拡張するので、拡張したノッチを正確な位置に形成することができる。 According to the workpiece machining method of the present invention, since the chamfered portion is removed after the notch is expanded in the center direction, the expanded notch remains, and the notch can be correctly detected in the subsequent steps.
Further, since the position of the notch is detected and the detected notch is expanded in the direction toward the center of the plate-like workpiece, the expanded notch can be formed at an accurate position.

板状ワークを示す平面図及び側面図。The top view and side view which show a plate-shaped workpiece. ワーク加工の流れを示すフロー図。The flowchart which shows the flow of work processing. ノッチ拡張装置の要部を示す平面図及び側面図。The top view and side view which show the principal part of a notch expansion apparatus. ノッチ検出段階を示す平面図及び側面図。The top view and side view which show a notch detection step. 切削段階を示す平面図及び正面図。The top view and front view which show a cutting step. 面取り除去工程を示す側面図。The side view which shows a chamfer removal process. 研削工程を示す側面図。The side view which shows a grinding process. 加工後の板状ワークを示す正面図及び側面図。The front view and side view which show the plate-shaped workpiece | work after a process. 加工後のノッチを示す拡大正視図。The enlarged front view which shows the notch after a process.

図１に示す板状ワーク１０は、基台となるサブストレート１１の上に、外周が甲丸面状に面取りされた円板状のウェーハ１２を、貼着シートなどの貼り合わせ部材を使って貼り合わせたものである。ウェーハ１２の外周には、結晶方位を示すノッチ１２１が形成されている。   A plate-shaped workpiece 10 shown in FIG. 1 is formed by using a bonding member such as a bonding sheet on a disk-shaped wafer 12 whose outer periphery is chamfered in a rounded surface on a substrate 11 serving as a base. It is what was pasted together. A notch 121 indicating a crystal orientation is formed on the outer periphery of the wafer 12.

図２に示すワーク加工方法２０は、以下の手順で実行される。まず、ノッチ拡張工程２１で、ノッチ１２１を板状ワーク１０の中心方向に拡張する。次に、面取り除去工程２２で、板状ワーク１０の面取りを除去する。最後に、研削工程２３で、板状ワーク１０を研削して、所定の厚さまで薄化する。以下では、各工程の詳細について説明する。   The workpiece machining method 20 shown in FIG. 2 is executed according to the following procedure. First, in the notch expanding step 21, the notch 121 is expanded in the center direction of the plate-like workpiece 10. Next, in the chamfer removal step 22, the chamfer of the plate-like workpiece 10 is removed. Finally, in the grinding step 23, the plate-like workpiece 10 is ground and thinned to a predetermined thickness. Below, the detail of each process is demonstrated.

（１）ノッチ拡張工程
図３に示すノッチ拡張装置３０は、板状ワーク１０を保持する保持テーブル３１と、ノッチ１２１を検出する検出手段３２と、ノッチ１２１を拡張する切削手段３３とを備え、ノッチ拡張工程２１の実行に用いられる。 (1) Notch expansion process The notch expansion apparatus 30 shown in FIG. 3 includes a holding table 31 that holds the plate-like workpiece 10, a detection means 32 that detects the notch 121, and a cutting means 33 that expands the notch 121. Used to execute the notch expansion step 21.

保持テーブル３１は、例えばチャックテーブルであり、多孔質材料などで形成された保持部３１１の上に板状ワーク１０を載置し、吸引源３１２で吸引することにより、板状ワーク１０を保持する。保持テーブル３１は、±Ｚ方向と平行な回転軸３１９を中心として回転し、送り手段（不図示）により駆動されて±Ｘ方向に移動する。   The holding table 31 is, for example, a chuck table, and holds the plate-like workpiece 10 by placing the plate-like workpiece 10 on a holding portion 311 formed of a porous material or the like and sucking it with a suction source 312. . The holding table 31 rotates around a rotation shaft 319 parallel to the ± Z direction, and is driven by a feeding means (not shown) to move in the ± X direction.

検出手段３２は、例えばレーザ式距離計であり、板状ワーク１０を保持した保持テーブル３１にレーザを照射して、レーザを反射した反射点までの距離を測定することにより、ノッチ１２１を検出することができる。検出手段３２は、保持テーブル３１の回転軸３１９が移動する経路である直線３１８上に検出範囲を有する。   The detecting means 32 is, for example, a laser distance meter, and detects the notch 121 by irradiating the holding table 31 holding the plate workpiece 10 with laser and measuring the distance to the reflection point where the laser is reflected. be able to. The detection means 32 has a detection range on a straight line 318 that is a path along which the rotation shaft 319 of the holding table 31 moves.

