JP2014165907A - Solid-state image pickup device and imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state image pickup device capable of switching between stereoscopic image and planar image while changing stereoscopic effect using no mechanical mechanism.SOLUTION: The solid-state image pickup device includes: a pixel part 300 which has plural pixels disposed in a matrix configuration; a light focusing element 302 disposed above the pixel part; and a signal processing section 106. Each of the plural pixels has a photoelectric conversion part. The pixel part has plural pixel groups including a first pixel group. The plural pixel group is constituted of pixels which are disposed in a same row and neighboring n-column (n: integer greater than 3) in the plural pixels. The signal processing section 106 multiplies an arbitrary real number on a signal output from the arbitrary pixel in the first pixel group and sums the same to simultaneously or separately generate a first combined signal for forming a first planar image, a second combined signal for forming a first stereoscopic image, and a third combined signal.

Description

  The present invention relates to a solid-state imaging device effective for a stereoscopic camera or a multi-view camera.

  In the conventional imaging device capable of stereoscopic viewing, there is a need to use a dynamic mechanism when switching between a stereoscopic image composed of two images with different viewpoints and a planar image with one viewpoint.

  For example, in the technique of Patent Document 1, the stereoscopic effect is changed by moving a variable aperture of a camera, or a planar image is generated.

International Publication No. 2012/002070

  However, since it is necessary to provide a mechanical mechanism in the method of Patent Document 1, when mounting on an extremely small camera, the size of the camera is restricted by the mechanism.

  SUMMARY An advantage of some aspects of the invention is to provide a solid-state imaging device capable of changing a stereoscopic effect and switching between a stereoscopic image and a planar image without using a mechanical mechanism.

  In order to achieve the above object, a solid-state imaging device according to one embodiment of the present invention includes a pixel portion in which a plurality of pixels are arranged in a matrix, a condensing element disposed above the pixel portion, and signal processing Each of the plurality of pixels includes a photoelectric conversion unit, the pixel unit includes a plurality of pixel groups including a first pixel group, and each of the plurality of pixel groups includes the plurality of pixel groups. Among the pixels, the pixels are arranged in the same row and adjacent n columns (n: integer of 3 or more), and the signal processing unit is output from any pixel in the first pixel group. The first synthesized signal for forming the first planar image, the second synthesized signal for forming the first stereoscopic image, and the third synthesized signal are obtained by multiplying each of the received signals by an arbitrary real number and then adding them together. The signal is generated simultaneously or separately.

  In addition, the signal processing unit multiplies the signals output from arbitrary pixels in the first pixel group by arbitrary real numbers, and then adds them, thereby adding a second parallax different from the first stereoscopic image. The fourth synthesized signal and the fifth synthesized signal that form the three-dimensional image may be generated simultaneously with the first to third synthesized signals or separately.

  According to this aspect, a plurality of stereoscopic images and planar images having different parallaxes can be formed simultaneously or separately without using a mechanical mechanism.

  According to the present invention, it is possible to provide a solid-state imaging device capable of changing a stereoscopic effect without using a mechanical mechanism and switching between a stereoscopic image and a planar image.

