JP2014146754A - Laminated through capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated through capacitor that allows reducing DC resistance while maintaining desired electrostatic capacitance.SOLUTION: A laminated through capacitor includes: an element body L; first and second terminal electrodes 1 and 2 for signals disposed on first and second side surfaces Lc and Ld of the element body L; first and second terminal electrodes 3 and 4 for ground connection disposed on third and fourth side surfaces Le and Lf of the element body L; and a plurality of internal electrodes 11 for signals and a plurality of internal electrodes 13 for ground connection alternately disposed in the element body L in the opposite direction of first and second primary surfaces. The internal electrodes 11 for signals are connected to the first and second terminal electrodes 1 and 2 for signals. The internal electrodes 13 for ground connection are connected to the first and second terminal electrodes 3 and 4 for ground connection, and a width w1 in the opposite direction of the first and second side surfaces Lc and Ld is narrower than a width w2 in the opposite direction of the first and second side surfaces Lc and Ld of the terminal electrode 3 for ground connection.

Description

  The present invention relates to a multilayer feedthrough capacitor.

  As a multilayer feedthrough capacitor, an element body, a plurality of signal terminal electrodes arranged on the outer surface of the element body, a ground terminal electrode arranged on the outer surface of the element body, and alternately arranged in the element body, A device having a plurality of signal internal electrodes and a ground internal electrode is known (for example, see Patent Document 1).

Japanese Patent Laid-Open No. 01-206615

  An object of the present invention is to provide a multilayer feedthrough capacitor capable of reducing a direct current resistance while securing a desired capacitance.

  The multilayer feedthrough capacitor according to the present invention includes a substantially rectangular first and second main surfaces facing each other and a first side direction of the first and second main surfaces so as to connect the first and second main surfaces. First and second side surfaces that extend in the direction opposite to each other, and third and fourth side surfaces that extend in the second side direction orthogonal to the first side direction so as to connect the first and second main surfaces and face each other. A plurality of signal terminal electrodes disposed on the first and second side surfaces of the element body, and for grounding disposed on at least one of the third and fourth side surfaces of the element body A terminal electrode and a plurality of signal internal electrodes and grounding internal electrodes, which are alternately arranged in the opposing direction of the first and second main surfaces in the element body, and each signal internal electrode includes a plurality of signal internal electrodes. Each grounding internal electrode is connected to the grounding terminal electrode and connected to the signal terminal electrode. Width in the opposing direction of the second side being narrower than the width in the opposing direction of the first and second side surfaces of the grounding terminal electrodes.

  In the multilayer feedthrough capacitor according to the present invention, the width in the facing direction of the first and second side surfaces of each grounding inner electrode is narrower than the width in the facing direction of the first and second side surfaces of the grounding terminal electrode, The capacitance formed by one signal internal electrode and one ground internal electrode is relatively small. Therefore, in order to secure a desired capacitance, it is necessary to increase the number of laminated layers of the signal internal electrode and the ground internal electrode. Thus, the DC resistance can be reduced by increasing the number of laminated signal internal electrodes.

  In the present invention, since the width in the opposing direction of the first and second side surfaces of each grounding internal electrode is narrow, even when the position of the signal internal electrode and the grounding internal electrode is shifted due to stacking shift, The area where the signal internal electrode and the ground internal electrode overlap is unlikely to change. Therefore, variation in capacitance can be reduced.

  The width in the opposing direction of the first and second side surfaces of the grounding internal electrode may be less than or equal to half the width in the opposing direction of the first and second side surfaces of the grounding terminal electrode. In this case, even when the position of each grounding internal electrode is shifted due to the stacking deviation, the grounding internal electrode protrudes from the width in the opposing direction of the first and second side surfaces of the grounding terminal electrode and is exposed. Can be prevented.

  The grounding internal electrode has a main electrode part facing the signal internal electrode, and an extraction electrode part extending from the main electrode part and connected to the grounding terminal electrode, and the first and second main electrode parts The width in the facing direction of the side surfaces may be narrower than the width in the facing direction of the first and second side surfaces of the extraction electrode portion. In this case, the width in the opposing direction of the first and second side surfaces of the main electrode portion is narrower than the width in the opposing direction of the first and second side surfaces of the extraction electrode portion. The capacitance formed by the two grounding inner electrodes is even smaller. Therefore, in order to secure a desired capacitance, it is necessary to further increase the number of laminated signal internal electrodes and grounding internal electrodes. By further increasing the number of laminated signal internal electrodes, the DC resistance This will be further reduced. Since the width in the opposing direction of the first and second side surfaces of the extraction electrode portion is wider than the width in the opposing direction of the first and second side surfaces of the main electrode portion, the ground electrode and the ground terminal electrode Connectivity can be secured.

  The main electrode portion has an electrode portion extending in the opposing direction of the third and fourth side surfaces, and the electrode portion of the main electrode portion in each grounding internal electrode is viewed from the opposing direction of the first and second main surfaces, You may position so that it may not mutually overlap. In this case, the level difference caused by the thickness of the electrode portion of the main electrode portion is dispersed, and deformation of the element body can be suppressed. Therefore, generation of internal structural defects can be suppressed.

  The main electrode part may have an electrode part branched into a plurality in the same plane. In this case, even if any one of the electrode portions is disconnected, a conductive state can be secured in the remaining electrode portions.

  Each dummy electrode further includes a plurality of dummy electrodes arranged on the same surface as each grounding internal electrode so as to sandwich the grounding internal electrode in the opposing direction of the first and second side surfaces and to be separated from the grounding internal electrode. May be connected to a corresponding signal terminal electrode. In this case, the adhesion between the element body and the signal terminal electrode can be improved.

