JP2014189637A - Modified polyarylene ether resin, epoxy resin composition, cured product of the same, prepreg, circuit board, and build-up film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a modified polyarylene ether resin which has a high industrial utility value because of its excellent solubility in various solvents, has a low softening point and low melt viscosity, and has excellent dielectric characteristics with both dielectric constant and dielectric loss tangent being low, and to provide an epoxy resin composition containing the same, a cured product thereof, a prepreg, a circuit board, and a build-up film.SOLUTION: Provided is a modified polyarylene ether resin having a polyarylene ether structure in a molecular structure, where at least one of the arylene groups, which constitute the arylene ether structure, has an aralkyl structural part on an aromatic nucleus, and a hydroxyl equivalent is in a range of 850 to 1,600 g/equivalent.

Description

  The present invention relates to a modified polyarylene ether resin having excellent solubility in various solvents, low softening point and melt viscosity, low dielectric constant and dielectric loss tangent, and excellent dielectric properties, and an epoxy resin composition containing the same , A cured product thereof, a prepreg, a circuit board, and a buildup film.

  Epoxy resin compositions containing an epoxy resin and a curing agent as an essential component exhibit excellent heat resistance and insulation in the cured product, and are widely used in electronic component applications such as semiconductors and multilayer printed boards. . Among the electronic component applications, in the technical field of insulating materials for multilayer printed circuit boards, resin materials having excellent dielectric properties that can cope with the increase in signal speed and frequency in various electronic devices, that is, dielectric constant and dielectric There is a demand for the development of a resin material having a sufficiently low tangent.

  Polyphenylene ether resin with a number average molecular weight (Mn) of 5000 or less is blended into an epoxy resin composition containing an epoxy resin and a cyanate ester resin as a technique for reducing both the dielectric constant and dielectric loss tangent of the cured epoxy resin composition. There is a known method (see Patent Document 1 below). However, since the conventional polyphenylene ether resin used in Patent Document 1 has very low solubility in various solvents and has a high softening point and melt viscosity, it is heated to around 90 ° C. It was necessary to mix with an epoxy resin and a curing agent component in a state dissolved in an organic solvent, and it was difficult to handle for industrial use.

WO2009 / 041137

  Therefore, the problem to be solved by the present invention is that it has high industrial utility value because of its excellent solubility in various solvents, has a low softening point and melt viscosity, and has a low dielectric constant and dielectric loss tangent. It is to provide a modified polyarylene ether resin having excellent resistance, an epoxy resin composition containing the same, a cured product thereof, a prepreg, a circuit board, and a buildup film.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors obtained a part of the aromatic nucleus of the polyarylene ether resin by modifying it with an aralkyl group, and have a hydroxyl equivalent of 850 to 1,600 g / equivalent. The modified polyarylene ether resin has significantly higher solubility in various solvents than the polyarylene ether resin before modification, has a low softening point and melt viscosity, and has a sufficiently low dielectric constant and dielectric loss tangent. The present invention has been found and the present invention has been completed.

  That is, the present invention relates to a modified polyarylene ether characterized by having a polyarylene ether structure in the molecular structure, and at least one of the arylene groups constituting the arylene ether structure has an aralkyl structure site on the aromatic nucleus. It relates to resin.

  The present invention further relates to an epoxy resin composition comprising the modified polyarylene ether resin, epoxy resin, and curing agent as essential components.

  The present invention further relates to a cured product obtained by curing the epoxy resin composition.

  The present invention further relates to a prepreg obtained by impregnating a reinforcing substrate with a solution obtained by diluting the epoxy resin composition in an organic solvent and semi-curing the resulting impregnated substrate.

  The present invention further relates to a circuit board obtained by obtaining a varnish obtained by diluting the epoxy resin composition in an organic solvent, and heating and press-molding a varnish shaped into a plate shape and a copper foil.

  The present invention further relates to a build-up film obtained by applying a solution obtained by diluting the epoxy resin composition in an organic solvent on a base film and drying it.

  According to the present invention, a modified polyarylene ether having high industrial utility value due to excellent solubility in various solvents, low softening point and melt viscosity, low dielectric constant and dielectric loss tangent, and excellent dielectric properties. A resin, an epoxy resin composition containing the resin, a cured product thereof, a prepreg, a circuit board, and a buildup film can be provided.

FIG. 1 is a GPC chart of the modified polyarylene ether resin (1) obtained in Example 1. 2 is a ¹³ C-NMR chart of the modified polyarylene ether resin (1) obtained in Example 1. FIG. FIG. 3 is a MALDI-MS chart of the modified polyarylene ether resin (1) obtained in Example 1.

Hereinafter, the present invention will be described in detail.
The modified polyarylene ether resin of the present invention has a polyarylene ether structure in the molecular structure, at least one of the arylene groups constituting the arylene ether structure has an aralkyl structure site on the aromatic nucleus, and has a hydroxyl group equivalent. It is the range of 850-1,600g / equivalent.

  Polyarylene ether resins are known to have an effect of reducing the dielectric constant and dielectric loss tangent in cured products when used in an epoxy resin composition, etc., but as described above, they can be dissolved in various solvents. It was difficult to handle due to its very low softness and high softening point and melt viscosity. On the other hand, the modified polyarylene ether resin of the present invention has a low dielectric constant and a low dielectric loss tangent because at least one of the arylene groups in the molecular structure has an aralkyl structure site on the aromatic nucleus, and exhibits excellent dielectric properties. While maintaining the characteristics, the solubility in various solvents is remarkably improved, and the softening point is further lowered. In general, a resin having a three-dimensionally bulky substituent skeleton is excellent in solvent solubility, but the dielectric properties tend to decrease with decreasing crystallinity, but the modified polyarylene ether resin of the present invention has solvent solubility. It has the characteristic of having both dielectric properties at a high level.

  As long as the modified polyarylene ether resin of the present invention has a polyarylene ether structure in its molecular structure, the entire molecular structure is not particularly limited. Examples of the arylene group include a phenylene group, a naphthylene group, and Examples of such structural sites include substituents such as alkyl groups, alkoxy groups and aryl groups on these aromatic nuclei. Among them, since it becomes a modified polyarylene ether resin having more excellent dielectric properties, the polyarylene ether structure is represented by the following structural formula (ii)

（式中Ｒ^２はそれぞれ独立に水素原子、炭素原子数１〜４のアルキル基、炭素原子数１〜４のアルコキシ基、フェニル基の何れかであり、ｋは繰り返し単位数を表す整数である。）
で表される構造部位であることが好ましい。

(In the formula, each R ² is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and k is an integer representing the number of repeating units. .)
It is preferable that it is a structure site | part represented by these.