The figure which shows schematic structure of the imaging device which concerns on embodiment of this invention. The figure which shows the optical concept which concerns on embodiment of this invention. The figure which shows an example of the pixel arrangement | sequence which concerns on embodiment of this invention. (A) (b) (c) is a figure which shows an example of the layout of the color filter which concerns on embodiment of this invention, respectively. 3A and 3B are examples of a cross-sectional structure of a pixel according to an embodiment of the present invention, where FIG. 3A is a cross-sectional view taken along the line XX ′ of FIG. 3A and 3B are examples of a cross-sectional structure of a pixel according to an embodiment of the present invention, where FIG. 3A is a cross-sectional view taken along the line XX ′ of FIG. 3A and 3B are examples of a cross-sectional structure of a pixel according to an embodiment of the present invention, where FIG. 3A is a cross-sectional view taken along the line XX ′ of FIG. It is the figure which simulated the optical path of the solid-state imaging device concerning the embodiment of the present invention, and (a) shows the simulation result when there is no partition and (b) has the partition. It is a figure which shows the relationship between the incident angle and sensitivity of the solid-state imaging device which concerns on embodiment of this invention, (a) is a figure which shows a simulation result in case there is no partition, (b) has a partition. 3A and 3B are examples of a cross-sectional structure of a pixel according to an embodiment of the present invention, where FIG. 3A is a cross-sectional view taken along the line XX ′ of FIG. 3A and 3B are examples of a cross-sectional structure of a pixel according to an embodiment of the present invention, where FIG. 3A is a cross-sectional view taken along the line XX ′ of FIG. 3 is an example of a cross-sectional structure of a pixel according to an embodiment of the present invention, and is a cross-sectional view taken along the line XX ′ of FIG. 3 is an example of a cross-sectional structure of a pixel according to an embodiment of the present invention, and is a cross-sectional view along YY ′ in FIG. 3. Diagram showing an example of the layout of a gradient index microlens Diagram showing an example of the layout of a gradient index microlens 3A and 3B are examples of a cross-sectional structure of a pixel according to an embodiment of the present invention, where FIG. 3A is a cross-sectional view taken along the line XX ′ of FIG. 3A and 3B are examples of a cross-sectional structure of a pixel according to an embodiment of the present invention, where FIG. 3A is a cross-sectional view taken along the line XX ′ of FIG. 3A and 3B are examples of a cross-sectional structure of a pixel according to an embodiment of the present invention, where FIG. 3A is a cross-sectional view taken along the line XX ′ of FIG. 3A and 3B are examples of a cross-sectional structure of a pixel according to an embodiment of the present invention, where FIG. 3A is a cross-sectional view taken along the line XX ′ of FIG. The figure which shows the outline of the optical path of the imaging device which concerns on embodiment of this invention. It is a conceptual diagram which shows an example of the method of acquiring a plane image with the imaging device which concerns on embodiment of this invention, (a) is a figure which shows the transmissive area | region determined virtually of the camera lens, (b) is from a pixel. (C) is a diagram showing the relationship between the incident angle of light and sensitivity It is a conceptual diagram which shows an example of the method of acquiring a plane image with the imaging device which concerns on embodiment of this invention, (a) is a figure which shows the transmissive area | region determined virtually of the camera lens, (b) is from a pixel. (C) is a diagram showing the relationship between the incident angle of light and sensitivity It is a conceptual diagram which shows an example of the method of acquiring a three-dimensional image with the imaging device which concerns on embodiment of this invention, (a) is a figure which shows the transmission region virtually determined of the camera lens, (b) is from a pixel. (C) is a diagram showing the relationship between the incident angle of light and sensitivity It is a conceptual diagram which shows an example of the method of acquiring a three-dimensional image with the imaging device which concerns on embodiment of this invention, (a) is a figure which shows the transmission region virtually determined of the camera lens, (b) is from a pixel. (C) is a diagram showing the relationship between the incident angle of light and sensitivity It is a conceptual diagram which shows an example of the method of acquiring a three-dimensional image with the imaging device which concerns on embodiment of this invention, (a) is a figure which shows the transmission region virtually determined of the camera lens, (b) is from a pixel. (C) is a diagram showing the relationship between the incident angle of light and sensitivity It is a conceptual diagram which shows an example of the method of acquiring a three-dimensional image with the imaging device which concerns on embodiment of this invention, (a) is a figure which shows the transmission region virtually determined of the camera lens, (b) is from a pixel. (C) is a diagram showing the relationship between the incident angle of light and sensitivity It is a conceptual diagram which shows an example of the method of acquiring a three-dimensional image with the imaging device which concerns on embodiment of this invention, (a) is a figure which shows the transmission region virtually determined of the camera lens, (b) is from a pixel. (C) is a diagram showing the relationship between the incident angle of light and sensitivity The figure which shows an example of the concept of the signal processing which concerns on embodiment of this invention The figure which shows an example of the concept of the signal processing which concerns on embodiment of this invention The figure which shows the simulation result of the oblique incidence characteristic before and behind the correction | amendment by the correction matrix which concerns on embodiment of this invention

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. Substantially the same configuration may be denoted by the same reference numeral and description thereof may be omitted. In addition, this invention is not limited to the following embodiment.

(Outline of imaging device)
FIG. 1 shows an outline of an imaging apparatus 100 according to the present embodiment. The camera lens 102 is composed of one. In addition, the imaging apparatus 100 includes an imaging unit 104 that receives light from the camera lens 102 and converts it into an electronic signal. The signal processing unit 106 processes a signal from the imaging unit 104 based on the control signal. The signal processing unit 106 may be formed on the same chip as the imaging unit 104 or may be formed on a separate chip. The signal processed by the signal processing unit 106 may be output to the monitor 108, stored in the recording medium 110, or output and storage may be performed simultaneously. Thus, the destination of the signal processed by the signal processing unit 106 is arbitrary.

