JP2014170883A - Jumper bus bar and implementation assembly using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jumper bus bar of a printed board assembly which allows electrification of a large current such as of several tens of amperes, is hard to be induction heated by a leaking magnetic flux, and is excellent in heat dissipation property.SOLUTION: A jumper bus bar is made of a conductive member which is implemented on a printed board containing a front surface, a rear surface, and a plurality through holes. It includes a body part which is plate-like extending in length direction and has a plurality of heat radiation fins, and a plurality of lead parts extending toward the printed board. When the plurality of lead parts are inserted into the through holes, each of lead parts abuts with an inner wall of the through hole that has a circular cross section, on the front surface of the printed board. A thickness in the direction vertical to the length direction is thinner at the rear surface than at the front surface of the printed board.

Description

  The present invention relates to a jumper bus bar (current auxiliary member) made of a conductive member mounted on a printed circuit board and a mounting assembly (current auxiliary assembly) using the same, and more particularly to a jumper bus bar used in a power electro device and the same. It relates to the mounting assembly used.

  The printed circuit board has a wiring pattern (copper foil pattern) formed by plating or vapor deposition of a metal such as copper, and in a normal use, the pattern thickness is generally about 55 μm. On the other hand, in the power electronics field, a printed circuit board on which a control circuit device for controlling a large current is mounted has a pattern of about 200 μm, for example, in order to suppress Joule heat generated in the wiring pattern, that is, to reduce the resistance of the wiring pattern. Although what has thickness is proposed, since manufacturing cost is very high, it is hardly utilized for a general product.

  Therefore, for example, Patent Document 1 proposes that a bus bar (metal conductor such as a sheet metal) as a member for assisting a wiring pattern is mounted on a printed circuit board by soldering to allow a larger current to flow. In addition, with the increase in the density of mounted components on a printed circuit board, a metal core substrate in which a metal core of about 400 μm, for example, is installed in the central layer of the printed circuit board is widely used to prevent heat concentration of the mounted components. . In addition, in order to flow a large current, there is a method of fastening a wire harness on a printed board with a screw. The wire harness is generally a bundle of a plurality of electric wires and covered with an insulator having high wear resistance, and has terminals for connection to a printed circuit board at both ends thereof.

JP 2010-062249 A

  However, in a normal flow soldering process or the like, when a lead such as a power semiconductor component that controls a large current or a relay is inserted into a through hole of a printed board and soldered and mounted, a wiring pattern having a substantial thickness Since the heat capacity is relatively large, the lead and through-holes of power semiconductor components and the like have difficulty in reaching the solder melting temperature, resulting in soldering defects.

  Similarly, when a metal core substrate including a metal core having a substantial thickness is adopted, the heat capacity of the metal core is relatively large, so that the lead and the through hole are not easily heated, and the reliability in the solder connection portion by the flow soldering process or the like In some cases, the property (so-called “soldering” into the through hole including the lead) is not sufficiently secured.

  Normally, when a through hole with poor solder finish is confirmed in a visual inspection after the flow soldering process, manual soldering correction work is performed, leading to an increase in manufacturing cost of the wiring pattern.

  In addition, in order to manufacture a printed circuit board including a wiring pattern having a substantial thickness, an advanced etching technique for the wiring pattern is required, so that the manufacturer of the printed circuit board is limited and the cost of the printed circuit board increases. .

  Further, in a power electronics device such as an industrial device, when a bus bar such as a rectangular sheet metal described in Patent Document 1 is mounted on a printed board, when the current flowing through the bus bar reaches several tens of amperes, the bus bar and the printed board There was a possibility that the connection part with would generate excessive heat due to current concentration.

  Although it is possible to increase the thickness of the bus bar in order to alleviate the current concentration at the connection part between the bus bar and the printed circuit board, the heat capacity of the bus bar also increases accordingly. Reliability may be lost and manufacturing costs may increase due to manual soldering correction.

  Also, when flow soldering a bus bar made of a metal material to a printed circuit board mainly composed of an epoxy resin or the like, the printed circuit board has a thermal expansion coefficient larger than that of the bus bar, so the bus bar is soldered with the printed circuit board warped. May be. At this time, as the printed circuit board cools, mechanical stress generated at the connection portion between the bus bar and the printed circuit board increases, and solder cracks may occur, reducing the reliability of the solder connection portion.

  In addition, power electronics equipment often has components that generate high-frequency leakage magnetic flux, such as switching transformers and reactors. When leakage magnetic flux is linked to a bus bar configured as a simple metal plate, eddy current is induced in the bus bar. Then, the bus bar is heated by induction. When heat is transferred from the bus bar heated by induction heating to the printed circuit board, the printed circuit board is locally heated, and the reliability as the printed circuit board may be impaired.

  Note that when a wire harness is used as a member for passing a large current, an operation of screwing the connection terminal of the wire harness to the terminal block and an operation of holding or fixing the wire harness are necessary, which reduces production efficiency. It was a cause. Further, since the wire harness is covered with an insulating film, there is a problem that Joule heat generated by a large current flowing in the wire harness is not easily radiated.

