JP2014161956A - Size management device for processing work in correct size - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a size management device for processing a work to a correct size by controlling the bottom surface position of the work.SOLUTION: A size management device 1 is for use in processing a work W to a correct size by incorporating in a machine tool 100 that includes: a work spindle 2, disposed freely rotatably in a base, for placing the work W on; a clamp device 3, disposed on the work spindle 2, for clamping the work W; a spindle device 103 for rotary-driving a rotary tool 105 used for processing the work W; and a spindle movement device for moving the spindle device 103. The device further includes: a hydraulic work bottom surface measurement device 4, disposed in the work spindle 2, for measuring a position of a bottom surface W1 of the work W by jetting a compressed fluid to the bottom surface W1; and bottom-surface position computation means 5 for determining whether the position of the bottom surface W1 is at a correct distance from a pre-set bottom-surface reference position h0, to calculate an increased or decreased distance relative to the correct distance.

Description

  The present invention relates to a dimension management apparatus, and more particularly, to a dimension management apparatus that manages the position of a seating surface of a workpiece and processes the workpiece into an appropriate dimension.

Conventionally, when an end surface (upper surface) of a silicon wafer (work) is ground by a vertical grinder, various dimension management devices are known to manage the thickness dimension of the work with high accuracy (for example, Patent Documents 1, 2).
The dimension management apparatus described in Patent Document 1 accurately measures the thickness of the workpiece by measuring the position of the upper surface of the workpiece and the position of the wafer holding table using a non-contact floating detector utilizing the air pressure ejected from the nozzle. It is something to manage.
The dimension management device described in Patent Document 2 is to accurately manage the thickness of a workpiece while measuring the thickness of the workpiece during grinding by the table surface measurement sensor 24 and the grinding surface measurement sensor 25. is there.

Japanese Patent Laying-Open No. 2003-97935 (paragraph 0038, FIG. 3) JP 2005-217326 A (paragraph 0023, FIG. 2)

  However, since the conventional dimension management apparatus measures the thickness dimension of the workpiece with reference to the wafer holding table, for example, the workpiece floats slightly from the wafer holding table that occurs when the workpiece is clamped to the wafer holding table. There was a problem of overlooking the dimensional error.

  This invention is made | formed in view of such a background, and makes it a subject to provide the dimension management apparatus which manages the bottom face position of a workpiece | work and processes a workpiece | work into an appropriate dimension.

  In order to solve the above-mentioned problem, the invention according to claim 1 of the present invention includes a base, a work spindle that is rotatably arranged on the base and places a work, and a clamp that clamps the work on the work spindle. Dimension management device mounted on a machine tool having a clamping device for rotating, a spindle device for rotationally driving a rotary tool for machining the workpiece, and a spindle moving device for moving the spindle device to machine the workpiece to an appropriate dimension A fluid-type workpiece bottom surface measuring device disposed on the workpiece spindle for measuring the position of the bottom surface by injecting pressure fluid onto the bottom surface of the workpiece; and a bottom surface reference position where the position of the bottom surface is set in advance. And a bottom surface position calculating means for determining whether or not the distance is appropriate and calculating an increase / decrease of the distance from the appropriate distance.

  The present invention, for example, measures the position of the bottom surface by injecting the pressure fluid onto the bottom surface of the workpiece by the fluid type workpiece bottom surface measuring device, for example, the bottom surface of the workpiece and the workpiece spindle side by the pressure fluid injected to the bottom surface of the workpiece It is possible to remove the processing powder and dust interposed between the two and the seating surface, and to perform accurate measurement, and to ensure a proper seating posture of the workpiece.

Further, the present invention obtains an increase / decrease between the position of the bottom surface and an appropriate distance with respect to a preset bottom surface reference position by a bottom surface position calculation means, so that the workpiece is properly clamped to a predetermined seating surface of the workpiece spindle without contact. It is possible to determine whether the workpiece has been lifted from the seating surface.
For this reason, for example, when it is determined that the lifting amount exceeds a preset threshold value and is not properly clamped, a warning can be issued and the operator can reconfirm the clamping state of the workpiece. Further, when it is determined that the lift amount is within a preset threshold value and is properly clamped, the cutting amount of the rotary tool can be set in consideration of the determined lift amount.
Thus, the dimension management apparatus according to the present invention can measure the bottom position of the workpiece, monitor the seating posture of the workpiece, and process the workpiece to an appropriate dimension.

