JP2014160775A - Substrate transfer apparatus, substrate processing apparatus and substrate storage method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To store a substrate appropriately for a cassette.SOLUTION: A substrate transfer apparatus according to an embodiment comprises: a substrate transfer part; a detection part; and a control device. The substrate transfer part delivers substrates to and from a cassette capable of storing a plurality of substrates. The detection part detects the substrate stored in the cassette. The control device controls the substrate transfer part. The control device includes a transfer control part, a determination part and a correction part. The transfer control part controls the substrate transfer part to store the substrate in a preliminarily fixed target storage position. The determination part determines after the detection part detects the substrate stored in the cassette, an actual storage position of the concerned substrate based on the detection result of the detection part. The correction part corrects, on the basis of a gap between the actual storage position and the target storage position of the substrate, the target storage position preliminarily fixed as a storage position of another substrate.

Description

  Embodiments disclosed herein relate to a substrate transport apparatus, a substrate processing apparatus, and a substrate accommodation method.

  2. Description of the Related Art Conventionally, there has been known a substrate processing apparatus that performs processing by sequentially removing substrates from a cassette in which a plurality of substrates are accommodated.

  For example, in Patent Document 1, each storage position of a substrate stored in a cassette is specified by using a detection unit such as a transmission sensor, and the substrate is taken out from the cassette according to the specified storage position, and the same cassette of the extracted substrate is stored. A substrate processing apparatus for performing return to the home is disclosed.

Japanese Patent Laid-Open No. 11-145244

  By the way, when the substrate taken out from the cassette is returned to another cassette instead of the original cassette, it is difficult to grasp the accommodation position in another cassette using the above-described conventional technology. For this reason, in such a case, the substrate is accommodated in accordance with the target accommodation position stored in advance.

  However, for example, if the cassette is not correctly placed on the mounting table or is slightly distorted, the target storage position stored in advance and the actual storage position are shifted, so that the substrate is appropriately stored in the cassette. There is a risk that it will not be possible.

  An object of one embodiment is to provide a substrate transport apparatus, a substrate processing apparatus, and a substrate accommodation method that can appropriately accommodate a substrate in a cassette.

  A substrate transfer apparatus according to an aspect of an embodiment includes a substrate transfer unit, a detection unit, and a control device. The substrate transfer unit transfers the substrate to and from a cassette that can store a plurality of substrates. A detection part detects the board | substrate accommodated in the cassette. The control device controls the substrate transport unit. In addition, the control device includes a conveyance control unit, a determination unit, and a correction unit. The conveyance control unit controls the substrate conveyance unit so as to accommodate the substrate with respect to a predetermined target accommodation position. The determination unit determines the actual storage position of the substrate based on the detection result of the detection unit after the detection unit detects the substrate stored in the cassette. The correction unit corrects the target accommodation position determined in advance as the accommodation position of another substrate based on the deviation between the actual accommodation position of the substrate and the target accommodation position.

  According to one aspect of the embodiment, the substrate can be appropriately accommodated in the cassette.

FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to the first embodiment. FIG. 2A is a diagram illustrating a schematic configuration of a cassette and a substrate detection unit. FIG. 2B is a diagram illustrating a schematic configuration of the cassette and the substrate detection unit. FIG. 3A is a schematic perspective view of a first holding unit provided in the substrate transfer apparatus. FIG. 3B is a schematic perspective view of a second holding unit provided in the substrate transfer apparatus. FIG. 4 is a block diagram illustrating a configuration of the control device. FIG. 5A is an explanatory diagram of determination processing by the determination unit. FIG. 5B is an explanatory diagram of determination processing by the determination unit. FIG. 6 is a flowchart showing a processing procedure of substrate accommodation processing executed by the substrate processing apparatus. FIG. 7 is a flowchart showing a processing procedure of substrate accommodation processing according to the second embodiment. FIG. 8 is an explanatory diagram for predicting the amount of deviation between the target storage position of the next wafer and the actual storage position.

  Hereinafter, embodiments of a substrate transfer apparatus, a substrate processing apparatus, and a substrate accommodation method disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

(First embodiment)
First, a schematic configuration of the substrate processing apparatus according to the first embodiment will be described with reference to FIG. FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to the first embodiment.

  In the following, in order to clarify the positional relationship, the X axis, the Y axis, and the Z axis that are orthogonal to each other are defined, and the positive direction of the Z axis is the vertically upward direction. In the following, the X-axis negative direction side is defined as the front side of the substrate processing apparatus, and the X-axis positive direction side is defined as the rear side of the substrate processing apparatus.

  As shown in FIG. 1, the substrate processing apparatus 100 includes a carry-in / out station 1, a transfer station 2, and a processing station 3. The carry-in / out station 1, the transfer station 2, and the processing station 3 are arranged in order of the carry-in / out station 1, the transfer station 2, and the processing station 3 from the front to the rear of the substrate processing apparatus 100.

  The carry-in / out station 1 is a place where a plurality of cassettes are placed. For example, four cassettes C <b> 1 to C <b> 4 are placed side by side in a state of being in close contact with the front wall of the transfer station 2. Each of the cassettes C1 to C4 is a storage container that can store a plurality of wafers W in a horizontal posture in multiple stages.

