JP2014156008A - Method for producing film-pasted molded part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the warpage of a film-pasted molded part in which a film is integrally pasted on a molded part upon its production.SOLUTION: The method for producing a film-pasted molded part comprises: a step where injection molding is performed in a state where a base material 3 is not pasted with an injection resin, thus a molded resin 21 is produced, and further, a shape is applied to the base material film 3; a step in which the base material film 3 applied with the shape is peeled from the molded resin 21; and a step in which the base material film 3 applied with the shape is pasted on the molded resin 21.

Description

  The present invention relates to a method for producing a molded article with a film in which a film is integrally bonded to a molded article.

As a method for decorating the surface of an article, there is a film insert molding method. In the film insert molding method, an insert film having a pattern layer or the like formed on a base sheet is supplied into an injection mold, and then a three-dimensional molded product is molded, and at the same time, the insert film is integrated with the molded product. (For example, refer to Patent Document 1).
Another method for decorating the surface of an article is an in-mold molding method. The in-mold molding method is a method in which a transfer material in which a transfer layer comprising a release layer, a design layer, an adhesive layer, etc. is formed on a base sheet is supplied into an injection mold, and then a three-dimensional molded product is formed. At the same time as molding, a transfer material is adhered to the surface of the molded product, and then the base sheet is peeled off to decorate the molded product.

JP 2000-37753 A

  In the insert molding method, the heated molten resin is cooled to become a solidified molded resin. At this time, the insert film is heated together with the molten resin and then cooled. When such a temperature change occurs, the entire finished product may be warped due to the difference in thermal expansion coefficient between the product and the insert film.

  An object of the present invention is to reduce the warpage of a molded product with a film in manufacturing a molded product with a film in which a film is integrally bonded to a molded product.

  Hereinafter, a plurality of modes will be described as means for solving the problems. These aspects can be arbitrarily combined as necessary.

The manufacturing method of a molded article with a film according to an aspect of the present invention includes the following steps.
A process of creating a molding resin and imparting a shape to the base film by performing injection molding in a state where the base film is not adhered to the injection resin.
◎ A step of peeling a base film provided with a shape from a molded resin.
◎ A step of attaching a base film with a shape to a molding resin.
In this manufacturing method, the base film is given a shape at the same time as the molding resin is manufactured, and is then peeled off from the molding resin and further pasted on the molding resin. Therefore, unlike the conventional film insert molding method, warpage of the molded product with a film due to the difference in thermal expansion coefficient between the molding resin and the base film is unlikely to occur.
Moreover, since the shape along the surface shape of the molding resin is imparted to the base film, a gap with the molding resin is reduced in the bonding step, and as a result, wrinkles and bubbles are hardly generated in the base film.
In addition, the state which does not adhere a base film with injection resin means the state which can peel a base film from molding resin after injection molding.

  In the step of imparting a shape to the base film, a decorative layer may be used to decorate the molded resin.

Prepare a carrier film with a decorative layer,
The carrier film is in contact with the base film in the step of imparting a shape to the base film, but is not adhered to the base film,
A step of peeling the carrier film from the molding resin may be further provided after the step of peeling from the molding resin and before the step of attaching the base film to the molding resin.

  The decorative layer may be fixed to the base film so as to be peelable.

  In the method for producing a molded article with a film according to the present invention, unlike the conventional film insert molding method, warping due to the difference in thermal expansion coefficient between the molding resin and the base film is less likely to occur in the molded article with a film.

The schematic diagram of the manufacturing method of the molded article with a film which concerns on 1st Embodiment and 2nd Embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 1st Embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 1st Embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 1st Embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 1st Embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 1st Embodiment. The schematic cross section of the article after resin molding of a 1st embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 1st Embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 1st Embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 1st Embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 2nd Embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 2nd Embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 2nd Embodiment. The schematic cross section of the article | item after resin molding of 3rd Embodiment. The schematic cross section of the article | item after resin molding of 4th Embodiment. Sectional drawing of the manufacturing method of the molded article with a film of 5th Embodiment. The schematic cross section of the article | item after resin molding of 5th Embodiment. The schematic cross section of the article | item after film adhesion of 5th Embodiment.

