JP2014191952A - Connector for multilayer substrate - Google Patents

Connector for multilayer substrate Download PDF

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Publication number
JP2014191952A
JP2014191952A JP2013065641A JP2013065641A JP2014191952A JP 2014191952 A JP2014191952 A JP 2014191952A JP 2013065641 A JP2013065641 A JP 2013065641A JP 2013065641 A JP2013065641 A JP 2013065641A JP 2014191952 A JP2014191952 A JP 2014191952A
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Prior art keywords
terminal
multilayer
cable
flat
board
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JP6068223B2 (en
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Toshihiro Niitsu
俊博 新津
Motohisa Haga
元久 羽賀
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Molex LLC
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Molex LLC
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Priority to JP2013065641A priority Critical patent/JP6068223B2/en
Priority to CN201420138363.7U priority patent/CN203932370U/en
Priority to US14/227,574 priority patent/US9318820B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/77Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/365Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0367Metallic bump or raised conductor not used as solder bump
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/09163Slotted edge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/0919Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09863Concave hole or via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303Pin-in-hole mounted pins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10386Clip leads; Terminals gripping the edge of a substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve stability of contact by reducing influences caused by variance in dimension precision or strength of a multilayer substrate and/or preventing deformation of a multilayer substrate 2 while connecting a tabular cable to an intermediate layer of the multilayer substrate.SOLUTION: A connector for a multilayer substrate comprises: a substrate-side connection part 1 disposed within an insertion port 2a formed on a thick surface of the multilayer substrate 2; and a cable-side connection part 101 provided in a distal end portion of a tabular cable 3 and inserted into the insertion port 2a so as to be electrically connected with the substrate-side connection part 1 in an intermediate layer of the multilayer substrate 2. The substrate-side connection part 1 includes a columnar terminal 61 and the cable-side connection part 101 includes tabular terminals 151 and 161. The columnar terminal 61 is formed protrusively from the intermediate layer of the multilayer substrate 2 in a thickness direction. The tabular terminals 151 and 161 include elastic contact portions 155 and 165 which are elastically brought into contact width a side surface portion of the columnar terminal 61 in a width direction of the insertion port 2a in response to the insertion of the cable-side connection part 101 into the insertion port 2a.

Description

本発明は、FPCなどの平板状ケーブルを多層基板の中間層に接続するための多層基板用コネクタに関する。   The present invention relates to a multilayer board connector for connecting a flat cable such as an FPC to an intermediate layer of a multilayer board.

携帯電話機、スマートフォンなどの電子機器では、配線パターンの高密度化に対応するために、プリント基板を積層状に形成した多層基板が広く用いられており、また、多層基板と電子部品モジュールとの接続や基板同士の接続には、FPCなどの平板状ケーブルが使用されている。   In electronic devices such as mobile phones and smartphones, multilayer boards with printed circuit boards formed in a laminated form are widely used in order to cope with higher wiring pattern density, and the connection between multilayer boards and electronic component modules is widely used. In addition, a flat cable such as an FPC is used for connection between the boards.

従来、平板状ケーブルを多層基板に接続する場合は、多層基板の表層にコネクタを実装し、ここに平板状ケーブルを接続していたが、多層基板の表層にコネクタを実装すると、コネクタを含めた多層基板の厚さ寸法が大きくなるだけでなく、多層基板上におけるコネクタの占有面積が大きくなり、多層基板や電子機器の小型化を阻害する惧れがあった。   Conventionally, when connecting a flat cable to a multilayer board, the connector was mounted on the surface of the multilayer board, and the flat cable was connected here, but when the connector was mounted on the surface of the multilayer board, the connector was included. Not only does the thickness dimension of the multilayer board increase, but the area occupied by the connector on the multilayer board increases, which may hinder the miniaturization of the multilayer board and electronic equipment.

そこで、近年では、平板状ケーブルを多層基板の中間層に接続することが提案されている。例えば、特許文献1には、多層基板の板厚面に形成された挿入口に平板状ケーブルを挿入することにより、平板状ケーブルと多層基板が電気的に接続される多層基板接続構造が示されている。   In recent years, therefore, it has been proposed to connect a flat cable to an intermediate layer of a multilayer board. For example, Patent Document 1 discloses a multilayer board connection structure in which a flat cable and a multilayer board are electrically connected by inserting a flat cable into an insertion port formed in the board thickness surface of the multilayer board. ing.

図15は、従来例に係る多層基板用コネクタを示す概略断面図である。
この図に示すように、平板状ケーブル3を多層基板2の中間層に接続するためのコネクタは、多層基板2の板厚面に形成された挿入口2a内に配置される基板側接続部801と、平板状ケーブル3の先端部に設けられるケーブル側接続部901とを備えており、挿入口2aに対するケーブル側接続部901の挿入に応じて、基板側接続部801に設けられる板ばね状端子851をケーブル側接続部901の端子部分に弾性的に接触させたり、或いは、特許文献1のように、ケーブル側接続部に設けられる板ばね状端子を基板側接続部の端子に弾性的に接触させることにより、平板状ケーブル3を多層基板2の中間層に電気的に接続させている。
FIG. 15 is a schematic cross-sectional view showing a multilayer board connector according to a conventional example.
As shown in this figure, the connector for connecting the flat cable 3 to the intermediate layer of the multilayer board 2 is a board-side connection portion 801 disposed in the insertion port 2a formed on the plate thickness surface of the multilayer board 2. And a cable-side connection portion 901 provided at the tip of the flat cable 3, and a leaf spring-like terminal provided in the board-side connection portion 801 in accordance with the insertion of the cable-side connection portion 901 into the insertion port 2 a. 851 is elastically brought into contact with the terminal portion of the cable-side connecting portion 901, or the leaf spring-like terminal provided in the cable-side connecting portion is elastically brought into contact with the terminal of the board-side connecting portion as in Patent Document 1. By doing so, the flat cable 3 is electrically connected to the intermediate layer of the multilayer substrate 2.

特開2004−335548号公報JP 2004-335548 A

しかしながら、図15や特許文献1に示すような従来の多層基板用コネクタでは、板ばね状端子851の反力を挿入口2aの上側積層基板(第1積層基板2b)や下側積層基板(第3積層基板2d)で受ける構造となっているので、板ばね状端子851のコンタクトギャップ(ばねの変位量)が、多層基板2の寸法精度や強度のバラツキに影響を受けたり、又は/或いは板ばね状端子851の弾性力に抗い多層基板2が変形したりするため、接触の安定性が得られない可能性があった。   However, in the conventional multilayer board connector as shown in FIG. 15 or Patent Document 1, the reaction force of the leaf spring-like terminal 851 is applied to the upper laminated board (first laminated board 2b) or lower laminated board (first board) of the insertion port 2a. Since the structure is received by the three laminated substrates 2d), the contact gap (spring displacement) of the leaf spring-like terminal 851 is affected by variations in the dimensional accuracy and strength of the multilayer substrate 2, and / or the plate. Since the multilayer substrate 2 is deformed against the elastic force of the spring-like terminal 851, the contact stability may not be obtained.

そこで、本発明は、上記の問題点に鑑みなされたものであって、平板状ケーブルを多層基板の中間層に接続するものでありながら、多層基板の寸法精度や強度のバラツキによる影響を小さくしたり、又は/或いは多層基板2の変形を防止し、接触の安定性を向上させることができる多層基板用コネクタを提供することを目的とする。   Therefore, the present invention has been made in view of the above-described problems, and reduces the influence of variations in dimensional accuracy and strength of the multilayer board while connecting the flat cable to the intermediate layer of the multilayer board. Another object of the present invention is to provide a connector for a multilayer board that can prevent deformation of the multilayer board 2 and / or improve contact stability.

本発明は上記目的を達成するために提案されたものであり、多層基板の板厚面に形成された挿入口内に配置される基板側接続部と、平板状ケーブルの先端部に設けられ、前記挿入口に対する挿入により前記多層基板の中間層で前記基板側接続部と電気的に接続されるケーブル側接続部と、を備える多層基板用コネクタであって、前記基板側接続部または前記ケーブル側接続部の一方が柱状端子、他方が平板状端子を備え、前記柱状端子は、前記多層基板の中間層または前記平板状ケーブルの先端部から、前記多層基板または前記平板状ケーブルの厚さ方向に突出形成され、前記平板状端子は、前記挿入口に対する前記ケーブル側接続部の挿入に応じて、前記柱状端子の側面部に前記挿入口の幅方向から弾性的に接触する弾性接触部を備えることを特徴とする。   The present invention has been proposed to achieve the above object, and is provided at a board-side connection portion disposed in an insertion port formed on a plate thickness surface of a multilayer board, and at a tip portion of a flat cable, A connector for a multilayer board, comprising: a cable-side connection part electrically connected to the board-side connection part in an intermediate layer of the multilayer board by insertion into the insertion port, the board-side connection part or the cable-side connection One of the parts includes a columnar terminal and the other includes a flat plate terminal, and the columnar terminal protrudes from the intermediate layer of the multilayer substrate or the tip of the flat cable in the thickness direction of the multilayer substrate or the flat cable. The flat terminal is provided with an elastic contact portion that elastically contacts the side surface portion of the columnar terminal from the width direction of the insertion port according to the insertion of the cable side connection portion into the insertion port. The features.

