JP2014192356A - Workpiece processor and teaching method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a workpiece processor and a teaching method capable of easily and reliably performing teaching.SOLUTION: A teaching method is provided for performing teaching on a workpiece processor which accommodates a plurality of workpieces in a reaction chamber and performs predetermined processing on the accommodated workpieces. The workpiece processor stores a work content in performing teaching work by operating a predetermined key, and voice guidance information for performing voice output of a guidance including a teaching standard. The teaching for the workpiece processor is performed by making an operator performing the teaching work operate the predetermined key according to a voice guidance output on the basis of the voice guidance information.

Description

  The present invention relates to a processing apparatus for a target object and a teaching method.

  In a manufacturing process of a semiconductor device, a batch type processing apparatus that performs film formation processing on an object to be processed by CVD (Chemical Vapor Deposition) or the like, for example, a semiconductor wafer is used (for example, see Patent Document 1). In such a processing apparatus, a plurality of semiconductor wafers are accommodated in a reaction chamber. For example, the semiconductor wafers are loaded and unloaded by a wafer transfer machine as a transfer means.

JP 2009-141205 A

  When semiconductor wafers are loaded and unloaded using such a wafer transfer machine, it is necessary to teach (learn) the movement path and stop position of the wafer transfer machine to the control means in advance. For example, the processing device is provided with an adjustment terminal, and functions used for adjustment on the screen of the adjustment terminal, such as single axis movement, teaching value input, offset movement, current position display, etc. are displayed on the screen. The teaching procedure is determined by arbitrarily selecting and judging these functions.

  However, since the adjustment terminal uses and adjusts the prepared functions according to the interpretation of the individual worker, a certain level of skill is required. Differences will occur.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a processing apparatus for a target object and a teaching method capable of performing teaching easily and reliably.

In order to achieve the above object, a processing apparatus for an object to be processed according to the first aspect of the present invention includes:
A processing apparatus for a target object that stores a plurality of target objects in a reaction chamber and performs a predetermined process on the stored target object,
A storage unit that stores voice guidance information for voice-outputting guidance content including teaching content by operating a predetermined key to perform teaching work;
A voice output unit that outputs the voice guidance information stored in the storage unit as a voice and causes a worker who performs the teaching operation to operate the predetermined key;
It is characterized by comprising.

  You may further provide the display part which displays the character which shows the operation | work content which operates the said predetermined | prescribed key and performs the said teaching operation | work.

The teaching method according to the second aspect of the present invention includes:
A teaching method for accommodating a plurality of objects to be processed in a reaction chamber and teaching a processing apparatus for an object to be processed that performs a predetermined process on the accommodated objects,
The processing apparatus for the object to be processed stores work contents for performing teaching work by operating a predetermined key, and voice guidance information for voice-outputting guidance including teaching standards,
According to the voice guidance output by the voice guidance information, the processing device of the object to be processed is taught by causing an operator who performs the teaching work to operate the predetermined key.

  The processing device for the object to be processed is displayed on the display unit by operating the predetermined key to display characters indicating the work content for performing the teaching operation and causing the operator performing the teaching operation to operate the predetermined key. May be taught.

  According to the present invention, teaching can be performed easily and reliably.

It is a figure which shows the outline | summary of the heat processing apparatus of this Embodiment. It is a figure which shows the structure of a loading area. It is a figure which shows the structure of a transfer mechanism. It is a figure which shows the structure of a control part. It is a figure which shows an example of a teaching menu. It is a flowchart explaining teaching of FIMS. It is a figure for demonstrating audio | voice guidance.

  Hereinafter, the processing apparatus of the to-be-processed object of this invention and the teaching method are demonstrated. In the present embodiment, the present invention will be described by taking as an example the case where the heat treatment apparatus 1 shown in FIG. First, the outline | summary of the heat processing apparatus 1 of this Embodiment is demonstrated.

