JP2014222672A - Connector and method for manufacturing connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrical connector which electrically connects a first connector with a first terminal and a second connector with a second terminal, in which superior conductivity and long term stability are obtained, while preventing solder protruding to a contact in the first connector terminal.SOLUTION: In an electrical connector, a first connector terminal has a body and a tail extending from the body, and the body has a projection region projecting from a body region. There is a contact with the second connector terminal in the projection region, an Au layer is provided in the projection region, and a solder barrier layer is provided in a region between the projection region and the tail.

Description

  The present invention relates to a connector, and more particularly to an electrical connector for electrically connecting a board and a board.

  Conventionally, a board-to-board connector (electric connector) for electrically connecting a pair of circuit boards arranged in parallel is known. The board-to-board connector includes a pair of connectors that are respectively attached to mutually facing surfaces of the pair of circuit boards, and each connector is electrically connected to each circuit board. And one circuit board and the other circuit board are electrically connected through the electrical connection between connectors. The electrical connection between the board and the connector and the electrical connection between the connectors are performed by a plurality of contacts (connector terminals) provided in each connector. The electrical connection between the board and the connector is performed by soldering the contacts to the circuit board, and the electrical connection between the connectors is performed by elastic contact between the contacts soldered to the respective boards. The part of the contact that is soldered to the circuit board is called the tail.

  Usually, each connector of the board-to-board connector has a plurality of the above-mentioned contacts, and the plurality of pairs of contacts are brought into elastic contact with the coupling between the connectors. Among these, there are a one-point contact connector that provides one electrical contact between a pair of contacts and a two-point contact connector that provides two electrical contacts. Since the two-point contact connector has more electrical contacts than the one-point contact connector, the two-point contact connector is superior in terms of preventing instantaneous interruption when receiving an impact such as dropping, and preventing contact failure due to foreign matter adhesion. It is desirable to provide an Au layer at the contact between these contacts from the viewpoint of conductivity and long-term stability.

  As electronic devices have become smaller and lighter in recent years, board-to-board connectors have become smaller, and of course, contacts that are a component of the connector have become smaller. For this reason, in a two-point contact connector that requires two contact points, the tail and the contact point are closer to each other with the miniaturization. Since the tail is soldered to the substrate, if the distance between the tail and the contact is small, “solder rise” in which the solder rises by capillary action from the tail toward the contact becomes a problem. As a method for preventing this, a method of providing a solder barrier layer of Ni or the like between the contact and the tail has been proposed (Patent Document 1).

JP2008-300193

  However, in recent miniaturized contacts, it has been difficult to provide a solder barrier layer only in a minute area between the contact and the tail. The solder barrier layer extended to the contact closer to the tail (hereinafter referred to as tail side contact) of the two points of contact, and as a result, the tail side contact was covered with the Ni layer. That is, the Au layer cannot be provided on the tail side contact, and there is a problem in terms of conductivity and long-term stability.

  As another solution of “soldering”, there is a method of attaching a contact simultaneously with the molding of the connector body by using insert molding. When manufacturing using insert molding, there is no gap for solder to enter between the contact and the connector, so there is no problem of solder rise. However, insert molding has problems such as a risk of failure due to resin covering of contacts and high cost, and its use is limited. Therefore, a technique for effectively preventing solder rise has been desired in a type in which contacts are retrofitted after forming a connector, that is, a contact press-fitting type two-point contact connector.

  According to the present invention, the first connector provided with the first connector terminal and the second connector provided with the second connector terminal are electrically connected by coupling the first and second connector terminals. In the electrical connector to be connected, the first connector terminal has a main body and a tail extending from the main body, and the main body includes a first region that is a protruding region protruding from the main body region, and a first region. A second region between the first region and the tail, and a third region around the first region, the contact with the second connector terminal being present in the first region, Of the first region, the second region, and the third region, the first region is provided with a Ni layer or a Ni alloy layer, and an Au layer formed on the Ni layer or the Ni alloy layer. A solder barrier layer made of a Ni layer or a Ni alloy layer is provided in the region and the third region. In the second region, the solder barrier layer is formed up to the boundary with the first region, and in the third region, the solder barrier layer is formed up to the boundary with the first region. An electrical connector is provided.

  The present invention is a two-point contact connector, wherein a solder barrier layer is provided in a region between the tail side contact and the tail, and an Au layer is provided at the contact. Therefore, good conductivity and long-term stability can be obtained while preventing the solder from rising from the tail to the contact.

