JP2014150105A - Component fixing jig and flip chip bonding method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component fixing jig capable of fixing a component with respect to force in plural directions and also to provide a flip chip bonding method using the same.SOLUTION: A component fixing jig 10 includes: a recess 11 in which a component 80 is housed; an inner bottom surface 12 and inner side surfaces 13, 14 which constitute the recess 11 and abut on the component 80; and suction holes 12a, 13a, 14a which are provided on the inner bottom surface 12 and the inner side surfaces 13, 14, respectively and perform vacuum-suction of the component 80.

Description

  The present invention relates to a component fixing jig for fixing components such as electronic components, and a flip chip bonding method using the same.

  FIG. 8 is a partial perspective view showing a conventional component fixing jig. Hereinafter, description will be given based on this drawing.

  The conventional component fixing jig 70 includes a recess 71 that accommodates the component 80, an inner bottom surface 72 on which the component 80 is placed in the recess 71, a suction hole 72a that is provided on the inner bottom surface 72 and vacuum-sucks the component 80, (For example, refer to Patent Document 1). Since the component 80 is fixed to the inner bottom surface 72 of the recess 71 by vacuum suction, for example, even if the component fixing jig 70 is inverted, it does not fall. In addition, three-dimensional orthogonal coordinates are defined in which the normal direction of the inner bottom surface 72 is the Z axis, the normal direction of the inner side surface 73 is the Y axis, and the normal direction of the inner side surface 74 is the X axis.

  FIG. 9 is a cross-sectional view showing a conventional flip chip bonding method. Hereinafter, a description will be given based on FIGS. 8 and 9. In addition, the cross section of the component fixing jig in FIG. 9 includes the cross section along the line IX-IX in FIG.

  The component 80 is a temperature compensated crystal oscillator (TCXO) as an example, and includes a lid portion 86, a frame portion 87, and a substrate portion 88. A crystal resonator (not shown) is mounted in a space formed by the lid portion 86 and the frame portion 87. A flip chip 90 is mounted on the substrate unit 88. The flip chip 90 is an IC chip including an oscillation circuit and a temperature compensation circuit, and includes a plurality of bump electrodes 91. For example, the lid portion 86 and the frame portion 87 are made of metal, the substrate portion 88 is made of ceramic, and the bump electrode 91 is made of gold.

  The conventional flip chip bonding method is a method using the component fixing jig 70, and is executed by the following procedure. First, the component 80 is accommodated in the recess 71 of the component fixing jig 70. Subsequently, the lower surface 82 of the component 80 is brought into contact with the inner bottom surface 72 of the recess 71, and the lower surface 82 of the component 80 is vacuum-sucked by the suction holes 72 a as indicated by the exhaust direction 75. Finally, the flip chip 90 is bonded to the upper surface 81 of the component 80 with ultrasonic waves.

In this ultrasonic bonding, the component 80 is fixed from the component fixing jig 70 to the component 80 in a state where the component 80 is fixed by vacuum suction and the bump electrode 91 of the flip chip 90 is applied to the pad electrode (not shown) of the substrate portion 88. The flip chip 90 is mounted on the substrate unit 88 by applying a load F _Z in the −Z-axis direction and ultrasonic vibration F _XY in the X-axis to Y-axis directions from the bonding tool 95 to the flip chip 90. is there.

JP 2006-31479 A

However, in the conventional component fixing jig 70, since the lower surface 82 of the component 80 is only vacuum-sucked by the suction hole 72a, the component 80 can be fixed against the force in the + Z-axis direction. The part 80 could not be sufficiently fixed with respect to the force. Therefore, in flip chip bonding using the component fixing jig 70, the energy of the ultrasonic vibration _FXY cannot be sufficiently transmitted to the component 80, and the bonding (bonding) of the bump electrode 91 may be defective.

  Accordingly, an object of the present invention is to provide a component fixing jig capable of fixing components against forces in a plurality of directions, and a flip chip bonding method using the same.

The component fixing jig according to the present invention is:
A recess for housing the parts;
A plurality of abutting surfaces that abut against the component, and constitute the recess,
A plurality of suction holes provided on each of the plurality of contact surfaces, for vacuum suction of the component;
It is equipped with.

The flip chip bonding method according to the present invention includes:
The component is accommodated in the recess of the component fixing jig according to the present invention,
A plurality of surfaces of the component are in contact with the plurality of contact surfaces, respectively, and vacuum suction is performed with the plurality of suction holes;
The flip chip is ultrasonically bonded to the other surface of the component.
Is.

  According to the component fixing jig according to the present invention, since the suction holes are provided in the plurality of contact surfaces that contact the component, respectively, the components can be vacuum-sucked by the plurality of suction holes. Can also fix parts.

  According to the flip chip bonding method according to the present invention, the energy of ultrasonic vibration can be reliably transmitted to the bump electrode of the flip chip by fixing the component using the component fixing jig according to the present invention, so that the bonding yield can be increased. It can be improved.

