JP2014214488A - Film for thermal laminate for resin foam, and building material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a new film for a thermal laminate for a resin foam, which can suitably apply the thermal laminate to the resin foam, as a protective film for the resin foam, and which can impart sufficient moisture-proof properties.SOLUTION: A film for a thermal laminate for a resin foam includes a joint layer (A) that contains an ethylene-based copolymer, and a resin layer (B) that contains a thermoplastic resin higher in melting point than the ethylene-based copolymer of the joint layer (A).

Description

  The present invention relates to a thermal laminate film for resin foam that can be used as a protective film for building materials such as heat insulating materials (referred to as “building material” in the present invention), and a building material using the same.

Thermal insulation materials used for walls and ceilings of houses and condominiums are made of resin foam or glass wool. Since this type of heat insulating material contains many voids (air parts) inside, it is structurally easy to take moisture into the inside and hardly release it, so the surface is generally covered with a moisture-proof film. It is.
In particular, in the case of a heat insulating material using a resin foam, it is formed of extremely small bubbles and a thin bubble film surrounding the bubbles, and has a high volume fraction of gas and low convection. Because of its softness, it may be scratched or chipped by contact. Further, since the bubble film is thin, it has problems such as easy moisture absorption and poor weather resistance. Therefore, by covering the surface of the resin foam with a protective film, it is necessary to protect the surface of the resin foam from scratches and chips and to improve moisture resistance.

  Therefore, for example, in Patent Document 1, one surface and both side surfaces of a flat heat insulating material body are covered with a covering sheet, and the other surface is covered with a moisture-proof film made of a polyolefin film having a thickness of 0.05 mm to 0.15 mm. The heat insulating material provided with the structure which becomes is proposed.

Patent Document 2 discloses a heat insulating material in which a moisture-proof film is bonded to one surface side of a surface-shaped heat insulating material main body.
In Patent Document 3, paper such as kraft paper, synthetic resin film with polyethylene film, metal foil such as aluminum foil and steel foil, non-woven fabric, and a sheet obtained by laminating these appropriately are attached to the front and back surfaces of the hard heat insulating layer. By doing so, it is disclosed that the surface protection of the heat insulating layer and the waterproof / moisture-proof function are imparted.

  Patent Document 4 discloses a heat insulating material formed by coating one surface or the entire surface of a heat insulating material with a moisture-proof film. Examples of the moisture-proof film include films of thermoplastic resins such as polyethylene, polyvinyl chloride, polyvinylidene chloride, polyester, and polycarbonate, laminates thereof, those obtained by vapor-depositing a metal such as aluminum, dissimilar resin films, and aluminum. The thing which laminated the foil etc. is mentioned.

  Patent Document 5 discloses a heat insulating material having a configuration in which a moisture-proof film is bonded to one surface of a heat-insulating mat made of inorganic fibers via an adhesive layer, and a suitable example of the moisture-proof film is disclosed. As a film of thermoplastic resin such as polyethylene, polyvinyl chloride, polyvinylidene chloride, polyester, polycarbonate, etc., laminates of these, metal such as aluminum deposited on these, different types of resin films, aluminum foil, etc. were laminated Things are listed.

  Further, Patent Document 6 discloses a natural organic compound having a metal vapor-deposited film and at least one kind of unsaturated bond on at least one side of a resin substrate as a heat insulating board film having excellent heat ray reflectivity and moisture resistance. A film for heat insulation board is disclosed in which a polymer resin film containing a polymer compound obtained by polymerizing is laminated.

JP 08-27918 A JP 2000-328689 A JP 2000-240184 A JP 2001-32398 A JP 2007-291838 A JP 2002-331607 A JP 2006-335063 A JP 2008-110509 A

In this type of heat insulating material, in order to attach a protective film such as a moisture-proof film to a resin foam, it is possible to securely bond and a hot melt such as ethylene-vinyl acetate copolymer resin from the viewpoint of short bonding time. It was common to use a system adhesive or the like.
However, when applying a moisture-proof film to a resin foam using a hot-melt adhesive, the adhesive is usually not applied / coated on the entire surface, but is applied / applied partially at appropriate intervals. Since they are bonded after being worked, there is a problem in that they cannot be brought into close contact with each other, and the unbonded portion is lifted up or is easily damaged or torn.

