JP2011099049A - Epoxy resin composition, cured product thereof, novel epoxy resin, novel phenol resin, prepreg and circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide excellent flame retardancy and heat resistance as well as low dielectric loss tangent. <P>SOLUTION: An epoxy resin composition contains an epoxy resin (A) and a curing agent (B) as essential constituents. The epoxy resin (A) has a molecular structure which has an polyaryleneoxy structure as a main skeleton thereof and in which glycidyloxy or methyl glycidyloxy group and a structural part (α) are bonded with an aromatic nucleus of the structure. The structural part (α) is expressed by structural formula (1) [in structural formula (1), each of R<SB>1</SB>and R<SB>2</SB>independently expresses methyl group or hydrogen atom, Ar expresses phenylene group, phenylene group nuclear-replaced by one to three 1C-4C alkyl groups, naphthylene group or naphthylene group nuclear-replaced by one to three 1C-4C alkyl groups and (n) is an integer of 1 or 2], wherein the abundance ratio of the aromatic nucleus constituting the structural part (α) is 0.1-0.5 mol per 1 mol aromatic nucleus constituting the polyaryleneoxy structure in the molecular structure and the softening point of the epoxy resin (A) is 80-140°C. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention provides an epoxy resin composition that exhibits excellent flame retardancy, heat resistance, and low dielectric loss tangent in the cured product, and has excellent performance in solvent solubility, the cured product, and a novel epoxy used in the epoxy resin composition The present invention relates to a resin, a novel phenol resin, a prepreg using the epoxy resin composition, and a laminate.

Epoxy resins are used in adhesives, molding materials, paints, photoresist materials, color developing materials, etc., and are also used in semiconductor encapsulants and circuits because of the excellent heat resistance and moisture resistance of the resulting cured products. Widely used in electrical and electronic fields such as insulating materials for substrates.
Among these various applications, in the field of insulating materials for circuit boards such as laminates, with the trend toward smaller and higher performance electronic devices, the trend toward higher density due to the narrower wiring pitch of semiconductor devices is significant. As a semiconductor mounting method corresponding to this, a flip chip connection method in which a semiconductor device and a substrate are joined by solder balls is widely used. In this flip-chip connection method, a solder ball is placed between a wiring board and a semiconductor, and the whole is heated and melt bonded to form a so-called reflow semiconductor mounting method. Therefore, the wiring plate itself is exposed to a high heat environment during solder reflow. In some cases, the wiring board has poor connection due to a decrease in the elastic modulus of the wiring board at a high temperature. Therefore, an insulating material used for a circuit board is required to have a high heat resistance that does not easily lower its elastic modulus even at high temperatures.
On the other hand, a halogen-based flame retardant such as bromine is blended together with an antimony compound in order to impart flame retardancy. However, in recent years, environmental and safety efforts have made efforts to develop a flame retardant method that does not use halogen-based flame retardants that may cause dioxins or antimony compounds that are suspected of causing carcinogenicity. Development is strongly required.
That is, an insulating material for a circuit board is required to have high heat resistance and flame retardancy, and an epoxy resin material that can meet such requirements is awaited.
In order to meet such demands, as an insulating material having excellent flame retardancy, for example, by introducing a polyaryleneoxy structure into the main skeleton of the resin structure, and further introducing an aralkyl structure into the polyaryleneoxy structure. An obtained phenol resin and an epoxy resin obtained by epoxidizing the phenol resin have been proposed (see Patent Document 1 below). Such phenolic resins or epoxy resins, for example, exhibit excellent flame retardancy when used as a semiconductor sealing material, but they themselves have low solubility in organic solvents and are partially crystallized in organic solvents. In addition to being difficult to use as a varnish composition such as an insulating material for circuit boards, if a circuit board is manufactured using these, sufficient flame retardancy is not exhibited. The heat resistance was inferior. Furthermore, when this phenol resin or epoxy resin is used as an insulating material for circuit boards, the high dielectric loss tangent required for circuit laminates in recent years is increased.

JP 2006-307162 A

  Therefore, the problem to be solved by the present invention is an epoxy resin composition, a novel epoxy resin and a novel phenol resin that can impart to the cured product performance such as excellent flame retardancy, heat resistance, and low dielectric loss tangent, An object of the present invention is to provide a cured epoxy resin product having performance and a circuit board for a prepreg obtained from the composition.

  As a result of intensive studies to solve the above problems, the present inventors have introduced a polyaryleneoxy structure into the main skeleton of the resin structure, and further introduced an aralkyl structure into the polyaryleneoxy structure, thereby providing dielectric properties. It has been found that flame retardancy can be drastically improved without lowering, and the present invention has been completed.

  That is, the present invention has a polyaryleneoxy structure as a main skeleton, and the aromatic nucleus of the structure includes a glycidyloxy group or a methylglycidyloxy group, and the following structural formula (1)

［構造式（１）中、Ｒ_１及びＲ_２は各々独立して、メチル基又は水素原子であり、Ａｒは、フェニレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたフェニレン基、ナフチレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたナフチレン基、ｎは１又は２の整数である。］で表される構造部位（α）が結合した分子構造を有しており、該分子構造中、前記ポリアリーレンオキシ構造を構成する芳香核１モルあたりの前記分子構造（α）を構成する芳香核の存在割合が０．１〜０．５モルとなる範囲であり、かつ、その軟化点が８０〜１４０℃であるエポキシ樹脂（Ａ）、並びに硬化剤（Ｂ）を必須成分とすることを特徴とするエポキシ樹脂組成物に関する（以下、このエポキシ樹脂組成物を「エポキシ樹脂組成物（I）」と略記する）。

[In the structural formula (1), R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is a phenylene group or a nuclear substitution with 1 to 3 of a C 1-4 alkyl group. A phenylene group, a naphthylene group, a naphthylene group substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms, and n is an integer of 1 or 2. And a fragrance constituting the molecular structure (α) per mole of aromatic nuclei constituting the polyaryleneoxy structure in the molecular structure. The epoxy resin (A) whose softening point is 80 to 140 ° C. and the curing agent (B) are essential components in the range in which the nucleus content is 0.1 to 0.5 mol. The epoxy resin composition is characterized (hereinafter, this epoxy resin composition is abbreviated as “epoxy resin composition (I)”).

  The present invention also relates to a cured product obtained by curing the epoxy resin composition (I).

  The present invention further has a polyaryleneoxy structure as a main skeleton, and the aromatic nucleus of the structure includes a glycidyloxy group or a methylglycidyloxy group, and the following structural formula (1):

［構造式（１）中、Ｒ_１及びＲ_２は各々独立して、メチル基又は水素原子であり、Ａｒは、フェニレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたフェニレン基、ナフチレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたナフチレン基、ｎは繰り返し数の平均値で０．１〜４である。］で表される構造部位（α）が結合した分子構造を有しており、該分子構造中、前記ポリアリーレンオキシ構造を構成する芳香核１モルあたりの前記分子構造（α）を構成する芳香核の存在割合が０．１〜０．５モルとなる範囲であり、かつ、その軟化点が８０〜１４０℃であることを特徴とする新規エポキシ樹脂に関する。

[In the structural formula (1), R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is a phenylene group or a nuclear substitution with 1 to 3 of a C 1-4 alkyl group. A phenylene group, a naphthylene group, a naphthylene group substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms, and n is an average number of repetitions of 0.1 to 4. And a fragrance constituting the molecular structure (α) per mole of aromatic nuclei constituting the polyaryleneoxy structure in the molecular structure. The present invention relates to a novel epoxy resin characterized in that the nucleus content is in the range of 0.1 to 0.5 mol and the softening point is 80 to 140 ° C.

  The present invention also has a polyaryleneoxy structure as a main skeleton, and the aromatic ring of the structure has a phenolic hydroxyl group and the following structural formula (1).

［構造式（１）中、Ｒ_１及びＲ_２は各々独立して、メチル基又は水素原子であり、Ａｒは、フェニレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたフェニレン基、ナフチレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたナフチレン基、ｎは１又は２の整数である。］で表される構造部位（α）が結合した分子構造を有しており、該分子構造中、前記ポリアリーレンオキシ構造を構成する芳香核１モルあたりの前記分子構造（α）を構成する芳香核の存在割合が０．１〜０．５モルとなる範囲であり、かつ、その軟化点が９０〜１５０℃であるフェノール樹脂（Ｂ’）、及びエポキシ樹脂（Ａ’）を必須成分とすることを特徴とするエポキシ樹脂組成物（以下、このエポキシ樹脂組成物を「エポキシ樹脂組成物（II）」と略記する）に関する。

[In the structural formula (1), R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is a phenylene group or a nuclear substitution with 1 to 3 of a C 1-4 alkyl group. A phenylene group, a naphthylene group, a naphthylene group substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms, and n is an integer of 1 or 2. And a fragrance constituting the molecular structure (α) per mole of aromatic nuclei constituting the polyaryleneoxy structure in the molecular structure. The phenol resin (B ′) and the epoxy resin (A ′) having a nucleus content of 0.1 to 0.5 mol and a softening point of 90 to 150 ° C. are essential components. The epoxy resin composition (hereinafter, this epoxy resin composition is abbreviated as “epoxy resin composition (II)”).

  The present invention also relates to a cured product obtained by curing the epoxy resin composition (II).

  The present invention further has a polyaryleneoxy structure as a main skeleton, and the aromatic ring of the structure has a phenolic hydroxyl group and the following structural formula (1).

［構造式（１）中、Ｒ_１及びＲ_２は各々独立して、メチル基又は水素原子であり、Ａｒは、フェニレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたフェニレン基、ナフチレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたナフチレン基、ｎは１又は２の整数である。］で表される構造部位（α）が結合した分子構造を有しており、該分子構造中、前記ポリアリーレンオキシ構造を構成する芳香核１モルあたりの前記分子構造（α）を構成する芳香核の存在割合が０．１〜０．５モルとなる範囲であり、かつ、その軟化点が９０〜１５０℃であることを特徴とする新規フェノール樹脂に関する。

[In the structural formula (1), R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is a phenylene group or a nuclear substitution with 1 to 3 of a C 1-4 alkyl group. A phenylene group, a naphthylene group, a naphthylene group substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms, and n is an integer of 1 or 2. And a fragrance constituting the molecular structure (α) per mole of aromatic nuclei constituting the polyaryleneoxy structure in the molecular structure. The present invention relates to a novel phenol resin characterized in that the nucleus content is in the range of 0.1 to 0.5 mol and the softening point is 90 to 150 ° C.

  The present invention further relates to a prepreg obtained by impregnating a reinforcing base material with the epoxy resin composition (I) or the epoxy resin composition (II) diluted in an organic solvent, and semi-curing the resulting impregnated equipment. .