  The present invention has been made in order to solve the above-described problems, and is capable of energizing a large current of several tens of amperes, is not easily heated by induction due to leakage magnetic flux, and has excellent heat dissipation. It aims to realize the jumper bus bar.

  The present invention is a jumper bus bar made of a conductive member mounted on a printed circuit board having a front surface, a back surface, and a plurality of through holes, and has a plurality of heat dissipating fins and a plate-like main body extending in the longitudinal direction; A plurality of lead portions extending toward the printed circuit board, and when the plurality of lead portions are inserted into the through holes, each lead portion has a circular cross section of the through hole on the surface of the printed circuit board. A jumper bus bar is provided that is in contact with an inner wall of the printed circuit board and has a thickness in a direction perpendicular to the longitudinal direction that is thinner on the back surface than on the front surface of the printed circuit board.

  According to the jumper bus bar of the present invention, since it is configured to be connected to the printed circuit board through a plurality of lead portions extending from the main body portion, the impedance between the main body portion and the wiring pattern can be reduced, and the lead Current concentration at the connecting portion between the portion and the through hole can be avoided. In addition, by providing a plurality of slits in the main body, induction heating of the main body due to leakage magnetic flux generated from peripheral power electronics devices can be suppressed, and local heating of the printed circuit board can be avoided.

  In addition, the lead part is provided with a constriction part, and the tip part of the lead part on the tip side from the constriction part is thinned by press working (thinner thickness is reduced), and the entire lead part that touches the solder during the flow soldering process The surface area can be increased, and the lead portion and the through hole can be sufficiently heated. As a result, it is possible to sufficiently raise the solder into the through hole and improve the reliability (solder rise) in the solder connection portion. Therefore, according to the present invention, it is possible to energize a larger current and realize a jumper bus bar with higher reliability.

(A)-(c) is the front view of the jumper bus bar of Embodiment 1 which concerns on this invention, a side view, and a top view. FIGS. 3A to 3C are a front view, a side view, and a bottom view of a mounting assembly in which the jumper bus bar according to the first embodiment is mounted on a printed board. It is an expansion perspective view of the lead part concerning Embodiment 1, and shows a through hole of a printed circuit board with a broken line. (A) And (b) is the top view and bottom view of the through-hole of the lead part and printed circuit board which were seen from the IVA-IVA line and IVB-IVB line of FIG. 3, respectively. (A) And (b) is sectional drawing seen from the VA-VA line of FIG. 4 (a) parallel to a XZ plane, and the VB-VB line parallel to a YZ plane, respectively. It is a front view similar to Fig.1 (a) which shows an eddy current when a leakage magnetic flux generate | occur | produces. It is a front view of the jumper bus bar which concerns on the modification 1 of Embodiment 1, Comprising: It is the same as that of Fig.1 (a). It is a top view of the jumper bus bar which concerns on the modification 2 of Embodiment 1, Comprising: It is the same as that of FIG.1 (c). FIG. 10 is an enlarged perspective view of a lead portion according to a third modification of the first embodiment, and shows a through hole of the printed board with a broken line. (A) And (b) is the top view and bottom view of the lead part and the through-hole of the printed circuit board which were seen from the XA-XA line | wire and XB-XB line | wire of FIG. 9, respectively. (A) And (b) is sectional drawing seen from the XIA-XIA line | wire of FIG. 10 (a) parallel to a XZ plane, and the XIB-XIB line | wire parallel to a YZ plane, respectively. It is an expansion perspective view of the lead part which concerns on the modification 4 of Embodiment 1, and shows the through hole of a printed circuit board with a broken line. (A) And (b) is the top view and bottom view of the lead part and the through-hole of the printed circuit board which were seen from the XIIIA-XIIIA line and XIIIB-XIIIB line of FIG. 12, respectively. (A) And (b) is sectional drawing seen from the XIVA-XIVA line of FIG. 13 (a) parallel to a XZ plane, and the XIVB-XIVB line parallel to a YZ plane, respectively. 6 is a side view of a mounting assembly according to Embodiment 2. FIG. (A) And (b) is a front view of two jumper bus bars which comprise a mounting assembly, Comprising: It is the same as that of Fig.1 (a). It is a side view of the mounting assembly which concerns on Embodiment 3, Comprising: It is the same as that of FIG.1 (b). It is a front view of the mounting assembly which concerns on Embodiment 3, Comprising: It is the same as that of Fig.1 (a). It is a top view of the mounting assembly which concerns on Embodiment 3, Comprising: It is the same as that of FIG.1 (c).

