JP2014187304A - Method of manufacturing multilayer ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic electronic component including a plurality of external electrodes formed on one surface of a ceramic element having an internal electrode, which allows for compaction and high capacity while enhancing productivity.SOLUTION: A laminate chip 50 in which a plurality of ceramic green sheets having an internal electrode pattern formed thereon are laminated, a plurality of lead-out electrode patterns for leading out the internal electrode pattern to different positions on one surface are formed, and the end of the internal electrode pattern is exposed on the surface other than the surface where the lead-out electrode pattern is led out, is prepared. The surface of the laminate chip 50, where the lead-out electrode pattern is led out, is sucked by a suction plate 52, and the laminate chip 50 is immersed in a ceramic paste tank 54, thus covering the exposed portion of the internal electrode pattern with ceramic paste.

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and more particularly to a method for manufacturing a multilayer ceramic electronic component in which a plurality of external electrodes are formed on one surface of a ceramic body having internal electrodes.

  In recent years, mobile electronic devices have been miniaturized. A large number of monolithic ceramic electronic components are mounted on mobile electronic devices, but with the miniaturization of mobile electronic devices, miniaturization of monolithic ceramic electronic components is also required. Furthermore, in a multilayer ceramic electronic component in which external electrodes are formed on both end faces of a ceramic body having internal electrodes, it is like a mountain skirt between the external electrodes and the wiring pattern to be mounted on the wiring pattern of the circuit board. It is necessary to form a spreading solder fillet. Therefore, it is necessary to form a wiring pattern on the circuit board larger from the end face of the multilayer ceramic electronic component by the solder fillet, and the mounting space for the multilayer ceramic electronic component is increased. However, along with the miniaturization of mobile electronic devices, in addition to the miniaturization of multilayer ceramic electronic components, it is also required to reduce the mounting space by reducing the mounting interval between components mounted on a circuit board. Yes.

  Therefore, as shown in FIG. 10, a multilayer ceramic electronic component 1 in which the internal electrode 2 is formed so as to be perpendicular to the mounting surface on the circuit board, and the internal electrode 2 is drawn out to the external electrode 3 formed on the mounting surface. There is. In such a multilayer ceramic electronic component 1, since it can be mounted on the wiring pattern of the circuit board by the external electrode 3 formed on one mounting surface, a solder fillet extending outward from the end of the multilayer ceramic electronic component is unnecessary. Therefore, the mounting space of the multilayer ceramic electronic component 1 can be reduced (see Patent Document 1).

  However, in multilayer ceramic capacitors and the like, not only miniaturization of parts and reduction of mounting space are required, but also increase in capacity is required, and it is required to increase the capacity without changing standard dimensions. Therefore, as shown in FIG. 11, the dimension of the laminated ceramic green sheet 4 in the width direction W and the dimension of the internal electrode pattern 5 in the width direction W are the same, and the end portion of the internal electrode pattern 5 is exposed on the side surface. There is a method of forming a multilayer ceramic capacitor using the ceramic multilayer body 6. In this method, as shown in FIG. 12, the ceramic laminate 6 is held by the holder 7, and the ceramic green sheet 8 is attached to the exposed surface of the internal electrode pattern 5 on both sides in the width direction W of the ceramic laminate 6. The ceramic body is formed by firing this. In the obtained ceramic body, the outside of the end portion of the internal electrode is covered by the side margin region where the adhered ceramic green sheet 8 is fired, and insulation at the end portion in the width direction of the ceramic body is ensured. The Here, by reducing the thickness of the side margin region, the internal electrode can be enlarged even with a ceramic body having standard dimensions, and a large-capacity multilayer ceramic capacitor can be obtained (Patent Document) 2).

Japanese Patent Laid-Open No. 10-289837 JP-A-6-349669

  However, in the method of attaching the ceramic green sheet to the surface where the end portion of the internal electrode pattern is exposed, it is necessary to apply the ceramic green sheet to all the surfaces where the internal electrode pattern is exposed other than the surface on which the external electrode is formed. . For example, when external electrodes are formed on opposite end faces of a ceramic laminate as in Patent Document 2, ceramic green sheets are attached to two opposing side surfaces of the ceramic laminate where the ends of the internal electrode pattern are exposed. There is a problem that it is necessary and productivity decreases.