  FIG. 2 shows an optical conceptual diagram of the lens according to the present embodiment. Light from the subject 200 is condensed on the solid-state imaging device 202 through the camera lens 102. The camera lens 102 is virtually divided into, for example, transmissive areas A, B, C, and D, and light passing through the respective areas is collected at a light receiving point 204.

(Pixel array)
FIG. 3 shows an example of pixel arrangement in the solid-state imaging device 202. The number of pixels is arbitrary. In the pixel unit 300, a plurality of pixels 300-pq (p, q: natural numbers) are arranged. It means that the pixel 300-pq is arranged at the coordinates of the p-th row and the q-th column. In the present specification, pixels arranged in the same row and adjacent n columns (n: an integer of 3 or more) are defined as a “pixel group”. In FIG. 3, pixels arranged in the same row and adjacent four columns form a pixel group. One color filter corresponds to one pixel group.

  In FIG. 3, different color filters are arranged for every two adjacent rows and four columns. That is, a color filter of the same color is arranged above a pixel group adjacent in the column direction. “G” means a green color filter, “B” means a blue color filter, and “R” means a red color filter, but it may be cyan, magenta, or yellow.

  Further, in the solid-state imaging device according to the present embodiment, different condensing elements are arranged for every four adjacent rows. Specifically, the condensing element 302 is arranged on each pixel group constituted by the pixels arranged from the first column to the fourth column, and is constituted by the pixels arranged from the fifth column to the eighth column. A condensing element 304 is disposed on each pixel group.

  The condensing elements 302 and 304 condense light to each pixel group arranged below each. Like this embodiment, the condensing element may be comprised with the lenticular lens by which the some convex lens was arrange | positioned along with parallel, for example. In this case, each of the light condensing elements 302 and 304 corresponds to one convex lens, and is disposed below each convex lens, and condenses light to the corresponding pixel group.

  4A, 4B, and 4C are diagrams showing variations in arrangement of the light collecting elements and the color filters, respectively. The arrangement shown below is an example, and the arrangement is arbitrary.

  FIG. 4A shows a case where the condensing elements 302a and 304a are arranged for every four adjacent rows. As shown in FIG. 3 and FIG. 4A, one kind of color filter is arranged for a plurality of pixels arranged in adjacent 1 row 4 columns, 2 rows 4 columns, or 4 rows 4 columns. May be.

  FIG. 4B shows a case where the light collecting elements 302b and 304b are arranged for every three adjacent rows. And as shown in FIG.4 (b), one type of color filter may be arrange | positioned with respect to the several pixel arrange | positioned at adjacent 1 row 3 columns or 3 rows 3 columns.

  FIG. 4C shows a case where the light collecting elements 302c and 304c are arranged for every five adjacent rows. And as shown in FIG.4 (c), one type of color filter may be arrange | positioned with respect to the several pixel arrange | positioned at adjacent 1 row 5 columns or 5 rows 5 columns.

(Back-illuminated type, laminated type)
5 (a) and 5 (b) show a case where the photoelectric conversion part is a back-illuminated type disposed on the wiring layer, or the photoelectric conversion film is sandwiched between a transparent upper electrode and an arbitrary lower electrode, and the lower electrode Sectional drawing in the case of the laminated type arrange | positioned on a wiring layer is shown. In this specification, words such as “upper” and “upper” mean the direction from the pixel to the light collecting element, and words such as “lower” and “lower” mean the opposite direction.

  FIG. 5A is a diagram showing an example of the XX ′ cross section of FIG. The condensing element 302 is disposed on the pixel group including the pixels 300-11 to 300-14, and the condensing element 304 is disposed on the pixel group including the pixels 300-15 to 300-18. ing. An interlayer film 500 and color filters 502 and 504 are disposed on the pixel. A color filter of the same color is disposed above the pixels 300-11 to 300-14 and the pixels 300-15 to 300-18 in each pixel group.

  The color filter is desirably arranged at a position closer to the pixel than the light collecting element. This is because incident light is scattered by the color filter, so that the amount of light received by the pixel decreases as the position of the color filter moves away from the pixel.