  In order to solve this problem, the present inventor has conceived that a protective film is thermally laminated and adhered to a resin foam by using a thermal laminating film as a protective film.

  Regarding the heat laminating film, for example, in Patent Document 7, it is composed of a protective layer (A), an intermediate layer (B), and a bonding layer (C), and the protective layer (A) is polymerized using a single site catalyst. The propylene / α-olefin copolymer, the intermediate layer (B) is made of a thermoplastic resin mainly composed of ethylene, and the bonding layer (C) is polymerized using (c1) a single site catalyst. · Α-olefin copolymer, (c2) ethylene / vinyl acetate copolymer, or (c3) ethylene / (meth) acrylic acid ester copolymer, for thermal lamination formed by multilayer inflation molding method A film is disclosed.

  Patent Document 8 discloses a laminate sheet for lamination produced by a T-die multilayer coextrusion method composed of a protective layer (A), an intermediate layer (B), and a bonding layer (C). (A) is composed of a propylene polymer polymerized using a single site catalyst, and the intermediate layer (B) is mainly composed of a propylene / α-olefin copolymer polymerized using a single site catalyst. There is disclosed a film for heat laminating comprising a thermoplastic resin, and the bonding layer (C) comprising an ethylene / α-olefin copolymer polymerized using a single site catalyst.

  Conventionally, an example using a heat laminating film as a protective film for a heat insulating material made of a resin foam has not been known. Therefore, when we used the conventional thermal laminating film as a protective film as it was, it was difficult to apply pressure when thermally laminating the protective film to a thick resin foam, so the adhesion to the resin foam was sufficient. It has been found that there are problems such as being unable to obtain a sufficient moisture resistance and scratch resistance.

  The present invention provides a new heat for resin foam that can be suitably heat laminated to a resin foam as a protective film for the resin foam, and that can provide sufficient moisture resistance and scratch resistance. It is intended to provide a film for laminating and a building material using the same.

The present invention relates to a joining layer (A) containing an ethylene copolymer having a melting point of 50 to 105 ° C., and a thermoplastic resin having a higher melting point than the ethylene copolymer of the joining layer (A). And a resin layer (B) formed therein, and a film for heat lamination for a resin foam characterized by having a thickness of 20 μm to 200 μm is proposed.
The present invention is also a building material having a structure in which the surface of a resin foam is covered with a protective film as a building material using the thermal laminating film as a protective film, and the protective film has a melting point of 50 to 50. A bonding layer (A) containing an ethylene copolymer at 105 ° C., and a resin layer (B) containing a thermoplastic resin having a melting point higher than that of the ethylene copolymer of the bonding layer (A) And a building material having a configuration in which the protective film is thermocompression-bonded to a resin foam. The construction material is a laminated film having a thickness of 20 μm to 200 μm.

  The heat laminate film for resin foam proposed by the present invention can be thermocompression bonded to the resin foam without using a hot melt adhesive, which can improve the productivity of building materials, for example. it can. In addition, since the entire film can be brought into close contact with the resin foam instead of being partially bonded, not only can it be partly lifted, it can be made very clean, and it is also sufficient for building materials. Moisture resistance and scratch resistance can be imparted. Therefore, it can be suitably used as, for example, a protective film for building materials such as a heat insulating material.

It is the schematic which shows the laminating apparatus used in the Example.

  Next, an embodiment for carrying out the present invention will be described. However, the present invention is not limited to the embodiments described below.

<Main building material>
A building material (referred to as “main building material”) according to an example of the embodiment of the present invention is a heat insulating material having a configuration in which the surface of a core material made of a resin foam is covered with a protective film. However, other members may be provided.

<Resin foam>
As the resin foam (core material) of the building material, a synthetic resin foam having closed cells is preferable from the viewpoint of lightness, water resistance, heat insulation, and the like.
Specifically, for example, a polyurethane foam, a phenol foam, a polyvinyl chloride foam, a melamine foam in addition to a thermoplastic resin foam such as a polystyrene foam, a polyethylene foam, and a polypropylene foam. Examples thereof include synthetic resin foams such as bodies. Among them, a polystyrene foam molded by an extrusion method is particularly preferable from the viewpoint of high heat insulation and low water absorption.