As shown in FIG. 1, the processing chamber 10 of the heat treatment apparatus 1 of the present embodiment is partitioned into a work area S1 and a loading area S2 by a partition wall 11. The work area S1 is an area for transporting a FOUP (FOUP: Front Opening Unified Pod) F, which is a sealed transport container containing a large number of semiconductor wafers W, for example, 25, and storing the FOUP F. For example, it is kept in an air atmosphere. On the other hand, the loading area S2 is a region for performing a heat treatment, for example, a film formation process or an oxidation process on the semiconductor wafer W, and is maintained in an inert gas, for example, a nitrogen gas (N ₂ ) atmosphere.

  In the work area S1, a load port 21, a hoop conveyor 22, a transfer stage 23, and a storage unit 24 are provided.

  The load port 21 mounts the FOUP F that is carried in by an external conveyance mechanism (not shown) from the conveyance port 20 provided at a side position of the processing chamber 10. For example, a door D is provided outside the processing chamber 10 at a position corresponding to the transfer port 20, and the transfer port 20 is configured to be freely opened and closed by the door D.

  The hoop conveyor 22 is provided between the load port 21 and the transfer stage 23, and conveys the hoop F in the work area S1. The hoop conveyance machine 22 conveys the hoop F on the load port 21 to the storage unit 24 provided on the upper side in the work area S <b> 1, and conveys the hoop F stored in the storage unit 24 to the transfer stage 23.

  The transfer stage 23 is provided on the work area S1 side of the partition wall 11 and places the FOUP F conveyed by the FOUP conveyor 22. In the transfer stage 23, the semiconductor wafer W is taken out from the loaded FOUP F to the loading area S2 by the transfer mechanism 41 described later. The transfer stage 23 is attached, for example, at two locations on the top and bottom. Further, the partition 11 at the side of the transfer stage 23 is open. A shutter 30 is provided on the loading area S2 side of the partition wall 11 so as to close the opening.

  FIG. 2 shows the structure of the loading area S2. As shown in FIG. 2, in the loading area S2, a transfer mechanism 41, a boat mounting table 45 (45a, 45b), and a boat transfer mechanism 51 are provided.

  The transfer mechanism 41 is provided between the shutter 30 and the boat mounting table 45a. The transfer mechanism 41 transfers the semiconductor wafer W between the FOUP F mounted on the transfer stage 23 and the wafer boat 42 mounted on the boat mounting table 45a.

  FIG. 3 shows the structure of the transfer mechanism 41. In FIG. 3, the single-tooth transfer mechanism 41 is shown so that the state where the semiconductor wafer W is mounted on the transfer mechanism 41 can be easily understood. As shown in FIG. 3, the transfer mechanism 41 includes an elevating part 41a, a fixing part 41b, and a fork 41c.

  As shown by the arrows in FIGS. 1 and 3, the elevating / lowering portion 41 a has a vertical axis and a rotary shaft, and is configured to be able to vertically move and turn the fixed portion 41 b and the fork 41 c. The fixed portion 41b has a fixed piece 41d, and is configured to be movable on the front and rear axes as indicated by arrows in FIG. The fork 41c locks one end of the semiconductor wafer W at its end 41e. Then, in a state where one end of the semiconductor wafer W is locked by the end portion 41e of the fork 41c, the fixing piece 41d of the fixing portion 41b is moved to the other end side of the semiconductor wafer W, whereby the semiconductor wafer W is transferred. (Fixed). Thus, the semiconductor wafer W is transferred by the transfer mechanism 41 by moving the fork 41c (transfer mechanism 41) while the semiconductor wafer W is held.

  In the teaching work, the operator operates (adjusts) the vertical axis, the rotary axis, and the front / rear axis of the transfer mechanism 41 to thereby set the stand-by position and the GET position of the fork 41c (position for GETting the semiconductor wafer W). , TCH position (teaching position), etc. are adjusted.

  The boat mounting tables 45a and 45b are tables on which the wafer boat 42 is mounted. In the present embodiment, a transfer boat mounting table 45a for mounting a wafer boat 42 for transferring the semiconductor wafer W by the transfer mechanism 41 and a standby boat mounting table 45b for mounting a standby wafer boat 42 are mounted. And two boat mounting tables are provided. Also, a plurality of wafer boats 42, for example, two wafer boats 42a and 42b are provided, and these two boats are used alternately.

