JP2014168832A - Processing device, processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure for removing materials adhering to a groove of a roller for making a wire travel.SOLUTION: The processing device for processing a workpiece by using a processing wire comprises: a roller having a groove to which the processing wire is wound and making the processing wire travel; a drive part rotating the roller; and a cleaning mechanism including a cleaning wire for cleaning the groove of the roller. The cleaning mechanism is disposed so that the cleaning wire fits to the groove of the roller and the roller is rotated by the drive part.

Description

  The present invention relates to a processing apparatus and a processing method, and relates to a technique for cleaning a groove of a roller for running a processing wire.

  In recent years, a method has been developed in which a plurality of work materials such as semiconductor materials, solar cell materials, and hard materials are simultaneously cut out in a short time by electric discharge machining.

  For example, in order to cut the workpiece material into a thin plate shape, the wire electrical discharge machining device is run while applying a voltage to the wire via a power supply, and an electric discharge phenomenon is generated by bringing the workpiece material close to the wire. The work material is subjected to electric discharge machining.

  Patent Literature 1 describes that a workpiece is cut by electric discharge machining with a plurality of traveling wires to cut into thin pieces.

  Conventionally, a wire saw is known as an apparatus for slicing a silicon ingot as a workpiece into a large number of thin pieces. This wire saw cuts a wire that is run by a guide roller (hereinafter also referred to as a main roller) against a workpiece while supplying slurry containing loose abrasive grains.

  At this time, if the processing scrap of the processed workpiece adheres to the wire together with the supplied free abrasive grains, a part thereof contaminates the wire winding portion. Therefore, Patent Document 2 proposes a cleaning method for processing waste adhering to a wire.

  Patent Document 2 proposes a method of wiping off dirt on a wire as a cleaning method in a slurry-type wire saw.

JP 2010-260151 A JP 2002-283208 A

  However, in recent years, in an apparatus for producing a wafer by cutting a workpiece such as a silicon ingot, it has been demanded to make a wafer thinner than before.

  In order to meet this demand, research and development have been conducted on reducing the diameter of the wire, reducing the pitch between wires, reducing the guide groove of the main roller, and reducing the pitch of the guide groove.

  As the wire diameter is reduced, the pitch between the wires is reduced, the guide groove of the main roller is reduced, and the guide groove pitch is reduced, the dirt on the guide groove of the main roller is reduced. The impact on the environment is increasing.

  For example, with the narrowing of the pitch of the guide groove, the wire is likely to drop off from the guide groove due to dirt such as processing waste in the guide groove of the main roller.

  As described above, when the wire falls from the guide groove, the user is forced to perform complicated operations such as washing the groove of the main roller or replacing the guide roller.

  Moreover, there is a possibility that it becomes difficult to efficiently produce a wafer due to the interruption of the processing process by this work.

  In addition, some processing scraps pass through the guide groove as the wire travels, but it is highly likely that a part of the processing scrape will inevitably remain on the surface of the groove or remain, especially until the next processing. If the time interval is long, it dries and adheres, and the shape of the guide groove is impaired.

  Further, the material on the surface of the wire melted by the electric discharge machining, the material of the workpiece, etc. adhere to the guide groove of the main roller, and the shape of the guide groove is impaired.

  As described above, the material adhering to the guide groove of the main roller due to the processing by the electric discharge machining may damage the shape of the guide groove, and as a result, the wire may come off the groove and the running of the wire cannot be maintained normally. It will be high.

  Conventionally, a method for wiping off the dirt of the wire as in Patent Document 2 has been proposed, but a method for cleaning the groove of the main roller to maintain the wire normally is not disclosed.

  Therefore, an object of the present invention is to provide a mechanism for removing a substance adhering to a groove of a roller for running a wire.

  The present invention is a processing apparatus for processing a workpiece using a processing wire, the roller having a groove for winding the processing wire, and a roller for running the processing wire, and rotating the roller And a cleaning mechanism including a cleaning wire for cleaning the groove of the roller, and the cleaning mechanism is arranged so that the cleaning wire meshes with the groove of the roller, and The roller is rotated by a driving unit.

  Further, the present invention is characterized in that the cleaning mechanism is provided with a cleaning wire at the same interval as the groove so that the cleaning wire engages with the groove of the roller.

  Further, according to the present invention, the cleaning mechanism includes a receiving unit that receives an instruction to start cleaning the groove of the roller, and a feed mechanism that moves the cleaning wire to a cleaning position defined by the cleaning wire and the groove of the roller. When the cleaning mechanism receives an instruction to start cleaning the groove of the roller, the feeding mechanism is disposed at a cleaning position where the cleaning wire and the groove of the roller are in contact with each other. The wire is moved.

