JP2014154753A - Semiconductor cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate mainly the problem due to friction stir welding, or the problem when providing a coolant outlet.SOLUTION: A cooling device body 28 has a body container 41, and an upper lid 42 that can be closed and fixed to the upper surface of the body container 41 by friction stir welding. A coolant outlet 23b is formed in the partial upper surface 414 on the other side of the upper surface of the body container 41. In the lower surface 412 of the body container 41, a jig insertion opening 416 into which a receiving jig 45, for receiving the pushing force from below when friction stir welding the upper lid 42, is provided. At the lower edge of the jig insertion opening 416, a lower lid 46 that can be closed and fixed by friction stir welding is provided while having a coolant circulation part 47. A lower lid fixing edge 417 has a strength section 418 that can withstand the pressing force when performing friction stir welding.

Description

  The present invention relates to a semiconductor cooling device.

  In recent years, various electronic devices are used in various fields. Some of such electronic devices use heat-generating semiconductors such as power transistors. Such exothermic semiconductors may malfunction due to thermal runaway, and therefore must be cooled to prevent thermal runaway. And there are air cooling type and water cooling type cooling methods for such exothermic semiconductors, but with higher performance and higher output of exothermic semiconductors, the cooling effect is higher than air cooling type. Opportunities to adopt the water-cooling method are increasing (see, for example, Patent Document 1).

  FIG. 7 shows a semiconductor cooling structure 1 currently under development.

  The semiconductor cooling structure 1 includes a power module 2 containing at least one heat generating semiconductor, a lower semiconductor cooling device 3 disposed in contact with the lower surface side of the power module 2, and an upper surface of the power module 2. The upper semiconductor cooling device 4 disposed in contact, the load receiving plate 5 disposed in contact with the upper portion of the upper semiconductor cooling device 4, and provided on the upper surface side of the load receiving plate 5 via the load receiving plate 5. An elastic member 6 capable of pressing the upper semiconductor cooling device 4 to the upper surface of the power module 2 is provided.

  At least the lower semiconductor cooling device 3 includes a cooling device main body 8 having a hollow portion serving as a coolant passage 7 therein. A coolant inlet that communicates with the coolant passage 7 is provided on one end side of the cooling device body 8, and a coolant outlet that communicates with the coolant passage 7 is provided on the other end side of the cooling device body 8. The upper surface of the cooling device main body 8 is provided with a contact surface 8a on which the war module 2 can be disposed in contact. Radiation fins 9 extending into the coolant passage 7 are provided on the back side of the contact surface 8a.

  The upper semiconductor cooling device 4 is also of a liquid cooling type substantially the same as the lower semiconductor cooling device 3.

  Then, the lower semiconductor cooling device 3 and the upper semiconductor cooling device 4 are made continuous so that the coolant discharged from the lower semiconductor cooling device 3 flows into the upper semiconductor cooling device 4.

  According to such a configuration, the lower semiconductor cooling device 3 disposed in contact with the lower surface side of the power module 2 and the upper semiconductor cooling device 4 disposed in contact with the upper surface of the power module 2 Both sides can be efficiently cooled.

  Further, by using the elastic member 6 and the load receiving plate 5 to press the upper semiconductor cooling device 4 against (or in close contact with) the upper surface of the power module 2, the dimensions of the power module 2 and the heat generating semiconductor inside the power module 2 are measured. By absorbing the effect of variation, the heat of the power module 2 can be efficiently transmitted to the upper semiconductor cooling device 4.

  In the lower semiconductor cooling device 3, the cooling liquid is supplied from the cooling liquid inlet provided on one end side of the cooling device main body 8 to the cooling liquid passage 7 inside the cooling device main body 8, and is cooled through the cooling liquid passage 7. The cooling liquid outlet provided on the other end side of the apparatus main body 8 is discharged to the outside (in this case, the upper semiconductor cooling apparatus 4). Then, the heat of the power module 2 is transmitted to the cooling liquid from the radiating fins 9 disposed in the cooling liquid passage 7, and is released to the outside together with the cooling liquid. Thereby, the power module 2 can be efficiently cooled by the coolant.

JP2009-18211A

  However, the semiconductor cooling structure 1 described above has the following problems.

  That is, when the lower semiconductor cooling device 3 and the upper semiconductor cooling device 4 are made continuous as described above, the coolant outlet of the lower semiconductor cooling device 3 and the coolant inlet of the upper semiconductor cooling device 4 face each other. Forming them together is convenient because it is the simplest in structure. Therefore, it is most desirable for the lower semiconductor cooling device 3 to provide a coolant outlet on the upper surface on the other end side of the lower semiconductor cooling device 3.

