JP2014220285A - Method of manufacturing electrochemical device and electrochemical device, and temporary joint device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique for facilitating temporary joint of a case and a lid, even in a compact electrochemical device.SOLUTION: In a method of manufacturing an electrochemical device, prior to main joining of a lid to a case for housing a power storage element and an electrolyte, the lid is joined temporarily to the case by laser welding. With such an arrangement, the lid can be joined temporarily to the case in non-contact. Consequently, the lid can be joined temporarily to the case even if a space for bringing an electrode for spot welding into contact cannot be ensure, in the process of manufacturing a compact electrochemical device.

Description

  The present invention relates to an electrochemical device manufacturing method, an electrochemical device, and a temporary bonding apparatus.

  The electrochemical device is configured by housing a power storage element and an electrolytic solution in a case sealed with a lid. The power storage element includes a positive electrode sheet, a separator, and a negative electrode sheet, and is sandwiched between the bottom surface in the case and the lid. The lid generally seals the case by being welded to the case.

  Patent Document 1 describes a technique in which a lid is temporarily joined to a case before the lid is finally joined to the case. When the lid is temporarily joined to the case, the lid is held at a position where the case can be sealed. The lid is temporarily joined to the case by spot welding. Thereafter, the lid is joined to the case by seam welding or the like.

JP 2010-251797 A

  In recent years, with the miniaturization and complication of electronic equipment and the like, miniaturization is also required for electrochemical devices used in the electronic equipment. When the lid is temporarily joined to the case, for example, a suction nozzle holds the lid by suction. When the electrochemical device is downsized, it is difficult to secure a space for contacting the spot welding electrode on the lid in a state where the adsorption nozzle adsorbs and holds the lid. On the other hand, if the diameter of the suction nozzle that sucks the lid is reduced, the suction force of the suction nozzle to the lid decreases.

  In view of the circumstances as described above, an object of the present invention is to make it possible to easily perform temporary bonding between a case and a lid even in a small electrochemical device.

  In order to achieve the above object, an electrochemical device manufacturing method according to an embodiment of the present invention provides a method for temporarily bonding a lid to the case by laser welding before the lid is permanently joined to a case containing a storage element and an electrolyte solution. Join.

  An electronic device according to an embodiment of the present invention is manufactured by the above manufacturing method.

The temporary joining apparatus which concerns on one form of this invention comprises a holding | maintenance part, an imaging part, an adsorption | suction part, an irradiation part, and a control part.
The holding unit holds a case for storing the power storage element and the electrolytic solution.
The imaging unit images the case held by the holding unit.
The said irradiation part adsorb | sucks the lid corresponding to the said case, and hold | maintains the said lid in the sealing position which can seal the said case hold | maintained at the said holding | maintenance part.
The irradiation unit irradiates the lid at the sealing position with laser light and joins the lid to the case.
The said control part controls the said irradiation part so that a laser beam may be irradiated to the irradiation position determined based on the image which the said imaging part imaged.

  Even in a small electrochemical device, the temporary bonding between the case and the lid can be easily performed.

1 is a perspective view of an electrochemical device according to a first embodiment of the present invention. It is sectional drawing along the A-A 'line | wire of the electrochemical device shown in FIG. It is a flowchart which shows the manufacturing method of the electrochemical device shown in FIG. It is sectional drawing which shows the manufacturing process of the electrochemical device shown in FIG. It is sectional drawing which shows the manufacturing process of the electrochemical device shown in FIG. It is sectional drawing which shows the manufacturing process of the electrochemical device shown in FIG. It is sectional drawing which shows the manufacturing process of the electrochemical device shown in FIG. It is sectional drawing which shows the manufacturing process of the electrochemical device shown in FIG. It is sectional drawing which shows the manufacturing process of the electrochemical device shown in FIG. It is sectional drawing which shows the temporary joining process of the electrochemical device shown in FIG. It is a schematic block diagram of the temporary joining apparatus used for manufacture of the electrochemical device shown in FIG. It is explanatory drawing of position adjustment with respect to the case of a lid in the manufacturing process of the electrochemical device shown in FIG. It is explanatory drawing of position adjustment with respect to the case of a lid in the manufacturing process of the electrochemical device shown in FIG. It is explanatory drawing of position adjustment with respect to the case of a lid in the manufacturing process of the electrochemical device shown in FIG. It is a schematic block diagram of the temporary joining apparatus shown in FIG. It is a figure which shows the position of the temporary joining in the manufacture process of the electrochemical device shown in FIG. It is a schematic block diagram of the temporary joining apparatus shown in FIG. It is a schematic block diagram of the temporary joining apparatus shown in FIG. It is a schematic block diagram of the temporary joining apparatus which concerns on the 2nd Embodiment of this invention. It is a schematic block diagram of the temporary joining apparatus which concerns on the 2nd Embodiment of this invention. It is a schematic block diagram of the temporary joining apparatus which concerns on the 3rd Embodiment of this invention. It is a schematic block diagram of the temporary joining apparatus which concerns on the 3rd Embodiment of this invention.