  The modified polyarylene ether resin of the present invention having such a polyarylene ether structure specifically has the following structural formula (I)

［式中Ｒ^２はそれぞれ独立に水素原子、炭素原子数１〜４のアルキル基、炭素原子数１〜４のアルコキシ基、フェニル基の何れかであり、ｌ及びｍはそれぞれ独立に０以上の整数であり、ｌとｍとの和は８以上である。また、式中Ｘは下記構造式（２−１）〜（２−９）

[Wherein R ² is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and l and m are each independently 0 or more. It is an integer, and the sum of l and m is 8 or more. In the formula, X represents the following structural formulas (2-1) to (2-9).

（式中、Ｒ^３はそれぞれ独立に水素原子、炭素原子数１〜４のアルキル基、炭素原子数１〜４のアルコキシ基、フェニル基の何れかであり、Ｒ^４はそれぞれ独立に炭素原子数１〜４のアルキル基、炭素原子数１〜４のアルコキシ基、フェニル基の何れかであり、ｎは０〜４の整数である。）
の何れかで表される構造部位であり、Ｙはそれぞれ独立に水素原子又は下記構造式（ｉ）

(In the formula, each R ³ is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and R ⁴ is each independently the number of carbon atoms. (It is any one of an alkyl group having 1 to 4, an alkoxy group having 1 to 4 carbon atoms, and a phenyl group, and n is an integer of 0 to 4).
Wherein Y is independently a hydrogen atom or the following structural formula (i)

（式中、Ｒ^１はそれぞれ独立してメチル基又は水素原子であり、Ａｒ^１はフェニレン基、ナフチレン基、又は、芳香核上に炭素原子数１〜４のアルキル基を１〜３個有するフェニレン基或いはナフチレン基であり、ｎは１又は２である。）
で表される構造部位の何れかであり、複数存在するＹのうち少なくとも一つは前記構造式（ｉ）で表される構造部位である。］
で表される分子構造を有するものが挙げられる。

(In the formula, each R ¹ independently represents a methyl group or a hydrogen atom, and Ar ¹ represents a phenylene group, a naphthylene group, or a phenylene having 1 to 3 alkyl groups having 1 to 4 carbon atoms on the aromatic nucleus. Group or naphthylene group, and n is 1 or 2.)
And at least one of the plurality of Ys is a structural part represented by the structural formula (i). ]
The thing which has the molecular structure represented by these is mentioned.

R ² in the structural formula (I) is each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group. It is preferable that it is a C1-C4 alkyl group, and it is especially preferable that it is a methyl group. The bonding position of R ² is preferably ortho with respect to the bonding position of ether-bonded oxygen, that is, preferably has a 2,6-xylylene ether structure.

X in the structural formula (I) is a structural portion represented by any one of the structural formulas (2-1) to (2-9), and among them, a modified polyarylene ether resin having more excellent dielectric properties. Therefore, the structural site represented by the structural formula (2-9) is preferable, and all four R ³ in the structural formula (2-9) are methyl groups, and two R ⁴ are It is more preferable that both are methyl groups. In addition, the bonding position of R ³ is preferably ortho-position to the bonding position of the ether bond oxygen, that is, has a 4,4′-isopropylidenebis (2,6-dimethyl-phenylene) structure. Is preferred.

In the structural formula (i), Ar ¹ is a phenylene group, a naphthylene group, or a phenylene group or a naphthylene group having 1 to 3 alkyl groups having 1 to 4 carbon atoms on the aromatic nucleus. A phenylene group is preferable because it is a modified polyarylene ether resin having excellent solubility in various solvents, a low softening point, and excellent dielectric properties. In addition, each R ¹ is independently a methyl group or a hydrogen atom, but since it becomes a modified polyarylene ether resin having an excellent balance between solubility in various solvents and dielectric properties, both R ¹ are both hydrogen atoms. It is preferable that

  Such a modified polyarylene ether resin of the present invention is easy to handle and is excellent in heat resistance of a cured product when used in an epoxy resin composition, and therefore has a softening point of 80 to 170 ° C. It is preferable that it is the range of 100-165 degreeC.

  The hydroxyl group equivalent of the modified polyarylene ether resin is in the range of 850 to 1,600 g / equivalent, and the hydroxyl equivalent is in this range, so that it has excellent solvent solubility and dielectric properties, and is blended in the epoxy resin composition. When used, the cured product has an excellent heat resistance.

  The modified polyarylene ether resin of the present invention can be produced by, for example, a method of reacting a polyarylene ether resin (A) having a polyarylene ether structure in the molecular structure with an aralkylating agent (B).

  As long as the polyarylene ether resin (A) used in the production method has a polyarylene ether structure in its molecular structure, the entire molecular structure is not particularly limited. As the arylene group, a phenylene group, Examples thereof include a naphthylene group and a structural site having a substituent such as an alkyl group, an alkoxy group, and an aryl group on these aromatic nuclei. Among them, since it becomes a modified polyarylene ether resin having more excellent dielectric properties, it is preferable that the polyarylene ether structure is a structural portion represented by the structural formula (ii), and such a polyarylene ether resin (A ) Is specifically the following structural formula (1)

［式中Ｒ^２はそれぞれ独立に水素原子、炭素原子数１〜４のアルキル基、炭素原子数１〜４のアルコキシ基、フェニル基の何れかであり、ｌ及びｍはそれぞれ独立に０以上の整数であり、ｌとｍとの和は８以上である。また、式中Ｘは下記構造式（２−１）〜（２−９）

[Wherein R ² is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and l and m are each independently 0 or more. It is an integer, and the sum of l and m is 8 or more. In the formula, X represents the following structural formulas (2-1) to (2-9).

（式中、Ｒ^３はそれぞれ独立に水素原子、炭素原子数１〜４のアルキル基、炭素原子数１〜４のアルコキシ基、フェニル基の何れかであり、Ｒ^４はそれぞれ独立に炭素原子数１〜４のアルキル基、炭素原子数１〜４のアルコキシ基、フェニル基の何れかであり、ｎは０〜４の整数である。）
の何れかで表される構造部位である。］
で表される分子構造を有するものが挙げられる。

(In the formula, each R ³ is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and R ⁴ is each independently the number of carbon atoms. (It is any one of an alkyl group having 1 to 4, an alkoxy group having 1 to 4 carbon atoms, and a phenyl group, and n is an integer of 0 to 4).
It is a structural part represented by either. ]
The thing which has the molecular structure represented by these is mentioned.