  Embodiments of a jumper bus bar according to the present invention will be described below with reference to the accompanying drawings. In the present invention, the term “jumper bus bar” refers to a “current auxiliary member” for energizing a large current of several tens of amperes in power electronics equipment, and these terms can be used interchangeably. . In the description of each embodiment, terms representing directions (for example, “upper side”, “lower side”, “left side”, “right side”, “X direction”, “Y direction”) for ease of understanding. , And “Z direction”, etc., are used as appropriate, but this is for the purpose of explanation, and these terms do not limit the present invention.

Embodiment 1 FIG.
The first embodiment of the jumper bus bar according to the present invention will be described in detail below with reference to FIGS. 1A to 1C are a front view, a side view, and a plan view of a jumper bus bar 1 according to the present invention. 2A to 2C are a front view, a side view, and a bottom view of the mounting assembly 101 in which the jumper bus bar 1 is mounted on the printed board 20. The mounting assembly 101 constitutes a part of the power electronics device, and the jumper bus bar 1 is mounted on the printed circuit board 20 in order to allow a large current to flow between the wiring patterns of the printed circuit board 20. It is a sheet metal processed metal plate made of a metal material (for example, copper, phosphor bronze, brass, etc.).

  More specifically, the jumper bus bar 1 has a plate-like main body 10 extending in the left-right direction in FIG. 1A (longitudinal direction of the jumper bus bar 1 and X direction in FIG. 3). The main body 10 has a pair of side portions (left side portion 11a and right side portion 11b) and a pair of end portions (upper end portion 12a and lower end portion 12b). The thickness of the main body 10 may be 2 mm or more, but the present invention is not limited to this.

  FIG. 3 is an enlarged perspective view of the lead portion 14 according to the present invention, and shows the through hole 22 of the printed circuit board 20 by a broken line. 4A and 4B are a plan view and a bottom view of the lead portion 14 and the through hole 22 of the printed circuit board 20 as seen from the IVA-IVA line and IVB-IVB line of FIG. 3 parallel to the XY plane, respectively. is there. FIGS. 5A and 5B are sectional views as seen from the VA-VA line in FIG. 4A parallel to the XZ plane and the VB-VB line parallel to the YZ plane, respectively. The jumper bus bar 1 extends from the lower end portion 12b of the left side portion 11a and the right side portion 11b of the main body portion 10 toward the printed circuit board 20 and is inserted into the through hole 22 of the printed circuit board 20. The plurality of lead portions 14 (preferably, three or more lead portions 14a to 14c in each of the side portions 11a and 11b) are solder-connected to the through holes 22 of the printed circuit board 20. Thus, it is electrically connected to the printed circuit board 20.

  The lead portion 14 according to the present invention extends from the lower end portion 12b of the main body portion 10 to the vicinity of the printed circuit board 20, has a base portion 30 having a rectangular cross section, a narrowed portion 32 whose cross-sectional area is reduced and enlarged, and a print A front end portion 34 that penetrates the through hole 22 of the substrate 20 is provided. The distal end portion 34 may be configured by thinning (thinning the thickness) the distal end portion 34 on the distal end side of the narrowed portion 32 by, for example, press working. Further, the front end portion 34 may be configured such that the length in the longitudinal direction (X direction) of the rectangular cross section parallel to the printed circuit board 20 is longer on the back surface than the front surface of the printed circuit board 20. Alternatively, the distal end portion 34 may be configured such that the length in the longitudinal direction (X direction) of the rectangular cross section parallel to the printed circuit board 20 gradually increases from the front surface to the back surface of the printed circuit board 20. Good.

On the other hand, the through hole 22 of the printed circuit board 20 according to the first embodiment has a circular portion 36 and a rectangular portion 38 in a cross section parallel to the printed circuit board (XY plane), and the circular portion on the front and back surfaces of the printed circuit board. A thin film made of a conductive material is disposed around and inside the 36 and the rectangular portion 38, so-called soldering lands 40 (FIGS. 4A and 4B and FIGS. 5A and 5B). Is formed.
When the jumper bus bar 1 is mounted on the printed circuit board 20 (when each lead part 14 is inserted deeply into each through hole 22 (press-fit)), the lead part 14 according to the present invention leads as shown in FIG. The thinned tip portion 34 of the portion 14 penetrates the rectangular portion 38 of the through hole 22, and on the surface of the printed circuit board 20 (FIG. 4A), the corner portion of the narrowed portion 32 having a rectangular cross section has a circular cross section. It is configured to abut against the inner wall of the through hole 22 and bite into it. For this reason, the jumper bus bar 1 can be installed so as to be mechanically self-supporting on the printed circuit board 20 (before the reflow soldering process). After that, the jumper bus bar 1 is transported to the flow soldering process, but since it is mechanically self-supporting on the printed circuit board 20, it does not fall down due to vibration during transport, and supports smooth flow soldering work. Can do.