  The heat treatment furnace 46 has a processing vessel 47 made of a quartz cylinder having an opening at the bottom and formed on a ceiling. A cylindrical heater 48 is provided around the processing container 47 so that the semiconductor wafer W in the processing container 47 can be heated. A cap 50 that can be raised and lowered by an elevating mechanism 49 is disposed below the processing container 47. Then, the wafer boat 42 containing the semiconductor wafers W is placed on the cap 50 and raised, whereby the semiconductor wafers W are loaded into the processing container 47. By this loading, the lower end opening of the processing container 47 is hermetically closed by the cap 50.

  The boat transfer mechanism 51 is provided in the vicinity of the boat mounting tables 45a and 45b. The boat transfer mechanism 51 is provided with an arm 51 a that can be moved forward and backward, and transfers the wafer boat 42 between the boat mounting tables 45 a and 45 b and the cap 50.

  Various sensors are arranged in the processing chamber 10 of the heat treatment apparatus 1. For example, the processing chamber 10 is provided with position sensors such as an end limit sensor and a base position sensor that detect a motor position and a cylinder position. The heat treatment furnace 46 is provided with a plurality of temperature sensors for measuring the temperature in the heat treatment furnace 46 and a plurality of pressure sensors for measuring the pressure in the heat treatment furnace 46.

  Moreover, the heat processing apparatus 1 is connected to the control part 100 which controls each part of the apparatus. FIG. 4 shows the configuration of the control unit 100. As shown in FIG. 4, an operation panel 121 and various sensors 122 are connected to the control unit 100.

  The operation panel 121 includes a display unit (display screen) and operation buttons, transmits operator operation instructions to the control unit 100, and displays various information from the control unit 100 on the display screen.

In addition, the operation panel 121 includes an audio output device (for example, a speaker), and outputs audio in accordance with audio data supplied from the control unit 100.
Various sensors 122 notify the control unit 100 of the detected information.

  As shown in FIG. 4, the control unit 100 includes a teaching information storage unit 101, a recipe storage unit 102, a ROM (Read Only Memory) 103, a RAM (Random Access Memory) 104, an I / O (Input / Output). ) Port 105, a CPU (Central Processing Unit) 106, and a bus 107 for interconnecting them.

  The teaching information storage unit 101 stores information (teaching information) necessary for teaching work such as FIMS (Front-Opening Interface Mechanical Standard) teaching, boat stage 1 teaching, I / O (Input / Output) check, which will be described later. . In the teaching information storage unit 101, for example, teaching information for each type of teaching work is stored. In the teaching information, information on characters displayed on the operation panel 121 and voice data (voice guidance) output from the operation panel 121 is stored. The voice guidance has a voice teaching assist function, and provides guidance such as voice guidance, operation confirmation, and teaching standards. This voice guidance can be performed simply by operating the “Yes” key, “No” key, and “CW (ClockWise) / CCW (Counter ClockWise)” key on the operation panel 121 in accordance with the sound output from the operation panel 121. It is created so that the control unit 100 can teach (learn) the movement path and stop position of the transfer mechanism 41. For this reason, the operator can perform teaching work easily and reliably only by operating according to the voice guidance. In addition, it is possible to perform I / O checks at the time of manufacturing or troubles alone.

  The recipe storage unit 102 stores a process recipe for determining a control procedure according to the type of processing executed in the heat treatment apparatus 1. The process recipe is a recipe prepared for each process (process) actually performed by the user. This recipe includes a predetermined operation program for each part of the apparatus.

The ROM 103 is composed of an EEPROM (Electrically Erasable Programmable Read Only Memory), a flash memory, a hard disk, and the like, and is a recording medium that stores an operation program of the CPU 106 and the like.
The RAM 104 functions as a work area for the CPU 106.
For example, the I / O port 105 supplies information from the sensor to the CPU 106 and outputs a control signal output from the CPU 106 to each unit of the apparatus.