  On the other hand, the lower semiconductor cooling device 3 has a structure in which the main body container portion 8b constituting the lower portion of the coolant passage 7 and the upper portion of the coolant passage 7 are structurally arranged in order to dispose the radiation fins 9 inside the coolant passage 7. It is necessary to provide heat radiating fins 9 on the lower surface of the upper lid portion 8c separately from the upper lid portion 8c to be configured. Further, the lower semiconductor cooling device 3 needs to have a high hermeticity in order to prevent leakage of the coolant. Therefore, it has been studied to close and fix the upper lid 8c by friction stir welding to the main body container 8b.

  However, a strong pressing force is applied to the cooling device main body 8 during the friction stir welding, so the periphery of the joint between the main body container portion 8b and the upper lid portion 8c must be structured to withstand this strong pressing force. Don't be.

  Further, regarding the way of providing the cooling liquid outlet with respect to the upper surface on the other end side of the lower semiconductor cooling device 3, the cooling liquid outlet is previously formed in the upper cover portion 8 c of the cooling device body 8. In this case, it is necessary to perform an operation such as closing the coolant outlet with a stopper when performing friction stir welding and removing the stopper after the friction stir welding. Moreover, since friction stir welding must be performed sufficiently away from the coolant outlet, there is a problem that the upper lid portion 8c becomes larger than necessary.

  On the other hand, it is conceivable that the coolant outlet is formed in the upper lid portion 8c after the friction stir welding, but in this case, the cutting waste when the coolant outlet is machined is inside the cooling device main body 8. This method is abandoned as it cannot be adopted because it becomes impossible to get in and remove.

  Therefore, it is desired that the cooling liquid outlet be provided on the upper surface of the other end side of the lower semiconductor cooling device 3 while solving the problem caused by the friction stir welding.

In order to solve the above-described problems, the present invention includes a cooling device body having a hollow portion serving as a cooling fluid passage inside, and a cooling fluid inlet communicating with the cooling fluid passage is provided on one end side of the cooling device body. A cooling liquid outlet that communicates with the cooling liquid passage is provided on the other end side of the cooling device main body, and an abutting surface capable of abutting and arranging a semiconductor is provided on the upper surface of the cooling device main body, A semiconductor cooling device provided on the side with heat dissipating fins extending into the coolant passage,
The cooling device main body has at least a main body container portion having a concave portion constituting a lower portion of the coolant passage, the upper surface has the contact surface, and the lower surface has the radiation fin, and the main body container portion. An upper lid portion that can be closed and fixed by friction stir welding to the upper lid mounting portion provided on the upper edge of the concave portion on the upper surface;
Furthermore, the cooling liquid outlet is formed on a partial upper surface portion that is partially provided at a position on the other end side with respect to the other end side edge portion of the upper lid mounting portion on the upper surface of the main body container portion,
When the upper lid portion is friction-stir welded to the other end side edge portion of the upper lid attaching portion on the lower surface portion of the main body container portion and below the coolant outlet, it acts on the other end side edge portion of the upper lid attaching portion. An opening for inserting a jig into which a receiving jig for receiving a pressing force from below can be inserted is provided,
The lower lid portion that can be closed and fixed by friction stir welding to the lower lid mounting edge provided at the lower edge of the jig insertion opening has a coolant circulation portion between the partial upper surface portion. Provided,
The lower lid attaching edge portion has a strength portion capable of withstanding a pressing force applied when the lower lid portion is friction stir welded.

  According to the present invention, the above-described configuration can solve the above-described problem of friction stir welding and the problem of providing the coolant outlet on the upper surface on the other end side of the lower semiconductor cooling device.

It is a perspective view of the semiconductor cooling structure concerning the Example of this invention. FIG. 2 is an exploded perspective view of FIG. 1. It is a cross-sectional view of FIG. It is a longitudinal cross-sectional view of FIG. It is the elements on larger scale of FIG. It is a perspective view which shows the mode of friction stir welding. It is a cross-sectional view showing a semiconductor cooling structure currently under development.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below in detail with reference to the drawings.

<Configuration> The configuration will be described below.
1 to 6 show this embodiment.

  As shown in the perspective view of FIG. 1 or the exploded perspective view of FIG. 2, the semiconductor cooling structure 21 includes a power module 22 (cooled body) in which at least one heat generating semiconductor 22 a is accommodated, and the power module 22. The lower semiconductor cooling device 23 disposed in contact with the lower surface of the power module 22, the upper semiconductor cooling device 24 disposed in contact with the upper surface of the power module 22, and the load disposed in contact with the upper portion of the upper semiconductor cooling device 24 A receiving plate 25 and an elastic member 26 provided on the upper surface side of the load receiving plate 25 and capable of pressing the upper semiconductor cooling device 24 to the upper surface of the power module 22 via the load receiving plate 25 are provided.