  In addition, since the lead portion 14 according to the present invention has the thinned wide tip portion 34, the surface area of the lead portion 14 as a whole increases, and is transmitted from the solder bath to the constricted portion 32 of the lead portion 14 in the flow soldering process. It becomes easy to heat and the wettability (solder finish) of the solder with respect to the lead part 14 can be improved. Conversely, since the cross-sectional area of the narrowed portion 32 of the lead portion 14 is smaller than the root portion 30, by suppressing heat transfer to the root portion 30 and the main body portion 10, the printed circuit board 20 and the main body portion 10 of the jumper bus bar 1 The stress distortion resulting from the difference in thermal expansion coefficient can be relieved, and the jumper bus bar 1 with higher reliability can be realized.

  Therefore, according to the present invention, even if the thickness of the jumper bus bar 1 is, for example, 2 mm or more and the heat capacity is large, the lead portion 14 is not sufficiently heated and the soldering operation is difficult. The constricted portion 32 is provided on the surface to increase the thermal resistance, and the through hole 22 and the tip end portion 34 are thinned so that the lead portion 14 and the through hole 22 are sufficiently heated, and solderability (soldering up) is improved. Can be improved. In addition, according to the present invention, the reliability of the solder connection portion is improved and the jumper bus bar 1 is mounted on the printed circuit board 20 by attaching the corner portion of the narrow portion 32 having a rectangular cross section to the inner wall of the through hole 22. And can improve the soldering workability.

  Further, since the jumper bus bar 1 according to the first embodiment has the plurality of lead portions 14a to 14c in the side portions 11a and 11b of the main body portion 10, the electrical resistance between the printed circuit board 20 and the jumper bus bar 1 is reduced. A large current can be distributed and flowed. That is, Joule heat generated by current flowing is generated in each lead portion 14a to 14c, and Joule heat is proportional to the square of the current, which is different from that of a bus bar having a single lead portion according to Patent Document 1 described above. Thus, according to the present invention, the amount of heat generated in each of the lead portions 14a to 14c can be reduced to 1/9 at maximum by dispersing the flowing current by the three lead portions 14a to 14c. Thus, according to the jumper bus bar 1 according to the first embodiment, a large current of several tens of amperes can be passed.

  Further, as shown in FIG. 1A and FIG. 2A, the jumper bus bar 1 has a plurality of radiating fins 16 extending upward from the upper end portion 12 a of the main body portion 10. A comb-like slit 17 is formed. It is preferable that the distance between the heat dissipating fins 16 and the comb-shaped slits 17 and the distance between adjacent lead portions 14 be equal. As a result, the jumper bus bar 1 according to the present invention can be easily manufactured from a single sheet metal by press punching, and the number of jumper bus bars 1 that can be manufactured from a single sheet metal is increased. The manufacturing cost per hit can be suppressed.

  As described in the background art section, power electronics devices often have components that generate high-frequency leakage magnetic flux, such as switching transformers and reactors. FIG. 6 is a front view similar to FIG. 1A, showing the eddy current Is when the leakage magnetic flux φ1 in the depth direction from the front of the paper surface is generated in the jumper bus bar 1 according to the present invention. When this leakage flux φ1 is linked to the jumper bus bar 1, an eddy current Is flows along the outer periphery in the direction of the right-hand thread as indicated by an arrow in FIG. However, the eddy current flowing along the outer periphery of the radiating fin 16 forms a magnetic flux φ2 between the slits 17 from the back of the drawing to the front, that is, in the direction opposite to the leakage magnetic flux φ1. That is, in the radiating fin 16, the leakage flux φ1 is canceled out with the flux φ2, and no eddy current flows. Therefore, although the main body 10 according to the present invention can be induction-heated by the eddy current Is caused by the leakage magnetic flux φ1, the radiating fin 16 does not flow and is not induction-heated (maintained in a low temperature state). The heat can be efficiently radiated from the main body 10 to the heat radiation fins 16. Therefore, according to the present invention, even in the case where leakage magnetic flux is generated in the power electronics device, the heat generated in the jumper bus bar 1 due to the eddy current is efficiently radiated through the heat radiation fins 16. Heat transfer to the substrate can be suppressed, and local thermal stress on the printed circuit board 20 can be reduced.

  Further, as described above, since the printed circuit board 20 has a thermal expansion coefficient larger than that of the jumper bus bar 1, in the flow soldering process, the printed circuit board 20 is warped so as to protrude downward, and the jumper bus bar 1 is soldered in this state. In some cases, mechanical stress may be generated in the solder connection portion between the through hole 22 and the lead portion 14 during cooling. However, since the jumper bus bar 1 according to the present invention has the slits 17 formed between the plurality of radiating fins 16, the flexibility of the jumper bus bar 1 as a whole is improved, and during cooling after the flow soldering process, The mechanical stress generated in the connection portion can be substantially relieved, and the reliability of the solder connection portion can be improved.