The CPU 106 constitutes the center of the control unit 100 and executes an operation program stored in the ROM 103. The CPU 106 controls the operation of the heat treatment apparatus 1 in accordance with the process recipe stored in the recipe storage unit 102 in accordance with an instruction from the operation panel 121. Further, the CPU 106 outputs a voice (voice guidance) according to the voice data stored in the teaching information storage unit 101 in accordance with an instruction from the operation panel 121.
The bus 107 transmits information between the units.

  Next, a teaching method using the heat treatment apparatus 1 configured as described above will be described. In the following description, the operation of each part constituting the heat treatment apparatus 1 is controlled by the control unit 100 (CPU 106). The operator can perform various teaching operations by operating the operation panel 121 and selecting the teaching menu shown in FIG. As described above, the teaching work is completed only by the operator operating the “Yes” key or the “No” key and the “CW / CCW” key of the operation panel 121 according to the voice guidance. Hereinafter, the teaching method of the present invention will be described by taking FIMS teaching, boat stage 1 teaching, and I / O check as examples.

(FIMS teaching)
FIG. 6 is a flowchart for explaining FIMS teaching.
First, the operator operates the operation panel 121 to select the teaching menu shown in FIG. When the teaching menu is selected, the control unit 100 (CPU 106) displays the teaching menu on the display screen of the operation panel 121 (step S1). The operator operates the operation panel 121 and selects “FIMS”. Next, the CPU 106 determines whether or not “FIMS” has been selected (step S2). If the CPU 106 determines that “FIMS” is not selected (step S2: No), the CPU 106 ends this process.

  When the CPU 106 determines that “FIMS” is selected (step S2: Yes), it reads the teaching information about the FIMS stored in the teaching information storage unit 101, and teaches on the TOP side with one tooth (step S3). Then, after performing teaching on the BTM side with one tooth (step S4), voice guidance processing for performing GET / PUT check (step S5) of the semiconductor wafer W with five teeth is performed. FIG. 7 shows an example of voice guidance processing when teaching on the TOP side with one tooth.

  As shown in FIG. 7, first, the CPU 106 starts voice data from the speaker of the operation panel 121, for example, “FIMS teaching starts. If it is OK, press the“ Y ”key. Is output. When the operator presses the “Y” key, the CPU 106 starts teaching the FIMS. First, the CPU 106 starts teaching on the TOP side.

  The CPU 106 opens voice data from the speaker of the operation panel 121, for example, “opens the FIMS door and moves the wafer transfer machine to the teaching standby position in the third groove on the TOP side. When the safety is secured, press the “Y” key. Is output. When the operator goes out of the apparatus and presses the “Y” key, the CPU 106 opens the FIMS door and moves the transfer mechanism 41 to the standby position on the TOP side. Then, the single tooth F / B (Forward / Back) axis is extended by, for example, about 20 cm so as to be easily visible at a level that does not interfere with the semiconductor wafer W.

  Next, the CPU 106 adjusts the voice data from the speaker of the operation panel 121, for example, “Adjust the rotation axis so as to face the center of the FIMS. Use the“ CW / CCW ”key to perform the operation. Press the “Y” key at the end of the operation. Is output. The operator operates the “CW / CCW” key so that the rotation axis comes to the center of the FIMS, and presses the “Y” key when the position setting is completed.

  Subsequently, the CPU 106 operates voice data from the speaker of the operation panel 121, for example, “operate the vertical axis so that the fork comes to the center between the third and fourth semiconductor wafers. Use the CCW key. Press the “Y” key at the end of the operation. Is output. The operator operates the “CW / CCW” key so that the fork comes to the center between the third and fourth semiconductor wafers W, and presses the “Y” key when the position setting is completed.

  Next, the CPU 106 extends voice data from the speaker of the operation panel 121, for example, “one tooth extends to the vicinity of the GET position. Press the“ Y ”key when ready. Is output. When the operator presses the “Y” key, the CPU 106 extends one tooth to the vicinity of the GET position.