  Hereinafter, the manufacturing method of the molded article with a film is demonstrated, referring drawings.

1. Outline of Embodiment (First Embodiment and Second Embodiment)
First, an outline of the embodiment will be described.
Drawing 1 is a mimetic diagram of a manufacturing method of a molded article with a film concerning a 1st embodiment and a 2nd embodiment.

(1) Film Preparation / Introduction Step In the first embodiment, as shown by reference numeral A, the base film 3 and the decorative film 15 are separately introduced into the injection mold 1. In 2nd Embodiment, as shown to the code | symbol B, the base film 3 and the decorating film 15 are first bonded together through the adhesive material, for example, and it introduce | transduces into the injection mold 1 in the state.

(2) Injection Molding / Base Film Shape Providing Step By performing injection molding using the mold 1 for injection molding, a molded product 23 after molding is obtained. The post-molding molded product 23 includes a molded resin body 25 and a base film 3 having a shape.

(3) Base film peeling step The base film 3 having a shape is peeled from the molded resin body 25. Then, the carrier film 17 is peeled from the molded resin body 25.

(4) Base Film Affixing Step The base film 3 is affixed to the molded resin body 25 using an adhesive. Thereby, the molded article 27 with a film is obtained. Finally, the protective sheet 11 is peeled off.

2. 1st Embodiment The manufacturing method of the molded article 27 with a film is demonstrated using FIGS. 2-6 and 8-10 are sectional views of a method for producing a molded article with a film according to the first embodiment. FIG. 7 is a schematic cross-sectional view of an article after resin molding according to the first embodiment.

(1) Injection Mold 1 The injection mold 1 includes a movable mold 5 and a fixed mold 7 as shown in FIG. In the injection mold 1, a film is sandwiched between the movable mold 5 and the fixed mold 7, and the molten resin is injected into the cavity to be molded. At the same time, a predetermined portion of the film can be adhered to the molded product.
The movable mold 5 has a cavity forming recess 5a and a vacuum suction port 5b. The fixed mold 7 has an injection gate (not shown). The cavity forming recess, the vacuum suction port, and the like may be provided in the fixed mold, and the injection gate may be provided in the fixed parting surface.

(2) Film In order to manufacture the molded article 27 with a film, the base film 3 and the decorative film 15 are used.
The base film 3 includes a base film body 9 and a protective sheet 11.
The material of the base film body 9 is PET (polyethylene terephthalate) excellent in heat resistance. However, the base film body 9 may be PET, PMMA (polymethyl methacrylate resin), PC (polycarbonate resin), or a laminated film or copolymer film thereof. The base film body 9 may have a hard coat layer on the surface.

The material of the base film body 9 may be polyamide resin, polyimide resin, polyester resin, acrylic resin, olefin resin, urethane resin, acrylonitrile butadiene styrene resin, or vinyl chloride resin.
For example, when the base film main body 9 is made of PMMA / PC / PMMA, an adhesive layer between the base film main body 9 and a release layer (described later) can be omitted.
The base film body 9 may be printed on the back surface.
The thickness of the base film body 9 is preferably 75 to 200 μm.
The protection sheet 11 is detachably attached to the base film body 9.

The decorative film 15 is a transfer foil, and includes a carrier film 17 and a decorative layer 19 (transfer layer). The decorative layer 19 is formed on the surface opposite to the base film 3 with respect to the carrier film 17.
The carrier film 17 is made of the same material as the base film body 9.

The decorative layer 19 is formed by sequentially laminating a release layer 31, a design layer 32, and an adhesive layer 33 on the carrier film 17 (see FIG. 7).
The release layer 31 is a layer located on the outermost side when the carrier film 17 is peeled off after transferring the design, and functions as a protective layer for the design.