  In addition, as shown in FIG. 10, in a multilayer ceramic electronic component in which internal electrodes are drawn on one surface of a ceramic laminate in order to form two external electrodes on one surface of the ceramic body, three surfaces are provided. When the end portion of the internal electrode is exposed, it is necessary to affix ceramic green sheets on the three surfaces of the ceramic laminate, which further reduces productivity.

  Therefore, a main object of the present invention is a method for manufacturing a multilayer ceramic electronic component in which a plurality of external electrodes are formed on one surface of a ceramic body having internal electrodes. It is an object of the present invention to provide a method for manufacturing a multilayer ceramic electronic component capable of increasing the capacity.

The present invention relates to a ceramic body having a plurality of internal electrodes stacked inside, a plurality of extraction electrodes for drawing internal electrodes to different positions on one surface of the ceramic body, and a surface of the ceramic body. A method of manufacturing a multilayer ceramic electronic component including a plurality of external electrodes connected to a lead electrode in which a plurality of ceramic green sheets on which internal electrode patterns are formed are stacked, and the internal electrode patterns are different on one surface A step of preparing a multilayer chip in which a plurality of extraction electrode patterns to be drawn out to the position are formed and an end of the internal electrode pattern is exposed on a surface other than the surface from which the extraction electrode pattern is extracted; The process of adsorbing the surface from which the extraction electrode pattern is extracted with an adsorption plate and the laminated chip adsorbed by the adsorption plate By immersion in Kkupesuto bath and a step of covering the exposed portions of the internal electrode pattern of a ceramic paste, a method of manufacturing a multilayer ceramic electronic part.
Internal electrode other than the surface from which the extraction electrode pattern is extracted by adsorbing the surface from which the extraction electrode pattern of the multilayer chip is extracted with an adsorption plate and immersing the multilayer chip adsorbed by the adsorption plate in a ceramic paste tank The exposed surface of the pattern can be covered with a ceramic paste. Here, even in a multilayer chip of the same size, the internal electrode pattern can be enlarged by thinning the ceramic paste layer covering the exposed surface of the internal electrode pattern. Therefore, by adopting this method for manufacturing a multilayer ceramic electronic component, a large-capacity multilayer electronic component having a predetermined size can be obtained.

In such a method of manufacturing a multilayer ceramic electronic component, further, a step of firing a multilayer chip in which an exposed portion of the internal electrode pattern is covered with a ceramic paste to form a ceramic body having an internal electrode and a lead electrode; Forming an external electrode connected to an extraction electrode drawn on one surface of the ceramic body.
A ceramic body having an internal electrode and an extraction electrode is formed by firing the multilayer chip manufactured by the method as described above, and an external electrode connected to the extraction electrode is formed, thereby forming a multilayer ceramic electronic component Can be obtained.

The external electrode can be formed by applying, drying and baking an electrode paste on the portion of the ceramic body from which the extraction electrode has been extracted, or by plating or sputtering.
As a method for forming the external electrode, a method such as electrode paste baking, plating, or sputtering can be employed.

The step of preparing the laminate chip includes a step of forming a mother laminate by laminating a plurality of ceramic green sheets on which a conductive paste layer having a predetermined shape is formed, a portion having no conductive paste layer, and a conductive layer. By cutting the mother laminate so that the continuous portion of the conductive paste layer is alternately cut, a surface with the exposed electrode pattern exposed is formed, and the mother laminate is formed by the continuous portion of the conductive paste layer. And a step of obtaining a laminated chip on which a surface where the end portion of the internal electrode pattern is exposed is formed by cutting.
A mother laminate can be obtained by laminating a plurality of ceramic green sheets on which a conductive paste layer having a predetermined shape is formed. By cutting the mother laminate, a laminate chip having an internal electrode pattern and a lead electrode pattern can be obtained. At this time, the end of the conductive paste layer is not exposed on the surface where the portion without the conductive paste layer is cut, and the end of the conductive paste layer is on the surface where the portion where the conductive paste layer is continuous is exposed. Exposed. Therefore, the exposed surface of the internal electrode pattern and the exposed surface of the extraction electrode pattern can be formed by cutting the mother laminate at a portion where the conductive paste layer is continuous.