  The interlayer film 500 is composed of an insulating film. The interlayer film 500 plays at least one of the role of flattening the portion where the light collecting elements 302 and 304 are arranged, the role of ensuring the optical film thickness in design, and the role of ensuring electrical insulation.

  FIG. 5B is a diagram showing an example of a YY ′ cross section in FIG. 3. A color filter 506 having a color different from that of the color filter 502 is disposed on the pixels in the third and fourth rows and the first to fourth columns.

  Further, as shown in FIGS. 6A and 6B, the first partition wall 600 may be disposed between the color filters of different colors above the boundary between adjacent pixel groups. The first partition wall 600 may be a light shielding material such as a material having a different refractive index from the interlayer film 500 or a metal material. With this configuration, incident light is reflected by the first partition wall 600, and crosstalk to adjacent pixels can be suppressed.

  Further, the first partition wall 600 may be made of a material having a lower refractive index than the color filters 502, 504, and 506. In this case, since the light incident in the vicinity of the first partition wall 600 is polarized toward the color filter having a relatively high refractive index, crosstalk to adjacent pixels can be suppressed.

  As shown in FIGS. 7A and 7B, the shape of the first partition wall 600 is preferably such that the area of the upper surface (condenser element side) is smaller than the area of the lower surface (pixel side). This is because the amount of incident light reflected from the upper surface of the first partition wall 600 is suppressed.

  8A and 8B are optical simulations using the Finite-difference time-domain method (FDTD method) for the difference between the case where there is no first partition wall 600 made of a light shielding material and the case where there is no first partition wall 600. Results are shown.

  FIG. 8A shows a state where incident light collected by the light collecting element Z enters the pixel D when there is no partition, and FIG. 8B shows a case where there is a partition.

  As shown in FIG. 8A, when there is no partition, for example, light incident on the pixel D is incident on the adjacent pixel Y. On the other hand, as shown in FIG. 8B, when there is a partition wall, for example, light incident on the pixel X does not enter the pixel A, and light incident on the pixel D does not enter the pixel Y. Crosstalk can be suppressed.

  FIGS. 9A and 9B plot the incident angle characteristics of the imaging unit in FIGS. 8A and 8B with respect to the pixels A, B, C, and D, respectively. The vertical axis represents sensitivity [a. u. The horizontal axis represents the incident angle [°] of the incident light incident on the light condensing element Z.

  As shown in FIG. 9A, in the case where there is no partition wall, crosstalk occurs due to the light condensed on the adjacent condensing elements, particularly when the incident angle is about 15 ° or more and about −15 ° or less. . On the other hand, as shown in FIG. 9B, when there is a partition wall, the crosstalk can be suppressed particularly when the incident angle is about 15 ° or more and about −15 ° or less.

  As shown in FIGS. 10A and 10B, the second partition wall 1000 is disposed above the boundary between the pixels in each pixel group so as to separate adjacent color filters. May be. In this case, the second partition wall 1000 is preferably made of a material having a lower refractive index than the color filters 502, 504, and 506. With such a configuration, light incident in the vicinity of the second partition wall 1000 is polarized toward the color filter having a relatively high refractive index, so that crosstalk to adjacent pixels can be suppressed.

(Surface irradiation type)
FIGS. 11A and 11B are cross-sectional views in the case of the surface irradiation type in which the wiring layer is disposed on the photoelectric conversion unit.

  FIG. 11A and FIG. 11B are diagrams showing examples of the XX ′ section and the YY ′ section in FIG. 3, respectively. In the case of a front-illuminated imaging element, a microlens 1102 made of a material having a higher refractive index than the interlayer film 500 is disposed above the wiring layer 1100 and below the light condensing elements 302 and 304. Since incident light is collected by the microlens 1102, the wiring layer 1100 is less likely to be shielded from light.

  12A and 12B, instead of the microlens 1102, a refractive index distribution type microlens in which a plurality of light transmission films 1202 are arranged in a concentric structure with an axis in a direction perpendicular to the light receiving surface as a central axis. 1204 may be sufficient. The light transmission film 1202 may be any material that has an insulating property and a higher refractive index than the interlayer film 500.

  In this case, when the width of the adjacent light transmission film 1202 is approximately equal to or smaller than the wavelength of incident light incident on the image sensor, the effective refractive index felt by the light is the volume of the light transmission film 1202 and the interlayer film 500. It can be calculated by the ratio.