The shape and size of the resin foam are arbitrary. However, it is usually plate-shaped.
When the resin foam is plate-shaped, it is preferable to attach protective sheets to the front and back surfaces.

<Protective film>
As a protective film of this building material (referred to as “the present protective film”), a bonding layer (A) containing an ethylene copolymer and a melting point higher than that of the ethylene copolymer of the bonding layer (A) Using a heat laminating film composed of a laminated film comprising a resin layer (B) containing a high thermoplastic resin and other layers as necessary, for example, a support layer (C) and an intermediate layer (D) Is preferably formed.
The film for thermal lamination means a film that can be heated and thermocompression-bonded, that is, thermally laminated without using an adhesive.

(thickness)
From the viewpoint of imparting sufficient adhesion, moisture resistance and scratch resistance as a protective sheet for building materials, the thickness of the protective film is preferably 20 μm to 200 μm, more preferably 20 μm or more or 150 μm or less, and particularly preferably 40 μm or more or 100 μm or less. .

(Junction layer (A))
The base polymer of the bonding layer (A) is preferably an ethylene-based copolymer having a melting point of 50 to 105 ° C., particularly 50 ° C. or higher or 100 ° C. or lower, particularly 55 ° C. or higher or 80 ° C. or lower.
Among these, an ethylene copolymer having an MFR of 0.1 to 60 g / 10 minutes, particularly 1.0 to 45 g / 10 minutes, and more preferably 1.0 to 20 g / 10 minutes is more preferable.
An ethylene copolymer having a melting point of 55 ° C. to 80 ° C. and an MFR of 0.1 to 20 g / 10 min, although it is difficult to apply pressure when thermally laminating a thick resin foam. Is used as the base polymer of the bonding layer (A), sufficient adhesion to the resin foam can be obtained.

  Here, the “base polymer” means a main resin component among the resin components constituting each layer. It does not specify the content ratio of the base polymer in each layer. As a guide, it is common to occupy 50% by mass or more, particularly 70% by mass or more, particularly 90% by mass or more (including 100%) of the resin component constituting each layer. When there are two or more types of base polymers, the content of each base polymer is 20% by mass or more, particularly 30% by mass or more, especially 40% by mass or more (including 50% by mass) of the resin component constituting each layer. (It is the same in the case described later).

  The base polymer of the bonding layer (A) is selected from the group consisting of, for example, an ethylene-α-olefin copolymer, an ethylene-vinyl acetate copolymer, and an ethylene- (meth) acrylate copolymer from the viewpoint of adhesiveness. One or more kinds of ethylene-based copolymers that can be suitably exemplified.

  In these ethylene copolymers, the content of copolymer components other than ethylene is preferably 5 to 40% by mass, and particularly preferably 7% by mass or more or 35% by mass or less.

As the ethylene-α-olefin copolymer, an ethylene-α-olefin copolymer polymerized using a single site catalyst can also be used.
The α-olefin other than ethylene used as a comonomer of the ethylene / α-olefin copolymer is preferably an α-olefin having 3 to 12 carbon atoms, specifically, propylene, 1-butene, Preferred examples include 1-pentene, 1-hexene, 1-octene and the like.
The content of the α-olefin in the ethylene-α-olefin copolymer is preferably 5 to 40% by mass, more preferably 7 to 35% by mass. If the content of α-olefin is 5% by mass or more, low-temperature sealability can be obtained, and if the content of α-olefin is 40% by mass or less, blocking resistance is not impaired. preferable.
The α-olefin content can be measured by 13C-NMR method.

Furthermore, if the density of the ethylene-α-olefin copolymer polymerized using a single site catalyst is 0.870 or less, stickiness occurs, and if it is 0.910 or more, the adhesive strength with the foaming material, etc. This is not preferable because the adhesion suitability deteriorates.
Therefore, the ethylene-α-olefin copolymer polymerized using a single site catalyst has a melting point of 50 ° C to 100 ° C, particularly 60 ° C to 95 ° C, and a density of 0.870 to 0.910. Is preferred.