R ² in the structural formula (1) has the same meaning as R ² in the structural formula (I), and as described above, it becomes a modified polyarylene ether resin having more excellent dielectric properties. Are preferably alkyl groups, and particularly preferably methyl groups. The bonding position of R ² is preferably ortho with respect to the bonding position of ether-bonded oxygen, that is, preferably has a 2,6-xylylene ether structure.

X in the structural formula (1) has the same meaning as R ² in the structural formula (I), and as described above, a modified polyarylene ether resin having more excellent dielectric properties is used. ), And it is more preferable that all four R ³ in the structural formula (2-9) are a methyl group, and two R ⁴ are both a methyl group. . In addition, the bonding position of R ³ is preferably ortho-position to the bonding position of the ether bond oxygen, that is, has a 4,4′-isopropylidenebis (2,6-dimethyl-phenylene) structure. Is preferred.

  In addition, the hydroxyl equivalent of the polyarylene ether resin (A) used here is excellent in solvent solubility and dielectric properties, and excellent in heat resistance of a cured product when used in an epoxy resin composition. The range is preferably from 500 to 1500 g / equivalent, and more preferably from 600 to 1000 g / equivalent.

  Next, examples of the aralkylating agent (B) to be reacted with the polyarylene ether resin (A) include a phenylmethanol compound, a phenylmethyl halide compound, a naphthylmethanol compound, a naphthylmethyl halide compound, and a styrene compound. Specifically, benzyl chloride, benzyl bromide, benzyl iodide, o-methylbenzyl chloride, m-methylbenzyl chloride, p-methylbenzyl chloride, p-ethylbenzyl chloride, p-isopropylbenzyl chloride, p-tert-butyl Benzyl chloride, p-phenylbenzyl chloride, 5-chloromethylacenaphthylene, 2-naphthylmethyl chloride, 1-chloromethyl-2-naphthalene and their nuclear substituted isomers, α-methylbenzyl chloride, and α, α- Dimethyl benzyl chloride, etc .; benzyl methyl ether, o-methyl benzyl methyl ether, m-methyl benzyl methyl ether, p-methyl benzyl methyl ether, p-ethyl benzyl methyl ether and nuclei thereof Isomers, benzyl ethyl ether, benzyl propyl ether, benzyl isobutyl ether, benzyl n-butyl ether, p-methylbenzyl methyl ether and its nuclear substitution isomers; benzyl alcohol, o-methylbenzyl alcohol, m-methylbenzyl alcohol, p-methylbenzyl alcohol, p-ethylbenzyl alcohol, p-isopropylbenzyl alcohol, ptert-butylbenzyl alcohol, p-phenylbenzyl alcohol, α-naphthylmethanol and their nuclear substituted isomers, α-methylbenzyl alcohol, and α , Α-dimethylbenzyl alcohol and the like; styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, α-methylstyrene, β-methylstyrene and the like.

  Among these, a modified polyarylene ether resin having excellent reactivity with the polyarylene ether resin (A), excellent solubility in various solvents and dielectric properties, and a low softening point can be obtained. Chloride, benzyl bromide or benzyl alcohol is preferred, and benzyl alcohol is particularly preferred.

  The reaction rate of the polyarylene ether resin (A) and the aralkylating agent (B) is a modified polyarylene ether resin having excellent solubility, low softening point, and excellent dielectric properties. The aralkylating agent is preferably in the range of 5 to 40 parts by mass with respect to 100 parts by mass.

  The reaction of the polyarylene ether resin (A) and the aralkylating agent (B) can be performed, for example, at a temperature of 100 to 180 ° C. in the presence of an acid catalyst. Examples of the acid catalyst used here include inorganic acids such as phosphoric acid, sulfuric acid, and hydrochloric acid, oxalic acid, benzenesulfonic acid, toluenesulfonic acid, methanesulfonic acid, fluoromethanesulfonic acid and other organic acids, aluminum chloride, zinc chloride, Examples thereof include Friedel-Crafts catalysts such as stannic chloride, ferric chloride, and diethyl sulfate.

  The amount of the acid catalyst used can be appropriately selected depending on the desired aralkylation rate, etc. In the case of an inorganic acid or an organic acid, it is 0.01 to 5.0 parts by mass with respect to 100 parts by mass of the reaction raw material. In the case of a Friedel-Crafts catalyst, it is preferably used in a range of 0.2 to 3.0 mol with respect to 1 mol of the aralkylating agent (B).

  The reaction may be performed in an organic solvent as necessary. Examples of the organic solvent used herein include ketone solvents such as acetone, methyl ethyl ketone, and cyclohexanone, acetate solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate, cellosolve, butyl carbitol, and the like. Examples thereof include carbitol solvents, aromatic hydrocarbon solvents such as toluene and xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone and the like.

  After completion of the reaction, the target modified polyarylene ether resin can be obtained by neutralizing the reaction system and then washing the reaction product with water.

  The epoxy resin composition of the present invention contains the aforementioned modified polyarylene ether resin, epoxy resin, and curing agent as essential components.

  Examples of the epoxy resin used in the present invention include bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, tetramethylbiphenyl type epoxy resin, polyhydroxynaphthalene type epoxy resin, phenol novolac type epoxy resin, and cresol novolac type. Epoxy resin, triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin, dicyclopentadiene-phenol addition reaction type epoxy resin, phenol aralkyl type epoxy resin, naphthol novolak type epoxy resin, naphthol aralkyl type epoxy resin, naphthol-phenol Condensed novolac epoxy resin, naphthol-cresol co-condensed novolac epoxy resin, aromatic hydrocarbon formaldehyde resin modified phenolic tree Type epoxy resins, biphenyl-modified novolak type epoxy resins. Among these epoxy resins, tetramethylbiphenol type epoxy resin, biphenyl aralkyl type epoxy resin, polyhydroxynaphthalene type epoxy resin, and novolac type epoxy resin are used in that a cured product having excellent flame retardancy can be obtained. A dicyclopentadiene-phenol addition reaction type epoxy resin is preferable in that a cured product having excellent dielectric properties is obtained.

Examples of the curing agent used in the present invention include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, imidazole, BF ₃ -amine complex, guanidine derivatives and other amine compounds: dicyandiamide, linolenic acid Amide compounds such as polyamide resin synthesized from the product and ethylenediamine: phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydro Acid anhydrides such as phthalic anhydride and methylhexahydrophthalic anhydride: phenol novolac resin, cresol novolac resin, aromatic hydrocarbon formaldehyde resin modified phenol resin, dicyclopentadi Phenol addition resin, phenol aralkyl resin, naphthol aralkyl resin, trimethylol methane resin, tetraphenylol ethane resin, naphthol novolac resin, naphthol-phenol co-condensed novolac resin, naphthol-cresol co-condensed novolac resin, biphenyl-modified phenol resin ( Polyphenolic compounds in which phenol nuclei are linked by bismethylene groups), biphenyl-modified naphthol resins (polyvalent naphthol compounds in which phenol nuclei are linked by bismethylene groups), aminotriazine-modified phenolic resins (phenolic nuclei are linked by melamine, benzoguanamine, etc.) Polyhydric phenol compounds).