  In the invention, it is preferable that the feeding mechanism includes the cleaning mechanism between a cleaning position where the cleaning wire and the groove of the roller are in contact with each other and a retreat position where the cleaning wire and the groove of the roller are not in contact. An end storage means for movably operating the wire for cleaning and storing an end condition for ending the cleaning process of the groove of the roller by the cleaning mechanism; and the cleaning wire is moved to the cleaning position by the feed mechanism. And a determination unit that determines whether the cleaning process of the groove of the roller by the cleaning mechanism satisfies the end condition stored in the end storage unit, and the feeding mechanism includes: The cleaning wire is moved to the retracted position on the condition that the cleaning process of the groove of the roller by the cleaning mechanism is determined to satisfy the end condition stored in the end storage unit. And wherein the door.

  Further, in the present invention, the cleaning mechanism is arranged so that the cleaning wire is engaged with the groove of the roller, and after the roller is rotated at least once by the driving unit, the feeding mechanism further includes: The cleaning wire is moved within the width of the groove to the left and / or to the right with respect to the groove direction of the roller.

  In the present invention, the cleaning mechanism further includes a vibration mechanism that applies vibration to the cleaning wire, and the cleaning mechanism is disposed so that the cleaning wire is engaged with a groove of the roller. The cleaning wire is vibrated by the vibration mechanism while the roller is rotated by the driving unit.

  Further, the present invention is characterized in that the receiving means receives an instruction to start cleaning the groove of the roller after the processing of the workpiece using the processing wire is completed.

  Further, according to the present invention, a start storage unit that stores a predetermined condition for receiving an instruction to start cleaning the groove of the roller, and a processing of a workpiece using the processing wire are stored in the start storage unit. Start determination means for determining whether or not the stored predetermined condition is satisfied, and the reception means is configured to perform processing for processing the workpiece using the processing wire by the start determination means. Cleaning of the groove of the roller is started even when the processing of the workpiece using the processing wire is not completed on the condition that it is determined that the predetermined condition stored in the means is satisfied. It is characterized by receiving the instruction.

  Further, the present invention is characterized in that the predetermined condition stored in the start storage means includes a processing time for processing the workpiece using the processing wire.

  The cleaning mechanism may further include a cleaning liquid supply port that supplies a cleaning liquid to a position where the cleaning wire and the groove of the roller are engaged with each other.

  Further, the present invention is characterized in that the machining apparatus is a wire electric discharge machining apparatus for machining the workpiece by electric discharge between the machining wire and the workpiece.

  The present invention also provides a roller for running the processing wire, a drive unit for rotating the roller, and a workpiece for processing the workpiece using the processing wire. A cleaning method for the roller in a processing apparatus, wherein a cleaning mechanism including a cleaning wire for cleaning the groove of the roller is arranged so that the cleaning wire is engaged with the groove of the roller, and The roller is rotated by a driving unit.

  According to the present invention, the substance adhering to the groove of the roller for running the wire can be removed.

It is the external view which looked at the multi-wire electric discharge machining system from the front. It is an enlarged view in the dotted-line 16 frame shown in FIG. It is an external view which shows the cleaning mechanism 12, the main rollers 8, 9, and the wire 7 (working wire). FIG. 6 is a diagram showing a state where the cleaning device 305 of the cleaning mechanism 12 has moved to the cleaning position 303 of the main roller 9 and the cleaning wire 302 of the cleaning device 305 and the guide groove of the main roller 9 are in contact with each other. It is the figure which looked at the cleaning mechanism 12 from the side (left) side. It is a conceptual diagram which shows each of the state which the guide groove of the main roller 9 and the wire 7 (working wire) contacted, and the state which the guide groove of the main roller 9 and the wire 302 for cleaning contacted.

  Hereinafter, the present invention will be described in detail according to preferred embodiments with reference to the accompanying drawings.

  FIG. 1 is an external view of a multi-wire electric discharge machining apparatus 1 according to an embodiment of the present invention as viewed from the front. The configuration of each mechanism shown in FIG. 1 is an example, and it goes without saying that there are various configuration examples depending on the purpose and application.

  The multi-wire electric discharge machining apparatus 1 is an application example of the machining apparatus of the present invention, and works a workpiece (workpiece) using a wire 7 (machining wire). Further, the multi-wire electric discharge machining apparatus 1 is an application example of a wire electric discharge machining apparatus for machining a workpiece by electric discharge between a machining wire and the workpiece.