The ethylene-vinyl acetate copolymer (EVA) preferably has a vinyl acetate content of 3 to 50% by mass, and the ethylene-vinyl acetate copolymer (EVA) has a vinyl acetate content of 3 to 50% by mass. Of these, it is more preferable that the content is 15% by mass or more or 25% by mass or less. If the vinyl acetate content is 3% by mass or more, poor adhesion can be suppressed, and if it is 50% by mass or less, stickiness can be prevented from being easily generated.
The MFR (230 ° C., 21.18N load) of the ethylene-vinyl acetate copolymer is preferably 1 to 30 g / 10 minutes, and more preferably 2 g / 10 minutes or more or 20 g / 10 minutes or less. . If the MFR is 1 g / 10 min or more, the adhesiveness can be prevented from being deteriorated, and if it is 30 g / 10 min or less, the stability of the molten resin film during molding can be maintained. .
In addition, MFR here can be measured based on JIS-K6921-2.

The ethylene- (meth) acrylic acid-based copolymer means a generically named copolymer having ethylene and acrylic acid, methacrylic acid, acrylic acid ester and / or methacrylic acid ester as a copolymerization component.
As a copolymerization ratio with these ethylene, it is preferable that (meth) acrylic acid or a (meth) acrylic acid ester-based comonomer is 5% by mass or more to less than 50% by mass, and more preferably 10% by mass or more or 40% by mass. % Or less, more preferably 15% by mass or less.
If the ratio of the comonomer is 5% by mass or more, a sufficient adhesive force can be easily obtained, and if it is less than 50% by mass, it is preferable because it is easy to handle as a resin.
Specifically, ethylene-acrylic acid copolymer (EAA), ethylene-ethyl acrylate copolymer resin (EEA), ethylene-methyl acrylate copolymer resin (EMA), ethylene-methyl methacrylate copolymer resin (EMMA). And the like.

  In the bonding layer (A), other additional optional components can be blended within a range in which the effects of the present invention are not significantly impaired. Such optional components include antioxidants, clearing agents, lubricants (slip agents), antiblocking agents, antistatic agents, antifogging agents, neutralizing agents, metal deactivators, colorants, fluorescent whitening agents. Can be mentioned.

(Resin layer (B))
The resin layer (B) is a layer formed by containing, as a base polymer, a thermoplastic resin having a higher melting point than the ethylene copolymer of the bonding layer (A).
Since the resin layer (B) has a melting point higher than that of the bonding layer (A), the resin layer (B) does not peel off by being bonded to the thermocompression bonding machine during the heat laminating process with the adherend, A protective film can be produced efficiently.

  Examples of the base polymer of the resin layer (B) include polyethylene resins and polypropylene resins, among which polypropylene resins are preferable.

  A propylene-α-olefin copolymer can also be used as the polypropylene resin. Moreover, you may mix a propylene-alpha-olefin copolymer with the polypropylene as a base polymer. In that case, it is preferable to use the metallocene polypropylene produced using the metallocene catalyst as the polypropylene.

As the propylene / α-olefin copolymer, a random copolymer of propylene mainly composed of a structural unit derived from propylene and an α-olefin other than propylene (for example, ethylene) can be preferably used. .
In the propylene / α-olefin copolymer, the proportion of α-olefin is preferably 0.5 to 12.0 mass%, and more preferably 1.0 mass% or more or 10.0 mass% or less. When the α-olefin copolymer is large, the rigidity of the film is reduced and the film is easily scratched. When it is too small, the flexibility and transparency are impaired.
Among these, from the viewpoints of transparency and stable film-forming property, a propylene-α olefin copolymer polymerized using a single site catalyst is preferable.

  The resin layer (B) can be blended with other additional optional components as long as the effects of the present invention are not significantly impaired. Such optional components include antioxidants, clearing agents, lubricants (slip agents), antiblocking agents, antistatic agents, antifogging agents, neutralizing agents, metal deactivators, colorants, fluorescent whitening agents. Can be mentioned.

  The thickness of the resin layer (B) is preferably 4 μm to 40 μm, more preferably 8 μm or more or 20 μm or less.