It is a fragmentary perspective view which shows the component fixing jig of Embodiment 1. FIG. It is sectional drawing containing the II-II line cross section in FIG. It is sectional drawing which shows an example of the manufacturing method of the component fixing jig of Embodiment 1. FIG. 1 is a cross-sectional view illustrating a flip chip bonding method according to a first embodiment. FIG. 5A is a schematic plan view showing the component fixing jig of the first embodiment, and FIG. 5B is an enlarged plan view showing the recesses in the first embodiment. It is a graph which shows the result of the flip chip bonding using the component fixing jig of Example 1. It is a graph which shows the result of the flip chip bonding using the component fixing jig of the comparative example 1. It is a fragmentary perspective view which shows the conventional component fixing jig. It is sectional drawing which shows the conventional flip chip bonding method.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. In the present specification and drawings, the same reference numerals are used for substantially the same components. The shapes depicted in the drawings are drawn so as to be easily understood by those skilled in the art, and thus do not necessarily match the actual dimensions and ratios.

  FIG. 1 is a partial perspective view showing the component fixing jig of the first embodiment. 2 is a cross-sectional view including a cross section taken along line II-II in FIG. FIG. 3 is a cross-sectional view illustrating an example of a method for manufacturing the component fixing jig of the first embodiment. Hereinafter, description will be given based on these drawings.

  As shown in FIG. 1, the component fixing jig 10 according to the first embodiment includes a recess 11 that accommodates a component 80, an inner bottom surface 12 that forms a recess 11, and a plurality of contact surfaces that contact the component 80. Side surfaces 13, 14, and suction holes 12 a, 13 a, 14 a that are provided on the inner bottom surface 12 and the inner side surfaces 13, 14 and vacuum-suck the component 80 are provided. That is, an example of “first to third contact surfaces” recited in the claims is the inner bottom surface 12 and the inner side surfaces 13 and 14, and the inner bottom surface 12 and the inner side surfaces 13 and 14 are orthogonal to each other. The “first to third suction holes” described in the claims are, for example, suction holes 12 a, 13 a, and 14 a corresponding to the first to third contact surfaces. Further, a three-dimensional orthogonal coordinate is defined in which the normal direction of the inner bottom surface 12 is the Z axis, the normal direction of the inner side surface 13 is the Y axis, and the normal direction of the inner side surface 14 is the X axis.

  As shown in FIG. 2, the suction holes 13a and 14a communicate with the suction hole 12a. Accordingly, when the pressure is reduced as shown in the exhaust direction 15 by the vacuum pump, suction force is generated in the suction holes 12a, 13a, and 14a. The component 80 and the flip chip 90 are the same as those described in FIG. The component 80 includes a lid portion 86, a frame portion 87, and a substrate portion 88. The flip chip 90 has a plurality of bump electrodes 91. The flip chip 90 is mounted on the upper surface 81 of the component 80, that is, the recessed plane at the center of the substrate portion 88. Here, the component 80 refers to a structure on which the flip chip 90 is mounted, and includes what is called a product. In addition, the shape of the component 80 used in the first embodiment is a rectangular parallelepiped (including a cube).

  As shown in FIG. 3, the component fixing jig 10 is formed by, for example, forming through holes in six stainless steel plates 21 to 26, respectively, and integrating these plates 21 to 26 by diffusion bonding. Can be manufactured. Note that “diffusion bonding” refers to a technique in which bonding is performed only by atomic transfer between materials without using any adhesive or the like and without dissolving the materials under high temperature, high pressure and high vacuum.

  According to the component fixing jig 10, by providing the suction holes 12a, 13a, and 14a on the inner bottom surface 12 and the inner side surfaces 13 and 14 that contact the component 80, respectively, the component 80 is moved in three directions by the suction holes 12a, 13a, and 14a. Therefore, the component 80 can be fixed not only against the force in the Z-axis direction but also against the force in the X-axis to Y-axis directions.

  FIG. 4 is a cross-sectional view illustrating the flip chip bonding method according to the first embodiment. Hereinafter, description will be made based on FIGS. 1, 2, and 4.

  The cross section of the component fixing jig 10 in FIG. 4 is the same as the cross section of the component fixing jig 10 in FIG. The bonding tool 95 is the same as that described with reference to FIG.

  The flip chip bonding method according to the first embodiment is a method using the component fixing jig 10 and is executed according to the following procedure. First, the component 80 is accommodated in the recess 11 of the component fixing jig 10. Subsequently, the lower surface 82 of the component 80 is brought into contact with the inner bottom surface 12, and the side surfaces 83 and 84 of the component 80 that intersect each other are brought into contact with the inner side surfaces 13 and 14. Then, as indicated by the exhaust direction 15, the lower surface 82 and the side surfaces 83 and 84, which are one surface of the component 80, are vacuum-sucked by the suction holes 12a, 13a and 14a, respectively. Finally, the flip chip 90 is bonded to the upper surface 81 which is the other surface of the component 80 by ultrasonic waves.