  The multi-wire electric discharge machining system according to the embodiment of the present invention includes a multi-wire electric discharge machining apparatus 1, a power supply unit 15 (power supply apparatus), and a machining fluid supply apparatus 18.

  The multi-wire electric discharge machining system can slice a work piece (silicon ingot 5 in the example of FIG. 1) into thin pieces at intervals of a plurality of wires 7 (wire electrodes) arranged in parallel by electric discharge.

  The multi-wire electric discharge machining apparatus 1 is connected to the power supply unit 15 via an electric wire (voltage application line), and is operated by electric power supplied from the power supply unit 15.

  The multi-wire electric discharge machining apparatus 1 is bonded to the work feeding apparatus 3 with an adhesive (adhesive of the bonding portion 4) when the work feeding apparatus 3 driven by a servo motor (not shown) moves in the vertical direction. A workpiece (the workpiece indicates a workpiece, which is the silicon ingot 5 in the example of FIG. 1) can be moved in the vertical direction.

  The multi-wire electric discharge machining apparatus 1 is an application example of the wire electric discharge machining apparatus of the present invention, and works a workpiece by electric discharge generated between the wire and the workpiece.

  In the embodiment of the present invention, when the silicon ingot 5 moves downward, the silicon ingot 5 and the wire 7 approach each other, and a discharge occurs between the silicon ingot 5 and the wire 7. Perform electrical discharge machining. At this time, the space between the silicon ingot 5 and the wire 7 (discharge gap (gap between the silicon ingot 5 and the wire 7)) is filled with the processing liquid, and this processing liquid has an electrical resistance of a predetermined width. Since it has a value, electric discharge is generated between the silicon ingot 5 and the wire 7, and the electric discharge machining of the silicon ingot 5 can be performed.

  It is also possible to cause electric discharge machining between the silicon ingot 5 and the wire 7 by providing the workpiece feeding device 3 below the wire 7 and moving the silicon ingot 5 upward. .

  In this embodiment, the silicon ingot 5 is described as an example of a workpiece, but other materials (conductor or semiconductor) that are not insulators, such as SIC (silicon carbide), can also be used.

  As shown in FIG. 1, the multi-wire electric discharge machining apparatus 1 includes a block 19 that functions as a base of the multi-wire electric discharge machining apparatus 1, a block 2 that is installed in an apparatus above the block 19, and a work feeding device 3, the bonding portion 4, the silicon ingot 5, the processing liquid tank 6, the main roller 8, the wire 7, the main roller 9, the power supply unit 10, the power supply 11, the processing liquid supply port 701, And a cleaning mechanism 12.

  Here, the main roller 8 or the main roller 9 is a roller for running a processing wire having a groove (guide groove) around which the wire 7 (processing wire) is wound. This is an application example.

  In addition, the multi-wire electric discharge machining apparatus 1 includes a drive unit that rotates the main roller 8 or the main roller 9 in order to run the wire 7 (working wire).

  Reference numeral 15 denotes a power supply unit (power supply device), which is controlled by a discharge servo control circuit that controls the servo motor so as to keep the discharge gap constant in order to efficiently generate discharge according to the state of discharge. Also, the workpiece is positioned and electric discharge machining is advanced.

  18 is a machining fluid supply device that feeds machining fluid necessary for cooling the electrical discharge machining section and removing machining chips (scraps) to the silicon ingot 5 and the wire 7 by a pump, and for machining chips in the machining fluid. Removal, management of specific resistance or conductivity (1 μS to 250 μS) by ion exchange resin, and management of liquid temperature (around 20 ° C.) are performed. Water is mainly used as the machining fluid, but electric discharge machining oil can also be used. In the present embodiment, water is used as an example of the machining fluid, but electric discharge machining oil may be used.

  Reference numerals 8 and 9 denote main rollers. Grooves (guide grooves) are formed on the main rollers at a predetermined pitch and number so as to be processed at a desired thickness. The wire whose tension is controlled from the wire supply bobbin is wound around the two main rollers as many times as necessary, and sent to the take-up bobbin. A wire speed of about 100 m / min to 900 m / min is used.

  The main roller 9 is an application example of the guide roller of the present invention, and the wire 7 wound around the main roller 9 is caused to travel as the main roller 9 rotates.

