JP2014152349A - Film deposition device and film deposition method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film deposition device and a film deposition method capable of adjusting intensity distribution of plasma for forming a uniform film when a film is deposited while conveying a substrate.SOLUTION: A film deposition device has: a conveying mechanism for conveying a film depositing substrate; a plasma generation unit that deposits a film on the film depositing substrate during conveyed by generating plasma using film depositing gas, and that is provided with plural through holes penetrating through a plate, a pair of annular electrodes provided along respective inner peripheries of the through holes at different positions in a depth direction of the through holes and a tubular dielectric body covering the inner peripheries of the through holes; and a power unit for independently supplying power to the respective electrodes of the through holes of the plasma generation unit. A first electrode at a position away from the film depositing substrate is exposed when seen from a space in the through hole, and a second electrode at a position near the film depositing substrate is covered with the dielectric when seen from the space in the through hole.

Description

  The present invention relates to a film forming apparatus and a film forming method using plasma.

  Conventionally, when a thin film is formed on a substrate, a plasma processing apparatus is often used. In particular, a parallel plate type plasma processing apparatus having a simple structure is often used in a film production line. In this parallel plate type plasma processing apparatus, for example, high frequency power of 13.6 MHz is used.

However, it has been known that the parallel plate type plasma processing apparatus has the following problems.
・ It is difficult to generate spatially uniform plasma in a wide film formation space corresponding to a large film formation substrate.
・ The throughput of the film formation process is low, and ・ The collision of ions and electrons with the film formation substrate increases as the supply power increases, and the film surface is not smooth.
The above problem is a greater obstacle to today's diversifying film forming processes.

On the other hand, a film deposition apparatus capable of forming a thin film having excellent barrier properties at high speed in plasma CVD is known (Patent Document 1). This film deposition apparatus is a film deposition apparatus that deposits a film having a predetermined width on the surface of a film while moving the film in the longitudinal direction using a plasma CVD apparatus.
Specifically, the plasma CVD apparatus includes a plasma source and a source gas supply means, and the plasma source includes an outer cylinder and an inner cylinder that are coaxially disposed along the width direction of the film. The both cylinders are provided with a plurality of holes along the axial direction on one side facing the film, the outer cylinder is an anode, the inner cylinder is a cathode, and a holocathode discharge is generated in the cathode. Then, a plasma jet is emitted from the hole to form a film on the film surface.

JP 2002-294458 A

  In the plasma film forming apparatus, a thin film having excellent barrier properties can be formed at high speed, but the film thickness uniformity is not taken into consideration. In order to make the film thickness uniform, it is necessary to make the density of generated plasma uniform, but the plasma film forming apparatus does not disclose means for making the plasma density uniform. Further, in the plasma film forming apparatus, the plasma intensity distribution cannot be adjusted in order to make the plasma density uniform.

  Accordingly, the present invention provides a film forming apparatus and a film forming method capable of adjusting the intensity distribution of plasma in order to form a uniform film when forming a film using plasma while transporting a substrate. With the goal.

One embodiment of the present invention is a film formation apparatus using plasma.
The film forming apparatus
A transport mechanism for transporting the deposition substrate during deposition of the deposition substrate;
A unit for forming a film on the film-forming substrate being transferred by generating plasma using a film-forming gas, the thickness of the plate provided on the plate facing the film-forming substrate A plurality of through holes penetrating in the direction, a pair of electrodes provided at different positions in the depth direction of the through hole along each circumference of the through hole, and the inner peripheral surface of the through hole. A plasma generating unit comprising: a tubular dielectric covering;
A power unit that individually supplies power for generating the plasma to the electrodes of the through holes of the plasma generation unit.
Of the pair of electrodes, the first electrode located far from the film formation substrate is exposed when viewed from the space in the through hole, and the second electrode located close to the film formation substrate is the through hole. The dielectric is covered when viewed from the space inside.

  It is preferable that the through holes are provided in a row along a width direction orthogonal to the transport direction of the film formation substrate.

  The power unit includes a control unit that controls the supply amount of the power for each through hole, and the control unit controls the supply amount of the power according to a film thickness of a film formed on the film formation substrate. It is preferable to control.

  The measurement unit has a measurement unit that measures a film thickness distribution of the film formed on the film formation substrate on the downstream side in the transport direction of the film formation substrate of the plasma generation unit, and the measurement unit displays the measurement result It is preferable that the control unit controls the supply amount of the electric power so that the film thickness distribution of the film becomes a target distribution according to the measurement result.