In the case where the adhesive layer is provided between the base film body 9 and the decorative film 15 as in the second embodiment described later, the material of the release layer 31 is a silicone resin or a melamine resin. Is preferred. However, the material of the release layer 31 is acrylic resin, nitrified cotton resin, polyurethane resin, chlorinated rubber resin, vinyl chloride-vinyl acetate copolymer resin, polyamide resin, polyester resin, epoxy resin, polycarbonate. Any of a resin, an olefin resin, and an acrylonitrile butadiene styrene resin may be used.
The film thickness of the release layer 31 is preferably 0.5 to 50 μm.

  In order to facilitate the peeling between the carrier film 17 and the peeling layer 31, a surface-treated release layer may be provided on the carrier film 17.

  The design layer 32 is a layer that represents characters, symbols, patterns, paint patterns, and the like. The design layer 32 is sealed between the release layer 31 and the adhesive layer 33. The material of the pattern layer 32 is one of acrylic resin, nitrified cotton resin, polyurethane resin, chlorinated rubber resin, vinyl chloride-vinyl acetate copolymer resin, polyamide resin, polyester resin, and epoxy resin. is there.

  The pattern layer 32 can be printed on the release layer 31 by known gravure printing. In gravure printing, printing is performed by holding ink in fine concave portions of the plate making, transferring the ink to the release layer 31 with the pressure of the impression cylinder, and the ink used is basically a solvent system. There is an advantage that adhesion is excellent even for a plastic film having poor wettability such as 31. Further, since the surface of the plastic film does not absorb ink and is extremely smooth, a fine pattern can be created by using gravure printing using an ink that is compatible with the release layer 31.

  The method for forming the design layer 32 on the release layer 31 is not limited to the gravure printing described above, and for example, if the design layer can be attached to the release layer 31 such as offset printing, screen printing, painting, and dipping. Any printing method can be applied.

Further, the pattern layer 32 may be formed of a metal film layer such as aluminum, chromium, copper, nickel, indium, tin, or silicon oxide by a method such as vacuum deposition or plating.
In addition, it is preferable to set the film thickness of the design layer 32 in the range of 0.5 μm to 50 μm in order to obtain sufficient design properties. When comprised by a metal film layer, 50 to 1200 mm is preferable.

The adhesive layer 33 is a layer for joining the design layer 32 to the surface of the molded product. The material of the adhesive layer 33 is acrylic resin, nitrified cotton resin, polyurethane resin, chlorinated rubber resin, vinyl chloride-vinyl acetate copolymer resin, polyamide resin, polyester resin, epoxy resin, polycarbonate resin. , An olefin resin, or an acrylonitrile butadiene styrene resin.
The thickness of the adhesive layer 33 is preferably 0.5 to 50 μm.

(3) Molten resin The molten resin that is supplied to the injection mold 1 and becomes the molding resin 21 (see FIG. 7) is a general-purpose material such as polystyrene resin, polyolefin resin, ABS resin, AS resin, and AN resin. Resin. The material of the molten resin is polyphenylene oxide / polystyrene resin, polycarbonate resin, polyacetal resin, acrylic resin, polycarbonate modified polyphenylene ether resin, polybutylene terephthalate resin and other general-purpose engineering resins, polysulfone resin, polyphenylene sulfide resin, polyphenylene oxide resin Super engineering resins such as resins, polyarylate resins, polyetherimide resins, polyimide resins, liquid crystal polyester resins, and polyallyl heat-resistant resins may be used. Note that a composite resin to which a reinforcing material such as glass fiber or an inorganic filler is added may be used.

(4) Manufacturing method The manufacturing method of the molded product 27 with a film using the injection mold 1 will be described.

As shown in FIG. 2, first, the base film 3 is introduced into the cavity forming recess 5 a of the movable mold 5 of the injection mold 1.
As shown in FIG. 3, the decorative film 15 is then introduced into the injection mold 1.