Modification 1
FIG. 7 is a front view of a jumper bus bar 11 according to a modification of the first embodiment, and is the same as FIG. In order to counter mechanical stress caused by warping of the printed circuit board 20, the heat dissipating fins 16 'of the jumper bus bar 1 extend downward from the lower end 12b of the main body 10 as shown in FIG. It may be configured. 5 is closer to the printed circuit board 20 than the slit 17 in FIG. 2A, the flexibility of the jumper bus bar 1 as a whole is increased, and the flow soldering process is performed. The mechanical stress at the time of subsequent cooling can be relaxed more efficiently. Similarly to the configuration in which the heat dissipating fins of the jumper bus bar 1 extend upward from the upper end portion 12a of the main body portion 10, the heat dissipating fins 16 'also have a structure in which the heat dissipating fins 16' extend from the lower portion of the lower end portion 12b of the main body portion 10. It is preferable that the distance between the “comb-like slits 17” and the distance between the adjacent lead portions 14 are equal. Accordingly, the jumper bus bar 1 according to the present invention can be easily manufactured from one sheet metal by press punching, and by increasing the number of jumper bus bars 1 that can be manufactured from one sheet metal, the jumper bus bar 1 per unit quantity of the jumper bus bar 1 The manufacturing cost can be reduced.

Modification 2
FIG. 8 is a plan view of the jumper bus bar 1 according to the first modification of the first embodiment, which is the same as FIG. 1C. In order to more efficiently relieve the mechanical stress during cooling, as shown in FIG. 8, the jumper bus bar 1 may be formed to have a curved portion 18 in a part of the longitudinal direction (X direction). That is, the bending portion 18 may increase the stretchability of the jumper bus bar 1 in the direction indicated by the double-headed arrow in FIG. 8 and more effectively relieve the mechanical stress during cooling.

Modification 3
The lead part 14 according to the first embodiment is not limited to those shown in FIGS. 3 to 5 and may have other forms. FIG. 9 is an enlarged perspective view of the lead portion 14 according to the third modification, and shows the land 40 of the through hole 22 of the printed circuit board 20 by a broken line. 10A and 10B are a plan view and a bottom view of the land 40 of the lead portion 14 and the through hole 22 of the printed circuit board 20 as viewed from the XA-XA line and the XB-XB line of FIG. 9 parallel to the XY plane. FIG. FIGS. 11A and 11B are cross-sectional views seen from the XIA-XIA line and the XIB-XIB line parallel to the YZ plane of FIG. 10A parallel to the XZ plane. The lead part 14 according to the third modification has the root part 30 and the tip part 34 similar to those of the first embodiment, but does not have the narrowed part 32 whose cross-sectional area is reduced and enlarged. That is, the distal end portion 34 of the third modification is thinned by, for example, pressing, and has substantially the same length as the root portion 30 in the longitudinal direction (X direction), but the root portion in the thickness direction (Y direction). It is formed to be thinner than 30. In the lead portion 14, the cross section of the portion (transition portion) 35 that transitions from the root portion 30 to the tip portion 34 gradually decreases as shown in FIGS. 9, 10 (a), and 10 (b). However, the transition part 35 may not be provided, and the cross section of the lead part 14 may rapidly change from the root part 30 toward the tip part 34 (not shown).

  On the other hand, the through hole 22 of the printed circuit board 20 according to the modified example 3 is the same as that generally used, and has a circular portion 36 in a cross section parallel to the printed circuit board (XY plane). When the jumper bus bar 1 is mounted on the printed board 20 (when each lead part 14 is inserted deeply into each through hole 22 (press-fit)), the lead part 14 according to the modified example 3 is formed on the surface of the printed board 20. (FIG. 10A), the corner portion of the root portion 30 having a rectangular cross section is configured to abut against the inner wall of the through hole 22 having a circular cross section. For this reason, the jumper bus bar 1 can be installed so as to be self-supporting mechanically (before the reflow soldering process) on the printed circuit board 20. After that, the jumper bus bar 1 is transported to the flow soldering process, but since it is mechanically self-supporting on the printed circuit board 20, it does not fall down due to vibration during transport, and supports smooth flow soldering work. Can do.

  Further, since the lead portion 14 according to the modified example 3 has the thinned tip portion 34, the heat capacity of the lead portion 14 can be reduced, and the lead portion 14 can be sufficiently heated to be soldered (soldering up). ) Can be improved. However, since the lead portion 14 according to the modified example 3 has a smaller surface area in contact with the solder, the solderability is inferior to that of the conventional lead portion, but a general circular through hole 22 can be used. Thus, the overall manufacturing cost of the mounting assembly 101 can be suppressed.