  As the two main rollers rotate in the same direction and at the same speed, one wire 7 sent from the wire feeding portion circulates around the outer periphery of the main rollers (two) and is arranged in parallel. A plurality of wires 7 can run in the same direction.

  The wire 7 is a single connected wire, and is fed out from a bobbin (not shown) and fitted into the guide groove on the outer peripheral surface of the main rollers 8 and 9, many times (about 2000 times at the maximum) outside the main roller. ) After being wound spirally, it is wound on a bobbin (not shown).

  The processing liquid tank 6 stores ion-exchanged water managed to have a specific resistance (electrical conductivity) within a predetermined range, and the ion-exchanged water is parallel to the wire 7 (also referred to as a wire electrode) and the silicon ingot 5. Is supplied as a working fluid to the position (discharge point) of the discharge gap close to each other.

  The machining fluid tank 6 stores a machining fluid used for electric discharge machining between the workpiece and the wire.

  The machining liquid is supplied into the machining liquid tank 6 from a machining liquid supply section (the machining liquid supply port 701 is also referred to as a machining liquid supply section) provided in the lower part of the machining liquid tank 6.

  The cleaning mechanism 12 is a mechanism that removes substances (processing waste, dirt, etc.) adhering to the guide groove of the main roller 9 and cleans them.

  Details of the cleaning mechanism 12 will be described later with reference to FIGS.

  Next, FIG. 2 will be described.

  FIG. 2 is an enlarged view within a dotted line 16 frame shown in FIG.

  The block 2 is joined to the work feeding device 3. The work feeding device 3 is bonded (bonded) to the silicon ingot 5 (work) and the bonding portion 4.

  In the present embodiment, a silicon ingot 5 will be described as an example of a workpiece (workpiece).

  For the bonding portion 4, a conductive adhesive that bonds (bonds) the work feeding device 3 and the silicon ingot 5 (work) is used.

  The work feeding device 3 is a device having a mechanism for moving the silicon ingot 5 bonded (bonded) by the bonding portion 4 in the vertical direction, and the silicon ingot 5 is moved by moving the work feeding device 3 downward. Can be brought closer to the wire 7.

  The processing liquid tank 6 is a container for storing the processing liquid. The working fluid is, for example, deionized water having a high resistance value. By providing the machining liquid between the wire 7 and the silicon ingot 5, electric discharge is generated between the wire 7 and the silicon ingot 5, and the silicon ingot 5 can be shaved.

  The main rollers 8 and 9 (also referred to as guide rollers) are formed with a plurality of rows of grooves for attaching the wires 7, and the wires 7 are attached to the grooves. And the main roller 8 and 9 rotates right or left, and the wire 7 travels.

  The wire 7 is wound around the main roller a plurality of times, and the wires 7 are aligned at a predetermined pitch according to the grooves carved in the main roller.

  The main rollers 8 and 9 have a structure in which metal is used in the center and the outside is covered with resin.

  The power supply 11 is resistant to mechanical wear and is required to have electrical conductivity, and a cemented carbide is used.

  A silicon ingot 5 is arranged at the upper part of the central portion between the two main rollers. The silicon ingot 5 is attached to the work feeding device 3, and the silicon ingot 5 is moved by moving the work feeding device 3 in the vertical direction. Moves up and down to process the silicon ingot 5.

  Further, a machining liquid tank 6 is provided in the central portion between the main rollers, the wire 7 and the silicon ingot 5 are immersed, and the electric discharge machining portion is cooled and the machining chip is removed.

  As shown in FIG. 2, the wire 7 is attached to the main rollers 8 and 9, and forms a wire row on the upper side and the lower side of the main rollers 8 and 9.

  Further, the wire 7 is a conductor, and the supplied voltage of the power supply unit 10 to which the voltage is supplied from the power supply unit 15 and the wire 7 are brought into contact with the wire 7. To be applied. (The power supply 11 applies a voltage to the wire 7.)

  Then, an electric discharge occurs between the wire 7 and the silicon ingot 5, and the silicon ingot 5 is shaved (electric discharge machining is performed), so that a thin silicon (silicon wafer) (workpiece) can be formed.

  FIG. 3 is an external view showing the cleaning mechanism 12, the main rollers 8 and 9, and the wire 7 (processing wire).

  The cleaning mechanism 12 includes a cleaning machine 305 having a cleaning wire 302 and a feed mechanism 301.

  As shown in FIG. 3, the cleaning mechanism 12 is disposed at a position between the main roller 8 and the main roller 9 and inside the wire 7 wound around the main rollers 8 and 9.