  12c and 12d are plan views showing the arrangement of the microlenses 1204. FIG. As shown in FIG. 12c, the concentric axis of the concentric structure of the microlens 1204 may be disposed so as to pass through the central axis of the corresponding pixel. Further, as shown in FIG. 12d, for example, the concentric axes of the microlenses 1204 at both ends in the pixel group may be shifted from the central axis of the corresponding pixel. The arrangement of the gradient index microlens 1204 according to the present embodiment is not limited to the arrangement shown in FIGS. 12c and 12d. The arrangement of the color filters is not limited to the arrangement shown in the figure.

  Further, as shown in FIGS. 13A and 13B, the wiring layer 1100 is penetrated above the pixel portion and below the condensing elements 302 and 304 in order to prevent light scattering loss. A disposed optical waveguide 1300 may be provided. The optical waveguide 1300 may be any material having a higher refractive index than the interlayer film 500.

  14A and 14B, the first partition wall 600 and the second partition wall 1000 are provided so as to separate the color filters 502 and 504 above the wiring layer 1100 and the optical waveguide 1300. May be arranged. With such a structure, light reflected by the wiring layer 1100 can be reduced.

  15A and 15B, a micro lens 1102 may be provided above the optical waveguide 1300, and color filters 502, 504, and 506 may be provided above the micro lens 1102. By setting it as such a structure, a condensing rate can further be improved. Note that, as shown in FIGS. 16A and 16B, a refractive index distribution type microlens 1204 may be arranged instead of the microlens 1102.

(Signal processing method)
A signal processing method for processing a signal from the imaging unit having the structure described above will be described below.

  FIG. 17 shows a state in which light that has passed through the camera lens 102 enters the pixels 300-11 to 300-18 shown in the XX ′ sectional view of FIG. 6A and is photoelectrically converted into a signal. FIG.

  Incident light that has passed through transmission areas A, B, C, and D defined by virtually dividing the camera lens 102 is referred to as incident light LA, LB, LC, and LD, respectively. The incident lights LA, LB, LC, and LD are collected on the corresponding pixels in each pixel group, and the photoelectrically converted signals are referred to as signals PA, PB, PC, and PD, respectively.

The first stereoscopic image is formed by a composite signal 3D _Left corresponding to the left eye and a composite signal 3D _Right corresponding to the right eye. The combined signal 3D _Left is expressed by Equation 1, and the combined signal 3D _Right is expressed by Equation 2.

α _3DL , β _3DL , γ _3DL , and δ _3DL represent coefficients (arbitrary real numbers) by which the signals PA, PB, PC, and PD are multiplied when a signal corresponding to the left eye is derived, and α _3DR , β _3DR , γ _3DR and δ _3DR represent coefficients (arbitrary real numbers) by which the signals PA, PB, PC, and PD are multiplied when a signal corresponding to the right eye is derived, respectively.

Further, a composite signal _{3D' Left} and synthesized signal _{3D' Right} to form a second three-dimensional image of the parallax different from the first three-dimensional image, the composite signal _{3D Left} synthetic signal _{3D Right} simultaneously be generated. That is, the solid-state imaging device according to the present embodiment can simultaneously form a plurality of stereoscopic images with different parallaxes. Of course, a plurality of stereoscopic images can be formed separately.

  A composite signal 2D for forming a planar image is expressed by Equation 3.

α _2D , β _2D , γ _2D , and δ _2D represent coefficients (arbitrary real numbers) by which the signals PA, PB, PC, and PD are multiplied when a planar image is acquired. According to the present embodiment, the composite signal 2D can be generated simultaneously with the composite signal for stereoscopic image formation. Of course, the planar image can be formed separately from the stereoscopic image.

[Plane image acquisition mode]
18 and 19 show conditions of two examples (planar mode 1 and planar mode 2) when a planar image is acquired.

(Plane mode 1)
As shown in FIGS. 18A and 18B, in the plane mode 1, two types of signals PB and PC generated by the light that has passed through the transmission regions B and C of the camera lens 102 are used. When the coefficient is determined as in Expression 4, the combined signal 2D is expressed as in Expression 5.

  As a result, the synthesized signal 2D is obtained as a synthesized sensitivity 1500 shown in FIG.

