JP2014159526A - Hot-melt pressure-sensitive adhesive composition and removable laminate using the pressure-sensitive adhesive composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hot-melt pressure-sensitive adhesive composition which exhibits good removability and maintains good adhesiveness and removability for a long period of time when the composition is formed into a pressure-sensitive layer on a substrate of a removable tape, a removable sheet or a surface protective film, which has a low viscosity compared to a conventional hot-melt pressure-sensitive adhesive composition and which can cope with an increase in a coating speed.SOLUTION: A hot-melt pressure-sensitive adhesive comprises (A) 20 to 40 pts. mass of a styrene-based thermoplastic elastomer having less than 18 mass% of a styrene unit, (B) 40 to 60 pts. mass of a tackifier resin, and (C) 10 to 30 pts. mass of an antioxidant, and further includes (D) 0.01 to 5 pts. mass of a release agent based on the total 100 pts. mass of the (A), (B) and (C) components. The composition has a melt viscosity of 7,000 mPa s or less at 180°C.

Description

  The present invention is suitably used for the production of rolls such as pressure-sensitive adhesive tapes, pressure-sensitive adhesive sheets, and surface protective films, exhibits good removability, maintains good pressure-sensitive adhesiveness and removability over a long period of time, TECHNICAL FIELD The present invention relates to a hot-melt pressure-sensitive adhesive composition that also supports an increase in coating speed and a re-peelable laminate (re-peeling tape, re-peeling sheet, re-peeling film) having re-peelability using the pressure-sensitive adhesive composition. .

In general, the re-peeling tape is made of natural rubber, diene rubber, or thermoplastic block copolymer as a base elastomer, which is a pressure-sensitive adhesive or hot-melt pressure-sensitive adhesive in which a tackifying resin, softener, stabilizer, etc. are dissolved and mixed. Is applied to a tape substrate such as a film, paper or cloth. However, with natural rubber and diene rubber, the adhesive strength to the adherend increases over time due to the passage of time and temperature rise due to storage after sticking the adhesive tape, which is inconvenient. There was a case to get up.
In order to solve this problem, a pressure-sensitive adhesive using a thermoplastic block copolymer or the like as a base elastomer is disclosed. For example, in JP-A-8-0678760 (Patent Document 1), a block represented by AB, comprising a polymer block A mainly composed of vinyl aromatic and a polymer block B mainly composed of a conjugated diene compound. An adhesive comprising a copolymer and a tackifying resin is disclosed. Among them, the content of the block A is specified to be 18% by mass or more, but in this range, smooth peeling may not be possible, which may be inconvenient for use.

  JP-A-6-122858 (Patent Document 2) discloses an example in which an easily peelable adhesive having a styrene-isoprene triblock copolymer is used for an adhesive sheet. In JP-A-5-194923 (Patent Document 3), a block copolymer represented by A-B-A or A-B (where A is a styrene polymer block, and B is butadiene) Polymer block, isoprene polymer block or polymer block obtained by hydrogenation thereof) 100 parts by mass, tackifying resin 10 to 200 parts by mass, and polyolefin resin 10 to 200 parts by mass An adhesive composition is disclosed. Further, in JP-A-7-179836 (Patent Document 4), A-B-A comprising a polymer block A mainly composed of vinyl aromatic and a polymer block B mainly composed of a conjugated diene compound, and / or A pressure-sensitive adhesive comprising a block copolymer represented by A-B, a tackifier resin, and a softener is disclosed. Japanese Patent Application Laid-Open No. 10-509748 (Patent Document 5) discloses a hot melt adhesive composition comprising a styrene / butadiene / styrene copolymer or an elastomer blended with styrene / butadiene / styrene and styrene / isoprene / styrene and a tackifying resin. Is used for plastics and cellulose materials. Japanese Patent Application Publication No. 2004-518770 (Patent Document 6) discloses an example in which a styrene block copolymer is used for label and tape production. However, all of them have a high melt viscosity and cannot cope with the recent increase in coating speed.

  In addition, in Japanese Patent No. 3395240 (Patent Document 7), peeling comprising hydrogenated paraffin process oil, high molecular weight styrene block polymer, polyphenylene ether resin or modified polyphenylene ether resin, tackifier resin and antioxidant as essential components. A hot-melt adhesive composition is disclosed. However, the use of process oil sometimes causes a problem such as contamination (glue transfer or the like) to the base material due to oil bleed.