Furthermore, in the step of preparing the multilayer chip, it is possible to prepare a multilayer chip in which adjacent internal electrode patterns are drawn to two different positions by the extraction electrode.
By using such a multilayer chip, a multilayer ceramic capacitor in which a capacitance is formed between two external electrodes can be obtained.

  According to the present invention, it is possible to cover all surfaces exposed with the internal electrode pattern with the ceramic paste simply by immersing the multilayer chip adsorbed by the suction plate in the ceramic paste tank, and it is easy to manufacture the multilayer ceramic electronic component. Can be done. Further, by thinning the ceramic paste layer covering the exposed surface of the internal electrode pattern, a multilayer chip having a large internal electrode pattern can be obtained, and a large-capacity multilayer ceramic electronic component can be obtained.

  The above-described object, other objects, features, and advantages of the present invention will become more apparent from the following description of embodiments for carrying out the invention with reference to the drawings.

FIG. 1 is a perspective view showing a multilayer ceramic capacitor as an example of the multilayer ceramic electronic component manufactured by the method of the present invention. FIG. 2 is a front view of the multilayer ceramic capacitor shown in FIG. FIG. 3 is an exploded perspective view of the multilayer ceramic capacitor shown in FIGS. 1 and 2. FIG. 4 is a plan view showing a ceramic green sheet on which a conductive paste layer for manufacturing the multilayer ceramic capacitor shown in FIGS. 1 to 3 is formed. 5 (a) and 5 (b) are perspective views showing a laminated chip manufactured using the ceramic green sheet shown in FIG. FIG. 6 is an illustrative view showing a step of applying a ceramic paste to the exposed surface of the internal electrode pattern of the multilayer chip shown in FIG. FIG. 7 is an exploded perspective view of another multilayer ceramic capacitor manufactured by the method of the present invention. FIG. 8 is a plan view showing a ceramic green sheet on which a conductive paste layer for producing another multilayer ceramic capacitor shown in FIG. 7 is formed. FIGS. 9A and 9B are perspective views showing a laminated chip manufactured using the ceramic green sheet shown in FIG. FIG. 10 is an exploded perspective view showing an example of a conventional multilayer ceramic capacitor. FIG. 11 is a perspective view showing a ceramic laminate used to obtain another conventional multilayer ceramic capacitor. FIG. 12 is an illustrative view showing a step of attaching a ceramic green sheet to the internal electrode pattern exposed portion of the ceramic laminate shown in FIG.

  FIG. 1 is a perspective view showing a multilayer ceramic capacitor as an example of a multilayer ceramic electronic component manufactured by the method of the present invention, and FIG. 2 is a front view thereof. The multilayer ceramic capacitor 10 includes a rectangular parallelepiped ceramic body 12. The ceramic body 12 is formed with a first main surface 12a and a second main surface 12b facing each other along a longitudinal direction, and a first side surface 12c and a second side surface 12d facing each other. A first end surface 12e and a second end surface 12f that are opposed to each other are formed at both ends. The corners and ridges of the ceramic body 12 are preferably rounded.

As a ceramic material constituting the ceramic body 12, for example, a dielectric ceramic material mainly composed of BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , CaZrO ₃ or the like can be used. Moreover, you may use what added subcomponents, such as a Mn compound, Mg compound, Si compound, Co compound, Ni compound, rare earth compound, to these main components.

  Here, a multilayer ceramic capacitor is described. However, when a piezoelectric ceramic is used, the multilayer ceramic electronic component functions as a piezoelectric component, and when a semiconductor ceramic is used, the multilayer ceramic electronic component is a thermistor. When the magnetic ceramic is used, the multilayer ceramic electronic component functions as an inductor. In the case of a multilayer ceramic capacitor, an element body using an insulating resin or other insulating material can be used instead of ceramic.

  As shown in FIG. 3, a first internal electrode 14a and a second internal electrode 14b are formed inside the ceramic body 12. The first internal electrode 14a and the second internal electrode 14b each have a main surface that faces the first side surface 12c and the second side surface 12d of the ceramic body 12, and the first side surface 12c and the second side surface. They are stacked in the direction connecting 12d. Therefore, the first internal electrode 14a and the second internal electrode 14b are arranged perpendicular to the first main surface 12a and the second main surface 12b of the ceramic body 12. The first internal electrode 14a and the second internal electrode 14b are alternately stacked in the ceramic body 12, and the main surface of the first internal electrode 14a and the main surface of the second internal electrode 14b are opposed to each other. Are arranged as follows.