As shown in FIG. 4, the space between the cavity forming recess 5a and the base film 3 is further sucked by vacuum from the vacuum suction port 5b of the movable mold 5, whereby the decorative film 15 becomes the cavity forming recess 5a. Sucked to the side. Thereby, the decorative film 15 is deformed so as to be in close contact with the base film 3.
In addition, the heating means arrange | positioned above the cavity formation recessed part 5a heats the base film 3 and the decorating film 15. FIG. The temperature of the mold is preferably 40 to 120 ° C.

  Next, as shown in FIG. 5, the injection mold 1 is closed, and the injection film (not shown) is inserted into the cavity while the base film 3 and the decorative film 15 are sandwiched in the injection mold 1. ) To inject the molten resin, thereby bringing the base film 3 and the decorative film 15 into a state where the molding resin 21 is overlapped. Thereafter, the molding resin 21 is solidified by cooling. Although resin shrinkage has occurred at this time, the base film 3 is in a shape that conforms to the surface shape of the molding resin 21 in a state where the base film 3 is not bonded to the molding resin 21 (a state in which the base film 3 is relatively movable). Is granted.

In the injection molding process described above, the base film 3 is in contact with the molding resin 21 (specifically, the carrier film 17), but is not bonded.
Further, the molding conditions may be the same as those in the conventional in-mold molding method.

  Next, as shown in FIG. 6, the injection mold 1 is opened, and the post-molding molded product 23 in which the base film 3 and the decorative film 15 and the molding resin 21 are overlapped is taken out. . The molded product 23 after molding is in a state where the molding resin 21 is covered with the base film 3 and the decorative film 15.

  As shown in FIG. 7, in the molded product 23 after molding, since the base film 3 is not adhered to the molding resin 21 (specifically, the carrier film 17), the base film 3 is molded resin 21 ( Specifically, it can be peeled off from the carrier film 17).

Next, as shown in FIG. 8, the base film 3 is peeled from the molded resin body 25. Specifically, the base film body 9 is separated from the carrier film 17. The molded resin body 25 is a state in which the decorative film 15 is integrally formed with the molded resin 21.
As described above, the peeled base film 3 has already been given a shape. That is, the base film 3 is preliminarily molded using the molding resin 21 that is an object to be attached later in the injection mold 1 used for molding the molding resin 21.

  Next, as shown in FIG. 9, the carrier film 17 of the molded resin body 25 is peeled off from other portions. Specifically, the carrier film 17 is separated from the release layer 31 of the decorative layer 19. In other words, the carrier film 17 is peeled from the molding resin 21 after the step of peeling the base film 3 from the molding resin 21 and before the step of sticking the base film 3 to the molding resin 21.

  Next, as shown in FIG. 10, the base film 3 is attached to the molded resin body 25. Specifically, the base film body 9 of the base film 3 is attached to the release layer 31 of the decorative layer 19 via an adhesive (not shown).

As described above, the base film 3 is given a shape at the same time as injection molding, then peeled off from the molding resin 21 and finally bonded to the molding resin 21. Therefore, unlike the conventional film insert molding method, warpage of the molded product with a film due to the difference in the thermal expansion coefficient between the base film and the molding resin hardly occurs.
Moreover, since the shape along the surface shape of the molding resin 21 is given to the base film 3, a gap with the molding resin 21 is reduced in the bonding step, and as a result, wrinkles and bubbles are generated in the base film 3. Hard to do.

  Finally, the protective sheet 11 is peeled off. As a result, a molded article 27 with a film is obtained.

3. 2nd Embodiment In the said embodiment, although the base film and the decorating film were separate bodies, both may be formed integrally. Such 2nd Embodiment is described using FIGS. 11-13. In addition, description is abbreviate | omitted about the same point as the said embodiment.