Modification 4
FIG. 12 is an enlarged perspective view of the lead portion 14 according to the modified example 4, and shows the land 40 of the through hole 22 of the printed circuit board 20 by a broken line. 13A and 13B are a plan view and a bottom view of the land 40 of the lead portion 14 and the through hole 22 of the printed circuit board 20 as viewed from the XIIIA-XIIIA line and the XIIIB-XIIIB line of FIG. 12 parallel to the XY plane. FIG. FIGS. 14A and 14B are cross-sectional views taken along lines XIIIA-XIIIA and XIIIB-XIIIB parallel to the YZ plane of FIG. 13A parallel to the XZ plane. Similar to the third modification, the lead portion 14 according to the fourth modification includes the root portion 30 and the tip portion 34 and does not include the narrowed portion 32 whose cross-sectional area is reduced and enlarged. That is, the distal end portion 34 of the modified example 4 is thinned by, for example, press working, and is formed to be longer than the root portion 30 in the longitudinal direction (X direction) and thinner than the root portion 30 in the thickness direction (Y direction). ing. The lead portion 14 is such that the cross section of the portion (transition portion) 35 that transitions from the root portion 30 to the tip end portion 34 gradually decreases as shown in FIGS. 12, 13 (a), and (b). However, the transition part 35 may not be provided, and the cross section of the lead part 14 may rapidly change from the root part 30 toward the tip part 34 (not shown).

  On the other hand, the through hole 22 of the printed circuit board 20 according to the modified example 4 has a circular part 36 and a rectangular part 38 in a cross section parallel to the printed circuit board (XY plane), as described in the first embodiment. A thin film made of a conductive material is disposed around and inside the circular portion 36 and the rectangular portion 38 on the front surface and the back surface of the printed circuit board, and a so-called soldering land 40 (FIGS. 13A and 13B) and FIG. 14A and 14B are configured.

  When the jumper bus bar 1 is mounted on the printed circuit board 20 (when each lead part 14 is inserted deeply into each through hole 22 (press-fit)), the lead part 14 according to the modified example 4 is as shown in FIG. The thinned tip portion 34 of the lead portion 14 penetrates the rectangular portion 38 of the through hole 22, and the corner portion of the root portion 30 having a rectangular cross section has a circular cross section on the surface of the printed circuit board 20 (FIG. 13A). It is formed so as to abut against the inner wall of the through-hole 22 having it. For this reason, the jumper bus bar 1 can be installed so as to be mechanically self-supporting on the printed circuit board 20 (before the reflow soldering process). After that, the jumper bus bar 1 is transported to the flow soldering process, but since it is mechanically self-supporting on the printed circuit board 20, it does not fall down due to vibration during transport, and supports smooth flow soldering work. Can do. Moreover, since the surface area where the front end portion 34 of the lead portion 14 according to the modified example 4 contacts the solder is made larger than that of the distal end portion 34 according to the modified example 3, the solderability can be improved.

Embodiment 2. FIG.
A mounting assembly according to the second embodiment of the present invention will be described in detail below with reference to FIGS. 15 and 16. Since the mounting assembly 102 according to the second embodiment uses a plurality of components having the same configuration as the jumper bus bar 1 described above in the first embodiment, the configuration related to the jumper bus bar according to the first embodiment. Description of points that overlap with the above will be omitted.

  FIG. 15 is a side view of the mounting assembly 102 according to the second embodiment, which is the same as FIG. 2B. The mounting assembly 102 according to the second embodiment includes a printed circuit board 20 and first and second jumper bus bars 1a and 1b mounted on the printed circuit board 20 adjacent to each other. 16 (a) and 16 (b) are front views of the first and second jumper bus bars 1a and 1b, which are the same as those in FIG. 1 (a). Each jumper bus bar 1a, 1b has the same configuration as that of the jumper bus bar 1 according to the first embodiment, and generally has the same main body portion 10 and a plurality of lead portions 14.

  However, as shown in FIG. 16A, the first jumper bus bar 1a does not have the heat radiating fins 16 extending from the main body 10, or even if it has the second heat radiating fins 16, the second heat radiating fins. 16 is configured to be shorter than the first heat dissipating fin 16 (not shown).

  In the mounting assembly 102 shown in FIG. 15, two first jumper bus bars 1a and three second jumper bus bars 1b arranged adjacent to both sides thereof are mounted on the printed circuit board 20. The mounting assembly 102 according to the second embodiment may be configured by mounting an arbitrary number of first and second jumper bus bars 1a and 1b on the printed circuit board 20 alternately adjacent to each other.

  Since the mounting assembly 102 according to the second embodiment uses the same configuration as that of the jumper bus bar 1 according to the first embodiment, the same effects as those described in the first embodiment can be obtained. Needless to say. Further, since the mounting assembly 102 according to the second embodiment includes the plurality of jumper bus bars 1a and 1b, an even larger current can be passed.

  In addition, according to the mounting assembly 102 according to the second embodiment, compared to the case where the plurality of jumper bus bars 1 according to the first embodiment are simply mounted adjacent to each other, between the second jumper bus bars 1b. In addition, since a space through which air flows can be provided above the first jumper bus bar 1a, the heat generated by the adjacent jumper bus bars 1a, 1b can be easily released upward, and sufficient By ensuring the cooling effect, heat dissipation is high and high reliability can be realized.