  Among these, those containing a large amount of an aromatic skeleton in the molecular structure are preferable because of their excellent dielectric properties. Specifically, phenol novolac resins, cresol novolac resins, aromatic hydrocarbon formaldehyde resin-modified phenol resins, and phenol aralkyl resins. A naphthol aralkyl resin, a naphthol novolak resin, a naphthol-phenol co-condensed novolak resin, a naphthol-cresol co-condensed novolak resin, a biphenyl-modified phenol resin, a biphenyl-modified naphthol resin, and an aminotriazine-modified phenol resin are preferable.

  The blend ratio of the modified polyarylene ether resin, the epoxy resin, and the curing agent is excellent in curability, and a cured product having a low dielectric constant and dielectric loss tangent is obtained. It is preferable that the ratio of the epoxy groups in the epoxy resin is 0.8 to 1.2 equivalents with respect to 1 equivalent of the total active groups.

  The epoxy resin composition of the present invention may contain a curing accelerator as necessary. Examples of the curing accelerator used here include phosphorus compounds, tertiary amines, imidazoles, organic acid metal salts, Lewis acids, amine complex salts, and the like. In particular, when the epoxy resin composition of the present invention is used as a build-up material application or a circuit board application, dimethylaminopyridine and imidazole are preferable because of excellent heat resistance, dielectric characteristics, solder resistance, and the like.

  As described above, the modified polyarylene ether resin of the present invention has characteristics that are superior in solvent solubility as compared with conventional polyarylene ether resins, and the epoxy resin composition of the present invention is used for build-up materials and circuit boards. When used as an application, it can be varnished using various organic solvents such as ketone solvents, alcohol solvents, and ester solvents in addition to conventionally used solvents such as toluene. Organic solvents that can be used as the solvent of the epoxy resin composition of the present invention include, for example, aromatic hydrocarbon solvents such as toluene and xylene, ketone solvents such as acetone, methyl ethyl ketone, and cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, Examples include acetate solvents such as propylene glycol monomethyl ether acetate and carbitol acetate; alcohol solvents such as ethanol, propanol and butanol; carbitol solvents such as cellosolve and butyl carbitol; dimethylformamide, dimethylacetamide and N-methylpyrrolidone. .

  When the epoxy resin composition of the present invention is used for printed wiring board applications, it is preferably a polar solvent having a boiling point of 160 ° C. or lower, such as methyl ethyl ketone, acetone, 1-methoxy-2-propanol, etc., and has a nonvolatile content of 40 to 80 It is preferable to use at a ratio of mass%. On the other hand, for use in build-up adhesive film applications, ketone solvents such as acetone, methyl ethyl ketone, cyclohexanone, etc., acetate solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, carbitol acetate, ethanol, propanol It is preferable to use an alcohol solvent such as butanol, a carbitol solvent such as cellosolve or butyl carbitol, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, etc., and a non-volatile content of 30 to 60% by mass. preferable.

  Moreover, the epoxy resin composition of this invention may use together other thermosetting resin suitably as needed. Examples of other thermosetting resins that can be used here include cyanate ester compounds, vinylbenzyl compounds, acrylic compounds, maleimide compounds, and copolymers of styrene and maleic anhydride. When other thermosetting resins described above are used in combination, the amount used is not particularly limited as long as the effect of the present invention is not impaired, but is in the range of 1 to 50 parts by weight in 100 parts by weight of the epoxy resin composition. It is preferable.

  When the epoxy resin composition of the present invention is used for applications requiring higher flame retardancy than for printed wiring boards, a non-halogen flame retardant containing substantially no halogen atoms may be blended.

  Examples of the non-halogen flame retardant include a phosphorus flame retardant, a nitrogen flame retardant, a silicone flame retardant, an inorganic flame retardant, an organic metal salt flame retardant, and the like. It is not intended to be used alone, and a plurality of the same type of flame retardants may be used, or different types of flame retardants may be used in combination.

  As the phosphorus flame retardant, either inorganic or organic can be used. Examples of the inorganic compounds include red phosphorus, monoammonium phosphate, diammonium phosphate, triammonium phosphate, ammonium phosphates such as ammonium polyphosphate, and inorganic nitrogen-containing phosphorus compounds such as phosphate amide. .

  The red phosphorus is preferably subjected to a surface treatment for the purpose of preventing hydrolysis and the like. Examples of the surface treatment method include (i) magnesium hydroxide, aluminum hydroxide, zinc hydroxide, water A method of coating with an inorganic compound such as titanium oxide, bismuth oxide, bismuth hydroxide, bismuth nitrate or a mixture thereof; (ii) an inorganic compound such as magnesium hydroxide, aluminum hydroxide, zinc hydroxide, titanium hydroxide; and A method of coating with a mixture of a thermosetting resin such as a phenol resin, (iii) thermosetting of a phenol resin or the like on a coating of an inorganic compound such as magnesium hydroxide, aluminum hydroxide, zinc hydroxide, or titanium hydroxide For example, a method of double coating with a resin may be used.

  The organic phosphorus compounds include, for example, general-purpose organic phosphorus compounds such as phosphate ester compounds, phosphonic acid compounds, phosphinic acid compounds, phosphine oxide compounds, phosphorane compounds, organic nitrogen-containing phosphorus compounds, and 9,10-dihydro -9-oxa-10-phosphaphenanthrene-10-oxide, 10- (2,5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenanthrene-10-oxide, 10- (2,7- Examples thereof include cyclic organic phosphorus compounds such as dihydrooxynaphthyl) -10H-9-oxa-10-phosphaphenanthrene-10-oxide and derivatives obtained by reacting them with compounds such as epoxy resins and phenol resins.

  For example, in the case where red phosphorus is used in 100 parts by mass of the epoxy resin composition, the amount of these phosphorus-based flame retardants is preferably 0.1 to 2.0 parts by mass. When using, it is preferable to mix | blend in the range of 0.1-10.0 mass part, and it is more preferable to mix | blend in the range of 0.5-6.0 mass part.

  In addition, when using the phosphorous flame retardant, the phosphorous flame retardant may be used in combination with hydrotalcite, magnesium hydroxide, boric compound, zirconium oxide, black dye, calcium carbonate, zeolite, zinc molybdate, activated carbon, etc. Good.