In addition, as a preferable combination example of the bonding layer (A) and the resin layer (B), an ethylene copolymer having a melting point of 50 to 105 ° C. and an MFR of 0.1 to 60 g / 10 min is contained. The combination of a joining layer (A) and the resin layer (B) containing a polypropylene resin can be mentioned. If the joining layer (A) and the resin layer (B) are provided, the water vapor permeability (JIS K7129 B method) can be easily adjusted to 0.5 to 50 g / m ² · day.

(Support layer (C))
Since this protective film is a laminated film formed by laminating layers having different compositions, it may be easily curled during film production and thermal lamination. Therefore, it is preferable to suppress curling by providing a support layer (C) between the bonding layer (A) and the resin layer (B). However, the support layer (C) is not always necessary.

  Such a support layer (C) is a layer containing an ethylene-based copolymer from the viewpoint that both the bonding layer (A) and the resin layer (B) have high adhesion and curl can be suppressed. Is preferred. Among these, it is preferable to contain low density polyethylene.

Specifically, for example, when the base polymer of the bonding layer (A) is an ethylene copolymer and the base polymer of the resin layer (B) is a polypropylene resin, the support layer (C) is an ethylene copolymer. It is preferable to contain a polymer or a polypropylene resin or both.
At this time, the mixability of the ethylene copolymer and the polypropylene resin may be poor and streaks may appear, but the metallocene system produced using a metallocene catalyst as the polypropylene resin of the support layer (C). By using a polypropylene resin, the affinity with the ethylene copolymer is increased, and both resins can be uniformly dispersed and mixed.

  The support layer (C) may contain other additional optional components as long as the effects of the present invention are not significantly impaired. Such optional components include antioxidants, clearing agents, lubricants (slip agents), antiblocking agents, antistatic agents, antifogging agents, neutralizing agents, metal deactivators, colorants, fluorescent whitening agents. Can be mentioned.

  The thickness of the support layer (C) is preferably 12 μm to 120 μm, particularly preferably 24 μm or more or 60 μm or less.

(Intermediate layer (D))
When the inflation molding method is employed as the method for forming the protective film, it is preferable to provide the intermediate layer (D) for the purpose of stabilizing the bubble shape.

For the intermediate layer (D) provided for such a purpose, it is preferable to employ a thermoplastic resin mainly composed of ethylene as a base polymer.
Examples of polyethylene include high-pressure radical polymerization method low-density polyethylene and high-density polyethylene.
In addition to ethylene homopolymers, copolymers of ethylene and other α-olefins other than ethylene can also be used.
As the α-olefin, an olefin having about 3 to 12 carbon atoms such as propylene, 1-butene, 1-hexene and 1-octene can be used, and the copolymerization amount thereof is more than 0% by mass and 30% by mass. % Or less, preferably 20% by mass or less. Therefore, linear low density polyethylene is also a preferred material. An ethylene / α-olefin copolymer polymerized using a single site catalyst is also a preferred material.

  Among them, as a base polymer of the intermediate layer (D), from the viewpoint of film formation stability, high-pressure radical polymerization method low-density polyethylene, ethylene-α-olefin copolymer polymerized using a single site catalyst, linear low density It is preferable to employ polyethylene or a mixture thereof.

  Further, the intermediate layer (D) can be added with other thermoplastic resin in a range that does not become a majority amount, for example, in the range of 50% or less, preferably 30% or less in the high-pressure radical polymerization low-density polyethylene. The ethylene-α-olefin copolymer described in the section of the bonding layer (A) can be added.

  The intermediate layer (D) can contain other additional optional components as long as the effects of the present invention are not significantly impaired. Examples of such optional components include an antioxidant, a clarifying agent, a lubricant, an antiblocking agent, an antistatic agent, an antifogging agent, a neutralizing agent, a metal deactivator, a coloring agent, and a fluorescent brightening agent. it can.

  The thickness of the intermediate layer (D) is preferably 12 μm to 120 μm, particularly preferably 24 μm or more or 60 μm or less.

(Laminated structure)
The protective film should just be the laminated structure provided with the joining layer (A) and the resin layer (B), and also laminate | stacks a support layer (C) or an intermediate | middle layer (D), and another layer as needed. The structure which becomes may be sufficient. Specifically, (A) / (B), (A) / (C) / (B), (A) / (D) / (B), (A) / (C) / (D) / ( B), (A) / (D) / (C) / (B) and the like.
At this time, the lamination method and film forming method of each layer are not particularly limited. For example, known methods such as a co-pressing inflation method, a co-pressing T-die method, and an extrusion laminating method can be employed.