As shown in FIG. 11, in this embodiment, an integrated film 30 in which the decorative film 15 is bonded to the base film 3 is used.
In the integrated film 30, the base film 3 is fixed so as to be peelable from the decorative film 15. For example, when the base film 3 is made of a PET film, an adhesive layer may be provided between the base film 3 and the decorative film 15.

  As shown in FIG. 12, first, the integral film 30 is introduced into the cavity forming recess 5 a of the movable mold 5 of the injection mold 1.

As shown in FIG. 13, the space between the cavity forming recess 5a and the integrated film 30 is further vacuumed from the vacuum suction port 5b of the movable die 5, and the integrated film 30 is drawn toward the cavity forming recess 5a. .
The description of the following injection molding operation is omitted.

Also in this embodiment, the base film 3 is given a shape at the same time as injection molding, then peeled off from the molding resin, and finally bonded to the molding resin. Therefore, unlike the conventional film insert molding method, warpage of the molded product with a film due to the difference in the thermal expansion coefficient between the base film and the molding resin hardly occurs.
Moreover, since the shape along the surface shape of the molding resin is imparted to the base film 3, the gap between the molding resin and the base resin film 3 is less likely to occur in the bonding process. .

4). 3rd Embodiment In the said embodiment, although both the base film and the decorating film were used, the film in which the decorating layer was integrally formed in the base film may be used. Such a third embodiment will be described with reference to FIG.

In this embodiment, the base film 3 includes a decorative layer 19. However, since the base film body 9 is not bonded to the decorative layer 19 in the molded product 23 after molding, the base film 3 can be peeled from the decorative layer 19.
The base film 3 to which the shape is imparted is bonded to the molding resin 21 on which the decorative layer 19 is formed.

  As a modification of this embodiment, the decorative layer may not be bonded to the molding resin during injection molding, and the decorative layer may be peeled off from the molding resin together with the base film. In that case, after that, the base film to which the shape is given and the decorative layer is formed is bonded to the molding resin.

5. 4th Embodiment In the said embodiment, although the decorating layer was integrally molded by the molding resin and the molding simultaneous decorating was performed, it is not necessary to decorate at the time of injection molding. Such 4th Embodiment is described using FIG.

  In this embodiment, the decorative layer is not formed on the base film 3. Therefore, the base film body 9 is in contact with the release layer 31. In the molded product 23 after molding, the base film body 9 can be peeled from the release layer 31.

6). Common Items of Embodiments The first to fourth embodiments have the following configurations and functions in common.
The manufacturing method of the molded article 27 with a film (an example of a molded article with a film) includes the following steps.
◎ Process for forming a molding resin 21 (an example of a molding resin) and imparting a shape to the base film 3 by performing injection molding in a state where the base film 3 (an example of the base film) is not adhered to the injection resin. (For example, FIG. 5).
A step of peeling the base film 3 to which the shape is imparted from the molding resin 21 (for example, FIG. 6).
A step of attaching the base film 3 to the molding resin 21 (for example, FIG. 10).

In this manufacturing method, the base film 3 is given a shape at the same time as the molding resin 21 is manufactured, and then peeled off from the molding resin 21 and further bonded to the molding resin 21. Therefore, unlike the conventional film insert molding method, warpage of the molded product with a film due to the difference in thermal expansion coefficient between the molding resin and the base film is unlikely to occur.
Further, since the base film 3 is given a shape along the surface shape of the molding resin 21, the gap with the molding resin 21 is reduced in the bonding step, and as a result, wrinkles and bubbles are generated in the base film 3. Hard to do.

7). 5th Embodiment The method to manufacture the molded article 127 with a film in this embodiment is demonstrated using FIGS.

The injection mold 101 includes a movable mold 105 and a fixed mold 107 as shown in FIG. In the injection mold 101, a film is sandwiched between the movable mold 105 and the fixed mold 107, and the molten resin is injected into the cavity to be molded. At the same time, the decorative layer can be transferred from the film to the molded product.
The movable mold 105 has a cavity forming recess 105a and a vacuum suction port (not shown). The fixed mold 107 has an injection gate 107a.