  Preferably, the power unit supplies the power supply by voltage pulses, and the control unit controls the power supply amount using the number of pulses per unit time of the voltage pulses.

  In the plasma generation unit, it is also preferable that the through holes are provided in a row along a width direction orthogonal to the transport direction of the film forming substrate, and a plurality of rows are also provided in the transport direction.

The film-forming substrate is a web-like film wound around a roll,
Preferably, the transport mechanism pulls the film from the roll and transports the film in one direction for film formation, and then winds the formed film to form a film forming roll.

  In this case, in order to increase the film thickness of the film, the transport mechanism pulls out the film formed from the film forming roll again and transports the film in the direction opposite to the one direction. It is preferable to roll up the film to form a new film forming roll.

The power unit supplies high-frequency power to the plasma generation unit,
The plate is a dielectric;
The first electrode is an annular electrode and is formed along the opening of the through hole on the first main surface of the plate;
The second electrode is an annular electrode, and is formed along the opening of the through hole on the second main surface opposite to the first main surface of the plate, and the second electrode of the plate. Connected to the ground conductor formed on the main surface of
The power supply line connected to the first electrode is preferably a microstrip line constituted by the dielectric and the ground conductor.

Another embodiment of the present invention is a film formation method using the film formation apparatus.
The film-forming substrate is a web-like film wound around a roll.
In this method,
A first step of drawing the film from the roll and transporting the film for film formation, and then winding the formed film to form a film forming roll;
In order to increase the thickness of the film, the film formed from the film forming roll is pulled out again and conveyed, and the film formed is wound up to form a new film forming roll. And including.
In this method, the thickness of the formed film is set to a target thickness by repeating the second step.

  In the above-described film forming apparatus and film forming method, when forming a film using plasma while transporting the film forming substrate, the intensity distribution of the plasma can be adjusted in order to form a uniform film.

It is a schematic structure figure of the whole film-forming apparatus of this embodiment. (A) It is a cross-sectional perspective view of the principal part of the plasma generation unit of this embodiment, (b) is an external appearance perspective view of the principal part shown to (a). It is a figure explaining the production | generation of the plasma in this embodiment. It is a figure explaining the structure of the electric power unit and plasma generation unit of this embodiment. It is a figure explaining the modification of this embodiment.

  Hereinafter, the film forming apparatus and the film forming method of the present invention will be described in detail.

(Deposition system)
FIG. 1 is a schematic configuration diagram illustrating the overall configuration of the film forming apparatus 10 of the present embodiment with lines. The film forming apparatus 10 includes a film forming container 12, a transport mechanism 14, a plasma generation unit 16, a power unit 18, a gas supply unit 20, and an exhaust unit 22. In the present embodiment, a description will be given of a web-like flexible substrate that is an extremely thin glass plate or resin film and can be wound in a roll shape as the film-forming substrate. However, the film-forming substrate used in the present invention is not limited to a web-like flexible substrate. For example, a plate-like hard substrate can be used as the deposition substrate.

  In the film forming space of the film forming container 12, a transport mechanism 14 and a plasma generation unit 16 are mainly provided. The film formation container 12 is a container for maintaining the film formation space in the film formation container 12 at a predetermined pressure or depressurizing the film formation substrate in the film formation space. Each of the outer peripheral wall surfaces of the film forming container 12 is provided with a heater (not shown) in order to set the atmosphere in the film forming space to a temperature suitable for the film forming process. As will be described later, in this embodiment, plasma generation is performed using dielectric barrier discharge. That is, plasma can be generated at atmospheric pressure. For this reason, the internal space in the film formation container 12 does not necessarily need to be in a reduced pressure state.

  The film formation substrate conveyed by the conveyance mechanism 14 is a web-like flexible film F wound around a roll. Here, the roll is the rotating roller 14a or the rotating roller 14b. The transport mechanism 14 includes rotating rollers 14a and 14b. The rotation rollers 14a and 14b are connected to a drive motor (not shown), and the rotation rollers 14a and 14b are configured to rotate by the rotation of the drive motor. The direction of rotation of the drive motor can be selected. A film F is wound around the rotating rollers 14a and 14b, and the film F has a roll shape. When forming a film as will be described later, the transport mechanism 14 rotates one of the rotating rollers 14a and 14b as a take-up roller and the other as a feed roller. That is, after the transport mechanism 14 pulls the film F from the roll (the state wound around the rotary roller 14b) by the rotation of the rotary rollers 14a and 14b, the transport mechanism 14 transports the film F in one direction for film formation. Then, the film F formed is wound up to form a film forming roll. FIG. 1 illustrates that the film F is conveyed from the rotating roller 14b to the rotating roller 14a and wound up by the rotating roller 14a.

