JP2014188596A - Polishing device temperature control system and polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the weight of a heat exchanger used for polishing pad temperature control and to suppress generation of damage and deformation of the heat exchanger.SOLUTION: A polishing device temperature control system 200 includes a heat exchanger 210 provided on a polishing pad 108 for polishing a substrate 102 and exchanging heat with the polishing pad 108. The polishing device temperature control system 200 also includes: a temperature controller 220 that controls a temperature of a heat medium used in the heat exchanger 210; and a pump 230 that supplies the heat medium the temperature of which is controlled by the temperature controller 220 to a heat medium inlet 212 of the heat exchanger 210. The polishing device temperature control system 200 further includes a buffer container 240 kept at a pressure equal to or lower than an atmospheric pressure and storing therein the heat medium flowing out from a heat medium outlet 214 of the heat exchanger 210.

Description

  The present invention relates to a polishing apparatus temperature control system and a polishing apparatus.

  In recent years, a polishing apparatus has been used to polish the surface of a substrate such as a semiconductor wafer. The polishing apparatus supplies a polishing slurry (slurry) onto the polishing pad while rotating the polishing table to which the polishing pad for polishing the substrate is attached, and presses the substrate held by the top ring against the polishing pad. To polish the surface of the substrate.

  Here, the polishing performance of the substrate varies greatly depending on the temperature of the polishing pad. For this reason, in the prior art, it is known to adjust the temperature of the polishing pad in order to obtain good polishing performance. For example, in the prior art, a heat exchanger is disposed on a polishing pad, and a heat medium adjusted to a predetermined target temperature is supplied to the heat exchanger using a pump, thereby controlling the polishing pad to a desired temperature. It is known to do.

JP 2012-176449 A

  However, the prior art does not consider reducing the weight of the heat exchanger used for controlling the temperature of the polishing pad.

  That is, since the heat exchanger is disposed on the polishing pad, if the weight of the heat exchanger is heavy, the polishing pad may be deformed, and as a result, the polishing performance may be adversely affected.

  Here, in order to reduce the weight of the heat exchanger, it is conceivable to form a thin casing or the like of the heat exchanger. However, when the heat exchanger casing or the like is simply formed thinly, if the heat medium after heat exchange is directly sucked by a pump, the heat exchanger may be damaged due to a large back pressure. Further, the heat transfer efficiency to the polishing pad may be reduced due to deformation of the heat exchanger due to pressure even if it does not break.

  Therefore, an object of the present invention is to reduce the weight of a heat exchanger used for controlling the temperature of the polishing pad and to prevent the heat exchanger from being damaged or deformed.

  One aspect of the polishing apparatus temperature control system of the present invention has been made in view of the above problems, and is provided on a polishing pad for polishing a substrate, and a heat exchanger for exchanging heat with the polishing pad, and the heat exchanger A temperature controller for controlling the temperature of the heat medium used in the apparatus, a pump for supplying the heat medium controlled by the temperature controller to the heat medium inlet of the heat exchanger, and a pressure below atmospheric pressure. And a buffer container for storing the heat medium flowing out from the heat medium outlet of the heat exchanger.

  The buffer container may be a container opened to atmospheric pressure.

In addition, a connection port connected to the heat medium intake port of the pump can be formed in the buffer container.

  Further, the pump sucks the heat medium stored in the buffer container through the connection port, circulates the sucked heat medium with the temperature controller, and by the circulation, the temperature controller It can be set as the pump which discharges the heat medium by which the temperature was controlled to the heat medium entrance of the said heat exchanger.

  The pump sucks the heat medium stored in the buffer container through the connection port, controls the temperature of the sucked heat medium by the temperature controller, and transfers the temperature-controlled heat medium to the buffer. A first pump that discharges to the container, and a second pump that supplies the heat medium stored in the buffer container to the heat medium inlet of the heat exchanger.