(Processing)
The surface of the protective film, for example, the surface of the bonding layer (A) is preferably corona-treated. By using the surface of the bonding layer (A) as a corona-treated surface, it is possible to develop a further excellent thermal laminate.
When heat laminating a thick resin foam, it is difficult to apply pressure, especially when the resin foam is made of a different material such as polystyrene, so the surface of the bonding layer (A) is corona treated. It is preferable to enhance the heat laminating property by using the surface.

(Physical properties)
Protective film, water vapor transmission rate (JIS K7129 B method, 40 ℃, RH 90%) is preferably is 0.5~50g / m ² · day, it's in among others 1.0g / m ² · day or more Is more preferable.
In order for the protective film to have such moisture resistance, the protective film, in particular, the resin layer (B) may be thickened, or the crystallinity of the base polymer of the resin layer (B) may be increased. However, it is not limited to such a method.

<Join method of protective film and resin foam>
In this building material, the resin foam and the protective film can be directly attached by heating and pressure-bonding, that is, heat laminating, without using a hot melt adhesive.
Thus, one of the features of the protective film is that it can be suitably heat-laminated even for different materials such as resin foam.

<Explanation of words>
“Sheet” generally refers to a product that is thin by definition in JIS and generally has a thickness that is small and flat for the length and width. In general, “film” is compared to the length and width. A thin flat product having an extremely small thickness and an arbitrarily limited maximum thickness, usually supplied in the form of a roll (Japanese Industrial Standard JISK6900). For example, in terms of thickness, in the narrow sense, a film having a thickness of 100 μm or more is sometimes referred to as a sheet, and a film having a thickness of less than 100 μm is sometimes referred to as a film. However, since the boundary between the sheet and the film is not clear and it is not necessary to distinguish the two in terms of the present invention, in the present invention, even when the term “film” is used, the term “sheet” is included and the term “sheet” is used. In some cases, “film” is included.

In the present specification, when expressed as “X to Y” (X and Y are arbitrary numbers), unless otherwise specified, “X is preferably greater than X” or “preferably Y”. It also includes the meaning of “smaller”.
In addition, when expressed as “X or more” (X is an arbitrary number) or “Y or less” (Y is an arbitrary number), it is “preferably greater than X” or “preferably less than Y”. Includes intentions.

  Hereinafter, the present invention will be further described in detail based on the following examples and comparative examples.

<Method for evaluating moisture resistance of protective film>
About the film for thermal lamination (protective film), the water vapor transmission rate was measured based on JIS K7129 B method, 40 degreeC-90% RH.

<Adhesion evaluation method>
For protective film-covered heat insulating material (sample), evaluate whether the protective film and heat insulating material are bonded together, and evaluate “Yes” if bonded, “No” if not bonded did.

<Appearance evaluation method>
For the protective film-covered insulation (sample), evaluate whether the film surface is defective due to thermal melting during bonding. If the appearance is good, "○". If the appearance is poor, "X". evaluated.

<Method for evaluating adhesion between protective film and resin foam>
The obtained protective film-covered heat insulating material (sample) was cut into a test piece having a width of 25 mm and a length of 100 mm, and 50 mm in the length direction was peeled off by hand, followed by a tensile tester at 300 mm / min in the 180 ° C. direction. The adhesive strength between the heat laminating film (protective film) and the resin foam was evaluated by measuring the tensile strength (N / 25 mm) when peeled at a speed.