  In this embodiment, in order to increase the film thickness of the film F, it is preferable to repeatedly form the film on the film F. At this time, the transport mechanism 14 again draws the film F formed from the film forming roll obtained by winding the film F after film formation with the rotating roller 14a, and moves from the rotating roller 14a to the rotating roller 14b. That is, it is preferable to transport in the direction opposite to the transport direction during the previous film formation. During conveyance, the film F is formed by the plasma generation unit 16 to increase the film thickness. The rotating roller 14b winds up the film F formed into a new film forming roll. Thereafter, in order to further increase the film thickness, the film is conveyed from the rotating roller 14b toward the rotating roller 14a, that is, in a direction opposite to the conveying direction during the previous film formation. During conveyance, the film F is formed by the plasma generation unit 16 to increase the film thickness. The rotating roller 14a winds up the film F formed into a new film forming roll. Thus, it is preferable that the film thickness of the film formed on the film F is set to a target thickness by increasing the film thickness while repeating conveyance of the film F in different directions.

On the ceiling surface of the film formation container 12, an introduction pipe 20 d that is connected to the gas supply unit 20 and introduces a film formation gas into the film formation space of the film formation container 12 is provided. It is configured to supply gas.
The gas supply unit 20 includes a first gas source 20a, a second gas source 20b, and a mass flow controller 20c.
The first gas source 20a and the second gas source 20b are gas sources for film forming gas, for example, gas sources such as silane gas and hydrogen gas, and are gases including thin film components formed on the film F. The flow rates of the first film forming gas from the first gas source 20a and the second film forming gas from the second gas source 20b are adjusted by the mass flow controller 20c and introduced into the film forming container 12 as a film forming gas. Of course, when the film forming gas is one kind of gas, one gas source is used.

  An exhaust pipe 22 a for exhausting unnecessary film forming gas in the film forming space in the film forming container 12 is provided on the ceiling surface of the film forming container 12. The exhaust pipe 22 a is connected to the exhaust unit 22. Thereby, the film formation space is maintained at a constant pressure.

  The exhaust unit 22 includes a rotary pump, a dry pump, or the like, and maintains the film formation space in the film formation container 12 at a constant pressure. Further, when the pressure in the film formation space is made lower than the atmospheric pressure, the exhaust unit 22 exhausts to a predetermined pressure.

  The plasma generation unit 16 is provided in the film formation container 12 and forms a film on the film F being conveyed by generating plasma using a film formation gas introduced into the film formation space. Specifically, deposition is performed by depositing, on the film F, gas molecules of a film-forming component that has been radicalized out of the film-forming gas decomposed by plasma, that is, by CVD (Chemical Vapor Deposition). The plasma generation unit 16 mainly includes a plate 16a, a first electrode 16b, a second electrode 16c, a tubular dielectric 16d, a feed line 16e, and a ground conductor 16g.

FIGS. 2A and 2B are diagrams illustrating one plasma generation element, which is a main part of the plasma generation unit 16. FIG. 2A is a cross-sectional view taken along the through-hole 16f.
The plate 16a is a dielectric plate provided so as to face the film F. As the dielectric plate, a resin plate such as Teflon (registered trademark) or glass epoxy multi or a glass plate is used. The plate 16a is provided with a plurality of through holes 16f penetrating in the thickness direction of the plate 16a. An annular first electrode 16b and second electrode 16c are provided at different positions in the depth direction of the through hole 16f so as to follow the circumference of the through hole 16f. The first electrode 16b is made of, for example, copper, and is connected to the power unit 18 through the feeder line 16e. On the main surface of the plate 16a close to the film F, a ground conductor 16g grounded through the power unit 18 is provided. The second electrode 16c is made of copper, for example, and is connected to the ground conductor 16g.