  In addition, an aspect of the polishing apparatus of the present invention includes any one of the above polishing apparatus temperature control systems, a polishing table on which the polishing pad is installed, and a substrate holding unit that holds the substrate. To do.

  According to this invention of this application, weight reduction of the heat exchanger used for temperature control of a polishing pad is achieved, and it is suppressed that a breakage and a deformation | transformation arise in a heat exchanger.

FIG. 1 is a perspective view schematically showing the overall configuration of the polishing apparatus. FIG. 2 is a diagram showing a schematic configuration of the polishing apparatus temperature control system of the first embodiment. FIG. 3 is a diagram showing a detailed configuration of the polishing apparatus temperature control system of the first embodiment. FIG. 4 is a diagram showing a schematic configuration of a modification of the polishing apparatus temperature control system of the first embodiment. FIG. 5 shows the heat medium temperature at the inlet of the heat exchanger and the heat medium temperature at the outlet when a heat medium of 3.5 L / min is discharged from the pump in a modification of the polishing apparatus temperature control system of the first embodiment. It is a figure which shows the flow volume of a heating medium and a time series. FIG. 6 shows the heat medium temperature at the inlet of the heat exchanger and the heat medium temperature at the outlet when a heat medium of 7 L / min is discharged from the pump in a modification of the polishing apparatus temperature control system of the first embodiment. It is a figure shown in time series. FIG. 7 is a diagram showing a schematic configuration of a polishing apparatus temperature control system of the second embodiment.

Hereinafter, a polishing apparatus temperature control system according to an embodiment of the present invention will be described with reference to the drawings. In the following embodiment, CMP (Chemical Mechanical) is used as an example.
A polishing apparatus temperature control system used for a polishing apparatus will be described, but is not limited thereto.

  First, the polishing apparatus will be described. FIG. 1 is a perspective view schematically showing the overall configuration of the polishing apparatus. As shown in FIG. 1, a polishing apparatus 100 includes a polishing table 110 on which a polishing pad 108 for polishing a substrate 102 such as a semiconductor wafer can be attached, and a first electric motor 112 that rotates the polishing table 110. A top ring (substrate holding part) 116 that can hold the substrate 102, and a second electric motor 118 that rotationally drives the top ring 116.

Further, the polishing apparatus 100 includes a first slurry line 120 capable of supplying a polishing abrasive liquid containing a polishing material on the upper surface of the polishing pad 108, and a dresser unit 124 having a dresser disk 122 for conditioning (shaping) the polishing pad 108. And comprising.

  When polishing the substrate 102, a polishing abrasive liquid containing an abrasive is supplied from the slurry line 120 to the upper surface of the polishing pad 108, and the polishing table 110 is driven to rotate by the first electric motor 112. Then, the substrate 102 held by the top ring 116 is pressed against the polishing pad 108 in a state where the top ring 116 is rotated around a rotation axis that is eccentric from the rotation axis of the polishing table 110. As a result, the substrate 102 is polished by the polishing pad 108 and planarized.

  Meanwhile, in the polishing apparatus 100, the temperature of the polishing table 110 is adjusted in order to improve the polishing rate (polishing rate) of the substrate 102. Specifically, the temperature of the polishing table 110 is adjusted by bringing a heat exchanger into contact with the polishing pad 108 on the polishing table 110 and raising the temperature inside the heat exchanger to, for example, about 80 ° C. to 100 ° C. by a temperature adjusting device. Supply the heated water (heat medium). Hereinafter, the polishing apparatus temperature control system of this embodiment will be described.