Japanese Patent Laid-Open No. 8-0678760 JP-A-6-122858 JP-A-5-194923 JP-A-7-179836 Japanese National Patent Publication No. 10-509748 JP-T-2004-518770 Japanese Patent No. 3995240

  The present invention has been made in view of the above circumstances, and a hot-melt pressure-sensitive adhesive composition capable of increasing the coating speed while maintaining appropriate adhesiveness and removability for a long period of time, and this composition An object of the present invention is to provide a removable laminate (removable tape, removable sheet, removable film) using the above-mentioned.

  As a result of intensive studies to achieve the above object, the present inventors have determined that a hot-melt pressure-sensitive adhesive prepared by adding a specific amount of a specific tackifier resin, an antioxidant, and a release agent to a styrene-based thermoplastic elastomer By using the composition as the adhesive surface of a re-peeling tape, re-peeling sheet, and re-peeling film, the same performance as a pressure-sensitive adhesive tape using conventional pressure-sensitive adhesives can be achieved, and the coating speed can be increased. To develop a hot-melt type pressure-sensitive adhesive composition corresponding to the above.

Accordingly, the present invention provides the following hot-melt pressure-sensitive adhesive composition and a product obtained using the composition.
[1] (A) 20 to 40 parts by mass of a styrene-based thermoplastic elastomer having a styrene unit of less than 18% by mass,
(B) 40-60 parts by mass of tackifying resin,
(C) 10 to 30 parts by mass of an antioxidant, and (D) 0.01 to 5 parts by mass of a mold release agent for 100 parts by mass of the components (A), (B) and (C). A hot melt pressure-sensitive adhesive composition comprising a melt viscosity at 180 ° C. of 7,000 mPa · s or less.
[2] The hot melt pressure-sensitive adhesive composition according to [1], wherein the component (A) is a block copolymer composed of a rubber polymer having an unsaturated bond with polystyrene.
[3] The hot melt pressure-sensitive adhesive composition according to [1], wherein the styrene thermoplastic elastomer of component (A) is an unhydrogenated elastomer.
[4] The hot melt pressure-sensitive adhesive composition according to [2], wherein the block copolymer of component (A) is a styrene-isoprene-styrene block copolymer.
[5] The hot melt pressure-sensitive adhesive composition according to any one of [1] to [4], wherein the component (C) is a phenolic antioxidant.
[6] The hot-melt adhesive according to any one of [1] to [5], wherein (D) the release agent is a compound selected from any of fatty acid amide, fatty acid ethylene bisamide, and higher alkyl group-containing polyethyleneimine. Agent composition.
[7] The hot melt pressure-sensitive adhesive composition according to [6], wherein (D) the release agent is a condensate of an imine compound and an alkyl carbamide.
[8] The hot melt pressure-sensitive adhesive composition according to any one of [1] to [7], which has a 180 ° C. melt viscosity of 2,000 to 7,000 mPa · s.
[9] Selected from any one of a re-peeling tape, a re-peeling sheet, and a re-peeling film formed by forming a layer of the hot melt pressure-sensitive adhesive composition according to any one of [1] to [8] on a base material A laminate having removability, which is characterized in that

  According to the hot melt pressure-sensitive adhesive composition of the present invention, when the composition is formed as a pressure-sensitive adhesive layer on a substrate of a re-peeling tape, a re-peeling sheet, or a re-peeling film, it exhibits good removability. , Maintaining good adhesiveness and removability over a long period of time. Moreover, it has a lower viscosity than conventional hot melt pressure-sensitive adhesive compositions, and can cope with an increase in coating speed.

  The styrenic thermoplastic elastomer which is the component (A) used in the present invention includes an unsaturated type and a saturated type (hydrogenated), and one or more of them are used. The unsaturated type of component (A) used in the present invention includes styrene-isoprene-styrene block copolymer (SIS), styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene-butadiene-styrene block. A copolymer (SEBS) is mentioned, and SIS is preferable from the viewpoint of elasticity and adhesiveness.

  As commercial products of SIS, there are Clayton D1107, 1112, and 1117 (both manufactured by Clayton Polymer Co., Ltd.), Quintac 3421, Quintac 3450 (both manufactured by Nippon Zeon Co., Ltd.), and SIS 5229 (manufactured by JSR).