  The invention according to claim 2 of the present invention is the dimension management device according to claim 1, wherein the fluid-type workpiece bottom surface measuring device is provided on the workpiece spindle and has a seating surface on which the workpiece is placed. And a nozzle that is formed on the seat plate and injects the pressure fluid onto the bottom surface of the workpiece.

  With this configuration, according to the second aspect of the present invention, the nozzle for injecting the pressure fluid to the bottom surface of the workpiece is provided on the seat plate on which the seating surface is formed, so that the pressure fluid is reliably injected to the bottom surface of the workpiece. can do.

  The invention according to claim 3 of the present invention is the dimension management device according to claim 1 or 2, wherein the position of the workpiece surface is measured by injecting the pressure fluid onto the workpiece surface of the workpiece. A fluid type work surface measurement apparatus, and a correction cutting amount calculation means for obtaining an appropriate cutting amount by adding or subtracting an increase / decrease in the distance from the appropriate distance with respect to the position of the processing surface. Features.

  With such a configuration, the invention according to claim 3 of the present invention is configured to add or subtract the amount of increase / decrease of the distance from the appropriate distance by the correction cutting amount calculation means, and set an appropriate cutting amount, so that the workpiece can be removed from the seating surface. Since the lifting amount can be canceled and the workpiece can be efficiently processed to an appropriate dimension, it is possible to improve productivity by suppressing a reduction in the operation rate.

  The invention according to claim 4 of the present invention is the dimension management device according to any one of claims 1 to 3, wherein the fluid type work surface measuring device is disposed in the spindle device. Then, the fluid workpiece work surface measuring device moves together with the rotary tool mounted on the spindle device.

With such a configuration, the invention according to claim 4 of the present invention is such that the fluid-type workpiece surface measurement device is arranged in the main spindle device, so that the cutting direction of the rotary tool during the machining of the workpiece by the rotary tool. Since the fluid workpiece workpiece surface measuring device can be moved integrally with the feed, measurement by the fluid workpiece workpiece surface measuring device is possible even during machining.
On the other hand, after completion of machining of the workpiece by the rotary tool, the fluid workpiece workpiece surface measuring device can be retracted from the workpiece integrally with the rotary tool, so that the workpiece can be quickly attached and detached.

  Thus, in the invention according to claim 4 of the present invention, the position of the fluid type work surface measurement apparatus is appropriately adjusted by moving the fluid type work surface measurement apparatus using the spindle moving device. Since it is not necessary to separately provide a moving device for the fluid workpiece work surface measuring device, it is possible to simplify the configuration of the machine tool and make it compact.

  The dimension management device according to the present invention can manage the bottom surface position of a workpiece and process the workpiece into an appropriate dimension. For this reason, the machine tool equipped with the dimension management device according to the present invention can improve productivity by suppressing a decrease in the operation rate while improving the machining accuracy.

It is side surface sectional drawing which shows the whole structure which applied the dimension management apparatus which concerns on embodiment of this invention to the vertical grinding machine. 1 is a partially enlarged sectional view of FIG. 1 showing a configuration of a vertical grinding machine according to an embodiment of the present invention, wherein (a) shows a configuration around a workpiece spindle and a clamping device, and a left half diagram clamps the workpiece with a clamping device. The right half figure shows the unclamped state, and (b) shows the configuration around the spindle device. It is typical sectional drawing which shows the structure of the dimension management apparatus which concerns on embodiment of this invention. It is a schematic diagram for demonstrating operation | movement of the dimension management apparatus which concerns on embodiment of this invention, (a) is front sectional drawing which shows the state which aligned the spindle apparatus with the measurement origin, (b) is correction | amendment cutting amount. It is a front view for demonstrating. It is a flowchart which shows operation | movement of the dimension management apparatus which concerns on embodiment of this invention.

  The dimension management device 1 according to the embodiment of the present invention will be described in detail with reference to the drawings as appropriate, taking as an example a case where the size management device 1 is applied to a desktop vertical grinding machine 100 which is a machine tool. In the present embodiment, the present invention is applied to the vertical grinder, but can be applied to other machine tools such as a horizontal grinder and a machining center.