Each of the through holes 16f is provided with a tubular dielectric 16d that covers the inner peripheral surface of the through hole 16f. For example, a quartz tube or a ceramic is used as the tubular dielectric 16d.
As shown in FIG. 2A, one end of the tubular dielectric 16d is located at the opening of the through hole 16f far from the film F, and the other end protrudes from the opening of the through hole 16f near the film F. It is provided to do.
The inner diameter of the annular first electrode 16b is configured to match the inner diameter of the inner peripheral surface of the tubular dielectric 16d. Therefore, the first electrode 16b is disposed in one opening of the through hole 16f on the plate 16a, so that the inner periphery of the annular first electrode 16b is a tubular dielectric as shown in FIG. It is provided along the inner periphery of 16d. On the other hand, the inner diameter of the annular second electrode 16c is configured to match the outer diameter of the tubular dielectric 16d. Therefore, by arranging the second electrode 16c at the other opening of the through hole 16f on the plate 16a, as shown in FIG. 2B, the inner periphery of the second electrode 16c is formed by the tubular dielectric 16d. It is provided along the outer periphery.
By providing the first electrode 16b and the second electrode 16d in the tubular dielectric 16d and the through hole 16f, the first electrode 16b located far from the film F is exposed as viewed from the space in the through hole 16f. The second electrode 16c located near the film F is covered with a tubular dielectric 16d as viewed from the space in the through hole 16f.
The first electrode 16b is exposed when viewed from the space inside the through hole 16f, and the second electrode 16c is covered with the tubular dielectric 16d when viewed from the space inside the through hole 16f, thereby forming the through hole 16f. When the plasma is generated in the region between the first electrode 16b and the second electrode 16c in the space, the force for pushing the plasma toward the film F is exhibited as described later with the generation of the plasma. It is.
Although the through-hole 16f and the dielectric tube 16d of the plasma generating element have a circular tube shape, and the plasma generating electrodes 16b and 16c have an annular electrode shape, these shapes are not limited to a circular tube shape or an annular shape. . The cross sections of the through hole 16f and the dielectric tube 16d may be rectangular, and the plasma generation electrodes 16b and 16c may also be rectangular ring shapes.

FIG. 3 is a view for explaining plasma generation in this embodiment.
By applying a voltage between the first electrode 16b and the second electrode 16c, plasma P using a film forming gas is generated in a region between the first electrode 16b and the second electrode 16c. At this time, the first electrode 16b far from the film F is exposed when viewed from the space in the through hole 16f, and the second electrode 16c close to the film F is covered with a tubular dielectric 16d when viewed from the space in the through hole 16f. Therefore, the pulling force is generated by the generated plasma P toward the second electrode 16c. The force generated by the generation of such plasma P is, for example, “Experimental Investigation of DBD Plasma Actuators Driven by Repetitive High Voltage Nanosecond Pulses with DC or Low-Frequency Sinusoidal Bias” (Dmitry F. Opaits et al., 38 ^th AIAA Plasmadynamics and Lasers Conference <br> in conjunction with the <br> 16 ^th , 25-28 June 2007). Therefore, the plasma generating element that has the first electrode 16b, the second electrode 16c, and the tubular dielectric 16d and generates the plasma P has a film-forming gas in the through hole 16f surrounded by the tubular dielectric 16d. It functions as an actuator that sucks into the space to generate plasma P, and further discharges radical molecules of film forming components generated by the film P being decomposed by the plasma P toward the film F.
That is, when the plasma P is generated in the space in the through hole 16f by the film forming gas, a downward pulling force in FIG. 3 is generated, so that the radical molecules generated by the plasma P are below the through hole 16f. And is discharged downward so as to diffuse from the opening.

FIG. 4 is a diagram illustrating the configuration of the power unit and the plasma generation unit of the present embodiment.
As described above, the plasma generating element having the first electrode 16b, the second electrode 16c, and the tubular dielectric 16d can generate plasma in the space in the through hole 16f surrounded by the tubular dielectric 16d. . In FIG. 4, the plasma generating element is denoted by reference numeral 17. As shown in FIG. 4, the plurality of through holes 16 f provided in the plate 16 a are preferably provided in a row along the width direction orthogonal to the transport direction of the film F. With such a configuration, the plasma generating elements 17 are formed in a line along the width direction of the film F. Since the plurality of plasma generating elements 17 that generate plasma are formed in a line along the width direction of the film F, the plasma P is used to transport the film F at once in the width direction of the film F. A film can be formed.