  The present invention further obtains a varnish obtained by diluting the epoxy resin composition (I) or the epoxy resin composition (II) in an organic solvent, and heat-press-molds the resulting varnish and a copper foil. It is related with the circuit board obtained by laminating | stacking.

  According to the present invention, an epoxy resin composition capable of imparting excellent flame retardancy and dielectric properties to a cured product, a novel epoxy resin and a novel phenol resin, an epoxy resin cured product having the above-mentioned performance, and A circuit board can be provided for the prepreg obtained from the composition.

2 is an FD-MS spectrum of the phenol resin (A-1) obtained in Example 1. FIG. 2 is an FD-MS spectrum obtained by trimethylsilylation of the phenol resin (A-1) obtained in Example 1. FIG. 1 is a GPC chart of a phenol resin (A-1) obtained in Example 1. FIG. 2 is an FD-MS spectrum of the epoxy resin (B-1) obtained in Example 2. It is a GPC chart figure of the phenol resin (B-1) obtained in Example 2.

Hereinafter, the present invention will be described in detail.
The epoxy resin (A) used in the epoxy resin composition (I) of the present invention has a polyaryleneoxy structure as the main skeleton, and the aromatic nucleus of the structure has a glycidyloxy group or a methylglycidyloxy group, and the following structure: Formula (1)

［構造式（１）中、Ｒ_１及びＲ_２は各々独立して、メチル基又は水素原子であり、Ａｒは、フェニレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたフェニレン基、ナフチレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたナフチレン基、ｎは１又は２の整数である。］
で表される構造部位（α）が結合した分子構造を有しており、該分子構造中、前記ポリアリーレンオキシ構造を構成する芳香核１モルあたりの前記分子構造（α）を構成する芳香核の存在割合が０．１〜０．５モルとなる範囲であり、かつ、その軟化点が８０〜１４０℃のものである。ここで、前記ポリアリーレンオキシ構造を構成する芳香核１モルあたりの前記分子構造（α）を構成する芳香核の存在割合とは、後述するエポキシ樹脂（Ａ）の製造方法におけるジヒドロキシ芳香族化合物（ａ１）１モルに対する前記アラルキル化剤（ａ２）のモル数に相当する。本発明では、エポキシ樹脂（Ａ）の製造方法におけるこれら原料成分のほぼ全量が生成物中に取り込まれる為、これら原料成分のモル比率が、実質的に前記分子構造（α）を構成する芳香核のモル基準の存在割合に相当することとなる。

[In the structural formula (1), R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is a phenylene group or a nuclear substitution with 1 to 3 of a C 1-4 alkyl group. A phenylene group, a naphthylene group, a naphthylene group substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms, and n is an integer of 1 or 2. ]
Aromatic nuclei constituting the molecular structure (α) per mole of aromatic nuclei constituting the polyaryleneoxy structure in the molecular structure. Is in the range of 0.1 to 0.5 mol, and the softening point is 80 to 140 ° C. Here, the abundance ratio of the aromatic nuclei constituting the molecular structure (α) per mole of aromatic nuclei constituting the polyaryleneoxy structure is a dihydroxy aromatic compound in the production method of the epoxy resin (A) described later ( a1) It corresponds to the number of moles of the aralkylating agent (a2) with respect to 1 mole. In the present invention, since almost all of these raw material components in the production method of the epoxy resin (A) are taken into the product, the molar ratio of these raw material components substantially constitutes the molecular structure (α). It corresponds to the existing ratio on the molar basis.

  Thus, the epoxy resin (A) is characterized by a high softening point and a low proportion of aromatic nuclei constituting the molecular structure (α). That is, the main chain of the polyaryleneoxy structure becomes relatively long, and excellent solvent solubility is exhibited, and it is possible to cope with high flame retardancy performance in circuit board applications. Furthermore, since the abundance ratio of the molecular structure (α) in the epoxy resin (A) is low, the reactivity of the epoxy group is improved, and excellent heat resistance can be imparted to the cured product. In particular, the existence of the molecular structure (α) is considered in view of the known knowledge that the char is formed by the arylene group in the polyaryleneoxy structure and the molecular structure (α) during the combustion. It is worth noting that excellent flame retardancy is exhibited even when the ratio is low.

  The polyarylene oxide structure constituting the basic skeleton of the epoxy resin (A) includes a polynaphthylene oxide structure and a naphthylene oxide structure such as a polynaphthylene oxide structure substituted with an alkyl group having 1 to 4 carbon atoms, In addition, a phenylene oxide structure such as a polyphenylene oxide structure and a polyphenylene oxide structure substituted with an alkyl group having 1 to 4 carbon atoms can be given. Among these, those having a naphthylene oxide structure are particularly preferred in the present invention because the flame retardant effect becomes more remarkable and the dielectric loss tangent is also lowered. Furthermore, among these, a polynaphthylene oxide structure or a methyl group-containing polynaphthylene oxycide structure is preferable, and a polynaphthylene oxide structure is particularly preferable.

  Next, the following structural formula (1) in the molecular structure of the epoxy resin (A)

で表される構造部位（α）において、Ｒ_１及びＲ_２は各々独立してメチル基又は水素原子であり、Ａｒは、フェニレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたフェニレン基、ナフチレン基、及び、炭素原子数１〜４のアルキル基の１〜３つで核置換されたナフチレン基からなる群から選択される二価の芳香族系炭化水素基である。また、炭素原子数１〜４のアルキル基の１〜３つで核置換されたフェニレン基とは、メチルフェニレン基、エチルフェニレン基、ｉ−プロピルフェニレン基、又はｔ−ブチルフェニレン基等が挙げられ、炭素原子数１〜４のアルキル基の１〜３つで核置換されたナフチレン基とは、メチルナフチレン基、エチルナフチレン基、ｉ−プロピルナフチレン基、及びｔ−ブチルナフチレン基等が挙げられる。また、ｎは１又は２の整数である。

R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is one to three of a phenylene group and an alkyl group having 1 to 4 carbon atoms. A divalent aromatic hydrocarbon group selected from the group consisting of a nuclei-substituted phenylene group, a naphthylene group, and a naphthylene group nucleus-substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms. is there. Examples of the phenylene group nucleus-substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms include methylphenylene group, ethylphenylene group, i-propylphenylene group, and t-butylphenylene group. Examples of the naphthylene group nucleus-substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms include methyl naphthylene group, ethyl naphthylene group, i-propyl naphthylene group, and t-butyl naphthylene group. N is an integer of 1 or 2.

Among these, it is preferable that R ₁ and R ₂ are both hydrogen atoms from the viewpoint of easy availability of raw materials in industrial production, excellent flame retardancy of the resulting cured product, and excellent dielectric properties. . The value of n is particularly preferably 1 from the viewpoints of flame retardancy and dielectric properties, and Ar is a phenylene group from the viewpoint of easy availability of raw materials and low viscosity of the epoxy resin (A). preferable.

  Further, in the present invention, the abundance ratio of the aromatic nucleus represented by “Ar” in the general formula (1) is 0.1 to 0.5 mol per mol of the aromatic nucleus constituting the polyaryleneoxy structure. It is a range. Here, when the abundance ratio of the aromatic nucleus represented by “Ar” in the general formula (1) is 0.5 or less, the heat resistance of the cured product is dramatically improved, and the flame retardancy is also improved. Get higher. On the other hand, by setting it to 0.1 or more, the flame retardancy of the cured product becomes good, and the dielectric loss tangent of the cured product also becomes low. The abundance ratio of the aromatic nucleus represented by “Ar” in the general formula (1) per mole of the aromatic nucleus constituting the polyaryleneoxy structure is as described above in the method for producing the epoxy resin (A). This corresponds to the number of moles of the aralkylating agent (a2) relative to 1 mole of the dihydroxy aromatic compound (a1).

  Moreover, specific examples of the glycidyloxy group or methylglycidyloxy group in the molecular structure of the epoxy resin (A) include glycidyloxy group and β-methylglycidyloxy group. From the viewpoint of flame retardancy and easy availability of raw materials for industrial production of the epoxy resin (A), a glycidyloxy group is preferred.

  In addition, the epoxy resin (A) used in the present invention has a softening point of 80 to 140 ° C., so that it has high solubility in organic solvents and becomes a material suitable for varnish for circuit boards. The main chain of an oxy structure becomes a comparatively long thing, and the flame retardance performance can be expressed conventionally.

  Further, the epoxy resin (A) preferably forms a polyarylene oxide structure using a dihydroxy aromatic compound as a raw material in the production of a phenol resin as a precursor thereof. In this case, the phenolic hydroxyl group is linear. Since it appears at both ends of the molecular structure, it is obtained mainly as a bifunctional epoxy resin. However, the resin component also includes a resin component partially epoxidized with a polyfunctional phenol resin having a molecular structure in which another hydroxynaphthalene ring is directly bonded to the naphthalene ring in the polynaphthylene oxide structure. obtain. Therefore, in this case, the epoxy resin (A) is obtained as a polyfunctional epoxy resin. Here, when applying the epoxy resin (A) to circuit board applications, it is preferable to further reduce the functional group concentration in the epoxy resin to improve the dielectric properties and moisture resistance after curing, In the case where the molecular weight in the epoxy resin (A) is small, the epoxy resin (A) has a low solubility in an organic solvent and is difficult to apply to a circuit board varnish. Epoxy equivalent is 257 to 320 g / eq. It is preferable that it is the range of these.

  As described above, the epoxy resin (A) described in detail above preferably has a polynaphthyleneoxy structure as the polyarylene oxide structure, and specifically, the following general formula (1)

で表される構造単位（α）を繰り返し単位とし、その両末端にグリシジルオキシ基又はメチルグリシジルオキシ基を有する構造を有する軟化点８０〜１４０℃のエポキシ樹脂であるものが有機溶剤への溶解性に優れ、かつ、難燃性及び耐熱性に優れた硬化物を与えることができる点から好ましい。

The structural unit (α) represented by the formula is a repeating unit, and an epoxy resin having a softening point of 80 to 140 ° C. having a structure having a glycidyloxy group or a methylglycidyloxy group at both ends thereof is soluble in an organic solvent. It is preferable in that it can provide a cured product excellent in flame retardancy and heat resistance.

  In the general formula (1), X is a hydrogen atom or the following general formula (2)

で表される構造部位（β）であり、かつ、前記一般式（２）中のＲ’は水素原子又はメチル基であり、前記一般式（１）及び一般式（２）中のＲは下記一般式（３）

And R ′ in the general formula (2) is a hydrogen atom or a methyl group, and R in the general formula (1) and the general formula (2) is General formula (3)

で表される構造部位（γ）であり、一般式（３）中のｎは１又は２であり、また、一般式（２）及び一般式（３）中のｐの値は０〜３の整数である。但し、前記エポキシ樹脂（Ａ）は、その分子構造中、前記構造部位（γ）中のベンゼン環をナフタレン環１個あたり０．１〜０．５個となる割合で有するものである。なお、上記一般式（１）においてナフタレン骨格への結合位置はナフタレン環を構成する２つの環の何れであってもよい。

In the general formula (3), n is 1 or 2, and the values of p in the general formula (2) and the general formula (3) are 0-3. It is an integer. However, the epoxy resin (A) has a benzene ring in the structural part (γ) in the molecular structure at a ratio of 0.1 to 0.5 per naphthalene ring. In the general formula (1), the bonding position to the naphthalene skeleton may be any of the two rings constituting the naphthalene ring.