It is the perspective view which shows the board-to-board connector 3 of the state which couple | bonded the plug connector 1 and the receptacle connector 2 in embodiment of this invention, and was the figure seen from the plug connector 1 side. FIG. 3 is a perspective view of the plug connector 1 in the embodiment of the present invention, as viewed from the side of the coupling surface with the receptacle connector 2. FIG. 3 is an exploded view of the plug connector 1 according to the embodiment of the present invention, as viewed from the coupling surface side with the receptacle connector 2. FIG. 3 is an exploded view of the plug connector 1 according to the embodiment of the present invention, as viewed from the surface side mounted on the substrate 91. It is a perspective view of the plug contact 61 in the embodiment of the present invention. It is a perspective view of the plug contact 261 in the modification of this invention. It is a perspective view of the plug contact 361 in the modification of this invention. FIG. 3 is a perspective view of the receptacle connector 2 according to the embodiment of the present invention, as viewed from the side of the connection surface with the plug connector 1. FIG. 3 is an exploded view of the receptacle connector 2 in the embodiment of the present invention, as viewed from the side of the coupling surface with the plug connector 1. FIG. 4 is an exploded view of the receptacle connector 2 in the embodiment of the present invention, as viewed from the surface side mounted on the substrate 191. It is a perspective view of the receptacle contact 161 in embodiment of this invention. It is sectional drawing of the board-to-board connector 3 of the state which couple | bonded the plug connector 1 and the receptacle connector 2 in embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows a state in which a board-to-board connector 3 as a pair of electrical connectors composed of a plug connector 1 as a first connector and a receptacle connector 2 as a second connector according to the embodiment of the present invention is coupled to each other. It is a perspective view shown. FIG. 1 is a view of the board-to-board connector 3 as viewed from the plug connector 1 side.

  The plug connector 1 is a surface mount type connector mounted on the surface of the substrate 91. The receptacle connector 2 is a surface mount type connector that is mounted on the surface of the substrate 191. The board-to-board connector 3 in the present embodiment electrically connects the board 91 and the board 191 through the connection between the plug connector 1 and the receptacle connector 2.

  First, the plug connector 1 will be described. FIG. 2 shows a perspective view of the plug connector 1 mounted on the substrate 91. FIG. 2 is a perspective view of the plug connector 1 viewed from the side of the coupling surface with the receptacle connector 2. 3 and 4 are exploded views of the plug connector 1. FIG. FIG. 3 is an exploded view of the plug connector 1 as viewed from the side of the connection surface with the receptacle connector 2, and FIG. 4 is an exploded view of the plug connector 1 as viewed from the side of the surface mounted on the substrate 91.

  As shown in FIG. 2, the plug connector 1 is a member having a rectangular parallelepiped shape, and the plug connector 1 is mounted on the substrate 91 by soldering plug contacts (plug connector terminals) 61 to the substrate 91. In the present application, the side of the plug connector 1 that is mounted on the board is referred to as “mounting side” or “lower side”, and the side to which the receptacle connector 2 is coupled is referred to as “coupling side” or “upper side”. In this application, the direction in which the rectangular parallelepiped plug connector 1 extends (the direction indicated as “Y” in FIG. 2) is orthogonal to the “longitudinal direction” and the “longitudinal direction” in a plane parallel to the substrate 91. The direction (direction indicated as “X” in FIG. 2) is referred to as “short direction”, and the direction perpendicular to the surface of the substrate 91 (direction indicated as “Z” in FIG. 2) is referred to as “height direction”.

  As shown in FIGS. 3 and 4, the plug connector 1 includes a bowl-shaped housing 11, a plurality of plug contacts 61 attached to the housing 11 from above, and a pair of nails 51 attached to the housing 11 from below. Have The housing 11 has a predetermined thickness in the height direction and a pair of beams 12a and 12b extending in parallel with each other in the longitudinal direction, and connecting both ends of the beams 12a and 12b extending in the short direction. A pair of bridges 26 a and 26 b and a bottom plate 17. The bottom plate 17 extends below the housing 11 so as to connect the beams 12a and 12b and the bridges 26a and 26b. In the center of the housing 11, a space 13 is defined by the beams 12 a and 12 b, the bridges 26 a and 26 b, and the bottom plate 17. A part of the receptacle connector 2 described later is inserted into the space 13.