Embodiment 3 FIG.
The mounting assembly according to the third embodiment will be described in detail below with reference to FIGS. The mounting assembly 103 according to the third embodiment generally uses a plurality of components having the same configuration as the jumper bus bar 1 described above in the first embodiment. Therefore, the mounting assembly 103 according to the first embodiment relates to the jumper bus bar 1 according to the first embodiment. Description of points that overlap with the configuration is omitted.

  FIGS. 17 and 18 are a side view and a front view of the mounting assembly 103 according to the third embodiment, which are the same as FIGS. 1B and 1A. The mounting assembly 103 according to the third embodiment includes a printed circuit board 20 and first and second jumper bus bars 1a and 1b mounted on the printed circuit board 20 adjacent to each other. FIG. 18 shows only the first jumper bus bar 1a with hatching for convenience so that the first and second jumper bus bars 1a and 1b can be distinguished from each other.

  FIG. 18 shows the mounting assembly 103 according to the third embodiment, and each jumper bus bar 1a, 1b has the same configuration as the jumper bus bar 1 according to the first embodiment. However, in the mounting assembly 103 according to the third embodiment, the positions where the first and second jumper bus bars 1a and 1b mounted adjacent to each other on the printed circuit board 20 are mounted in the horizontal direction of FIG. It is mounted so as to be staggered, that is, staggered by shifting the width of the slit 17. In other words, the first and second jumper bus bars 1a and 1b according to the third embodiment are mounted on the printed circuit board 20 while being displaced by a predetermined width in the longitudinal direction.

  FIG. 19 is a bottom view of the mounting assembly 103 and is similar to FIG. In the mounting assembly 103 shown in FIG. 10, five jumper bus bars 1 are mounted on the printed circuit board 20, but the mounting assembly 103 according to the third embodiment is not limited to this, and an arbitrary number Alternatively, the jumper bus bars 1 may be mounted on the printed board 20 alternately adjacent to each other. Since the mounting assembly 103 according to the third embodiment uses the same configuration as that of the jumper bus bar according to the first embodiment, it is possible to obtain the same effects as those described in the first embodiment. Needless to say. In addition, since the mounting assembly 103 according to the third embodiment includes a plurality of jumper bus bars 1, an even larger current can flow.

  Further, according to the mounting assembly according to the third embodiment, since a gap can be secured around the radiating fins 16 of the jumper bus bar 1, the heat from the adjacent jumper bus bar 1 is reduced. Further, by forming a gap between the adjacent jumper bus bars 1, air permeability is improved, turbulence is easily generated, and heat dissipation can be improved.

  In the mounting assembly 103 shown in FIG. 18, the radiating fins 16 of each jumper bus bar 1 have been described as having the same length, but, similar to the jumper bus bar 1 used in the mounting assembly according to the second embodiment, You may use the jumper bus bar 1 from which the length of the radiation fin 16 differs.

  Further, in the mounting assemblies 102 and 103 according to the second and third embodiments, as described as the first modification of the first embodiment, the radiation fins 16 extend downward from the lower end 12b of the main body 10. It may be configured to relieve the mechanical stress during cooling after the flow soldering process more efficiently. Similarly to the second modification of the first embodiment, the jumper bus bar 1 is formed so as to have a curved portion 18 in the longitudinal direction (left and right direction in FIG. 5), thereby increasing the stretchability of the jumper bus bar 1. You may make it relieve | moderate more efficiently the mechanical stress at the time of cooling.

  Further, in the mounting assemblies 102 and 103 according to the second and third embodiments, as described in the third modification of the first embodiment, the lead portion 14 includes the root portion 30 and the tip portion 34, and the longitudinal direction (X (Direction) has substantially the same length as the root portion 30, but may be configured to be thinner than the root portion 30 in the thickness direction (Y direction). As a result, when the jumper bus bar 1 is mounted on the printed circuit board 20, the lead portion 14 is digged into the inner wall of the through hole 22 to support a smooth flow soldering operation, and a general circular through hole is used. As a result, the overall manufacturing cost of the mounting assembly can be reduced.

  Further, in the mounting assemblies 102 and 103 according to the second and third embodiments, as described in the fourth modification of the first embodiment, the lead portion 14 has the root portion 30 and the tip portion 34, and the root portion 30 and The distal end portion 34 may be formed so as to be longer than the root portion 30 in the longitudinal direction (X direction) and thinner than the root portion 30 in the thickness direction (Y direction). As a result, when the jumper bus bar 1 is mounted on the printed circuit board 20, the lead portion 14 is digged into the inner wall of the through hole 22 to support a smooth flow soldering operation, and the tip portion 34 of the lead portion 14 is soldered. Since the surface area to be touched can be made larger than that of the distal end portion 34 according to the modification 3, the solderability can be improved.

DESCRIPTION OF SYMBOLS 1 ... Jumper bus bar (current auxiliary member), 10 ... Main body part, 11 ... Side part, 12 ... End part, 14 ... Lead part, 16 ... Radiation fin, 17 ... Slit, 18 ... Curved part, 20 ... Printed circuit board, 22 ... through-hole, 30 ... root, 32 ... constriction, 34 ... tip, 35 ... transition, 36 ... circular, 38 ... rectangular, 40 ... land, 101, 102, 103 ... mount assembly (current auxiliary assembly) ).

