JP2014204024A - Method for manufacturing structure with conductor wiring and thermosetting resin composition and thermosetting resin film used for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a structure with a conductor wiring having a fine opening in an insulating layer and indicating excellent reliability, and a thermosetting resin composition and a thermosetting resin film suitable therefor.SOLUTION: The method for manufacturing the structure including a second conductor wiring which is provided with an opening in the insulating layer on a support having a first conductor wiring on a surface thereof and in which a wiring part connected to the first conductor wiring is formed in the opening comprises the steps of: forming a positive photosensitive resin layer so as to cover the first conductor wiring (first photosensitive resin layer forming step); patterning the positive photosensitive resin layer by subjecting it to exposure processing and development processing (first patterning step); forming a thermosetting resin layer so as to cover this pattern (thermosetting resin layer forming step); exposing a prescribed location of the positive photosensitive resin layer pattern from the thermosetting resin layer by removing a part of the thermosetting resin layer (pattern exposure step); and exposing the first conductor wiring by removing the pattern of the positive photosensitive resin layer exposed from the thermosetting resin layer (opening forming step).

Description

  The present invention relates to a method for producing a structure having conductor wiring, a thermosetting resin composition used therefor, and a thermosetting resin film.

  A printed wiring board, which is one of the structures having conductor wiring, is a structure in which a plurality of wiring layers are formed on a core substrate, a copper-clad laminate serving as a core substrate, and an interlayer insulating material provided between each wiring layer And a solder resist provided on the outermost surface. A semiconductor element is usually mounted on a printed wiring board via a die bonding material or an underfill material. In addition, if necessary, the entire surface may be sealed with a transfer sealing material, or a metal cap (lid) for the purpose of improving heat dissipation may be attached. In recent years, semiconductor devices have become lighter and shorter, and the density of semiconductor elements and multilayer printed wiring boards has been increasing. Further, packaging forms such as a package-on-package in which a semiconductor device is stacked on a semiconductor device are actively performed, and it is expected that the mounting density of the semiconductor device will be further increased in the future.

  Incidentally, it is necessary to provide vias (openings) for electrically connecting the upper and lower wiring layers in the interlayer insulating material of the printed wiring board. If the number of flip chip pins mounted on the printed wiring board increases, it is necessary to provide openings corresponding to the number of pins. However, the conventional printed wiring board has a low mounting density, and the number of pins of the semiconductor element to be mounted is designed from several thousand pins to around 10,000 pins, so there is no need to provide openings with a small diameter and a narrow pitch. It was.

  However, as miniaturization of semiconductor elements progresses and the number of pins increases from tens of thousands to hundreds of thousands of pins, the openings formed in the interlayer insulating material of the printed wiring board are also narrowed to match the number of pins of the semiconductor elements. The need to do is increasing. Recently, development of a printed wiring board in which an opening is provided by a laser using a thermosetting resin material has been advanced (see, for example, Patent Documents 1 to 4).

JP 08-279678 A JP-A-11-054913 JP 2001-217543 A Japanese Patent Laid-Open No. 2003-017848 JP-A-11-274727

  The printed wiring boards described in Patent Documents 1 to 4 are provided with an opening by a laser using a thermosetting resin material.

  FIG. 12 is a diagram illustrating a conventional method for manufacturing a multilayer printed wiring board. A multilayer printed wiring board 100A shown in FIG. 12F has a wiring pattern on the surface and inside. The multilayer printed wiring board 100A is obtained by laminating a copper clad laminate, an interlayer insulating material, a metal foil, and the like and appropriately forming a wiring pattern by an etching method or a semi-additive method.

  First, an interlayer insulating layer 103 is formed on both surfaces of a copper clad laminate 101 having a wiring pattern 102 on the surface (see FIG. 12A). The interlayer insulating layer 103 may be printed with a thermosetting resin composition using a screen printer or a roll coater, or a film made of the thermosetting resin composition is prepared in advance, and this film is formed using a laminator. Can also be attached to the surface of the printed wiring board. Next, an opening 104 is formed using a YAG laser or a carbon dioxide gas laser at a portion that needs to be electrically connected to the outside, and a smear (residue) around the opening 104 is removed by a desmear process (FIG. 12B). reference). Next, a seed layer 105 is formed by an electroless plating method (see FIG. 12C). A photosensitive resin composition is laminated on the seed layer 105, and a predetermined portion is exposed and developed to form a wiring pattern 106 (see FIG. 12D). Next, a wiring pattern 107 is formed by an electrolytic plating method, and after removing the cured product of the photosensitive resin composition by a peeling solution, the seed layer 105 is removed by etching (see FIG. 12E). The multilayer printed wiring board 100A can be manufactured by repeating the above and forming the solder resist 108 on the outermost surface (see FIG. 12F).

  In the multilayer printed wiring board 100A obtained in this way, semiconductor elements are mounted at corresponding locations, and electrical connection can be ensured. However, the multilayer printed wiring board 100A manufactured by such a method requires introduction of a new facility such as a laser, and it is difficult to provide a relatively large opening or a minute opening of 60 μm or less, There are problems that it is necessary to use different lasers according to the aperture diameter, and it is difficult to provide a special shape. In addition, when forming an opening using a laser, each opening must be formed one by one, so it takes time when it is necessary to provide a large number of fine openings, and a resin residue around the opening. Therefore, unless the residue is removed, there is a problem that the reliability of the obtained multilayer printed wiring board is lowered.

  On the other hand, the first photosensitive resin layer that swells with an alkaline solution on the conductor wiring is patterned so that the opening-shaped portion remains, and a thermosetting resin layer is formed on the support so as to cover this pattern Development of a printed wiring board comprising a step of removing the remaining photosensitive resin film by swelling and peeling with an alkaline solution to expose the conductor wiring and form an opening in the thermosetting resin layer (for example, patents) Reference 5).

  The printed wiring board described in Patent Document 5 uses a photosensitive resin layer that swells with an alkaline solution to form an opening that exposes a conductor wiring, and this photosensitive resin layer is used to expose and open the conductor wiring. Is removed by swelling and peeling with an alkaline solution.

  However, in this method, since heat treatment is performed in the process of forming the thermosetting resin layer, the portion patterned with the photosensitive resin layer is further cured, and it is difficult to remove the alkaline solution by swelling and peeling. .

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for sufficiently efficiently producing a structure having a fine opening in an insulating layer and having excellent reliability. . Further, the present invention provides a structure (for example, a printed wiring board) having a conductor wiring manufactured by the above method, and a thermosetting resin composition and a thermosetting resin film suitable for manufacturing these structures. The purpose is to provide.