また、前記平板状端子と前記柱状端子との接触箇所を複数有し、複数の接触箇所に生じる前記平板状端子の反力が互いに相殺されることを特徴とする。   In addition, a plurality of contact portions between the flat terminal and the columnar terminal are provided, and reaction forces of the flat terminal generated at the plurality of contact portions cancel each other.

また、前記柱状端子に一側方から接触する前記平板状端子の反力が、同じ柱状端子に他側方から接触する前記平板状端子の反力で相殺されることを特徴とする。   Further, the reaction force of the flat plate terminal that contacts the columnar terminal from one side is offset by the reaction force of the flat plate terminal that contacts the same columnar terminal from the other side.

また、前記柱状端子に一側方から接触する前記平板状端子の反力が、他の柱状端子に他側方から接触する前記平板状端子の反力で相殺されることを特徴とする。   Further, the reaction force of the flat plate terminal that contacts the columnar terminal from one side is offset by the reaction force of the flat plate terminal that contacts the other columnar terminal from the other side.

また、前記柱状端子は、前記平板状端子の接触位置を規定する小径部を備えることを特徴とする。   The columnar terminal includes a small-diameter portion that defines a contact position of the flat-plate terminal.

また、前記柱状端子は、エッチング工法を用いて形成された突起であることを特徴とする。   The columnar terminals are protrusions formed by using an etching method.

また、前記基板側接続部は、エッチング工法を用いて形成された前記柱状端子および挿入ガイドを備え、該挿入ガイドにより前記挿入口に対する前記ケーブル側接続部の挿入をガイドすることを特徴とする。   The board-side connection portion includes the columnar terminal and an insertion guide formed by using an etching method, and the insertion guide guides insertion of the cable-side connection portion into the insertion port.

本発明によれば、平板状ケーブルを多層基板の中間層に接続するものでありながら、多層基板の寸法精度や強度のバラツキによる影響を小さくしたり、又は/或いは多層基板の変形を防止し、接触の安定性を向上させることができる。   According to the present invention, while the flat cable is connected to the intermediate layer of the multilayer substrate, the influence of variations in the dimensional accuracy and strength of the multilayer substrate is reduced, or / or deformation of the multilayer substrate is prevented, Contact stability can be improved.

本発明の第1実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルを示す斜視図であり、(a)は非接続状態を示す斜視図、(b)は一部を省略して基板側接続部およびケーブル側接続部を露出させた斜視図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the multilayer substrate and flat cable to which the connector for multilayer substrates which concerns on 1st Embodiment of this invention is applied, (a) is a perspective view which shows a non-connection state, (b) abbreviate | omits one part It is the perspective view which exposed the board | substrate side connection part and the cable side connection part. 本発明の第1実施形態に係る多層基板用コネクタが適用された多層基板を示す図であり、(a)は多層基板の上面図、(b)は多層基板の正面図、(c)は多層基板の下面図、(d)は多層基板の側面図である。It is a figure which shows the multilayer substrate to which the connector for multilayer substrates which concerns on 1st Embodiment of this invention was applied, (a) is a top view of a multilayer substrate, (b) is a front view of a multilayer substrate, (c) is a multilayer The bottom view of a board | substrate and (d) are side views of a multilayer board | substrate. 本発明の第1実施形態に係る多層基板用コネクタが適用された多層基板を示す図であり、(a)は多層基板のA−A断面図、(b)は柱状端子の拡大正面図である。It is a figure which shows the multilayer substrate to which the connector for multilayer substrates which concerns on 1st Embodiment of this invention was applied, (a) is AA sectional drawing of a multilayer substrate, (b) is an enlarged front view of a columnar terminal. . 本発明の第1実施形態に係る多層基板用コネクタが適用された平板状ケーブルを示す図であり、(a)は平板状ケーブルの上面図、(b)は平板状ケーブルの側面図、(c)は平板状ケーブルの下面図である。It is a figure which shows the flat cable with which the connector for multilayer substrates which concerns on 1st Embodiment of this invention was applied, (a) is a top view of a flat cable, (b) is a side view of a flat cable, (c) ) Is a bottom view of the flat cable. 本発明の第1実施形態に係る多層基板用コネクタのケーブル側接続部を示す図であり、(a)はケーブル側接続部の拡大上面図、(b)はケーブル側接続部の拡大下面図である。It is a figure which shows the cable side connection part of the connector for multilayer substrates which concerns on 1st Embodiment of this invention, (a) is an enlarged top view of a cable side connection part, (b) is an enlarged bottom view of a cable side connection part. is there. 本発明の第1実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルを示す斜視図であり、(a)は接続状態を示す斜視図、(b)は接続状態を示す断面図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a multilayer board and a flat cable to which the multilayer board connector according to the first embodiment of the present invention is applied, (a) is a perspective view showing a connection state, and (b) is a cross section showing the connection state. FIG. 本発明の第2実施形態に係る多層基板用コネクタの基板側接続部およびケーブル側接続部を示す斜視図である。It is a perspective view which shows the board | substrate side connection part and cable side connection part of the connector for multilayer substrates which concern on 2nd Embodiment of this invention. 本発明の第3実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルの接続状態を示す斜視図である。It is a perspective view which shows the connection state of the multilayer board | substrate with which the connector for multilayer boards concerning 3rd Embodiment of this invention was applied, and a flat cable. 本発明の第3実施形態に係る多層基板用コネクタが適用された多層基板を示す図であり、(a)は多層基板の平面図、(b)は多層基板の正面図、(c)は多層基板の下面図、(d)は多層基板の側面図である。It is a figure which shows the multilayer substrate to which the connector for multilayer substrates which concerns on 3rd Embodiment of this invention was applied, (a) is a top view of a multilayer substrate, (b) is a front view of a multilayer substrate, (c) is a multilayer The bottom view of a board | substrate and (d) are side views of a multilayer board | substrate. 本発明の第3実施形態に係る多層基板用コネクタが適用された多層基板のB−B断面図である。It is BB sectional drawing of the multilayer substrate to which the connector for multilayer substrates which concerns on 3rd Embodiment of this invention was applied. 本発明の第4実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルの接続状態を示す斜視図である。It is a perspective view which shows the connection state of the multilayer board | substrate with which the connector for multilayer boards concerning 4th Embodiment of this invention was applied, and a flat cable. 本発明の第4実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルの接続状態を示す図であり、(a)は多層基板および平板状ケーブルの上面図、(b)は多層基板および平板状ケーブルの正面図、(c)は多層基板および平板状ケーブルの下面図、(d)は多層基板および平板状ケーブルの側面図である。It is a figure which shows the connection state of the multilayer board | substrate and flat cable to which the connector for multilayer boards concerning 4th Embodiment of this invention was applied, (a) is a top view of a multilayer board and a flat cable, (b) is FIG. 3C is a front view of the multilayer board and the flat cable, FIG. 3C is a bottom view of the multilayer board and the flat cable, and FIG. 3D is a side view of the multilayer board and the flat cable. 本発明の第5実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルの接続状態を示す斜視図である。It is a perspective view which shows the connection state of the multilayer board | substrate with which the connector for multilayer boards concerning 5th Embodiment of this invention was applied, and a flat cable. 本発明の第5実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルの接続状態を示す図であり、(a)は多層基板および平板状ケーブルの上面図、(b)は多層基板および平板状ケーブルの正面図、(c)は多層基板および平板状ケーブルの下面図、(d)は多層基板および平板状ケーブルの側面図である。It is a figure which shows the connection state of the multilayer substrate and flat cable to which the connector for multilayer substrates which concerns on 5th Embodiment of this invention is applied, (a) is a top view of a multilayer substrate and a flat cable, (b) is FIG. 3C is a front view of the multilayer board and the flat cable, FIG. 3C is a bottom view of the multilayer board and the flat cable, and FIG. 3D is a side view of the multilayer board and the flat cable. 従来例に係る多層基板用コネクタを示す概略断面図である。It is a schematic sectional drawing which shows the connector for multilayer substrates which concerns on a prior art example.