The power unit 18 includes a high voltage power supply 18a, a control unit 18b, and a high voltage pulse generation circuit 18c. The power unit 18 is wired via a feeder line 16e so as to supply power to each of the plasma generation elements 17.
The high voltage power supply 18a supplies, for example, a voltage of 500V to the high voltage pulse generation circuit 18c.
The control part 18b is a part which controls the supply amount of electric power so that the film thickness formed in the film F may become target thickness, and is comprised by a computer. In the computer, the control unit 18b functions by reading and executing a software program stored in a memory (not shown). The controller 18b preferably controls the amount of power supplied to each of the plasma generating elements 17.

The high voltage pulse generation circuit 18c is a circuit configured to generate a voltage pulse to be supplied to each of the plasma generation elements 17 in accordance with an instruction from the control unit 18b. The level of the voltage pulse only needs to be such that plasma P can be generated in the through hole 16f, and depends on the pressure in the film formation space.
As a more preferred aspect, the high voltage pulse generation circuit 18 c of the power unit 18 generates a voltage pulse according to an instruction from the control unit 18 b and supplies this voltage pulse to each of the plasma generation elements 17. For example, a pulse having a frequency of 10 kHz to 100 MHz is used as the voltage pulse. The controller 18b controls the supply amount of electric power according to the formed film thickness so that the film thickness formed on the film F becomes a target thickness. Specifically, the control unit 18b controls the amount of power supply using the number of voltage pulses per unit time. When there is a portion where the film thickness formed on the film F is thin in the width direction, the number of pulses per unit time of the voltage pulse supplied to the plasma generating element 17 corresponding to the thin portion is increased to generate the plasma P. Control to increase the frequency is good. By controlling the generation frequency of the plasma P, the intensity of the plasma P can be controlled.
As described above, in the present embodiment, adjusting the power supplied to each of the plasma generation elements 17 using the number of pulses of the voltage pulse per unit time allows the film thickness distribution of the film formed on the film F to be predetermined. This is preferable in terms of the distribution. However, in order to make the film thickness distribution of the film formed on the film F a predetermined distribution, the pulse width and the level of the pulse voltage may be controlled.

Control of the film thickness of the film F by the control part 18b is based on the measurement result by the measurement unit 24 (refer FIG. 4) which measures the thickness distribution of the film | membrane provided in the downstream of the conveyance direction of the film F of the plasma generation unit 16. It is preferable to be performed. That is, the measurement unit 24 sends the measurement result to the control unit 18b, and the control unit 18b supplies the power so that the film thickness distribution in the width direction of the film F becomes the target thickness distribution according to the measurement result. It is preferable to control the supply amount.
The measurement unit 24 includes, for example, a laser light irradiation unit 24a and a light receiving unit 24b. The laser beam irradiation unit 24 and the light receiving unit 24b are provided on different sides of the film F. The laser beam irradiation unit 24 linearly irradiates the laser beam in the width direction of the film F, and the light receiving unit 24b receives the transmitted light of the laser beam transmitted through the film F. The light receiving unit 24b sends the received light intensity of the received transmitted light to the control unit 18b as a measurement result. The controller 18b can acquire information on the distribution in the width direction of the film thickness based on the intensity of the received light intensity.
Thus, based on the measurement result of the film thickness distribution of the film formed on the film F, the plasma along the width direction of the film F is controlled by controlling the amount of power supplied to each of the plasma generating elements 17. It is possible to control the intensity distribution. Thereby, the thickness distribution of the film formation in the width direction of the film F can be made uniform.

When the power supplied from the power unit 18 to the plasma generation unit 16 is a high-frequency pulse of 1 MHz to 100 MHz, that is, when the power supply from the power unit 18 is a high-frequency power supply system, the power supply line 16e. In the present embodiment, the power supply line 16e is a microstrip line as a preferred form. In this case, the first electrode 16b is formed along the opening of the through hole 16f on one main surface (first main surface) of the plate 16a, and the second electrode 16c is formed by the first main surface of the plate 16a. It is formed along the opening of through hole 16f on the second main surface facing the surface. Second electrode 16c is connected to a ground conductor 16g formed on the second main surface of plate 16a. Therefore, the power supply line 16e connected to the first electrode 16b can form a microstrip line composed of a plate-like dielectric that is the plate 16a and the ground conductor 16g.
When the power supply from the power unit 18 is not a high-frequency (1 MHz or higher) power supply, for example, a power supply with a frequency of 10 kHz to less than 1 MHz, it is not always necessary to use a microstrip line power supply method. In this case, the ground conductor 16g need not be provided, and a coaxial cable can be used as the feeder line 16e.