  The epoxy resin (A) detailed above can be produced, for example, by the following production method.

  That is, the dihydroxy aromatic compound (a1) and the following structural formula (2)

〔式中、Ｒ_１、Ｒ_２は各々独立して、メチル基又は水素原子であり、Ａｒは、フェニレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたフェニレン基、ナフチレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたナフチレン基を、Ｙはハロゲン原子、アルコキシ基、又は水酸基を表す。〕で表される化合物、又は下記構造式（３）

[Wherein R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is a phenylene group or a phenylene group that is nucleus-substituted with 1 to 3 of a C 1-4 alkyl group. Y represents a halogen atom, an alkoxy group, or a hydroxyl group, a naphthylene group that is nucleus-substituted with 1 to 3 of a naphthylene group or an alkyl group having 1 to 4 carbon atoms. Or a compound represented by the following structural formula (3)

〔式中、Ｒ_１、Ｒ_３、Ｒ_４は各々独立してメチル基又は水素原子であり、Ａｒは、フェニレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたフェニレン基、ナフチレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたナフチレン基を表す。〕で表される化合物からなる群から選択されるアラルキル化剤（ａ２）とを、酸触媒の存在下に反応させてフェノール樹脂を得る工程（以下、この工程を「工程１」と略記する。）、次いで、得られたフェノール樹脂をとエピハロヒドリン類（ａ３）とを反応させる工程（以下、この工程を「工程２」と略記する。）とを経て目的とするエポキシ樹脂（Ａ）を製造することができる。

[Wherein R ₁ , R ₃ and R ₄ are each independently a methyl group or a hydrogen atom, and Ar is substituted with 1 to 3 of a phenylene group or an alkyl group having 1 to 4 carbon atoms. A naphthylene group substituted with 1 to 3 of a phenylene group, a naphthylene group, or an alkyl group having 1 to 4 carbon atoms is represented. ] The process which makes the aralkylation agent (a2) selected from the group consisting of the compound represented by these react with presence of an acid catalyst, and obtains a phenol resin (henceforth this process is abbreviated as "process 1". ), And the step of reacting the obtained phenolic resin with epihalohydrins (a3) (hereinafter, this step is abbreviated as “step 2”) to produce the desired epoxy resin (A). be able to.

  That is, first, in step 1, the dihydroxy aromatic compound (a1) and the aralkylating agent (a2) are reacted with the presence of an acid catalyst to form a polyarylene structure as a main skeleton with phenolic hydroxyl groups at both ends. And a phenol resin having an aralkyl group bonded in a pendant form on the aromatic nucleus of the polyarylene structure.

  Here, the reaction ratio between the dihydroxy aromatic compound (a1) and the aralkylating agent (a2) is the reaction ratio (a1) between the dihydroxy aromatic compound (a1) and the aralkylating agent (a2) on a molar basis. ) / (A2) is preferably in the range of 1 / 0.1 to 1 / 0.5, and the epoxy resin (A) finally obtained has a good balance between flame retardancy and heat resistance. It is preferable from the point which becomes.

  Examples of the dihydroxy aromatic compound (a1) that can be used here include dihydric phenols such as catechol, resorcinol, and hydroquinone, and 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxy. Naphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene And dihydroxynaphthalene. Among these, the phenol resin obtained in particular or the cured product of the epoxidized epoxy resin has a further improved flame retardancy, and the cured product has a lower dielectric loss tangent, resulting in better dielectric properties. Naphthalene, particularly 1,6-dihydroxynaphthalene or 2,7-dihydroxynaphthalene is preferable, and 2,7-dihydroxynaphthalene is particularly preferable.

  Next, among the aralkylating agent (a2), the following structural formula (2)

［式中、Ｒ_１、Ｒ_２は各々独立して、メチル基又は水素原子であり、Ａｒは、フェニレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたフェニレン基、ナフチレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたナフチレン基を表す。］で表される化合物としては、例えば、Ｙがハロゲン原子の場合、ベンジルクロライド、ベンジルブロマイド、ベンジルアイオダイト、ｏ−メチルベンジルクロライド、ｍ−メチルベンジルクロライド、ｐ−メチルベンジルクロライド、ｐ−エチルベンジルクロライド、ｐ−イソプロピルベンジルクロライド、ｐ−ｔｅｒｔ−ブチルベンジルクロライド、ｐ−フェニルベンジルクロライド、５−クロロメチルアセナフチレン、２−ナフチルメチルクロライド、１−クロロメチル−２−ナフタレン及びこれらの核置換異性体、α−メチルベンジルクロライド、並びにα，α−ジメチルベンジルクロライド等が挙げられる。

[Wherein, R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is a phenylene group or a phenylene group that is nucleus-substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms. , A naphthylene group substituted with 1 to 3 of a naphthylene group or an alkyl group having 1 to 4 carbon atoms. As the compound represented by formula (I), for example, when Y is a halogen atom, benzyl chloride, benzyl bromide, benzyl iodide, o-methylbenzyl chloride, m-methylbenzyl chloride, p-methylbenzyl chloride, p-ethylbenzyl Chloride, p-isopropylbenzyl chloride, p-tert-butylbenzyl chloride, p-phenylbenzyl chloride, 5-chloromethylacenaphthylene, 2-naphthylmethyl chloride, 1-chloromethyl-2-naphthalene and their nuclear substitution isomerism Body, α-methylbenzyl chloride, and α, α-dimethylbenzyl chloride.

  When Y is an alkoxy group, the alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms. The compound represented by the structural formula (2) is, for example, benzyl methyl ether or o-methylbenzyl methyl ether. M-methylbenzyl methyl ether, p-methylbenzyl methyl ether, p-ethylbenzyl methyl ether and their nuclear substitution isomers, benzyl ethyl ether, benzylpropyl ether, benzylisobutyl ether, benzyl n-butyl ether, p-methylbenzyl And methyl ether and its nucleus-substituted isomers.

  When Y is a hydroxyl group, examples of the compound represented by the structural formula (2) include benzyl alcohol, o-methylbenzyl alcohol, m-methylbenzyl alcohol, p-methylbenzyl alcohol, p-ethylbenzyl alcohol, p- Examples include isopropyl benzyl alcohol, p-tert-butyl benzyl alcohol, p-phenyl benzyl alcohol, α-naphthyl carbinol and their nuclear substitution isomers, α-methyl benzyl alcohol, and α, α-dimethyl benzyl alcohol.

  Of the aralkylating agent (a2), the following structural formula (3)

  Examples of the compound represented by the formula include styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, α-methylstyrene, β-methylstyrene, and the like.

  Among these, the aralkylating agent represented by the structural formula (2) is particularly preferable from the viewpoint of flame retardancy, and benzyl chloride, benzyl bromide, and benzyl alcohol are the final epoxy resins or phenol resins that are finally obtained. It is preferable from the point that the flame retardant effect becomes more remarkable in the cured product.

  Examples of the acid catalyst that can be used in the reaction of the dihydroxy aromatic compound (a1) and the aralkylating agent (a2) in Step 1 include inorganic acids such as phosphoric acid, sulfuric acid, and hydrochloric acid, oxalic acid, benzenesulfonic acid, and toluenesulfone. Examples include acids, organic acids such as methanesulfonic acid and fluoromethanesulfonic acid, and Friedel-Crafts catalysts such as aluminum chloride, zinc chloride, stannic chloride, ferric chloride, and diethylsulfuric acid.

  The amount of the acid catalyst used can be appropriately selected depending on the target modification rate and the like. For example, in the case of an inorganic acid or an organic acid, the amount of the acid catalyst is 0.1% relative to 100 parts by mass of the dihydroxy aromatic compound (a1). The range is from 001 to 5.0 parts by mass, preferably from 0.01 to 3.0 parts by mass. In the case of a Friedel-Crafts catalyst, 0.2 to 3.0 parts per mol of the dihydroxy aromatic compound (a1). It is preferable that the amount be in the range of 0.5 to 2.0 mol.

  The reaction between the dihydroxy aromatic compound (a1) and the aralkylating agent (a2) in the step 1 is preferable from the viewpoint that the molecular weight increases and the softening point can be easily adjusted. Examples of the organic solvent that can be used here include ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dipropyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, Non-protocols such as ethylene glycol such as ethylene glycol monopropyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, mono- or diether of diethylene glycol, dimethylformamide and dimethyl sulfoxide Sex polar solvents, as well as benzene, toluene, xylene, aromatic organic solvents such as chlorobenzene. Among these, an aromatic organic solvent is particularly preferable from the viewpoint of excellent solubility in raw materials, and xylene is particularly preferable from the viewpoint that the softening point of the reaction product obtained can be further increased.

  A specific method for carrying out the reaction of Step 1 is to dissolve the dihydroxy aromatic compound (a1), the aralkylating agent (a2), and the acid catalyst in the presence of an organic solvent, and first, at a temperature condition of 100 to 140 ° C. It is preferable from the point that the softening point of the phenol resin obtained by reacting by reacting by raising the temperature to 140 to 180 ° C. after reacting for 1/2 to 2/3 of the total reaction time is increased. The reaction time is not particularly limited, but is preferably 1 to 10 hours. Therefore, specifically, the reaction can be performed by maintaining the temperature for 1 to 10 hours. In addition, it is preferable that hydrogen halide, water, alcohols, and the like generated during the reaction are distilled out of the system by using a fractionating tube or the like from the viewpoint that the reaction proceeds rapidly and productivity is improved.

  Further, when the resulting dihydroxynaphthalene compound is highly colored, an antioxidant or a reducing agent may be added to the reaction system in order to suppress it. Examples of the antioxidant include hindered phenol compounds such as 2,6-dialkylphenol derivatives, divalent sulfur compounds, and phosphite compounds containing trivalent phosphorus atoms. Examples of the reducing agent include hypophosphorous acid, phosphorous acid, thiosulfuric acid, sulfurous acid, hydrosulfite, and salts thereof.

  After completion of the reaction, the acid catalyst can be removed by neutralization treatment, water washing treatment or decomposition, and the desired phenol resin can be separated by general operations such as extraction and distillation. The neutralization treatment and the water washing treatment may be performed according to a conventional method. For example, basic substances such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, triethylenetetramine, aniline can be used as the neutralizing agent.

