JP2014186928A - Lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device which maintains good luminous efficiency of a semiconductor light emitting element by a relatively simple structure.SOLUTION: A lighting device includes: a mounting substrate 6 on which an LED 61 is mounted; and a light guide plate 9 which is disposed along a surface of the mounting surface 6 and guides an outgoing beam of the LED 61. A sealing member 8 is placed between the mounting substrate 6 and the light guide plate 9 so as to closely contact with the mounting substrate 6 and the light guide plate 9. The sealing member 8 shields the atmosphere around the LED 61 from outer air.

Description

  The present invention relates to an illumination device using a semiconductor light emitting element such as an LED (Light Emitting Device) as a light source.

2. Description of the Related Art In recent years, illumination devices that use semiconductor light emitting elements such as LEDs as light sources have become widespread (see, for example, Patent Document 1).
FIG. 9 shows a configuration example of a conventional desk stand type lighting device 1x. The illuminating device 1x includes a base 2x, an arm 3x erected on the base 2x, and a head 4x disposed at one end of the arm 3x. The head 4x incorporates a mounting board formed by mounting a plurality of LEDs on the surface of the board.

FIG. 10 shows a configuration example of the LED. The LED 61 includes a substrate 610, a plurality of lead plates 611 disposed on the substrate 610, a chip 613 mounted on the lead plate 611, a bonding wire 614 that electrically connects the chip 613 and the lead plate 611, and a reflective member 615 and a sealing resin 617 that covers the reflective surface 616 of the reflective member 615 and the chip 613.
When the lighting device 1 x is driven, the light emitted from the chip 613 is reflected by the reflecting surface 616 of the reflecting member 615 and is emitted to the outside through the sealing resin 617. Thereby, the emitted light from LED61 is utilized as illumination light.

JP 2006-12755 A

An illumination device using a semiconductor light emitting element as a light source is required to exhibit good light emission efficiency, but has the following problems.
The sealing resin 617 of the LED 61 has a property of passing some air. When air enters the vicinity of the LED 61 from the outside of the head 4x, the air also enters the inside of the sealing resin 617. The air finally reaches the reflecting surface 616 of the reflecting member 615. Usually, since air contains a small amount of sulfur compound such as sulfur dioxide (SO ₂ ), when the reflecting surface 616 is made of a material containing silver, the sulfur compound in the air is separated from the silver on the reflecting surface 616. Can react. This reaction may generate a silver compound, and the reflective surface 616 may deteriorate (blacken). Thereby, with use of the lighting device, the reflection characteristics of the reflection member 615 may deteriorate with time, and the light emission efficiency of the LED 61 may be reduced. The same problem can also occur when a component such as a nitrogen compound contained in the air causes an unnecessary reaction with the reflecting surface 616.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an illuminating device capable of maintaining good light emission efficiency of a semiconductor light emitting element with a relatively simple configuration.

  In order to solve the above problems, one embodiment of the present invention is a mounting substrate including a substrate, a semiconductor light emitting element mounted on the surface of the substrate, and the semiconductor light emitting element disposed on the surface of the substrate so as to overlap with the semiconductor light emitting element. A light guide plate that guides the emitted light of the semiconductor light emitting element, and a reflective member that is disposed on the surface of the substrate so as to surround an outer periphery of the light guide plate and reflects the emitted light of the semiconductor light emitting element. And surrounding the semiconductor light emitting element in close contact with the light guide plate and the mounting substrate at intersections between the mounting substrate and the reflective member and between the reflective member and the outer periphery of the light guide plate. Thus, it is set as the structure by which the sealing member is arrange | positioned.

In another aspect of the present invention, the sealing member may be a packing or a gasket.
In another aspect of the present invention, the light guide plate may have a groove at a position facing the mounting substrate, and the sealing member may be fitted into the groove.
In another aspect of the present invention, it further comprises a base on which the mounting substrate is disposed on the surface, the mounting substrate being hermetically adhered to the surface of the base and having a hole penetrating in the thickness direction, Between the light guide plate and the base, the inside of the hole of the mounting substrate may be in communication with the atmosphere around the semiconductor light emitting element.