  Grooves 16 for receiving plug contacts are formed in the beams 12a and 12b at predetermined intervals in the longitudinal direction. The groove 16 is formed on both side surfaces of the beam so as to extend in the height direction. A plurality of grooves 16 are formed in the beams 12 a and 12 b, so that convex portions 18 are defined between the grooves 16.

  The bridges 26a and 26b are formed to have a predetermined thickness in the height direction so that the upper surfaces 26Ua and 26Ub are higher than the upper surfaces of the beams 12a and 12b. Holes 23 to which the nails 51 are attached are formed in the lower surfaces 26Ba and 26Bb of the bridge (see FIG. 4). The nail 51 is bonded or soldered to the substrate 91 at the time of mounting to reinforce the connection between the plug connector 1 and the substrate 91.

  Next, the plug contact 61 attached to the housing 11 will be described. FIG. 5 is a perspective view of the plug contact 61. The plug contact 61 has a shape in which a flat long plate is bent in an inverted U shape and one end thereof is bent at approximately 90 degrees, and an inverted U-shaped main body 62 and a tail 63 extending from the main body 62 are provided. Consists of. The main body 62 includes a first side wall 67 and a second side wall 64 that are spaced apart and extend substantially in parallel with each other, and a bent portion 65 that connects them. The end of the second side wall 64 bends toward the tail 63. The second side wall 64 includes a lower half portion 64a that extends to the tail 63 and an upper half portion 64b that continues to the bent portion 65. As will be described later, a solder barrier layer 69 is provided on the lower half portion 64a. . On the surface of the second side wall 64, a convex portion 68 is provided so as to protrude across the lower half portion 64a and the upper half portion 64b. The convex portion 68 extends from the bent portion 65 toward the tail, and has an upper step portion 68a on the bent portion side and a lower step portion 68b connected to the tail portion, and the upper step portion 68a is formed higher than the lower step portion 68b. A step 68c is defined between the upper step 68a and the lower step 68b. The upper stage portion 68a functions as a retaining member for coupling with a receptacle contact 161, which will be described later, or functions as a fitting detection that provides a click feeling during coupling and detects fitting. Further, the convex portion 68 has a width narrower than the width of the second side wall 64. Therefore, flat regions 64 c as flat portions of the second side wall 64 exist on both sides of the convex portion 68. Further, both side surfaces of the second side wall 64 extending by connecting the tail 72 and the bent portion 65 are not flat but have a wedge shape. This wedge shape exerts an anchor effect when mounting the plug contact 61, which will be described later, to the housing 11, and strengthens the mounting of the plug contact 61. The plug contact 61 having such a shape can be formed by press molding or the like using a conductive metal.

  In order to attach the plug contact 61 to the housing 11, the first contact 67 and the second sidewall 64 of the plug contact 61 are inserted into the grooves 16 of the beams 12 a and 12 b of the first housing 11. The housing 11 is pressed from above toward the beams 12a and 12b. As a result, the first side wall 67 and the second side wall 64 are sandwiched from both sides by the side wall 18 a of the convex portion 18, whereby the plug contact 61 is fixed to the beams 12 a and 12 b of the first housing 11. Both side surfaces of the first side wall 67 of the plug contact 61 are wedge-shaped, and they bite into the side wall 18a of the convex portion 18 to exert an anchor effect. Thereby, the plug contact 61 is firmly attached to the first housing 11. Further, in the plug contact 61 attached in this way, the convex portion 68, the flat region 64 c of the second side wall 64, and the tail 63 are exposed to the outer surface of the plug connector 1.

  When the plug connector 1 and the receptacle connector 2 are coupled, the plug contact 61 has two points of contact with the receptacle contact 161 described later. FIG. 12 shows a cross-sectional view when the plug connector 1 and the receptacle connector 2 are coupled. The plug contact 61 and the receptacle contact 161 come into contact at two points based on their shapes, and these two points form a contact point between the plug contact 61 and the receptacle contact 161. In FIG. A contact 70 and a second contact 71 are shown. The first contact 70 is located on the first side wall 67 of the plug connector 1, and the second contact 71 is located on the convex portion 68.