切削手段３３は、支持部３３３に支持されたモータ３３２が、±Ｙ方向に平行なスピンドル３３１を高速回転させることにより、スピンドル３３１の先端に装着された切削砥石３９が回転し、板状ワーク１０を切削することができる。切削手段３３は、送り手段（不図示）により駆動されて±Ｚ方向に移動する。切削砥石３９は、形成するノッチ１２１の形状に合わせて、外周端部がＶ字状に尖った形状に形成されている。切削砥石３９は、直線３１８上に配置されている。   In the cutting means 33, the motor 332 supported by the support portion 333 rotates the spindle 331 parallel to the ± Y direction at a high speed, whereby the cutting grindstone 39 attached to the tip of the spindle 331 rotates, and the plate-like workpiece 10. Can be cut. The cutting means 33 is driven by a feeding means (not shown) and moves in the ± Z direction. The cutting grindstone 39 is formed in a shape in which the outer peripheral end is pointed in a V shape in accordance with the shape of the notch 121 to be formed. The cutting grindstone 39 is disposed on the straight line 318.

まず、図４に示すノッチ検出段階２１１において、板状ワーク１０の中心が、保持テーブル３１の回転軸３１９と一致するように、板状ワーク１０を保持テーブル３１に載置し、載置された板状ワーク１０を保持テーブル３１が保持する。そして、保持テーブル３１を＋Ｘ方向に移動させながら、検出手段３２が反射点までの距離を測定する。反射点までの距離が保持テーブル３１の保持部３１１までの距離よりも近くなったことを検出手段３２が検出した場合、板状ワーク１０の外周が、検出手段３２の直下を通過したことがわかる。そこから、ノッチ１２１の深さよりも小さい所定の距離だけ、保持テーブル３１を＋Ｘ方向に移動させたのち、保持テーブル３１を停止する。   First, in the notch detection stage 211 shown in FIG. 4, the plate-like workpiece 10 is placed on the holding table 31 so that the center of the plate-like workpiece 10 coincides with the rotation shaft 319 of the holding table 31. A holding table 31 holds the plate-like workpiece 10. Then, the detection means 32 measures the distance to the reflection point while moving the holding table 31 in the + X direction. When the detection means 32 detects that the distance to the reflection point is closer than the distance to the holding portion 311 of the holding table 31, it can be seen that the outer periphery of the plate-like workpiece 10 has passed directly under the detection means 32. . From there, the holding table 31 is moved in the + X direction by a predetermined distance smaller than the depth of the notch 121, and then the holding table 31 is stopped.

次に、回転軸３１９を中心として保持テーブル３１を回転させる。これにより、検出手段３２の検出範囲が板状ワーク１０に対して相対的に移動し、板状ワーク１０の中心を中心とする円３２１を描く。保持テーブル３１の回転によりノッチ１２１が検出手段３２の直下を通過すると、その間だけ、検出手段３２が測定する反射点までの距離が大きくなる。そこで、保持テーブル３１を回転させていって、反射点までの距離が大きくなったときの回転角度と、反射点までの距離が元に戻ったときの回転角度とを計測することにより、その範囲にノッチ１２１があることを検出する。   Next, the holding table 31 is rotated around the rotation shaft 319. Thereby, the detection range of the detection means 32 moves relatively with respect to the plate-shaped workpiece 10, and the circle 321 centering on the center of the plate-shaped workpiece 10 is drawn. When the notch 121 passes immediately below the detection means 32 due to the rotation of the holding table 31, the distance to the reflection point measured by the detection means 32 increases only during that time. Therefore, by rotating the holding table 31 and measuring the rotation angle when the distance to the reflection point is increased and the rotation angle when the distance to the reflection point is restored, the range is obtained. , It is detected that there is a notch 121.

２つの回転角度を計測したのち、保持テーブル３１を逆回転して、計測した２つの回転角度を平均した角度で回転を停止する。これにより、板状ワーク１０は、中心に対して＋Ｘ方向にノッチ１２１が位置する向きになる。   After measuring the two rotation angles, the holding table 31 is reversely rotated, and the rotation is stopped at an angle obtained by averaging the two measured rotation angles. Thereby, the plate-like workpiece 10 is oriented so that the notch 121 is positioned in the + X direction with respect to the center.