  The first internal electrode 14a and the second internal electrode 14b are drawn to the second main surface 12b of the ceramic body 12 by the first lead electrode 16a and the second lead electrode 16b, respectively. The first extraction electrode 16 a is extracted to the first end face 12 e side of the ceramic body 12. Note that the first extraction electrode 16a is preferably extracted at a position close to the first end face 12e side. Further, the second extraction electrode 16b is extracted to the second end face 12f side of the ceramic body 12 with a space from the first extraction electrode 16a. The second extraction electrode 16b is preferably extracted at a position close to the second end face 12f side. The first internal electrode 14a and the second internal electrode 14b are not exposed on the first main surface 12a, both side surfaces 12c, 12d, and both end surfaces 12e, 12f of the ceramic body 12.

  As a material of the internal electrodes 14a and 14b, for example, Ni, Cu, Ag, Pd, an Ag—Pd alloy, Au, or the like can be used. The thickness of the internal electrodes 14a, 14b is preferably 0.3 μm to 2.0 μm. Moreover, it is preferable that the space | interval between adjacent internal electrode 14a, 14b is 0.5 micrometer-10 micrometers.

  A first external electrode 18a and a second extraction electrode 18b are formed on the second main surface 12b of the ceramic body 12 so as to be connected to the first extraction electrode 16a and the second extraction electrode 16b. Is done. The first external electrode 18 a is formed along the first end surface 12 e on the second main surface 12 b of the ceramic body 12. The second external electrode 18b is formed along the second end surface 12f on the second main surface 12b of the ceramic body 12 at a distance from the first external electrode 18a.

  The first external electrode 18a and the second external electrode 18b are composed of, for example, a base layer and a plating layer. The underlayer is formed on the second main surface 12b of the ceramic body 12 so as to cover the exposed portions of the first extraction electrode 16a and the second extraction electrode 16b. The underlayer plays a role of making electrical connection with the exposed portions of the extraction electrodes 16a and 16b and sealing against moisture. The underlayer can be formed, for example, by baking an electrode paste film, but may be formed by a plating method, a sputtering method, or the like.

  When the base layer is formed by baking the electrode paste film, it is preferable to use an electrode paste containing a conductive metal and glass. When the underlayer is formed using an electrode paste containing glass, the glass component contained in the underlayer penetrates into the ceramic grain boundaries to increase the bonding strength between the ceramic body 12 and the external electrodes 18a and 18b. This contributes to improvement of the fixing force of the external electrodes 18a and 18b and prevention of moisture intrusion.

  For example, Cu, Ni, Ag, Pd, an Ag—Pd alloy, Au, or the like can be used as the conductive metal used in the electrode paste for forming the underlayer. Moreover, as a glass component used for this electrode paste, the glass containing B, Si, Ba, Mg, Al, Li, Zn etc. can be used, for example. The base layer is formed by applying an electrode paste to the end face of the ceramic body 12 before firing and firing, thereby forming the base layers of the external electrodes 18a and 18b simultaneously with the formation of the ceramic body 12 having the internal electrodes 14a and 14b. Can be formed by a cofire. The underlayer of the external electrodes 18a and 18b can also be formed by a postfire that applies and pastes an electrode paste on the end face of the ceramic body 12 after firing. The thickness of the base layer formed by baking the electrode paste is preferably 10 μm to 50 μm at the thickest portion.

  When the underlayer is formed by a plating method, for example, one kind of metal selected from the group consisting of Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, and Zn or an alloy containing the metal can be used. . When the underlayer is formed by a plating method, it is preferable that the underlayer does not contain a glass component, and the metal ratio of the plating film is preferably 99% by volume or more. For example, when Ni is used as the extraction electrodes 16a and 16b, it is preferable to use Cu having good bonding properties with Ni as the underlayer. The thickness of the underlayer formed by the plating method is preferably 1 to 15 μm.

  When the underlayer is formed by sputtering, for example, one kind of metal selected from the group consisting of Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, and Zn or an alloy containing the metal can be used. . The thickness of the base layer formed by sputtering is preferably 0.01 to 1.0 μm.