  The transfer station 2 is arranged behind the loading / unloading station 1 and includes a substrate transfer unit 21 and a substrate delivery table 22 inside. A buffer cassette (not shown) in which a plurality of wafers W are temporarily stored is placed on the substrate delivery table 22.

  The substrate transfer unit 21 transfers the wafer W between the cassettes C1 to C4 mounted on the loading / unloading station 1 and the buffer cassette mounted on the substrate transfer table 22. Specifically, the substrate transfer unit 21 performs a process of taking out the wafer W from the cassettes C1 to C4 and storing it in the buffer cassette, and a process of taking out the wafer W from the buffer cassette and storing it in the cassettes C1 to C4.

  Further, the transfer station 2 is provided with substrate detection units 23 for detecting the wafers W accommodated in the cassettes C1 to C4, corresponding to the cassettes C1 to C4, respectively.

  Here, schematic configurations of the cassettes C1 to C4 and the substrate detection unit 23 will be described with reference to FIGS. 2A and 2B. 2A and 2B are diagrams illustrating schematic configurations of the cassettes C1 to C4 and the substrate detection unit 23. FIG. In FIG. 2A, the board | substrate detection part 23 provided corresponding to the cassette C1 is shown as an example.

  As shown in FIG. 2A, the cassette C1 is a box having an opening on the side facing the transfer station 2 (X-axis positive direction side). The left and right dimensions of the cassette C1 are slightly longer than the dimensions of the wafer W. Further, the depth is longer than the dimension of the wafer W, and the dimension is such that the wafer W does not protrude from the opening.

  Inside the cassette C1, there are provided a support portion (not shown) for supporting the edge of the wafer W located on the opposite side of the opening, and a pair of support portions 12 and 12 for supporting the left and right edges of the wafer W. It has been. By being supported by these supporting portions, the wafer W is accommodated in the cassette C1 in a horizontal posture.

  The cassettes C2 to C4 have the same configuration as the cassette C1. Here, a cassette that accommodates 12 wafers W is illustrated, but the number of wafers W that can be accommodated in the cassettes C1 to C4 is not limited to 12.

  As shown in FIG. 2A and FIG. 2B, the substrate detector 23 includes a light projector 231 that emits light, a light receiver 232 that receives light emitted by the light projector 231, and a light projector 231 and a light receiver 232 along the vertical direction. And a moving unit (not shown) that is moved. The projector 231 and the light receiver 232 are horizontally disposed so as to face each other on the left and right sides of the opening of the cassette C1.

  The board | substrate detection part 23 moves the light projector 231 and the light receiver 232 along a perpendicular direction using the moving part which is not shown in the state irradiated with light from the light projector 231. When the wafer W does not exist between the projector 231 and the light receiver 232, the light irradiated from the projector 231 is received by the light receiver 232. On the other hand, when the wafer W exists between the light projector 231 and the light receiver 232, the light irradiated from the light projector 231 does not reach the light receiver 232 because it is blocked by the wafer W. Thereby, the board | substrate detection part 23 can detect the wafer W accommodated in cassette C1.

  The control device 6 to be described later determines the actual accommodation position of the wafer W based on the detection signal S output from the substrate detection unit 23. This point will be described later.

  In addition, although the example in case the board | substrate detection part 23 has a transmissive | pervious optical sensor was shown here, the board | substrate detection part 23 has not only a transmissive | pervious optical sensor but a reflective optical sensor. Also good.

  The substrate transfer unit 21 installed in the transfer station 2 includes two substrate holding units that can operate independently. Here, the structure of each board | substrate holding part with which the board | substrate conveyance part 21 is provided is demonstrated with reference to FIG. 3A and FIG. 3B. FIG. 3A is a schematic perspective view of a first holding unit provided in the substrate transfer unit 21, and FIG. 3B is a schematic perspective view of a second holding unit provided in the substrate transfer unit 21.

  As shown in FIG. 3A, the first holding unit 211 provided in the substrate transfer unit 21 includes one fork 211a, and holds one wafer W in a horizontal posture using the fork 211a. On the other hand, as shown to FIG. 3B, the 2nd holding | maintenance part 212 with which the board | substrate conveyance part 21 is provided is provided with several (here, four) forks 212a-212d, and using these several forks 212a-212d. A plurality of (here, four) wafers W are held in a multi-stage in the vertical direction in a horizontal posture. The second holding unit 212 is disposed above the first holding unit 211.

  The 1st holding | maintenance part 211 and the 2nd holding | maintenance part 212 are each provided in the front-end | tip part of a different arm, for example, and can operate | move independently. The vertical interval between the forks 211a and 212a to 212d is substantially the same as the vertical interval between the pair of support portions 12 and 12 (see FIG. 2A) of the cassettes C1 to C4. Using the first holding unit 211 and the second holding unit 212, a plurality of (here, a maximum of five) wafers W can be simultaneously transferred between the cassettes C1 to C4 and the buffer cassette.