  As shown in FIGS. 19A and 19B, in the plane mode 2, four types of signals PA, PB, PC, and PD generated by light that has passed through the transmission areas A, B, C, and D of the camera lens 102 are obtained. Use the signal. When the coefficient is determined as in Expression 6, the combined signal 2D is expressed as in Expression 7.

  As a result, the synthesized signal 2D is obtained as a synthesized sensitivity 1502 shown in FIG.

  Note that the values of the coefficients of the combined signal 2D shown in Expression 4 and Expression 6 are examples. That is, the coefficient is not limited to the above-described values, and a flat image output by any combination of numerical values is possible. In addition, the combined signals represented by Expression 5 and Expression 7 can be output simultaneously, or can be output separately.

[Stereoscopic image acquisition mode]
20 to 24 show conditions of five types of modes (stereo modes 1 to 5) when a stereo image is acquired.

(3D mode 1)
As shown in FIGS. 20A and 20B, in the stereoscopic mode 1, two types of signals PB and PC generated by light passing through the transmission regions B and C of the camera lens 102 are used. When the coefficient of the composite signal 3D _Left corresponding to the left eye is determined as shown in Expression 8 and the coefficient of the composite signal 3D _Right corresponding to the right eye is determined as shown in Expression 9, the combined signals are expressed as Expression 10 and Expression 11, respectively.

As shown in FIG. 20 (c), in this case, the composite signal _{3D Left} showed the highest sensitivity at the incident angle of about 5 °, the combined signal _{3D Right} has the highest sensitivity at the incident angle of approximately -5 °.

(3D mode 2)
As shown in FIGS. 21A and 21B, in the stereoscopic mode 2, four types of signals PA, PB, PC, and PD generated by light passing through the transmission areas A, B, C, and D of the camera lens 102 are obtained. Use the signal. When the coefficient of the composite signal 3D _Left corresponding to the left eye is determined as shown in Expression 12 and the coefficient of the composite signal 3D _Right corresponding to the right eye is determined as shown in Expression 13, the combined signals are expressed as Expression 14 and Expression 15, respectively.

As shown in FIG. 21C, in this case, the synthesized signal 3D _Left shows the highest sensitivity at an incident angle of about 7 °, and the synthesized signal 3D _Right shows the highest sensitivity at an incident angle of about −7 °.

(3D mode 3)
As shown in FIGS. 22A and 22B, in the stereoscopic mode 3, four types of signals PA, PB, PC, and PD generated by the light that has passed through the transmission regions A, B, C, and D of the camera lens 102 are obtained. Use the signal. When the coefficient of the composite signal 3D _Left corresponding to the left eye is defined as Equation 16 and the coefficient of the composite signal 3D _Right corresponding to the right eye is defined as Equation 17, the composite signal is expressed as Equation 18 and Equation 19, respectively.

As shown in FIG. 22C, in this case, the synthesized signal 3D _Left shows the highest sensitivity at an incident angle of about 13 °, and the synthesized signal 3D _Right shows the highest sensitivity at an incident angle of about −13 °.

(3D mode 4)
As shown in FIGS. 23A and 23B, in the stereoscopic mode 4, two types of signals PA and PD generated by light passing through the transmission areas A and D of the camera lens 102 are used. If the coefficient of the composite signal 3D _Left corresponding to the left eye is defined as Equation 20 and the coefficient of the composite signal 3D _Right corresponding to the right eye is defined as Equation 21, the composite signal is expressed as Equation 22 and Equation 23, respectively.

As shown in FIG. _23C , in this case, the synthesized signal 3D _Left shows the highest sensitivity at an incident angle of about 13 °, and the synthesized signal 3D _Right shows the highest sensitivity at an incident angle of about −13 °.

(3D mode 5)
As shown in FIGS. 24A and 24B, in the stereoscopic mode 5, four types of signals PA, PB, PC, and PD generated by light passing through the transmission areas A, B, C, and D of the camera lens 102 are obtained. Use the signal. When the coefficient of the composite signal 3D _Left corresponding to the left eye is determined as shown in Expression 24 and the coefficient of the composite signal 3D _Right corresponding to the right eye is determined as shown in Expression 25, the combined signals are expressed as Expression 26 and Expression 27, respectively.

As shown in FIG. _24C , in this case, the combined signal 3D _Left shows the highest sensitivity from an incident angle of about 7 ° to 13 °, and the combined signal 3D _Right is the highest from an incident angle of about −7 ° to −13 °. High sensitivity is shown.