In another aspect of the present invention, the reflection member covers a peripheral portion of the light guide plate and is fixed to the base, and the light guide plate is interposed between the reflection member and the base via the sealing member. Then, by pressing the mounting substrate, the surface of the mounting substrate facing the base can be in pressure contact with the surface of the base.
In another aspect of the present invention, a plurality of the semiconductor light emitting elements are mounted on the surface of the substrate so as to form an annular element array, and the sealing member exists on the outer periphery of the annular element array It can also be.

In another aspect of the present invention, each of the outer circumferences of the mounting substrate and the light guide plate may be circular, and the peripheral edge may have a semi-parabolic cross-sectional shape.
In another aspect of the present invention, the reflection member may have a groove portion into which the sealing member is fitted.
In another aspect of the present invention, the light guide plate may further include a diffusion plate that is laminated on the upper surface of the light guide plate and diffuses light emitted from the semiconductor light emitting device.

In another aspect of the present invention, when the light guide plate and the mounting substrate are viewed in plan, the periphery of the light guide plate may be positioned directly above the semiconductor light emitting element.
In another aspect of the present invention, it may be configured to include a pedestal portion and an arm that is attached to the pedestal portion and supports the mounting substrate, the light guide plate, the sealing member, and the reflecting member.

  In the lighting device according to one embodiment of the present invention, the light guide plate is disposed so as to overlap the semiconductor light emitting element on the surface of the substrate, and the reflection member is disposed so as to surround the outer periphery of the light guide plate. For this reason, even if the emitted light incident on the light guide plate from the semiconductor light emitting element is emitted to the outside from the outer periphery of the light guide plate, the light is reflected by the reflecting member and incident again on the light guide plate, which can be used effectively. Accordingly, it is possible to prevent a decrease in light emission efficiency.

  Furthermore, the lighting device according to one embodiment of the present invention provides a semiconductor light-emitting element which is in close contact with the light guide plate and the mounting substrate at the intersections between the mounting substrate and the reflecting member and between the reflecting member and the outer periphery of the light guide plate. A sealing member surrounding the. Therefore, even when the semiconductor light emitting element includes a reflective surface made of a material containing silver, it is possible to prevent the outside air from reaching the reflective surface via the sealing resin of the semiconductor light emitting element and degrading the reflective surface. Moreover, if a sealing member is arrange | positioned in the intersection of a mounting board | substrate and a reflection member, and between the reflection member and the outer periphery of a light-guide plate, it is not necessary to arrange | position a several sealing member in a different location.

  As a result, it is possible to provide an illuminating device capable of maintaining good light emission efficiency of the semiconductor light emitting element with a relatively simple configuration.

External appearance block diagram of lighting apparatus 1 according to Embodiment 1 as viewed obliquely from above External appearance view of the lighting device 1 viewed from obliquely below Exploded view showing the internal configuration of the light source unit 40 A perspective sectional view showing an internal configuration of the light source unit 40 Partial sectional view showing the internal configuration of the light source unit 40 Partial sectional view for explaining the sealing effect of lighting device 1 Partial sectional view for explaining the light guide effect of lighting device 1 The fragmentary sectional view which shows the internal structure of 40 A of light source units of the illuminating device which concerns on Embodiment 2. FIG. External configuration diagram of conventional lighting device 1x Sectional drawing which shows the structural example of LED61

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
<Embodiment 1>
Illumination device 1 of Embodiment 1 is shown in FIGS. The illumination device 1 includes a base (pedestal part) 2, an arm 3, and a head (illumination part) 4.
[Base 2]
The base 2 incorporates a weight (weight) inside, and enables the lighting device 1 to be stably placed so as not to fall on the desk. As an example, the base 2 has an annular appearance. As shown in FIG. 2, the wiring 2a is extended from the back side of the base 2, and is electrically connected to an external commercial power source. When the lighting device 1 is driven, power is supplied to the operation unit 3c and the head 4 from an external commercial power supply via the wiring 2a.
[Arm 3]
The arm 3 is a movable support body that supports the head 4, and includes a first arm 3a and a second arm 3b. A head 4 is disposed at one end of the first arm 3a. The other end of the first arm 3a and one end of the second arm 3b are connected to each other to form a hinge 3e. The other end of the second arm 3b is connected to one end of the base 2 to form a hinge 3d. Thereby, for example, when the user pulls the arm 3 close to the hand, the arm 3 extends to the user side.

An operation unit 3c is provided on the side surface of the second arm 3b. Operating portion 3c and the power button 3c ₁ of pushbutton consists electrostatic dimming portion 3c ₂ Prefecture. When the user presses the power button 3c _1, it allows the on / off operation of the lighting device 1. Also, when sliding a finger on a user dimming section 3c _2, it enables dimming of the head 4 is.
[Head 4]
As shown in FIG. 2, the head 4 is disposed at one end of the first arm 3a with the main emission direction facing downward. A light source unit 40 is built in the head 4. The configuration of the light source unit 40 is shown in FIGS. 3, 4, and 5. The light source unit 40 has a thin disk-like appearance as a whole. As an internal configuration, the light source unit 40 includes a heat sink 5, a mounting substrate 6, a diffuse reflection sheet 7, a sealing member 8, a light guide plate 9, a diffusion cover 10, a reflection member 11, and a plurality of screws B. Have
(I) Heat sink 5
The heat radiating plate 5 is a base in the light source unit 40 and radiates heat generated by driving the LEDs 61 of the mounting substrate 6. As an example of the material of the heat sink 5, a metal material having excellent heat capacity such as iron or aluminum can be given. The heat radiating plate 5 includes a convex portion 51 disposed in the center of the surface facing the mounting substrate 6 (the upper surface of the paper in FIG. 3), and a flat portion 50 disposed around the convex portion 51. The substrate 51 of the mounting substrate 6 is inserted into the convex portion 51 and the diffuse reflection sheet 7 is disposed. The mounting substrate 6 is disposed on the flat portion 50. A plurality of female screws 52 are arranged around the flat portion 50 at intervals.
(Ii) Mounting board 6
The mounting substrate 6 includes a substrate 60, a plurality of LEDs 61, a connector 62, and wiring 63.

  The substrate 60 has an annular shape, and is mainly composed of a glass composite material as an example. A wiring pattern (not shown) for electrically connecting the LEDs 61 in series is formed on the upper surface 60 </ b> A of the substrate 60. The lower surface 60B of the substrate 60 is flat and is arranged so as to be in thermal contact with the flat portion 50 of the heat sink 5 in surface contact. Inside the light source unit 40, the inside of the central hole of the substrate 60 (the gap between the substrate 60 and the convex portion 51) communicates with the atmosphere Q of the LED 61 (see FIG. 5). The substrate 60 may be configured using a known flexible substrate. The inner diameter of the substrate 60 matches the outer diameter of the convex portion 51.

  The LED 61 is an example of a semiconductor light emitting element, and is an illumination light source in the illumination device 1. The LED 61 is covered with a sealing resin 617 in a state where the chip 63 mounted on the upper surface 60A with the upper (Z) direction as the main emission direction is surrounded by the reflecting member 615 (the LED 61 in FIGS. 5 and 10). See). When the substrate 60 is viewed in plan, a plurality of LEDs 61 (here, 18) are mounted at regular intervals on the upper surface 60A of the substrate 60 so as to form an annular element array.

An electrical element other than the LED 61 such as a resistance element is also mounted on the upper surface 60A of the substrate 60.
The connector 62 is mounted on the upper surface 60 </ b> A of the substrate 60 and electrically connects each LED 61 and the wiring 63. The connector 62 is formed of an injection molded product using a resin material such as PP (polypropylene) or PE (polyethylene). A conductive member (not shown) is disposed inside the connector 62.

The wiring 63 is configured by covering an axial lead wire with an insulating member, and one end thereof is electrically connected to the wiring pattern of the substrate 60. The other end of the wiring 63 is inserted into the first arm 3a and the second arm 3b, and is electrically connected to the operation unit 3c.
In the lighting device 1, the wiring 63 can be directly electrically connected to the wiring pattern without using the connector 62.
(Iii) Diffuse reflection sheet 7
The diffuse reflection sheet 7 reflects the light of the LED 61 that has returned from the light guide plate 9 to the front again to produce outgoing light. The diffuse reflection sheet 7 is a sheet obtained by mixing a white pigment in a resin material such as PET (polyethylene terephthalate).
(Iv) Light guide plate 9
The light guide plate 9 guides the emitted light of the LED 61 to the entire inside of the plate and emits the same as surface light emission to the outside. The light guide plate 9 is formed by dispersing a diffusing material in a resin material having a constant refractive index, for example, an acrylic resin such as PC (polycarbonate) or PMMA (polymethyl methacrylate) resin. The light guide plate 9 has a disk shape as an example, and includes a main surface portion 90, a peripheral edge portion 91, a flange portion 92, and a groove portion 93. The light guide plate 9 is disposed on the surface of the mounting substrate 6 via the diffuse reflection sheet 7 so as to overlap the LEDs 61.

  The main surface portion 90 is a main portion of the light guide plate 9, and has an upper surface 90 </ b> A that emits emitted light and a lower surface 90 </ b> B (a surface facing the diffuse reflection sheet 7) on which light is incident from the LED 61. The lower surface 90B of the main surface 90 is generally flat, but microscopically is subjected to fine unevenness processing (texture processing) based on a printing method or the like, and the light guided from the LED 61 is diffusely reflected throughout the plate. It is intended to be diffusible.

  The peripheral edge portion 91 exists around the entire main surface portion 90 and has a parabolic cross-sectional shape in which the thickness decreases toward the edge. Accordingly, the peripheral edge 91 has a lens structure. In the light source unit 40, the peripheral edge portion 91 is disposed at a position overlapping the LED 61. However, when the light source unit 40 is viewed in plan, the peripheral edge portion 91 is covered with the reflecting member 11. This makes it difficult to visually recognize the mounting position of the LED 61 from the outside, and suppresses luminance unevenness (graininess) that may be caused by direct emission of high-luminance light emission from the mounting position of the LED 61.

If the thickness of the light guide plate 9 is increased, the curvature of the peripheral edge portion 91 can be reduced, and the light reflection efficiency is improved. Therefore, when the light guide plate 9 is formed by injection molding using a resin material, it is desirable to make the curvature of the peripheral edge portion 91 as small as possible.
The flange portion 92 exists on the entire periphery of the peripheral edge portion 91 and is disposed so as to overlap the upper surface 60 </ b> A of the substrate 60.

The groove 93 is provided at a position facing the mounting substrate 6 in the light guide plate 9. Specifically, the groove portion 93 has a fan-shaped cross-sectional shape formed by indenting the outer peripheral side surface of the flange portion 92 inward as shown in FIG. A part of the sealing member 8 is fitted in the groove 93.
(V) Sealing member 8
The sealing member 8 closes between the mounting substrate 6 and the light guide plate 9 and between the light guide plate 9 and the reflection member 11 on the outer periphery of the peripheral edge portion 91 of the light guide plate 9 and surrounds each LED 61. Placed in. Thereby, the atmosphere Q of each LED 61 on the upper surface 60A of the substrate 60 is shut off from the outside air. The sealing member 8 is a gasket as an example, and more specifically an O-ring. As the material of the gasket, a known elastomer material or resin material can be used. For example, nitrile rubber, silicone rubber, acrylic rubber, fluorine rubber such as polytetrafluoroethylene (PTFE), styrene rubber, ethylene propylene (EP) rubber such as EPDM (ethylene propylene rubber containing a small amount of diene monomer), Examples thereof include styrene butadiene (SB) rubber. The sealing member 8 has a circular cross-sectional shape with a wire diameter of 2 mm as a size example, and is configured in an endless annular shape whose inner diameter is slightly smaller than the diameter of the groove portion 93 of the light guide plate 9. The sealing member 8 is fitted into the groove portion 93 on the outer periphery of the peripheral edge portion 91 of the light guide plate 9 in a forced fit state. In this state, the sealing member 8 is in close contact with the light guide plate 9, the reflecting member 11, and the upper surface 60 of the substrate 60 of the mounting substrate 6.
(Vi) Diffusion cover 10
The diffusion cover 10 uniformly diffuses the emitted light of the LED 61 that is incident from the main surface portion 90 of the light guide plate 9 to produce surface emission with less luminance unevenness. The diffusion cover 10 is made of, for example, a resin material such as acrylic and is disposed so as to overlap the upper surface 90 </ b> A of the main surface portion 90 of the light guide plate 9. The diffusion cover 10 can be colored, for example, blue for the purpose of adjusting the light emission of the LED 61. When the diffusion cover 10 is blue, the yellow component can be removed from the light emitting component of the LED 61.
(Vii) Reflecting member 11
The reflection member 11 reflects the light leaked to the outside from the peripheral edge portion 91 of the light guide plate 9 again to the light guide plate 9 so that it can be used for surface emission. The reflection member 11 is a means (front surface) for holding the mounting substrate 6, the diffuse reflection sheet 7, the sealing member 8, the light guide plate 9, and the diffusion cover 10 in the light source unit 40 and the heat sink 5. It is also used as a cover. The reflection member 11 is disposed on the upper surface 60 </ b> A of the mounting substrate 6 so as to surround the outer periphery of the light guide plate 9 and cover the peripheral edge 91.

The reflecting member 11 is configured by mixing a white pigment with a resin material having excellent heat resistance, for example. The reflecting member 11 has an annular shape and includes an opening 110, a plurality of through holes 111, and a notch 112.
The opening 110 irradiates light emitted from the diffusion cover 10 to the outside.
Each through hole 111 is formed at a position overlapping the female screw 52 of the heat sink 5, and the male screw B is screwed to the female screw 52 through the through hole 111. Thereby, the reflecting member 11 is fixed to the heat sink 5.

The notch 112 exposes the connector 62 to the outside.
As shown in FIGS. 4 and 5, the reflecting member 11 has a reflecting portion 113 on the back surface of the reflecting member 11 at the periphery of the opening 110. The reflecting portion 113 has a curved surface shape that matches the peripheral edge portion 91 of the light guide plate 9, and is disposed to face the peripheral edge portion 91.
On the outer periphery of the reflection portion 113, a groove portion 114 is present at a position facing the groove portion 93 of the light guide plate 9 with the sealing member 8 interposed therebetween. A part of the sealing member 8 exposed from the groove portion 93 is fitted into the groove portion 114. As shown in FIG. 5, the remaining portion of the sealing member 8 that protrudes from the groove portions 93 and 114 is exposed in the thickness (Z) direction of the light source unit 40. For this reason, when the male screw B is tightened into the female screw 52 through the through hole 111, the light guide plate 9 presses the mounting substrate 6 through the sealing member 8, and the sealing member 8 is connected to the upper surface 60A of the substrate 60. In close contact. As a result, at the intersections between the mounting substrate 6 and the reflecting member 11 and between the reflecting member 11 and the outer periphery of the light guide plate 9, the LED 61 is sealed so as to be in close contact with the light guide plate 9 and the mounting substrate 6. A stop member 8 is arranged. On the other hand, as the male screw B is tightened, the sealing member 8 presses the substrate 60 downward, and the lower surface 60 </ b> B of the substrate 60 is brought into pressure contact with the surface of the flat portion 50 of the radiator plate 5. Thereby, in the light source unit 40, the atmosphere Q of the LED 61 is blocked from the outside air.
(About the effect of the lighting device 1)
In the illumination device 1, the following various effects can be expected.

[Sealing effect by sealing member 8]
As shown in FIG. 6, in the lighting device 1, the sealing member 8 is in close contact with the reflecting member 11 in the region M ₁ in the groove 114, in close contact with the light guide plate 9 in the region M ₂ in the groove 93, and the upper surface 60 </ _b > A. The upper region M ₃ is in close contact with the substrate 60. Further, by tightening the male screw B into the female screw 52, the substrate 60 is in surface contact with the flat portion 50 of the heat sink 5 in the region M ₄ on the lower surface 60B of the substrate 60 (here, the entire region of the lower surface 60B). .

Therefore, even if outside air enters the light source unit 40 through the gap G ₁ between the reflecting member 11 and the heat sink 5, the entry path R ₁ along the upper surface 60A of the substrate 60 and the lower surface 60B. It is blocked both the entry pathway R ₂ taken along. Further, outside air enters the light source unit 40 through the gap G ₂ between the diffusion cover 10 and the opening 110 of the reflecting member 11 and the gap G ₃ between the peripheral edge portion 91 and the reflecting portion 113. also, intrusion path R ₃ passing through the gaps G _2, G ₃ is blocked. Therefore, the atmosphere Q of the LED 61 is isolated from the outside air and kept airtight.

  Therefore, for example, even when the LED 61 includes the reflection member 615 having the reflection surface 616 made of a material containing silver, the outside air enters the reflection surface 616 of the reflection member 615 in the sealing resin 617 and degrades the reflection surface 616. Can be prevented. Thereby, even when a sulfur compound, a nitrogen compound, etc. are contained in air, it can prevent that the reflective surface 616 deteriorates. As a result, the luminous efficiency of the LED 61 can be maintained well.

  When the LED 61 is on, the atmospheric pressure of the atmosphere Q rises because air is heated and expanded. Further, when the LED 61 is turned off, the atmospheric pressure of the atmosphere Q decreases because the air is cooled and contracts. As the air expands and contracts, the atmosphere Q can be prevented from contacting the outside air even if the pressure of the atmosphere Q varies with respect to the outside air pressure. Thereby, the illuminating device which can expect the luminous efficiency excellent over a long term can be provided.

In addition, since the light guide plate 9 has the groove portion 93, the sealing member 8 can be fitted in the groove portion 93 in advance in the manufacturing process, and can be easily disposed between the light guide plate 9 and the mounting substrate 6. The sealing member 8 can be easily positioned with respect to 60A. Therefore, it is possible to prevent a decrease in the yield of the manufacturing process and to manufacture the lighting device 1 satisfactorily.
Furthermore, in the illuminating device 1, as illustrated in FIG. 6, the sealing member 8 is disposed at the intersection between the mounting substrate 6 and the reflecting member 11 and between the reflecting member 11 and the outer periphery of the light guide plate 9.
For this reason, it is not necessary to arrange the plurality of sealing members 8 at different locations of the light source unit 40 in order to close the outside air intrusion paths R ₁ and R ₃ .

As a result, an increase in the number of members can be prevented, and the lighting device 1 that can maintain the light emission efficiency of each LED 61 satisfactorily with a relatively simple configuration can be provided.
[Light guide effect by light guide plate 9]
When the lighting device 1 is driven, as shown in FIG. 7, the light L ₁ and L ₂ emitted from the LED 61 are incident on the light guide plate 9 from below the peripheral edge portion 91. The lights L ₁ and L ₂ are regularly reflected by the peripheral edge portion 91 and the reflection portion 113 and guided to the main surface portion 90 side. The lights L ₁ and L ₂ are reflected by the diffuse reflection sheet 7 and then the lights L ₁ and L ₂ are emitted from the main surface portion 90 to the outside. The lights L ₁ and L ₂ are diffused in the diffusion cover 10 and become illumination light.

Here, in the lighting device 1, the light guide plate 9 is disposed so as to overlap each LED 61, and the reflection member 11 is disposed so as to cover the peripheral edge 91 of the light guide plate 9, so that the light is incident on the light guide plate 9 from each LED 61. Even if the light L ₁ and L ₂ are emitted to the outside from the peripheral edge portion 91 of the light guide plate 9, the lights L ₁ and L ₂ are reflected by the reflection portion 113 and are incident on the light guide plate 9 again, and are effective as illumination light. Available. Accordingly, it is possible to prevent a decrease in luminous efficiency.

Moreover, in the illuminating device 1, since LED61 is covered with the reflection member 11 and it is hard to visually recognize from the outside, the brightness nonuniformity (graininess) in the light emission surface is reduced. On the other hand, by adopting the lens-shaped peripheral edge portion 91, the emitted light of the LED 61 is efficiently guided to the main surface portion 90 side like the lights L ₁ and L ₂ . Thereby, excellent surface emission can be expected.
Moreover, in the illuminating device 1, the optical path is shortened by arrange | positioning the spreading | diffusion cover 10 which is a light emission surface, and the upper surface 60A of the board | substrate 60 which is a mounting surface of LED61 overlapping. For this reason, the light source unit 40 can be made compact and thin.

In addition, as shown in FIG. 7, when the thickness D (Z-direction thickness) of the flange portion 92 is sufficiently reduced, the emitted light L ₃ emitted from the LED 61 toward the flange portion 92 during driving may be diffusely reflected. This is desirable because the optical path can be shortened and the improvement in light extraction efficiency can be expected.
Hereinafter, another embodiment of the present invention will be described focusing on differences from the first embodiment.
<Embodiment 2>
FIG. 8 is an enlarged cross-sectional view around the light guide plate 9A in the light source unit 40A of the lighting apparatus according to Embodiment 2. In the second embodiment, as a difference from the first embodiment, a sealing member 8A having a rectangular cross section is used. As an example, the sealing member 8A is a packing made of an elastomer material. The light guide plate 9A and the reflective member 11A have the same basic structure as the light guide plate 9 and the reflective member 11 of the first embodiment, but are different in that each has a groove portion 93A, 114A that matches the shape of the sealing member 8A. .

In the second embodiment, the same effect as in the first embodiment can be expected. Further, by employing the rectangular cross-section sealing member 8A, any one side surface of the sealing member 8A can be surely brought into surface contact with the upper surface 60A of the substrate 60 and the groove portions 93A and 114A. The atmosphere Q can be effectively shielded from the outside air and kept airtight.
<Other matters>
In each of the above embodiments, the disk-shaped light source units 40 and 40A are shown. However, the light source units 40 and 40A are not limited to a disk shape, and are, for example, rectangular (rectangular or the like), polygonal, or elliptical. Also good. In this case, the shape of the light guide plate 9 is not limited to a disc shape, and may be a rectangular shape or a polygonal shape according to the shape of the light source units 40 and 40A. Further, the shape of the base 2 is not limited, and may be any one of a cylindrical shape, a polygonal cylindrical shape, a columnar shape, a polygonal columnar shape, a conical shape, a polygonal pyramid shape, an irregular shape such as a dome shape or a heart side. .

The arm 3 is not limited to the configuration having the hinges 3d and 3e shown in FIG. For example, the arm 3 may be configured by a single columnar or shaft-shaped member as the arm 3x in FIG.
In the light source unit 40, it is desirable that the peripheral edge portion 91 and the reflecting portion 113 are sufficiently close to each other because the light reflection efficiency in the vicinity of the peripheral edge portion 91 is increased. Specifically, it is preferable that the peripheral edge portion 91 and the reflection portion 113 are in close contact with each other or are disposed close to each other at a distance of 0.5 mm or less (particularly 0.3 mm or less).

In each of the above embodiments, a desk stand type lighting device has been shown. However, the lighting device of each aspect of the present invention is not limited to a desk stand type. For example, an illumination device such as a ceiling type or a downlight type may be used.
The semiconductor light emitting device used in the present invention is not limited to an LED. Other semiconductor light emitting elements can also be used as the semiconductor light emitting element of the present invention. For example, an organic EL (Electro-Luminescence) element, an LD (Laser Diode), or the like may be used alone or in combination.

  The substrate 60 of the mounting substrate 6 is not limited to an annular shape, and may be a disk shape in which holes are omitted from the substrate 60 shown in FIG. If the sealing member 8 is disposed in close contact with the upper surface 60A of the substrate 60 and the lower surface 90B of the light guide plate 9 between the disk-shaped substrate 60 and the light guide plate 9, the atmosphere Q is defined as outside air. Can be shut off and kept airtight. In this case, if the convex portion 51 is omitted from the upper surface of the heat radiating plate 5, the substrate 60 can be fitted into the flat portion 50.