  Further, as shown in FIG. 1, the transfer station 2 is further provided with a dummy wafer storage unit 24. The dummy wafer storage unit 24 stores a dummy wafer Wd. Unlike the wafer W, the dummy wafer Wd is a wafer that is not a product wafer. The specific contents of the substrate storing process using the dummy wafer Wd will be described in the second embodiment. In the first embodiment, the dummy wafer storage unit 24 is not necessarily provided.

  The processing station 3 is disposed behind the transfer station 2. In the processing station 3, a substrate transfer unit 31 is disposed at the center, and a plurality (here, six) of substrate processing units 5 are arranged in the front-rear direction on both the left and right sides of the substrate transfer unit 31. . In the processing station 3, the substrate transfer unit 31 transfers the wafers W one by one between the substrate transfer table 22 of the transfer station 2 and each substrate processing unit 5, and each substrate processing unit 5 transfers the wafer W to the wafer W. Then, substrate processing such as cleaning processing is performed one by one.

  In the substrate processing apparatus 100 configured as described above, first, the substrate transfer unit 21 of the transfer station 2 takes out the wafer W from the cassettes C1 to C4 placed on the carry-in / out station 1, and delivers the taken-out wafer W to the substrate. It is accommodated in a buffer cassette (not shown) of the table 22. The wafer W accommodated in the buffer cassette is taken out by the substrate transfer unit 31 of the processing station 3 and is carried into one of the substrate processing units 5.

  The wafer W carried into the substrate processing unit 5 is subjected to substrate processing by the substrate processing unit 5, then unloaded from the substrate processing unit 5 by the substrate transfer unit 31, and accommodated again in the buffer cassette of the substrate delivery table 22. The Then, the processed wafers W accommodated in the buffer cassette are returned to the cassettes C1 to C4 by the substrate transfer unit 21.

  In addition, the substrate processing apparatus 100 includes a control device 6. The control device 6 is a device that controls the operation of the substrate processing apparatus 100 described above.

  Here, the configuration of the control device 6 will be described with reference to FIG. FIG. 4 is a block diagram showing the configuration of the control device 6. Note that FIG. 4 shows only the components necessary for explaining the features of the control device 6, and omits descriptions of general components.

  As shown in FIG. 4, the control device 6 includes a control unit 61 and a storage unit 62. Based on the information stored in the storage unit 62, the controller 61 takes out the wafer W from the cassettes C1 to C4 and stores it in the buffer cassette, and takes out the wafer W from the buffer cassette and stores it in the cassettes C1 to C4. To the substrate transfer unit 21.

  Note that the substrate transport apparatus disclosed in the present application includes the control device 6, the substrate transport unit 21, and the substrate detection unit 23 shown in FIG. 4.

  Next, a specific operation of the substrate processing apparatus 100 will be described. In the substrate processing apparatus 100, first, the substrate transport unit 21 performs a process of taking out the wafer W from the cassettes C <b> 1 to C <b> 4 and storing it in the buffer cassette of the substrate delivery table 22 under the control of the control device 6.

  Specifically, first, the substrate detection unit 23 detects the position of each wafer W accommodated in the cassettes C1 to C4. Subsequently, the control unit 61 determines a target extraction position based on the position detected by the substrate detection unit 23, and the first holding unit 211 or the second holding unit of the substrate transport unit 21 with respect to the determined target extraction position. 212 is moved to take out the wafer W from the cassettes C1 to C4.

  As a specific method for taking out the wafer W from the cassettes C1 to C4, for example, a substrate taking-out method described in Japanese Patent Application Laid-Open No. 2003-168715 can be employed.

  Subsequently, the substrate transfer unit 31 takes out the wafer W accommodated in the buffer cassette from the buffer cassette and carries it into the substrate processing unit 5. When the processing of the wafer W by the substrate processing unit 5 is completed, the substrate transfer unit 31 takes out the processed wafer W from the substrate processing unit 5 and stores it in the buffer cassette.

  Then, the substrate transfer unit 21 takes out the processed wafers W stored in the buffer cassette from the buffer cassette and stores them in the cassettes C1 to C4.

  Here, when the processed wafer W is accommodated in the original cassettes C1 to C4, the control unit 61 detects the detection result (target extraction position) of the substrate detection unit 23 acquired when the wafer W is taken out from the cassettes C1 to C4. The processed wafer W is accommodated in the original positions of the original cassettes C1 to C4.

  On the other hand, when the processed wafers W are accommodated in different cassettes C1 to C4, processing different from the above case is performed. Here, the case where the processed wafers W are accommodated in the different cassettes C1 to C4 will be specifically described with reference to an example in which the wafer W taken out from the cassette C1 is accommodated in the cassette C3. It is assumed that the cassette C3 in which the processed wafer W is accommodated is empty.

  As illustrated in FIG. 4, the control unit 61 of the control device 6 includes a transport control unit 611, a determination unit 612, and a correction unit 613. In addition, target position information 621 and determination information 622 are stored in the storage unit 62 of the control device 6.