<Outline of vertical grinding machine>
As shown in FIG. 1, the vertical grinding machine 100 includes a workpiece spindle 2 that is rotatably arranged on a base 101, a drive device 102 that rotates the workpiece spindle 2, and a clamping device that is arranged on the workpiece spindle 2. 3, a spindle device 103 that rotationally drives a rotating grindstone 105 that is a rotary tool, a spindle moving device 104 that moves the spindle device 103, and a control device 106 that controls the operation.

  In the vertical grinding machine 100, auxiliary devices such as a processing chamber cover and a coolant supply device are not particularly limited, and illustration and detailed description thereof are omitted for convenience of explanation.

The vertical grinding machine 100 grinds the upper surface W2 (end surface) of the workpiece W by rotating the workpiece W clamped on the upper surface of the workpiece spindle 2 with a rotating grindstone 105 that is driven to rotate by the spindle device 103. Is processed to a predetermined tolerance.

  As shown in FIG. 1, the base 101 includes a base part 101a, a standing frame part 101b extending upward from the base part 101a, and a horizontal frame part 101c extending horizontally from the standing frame part 101b. The work spindle 2 is rotatably supported by the horizontal frame portion 101c, and the spindle device 103 is movably supported by the standing frame portion 101b.

  As shown in FIG. 2A, the work spindle 2 is provided in a cylindrical housing 21 fixed to the horizontal frame portion 101 c (see FIG. 1), and is rotatably installed in the housing 21 via a bearing 22. Rotating main shaft 23, workpiece mounting portion 23 a fixed to the upper portion of rotating main shaft 23, and air supply path 24 for supplying compressed air to the upper portion of workpiece mounting portion 23 a, and the workpiece mounting portion A work W is placed on 23a and rotated.

  The air supply path 24 is formed up to the upper part of the work mounting part 23a through the rotary spindle 23 and the work mounting part 23a. The air supply path 24 is rotatable such as a rotary joint 25 (see FIG. 1). Compressed air is supplied from an air source 26 (see FIG. 1) via a connecting member.

  As shown in FIG. 1, the drive device 102 is a device that rotationally drives the work spindle 2, and includes a drive motor 102 a and a transmission mechanism 102 b that transmits the driving force of the drive motor 102 a to the work spindle 2. However, it is not particularly limited.

  As shown in FIG. 2 (a), the clamp device 3 includes a chuck device 31 disposed on the workpiece mounting portion 23a, a draw bar 32 that drives the chuck device 31, and a chuck that biases the draw bar 32 downward. The urging means 33 that clamps with the device 31 (see the left figure in FIG. 2A), and the draw bar 32 is pushed up against the urging force of the urging means 33 by an actuator or the like to unclamp the chuck device 31. And an unclamping device 34 (see FIG. 1) that expands in the direction (see the right half of FIG. 2A).

  With this configuration, the clamp device 3 urges the draw bar 32 downward by the urging means 33, thereby moving the chuck device 31 horizontally in the direction of diameter reduction to clamp the workpiece W (see FIG. 2A). (See the left half figure), and by pushing up the draw bar 32 upward, the chuck device 31 is moved horizontally in the diameter increasing direction to unclamp the work W (see the right half figure in FIG. 2A). However, since various forms can be adopted and are not particularly limited, detailed description will be omitted.

As shown in FIG. 2B, the spindle device 103 includes a spindle 103a to which a rotating grindstone 105 is detachably mounted, and a spindle head 103c that rotatably supports the spindle 103a by a bearing 103b.
As shown in FIG. 1, the main shaft moving device 104 is a device that moves the main shaft device 103 in the axial direction (vertical direction, Z-axis direction) and in the front-rear direction (Y-axis direction). The spindle moving device 104 can move the rotating grindstone 105 mounted on the spindle 103a in the Z-axis direction and the Y-axis direction by moving the spindle device 103.

  As shown in FIG. 1, the control device 106 includes a work spindle control device 106 a that controls the operations of the workpiece spindle 2 and the clamping device 3, a spindle control device 106 b that controls the operations of the spindle device 103 and the spindle movement device 104, It has.

  In the present embodiment, for convenience of explanation, the control device 106 and the dimension management device 1 of the vertical grinding machine 100 will be described separately for convenience. However, the control device 106 and the dimension management device 1 may be configured separately. In a state where 1 is mounted on the vertical grinding machine 100, it may be configured collectively.