以下、本発明に係る好適な実施形態について、図面を参照しながら詳細に説明する。なお、実施形態の説明の全体を通じて同じ要素には同じ符号を付して説明する。また、多層基板(基板側接続部)においては、平板状ケーブル(ケーブル側接続部)の挿入口が形成される板厚面を正面とし、挿入口に対する平板状ケーブルの挿抜方向を前後方向、多層基板の板厚方向を上下方向、挿入口の幅方向を左右方向として説明する。   DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the drawings. Note that the same reference numerals are given to the same elements throughout the description of the embodiment. Also, in a multilayer board (board-side connection part), the front side is the plate thickness surface where the insertion port of the flat cable (cable side connection part) is formed, and the insertion / extraction direction of the flat cable with respect to the insertion port is the front-rear direction, the multilayer The description will be made assuming that the thickness direction of the substrate is the vertical direction and the width direction of the insertion slot is the horizontal direction.

また、平板状ケーブル(ケーブル側接続部)においては、挿入口に対する平板状ケーブルの挿抜方向を前後方向、平板状ケーブルの厚さ方向を上下方向、平板状ケーブルの幅方向を左右方向として説明する。 In the flat cable (cable side connecting portion), the flat cable insertion / extraction direction with respect to the insertion port is the front-rear direction, the flat cable thickness direction is the vertical direction, and the flat cable width direction is the horizontal direction. .

図1は、本発明の第1実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルを示す斜視図であり、(a)は非接続状態を示す斜視図、(b)は一部を省略して基板側接続部およびケーブル側接続部を露出させた斜視図である。
この図に示すように、本発明の第1実施形態に係る多層基板用コネクタは、多層基板2の板厚面に形成された挿入口2a内に配置される基板側接続部1と、平板状ケーブル3の先端部に設けられ、挿入口2aに対する挿入により多層基板2の中間層で基板側接続部1と電気的に接続されるケーブル側接続部101とを備える。
FIG. 1 is a perspective view showing a multilayer board and a flat cable to which the multilayer board connector according to the first embodiment of the present invention is applied. FIG. 1 (a) is a perspective view showing a non-connected state, and FIG. It is the perspective view which abbreviate | omitted one part and exposed the board | substrate side connection part and the cable side connection part.
As shown in this figure, the connector for a multilayer board according to the first embodiment of the present invention includes a board-side connecting portion 1 disposed in an insertion slot 2a formed on the plate thickness surface of the multilayer board 2, and a flat plate shape. A cable-side connection portion 101 is provided at the distal end portion of the cable 3 and electrically connected to the substrate-side connection portion 1 at the intermediate layer of the multilayer substrate 2 by insertion into the insertion port 2a.

なお、図に示す多層基板2や平板状ケーブル3は、全体を示すものではなく、多層基板用コネクタが設けられる部分をトリミングしたものである。例えば、平板状ケーブル3は、通常、長尺の帯状の部材であるが、図においては、図示の都合上、後方(図1における左下方)の部分が切除された状態で示されている。   The multilayer substrate 2 and the flat cable 3 shown in the figure do not show the whole, but are obtained by trimming a portion where the multilayer substrate connector is provided. For example, the flat cable 3 is usually a long belt-like member, but in the drawing, for the sake of illustration, the rear (lower left in FIG. 1) portion is shown in a cut-out state.

図2は、本発明の第1実施形態に係る多層基板用コネクタが適用された多層基板を示す図であり、(a)は多層基板の上面図、(b)は多層基板の正面図、(c)は多層基板の下面図、(d)は多層基板の側面図である。
この図に示すように、多層基板2は、積層状に形成されたプリント基板により構成されている。例えば、本実施形態の多層基板2は、3層のプリント基板を有し、以下、上側に積層された基板を第1積層基板2b、中間に積層された基板を第2積層基板2c、下側に積層された基板を第3積層基板2dと称する。
2A and 2B are diagrams showing a multilayer board to which the multilayer board connector according to the first embodiment of the present invention is applied, wherein FIG. 2A is a top view of the multilayer board, FIG. 2B is a front view of the multilayer board, c) is a bottom view of the multilayer substrate, and (d) is a side view of the multilayer substrate.
As shown in this figure, the multilayer substrate 2 is composed of a printed circuit board formed in a laminated form. For example, the multilayer board 2 of the present embodiment has a three-layer printed board. Hereinafter, the board laminated on the upper side is the first laminated board 2b, the board laminated on the middle is the second laminated board 2c, and the lower side. The substrate laminated on the substrate is referred to as a third laminated substrate 2d.

図3は、本発明の第1実施形態に係る多層基板用コネクタが適用された多層基板を示す図であり、(a)は多層基板のA−A断面図、(b)は柱状端子の拡大正面図である。
この図に示すように、本実施形態の多層基板2では、第2積層基板2cの一部を矩形状に除去することにより挿入口2aが形成されている。そして、挿入口2a内には、導体パターン51、柱状端子61および挿入ガイド71を備えた基板側接続部1が設けられる。なお、本実施形態の多層基板2と挿入口2aの上下方向の寸法は、0.7〔mm〕と0.4〔mm〕であるが、この寸法に限られることはなく、如何なる寸法であってもよい。
3A and 3B are diagrams showing a multilayer board to which the multilayer board connector according to the first embodiment of the present invention is applied. FIG. 3A is a cross-sectional view taken along line AA of the multilayer board, and FIG. It is a front view.
As shown in this figure, in the multilayer substrate 2 of the present embodiment, an insertion port 2a is formed by removing a part of the second laminated substrate 2c into a rectangular shape. And the board | substrate side connection part 1 provided with the conductor pattern 51, the columnar terminal 61, and the insertion guide 71 is provided in the insertion port 2a. The vertical dimension of the multilayer substrate 2 and the insertion slot 2a of this embodiment is 0.7 [mm] and 0.4 [mm], but is not limited to this dimension, and any dimension. May be.

導体パターン51は、挿入口2a内の下面または上面に設けられる。例えば、本実施形態では、挿入口2a内の下面である第3積層基板2dの上面に4つの導体パターン51を設けている。各導体パターン51は、前後方向に沿うとともに、左右方向に並列しており、多層基板2の図示されない他の導体パターンに接続される。また、隣接する導体パターン51同士は絶縁空間52を介して分離されている。   The conductor pattern 51 is provided on the lower surface or the upper surface in the insertion port 2a. For example, in this embodiment, four conductor patterns 51 are provided on the upper surface of the third laminated substrate 2d, which is the lower surface in the insertion slot 2a. Each conductor pattern 51 is parallel to the left-right direction along the front-rear direction, and is connected to another conductor pattern (not shown) of the multilayer substrate 2. Adjacent conductor patterns 51 are separated from each other through an insulating space 52.

柱状端子61は、各導体パターン51の表面から上方に向けて突出形成された突起であり、例えば、厚さが数〔μm〕〜数10〔μm〕のばね性を備える銅箔にフォトリソグラフィ技術を利用したエッチング工法によって、導体パターン51と一体的に形成される。また、本実施形態では、柱状端子61の高さは、挿入口2aの高さよりも多少低くなっており、柱状端子61の上面と挿入口2a内の上面(第1積層基板2bの下面)との間には所定の隙間62が確保される。なお、柱状端子61の上面と挿入口2a内の上面とは、当接してもよく、その場合には、挿入口2aの上下面を画成する基板(本実施形態では第1積層基板2bの下面と第3積層基板2dの上面)が変形し挿入口2aの上下方向の寸法が狭くなることを防止することができる。   The columnar terminal 61 is a protrusion formed so as to protrude upward from the surface of each conductor pattern 51. For example, a photolithography technique is applied to a copper foil having a spring property with a thickness of several [μm] to several tens [μm]. It is formed integrally with the conductor pattern 51 by an etching method utilizing the above. In the present embodiment, the height of the columnar terminal 61 is slightly lower than the height of the insertion port 2a, and the upper surface of the columnar terminal 61 and the upper surface in the insertion port 2a (the lower surface of the first multilayer substrate 2b) A predetermined gap 62 is secured in between. The upper surface of the columnar terminal 61 and the upper surface in the insertion port 2a may be in contact with each other. In this case, a substrate that defines the upper and lower surfaces of the insertion port 2a (in this embodiment, the first laminated substrate 2b). It is possible to prevent the lower surface and the upper surface of the third laminated substrate 2d) from being deformed and the vertical dimension of the insertion port 2a from becoming narrow.