Example 1
As shown in the table, the bonding layer (A) has an ethylene-α-olefin copolymer (trade name “KS340T” manufactured by Nippon Polyethylene Co., Ltd., MFR = 3.5 g / 10 min, density = 0.880, melting point 60 ° C.) 100 parts by mass, blocking agent 15 parts by mass (trade name “KMB32F”, manufactured by Nippon Polyethylene Co., Ltd.) and slip agent 1 part by mass (trade name “KMB05S”, manufactured by Nippon Polyethylene Co., Ltd.) In the resin layer (B), 95 parts by mass of a metallocene polypropylene as a base polymer (trade name “WEG7T”, manufactured by Nippon Polypro Co., Ltd., MFR = 1.8 g / 10 min, density = 0.900, melting point 153 ° C.) and 5 parts by mass of a propylene-ethylene block copolymer (trade name “BC3HF”, Nippon Polypro Co., Ltd.) , MFR = 8.5, density = 0.900, melting point 162 ° C.), low density polyethylene (trade name “HE30”, manufactured by Nippon Polyethylene Co., Ltd., MFR = 0.3 g / min) is used for the support layer (C). 10 minutes, melting point 108 ° C., and the bonding layer (A), the support layer (C), and the resin layer (B) in the order of 10 μm, 30 μm, and 10 μm, respectively, so that the bonding layer (A) is outside the bubble. Lamination was performed to obtain a thickness, and a film was formed using an inflation coextrusion molding machine. At that time, the extrusion rate is 120 kg / H, the tube width is 950 mm, the above layer ratio is adjusted so that the total thickness is 50 μm, the surface of the bonding layer (A) is subjected to corona treatment inline, and the ear is listened to by the inline slit. A film for heat lamination (protective film) having a width of 915 mm was obtained as a final product.

  The bonding layer (A) of the two heat laminating films (protective films) obtained above on both the front and back surfaces of a polystyrene-based foam (length x width 100 mm x 300 mm, thickness 24 mm) molded by an extrusion method The corona-treated surfaces were overlapped, and using a device of the type shown in FIG. 1, a protective film-coated heat insulating material (sample) was produced by heat laminating at a roll temperature of 130 ° C. and a take-up speed of 5 m / min.

  As shown in Table 1, the obtained heat insulating material (sample) is excellent in appearance shape, sufficiently high in heat sealability, sufficient in adhesion, and confirmed to have excellent practicality. did it.

(Example 2)
As shown in Table 1, protective film-covered heat insulation was carried out in the same manner as in Example 1 except that the thicknesses of the bonding layer (A), the resin layer (B) and the support layer (C) were 20 μm, 20 μm and 60 μm, respectively. A material (sample) was prepared.

  As shown in Table 1, the obtained heat insulating material (sample) is excellent in appearance shape, sufficiently high in heat sealability, sufficient in adhesion, and confirmed to have excellent practicality. did it.

Example 3
As shown in Table 1, as the base resin of the bonding layer (A), an ethylene-vinyl acetate copolymer (trade name “LV570” manufactured by Nippon Polyethylene Co., Ltd., MFR = 15 g / 10 min, density = 0.922, melting point 83 ° C. , Vinyl acetate content = 20%) A protective film-covered heat insulating material (sample) was produced in the same manner as in Example 1 except that 100 parts by mass of the anti-blocking agent and the slip agent were not added.

  As shown in Table 1, the obtained heat insulating material (sample) is excellent in appearance shape, sufficiently high in heat sealability, sufficient in adhesion, and confirmed to have excellent practicality. did it.

Example 4
As shown in Table 1, 50 parts by mass of low density polyethylene (trade name “HE30”, manufactured by Nippon Polyethylene Co., Ltd., MFR = 0.3 g / 10 min, melting point 108 ° C.) and metallocene polypropylene (product) Name “WEG7T”, manufactured by Nippon Polypro Co., Ltd., MFR = 1.8 g / 10 min, density = 0.900) Except for using 50 parts by mass, a protective film-covered heat insulating material (sample) was obtained in the same manner as in Example 1. Was made.

  As shown in Table 1, the obtained heat insulating material (sample) is excellent in appearance shape, sufficiently high in heat sealability, sufficient in adhesion, and confirmed to have excellent practicality. did it. In addition, it was confirmed that the workability of the protective film was improved from the point without curling.

(Comparative Example 1)
As shown in Table 1, low-density polyethylene (trade name “UF420”, manufactured by Nippon Polyethylene Co., Ltd., MFR = 0.9 g / 10 minutes, melting point: 123 ° C.) 100 parts by mass with a single layer so that the thickness is 50 μm. The film was formed with a layer machine. At that time, the extrusion rate is 120 kg / H, the tube width is 950 mm, the above layer ratio is adjusted to a total thickness of 50 μm, the bubble outer surface is corona-treated inline, the ear is cut off with the inline slit, and the final product has a width of 915 mm. A laminated film (protective film) was obtained.