In order to achieve the above object, a method for manufacturing an electrochemical device according to an embodiment of the present invention includes performing laser welding of the lid to the case before the lid is fully joined to the case containing the storage element and the electrolytic solution. Temporary joining.
With this configuration, the lid can be temporarily joined to the case in a non-contact manner. Therefore, in the manufacturing process of a small electrochemical device, even when a space for contacting, for example, an electrode for spot welding cannot be secured on the lid, the lid can be temporarily joined to the case.

In the laser welding, the direction of the laser beam may be adjusted using a galvano scanner.
With this configuration, the direction of the laser light emitted from the light source can be adjusted without changing the direction of the light source that emits the laser light.

The lid is temporarily joined to the case in a state where the lid is held at a position where the case can be sealed using an adsorption portion that adsorbs the lid.
With this configuration, the lid can be held by a general method.

In the laser welding, the laser beam may be irradiated from a position facing the case.
With this configuration, it is possible to irradiate a laser beam at an accurate position on the lid. Further, even when a plurality of positions on the lid are irradiated with laser light, the intensity of the laser light becomes uniform at any position.

An adsorption force for adsorbing the lid may be applied to the adsorption portion via an exhaust passage extending from the outside of a region facing the case.
With this configuration, it is possible to easily secure an arrangement space for a light source that emits laser light.

An opening may be formed in the suction portion, and the lid may be irradiated with laser light through the opening.
With this configuration, even when the lid is smaller than the suction portion, the lid can be irradiated with laser light through the opening of the suction portion. Thereby, even in an ultra-small electrochemical device, the case and the lid can be temporarily joined.

An electronic device according to an embodiment of the present invention is manufactured by the above manufacturing method.
With this configuration, the yield of small electronic devices is improved.

The temporary joining apparatus which concerns on one Embodiment of this invention comprises a holding | maintenance part, an imaging part, an adsorption | suction part, an irradiation part, and a control part.
The holding unit holds a case for storing the power storage element and the electrolytic solution.
The imaging unit images the case held by the holding unit.
The said irradiation part adsorb | sucks the lid corresponding to the said case, and hold | maintains the said lid in the sealing position which can seal the said case hold | maintained at the said holding | maintenance part.
The irradiation unit irradiates the lid at the sealing position with laser light and joins the lid to the case.
The said control part controls the said irradiation part so that a laser beam may be irradiated to the irradiation position determined based on the image which the said imaging part imaged.
According to this configuration, the lid can be temporarily joined to the case without contact. Therefore, when the lid is temporarily joined to the case, it is not necessary to secure a space for contacting, for example, an electrode for spot welding to the lid.

The irradiation unit may include a galvano scanner capable of adjusting the direction of laser light.
With this configuration, the irradiation unit can adjust the direction of the laser light emitted from the light source without changing the direction of the light source.

The irradiation unit may be disposed to face the holding unit.
With this configuration, the irradiating unit can irradiate the laser beam at an accurate position on the lid. Further, even when the irradiation unit irradiates laser light to a plurality of positions on the lid, the intensity of the laser light becomes uniform at any position.

The exhaust path may further include an exhaust path that connects the adsorption unit to a pump, and the exhaust path may extend from the outside of the region where the holding unit and the irradiation unit are opposed to the adsorption unit.
With this configuration, it is possible to easily secure the arrangement space of the irradiation unit.

The adsorption part may further include an opening facing the irradiation position.
With this configuration, even when the lid is smaller than the suction portion, the irradiation portion can irradiate the lid with laser light through the opening of the suction portion. Thereby, even in an ultra-small electrochemical device, the case and the lid can be temporarily joined.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawing, an X axis, a Y axis, and a Z axis that are orthogonal to each other are shown as appropriate. The X axis, the Y axis, and the Z axis are common in all drawings.

<First Embodiment>
[Schematic configuration]
FIG. 1 is a perspective view of an electrochemical device 100 according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line AA ′ of the electrochemical device 100 shown in FIG. The electrochemical device 100 according to the present embodiment is configured as a small electric double layer capacitor having a dimension in the X-axis direction of 2.5 mm and a dimension in the Y-axis direction of 3.2 mm, for example.