<Dimension management device>
Next, the dimension management device 1 will be described in detail with reference mainly to FIGS. 3 and 4. FIG. 3 is a cross-sectional view showing the configuration of the dimension management device, and shows an exaggerated view of the workpiece floating in the clamped state. FIG. 4 is a schematic front cross-sectional view for explaining the operation of the dimension management device. (A) is a state in which the spindle device is positioned at a preset measurement origin position with respect to the workpiece, and (b) is a corrected cutting amount. It is a figure which shows the relationship between the state (left figure) and the contact | adherence state (right figure) in which the workpiece | work for demonstrating was lifted from the seating surface.

The dimension management device 1 increases or decreases (high) the distance between the position of the bottom surface W1 of the fluid type workpiece bottom surface measuring device (bottom surface measuring device 4) that measures the position of the bottom surface W1 of the workpiece W and the preset bottom surface reference position h0. A bottom surface position calculating means 5 for obtaining a difference in thickness), a fluid type work surface measuring device (upper surface measuring device 6) for measuring the position of the processing surface (the upper surface W2 of the workpiece W), and a workpiece from the bottom surface reference position h0. The distance between the upper surface position calculating means 7 for determining the distance to the position of the upper surface W2 of W, the pre-correction cutting amount calculating means 81 for determining the cutting amount of the rotating grindstone 105 from the position of the upper surface W2 of the workpiece W, and the bottom surface reference position h0. And a correction cutting amount calculation means 8 for obtaining a correction cutting amount t2 by increasing / decreasing the increase / decrease to the pre-correction cutting amount t1.
In the vertical grinding machine 100 according to the present embodiment, the distance from the bottom surface reference position h0 corresponds to the “height”, and therefore, in relation to the bottom surface reference position h0, “the height from the bottom surface reference position h0”. May be displayed.

<Bottom measurement device>
The bottom surface measuring device 4 is a device that measures the position of the bottom surface W1 of the workpiece W, specifically, as an example, the distance δ1 from the nozzle 42a of the nozzle 42 to the bottom surface W1 of the workpiece W, and places the workpiece W thereon. A seat plate 41, a nozzle 42 formed on the seat plate 41, a pressure measuring device 43 that measures the pressure of compressed air injected from the nozzle 42, and a bottom surface W <b> 1 of the workpiece W from the pressure measured by the pressure measuring device 43. Pressure calculating means 44 for determining the position of

The seat plate 41 is disposed on a work placement portion 23a fixed to the upper part of the rotation spindle 23, and a seating surface 41a on which the work W is placed, and a bottom surface of the work W on which the opening portion is placed on the seating surface 41a. And a gap 41b formed so as to be covered with W1.
The seating surface 41a is a reference surface on which the workpiece W is seated in close contact, and is set to the bottom surface reference position h0 in the present embodiment.

  The nozzle 42 penetrates the seat plate 41 in the thickness direction and is formed in the gap portion 41b so that the injection port 42a opens from below. The nozzle 42 is connected to an air supply path 24 that supplies compressed air to the upper part of the workpiece mounting portion 23a, and is supplied with compressed air from the air source 26 (see FIG. 1) through the air supply path 24. It has become. For this reason, the compressed air injected from the injection port 42a is injected toward the bottom face W1 of the workpiece | work W perpendicularly | vertically through the space | gap part 41b.

The pressure measuring instrument 43 measures the pressure (pressure fluctuation) in the air supply path 24 by the compressed air injected from the nozzle 42 onto the bottom surface W1 of the workpiece W. The pressure calculation means 43 calculates the position of the bottom surface of the workpiece W from the pressure measured by the pressure measuring device 43, and obtains the distance δ1 from the injection port 42a of the nozzle 42 to the bottom surface W1 of the workpiece W.
In this way, the bottom surface measuring device 4 determines the distance δ1 from the nozzle 42a of the nozzle 42 to the bottom surface W1 of the workpiece W.

In this embodiment, the gap 41b is formed in the seat plate 41, and the compressed air is jetted from the nozzle 42 to the bottom surface W1 of the work W through the gap 41b. However, the present invention is not limited to this. Instead, the compressed air may be injected to the bottom surface W1 of the workpiece W in a state of being in close contact with the seating surface 41a without forming the gap portion 41b.
Thus, in the present embodiment, by forming the gap 41b, the contact area between the bottom surface W1 of the workpiece W and the seating surface 41a is reduced, and compressed air is spread over a wide range of the bottom surface W1 of the workpiece W. By spraying, it is possible to efficiently and reliably remove processed powder and dust.