  Next, as the step 2, the desired epoxy resin can be obtained by reacting the phenol resin obtained in step 1 with the epihalohydrins (a3). In the reaction in Step 2, 2 to 10 mol of epihalohydrin (a3) is added to 1 mol of phenolic hydroxyl group in the phenol resin, and further 0.9 to 1 mol of phenolic hydroxyl group in the phenol resin. A method of reacting at a temperature of 20 to 120 ° C. for 0.5 to 10 hours while adding or gradually adding 2.0 mol of a basic catalyst is mentioned.

  The basic catalyst used here can be used as a solid or as an aqueous solution thereof. When the basic catalyst is used as an aqueous solution, it is continuously added, and water and epihalohydrins (a3) are continuously distilled from the reaction mixture under reduced pressure or normal pressure. May be removed and the epihalohydrins (a3) may be continuously returned to the reaction mixture.

  Examples of the epihalohydrins (a3) include epichlorohydrin, epibromohydrin, β-methylepichlorohydrin and the like. Among them, epichlorohydrin is preferable because it is easily industrially available. In addition, when performing industrial production, in the reaction after the next batch after completion of the reaction in the first batch of epoxy resin production, the epihalohydrin (a3) recovered from the crude reaction product and the amount consumed in the reaction disappear. It is preferable to use together with a new epihalohydrin (a3) corresponding to the amount to be used.

  Specific examples of the basic catalyst include alkaline earth metal hydroxides, alkali metal carbonates, and alkali metal hydroxides. In particular, alkali metal hydroxides are preferable from the viewpoint of excellent catalytic activity of the epoxy resin synthesis reaction, and examples thereof include sodium hydroxide and potassium hydroxide. In use, these basic catalysts may be used in the form of an aqueous solution of about 10 to 55% by mass, or in the form of a solid. Moreover, the reaction rate in the synthesis | combination of an epoxy resin can be raised by using an organic solvent together. Examples of such organic solvents include, but are not limited to, ketones such as acetone and methyl ethyl ketone, alcohols such as methanol, ethanol, 1-propyl alcohol, isopropyl alcohol, 1-butanol, secondary butanol, and tertiary butanol, methyl Examples include cellosolves such as cellosolve and ethyl cellosolve, ethers such as tetrahydrofuran, 1,4-dioxane, 1,3-dioxane and diethoxyethane, and aprotic polar solvents such as acetonitrile, dimethyl sulfoxide and dimethylformamide. These organic solvents may be used alone or in combination of two or more as appropriate in order to adjust the polarity.

  After the reaction product of the epoxidation reaction is washed with water, unreacted epihalohydrin and the organic solvent to be used in combination are distilled off by distillation under heating and reduced pressure. Further, in order to obtain an epoxy resin with less hydrolyzable halogen, the obtained epoxy resin is again dissolved in an organic solvent such as toluene, methyl isobutyl ketone, methyl ethyl ketone, and alkali metal hydroxide such as sodium hydroxide or potassium hydroxide. Further reaction can be carried out by adding an aqueous solution of the product. At this time, a phase transfer catalyst such as a quaternary ammonium salt or crown ether may be present for the purpose of improving the reaction rate. When the phase transfer catalyst is used, the amount used is preferably in the range of 0.1 to 3.0% by mass with respect to the epoxy resin used. After completion of the reaction, the generated salt is removed by filtration, washing with water, and a high-purity epoxy resin can be obtained by distilling off a solvent such as toluene and methyl isobutyl ketone under heating and reduced pressure.

  Moreover, in the epoxy resin composition (I) of the present invention, the epoxy resin (A) may be used alone as an epoxy resin component, and the epoxy resin (A) and the epoxy resin (A) may be used as long as the effects of the present invention are not impaired. You may use together with another epoxy resin. When other epoxy resins are used in combination, the proportion of these used is preferably in the range where the proportion of the epoxy resin (A) in the total mass of the epoxy resin component is 30% by mass or more, particularly 40% by mass or more. .

  As the other epoxy resins that can be used in combination here, various epoxy resins can be used. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, tetramethylbiphenyl type epoxy resin, phenol novolac Type epoxy resin, cresol novolac type epoxy resin, triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin, dicyclopentadiene-phenol addition reaction type epoxy resin, phenol aralkyl type epoxy resin, naphthol novolak type epoxy resin, naphthol aralkyl type Epoxy resin, naphthol-phenol co-condensed novolak type epoxy resin, naphthol-cresol co-condensed novolak type epoxy resin, aromatic hydrocarbon formaldehyde resin-modified phenol Lumpur resin type epoxy resins, biphenyl-modified novolak type epoxy resins. Among these epoxy resins, it is preferable to use a tetramethyl biphenol type epoxy resin, a biphenyl aralkyl type epoxy resin, or a novolac type epoxy resin from the viewpoint that a cured product having excellent flame retardancy can be obtained.

The curing agent (B) used in the epoxy resin composition (I) of the present invention is a known various curing agent for epoxy resins, such as amine compounds, amide compounds, acid anhydride compounds, phenol compounds, and the like. A curing agent can be used. Specifically, examples of the amine compound include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, imidazole, BF ₃ -amine complex, and guanidine derivative. Examples of the amide compound include dicyandiamide. And polyamide resins synthesized from dimer of linolenic acid and ethylenediamine. Examples of acid anhydride compounds include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, and tetrahydrophthalic anhydride. Acid, methyltetrahydrophthalic anhydride, methyl nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, etc., and phenolic compounds include phenol novolac resin, cresol novolac resin Aromatic hydrocarbon formaldehyde resin modified phenol resin, dicyclopentadiene phenol addition type resin, phenol aralkyl resin, naphthol aralkyl resin, trimethylol methane resin, tetraphenylol ethane resin, naphthol novolak resin, naphthol-phenol co-condensed novolak resin, naphthol -Cresol-condensed novolak resin, biphenyl-modified phenolic resin (polyhydric phenol compound in which phenol nucleus is linked by bismethylene group), biphenyl-modified naphthol resin (polyvalent naphthol compound in which phenol nucleus is linked by bismethylene group), aminotriazine modified Examples thereof include polyhydric phenol compounds such as phenol resins (polyhydric phenol compounds in which phenol nuclei are linked with melamine or benzoguanamine).

  Among these, those containing a large amount of an aromatic skeleton in the molecular structure are preferable from the viewpoint of flame retardancy, and specifically, phenol novolac resins, cresol novolac resins, aromatic hydrocarbon formaldehyde resin-modified phenol resins, phenol aralkyls. Resins, naphthol aralkyl resins, naphthol novolak resins, naphthol-phenol co-condensed novolak resins, naphthol-cresol co-condensed novolak resins, biphenyl-modified phenol resins, biphenyl-modified naphthol resins, and aminotriazine-modified phenol resins are preferred because of excellent flame retardancy. .

  However, in the present invention, the flame retardancy is remarkably improved, and the phenolic aralkyl resin, particularly, the following structural formula (i)

で表される構造を結節基として複数のフェノール類が結節した構造を有するフェノール樹脂であることが好ましい。ここで、構造式（ｉ）中、Ｙは、炭素原子数１〜４のアルキル基又は水素原子、ｍは０〜３の整数である。

It is preferable that the phenol resin has a structure in which a plurality of phenols are knotted with the structure represented by Here, in Structural Formula (i), Y is an alkyl group having 1 to 4 carbon atoms or a hydrogen atom, and m is an integer of 0 to 3.

  The amount of the epoxy resin (A) and the curing agent (B) in the epoxy resin composition (I) of the present invention is such that the resulting cured product has good mechanical properties and the like. The amount of active groups in the curing agent (B) is preferably in the range of 0.7 to 1.5 equivalents with respect to a total of 1 equivalent of epoxy groups in the epoxy resin containing (A).

  Next, another epoxy resin composition (II) of the present invention has a polyaryleneoxy structure as a main skeleton, a phenolic hydroxyl group and the following structural formula (1) in the aromatic ring of the structure.

［式（１）中、Ｒ_１及びＲ_２は各々独立して、メチル基又は水素原子であり、Ａｒは、フェニレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたフェニレン基、ナフチレン基、炭素原子数１〜４のアルキル基の１〜３つで核置換されたナフチレン基、ｎは繰り返し数の平均値で０．１〜４である。］で表される構造部位（α）が結合した分子構造を有しており、該分子構造中、前記ポリアリーレンオキシ構造を構成する芳香核１モルあたりの前記分子構造（α）を構成する芳香核の存在割合が０．１〜０．５モルとなる範囲であり、かつ、その軟化点が９０〜１５０℃であるフェノール樹脂（Ｂ’）、及びエポキシ樹脂（Ａ’）を必須成分とするものである。

[In Formula (1), R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is substituted with 1 to 3 of a phenylene group or an alkyl group having 1 to 4 carbon atoms. A phenylene group, a naphthylene group, a naphthylene group that is nucleus-substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms, and n is an average number of repetitions of 0.1 to 4. And a fragrance constituting the molecular structure (α) per mole of aromatic nuclei constituting the polyaryleneoxy structure in the molecular structure. The phenol resin (B ′) and the epoxy resin (A ′) having a nucleus content of 0.1 to 0.5 mol and a softening point of 90 to 150 ° C. are essential components. Is.

  Here, in the phenol resin (B ′), the presence of the aromatic nuclei constituting the molecular structure (α) per mole of the aromatic nuclei constituting the polyaryleneoxy structure is 0.5 or less. In addition to dramatically improving the heat resistance of objects, the flame retardancy also increases. On the other hand, by setting it to 0.1 or more, the flame retardancy of the cured product becomes good, and the dielectric loss tangent of the cured product also becomes low. In the phenol resin (B ′), the abundance ratio of the aromatic nucleus constituting the molecular structure (α) per mole of the aromatic nucleus constituting the polyaryleneoxy structure is, as described above, the phenol resin (B ′ This corresponds to the number of moles of the aralkylating agent (a2) relative to 1 mole of the dihydroxy aromatic compound (a1) in the production method.

  In addition, the phenol resin (B ′) has a softening point in the range of 90 to 150 ° C., so that it has high solubility in an organic solvent and becomes a material suitable for a varnish for circuit boards. This has a relatively long main chain, and can exhibit unprecedented flame retardancy.

  Thus, the phenol resin (B ′) is characterized by a high softening point and a low proportion of aromatic nuclei constituting the molecular structure (α). The main chain of the polyaryleneoxy structure becomes relatively long, exhibits excellent solvent solubility, and can cope with advanced flame retardancy in circuit board applications. Furthermore, since the abundance ratio of the molecular structure (α) in the phenol resin (B ′) is lowered, the reactivity of the phenolic hydroxyl group is improved, and excellent heat resistance can be imparted to the cured product.