  In the present invention, among these, it is preferable to use a block copolymer composed of a rubber polymer having an unsaturated bond with polystyrene, more preferably an unhydrogenated one, and a styrene-isoprene-styrene block. It is preferable to use a copolymer.

  The polystyrene-converted weight average molecular weight of these styrenic elastomers by gel permeation chromatography (GPC) is preferably 50,000 to 250,000, more preferably 100,000 to 200,000, and 170,000 to 200,000 is most preferred. If the weight average molecular weight is too small, the melt viscosity of the system may be reduced or glue transfer may increase, and if it is too large, the viscosity of the system may be increased and compatibility with other components may be deteriorated.

  Moreover, it is preferable that the amount of styrene is less than 18 mass%, More preferably, it is 13-16 mass%. If the amount of styrene is too large, smooth peeling cannot be achieved. The amount of styrene can be measured with an Abbe refractometer.

  (A) The compounding quantity of a component is 20-40 mass parts among the total 100 mass parts of (A), (B), (C) component, Preferably it is 30-35 mass parts.

  The tackifying resin that is the component (B) used in the present invention preferably has a softening point of 70 to 150 ° C, more preferably 95 to 110 ° C. When the softening point is less than 70 ° C., there may be a problem that the adhesive strength is weak. When the softening point exceeds 150 ° C., the hardness of the hot-melt adhesive composition increases and the peeling resistance may deteriorate. Examples of such tackifying resins include rosin esters, hydrogenated rosin esters, terpene resins, hydrogenated terpene resins, terpene phenol resins, coumarone resins, hydrogenated alicyclic petroleum resins, aliphatic petroleum resins, and the like. Species or two or more can be used. Commercially available products include Alcon P100 (manufactured by Arakawa Chemical Co., softening point 100 ° C.), Kraton S195 (manufactured by ZEON Corporation, softening point 95 ° C.), Escorez 1102 (manufactured by Tonex Co., Ltd., softening point 100 ° C.), yeast tack C100W ( Eastman Chemical Co., Ltd., softening point 100 ° C.) and the like, and those having a weight average molecular weight of 300 to 5,000 are used.

  (B) The compounding quantity of a component is 40-60 mass parts among the total 100 mass parts of (A), (B), (C) component, Preferably it is 45-55 mass parts. If the amount is less than 40 parts by mass, the viscosity may be high and the coating suitability by the coating machine may be deteriorated. If the amount exceeds 60 parts by mass, the hardness of the hot melt pressure-sensitive adhesive composition may be increased and the peeling resistance may be deteriorated.

  As an antioxidant which is (C) component used by this invention, the 1 type (s) or 2 or more types chosen from a phenol type, a sulfur type, a phosphorus type etc. can be used. Sulfur-based ones have a problem of sulfur odor due to hot melt heating, and phosphorus-based ones are preferred because of their cost. Specifically, 2,6-di-t-butyl-4-methylphenol, n-octadecyl-3- (4′-hydroxy-3 ′, 5′-di-t-butylphenyl) propionate, pentaerythrityl -Tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 2-tetra-butyl-6- (3-tert-butyl-2-hydroxy-5-methylbenzyl) -4 -Methylphenyl) acrylate, 3,9-bis [2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) -propionyloxy] -1,1-dimethylethyl] -2,4 , 8,10-tetraoxaspiro [5.5] undecane and the like. Commercially available products include Irganox 1010 (manufactured by Ciba Specialty Chemicals).

  (C) The compounding quantity of a component is 10-30 mass parts among the total 100 mass parts of (A), (B), (C) component, Preferably it is 15-20 mass parts. If it is less than 10 parts by mass, the effect of reducing the viscosity cannot be exhibited, and if it exceeds 30 parts by mass, it is disadvantageous in terms of cost.

  Examples of the release agent that is the component (D) used in the present invention include a fatty acid amide having 12 to 20 carbon atoms, a fatty acid ethylene bisamide having 12 to 20 carbon atoms, and a polyethyleneimine containing a higher alkyl group having 12 to 20 carbon atoms. However, considering the re-peeling effect, it is preferably a condensate of an imine compound and an alkyl carbamide. In this case, examples of the imine compound include ethyleneimine, heptamethyleneimine, hexamethyleneimine, and the like, and examples of the alkyl carbamide include methyl carbamate, ethyl carbamate, benzyl carbamate, octadecyl carbamate, and the like. Among these, a higher alkyl group-containing modified polyethyleneimine having 12 to 20 carbon atoms is preferable. As a commercial item, there is RP-20 (manufactured by Nippon Shokubai Co., Ltd., octadecyl isocyanate-modified polyethyleneimine, melting point 87 to 95 ° C.).