  A plating layer is formed on the base layer. As a material of the plating layer, for example, one kind of metal selected from the group consisting of Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, and Zn or an alloy containing the metal can be used. The plating layer may be formed of a plurality of layers, and preferably has a two-layer structure of a Ni plating layer and a Sn plating layer. The Ni plating layer has a solder barrier performance, and the Sn plating layer improves solder wettability. The thickness per plating film is preferably 1 to 10 μm. Furthermore, a conductive resin layer for stress relaxation may be formed between the base layer and the plating layer. As described above, the first external electrode 18a and the second internal electrode 14b are alternately stacked on the first internal electrode 14a and the second internal electrode 14b, which are alternately stacked via the first extraction electrode 16a and the second extraction electrode 16b. When the external electrodes 18b are connected, a capacitance is formed between the external electrodes 18a and 18b.

  In order to manufacture such a multilayer ceramic capacitor 10, a ceramic green sheet, a conductive paste for internal electrodes, and a conductive paste for external electrodes are prepared. The ceramic green sheet and various conductive pastes include a binder and a solvent, and a known organic binder or organic solvent can be used.

First, BaTiO ₃ , CaTiO ₃ , SrTiO ₃ or CaZrO ₃ as main components and Mn compound, Fe compound, Cr compound, Co compound or Ni compound as accessory components are weighed at a predetermined ratio and put into a ball mill. Wet preparation is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a dielectric ceramic powder. An organic binder and an organic solvent are added to the dielectric ceramic powder and mixed by a ball mill. The ceramic slurry thus obtained is formed into a sheet shape on a carrier sheet by the doctor blade method and dried to obtain a ceramic green sheet. The ceramic green sheet preferably has a thickness of 0.1 to 10 μm.

  A conductive paste layer is formed on the ceramic green sheet by printing the conductive paste in a predetermined pattern by, for example, screen printing. Specifically, a conductive paste layer is formed on a ceramic green sheet by applying a paste made of a conductive material by a method such as a screen printing method or a photolithography method. The paste made of a conductive material is, for example, obtained by adding an organic binder and an organic solvent to metal powder.

  As the conductive paste layer, for example, as shown in FIG. 4, the conductive paste layer 34 is formed on the ceramic green sheet 30 while leaving the rectangular blank portions 32 formed at predetermined intervals. In FIG. 4, the cut part after laminating | stacking a ceramic green sheet is shown with the dotted line. The cut portions of the ceramic green sheet 30 are set to be vertically and horizontally so as to cross the continuous portions of the blank portions 32 and the conductive paste layer 34 so as to intersect at the center of the blank portion 32. Further, another cut portion is set vertically and horizontally so as to pass through a continuous portion of the conductive paste layer 34 between the plurality of blank portions 32.

  When the ceramic green sheet 30 is cut at the cutting portion as shown in FIG. 4, the first internal electrode pattern 36a to be the first internal electrode 14a and the first lead electrode pattern to be the first lead electrode 16a The first region 40a in which 38a is formed, the second internal electrode pattern 36b to be the second internal electrode 14b, and the second region 40b in which the second lead electrode pattern 38b to be the second lead electrode 16b is formed And are formed. In the first region 40a, the first extraction electrode pattern 38a is drawn out to one end side of one side of the cut portion of the ceramic green sheet 30, and the first three sides of the cut portion are extended to the end portion thereof. An internal electrode pattern 36a is formed. Further, in the second region 40b, the second extraction electrode pattern 38b is drawn out to the other end side of one side of the cut portion of the ceramic green sheet 30, and the other three sides of the cut portion are extended to the end portion thereof. A second internal electrode pattern 36b is formed.

  A mother laminated body is formed using the ceramic green sheet 30 on which the conductive paste layer 34 is formed. In the mother laminate, the ceramic green sheets 30 on which the conductive paste layer is not formed are stacked, the ceramic green sheets 30 on which the conductive paste layer 34 is formed are stacked thereon, and the conductive paste layer is further formed. It is formed by laminating ceramic green sheets 30 that are not. At this time, the ceramic green sheets 30 are laminated so that the first regions 40a and the second regions 40b of the conductive paste layer 34 are adjacent and alternately overlap each other. A mother laminate can be obtained by pressing this laminate in the lamination direction by a method such as isostatic pressing.