  Subsequently, the CPU 106 adjusts the voice data from the speaker of the operation panel 121, for example, “Adjust the longitudinal axis so that one tooth is at the center of the semiconductor wafer. Use the“ CW / CCW ”key to perform the operation. Press the “Y” key at the end of the operation. Is output. The operator operates the “CW / CCW” key so that the front and rear axes are at the center of the semiconductor wafer W, and presses the “Y” key when the position setting is completed.

  Next, the CPU 106 moves the voice data from the speaker of the operation panel 121 to, for example, “TCH position. Press the“ Y ”key when ready. Is output. When the operator presses the “Y” key, the CPU 106 moves one tooth to the TCH position.

  Subsequently, the CPU 106 adjusts the voice data from the speaker of the operation panel 121, for example, “Adjust TCH so that the distance between the semiconductor wafer and the fork is 0.2 mm. Use the “CW / CCW” key to adjust the vertical position. Press "Y" key when finished. Is output. The operator adjusts the vertical axis (vertical position) with the “CW / CCW” key, and presses the “Y” key when the clearance becomes 0.2 mm.

  Next, the CPU 106 presses voice data from the speaker of the operation panel 121, for example, “lifts the semiconductor wafer. Press the“ Y ”key when ready. Is output. When the operator presses the “Y” key, the CPU 106 lifts the semiconductor wafer W with a fork.

  Subsequently, the CPU 106 adjusts the voice data from the speaker of the operation panel 121, for example, “Adjust the position of the vertical axis so that the semiconductor wafer comes to the center position of the second and third grooves. Use the CCW key. Press the “Y” key at the end of the operation. Is output. The operator adjusts the position of the vertical axis with the “CW / CCW” key so that the semiconductor wafer W comes to the center position of the second and third grooves, and presses the “Y” key.

  Next, the CPU 106 returns audio data from the speaker of the operation panel 121, for example, “pulls the fork to the home position (HP). Press the“ Y ”key when ready. Is output. When the operator presses the “Y” key, the CPU 106 pulls the fork back to HP.

  Subsequently, the CPU 106 confirms the sound data from the speaker of the operation panel 121, for example, “Check the clearance of the rotating shaft. Check that the left and right clearances of the front nail are uniform. Press the “Y” key. If it is not even, press the “N” key. Is output.

  When the operator presses the “N” key, the CPU 106 adjusts the rotation axis, PUTs the semiconductor wafer W from the fork, and closes the FIMS door. Then, after opening the FIMS door and resetting the position of the semiconductor wafer W, the CPU 106 re-gets the semiconductor wafer W with a fork, and reconfirms the clearance of the rotating shaft. Next, the CPU 106 confirms the sound data from the speaker of the operation panel 121, for example, “Check the clearance of the rotating shaft. Confirm that the gap between the front claws is within 0.1 mm to 0.5 mm. Use a gap gauge to check, if the gap is OK, press the “Y” key, otherwise press the “N” key. Is output.

  When the operator presses the “N” key, the CPU 106 PUTs the semiconductor wafer W from the fork and closes the FIMS door. Then, after opening the FIMS door and resetting the position of the semiconductor wafer W, the CPU 106 moves the fork to the adjustment position of the front and rear axis again, adjusts the front and rear axis, and reconfirms the claw gap.

  On the other hand, when the operator presses the “Y” key, the teaching on the TOP side in step S3 ends. Subsequently, the CPU 106 moves the transfer mechanism 41 to the standby position on the BTM side, and executes BTM-side teaching in the same procedure as the TOP-side teaching (step S4). When the teaching on the TOP side and the BTM side is completed, the FIMS teaching is completed by executing the GET / PUT check (step S5) of the semiconductor wafer W with five teeth in the same procedure. .

(Boat stage 1 teaching)
Similar to the FIMS teaching, the operator operates the operation panel 121 to select the teaching menu shown in FIG. When the teaching menu is selected, the control unit 100 (CPU 106) displays the teaching menu on the display screen of the operation panel 121. The operator operates the operation panel 121 to select “boat stage 1”. When determining that “boat stage 1” is selected, the CPU 106 reads teaching information related to the boat stage 1 stored in the teaching information storage unit 101 and performs voice guidance processing.