  As the mode shifts from the stereoscopic mode 1 to the stereoscopic mode 4, the coefficient multiplied by the signals PA and PD generated by the incident light passing through the transmission areas A and D near the outer edge of the camera lens 102 is increased, while the transmission near the center of the camera lens 102 is increased. The coefficients multiplied by the signals PB and PC generated by the incident light passing through the regions B and C are reduced. By doing so, it becomes possible to widen the interval between the average incident angle of the signal handled dynamically as the right eye, that is, the right eye centroid, and the average incident angle of the signal handled as the left eye, that is, the left eye centroid, by electronic control. By performing such signal processing, the distance between the eyes can be freely controlled, and a stereoscopic image having the optimal stereoscopic effect for the observer can be obtained.

  Also, in the stereoscopic mode 5, as compared with other modes, a highly sensitive stereoscopic image can be taken with respect to a wide incident angle as shown in FIG.

  In addition, the value of the coefficient of the composite signal in this embodiment is an example. That is, the coefficients are not limited to the above-described values, and image output by any combination of numerical values is possible.

(Selection method of used pixels)
Next, a method for selecting a signal to be used will be described. The signal to be used may be selected anywhere inside or outside the solid-state imaging device or outside the imaging device.

  For example, FIG. 25 shows an example of the case where it is performed inside a solid-state imaging device. Pixels 2202 are arranged in a matrix in the pixel portion 2200. An analog signal (pixel signal) photoelectrically converted by the pixel 2202 arranged in the row selected by the vertical scanning circuit 2211 via the selected row control line 2204 is output to the column signal line 2205. The analog signal is converted into a digital signal by the AD converter 2206 connected to the column signal line 2205. The use pixel selection unit 2214 selects only the digital signal to be used, and the multiplexer circuit 2208 selectively outputs it to the horizontal scanning circuit 2210.

  FIG. 25 is a diagram showing a case where only signals PB and PC are output. The signal output to the horizontal scanning circuit 2210 is input to the input I / F 2212. In this way, by acquiring only necessary signals from the solid-state imaging device and reducing transfer data, the signal processing speed can be improved.

  FIG. 26 shows a case where all signals PA, PB, PC, and PD are once output from the solid-state imaging device, and then the solid-state imaging device or signals (signals PB and PC) to be used outside the imaging device are selected. It is a figure. In this case, all digital signals converted by the AD converter 2206 are output to the horizontal scanning circuit and then input to the input I / F 2212. A signal to be used is selected by a solid-state imaging device or an external selection circuit 2216 provided outside the imaging device. In this way, if all data is output and stored in a storage medium outside the solid-state imaging device or outside the imaging device, any of the equations 1, 2 and 3 can be used even after imaging. A composite signal can be acquired.

(Correction matrix)
It is also possible to correct the angle component by calculating the signals PA, PB, PC, PD as shown in Equation 28.

Here, α _pq is a matrix component, and p and q indicate a row number and a column number, respectively. In the example of Expression 28, p and q are both integers of 1 or more and 4 or less. That is, n types of signals PA, PB, PC, and PD output from n (here, n = 4) pixels in each pixel group are multiplied by a correction coefficient and added together to obtain a new n. Kinds of signals PA ′, PB ′, PC ′, PD ′ are generated.

FIG. 27 is a diagram showing oblique incidence characteristics before and after correction. The vertical axis represents sensitivity [a. u. The horizontal axis represents the incident angle [°]. α _pq is derived using the oblique incidence characteristic before correction shown in FIG. That is, α _pq in Expression 28 may be set so as to reduce sensitivity at an incident angle at which crosstalk occurs between adjacent pixels. For example, in the case of the signal PB, α ₂₁ , α ₂₂ , α ₂₃ , and α ₂₄ that can derive PB ′ with reduced sensitivity when the incident angle is about −10 ° or less and about 0 ° or more may be set as appropriate. FIG. 27 shows the corrected oblique incidence characteristic obtained by the above method.

  The solid-state imaging device of the present invention can be used for a digital still camera, a digital video camera or a camera-equipped portable device, a medical or industrial endoscope camera, a distance measuring camera, and the like, and is industrially useful.