  The electrochemical device 100 includes a case 11, a seal ring 18, and a lid 12. The case 11 and the lid 12 have a function as a casing of the electrochemical device 100.

  The case 11 is formed in a rectangular parallelepiped shape, and forms a space 11a opened upward in the Z-axis direction. The space 11a is surrounded by a bottom surface 11b of the case 11 and an inner side surface 11c having a rectangular opening shape.

  The seal ring 18 is provided over the entire circumference of the upper edge of the case 11 in the Z-axis direction. The seal ring 18 is provided so that the case 11 and the lid 12 are in close contact with each other by welding.

  The lid 12 is a rectangular flat member that is joined to the seal ring 18 and covers a region surrounded by the seal ring 18. The peripheral edge of the lid 12 is slightly recessed toward the case 11, and the peripheral edge is joined to the seal ring 18. As a result, the space 11 a in the case 11 is airtightly and liquid-tightly closed by the lid 12.

  The case 11 is made of a ceramic material. Specifically, the case 11 is made of, for example, a high temperature co-fired ceramics (HTCC) or a low temperature co-fired ceramics (LTCC: Low Temperature Co-fired Ceramics).

  The case 11 is provided with a positive electrode 14 and a negative electrode 15. The positive electrode 14 and the negative electrode 15 are exposed at both ends in the Y-axis direction of the lower surface of the case 11 in the Z-axis direction. The positive electrode 14 and the negative electrode 15 are made of, for example, a conductive material mainly composed of kovar, tungsten, or silver. The material forming the positive electrode 14 and the negative electrode 15 is preferably formed of a material having a small difference in coefficient of thermal expansion from the ceramic material forming the case 11 at the sintering temperature of the case 11.

  The case 11 is provided with a via 16 extending from the positive electrode 14 upward in the Z-axis direction and penetrating to the bottom surface 11b of the space 11a. More specifically, the positive electrode 14 is drawn to the outer surface of the case 11, extends upward in the Z-axis direction along the outer surface of the case 11, and further extends to the via 16 toward the inside of the case 11 in the Y-axis direction. Yes. The via 16 is also formed of the same material as the positive electrode 14 and the negative electrode 15.

  The negative electrode 15 is drawn to the outer surface of the case 11, extends upward in the Z-axis direction along the outer surface of the case 11, and further extends a predetermined distance toward the inside of the case 11 in the Y-axis direction. The negative electrode 15 is connected to the negative electrode wiring 17 inside the material forming the case 11, and the negative electrode wiring 17 penetrates to the upper end of the side wall of the case 11 in the Z-axis direction. The negative electrode wiring 17 is connected to the seal ring 18 at the upper end of the side wall of the case 11.

  The lid 12 and the seal ring 18 are made of a metal material. Specifically, the lid 12 and the seal ring 18 are made of a conductive material mainly composed of tungsten, kovar, or silver. The material forming the lid 12 and the seal ring 18 is preferably the same material as the material forming the positive electrode 14, the negative electrode 15, and the via 16.

  The electrochemical device 100 includes a power storage element 13 and an electrolytic solution. The power storage element 13 and the electrolytic solution are sealed in the space 11 a of the case 11.

  The power storage element 13 has three rectangular sheets including a positive electrode sheet 13a, a negative electrode sheet 13b, and a separate sheet 13c. Both the positive electrode sheet 13a and the negative electrode sheet 13b are formed of activated carbon. The separate sheet 13c is sandwiched between the positive electrode sheet 13a and the negative electrode sheet 13b, and insulates the positive electrode sheet 13a and the negative electrode sheet 13b. The power storage element 13 is disposed such that the positive electrode sheet 13 a faces the bottom surface 11 b of the case 11 and the negative electrode sheet 13 b faces the lid 12.

  As the electrolytic solution, a general one can be used. The combination of the salt and solvent used for the electrolytic solution can be determined as appropriate. As an electrolytic solution, for example, propylene carbonate can be used as a solvent, and ethylmethylimidazolium tetrafluoroborate can be used as a salt. The salt concentration of the electrolytic solution can be set to 2 mol / l, for example.

  The electrochemical device 100 includes a positive electrode current collector film 19 that is a current collector film on the positive electrode side of the electricity storage element 13. The positive electrode current collector film 19 is provided on the bottom surface 11 b of the case 11. In the electrochemical device 100, the lid 12 also functions as a negative electrode current collector film.