Claims (13)

A jumper bus bar made of a conductive member mounted on a printed circuit board having front and back surfaces and a plurality of through holes,
A plate-like main body having a plurality of heat dissipating fins and extending in the longitudinal direction;
A plurality of lead portions extending toward the printed circuit board;
When the plurality of lead portions are inserted into the through holes, the lead portions are in contact with an inner wall having a circular cross section of the through hole on the surface of the printed board, and have a thickness in a direction perpendicular to the longitudinal direction. The jumper bus bar is configured to be thinner on the back surface than on the front surface of the printed circuit board.   The lead portion includes a root portion having a rectangular cross section, a narrow portion having a cross-sectional area that decreases and expands toward the printed circuit board, and a tip portion having a cross-sectional area smaller than the cross-sectional area of the root portion. The jumper bus bar according to claim 1, wherein The through hole has a circular portion and a rectangular portion;
When the plurality of lead portions are inserted into the through holes, the lead portions are configured such that the length in the longitudinal direction is longer on the back surface than the front surface of the printed circuit board. The jumper bus bar according to claim 1 or 2. The through hole has a circular portion and a rectangular portion;
When the plurality of lead portions are inserted into the through holes, each lead portion is configured such that the length in the longitudinal direction gradually increases from the front surface of the printed circuit board toward the back surface. The jumper bus bar according to any one of claims 1 to 3.   The jumper bus bar according to claim 1, wherein the main body has a curved portion that is curved along the longitudinal direction.   A mounting assembly comprising the jumper bus bar according to claim 1, and the printed circuit board having the front surface, the back surface, and the plurality of through holes. A printed circuit board having front and back surfaces and a plurality of through holes;
A jumper bus bar made of a conductive member mounted on the printed circuit board;
The jumper bus bar has a plurality of heat radiating fins, has a plate-like main body portion extending in the longitudinal direction, and a plurality of lead portions extending toward the printed circuit board,
When the plurality of lead portions are inserted into the through holes, the lead portions are in contact with an inner wall having a circular cross section of the through hole on the surface of the printed board, and have a thickness in a direction perpendicular to the longitudinal direction. The mounting assembly is configured to be thinner on the back surface than on the front surface of the printed circuit board. A printed circuit board having front and back surfaces and a plurality of through holes;
First and second jumper bus bars made of a conductive member mounted on the printed circuit board;
Each of the first and second jumper bus bars has a plate-like main body portion extending in the longitudinal direction and a plurality of lead portions extending toward the printed circuit board,
When the plurality of lead portions are inserted into the through holes, the lead portions are
The surface of the printed circuit board is in contact with the inner wall having a circular cross section of the through hole, and is configured such that the thickness in the direction perpendicular to the longitudinal direction is thinner on the back surface than the surface of the printed circuit board,
The main body portion of the first jumper bus bar has a plurality of first radiating fins, and the main body portion of the second jumper bus bar has a second radiating fin shorter than the first radiating fins, Or a mounting assembly characterized by having no heat radiation fins. A printed circuit board having front and back surfaces and a plurality of through holes;
First and second jumper bus bars made of a conductive member mounted on the printed circuit board;
Each of the first and second jumper bus bars has a plate-like main body portion extending in the longitudinal direction and a plurality of lead portions extending toward the printed circuit board,
When the plurality of lead portions are inserted into the through holes, the lead portions are in contact with an inner wall having a circular cross section of the through hole on the surface of the printed board, and have a thickness in a direction perpendicular to the longitudinal direction. Is configured to be thinner on the back surface than the front surface of the printed circuit board,
The mounting assembly, wherein the first and second jumper bus bars are mounted on the printed circuit board with a predetermined width shifted in the longitudinal direction.   The lead portion includes a root portion having a rectangular cross section, a narrow portion having a cross-sectional area that decreases and expands toward the printed circuit board, and a tip portion having a cross-sectional area smaller than the cross-sectional area of the root portion. 10. A mounting assembly according to any one of claims 7-9.   The mounting assembly according to any one of claims 7 to 10, wherein an interval between the lead portions of the first and second jumper bus bars is substantially the same as a predetermined width of the heat radiating fin. The through hole has a circular portion and a rectangular portion;
When the plurality of lead portions are inserted into the through holes, the length of each lead portion in the longitudinal direction is longer on the back surface than on the front surface of the printed circuit board. Item 12. The mounting assembly according to any one of Items 7 to 11. The through hole has a circular portion and a rectangular portion;
When the plurality of lead portions are inserted into the through holes, each lead portion is configured such that the length in the longitudinal direction gradually increases from the front surface of the printed circuit board toward the back surface. 13. A mounting assembly according to any one of claims 7 to 12, characterized in that:

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