  By cutting the mother laminated body so that the ceramic green sheets 30 laminated at the cutting portion shown in FIG. 4 are cut, the laminated body chip 50 is formed. Here, since the first regions 40a and the second regions 40b of the conductive paste layer 34 are alternately stacked, when the ceramic green sheet 30 having the conductive paste layer 34 shown in FIG. 4 is used, A laminate in which the first internal electrode pattern 36a and the second internal electrode pattern 36b face each other, and the first extraction electrode pattern 38a and the second extraction electrode pattern 38b are extracted to both ends of one cut surface. The body chip 50 is obtained. In this multilayer chip 50, as shown in FIGS. 5A and 5B, the first extraction electrode pattern 38a and the second extraction electrode pattern 38b are alternately extracted in the stacking direction on one cut surface. It becomes the composition. That is, the first extraction electrode pattern 38a is drawn every other layer on one end side of one cut surface of the multilayer chip 50, and the second is extracted every other layer on the other end side of one cut surface of the multilayer chip 50. The lead electrode pattern 38b is drawn out. On the other three cut surfaces of the multilayer chip 50, the first internal electrode patterns 36a and the second internal electrode patterns 36b are alternately exposed in the stacking direction.

  The surface from which the extraction electrode patterns 38a and 38b of the multilayer chip 50 thus obtained are extracted is adsorbed to the adsorption plate 52 as shown in FIG. As the suction plate 52, for example, an adhesive plate or a suction plate using air can be used. As shown in FIG. 6, the laminate chip 50 adsorbed on the adsorption plate 52 is immersed in the ceramic paste in the ceramic paste tank 54. Thereafter, the ceramic chip is applied to a surface other than the surface adsorbed by the adsorption plate 52 by pulling up the multilayer chip 50. Thereby, the surface where the internal electrode patterns 36a and 36b of the multilayer chip 50 are exposed is covered with the ceramic paste. As the ceramic paste used here, the same one used for forming the ceramic green sheet 30 may be used, or a separately prepared ceramic paste may be used.

  The ceramic element having the first and second internal electrodes 14a, 14b and the first and second lead electrodes 16a, 16b is obtained by removing the suction plate 52 from the laminated chip 50 coated with the ceramic paste and firing it. A body 12 is formed. A base layer for the first and second external electrodes 18a and 18b is formed on the second main surface 12b of the ceramic body 12 so as to cover the first and second lead electrodes 16a and 16b. The

  In order to form the base layer, for example, an electrode paste is applied to the exposed portions of the first and second extraction electrodes 16a and 16b and baked. At this time, the baking temperature is preferably 700 to 900 ° C. If necessary, one or more plating films are formed on the base layer to form the first and second external electrodes 18a, 18b.

  Further, in order to form the underlayer, the exposed portions of the first and second extraction electrodes 16a and 16b may be plated. Either electroplating or electroless plating can be used for the plating process, but electroless plating requires pretreatment with a catalyst to improve the plating deposition rate, and the process is complicated. There are disadvantages. Therefore, it is usually preferable to employ electrolytic plating. As the plating method, barrel plating is preferably used. If necessary, one or more plating films are formed on the base layer to form the first and second external electrodes 18a, 18b.

  Further, a sputtering method may be employed to form the underlayer. In this case, a mask in which a hole is formed in the shape of the underlying layer to be formed is prepared, and the laminated chip 50 is disposed in the hole so that the exposed surfaces of the extraction electrodes 16a and 16b are aligned, and this is installed in a vacuum chamber. Then, the vacuum chamber is evacuated, and then argon gas is injected into the vacuum chamber, and a high electric field is applied to attach the target metal to the multilayer chip 50. Here, the thickness of the underlayer is adjusted by adjusting sputtering conditions such as time. If necessary, one or more plating films are formed on the base layer to form the first and second external electrodes 18a, 18b.

  In this way, the multilayer ceramic capacitor 10 is obtained. In order to obtain the ceramic body 12, the exposed surfaces of the first and second lead electrode patterns 38a, 38b of the multilayer chip 50 are sucked by the suction plate 52, By immersing the multilayer chip 50 in the ceramic paste tank 54, the exposed surfaces of the first and second internal electrode patterns 36a and 36b can be covered with the ceramic paste at a time. Therefore, it is not time-consuming as in the case where ceramic green sheets are adhered to the plurality of exposed surfaces of the first and second internal electrode patterns 36a and 36b, and the productivity of the multilayer ceramic capacitor 10 can be improved. .