In order to solve the above-described problem, the method for manufacturing a structure having a conductor wiring according to the present invention is provided with an opening in an insulating layer formed on a support body having a first conductor wiring on the surface, and the first conductor A method for manufacturing a structure having a second conductor wiring in which a wiring portion connected to a wiring is formed in the opening, wherein the photosensitive member is formed on the support so as to cover the first conductor wiring. A first photosensitive resin layer forming step of forming a resin layer; a first patterning step of patterning the positive photosensitive resin layer by exposing and developing; and the positive photosensitive resin layer A thermosetting resin layer forming step of forming a thermosetting resin layer on the support so as to cover the pattern, and a pattern of the positive photosensitive resin layer by removing a part of the thermosetting resin layer A predetermined portion of the heat-curing resin layer is exposed from the thermosetting resin layer. Forming an opening in the thermosetting resin layer for removing the pattern of the positive photosensitive resin layer exposed from the thermosetting resin layer and exposing the first conductor wiring A process.
Moreover, it is preferable that the manufacturing method of the structure which has a conductor wiring which concerns on this invention removes the pattern of the said positive photosensitive resin layer exposed from the said thermosetting resin layer by an exposure and image development process.

  In the manufacturing method of the structure having the conductor wiring, various patterns can be obtained by patterning using the positive photosensitive resin layer in the first patterning process in accordance with the shape of the opening formed in the thermosetting resin layer. A simple opening can be easily formed. Further, in this method for manufacturing a structure (printed wiring board), the photosensitive resin layer can be easily removed by exposure and development in the step of removing the photosensitive resin layer for exposing and opening the conductor wiring. For this reason, even when the number of pins of the semiconductor element increases and a large number of fine openings need to be provided, a printed wiring board having excellent reliability can be efficiently manufactured.

  Further, as a process immediately after the thermosetting resin layer forming process, a thermosetting process for thermosetting the thermosetting resin layer is further provided, and in the pattern exposing process and the opening forming process, plasma processing and desmear processing are performed. By applying, it is preferable to remove part of the thermosetting resin layer after the thermosetting and remove the pattern of the positive photosensitive resin layer exposed from the thermosetting resin layer. In this case, the pattern of the positive photosensitive resin layer can be quickly exposed by plasma treatment and desmear treatment, and residues around the opening can be more reliably reduced.

  Further, as a step immediately after the thermosetting resin layer forming step, further comprising a thermosetting step for thermosetting the thermosetting resin layer, and by applying a desmear treatment in the pattern exposure step and the opening forming step, It is preferable to remove a part of the thermosetting resin layer and remove the pattern of the positive photosensitive resin layer exposed from the thermosetting resin layer. In this case, the pattern of the positive photosensitive resin layer can be quickly exposed by the desmear process, and the residue around the opening can be more reliably reduced.

  Further, as a step immediately after the thermosetting resin layer forming step, a thermosetting step of thermosetting the thermosetting resin layer is further provided, and in the pattern exposure step, a polishing treatment is performed, so that after the thermosetting Removing a part of the thermosetting resin layer, and removing the pattern of the positive photosensitive resin layer exposed from the thermosetting resin layer by performing a desmear process in the opening forming step. Is preferred. In this case, the pattern of the positive photosensitive resin layer can be exposed promptly by the polishing process or the desmear process, and the residue around the opening can be more reliably reduced by the desmear process.

  Further, as a step immediately after the thermosetting resin layer forming step, a thermosetting step of thermosetting the thermosetting resin layer is further provided, and plasma treatment is performed in the pattern exposing step and the opening forming step. It is preferable that a part of the thermosetting resin layer after the thermosetting is removed and a pattern of the positive photosensitive resin layer exposed from the thermosetting resin layer is removed. In this case, the pattern of the positive photosensitive resin layer can be quickly exposed by the plasma treatment, and the residue around the opening can be more reliably reduced.

  Further, as a step between the pattern exposure step and the opening forming step, a thermosetting step of thermosetting the thermosetting resin layer is further provided, and in the pattern exposure step, a plasma treatment is performed to perform thermosetting. Removal of a part of the previous thermosetting resin layer, and removal of the positive photosensitive resin layer exposed from the thermosetting resin layer after the thermosetting by performing plasma treatment in the opening forming step. Preferably it is done. In this case, the pattern of the positive photosensitive resin layer can be quickly exposed by the plasma treatment, and the residue around the opening can be more reliably reduced.

  In the pattern exposure step and the opening formation step, plasma treatment is performed to remove a part of the thermosetting resin layer before thermosetting, and the positive photosensitive resin layer exposed from the thermosetting resin layer. It is preferable to further include a thermosetting step of thermosetting the thermosetting resin layer as a subsequent step of the opening forming step. In this case, the pattern of the positive photosensitive resin layer can be quickly exposed by the plasma treatment, and the residue around the opening can be more reliably reduced.

  Moreover, in the said thermosetting process, it is preferable that the temperature of the said thermosetting resin layer shall be 150-250 degreeC, and heating time shall be 30-300 minutes. When the temperature of the thermosetting resin layer is 150 ° C. or more and the heating time is 30 minutes or more, the thermosetting resin layer can be sufficiently cured. Therefore, in the subsequent pattern exposure step and opening formation step, thermosetting It becomes easy to remove the resin layer and easily expose the conductor wiring. On the other hand, if the temperature of the thermosetting resin layer is 250 ° C. or less and the heating time is 300 minutes or less, oxidation of copper on the surface of the conductor wiring can be suppressed, and peeling of the thermosetting resin layer at the copper interface can be prevented. .

  Moreover, it is preferable to perform the said thermosetting in the atmosphere of an inert gas in the said thermosetting process. By performing thermosetting in an inert gas atmosphere, copper oxidation on the surface of the conductor wiring can be suppressed in the thermosetting step.

  A seed layer forming step of forming a seed layer as a base of the wiring portion by an electroless plating method so as to cover at least a part of the thermosetting resin layer after the opening is formed; A second patterning step of forming a second photosensitive resin layer so as to cover and then patterning the second photosensitive resin layer by subjecting the second photosensitive resin layer to an exposure process and a development process, and so as to cover at least the seed layer In addition, after forming the wiring part by electrolytic plating, the wiring part patterning step of patterning the wiring part by peeling off the pattern of the second photosensitive resin layer by a peeling process and the wiring part are formed. It is preferable to further include a seed layer removing step of removing a seed layer in a region that is not. By forming the seed layer, the wiring part can be formed by electrolytic plating, and the wiring part can be selectively patterned.

In the first photosensitive resin layer forming step, it is preferable that the thickness T ₁ of the first photosensitive resin layer (positive photosensitive resin layer) is ₂ to 50 μm. When the thickness T ₁ of the positive photosensitive resin layer or more 2 [mu] m, it becomes easy to forming the photosensitive resin composition used for forming the positive photosensitive resin layer, a film-like for use in the production of printed wiring board A photosensitive resin composition can be easily produced. And the thickness T ₁ of the positive photosensitive resin layer and 50μm or less, it is easy to form a fine pattern in the positive photosensitive resin layer.

In the thermosetting resin layer forming step, it is preferable that the thickness T2 of the thermosetting resin layer is ₂ to 50 μm. And the thickness T ₂ of the thermosetting resin layer and over 2 [mu] m, it becomes easy by forming a thermosetting resin composition used to form the thermosetting resin layer, a film-like heat used in the production of printed wiring board A curable resin composition can be easily produced. And the thickness T ₂ of the thermosetting resin layer and 50μm or less, it is easy to form a fine pattern in the thermosetting resin layer.