(First embodiment)
An outline of the polishing apparatus temperature control system of the first embodiment will be described. FIG. 2 is a diagram showing a schematic configuration of the polishing apparatus temperature control system of the first embodiment. As shown in FIG. 2, the polishing apparatus temperature control system 200 is provided on a polishing pad 108 for polishing the substrate 102, a heat exchanger 210 for exchanging heat with the polishing pad 108, and a heat used in the heat exchanger 210. A temperature controller 220 for controlling the temperature of the medium. Further, the polishing apparatus temperature control system 200 includes a pump 230 that supplies the heat medium whose temperature is controlled by the temperature controller 220 to the heat medium inlet of the heat exchanger 210, and heat that has flowed out of the heat medium outlet of the heat exchanger 210. And a buffer container 240 for storing the medium. The heat medium stored in the buffer container 240 is sucked into the pump 230 through the connection port 242 formed in the buffer container 240. In the present embodiment, the example in which the temperature controller 220 and the pump 230 are accommodated in the temperature adjustment device 250 is shown, but the present invention is not limited to this.

  In this embodiment, the buffer container 240 can be a container maintained at a pressure equal to or lower than atmospheric pressure. The buffer container 240 may be a container opened to atmospheric pressure, for example. As a result, it is possible to suppress an increase in the back pressure of the heat exchanger 210 as compared with the case where the heat medium after the heat exchange is directly sucked by the pump 230, so that the weight of the heat exchanger 210 can be reduced. In addition, it is possible to prevent the heat exchanger 210 from being damaged or deformed.

  That is, since the heat exchanger 210 is installed on the polishing pad 108, it is preferable to reduce the weight so that the polishing pad 108 is not deformed. In order to reduce the weight of the heat exchanger 210, it is conceivable to form the casing and the like of the heat exchanger 210 with a thinly processed material. Such a heat exchanger 210 is structurally weak against back pressure when draining the heat medium. Therefore, when the heat medium is returned directly to the pump 230, the back pressure is excessively applied to the heat exchanger 210 and the heat exchanger 210. May be damaged or deformed.

  For example, the back pressure of the heat exchanger 210 may be reduced by draining the heat medium discharged from the heat exchanger 210 without returning it to the pump 230. The energy of the heated heat medium is wasted, and it becomes difficult to stabilize the temperature of the heat medium supplied to the heat exchanger 210 at a desired temperature.

In this respect, according to the present embodiment, the heat medium after heat exchange flows out into the buffer container 240 maintained at atmospheric pressure, so that the back pressure of the heat exchanger 210 can be reduced. As a result, even if it is the heat exchanger 210 reduced in weight, it can suppress that damage and a deformation | transformation arise in the heat exchanger 210. FIG. Further, since the heat medium stored in the buffer container 240 is circulated to the pump 230 and reused, the energy of the heated heat medium is effectively utilized, and the temperature of the heat medium supplied to the heat exchanger 210 is changed. It becomes easy to stabilize at a desired temperature.

  Further, when a storage tank for storing the heat medium is provided in the temperature adjusting device 250, the heat medium in the buffer container 240 is returned to the storage tank by its own weight, and the heat medium stored in the storage tank is sucked by the pump 230. Can do. In this case, since the flow rate of the heat medium drawn in by the temperature adjustment device 250 can be controlled, the heat medium can be supplied and circulated while keeping the temperature of the heat medium in the temperature adjustment device 250 constant.

  Next, details of the polishing apparatus temperature control system of the first embodiment will be described. FIG. 3 is a diagram showing a schematic configuration of the polishing apparatus temperature control system of the first embodiment.

  The temperature adjusting device 250 is connected to an inflow pipe 310 for flowing water used as a heat medium from the outside. The inflow pipe 310 is connected to an inflow port 251 formed in the temperature adjustment device 250. The inlet pipe 310 is provided with a valve 302 and a pressure gauge 304. When water flows into the temperature adjustment device 250 from the outside, the valve 302 is controlled to “open”, and when water does not flow, the valve 302 is controlled to “close”. Further, the pressure in the inflow pipe 310 is detected by the pressure gauge 304.