  The power storage element 13 is provided with conductive adhesive layers 20 and 21 on both sides facing the Z-axis direction. More specifically, the conductive adhesive layer 20 is provided on the positive electrode sheet 13 a of the electricity storage element 13 via the positive electrode current collector film 19, and the conductive adhesive layer 21 is provided on the negative electrode sheet 13 b of the electricity storage element 13.

  Therefore, the positive electrode sheet 13 a is connected to the via 16 exposed on the bottom surface 11 b of the case 11 through the positive electrode current collecting film 19 and the conductive adhesive layer 20. The negative electrode sheet 13 b is connected to the negative electrode wiring 17 through the conductive adhesive layer 21, the lid 12, and the seal ring 18.

  The electrochemical device 100 can store electric power in the electric storage element 13 by applying a voltage between the positive electrode 14 and the negative electrode 15 with the above configuration, and can also store electric power stored in the electric storage element 13 in the positive electrode. 14 and the negative electrode 15.

[Method of Manufacturing Electrochemical Device 100]
(Overview)
FIG. 3 is a flowchart showing a method for manufacturing the electrochemical device 100. 4A to 4C are cross-sectional views in the manufacturing process of the case unit 200 of the electrochemical device 100. 5A and 5B are cross-sectional views in the manufacturing process of the lid unit 300 of the electrochemical device 100. FIG. 6 and 7 are cross-sectional views in the process of joining the case unit 200 and the lid unit 300 to each other. Hereinafter, an outline of a method for manufacturing the electrochemical device 100 will be described with reference to FIG.

  First, the structure of the case 11 shown in FIG. 4A is prepared. The structure of the case 11 is configured as a ceramic sintered body in which electrodes and the like are formed using a ceramic lamination technique. A seal ring 18 is provided on the side wall of the case 11.

  In step S <b> 1, the conductive adhesive layer 20 is formed in the case 11. Thereby, the conductive adhesive layer 20 is connected to the via 16. In step S <b> 2, the positive electrode sheet 13 a is inserted into the case 11. Specifically, the positive electrode sheet 13 a is provided on the conductive adhesive layer 20 via the positive electrode current collector film 19. In step S3, the positive electrode sheet 13a is dried. FIG. 4B shows the state after step S3.

  In step S4, an electrolytic solution is injected into the case 11. The injection amount of the electrolytic solution can be determined as appropriate. Thereby, electrolyte solution fully osmose | permeates the positive electrode sheet 13a. In step S <b> 5, the separator 13 c is inserted into the case 11. Specifically, the separator 13c is provided on the positive electrode sheet 13a. FIG. 4C shows the state after step S5. Thereby, the case unit 200 is completed.

  In step S <b> 6, the conductive adhesive layer 21 is formed on the inner surface of the lid 12. FIG. 5A shows the state after step S6. In step S <b> 7, the negative electrode sheet 13 c is inserted into the lid 12. Specifically, the negative electrode sheet 13 b is provided on the conductive adhesive layer 21. In step S8, the negative electrode sheet 13b is dried. In step S <b> 9, an electrolytic solution is injected into the lid 12. The injection amount of the electrolytic solution can be set to an amount that can penetrate the negative electrode sheet 13b. FIG. 5B shows the state after step S9. Thereby, the lid unit 300 is completed.

  FIG. 6 is a cross-sectional view illustrating a process in which the lid unit 300 sucked by the suction nozzle 3 moves onto the case unit 200. FIG. 7 is a cross-sectional view showing a state where the lid unit 300 sucked by the suction nozzle 3 is positioned on the case unit 200. In the state shown in FIG. 7, the lid 12 is in contact with the seal ring 18, and the suction nozzle 3 holds the lid unit 300 by suction. Further, the negative electrode sheet 13b is in contact with the separator 13c.

  In step S10, the case unit 200 and the lid unit 300 are temporarily joined in the state shown in FIG. Specifically, the case 12 is joined to the seal ring 18 by laser welding by irradiating the four corners of the case 12 with laser light L. Details of the temporary joining step in step S10 will be described later.

  In step S11, the case unit 200 and the lid unit 300 are finally joined. Specifically, first, as shown in FIG. 7, the suction holding of the case unit 200 by the suction nozzle 3 is released. Then, the laser beam L is continuously irradiated along the four sides of the lid 12 so that the lid 12 and the seal ring 18 are joined by laser welding over the entire circumference. Thereby, the lid 12 seals the case 11.