Further, in the thermosetting resin layer forming step, a ratio of a thickness T ₂ of the thermosetting resin layer to a thickness T ₁ of the first photosensitive resin layer (positive photosensitive resin layer) (T ₂ / T ₁ ) is preferably set to 1.0 to 2.0. When (T ₂ / T ₁ ) is 1.0 or more, the pattern of the positive photosensitive resin layer is easily embedded with the thermosetting resin composition in the thermosetting resin layer forming step. The reliability of the structure which has can be improved more. On the other hand, when (T ₂ / T ₁ ) is 2.0 or less, the thermosetting resin layer can be easily removed in the subsequent process, and the opening can be formed in the thermosetting resin layer in a short time. The structure which has can be manufactured more efficiently.

In the opening forming step, a ratio (D / R _min ) of the depth D of the opening to the minimum diameter R _min among the openings formed in the thermosetting resin layer is 0.1 to 1. 0 is preferable. When (D / R _min ) is 0.1 or more, the thickness of the thermosetting resin layer does not become too thin. Therefore, even when a fine opening is formed in the thermosetting resin layer, the shape of the opening Can be kept stable. On the other hand, when (D / R _min ) is 1.0 or less, the positive photosensitive resin layer is easily removed, and a fine opening having a diameter of 60 μm or less is more easily formed.

  Moreover, the structure having a conductor wiring according to the present invention is a structure having a conductor wiring manufactured by the above-described method for manufacturing a structure having a conductor wiring, and the diameter of the opening of the thermosetting resin layer. Is preferably 60 μm or less. The structure having the conductor wiring manufactured by the manufacturing method described above has a fine opening in the insulating layer and has excellent reliability as compared with the structure having the conventional conductor wiring shown in FIG. be able to. Further, when the diameter of the opening of the thermosetting resin layer in the structure having the conductor wiring is 60 μm or less, a semiconductor element having a large number of pins having tens of thousands to hundreds of thousands of pins is mounted. It will be suitable for

  The structure having a conductor wiring according to the present invention is a thermosetting resin composition used in the above-described method for producing a structure having a conductor wiring, and includes an epoxy resin, a phenol resin, a cyanate ester resin, and a polyamide. Thermosetting containing a resin composition containing at least one selected from the group consisting of an imide resin and a thermosetting polyimide resin, and an inorganic filler having a maximum particle size of 5 μm or less and an average particle size of 1 μm or less It is preferable that it is an adhesive resin composition. By forming a thermosetting resin layer using such a thermosetting resin composition, the surface of the opening formed in the thermosetting resin layer becomes smooth, and it becomes easy to form a seed layer on the opening.

  Moreover, this invention relates to the thermosetting resin film which consists of a thermosetting resin composition mentioned above.

  According to the present invention, a structure having a conductive wiring having a fine opening in an insulating layer and excellent reliability can be manufactured sufficiently efficiently.

It is sectional drawing which shows the manufacturing method of the printed wiring board which concerns on one Embodiment of this invention. FIG. 3 is a cross-sectional view showing a first photosensitive resin layer forming step subsequent to FIG. 1. FIG. 3 is a cross-sectional view showing a first patterning process subsequent to FIG. 2. FIG. 4 is a cross-sectional view showing a thermosetting resin layer forming step subsequent to FIG. 3. FIG. 5 is a cross-sectional view showing a pattern exposure process subsequent to FIG. 4. FIG. 6 is a cross-sectional view showing an opening forming step subsequent to FIG. 5. FIG. 7 is a cross-sectional view showing a seed layer forming step that follows FIG. 6. FIG. 8 is a cross-sectional view showing a second patterning step subsequent to FIG. 7. FIG. 9 is a cross-sectional view showing a state in which a wiring part is formed in a wiring part patterning step subsequent to FIG. 8. FIG. 9 is a cross-sectional view showing a state in which a wiring portion is patterned in a wiring portion patterning step subsequent to FIG. 8. It is an end view which shows typically the multilayer printed wiring board which has a soldering resist and a nickel / gold layer on the surface in which the wiring part was formed. It is sectional drawing which shows the manufacturing method of the conventional multilayer printed wiring board.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted. Further, the positional relationship such as up, down, left and right is based on the positional relationship shown in the drawings unless otherwise specified. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios.

  The method for producing a structure having conductor wiring according to the present invention is suitably used for producing a printed wiring board for mounting a semiconductor element. In particular, in addition to the manufacture of printed wiring boards for mounting flip chip type semiconductor elements, in addition to coreless substrates, WLP (Wafer Level Package), eWLB (embedded Wafer Level Ball Grid Array) and other board-less package rewiring methods Can also be suitably used. Among them, the size of the semiconductor element to be mounted is large, and it is particularly suitable for a printed wiring board for electrically connecting to tens of thousands of bumps arranged in an area array on the surface of the semiconductor element.

  FIG. 1 is a cross-sectional view illustrating a method for manufacturing a printed wiring board according to an embodiment of the present invention. As shown to Fig.1 (a), the copper clad laminated body 1 which has the copper foil 2 on the surface of the both sides which are support bodies first is prepared. Next, as shown in FIG. 1B, unnecessary portions of the copper foil 2 of the copper clad laminate 1 are removed by etching to form conductor wirings 2 a and 2 b to obtain a printed wiring board 10. Note that the material of the wiring is not limited to copper.

Next, as shown in FIG. 2, a positive photosensitive resin layer 3 described later is formed on the printed wiring board 10 so as to cover the conductor wirings 2a and 2b (first photosensitive resin layer forming step). The thickness T ₁ of the positive photosensitive resin layer 3 is preferably 2 to 50 μm, more preferably 5 to 30 μm. When the thickness T ₁ of the positive photosensitive resin layer or more 2 [mu] m, easily forming a positive photosensitive resin composition used for forming the positive photosensitive resin layer. And the thickness T ₁ of the positive photosensitive resin layer and 50μm or less, cracking is easy to form a fine pattern does not occur in the positive photosensitive resin layer. The thickness T ₁ of the positive photosensitive resin layer refers to the thickness of the positive photosensitive resin layer 3 on the conductor wirings 2a and 2b as shown in FIG.

Then, by irradiating actinic rays through the mask pattern, the portion removed in the positive photosensitive resin layer 3 after the subsequent development treatment is exposed to be alkali-soluble, and the positive photosensitive resin in the portion other than the exposed portion is exposed. The layer 3 is an unexposed portion (exposure processing in the first patterning step). A known light source can be used as the actinic ray light source. For example, a light source that effectively emits ultraviolet rays, such as a carbon arc lamp, a mercury vapor arc lamp, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, and a xenon lamp can be used. Further, direct drawing direct laser exposure may be used. Although exposure amount varies depending on the composition of the device or a photosensitive resin composition to be used, preferably in the 10 to 10000 mJ / cm ^2, and more preferably a 50~7000mJ / cm ^2. When the exposure amount is 100 mJ / cm ² or more, the positive photosensitive resin composition after the development treatment can be removed in a short time, and when the exposure amount is 10000 mJ / cm ² or less, pattern shape defects due to leakage light from the mask are less likely to occur. The pattern of the positive photosensitive resin layer 3 can be stably formed after development.