  (D) The compounding quantity of a component is 0.01-5 mass parts with respect to a total of 100 mass parts of (A), (B), (C) component, Preferably it is 0.5-1 mass part. . If the amount is less than 0.01 parts by mass, a sufficient releasing effect may not be exhibited. If the amount exceeds 5 parts by mass, the miscibility with the components (A), (B), (C) and the like may deteriorate. There arises a problem that the melt type pressure-sensitive adhesive composition is colored more than necessary. In addition, bleeding (smoothness) to the surface of the hot melt pressure-sensitive adhesive composition may occur.

  In the prior art so far, process oil, higher fatty acid, and low-molecular-weight olefin oligomer are blended to give a low viscosity and various performance as a resin solubilizer. There are many. In the present invention, by combining the low-viscosity effect of the antioxidant and the release performance of the release agent, it is possible to reduce the above-described adverse effects and obtain a target good hot-melt pressure-sensitive adhesive composition. From this point, the hot melt pressure-sensitive adhesive composition of the present invention may not contain process oil, higher fatty acid, and low molecular olefin oligomer.

  If the components (A), (B), and (C) are not present and the component (D) is not present, there is no releasability, and problems arise in re-adhesiveness and heat resistance, and (A), (B), ( If only the component (D) is present and the component (C) is not present, the viscosity becomes high and the coating property becomes defective.

The hot melt pressure-sensitive adhesive composition of the present invention can be prepared by uniformly mixing predetermined amounts of each of the above components according to a conventional method.
The melt viscosity at 180 ° C. of the obtained hot melt pressure-sensitive adhesive composition is 7,000 mPa · s or less, preferably 2,000 to 7,000 mPa · s, and more preferably 2,500 to 7,000 mPa · s. It is preferable. If the viscosity is too low, there is a problem that coater coating is difficult, and if it exceeds 7,000 mPa · s, there is a problem that coating such as spray coating is difficult. In the present invention, the melt viscosity can be measured with a visco block viscometer manufactured by Toki Sangyo.

  Furthermore, the softening point of the hot melt pressure-sensitive adhesive composition is preferably 85 to 120 ° C, and more preferably 90 to 110 ° C. If it is less than 85 degreeC, heat resistance may fall, and if it exceeds 120 degreeC, it may become difficult to fuse | melt.

  Components other than the components (A), (B), (C), and (D) can be added to the hot melt pressure-sensitive adhesive composition of the present invention as necessary. Specific examples include ultraviolet absorbers, low density polyethylene, inorganic and organic filler fillers, process oils, and waxes.

Next, a method for producing the composition will be described.
(A) Styrenic thermoplastic elastomer 20-40 parts by mass,
(B) 40-60 parts by mass of tackifying resin,
(C) 10 to 30 parts by mass of antioxidant so that the total of these becomes 100 parts by mass, and (D) mold release with respect to a total of 100 parts by mass of components (A), (B) and (C) Add 0.01 to 5 parts by mass of an agent, if necessary, an ultraviolet absorber, a bulking agent, etc., and heat and knead 2-4 with a mixer or kneader at a melting temperature or higher (eg, 140-200 ° C.). A hot-melt type pressure-sensitive adhesive composition (pressure-sensitive adhesive) is prepared for a period of time.

Thereafter, the pressure-sensitive adhesive composition of the present invention is melted at 150 to 180 ° C. above the complete softening point with an applicator. The melted adhesive is applied to a coating apparatus such as a spray coater, a spin coater, a roll coater or a die coater, such that the thickness after curing is 10 to 50 μm (10 to 100 g / m ² ). Re-peeling tape by applying the entire surface or partial coating to a substrate such as paper, woven fabric, non-woven fabric, plastic film, etc., and further bonding paper, woven fabric, non-woven fabric, plastic film from there if necessary. Sheets and films are obtained. Curing can be performed by natural cooling or the like. Under the present circumstances, the obtained laminated body is in a roller and can manufacture continuously as a wound body, and can be manufactured continuously.
The substrate to be used is generally a peelable substrate, and it is more preferable to use a release paper coated with a release material, or a film such as polyethylene or polyethylene terephthalate.