  The cleaning wire 302 is a wire for cleaning the groove of the main roller 8 or 9.

  Further, the cleaning mechanism 12 is disposed so that the cleaning wire 302 is engaged with the groove (guide groove) of the main roller 8 or 9, and the roller is rotated by a driving unit that rotates the roller. Thereby, the groove | channel (guide groove | channel) of the main roller 8 or 9 is cleaned.

  Further, the cleaning mechanism 12 is provided with the cleaning wire 302 at the same interval as the interval of the groove so that the cleaning wire 302 engages with the groove (guide groove) of the main roller 8 or 9.

  The cleaning mechanism 12 includes a receiving mechanism (receiving unit) that receives an instruction to start cleaning the groove (guide groove) of the main roller 8 or 9 from the user. In addition, the reception mechanism (reception unit) receives not only a user instruction but also a cleaning start signal from the multi-wire electric discharge machining apparatus 1 as a cleaning start instruction. For example, the reception means (reception mechanism) cleans the guide groove of the main roller using a cleaning start signal output from the multi-wire electric discharge machining apparatus 1 after the processing of the workpiece using the processing wire is completed. Accepted as a start instruction.

  Further, the multi-wire electric discharge machining apparatus 1 stores a predetermined condition for receiving an instruction to start cleaning of the guide groove of the main roller in a memory (start storage means). Here, the predetermined condition includes a processing time for processing the workpiece using the processing wire.

  The control unit of the multi-wire electric discharge machining apparatus 1 determines whether the processing of the workpiece using the wire 7 (machining wire) satisfies a predetermined condition stored in the start storage unit (start determination unit) The processing of the workpiece using the processing wire is not completed on the condition that the processing of the workpiece using the processing wire is determined to satisfy the predetermined condition. However, the reception unit receives an instruction to start cleaning the groove of the main roller.

  The feed mechanism 104 is a mechanism that moves the cleaning tool 305 between a cleaning position 303 that contacts the guide groove of the main roller and a retreat position 304 that does not contact the guide groove.

  In addition, the feed mechanism 104 can be controlled to move the cleaning tool 305 to the cleaning position 303 in contact with the guide groove to clean the guide groove, regardless of whether the machining is in progress or the processing is stopped.

  Further, the feed mechanism 104 moves the cleaning wire 302 between a cleaning position where the cleaning wire 302 and the guide groove of the main roller contact each other and a retreat position where the cleaning wire 302 and the main roller groove do not contact each other. Cleaning is performed at a cleaning position where the cleaning wire 302 and the guide groove of the main roller come into contact with each other when the receiving mechanism (receiving means) receives an instruction to start cleaning the guide groove of the main roller. The wire 302 is moved.

  In addition, the multi-wire electric discharge machining apparatus 1 stores in the memory (end storage means) end conditions (such as the cleaning process time and the number of rotations of the main roller) for ending the cleaning process of the guide groove of the main roller by the cleaning mechanism 12. I remember it.

  Then, after the cleaning wire 302 is moved to the cleaning position 303 by the feed mechanism 301 by the control unit such as the CPU of the multi-wire electric discharge machining apparatus 1, the cleaning process of the guide groove of the main roller by the cleaning mechanism 12 is completed. It is determined whether the end condition stored in the means is satisfied (determination means (determination mechanism)).

  Then, the feeding mechanism 301 retreats on the condition that the determination unit (determination mechanism) determines that the cleaning process of the guide groove of the main roller by the cleaning mechanism 12 satisfies the end condition stored in the end storage unit. The cleaning wire 302 is moved to the position 304.

  FIG. 4 is a diagram illustrating a state in which the cleaning tool 305 of the cleaning mechanism 12 moves to the cleaning position 303 of the main roller 9 and the cleaning wire 302 of the cleaning tool 305 and the guide groove of the main roller 9 are in contact with each other. It is.

  The cleaning mechanism 12 further includes a cleaning tool feed driving unit 403 and a holding unit 404, and the cleaning tool 305 includes a cleaning liquid supply port 401 and a cleaning liquid supply port 402.

  The cleaning mechanism 12 includes cleaning liquid supply ports 401 and 402 for supplying a cleaning liquid at a position where the cleaning wire 302 and the guide groove of the main roller are engaged with each other.

  The cleaning tool feed driving unit 403 is a mechanism that drives the operation of the cleaning tool by the feed mechanism 301.

  The holding unit 404 is a mechanism that connects the cleaning tool 305 and the feed mechanism 301 and holds the cleaning tool 305. Therefore, the cleaning tool 305 can be moved by moving the holding unit 404 by the operation of the feed mechanism 301.