  The transfer control unit 611 controls the substrate transfer unit 21 to transfer the wafer W between the cassettes C <b> 1 to C <b> 4 and the buffer cassette of the substrate transfer table 22. The transfer control unit 611 uses the target position information 621 stored in the storage unit 62 when the first wafer W (hereinafter referred to as “first wafer”) is stored in the empty cassette C3. By controlling the transfer unit 21, the first wafer is accommodated in a target accommodation position that is determined in advance as the accommodation position of the first wafer.

  The target position information 621 stored in the storage unit 62 is information indicating the target accommodation position of the wafer W in each slot of the cassettes C1 to C4. The target accommodation position is a predetermined accommodation position of the wafer W.

  The operation when the wafer W is taken out from the cassettes C <b> 1 to C <b> 4 described above is also performed by the transfer control unit 611 controlling the substrate transfer unit 21.

  The determination unit 612 determines the actual storage position of the wafer W stored in the cassette C3 based on the detection result of the substrate detection unit 23. Here, the contents of the determination process by the determination unit 612 will be described with reference to FIGS. 5A and 5B. 5A and 5B are explanatory diagrams of determination processing by the determination unit 612. FIG.

  As shown in FIGS. 5A and 5B, the determination unit 612 determines from the time during which the substrate detection unit 23 continues to detect the wafer W (see t1 and t2 in FIG. 5B) and the speed at which the substrate detection unit 23 moves in the vertical direction. The vertical thickness of the wafer W is determined. Then, the determination unit 612 determines the center position of this thickness (see P1 and P2 in FIG. 5B) as the actual accommodation position of the wafer W. Further, the determination unit 612 can determine whether the posture of the wafer W is normal from the detected thickness of the wafer W.

  Then, the determination unit 612 stores determination information 622 including information on the determined actual storage position of the wafer W and the thickness of the wafer W in the storage unit 62. The position determined as the actual accommodation position of the wafer W is not limited to the center position of the thickness.

  The correction unit 613 calculates a deviation amount in the vertical direction between the actual accommodation position of the first wafer determined by the determination unit 612 and the target accommodation position of the wafer with respect to each slot of the cassette C3 indicated by the target position information 621. . Then, the correction unit 613 sets the above-described deviation amount in the vertical direction from a target accommodation position that is determined in advance as an accommodation position of the wafer W to be accommodated next in the cassette C3 (hereinafter referred to as “second wafer”). The position shifted by the amount is calculated as the corrected target accommodation position and output to the transport control unit 611.

  Then, the transfer control unit 611 controls the substrate transfer unit 21 so that the second wafer is stored in the corrected target storage position. Thereby, even if the position of each slot of the cassette C3 is totally displaced in the vertical direction, the second wafer can be appropriately accommodated in the cassette C3 without causing interference with the first wafer.

  The first wafer is accommodated in the cassette C3 according to the pre-stored target position information 621. At this time, since the cassette C3 is empty, the first wafer interferes with other wafers W. It is not.

  Next, with reference to FIG. 6, a specific processing procedure of the substrate storing process in the case where the wafer W which has been taken out from the cassette C1 and processed by the substrate processing unit 5 and stored in the buffer cassette is stored in the cassette C3 will be described. I will explain. FIG. 6 is a flowchart showing a processing procedure of the substrate accommodation processing executed by the substrate processing apparatus 100. FIG. 6 shows a processing procedure until the cassette C3 is changed from an empty state to a full state.

  As shown in FIG. 6, in the substrate processing apparatus 100, the transfer control unit 611 of the control unit 61 controls the substrate transfer unit 21 so that the first wafer accommodated in the buffer cassette (not shown) of the substrate transfer table 22 is the first. Holding is performed using the holding unit 211 (step S101). Then, the transfer control unit 611 stores the first wafer held by the first holding unit 211 in the lowermost slot of the cassette C3 (step S102).

  Thus, the 1st wafer can be stored in cassette C3 more safely by making the storage position of the 1st wafer into the lowest stage of cassette C3.

  That is, if the cassette C3 is tilted, the error between the target accommodation position of each slot and the actual accommodation position becomes larger in the upper slot. Therefore, the lowermost stage where the error between the target storage position and the actual storage position is the smallest is set as the storage position of the first wafer stored in accordance with the previously stored target position information 621, so that the first wafer is The possibility of contacting the support portion 12 of the cassette C3 can be reduced.

  Note that the accommodation position of the first wafer is not limited to the lowermost stage of the cassette C3, and may be the uppermost stage of the cassette C3 or other stages.

  Subsequently, the substrate detection unit 23 detects the first wafer accommodated in the cassette C3. Thereafter, in the substrate processing apparatus 100, the determination unit 612 of the control device 6 determines the actual storage position of the first wafer stored in the cassette C3 and the thickness of the first wafer based on the detection result of the substrate detection unit 23. (Step S103). Then, the determination unit 612 stores determination information 622 including the actual accommodation position of the first wafer and the thickness of the first wafer in the storage unit 62.

  Subsequently, the transfer control unit 611 determines whether or not the thickness of the first wafer is normal (step S104). Specifically, the transfer control unit 611 determines that the thickness of the first wafer is normal if the thickness of the first wafer indicated by the determination information 622 is within the threshold, and abnormal if the thickness exceeds the threshold. Judge that there is.