  At least the lower semiconductor cooling device 23 includes a cooling device main body 28 having a hollow portion serving as a coolant passage 27 therein, as shown in the cross-sectional view of FIG. A cooling liquid inlet 23a (see FIG. 1 or 2) communicating with the cooling liquid passage 27 is provided on one end side of the cooling apparatus main body 28, and a cooling liquid communicating with the cooling liquid passage 27 on the other end side of the cooling apparatus main body 28. An outlet 23b is provided. A contact surface 28 a on which the power module 22 can be placed in contact is provided on the upper surface of the cooling device main body 28. Radiating fins 29 extending into the coolant passage 27 are provided on the back side of the contact surface 28a.

  The upper semiconductor cooling device 24 is also of a liquid cooling type that is substantially the same as the lower semiconductor cooling device 23.

  In the case of this embodiment, the above-described power module 22 is a plate-like body having a rectangular shape in plan view and including three heat generating semiconductors 22a such as power transistors. Note that the number of the exothermic semiconductors 22a is not limited to three.

  The lower semiconductor cooling device 23 and the upper semiconductor cooling device 24 have a rectangular shape in plan view that is one or more times larger than the power module 22 so that the entire surface of the power module 22 can be covered and hidden. Yes.

  The lower semiconductor cooling device 23 and the upper semiconductor cooling device 24 are directly fastened and fixed using a fastener 31 such as a bolt. The fasteners 31 are attached to four corner portions of the lower semiconductor cooling device 23 and the upper semiconductor cooling device 24. The attachment position of the fastener 31 is not restricted to this.

Then, the cooling liquid L supplied from the cooling liquid inlet 23a provided on one end side of the lower semiconductor cooling device 23 flows through the inside of the lower semiconductor cooling device 23 from one end side to the other end side in the longitudinal direction. The coolant exits from the coolant outlet 23 b provided on the other end of the cooling device 23 and enters the inside of the upper semiconductor cooler 24 from the coolant inlet 24 a provided on the other end of the upper semiconductor cooler 24. Of the upper semiconductor cooling device 24 is discharged from a coolant outlet 24b provided on one end side of the upper semiconductor cooling device 24.
That is, the lower semiconductor cooling device 23 and the upper semiconductor cooling device 24 are connected so that one continuous flow of the cooling liquid L is formed. Between the coolant outlet 23b on the other end side of the lower semiconductor cooling device 23 and the coolant inlet 24a on the other end side of the upper semiconductor cooling device 24, a seal member 32 or a connecting member having a sealing property is provided.

  In addition, the load receiving plate 25 described above has a rectangular shape in plan view that is one or more times larger than the power module 22 so that the entire surface of the power module 22 can be pressed.

  The elastic member 26 has a strip shape extending in the width direction of the upper semiconductor cooling device 24, and a lower detour-shaped pressing portion 26a capable of partially pressing the load receiving plate 25 is provided at an intermediate portion thereof. Have at least one. The elastic member 26 is fastened and fixed to a mounting portion 33 whose both ends are integrally fixed to the side surface of the lower semiconductor cooling device 23 by using a fastener 34 such as a bolt. The elastic member 26 is provided at least in one place with respect to the longitudinal direction of the upper semiconductor cooling device 24. In this case, it is provided at two positions between the three heat generating semiconductors 22a.

  And the thing of this Example is provided with the following structures with respect to the above whole structures.

(Configuration 1)
As shown in the longitudinal sectional view of FIG. 4 or the partially enlarged view of FIG. 5, the cooling device body 28 of the lower semiconductor cooling device 23 (semiconductor cooling device) has at least a concave portion 410 constituting the lower portion of the coolant passage 27. A main body container part 41, a contact surface 28a on the upper surface, and a heat dissipating fin 29 on the lower surface, and an upper lid attaching part 411 provided on the upper edge of the concave part 410 on the upper surface of the main body container part 41, And an upper lid portion 42 that can be closed and fixed by friction stir welding.