  An Au layer 72 is provided on the tail 63 and the convex portion 68 of the plug contact 61, respectively, and a solder barrier layer 69 made of an Ni layer is provided on the lower half portion 64a except for the convex portion 68. Therefore, as shown in FIG. 5, a solder barrier layer 69 exists between the tail 63 provided with the Au layer 72 and the convex portion 68. The plug contact 61 of this embodiment was manufactured by the following method. First, Ni base plating is performed on the entire base of the conductive Cu alloy by electrolytic plating, and Au plating is further applied thereon. Next, the plated Au layer in the lower half portion 64a is removed, and the Ni underlayer is exposed to form a solder barrier layer 69. In order to remove the Au layer, the lower half 64a was irradiated with laser light to evaporate the Au layer. In addition, the Au layer may be removed using other well-known techniques such as heat and chemical treatment. Further, any method may be used such as a method in which the Au region is not deposited by masking the flat region 64c before the plug contact 61 is plated with Au, and an Au layer is formed on the convex portion 68 to form the flat region 64c. In this case, the Au layer should not be formed.

  As an example, a method of removing the Au layer with laser light after electroplating will be described. In the present embodiment, the plug contact 61 is provided with a convex portion 68 where the second contact 71 is located so as to protrude from the flat portion of the second side wall 64. As described above, the Au layer 72 is formed by electrolytic plating. However, since the current density of the portion protruding by the electrolytic plating is increased, a large amount of metal is deposited on such a portion, and the plating film is formed thick. Accordingly, the convex portion 68 is formed such that the Au layer is thicker than the flat portion of the second side wall 64 including the flat portion 64c. In this state, when the entire lower half portion 64a including the convex portion 68 is irradiated with laser light, the solder barrier layer 69 can be formed leaving the Au layer 72 only on the convex portion 68 where the Au layer is formed thick. . However, if the current density is set to the optimum condition, it is possible to deposit the Au layer only on the convex portion 68.

  In recent miniaturized contacts, the tail and the tail side contact (second contact) are close to each other, so it is difficult to form a solder barrier layer while leaving the Au layer at the tail side contact (second contact). There were problems in terms of conductivity and long-term stability. According to the present invention, a solder barrier layer can be formed while leaving an Au layer in a minute area such as a tail side contact by providing a convex portion even for a minute contact.

  Next, the receptacle connector 2 will be described. FIG. 8 is a perspective view of the receptacle connector 2 mounted on the board 191. FIG. FIG. 8 is a perspective view of the receptacle connector 2 as seen from the side of the connecting surface with the plug connector 1. 9 and 10 are exploded views of the receptacle connector 2. FIG. FIG. 9 is an exploded view of the receptacle connector 2 as seen from the side of the connection surface with the plug connector 1, and FIG. 10 is an exploded view of the receptacle connector 2 as seen from the side of the surface mounted on the substrate 191.

  As shown in FIG. 8, the receptacle connector 2 is a member having a rectangular parallelepiped shape, and is mounted on the substrate 191 by soldering the receptacle contact 161 to the substrate 191. In the present application, the side of the receptacle connector 2 that is mounted on the substrate is appropriately referred to as “mounting side” or “lower side”, and the side to which the plug connector 2 is coupled is referred to as “coupling side” or “upper side”. Further, in the present application, the direction in which the rectangular parallelepiped receptacle connector 2 extends (the direction indicated as “Y” in FIG. 8) is “longitudinal direction” and is orthogonal to the “longitudinal direction” in a plane parallel to the substrate 191. The direction (direction indicated as “X” in FIG. 8) is referred to as “short direction”, and the direction perpendicular to the surface of the substrate 91 (direction indicated as “Z” in FIG. 8) is referred to as “height direction”.

  As shown in FIGS. 9 and 10, the receptacle connector 2 includes a bowl-shaped housing 101, a plurality of receptacle contacts 161 attached to the housing 101 from above, and two pairs of nails 151 attached to the housing 101 from above. Have The housing 101 has a predetermined thickness in the height direction and connects a pair of beams 112a and 112b extending in parallel with each other in the longitudinal direction and the ends of the beams 112a and 112b extending in the short direction. A pair of bridges 126a and 126b and a bottom plate 117. The bottom plate 117 extends below the housing 101 so as to connect the beams 112a and 112b and the bridges 126a and 126b. A raised portion 114 projects from the center portion of the bottom plate 117 and extends in the longitudinal direction.