The bottom surface position calculation means 5 is a calculation device that calculates increase / decrease in the distance between the position of the bottom surface W1 of the workpiece W obtained by the bottom surface measurement device 4 and the bottom surface reference position h0 (sitting surface 41a).
The bottom surface reference position h0 is a reference surface for managing the height dimension of the workpiece W, and can be set arbitrarily. In the present embodiment, the bottom surface reference position h0 is formed on the upper surface of the seat plate 41 that is easy to manage the accuracy. Is set on the seating surface 41a of the workpiece W.

When the seating surface 41a of the workpiece W is set as the bottom surface reference position h0, when the seating posture of the workpiece W is appropriate, the bottom surface W1 of the workpiece W and the seating surface 41a are in close contact with each other. The distance between the position and the bottom reference position h0 = 0.
Therefore, in this embodiment, “increase or decrease in the distance between the position of the bottom surface W1 of the workpiece W and the bottom surface reference position h0” is the distance from the bottom surface reference position h0 to the bottom surface W1 of the workpiece W, that is, the height h1 (increment). equal.

Here, the height z1 from the nozzle 42a of the nozzle 42 to the seating surface 41a of the workpiece W is a known numerical value that is measured in advance and stored in a storage unit (not shown).
Accordingly, since the distance δ1 from the injection port 42a to the bottom surface W1 of the workpiece W is obtained by the pressure calculation unit 43, the bottom surface position calculating unit 5 has a height h1 from the bottom surface reference position h0 to the bottom surface W1 of the workpiece W. H1 = δ1−z1.

<Fluid workpiece processing surface measuring device (upper surface measuring device)>
The upper surface measuring device 6 is a position of the upper surface W2 of the workpiece W, which is the surface to be processed, specifically, as an example in a state where the spindle device 103 is positioned at a preset measurement origin position (the position in FIG. 4A). This is an apparatus for measuring a distance δ2 (see FIG. 4) from the nozzle 61a of the nozzle 61 to the upper surface W2 of the workpiece W.
As shown in FIG. 3, the upper surface measuring device 6 includes a nozzle 61 that injects compressed air onto the upper surface W <b> 2 of the workpiece W, an air supply path 62 that supplies compressed air to the nozzle 61, and a pressure fluid that is injected from the nozzle 61. A pressure measuring device 63 that measures the pressure of the workpiece W, and a pressure calculating means 64 that obtains the position of the upper surface W2 of the workpiece W from the pressure measured by the pressure measuring device 63.

The nozzle 61 is fixed to the spindle head 103c so that the injection port 61a opens downward. With this configuration, the nozzle 61 and the rotating grindstone 105 can be moved together by moving the spindle head 103c with the spindle moving device 104.
For this reason, during the processing of the workpiece W, the nozzle 61 can be moved integrally in accordance with the feed in the cutting direction of the rotating grindstone 105, so that measurement during grinding can be performed. On the other hand, after the processing of the workpiece W by the rotating grindstone 105 is completed, the nozzle 61 can be retracted from the workpiece W integrally with the rotating grindstone 105, so that the workpiece W can be easily attached and detached.

  The air supply path 62 is formed in the spindle head 103c. The nozzle 61 communicates with an air supply path 62 for supplying compressed air, and compressed air is supplied from the air source 26 (see FIG. 1) through the air supply path 62. For this reason, the compressed air injected from the injection port 61a is injected perpendicularly toward the upper surface W2 of the workpiece W.

  The pressure measuring device 63 measures the pressure (pressure fluctuation) in the air supply path 62 due to the compressed air injected from the nozzle 61 onto the upper surface W2 of the workpiece W. The pressure calculation means 64 calculates the position of the upper surface W2 of the workpiece W from the pressure measured by the pressure measuring device 63, and obtains the distance δ2 from the injection port 61a of the nozzle 61 to the upper surface W2 of the workpiece W.