  Seam welding (resistance welding) may be used for the main joining between the case unit 200 and the lid unit 300. However, by using non-contact laser welding for the main joining between the case unit 200 and the lid unit 300, the positional deviation of the case unit 200 with respect to the lid unit 300 is prevented. In laser welding, no impact is applied to the case unit 200 and the lid unit 300, so that the yield of the electrochemical device 100 is improved.

(Temporary joining method of case unit 200 and lid unit 300)
In the present embodiment, the temporary joining between the case unit 200 and the lid unit 300 is performed using the temporary joining device 1. In the drawings in the following description, configurations other than the case 11 of the case unit 200 and configurations other than the lid 12 of the lid unit 300 are omitted as appropriate.

  FIG. 8 is a schematic diagram of the temporary joining apparatus 1 according to the present embodiment. The temporary joining apparatus 1 includes a main body 2, a suction nozzle 3 extending downward from the main body 2 in the Z-axis direction, a camera 4 provided on the lower surface of the main body 2 in the Z-axis direction, and a case unit 200 that holds the case unit 200 in a predetermined position. And a control unit 10 provided in the main body 2.

  The suction nozzle 3 is configured as a cylindrical pipe member having an exhaust passage 3a. The lower end in the Z-axis direction of the suction nozzle 3 is configured as a suction portion 3b that can suck the lid 12 by a suction force by a pump (not shown) connected to the main body 2. The suction nozzle 3 is movable in the X-axis direction, the Y-axis direction, and the Z-axis direction under the control of the control unit 10. The temporary bonding apparatus 1 may be configured such that only the suction nozzle 3 is movable, or may be configured such that the suction nozzle 3 is movable together with the main body 2.

  Further, the suction nozzle 3 is rotatable about a central axis parallel to the Z-axis direction passing through the center of the exhaust passage 3a. That is, the suction nozzle 3 can change the directions of the lid 12 in the X-axis direction and the Y-axis direction. Therefore, when the orientation of the sucked lid 12 and the orientation of the case 11 are not aligned, the temporary joining device 1 rotates the suction nozzle 3 to change its posture. Thereby, the temporary joining apparatus 1 can match the direction of the lid 12 with the direction of the case 11.

  The camera 4 is configured as an imaging unit that images the case unit 200 from above in the Z-axis direction and outputs the captured image to the control unit 10. The control unit 10 calculates an accurate position of the seal ring 18 of the case unit 200 by analyzing an image captured by the camera 4. And the temporary joining apparatus 1 moves the lid unit 300 with the suction nozzle 3 according to the position and attitude | position of the seal ring 18 based on the calculation result of the control part 10. FIG.

  9A to 9C are schematic diagrams illustrating a process of moving the lid 12 of the lid unit 300 onto the seal ring 18 of the case unit 200 held by the holding unit 9 in the temporary joining device 1.

  As shown in FIG. 9A, the suction nozzle 3 rotates and the direction of the lid unit 300 is adjusted to the direction of the case unit 200. Next, as illustrated in FIG. 9B, the suction nozzle 3 moves in the X-axis direction and the Y-axis direction, and the lid unit 300 is disposed above the case unit 200 in the Z-axis direction. 9C, the suction nozzle 3 moves downward in the Z-axis direction, and the lid 12 of the lid unit 300 is brought into contact with the entire circumference of the seal ring 18 of the case unit 200.

  FIG. 10 is a view showing a state in which the temporary joining apparatus 1 holds the lid unit 300 on the case unit 200 by the suction nozzle 3. FIG. 11 is a diagram showing a temporary joining position M in the lid 12.

  As shown in FIG. 10, the lid unit 300 is temporarily joined to the case unit 200 in a state where the suction nozzle 3 sucks and holds the lid unit 300 at an accurate position. Thereby, in the temporary joining apparatus 1, the position shift with respect to the case unit 200 of the lid unit 300 at the time of temporary joining is prevented.

  FIG. 11 shows the temporary joining position M at which temporary joining is performed on the lid 12 with cross marks. In the present embodiment, the laser beam L is irradiated to the temporary bonding positions M at the four corners of the irradiation unit lid 12, thereby temporarily bonding the lid 12 of the lid unit 300 to the seal ring 18 of the case unit 200. The temporary joining position M in the lid 12 may be a position along the seal ring 18 and is appropriately determined. Further, the number of the temporary joining positions M may be any number as long as it is one or more, but it is preferable that the positions are a plurality of mutually targetable positions.

