JP2014217529A5 - - Google Patents
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- Publication number
- JP2014217529A5 JP2014217529A5 JP2013098027A JP2013098027A JP2014217529A5 JP 2014217529 A5 JP2014217529 A5 JP 2014217529A5 JP 2013098027 A JP2013098027 A JP 2013098027A JP 2013098027 A JP2013098027 A JP 2013098027A JP 2014217529 A5 JP2014217529 A5 JP 2014217529A5
- Authority
- JP
- Japan
- Prior art keywords
- thermal drain
- ultrasonic probe
- thermal
- drain
- casing wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000523 sample Substances 0.000 claims 17
- 238000002604 ultrasonography Methods 0.000 claims 7
- 210000001331 Nose Anatomy 0.000 claims 5
- 229920000642 polymer Polymers 0.000 claims 5
- 239000000463 material Substances 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 3
- 239000000789 fastener Substances 0.000 claims 2
Claims (20)
前記鼻状部の端部にあるレンズと、
前記レンズの後方で前記鼻状部内にある超音波振動子と、
前記振動子を前記ケーシング壁に熱的に結合する熱ドレインであって、前記ケーシング壁を形成する材料の熱抵抗よりも低い熱抵抗を有する材料から形成された熱ドレインと
を備える、超音波プローブ。 A nose with an outer polymeric casing wall;
A lens at the end of the nose,
An ultrasound transducer in the nose behind the lens;
An ultrasonic probe comprising: a thermal drain that thermally couples the vibrator to the casing wall, the thermal drain being formed from a material having a thermal resistance lower than that of a material forming the casing wall. .
前記超音波振動子からの熱を、熱ドレインを横切って前記超音波プローブの外部高分子ケーシングへと熱伝導するステップと
を含み、
前記熱ドレインは、前記外部高分子ケーシングと接触し、なおかつ構造的に前記外部高分子ケーシングを支持するものであり、
前記外部高分子ケーシングは、3mm以下の厚さのケーシング壁を有する
方法。 Generating ultrasonic vibrations in an ultrasonic probe using an ultrasonic transducer;
The heat from the ultrasonic vibrator, seen including a step of heat conduction and across the heat drain to the outside polymer casing of the ultrasonic probe,
The thermal drain is in contact with the outer polymer casing and structurally supports the outer polymer casing;
The outer polymer casing has a casing wall with a thickness of 3 mm or less .
前記熱ドレインの周りに前記外部高分子ケーシングをオーバーモールドするステップと
をさらに含む、請求項14記載の方法。 Forming the thermal drain;
The method of claim 14, further comprising overmolding the outer polymeric casing around the thermal drain.
前記金属製の熱ドレインの周りに外部高分子ケーシングをオーバーモールドするステップと、
前記熱ドレイン内に超音波プローブ振動子を位置付けるステップと
を含む、方法。 Forming a metal thermal drain;
Overmolding an outer polymeric casing around the metallic thermal drain;
Positioning an ultrasonic probe transducer within the thermal drain.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013098027A JP6176834B2 (en) | 2013-05-08 | 2013-05-08 | Thermal drain of ultrasonic probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013098027A JP6176834B2 (en) | 2013-05-08 | 2013-05-08 | Thermal drain of ultrasonic probe |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014217529A JP2014217529A (en) | 2014-11-20 |
JP2014217529A5 true JP2014217529A5 (en) | 2016-06-16 |
JP6176834B2 JP6176834B2 (en) | 2017-08-09 |
Family
ID=51936588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013098027A Active JP6176834B2 (en) | 2013-05-08 | 2013-05-08 | Thermal drain of ultrasonic probe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6176834B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6408163B2 (en) | 2015-09-18 | 2018-10-17 | 富士フイルム株式会社 | Photoacoustic measurement probe, probe unit including the same, and photoacoustic measurement apparatus |
JP6122090B1 (en) * | 2015-11-26 | 2017-04-26 | 株式会社日立製作所 | Ultrasonic probe |
JP6548234B2 (en) | 2017-11-30 | 2019-07-24 | ゼネラル・エレクトリック・カンパニイ | Ultrasonic probe and ultrasonic image display apparatus |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4632800B2 (en) * | 2005-01-28 | 2011-02-16 | 株式会社東芝 | Ultrasonic probe |
JP2006158483A (en) * | 2004-12-03 | 2006-06-22 | Matsushita Electric Ind Co Ltd | Ultrasonic probe |
-
2013
- 2013-05-08 JP JP2013098027A patent/JP6176834B2/en active Active
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