  The cleaning liquid supply port 401 and the cleaning liquid supply port 402 are ports for spraying and supplying cleaning liquid such as water and / or chemical liquid to a portion where the guide groove of the main roller 9 and the cleaning wire 302 are in contact with each other. . The water used here may be the same as the water used as the processing liquid.

  The cleaning tool 305 is moved to the cleaning position 303 where the cleaning wire 302 is in contact with the guide groove of the main roller 9 by the feed mechanism 301 driven by the cleaning tool feed driving unit 403, and the main roller 9 is rotated to rotate the cleaning wire. By the frictional force between 302 and the guide groove of the main roller 9, substances (working waste, dirt, etc.) adhering, remaining, and fixed to the guide groove are removed.

  Further, the above-described cleaning liquid supply ports 401 and 402 are provided above and below the cleaning device 305, so that cleaning can be performed while spraying cleaning liquid such as water or chemicals in order to improve the removal effect.

  Further, the holding unit 404 of the cleaning tool 305 can further be provided with an excitation mechanism that applies vibration to the cleaning tool 305 including the cleaning wire 302, and the cleaning tool 305 has vibration having the same amplitude as the width of the guide groove. It is possible to more effectively clean the entire inside of the guide groove.

  FIG. 5 is a view of the cleaning mechanism 12 as viewed from the side (left side).

  As shown in FIG. 5, the cleaning mechanism 12 further includes a cleaning liquid supply unit 501.

  The cleaning liquid supply unit 501 is a mechanism that stores the cleaning liquid and supplies the cleaning liquid to the cleaning liquid supply port 402 (feeds out the cleaning liquid), and is provided at the end of the cleaning mechanism 12.

  As shown in FIG. 5, the cleaning mechanism 12 is provided with the same number of cleaning wires 302 as the number of guide grooves of the main roller 9 on the upper and lower rod-shaped supports.

  Further, the diameter of the cleaning wire 302 is smaller than the width of the guide groove, and the cleaning wire 302 is stretched at the same interval as the interval of the guide groove.

  The central portion of the cleaning wire 302 is made of a material containing nylon, steel, or the like. In addition, diamond fixed abrasive grains are provided on the surface of the cleaning wire 302.

  FIG. 6 is a conceptual diagram showing a state where the guide groove of the main roller 9 and the wire 7 (processing wire) are in contact with each other, and a state where the guide groove of the main roller 9 and the cleaning wire 302 are in contact with each other. .

  As shown in FIG. 6, reference numeral 601 denotes a state in which the wire 7 (processing wire) is strung over the guide groove of the main roller 9 and the guide groove of the main roller 9 and the wire 7 (processing wire) are in contact with each other. ing.

  Reference numeral 602 denotes a state in which the cleaning wire 302 is pressed against the guide groove of the main roller 9 and the guide groove of the main roller 9 and the cleaning wire 302 are in contact with each other.

  When the machining waste 110 generated during the electric discharge machining remains on the slope or bottom of the guide groove, the remaining position of the machining waste 110 moves from the bottom to the surface side of the main roller 9 with respect to the bottom of the guide groove (h1-1 / When the distance is 2 × d1) or more, the machining waste 110 becomes an obstacle that the wire 7 (working wire) fits into the guide groove of the main roller 9 and the wire 7 (working wire) travels while the wire is running. 7 (processing wire) is likely to be out of order from the guide groove of the main roller 9.

  In order to solve such a problem, in the present invention, a mechanism for removing substances such as the processing waste 110 attached to the guide groove is newly provided.

  Here, h1 indicates the distance from the bottom of the guide groove to the center point of the wire 7 (processing wire) when the wire 7 (processing wire) is wound around the main roller 9.

  D1 is the diameter of the wire 7 (processing wire).

  Further, h1 is obtained by substituting the processing angle θ of the guide groove of the main roller 9 and the diameter d1 of the wire 7 (processing wire) into the following equation. Here, the processing angle θ of the guide groove of the main roller 9 and the diameter d1 of the wire 7 (processing wire) are stored in the memory, and by substituting the stored processing angle θ and diameter d1, h1 can be obtained.

    h1 = d1 / {2 × sin (θ / 2)}

  The processing waste 110 includes processing materials (such as silicon), wire materials (such as brass and iron), chalk (such as calcium carbonate) derived from processing liquid (tap water), and guide groove materials (such as urethane).