  In the center of the housing 101, a space 113 is defined by beams 112a and 112b, bridges 126a and 126b, and a bottom plate 17, and this space 113 is divided into two spaces 113a and 113b extending in the longitudinal direction by a raised portion 114. Is done. The space 113 is divided into two spaces 113 c and 113 d extending in the short direction by the raised portion 114. The spaces 113a and 113b communicate with the spaces 113c and 113d around the raised portion 114, and a part of the plug connector 1 is inserted into the communicated spaces 113a to 113d.

  On both side surfaces of the raised portion 114, a plurality of grooves 115a and 115b for receiving the receptacle contacts 161 at predetermined intervals in the longitudinal direction are formed. The grooves 115a and 115b are formed on both side surfaces of the raised portion 114 so as to extend in the height direction. Similarly, a plurality of grooves 116a and 116b for receiving the receptacle contacts 161 at predetermined intervals in the longitudinal direction are formed in each of the beams 112a and 112b. The grooves 116a and 116b are formed on both side surfaces of the beams 112a and 112b so as to extend in the height direction.

  The groove 115a formed on one side surface of the raised portion 114 functions as a cavity for accommodating the receptacle contact 161 together with the grooves 116a formed at corresponding positions on both side surfaces of the beam 112a via the space 113a. Similarly, the groove 115b formed on the other surface of the raised portion 114 functions as a cavity for accommodating the receptacle contact 161 together with the grooves 116b formed at corresponding positions on both side surfaces of the beam 112b via the space 113b. . Further, a plurality of grooves 116a and 116b are formed in the beams 112a and 112b, so that a convex portion 118 is defined between the grooves 116a and 116b.

  Two pairs of holes 123 to which the nails 151 are attached are formed at both ends in the longitudinal direction of the beams 112a and 112b (see FIG. 9). The nail 151 is bonded to the substrate 191 at the time of mounting to reinforce the connection between the receptacle connector 2 and the substrate 191.

  Next, the receptacle contact 161 attached to the housing 101 will be described. FIG. 11 is a perspective view of the receptacle contact 161. The receptacle contact 161 has a shape in which a flat long plate is bent in an approximately S shape, and includes an approximately S-shaped main body 162 and a tail 163 extending from the main body 162. The main body 162 has a flat side wall 164 whose one end is connected to the tail 163, and an Ω-shaped portion 166 having a Ω-shaped side shape connected to the other end of the side wall 164 via a connecting portion 165. One end of the receptacle contact 161 is located at the tip of the tail 163, and the other end is located at the end 167 of the Ω-shaped portion 166. The tail 163 extends at a substantially right angle with respect to the side wall 164 in a direction opposite to the connecting portion 165. The receptacle contact 161 having such a shape can be formed by press-molding a conductive metal using a metal mold.

  In order to attach the receptacle contact 161 to the housing 101, the receptacle contact 161 is fitted so that the Ω-shaped portion 166 and the side wall 164 of the receptacle contact 161 are fitted into the grooves 115a and 116a as well as the grooves 115b and 116b. Is pressed toward the housing 101 from above. As a result, the Ω-shaped portion 166 and the side wall 164 of the receptacle contact 161 are coupled into the grooves 115 a and 116 a, and similarly into the grooves 115 b and 116 b, and are fixed to the housing 101.

  The receptacle contact 161 of the present embodiment was manufactured by subjecting the entire base of a conductive Cu alloy to Ni base plating by electrolytic plating, and further Au plating thereon.

  The housings 11 and 101 in the plug connector 1 and the receptacle connector 2 of the present embodiment described above can be integrally formed of an insulating material such as a synthetic resin. The re-sectorable contacts 161 in the receptacle connector 2 are provided on the beams 112a and 112b so as to correspond to the same number at the same pitch as the plug connector 1. The dimensions of the housing and the pitch and number of contacts can be changed as appropriate.

  Next, the connection between the plug connector 1 and the receptacle connector 2 will be described. The coupling is made by connecting the coupling surface of the plug connector 1 (upper side in FIG. 2) and the coupling surface of the receptacle connector 2 (upper side in FIG. 8) and connecting the projecting beams 12a and 12b and the bridges 26a and 26b. Is performed by fitting into the concave shape which is formed of the spaces 113a to 113d in the receptacle connector 2. At this time, as shown in the cross-sectional view of FIG. 12, the plurality of plug contacts 61 provided in the plug connector 1 and the plurality of receptacle contacts 161 provided in the receptacle connector 2 are respectively in elastic contact and electrically connected. .