  That is, when the thickness of the first wafer determined by the determination unit 612 is large, in other words, when the detection time of the first wafer by the substrate detection unit 23 is long, there is a possibility that the first wafer is accommodated in an inclined state. is there. Therefore, in this case, the transfer control unit 611 determines that the thickness of the first wafer is abnormal (No in step S104), stops the subsequent processing (step S105), and ends the substrate accommodation processing. .

  Thus, the transfer control unit 611 determines whether the thickness of the first wafer accommodated in the cassette C3 is normal based on the detection time of the first wafer by the substrate detection unit 23, and is abnormal. If it is determined, the subsequent processing is stopped. As a result, it is possible to prevent the wafer W after the second wafer from coming into contact with the first wafer housed in the cassette C3 in an abnormal posture and being damaged.

  Here, it is determined whether or not the thickness of the first wafer is normal by determining whether or not the thickness of the first wafer is within the threshold value. It may be determined whether the thickness of the first wafer is normal by determining whether the detection time of one wafer is within a threshold value.

  On the other hand, when it is determined that the thickness of the first wafer is normal (step S104, Yes), the correction unit 613 performs the target accommodation position of the first wafer indicated by the target position information 621 and the first information indicated by the determination information 622. The amount of deviation from the actual accommodation position of one wafer is calculated. Then, the conveyance control unit 611 determines whether or not the calculated deviation amount is within the threshold value (step S106).

  When the deviation amount exceeds the threshold (No at Step S106), the transfer control unit 611 stops the subsequent process (Step S105) and ends the substrate accommodation process.

  As described above, when the deviation between the actual storage position of the first wafer and the target storage position exceeds the threshold value, the transfer control unit 611 determines that the cassette C3 is abnormal and stops the subsequent processing. As a result, it is possible to prevent the wafers W subsequent to the second wafer from being accommodated in the abnormal cassette C3 and the wafers W from being damaged.

  On the other hand, when it is determined that the amount of deviation between the actual storage position of the first wafer and the target storage position is within the threshold (Yes in step S106), the correction unit 613 includes a plurality of (for example, five) correction sheets. Each target accommodation position of the wafer W is corrected by the amount of deviation calculated in step S106 (step S107).

  Subsequently, the transfer control unit 611 controls the substrate transfer unit 21 to transfer a plurality of wafers W (second wafers) stored in a buffer cassette (not shown) of the substrate transfer table 22 to the first holding unit 211 and the second holding unit 211. It is held using the holding unit 212 (step S108). The transfer control unit 611 simultaneously accommodates the plurality of wafers W held by the first holding unit 211 and the second holding unit 212 at the target accommodation position of each wafer W corrected in step S107 (step S107). S109).

  As described above, after the first wafer is accommodated in the cassette C3, the control unit 61 simultaneously accommodates the plurality of second wafers at the corrected target accommodation positions. Thereby, the time which a board | substrate accommodation process requires can be shortened.

  Here, a plurality of second wafers are held using the first holding unit 211 and the second holding unit 212 and are simultaneously accommodated in the cassette C3. However, the transfer control unit 611 is at least a second holding unit. The plurality of second wafers may be held using the unit 212 and accommodated in the cassette C3, and the first holding unit 211 is not necessarily used.

  Subsequently, the control unit 61 determines whether or not the cassette C3 is full (step S110). Whether or not the cassette is full can be determined based on the control information of the substrate transfer unit 21 sent from the transfer control unit 611. When the cassette C3 is not full (step S110, No), the control unit 61 repeats the processing of steps S107 to S110 until the cassette C3 is full (that is, the same operation is performed for the wafers W after the third wafer. to continue). When it is determined that the cassette C3 is full (step S110, Yes), the control unit 61 ends the substrate accommodation process.

  As described above, the substrate processing apparatus 100 according to the first embodiment includes the substrate transport unit 21, the substrate detection unit 23, and the control device 6. The substrate transfer unit 21 delivers the substrate to and from the cassettes C1 to C4 that can store a plurality of wafers W. The board | substrate detection part 23 detects the board | substrate accommodated in cassette C1-C4. The control device 6 controls the substrate transport unit 21.

  The control device 6 includes a transport control unit 611, a determination unit 612, and a correction unit 613. The transfer control unit 611 controls the substrate transfer unit 21 to store the first wafer with respect to a predetermined target storage position. The determination unit 612 determines the actual storage position of the first wafer based on the detection result of the substrate detection unit 23 after the substrate detection unit 23 detects the first wafer stored in the cassette C3. Then, the correction unit 613 corrects the target accommodation position determined in advance as the second wafer and the subsequent accommodation positions based on the deviation between the actual accommodation position of the first wafer and the target accommodation position.

  Therefore, according to the substrate processing apparatus 100 according to the first embodiment, the wafer W can be appropriately accommodated in the cassette C3.