<Upper surface position calculation means>
The upper surface position calculating means 7 is an arithmetic device that calculates the height h2 from the bottom surface reference position h0 to the upper surface W2 of the workpiece W.
Here, the height z2 from the bottom surface reference position h0 to the injection port 61a of the nozzle 61 is measured in advance from the measurement origin position (position of FIG. 4A) of the spindle device 103 and stored in a storage means (not shown). Is a known numerical value.
Accordingly, since the distance δ2 from the injection port 61a of the nozzle 61 to the upper surface W2 of the work W is obtained by the pressure calculating means 64, the upper surface position calculating means 7 is high from the bottom surface reference position h0 to the upper surface W2 of the work W. The length h2 can be obtained from h2 = z2-δ2.

<Cutting amount calculation means before correction>
4B, the pre-correction cut amount t1 is a pre-correction cut amount that is not corrected based on the position of the bottom surface W1 of the workpiece W, and only the position T1 of the top surface W2 of the workpiece W. This is the amount of cut obtained from. Therefore, when it is assumed that the workpiece W is properly clamped in close contact with the seating surface 41a, the workpiece W can be processed into an appropriate thickness dimension T0.
The pre-correction cut amount calculation means 81 subtracts an appropriate thickness dimension T0 of the workpiece W from the height h2 from the bottom surface reference position h0 to the upper surface W2 of the workpiece W to obtain a pre-correction cut amount t1 = h2-T0.

<Correction cut amount>
As shown in the left diagram of FIG. 4B, the corrected cut amount t2 is a cut obtained by correcting the lift amount h1 of the workpiece W relative to the cut amount before correction in a state where the workpiece W is lifted by h1 from the seating surface. Amount.
Therefore, in the state where the workpiece W is lifted from the seating surface 41a by the height h1, the corrected cut amount t2 = t1-h1 with respect to the cut amount t1 before correction.
The corrected cutting amount calculation means 8 obtains a corrected cutting amount t2 by increasing / decreasing (subtracting) the increase / decrease (lift amount = height h1) of the distance from the bottom surface reference position h0 to the pre-correction cutting amount t1.

Next, the operation of the dimension management apparatus 1 according to the embodiment of the present invention will be described mainly with reference to FIGS.
When the operator M sets the workpiece W on the seat plate 41 and presses an activation button (not shown), the vertical grinding machine 100 drives the clamping device 3 by the control device 106 to clamp the workpiece W (step S1). ). The vertical grinding machine 100 moves the spindle device 103 by the spindle moving device 104 to align the spindle device 103 and the upper surface measuring device 6 with the measurement origin position (see FIG. 4A) (step S2).

The dimension management device 1 measures the distance δ1 from the injection port 42a of the nozzle 42 to the bottom surface W1 of the workpiece W by the bottom surface measuring device 4 (step S3), and the bottom surface position calculation means 5 from the bottom surface reference position h0 to the workpiece W. The distance h1 to the bottom surface W1 is obtained (step S4).
The dimension management device 1 measures the distance δ2 from the nozzle 61a of the nozzle 61 to the upper surface W2 of the workpiece W by the upper surface measuring device 6 (step S5), and the upper surface position calculation means 7 from the bottom surface reference position h0 to the upper surface W2. Distance h2 is obtained (step S6).

  In this embodiment, steps S3 and S4 are executed, and then steps S5 and S6 are executed. However, the present invention is not limited to this, and steps S5 and S6 are executed, and then steps S3 and S4 May be executed.

  The dimension management device 1 obtains the pre-correction cut amount t1 = h2−T0 by the pre-correction cut amount calculation means 81 (step S7), and obtains the correction cut amount t2 = t1−h1 by the correction cut amount calculation means 8 (step S7). Step S8).

  The vertical grinding machine 100 sets the corrected cutting amount t2 obtained by the dimension management device 1 as the cutting amount, moves the spindle device 103 in the Z-axis direction by the spindle moving device 104, and rotates the rotating grindstone 105. However, from the state where the rotating grindstone 105 is in contact with the workpiece W, the cutting is performed by the correction cutting amount t2 (step S9).

  Here, the position at which the grinding wheel 105 is brought into contact with the workpiece W and the grinding is started is determined in advance by the height difference δ3 (see FIG. 4A) between the nozzle 61a of the nozzle 61 and the lower surface of the grinding wheel 105. It can be obtained by measuring and storing.