  Next, by removing both surfaces of the positive photosensitive resin layer 3 other than the unexposed portions by development, the first positive photosensitive resin layer pattern 3a on both surfaces of the printed wiring board as shown in FIG. 3b is formed (development process in the first patterning step). The patterns 3a and 3b of the positive photosensitive resin layer are removed in an opening forming step to be described later, and become fine openings formed in the thermosetting resin layer 4 (see FIG. 6). As the developer used at this time, for example, an alkaline developer such as an aqueous solution of tetramethylammonium hydroxide (TMAH) at 20 to 50 ° C. or a solution of sodium carbonate (1 to 5% by mass aqueous solution) is used. Development is performed by a known method such as rocking immersion, brushing, and scraping. As a result, patterns 3a and 3b of a predetermined positive photosensitive resin layer are formed.

  After the development processing, as shown in FIG. 4, a thermosetting resin layer 4 made of a thermosetting resin composition described later is formed on the printed wiring board 10 so as to cover the patterns 3a and 3b of the positive photosensitive resin layer. Form (thermosetting resin layer forming step). In the process of forming the thermosetting resin layer 4, the thermosetting resin layer is obtained by performing a known screen printing in the case of a liquid, a process of applying by a roll coater, or a process of attaching by a vacuum laminating in the case of a film. 4 is formed on a printed wiring board. As the thermosetting resin composition used for forming the thermosetting resin layer, both liquid and film can be applied. In order to control the thickness of the thermosetting resin layer 4 with high accuracy, the thickness is previously set. The film-like thing which manages thickness can be used conveniently.

The thickness T2 of the thermosetting resin layer 4 is preferably _{2 to} 50 μm, more preferably 5 to 30 μm. When the thickness T ₂ of the thermosetting resin layer 4 is 2 μm or more, it becomes easy to form a thermosetting resin composition used for forming the thermosetting resin layer 4. Therefore, a film shape used for manufacturing a printed wiring board is used. This thermosetting resin composition can be easily produced. When the thickness T ₂ of the thermosetting resin layer is 50 μm or less, it becomes easy to form a fine pattern on the thermosetting resin layer 4. The thickness T ₂ of the thermosetting resin layer 4, as shown in FIG. 4, refer to the thickness of the conductor wiring 2a, a thermosetting resin composition on 2b. Further, it is preferable that the thickness T ₁ and the thickness T ₂ of the thermosetting resin layer 4 of the positive photosensitive resin layer 3 is the same thickness.

In the thermosetting resin layer forming step, the ratio (T ₂ / T ₁ ) of the thickness T ₂ of the thermosetting resin layer 4 to the thickness T ₁ of the positive photosensitive resin layer 3 is 1.0 to 2.0. It is preferable to set it as 1.0-1.5, and it is more preferable to set it as 1.0-1.5. When (T ₂ / T ₁ ) is 1.0 or more, the pattern 3a, 3b of the positive photosensitive resin layer can be easily embedded with the thermosetting resin composition in the thermosetting resin layer forming step. The reliability of the printed wiring board can be further increased. On the other hand, when (T ₂ / T ₁ ) is 2.0 or less, an opening can be formed in the thermosetting resin layer 4 in a short time, and a printed wiring board can be manufactured more efficiently. When used, the chemical solution can be prevented from deteriorating.

  Next, the formed thermosetting resin layer 4 is thermally cured (thermosetting step). In the thermosetting treatment, the temperature is preferably 150 to 250 ° C. and the heating time is preferably 30 to 300 minutes. More preferably, the temperature is 160 to 200 ° C. and the heating time is 30 to 120 minutes. If the temperature is 150 ° C. or higher and the heating time is 30 minutes or longer, the thermosetting resin layer 4 can be sufficiently cured. Therefore, the thermosetting resin layer 4 is removed in the subsequent pattern exposure step and opening formation step. This makes it easier to expose the conductor wirings 2a and 2b. On the other hand, when the temperature is 250 ° C. or less and the heating time is 300 minutes or less, the surface of the conductor wirings 2a and 2b can be prevented from being oxidized, and the thermosetting resin layer 4 is peeled off at the interface between the conductor wirings 2a and 2b. It can be suppressed. Note that a clean oven is generally used for thermosetting, and curing may be performed in an atmosphere of an inert gas such as nitrogen in order to suppress copper oxidation.

  Next, by applying a desmear process, a part of the thermosetting resin layer 4 after thermosetting is removed to expose predetermined portions of the patterns 3 a and 3 b of the positive photosensitive resin layer from the thermosetting resin layer 4. (Pattern exposure process).

  A desmear process can be implemented by immersing a to-be-processed board | substrate in liquid mixture, such as a sodium permanganate liquid, sodium hydroxide liquid, potassium permanganate liquid, chromium liquid, a sulfuric acid, for example. Specifically, after the substrate to be treated is swelled with hot water or a predetermined swelling liquid, residues, etc. are removed with sodium permanganate liquid, etc., and reduction (neutralization) is performed, followed by washing with water and washing with hot water. , Dry. If a sufficient opening is not formed even after a single process, the process may be performed multiple times. The desmear process is not limited to the above. Moreover, you may perform a thermosetting process again after a desmear process. Although the effect varies depending on the thermosetting resin to be used, not only the glass transition temperature can be raised by thermosetting, but also a low thermal expansion can be achieved.

After the patterns 3a and 3b of the positive photosensitive resin layer are exposed from the thermosetting resin layer 4, they are exposed to be alkali-soluble. A known light source can be used as the actinic ray light source. For example, a light source that effectively emits ultraviolet rays, such as a carbon arc lamp, a mercury vapor arc lamp, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, and a xenon lamp can be used. Further, direct drawing direct laser exposure may be used. Although exposure amount varies depending on the composition of the device or a photosensitive resin composition to be used, preferably in the 100~10000mJ / cm ^2, and more preferably a 10~7000mJ / cm ^2. When the exposure amount is 100 mJ / cm ² or more, the positive photosensitive resin composition can be easily removed. In this way, the conductor wirings 2a and 2b are exposed as shown in FIG. 6 (opening forming step). Thus, the opening 4h is formed in the thermosetting resin layer 4.

