JP2014224832A5 - Physical quantity measuring apparatus and manufacturing method thereof - Google Patents

Physical quantity measuring apparatus and manufacturing method thereof Download PDF

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JP2014224832A5
JP2014224832A5 JP2014177581A JP2014177581A JP2014224832A5 JP 2014224832 A5 JP2014224832 A5 JP 2014224832A5 JP 2014177581 A JP2014177581 A JP 2014177581A JP 2014177581 A JP2014177581 A JP 2014177581A JP 2014224832 A5 JP2014224832 A5 JP 2014224832A5
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physical quantity
resin
quantity measuring
measuring device
lead frame
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JP2014177581A
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JP5841211B2 (en
JP2014224832A (en
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Description

本発明は物理量計測装置及びその製造方法に関する。 The present invention relates to a physical quantity measuring device and a manufacturing method thereof .

本発明は、上記の点に鑑みてなされたものであり、その目的とするところは、回路パッケージのモールド樹脂から露出する切断端部に水や塩水が付着するのを防ぐことができる物理量計測装置及びその製造方法を提供することである。 The present invention has been made in view of the above points, and an object of the present invention is to provide a physical quantity measuring device capable of preventing water and salt water from adhering to a cut end exposed from a mold resin of a circuit package. And a method of manufacturing the same.

Claims (6)

物理量検出部と、回路パッケージと、を備えた物理量計測装置であって、A physical quantity measuring device comprising a physical quantity detection unit and a circuit package,
前記回路パッケージは、リードフレームと、該リードフレームに支持された制御回路と、該制御回路を封止する樹脂と、該樹脂から露出した前記リードフレームの切断端部を被覆する被覆部と、を有することを特徴とする物理量計測装置。The circuit package includes a lead frame, a control circuit supported by the lead frame, a resin that seals the control circuit, and a covering that covers a cut end portion of the lead frame exposed from the resin. A physical quantity measuring device comprising: 外部機器との電気的な接続を行うための外部接続部をさらに備え、It further includes an external connection part for electrical connection with an external device,
前記被覆部は、前記外部接続部を形成する樹脂によって形成されていることを特徴とする請求項１に記載の物理量計測装置。The physical quantity measuring device according to claim 1, wherein the covering portion is formed of a resin that forms the external connection portion. 前記回路パッケージを固定する固定部をさらに備え、A fixing portion for fixing the circuit package;
前記固定部は、前記外部接続部を形成する樹脂によって形成されていることを特徴とする請求項２に記載の物理量計測装置。The physical quantity measuring device according to claim 2, wherein the fixing portion is made of a resin that forms the external connection portion. 前記制御回路を封止する樹脂は、熱硬化性樹脂であり、The resin that seals the control circuit is a thermosetting resin,
前記外部接続部を形成する樹脂は、熱可塑性樹脂であることを特徴とする請求項２又は請求項３に記載の物理量計測装置。The physical quantity measuring apparatus according to claim 2, wherein the resin forming the external connection portion is a thermoplastic resin. 前記被覆部によって被覆される前記リードフレームの切断端部は、前記リードフレームに設けられた複数のリードの切断端部を含み、該複数のリードの切断端部の間に電位差が生じることを特徴とする請求項１から請求項４のいずれか一項に記載の物理量計測装置。The cutting end portion of the lead frame covered by the covering portion includes cutting ends of a plurality of leads provided in the lead frame, and a potential difference is generated between the cutting ends of the plurality of leads. The physical quantity measuring device according to any one of claims 1 to 4. 請求項１から請求項５のいずれか一項に記載の物理量計測装置の製造方法であって、It is a manufacturing method of the physical quantity measuring device according to any one of claims 1 to 5,
前記リードフレームをリードによって支持枠に支持し、前記リードフレームに支持された前記制御回路を樹脂によって封止する工程と、Supporting the lead frame on a support frame with leads, and sealing the control circuit supported on the lead frame with resin;
前記リードを切断して前記支持枠から前記回路パッケージを切り離す工程と、Cutting the leads and separating the circuit package from the support frame;
前記回路パッケージの前記制御回路を封止する樹脂から露出した前記リードの切断端部を被覆する被覆部を形成する工程と、Forming a covering portion that covers the cut end portion of the lead exposed from the resin that seals the control circuit of the circuit package;
を備えることを特徴とする物理量計測装置の製造方法。A method of manufacturing a physical quantity measuring device comprising:
JP2014177581A 2014-09-01 2014-09-01 Physical quantity measuring apparatus and manufacturing method thereof Active JP5841211B2 (en)

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JP2014177581A JP5841211B2 (en) 2014-09-01 2014-09-01 Physical quantity measuring apparatus and manufacturing method thereof

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JP2014177581A JP5841211B2 (en) 2014-09-01 2014-09-01 Physical quantity measuring apparatus and manufacturing method thereof

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2012136347A Division JP5632881B2 (en) 2012-06-15 2012-06-15 Thermal flow meter

Publications (3)

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JP2014224832A JP2014224832A (en) 2014-12-04
JP2014224832A5 true JP2014224832A5 (en) 2015-08-06
JP5841211B2 JP5841211B2 (en) 2016-01-13

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Publication number Priority date Publication date Assignee Title
JP6421092B2 (en) * 2015-07-31 2018-11-07 日立オートモティブシステムズ株式会社 Physical quantity detection device
JP6474342B2 (en) * 2015-10-28 2019-02-27 日立オートモティブシステムズ株式会社 Physical quantity detection device
JP6973268B2 (en) * 2018-04-24 2021-11-24 株式会社デンソー Physical quantity measuring device

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* Cited by examiner, † Cited by third party
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JP5212159B2 (en) * 2009-02-16 2013-06-19 株式会社デンソー Sensor device
JP5168184B2 (en) * 2009-02-23 2013-03-21 株式会社デンソー Sensor device and manufacturing method thereof
JP5147888B2 (en) * 2010-04-05 2013-02-20 三菱電機株式会社 Thermal sensor element
JP5195819B2 (en) * 2010-06-02 2013-05-15 株式会社デンソー Air flow measurement device

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