(Second Embodiment)
By the way, in the first embodiment described above, the amount of deviation between the actual accommodation position of the first wafer and the target accommodation position is used as a correction amount, and this correction amount is used as the correction amount for the target accommodation positions of all subsequent wafers W. The example in the case of applying was demonstrated. That is, in the above-described first embodiment, the amount of deviation between the actual accommodation position of the wafer W and the target accommodation position is calculated only for the first wafer, which is the first wafer W.

  However, the substrate accommodation process is not limited to this, and the deviation amount may be calculated every time the wafer W is accommodated in the cassette C3. Below, the example of the board | substrate accommodation process in such a case is demonstrated using FIG. FIG. 7 is a flowchart showing a processing procedure of substrate accommodation processing according to the second embodiment. Note that steps S201 to S206 in FIG. 7 are the same as steps S101 to S106 in FIG.

  As shown in FIG. 7, when it is determined in step S206 that the thickness of the first wafer is normal (step S206, Yes), the control unit 61 determines a predetermined number of sheets with respect to the cassette C3 (here, m sheets). It is determined whether or not the accommodation of the wafer W is completed (step S207).

  In this processing, when the number of wafers W accommodated in the cassette C3 has not reached m (No in step S207), the correction unit 613 performs the next processing based on the actual accommodation position of the wafer W accommodated in the current cassette C3. Next, the target accommodation position of one wafer W to be accommodated in the cassette C3 is corrected (step S208). Then, the transfer control unit 611 controls the substrate transfer unit 21 to hold one wafer W stored in the buffer cassette by the first holding unit 211 (step S209), and corrects the target wafer W after correction. It accommodates in an accommodation position (step S210).

  Subsequently, the control unit 61 determines whether or not the cassette C3 is full (step S211). When the cassette C3 is not full (No at Step S211), the control unit 61 repeats the processes at Steps S203 to S211 until the number of wafers W accommodated in the cassette C3 reaches m.

  Thus, in the second embodiment, every time the wafer W is accommodated in the cassette C3, the actual accommodation position is calculated and the next target accommodation position is corrected. Specifically, the determination unit 612 determines the actual storage position of the wafer W every time the wafer W is stored in the cassette C3, and the correction unit 613 stores the wafer W in the cassette C3. Based on the actual accommodation position of the wafer W, the next target accommodation position of the wafer W is corrected. Thereby, the wafer W can be more appropriately accommodated in the cassette C3.

  On the other hand, when it is determined in step S207 that accommodation of the m-th wafer W has been completed (step S207, Yes), the correction unit 613 determines each target accommodation position of a plurality of (for example, five) wafers W as m. Correction is performed based on the actual accommodation position of the first wafer W (step S212).

  Then, the transfer control unit 611 controls the substrate transfer unit 21 to hold the plurality of wafers W accommodated in the buffer cassette by the first holding unit 211 and the second holding unit 212 (step S213). W is simultaneously accommodated in each of the corrected target accommodation positions (step S214).

  Subsequently, the control unit 61 determines whether or not the cassette C3 is full (step S215). When the cassette C3 is not full (step S215, No), the control unit 61 repeats the processes of steps S212 to S215 until the cassette C3 is full.

  The control unit 61 determines that the cassette C3 is full in step S211 (step S211, Yes), determines that the cassette C3 is full in step S215 (step S215, Yes), or When the processing is stopped in S205, the substrate accommodation processing is terminated.

  Thus, in the second embodiment, when the number of wafers W accommodated in the cassette C3 reaches a predetermined number, that is, when a predetermined number of wafers W can be normally accommodated without stopping the processing. Therefore, it is determined that there is a low possibility that an abnormality will occur in the future, and the process moves to a process of storing a plurality of wafers W in a cassette C3. Thereby, the wafer W can be appropriately accommodated in the cassette C3 in a short time.

(Third embodiment)
By the way, in the first embodiment and the second embodiment described above, the example in which the first wafer first accommodated in the cassettes C1 to C4 is the wafer W that is a product wafer has been described. However, the first wafer may be a dummy wafer Wd (see FIG. 1) instead of the product wafer. Hereinafter, in the third embodiment, an example in which a dummy wafer Wd is used as the first wafer will be described.

  In such a case, in the substrate processing apparatus 100, the substrate transfer unit 21 takes out the dummy wafer Wd from the dummy wafer storage unit 24 according to the control by the transfer control unit 611 while the wafer W is being processed in the substrate processing unit 5.

  Subsequently, the substrate processing apparatus 100 performs the same processes as steps S102 and S103 shown in FIG. 6 or steps S202 and S203 shown in FIG. That is, after the substrate transport unit 21 stores the dummy wafer Wd taken out from the dummy wafer storage unit 24 in the lowermost slot of the empty cassette C3 and the substrate detection unit 23 detects the dummy wafer Wd, the determination unit 612 Based on the detection result of the substrate detection unit 23, the actual accommodation position and thickness of the dummy wafer Wd are determined.

  When the determination unit 612 determines the actual accommodation position and thickness of the dummy wafer Wd, the substrate transfer unit 21 takes out the dummy wafer Wd from the cassette C3 and returns it to the dummy wafer storage unit 24. As a result, the cassette C3 becomes empty again.