  Further, by reducing the thickness of the ceramic paste covering the first and second internal electrode patterns 36a and 36b, the multilayer chip 50 can be enlarged when obtaining the multilayer ceramic capacitor 10 of a predetermined size. . As a result, the first and second internal electrode patterns 36a and 36b can be enlarged to increase the facing area, and a large-capacity multilayer ceramic capacitor 10 can be obtained even if it has a predetermined size.

  Of course, in this multilayer ceramic capacitor 10, since the first external electrode 18 a and the second external electrode 18 b are formed on one surface of the ceramic body 12, the ceramic body 12 is mounted when mounted on the circuit board. There is no need to form solder fillets at the ends. Therefore, the interval between adjacent elements can be reduced, and the mounting area of the elements can be reduced.

  As shown in FIG. 7, the first dummy electrode 20a is formed in the same layer as the first internal electrode 14a and the first extraction electrode 16a, and the second internal electrode 14b and the second extraction electrode 16b The second dummy electrode 20b may be formed on the same layer. The first dummy electrode 20a is formed at a position corresponding to the second lead electrode 16b laminated adjacently, and the second dummy electrode 20b is a position corresponding to the first lead electrode 16a laminated adjacently. Formed. Here, the first dummy electrode 20a and the second dummy electrode 20b are not connected to the first internal electrode 14a and the second internal electrode 14b, and do not contribute to the formation of capacitance. is there.

  In such a multilayer ceramic capacitor 10, the first external electrode 18a is formed so as to be connected to the first extraction electrode 16a and the second dummy electrode 20b. The second external electrode 18b is formed so as to be connected to the second extraction electrode 16b and the first dummy electrode 20a.

  In order to obtain such a multilayer ceramic capacitor 10, when forming the mother multilayer body 50, as shown in FIG. 8, the conductive paste layer is left on the ceramic green sheet 30, leaving a rectangular wave-shaped blank portion 32. 34 is formed. When such a conductive paste layer 34 is formed, a cut portion connecting the central portion of the peak of the rectangular wave-shaped blank portion 32 and a cut portion connecting the central portion of the valley are set. Here, the conductive paste layer The portions where no conductive paste exists and the portions where the conductive paste layer 34 continues are cut alternately. In addition, a cutting portion connecting the rising portion and the central portion of the falling portion of the rectangular wave-shaped blank portion 32 is set, and here, the portion without the conductive paste layer and the portion where the conductive paste layer 34 is continuous are alternately arranged. Disconnected. Further, another cut portion is set so that the conductive paste layer 34 between the rectangular wave-shaped blank portions 32 passes through a continuous portion.

  When the conductive paste layer 34 having such a pattern is formed, in the first region 40a, the first lead electrode pattern 38a is drawn to one end side of one side of the cut portion of the ceramic green sheet 30, A first dummy electrode pattern 42a having the same shape as the first lead electrode pattern 38a is drawn to the other end side. Furthermore, first internal electrode patterns 36a are formed on the other three sides of the cut portion up to the end portions. In the second region 40b, the second lead electrode pattern 38b is drawn to one end side of one side of the cut portion of the ceramic green sheet 30, and the same shape as the second lead electrode pattern 38b is drawn to the other end side. The second dummy electrode pattern 42b is drawn out. Further, second internal electrode patterns 36b of the conductive paste layer 34 are formed on the other three sides of the cut portion up to the end portions.

  When the ceramic green sheet 30 having such a conductive paste layer 34 is used, the first internal electrode pattern 36a and the second internal electrode pattern 36b face each other, and the first lead electrode pattern 38a, The multilayer chip 50 in which the second lead electrode pattern 38b, the first dummy electrode pattern 42a, and the second dummy electrode pattern 42b are drawn to both ends of one cut surface is obtained. In this multilayer chip 50, as shown in FIGS. 9A and 9B, the first extraction electrode pattern 38a and the second dummy electrode pattern 42b are alternately extracted on one end side of one cut surface. The second lead electrode pattern 38b and the first dummy electrode pattern 42a are alternately drawn on the other end side of the same cut surface. Therefore, compared with the multilayer chip 50 shown in FIG. 5, in the multilayer chip 50 shown in FIG. 9, the density of the drawn electrode pattern is doubled at both ends of one cut surface. On the other three cut surfaces of the multilayer chip 50, the first internal electrode patterns 36a and the second internal electrode patterns 36b are alternately exposed in the stacking direction.