また、柱状端子61の上面や横断面の形状は、左右方向の寸法よりも前後方向の寸法の方が大きい略楕円形であり、かつ、前方(挿入口2aの開口側)が尖った形状であることが望ましい。その理由は、ケーブル側接続部101(柱状端子挿入部154、164)に対する柱状端子61の相対的な挿入がスムーズになるからである。なお、本実施形態では、柱状端子61の上面や横断面の形状を略楕円形としているが、野球のホームベースのような五角形としたり、六角形や円形としてもよく、任意に変更することができる。   Further, the shape of the upper surface and the cross section of the columnar terminal 61 is a substantially oval shape whose dimension in the front-rear direction is larger than that in the left-right direction, and the front (opening side of the insertion port 2a) is pointed. It is desirable to be. The reason is that the relative insertion of the columnar terminal 61 with respect to the cable side connection portion 101 (columnar terminal insertion portion 154, 164) becomes smooth. In the present embodiment, the shape of the upper surface and cross section of the columnar terminal 61 is substantially elliptical, but it may be a pentagon like a baseball base, a hexagon or a circle, and can be arbitrarily changed. it can.

また、柱状端子61の側面形状は、図3の(b)に示すように凹面となっていることが望ましい。その理由は、柱状端子61の側面部に対するケーブル側接続部101(弾性接触部155、165)の接触位置を規定し、接続を安定させることができるからである。例えば、本実施形態では、柱状端子61の高さ方向の中間部を小径部63とし、この小径部63から基端側および先端側に向けて徐々に径寸法を大きくすることにより、湾曲状にへこんだ凹面を形成している。   Further, the side surface shape of the columnar terminal 61 is desirably a concave surface as shown in FIG. The reason is that the contact position of the cable side connection portion 101 (elastic contact portions 155, 165) with respect to the side surface portion of the columnar terminal 61 is defined, and the connection can be stabilized. For example, in the present embodiment, the intermediate portion in the height direction of the columnar terminal 61 is a small diameter portion 63, and the diameter is gradually increased from the small diameter portion 63 toward the proximal end side and the distal end side, thereby forming a curved shape. A concave surface is formed.

挿入ガイド71は、挿入口2a内の左右両端部に設けられ、挿入口2aに対するケーブル側接続部101の挿入をガイドする。本実施形態の挿入ガイド71は、挿入口2a内の左右両端部に設けられる導体パターン51の表面から上方に向けて突出形成された突起であり、例えば、フォトリソグラフィ技術を利用したエッチング工法によって、導体パターン51や柱状端子61とともに形成される。また、挿入ガイド71の高さは、挿入口2aの高さよりも多少低くなっており、挿入ガイド71の上面と挿入口2a内の上面(第1積層基板2bの下面)との間には所定の隙間72が確保されるが、互いに当接してもよい。   The insertion guides 71 are provided at both left and right end portions in the insertion port 2a, and guide the insertion of the cable side connection portion 101 into the insertion port 2a. The insertion guide 71 of the present embodiment is a protrusion that is formed to protrude upward from the surface of the conductor pattern 51 provided at both left and right end portions in the insertion opening 2a. For example, by an etching method using a photolithography technique, It is formed together with the conductor pattern 51 and the columnar terminal 61. Further, the height of the insertion guide 71 is slightly lower than the height of the insertion port 2a, and a predetermined distance is provided between the upper surface of the insertion guide 71 and the upper surface in the insertion port 2a (the lower surface of the first multilayer substrate 2b). The gap 72 is secured, but they may be in contact with each other.

また、挿入ガイド71の上面や横断面の形状は、ケーブル側接続部101の挿入をガイドし得るものであれば任意に変更することが可能であるが、ケーブル側接続部101の挿入をガイドするように挿入口2aの左右両端部に沿に沿い、前後方向に延設される挿入ガイド部73だけでなく、ケーブル側接続部101の挿入限度位置を規定する左右方向に延設されるストッパ部74を備えることが望ましい。なお、本実施形態では、挿入ガイド部73とストッパ部74は一体的に形成されているが、別々に形成されてもよい。   Further, the shape of the upper surface and the cross section of the insertion guide 71 can be arbitrarily changed as long as it can guide the insertion of the cable side connection portion 101, but the insertion of the cable side connection portion 101 is guided. Thus, not only the insertion guide portion 73 extending in the front-rear direction along the left and right ends of the insertion port 2a, but also the stopper portion extending in the left-right direction that defines the insertion limit position of the cable side connection portion 101 74 is preferably provided. In this embodiment, the insertion guide portion 73 and the stopper portion 74 are integrally formed, but may be formed separately.

つぎに、平板状ケーブル3およびケーブル側接続部101の構成について説明する。   Next, the configuration of the flat cable 3 and the cable-side connecting portion 101 will be described.

図4は、本発明の第1実施形態に係る多層基板用コネクタが適用された平板状ケーブルを示す図であり、(a)は平板状ケーブルの上面図、(b)は平板状ケーブルの側面図、(c)は平板状ケーブルの下面図である。
平板状ケーブル3は、FPC(Flexible Printed Circuit:フレキシブル回路基板)、FFC(Flexible Flat Cable:フレキシブルフラットケーブル)等と称される平板状の可撓性ケーブルであり、平板状のものであればケーブルであっても基板であってもよく、いかなる種類のものであってもよい。
4A and 4B are diagrams showing a flat cable to which the multilayer board connector according to the first embodiment of the present invention is applied. FIG. 4A is a top view of the flat cable, and FIG. 4B is a side view of the flat cable. FIG. 4C is a bottom view of the flat cable.
The flat cable 3 is a flat flexible cable called FPC (Flexible Printed Circuit: Flexible Circuit Board), FFC (Flexible Flat Cable), etc. It may be a substrate or any kind of substrate.

本実施形態の平板状ケーブル3は、FPCで構成されており、長尺な帯状の形状を備える絶縁性の薄板部材であるベースフィルム3aと、ベースフィルム3aの一面に並列に配設された複数本(本実施形態では4本)の導体パターン3bと、導体パターン3bを覆うように積層されるカバーフィルム3cとを備える。平板状ケーブル3の一端部では、カバーフィルム3cが除去されており、導体パターン3bが露出した状態となっている。   The flat cable 3 of the present embodiment is made of FPC, and a plurality of base films 3a, which are insulating thin plate members having a long belt-like shape, are arranged in parallel on one surface of the base film 3a. The present embodiment includes four (in this embodiment, four) conductor patterns 3b and a cover film 3c laminated so as to cover the conductor patterns 3b. At one end of the flat cable 3, the cover film 3c is removed, and the conductor pattern 3b is exposed.

図5は、本発明の第1実施形態に係る多層基板用コネクタのケーブル側接続部を示す図であり、(a)はケーブル側接続部の拡大上面図、(b)はケーブル側接続部の拡大下面図である。
この図に示すように、ケーブル側接続部101は、複数の平板状端子151、161と、これらを所定の間隔を存して一体的に支持する絶縁性の支持板171とからなり、全体としては、挿入口2aに挿入可能な矩形状の平面形状を備える。そして、ケーブル側接続部101は、各平板状端子151、161がそれぞれ導体パターン3bと電気的に接続される状態で平板状ケーブル3の一端部に実装される。
5A and 5B are diagrams showing a cable side connection portion of the multilayer board connector according to the first embodiment of the present invention, wherein FIG. 5A is an enlarged top view of the cable side connection portion, and FIG. 5B is a view of the cable side connection portion. It is an enlarged bottom view.
As shown in this figure, the cable-side connecting portion 101 includes a plurality of flat terminals 151 and 161 and an insulating support plate 171 that integrally supports these terminals with a predetermined interval. Is provided with a rectangular planar shape that can be inserted into the insertion port 2a. And the cable side connection part 101 is mounted in the one end part of the flat cable 3 in the state in which each flat terminal 151,161 is electrically connected with the conductor pattern 3b, respectively.