  Further, the temperature adjustment device 250 includes two inlets 252 and 254 that allow the heat medium to flow in, and two outlets 256 and 258 that allow the heat medium to flow to the outside. The outlet 258 and the heat medium inlet 212 of the heat exchanger 210 are connected by a heat medium supply pipe 320.

  The heat medium supply pipe 320 is provided with a first valve 322, a first pressure gauge 324, a second valve 326, a regulator 328, a second pressure gauge 332, and a flow meter 334 in order from the outlet 258 side. .

  The first valve 322 and the second valve 326 are controlled to be “open” when the heat medium is supplied to the heat exchanger 210, and are controlled to be “closed” when the heat medium is not supplied to the heat exchanger 210. Further, the regulator 328 lowers the pressure of the heat medium raised to a predetermined value by the pump 230 to a desired pressure. The first pressure gauge 324 detects the pressure of the heat medium before the pressure is reduced by the regulator 328. The second pressure gauge 332 detects the pressure of the heat medium after the pressure is reduced by the regulator 328. The flow meter 334 detects the flow rate of the heat medium supplied to the heat exchanger 210.

  The outlet 256 and the inlet 254 are connected by a circulation pipe 350. In the circulation pipe 350, a flow meter 352, a pressure gauge 354, and a valve 356 are provided in this order from the outlet 256 side. Further, a temperature controller 220 is provided in a flow path between the discharge port 230-2 and the outlet 256 of the pump 230. When the valve 356 is controlled to be “open”, the temperature of the heat medium discharged from the discharge port 230-2 is controlled (temperature rise) by the temperature controller 220 when passing through the temperature controller 220, and the outlet 256. Then, the heat medium returns to the suction port 230-1 of the pump 230 again through the circulation pipe 350.

  That is, the pump 230 sucks the heat medium stored in the buffer container 240 through the connection port 242 and circulates the sucked heat medium with the temperature controller 220 using the circulation pipe 350. Control the temperature of the medium. Then, the pump 230 discharges the heat medium whose temperature is controlled by the temperature controller 220 by circulation to the heat medium inlet of the heat exchanger 210 via the heat medium supply pipe 320.

  The flow meter 352 detects the flow rate of the heat medium flowing through the circulation pipe 350. The pressure gauge 354 detects the pressure of the heat medium flowing through the circulation pipe 350. The valve 356 is controlled to “open” when the temperature of the heating medium is controlled using the temperature controller 220, and is controlled to be “closed” when the temperature of the heating medium is not controlled using the temperature controller 220. .

  An outflow pipe 341 is connected to the heat medium outlet 214 of the heat exchanger 210. The heat medium flowing out from the heat medium outlet 214 flows into the buffer container 240 through the outflow pipe 341 and is stored in the buffer container 240.

  The connection port 242 and the inflow port 252 of the buffer container 240 are connected by a suction pipe 340. A valve 342 is connected to the suction pipe 340. When the pump 230 sucks the heat medium from the buffer container 240, the valve 342 is controlled to be “open”.

  In the present embodiment, the buffer container 240 communicates with the atmosphere through an opening formed in a part or the whole of the upper surface of the housing, for example. Thereby, the inside of the buffer container 240 is opened to atmospheric pressure. On the other hand, the heat medium is pressurized by the pump 230 and supplied to the heat exchanger 210.

  Therefore, since the pressure in the buffer container 240 is maintained at atmospheric pressure, the heat medium flowing out from the heat medium outlet 214 smoothly flows into the buffer container 240. As a result, it is possible to suppress an increase in the back pressure of the heat exchanger 210 as compared with the case where the heat medium after heat exchange is directly sucked by the pump 230. Therefore, even if the casing of the heat exchanger 210 is thinned to reduce the weight of the heat exchanger 210, the heat exchanger 210 can be prevented from being damaged or deformed.

  In addition to this, in the present embodiment, the heat medium stored in the buffer container 240 is circulated to the pump 230 and reused. Therefore, the energy of the heated heat medium is effectively utilized, and the heat exchanger 210 is used. It becomes easy to stabilize the temperature of the heat medium supplied to the desired temperature.