  The phenol resin (B ′) in the epoxy resin composition (II) has the same structure as the phenol resin that is a precursor of the epoxy resin (A) in the epoxy resin composition (I). Further, in the phenol resin (B ′), the functional number of the phenolic hydroxyl group is desirably formed as a polyarylene oxide structure from a dihydroxy aromatic compound as in the case of the epoxy resin (A). In this case, since the phenolic hydroxyl group appears at both ends of the linear molecular structure, it is mainly obtained as a bifunctional phenol resin. However, in the resin component, naphthalene partially in the polynaphthylene oxide structure is obtained. It may be a polyfunctional phenol resin having a molecular structure in which another hydroxy naphthalene ring is bonded to the ring by a direct bond.

  The phenol resin (B ′) is excellent in the effect of improving the dielectric properties and moisture resistance after curing, and is excellent in fluidity, so that the hydroxyl equivalent of the phenol resin (B ′) is 160 to 220 g / eq. , Especially 161-220 g / eq. Those within the range are preferred.

  Among the above-mentioned phenol resins (B ′), those having a polynaphthyleneoxy structure as the polyarylene oxide structure are preferable because they exhibit excellent flame retardancy and also have a low dielectric loss tangent. The following general formula (1 ')

で表される構造単位（α’）を繰り返し単位とし、その両末端にフェノール性水酸基を有する軟化点９０〜１５０℃のエポキシ樹脂であることが有機溶剤への溶解性に優れ、かつ、難燃性及び耐熱性に優れた硬化物を与えることができる点から好ましい。

The epoxy resin having a softening point of 90 to 150 ° C. having a phenolic hydroxyl group at both ends of the structural unit (α ′) represented by the formula is excellent in solubility in an organic solvent and flame retardant From the point which can give the hardened | cured material excellent in property and heat resistance.

  In the above general formula (1 '), X is a hydrogen atom or the following general formula (2)

で表される構造部位（β’）であり、かつ、前記一般式（１’）及び一般式（２’）中のＲは下記一般式（３）

And R in the general formula (1 ′) and the general formula (2 ′) is represented by the following general formula (3):

で表される構造部位（γ）であり、一般式（３）中のｎは１又は２であり、また、一般式（２’）及び一般式（３）中のｐの値は０〜３の整数である。但し、前記フェノール樹脂（Ｂ’）は、その分子構造中、前記構造部位（γ）をナフタレン環１個あたり０．１〜０．５個となる割合で有するものである。

In the general formula (3), n is 1 or 2, and the values of p in the general formula (2 ′) and the general formula (3) are 0-3. Is an integer. However, the said phenol resin (B ') has the said structure part ((gamma)) in the molecular structure in the ratio used as 0.1-0.5 per naphthalene ring.

  In the general formula (1 ′), the bonding position to the naphthalene skeleton may be any of two rings constituting the naphthalene ring. In addition, in the phenol resin (B ′), the heat resistance of the cured product is dramatically improved by making the existence ratio of the structural portion (γ) 0.5 or less with respect to one naphthalene skeleton, Flame retardancy also increases. On the other hand, by setting it to 0.1 or more, the flame retardancy of the cured product becomes good, and the dielectric loss tangent of the cured product also becomes low. Here, the abundance ratio of the structural site (γ) relative to the naphthalene skeleton corresponds to the number of moles of the aralkylating agent (a2) relative to 1 mole of dihydroxynaphthalene in the production method as described above.

  Since the phenol resin (B ′) detailed above has the same structure as the phenol resin which is the precursor of the epoxy resin (A) in the epoxy resin composition (I), the production of the epoxy resin (A) described above. Preferably, it is produced by step 1 in the method.

  In the epoxy resin composition (II) of the present invention, the phenol resin (B ′) may be used alone as a curing agent for the epoxy resin (A ′), but other curing agents are used as long as the effects of the present invention are not impaired. May be used in combination. Specifically, other curing agents can be used in combination in the range where the phenol resin is 30% by mass or more, preferably 40% by mass or more with respect to the total mass of the curing agent.

  The other curing agent that can be used in combination with the phenol resin (B ′) of the present invention is not particularly limited, and examples thereof include amine compounds, amide compounds, acid anhydride compounds, and the above-described phenol resins (B ′). ) And other phenolic compounds and aminotriazine-modified phenolic resins (polyhydric phenolic compounds in which phenolic nuclei are linked with melamine, benzoguanamine, etc.).

  Among these, phenol novolak resin, cresol novolak resin, aromatic hydrocarbon formaldehyde resin modified phenol resin, phenol aralkyl resin, naphthol aralkyl resin, naphthol novolak resin, naphthol-phenol co-condensed novolak resin, naphthol-cresol co-condensed novolak resin, Biphenyl-modified phenolic resin, biphenyl-modified naphthol resin, aminotriazine-modified phenolic resin are preferred because of excellent flame retardancy, especially high aromaticity such as phenol aralkyl resin, naphthol aralkyl resin, biphenyl-modified phenol resin, biphenyl-modified naphthol resin, Using a compound such as a phenolic resin having a high hydroxyl equivalent or an aminotriazine-modified phenolic resin containing a nitrogen atom, From the viewpoint of retardancy and dielectric properties superior.

  Next, as the epoxy resin (B ′) used in the epoxy resin composition (II) of the present invention, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, tetramethylbiphenyl type epoxy resin, Phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin, dicyclopentadiene-phenol addition reaction type epoxy resin, phenol aralkyl type epoxy resin, Naphthol novolac epoxy resin, naphthol aralkyl epoxy resin, naphthol-phenol co-condensed novolac epoxy resin, naphthol-cresol co-condensed novolac epoxy resin, good Family hydrocarbon-formaldehyde resin-modified phenol resin type epoxy resin, a biphenyl novolak type epoxy resins. Moreover, these epoxy resins may be used independently and may mix 2 or more types.

  Of these, biphenyl type epoxy resins, naphthalene type epoxy resins, phenol aralkyl type epoxy resins, biphenyl novolac type epoxy resins and xanthene type epoxy resins are particularly preferred because of their excellent flame retardancy and dielectric properties.

  The blending amount of the epoxy resin (B) and the curing agent in the epoxy resin composition (II) of the present invention is not particularly limited, but the epoxy resin (B The amount of the active group in the curing agent containing the phenol resin (A) is preferably 0.7 to 1.5 equivalents with respect to a total of 1 equivalent of the epoxy groups.

  Further, if necessary, a curing accelerator can be appropriately used in combination with the epoxy resin composition (II) of the present invention. Various curing accelerators can be used, and examples thereof include phosphorus compounds, tertiary amines, imidazoles, organic acid metal salts, Lewis acids, and amine complex salts. In particular, when used as a semiconductor encapsulating material, it is excellent in curability, heat resistance, electrical characteristics, moisture resistance reliability, etc., so that triphenylphosphine is used for phosphorus compounds and 1,8-diazabicyclo is used for tertiary amines. -[5.4.0] -undecene (DBU) is preferred.

  As described above, the epoxy resin compositions (I) and (II) of the present invention described in detail above are characterized by exhibiting excellent solvent solubility. Therefore, the epoxy resin compositions (I) and (II) preferably contain an organic solvent (C) in addition to the above components. Examples of the organic solvent (C) that can be used here include methyl ethyl ketone, acetone, dimethylformamide, methyl isobutyl ketone, methoxypropanol, cyclohexanone, methyl cellosolve, ethyl diglycol acetate, propylene glycol monomethyl ether acetate, etc. The proper amount used can be appropriately selected depending on the application, but for example, in a printed wiring board application, it is preferable to use a polar solvent having a boiling point of 160 ° C. or lower, such as methyl ethyl ketone, acetone, 1-methoxy-2-propanol, etc. The non-volatile content is preferably 40 to 80% by mass. On the other hand, in the adhesive film use for build-up, as the organic solvent (C), for example, ketones such as acetone, methyl ethyl ketone, cyclohexanone, acetic acid such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, carbitol acetate, etc. Esters, carbitols such as cellosolve and butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, etc. are preferably used, and non-volatile content is 30 to 60 mass. It is preferable to use it in the ratio which becomes%.

  In addition, the epoxy resin compositions (I) and (II) contain substantially no halogen atoms in the range of, for example, a printed wiring board, in order to exhibit flame retardancy, as long as reliability is not lowered. A non-halogen flame retardant may be blended.

  Examples of the non-halogen flame retardants include phosphorus flame retardants, nitrogen flame retardants, silicone flame retardants, inorganic flame retardants, and organic metal salt flame retardants. The flame retardants may be used alone or in combination, and a plurality of flame retardants of the same system may be used, or different types of flame retardants may be used in combination.

  As the phosphorus flame retardant, either inorganic or organic can be used. Examples of the inorganic compounds include red phosphorus, monoammonium phosphate, diammonium phosphate, triammonium phosphate, ammonium phosphates such as ammonium polyphosphate, and inorganic nitrogen-containing phosphorus compounds such as phosphate amide. .

  The red phosphorus is preferably subjected to a surface treatment for the purpose of preventing hydrolysis and the like. Examples of the surface treatment method include (i) magnesium hydroxide, aluminum hydroxide, zinc hydroxide, water A method of coating with an inorganic compound such as titanium oxide, bismuth oxide, bismuth hydroxide, bismuth nitrate or a mixture thereof; (ii) an inorganic compound such as magnesium hydroxide, aluminum hydroxide, zinc hydroxide, titanium hydroxide; and A method of coating with a mixture of a thermosetting resin such as a phenol resin, (iii) thermosetting of a phenol resin or the like on a coating of an inorganic compound such as magnesium hydroxide, aluminum hydroxide, zinc hydroxide, or titanium hydroxide For example, a method of double coating with a resin may be used.

  Examples of the organic phosphorus compound include, for example, general-purpose organic phosphorus compounds such as phosphate ester compounds, phosphonic acid compounds, phosphinic acid compounds, phosphine oxide compounds, phosphorane compounds, organic nitrogen-containing phosphorus compounds, and 9,10- Dihydro-9-oxa-10-phosphaphenanthrene = 10-oxide, 10- (2,5-dihydrooxyphenyl) -10H-9-oxa-10-phosphaphenanthrene = 10-oxide, 10- (2,7 -Dihydrooxynaphthyl) -10H-9-oxa-10-phosphaphenanthrene = 10-oxide and other cyclic organic phosphorus compounds and derivatives obtained by reacting them with compounds such as epoxy resins and phenol resins.

  The blending amount thereof is appropriately selected according to the type of the phosphorus-based flame retardant, the other components of the epoxy resin compositions (I) and (II), and the desired degree of flame retardancy. Red phosphorus is used as a non-halogen flame retardant in 100 parts by mass of the epoxy resin composition (I) and (II) containing all of a resin, a curing agent, a non-halogen flame retardant, and other fillers and additives. In the case of 0.1 to 2.0 parts by mass, the organophosphorus compound is preferably used in the range of 0.1 to 10.0 parts by mass, particularly 0. It is preferable to mix | blend in the range of 0.5-6.0 mass parts.