  The electrical connection between the plug contact 61 and the receptacle contact 161 will be described. As shown in the sectional view of FIG. 12, when the plug contact 61 and the receptacle contact 161 are joined, the beams 12a and 12b of the plug connector 1 are inserted into the spaces 113a and 113b in the receptacle connector 2, and The character main body 62 is inserted into the Ω-shaped portion 166 of the receptacle contact 161. Since the Ω-shaped portion 166 has a constricted shape, the constricted portion at the end 167 abuts against the flat first side wall 67 of the plug contact 61 to provide the first contact 70, and the convex portion 68 of the plug contact 61. However, the second contact 71 is brought into contact with the other constricted portion of the Ω-shaped portion 166 of the receptacle contact 161. As a result, the plug contact 61 and the receptacle connector 2 become conductive.

  The board-to-board connector 3 including the plug connector 1 and the receptacle connector 2 according to the present embodiment is a two-point contact connector having two contacts, a first contact 70 and a second contact 71, and therefore is compared with the one-point contact connector. High contact reliability. And, by providing the solder barrier layer 69 between the tail 63 of the plug connector 1 and the adjacent second contact 68 to prevent the solder from rising, the Au layer 72 is provided on the second contact 68, thereby providing good conductivity. And long-term stability.

[Deformation]
Hereinafter, modified forms of the plug connector 1 and the receptacle connector 2 of the present embodiment will be described.

  In the plug connector 1 of the present embodiment, as shown in FIG. 5, the solder barrier layer 69 is formed only on the lower half 64 a, but the solder barrier layer 69 is provided at least between the tail 63 and the convex portion 68. It only has to be done. For example, a solder barrier layer 269 may be formed in both regions of the lower half 264a and the upper half 264b of the second sidewall as in the plug contact 261 shown in FIG. Such a structure can reduce the cost because the amount of gold to be deposited is reduced. Further, like the plug contact 361 shown in FIG. 7, the solder barrier layer 369 is formed only in the region 364d between the tail 363 and the convex portion 368, which is a part of the lower half portion 364a. The solder barrier layer may not be formed in the flat region 364c.

  In the present embodiment and the modification, the protrusion 68 (268, 368) of the plug connector 1 is one place, but a plurality may be formed as necessary. In the present embodiment and the modified embodiment, the convex portions 68 (268, 368) have the flat portions 64c (264c, 364c) on both sides thereof, but protrude from the flat region of the second side wall 64. The flat portions 64c (264c, 364c) on both sides may not be provided. That is, the convex portion 68 (268, 368) may protrude over the entire width direction. (In this case, it can also be seen as protruding from the solder barrier layer).

  In the present embodiment and the modified embodiment, the Au layer 72 (272, 373) is formed in all regions of the lower step portion 68b (268b, 368b) of the convex portion 68 (268, 368), but at least the second contact 71 If the portion where is located is covered with the Au layer, it is not always necessary to cover the entire surface with the Au layer.

  In this embodiment and the modified embodiment, the Ni layer is formed as the solder barrier layer 69. However, the solder barrier layer can be formed of a metal having poor solder wettability, such as Ni, Ni alloy, Cu, Cu alloy, or the like. Among these, Ni or Ni alloy is preferable in terms of oxidation resistance as compared with others.

  In the receptacle connector 2 of the present embodiment and the modified embodiment, the convex shape is not provided in the Ω-shaped portion 166 where the second contact 71 is provided. Further, no solder barrier layer was provided between the tail 163 and the second contact 71. This is because in the present embodiment, the tail portion and the second contact point have a sufficient distance, and the problem of solder rise does not occur even if the solder barrier layer is not provided. However, depending on the size, shape, etc. of the contact, the risk of solder rising may occur. In the receptacle connector 2, a convex shape is provided in the Ω-shaped portion 166, and the tail 163 and the second contact 71 are provided. A solder barrier layer may be provided.

  The substrates 91 and 191 of the present embodiment and the modified embodiments are, for example, printed circuit boards used for electronic devices or the like, but may be any type of substrate such as a flexible printed circuit board (FPC).

  The board-to-board connector of the present invention electrically connects the board and board, and can obtain good conductivity and long-term stability from its structure. Therefore, the board-to-board connector of the present invention can be used as a connector for connecting a circuit board or the like in a small electronic device or the like.