  Examples of the nitrogen-based flame retardant include triazine compounds, cyanuric acid compounds, isocyanuric acid compounds, phenothiazines, and the like, and triazine compounds, cyanuric acid compounds, and isocyanuric acid compounds are preferable.

  Examples of the triazine compound include melamine, acetoguanamine, benzoguanamine, melon, melam, succinoguanamine, ethylene dimelamine, melamine polyphosphate, triguanamine and the like, for example, sulfuric acid such as guanylmelamine sulfate, melem sulfate, melam sulfate Examples thereof include aminotriazine compounds, aminotriazine-modified phenol resins, and aminotriazine-modified phenol resins that are further modified with tung oil, isomerized linseed oil, and the like.

  Examples of the cyanuric acid compound include cyanuric acid and cyanuric acid melamine.

  The blending amount of the nitrogen-based flame retardant is preferably blended in the range of 0.05 to 10 parts by weight, for example, in the range of 0.1 to 5 parts by weight in 100 parts by weight of the epoxy resin composition. Is more preferable.

  Moreover, when using the said nitrogen-type flame retardant, you may use together a metal hydroxide, a molybdenum compound, etc.

  The silicone flame retardant is not particularly limited as long as it is an organic compound containing a silicon atom, and examples thereof include silicone oil, silicone rubber, and silicone resin.

  It is preferable to mix | blend the compounding quantity of the said silicone type flame retardant in the range of 0.05-20 mass parts in 100 mass parts of epoxy resin compositions, for example. Moreover, when using the said silicone type flame retardant, you may use a molybdenum compound, an alumina, etc. together.

  Examples of the inorganic flame retardant include metal hydroxide, metal oxide, metal carbonate compound, metal powder, boron compound, and low melting point glass.

  Examples of the metal hydroxide include aluminum hydroxide, magnesium hydroxide, dolomite, hydrotalcite, calcium hydroxide, barium hydroxide, and zirconium hydroxide.

  Examples of the metal oxide include zinc molybdate, molybdenum trioxide, zinc stannate, tin oxide, aluminum oxide, iron oxide, titanium oxide, manganese oxide, zirconium oxide, zinc oxide, molybdenum oxide, cobalt oxide, bismuth oxide, Examples thereof include chromium oxide, nickel oxide, copper oxide, and tungsten oxide.

  Examples of the metal carbonate compound include zinc carbonate, magnesium carbonate, calcium carbonate, barium carbonate, basic magnesium carbonate, aluminum carbonate, iron carbonate, cobalt carbonate, and titanium carbonate.

  Examples of the metal powder include aluminum, iron, titanium, manganese, zinc, molybdenum, cobalt, bismuth, chromium, nickel, copper, tungsten, and tin.

  Examples of the boron compound include zinc borate, zinc metaborate, barium metaborate, boric acid, and borax.

Examples of the low-melting-point glass include Sheepley (Bokusui Brown), hydrated glass SiO ₂ —MgO—H ₂ O, PbO—B ₂ O ₃ system, ZnO—P ₂ O ₅ —MgO system, and P ₂ O. Glass forms such as _5- B ₂ O ₃ —PbO—MgO, P—Sn—O—F, PbO—V ₂ O ₅ —TeO ₂ , Al ₂ O ₃ —H ₂ O, lead borosilicate, etc. A compound can be mentioned.

  The blending amount of the inorganic flame retardant is, for example, preferably in the range of 0.05 to 20 parts by mass and in the range of 0.5 to 15 parts by mass in 100 parts by mass of the epoxy resin composition. Is more preferable.

  Examples of the organic metal salt flame retardant include ferrocene, acetylacetonate metal complex, organic metal carbonyl compound, organic cobalt salt compound, organic sulfonic acid metal salt, metal atom and aromatic compound or heterocyclic compound. And the like.

  It is preferable to mix | blend the compounding quantity of the said organometallic salt type flame retardant in the range of 0.005-10 mass parts in 100 mass parts of epoxy resin compositions, for example.

  The epoxy resin composition of this invention can mix | blend an inorganic filler as needed. Examples of the inorganic filler include fused silica, crystalline silica, alumina, silicon nitride, and aluminum hydroxide. When particularly increasing the blending amount of the inorganic filler, it is preferable to use fused silica. The fused silica can be used in either a crushed shape or a spherical shape. However, in order to increase the blending amount of the fused silica and suppress an increase in the melt viscosity of the molding material, it is preferable to mainly use a spherical shape. In order to further increase the blending amount of the spherical silica, it is preferable to appropriately adjust the particle size distribution of the spherical silica. The filling rate is preferably higher in consideration of flame retardancy, and particularly preferably 20% by mass or more with respect to the total amount of the thermosetting resin composition. Moreover, when using for uses, such as an electrically conductive paste, electroconductive fillers, such as silver powder and copper powder, can be used.

  In addition to the above, the epoxy resin composition of the present invention may contain various compounding agents such as a silane coupling agent, a release agent, a pigment, and an emulsifier, if necessary.

  The epoxy resin composition of the present invention is obtained by uniformly mixing the above-described components, and can be easily made into a cured product by a method similar to the curing of conventionally known epoxy resin compositions. Examples of the cured product include molded cured products such as laminates, cast products, adhesive layers, coating films, and films.

  Since the epoxy resin composition of the present invention has a low dielectric constant and dielectric loss tangent of the cured product, circuit boards such as hard printed wiring board materials, resin compositions for flexible wiring boards, interlayer insulation materials for build-up boards, etc. It can be suitably used for various electronic materials such as insulating materials for semiconductors, semiconductor sealing materials, conductive pastes, build-up adhesive films, resin casting materials, adhesives and the like. Above all, taking advantage of both the high solubility in various solvents and the dielectric properties of the modified polyarylene ether resin of the present invention, rigid printed wiring board materials, resin compositions for flexible wiring boards, and interlayers for build-up boards It can be particularly preferably used for circuit board materials such as insulating materials.