  In addition, when using the phosphorous flame retardant, the phosphorous flame retardant may be used in combination with hydrotalcite, magnesium hydroxide, boric compound, zirconium oxide, black dye, calcium carbonate, zeolite, zinc molybdate, activated carbon, etc. Good.

  Examples of the nitrogen-based flame retardant include triazine compounds, cyanuric acid compounds, isocyanuric acid compounds, phenothiazines, and the like, and triazine compounds, cyanuric acid compounds, and isocyanuric acid compounds are preferable.

  Examples of the triazine compound include melamine, acetoguanamine, benzoguanamine, melon, melam, succinoguanamine, ethylene dimelamine, melamine polyphosphate, triguanamine, and the like, for example, guanylmelamine sulfate, melem sulfate, melam sulfate, etc. Examples thereof include an aminotriazine sulfate compound, aminotriazine-modified phenol resin, and aminotriazine-modified phenol resin further modified with tung oil, isomerized linseed oil, and the like.

  Specific examples of the cyanuric acid compound include cyanuric acid and cyanuric acid melamine.

  The blending amount of the nitrogen-based flame retardant is appropriately selected depending on the type of the nitrogen-based flame retardant, the other components of the epoxy resin compositions (I) and (II), and the desired degree of flame retardancy. For example, 0.05 to 10 parts by mass in 100 parts by mass of epoxy resin composition (I) and (II) in which all of epoxy resin, curing agent, non-halogen flame retardant and other fillers and additives are blended It is preferable to mix | blend in the range of 0.1-5 mass parts especially.

  Moreover, when using the said nitrogen-type flame retardant, you may use together a metal hydroxide, a molybdenum compound, etc.

  The silicone flame retardant is not particularly limited as long as it is an organic compound containing a silicon atom, and examples thereof include silicone oil, silicone rubber, and silicone resin.

  The amount of the silicone-based flame retardant is appropriately selected depending on the type of the silicone-based flame retardant, the other components of the epoxy resin compositions (I) and (II), and the desired degree of flame retardancy. For example, in 100 parts by mass of epoxy resin composition (I) and (II) containing all of epoxy resin, curing agent, non-halogen flame retardant and other fillers and additives, 0.05 to 20 parts by mass It is preferable to mix in the range. Moreover, when using the said silicone type flame retardant, you may use a molybdenum compound, an alumina, etc. together.

  Examples of the inorganic flame retardant include metal hydroxide, metal oxide, metal carbonate compound, metal powder, boron compound, and low melting point glass.

  Specific examples of the metal hydroxide include aluminum hydroxide, magnesium hydroxide, dolomite, hydrotalcite, calcium hydroxide, barium hydroxide, zirconium hydroxide and the like.

  Specific examples of the metal oxide include, for example, zinc molybdate, molybdenum trioxide, zinc stannate, tin oxide, aluminum oxide, iron oxide, titanium oxide, manganese oxide, zirconium oxide, zinc oxide, molybdenum oxide, and cobalt oxide. Bismuth oxide, chromium oxide, nickel oxide, copper oxide, tungsten oxide and the like.

  Specific examples of the metal carbonate compound include zinc carbonate, magnesium carbonate, calcium carbonate, barium carbonate, basic magnesium carbonate, aluminum carbonate, iron carbonate, cobalt carbonate, and titanium carbonate.

  Specific examples of the metal powder include aluminum, iron, titanium, manganese, zinc, molybdenum, cobalt, bismuth, chromium, nickel, copper, tungsten, and tin.

  Specific examples of the boron compound include zinc borate, zinc metaborate, barium metaborate, boric acid, and borax.

Specific examples of the low-melting-point glass include, for example, Ceeley (Bokusui Brown), hydrated glass SiO ₂ —MgO—H ₂ O, PbO—B ₂ O ₃ system, ZnO—P ₂ O ₅ —MgO system, P ₂ O ₅ —B ₂ O ₃ —PbO—MgO, P—Sn—O—F, PbO—V ₂ O ₅ —TeO ₂ , Al ₂ O ₃ —H ₂ O, lead borosilicate, etc. The glassy compound can be mentioned.

  The amount of the inorganic flame retardant is appropriately selected according to the type of the inorganic flame retardant, the other components of the epoxy resin compositions (I) and (II), and the desired degree of flame retardancy. For example, in 100 parts by mass of epoxy resin composition (I) and (II) containing all of epoxy resin, curing agent, non-halogen flame retardant and other fillers and additives, 0.05 to 20 parts by mass It is preferable to mix | blend in the range of 0.5-15 mass parts especially.

  Examples of the organic metal salt flame retardant include ferrocene, acetylacetonate metal complex, organic metal carbonyl compound, organic cobalt salt compound, organic sulfonic acid metal salt, metal atom and aromatic compound or heterocyclic compound or an ionic bond or Examples thereof include a coordinated compound.

  The amount of the organometallic salt flame retardant is appropriately selected depending on the type of the organometallic salt flame retardant, the other components of the epoxy resin compositions (I) and (II), and the desired degree of flame retardancy. However, for example, in 100 parts by mass of epoxy resin compositions (I) and (II) containing all of epoxy resin, curing agent, non-halogen flame retardant, and other fillers and additives, 0.005 It is preferable to mix | blend in the range of -10 mass parts.

  An inorganic filler can be blended with the epoxy resin compositions (I) and (II) of the present invention as necessary. Examples of the inorganic filler include fused silica, crystalline silica, alumina, silicon nitride, and aluminum hydroxide. When particularly increasing the blending amount of the inorganic filler, it is preferable to use fused silica. The fused silica can be used in either a crushed shape or a spherical shape. However, in order to increase the blending amount of the fused silica and suppress an increase in the melt viscosity of the molding material, it is preferable to mainly use a spherical shape. In order to further increase the blending amount of the spherical silica, it is preferable to appropriately adjust the particle size distribution of the spherical silica. The filling rate is preferably higher in consideration of flame retardancy, and particularly preferably 20% by mass or more with respect to the total amount of the epoxy resin compositions (I) and (II). Moreover, when using for uses, such as an electrically conductive paste, electroconductive fillers, such as silver powder and copper powder, can be used.

  In the epoxy resin compositions (I) and (II) of the present invention, various compounding agents such as a silane coupling agent, a release agent, a pigment, and an emulsifier can be added as necessary.

  The epoxy resin compositions (I) and (II) of the present invention can be obtained by uniformly mixing the above-described components. The epoxy resin compositions (I) and (II) of the present invention, in which the epoxy resin of the present invention, a curing agent and, if necessary, a curing accelerator are blended, can be easily converted into a cured product by a method similar to a conventionally known method. can do. Examples of the cured product include molded cured products such as laminates, cast products, adhesive layers, coating films, and films.

  Applications for which the epoxy resin compositions (I) and (II) of the present invention are used include hard printed wiring board materials, resin compositions for flexible wiring boards, insulating materials for circuit boards such as interlayer insulating materials for build-up boards , Semiconductor sealing material, conductive paste, build-up adhesive film, resin casting material, adhesive and the like. Among these various applications, in hard printed wiring board materials, insulating materials for electronic circuit boards, and adhesive film for build-up, passive parts such as capacitors and active parts such as IC chips are embedded in so-called electronic parts. It can be used as an insulating material for a substrate. Among these, circuit boards such as hard printed wiring board materials, resin compositions for flexible wiring boards, and interlayer insulation materials for build-up boards because of their high flame resistance, high heat resistance, low thermal expansibility, and solvent solubility. It is preferable to use it for a material and a semiconductor sealing material.

  Here, the circuit board of the present invention obtains a varnish obtained by diluting the epoxy resin composition (I) or (II) in an organic solvent, and laminates the resulting varnish with a copper foil, followed by heating and pressing. It is manufactured by molding. Specifically, for example, to produce a hard printed wiring board, the varnish-like epoxy resin composition (I) or (II) containing the organic solvent (D) is further blended with the organic solvent (D). There is a method of obtaining a prepreg of the present invention which is produced by varnishing, impregnating it into a reinforcing base material, and semi-curing it, and superimposing a copper foil on the prepreg. Examples of the reinforcing substrate that can be used here include paper, glass cloth, glass nonwoven fabric, aramid paper, aramid cloth, glass mat, and glass roving cloth. More specifically, the varnish-like epoxy resin compositions (I) and (II) are first heated at a heating temperature corresponding to the solvent type used, preferably 50 to 170 ° C. A prepreg that is a cured product is obtained. At this time, the mass ratio of the epoxy resin composition (I) or (II) to be used and the reinforcing substrate is not particularly limited, but it is usually prepared so that the resin content in the prepreg is 20 to 60 mass%. Is preferred. Next, the prepreg obtained as described above is laminated by a conventional method, and a copper foil is appropriately stacked, and then subjected to thermocompression bonding at a pressure of 1 to 10 MPa at 170 to 250 ° C. for 10 minutes to 3 hours, A target circuit board can be obtained.

  In order to produce a flexible wiring board from the epoxy resin composition (I) or (II) of the present invention, the phenols, the epoxy resin (B), the curing accelerator (C), and the organic solvent (D) are added. It mix | blends and it apply | coats to an electrically insulating film using coating machines, such as a reverse roll coater and a comma coater. Subsequently, it heats at 60-170 degreeC for 1 to 15 minutes using a heating machine, volatilizes a solvent, and B-stages an adhesive composition. Next, the metal foil is thermocompression bonded to the adhesive using a heating roll or the like. At that time, the pressure is preferably 2 to 200 N / cm and the pressure is preferably 40 to 200 ° C. If sufficient adhesive performance can be obtained, the process may be completed here. However, when complete curing is required, it is preferably post-cured at 100 to 200 ° C. for 1 to 24 hours. The thickness of the adhesive composition film after finally curing is preferably in the range of 5 to 100 μm.

  As a method for obtaining an interlayer insulating material for buildup substrates from the epoxy resin composition (I) or (II) of the present invention, for example, the epoxy resin composition (I) or (II) appropriately blended with rubber, filler or the like. Is applied to the wiring board on which the circuit is formed using a spray coating method, a curtain coating method, or the like, and then cured. Then, after drilling a predetermined through-hole part etc. as needed, it treats with a roughening agent, forms the unevenness | corrugation by washing the surface with hot water, and metal-treats, such as copper. As the plating method, electroless plating or electrolytic plating treatment is preferable, and examples of the roughening agent include an oxidizing agent, an alkali, and an organic solvent. Such operations are sequentially repeated as desired, and a build-up base can be obtained by alternately building up and forming the resin insulating layer and the conductor layer having a predetermined circuit pattern. However, the through-hole portion is formed after the outermost resin insulating layer is formed. In addition, a resin-coated copper foil obtained by semi-curing the resin composition on the copper foil is thermocompression-bonded at 170 to 250 ° C. on a circuit board on which a circuit is formed, thereby forming a roughened surface and plating treatment. It is also possible to produce a build-up substrate by omitting the process.