In the opening forming step, the diameter of the opening formed in the thermosetting resin layer 4 (R shown in FIG. 6) is preferably 60 μm or less. Moreover, it is preferable that ratio (D / _Rmin ) of the depth of the said opening with respect to the diameter _Rmin of the minimum opening among the openings formed in the thermosetting resin layer 4 shall be 0.1-1.0. 0.2 to 0.8 is more preferable. When (D / R _min ) is 0.1 or more, the thickness of the thermosetting resin layer 4 does not become too thin, so even if a fine opening is formed in the thermosetting resin layer 4, the opening The shape of 4h can be kept stable. On the other hand, when (D / R _min ) is 1.0 or less, the positive photosensitive resin layer 3 is easily removed, and a fine opening with a diameter of 60 μm or less is more easily formed. The shape of the opening 4h is circular, but may be elliptical or the like. When the opening is formed in a shape other than a circle, the diameter R _min may be a circle equivalent diameter.

  Next, as shown in FIG. 7, seed layers 5 are formed on both surfaces by electroless plating so as to cover at least part of the thermosetting resin layer 4 after the opening 4h is formed (seed layer forming step). . In the seed layer forming step, the surface 4s of the thermosetting resin layer 4 where the opening 4h is not provided, the wall surface 4w of the thermosetting resin layer 4 where the opening 4h is provided and the exposed conductor wiring. A seed layer 5 is formed on the surfaces 2a and 2b. The thickness of the seed layer 5 is not particularly limited, but is usually preferably 0.1 to 1.0 μm. The seed layer 5 can be formed not only by electroless copper plating but also by sputtering. The target can be selected as appropriate, but it is common to deposit Cu after Ti. The thickness of Ti or Cu is not particularly limited, but is preferably about 20 to 100 nm for Ti and about 100 to 500 nm for Cu.

  Next, after a film-like photosensitive resin composition is adhered to both surfaces to form a second photosensitive resin layer, a phototool having a predetermined pattern is brought into close contact, and exposure processing and development processing are performed. As shown in FIG. 2, the second photosensitive resin layers on both sides are patterned (second patterning step). The patterns 6a and 6b of the second photosensitive resin layer formed on both surfaces form a fine wiring pattern in a portion closer to the surface on which the semiconductor element is mounted, so that the pattern 6b of the second photosensitive resin layer is smaller than the pattern 6b of the second photosensitive resin layer. The pattern pitch of the pattern 6a of the second photosensitive resin layer is narrower.

  Next, as shown in FIG. 9, the wiring part 7 is formed by an electrolytic plating method such as copper electrolytic plating so as to cover at least a part of the seed layer 5. In this step, the wiring portion 7 is formed on the surface of the seed layer 5 other than the region where the patterns 6a and 6b of the second photosensitive resin layer are formed. In the region where the opening 4h is formed, the wiring portion 7 is formed on the seed layer 5 formed on the wall surface 4w and the surfaces of the conductor wirings 2a and 2b. The thickness of the wiring part 7 is preferably 1 to 20 μm. Thereafter, the patterns 6a and 6b of the second photosensitive resin layer are peeled off by a peeling solution to form wiring patterns 7a and 7b (wiring part patterning step). Next, the seed layer 5 in the region where the wiring part 7 is not formed is removed by etching using an etching solution (seed layer removing step).

  Through the above steps, as shown in FIG. 10, a multilayer printed wiring board 100 having wiring portions (wiring patterns 7a and 7b) on the surface can be obtained. Furthermore, after repeating the series of steps from the photosensitive resin layer forming step to the seed layer removing step on both the front and back surfaces of the multilayer printed wiring board 100, a solder resist 8 is formed on the outermost layer, By forming a nickel / gold layer 9 by plating using an electrolytic nickel / gold plating solution or the like, a multilayer printed wiring board 200 as shown in FIG. 11 can be obtained. For example, the multilayer printed wiring board 200 has three wiring portions (wiring patterns 7a and 7b) by repeating a series of steps from the photosensitive resin layer forming step to the seed layer removing step three times. In the multilayer printed wiring board 200, wiring portions (wiring patterns 7a and 7b) formed in each thermosetting resin layer 4 are electrically connected.

  The multilayer printed wiring boards 100 and 200 are suitable as printed wiring boards for mounting flip-chip type semiconductor elements that are becoming finer and higher in density. Among them, the size of the semiconductor element to be mounted is large, and it is particularly suitable for a printed wiring board for electrically connecting to tens of thousands of bumps arranged in an area array on the surface of the semiconductor element.

  Next, the positive photosensitive resin composition and the thermosetting resin composition used in the production of the above-described multilayer printed wiring boards 100 and 200 will be described in detail, but the present invention is limited to these resin compositions. is not.

  The positive photosensitive resin composition used for the production of the multilayer printed wiring boards 100 and 200 is not particularly limited to semiconductor applications. Industrial Co., Ltd.) and WPR series (JSR Co., Ltd.) can be used.

  Although the thermosetting resin composition used for manufacture of the multilayer printed wiring boards 100 and 200 is not specifically limited, the following are suitable. That is, the thermosetting resin composition suitable for the formation of the thermosetting resin layer 4 is at least one selected from the group consisting of epoxy resins, phenol resins, cyanate ester resins, polyamideimide resins, and thermosetting polyimide resins. It is preferable to contain the resin composition to contain and the inorganic filler whose maximum particle diameter is 5 micrometers or less and whose average particle diameter is 1 micrometer or less. In addition, as a hardening | curing agent combined with an epoxy resin, conventionally well-known various epoxy resin hardening | curing agents or an epoxy resin hardening accelerator can be mix | blended.

  The epoxy resin is preferably an epoxy resin having one or more glycidyl groups in the molecule. The filling amount of the inorganic filler is preferably in the range of 0 (0.01) to 90% by mass, more preferably in the range of 20 to 70% by mass, and still more preferably 30 to 60% by mass.

  As described above, in the method for manufacturing a printed wiring board according to this embodiment, the positive photosensitive resin layer 3 is formed in the first patterning process in accordance with the shape of the opening formed in the thermosetting resin layer 4. By patterning, various shapes of openings 4h can be easily formed. Further, in the method for manufacturing a printed wiring board according to the present embodiment, in addition to forming the plurality of openings 4h at the same time, unlike the case of forming the openings with a laser, the residue of the photosensitive resin around the openings 4h can be reduced. For this reason, even if the number of pins of the semiconductor element increases and it is necessary to provide a large number of fine openings 4h, a printed wiring board having excellent reliability can be manufactured sufficiently efficiently.

  Further, in the present embodiment, as a process immediately after the thermosetting resin layer forming process, a thermosetting process for thermosetting the thermosetting resin layer 4 is further provided. In the pattern exposure process and the opening forming process, plasma treatment and desmearing are performed. By performing the treatment, a part of the thermosetting resin layer 4 is removed and the positive photosensitive resin layer 3 exposed from the thermosetting resin layer 4 is removed. In this case, the positive photosensitive resin layer 3 can be quickly exposed by plasma treatment and desmear treatment, and residues around the opening 4h can be more reliably reduced by desmear treatment.