(Supplementary explanation 1)
Here, the main body container portion 41 has a lower surface portion 412 and a side surface portion 413 that rises along the peripheral edge portion of the lower surface portion 412. The upper lid part 42 constitutes the upper part of the coolant passage 27 by closing the concave part 410. Further, the upper lid part 42 is used as a heat transfer promoting member by having the contact surface 28 a and the heat radiating fins 29. The upper lid attaching portion 411 is a stepped portion that can attach the upper lid portion 42 to the upper surface of the main body container portion 41 in a flush state. The main body container portion 41 and the upper lid portion 42 can be friction stir welded and are made of a metal having high thermal conductivity. For example, it is made of aluminum or copper. The friction stir welding will be described later.

(Configuration 2)
The coolant outlet 23 b is formed on the upper surface portion 414 provided partially on the upper surface of the main body container portion 41 at a position on the other end side than the other end side edge portion 411 a of the upper lid attaching portion 411.

(Supplementary explanation 2)
Here, the coolant outlet 23b is provided at least a distance necessary for friction stir welding from the other end side edge portion 411a of the upper lid attaching portion 411. The coolant outlet 23b is provided in advance before the friction stir welding. In this case, the coolant outlet 23 b is provided inside the peripheral wall portion 415 that rises upward from the partial upper surface portion 414. However, the coolant outlet 23b may be a simple opening.

(Configuration 3)
The other end side edge portion of the upper lid attaching portion 411 when the upper lid portion 42 is friction stir welded below the other end side edge portion 411a of the upper lid attaching portion 411 and the coolant outlet 23b in the lower surface portion 412 of the main body container portion 41. A jig insertion opening 416 into which a receiving jig 45 for receiving a pressing force acting on 411a from below can be inserted is provided.
A lower lid portion 46 that can be closed and fixed by friction stir welding to a lower lid mounting edge portion 417 provided at the lower edge of the jig insertion opening 416 is provided between the partial upper surface portion 414 and a coolant. A circulation part 47 is provided.
Further, the lower lid attaching edge 417 has a strength portion 418 capable of withstanding the pressing force applied when the lower lid portion 46 is friction stir welded.

(Supplementary explanation 3)
Here, the lower lid attaching edge 417 is a stepped portion to which the lower lid 46 can be attached. Preferably, the stepped portion can attach the lower lid portion 46 to the lower lid attaching edge 417 in a flush state. The coolant circulation part 47 connects the concave part 410 and the coolant outlet 23b. The proof stress portion 418 is a thick portion in which the vertical dimension t2 is larger than the thickness t1 of the other end side edge portion 411a (partial top surface portion 414) of the upper lid attaching portion 411 (t1 <t2).
In this case, the proof stress portion 418 is a peripheral wall portion (falling wall portion) that rises downward from the peripheral edge portion of the jig insertion opening 416 so as to be a thick portion. However, the proof stress portion 418 may be configured not to provide the above-described falling wall portion, for example, by making the entire lower surface portion 412 of the main body container portion 41 thick.

(Configuration 4)
As shown in FIG. 6, the friction stir welding (FSW for short) described above is performed on the members 53 and 54 to be joined with a strong force while rotating the columnar tool 52 having the projection 51 at the tip. By pressing and fitting the protrusions 51 into the joints 55 of the members 53 and 54, frictional heat is generated to soften the members 53 and 54, and the periphery of the joints 55 is plastically flowed by the rotational force of the tool 52. In this method, the members 53 and 54 are integrated while being kneaded.

(Supplementary explanation 4)
In this case, the above-described members 53 and 54 are the main body container portion 41 and the upper lid portion 42, or the main body container portion 41 and the lower lid portion 46.

  After the friction stir welding, the generated burrs are removed along the joining line.

  <Operation> The operation of this embodiment will be described below.

  According to such a configuration, the lower semiconductor cooling device 23 disposed in contact with the lower surface side of the power module 22 and the upper semiconductor cooling device 24 disposed in contact with the upper surface of the power module 22 Both sides can be efficiently cooled.

  Further, by using the elastic member 26 and the load receiving plate 25, the upper semiconductor cooling device 24 is brought into pressure contact (or close contact) with the upper surface of the power module 22, so The influence of the dimensional variation can be absorbed and the heat of the power module 22 can be efficiently transmitted to the upper semiconductor cooling device 24.

  Then, the cooling liquid L is supplied from a cooling liquid inlet 23 a provided on one end side of the cooling device main body 28 to the cooling liquid passage 27 inside the cooling device main body 28, and the cooling liquid passage 27 is passed through the other cooling device main body 28. The coolant is discharged from the coolant outlet 23b provided on the end side. Then, the heat of the power module 22 is transmitted to the cooling liquid L from the radiating fins 29 disposed in the cooling liquid passage 27 and is released to the outside together with the cooling liquid L (in this case, to the upper semiconductor cooling device 24). Sent). Thereby, the power module 22 can be efficiently cooled by the coolant L.