(Film formation method)
Hereinafter, the film forming method of this embodiment will be described.
First, in the film forming apparatus 10, the exhaust unit 22 is driven so that the atmosphere in the film forming space in the film forming container 12 is maintained at a constant pressure. On the other hand, a film forming gas is constantly introduced into the film forming space at a predetermined flow rate through the gas supply unit 20. At this time, the film F is drawn out from the rotating roller 14b and conveyed so as to be wound around the rotating roller 14a. During conveyance of the film F, electric power is supplied between the first electrode 16b and the second electrode 16c. As a result, dielectric barrier discharge using the film-forming gas is generated in each of the plasma generation elements 17, and plasma is generated. Power is supplied to each of the plasma generating elements 17 by voltage pulses having a predetermined number of pulses per unit time.

  Due to the power supply, a film is formed between the first electrode 14b exposed when viewed from the space inside the through hole 16f and the second electrode 14c covered with the dielectric 16d when viewed from the space inside the through hole 16f. Plasma P using gas is generated. The generated plasma P receives force from the first electrode 14b toward the second electrode 14c as described above. After the plasma P is generated, ions are neutralized over time, and radical molecules as film forming components are generated. The radical molecules are discharged toward the film F from the through holes 16f under the force. Thereby, a thin film is formed in the film F in conveyance. Excess neutral radicals, film forming gases and ions are exhausted from the exhaust pipe 22a. Thereby, the pressure in the film forming space is maintained constant.

  The film thickness of the thin film formed on the film F is measured by the measuring unit 24. Specifically, among the laser beams irradiated linearly in the width direction of the film F, the light receiving unit 24b receives the transmitted light that has passed through the film. The light receiving unit 24 sends the generated light reception signal (light reception intensity signal) to the control unit 18b. The controller 18b obtains the distribution of the transmittance of the laser light from the level of the received light signal. The control unit 18b includes a reference table that represents the relationship between the film thickness and the laser beam transmittance. The control unit 18b refers to the reference table using the transmittance distribution to obtain the thickness distribution in the width direction of the film F of the formed film. For example, the control unit 18b obtains the position in the width direction of the film F below the predetermined allowable range in the film thickness distribution and the level of the film thickness at this position, and corresponds to the obtained position in the width direction of the film F. The plasma generating element 17 is specified. The control unit 18b further determines the supply amount of power supplied to the specified plasma generation element 17 based on the obtained film thickness level. The controller 18b determines the number of pulses per unit time of the voltage pulse from the determined supply amount of power. The control unit 18b sends a control signal having the determined number of pulses to the high voltage pulse generation circuit 18c. The high voltage pulse generation circuit 18c generates voltage pulses having the number of pulses as instructed according to the control signal from the control unit 18b. Of course, the control unit 18b obtains the position in the width direction exceeding the predetermined allowable range in the film thickness distribution and the film thickness level at this position, and determines the plasma generation element 17 corresponding to the obtained position in the width direction. You may specify. In this case, the control unit 18b can further determine the supply amount of power supplied to the specified plasma generation element 17 based on the obtained film thickness level.

  The film F thus formed while being conveyed is taken up by the conveying roller 14a to form a film forming roll. In addition, when the film thickness of the film formed on the film F is equal to or less than the target film thickness to be finally formed, the film F is drawn from the film forming roll wound by the rotating roller 14a, and the rotating roller 14b The film F is conveyed toward. During transport, when passing through the plasma generation unit 16, film F is formed using plasma. Thereby, the film thickness on the film F can be made thick. At this time, although not shown, a measuring unit for measuring the thin film having a large thickness may be provided between the plasma generating element 17 and the rotating roller 14b. Further, before film formation is performed, the control unit 18b may determine the amount of power supplied to each of the plasma generation elements 17 according to the distribution of the film thickness of the film measured by the measurement unit 24.

  In other words, when the film F is a web-like film wound around a roll (the rotating roller 14a or the rotating roller 14b), the film F is drawn out from the rotating roller 14a or the rotating roller 14b during film formation. After the film F is transported for the film, the film F formed during the transport is wound by the rotating roller 14a or the rotating roller 14b to form a film forming process roll (first step). Thereafter, in order to increase the film thickness of the film F, the film F formed from the film-forming process roll formed by being wound around the rotating roller 14a or the rotating roller 14b is again drawn out and conveyed, and the film F is formed during the conveyance. The film F thus formed is wound up by the rotating roller 14b or the rotating roller 14a to form a new film forming roll (second step). Further, by repeating the second step, the film thickness can be set to the target thickness. That is, the film F is conveyed rightward and leftward as shown in FIG. 1, and the film F is formed by the plasma generation unit 16 each time to increase the film thickness.