In this ultrasonic bonding, the component 80 is fixed by vacuum suction from three directions, and the bump electrode 91 of the flip chip 90 is applied to the pad electrode (not shown) of the substrate portion 88 from the component fixing jig 10. By applying heat to the component 80 and applying a load F _Z in the −Z-axis direction and ultrasonic vibration F _XY in the X-axis to Y-axis directions from the bonding tool 95 to the flip chip 90, the flip chip 90 is placed on the substrate portion 88. It is to be implemented.

In the component fixing jig 10, the lower surface 82 and the side surfaces 83, 84 of the component 80 are vacuum-sucked from the three directions by the suction holes 12 a, 13 a, 14 a, so that the component 80 can be sufficiently fixed against the force in the Z-axis direction. In addition, the component 80 can be sufficiently fixed against a force in the X-axis to Y-axis directions. Therefore, the energy of the ultrasonic vibration F _XY is consumed for bonding (bonding) of the bump electrode 91 without being consumed for slipping of the component 80. Therefore, according to the flip chip bonding method of the first embodiment, the energy of the ultrasonic vibration _FXY can be reliably transmitted to the bump electrode 91 of the flip chip 90 by fixing the component 80 using the component fixing jig 10. Therefore, the bonding yield can be improved.

  Next, Example 1 that further embodies the first embodiment will be described. FIG. 5A is a schematic plan view showing the component fixing jig of the first embodiment, and FIG. 5B is an enlarged plan view showing the recesses in the first embodiment. Hereinafter, a description will be given based on FIG.

  The component fixing jig 10 according to the first embodiment is called an arrangement jig and includes n rows × m columns of concave portions 11. The recess 11 is called a pocket, and notches 31 to 36 are formed in addition to the inner bottom surface 12 and the inner side surfaces 13 and 14 and the suction holes 12a, 13a and 14a. The notches 31 to 36 are for facilitating taking in and out of the part 80.

  6 is a graph showing the result of flip chip bonding using the component fixing jig of Example 1. FIG. FIG. 7 is a graph showing the results of flip chip bonding using the component fixing jig of Comparative Example 1. Hereinafter, a description will be given with reference to FIGS.

  Of the n rows × m columns of recesses 11, n = 1 to 16 and m = 1, that is, 16 pieces from the first row to the 16th row of the first column were subjected to flip chip bonding. The horizontal axis in FIG. 6 is the numbers 1 to 16 of the 16 recesses 11, and the vertical axis in FIG. 6 is the impedance. The impedance is given by the supply voltage / supply current to the bonding tool during flip chip bonding. In FIG. 6, impedance variation during flip chip bonding is measured for each recess 11, and the maximum value (max) is plotted with ◆, the minimum value (min) is plotted with ▲, and the average value (average) is plotted with ■. ing.

  The component fixing jig used in Comparative Example 1 in FIG. 7 has the same structure as the component fixing jig 10 used in Example 1 except that only the suction holes 12a are formed in the recesses 11, that is, the conventional component. It has the same structure as the fixing jig 70 (FIG. 8). The conditions for flip chip bonding in Comparative Example 1 are also the same as in Example 1. The vertical axis and horizontal axis in FIG. 7 are the same as the vertical axis and horizontal axis in FIG.

  As is clear from FIGS. 6 and 7, Example 1 has less impedance variation between different recesses 11 than Comparative Example 1, and less impedance variation due to the number of times even in the same recess 11. This means that Example 1 has a more stable flip chip bonding process and a higher bonding yield than Comparative Example 1.

  The present invention has been described above with reference to the above-described embodiments and examples. However, the present invention is not limited to the above-described embodiments and examples. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention. For example, the number of suction holes provided in one recess may be any number as long as it is plural, and is not limited to three, but may be two or four or more.

DESCRIPTION OF SYMBOLS 10 Component fixing jig 11 Recess 12 Inner bottom surface 12a Adsorption hole 13 Inner side surface 13a Adsorption hole 14 Inner side surface 14a Adsorption hole 15 Exhaust direction 21-26 Plate 31-36 Notch

70 Component fixing jig 71 Recessed portion 72 Inner bottom surface 72a Adsorption hole 73 Inner side surface 74 Inner side surface 75 Exhaust direction

80 parts 81 upper surface 82 lower surface 83 side surface 84 side surface 86 lid portion 87 frame portion 88 substrate portion 90 flip chip 91 bump electrode 95 bonding tool F _XY ultrasonic vibration F _Z load

Claims (3)

A recess for housing the parts;
A plurality of abutting surfaces that abut against the component, and constitute the recess,
A plurality of suction holes provided on each of the plurality of contact surfaces, for vacuum suction of the component;
Parts fixing jig with. The plurality of contact surfaces include first to third contact surfaces orthogonal to each other,
The plurality of suction holes are first to third suction holes provided on the first to third contact surfaces, respectively.
The component fixing jig according to claim 1. The component is accommodated in the concave portion of the component fixing jig according to claim 1 or 2,
A plurality of surfaces of the component abut each of the plurality of abutment surfaces, and adsorbed by the plurality of adsorption holes;
A flip chip is ultrasonically bonded to the other side of the component;
Flip chip bonding method.

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