  Also in this multilayer chip 50, the surface from which the first and second extraction electrode patterns 38a and 38b and the first and second dummy electrode patterns 42a and 42b are extracted is adsorbed by the adsorption plate 52 and is adsorbed to the ceramic paste tank 54. Soaked. Thereby, the ceramic paste can be applied to all exposed surfaces of the first internal electrode pattern 36a and the second internal electrode pattern 36b at a time.

  By firing the multilayer chip 50 coated with the ceramic paste in this way, the first and second internal electrodes 14a, 14b, the first and second extraction electrodes 16a, 16b, the first and second The ceramic body 12 having the dummy electrodes 20a and 20b can be obtained. Then, the first external electrode 18a is formed so as to be connected to the first extraction electrode 16a and the second dummy electrode 20b, and is connected to the second extraction electrode 16b and the first dummy electrode 20a. The multilayer ceramic capacitor 10 is obtained by forming the second external electrode 18b.

  As described above, even when the ceramic element body 12 on which the first and second dummy electrodes 20a and 20b are formed is used, it is possible to obtain a large-capacity multilayer ceramic capacitor 10 with good productivity. When such a ceramic body 12 is used, the distance between the first extraction electrode 16a and the second dummy electrode 20b is small, and the distance between the second extraction electrode 16b and the first dummy electrode 20a is small. Therefore, in particular, when the base layer of the external electrodes 18a and 18b is formed by a plating method, it is easy to deposit by plating, which is advantageous for forming the external electrodes 18a and 18b.

DESCRIPTION OF SYMBOLS 10 Multilayer ceramic capacitor 12 Ceramic body 14a 1st internal electrode 14b 2nd internal electrode 16a 1st extraction electrode 16b 2nd extraction electrode 18a 1st external electrode 18b 2nd external electrode 20a 1st dummy electrode 20b 2nd dummy electrode 30 Ceramic green sheet 34 Conductive paste layer 36a 1st internal electrode pattern 36b 2nd internal electrode pattern 38a 1st extraction electrode pattern 38b 2nd extraction electrode pattern 40a 1st area | region 40b 2nd 2 region 42a First dummy electrode pattern 42b Second dummy electrode pattern 50 Laminate chip 52 Adsorption plate 54 Ceramic paste tank

Claims (3)

In a ceramic body having a plurality of internal electrodes stacked inside, a plurality of extraction electrodes for pulling out the internal electrodes to different positions on one surface of the ceramic body, and a surface of the ceramic body A method for producing a multilayer ceramic electronic component comprising a plurality of external electrodes connected to the extraction electrode,
A plurality of ceramic green sheets each having an internal electrode pattern formed thereon are laminated to form a plurality of extraction electrode patterns for extracting the internal electrode pattern to different positions on one surface, and the extraction electrode pattern is extracted. Preparing a laminate chip in which an end of the internal electrode pattern is exposed on a surface other than the surface;
A step of adsorbing the surface of the multilayer chip from which the extraction electrode pattern is extracted with an adsorption plate; and an exposed portion of the internal electrode pattern by immersing the multilayer chip adsorbed by the adsorption plate in a ceramic paste tank A method for producing a multilayer ceramic electronic component, comprising a step of covering the substrate with a ceramic paste. Firing the multilayer chip with the exposed portion of the internal electrode pattern covered with a ceramic paste to form the ceramic body having the internal electrode and the extraction electrode; and on one surface of the ceramic body The manufacturing method of the multilayer ceramic electronic component of Claim 1 including the process of forming the said external electrode connected to the said extraction electrode pulled out.   3. The multilayer ceramic according to claim 2, wherein the external electrode is formed by applying, drying and baking an electrode paste on a portion of the ceramic body from which the extraction electrode is extracted, or by plating or sputtering. Manufacturing method of electronic components.

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