  Further, in the present embodiment, as a process immediately after the thermosetting resin layer forming process, a thermosetting process for thermosetting the thermosetting resin layer 4 is further provided, and desmear treatment is performed in the pattern exposing process and the opening forming process. Thus, a part of the thermosetting resin layer 4 after thermosetting is removed, and the positive photosensitive resin layer 3 exposed from the thermosetting resin layer 4 is removed. In this case, the positive photosensitive resin layer 3 can be quickly exposed by the desmear process, and residues around the opening 4h can be more reliably reduced.

  Further, in the present embodiment, as a process immediately after the thermosetting resin layer forming process, a thermosetting process for thermosetting the thermosetting resin layer is further provided, and in the pattern exposure process, by performing a polishing process, thermosetting is performed. A part of the later thermosetting resin layer 4 is removed, and the positive photosensitive resin layer 3 exposed from the thermosetting resin layer 4 is removed by performing a desmear process in the opening forming step. In this case, the positive photosensitive resin layer 3 can be quickly exposed by the polishing process and the desmear process, and the residue around the opening 4h can be more reliably reduced by the desmear process.

  Moreover, in this embodiment, the thermosetting process which thermosets the thermosetting resin layer 4 is further provided as a process immediately after a thermosetting resin layer formation process, and a plasma process is performed in a pattern exposure process and an opening formation process. Thus, a part of the thermosetting resin layer 4 after thermosetting is removed, and the positive photosensitive resin layer 3 exposed from the thermosetting resin layer 4 is removed. In this case, the positive photosensitive resin layer 3 can be exposed promptly by plasma treatment, and residues around the opening 4h can be more reliably reduced.

  In this embodiment, the seed layer 5 that forms the foundation of the wiring patterns 7a and 7b is formed by electroless plating so as to cover at least a part of the thermosetting resin layer 4 after the opening 4h is formed. A second patterning step of forming a second photosensitive resin layer so as to cover the seed layer 5 and then patterning the second photosensitive resin layer by exposing and developing the second photosensitive resin layer; After forming the wiring part 7 by the electrolytic plating method so as to cover the seed layer 5, the wiring part patterning is performed by peeling the second photosensitive resin layer patterns 6a and 6b by a peeling process to pattern the wiring part 7. It is preferable to further include a step and a seed layer removing step of removing the seed layer 5 in a region where the wiring portion is not formed. By forming the seed layer 5, the wiring part 7 can be formed by electrolytic plating, and the wiring part 7 can be selectively patterned.

  The printed wiring board 100 according to the present invention is a printed wiring board manufactured by the method for manufacturing a printed wiring board according to this embodiment, and the diameter of the opening 4h of the thermosetting resin layer 4 is 60 μm or less. is there. According to such a printed wiring board 100, compared with the conventional printed wiring board shown in FIG. 12, the thermosetting resin layer 4 has the fine opening 4h and can have excellent reliability. . In addition, since such a printed wiring board 100 has a diameter of the opening 4h of the thermosetting resin layer 4 of 60 μm or less, it is suitable for mounting a semiconductor element having tens of thousands to hundreds of thousands of pins. It will be. Further, the printed wiring board 100 can be subjected to various kinds of processing generally performed on the printed wiring board, for example, nickel / gold plating or soldering on the surface wiring pattern.

  As mentioned above, although the suitable embodiment of the manufacturing method and thermosetting resin composition of the printed wiring board (structure which has a conductor wiring) concerning this invention was described, this invention is not necessarily limited to embodiment mentioned above. Instead, changes may be made as appropriate without departing from the spirit of the invention.

  For example, in the above-described embodiment, a thermosetting process for thermosetting the thermosetting resin layer 4 is provided as a process immediately after the thermosetting resin layer forming process. However, in the pattern exposure process and the opening forming process, plasma processing is performed. When removing a part of the thermosetting resin layer 4 and removing the first photosensitive resin layer 3 exposed from the thermosetting resin layer 4, a pattern exposing step and an opening forming step are performed. A thermosetting step may be provided as a step between the steps or as a step after the opening forming step.

<Preparation of printed wiring board having conductor wiring>
First, a copper clad laminate 1 (MCL-E-679FG manufactured by Hitachi Chemical Co., Ltd.) in which a copper foil 2 having a thickness of 12 μm was adhered to both surfaces was prepared. The thickness of the copper clad laminate 1 was 400 μm (see FIG. 1A). The copper foil 2 was etched and processed into a predetermined pattern shape (see FIG. 1B).

<Formation of first photosensitive resin layer>
Next, as shown in FIG. 2, a positive photosensitive resin composition (Hitachi Chemical DuPont Microsystems HD8820) was applied as a photosensitive resin composition so that the film thickness was 40 μm to 50 μm, The film was preliminarily dried for 5 minutes on a hot plate and then dried for 5 minutes with a 120 ° C. drier. A positive-type photosensitive resin composition is formed on a film and a photo tool having a pattern formed thereon is brought into close contact, and is exposed at an energy amount of 1000 to 5000 mJ / cm ² using an EXM-1201 type exposure machine manufactured by Oak Manufacturing Co., Ltd. Went. Next, development was performed using a 2.38 mass% aqueous solution of tetramethylammonium hydroxide (TMAH), and an inert gas oven (manufactured by Koyo Thermo System Co., Ltd.) was used, and the temperature was 200 ° C. (temperature increase time 1.5). Time) for 1 hour. Thus, exposure processing and development processing were performed on the positive photosensitive resin composition to form patterns 3a and 3b of the first photosensitive resin layer (see FIG. 3).

<Thermosetting resin composition used for formation of the thermosetting resin layer 4>
What was shown below was prepared as a thermosetting resin composition used for formation of the thermosetting resin layer 4 (interlayer insulation layer) of a printed wiring board.

<Thermosetting resin composition A>
As an epoxy resin, a biphenyl aralkyl type epoxy resin, 70 mass parts of product name NC-3000H (made by Nippon Kayaku Co., Ltd.) was used. Synthesis of Curing Agent Example 1: Heat and coolable reaction vessel equipped with a thermometer, a stirrer, a moisture meter with a reflux condenser, and a volume of 2 liters, bis (4-aminophenyl) sulfone: 26.40 g , 2,2′-bis [4- (4-maleimidophenoxy) phenyl] propane: 484.50 g, p-aminobenzoic acid: 29.10 g, and dimethylacetamide: 360.00 g were added at 140 ° C. for 5 hours. It was made to react and the solution of the hardening | curing agent (A-1) which has a sulfone group in a molecular principal chain, and has an acidic substituent and an unsaturated N-substituted maleimide group was obtained. 30 parts by mass of this curing agent was blended.

  As the inorganic filler component, silica filler having an average particle size of 50 nm and silane coupling treatment with vinylsilane was used. In addition, the inorganic filler component was blended so as to be 30% by mass with respect to the resin content. The dispersion state was measured using a dynamic light scattering nanotrack particle size distribution analyzer “UPA-EX150” (manufactured by Nikkiso Co., Ltd.) and a laser diffraction scattering type microtrack particle size distribution meter “MT-3100” (manufactured by Nikkiso Co., Ltd.). Measurement was performed and it was confirmed that the maximum particle size was 1 μm or less.