  The wire diameter d2 of the cleaning wire 302 for removing these processing wastes 110 is set to be equal to or smaller than the diameter d1 of the wire 7 (processing wire). As a result, it is possible to remove the processing waste 110 that becomes an obstacle to the traveling of the wire 7 (processing wire), and the wire 7 (processing wire) is connected to the main roller 9 while the wire 7 (processing wire) is traveling. It is possible to reduce the possibility of occurrence of problems such as detachment from the guide groove.

  When the cleaning wire 302 is pressed against the guide groove in order to clean the guide groove of the main roller 9, the movement amount Y of the cleaning wire 302 moving from the surface of the main roller 9 toward the bottom of the guide groove is expressed as (D− By setting h2), the cleaning wire 302 is not strongly pressed against the guide groove, and the main roller 9 is rotated to run the wire 7 (processing wire) without damaging the guide groove. It is possible to remove the machining waste 110 remaining in the groove having a depth greater than the depth that affects the process.

  In this way, the cleaning wire 302 is moved from the surface of the main roller 9 by the movement amount Y (the value of D−h2), thereby moving the cleaning wire 302 to a position (cleaning position 303) in contact with the guide groove. It becomes possible. Here, D indicates the depth of the guide groove, and h2 indicates the distance from the bottom of the guide groove to the center of the cleaning wire in contact with the guide groove. Further, since D and h2 are preset and stored in the memory, the movement amount Y is obtained by reading the values of D and h2 from the memory and calculating the value of (D−h2). The feed mechanism 301 moves the cleaning tool 305 and the feed mechanism 301 from the retracted position 304 by driving the cleaning tool feed driving unit 403 by a value obtained by adding the distance from the surface of the main roller 9 to the retracted position 304 to the amount of movement Y. By moving toward the bottom of the guide groove, the cleaning wire 302 can be brought into contact with the surface of the guide groove.

  Thus, after the cleaning wire 302 is moved to contact the surface of the guide groove with the cleaning wire 302 and the main roller 9 is rotated at least once, the cleaning wire 302 is moved within the range of the movement amount Y within the guide groove. The cleaning wire 302 can be moved by the feed mechanism 301 along the line. Thereby, the processing waste around the surface of the guide groove can be effectively removed.

  That is, the cleaning mechanism 302 is arranged so that the cleaning wire 302 is engaged with the guide groove of the main roller, and after the main roller is rotated at least once by the drive unit that rotates the main roller, the feeding mechanism 301 further includes The cleaning wire 302 is moved within the range of the width of the guide groove to the left and / or right with respect to the direction of the guide groove of the main roller.

  As described above, h2 is the distance from the bottom of the guide groove when the cleaning wire 302 is in contact with the guide groove to the center of the cleaning wire 302, and D is the depth of the guide groove. It is calculated as follows.

    h2 = d2 / {2 × sin (θ / 2)}

  By the above method, the processing waste 110 at the bottom of the guide groove can be removed, and the processing waste 110 remaining in the opening of the guide groove can be opened by the vibration mechanism provided in the holding portion 404. It can be removed by moving the cleaning wire 302 while vibrating it with the same amplitude as the width P.

  That is, the cleaning mechanism 12 includes a vibration mechanism that applies vibration to the cleaning wire 302. The cleaning mechanism 12 is disposed so that the cleaning wire 302 engages with the guide groove of the main roller and rotates the main roller. While the main roller is rotated by the driving unit, the cleaning wire 302 is vibrated by the vibration mechanism.

  At this time, the cleaning wire 302 can be stopped after moving at a pitch not exceeding the wire diameter d2, and the guide roller can be rotated at least once during the stationary state, thereby reducing the cleaning residue.

  Further, the same effect can be obtained even if the cleaning wire 302 is reciprocated in the section of the movement amount Y.

  Even if the processing waste 110 remains on the bottom side of the guide groove with respect to the cleaning wire 302, it does not come into contact with the wire 7 (processing wire).

  It is desirable from the viewpoint of removal efficiency that the above-described guide groove cleaning method is performed before the machining waste is dried and fixed, and is typically performed immediately after completion of the electric discharge machining process, and the discharge is performed for a longer time than the predetermined time. When processing is performed, control is performed so that it is executed even during processing.

  As mentioned above, according to this invention, the substance adhering to the groove | channel of the roller for running a wire can be removed.