  That is, the height (corresponding to δ3) from the upper surface W2 of the workpiece W to the ejection port 61a of the nozzle 61 in a state where the rotating grindstone 105 is in contact with the workpiece W is obtained by the upper surface measuring device 6 (see FIG. 3). For example, when the rotating grindstone 105 sets the correction cut amount t2 from the position shown in FIG. 4A, the height h3 from the lower surface of the rotating grindstone 105 to the upper surface W2 of the workpiece W is δ2−δ3. Therefore, the feed amount of the rotating grindstone 105 in the Z-axis direction (see FIG. 1) may be set to “δ2−δ3 + t2”.

The dimension management device 1 according to the embodiment of the present invention configured as described above has the following operational effects.
The dimension management device 1 determines whether or not the workpiece W is properly clamped on the seating surface 41a in a non-contact manner by the bottom surface measuring device 4 and the bottom surface position calculation means 5, and obtains the amount of lifting of the workpiece W from the seating surface 41a. By setting the appropriate correction cut amount t2 by the correction cut amount calculation means 8, the workpiece W can be efficiently machined to an appropriate dimension, so that the productivity can be improved by suppressing the decrease in the operation rate. it can.

As mentioned above, although embodiment of this invention was described, this invention is not limited to above-mentioned each embodiment, It can change suitably and can implement.
For example, in the present embodiment, the correction cutting amount t2 obtained by the dimension management apparatus 1 is set as the cutting amount (steps S8 to S9), but the present invention is not limited to this, and the correction cutting amount t2 = A judgment means is provided for judging whether or not t1-h1 is within a predetermined threshold value (lifting limit value). If the lifting value exceeds the lifting value limit value, an operator may use a lamp or a buzzer. M may be warned and alerted.

  In the present embodiment, the air pressure type using the injection pressure of compressed air is adopted as the bottom surface measuring device 4 and the top surface measuring device 6, but the invention is not limited to this, and a hydraulic type using water pressure or hydraulic pressure is used. A non-contact measuring device can also be adopted.

DESCRIPTION OF SYMBOLS 1 Dimension management apparatus 2 Work spindle 3 Clamp apparatus 4 Bottom surface measuring device (fluid type work bottom surface measuring device)
5 Bottom surface position calculation means 6 Top surface measuring device (fluid workpiece work surface measuring device)
7 Upper surface position calculating means 8 Correction cutting amount calculating means 24 Air supply path 41 Seat plate 41a Seating surface 41b Gap part 42 Nozzle 43 Pressure measuring instrument 44 Pressure calculating means 61 Nozzle 62 Air supply path 63 Pressure measuring instrument 64 Pressure calculating means 81 Correction Precut amount calculation means 100 Vertical grinding machine 103 Spindle device 104 Spindle moving device 105 Rotary grindstone T0 Appropriate thickness dimension T1 Top surface position W Work W1 Bottom surface W2 Top surface (Work surface)
h0 Bottom reference position h1 Height from bottom reference position to workpiece bottom (increase / decrease with appropriate distance)
h2 Height from bottom surface reference position to workpiece top surface

Claims (4)

Base and
A work spindle that is rotatably disposed on the base and places the work;
A clamping device disposed on the workpiece spindle and clamping the workpiece;
A spindle device for rotationally driving a rotary tool for machining the workpiece;
A spindle control device that moves the spindle device, and a dimension management device that is mounted on a machine tool having the spindle device to process the workpiece into an appropriate dimension,
A fluid-type workpiece bottom surface measuring device that is disposed on the workpiece spindle and injects pressure fluid onto the bottom surface of the workpiece to measure the position of the bottom surface;
Determining whether or not the position of the bottom surface is an appropriate distance with respect to a preset bottom surface reference position, and determining the increase or decrease of the distance from the appropriate distance;
A dimension management device comprising: The fluid type work bottom measuring device is
A seat plate disposed on the work spindle and having a seating surface on which the work is placed;
A nozzle formed on the seat plate for injecting the pressure fluid to the bottom surface of the workpiece;
The dimension management device according to claim 1, comprising: A fluid type work surface measurement device for injecting pressure fluid onto the work surface of the work and measuring the position of the work surface;
Correction cutting amount calculation means for calculating an appropriate cutting amount by adding or subtracting an increase / decrease of the distance from the appropriate distance with respect to the position of the processing surface;
The dimension management apparatus according to claim 1, further comprising: The fluid type work surface measurement apparatus is disposed in the spindle device, and the fluid type work surface measurement apparatus moves as a unit with the rotary tool mounted on the spindle device,
The dimension management apparatus according to any one of claims 1 to 3, wherein:

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