JP2014150188A5 - - Google Patents
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- JP2014150188A5 JP2014150188A5 JP2013018742A JP2013018742A JP2014150188A5 JP 2014150188 A5 JP2014150188 A5 JP 2014150188A5 JP 2013018742 A JP2013018742 A JP 2013018742A JP 2013018742 A JP2013018742 A JP 2013018742A JP 2014150188 A5 JP2014150188 A5 JP 2014150188A5
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- layer
- light emitting
- insulating layer
- electrode
- conductive material
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- 239000004065 semiconductor Substances 0.000 claims 7
- 239000004020 conductor Substances 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Claims (10)
第1の導電材料を含み、且つ前記平たい台の前記上表面の上に位置する第1の層と、第2の導電材料を含み、且つ前記第1の層の上に位置する第2の層とを含む第1の電極と、
前記複数の凹溝の各前記底部にそれぞれ位置する複数の第2の電極と、
前記複数の凹溝に位置し、且つ前記平たい台の前記上表面の一部の上に位置する第1の絶縁層であって、前記第1の絶縁層が複数の通路を含み、前記複数の第2の電極を露出する、第1の絶縁層と、
前記第1の絶縁層の上に位置し、且つ前記第1の電極と接触する第1の電極パッドと、
前記複数の第2の電極の上に位置し、且つ前記複数の第2の電極と接触する第2の電極パッドと、を含む発光素子。 A semiconductor stack comprising a plurality of concave grooves each having a bottom and a flat base having an upper surface;
It comprises a first conductive material and a first layer located on the flat platform the upper surface of the includes a second electrically conductive material and a second layer positioned on the first layer A first electrode comprising:
A plurality of second electrodes respectively located at the bottom of each of the plurality of grooves,
A first insulating layer located in the plurality of concave grooves and on a part of the upper surface of the flat table, wherein the first insulating layer includes a plurality of passages; A first insulating layer exposing the second electrode;
A first electrode pad located on the first insulating layer and in contact with the first electrode;
A light-emitting element including a second electrode pad positioned on the plurality of second electrodes and in contact with the plurality of second electrodes .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013018742A JP6218386B2 (en) | 2013-02-01 | 2013-02-01 | Light emitting element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013018742A JP6218386B2 (en) | 2013-02-01 | 2013-02-01 | Light emitting element |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017184264A Division JP6501845B2 (en) | 2017-09-26 | 2017-09-26 | Light emitting element |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014150188A JP2014150188A (en) | 2014-08-21 |
JP2014150188A5 true JP2014150188A5 (en) | 2016-03-10 |
JP6218386B2 JP6218386B2 (en) | 2017-10-25 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013018742A Active JP6218386B2 (en) | 2013-02-01 | 2013-02-01 | Light emitting element |
Country Status (1)
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JP (1) | JP6218386B2 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US6828596B2 (en) * | 2002-06-13 | 2004-12-07 | Lumileds Lighting U.S., Llc | Contacting scheme for large and small area semiconductor light emitting flip chip devices |
JP2007266396A (en) * | 2006-03-29 | 2007-10-11 | Showa Denko Kk | Flip-chip type semiconductor light-emitting device, the flip-chip type semiconductor light-emitting device mounting method, flip-chip type semiconductor light-emitting device mounting structure, and light-emitting diode lamp |
US8368100B2 (en) * | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
KR101252032B1 (en) * | 2010-07-08 | 2013-04-10 | 삼성전자주식회사 | Semiconductor light emitting device and method of manufacturing the same |
JP5777879B2 (en) * | 2010-12-27 | 2015-09-09 | ローム株式会社 | Light emitting device, light emitting device unit, and light emitting device package |
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2013
- 2013-02-01 JP JP2013018742A patent/JP6218386B2/en active Active