次に、図５に示す切削段階２１２において、保持テーブル３１を＋Ｘ方向に移動させて、板状ワーク１０の外周を切削手段３３の直下に位置させる。切削砥石３９を回転させた状態で切削手段３３を−Ｚ方向に移動させ、切削砥石３９を板状ワーク１０に切り込ませる。切削砥石３９の−Ｚ方向最下端が、ウェーハ１２の下面（サブストレート１１に張り合わせられた側の面）の±Ｚ方向の位置よりも−Ｚ方向に所定の距離下がった最大切込み位置に達するまで、切削手段３３を−Ｚ方向に移動させる。これにより、ノッチ１２１の位置から板状ワーク１０の中心方向へ向けての切込み１２２が形成される。切込み１２２の形状は、切削砥石３９の形状に沿って正面視円弧状になる。   Next, in the cutting stage 212 shown in FIG. 5, the holding table 31 is moved in the + X direction so that the outer periphery of the plate-like workpiece 10 is positioned directly below the cutting means 33. With the cutting grindstone 39 rotated, the cutting means 33 is moved in the −Z direction, and the cutting grindstone 39 is cut into the plate-like workpiece 10. Until the lowermost end in the −Z direction of the cutting grindstone 39 reaches the maximum cutting position that is a predetermined distance lower in the −Z direction than the position in the ± Z direction on the lower surface of the wafer 12 (the surface bonded to the substrate 11). Then, the cutting means 33 is moved in the −Z direction. As a result, a notch 122 is formed from the position of the notch 121 toward the center of the plate-like workpiece 10. The shape of the cut 122 is an arc shape when viewed from the front along the shape of the cutting grindstone 39.

（２）面取り除去工程
図６に示す面取り除去工程２２で使用される面取り除去装置４０は、板状ワーク１０を保持する保持テーブル４１と、切削砥石４９が装着された切削手段４２とを備える。保持テーブル４１は、例えばチャックテーブルであり、多孔質材料などで形成された保持部４１１の上に板状ワーク１０を載置し、吸引源４１２で吸引することにより、板状ワーク１０を保持する。保持テーブル３１は、±Ｚ方向と平行な回転軸４１９を中心として回転する。切削手段４２は、±Ｘ方向に平行な方向を回転軸４３９として回転する切削砥石４９を高速回転させて板状ワーク１０に接触させて切削することにより、面取りを除去する。切削手段４２は、送り手段（不図示）により±Ｚ方向に移動する。そして、保持テーブル４１を回転させながら、高速回転している切削砥石４９を、保持テーブル４１が保持した板状ワーク１０に切り込ませて外周を切削することにより、ウェーハ１２の外周に設けられた面取りを除去する。 (2) Chamfering and removing step The chamfering and removing device 40 used in the chamfering and removing step 22 shown in FIG. 6 includes a holding table 41 that holds the plate-like workpiece 10 and a cutting means 42 to which a cutting grindstone 49 is attached. The holding table 41 is, for example, a chuck table, and the plate-like workpiece 10 is held by placing the plate-like workpiece 10 on a holding portion 411 formed of a porous material or the like and sucking it with a suction source 412. . The holding table 31 rotates around a rotation axis 419 parallel to the ± Z directions. The cutting means 42 removes chamfering by rotating a cutting grindstone 49 rotating around a rotation axis 439 in a direction parallel to the ± X direction so as to contact the plate-like workpiece 10 for cutting. The cutting means 42 is moved in the ± Z direction by a feeding means (not shown). Then, while rotating the holding table 41, the cutting grindstone 49 rotating at high speed was cut into the plate-like workpiece 10 held by the holding table 41 to cut the outer periphery, thereby being provided on the outer periphery of the wafer 12. Remove the chamfer.