  Of these, when applied to circuit board applications, a varnish obtained by diluting the epoxy resin composition of the present invention in an organic solvent is obtained, and this is formed into a plate shape, laminated with copper foil, and heated and pressed. Can be manufactured. In addition, when applying to hard printed circuit board applications, a prepreg is obtained by impregnating a reinforcing base material with a varnish-like epoxy resin composition containing an organic solvent and semi-curing it, and copper foil is laminated on it and heated. It can be manufactured by a method of pressure bonding. Examples of the reinforcing substrate that can be used here include paper, glass cloth, glass nonwoven fabric, aramid paper, aramid cloth, glass mat, and glass roving cloth. More specifically, the varnish-like epoxy resin composition described above is first heated at a heating temperature corresponding to the solvent type used, preferably 50 to 170 ° C. to obtain a prepreg that is a cured product. . Under the present circumstances, although the mass ratio of the thermosetting resin composition to be used and a reinforcement base material is not specifically limited, Usually, it is preferable to prepare so that the resin content in a prepreg may be 20-60 mass%. Next, the prepreg obtained as described above is laminated by a conventional method, and a copper foil is appropriately stacked, and then subjected to thermocompression bonding at a pressure of 1 to 10 MPa at 170 to 250 ° C. for 10 minutes to 3 hours, A target circuit board can be obtained.

  In order to produce a flexible wiring board from the epoxy resin composition of the present invention, an epoxy resin composition containing an organic solvent is applied to an electrically insulating film using a coating machine such as a reverse roll coater or a comma coater. Subsequently, it heats for 1 to 15 minutes at 60-170 degreeC using a heater, volatilizes a solvent, and makes an epoxy resin composition B-stage. Next, the metal foil is thermocompression bonded to the resin composition layer using a heating roll or the like. At that time, the pressure is preferably 2 to 200 N / cm and the pressure is preferably 40 to 200 ° C. If sufficient adhesive performance can be obtained, the process may be completed here. However, when complete curing is required, it is preferably post-cured at 100 to 200 ° C. for 1 to 24 hours. The thickness of the resin composition layer after finally curing is preferably in the range of 5 to 100 μm.

  In order to produce an interlayer insulating material for a build-up board from the epoxy resin composition of the present invention, for example, an epoxy resin composition appropriately blended with rubber, filler or the like is applied to a wiring board on which a circuit is formed by a spray coating method or curtain coating After applying using a method or the like, it is cured. Then, after drilling a predetermined through-hole part etc. as needed, it treats with a roughening agent, forms the unevenness | corrugation by washing the surface with hot water, and metal-treats, such as copper. As the plating method, electroless plating or electrolytic plating treatment is preferable, and examples of the roughening agent include an oxidizing agent, an alkali, and an organic solvent. Such operations are sequentially repeated as desired, and a build-up base can be obtained by alternately building up and forming the resin insulating layer and the conductor layer having a predetermined circuit pattern. However, the through-hole portion is formed after the outermost resin insulating layer is formed. Also, a copper foil with resin obtained by semi-curing the resin composition on the copper foil is heat-pressed at 170 to 250 ° C. on a wiring board on which a circuit is formed, thereby forming a roughened surface and a plating process. It is also possible to produce a build-up board without the above.

  The method for producing an adhesive film for buildup from the epoxy resin composition of the present invention is, for example, an adhesive for multilayer printed wiring boards by applying the epoxy resin composition of the present invention on a support film to form a resin composition layer. The method of using a film is mentioned.

  When the epoxy resin composition of the present invention is used for a build-up adhesive film, the adhesive film is softened under the lamination temperature condition (usually 70 ° C. to 140 ° C.) in the vacuum laminating method, and at the same time as laminating the circuit board, It is important to show fluidity (resin flow) capable of filling the via hole or through hole in the substrate, and it is preferable to blend the above-described components so as to exhibit such characteristics.

  Here, the diameter of the through hole of the multilayer printed wiring board is usually 0.1 to 0.5 mm, and the depth is usually 0.1 to 1.2 mm. It is usually preferable to allow resin filling in this range. When laminating both surfaces of the circuit board, it is desirable to fill about 1/2 of the through hole.

  Specifically, the method for producing the adhesive film described above is, after preparing the varnish-like epoxy resin composition of the present invention, coating the varnish-like composition on the surface of the support film and further heating, or It can manufacture by drying an organic solvent by hot air spraying etc. and forming the layer ((alpha)) of an epoxy resin composition.

  The thickness of the formed layer (α) is usually not less than the thickness of the conductor layer. Since the thickness of the conductor layer of the circuit board is usually in the range of 5 to 70 μm, the thickness of the resin composition layer is preferably 10 to 100 μm.

  In addition, the said layer ((alpha)) may be protected with the protective film mentioned later. By protecting with a protective film, it is possible to prevent dust and the like from being attached to the surface of the resin composition layer and scratches.

  The above-mentioned support film and protective film are made of polyolefin such as polyethylene, polypropylene and polyvinyl chloride, polyethylene terephthalate (hereinafter sometimes abbreviated as “PET”), polyester such as polyethylene naphthalate, polycarbonate, polyimide, and further. Examples thereof include metal foil such as pattern paper, copper foil, and aluminum foil. In addition, the support film and the protective film may be subjected to a release treatment in addition to the mud treatment and the corona treatment.

  Although the thickness of a support film is not specifically limited, Usually, it is 10-150 micrometers, Preferably it is used in 25-50 micrometers. Moreover, it is preferable that the thickness of a protective film shall be 1-40 micrometers.

  The above support film is peeled off after laminating on the circuit board or after forming the insulating layer by heat curing. If the support film is peeled after the adhesive film is heat-cured, adhesion of dust and the like in the curing process can be prevented. In the case of peeling after curing, the support film is usually subjected to a release treatment in advance.

  Next, the method for producing a multilayer printed wiring board using the adhesive film obtained as described above is, for example, when the layer (α) is protected with a protective film, Lamination is performed on one or both sides of the circuit board by, for example, vacuum laminating so that α) is in direct contact with the circuit board. The laminating method may be a batch method or a continuous method using a roll. Further, the adhesive film and the circuit board may be heated (preheated) as necessary before lamination.

The laminating conditions are preferably a pressure bonding temperature (laminating temperature) of 70 to 140 ° C., a pressure bonding pressure of preferably 1 to 11 kgf / cm ² (9.8 × 10 ^{4 to} 107.9 × 10 ⁴ N / m 2), Lamination is preferably performed under reduced pressure with an air pressure of 20 mmHg (26.7 hPa) or less.

  When the epoxy resin composition of the present invention is used as a conductive paste, for example, a method in which fine conductive particles are dispersed in an epoxy resin composition to form a composition for an anisotropic conductive film, a circuit that is liquid at room temperature Examples thereof include a paste resin composition for connection and an anisotropic conductive adhesive.

  The epoxy resin composition of the present invention can also be used as a resist ink. In this case, a vinyl monomer having an ethylenically unsaturated double bond and a cationic polymerization catalyst as a curing agent are blended in the epoxy resin composition, and further a pigment, talc, and filler are added to obtain a resist ink composition. Then, after apply | coating on a printed circuit board by a screen printing system, the method of setting it as a resist ink hardened | cured material is mentioned.