  Next, in order to produce a semiconductor sealing material from the epoxy resin composition (I) or (II) of the present invention, the phenols (A), the epoxy resin (B), the curing accelerator (C), and Examples thereof include a method in which a compounding agent such as an inorganic filler is sufficiently melt-mixed using an extruder, a kneader, a roll or the like as required until uniform. At that time, silica is usually used as the inorganic filler, and the filling rate is preferably in the range of 30 to 95% by mass of the filler per 100 parts by mass of the epoxy resin composition. 70 parts by mass or more is particularly preferable in order to improve the moisture resistance and solder crack resistance and decrease the linear expansion coefficient, and 80 parts by mass or more is more effective in order to significantly increase these effects. Can be increased. For semiconductor package molding, the composition is molded by casting, using a transfer molding machine, an injection molding machine or the like, and further heated at 50 to 200 ° C. for 2 to 10 hours to form a semiconductor device which is a molded product. There is a way to get it.

  The method for producing an adhesive film for buildup from the epoxy resin composition (I) or (II) of the present invention includes, for example, applying the epoxy resin composition (I) or (II) of the present invention on a support film. The method of forming the resin composition layer and making it the adhesive film for multilayer printed wiring boards is mentioned.

  When the epoxy resin composition (I) or (II) of the present invention is used for an adhesive film for build-up, the adhesive film is softened under the temperature condition of the laminate in the vacuum laminating method (usually 70 ° C. to 140 ° C.). It is important to show fluidity (resin flow) that allows resin filling in via holes or through holes that exist in the circuit board at the same time as the lamination of the substrate, and the above components are blended so as to exhibit such characteristics. It is preferable.

  Here, the diameter of the through hole of the multilayer printed wiring board is usually 0.1 to 0.5 mm, and the depth is usually 0.1 to 1.2 mm. It is usually preferable to allow resin filling in this range. When laminating both surfaces of the circuit board, it is desirable to fill about 1/2 of the through hole.

  Specifically, the above-mentioned method for producing an adhesive film is prepared by preparing the varnish-like epoxy resin composition (I) or (II) of the present invention, and then applying the varnish-like composition on the surface of the support film. It can be produced by coating and further drying the organic solvent by heating or blowing hot air to form the layer (α) of the epoxy resin composition (I) or (II).

  The thickness of the formed layer (α) is usually not less than the thickness of the conductor layer. Since the thickness of the conductor layer of the circuit board is usually in the range of 5 to 70 μm, the thickness of the resin composition layer is preferably 10 to 100 μm.

  In addition, the said layer ((alpha)) may be protected with the protective film mentioned later. By protecting with a protective film, it is possible to prevent dust and the like from being attached to the surface of the resin composition layer and scratches.

  The above-mentioned support film and protective film are made of polyolefin such as polyethylene, polypropylene and polyvinyl chloride, polyethylene terephthalate (hereinafter sometimes abbreviated as “PET”), polyester such as polyethylene naphthalate, polycarbonate, polyimide, and further. Examples thereof include metal foil such as pattern paper, copper foil, and aluminum foil. In addition, the support film and the protective film may be subjected to a release treatment in addition to the mud treatment and the corona treatment.

  Although the thickness of a support film is not specifically limited, Usually, it is 10-150 micrometers, Preferably it is used in 25-50 micrometers. Moreover, it is preferable that the thickness of a protective film shall be 1-40 micrometers.

  The above support film is peeled off after being laminated on a circuit board or after forming an insulating layer by heat curing. If the support film is peeled after the adhesive film is heat-cured, adhesion of dust and the like in the curing process can be prevented. In the case of peeling after curing, the support film is usually subjected to a release treatment in advance.

  Next, the method for producing a multilayer printed wiring board using the adhesive film obtained as described above is, for example, when the layer (α) is protected with a protective film, Lamination is performed on one or both sides of the circuit board by, for example, vacuum laminating so that α) is in direct contact with the circuit board. The laminating method may be a batch method or a continuous method using a roll. Further, the adhesive film and the circuit board may be heated (preheated) as necessary before lamination.

The laminating conditions are preferably a pressure bonding temperature (laminating temperature) of 70 to 140 ° C., a pressure bonding pressure of preferably 1 to 11 kgf / cm ² (9.8 × 10 ^{4 to} 107.9 × 10 ⁴ N / m 2), Lamination is preferably performed under reduced pressure with an air pressure of 20 mmHg (26.7 hPa) or less.

  When the epoxy resin compositions (I) and (II) of the present invention are used as a conductive paste, for example, fine conductive particles are dispersed in the epoxy resin compositions (I) and (II) and are anisotropic. Examples thereof include a method for forming a conductive film composition, a method for forming a paste resin composition for circuit connection that is liquid at room temperature, and an anisotropic conductive adhesive.

  Moreover, the epoxy resin composition (I) of the present invention can be further used as a resist ink. In this case, a vinyl monomer having an ethylenically unsaturated double bond and a cationic polymerization catalyst as a curing agent (B) are blended with the epoxy resin (A), and a pigment, talc and filler are further added to form a resist. A method for forming a resist ink cured product after coating on a printed circuit board by a screen printing method after an ink composition is used.

  The method for obtaining the cured product of the present invention may be based on a general method for curing an epoxy resin composition. For example, the heating temperature condition may be appropriately selected depending on the type and use of the curing agent to be combined. What is necessary is just to heat the composition obtained by the said method in the temperature range about 20-250 degreeC. As the molding method and the like, a general method of the epoxy resin composition is used, and a condition specific to the epoxy resin composition of the present invention is not particularly required.

  Therefore, by using the epoxy resin (A) or the phenol resin (B ′), it is possible to obtain an epoxy resin composition excellent in environmental characteristics that exhibits high flame retardancy without using a halogen-based flame retardant. it can. In addition, the excellent dielectric properties of these cured products can realize high-speed operation speed of high-frequency devices. In addition, the phenol resin can be easily and efficiently produced by the production method of the present invention, and a molecular design corresponding to the target level of performance described above becomes possible.

Next, the present invention will be specifically described with reference to Examples and Comparative Examples. In the following, “parts” and “%” are based on mass unless otherwise specified. In addition, the melt viscosity and softening point measurement in 150 degreeC, GPC measurement, < ¹³ > C-NMR, and FD-MS spectrum were measured on condition of the following.

1) Melt viscosity at 150 ° C .: Conforms to ASTM D4287.
2) Softening point measurement method: compliant with JIS K7234.
3) GPC:
Apparatus: Measured under the following conditions using “HLC-8220 GPC” manufactured by Tosoh Corporation.
Column: TSK-GEL G2000HXL + G2000HXL manufactured by Tosoh Corporation
+ G3000HXL + G4000HXL
Solvent: Tetrahydrofuran Flow rate: 1 ml / min
Detector: RI
4) ¹³ C-NMR: Measured by “NMR GSX270” manufactured by JEOL Ltd.
5) FD-MS: Measured with a double convergence mass spectrometer “AX505H (FD505H)” manufactured by JEOL Ltd.

Example 1
In a flask equipped with a thermometer, dropping funnel, condenser, fractionator, and stirrer, 160 parts (1.0 mol) of 2,7-dihydroxynaphthalene, 25 parts (0.25 mol) of benzyl alcohol, xylene 160 And 2 parts of p-toluenesulfonic acid monohydrate were charged and stirred at room temperature while blowing nitrogen. Thereafter, the temperature was raised to 140 ° C., and the resulting water was stirred for 4 hours while distilling out of the system (xylene distilled off simultaneously was returned to the system). Thereafter, the temperature was raised to 150 ° C., and the resulting water and xylene were stirred for 3 hours while distilling out of the system. After completion of the reaction, 2 parts of a 20% aqueous sodium hydroxide solution was added for neutralization, and then water and xylene were removed under reduced pressure to obtain 178 parts of phenolic resins (A-1). The obtained phenol resins (A-1) were brown solids, the hydroxyl group equivalent was 169 grams / equivalent, and the softening point was 130 ° C.
A GPC chart of the obtained phenolic resins is shown in FIG.
The structural analysis of phenol resins (A-1) by FD-MS and ¹³ C-NMR is performed, and the phenol resins (A-1) are trimethylsilylated for use in the measurement of FD-MS by the trimethylsilylation method. Then, the following a. To f. The peak of was confirmed.

a. A peak in which one benzyl group (molecular weight Mw: 90) is added to 2,7-dihydroxynaphthalene (Mw: 160) (M ⁺ = 250), and a peak in which two benzyl groups (molecular weight Mw: 90) are further added (M ⁺ = 340).
Therefore, it was confirmed that the compound had a structure in which 1 mol of benzyl group was bonded to 1 mol of 2,7-dihydroxynaphthalene and a compound having a structure in which 2 mol was bonded.

b. A peak of 2,7-dihydroxynaphthalene dimer (M ⁺ = 302) and a peak obtained by adding two trimethylsilyl groups (molecular weight Mw: 72) to this (M ⁺ = 446).
Therefore, b. Was confirmed to be a 2,7-dihydroxynaphthalene dimer ether compound.

c. The peak of 2,7-dihydroxynaphthalene trimer (M ⁺ = 444), the peak obtained by adding two trimethylsilyl groups (molecular weight Mw: 72) (M ⁺ = 588) and the peak added by three (M ⁺ = 444) ⁺ = 660).
Therefore, c. Is a trimer compound having a structure formed by nuclear dehydration of 1 mol of 2,7-dihydroxynaphthalene per 1 mol of 2,7-dihydroxynaphthalene trimer ether compound and 2,7-dihydroxynaphthalene dimer ether. I confirmed that there was.

d. A peak of 2,7-dihydroxynaphthalene tetramer (M ⁺ = 586), a peak (M ⁺ = 730) added with two trimethylsilyl groups (molecular weight Mw: 72) and a peak added with three (M ⁺ = 586) ⁺ = 802).
Therefore, d. Is a tetramer compound having a structure formed by nuclear dehydration of 1 mol of 2,7-dihydroxynaphthalene per 1 mol of 2,7-dihydroxynaphthalene tetramer ether compound and 2,7-dihydroxynaphthalene trimer ether. I confirmed that there was.

e. A peak of 2,7-dihydroxynaphthalene pentamer (M ⁺ = 729), a peak (M ⁺ = 873) added with two trimethylsilyl groups (molecular weight Mw: 72) and a peak added with three (M ⁺ = 729) ⁺ = 944) and 4 added peaks (M ⁺ = 1016).
Therefore, e. Is a pentamer compound having a structure formed by nuclear dehydration of 1 mol of 2,7-dihydroxynaphthalene per 1 mol of 2,7-dihydroxynaphthalene pentamer ether compound and 2,7-dihydroxynaphthalene tetramer ether, and It was confirmed that 1 mol of 2,7-dihydroxynaphthalene trimer ether was a pentamer compound having a structure formed by 2 mol of 2,7-dihydroxynaphthalene resulting from nuclear dehydration.

f. A peak obtained by adding one benzyl group (molecular weight Mw: 90) to each of b to e, and a peak obtained by further adding two benzyl groups (molecular weight Mw: 90).
Therefore, it was confirmed that each of the compounds b to e was a compound having a structure in which 1 mol of a benzyl group was bonded to 1 mol and a compound having a structure in which 2 mol were bonded.