  Subsequently, the substrate transport unit 21 takes out the wafer W, which is a product wafer processed by the substrate processing unit 5, from the buffer cassette. Then, the substrate transfer unit 21 accommodates the wafer W taken out from the buffer cassette in the actual accommodation position of the dummy wafer Wd determined by the determination unit 612.

  As described above, in the second embodiment, before the product wafer is accommodated in the cassette C3, the dummy wafer Wd is accommodated in the cassette C3, the actual accommodation position of the dummy wafer Wd is determined, and the actual accommodation position of the dummy wafer Wd is determined. The first product wafer was accommodated in the cassette C3. Thereby, the risk that the product wafer initially accommodated in the cassette C3 is damaged can be reduced.

  The subsequent processing is the same as the processing in steps S103 to S110 shown in FIG. 6 or steps S203 to S215 shown in FIG. That is, the actual storage position and thickness of the wafer W stored in the cassette C3 are determined by the determination unit 612, and whether the thickness of the wafer W is normal and whether the deviation from the target storage position is within the threshold value, respectively. After the determination, the target accommodation positions of the plurality of wafers W are corrected, and the plurality of wafers W are accommodated simultaneously with respect to the corrected target accommodation positions.

  In the above-described example, after determining the actual accommodation position and the like of the dummy wafer Wd, the actual accommodation position and the like are also determined for the wafer W accommodated in the same place as the dummy wafer Wd. However, the determination processing for the wafer W accommodated in the same place as the dummy wafer Wd may be omitted, and the correction of each target accommodation position of the plurality of wafers W may be performed based on the actual accommodation position of the dummy wafer Wd.

(Fourth embodiment)
The substrate processing apparatus 100 may use the accumulated determination information 622 to predict the amount of deviation between the next target storage position of the wafer W and the actual storage position. This point will be described with reference to FIG. FIG. 8 is an explanatory diagram for predicting the amount of deviation between the target storage position of the next wafer W and the actual storage position.

  In addition, P1-P4 shown in FIG. 8 shows the target accommodation position, and p1-p3 shows the actual accommodation position determined based on the detection result of the board | substrate detection part 23. FIG.

  For example, when the cassette C3 is inclined, as shown in FIG. 8, the shift amounts g1 to g3 between the target storage positions P1 to P3 and the actual storage positions p1 to p3 increase toward the upper side of the cassette C3. The correction unit 613 accumulates the deviation amounts g1 to g3 in the storage unit 62, calculates a change rate of the deviation amount from the accumulated deviation amounts g1 to g3, and calculates the calculated change rate and the next target accommodation position P4. Are used to predict the next shift amount g4. Then, the correction unit 613 calculates the corrected target accommodation position P4 using the predicted shift amount g4.

  As described above, the deviation amount between the target accommodation position and the actual accommodation position may be accumulated in the storage unit 62, and the next deviation amount may be predicted based on the accumulated deviation amount. Thereby, the correction | amendment precision of a target accommodation position can be improved.

  Further, the control unit 61 may change the number of wafers W to be simultaneously accommodated based on the accumulated information of the deviation amount between the target accommodation position and the actual accommodation position.

  That is, as the inclination of the cassette C3 increases, it becomes more difficult to simultaneously accommodate a plurality of wafers W in the cassette C3. Therefore, the transfer control unit 611 may reduce the number of wafers W accommodated at the same time as the change rate of the deviation amount increases.

  For example, the transfer control unit 611 predicts actual accommodation positions of the plurality of wafers W to be accommodated next time using the change rate of the deviation amount, and can simultaneously accommodate the predicted actual accommodation positions. It is also possible to control the substrate transfer unit 21 so that the maximum number of wafers W is determined and the maximum number of wafers W are simultaneously accommodated in the cassette C3.

  In each of the above-described embodiments, an example in which the substrate detection unit 23 is a dedicated unit provided in the transfer station 2 has been described. However, the substrate detection unit 23 is provided at the tip of the fork 211a of the first holding unit 211, for example. A projector and a light receiving unit may be attached.

  Further, in each of the embodiments described above, an example in which the first wafer is the first wafer W accommodated in the cassette C3 has been described. However, the first wafer is not limited to this. Alternatively, the second and subsequent wafers W may be used.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

W wafer Wd dummy wafer C1 to C4 cassette 1 carry-in / out station 2 transfer station 6 control device 21 substrate transfer unit 22 substrate transfer table 23 substrate detection unit 61 control unit 62 storage unit 100 substrate processing apparatus 211 first holding unit 212 second holding unit 231 projector 232 light receiver 611 transport control unit 612 determination unit 613 correction unit 621 target position information 622 determination information

Claims (13)