  12A and 12B are schematic views of the temporary joining apparatus 1. FIG. The temporary bonding apparatus 1 includes a light source 5 that emits laser light L, a galvano scanner 6 that can adjust the direction of the laser light L emitted from the light source 5, and an inert gas introduction unit that blows out an inert gas toward the lid 12. 7 is further provided.

  The light source 5 and the galvano scanner 6 constitute an irradiation unit 8 for irradiating the laser beam L to a predetermined temporary joining position M of the lid 12. As shown in FIGS. 12A and 12B, the direction of the laser light L emitted from the light source 5 is adjusted by the galvano scanner 6 so as to enter each temporary joining position M. Thereby, the lid unit 300 is laser-welded to the case unit 200 at each temporary joining position M.

  The light source 5 and the galvano scanner 6 are controlled by the control unit 10. Specifically, the control unit 10 controls the timing of emission of the laser light L by the light source 5 and the adjustment of the direction of the laser light L by the galvano scanner 6. The control unit 10 calculates an accurate temporary joining position M of the lid unit 300 by analyzing an image captured by the camera 4. And the temporary joining apparatus 1 irradiates the laser beam L to the temporary joining position M of the lid unit 300 by the irradiation part 8 based on the calculation result of the control part 10.

  Laser welding conditions can be adjusted as appropriate. In the present embodiment, the laser beam irradiated by the irradiation unit 8 is a fiber laser. The wavelength of the laser beam was 1080 nm, and the output of the laser beam was 100 W.

  The inert gas introduction unit 7 blows out the inert gas toward the temporary joining position M so that the lid 12 and the like are not burnt due to oxidation in laser welding. Nitrogen, helium, argon, etc. are employable as an inert gas which the inert gas introduction part 7 blows off.

  The configuration of the inert gas introduction unit 7 can be determined as appropriate. In the temporary bonding apparatus 1, two inert gas introduction parts 7 are used as shown in FIG. 12B. Each inert gas introduction part 7 has an angle α with respect to the XY plane of 60 °, and an opening angle β between the inert gas introduction parts 7 is 15 °. Further, nitrogen was used as the inert gas, and the flow rate of nitrogen gas was 20 l / min. Moreover, the distance from the center of the upper surface of the lid 12 in each inert gas introduction part 7 was 10 mm.

  Note that, in general temporary welding by spot welding, since the electrode for spot welding needs to be brought into contact with the lid at the time of temporary bonding, the position of the lid may deviate from the position of the case. Further, in spot welding, an impact is applied to the lid and the case due to the contact of the electrodes, so that each configuration of the case unit and the lid unit may be damaged. As such a case, for example, a case where the electrolytic solution in the case adheres between the seal ring and the lid can be mentioned. In this case, a bonding failure between the lid and the case may occur. On the other hand, since temporary joining by laser welding is non-contact, there is no occurrence of displacement of the lid with respect to the case, and no impact is applied to the lid and the case.

  Moreover, since the temporary joining by general spot welding is performed as resistance welding, it is necessary to flow an electric current through a welding position for a fixed time, and it is difficult to shorten welding time. On the other hand, the temporary joining by laser welding can shorten the welding time by appropriately setting the conditions.

  Furthermore, since the lid is generally formed by punching, burrs are generated at the end portions thereof. In spot welding, an excessive Joule heat is generated in the burr, so that the spot welding electrode may be consumed. Therefore, in spot welding, it takes time and effort to remove the burr of the lid. On the other hand, in the temporary joining by laser welding, since the burrs are not overheated, the above problem due to the burr of the lid does not occur.

  Thus, according to the temporary joining apparatus 1 which concerns on this embodiment, while the lid unit 300 is correctly joined to the case unit 200, the welding time of the lid unit 300 and the case unit 200 can be shortened. Therefore, according to the temporary bonding apparatus 1, the yield of the electrochemical device 100 is improved, and the tact time for temporary bonding between the lid unit 300 and the case unit 200 is shortened.

<Second Embodiment>
13A and 13B are schematic views of a temporary bonding apparatus 31 according to the second embodiment of the present invention. The temporary bonding apparatus 31 according to the present embodiment is configured in the same manner as the temporary bonding apparatus 1 according to the first embodiment, except for the configuration described below. About the structure similar to the temporary joining apparatus 1 which concerns on 1st Embodiment, while attaching | subjecting the same code | symbol in FIG. 13A and FIG. 13B, the description is abbreviate | omitted suitably.