平板状端子151、161は、例えば、厚さが数〔μm〕〜数10〔μm〕のばね性を備える銅箔にエッチング加工等を施してパターニングすることによって形成されたものである。図に示される例では、互いに平行に並んで配設された一対の第1平板状端子151と、その外側に平行に並ぶ一対の第2平板状端子161とを備え、隣接する平板状端子151、161同士は絶縁空間152、162を介して分離されている。   The flat terminals 151 and 161 are formed, for example, by performing etching and patterning on a copper foil having a spring property with a thickness of several [μm] to several tens [μm]. In the example shown in the figure, a pair of first flat terminals 151 arranged in parallel to each other and a pair of second flat terminals 161 arranged in parallel to the outside thereof are provided, and adjacent flat terminals 151 are provided. 161 are separated from each other through insulating spaces 152 and 162.

各平板状端子151、161は、後方に向けて突出するテール部153、163が一体的に形成されており、各平板状端子151、161のテール部153、163がそれぞれ平板状ケーブル3の導体パターン3bにはんだ付や異方性導電シート、接着等によって電気的に接続される。   The flat terminals 151 and 161 are integrally formed with tail portions 153 and 163 projecting rearward, and the tail portions 153 and 163 of the flat terminals 151 and 161 are conductors of the flat cable 3, respectively. It is electrically connected to the pattern 3b by soldering, an anisotropic conductive sheet, adhesion or the like.

各平板状端子151、161は、前方に開口する柱状端子挿入部154、164を備えるとともに、柱状端子挿入部154、164内には、基板側接続部1との接続時に柱状端子61に弾性的に接触する弾性接触部155、165が形成されている。つまり、弾性接触部155、165の配列は、柱状端子61の配列に合わせて決定され、柱状端子61の配列が変更された場合には、それに適合するように、弾性接触部155、165の配列も変更される。   Each flat terminal 151, 161 includes a columnar terminal insertion portion 154, 164 that opens forward, and the columnar terminal insertion portion 154, 164 is elastic to the columnar terminal 61 when connected to the board-side connection portion 1. Elastic contact portions 155 and 165 are formed in contact with each other. That is, the arrangement of the elastic contact portions 155 and 165 is determined in accordance with the arrangement of the columnar terminals 61, and when the arrangement of the columnar terminals 61 is changed, the arrangement of the elastic contact portions 155 and 165 is adapted to the change. Will also be changed.

弾性接触部155、165は、例えば、フォトリソグラフィ技術を利用したエッチング工法によって形成される。典型的には、平板状端子151、161においてエッチング工法によって残存したパターンが弾性接触部155、165となり、その周囲の材料が除去された部分で柱状端子挿入部154、164が形成される。   The elastic contact portions 155 and 165 are formed by, for example, an etching method using a photolithography technique. Typically, the patterns remaining in the flat terminals 151 and 161 by the etching method become the elastic contact portions 155 and 165, and the columnar terminal insertion portions 154 and 164 are formed in the portions where the surrounding material is removed.

第1平板状端子151の平面形状は左右対称であり、柱状端子挿入部154内の左右両側に一対の弾性接触部155を備える。各弾性接触部155は、柱状端子挿入部154の周縁に接続された基部155aと、該基部155aから柱状端子挿入部154内に延出する腕部155bと、腕部155bの先端部に接続された接触部155cとを備えており、腕部155bがばねとして機能することにより、接触部155cの左右方向の弾性的な変位が許容される。   The planar shape of the first flat terminal 151 is bilaterally symmetric and includes a pair of elastic contact portions 155 on both the left and right sides in the columnar terminal insertion portion 154. Each elastic contact portion 155 is connected to a base portion 155a connected to the periphery of the columnar terminal insertion portion 154, an arm portion 155b extending from the base portion 155a into the columnar terminal insertion portion 154, and a distal end portion of the arm portion 155b. And the arm portion 155b functions as a spring, thereby allowing the elastic displacement of the contact portion 155c in the left-right direction.

第1平板状端子151において、左右に対向する弾性接触部155の間隔は、柱状端子挿入部154の開口側では広く、奥側ほど狭くなるように形成されている。これにより、柱状端子61が左右の接触部155c間にスムーズに導かれる。また、左右に対向する接触部155cの間隔は、柱状端子61の小径部63よりも幅狭になっており、柱状端子61が接触部155c同士の間に相対的に移動すると、左右の接触部155cが柱状端子61の側面部に当接して押広げられる。これにより、左右の接触部155cは、腕部155bのばね力で柱状端子61の側面部に左右両側から弾性的に接触される。   In the first flat terminal 151, the distance between the elastic contact portions 155 facing left and right is formed to be wider on the opening side of the columnar terminal insertion portion 154 and narrower toward the back side. Thereby, the columnar terminal 61 is smoothly guided between the left and right contact portions 155c. Further, the interval between the contact portions 155c facing left and right is narrower than the small diameter portion 63 of the columnar terminal 61. When the columnar terminal 61 moves relatively between the contact portions 155c, the left and right contact portions are arranged. 155c is in contact with the side surface of the columnar terminal 61 and is spread. As a result, the left and right contact portions 155c are elastically brought into contact with the side surface portion of the columnar terminal 61 from both the left and right sides by the spring force of the arm portion 155b.

第2平板状端子161の平面形状は左右対称ではなく、柱状端子挿入部164内に左右両側に弾性接触部165と非弾性接触部166を備える。弾性接触部165は、柱状端子挿入部164の周縁に接続された基部165aと、該基部165aから柱状端子挿入部164内に延出する腕部165bと、腕部165bの先端部に接続された接触部165cとを備えており、腕部165bがばねとして機能することにより、接触部165cの左右方向の弾性的な変位が許容される。   The planar shape of the second flat terminal 161 is not bilaterally symmetric, and includes an elastic contact portion 165 and an inelastic contact portion 166 on the left and right sides in the columnar terminal insertion portion 164. The elastic contact portion 165 is connected to a base portion 165a connected to the periphery of the columnar terminal insertion portion 164, an arm portion 165b extending from the base portion 165a into the columnar terminal insertion portion 164, and a distal end portion of the arm portion 165b. The contact portion 165c is provided, and the arm portion 165b functions as a spring, so that elastic displacement of the contact portion 165c in the left-right direction is allowed.

第2平板状端子161において、左右に対向する弾性接触部165と非弾性接触部166との間隔は、柱状端子挿入部164の開口側では広く、奥側ほど狭くなるように形成されている。これにより、柱状端子61が弾性接触部165の接触部165cと非弾性接触部166の接触部166aとの間にスムーズに導かれる。また、左右に対向する接触部165c、166aの間隔は、柱状端子61の小径部63よりも幅狭になっており、柱状端子61が接触部165c、166aの間に相対的に移動すると、接触部165c、166aが柱状端子61の側面部に当接し、一方の接触部165cが押広げられる。これにより、一方の接触部165cは、腕部165bのばね力で柱状端子61の側面部に一側方から弾性的に接触される。   In the second flat terminal 161, the distance between the elastic contact portion 165 and the non-elastic contact portion 166 facing left and right is wide at the opening side of the columnar terminal insertion portion 164 and narrower toward the back side. Accordingly, the columnar terminal 61 is smoothly guided between the contact portion 165c of the elastic contact portion 165 and the contact portion 166a of the inelastic contact portion 166. Further, the interval between the contact portions 165c and 166a facing left and right is narrower than the small-diameter portion 63 of the columnar terminal 61. When the columnar terminal 61 moves relatively between the contact portions 165c and 166a, the contact is made. The portions 165c and 166a abut against the side surface portion of the columnar terminal 61, and one contact portion 165c is expanded. Thereby, one contact part 165c is elastically contacted from the side by the side part of the columnar terminal 61 with the spring force of the arm part 165b.

第2平板状端子161の非弾性接触部166は、弾性接触部165に比して強度的に優れ、挿入口2aへの挿入に際しては、挿入ガイド71との接触する被ガイド部として機能するようになっている。また、非弾性接触部166の先端角部166bや支持板171の先端角部171aは、傾斜状に面取りされており、挿入口2aへの挿入を容易にしている。   The inelastic contact portion 166 of the second flat terminal 161 is superior in strength to the elastic contact portion 165, and functions as a guided portion that contacts the insertion guide 71 when inserted into the insertion port 2a. It has become. Further, the tip corner portion 166b of the non-elastic contact portion 166 and the tip corner portion 171a of the support plate 171 are chamfered in an inclined shape to facilitate insertion into the insertion port 2a.

つぎに、基板側接続部1とケーブル側接続部101との接続動作について説明する。   Next, a connection operation between the board-side connection unit 1 and the cable-side connection unit 101 will be described.