A substrate transfer unit that transfers the substrate to and from a cassette that can store a substrate;
A detection unit for detecting a substrate housed in the cassette;
A control device for controlling the substrate transfer unit,
The controller is
A transfer control unit that controls the substrate transfer unit to store the substrate with respect to a predetermined target storage position;
A determination unit for determining an actual storage position of the substrate based on a detection result of the detection unit after detecting the substrate stored in the cassette by the detection unit;
A substrate transport apparatus comprising: a correction unit that corrects a target accommodation position that is predetermined as an accommodation position of another substrate based on a deviation between an actual accommodation position of the substrate and the target accommodation position. The conveyance control unit
Controlling the substrate transport unit so as to accommodate one substrate with respect to a predetermined target accommodation position;
The correction unit is
Based on the deviation between the actual storage position of the one substrate and the target storage position, the target storage position determined in advance as the storage position of the plurality of substrates to be stored next is corrected. The substrate transfer apparatus according to claim 1. The substrate transport unit is
A first holding unit for holding the substrate;
A second holding part for holding a plurality of the substrates,
The conveyance control unit
After the one substrate is held by the first holding unit and accommodated in the cassette, the plurality of substrates are held by at least the second holding unit and corrected by the correction unit. The substrate transfer apparatus according to claim 2, wherein the plurality of substrates are accommodated simultaneously with respect to each target accommodation position of the substrate. The determination unit
Each time the substrate is stored in the cassette, the actual storage position of the substrate is determined,
The correction unit is
Each time the substrate is stored in the cassette, the next target storage position of the substrate is corrected based on the deviation between the actual storage position of the substrate and the corrected target storage position of the substrate. The substrate transfer apparatus according to claim 1, 2, or 3. The conveyance control unit
The substrate transport unit is controlled so as to accommodate a substrate to be initially accommodated in the cassette with respect to a target accommodation position determined in advance as the lowest position of the cassette. The substrate transfer apparatus according to any one of 4. The conveyance control unit
The substrate transport unit is controlled to accommodate the dummy substrate with respect to a predetermined target accommodation position, and after the actual accommodation position of the dummy substrate is determined by the determination unit, the dummy substrate is removed from the cassette. The substrate transport unit according to claim 1, wherein the substrate transport unit is controlled so as to store the substrate with respect to an actual storage position of the dummy substrate after being taken out. apparatus. A substrate transfer device for loading a substrate from the outside;
A substrate processing unit for processing the substrate carried in by the substrate transfer device;
A delivery unit for delivering the substrate carried by the substrate transport apparatus to the substrate processing unit;
The substrate transfer device includes:
A substrate transfer unit that transfers the substrate to and from a cassette that can store a substrate;
A detection unit for detecting a substrate housed in the cassette;
A control device for controlling the substrate transfer unit,
The controller is
A transfer control unit that controls the substrate transfer unit to store the substrate with respect to a predetermined target storage position;
A determination unit for determining an actual storage position of the substrate based on a detection result of the detection unit after detecting the substrate stored in the cassette by the detection unit;
A substrate processing apparatus, comprising: a correction unit that corrects a target accommodation position that is predetermined as an accommodation position of another substrate based on a deviation between an actual accommodation position of the substrate and the target accommodation position. A first accommodation step of accommodating a substrate at a predetermined target accommodation position by controlling a substrate transport unit that delivers the substrate to and from a cassette capable of accommodating a substrate;
A determination step of determining an actual storage position of the substrate based on a detection result of the detection unit after detecting the substrate stored in the cassette by a detection unit that detects the substrate stored in the cassette;
A correction step of correcting a target accommodation position determined in advance as an accommodation position of another substrate based on a deviation between the actual accommodation position of the substrate and the target accommodation position;
And a second accommodation step of accommodating the other substrate with respect to the target accommodation position corrected in the correction step by controlling the substrate transport unit. The first accommodation step includes
Controlling the substrate transport unit to store the single substrate with respect to a target storage position determined in advance as a single substrate storage position;
The correction step includes
Based on the deviation between the actual storage position of the one substrate and the target storage position, the target storage position determined in advance as the storage position of the plurality of substrates to be stored next is corrected. The substrate accommodation method according to claim 8. The substrate transport unit is
A first holding unit for holding the substrate;
A second holding part for holding a plurality of the substrates,
The first accommodation step includes
Holding the one substrate by the first holding unit and storing it in the cassette;
The second accommodation step includes
The plurality of substrates are held by at least the second holding unit, and the plurality of substrates are simultaneously accommodated at each target accommodation position of the plurality of substrates corrected in the correction step. The substrate accommodation method according to claim 9. The determination step includes
Each time the substrate is stored in the cassette, the actual storage position of the substrate is determined,
The correction step includes
Each time the substrate is stored in the cassette, the next target storage position of the substrate is corrected based on the deviation between the actual storage position of the substrate and the corrected target storage position of the substrate. The substrate accommodation method according to claim 8, 9 or 10. The first accommodation step includes
The substrate transport unit is controlled to accommodate a substrate to be initially accommodated in the cassette with respect to a target accommodation position determined in advance as the lowest position of the cassette. The substrate accommodation method according to any one of 11. The first accommodation step includes
The substrate transport unit is controlled to house a dummy substrate at a predetermined target housing position, and after the actual housing position of the dummy substrate is determined in the determination step, the substrate transport unit is controlled. The substrate accommodation method according to any one of claims 8 to 12, wherein the dummy substrate is taken out from the cassette, and the substrate is accommodated with respect to an actual accommodation position of the dummy substrate.

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