  A thermosetting resin is obtained by uniformly applying the solution of the thermosetting resin composition obtained as described above onto a 16 μm-thick polyethylene terephthalate film (G2-16, manufactured by Teijin Ltd., trade name) as a support layer. A composition layer was formed. Then, the thermosetting resin composition layer (thermosetting resin film) was obtained by drying the thermosetting resin composition layer at 100 ° C. for about 10 minutes using a hot air convection dryer. A film-shaped thermosetting resin composition having a film thickness of 20 μm was prepared.

  Next, a polyethylene film (NF-15, manufactured by Tamapoly Co., Ltd., trade name) is protected on the surface opposite to the side in contact with the support layer so that dust or the like does not adhere to the thermosetting resin composition layer. Bonding as a film gave a thermosetting film type resin composition.

  The thermosetting resin layer 4 was formed on the printed wiring board using the obtained thermosetting film type resin composition (see FIG. 4). Specifically, first, only the protective film of the thermosetting film type resin composition made of the thermosetting resin composition A is peeled off, and both surfaces of the printed wiring board 10 (positive type photosensitive resin layer patterns 3a and 3b and conductors) are peeled off. A thermosetting resin composition was placed on the wirings 2a and 2b). The thermosetting resin composition was laminated on the surface of the printed wiring board using a press-type vacuum laminator (MVLP-500, manufactured by Meiki Seisakusho Co., Ltd., trade name). The press conditions were as follows: hot plate temperature of 80 ° C., evacuation time of 20 seconds, laminating press time of 30 seconds, atmospheric pressure of 4 kPa or less, and pressing pressure of 0.4 MPa. Next, the thermosetting resin layer 4 was thermally cured at a predetermined temperature and a predetermined time in a clean oven.

  Then, by performing a removal process along the steps shown in Table 1, the thermosetting resin layer 4 is polished to expose the patterns 3a and 3b of the positive photosensitive resin layer, and the positive photosensitive resin layer The patterns 3a and 3b were removed, and a part of the thermosetting resin layer 4 was opened (see FIGS. 5 and 6). Table 1 shows the process conditions for forming an opening during the production of the printed wiring board in the example.

Thereafter, as shown in FIG. 7, a seed layer 5 having a thickness of 1 μm was formed by an electroless copper plating method so as to cover the thermosetting resin layer 4. Next, as shown in FIG. 8, a dry film resist 6 (Hitachi Chemical Co., Ltd., Photoc RY-3525) as a second photosensitive resin composition was attached to both sides with a roll laminator, and a photo tool having a pattern formed thereon was adhered. Then, the exposure was performed with an energy amount of 100 mJ / cm ² using an EXM-1201 type exposure machine manufactured by Oak Manufacturing Co., Ltd. Next, spray development was performed for 90 seconds with a 1 mass% sodium carbonate aqueous solution at 30 ° C. to open the dry film resist 6 (patterns 6a and 6b of the second photosensitive resin layer). Next, as shown in FIG. 8, copper plating (wiring part 7) having a thickness of 10 μm was formed by electrolytic copper plating so as to cover at least part of the seed layer 5 (see FIG. 9). Next, as shown in FIG. 9, the patterns 6a and 6b of the second photosensitive resin layer were peeled off by a peeling solution to form wiring patterns 7a and 7b. Next, the seed layer 5 was removed from the etching solution (see FIG. 10). This process is repeated three times on both sides, and after forming the solder resist 8 on the outermost layer, using a commercially available electroless nickel / gold plating solution, the plating process is performed so that the nickel plating thickness is 5 μm and the gold plating thickness is 0.1 μm. The nickel / gold layer 9 was formed. In this way, a multilayer printed wiring board 200 was obtained (see FIG. 11).

  The multilayer printed wiring board 200 has a board size of 45 mm × 45 mm, and openings each having a diameter of 30 μm, 50 μm, 70 μm, and 90 μm are provided in the form of an area array in the range of the central part 20 mm × 20 mm.

[Embeddability]
The embedding property of the thermosetting resin layer was evaluated based on the following criteria.
A: Good embedding without voids.
C: There is a gap and the embedding in the opening is insufficient, but there is no problem in manufacturing a printed wiring board.

[chemical resistance]
The chemical resistance of the thermosetting resin layer was visually confirmed and evaluated based on the following criteria. The removal process is a plasma process or a desmear process in the exposure process.
A: The thermosetting resin layer does not peel off after the removal treatment.
C: Peeling of the thermosetting resin layer was confirmed after the removal treatment, but there was no problem in producing a printed wiring board.

[Resolution]
About resolution (opening property), it observed with the electron microscope (SEM) and evaluated based on the following references | standards.
AA: An opening having a diameter of 30 μm or less.
A: Opening with a diameter of 50 μm or less.
B: Opening with a diameter of 70 μm or less.
C: Opening with a diameter of 90 μm or less.

[Wall smoothness]
About the wall surface smoothness of opening, it confirmed with the electron microscope and evaluated based on the following references | standards.
A: The wall surface is smooth.
C: A filler missing or step was confirmed on the wall surface, but there was no problem in manufacturing a printed wiring board.

[Removability of residue]
The residue removability of the opening was evaluated based on the following criteria.
A: There is no residue of the photosensitive resin composition on the copper surface, and it can be peeled off and removed.
C: Although the residue of the photosensitive resin composition was confirmed, there is no problem in manufacturing a printed wiring board.

[Electroless copper plating]
The electroless copper plating property was evaluated based on the following criteria.
A: The whole surface is plated smoothly.
C: Plating unevenness was confirmed on the copper surface of the opening, but there was no problem in manufacturing a printed wiring board.

  The results are shown in Table 2 together with the desmear roughening time required for pattern exposure, the development time when opening the pattern, and the height of the opening. This processing is not limited to the interlayer connection of the printed wiring board, but can be applied to all the devices having fine and high-density openings such as a solder resist opening process and a wafer level package rewiring process.

As shown in the examples, the embedding property is good, the chemical resistance in the pattern exposure process and the opening forming process is excellent, the desmear time and the development time are short, and the print having excellent resolution, smoothness, and plating properties. A wiring board can be manufactured.
According to the method for manufacturing a structure having a conductor wiring according to the present invention, the positive photosensitive resin layer is patterned in the first patterning process in accordance with the shape of the opening formed in the thermosetting resin layer. Openings of various shapes can be provided. Furthermore, in the process of removing the photosensitive resin layer for opening, it can be easily removed by exposure and development. Further, in the method of manufacturing a structure having a conductor wiring, unlike the case where openings are formed by a laser, a plurality of openings can be formed simultaneously, and resin residues around the openings can be reduced. For this reason, even when the number of pins of the semiconductor element increases and a large number of fine openings need to be provided, a structure having excellent reliability can be manufactured sufficiently efficiently.