図6は、本発明の第1実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルを示す斜視図であり、(a)は接続状態を示す斜視図、(b)は接続状態を示す断面図である。
この図に示すように、平板状ケーブル3を多層基板2の中間層に接続する場合は、平板状ケーブル3の先端部に設けられたケーブル側接続部101を、多層基板2の板厚面に形成された挿入口2aに挿入する。ケーブル側接続部101には、表裏があり、支持板171が上を向く状態で挿入口2aに挿入すると、支持板171が挿入口2a内の隙間62、72を通過し、ケーブル側接続部101の挿入が許容されるが、支持板171が下を向く状態で挿入口2aに挿入すると、支持板171が柱状端子61や挿入ガイド71に当接し、ケーブル側接続部101の挿入が規制される。なお、ケーブル側接続部101の支持板171を除いたケーブル側接続部101を使用する場合、柱状端子61や挿入ガイド71の上面が、挿入口2aの下面と当接し隙間62、72を備えない基板側接続部1と接続してもよく、用途に応じて適宜選択すればよい。
FIG. 6 is a perspective view showing a multilayer board and a flat cable to which the multilayer board connector according to the first embodiment of the present invention is applied, (a) is a perspective view showing a connection state, and (b) is a connection. It is sectional drawing which shows a state.
As shown in this figure, when the flat cable 3 is connected to the intermediate layer of the multilayer board 2, the cable side connection portion 101 provided at the tip of the flat cable 3 is connected to the plate thickness surface of the multilayer board 2. It inserts in the formed insertion port 2a. The cable-side connection portion 101 has front and back surfaces. When the cable-side connection portion 101 is inserted into the insertion port 2a with the support plate 171 facing upward, the support plate 171 passes through the gaps 62 and 72 in the insertion port 2a. However, if the support plate 171 is inserted into the insertion port 2a with the support plate 171 facing downward, the support plate 171 contacts the columnar terminal 61 and the insertion guide 71, and the insertion of the cable side connection portion 101 is restricted. . In addition, when using the cable side connection part 101 except the support plate 171 of the cable side connection part 101, the upper surface of the columnar terminal 61 or the insertion guide 71 is in contact with the lower surface of the insertion port 2a and does not have the gaps 62 and 72. You may connect with the board | substrate side connection part 1, and should just select suitably according to a use.

挿入口2aに対するケーブル側接続部101の挿入は、挿入口2a内の左右両端部に設けられる挿入ガイド71でガイドされる。このとき、挿入ガイド71に接触するのは、弾性接触部155、165に比べて強度的に優れた非弾性接触部166であるから、挿入ガイド71との接触による破損なども防止することができる。   Insertion of the cable side connection portion 101 into the insertion port 2a is guided by insertion guides 71 provided at both left and right end portions in the insertion port 2a. At this time, the non-elastic contact portion 166 that is superior in strength to the elastic contact portions 155 and 165 contacts the insertion guide 71, so that damage due to contact with the insertion guide 71 can also be prevented. .

また、挿入ガイド71は、エッチング工法によって柱状端子61とともに形成され、柱状端子61との位置精度が極めて高いので、挿入ガイド71のガイドによって、ケーブル側接続部101の平板状端子151、161(弾性接触部155、165)を基板側接続部1の柱状端子61に対して精度良く位置決めすることができる。   Further, the insertion guide 71 is formed together with the columnar terminal 61 by an etching method, and the positional accuracy with the columnar terminal 61 is extremely high. Therefore, the plate-shaped terminals 151 and 161 (elasticity) of the cable side connection portion 101 are guided by the guide of the insertion guide 71. The contact portions 155 and 165) can be accurately positioned with respect to the columnar terminal 61 of the board side connection portion 1.

そして、挿入口2aに対してケーブル側接続部101を挿入すると、ケーブル側接続部101の平板状端子151、161が基板側接続部1の柱状端子61に接触し、平板状ケーブル3が多層基板2の中間層に対して電気的に接続される。このとき、平板状端子151、161の弾性接触部155、165は、柱状端子61の側面部に対して左右方向から弾性的に接触するので、平板状端子151、161の反力を挿入口2aの上側や下側の積層基板2b、2dで受ける必要がなく、その結果、平板状端子151、161のコンタクトギャップが、多層基板2の寸法精度や強度のバラツキに影響を受けることを回避し、又、多層基板2の変形を防止するため、接触の安定性を向上させることができる。   When the cable side connecting portion 101 is inserted into the insertion port 2a, the flat terminals 151 and 161 of the cable side connecting portion 101 come into contact with the columnar terminals 61 of the board side connecting portion 1, and the flat cable 3 is connected to the multilayer board. Electrically connected to the two intermediate layers. At this time, since the elastic contact portions 155 and 165 of the flat terminals 151 and 161 elastically contact the side surface of the columnar terminal 61 from the left and right directions, the reaction force of the flat terminals 151 and 161 is applied to the insertion port 2a. The upper and lower laminated substrates 2b and 2d do not need to be received, and as a result, the contact gap between the flat terminals 151 and 161 is avoided from being affected by variations in the dimensional accuracy and strength of the multilayer substrate 2, In addition, since the deformation of the multilayer substrate 2 is prevented, the contact stability can be improved.

詳しくは、挿入口2aに対してケーブル側接続部101を挿入すると、ケーブル側接続部101の第1平板状端子151では、左右の弾性接触部155が柱状端子61の側面部に当接して押広げられる。これにより、左右の弾性接触部155は、腕部155bのばね力で柱状端子61の側面部に左右両側から弾性的に接触する。このような弾性的な接触箇所では反力が発生するが、柱状端子61の側面部に左右両側から弾性的に接触することにより、反力は互いに相殺される。   Specifically, when the cable side connection portion 101 is inserted into the insertion port 2 a, the left and right elastic contact portions 155 come into contact with the side surface portion of the columnar terminal 61 and push in the first flat terminal 151 of the cable side connection portion 101. Can be spread. Thereby, the left and right elastic contact portions 155 elastically contact the side surface portion of the columnar terminal 61 from both the left and right sides by the spring force of the arm portion 155b. Although a reaction force is generated at such an elastic contact portion, the reaction force cancels out by elastically contacting the side surface portion of the columnar terminal 61 from both the left and right sides.

また、挿入口2aに対してケーブル側接続部101を挿入すると、ケーブル側接続部101の第2平板状端子161では、弾性接触部165と非弾性接触部166が柱状端子61の側面部に当接し、一方の弾性接触部165が押広げられる。これにより、弾性接触部165は、腕部165bのばね力で柱状端子61の側面部に一側方から弾性的に接触する。このような弾性的な接触箇所では反力が発生するが、左右一対の第2平板状端子161を左右逆向きに配置することにより、反力は互いに相殺される。つまり、弾性接触部165を柱状端子61に一側方から接触させる第2平板状端子161の反力は、弾性接触部165を他の柱状端子61に他側方から接触させる第2平板状端子161の反力で相殺される。   Further, when the cable side connection portion 101 is inserted into the insertion port 2 a, the elastic contact portion 165 and the non-elastic contact portion 166 contact the side surface portion of the columnar terminal 61 in the second flat terminal 161 of the cable side connection portion 101. In contact therewith, one elastic contact portion 165 is expanded. Thereby, the elastic contact part 165 elastically contacts the side part of the columnar terminal 61 from one side by the spring force of the arm part 165b. Although a reaction force is generated at such an elastic contact point, the reaction force is canceled out by arranging the pair of left and right second flat plate terminals 161 in the opposite directions. That is, the reaction force of the second flat terminal 161 that makes the elastic contact portion 165 contact the columnar terminal 61 from one side is the second flat terminal that makes the elastic contact portion 165 contact the other columnar terminal 61 from the other side. It is offset by 161 reaction force.

また、平板状端子151、161の弾性接触部155、165が弾性的に接触する柱状端子61の側面部には、小径部63によって凹面が形成されているので、弾性接触部155、165との接触位置を規定することができ、その結果、平板状端子151、161の弾性接触部155、165が柱状端子61から外れることを防止できるだけでなく、柱状端子61と平板状端子151、161との良好な接触状態を維持することができる。   Moreover, since the concave surface is formed by the small diameter part 63 in the side part of the columnar terminal 61 which the elastic contact parts 155 and 165 of the flat terminal 151 and 161 contact elastically, it is with the elastic contact parts 155 and 165. The contact position can be defined, and as a result, not only can the elastic contact portions 155 and 165 of the flat terminals 151 and 161 be prevented from coming off from the column terminals 61, but also the contact between the column terminals 61 and the flat terminals 151 and 161 can be reduced. A good contact state can be maintained.