  In the temporary joining device 31, the suction portion 33 b that sucks the lid unit 300 is offset from the main body 2 in the Y-axis direction. Specifically, the suction nozzle 33 is configured as a pipe member that extends a predetermined distance downward from the main body 2 in the Z-axis direction, bends in the Y-axis direction and extends for a predetermined distance, and further bends downward in the Z-axis direction and extends to the suction portion 33b. Is done. The exhaust passage 33 a inside the suction nozzle 33 is also bent together with the suction nozzle 33.

  In the temporary joining apparatus 11, since the main body 2 is not located above the suction portion 33b of the suction nozzle 33, that is, above the holding portion 9 that holds the case unit 200, the irradiation unit 8 is located above the suction portion 33b in the Z-axis direction. Can be arranged. Therefore, the irradiation unit 8 of the temporary bonding apparatus 31 can be disposed to face the holding unit 9 that holds the case unit 200. That is, the lid unit 300, the case unit 200, and the holding unit 9 sucked by the suction part 33 b of the suction nozzle 33 are arranged so as to face the Z-axis direction.

  Accordingly, since the laser beam L is emitted from almost immediately above the temporary bonding position M of the lid unit 300 in the temporary bonding apparatus 31, the laser beam L is emitted more than when the laser beam L is irradiated obliquely to the lid unit 300. The light enters the more accurate temporary joining position M. Thereby, in the temporary joining apparatus 31, the irradiation position of the laser beam L by the irradiation part 8 is prevented from deviating from the temporary joining position M. Therefore, in the temporary bonding apparatus 31, temporary bonding failure can be suppressed.

  Furthermore, in the temporary joining apparatus 31, since the irradiation part 8 irradiates the laser beam L from almost right above the temporary joining position M of the lid unit 300, the distance between the irradiation part 8 and each temporary joining position M becomes substantially equal. Therefore, the intensity of the laser beam L at each temporary joining position M becomes uniform, and the lid unit 300 is joined to the case unit 200 at the same degree at each temporary joining position M.

<Third Embodiment>
14A and 14B are schematic views of a temporary bonding apparatus 41 according to the third embodiment of the present invention. The temporary bonding apparatus 41 according to the present embodiment is configured in the same manner as the temporary bonding apparatus 1 according to the first embodiment, except for the configuration described below. About the structure similar to the temporary joining apparatus 1 which concerns on 1st Embodiment, while attaching | subjecting the same code | symbol in FIG. 14A and FIG. 14B, the description is abbreviate | omitted suitably.

  In the temporary bonding apparatus 41, as in the temporary bonding apparatus 31 according to the second embodiment, the suction portion 43b that sucks the lid unit 300 is offset from the main body 2 in the Y-axis direction.

  The temporary joining device 41 includes a plate-like suction plate 43 extending from the main body 2 in the Y-axis direction. The suction plate 43 is provided with a suction portion 43b having a rectangular opening on the lower surface in the Z-axis direction, and an exhaust passage 43a extending from the suction portion 43b into the suction plate 43. Further, the temporary joining device 41 includes a connecting portion 42 that extends downward from the main body 2 in the Z-axis direction and connects the main body 2 and the suction plate 43. The connection portion 42 is provided with an exhaust passage 42 a that connects the exhaust passage 43 a of the suction plate 43 to the main body 2.

  In the temporary joining device 41, the camera 4 is provided on the lower surface of the suction plate 43 below the connection portion 42. However, the position of the camera 4 can be determined as appropriate, and the camera 4 may be provided on the lower surface in the Z-axis direction of the main body 2 as in the first embodiment and the second embodiment.

  In the temporary joining device 41, since the main body 2 is not located above the suction portion 43b of the suction plate 43 in the Z-axis direction, the irradiation unit 8 can be disposed above the suction portion 43b in the Z-axis direction. Therefore, the irradiation unit 8 of the temporary bonding apparatus 41 is disposed so as to face the lid unit 300, the case unit 200, and the holding unit 9 that are adsorbed by the adsorption unit 43 b of the adsorption plate 43 in the Z-axis direction.

  The dimension in the Y-axis direction of the suction plate 43 is larger than the dimension in the Y-axis direction from the lid unit 200. The suction plate 43 is provided with an opening 43 c at a position corresponding to the temporary joining position M of the lid unit 200. In the temporary bonding apparatus 41, the irradiation unit 8 irradiates the laser beam L into the opening 43 c of the suction plate 43. Thereby, the laser beam L irradiated by the irradiation unit 8 is irradiated to the temporary joining position M of the lid unit 200 through the opening 43c.