（３）研削工程
図７に示す研削工程２３で使用される研削装置５０は、板状ワーク１０を保持する保持テーブル５１と、研削砥石５９が装着された研削ホイール５３を有する研削手段５２とを備える。保持テーブル５１は、例えばチャックテーブルであり、多孔質材料などで形成された保持部５１１の上に板状ワーク１０を載置し、吸引源５１２で吸引することにより、板状ワーク１０を保持する。保持テーブル５１は、±Ｚ方向と平行な回転軸５１９を中心として回転する。研削手段５２は、±Ｚ方向に平行な回転軸５３９を中心として研削ホイール５３を高速回転させることにより、研削ホイール５３に装着された研削砥石５９が回転し、板状ワーク１０の上面を研削することができる。研削手段５２は、送り手段（不図示）により駆動されて±Ｚ方向に移動する。研削手段を−Ｚ方向に移動させながら、板状ワーク１０が所定の厚さになるまで研削することにより、板状ワーク１０を薄化する。 (3) Grinding Step A grinding device 50 used in the grinding step 23 shown in FIG. 7 includes a holding table 51 for holding the plate-like workpiece 10 and a grinding means 52 having a grinding wheel 53 on which a grinding wheel 59 is mounted. Prepare. The holding table 51 is, for example, a chuck table, and holds the plate-like workpiece 10 by placing the plate-like workpiece 10 on a holding portion 511 formed of a porous material or the like and sucking it with a suction source 512. . The holding table 51 rotates around a rotation axis 519 parallel to the ± Z direction. The grinding means 52 rotates the grinding wheel 53 at a high speed around the rotation axis 539 parallel to the ± Z directions, whereby the grinding wheel 59 mounted on the grinding wheel 53 rotates and the upper surface of the plate-like workpiece 10 is ground. be able to. The grinding means 52 is driven by a feeding means (not shown) and moves in the ± Z direction. The plate-like workpiece 10 is thinned by grinding until the plate-like workpiece 10 has a predetermined thickness while moving the grinding means in the -Z direction.

図８に示すように、薄化された板状ワーク１０では、ノッチ拡張工程２１で形成された切込み１２２の大部分が面取り除去工程２２及び研削工程２３で除去され、残った部分がノッチ１２３になる。   As shown in FIG. 8, in the thin plate-like workpiece 10, most of the cuts 122 formed in the notch expansion process 21 are removed in the chamfering removal process 22 and the grinding process 23, and the remaining part becomes the notch 123. Become.

このように、面取り除去工程２２及び研削工程２３の前に、ノッチ１２１を検出し、検出したノッチ１２１を中心方向に拡張して切込み１２２を形成しておくことにより、面取り除去工程２２及び研削工程２３の終了後に、ノッチ１２３が残る。切込み１２２は、ノッチ１２１を板状ワーク１０の中心方向に拡張したものなので、ノッチ１２３は、板状ワーク１０の中心から見て、ノッチ１２１があった方向と正確に同じ方向に形成されている。このため、その後の工程で、ノッチ１２３を正しく検出することができる。   Thus, before the chamfer removing step 22 and the grinding step 23, the notch 121 is detected, and the detected notch 121 is expanded in the center direction to form the cut 122, whereby the chamfer removing step 22 and the grinding step. After the end of 23, the notch 123 remains. Since the notch 122 is obtained by extending the notch 121 in the center direction of the plate-like workpiece 10, the notch 123 is formed in exactly the same direction as the direction in which the notch 121 was seen when viewed from the center of the plate-like workpiece 10. . For this reason, the notch 123 can be detected correctly in the subsequent steps.

図９に示すように、加工後に残るノッチ１２３の形状は、ノッチ拡張工程２１で板状ワーク１０に切り込んだ切削砥石３９の形状を写したものになり、ＸＹ平面に近い緩やかな２つの斜面が向かい合った形状になる。これを＋Ｚ方向から見ると、角度θを有するＶ字状である。
なお、切削砥石３９の直径をもっと小さくし、切削砥石３９が板状ワーク１０に切り込む最大切込み位置をもっと−Ｚ方向に下げれば、ノッチ１２３の内壁を±Ｚ方向に近い急な斜面にすることができる。 As shown in FIG. 9, the shape of the notch 123 remaining after machining is a copy of the shape of the cutting grindstone 39 cut into the plate-like workpiece 10 in the notch expansion step 21, and two gentle slopes close to the XY plane are present. It becomes the opposite shape. When viewed from the + Z direction, this is a V-shape having an angle θ.
If the diameter of the cutting grindstone 39 is further reduced and the maximum cutting position at which the cutting grindstone 39 cuts into the plate-like workpiece 10 is further lowered in the −Z direction, the inner wall of the notch 123 is made a steep slope close to the ± Z direction. Can do.