  <Effect> According to this embodiment, the following effects can be obtained.

  The cooling device main body 28 is substantially configured by closing and fixing the upper lid portion 42 by friction stir welding to the upper lid attaching portion 411 provided at the upper edge of the concave portion 410 in the main body container portion 41. As a result, the main part of the sealed coolant passage 27 is formed, and the radiation fins 29 are inserted into the coolant passage 27.

  Further, the coolant outlet 23 b is provided on the partial upper surface portion 414 that is partially provided on the upper surface of the main body container portion 41 at a position on the other end side with respect to the other end side edge portion 411 a of the upper lid attaching portion 411. Accordingly, a jig insertion opening 416 is provided below the other end side edge 411a of the upper lid attaching part 411 and the coolant outlet 23b in the lower surface part 412 of the main body container part 41, and the jig insertion opening is provided. By inserting the receiving jig 45 from the portion 416, when the upper lid portion 42 is friction stir joined to the upper lid attaching portion 411 of the upper edge of the concave portion 410, the other end side edge portion of the upper lid attaching portion 411 is received by the receiving jig 45. The pressing force applied to 411a can be received from below. Accordingly, the upper lid portion 42 can be attached to the upper lid attaching portion 411 of the main body container portion 41 by the friction stir welding without any trouble without making the partial upper surface portion 414 thick.

  In addition, the lower lid portion 46 is closed and fixed to the jig insertion opening 416 by friction stir welding. At this time, the coolant circulation portion 47 is provided between the lower lid portion 46 and the partial upper surface portion 414. Since it is formed, the coolant L can be circulated without being blocked between the lower lid portion 46 and the partial upper surface portion 414.

  When the lower lid portion 46 is friction stir welded to the jig insertion opening 416, the strength insertion portion 418 is provided on the lower lid mounting edge 417 of the jig insertion opening 416, so that the friction stir welding is performed. It is designed to withstand the pressing force. Accordingly, the lower lid portion 46 can be attached to the jig insertion opening 416 of the main body container portion 41 without any trouble by friction stir welding.

  Although the embodiments of the present invention have been described in detail with reference to the drawings, the embodiments are only examples of the present invention, and the present invention is not limited to the configurations of the embodiments. Needless to say, design changes and the like within a range not departing from the gist of the invention are included in the present invention.

27 Coolant passage 28 Cooling device body 23a Coolant inlet 23b Coolant outlet 28a Contact surface 29 Radiation fin 41 Main body container part 410 Recessed part 411 Upper lid attaching part 411a Other end side edge part 412 Lower surface part 414 Partial upper surface part 416 Jig Insertion opening 417 Lower lid mounting edge 418 Strength bearing portion 42 Upper lid portion 45 Receiving jig 46 Lower lid portion 47 Coolant flow portion

Claims (1)

Provided with a cooling device body having a hollow portion serving as a coolant passage inside,
A coolant inlet communicating with the coolant passage is provided at one end of the cooling device body;
A coolant outlet communicating with the coolant passage is provided on the other end side of the cooling device body,
A contact surface on which a semiconductor can be disposed in contact with the upper surface of the cooling device body is provided,
A semiconductor cooling device provided with a radiation fin extending into the coolant passage on the back side of the contact surface,
The cooling device main body has at least a main body container portion having a concave portion constituting a lower portion of the coolant passage;
An upper lid that has the abutment surface on the upper surface and the radiating fin on the lower surface, and can be closed and fixed by friction stir welding to the upper lid mounting portion provided on the upper edge of the concave portion on the upper surface of the main body container portion And
Furthermore, the cooling liquid outlet is formed on a partial upper surface portion that is partially provided at a position on the other end side with respect to the other end side edge portion of the upper lid mounting portion on the upper surface of the main body container portion,
When the upper lid portion is friction-stir welded to the other end side edge portion of the upper lid attaching portion on the lower surface portion of the main body container portion and below the coolant outlet, it acts on the other end side edge portion of the upper lid attaching portion. An opening for inserting a jig into which a receiving jig for receiving a pressing force from below can be inserted is provided,
The lower lid portion that can be closed and fixed by friction stir welding to the lower lid mounting edge provided at the lower edge of the jig insertion opening has a coolant circulation portion between the partial upper surface portion. Provided,
The semiconductor cooling device according to claim 1, wherein the lower lid attaching edge portion has a strength portion capable of withstanding a pressing force applied when the lower lid portion is friction stir joined.