1 Multi-wire EDM 2 Block 2
DESCRIPTION OF SYMBOLS 3 Work feeding apparatus 4 Bonding part 5 Silicon ingot 6 Processing liquid tank 7 Wire 8 Main roller 9 Main roller 10 Feeding unit 11 Feeder 12 Cleaning mechanism 15 Power supply unit 18 Processing liquid supply apparatus 19 Block 701 Processing liquid supply port

Claims (12)

A processing apparatus for processing a workpiece using a processing wire,
A roller for running the processing wire, having a groove for winding the processing wire;
A drive unit for rotating the roller;
A cleaning mechanism including a cleaning wire for cleaning the groove of the roller;
With
The said cleaning mechanism arrange | positions so that the said wire for cleaning may engage with the groove | channel of the said roller, and rotates the said roller by the said drive part, The processing apparatus characterized by the above-mentioned.   2. The processing apparatus according to claim 1, wherein the cleaning mechanism is provided with a cleaning wire at the same interval as the groove so that the cleaning wire engages with the groove of the roller. The cleaning mechanism is
Receiving means for receiving an instruction to start cleaning the groove of the roller;
A feed mechanism for moving the cleaning wire to a cleaning position formed by the cleaning wire and the groove of the roller;
Further comprising
The feeding mechanism moves the cleaning wire to a cleaning position where the cleaning wire and the roller groove come into contact with each other when the receiving unit receives an instruction to start cleaning the groove of the roller. The processing apparatus according to claim 1, wherein the processing apparatus is characterized. The feed mechanism can move the cleaning wire between a cleaning position where the cleaning wire and the groove of the roller are in contact and a retreat position where the cleaning wire and the roller groove are not in contact. Work,
End storage means for storing an end condition for ending the cleaning of the groove of the roller by the cleaning mechanism;
Determining means for determining whether the cleaning process of the groove of the roller by the cleaning mechanism satisfies the end condition stored in the end storage means after the cleaning wire is moved to the cleaning position by the feed mechanism; ,
Further comprising
The feeding mechanism is configured to clean the roller groove at the retracted position on the condition that the determination unit determines that the cleaning process of the groove of the roller by the cleaning mechanism satisfies the end condition stored in the end storage unit. The processing apparatus according to claim 3, wherein the working wire is moved.   After the cleaning mechanism is arranged so that the cleaning wire engages with the groove of the roller, and after the roller has been rotated at least once by the driving unit, the feeding mechanism further includes a direction of the groove of the roller. 5. The processing apparatus according to claim 3, wherein the cleaning wire is moved in the range of the width of the groove in the left direction and / or the right direction. The cleaning mechanism further includes a vibration mechanism that applies vibration to the cleaning wire,
The cleaning mechanism is arranged such that the cleaning wire is engaged with the groove of the roller, and the cleaning wire is vibrated by the vibration mechanism while the roller is rotated by the driving unit. The processing apparatus according to any one of claims 1 to 5, characterized in that:   The said receiving means receives the instruction | indication of the cleaning start of the groove | channel of the said roller, after the processing of the workpiece using the said wire for processing is completed, The any one of Claim 3 thru | or 6 characterized by the above-mentioned. The processing apparatus as described. Start storage means for storing predetermined conditions for receiving an instruction to start cleaning the groove of the roller;
Start determination means for determining whether the processing of the workpiece using the processing wire satisfies a predetermined condition stored in the start storage means;
Further comprising
The accepting means is conditioned on the condition that the start determining means determines that the processing of the workpiece using the processing wire satisfies a predetermined condition stored in the start storage means. 6. The apparatus according to claim 3, wherein an instruction to start cleaning the groove of the roller is received even when the processing of the workpiece using the wire for processing is not completed. Processing equipment.   The processing apparatus according to claim 8, wherein the predetermined condition stored in the start storage unit includes a processing time for processing the workpiece using the processing wire.   10. The processing apparatus according to claim 1, wherein the cleaning mechanism further includes a cleaning liquid supply port that supplies a cleaning liquid to a position where the cleaning wire and the groove of the roller are engaged with each other.   The said processing apparatus is a wire electric discharge machining apparatus which processes the said workpiece by the electrical discharge between the said wire for a process, and a workpiece, The Claim 1 characterized by the above-mentioned. Processing equipment. A roller for running the processing wire, having a groove for winding the processing wire;
A drive unit for rotating the roller;
A method of cleaning the roller in a processing apparatus for processing a workpiece using the processing wire,
The cleaning mechanism including a cleaning wire for cleaning the groove of the roller is arranged so that the cleaning wire is engaged with the groove of the roller, and the roller is rotated by the driving unit. Cleaning method.

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