In order to manufacture the molded article 127 with a film, the transfer film 108 is used.
The transfer film 108 includes a base film (not shown) and a design layer 131 (see FIG. 17). The material of the base film and the transfer layer is the same as in the above embodiment.
First, the transfer film 108 is introduced into the cavity forming recess 105 a of the movable mold 105 of the injection mold 101. Next, the space between the cavity forming recess 105a and the transfer film 103 is vacuumed from a vacuum suction port (not shown) of the movable mold 105, whereby the transfer film 108 is drawn toward the cavity forming recess 105a. .

Next, as shown in FIG. 16, the injection mold 1 is closed, and the molten resin is injected from the injection gate 107a into the cavity with the transfer film 103 sandwiched in the injection mold 1, thereby The transfer film 108 is integrated with the molding resin 121. Thereafter, the molding resin 121 is solidified by cooling.
Next, the injection mold 101 is opened, and the molding resin 121 is taken out. Then, the transfer film 108 is peeled off from the molding resin 121. As a result, as shown in FIG. 17, the design layer 131 is transferred to the surface of the molding resin 121.

  Further, as shown in FIG. 18, a transparent film 109 is bonded to the molding resin 121 through the adhesive layer 133. Thereby, the molded article 127 with a film is obtained.

  In this embodiment, the pattern layer 131 is integrated in a state of being embedded in the surface of the molding resin 121, and therefore the surface of the molding resin 121 has high smoothness. Therefore, when the film 109 is bonded to the molding resin 121, unlike the conventional case, unevenness of the product surface due to the design layer 131 is unlikely to occur.

  Conventionally, as a method for producing a decorated product, a decorated film is bonded to the surface of a molded product. However, the printed pattern of the film is formed by, for example, screen printing, and therefore has a 3 to 15 μm unevenness, which has a problem that it becomes an uneven appearance of the product. In order to solve such a problem, it is conceivable to increase the thickness of the adhesive layer, but the problem of unevenness could not be solved completely. Further, when the alignment accuracy between the molded product and the film is inferior like a three-dimensional molded product, the positional deviation is also large.

  In the above-described embodiment, the decoration is performed on the resin molded product by the in-mold molding method, so that the surface of the molded resin is in a flat state without unevenness due to printing. In addition, the pattern can be accurately aligned during the simultaneous decoration.

8). Other Embodiments Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. In particular, a plurality of embodiments and modifications described in this specification can be arbitrarily combined as necessary.

  The present invention can be widely applied to a method of manufacturing a molded article with a film in which a film is integrally bonded to a molded article.

1: injection mold 3: base film 5: movable mold 5a: cavity forming recess 5b: vacuum suction port 7: fixed mold 9: base film body 11: protective sheet 15: decorative film 17: carrier film 19: Decorative layer 21: Molded resin 23: Molded product 25: Molded resin body 27: Molded resin body 30: Molded product 30 with film: Integrated film 31: Release layer 32: Design layer 33: Adhesive layer

Claims (4)

By performing injection molding in a state where the base film is not adhered to the injection resin, a step of producing a molding resin and imparting a shape to the base film;
Peeling the base film provided with the shape from the molding resin;
Adhering the base film to which the shape is applied to the molding resin;
A method for producing a molded article with a film.   The method for producing a molded article with a film according to claim 1, wherein in the step of imparting a shape to the base film, the decorative resin is also used to decorate the molded resin. Prepare a carrier film provided with the decorative layer,
The carrier film is in contact with the base film in the step of imparting a shape to the base film, but is not adhered to the base film,
The film according to claim 2, further comprising a step of peeling the carrier film from the molding resin after the step of peeling from the molding resin and before the step of attaching the base film to the molding resin. A manufacturing method of a molded product with an attachment.   The said decoration layer is a manufacturing method of the molded article with a film of Claim 2 currently fixed to the said base film so that peeling is possible.

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