  First, the CPU 106 starts voice data from the speaker of the operation panel 121, for example, “Teaching of the boat stage 1 starts. This teaching is on the condition that the teaching of the FIMS is completed. Move the carrier containing the wafer and press the “Y” key when ready. Is output. When the operator moves the carrier containing the FIMS teaching semiconductor wafer W and presses the “Y” key, the CPU 106 starts teaching the boat stage 1.

  Next, the CPU 106 sends voice data from the speaker of the operation panel 121, for example, “This boat is a pitch boat with 150 mm grooves of 7 mm pitch. Is the boat type correct? If it is correct, press the“ Y ”key. . If it is not correct, set the correct setting from the boat setting menu and press the “Y” key. Is output. When the operator presses the “Y” key, the CPU 106 opens the voice data from the speaker of the operation panel 121, for example, “opens the FIMS door, acquires the semiconductor wafer from the first groove, and reaches the teaching position of the boat TOP. Go out of the device and press the “Y” key when the safety inside the device is secured. Is output.

  When the operator goes out of the apparatus and presses the “Y” key, the CPU 106 opens the FIMS door, GETs the semiconductor wafer W in the first groove, and moves the transfer mechanism 41 to the boat stage 1, TOP side. Move to the standby position. Then, the F / B axis of one tooth is extended by, for example, about 20 cm so that it can be easily seen at a level that does not interfere with the semiconductor wafer W. Then, the CPU 106 performs the boat stage 1 teaching in the same procedure as the FIMS teaching.

(I / O check)
Similar to the FIMS teaching, the operator operates the operation panel 121 to select the teaching menu shown in FIG. When the teaching menu is selected, the control unit 100 (CPU 106) displays the teaching menu on the display screen of the operation panel 121. The operator operates the operation panel 121 and selects “I / O check”. When determining that “I / O check” is selected, the CPU 106 reads teaching information related to the I / O check stored in the teaching information storage unit 101 and performs voice guidance processing. In this I / O check, a sensor arranged in the heat treatment apparatus 1 is displayed on the display unit of the operation panel 121, and the operator is specified by pressing the displayed sensor.

  First, the CPU 106 outputs voice data, for example, “Check the wafer presence sensor on the right side of the buffer 1. Press the wafer presence sensor on the right side of the buffer 1” from the speaker of the operation panel 121. The operator pushes the wafer presence sensor on the right side of the buffer 1.

  When the wafer presence sensor on the right side of the buffer 1 is pressed, the CPU 106 confirms ON / OFF of the wafer presence sensor on the right side of the buffer 1. Note that this ON / OFF confirmation is made by, for example, ON / OFF confirmation software. When the CPU 106 confirms that the wafer presence sensor on the right side of the buffer 1 is turned on, the voice data from the speaker of the operation panel 121, for example, “The wafer presence sensor on the right side of the buffer 1 has been confirmed. The operator releases the wafer presence sensor on the right side of the buffer 1.

  When the wafer presence / absence sensor on the right side of the buffer 1 is released, the CPU 106 confirms ON / OFF of the wafer presence / absence sensor on the right side of the buffer 1. When the CPU 106 confirms that the wafer presence sensor on the right side of the buffer 1 is turned off, the voice data from the speaker of the operation panel 121, for example, “confirmed that the wafer presence sensor on the right side of the buffer 1 is turned off. "Press the presence sensor." Is output.

  Thus, an I / O check for confirming ON / OFF is performed for each sensor. Then, when the I / O check of all the sensors is finished, this process is finished.

  As described above, according to the present embodiment, it is possible to perform teaching work simply by operating a predetermined key on operation panel 121 in accordance with voice guidance. For this reason, teaching work can be performed easily and reliably. In addition, it is possible to perform teaching work alone.

  In addition, this invention is not restricted to said embodiment, A various deformation | transformation and application are possible. Hereinafter, other embodiments applicable to the present invention will be described.