  Next, a modification of the polishing apparatus temperature control system of the first embodiment will be described. FIG. 4 is a diagram showing a schematic configuration of a modification of the polishing apparatus temperature control system of the first embodiment. In the modification of FIG. 4, a supply pipe 320 that supplies a heat medium from the temperature adjustment device 250 to the heat exchanger 210 includes a first hand valve 422, a second hand valve 424, a flow meter 426, and a thermocouple 462. Is provided.

  The first hand valve 422 is a valve whose opening degree is controlled in order to control the flow rate of the heat medium flowing through the supply pipe 320. The second hand valve 424 is a valve for turning on / off the supply pipe 320. The flow meter 426 detects the flow rate of the heat medium flowing through the supply pipe 320. The thermocouple 462 detects the temperature of the heat medium at the heat medium inlet 212 of the heat exchanger 210.

  In this modification, a chiller 540 is provided instead of the buffer container 240. The chiller 540 has a temperature controller for preheating the heat medium. The water that has flowed into the temperature adjustment device 250 flows into the chiller 540 through the cooling water pipe 450. The cooling water pipe 450 is provided with a valve 452. The valve 452 is controlled to be “open” when the factory water is sent to the chiller 540, and is controlled to be “closed” when the water is not sent to the chiller 540.

The temperature adjustment device 250 and the chiller 540 are connected by a temperature raising pipe 430. The temperature increasing pipe 430 is provided with a temperature increasing valve 432. The temperature raising valve 432 is controlled to be “open” until the temperature of the heat medium is raised to a predetermined temperature by the chiller 540, and is closed when the temperature of the heat medium is raised to the predetermined temperature. Be controlled.

  The temperature adjustment device 250 raises the temperature of the heat medium raised by the chiller 540 to a predetermined temperature, and then supplies the heat medium to the heat exchanger 210 via the supply pipe 320.

  Also in this modification, a buffer container 240 that is open to atmospheric pressure is provided inside the chiller 540. The heat medium flowing out from the heat medium outlet 214 of the heat exchanger 210 flows into the buffer container 240 through the outflow pipe 341. The chiller 540 preheats the heat medium stored in the buffer container 240. The outflow pipe 341 is provided with a thermocouple 464. The thermocouple 464 detects the temperature of the heat medium at the heat medium outlet 214 of the heat exchanger 210.

  According to this modification, the pressure in the buffer container 240 is maintained at atmospheric pressure, so that the heat medium flowing out from the heat medium outlet 214 flows into the buffer container 240 smoothly. As a result, it is possible to suppress an increase in the back pressure of the heat exchanger 210 as compared with the case where the heat medium after heat exchange is directly sucked by the pump 230. Therefore, even if the casing of the heat exchanger 210 is thinned to reduce the weight of the heat exchanger 210, the heat exchanger 210 can be prevented from being damaged or deformed.

  Next, experimental results such as the heat medium temperature at the heat medium inlet 212 of the heat exchanger 210 and the heat medium temperature at the heat medium outlet 214 when this modification is used will be described. FIG. 5 shows the heat medium temperature at the inlet of the heat exchanger and the heat medium temperature at the outlet when a heat medium of 3.5 L / min is discharged from the pump in a modification of the polishing apparatus temperature control system of the first embodiment. It is a figure which shows the flow volume of a heating medium and a time series.

  In FIG. 5, the horizontal axis indicates the passage of time (sec), and the left vertical axis indicates the heat medium temperature at the heat medium inlet 212 of the heat exchanger 210 and the heat medium temperature (° C.) at the heat medium outlet 214. The right vertical axis indicates the flow rate (L / min) of the heat medium.