1 Plug connector 2 Receptacle connector 3 Board to board connector

11 Housing 12a, 12b Beam 13 Space 16 Groove 17 Bottom plate 18 Protruding portion 18a Protruding side wall 23 Hole 26a, 26b Bridge 26Ua, 26Ub Bridge upper surface 26Ba, 26Bb Bridge lower surface 51 Neel

61 Plug contact 62 Body 63 Tail 64 Second side wall 64a Lower half part 64b Upper half part 64c Flat region 65 Bent part 67 First side wall 68 Convex part 68a Upper step part 68b Lower step part 68c Step difference 69 Solder barrier layer

70 First contact 71 Second contact 72 Au layer

91 Substrate 191 Substrate

101 Housing 112a, 112b Beam 113 Space 113a, 113b, 113c, 113d Space 114 Raised portion 115a, 115b Groove 116a, 116b Groove 117 Bottom plate 118 Protruding portion 123 Hole 126a, 126b Bridge 151 Nail

161 Receptacle contact 162 Body 163 Tail 164 Side wall 165 Bending part 166 Ω-shaped part 167 End of Ω-shaped part 166

261 Plug contact 264 Second side wall 264a Lower half 264b Upper half 264c Flat region 268 Convex 268b Lower step 269 Solder barrier layer 272 Au layer

361 Plug contact 363 Tail 364a Lower half 364b Upper half 364c Flat region 364d Region 368 between tail 363 and projection 368 Projection 368b Lower step 369 Solder barrier layer 372 Au layer

Claims (7)

In the electrical connector for electrically connecting the first connector provided with the first connector terminal and the second connector provided with the second connector terminal by coupling of the first and second connector terminals,
The first connector terminal has a main body and a tail extending from the main body,
The main body includes a first region that is a protruding region protruding from the main body region, a second region between the first region and the tail, and a third region around the first region. Have
A contact with the second connector terminal is present in the first region;
Of the first region, the second region, and the third region, a Ni layer or a Ni alloy layer and an Au layer formed on the Ni layer or the Ni alloy layer are provided in the first region,
In the second region and the third region, a solder barrier layer made of a Ni layer or a Ni alloy layer is provided,
In the second region, the solder barrier layer is formed up to the boundary with the first region,
In the third region, the solder barrier layer is formed up to a boundary with the first region.   The electrical connector according to claim 1, wherein the tail has an Au layer.   The electrical connector according to claim 1, wherein the first region, the third region, and the tail are exposed on an outer surface of the first connector.   The electrical connector according to claim 1, wherein the first connector terminal is fitted into and attached to the first connector. The first connector terminal is:
A base of the connector terminal having the main body and the tail extending from the main body, wherein the main body is a first area that is the protruding area protruding from the main body area, and a first area; Providing a base having a second region between the tail and a third region around the first region, wherein the contact is in the first region;
Forming a Ni layer or a Ni alloy layer by electrolytic plating in the first region, the second region, and the third region;
Forming an Au layer on the Ni layer or Ni alloy layer by electrolytic plating to form a thicker Au layer in the first region than the second region and the third region;
The electrical connector according to any one of claims 1 to 4, wherein the electrical connector is manufactured by removing an Au layer other than the first region. In a connector provided with a connector terminal having contacts with other connector terminals,
The connector terminal has a main body and a tail extending from the main body,
The main body includes a first region that is a protruding region protruding from the main body region, a second region between the first region and the tail, and a third region around the first region. Have
The contact is in the first region;
Among the first region, the second region, and the third region, a Ni layer or a Ni alloy layer and an Au layer formed on the Ni layer or the Ni alloy layer are provided in the first region,
In the second region and the third region, a solder barrier layer made of a Ni layer or a Ni alloy layer is provided,
In the second region, the solder barrier layer is formed up to the boundary with the first region,
In the third region, the solder barrier layer is formed up to the boundary with the first region. In a manufacturing method of a connector provided with a connector terminal having contacts with other connector terminals,
A connector terminal base having a main body and a tail extending from the main body, wherein the main body is a first region that is a protruding region protruding from the main body region, and between the first region and the tail. A base having a second region and a third region around the first region, wherein the contact is in the first region;
Forming a Ni layer or a Ni alloy layer by electrolytic plating in the first region, the second region, and the third region;
Forming an Au layer on the Ni layer or Ni alloy layer by electrolytic plating to form a thicker Au layer in the first region than the second region and the third region;
Removing the Au layer other than the first region to produce the connector terminal;
A method for manufacturing a connector, comprising: fitting and mounting the manufactured connector terminal into a housing of the connector.

Images