  In this embodiment, the web-like film F that is conveyed using the rotating rollers 14a and 14b is used as a film formation substrate. However, a single glass substrate or resin substrate that is placed on a moving belt and conveyed is used. A substrate for film formation can also be used.

Summarizing the present embodiment, the following effects are obtained.
In the present embodiment, the first electrode 14b at a position far from the film F is exposed when viewed from the space in the through hole 16f, and the second electrode 14c at a position close to the film F is from the space in the through hole 16f. Since it is covered with the dielectric 16d as seen, the film forming gas is attracted by the generation of the plasma P, and the radial molecules of the film forming components generated from the plasma P are ejected and deposited on the film F. Therefore, in this embodiment, film formation can be performed at high speed. In addition, since the power unit 18 individually supplies power between the first electrode 16b and the second electrode 16c provided in each of the through holes of the plasma generation unit 16, by controlling the power supply individually, The intensity distribution of plasma can be easily adjusted, and a uniform film can be formed.

  Since the through holes 16f are provided in a row along the width direction orthogonal to the transport direction of the film F, the plasma generating elements 17 are provided in a row along the width direction of the film F. For this reason, since the film F can be formed at once in the width direction, the film can be formed at high speed.

  The control unit 18b of the power unit 18 controls the amount of power supplied to the plasma generation element 17 for each through-hole 16f, that is, for each plasma generation element 17, and the control unit 18b controls the film thickness of the film formed on the film F. The amount of power supply is controlled according to Therefore, this embodiment can form a uniform film on the film F easily.

  The measurement unit 24 provided on the downstream side in the transport direction of the film F of the plasma generation unit 16 measures the film thickness distribution of the film formed on the film F, and the measurement unit 24 sends the measurement result to the control unit 18b. The control unit 18b controls the supply amount of electric power so that the film thickness distribution becomes the target thickness distribution according to the measurement result. For this reason, a uniform film can be more easily formed on the film F.

  At this time, it is preferable that the power unit 18 supplies power by voltage pulses, and the control unit 18b controls the power supply amount using the number of pulses per unit time of the voltage pulses. In the case of this preferred form, the intensity distribution of plasma can be easily adjusted using the number of pulses, and control for forming a uniform film on the film F can be performed more easily.

  The first electrode 16b is formed along the opening of the through hole 16f on the first main surface of the plate 16a. The second electrode 16c is formed along the opening of the through hole 16f on the second main surface opposite to the first main surface of the plate 16a, and is formed on the second main surface of the plate 16a. Connected to 16g. The power supply line 16e connected to the first electrode 16b is a microstrip line composed of a dielectric plate 16a and a ground conductor 16g. For this reason, when supplying high frequency electric power to the 1st electrode 16b, the feeder 16e can be made into a simple structure.

  In the present embodiment, the web-like film F wound around the roll is conveyed in the right direction and the left direction in FIG. 1 using the rotating rollers 14a and 14b, and is formed by the plasma generation unit 16 each time. By increasing the film thickness, a film having a target thickness can be efficiently formed on the film F.

(Modification)
FIG. 5 is a diagram for explaining a modification of the present embodiment. In the plasma generation unit 16 of this modification, the through holes 16 f are provided in a row along the width direction of the film F, and a plurality of rows are also provided in the transport direction of the film F. That is, the plasma generating elements 17 are provided in a row along the width direction of the film F, and a plurality of rows are also provided in the transport direction of the film F. Such plasma generating elements 17 are individually connected to the power supply unit 18, and the power supplied to each of the plasma generating elements 17 is individually controlled by the control unit 18b. Thus, by providing a plurality of plasma generating elements 17 not only in the width direction of the film F but also in the transport direction, the film forming speed of the film formed on the film F can be improved. Since the film forming speed is improved, the conveyance speed of the film F can be increased in accordance with the film forming speed. Therefore, the time for forming a film having a target film thickness on the film F can be shortened.
In the case of this modification, the film forming gas supplied to each of the plasma generating elements 17 may be changed according to the position in the transport direction of the film F. Thereby, the thin film formed in the film F can be formed as a multi-laminate film in which different layers are laminated.