  As described above, the modified polyarylene ether resin of the present invention has a better balance between solvent solubility and dielectric properties compared to conventional polyarylene ether resins, so it is possible to increase the calculation speed of high-frequency devices. Alcohol solvent with relatively low environmental impact instead of the conventional organic solvent with high environmental impact such as toluene, which has been the mainstream, because it can contribute to varnish when applied to various electronic materials. Or an ester solvent can be used.

Next, the present invention will be specifically described with reference to Examples and Comparative Examples. In the following, “parts” and “%” are based on mass unless otherwise specified. The softening point measurement, GPC measurement, ¹³ C-NMR, and MALDI-MS spectrum were measured under the following conditions.

Softening point measurement method: compliant with JIS K7234.

GPC: Measured under the following conditions.
Measuring device: “HLC-8220 GPC” manufactured by Tosoh Corporation
Column: Guard column “HXL-L” manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ Tosoh Corporation “TSK-GEL G3000HXL”
+ Tosoh Corporation “TSK-GEL G4000HXL”
Detector: RI (Differential refraction diameter)
Data processing: “GPC-8020 Model II version 4.10” manufactured by Tosoh Corporation
Measurement conditions: Column temperature 40 ° C
Developing solvent Tetrahydrofuran
Flow rate: 1.0 ml / min Standard: The following monodisperse polystyrene having a known molecular weight was used in accordance with the measurement manual of “GPC-8020 Model II version 4.10”.

(Polystyrene used)
“A-500” manufactured by Tosoh Corporation
"A-1000" manufactured by Tosoh Corporation
"A-2500" manufactured by Tosoh Corporation
"A-5000" manufactured by Tosoh Corporation
“F-1” manufactured by Tosoh Corporation
"F-2" manufactured by Tosoh Corporation
“F-4” manufactured by Tosoh Corporation
“F-10” manufactured by Tosoh Corporation
“F-20” manufactured by Tosoh Corporation
“F-40” manufactured by Tosoh Corporation
“F-80” manufactured by Tosoh Corporation
“F-128” manufactured by Tosoh Corporation
Sample: A 1.0 mass% tetrahydrofuran solution filtered in terms of resin solids and filtered through a microfilter (50 μl).

¹³ C-NMR: Measured with “JNM-ECA500” manufactured by JEOL Ltd.

MALDI-MS: Measured by “AXIMA-TOF2” manufactured by Shimadzu Biotech.

Example 1 Production of Modified Polyarylene Ether Resin (1) A flask equipped with a thermometer, a dropping funnel, a condenser tube, a fractionating tube, and a stirrer was charged with a polyphenylene ether resin [“MX-90” manufactured by SABIC Corporation: hydroxyl group equivalent of 880 g. / Equivalent, having a molecular structure represented by the following structural formula (II). 880 g, benzyl alcohol 88.0 g, and paratoluenesulfonic acid monohydrate 26.4 g were charged and stirred at room temperature while blowing nitrogen. Then, it heated up at 150 degreeC and stirred for 6 hours, distilling the water to produce | generate out of the system. After completion of the reaction, 970 g of methyl isobutyl ketone and 8.0 g of a 20% aqueous sodium hydroxide solution were added to neutralize, and then the aqueous layer was removed by liquid separation, washed with 490 g of water three times, and methyl isobutyl ketone was reduced in pressure. Under removal, 953 g of a modified polyphenylene ether resin (1) was obtained. A GPC chart of the resulting modified polyarylene ether resin (1) is shown in FIG. 1, a ¹³ C-NMR chart is shown in FIG. 2, and a MALDI-MS chart is shown in FIG. The modified polyarylene ether resin (1) was a brown solid, the hydroxyl group equivalent was 923 g / equivalent, and the softening point was 158 ° C.

Example 2 Production of Modified Polyarylene Ether Resin (2) A flask equipped with a thermometer, a dropping funnel, a condenser tube, a fractionating tube and a stirrer was charged with a polyphenylene ether resin (“MX-90” manufactured by SABIC: hydroxyl group equivalent 880 g). / Equivalent, having the molecular structure represented by the above structural formula (II)) 880 g, benzyl alcohol 264.0 g, paratoluenesulfonic acid monohydrate 26.4 g were charged and stirred at room temperature while blowing nitrogen. . Then, it heated up at 150 degreeC and stirred for 6 hours, distilling the water to produce | generate out of the system. After completion of the reaction, 1140 g of methyl isobutyl ketone and 8.0 g of a 20% aqueous sodium hydroxide solution were added to neutralize, and then the aqueous layer was removed by liquid separation, followed by washing with 570 g of water three times, Under removal, 1095 g of a modified polyarylene ether resin (2) was obtained. The modified polyarylene ether resin (2) was a brown solid, the hydroxyl group equivalent was 1,053 / equivalent, and the softening point was 110 ° C.

Example 3 Production of Modified Polyarylene Ether Resin (3) A flask equipped with a thermometer, a dropping funnel, a condenser tube, a fractionating tube, and a stirrer was charged with a polyphenylene ether resin (“MX-90” manufactured by SABIC: hydroxyl group equivalent 880 g). 880 g, 264.0 g of styrene, and 8.8 g of paratoluenesulfonic acid monohydrate were charged and stirred at room temperature while blowing nitrogen. Then, it heated up at 150 degreeC and stirred for 6 hours, distilling the water to produce | generate out of the system. After completion of the reaction, 1140 g of methyl isobutyl ketone and 36.1 g of a 20% aqueous sodium hydroxide solution were added for neutralization, and then the aqueous layer was removed by liquid separation, followed by washing with 570 g of water three times, Under removal, 1083 g of a modified polyarylene ether resin (3) was obtained. The modified polyarylene ether resin (3) was a brown solid, the hydroxyl group equivalent was 1,043 g / equivalent, and the softening point was 112 ° C.

Example 4 Production of Modified Polyarylene Ether Resin (4) A flask equipped with a thermometer, a dropping funnel, a condenser tube, a fractionating tube and a stirrer was charged with a polyphenylene ether resin (“MX-90” manufactured by SABIC: hydroxyl group equivalent 880 g). / Equivalent, having the molecular structure represented by the structural formula (II))) 880 g and benzyl chloride 264.0 g were charged and stirred at room temperature while blowing nitrogen. Then, it heated up at 150 degreeC and stirred for 6 hours, distilling the water to produce | generate out of the system. After completion of the reaction, 1140 g of methyl isobutyl ketone and 36.1 g of a 20% aqueous sodium hydroxide solution were added for neutralization, and then the aqueous layer was removed by liquid separation, followed by washing with 570 g of water three times, Under removal, 1105 g of a modified polyarylene ether resin (4) was obtained. The modified polyarylene ether resin (4) was a brown solid, the hydroxyl group equivalent was 1,021 g / equivalent, and the softening point was 115 ° C.