また、平板状端子151、161の弾性接触部155、165を柱状端子61の側面部に対して左右方向から弾性的に接触させる場合、柱状端子61の位置誤差を弾性接触部155、165の弾性変位許容公差範囲より小さく抑えることが要求されるが、柱状端子61はエッチング工法によって高精度に形成されるので、この要求を満たすことができる。   Further, when the elastic contact portions 155 and 165 of the plate-shaped terminals 151 and 161 are elastically contacted with the side surface portion of the columnar terminal 61 from the left and right directions, the positional error of the columnar terminal 61 is caused by the elasticity of the elastic contact portions 155 and 165. Although it is required to be smaller than the allowable displacement tolerance range, the columnar terminal 61 can be formed with high accuracy by an etching method, and can satisfy this requirement.

つぎに、本発明の他の実施形態について説明する。なお、第1実施形態と同じ構造を有するものについては、同じ符号を付与することによってその説明を省略する。また、前記第1実施形態と同じ動作および同じ効果についても、その説明を省略する。   Next, another embodiment of the present invention will be described. In addition, about the thing which has the same structure as 1st Embodiment, the description is abbreviate | omitted by providing the same code | symbol. The description of the same operation and the same effect as the first embodiment is also omitted.

図7は、本発明の第2実施形態に係る多層基板用コネクタの基板側接続部およびケーブル側接続部を示す斜視図である。
この図に示すように、本発明の第2実施形態に係る多層基板用コネクタは、基板側接続部201が平板状端子151、161を備え、ケーブル側接続部301が柱状端子61を備える点が第1実施形態と相違している。この場合、基板側接続部201は、多層基板2と別工程で形成し、多層基板2の挿入口2a内に実装される。このとき、基板側接続部201を多層基板2の挿入口2aに挿入した状態で、各平板状端子151、161のテール部153、163を挿入口2a内の導体パターンに半田付けする必要があるが、これは、テール部153、163に粉状または粒状の半田や熱硬化性の導電性接着剤を塗布し、挿入口2aへの挿入後に熱処理を行うことで実現される。
FIG. 7 is a perspective view showing a board-side connecting part and a cable-side connecting part of the multilayer board connector according to the second embodiment of the present invention.
As shown in this figure, in the multilayer board connector according to the second embodiment of the present invention, the board-side connecting portion 201 is provided with flat terminals 151 and 161, and the cable-side connecting portion 301 is provided with columnar terminals 61. This is different from the first embodiment. In this case, the board-side connecting portion 201 is formed in a separate process from the multilayer board 2 and mounted in the insertion port 2a of the multilayer board 2. At this time, it is necessary to solder the tail portions 153 and 163 of the respective plate-like terminals 151 and 161 to the conductor pattern in the insertion port 2a in a state where the board-side connection portion 201 is inserted into the insertion port 2a of the multilayer substrate 2. However, this is realized by applying powder or granular solder or a thermosetting conductive adhesive to the tail portions 153 and 163 and performing a heat treatment after the insertion into the insertion port 2a.

図8は、本発明の第3実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルの接続状態を示す斜視図、図9は、本発明の第3実施形態に係る多層基板用コネクタが適用された多層基板を示す図であり、(a)は多層基板の平面図、(b)は多層基板の正面図、(c)は多層基板の下面図、(d)は多層基板の側面図、図10は、本発明の第3実施形態に係る多層基板用コネクタが適用された多層基板のB−B断面図である。
この図に示すように、本発明の第3実施形態に係る多層基板用コネクタは、基板側接続部401の柱状端子461が導電性を有するピン462で形成される点が前記実施形態と相違している。この場合、ピン462は、挿入口2aの上側および下側の積層基板2b、2dに形成した挿入孔2eに対して貫通状に挿入することにより、多層基板2Bの挿入口2a内に配置することができる。
FIG. 8 is a perspective view showing a connection state of a multilayer board and a flat cable to which the multilayer board connector according to the third embodiment of the present invention is applied, and FIG. 9 is a multilayer board according to the third embodiment of the present invention. 1A is a plan view of a multilayer board, FIG. 2B is a front view of the multilayer board, FIG. 3C is a bottom view of the multilayer board, and FIG. FIG. 10 is a BB cross-sectional view of a multilayer board to which the multilayer board connector according to the third embodiment of the present invention is applied.
As shown in this figure, the multilayer board connector according to the third embodiment of the present invention is different from the above embodiment in that the columnar terminals 461 of the board-side connecting portion 401 are formed by conductive pins 462. ing. In this case, the pin 462 is disposed in the insertion port 2a of the multilayer substrate 2B by inserting the pin 462 so as to penetrate through the insertion holes 2e formed in the upper and lower laminated substrates 2b and 2d of the insertion port 2a. Can do.

図11は、本発明の第4実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルの接続状態を示す斜視図、図12は、本発明の第4実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルの接続状態を示す図であり、(a)は多層基板および平板状ケーブルの上面図、(b)は多層基板および平板状ケーブルの正面図、(c)は多層基板および平板状ケーブルの下面図、(d)は多層基板および平板状ケーブルの側面図である。
この図に示すように、本発明の第4実施形態に係る多層基板用コネクタは、多層基板2の複数の中間層に設けられる点が前記実施形態と相違している。例えば、図に示す例は、5層構造の多層基板2Cであり、同じ板厚面の2層目と4層目に挿入口2aを設け、各挿入口2a内に基板側接続部を構成している。このようにすると、多層基板2Cの複数の中間層に対してそれぞれ平板状ケーブル3を接続することが可能になる。
FIG. 11 is a perspective view showing a connection state of a multilayer board and a flat cable to which the multilayer board connector according to the fourth embodiment of the invention is applied, and FIG. 12 is a multilayer board according to the fourth embodiment of the invention. It is a figure which shows the connection state of the multilayer board | substrate with which the connector for connectors was applied, and the flat cable, (a) is a top view of a multilayer board | substrate and a flat cable, (b) is a front view of a multilayer board | substrate and a flat cable, c) is a bottom view of the multilayer substrate and the flat cable, and (d) is a side view of the multilayer substrate and the flat cable.
As shown in this figure, the connector for a multilayer board according to the fourth embodiment of the present invention is different from the above-described embodiment in that it is provided in a plurality of intermediate layers of the multilayer board 2. For example, the example shown in the figure is a multi-layer substrate 2C having a five-layer structure, and an insertion port 2a is provided in the second layer and the fourth layer of the same plate thickness surface, and a substrate side connection portion is configured in each insertion port 2a. ing. In this way, the flat cable 3 can be connected to each of the plurality of intermediate layers of the multilayer substrate 2C.

図13は、本発明の第5実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルの接続状態を示す斜視図、図14は、本発明の第5実施形態に係る多層基板用コネクタが適用された多層基板および平板状ケーブルの接続状態を示す図であり、(a)は多層基板および平板状ケーブルの上面図、(b)は多層基板および平板状ケーブルの正面図、(c)は多層基板および平板状ケーブルの下面図、(d)は多層基板および平板状ケーブルの側面図である。
この図に示すように、本発明の第5実施形態に係る多層基板用コネクタは、第4実施形態と同様に、多層基板2Dの複数の中間層に設けられるが、平板状ケーブル3を異なる方向から多層基板2Dに接続させる点が第4実施形態と相違している。例えば、図に示す例は、5層構造の多層基板2Dであり、隣接する板厚面の2層目と4層目に挿入口2aを設け、各挿入口2a内に基板側接続部を構成している。このようにすると、多層基板2Cの複数の中間層に対してそれぞれ異なる方向から平板状ケーブル3を接続することが可能になる。
13 is a perspective view showing a connection state of a multilayer board to which a multilayer board connector according to a fifth embodiment of the present invention is applied and a flat cable, and FIG. 14 is a multilayer board according to the fifth embodiment of the present invention. It is a figure which shows the connection state of the multilayer board | substrate with which the connector for connectors was applied, and the flat cable, (a) is a top view of a multilayer board | substrate and a flat cable, (b) is a front view of a multilayer board | substrate and a flat cable, c) is a bottom view of the multilayer substrate and the flat cable, and (d) is a side view of the multilayer substrate and the flat cable.
As shown in this figure, the multilayer board connector according to the fifth embodiment of the present invention is provided in a plurality of intermediate layers of the multilayer board 2D as in the fourth embodiment, but the flat cable 3 is arranged in different directions. Is different from the fourth embodiment in that it is connected to the multilayer substrate 2D. For example, the example shown in the figure is a multi-layer substrate 2D having a five-layer structure, and an insertion port 2a is provided in the second and fourth layers of adjacent plate thickness surfaces, and a substrate side connection portion is configured in each insertion port 2a. doing. In this way, the flat cable 3 can be connected to the plurality of intermediate layers of the multilayer substrate 2C from different directions.