  DESCRIPTION OF SYMBOLS 1 ... Copper clad laminated body, 2a, 2b ... Conductor wiring (copper foil), 3 ... 1st photosensitive resin layer (positive type photosensitive resin layer), 3a, 3b ... 1st photosensitive resin layer (1st 4 ... thermosetting resin layer, 4h ... opening, 4w ... wall surface of opening, 5 ... seed layer, 6a, 6b ... pattern of second photosensitive resin layer, 7 ... wiring portion , 7a, 7b ... wiring pattern, 8 ... solder resist, 9 ... nickel / gold layer, 10 ... printed wiring board (inner layer board), 100 ... multilayer printed wiring board, 200 ... multilayer print having solder resist and nickel / gold layer Wiring board.

Claims (18)

An opening is provided in the insulating layer formed on the support having the first conductor wiring on the surface, and a second conductor wiring in which a wiring portion connected to the first conductor wiring is formed in the opening is provided. A method for producing a structure having:
A first photosensitive resin layer forming step of forming a positive photosensitive resin layer on the support so as to cover the first conductor wiring;
A first patterning step of patterning the positive-type photosensitive resin layer by performing an exposure process and a development process;
A thermosetting resin layer forming step of forming a thermosetting resin layer on the support so as to cover the pattern of the positive photosensitive resin layer;
A pattern exposure step of removing a part of the thermosetting resin layer to expose a predetermined portion of the pattern of the positive photosensitive resin layer from the thermosetting resin layer;
Forming an opening in the thermosetting resin layer to remove the pattern of the positive photosensitive resin layer exposed from the thermosetting resin layer and exposing the first conductor wiring;
A method for manufacturing a structure having a conductor wiring.   The manufacturing method of the structure which has a conductor wiring of Claim 1 which removes the pattern of the said positive photosensitive resin layer exposed from the said thermosetting resin layer by an exposure and image development process. As a step immediately after the thermosetting resin layer forming step, further comprising a thermosetting step of thermosetting the thermosetting resin layer,
In the pattern exposure step and the opening formation step, plasma treatment and desmear treatment are performed to remove a part of the thermosetting resin layer after the thermosetting, and the positive exposed from the thermosetting resin layer. The manufacturing method of the structure which has a conductor wiring of Claim 1 which performs the removal of the pattern of a type photosensitive resin layer. As a step immediately after the thermosetting resin layer forming step, further comprising a thermosetting step of thermosetting the thermosetting resin layer,
In the pattern exposure step and the opening formation step, by performing desmear treatment, removal of a part of the thermosetting resin layer after the thermosetting, and the positive photosensitive resin exposed from the thermosetting resin layer The manufacturing method of the structure which has a conductor wiring of Claim 1 which performs the removal of the pattern of a layer. As a step immediately after the thermosetting resin layer forming step, further comprising a thermosetting step of thermosetting the thermosetting resin layer,
In the pattern exposure process, a part of the thermosetting resin layer after the thermosetting is removed by performing a polishing process, and in the opening forming process, a desmear process is performed, thereby the thermosetting resin layer. The manufacturing method of the structure which has a conductor wiring of Claim 1 which removes the pattern of the said positive photosensitive resin layer exposed from. As a step immediately after the thermosetting resin layer forming step, further comprising a thermosetting step of thermosetting the thermosetting resin layer,
In the pattern exposure step and the opening formation step, plasma treatment is performed to remove a part of the thermosetting resin layer after the thermosetting, and the positive photosensitive resin exposed from the thermosetting resin layer. The manufacturing method of the structure which has a conductor wiring of Claim 1 which performs the removal of the pattern of a layer. As a step between the pattern exposing step and the opening forming step, further comprising a thermosetting step of thermosetting the thermosetting resin layer,
In the pattern exposure step, plasma treatment is performed to remove a part of the thermosetting resin layer before thermosetting, and in the opening forming step, plasma treatment is performed to perform thermosetting after the thermosetting. The manufacturing method of the structure which has a conductor wiring of Claim 1 which removes the pattern of the said positive photosensitive resin layer exposed from the resin layer. In the pattern exposure step and the opening formation step, plasma treatment is performed to remove a part of the thermosetting resin layer before thermosetting, and the positive photosensitive resin layer exposed from the thermosetting resin layer. And remove the pattern of
The manufacturing method of the structure which has a conductor wiring of Claim 1 further provided with the thermosetting process of thermosetting the said thermosetting resin layer as a post process of the said opening formation process.   In the said thermosetting process, the temperature of the said thermosetting resin layer shall be 150-250 degreeC, and the heating time shall be 30-300 minutes, The structure which has the conductor wiring as described in any one of Claims 3-8. Manufacturing method.   The manufacturing method of the structure which has a conductor wiring as described in any one of Claims 3-9 which performs the said thermosetting in the atmosphere of inert gas in the said thermosetting process. A seed layer forming step of forming a seed layer as a base of the wiring portion by an electroless plating method so as to cover at least a part of the thermosetting resin layer after the opening is formed;
A second patterning step of forming a second photosensitive resin layer so as to cover the seed layer and then patterning the second photosensitive resin layer by exposing and developing the second photosensitive resin layer;
A wiring portion patterning step of patterning the wiring portion by peeling off the pattern of the second photosensitive resin layer by a peeling process after forming the wiring portion by electrolytic plating so as to cover at least the seed layer; ,
The method for producing a structure having a conductor wiring according to claim 1, further comprising: a seed layer removing step of removing a seed layer in a region where the wiring portion is not formed. The structure having a conductor wiring according to any one of claims 1 to 11, wherein in the first photosensitive resin layer forming step, a thickness T1 of the _first photosensitive resin layer is set to ₂ to 50 µm. Body manufacturing method. The manufacturing of the structure having a conductor wiring according to any one of claims 1 to 12, wherein in the thermosetting resin layer forming step, a thickness T2 of the thermosetting resin layer is set to ₂ to 50 µm. Method. In the thermosetting resin layer forming step, the ratio (T ₂ / T ₁ ) of the thickness T ₂ of the thermosetting resin layer to the thickness T ₁ of the first photosensitive resin layer is 1.0 to The manufacturing method of the structure which has the conductor wiring as described in any one of Claims 1-13 set to 2.0. In the opening forming step, a ratio (D / R _min ) of the depth D of the opening to the diameter R _min of the smallest opening among the openings formed in the thermosetting resin layer is 0.1 to 1. The manufacturing method of the structure which has the conductor wiring as described in any one of Claims 1-14 made into 0. A structure having conductor wiring manufactured by the method for manufacturing a structure having conductor wiring according to any one of claims 1 to 15,
The structure which has a conductor wiring whose diameter of the opening which the said thermosetting resin layer has is 60 micrometers or less. A thermosetting resin composition used in a method for producing a structure having a conductor wiring according to any one of claims 1 to 15,
A resin composition containing at least one selected from the group consisting of epoxy resins, phenol resins, cyanate ester resins, polyamideimide resins and thermosetting polyimide resins;
An inorganic filler having a maximum particle size of 5 μm or less and an average particle size of 1 μm or less;
Containing thermosetting resin composition.   A thermosetting resin film comprising the thermosetting resin composition according to claim 17.

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