Evaluation of solvent solubility Modified polyarylene ether resins (1) to (4) obtained in Examples 1 to 4 and unmodified polyphenylene ether resin ("MX-90" manufactured by SABIC): hydroxyl group equivalent 880 g / Equivalents and a molecular structure represented by the structural formula (II)) were dried at 150 ° C. and vacuum under reduced pressure for 12 hours to obtain a dried solid resin. This solid resin was subjected to toluene, methyl ethyl ketone (hereinafter abbreviated as “MEK”), methyl isobutyl ketone (hereinafter abbreviated as “MIBK”), N, N′-dimethylformamide (hereinafter “DMF”) at 25 ° C. ), Cyclohexanone, 1-methoxy-2-propanol (hereinafter abbreviated as “MP”), propylene glycol monomethyl ether acetate (hereinafter abbreviated as “PGMAC”), N-methylpyrrolidone (hereinafter “NMP”). ”, Normal butanol (hereinafter abbreviated as“ BuOH ”), and ethyl acetate, and the amount (g) of solid content dissolved in 100 g of each solvent was evaluated. The results are shown in Table 1.

Examples 5 to 9 and Comparative Examples 1 and 2
<Preparation of epoxy resin composition and evaluation of physical properties>
As an epoxy resin, “EPICLON N-680” (cresol novolac type epoxy resin, epoxy group equivalent 213 g / equivalent) manufactured by DIC Corporation, and the modified polyarylene ether resins (1) to (4) or SABIC “ MX-90 "(hydroxyl equivalent: 880 g / equivalent, having the molecular structure represented by the structural formula (II)) and" PHENOLITE TD-2090 "(phenol novolac resin, hydroxyl equivalent: 105 / Both) were blended in such a ratio that the epoxy group in the epoxy resin and the total of the phenolic hydroxyl groups in the curing agent were equivalent. To this, 0.025 phr of 2-ethyl-4-methylimidazole was added as a curing catalyst, and methyl ethyl ketone was blended and adjusted so that the nonvolatile content (N.V.) of each composition was finally 58 mass%. . Next, a laminate was prepared by curing under the following conditions, and dielectric properties and moisture absorption were evaluated by the following methods. The results are shown in Tables 2 and 3.

<Laminate production conditions>
Base material: Glass cloth “# 2116” (210 × 280 mm) manufactured by Nitto Boseki Co., Ltd.
Number of plies: 6 Condition of prepreg: 160 ° C
Curing conditions: 200 ° C., 40 kg / cm ² for 1.5 hours, post-molding plate thickness: 0.8 mm

<Measurement of dielectric constant and dissipation factor>
In accordance with JIS-C-6481, the dielectric material at 1 GHz of the test piece after being stored in an indoor room at 23 ° C. and 50% humidity for 24 hours after absolutely dry using an impedance material analyzer “HP4291B” manufactured by Agilent Technologies, Inc. The rate and dielectric loss tangent were measured.

<Measurement of moisture absorption rate>
Cut out a test piece to a size of 50 x 25 x 2 mm, use a pressure cooker tester, hold the test piece for 2 hours at 121 ° C, 2.1 atm, and 100% RH, and measure the weight change before and after that. did.

Claims (10)

The molecular structure has a polyarylene ether structure, and at least one of the arylene groups constituting the arylene ether structure has an aralkyl structure site on the aromatic nucleus, and the hydroxyl group equivalent is in the range of 850 to 1,600 g / equivalent. A modified polyarylene ether resin characterized by being. The modified polyarylene ether resin according to claim 1, which has a softening point in the range of 80 to 170 ° C. A polyarylene ether resin (A) having a polyarylene ether structure in the molecular structure and having a hydroxyl group equivalent in the range of 500 to 1,500 g / equivalent, and an aralkylating agent (B) are converted into a polyarylene ether resin (A 3) The modified polyarylene ether resin according to claim 1 or 2, which is obtained by reacting 100 parts by mass of the aralkylating agent (B) at a ratio of 5 to 40% by mass. The polyarylene ether resin (A) is represented by the following structural formula (1)

[Wherein R ² is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and l and m are each independently 0 or more. It is an integer, and the sum of l and m is 8 or more. In the formula, X represents the following structural formulas (2-1) to (2-9).

(In the formula, each R ³ is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and R ⁴ is each independently the number of carbon atoms. (It is any one of an alkyl group having 1 to 4, an alkoxy group having 1 to 4 carbon atoms, and a phenyl group, and n is an integer of 0 to 4).
It is a structural part represented by either. ]
The modified polyarylene ether resin according to claim 1, which has a molecular structure represented by: The following structural formula (I)

[Wherein R ² is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and l and m are each independently 0 or more. It is an integer, and the sum of l and m is 8 or more. In the formula, X represents the following structural formulas (2-1) to (2-9).

(In the formula, each R ³ is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and R ⁴ is each independently the number of carbon atoms. (It is any one of an alkyl group having 1 to 4, an alkoxy group having 1 to 4 carbon atoms, and a phenyl group, and n is an integer of 0 to 4).
Wherein Y is independently a hydrogen atom or the following structural formula (i)

(In the formula, each R ¹ independently represents a methyl group or a hydrogen atom, and Ar ¹ represents a phenylene group, a naphthylene group, or a phenylene having 1 to 3 alkyl groups having 1 to 4 carbon atoms on the aromatic nucleus. Group or naphthylene group, and n is 1 or 2.)
And at least one of the plurality of Ys is a structural part represented by the structural formula (i). ]
The modified polyarylene ether resin according to any one of claims 1 to 4, which has a molecular structure represented by: An epoxy resin composition comprising the modified polyarylene ether resin, the epoxy resin, and the curing agent according to any one of claims 1 to 5 as essential components. A cured product obtained by curing the epoxy resin composition according to claim 6. A prepreg obtained by impregnating a reinforcing base material with the epoxy resin composition according to claim 6 diluted in an organic solvent, and semi-curing the resulting impregnated base material. A circuit board obtained by obtaining a varnish obtained by diluting the epoxy resin composition according to claim 6 in an organic solvent, and subjecting the varnish to a plate shape and a copper foil. The buildup film obtained by apply | coating what dried the epoxy resin composition of Claim 6 in the organic solvent on a base film, and making it dry.

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