  A graph 510 shows the heat medium temperature (supply temperature) at the heat medium inlet 212 of the heat exchanger 210, and a graph 520 shows the heat medium temperature (return temperature) at the heat medium outlet 214 of the heat exchanger 210. Yes. As shown in FIG. 5, when about 20 (sec) has elapsed from the start of supply of the heat medium, the supply temperature is maintained at about 80 ° C.

  This indicates that desired temperature control can be performed on the polishing pad 108 in a relatively short time of about 20 (sec) from the start of supply of the heat medium. As described above, according to the present embodiment, the heat medium stored in the buffer container 240 is circulated to the pump 230 and reused, so that the energy of the heated heat medium is effectively utilized and the heat exchanger is used. It becomes easy to stabilize the temperature of the heat medium supplied to 210 to a desired temperature.

  A graph 530 indicates the flow rate of the heat medium detected by the flow meter 426. As shown in the graph 530, the flow rate of the heat medium pulsates at a predetermined cycle. This is because the flow rate of the heat medium flowing through the supply pipe 320 is synchronized with the ON / OFF control of the valve 452. This is thought to be due to an increase or decrease.

  Next, experimental results when the flow rate of the pump 230 is changed with the same configuration will be described. FIG. 6 shows the heat medium temperature at the inlet of the heat exchanger and the heat medium temperature at the outlet when a heat medium of 7 L / min is discharged from the pump in a modification of the polishing apparatus temperature control system of the first embodiment. It is a figure shown in time series.

In FIG. 6, a graph 510 shows the heat medium temperature (at the heat medium inlet 212 of the heat exchanger 210 (
The graph 520 shows the heat medium temperature (return temperature) at the heat medium outlet 214 of the heat exchanger 210. As shown in FIG. 6, when about 5 (sec) elapses from the start of supply of the heat medium, the supply temperature is maintained at about 80 ° C.

  This indicates that desired temperature control can be performed on the polishing pad 108 in a relatively short time of about 5 (sec) from the start of supply of the heat medium. As described above, according to the present embodiment, the heat medium stored in the buffer container 240 is circulated to the pump 230 and reused, so that the energy of the heated heat medium is effectively utilized and the heat exchanger is used. It becomes easy to stabilize the temperature of the heat medium supplied to 210 to a desired temperature. The supply temperature rises faster as the flow rate of the heat medium increases. However, if the flow rate is too high, the back pressure of the heat exchanger 210 may increase. The supply flow rate of the heat medium to the heat exchanger 210 does not need to be increased if the temperature of the heat medium can be appropriately controlled, and the temperature of the heat medium is easily stabilized.

(Second Embodiment)
Next, the polishing apparatus temperature control system of the second embodiment will be described. FIG. 7 is a diagram showing a schematic configuration of a polishing apparatus temperature control system of the second embodiment. The second embodiment is different from the first embodiment in that the heat medium is supplied from the buffer container 240 to the heat exchanger 210. Since other configurations are the same as those in the first embodiment, description thereof will be omitted.

  In the first embodiment, the example in which the heat medium is directly supplied from the temperature adjustment device 250 to the heat exchanger 210 has been described. On the other hand, as shown in FIG. 7, in the polishing apparatus temperature control system 300 of the second embodiment, the heat medium flows out from the temperature adjustment device 250 to the buffer container 240 and is stored in the buffer container 240. In the polishing apparatus temperature control system 300 according to the second embodiment, the heat medium stored in the buffer container 240 is supplied to the heat exchanger 210.

  That is, in the second embodiment, the pumps that supply the heat medium whose temperature is controlled by the temperature controller 220 to the heat medium inlet 212 of the heat exchanger 210 are the first pump 230-1 and the second pump 230-. 2 is comprised.

  The first pump 230-1 sucks the heat medium stored in the buffer container 240 through the connection port 242, controls the temperature of the sucked heat medium by the temperature controller 220, and buffers the temperature-controlled heat medium. Discharge into the container 240. The second pump 230-2 supplies the heat medium stored in the buffer container 240 to the heat medium inlet 212 of the heat exchanger 210.