  The hot melt pressure-sensitive adhesive composition of the present invention has a lower viscosity than conventional ones and can cope with high-speed coating of 100 m / min or more, particularly about 100 to 500 m / min.

  The layered product having removability obtained by the present invention peels off a single-sided base material or a double-sided base material, and laminates it to an object that requires protection, so that a circuit such as a building member, a hygiene product, or a semiconductor can be obtained. It can be used for protecting or laminating other parts.

  EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example.

[Example 1]
As component (A), QUINTAC 3421 (manufactured by Kraton Polymer Co., Ltd., styrene-isoprene-styrene block copolymer, 14% by mass of styrene) is 33 parts by mass. As component (B), Escorez 1102 (manufactured by Tonex Co., Ltd., softening point 100) is used. (° C) 47 parts by mass, (C) component Irganox 1010 (Ciba Specialty Chemicals) 20 parts by mass, (D) component RP-20 (octadecyl isocyanate-modified polyethyleneimine, Nippon Shokubai Co., Ltd.) 0.5 parts by mass was melt-mixed at 180 ° C. to prepare a hot-melt pressure-sensitive adhesive composition, and evaluation of melt viscosity, softening point, compatibility, adhesive strength, re-adhesiveness, heat resistance, and paste transfer was performed. . In addition, the bleeding property of the hot melt surface was also confirmed. The results are shown in Table 1.

[Examples 2-6, Comparative Examples 1-8]
In the same manner as in Example 1, each component was melted and mixed at 180 ° C. based on the composition of raw material types and preparation amounts shown in Tables 1 and 2 to prepare a hot melt pressure-sensitive adhesive composition. A test similar to that of the hot-melt pressure-sensitive adhesive composition was conducted. The results are shown in Tables 1 and 2.

[(A) component]
Quintac 3421:
Non-hydrogenated thermoplastic elastomer which is a styrene-isoprene-styrene block copolymer manufactured by Nippon Zeon Co., Ltd., styrene content 14% by mass, weight average molecular weight 200,000
Quintac 3433N:
Non-hydrogenated thermoplastic elastomer which is a styrene-isoprene-styrene block copolymer manufactured by Nippon Zeon Co., Ltd., styrene content 16% by mass, weight average molecular weight 170,000

[Component (B)]
Escorez 1102:
Tonex, softening point 100 ° C., non-hydrogenated C5 aliphatic petroleum resin yeast tack C100W:
Eastman Chemical Co., Ltd., softening point 100 ° C., hydrogenated C5 petroleum resin YS Resin TO105:
Yasuhara Chemical Co., Ltd., softening point 105 ° C., aromatic modified terpene resin Alcon M115:
Arakawa Chemical Industries, softening point 115 ° C., alicyclic saturated hydrocarbon resin Crystallex 5140:
Eastman Chemical, softening point 140 ° C, styrene resin

[Component (C)]
Irganox 1010:
Ciba Specialty Chemicals, phenolic antioxidant, pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], molecular weight 1,178, melting point 110-130 ° C
Sumilyzer GA-80:
Sumitomo Chemical Co., Ltd., phenolic antioxidant, 3,9-bis [2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) -propionyloxy] -1,1-dimethylethyl ] -2,4,8,10-tetraoxaspiro [5.5] undecane, molecular weight 741, melting point 110-130 ° C.

[(D) component]
RP-20 (manufactured by Nippon Shokubai Co., Ltd., octadecyl isocyanate-modified polyethyleneimine (polyethyleneimine octadecylcarbamate))
[(E) Other ingredients]
Tinuvin 326 (Ciba Specialty Chemicals, benzotriazole UV absorber)

<Evaluation method>
1. Melt viscosity The melt viscosity at 180 ° C. was measured using a viscoblock viscometer manufactured by Toki Sangyo Co., Ltd.
(Rotation speed: No. 3 rotor used at 6 rpm)
2. Softening point Ring and ball method JAI (Japan Adhesive Industry Standard) 7-1999 Measured by hot melt adhesion test method.
3. Compatibility In the system at the time of melting and mixing, the transparency and viscosity of the liquid were visually confirmed.
4). Appearance (bleedability to the surface)
In the blended product, the bleeding property (presence / absence of sliminess) of the hot melt composition coating surface was confirmed by a tentacle.
[Judgment]
○: No slimy feeling ×: There is a slimy feeling