Example 2
A flask equipped with a thermometer, a dropping funnel, a condenser, and a stirrer was purged with nitrogen gas while 169 g of phenol resins (A-1) obtained in Example 1, 463 g of epichlorohydrin (5.0 mol), n -139 g of butanol and 2 g of tetraethylbenzylammonium chloride were charged and dissolved. After raising the temperature to 65 ° C., the pressure was reduced to an azeotropic pressure, and 90 g (1.1 mol) of a 49% aqueous sodium hydroxide solution was added dropwise over 5 hours. Thereafter, stirring was continued for 0.5 hours under the same conditions. During this time, the distillate distilled by azeotropic distillation was separated with a Dean-Stark trap, the water layer was removed, and the reaction was carried out while returning the oil layer to the reaction system. Thereafter, unreacted epichlorohydrin was distilled off under reduced pressure. 432 g of methyl isobutyl ketone and 130 g of n-butanol were added to the crude epoxy resin thus obtained and dissolved. Further, 10 g of a 10% aqueous sodium hydroxide solution was added to this solution and reacted at 80 ° C. for 2 hours, and then washing with water 150 g was repeated three times until the pH of the washing solution became neutral. Next, the system was dehydrated by azeotropic distillation, and after microfiltration, the solvent was distilled off under reduced pressure to obtain 230 g of an epoxy resin (hereinafter abbreviated as “epoxy resin (B-1)”). . The resulting epoxy resin had a softening point of 100 ° C. and an epoxy equivalent of 277 g / eq.

Example 3
The reaction was conducted in the same manner as in Example 1 except that the amount was changed to 54 parts (0.5 mol) of benzyl alcohol to obtain 207 parts of phenol resins (A-3). The phenol resins (A-2) were brown solids, had a hydroxyl group equivalent of 166 g / equivalent and a softening point of 110 ° C.

Example 4
The reaction was conducted in the same manner as in Example 1 except for changing to 16 parts (0.15 mol) of benzyl alcohol to obtain 233 parts of phenol resins (A-3). The phenol resins (A-3) were brown solids, had a hydroxyl group equivalent of 162 grams / equivalent and a softening point of 141 ° C.

Example 5
The reaction was the same as in Example 2 except that 169 g of the phenolic resin (A-1) was changed to 162 g of the phenolic resin (A-3), to obtain 220 parts of an epoxy resin (B-3). The resulting epoxy resin had a softening point of 110 ° C. and an epoxy equivalent of 268 g / eq.

Comparative Example 1
The reaction was carried out in the same manner as in Example 1 except that the reaction temperature was 150 ° C., the reaction time was 3 hours, 108 parts (1.0 mol) of benzyl alcohol was changed, and 160 parts of xylene was not added. -4) was obtained 240 parts. The phenol resins (A-4) were brown solids, the hydroxyl group equivalent was 160 g / equivalent, and the softening point was 77 ° C.

Comparative Example 2
The reaction was performed in the same manner as in Example 2 except that 169 g of the phenolic resin (A-1) was changed to 160 g of the phenolic resin (A-4) to obtain 220 parts of an epoxy resin (B-4). The resulting epoxy resin had a softening point of 47 ° C. and an epoxy equivalent of 231 g / eq.

Comparative Example 3
The reaction was carried out in the same manner as in Example 1 except that the reaction temperature was 150 ° C., the reaction time was 3 hours, benzyl alcohol was changed to 76 parts (0.7 mol), and 160 parts of xylene was not added. -4) was obtained 210 parts. The phenol resins (A-5) were brown solids, had a hydroxyl group equivalent of 156 grams / equivalent and a softening point of 83 ° C.

Comparative Example 4
The reaction was performed in the same manner as in Example 2 except that 169 g of the phenolic resin (A-1) was changed to 156 g of the phenolic resin (A-5) to obtain 220 parts of an epoxy resin (B-5). The resulting epoxy resin had a softening point of 66 ° C. and an epoxy equivalent of 255 g / eq.

Example 6 and Comparative Example 3 (Adjustment of epoxy resin composition and evaluation of physical properties)
In accordance with the composition shown in Table 1 below, (B-1) and (B-3) as epoxy resins, N-770 (phenol novolac type epoxy resin, epoxy equivalent: 183 g / eq) manufactured by DIC Corporation as a curing agent (A-1), (A-3), (A-4) and TD-2090 manufactured by DIC Corporation (softening point 120 ° C., phenol novolac resin, hydroxyl group equivalent: 105 g / eq) are blended and further cured. 2-ethyl-4-methylimidazole (2E4MZ) 0.1 phr is blended as an accelerator, and methyl ethyl ketone is blended so that the nonvolatile content (NV) of each composition is finally 58% by mass. did.
Next, a laminate was prepared by curing under the following conditions, and heat resistance, dielectric properties and flame retardancy were evaluated by the following methods. The results are shown in Table 1.

<Laminate production conditions>
Base material: Glass cloth “# 2116” (210 × 280 mm) manufactured by Nitto Boseki Co., Ltd.
Number of plies: 6
Prepregation conditions: 160 ° C
Curing conditions: 200 ° C., 40 kg / cm ² for 1.5 hours, post-molding plate thickness: 0.8 mm

<Heat resistance (glass transition temperature)>
Using a viscoelasticity measuring device (DMA: solid viscoelasticity measuring device RSAII manufactured by Rheometric, rectangular tension method; frequency 1 Hz, heating rate 3 ° C./min), the elastic modulus change is maximized (tan δ change rate is the highest). The (large) temperature was evaluated as the glass transition temperature.

<Measurement of dielectric constant and dissipation factor>
In accordance with JIS-C-6481, the dielectric material at 1 GHz of the test piece after being stored in an indoor room at 23 ° C. and 50% humidity for 24 hours after absolutely dry using an impedance material analyzer “HP4291B” manufactured by Agilent Technologies, Inc. The rate and dielectric loss tangent were measured.
<Flame retardance>
In accordance with the UL-94 test method, a combustion test was performed using five 125 × 13 × 0.8 mm test pieces.
<Solvent solubility test>
Judging by the appearance after storing a methyl ethyl ketone solution having a blended nonvolatile content (N.V.) of 58 mass% at 0 ° C. for 60 days.

Footnotes in Table 1:
* 1: Maximum combustion time (seconds) in one flame contact
* 2: Total burning time of 5 test pieces (seconds)
The evaluation result shown as “self-extinguishing” does not satisfy the flame retardancy required for V-1 (ΣF ≦ 250 seconds and F _max ≦ 30 seconds), but does not reach combustion (flame clamp arrival). The fire extinguisher level.

Claims (10)

It has a polyaryleneoxy structure as the main skeleton, and the aromatic nucleus of the structure has a glycidyloxy group or a methylglycidyloxy group, and the following structural formula (1)

[In the structural formula (1), R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is a phenylene group or a nuclear substitution with 1 to 3 of a C 1-4 alkyl group. A phenylene group, a naphthylene group, a naphthylene group substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms, and n is an integer of 1 or 2. And a fragrance constituting the molecular structure (α) per mole of aromatic nuclei constituting the polyaryleneoxy structure in the molecular structure. The epoxy resin (A) whose softening point is 80 to 140 ° C. and the curing agent (B) are essential components in the range in which the nucleus content is 0.1 to 0.5 mol. An epoxy resin composition. The epoxy resin (A) has an epoxy equivalent of 257 to 320 g / eq. The epoxy resin composition according to claim 1, which is in the range of The epoxy resin composition according to claim 1, wherein R ₁ and R ₂ in the general formula (1) are both hydrogen atoms. Hardened | cured material obtained by hardening the epoxy resin composition of any one of Claims 1-3. It has a polyaryleneoxy structure as the main skeleton, and the aromatic nucleus of the structure has a glycidyloxy group or a methylglycidyloxy group, and the following structural formula (1)

[In the structural formula (1), R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is a phenylene group or a nuclear substitution with 1 to 3 of a C 1-4 alkyl group. A phenylene group, a naphthylene group, a naphthylene group substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms, and n is an integer of 1 or 2. And a fragrance constituting the molecular structure (α) per mole of aromatic nuclei constituting the polyaryleneoxy structure in the molecular structure. A novel epoxy resin characterized in that the nucleus content is in the range of 0.1 to 0.5 mol and the softening point is 80 to 140 ° C. It has a polyaryleneoxy structure as the main skeleton, and the aromatic nucleus of the structure has a phenolic hydroxyl group and the following structural formula (1)

[In the structural formula (1), R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is a phenylene group or a nuclear substitution with 1 to 3 of a C 1-4 alkyl group. A phenylene group, a naphthylene group, a naphthylene group substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms, and n is an integer of 1 or 2. And a fragrance constituting the molecular structure (α) per mole of aromatic nuclei constituting the polyaryleneoxy structure in the molecular structure. The phenol resin (B ′) and the epoxy resin (A ′) having a nucleus content of 0.1 to 0.5 mol and a softening point of 90 to 150 ° C. are essential components. An epoxy resin composition characterized by that. A cured product obtained by curing the epoxy resin composition according to claim 6. It has a polyaryleneoxy structure as the main skeleton, and the aromatic nucleus of the structure has a phenolic hydroxyl group and the following structural formula (1)

[In the structural formula (1), R ₁ and R ₂ are each independently a methyl group or a hydrogen atom, and Ar is a phenylene group or a nuclear substitution with 1 to 3 of a C 1-4 alkyl group. A phenylene group, a naphthylene group, a naphthylene group substituted with 1 to 3 alkyl groups having 1 to 4 carbon atoms, and n is an integer of 1 or 2. And a fragrance constituting the molecular structure (α) per mole of aromatic nuclei constituting the polyaryleneoxy structure in the molecular structure. A novel phenol resin characterized in that the abundance ratio of nuclei is in the range of 0.1 to 0.5 mol and the softening point is 90 to 150 ° C. A prepreg obtained by impregnating a reinforcing substrate with the resin composition according to claim 1 diluted with an organic solvent and semi-curing the resulting impregnated substrate. A varnish obtained by diluting the epoxy resin composition according to claim 1, 2, 3, 5, 6, or 8 in an organic solvent is obtained, and a sheet formed from the varnish and a copper foil are heat-press molded. Circuit board obtained by

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