DESCRIPTION OF SYMBOLS 100 Image pick-up device 102 Camera lens 104 Image pick-up part 106 Signal processing part 108 Monitor 110 Recording medium 200 Subject 202 Solid-state image pick-up device 204 Receiving point 300 Pixel part 302, 304 Condensing element 302a-c, 304a-c Condensing element 500 Interlayer film 502 , 504, 506 Color filter 600 First partition 1000 Second partition 1100 Wiring layer 1102 Microlens 1202 Light transmission film 1204 Refractive index distribution type microlens 1300 Optical waveguide 2200 Pixel section 2202 Pixel 2204 Selected row control line 2205 Column signal Line 2206 AD converter 2208 Multiplexer circuit 2210 Horizontal scanning circuit 2211 Vertical scanning circuit 2212 Input I / F
2214 Used pixel selection unit 2216 External selection circuit

Claims (14)

A pixel portion in which a plurality of pixels are arranged in a matrix;
A light condensing element disposed above the pixel portion;
A signal processing unit,
Each of the plurality of pixels has a photoelectric conversion unit,
The pixel portion has a plurality of pixel groups including a first pixel group,
Each of the plurality of pixel groups is composed of pixels arranged in the same row and adjacent n columns (n: an integer of 3 or more) among the plurality of pixels.
The signal processing unit multiplies the signals output from arbitrary pixels in the first pixel group by arbitrary real numbers, respectively, and then adds them.
A first composite signal forming a first planar image;
A solid-state imaging device that generates the second synthesized signal and the third synthesized signal forming the first stereoscopic image simultaneously or separately. The signal processing unit multiplies the signals output from arbitrary pixels in the first pixel group by arbitrary real numbers, respectively, and then adds them.
A fourth combined signal and a fifth combined signal that form a second stereoscopic image having a different parallax from the first stereoscopic image;
The solid-state imaging device according to claim 1, wherein the solid-state imaging device is generated simultaneously with or separately from the first to third synthesized signals. The condensing element is composed of a lenticular lens in which a plurality of convex lenses are arranged in parallel,
The solid-state imaging device according to claim 1, wherein each convex lens is disposed below each convex lens and collects light to the corresponding pixel group. The solid-state imaging device further includes:
A plurality of color filters disposed above the pixel unit and below the light collecting element;
The solid-state imaging device according to claim 1, wherein the color filters of the same color are disposed above the pixels in each pixel group. The plurality of pixel groups include a first pixel group and a second pixel group in which the color filters of the same color are disposed above,
The solid-state imaging device according to claim 4, wherein the first pixel group and the second pixel group are adjacent to each other in a column direction. The solid-state imaging device further includes:
A first partition disposed between the color filters of different colors;
The solid-state imaging device according to claim 4, wherein the first partition is made of a material having a refractive index lower than that of the color filter or a light shielding material. The solid-state imaging device further includes:
A wiring layer disposed above the pixel portion and below the light collecting element;
The solid-state imaging device according to claim 1, further comprising: a plurality of microlenses arranged above the wiring layer and below the light collecting element. The solid-state imaging device according to claim 7, wherein each of the plurality of microlenses is a refractive index distribution type microlens in which a plurality of light transmission films are arranged in a concentric structure. The solid-state imaging device according to claim 8, wherein the microlens includes a refractive index distribution type microlens in which a central axis of the corresponding pixel and a concentric axis of the concentric structure are shifted from each other. The solid-state imaging device further includes:
A wiring layer disposed above the pixel portion and below the light collecting element;
An optical waveguide disposed above each pixel and disposed so as to penetrate the wiring layer;
The solid-state imaging device according to claim 1. The solid-state imaging device further includes:
A second partition disposed above the boundary between the pixels in each pixel group and disposed between the adjacent color filters;
The solid-state imaging device according to claim 4, wherein the second partition wall is made of a material having a refractive index lower than that of the color filter. The signal processing unit generates new n types of signals by multiplying n types of signals output from n pixels in each pixel group, respectively, after multiplying each by a correction coefficient. The solid-state imaging device according to any one of 11. The solid-state imaging device further includes a use pixel selection unit,
The solid-state imaging device according to claim 1, wherein the use pixel selection unit selects only a signal to be used among signals output from the pixels in each pixel group. An imaging apparatus including the solid-state imaging apparatus according to claim 1,
The imaging device includes a camera lens,
The camera lens is virtually divided into n transmission regions,
The incident light that has passed through the n regions is condensed by the light condensing element onto the corresponding pixel among n pixels in each pixel group.