5. Adhesion commercial fully coated at a speed of 150 meters / min in the PET film at a coating temperature of 180 ° C. so that 20 to 30 g / m ² of the hot melt adhesive composition in a die coater, after 4 hours left standing at 23 ° C. The pressure-sensitive adhesive surface and the substrate for evaluation (SUS plate) were pressure-bonded once with a hand roller (500 g) and bonded together, and peeled 180 ° at a tensile speed of 300 mm / min to determine the adhesive strength. The adhesive force required for this product is 2.5 to 8.5 N / 25 mm width.
6). Re-adhesive (5 times)
Commercial fully coated at a speed of 150 meters / min in the PET film at a coating temperature of 180 ° C. so that 20 to 30 g / m ² of the hot melt adhesive composition in a die coater, after 4 hours left standing at 23 ° C., this After the pressure-sensitive adhesive surface and the substrate for evaluation (SUS plate) are pressure-bonded once with a hand roller (500 g) and bonded together, the operation of peeling the test film by hand and then bonding again with the hand roller (500 g) is repeated five times. It was. And after the 5th bonding, 180 degree | times peeling was implemented with the tension speed of 300 mm / min, and the adhesive force was calculated | required. The adhesive force required for this product is 2.5 to 8.5 N / 25 mm width.
The following determinations were made, and the measured adhesive strengths are shown in Tables 1 and 2. The parenthesized values are actual adhesive strengths.
[Judgment]
○: Adhesive strength is in the range of 2.5 to 8.5 N / 25 mm in the evaluation of adhesive strength of 5 and this evaluation, and the rate of increase is 0.9 to 1.5 times ×: Other than the above

7). Heat resistance A hot melt pressure-sensitive adhesive composition was applied to a commercially available PET film with a die coater at a coating temperature of 180 ° C. so as to be ²⁰ to 30 g / m ^2, and allowed to stand at 23 ° C. for 4 hours. The base material (SUS plate) was pressed and bonded once with a hand roller (500 g), left at 40 ° C. for 3 days, then left at 23 ° C. for 16 hours, and peeled 180 ° at a tension rate of 300 mm / min. The adhesive strength was determined.
Compared to the obtained adhesive strength after heating and the value of the adhesive strength obtained in 5, the ratio (strength increase rate: times) is calculated. The closer the rate of increase was to 1 times, the lower the rate of increase, and the better the heat resistance.
[Judgment]
○: Increase rate 1.0 to 1.5 times ×: Increase rate more than 1.5 times Paste transfer The test piece after the heat resistance evaluation was visually checked for paste transfer.
[Evaluation]
○: No glue transfer ×: With glue transfer

Claims (9)

(A) 20 to 40 parts by mass of a styrene-based thermoplastic elastomer having a styrene unit of less than 18% by mass,
(B) 40-60 parts by mass of tackifying resin,
(C) 10 to 30 parts by mass of an antioxidant, and (D) 0.01 to 5 parts by mass of a mold release agent for 100 parts by mass of the components (A), (B) and (C). A hot melt pressure-sensitive adhesive composition comprising a melt viscosity at 180 ° C. of 7,000 mPa · s or less.   The hot melt pressure-sensitive adhesive composition according to claim 1, wherein the component (A) is a block copolymer comprising a rubber polymer having an unsaturated bond with polystyrene.   The hot melt pressure-sensitive adhesive composition according to claim 1, wherein the styrene thermoplastic elastomer as component (A) is an unhydrogenated elastomer.   The hot melt pressure-sensitive adhesive composition according to claim 2, wherein the block copolymer of component (A) is a styrene-isoprene-styrene block copolymer.   (C) A component is a phenolic antioxidant, The hot-melt-type adhesive composition of any one of Claims 1-4.   (D) The hot melt pressure-sensitive adhesive composition according to any one of claims 1 to 5, wherein the release agent is a compound selected from any of fatty acid amide, fatty acid ethylene bisamide, and higher alkyl group-containing polyethyleneimine.   The hot-melt pressure-sensitive adhesive composition according to claim 6, wherein (D) the release agent is a condensate of an imine compound and an alkyl carbamide.   The hot melt pressure-sensitive adhesive composition according to any one of claims 1 to 7, wherein the melt viscosity at 180 ° C is from 2,000 to 7,000 mPa · s.   The substrate is selected from any one of a re-peeling tape, a re-peeling sheet, and a re-peeling film formed by forming a layer of the hot melt pressure-sensitive adhesive composition according to any one of claims 1 to 8. A laminate having removability.