  As described above, the film forming apparatus and the film forming method of the present invention have been described in detail. However, the present invention is not limited to the above-described embodiments and modifications, and various improvements and modifications can be made without departing from the gist of the present invention. Of course.

DESCRIPTION OF SYMBOLS 10 Film-forming apparatus 12 Film-forming container 14 Transport mechanism 16 Plasma generation unit 16a Plate 16b 1st electrode 16c 2nd electrode 16d Dielectric 16e Feed line 16f Through-hole 16g Grounding conductor 18 Power unit 18a High voltage power supply 18b Control part 18c High voltage Pulse generation circuit 20 Gas supply unit 20a First gas source 20b Second gas source 20c Mass flow controller 20d Introduction pipe 22 Exhaust unit 22a Exhaust pipe 24 Measurement unit 24a Laser light irradiation part 24b Light receiving part

Claims (10)

A film forming apparatus using plasma,
A transport mechanism for transporting the deposition substrate during deposition of the deposition substrate;
A unit for forming a film on the film-forming substrate being transferred by generating plasma using a film-forming gas, the thickness of the plate provided on the plate facing the film-forming substrate A plurality of through-holes penetrating in the direction, a pair of annular electrodes provided at different positions in the depth direction of the through-holes along the inner peripheral surfaces of the through-holes, and the through-holes A plasma generating unit comprising a tubular dielectric covering an inner peripheral surface;
A power unit that individually supplies power for generating the plasma to each electrode of the through hole of the plasma generation unit,
Of the pair of electrodes, the first electrode located far from the film formation substrate is exposed when viewed from the space in the through hole, and the second electrode located close to the film formation substrate is the through hole. A film forming apparatus, which is covered with the dielectric as viewed from the space inside.   The film formation apparatus according to claim 1, wherein the through holes are provided in a row along a width direction orthogonal to a conveyance direction of the film formation substrate.   The power unit includes a control unit that controls the supply amount of the power for each through hole, and the control unit controls the supply amount of the power according to a film thickness of a film formed on the film formation substrate. The film forming apparatus according to claim 1, wherein the film forming apparatus is controlled.   The measurement unit has a measurement unit that measures a film thickness distribution of the film formed on the film formation substrate on the downstream side in the transport direction of the film formation substrate of the plasma generation unit, and the measurement unit displays the measurement result The film forming apparatus according to claim 3, wherein the control unit controls the supply amount of the electric power so that the film thickness distribution of the film becomes a target distribution according to the measurement result. .   5. The power unit according to claim 3, wherein the power unit supplies the power supply by a voltage pulse, and the control unit controls the supply amount of the power by using the number of pulses per unit time of the voltage pulse. Deposition device.   6. The plasma generation unit according to claim 1, wherein the through holes are provided in a row along a width direction orthogonal to the transport direction of the film forming substrate, and a plurality of rows are also provided in the transport direction. The film forming apparatus according to claim 1. The film-forming substrate is a web-like film wound around a roll,
The said conveyance mechanism pulls out a film from a roll, conveys the said film for film formation in one direction, and then winds up the formed film to form a film-forming treatment roll. The film forming apparatus according to claim 1.   In order to increase the film thickness of the film, the transport mechanism pulls out the film formed from the film forming roll again, transports the film in the direction opposite to the one direction, and winds the film formed. The film forming apparatus according to claim 7, wherein the film forming apparatus takes a new film forming roll. The power unit supplies high-frequency power to the plasma generation unit,
The plate is a dielectric;
The first electrode is formed along the opening of the through hole on the first main surface of the plate,
The second electrode is formed along the opening of the through hole on the second main surface opposite to the first main surface of the plate, and is formed on the second main surface of the plate. Connected to the ground conductor
The film forming apparatus according to claim 1, wherein the power supply line connected to the first electrode is a microstrip line configured by the dielectric and the ground conductor. A film forming method using the film forming apparatus according to any one of claims 1 to 6,
The film-forming substrate is a web-like film wound around a roll,
A first step of drawing the film from the roll and transporting the film for film formation, and then winding the formed film to form a film forming roll;
In order to increase the thickness of the film, the film formed from the film forming roll is pulled out again and conveyed, and the film formed is wound up to form a new film forming roll. And including
A film forming method, wherein the film thickness of the formed film is set to a target thickness by repeating the second step.

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