  The heat laminating film (protective film) thus produced is overlaid on the polystyrene foam molded by the extrusion method and protected by thermocompression bonding (130 ° C., pressure 5.0 m / min) with a roll crimping machine. An attempt was made to make a film-coated insulation (sample), but it did not adhere.

Claims (15)

A building material having a structure in which the surface of the resin foam is covered with a protective film,
The protective film includes a joining layer (A) containing an ethylene copolymer having a melting point of 50 to 105 ° C., and a thermoplastic resin having a higher melting point than the ethylene copolymer of the joining layer (A). And a resin layer (B) containing, comprising a laminated film having a thickness of 20 μm to 200 μm,
The building material provided with the structure by which the said protective film is thermocompression-bonded to the said resin foam. The protective film includes a joining layer (A) containing an ethylene copolymer having an MFR of 0.1 to 60 g / 10 min, and a resin layer (B) containing a polypropylene resin, ^2. The building material according to claim 1, comprising a laminated film having a water vapor permeability (JIS K7129 B method) of 0.5 to 50 g / m ² · day.   The protective film is composed of a laminated film provided with a support layer (C) containing an ethylene copolymer or a thermoplastic resin or both resins between the bonding layer (A) and the resin layer (B). The building material according to claim 1 or 2, wherein   The protective film includes a bonding layer (A) containing an ethylene copolymer, a resin layer (B) containing a polypropylene resin, an ethylene copolymer or a thermoplastic resin, or both resins. The building material according to claim 1, wherein the building material comprises a laminated film provided with a support layer containing C.   The bonding layer (A) is selected from the group consisting of an ethylene / α-olefin copolymer, an ethylene-vinyl acetate copolymer and an ethylene- (meth) acrylate copolymer polymerized using a single site catalyst. The building material according to claim 1, comprising at least one ethylene copolymer.   The building material according to claim 3 or 4, wherein the support layer (C) contains a metallocene polypropylene resin produced using a metallocene catalyst.   The surface of the joining layer (A) of a protective film is corona-treated, The building material in any one of Claims 1-6 characterized by the above-mentioned.   The building material according to any one of claims 1 to 7, wherein the resin foam is any one selected from the group consisting of a polystyrene foam, a polyurethane foam, and a polypropylene foam.   A joining layer (A) comprising an ethylene copolymer having a melting point of 50 to 105 ° C. and a thermoplastic resin having a melting point higher than that of the ethylene copolymer of the joining layer (A) And a resin layer (B) having a thickness of 20 μm to 200 μm. A bonding layer (A) containing an ethylene copolymer having an MFR of 0.1 to 60 g / 10 min and a resin layer (B) containing a polypropylene resin, and having a water vapor permeability (JIS) It consists of a laminated film whose K7129 B method) is 0.5-50 g / m < ² > * day, The film for thermal lamination for resin foams of Claim 9 characterized by the above-mentioned.   The resin according to claim 9 or 10, comprising a support layer (C) containing an ethylene copolymer, a thermoplastic resin, or both resins between the bonding layer (A) and the resin layer (B). Film for thermal lamination for foam.   A joining layer (A) containing an ethylene copolymer, a resin layer (B) containing a polypropylene resin, a support layer (C) containing an ethylene copolymer and a polypropylene resin, The film for thermal laminates for resin foams in any one of Claims 9-11 provided with these.   The bonding layer (A) is selected from the group consisting of an ethylene / α-olefin copolymer, an ethylene-vinyl acetate copolymer and an ethylene- (meth) acrylate copolymer polymerized using a single site catalyst. The heat laminating film for resin foam according to claim 9, comprising at least one ethylene copolymer.   The film for thermal lamination for a resin foam according to claim 12 or 13, wherein the support layer (C) contains a metallocene polypropylene-based resin produced using a metallocene-based catalyst.   The surface of the joining layer (A) is corona-treated, The film for thermal lamination for a resin foam according to any one of claims 9 to 14.

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