  Also in the present embodiment, the buffer container 240 communicates with the atmosphere through, for example, an opening formed in a part or all of the upper surface of the housing. Thereby, the inside of the buffer container 240 is opened to atmospheric pressure. On the other hand, the heat medium is pressurized by the pump 230-2 and supplied to the heat exchanger 210.

  Therefore, since the pressure in the buffer container 240 is maintained at atmospheric pressure, the heat medium flowing out from the heat medium outlet 214 smoothly flows into the buffer container 240. As a result, it is possible to suppress an increase in the back pressure of the heat exchanger 210 as compared with the case where the heat medium after heat exchange is directly sucked by the pump 230. Therefore, even if the casing of the heat exchanger 210 is thinned to reduce the weight of the heat exchanger 210, the heat exchanger 210 can be prevented from being damaged or deformed.

  In addition to this, according to the present embodiment, the heat medium stored in the buffer container 240 is reused by using the first pump 230-1 and the second pump 230-2, so that the heated temperature is increased. The energy of the medium is effectively used, and the temperature of the heat medium supplied to the heat exchanger 210 is easily stabilized at a desired temperature.

  According to this embodiment, the pump 230-2 that supplies the heat medium to the heat exchanger 210 can operate independently of the pump 230-1, and changes the flow rate supplied to the heat exchanger 210. It is also possible. Thereby, the amount of heat of the heat medium transmitted from the heat exchanger 210 to the polishing pad 108 can be controlled. By providing the buffer container 240 with a temperature rising pump 230-1 in the container and a pump 230-2 for supplying to the heat exchanger 210 independently, temperature rising and temperature control of the heat exchanger can be performed. There is an advantage that it can be operated stably.

DESCRIPTION OF SYMBOLS 100 Polishing apparatus 102 Substrate 108 Polishing pad 110 Polishing table 200,300 Polishing apparatus temperature control system 210 Heat exchanger 212 Heat medium inlet 214 Heat medium outlet 220 Temperature controller 230 Pump 240 Buffer container 242 Connection port 250 Temperature adjustment apparatus

Claims (6)

A heat exchanger provided on a polishing pad for polishing a substrate, for exchanging heat with the polishing pad;
A temperature controller for controlling the temperature of the heat medium used in the heat exchanger;
A pump for supplying the heat medium whose temperature is controlled by the temperature controller to the heat medium inlet of the heat exchanger;
A buffer container for storing a heat medium that is kept at a pressure lower than atmospheric pressure and flows out from the heat medium outlet of the heat exchanger;
A polishing apparatus temperature control system comprising: The polishing apparatus temperature control system according to claim 1,
The buffer container is a container opened to atmospheric pressure,
A polishing apparatus temperature control system. In the polishing apparatus temperature control system according to claim 1 or 2,
The buffer container has a connection port connected to a heat medium suction port of the pump.
A polishing apparatus temperature control system. The polishing apparatus temperature control system according to claim 3,
The pump sucks the heat medium stored in the buffer container through the connection port, circulates the sucked heat medium with the temperature controller, and the temperature is controlled by the temperature controller by the circulation. A pump that discharges the controlled heat medium to the heat medium inlet of the heat exchanger;
A polishing apparatus temperature control system. The polishing apparatus temperature control system according to claim 3,
The pump sucks the heat medium stored in the buffer container through the connection port, controls the temperature of the sucked heat medium by the temperature controller, and sends the temperature-controlled heat medium to the buffer container. A first pump for discharging;
A second pump for supplying the heat medium stored in the buffer container to the heat medium inlet of the heat exchanger;
Having
A polishing apparatus temperature control system. The polishing apparatus temperature control system according to any one of claims 1 to 5, a polishing table on which the polishing pad is installed, a substrate holding unit that holds the substrate,
A polishing apparatus comprising: