JP2014175221A - Light source for lighting and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source for lighting which achieves short assembly time and high heat radiation performance.SOLUTION: A light source for lighting includes: a support base 40 having an opening and attached to a lighting device 110; and a substrate 20 which has a first main surface provided with a light emitting section 21, a second main surface 24 that is a surface opposite to the first main surface, and end parts 25a, 25b supported by inner peripheral surfaces 35a, 35b of the opening. The second main surface is flush with an attachment surface 34 of the support base 40 that is attached to the lighting device 110 or protrudes to the lighting device 110 side relative to the attachment surface 34.

Description

  The present invention relates to an illumination light source in which a light emitting element such as an LED is used as a light source, and an illumination device including the illumination light source.

  2. Description of the Related Art Conventionally, an LED lamp, which is a disk-shaped or flat-shaped illumination light source using a light emitting diode (LED) as a light source, has been proposed (for example, see Patent Document 1).

  Such an LED lamp generally includes a substrate on which a light emitting element is provided, a support base that supports the substrate, and a housing. Moreover, it is common that the board | substrate and a support stand are adhere | attached with an adhesive material.

US Patent Application Publication No. 2012/0236532

  In the LED lamp as described above, it is necessary to provide time for drying the adhesive in the assembly process. For this reason, it is a problem that it takes time to assemble the LED lamp. In addition, the adhesive may become a thermal resistance, and the heat dissipation of the substrate may be hindered.

  An object of the present invention is to provide an illumination light source having a short assembly time and high heat dissipation, and an illumination device including the illumination light source in consideration of the above-described conventional problems.

  In order to achieve the above object, an illumination light source according to an aspect of the present invention includes an opening, a support base attached to a lighting fixture, a first main surface on which a light emitting element is provided, and the first main surface. And a substrate having an end portion supported by the inner peripheral surface of the opening, and the second main surface is attached to the lighting fixture of the support base. It is flush with the mounting surface, which is a surface to be mounted, or protrudes closer to the luminaire side than the mounting surface.

  Moreover, the said edge part of the said board | substrate is a taper shape, contact | abuts with the internal peripheral surface of the said taper-shaped opening part corresponding to the said taper shape, and may be supported by the internal peripheral surface of the said opening part.

  Moreover, the said edge part of the said board | substrate is step shape, may contact | abut with the internal peripheral surface of the said opening part of the staircase shape corresponding to the said step shape, and may be supported by the internal peripheral surface of the said opening part.

  Furthermore, a holding member that supports the first main surface of the substrate may be provided, and the end portion of the substrate may be supported by the inner peripheral surface of the opening from the second main surface side.

  Further, the holding member further presses the substrate from the first main surface side of the substrate, and the second main surface of the substrate pressed by the holding member is more than the mounting surface than the mounting surface. When the support base is attached to the lighting fixture, the second main surface of the substrate may be flush with the mounting surface and pressed against the lighting fixture by the holding member.

  Furthermore, a housing that covers at least a part of a region of the first main surface of the substrate where no light emitting element is provided may be provided, and the holding member may be formed integrally with the housing.

  The holding member may be formed integrally with the support base.

  Further, the casing and the support base may be engaged by a claw portion provided on the casing or the support base.

  Moreover, the illuminating device which concerns on 1 aspect of this invention is equipped with the light source for illumination of the said any one aspect, and the said lighting fixture.

  According to the present invention, it is possible to provide an illumination light source having a short assembly time and high heat dissipation, and an illumination device including the illumination light source.

External perspective view of LED unit according to Embodiment 1 as seen from the front External perspective view of LED unit according to Embodiment 1 as seen from the rear 1 is an exploded perspective view of an LED unit according to Embodiment 1. FIG. Schematic sectional view of a conventional LED unit Schematic cross-sectional view of the LED unit according to Embodiment 1 Illustration for explaining creepage distance Schematic cross-sectional view of an LED unit having a configuration in which the second main surface protrudes closer to the lighting fixture than the mounting surface Schematic cross-sectional view of an LED unit where the end of the substrate is stepped Schematic cross-sectional view of an LED unit having a tapered shape in which the end of the substrate is different from that in FIG. Sectional drawing which shows the structure outline | summary of the illuminating device which concerns on Embodiment 2. FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an illumination light source and an illumination device according to embodiments of the present invention will be described with reference to the drawings. Each figure is a schematic diagram and is not necessarily illustrated exactly.

  Each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangement positions, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements not described in the independent claims are described as arbitrary constituent elements.

  In the following embodiments, an LED unit (LED lamp) will be described as an example of an illumination light source.

(Embodiment 1)
First, a schematic configuration of the LED unit according to Embodiment 1 will be described with reference to FIGS. 1A, 1B, and 2. FIG.

  1A and 1B are external perspective views of an LED unit according to Embodiment 1. FIG.

  2 is an exploded perspective view of the LED unit according to Embodiment 1. FIG.

  In FIG. 1A, FIG. 1B, and FIG. 2, the side from which the light is extracted from the LED unit 1 (hereinafter referred to as the light irradiation side) is shown as the upper side. In the following description, the light irradiation side is the front side (front), the opposite side to the light irradiation side is the rear side (rear), and the direction intersecting the front-rear direction is the side.

  That is, the front-rear direction in the LED unit 1 is a direction parallel to the Z axis in the present embodiment, and the side in the LED unit 1 is a direction parallel to the XY plane in the present embodiment.

  As shown in FIG. 1A, FIG. 1B, and FIG. 2, the LED unit 1 is an illumination light source having a circular overall shape and a flat shape. The LED unit 1 is a device that emits light by being attached to a lighting fixture 110 as shown in FIG. 1A.

  Specifically, the LED unit 1 is an LED lamp having an outer diameter of 30 mm to 150 mm and a height of about 10 mm to 30 mm, for example.

  The LED unit 1 in the present embodiment includes a main body 5 having a housing 10 and a support base 40 (pedestal), and a substrate 20.

  The casing 10 is a casing having an outer shape that is disposed on the light irradiation side (front) of the LED unit 1. The housing 10 has openings at the front and rear, and is connected to the support base 40 at the rear.

  In addition, the substrate 20 is disposed between the housing 10 and the support base 40. That is, the housing 10 is disposed so as to sandwich the substrate 20 in the front-rear direction with the support base 40. In the present embodiment, the main body 5 is constituted by the support base 40 and the housing 10.

  In the LED unit 1, the light emitting part 21 provided on the substrate 20 is exposed from the opening provided in the front part of the housing 10. In the housing 10, the peripheral portion of the light emitting unit 21 is a holding unit 19 (holding member). That is, the holding part 19 forms an opening provided in the front part of the housing 10. The holding unit 19 supports the substrate 20 from the front side and holds the substrate 20 in a state of being fitted into the opening 35.

  The housing 10 is formed of a resin housing made of a synthetic resin having insulation properties such as PBT (polybutylene terephthalate).

  The main body portion 5 includes insertion holes 22 a and 22 b and two release holes 15.

  Each of the insertion holes 22a and 22b is a hole through which the end of the conductive member is inserted from the outside to the inside of the main body 5, and is provided on the side surface 10b of the housing 10 in the present embodiment.

  In the present embodiment, the end portion of the lead wire 122a extending from the lighting fixture is inserted into the insertion hole 22a, and the end portion of the lead wire 122b similarly extending from the lighting fixture is inserted into the insertion hole 22b.

  Each of the lead wires 122a and 122b is an example of a conductive member. One of the lead wires 122a and 122b is connected to the positive output terminal of the power supply circuit included in the lighting fixture, and the other is connected to the negative output terminal of the power supply circuit.

  The ends of each of the lead wires 122a and 122b are electric wires (single wires or soldered stranded wires) having no insulation coating, and have an outer diameter of about 0.5 mm to 2 mm, for example.

  The end portions of the lead wires 122a and 122b are detachably held by a lead wire holding portion (not shown) disposed inside the housing 10.

  The release hole 15 is a hole provided to release the holding of the end portion of the lead wire 122a (122b) by the lead wire holding portion by inserting the tip of a minus driver or the like.

  The main body 5 further includes recesses 12 and 13 provided in a recessed shape from the front surface 10 a that is the front surface of the housing 10. A mounting hole 12a (13a) through which a mounting member (for example, a screw) for mounting the LED unit 1 to the lighting fixture passes is formed on the bottom surface of the recess 12 (13).

  For example, as shown in FIG. 1A, the LED unit 1 is screwed to the luminaire 110 using the mounting holes 13 a of the two recesses 13 arranged inside the three recesses 12 in the housing 10. The LED unit 1 may be screwed to the luminaire using the mounting holes 12a of the three recesses 12 arranged along the outer periphery of the housing 10. In either case, the head of each screw is accommodated inside the recess 12 or 13.

  That is, the three recessed portions 12 (mounting holes 12a) and the two recessed portions 13 (mounting holes 13a) are provided to correspond the LED unit 1 to both the three-point stopper and the two-point stopper. Any one of them may be provided.

  The substrate 20 is a substrate provided with one or more light emitting elements such as semiconductor light emitting elements. The substrate 20 is, for example, a rectangular flat substrate, and is a first main surface (front surface) on which a light emitting element is provided and a surface opposite to the first main surface, and is connected to the support base 40. 2 main surfaces (back surface). In the present embodiment, the end portions (side surfaces, end surfaces) respectively corresponding to the four sides of the substrate 20 are tapered.

  Moreover, it is preferable to comprise the board | substrate 20 with a material with high heat conductivity, for example, it is comprised by the alumina substrate which consists of alumina.

  In addition to the alumina substrate, the substrate 20 may be another ceramic substrate such as aluminum nitride, a metal substrate such as aluminum or copper, a resin substrate, or a metal base substrate having a laminated structure of metal and resin. You can use it. The substrate 20 may be a high thermal conductive resin containing an inorganic filler. The shape of the substrate 20 may be a circle or a polygon other than a rectangle.

  The first main surface of the substrate 20 is provided with a light emitting unit 21 having one or more light emitting elements that emit light forward.

  Specifically, the light emitting unit 21 includes one or more LED chips 21a mounted on the substrate 20 and a sealing member 21b. The LED chip 21a is an example of a light emitting element, and is mounted on the first main surface of the substrate 20 by die bonding or the like. In the first embodiment, a plurality of LED chips 21 a are mounted so as to form four element rows substantially parallel to the short side direction of the substrate 20.

  As the LED chip 21a, for example, a blue LED chip that emits blue light having a center wavelength of 440 nm to 470 nm is used.

  The sealing member 21b is provided in a straight line shape substantially parallel to the short side direction of the substrate 20 so as to cover the four element rows. Examples of the sealing member 21b include a phosphor-containing resin made of a resin containing a phosphor that seals the LED chip 21a to protect the LED chip 21a and converts the wavelength of light from the LED chip 21a. .

  Specifically, as the sealing member 21b, for example, when the LED chip 21a is a blue LED, YAG (yttrium, aluminum, garnet) -based yellow phosphor particles are dispersed in a silicone resin in order to obtain white light. A phosphor-containing resin can be used. As a result, white light is emitted from the light emitting unit 21 (sealing member 21b) by yellow light wavelength-converted by the phosphor particles and blue light from the blue LED chip.

  Moreover, the outer diameter of the light emission part 21 is 5-50 mm, for example, and when the LED unit 1 is a 20W type LED lamp, the outer diameter of the light emission part 21 is 20 mm, for example.

  In addition, in this Embodiment, although the circular light emission part 21 was illustrated, the shape or structure of the light emission part 21 is not limited to a round thing. For example, a square shape may be adopted as the shape of the light emitting unit 21.

  Moreover, there is no limitation in particular in the aspect of sealing of the some LED chip 21a by the sealing member 21b. The sealing member 21b may seal the LED chips 21a for each element row as described above, or may collectively seal the LED chips 21a arranged in a matrix.

  Further, as shown in FIG. 2, connectors 23 a and 23 b are arranged at the end of the substrate 20. The connectors 23a and 23b are electrically connected to a lead wire holding portion (not shown) that holds the ends of the lead wires 122a and 122b by electric wires (not shown).

  That is, the LED chip 21a of the light emitting unit 21 is supplied with electric power from the lighting fixture via the holding unit and the connectors 23a and 23b, whereby the light emitting unit 21 emits light.

  The arrangement positions of the connectors 23a and 23b are not particularly limited, and the connectors 23a and 23b may be arranged anywhere on the board 20. Moreover, the board | substrate 20 does not need to be equipped with the connectors 23a and 23b, for example, the electric wire connected with the lead wire holding | maintenance part may be soldered to the board | substrate 20. FIG.

  The support base 40 is a pedestal to which the substrate 20 is attached. The support base 40 is provided with an opening 35. The shape of the opening 35 is a rectangle corresponding to the shape of the substrate 20. The substrate 20 is fitted into the opening 35. As shown in FIG. 1B, in the rear part of the LED unit 1, the second main surface of the substrate 20 is flush with the mounting surface 34 of the support base 40. The details of the positional relationship between the support base 40 and the substrate 20 will be described later.

  The support base 40 is provided with claw portions 18a and 18b. The claw portions 18a and 18b are flexible fitting piece-like claws, and are supported by the housing 10 by fitting with fitting portions (not shown) provided in the housing 10 corresponding to these. The stand 40 is held. Thereby, since the housing | casing 10 and the support stand 40 are simply hold | maintained without using a screw etc., there exists an advantage by which the assembly time of the LED unit 1 is shortened.

  In addition, the structure which hold | maintains the housing | casing 10 and the support stand 40 is not limited to such a structure, A claw part is provided in the housing | casing 10, and the structure by which the fitting part corresponding to these is provided in a support stand. It may be. Moreover, the structure by which the housing | casing 10 and the support stand 40 are screwed may be sufficient. In the present embodiment, the claw portions 18 a and 18 b are formed integrally with the support base 40, but may be configured as a separate member from the support base 40 and attached to the support base 40. The above configurations may be combined.

  The material of the support base 40 is typically resin or aluminum. Here, when a material having high thermal conductivity such as aluminum is adopted as the material of the support base 40, the support base 40 can enhance the heat dissipation through the support base 40 of the substrate 20. Further, the support base 40 may be a high thermal conductive resin containing an inorganic filler.

  Further, a heat conducting member for releasing heat to the lighting fixture side may be arranged on the rear surface of the support base 40. As the heat conducting member, for example, a rubber or resin sheet such as a silicon sheet or an acrylic sheet, a liquid member such as grease, or the like can be considered.

  Next, the characteristic configuration of the LED unit 1 will be described in comparison with a conventional example.

  FIG. 3 is a schematic cross-sectional view of a conventional LED unit 1a. FIG. 4 is a schematic cross-sectional view of the LED unit 1. 4 is a schematic cross-sectional view when the LED unit 1 is cut along a plane perpendicular to the substrate 20a through the line XX ′ shown in FIG. 1A, and FIG. 3 shows a conventional LED corresponding to this. It is a schematic cross section of the unit 1a.

  As shown in FIG. 3, in the conventional LED unit 1 a, the substrate 20 a and the support base 40 a are bonded by the adhesive 22. In such a case, it is necessary to provide time for drying the adhesive 22 in the assembly process. For this reason, in LED unit 1a, it is a subject that assembly takes time.

  Moreover, the illuminating device in which the LED unit 1a is attached to the luminaire 110 has two joint surfaces, that is, a joint surface between the substrate 20a and the support base 40a and a joint surface between the support base 40a and the light fixture 110. . Therefore, when the heat emitted by the light emission of the light emitting unit 21 is released (transferred) from the substrate 20a to the lighting fixture 110, it is a problem that these joint surfaces (interfaces) become thermal resistance. Furthermore, the adhesive 22 itself may become a thermal resistance.

  Therefore, as shown in FIG. 4, in the LED unit 1, the substrate 20 is fitted into the opening 35 in a state where the ends 25 a and 25 b of the substrate 20 are locked to the inner peripheral surfaces 35 a and 35 b of the opening 35, respectively. It is a feature. That is, the end portions 25 a and 25 b are characterized by being supported by the inner peripheral surfaces 35 a and 35 b of the opening 35.

  Thus, in the LED unit 1, since the board | substrate 20 and the support stand 40 are simply connected without using an adhesive material, the assembly time of the LED unit 1 is shortened compared with the LED unit 1a. Further, the cost for the adhesive is also reduced.

  Further, in the LED unit 1, the second main surface 24 of the substrate 20 is configured to be flush with an attachment surface 34 that is a surface attached to the lighting fixture 110 of the support base. Here, the flushness means that the flat surface defined by the second main surface 24 and the flat surface defined by the attachment surface 34 are the variation in assembly of the LED units 1 and the dimensions of the substrate 20 and the support base 40. This means that they are substantially in the same plane in consideration of tolerances and the like. The plane defined by the second main surface 24 and the plane defined by the attachment surface 34 do not mean that they are completely the same plane.

  Thereby, since the board | substrate 20 is in direct surface contact with the lighting fixture 110 in the 2nd main surface 24, the thermal resistance between the board | substrate 20 and the lighting fixture 110 is reduced. Therefore, the heat emitted by the light emission of the light emitting unit 21 can be efficiently released from the substrate 20 to the lighting fixture 110, and the heat dissipation of the LED unit 1 is enhanced. The increase in temperature of the substrate 20 contributes to luminance unevenness and luminance decrease of the light emitting unit 21 on the substrate 20. For this reason, the structure which makes the board | substrate 20 contact the lighting fixture 110 directly, and improves heat dissipation is useful.

  Hereinafter, the characteristic configuration of the LED unit 1 will be described in more detail with reference to FIG.

  The end 25 a is an end corresponding to one long side of the substrate 20, and the end 25 b is an end corresponding to the other long side of the substrate 20. As shown in FIG. 4, the tapered shape of the end portions 25a and 25b is symmetric such that the width in the short side direction (Y direction in FIG. 4) of the substrate 20 decreases from the front (light irradiation side) toward the rear. The taper shape has a typical taper angle.

  The inner peripheral surfaces 35a and 35b are inner peripheral surfaces that form the opening 35 (opening). The tapered shapes of the inner peripheral surfaces 35a and 35b are tapered shapes corresponding to the end portions 25a and 25b, respectively.

  Specifically, the tapered shape of the inner peripheral surfaces 35a and 35b is a tapered shape in which the opening diameter of the opening 35 in the Y direction in FIG. 4 decreases from the front to the rear.

  In the present embodiment, as shown in FIG. 4, the taper angle of the inner peripheral surface 35a and the taper angle of the end portion 25a are substantially the same, and the end portion 25a abuts on the inner peripheral surface 35a. Supported. The taper angle of the inner peripheral surface 35b and the taper angle of the end portion 25b are substantially the same, and the end portion 25b is supported in contact with the inner peripheral surface 35b.

  With the configuration as described above, the end portion 25a is locked to the inner peripheral surface 35a, and the end portion 25b is locked to the inner peripheral surface 35b. Therefore, when the support base 40 and the substrate 20 are placed with the light irradiation side facing upward, the substrate 20 does not fall off. Such a configuration has an advantage that a jig or the like for holding the substrate 20 is not required when the LED unit 1 is assembled. Moreover, the heat dissipation through the support base 40 of the board | substrate 20 can be improved by making edge part 25a and 25b and inner peripheral surface 35a and 35b contact | abut, respectively.

  Further, the substrate 20 is held in a state of being fitted in the opening 35 by the holding portion 19 which is a part of the housing 10. Here, the state in which the substrate 20 is fitted in the opening 35 means that at least a part of the substrate 20 is located in the opening 35 of the support base 40.

  Specifically, the holding unit 19 supports the substrate 20 from the first main surface side (light irradiation side) of the substrate 20 and restricts the movement of the substrate 20 to the light emitting side.

  On the other hand, as described above, the end portions 25a and 25b of the substrate 20 are supported by the inner peripheral surfaces 35a and 35b of the opening from the second main surface 24 side. That is, the substrate 20 is sandwiched and fixed by the support base 40 and the housing 10 provided with the holding unit 19. As described above, the housing 10 and the support base 40 are fixed by the claw portions 18 a and 18 b provided on the support base 40.

  With the configuration as described above, the assembly time is shortened and the LED unit 1 with high heat dissipation is realized. Although not shown, the end portions corresponding to the two short sides of the substrate 20 are also tapered like the end portions 25a and 25b, and the inner peripheral surface corresponding to these two end portions is also internal. Similar to the peripheral surfaces 35a and 35b, it is configured in a tapered shape.

  Note that the end of the substrate 20 having a tapered shape also has an effect of increasing the creeping distance (insulating distance) from the lighting fixture 110 to the end of the first main surface of the substrate 20.

  FIG. 5 is a diagram for explaining the creepage distance.

  As shown in FIG. 5, in the conventional board | substrate 20a, the creeping distance from the lighting fixture 110 to the edge of the 1st main surface of the board | substrate 20 is the distance L1 equivalent to the thickness of the board | substrate 20a.

  On the other hand, in the substrate 20 having a tapered end, when the thickness of the substrate 20 is the same, from the end of the second main surface 24 to which the lighting fixture 110 is attached to the end of the first main surface of the substrate 20. Is a distance L2 longer than the distance L1. Specifically, when the taper angle is 45 degrees, L2 = √2 × L1. That is, the creepage distance is extended in the substrate 20 as compared with the conventional substrate 20a.

  In the above description, the second main surface 24 is configured to be flush with the mounting surface 34, but the second main surface 24 protrudes closer to the lighting fixture 110 than the mounting surface 34. Also good.

  FIG. 6 is a schematic cross-sectional view of an LED unit having a configuration in which the second main surface protrudes closer to the lighting fixture 110 than the mounting surface. In FIG. 6, only the substrate 20b is different from the configuration shown in FIG. The width of the long side direction (X direction in the drawing) and the width of the short side direction (Y direction in the drawing) of the substrate 20 b are slightly shorter than those of the substrate 20.

  FIG. 6A is a diagram showing the LED unit 1b before being attached to the lighting fixture 110. FIG. In the state of FIG. 6A, the substrate 20 b is supported by the first main surface being pressed by the holding portion 19. Ends 28a and 28b of the substrate 20b are supported from the second main surface 24b side by inner peripheral surfaces 35a and 35b, respectively.

  In the state of FIG. 6A, when the substrate 20b is pushed from the second main surface 24b side, the second main surface 24b is being pushed by the deflection of the holding portion 19 (deflection of the housing 10). The substrate 20b moves to the light irradiation side. In other words, there is a so-called play structure.

  Therefore, as shown in FIG. 6B, when the LED unit 1 b is attached to the lighting fixture 110, the second main surface 24 b of the substrate 20 b is flush with the attachment surface 34 and is illuminated by the holding unit 19. Pressed against the instrument 110.

  Thereby, the 2nd main surface 24b of LED unit 1b can be stuck to lighting fixture 110, and the heat dissipation of LED unit 1b can further be improved.

  In FIG. 6, as an example, the configuration in which the second main surface 24b is pressed as described above is realized by reducing the width in the long side direction and the width in the short side direction of the substrate 20b. The above configuration can also be realized by other methods such as increasing the diameter of 35.

  For example, the structure which provides an elastic member between the holding | maintenance part 19 and the board | substrate 20b, and presses the 2nd main surface 24b using the elasticity of the said elastic member may be implement | achieved. Moreover, the structure which heightens the elasticity of the holding part 19 itself by shape | molding the holding part 19 thinly, and presses the 2nd main surface 24b using the elasticity of the holding part 19 itself may be implement | achieved. The elastic member in this case is, for example, a coil spring or a leaf spring.

  The LED units 1 and 1b according to Embodiment 1 have been described above. In the LED units 1 and 1b according to the first embodiment, the assembly time is shortened and the heat dissipation is improved. Further, the LED units 1 and 1b can be manufactured at a lower cost than a configuration using a conventional adhesive.

(Modification)
The present invention is not limited to the first embodiment.

  In Embodiment 1, the example in which the end portion of the substrate has a tapered shape has been described, but the shape of the end portion is not limited to such a shape. For example, the end of the substrate may be stepped.

  FIG. 7 is a schematic cross-sectional view of the LED unit 1c in which the end portion of the substrate has a staircase shape. In FIG. 7, the shape of the end portion of the substrate 20c and the shape of the inner peripheral surface of the opening 35 of the support base 40c are different from the configuration shown in FIG.

  The edge part 26a and the edge part 26b of the board | substrate 20c are step shape. The inner peripheral surface 36a has a step shape corresponding to the step shape of the end portion 26a, and the inner peripheral surface 36b has a step shape corresponding to the step shape of the end portion 26b. The end portion 26a abuts on the inner peripheral surface 36a and is supported from the second main surface 24c side by the inner peripheral surface 36a. The end portion 26b contacts the inner peripheral surface 36b and is supported from the second main surface 24c side by the inner peripheral surface 36b.

  In the first embodiment, the four end portions corresponding to the respective sides of the substrate 20 are supported by the inner peripheral surface of the opening portion 35, but all four end portions are the inner peripheral surface of the opening portion 35. Need not be supported by. In the case where the substrate as described above is rectangular, at least each of the end portions corresponding to the two opposing sides is supported by the inner peripheral surface of the opening 35, and the substrate is fitted into the opening. It is possible to keep it in a state. Moreover, when a board | substrate is circular, at least one part of an edge part should just be supported by the internal peripheral surface of an opening part.

  Further, when the substrate is rectangular, the shape of the end portions may not be the same shape at all four end portions. For example, the direction of the taper angle may be changed between an end corresponding to the long side and an end corresponding to the short side.

  FIG. 8 is a schematic cross-sectional view of an LED unit 1d having a tapered end portion different from that in FIG. In FIG. 8, it is assumed that the shape of the end portion of the substrate 20d and the shape of the inner peripheral surface of the opening 35 of the support base 40d are different from the configuration shown in FIG.

  As shown in FIG. 8, the end portion 27a is an end portion corresponding to one long side of the substrate 20d, and the end portion 27b is an end portion corresponding to the other long side of the substrate 20d. As shown in FIG. 8, the tapered shapes of the end portions 27a and 27b are symmetrical so that the width in the short side direction (Y direction in FIG. 8) of the substrate 20 increases from the front (light irradiation side) toward the rear. The taper shape has a typical taper angle. The inner peripheral surfaces 37a and 37b have shapes corresponding to these. Therefore, the end portion 27a is supported from the first main surface side by the inner peripheral surface 37a, and the end portion 27b is supported from the first main surface side by the inner peripheral surface 37b.

  On the other hand, as described in the first embodiment, the tapered shape of the two end portions corresponding to the two short sides of the substrate 20d is in the direction of the long side of the substrate 20 from the front (light irradiation side) toward the rear ( The taper shape has a symmetrical taper angle such that the width in the X direction in FIG. In addition, the two inner peripheral surfaces corresponding to the two end portions each have a tapered shape corresponding to the two end portions.

  Therefore, the two end portions are supported from the second main surface 24d side by inner peripheral surfaces corresponding to these two end portions. Therefore, the substrate 20d is held in a state of being fitted in the opening.

  With such a configuration, there is an advantage that the movement of the substrate 20d can be regulated without a holding portion. In such a configuration, since it is difficult to fit the substrate 20d into the opening, the substrate 20d is configured such that one support base 40d is composed of two parts (one support base 40d can be divided). Is preferably fitted into the opening 35.

  In the first embodiment, the holding portion, which is a holding member, is formed integrally with the housing. However, as described above, the holding member is not an essential component. The holding member may be formed integrally with the support base, and may be realized as a holding portion that supports the end portion of the substrate from the first main surface side or the second main surface side. It may be realized as a separate member. An elastic member such as a leaf spring can be applied to the holding member provided separately.

  In the first embodiment, the end portion 25a and the end portion 25b are supported in contact with the inner peripheral surfaces 35a and 35b, respectively, but at least a part of the end portion and the inner peripheral surface are in direct contact with each other. The inner peripheral surface may be configured to support the end portion.

(Embodiment 2)
Next, the illuminating device 100 which concerns on Embodiment 2 is demonstrated.

  FIG. 9 is a cross-sectional view showing a schematic configuration of illumination apparatus 100 according to Embodiment 2.

  In addition, although the illuminating device 100 which concerns on this Embodiment is provided with the LED unit 1 which concerns on the said Embodiment 1, the illuminating device 100 is replaced with the LED unit 1, and LED unit 1b, 1c, or 1d is used. It may be provided.

  As illustrated in FIG. 9, the lighting device 100 is a downlight attached to a ceiling board 200, for example. The lighting device 100 includes a lighting fixture 110 and the LED unit 1 according to the first embodiment.

  The lighting fixture 110 is a fixture for supplying power to the LED unit 1 attached to the lighting fixture 110. The lighting fixture 110 includes a fixture main body 110 a provided so as to cover the LED unit 1, and a power supply circuit 220 that supplies power to the LED unit 1.

  The instrument main body 110a has a heat radiation part 110b and a reflection part 110c, and the power supply circuit 220 has lead wires 220a and 220b.

  The heat radiating part 110 b radiates heat transmitted from the LED unit 1. The heat dissipating part 110b accommodates the power supply circuit 220 therein, and the LED unit 1 is fixed to the front part (the lower part in FIG. 9).

  For example, the LED unit 1 is fixed to the lower surface portion of the heat radiating portion 110b by screws 250 that pass through the mounting holes 12a disposed in the three concave portions 12 of the LED unit 1.

  Here, the shape of the heat radiating portion 110b is not particularly limited as long as it is a shape suitable for heat radiation. For example, a shape in which fins are radially formed on the outer periphery is conceivable. Moreover, it is preferable to comprise the thermal radiation part 110b with a material with high heat conductivity, such as aluminum.

  The reflection part 110c has a substantially cup shape in which a circular opening is formed in the front part (lower part), and is configured to surround the side of the LED unit 1. Specifically, the reflecting portion 110c is a cylindrical portion formed so that the inner diameter gradually increases downward from the periphery of the lower surface portion of the heat radiating portion 110b.

  That is, the reflection part 110c has an opening on the light irradiation side, and is configured to reflect the light from the LED unit 1. For example, the reflection part 110c is comprised with the white synthetic resin which has insulation. In addition, in order to improve a reflectance, you may coat a reflective film on the inner surface of the reflection part 110c. In addition, the reflection part 110c is not limited to the thing made from a synthetic resin, You may use the metal reflecting plates formed by pressing a metal plate.

  The power supply circuit 220 is a member for supplying DC power to the LED unit 1. That is, in the power supply circuit 220, circuit elements (electronic components) for converting AC power to DC power are arranged.

  The power supply circuit 220 receives AC power, converts it into DC power, and supplies the DC power to the LED unit 1 via the lead wires 220a and 220b.

  Specifically, the lead wires 220a and 220b are connected to the lead wires 122a and 122b via the connectors 221 and 222, respectively. Thereby, the LED unit 1 can receive DC power supplied from the power supply circuit 220 via the lead wires 122a and 122b.

  In addition, the lighting fixture 110 may be implement | achieved as an instrument which can light-control the LED unit 1 by arrange | positioning the electronic component etc. for performing the light control of the LED unit 1 in the power supply circuit 220. FIG.

  Further, when the LED unit 1 attached to the lighting fixture 110 has a built-in power supply circuit that performs conversion from alternating current to direct current, the lighting device 100 may not include the power supply circuit 220.

  As described above, according to the illumination device 100 according to the second embodiment, since the LED unit 1 according to the first embodiment is provided, the same effects as those of the first embodiment can be obtained. That is, the illuminating device 100 provided with the illumination light source with short assembly time and high heat dissipation is realized. This effect is similarly exhibited even if the lighting device 100 is subjected to various modifications described in the first embodiment and its modifications.

(Other)
As mentioned above, although the LED unit and the illuminating device which concern on this invention were demonstrated based on Embodiment 1, its modification, and Embodiment 2, this invention is limited to these Embodiment and modification. It is not a thing.

  For example, in the first embodiment, the light emitting unit 21 has a COB (Chip On Board) type configuration in which one or more LED chips 21 a are directly mounted on the substrate 20, but is not limited thereto.

  For example, a package-type LED element in which the LED chip 21a is mounted in a resin-molded cavity and a phosphor-containing resin is sealed in the cavity may be employed as the light-emitting element of the light-emitting unit 21. That is, as the light emitting unit 21, a surface mount type (SMD) light emitting unit configured by mounting one or more LED elements on a substrate may be employed.

  Moreover, in said Embodiment 1, although the light emission part 21 was comprised so that white light might be emitted by blue LED and yellow fluorescent substance, it is not restricted to this. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used and combined with a blue LED to emit white light.

  The light emitting unit 21 may use an LED that emits a color other than blue. For example, when an ultraviolet light emitting LED chip is used as the LED, a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles. Furthermore, a wavelength conversion material other than the phosphor particles may be used. For example, the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light. A material containing a substance that emits light may be used.

  In the first embodiment, the LED is exemplified as the light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, or a light emitting element such as an organic EL (Electro Luminescence) or inorganic EL may be used.

  In addition, the form obtained by making various modifications conceived by those skilled in the art with respect to each embodiment and modification, or the components and functions in each embodiment and modification are optional without departing from the gist of the present invention. Embodiments realized by combining these are also included in the present invention.

DESCRIPTION OF SYMBOLS 1, 1a, 1b, 1c, 1d LED unit 5 Main body part 10 Case 10a Front surface 10b Side surface 12, 13 Concave part 12a, 13a Mounting hole 15 Release hole 18a, 18b Claw part 19 Holding part 20, 20a, 20b, 20c, 20d Substrate 21 Light emitting part 21a LED chip (light emitting element)
21b Sealing member 22 Adhesive material 22a, 22b Insertion hole 23a, 23b, 221, 222 Connector 24, 24b, 24c, 24d Second main surface 25a, 25b, 26a, 26b, 27a, 27b, 28a, 28b End 34 Attachment Surface 35a, 35b, 36a, 36b, 37a, 37b Inner peripheral surface 35 Opening 40, 40a, 40b, 40c, 40d Support base 100 Lighting device 110 Lighting fixture 110a Appliance main body 110b Heat radiation portion 110c Reflecting portion 122a, 122b, 220a, 220b Lead wire 200 Ceiling panel 220 Power supply circuit 250 Screw

Claims (9)

A support base having an opening and attached to a lighting fixture;
A first main surface on which a light emitting element is provided, a second main surface that is a surface opposite to the first main surface, and a substrate having an end portion supported by an inner peripheral surface of the opening,
The second main surface is flush with an attachment surface, which is a surface attached to the luminaire of the support base, or protrudes toward the luminaire from the attachment surface. The edge part of the said board | substrate is a taper shape, contact | abuts with the internal peripheral surface of the said taper-shaped opening part corresponding to the said taper shape, and is supported by the internal peripheral surface of the said opening part. Light source for illumination. The edge part of the said board | substrate is step shape, contact | abuts with the internal peripheral surface of the said opening part of the staircase shape corresponding to the said step shape, and is supported by the internal peripheral surface of the said opening part. Light source for illumination. And a holding member that supports the first main surface of the substrate.
The illumination light source according to claim 1, wherein the end portion of the substrate is supported by an inner peripheral surface of the opening from the second main surface side. The holding member further presses the substrate from the first main surface side of the substrate,
The second main surface of the substrate pressed by the holding member protrudes closer to the lighting fixture than the mounting surface,
The lighting device according to claim 4, wherein when the support base is attached to the lighting fixture, the second main surface of the substrate is flush with the mounting surface and is pressed against the lighting fixture by the holding member. light source. And a housing that covers at least a part of a region of the first main surface of the substrate where a light emitting element is not provided.
The illumination light source according to claim 4, wherein the holding member is formed integrally with the housing. The illumination light source according to claim 4, wherein the holding member is formed integrally with the support base. The illumination light source according to claim 1, wherein the housing and the support base are engaged by a claw portion provided on the housing or the support base. The illumination light source according to any one of claims 1 to 8,
A lighting device comprising the lighting fixture.

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