なお、第5実施形態の多層基板用コネクタは、多層基板2に接続された2本の平板状ケーブル3を一本のピン2fで抜止めする抜止め構造を備えている。この抜止め構造は、多層基板2において、異なる方向から挿入された平板状ケーブル3(ケーブル側接続部101)が平面視で重なり合う位置で上下方向に貫通するように形成される挿入孔2gと、平板状ケーブル3(ケーブル側接続部101)側において、挿入状態で挿入孔2gと連通するように形成される係合孔(図示せず)とを含み、ケーブル挿入状態で挿入孔2gにピン2fを挿入することにより、ピン2fが2本の平板状ケーブル3の係合孔に係合し、両平板状ケーブル3の抜止めを行うものである。   Note that the multilayer board connector of the fifth embodiment has a retaining structure for retaining the two flat cables 3 connected to the multilayer board 2 with a single pin 2f. This retaining structure includes an insertion hole 2g formed in the multilayer substrate 2 so that the flat cable 3 (cable side connection portion 101) inserted from different directions penetrates in the vertical direction at a position where it overlaps in plan view; The flat cable 3 (cable side connecting portion 101) side includes an engagement hole (not shown) formed so as to communicate with the insertion hole 2g in the inserted state, and the pin 2f is inserted into the insertion hole 2g in the cable inserted state. By inserting the pin 2f, the pin 2f is engaged with the engagement holes of the two flat cables 3 to prevent the two flat cables 3 from being pulled out.

以上、本発明の好ましい実施形態について詳述したが、本発明は上述した実施形態に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形、変更が可能である。   The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications may be made within the scope of the gist of the present invention described in the claims. It can be changed.

1…基板側接続部、2、2B、2C、2D…多層基板、2a…挿入口、2b…第1積層基板、2c…第2積層基板、2d…第3積層基板、2e…挿入孔、2f…ピン、2g…挿入孔、3…平板状ケーブル、3a…ベースフィルム、3b…導体パターン、3c…カバーフィルム、51…導体パターン、52…絶縁空間、61…柱状端子、62…隙間、63…小径部、71…挿入ガイド、72…隙間、73…挿入ガイド部、74…ストッパ部、101…ケーブル側接続部、151…第1平板状端子、152…絶縁空間、153…テール部、154…柱状端子挿入部、155…弾性接触部、155a…基部、155b…腕部、155c…接触部、161…第2平板状端子、162…絶縁空間、163…テール部、164…柱状端子挿入部、165…弾性接触部、165a…基部、165b…腕部、165c…接触部、166…非弾性接触部、166a…接触部、166b…先端角部、171…支持板、171a…先端角部、201…基板側接続部、301…ケーブル側接続部、401…基板側接続部、461…柱状端子、462…ピン、801…基板側接続部、851…板ばね状端子、901…ケーブル側接続部   DESCRIPTION OF SYMBOLS 1 ... Board | substrate side connection part 2, 2B, 2C, 2D ... Multilayer board, 2a ... Insertion opening, 2b ... 1st laminated board, 2c ... 2nd laminated board, 2d ... 3rd laminated board, 2e ... Insertion hole, 2f ... Pin, 2g ... Insertion hole, 3 ... Flat cable, 3a ... Base film, 3b ... Conductor pattern, 3c ... Cover film, 51 ... Conductor pattern, 52 ... Insulating space, 61 ... Columnar terminal, 62 ... Gap, 63 ... Small diameter part 71 ... Insertion guide 72 ... Gap 73 ... Insertion guide part 74 ... Stopper part 101 ... Cable side connection part 151 ... First flat plate terminal 152 ... Insulating space 153 ... Tail part 154 ... Columnar terminal insertion portion, 155 ... elastic contact portion, 155a ... base portion, 155b ... arm portion, 155c ... contact portion, 161 ... second flat plate terminal, 162 ... insulating space, 163 ... tail portion, 164 ... columnar terminal insertion portion, 165 ... 165a ... base part, 165b ... arm part, 165c ... contact part, 166 ... non-elastic contact part, 166a ... contact part, 166b ... tip corner, 171 ... support plate, 171a ... tip corner, 201 ... substrate Side connection part 301 ... Cable side connection part 401 ... Board side connection part 461 ... Columnar terminal, 462 ... Pin, 801 ... Board side connection part, 851 ... Leaf spring terminal, 901 ... Cable side connection part

Claims (7)

多層基板の板厚面に形成された挿入口内に配置される基板側接続部と、
平板状ケーブルの先端部に設けられ、前記挿入口に対する挿入により前記多層基板の中間層で前記基板側接続部と電気的に接続されるケーブル側接続部と、を備える多層基板用コネクタであって、
前記基板側接続部または前記ケーブル側接続部の一方が柱状端子、他方が平板状端子を備え、
前記柱状端子は、前記多層基板の中間層または前記平板状ケーブルの先端部から、前記多層基板または前記平板状ケーブルの厚さ方向に突出形成され、
前記平板状端子は、前記挿入口に対する前記ケーブル側接続部の挿入に応じて、前記柱状端子の側面部に前記挿入口の幅方向から弾性的に接触する弾性接触部を備えることを特徴とする多層基板用コネクタ。
A board-side connecting portion arranged in an insertion port formed on the plate thickness surface of the multilayer board;
A multilayer board connector comprising: a cable side connection portion provided at a distal end portion of a flat cable and electrically connected to the board side connection portion at an intermediate layer of the multilayer board by insertion into the insertion port. ,
One of the board side connection part or the cable side connection part comprises a columnar terminal, the other comprises a flat terminal,
The columnar terminal is formed to project from the intermediate layer of the multilayer board or the tip of the flat cable in the thickness direction of the multilayer board or the flat cable,
The flat terminal includes an elastic contact portion that elastically contacts a side surface portion of the columnar terminal from a width direction of the insertion port in accordance with insertion of the cable side connection portion into the insertion port. Multi-layer board connector.
前記平板状端子と前記柱状端子との接触箇所を複数有し、複数の接触箇所に生じる前記平板状端子の反力が互いに相殺されることを特徴とする請求項1に記載の多層基板用コネクタ。   The multi-layer board connector according to claim 1, wherein the flat-plate terminal and the columnar terminal have a plurality of contact portions, and reaction forces of the flat-plate terminals generated at the plurality of contact portions cancel each other. . 前記柱状端子に一側方から接触する前記平板状端子の反力が、同じ柱状端子に他側方から接触する前記平板状端子の反力で相殺されることを特徴とする請求項1または2に記載の多層基板用コネクタ。   The reaction force of the flat terminal that contacts the columnar terminal from one side is offset by the reaction force of the flat terminal that contacts the same columnar terminal from the other side. The connector for multilayer boards as described in 2. 前記柱状端子に一側方から接触する前記平板状端子の反力が、他の柱状端子に他側方から接触する前記平板状端子の反力で相殺されることを特徴とする請求項1〜3のいずれか一項に記載の多層基板用コネクタ。   The reaction force of the flat terminal that contacts the columnar terminal from one side is offset by the reaction force of the flat terminal that contacts the other columnar terminal from the other side. The connector for multilayer boards as described in any one of 3. 前記柱状端子は、前記平板状端子の接触位置を規定する小径部を備えることを特徴とする請求項1〜4のいずれか一項に記載の多層基板用コネクタ。   The said columnar terminal is provided with the small diameter part which prescribes | regulates the contact position of the said flat terminal, The connector for multilayer substrates as described in any one of Claims 1-4 characterized by the above-mentioned. 前記柱状端子は、エッチング工法を用いて形成された突起であることを特徴とする請求項1〜5のいずれか一項に記載の多層基板用コネクタ。   The multilayer substrate connector according to claim 1, wherein the columnar terminal is a protrusion formed by using an etching method. 前記基板側接続部は、エッチング工法を用いて形成された前記柱状端子および挿入ガイドを備え、該挿入ガイドにより前記挿入口に対する前記ケーブル側接続部の挿入をガイドすることを特徴とする請求項1〜6のいずれか一項に記載の多層基板用コネクタ。   The board-side connecting portion includes the columnar terminal and an insertion guide formed by using an etching method, and guides insertion of the cable-side connecting portion into the insertion port by the insertion guide. The connector for multilayer boards as described in any one of -6.
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