このように、ノッチ１２３を所定の形状（例えばＳＥＭＩ規格で定められている形状）にするためには、その形状に対応する形状に形成された切削砥石３９を使用すればよい。
なお、切削砥石３９は、サブストレート１１まで切り込む構成であってもよいし、ウェーハ１２だけを切削し、サブストレート１１までは切り込まない構成であってもよい。 Thus, in order to make the notch 123 into a predetermined shape (for example, a shape defined by the SEMI standard), a cutting grindstone 39 formed in a shape corresponding to the shape may be used.
The cutting grindstone 39 may be configured to cut to the substrate 11 or may be configured to cut only the wafer 12 and not to the substrate 11.

以上説明した実施形態は、一例であり、本発明は、これに限定されるものではない。例えば、本質的でない部分の構成を、他の構成に置き換えてもよい。
板状ワーク１０は、サブストレート１１の上にウェーハ１２を貼り合わせたものではなく、１枚のウェーハのみからなるものであってもよい。
また、検出手段３２は、レーザ距離計ではなく、例えば、カメラで撮影した画像を処理することにより、ノッチ１２１を検出する構成であってもよい。 The embodiment described above is an example, and the present invention is not limited to this. For example, the configuration of the non-essential part may be replaced with another configuration.
The plate-like workpiece 10 is not formed by bonding the wafer 12 on the substrate 11 but may be composed of only one wafer.
Further, the detection means 32 may be configured not to be a laser distance meter, but to detect the notch 121 by processing an image taken by a camera, for example.

１０ 板状ワーク、１１ サブストレート、１２ ウェーハ、
１２１，１２３ ノッチ、１２２ 切込み、
２０ ワーク加工方法、
２１ ノッチ拡張工程、２１１ ノッチ検出段階、２１２ 切削段階、
２２ 面取り除去工程、２３ 研削工程、
３０ ノッチ拡張装置、３１，４１，５１ 保持テーブル、
３１１，４１１，５１１ 保持部、３１２，４１２，５１２ 吸引源、
３１８ 直線、３１９，４１９，４３９，５１９，５３９ 回転軸、
３２ 検出手段、３２１ 円、３３ 切削手段、３３１ スピンドル、３３２ モータ、３３３ 支持部、３９，４９ 切削砥石、
４０ 面取り除去装置、４２ 切削手段、５０ 研削装置、５２ 研削手段、
５３ 研削ホイール、５９ 研削砥石。 10 plate workpiece, 11 substrate, 12 wafer,
121, 123 notches, 122 notches,
20 Workpiece processing method,
21 notch expansion process, 211 notch detection stage, 212 cutting stage,
22 chamfer removal process, 23 grinding process,
30 notch expansion device, 31, 41, 51 holding table,
311, 411, 511 holding unit, 312, 412, 512 suction source,
318 straight line, 319, 419, 439, 519, 539 rotation axis,
32 detection means, 321 circle, 33 cutting means, 331 spindle, 332 motor, 333 support, 39, 49 cutting wheel,
40 chamfer removing device, 42 cutting means, 50 grinding device, 52 grinding means,
53 grinding wheels, 59 grinding wheels.

Claims (2)

ノッチと面取りとが外周に形成された板状ワークを薄化するワーク加工方法であって、
該ノッチを該板状ワークの中心方向に拡張するノッチ拡張工程と、
該ノッチが拡張された板状ワークの該面取りを除去する面取り除去工程と、
該面取りが除去された板状ワークを研削して、所定の厚さまで薄化する研削工程と、を備え、
該ノッチ拡張工程において、該研削工程で薄化した板状ワークに拡張したノッチの一部が残るように該ノッチを拡張する、
ワーク加工方法。 A workpiece processing method for thinning a plate-like workpiece having notches and chamfers formed on the outer periphery,
A notch expanding step of expanding the notch toward the center of the plate-like workpiece;
A chamfer removing step of removing the chamfer of the plate-like workpiece with the notch extended;
Grinding the plate-like workpiece from which the chamfer has been removed, and thinning to a predetermined thickness, and
In the notch expansion step, the notch is expanded so that a part of the expanded notch remains on the plate workpiece thinned in the grinding step.
Workpiece processing method. 前記ノッチ拡張工程において、前記ノッチの位置を検出し、検出したノッチの位置に切削砥石を切り込ませて、前記板状ワークの中心方向に前記ノッチを拡張する、請求項１記載のワーク加工方法。   The workpiece processing method according to claim 1, wherein in the notch expanding step, the position of the notch is detected, a cutting grindstone is cut into the detected position of the notch, and the notch is expanded toward the center of the plate-shaped workpiece. .
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