  In the above embodiment, the present invention has been described by taking as an example the case where voice guidance is performed by outputting voice data from the speaker of the operation panel 121. For example, a USB headphone or the like via a USB (Universal Serial Bus) from the control unit 100 Voice guidance may be performed by outputting voice data from a USB speaker. Further, voice guidance may be performed by outputting voice data from a notebook PC (Personal Computer) via a LAN (Local Area Network).

  Furthermore, the contents for voice guidance may be displayed as characters on the display screen of the operation panel 121. In this case, the work can be performed more easily and reliably.

  It is preferable to store the inspection result of the teaching work in the heat treatment apparatus 1. In this case, it is possible to leave a history of when and who was teaching in which boat, which can contribute to tracking when an accident occurs and preventing the occurrence of an accident.

  In the above embodiment, the present invention has been described by taking FIMS teaching, boat stage 1 teaching, and I / O check as examples of teaching work. However, the present invention is not limited to these examples. It may be used for the O check.

  The control unit 100 according to the embodiment of the present invention can be realized using a normal computer system, not a dedicated system. For example, the above-described processing is executed by installing the program from a recording medium (such as a flexible disk or a CD-ROM (Compact Disc Read Only Memory)) storing the program for executing the above-described processing in a general-purpose computer. The control unit 100 can be configured.

  The means for supplying these programs is arbitrary. In addition to being able to be supplied via a predetermined recording medium as described above, for example, it may be supplied via a communication line, a communication network, a communication system, or the like. In this case, for example, the program may be posted on a bulletin board (BBS: Bulletin Board System) of a communication network and provided by superimposing it on a carrier wave via the network. Then, the above-described processing can be executed by starting the program thus provided and executing it in the same manner as other application programs under the control of an OS (Operating System).

  The present invention is suitable for teaching a transfer mechanism of a workpiece.

DESCRIPTION OF SYMBOLS 1 Heat processing apparatus 10 Processing chamber 11 Partition 20 Transfer port 21 Load port 22 Hoop transfer machine 23 Transfer stage 24 Storage part 30 Shutter 41 Transfer mechanism 41a Lifting part 41b Fixing part 41c Fork 41d Fixing piece 41e End part 42, 42a, 42b Wafer Boat 43 Claw part 43a Bottom part 43b Side wall part 45a, 45b Boat mounting table 46 Heat treatment furnace 47 Processing vessel 48 Heater 49 Lifting mechanism 50 Cap 51 Boat transfer mechanism 51a Arm 100 Control part 101 Teaching information storage part 102 Recipe storage part 103 ROM
104 RAM
105 I / O port 106 CPU
107 Bus 121 Operation Panel 122 Sensor D Door F Hoop S1 Work Area S2 Loading Area W Semiconductor Wafer

Claims (4)

A processing apparatus for a target object that stores a plurality of target objects in a reaction chamber and performs a predetermined process on the stored target object,
A storage unit that stores voice guidance information for voice-outputting guidance content including teaching content by operating a predetermined key to perform teaching work;
A voice output unit that outputs the voice guidance information stored in the storage unit as a voice and causes a worker who performs the teaching operation to operate the predetermined key;
An apparatus for processing an object to be processed.   The processing apparatus for an object to be processed according to claim 1, further comprising a display unit that displays characters indicating work contents for performing the teaching work by operating the predetermined key. A teaching method for accommodating a plurality of objects to be processed in a reaction chamber and teaching a processing apparatus for an object to be processed that performs a predetermined process on the accommodated objects,
The processing apparatus for the object to be processed stores work contents for performing teaching work by operating a predetermined key, and voice guidance information for voice-outputting guidance including teaching standards,
A teaching method, comprising: teaching a processing device of the object to be processed by causing an operator who performs the teaching operation to operate the predetermined key according to the audio guidance output by the audio guidance information.   The processing device for the object to be processed is displayed on the display unit by operating the predetermined key to display characters indicating the work content for performing the teaching operation and causing the operator performing the teaching operation to operate the predetermined key. The teaching method according to claim 3, wherein teaching is performed.