Between the lower surface 60B of the board | substrate 60 and the flat part 50, in order to improve both thermal conductivity and adhesiveness, you may arrange | position thermally conductive grease and a heat-transfer sheet | seat.
In the light guide plate 9, the flange portion 92 is not essential and may be omitted. In this case, the groove portion 93 can be directly provided on the outer periphery of the peripheral edge portion 91.
As the sealing members 8 and 8A, any one of a sealing material, a caulking agent, a filler, and the like can be used in addition to a gasket or packing such as an O-ring. As a filler, what contains at least any one of a thermosetting resin material, an energy-beam curable resin material, a silicone resin material, an epoxy resin material, and an elastomer material can be used.

The reflecting member 11 can also be configured by performing white coating on the surface of a member having a color other than white.
The effect of the present invention is obtained by disposing the sealing member 8 between the substrate 60 in the light source unit 40 and the light guide plate 9. For this reason, even if the external shape of the light source unit 40 and the shape of the arm incorporating the light source unit 40 are changed, the advantage of the present invention can be expected.

L _{1 to} L ₃ outgoing light _1, 1x illumination device 2, 2x base 3, 3x arm 4, 4x illumination unit 5 heat sink 6 mounting substrate 7 diffuse reflection sheet 8, 8A sealing member 9, 9A light guide plate 10 diffusion cover 11 , 11A Reflective member 40, 40A Light source unit 90 Main surface portion 91 Peripheral portion 92, 92A Flange portion 93, 93A Groove portion of light guide plate 113 Reflective portion 114, 114A Groove portion of reflective member

Claims (11)

A mounting substrate having a substrate and a semiconductor light emitting element mounted on the surface of the substrate;
A light guide plate that is disposed on the surface of the substrate so as to overlap the semiconductor light emitting element, and guides the emitted light of the semiconductor light emitting element;
A reflective member disposed on the surface of the substrate so as to surround an outer periphery of the light guide plate, and reflecting light emitted from the semiconductor light emitting element;
To surround the semiconductor light emitting element in close contact with the light guide plate and the mounting substrate at the intersection between the mounting substrate and the reflective member and between the reflective member and the outer periphery of the light guide plate, A lighting device, wherein a sealing member is disposed. The lighting device according to claim 1, wherein the sealing member is a packing or a gasket. The light guide plate has a groove at a position facing the mounting substrate,
The lighting device according to claim 1, wherein the sealing member is fitted in the groove. Further comprising a base on which the mounting substrate is disposed,
The mounting board is in airtight contact with the surface of the base and has a hole penetrating in the thickness direction;
The lighting device according to any one of claims 1 to 3, wherein an inside of a hole of the mounting substrate communicates with an atmosphere around the semiconductor light emitting element between the light guide plate and the base. The reflective member covers a peripheral edge of the light guide plate and is fixed to the base;
Between the reflecting member and the base, the light guide plate presses the mounting substrate via the sealing member, so that the surface of the mounting substrate facing the base is on the surface of the base. The lighting device according to claim 4, wherein the lighting device is press-contacted. A plurality of the semiconductor light emitting elements are mounted on the surface of the substrate so as to form an annular element array,
The lighting device according to claim 1, wherein the sealing member is present on an outer periphery of the annular element array. Each outer periphery of the mounting substrate and the light guide plate is circular,
The lighting device according to claim 1, wherein the peripheral portion has a semi-parabolic cross-sectional shape. The lighting device according to claim 1, wherein the reflecting member has a groove portion into which the sealing member is fitted. The lighting device according to claim 1, further comprising a diffusion plate that is laminated on an upper surface of the light guide plate and diffuses light emitted from the semiconductor light emitting element. When viewing the light guide plate and the mounting substrate in plan view,
The illuminating device according to claim 1, wherein a peripheral edge portion of the light guide plate is located immediately above the semiconductor light emitting element. The lighting device according to claim 1, further comprising: a pedestal portion and an arm that is attached to the pedestal portion and supports the mounting substrate, the light guide plate, the sealing member, and the reflecting member.

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