  In the temporary bonding apparatus 41, the laser light L is irradiated from almost right above the temporary bonding position M of the lid unit 300, so that the laser light L passes through the opening 43c of the suction plate 43 and the temporary bonding position M of the lid unit 200. Is incident on. On the other hand, when the laser light L is irradiated obliquely onto the lid unit 300, the laser light L may not enter the opening 43c and may enter the side surface of the opening 43c, for example.

  Thus, in the temporary joining apparatus 41, the opening part 43c is provided in the adsorption | suction board 43, and the irradiation part 8 is provided just above the adsorption part 43b, and thereby the irradiation part 8 passes through the opening part 43c. The laser beam L can be irradiated to the temporary joining position M of the lid unit 200. The position of the irradiation unit 8 can be changed according to the thickness of the suction plate 43 and the size of the opening 43c. That is, the temporary joining device 41 may be configured so that the laser light L irradiated by the irradiation unit 8 can pass through the opening 43c of the suction plate 43.

  The temporary joining apparatus 41 according to the present embodiment is very effective particularly when the electrochemical device is further downsized. That is, when the lid unit 300 is sucked and held using the suction nozzle, the suction nozzle may block the temporary joining position M of the lid unit 300 in some cases. On the other hand, in the suction plate 43 according to the present embodiment, when the suction plate 43 is larger than the lid unit 300, the temporary joining position M of the lid unit 300 can be exposed by the opening 43c. Therefore, the temporary bonding apparatus 41 can temporarily bond the lid unit 300 to the case unit 200 even when the electrochemical device is further downsized.

  The embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  For example, the electrochemical device to which the present invention is applicable is not limited to an electric double layer capacitor. The electrochemical device may be an electrochemical capacitor other than an electric double layer capacitor. Examples of such an electrochemical capacitor include a PAS (Poly Acid Semiconductor) capacitor. In this case, both the positive electrode sheet 13a and the negative electrode sheet 13b of the electricity storage unit 13 may be formed of a polyacene organic semiconductor. Furthermore, the present invention can be applied to electrochemical devices other than capacitors such as lithium ion secondary batteries.

DESCRIPTION OF SYMBOLS 1 ... Temporary joining apparatus 2 ... Main body 3 ... Adsorption nozzle 4 ... Camera 5 ... Light source 6 ... Galvano scanner 7 ... Inert gas introduction part 8 ... Irradiation part 9 ... Holding part 10 ... Control part 100 ... Electrochemical device 200 ... Case unit 300 ... Lid unit

Claims (12)

A method for manufacturing an electrochemical device, wherein the lid is temporarily joined to the case by laser welding before the lid is fully joined to the case containing the storage element and the electrolytic solution. A method for producing an electrochemical device according to claim 1,
In the laser welding, a method for manufacturing an electrochemical device in which the direction of laser light is adjusted using a galvano scanner. The electrochemical device according to claim 1 or 2,
A method for manufacturing an electrochemical device, wherein the lid is temporarily joined to the case in a state where the lid is held at a position where the case can be sealed using an adsorption portion that adsorbs the lid. A method for producing an electrochemical device according to claim 3,
In the laser welding, a method for manufacturing an electrochemical device in which laser light is irradiated from a position facing the case. A method for producing an electrochemical device according to claim 4,
The method for manufacturing an electrochemical device, wherein an adsorption force for adsorbing the lid is applied to the adsorption portion via an exhaust passage extending from an outer side of a region facing the case. A method for producing an electrochemical device according to any one of claims 3 to 5,
An electrochemical device manufacturing method, wherein an opening is formed in the adsorption portion, and the lid is irradiated with laser light through the opening. The electrochemical device manufactured by the manufacturing method of any one of Claim 1 to 6. A holding unit for holding a case for storing the power storage unit and the electrolytic solution;
An imaging unit that images the case held by the holding unit;
An adsorption part that adsorbs the lid corresponding to the case and holds the lid in a sealing position capable of sealing the case held by the holding part;
An irradiation unit that irradiates the lid at the sealing position with laser light and joins the lid to the case;
A temporary joining apparatus comprising: a control unit that controls the irradiation unit to irradiate a laser beam to an irradiation position determined based on an image captured by the imaging unit. The temporary joining device according to claim 8,
The irradiation unit includes a galvano scanner capable of adjusting the direction of laser light. The temporary joining device according to claim 8 or 9,
The irradiation unit is disposed to face the holding unit. The temporary joining device according to claim 10,
Further comprising an exhaust passage connecting the adsorption part to a pump;
The exhaust path extends from the outside of the facing region between the holding unit and the irradiation unit to the adsorption unit. The temporary joining device according to claim 10 or 11,
The suction unit further includes an opening facing the irradiation position.

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