  The interval in the opposing direction of the first and second side surfaces of the plurality of dummy electrodes may be narrower than the width in the opposing direction of the first and second side surfaces of the ground terminal electrode. In this case, generation of a step due to the thickness of the grounding internal electrode is suppressed, and deformation of the element body can be suppressed. Therefore, generation of internal structural defects can be suppressed.

  The grounding internal electrode has a main electrode part facing the signal internal electrode, and an extraction electrode part extending from the main electrode part and connected to the grounding terminal electrode, and the first and second main electrode parts The width in the opposing direction of the side surface is narrower than the width in the opposing direction of the first and second side surfaces of the extraction electrode portion, and the interval in the opposing direction of the first and second side surfaces of the plurality of dummy electrodes is the extraction electrode It may be narrower than the width in the opposing direction of the first and second side surfaces of the part. In this case, the width in the opposing direction of the first and second side surfaces of the main electrode portion is narrower than the width in the opposing direction of the first and second side surfaces of the extraction electrode portion. The capacitance formed by the two grounding inner electrodes is even smaller. Therefore, in order to secure a desired capacitance, it is necessary to further increase the number of laminated signal internal electrodes and grounding internal electrodes. By further increasing the number of laminated signal internal electrodes, the DC resistance This will be further reduced. Further, the occurrence of a step due to the thickness of the grounding internal electrode (main electrode portion) is further suppressed, and the deformation of the element body can be further suppressed.

  The first and second main surfaces have a substantially rectangular shape with the first side as the long side and the second side as the short side, and each signal internal electrode is in the opposing direction of the third and fourth side surfaces. May be wider than the width in the opposing direction of the first and second side surfaces. In this case, the DC resistance per signal internal electrode is lowered, and the DC resistance of the entire multilayer feedthrough capacitor can be further reduced.

  A plurality of signal terminal electrodes are disposed on the first side surface side and the second side surface side, respectively, and a plurality of signal internal electrodes are disposed on the same plane, and each signal interior located in the same plane The electrodes may be connected to different signal terminal electrodes on the first side surface side and the second side surface side. In this case, it is possible to realize a multilayer feedthrough capacitor array in which a desired capacitance is ensured and a direct current resistance is reduced.

  Each grounding internal electrode has a region that does not overlap with the signal internal electrode wider in the opposing direction of the first and second side surfaces than the remaining region when viewed from the opposing direction of the first and second main surfaces. Also good. In this case, generation of a step due to the thickness of the signal internal electrode is suppressed, and deformation of the element body can be suppressed. Therefore, generation of internal structural defects can be suppressed.

  According to the present invention, it is possible to provide a multilayer feedthrough capacitor capable of reducing a direct current resistance while ensuring a desired capacitance.

1 is a perspective view showing a multilayer feedthrough capacitor according to an embodiment. It is a disassembled perspective view which shows the structure of an element body. It is a top view which shows the signal internal electrode and the ground internal electrode. It is a top view which shows the modification of the grounding internal electrode. It is a top view which shows the modification of the internal electrode for grounding. It is a top view which shows the modification of the grounding internal electrode. It is a disassembled perspective view which shows the structure of the element body in the multilayer feedthrough capacitor which concerns on the modification of this embodiment. It is a top view which shows the internal electrode for grounding, and a dummy electrode. It is a top view which shows the modification of a grounding internal electrode and a dummy electrode. It is a perspective view which shows the multilayer feedthrough capacitor which concerns on the modification of this embodiment. It is a disassembled perspective view which shows the structure of an element body. It is a top view which shows the signal internal electrode and the ground internal electrode. It is a top view which shows the modification of the internal electrode for grounding. It is a top view which shows the modification of the internal electrode for grounding. It is a top view which shows the modification of the grounding internal electrode. It is a disassembled perspective view which shows the structure of the element body in the multilayer feedthrough capacitor which concerns on the modification of this embodiment. It is a top view which shows the internal electrode for grounding, and a dummy electrode. It is a top view which shows the modification of a grounding internal electrode and a dummy electrode. It is a perspective view which shows the multilayer feedthrough capacitor array which concerns on the modification of this embodiment. It is a disassembled perspective view which shows the structure of an element body. It is a top view which shows the signal internal electrode and the ground internal electrode. It is a top view which shows the modification of the internal electrode for grounding.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  First, the structure of the multilayer feedthrough capacitor C1 according to the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing a multilayer feedthrough capacitor according to this embodiment. FIG. 2 is an exploded perspective view showing the configuration of the element body.

  As shown in FIG. 1, the multilayer feedthrough capacitor C1 includes an element body L having dielectric characteristics, first and second signal terminal electrodes 1 and 2 disposed on the outer surface of the element body L, and an element body L. First and second ground terminal electrodes 3 and 4 disposed on the outer surface of the first and second ground terminals.

  As shown in FIG. 1, the element body L has a substantially rectangular parallelepiped shape, and has substantially rectangular first and second main surfaces La and Lb facing each other as outer surfaces thereof, and first and second side surfaces facing each other. Lc, Ld and opposing third and fourth side surfaces Le, Lf. The first and second side surfaces Lc, Ld extend in the short side direction of the first and second main surfaces La, Lb so as to connect the first and second main surfaces La, Lb. The third and fourth side surfaces Le and Lf extend in the long side direction of the first and second main surfaces La and Lb so as to connect the first and second main surfaces La and Lb.

  The first signal terminal electrode 1 is disposed on the first side face Lc side of the element body L. The first signal terminal electrode 1 covers the entire surface of the first side face Lc, and ends of the first and second main faces La and Lb and the third and fourth side faces Le and Lf (ends on the first side face Lc side). Part). The second signal terminal electrode 2 is disposed on the second side face Ld side of the element body L. The second signal terminal electrode 2 covers the entire surface of the second side face Ld, and ends of the first and second main faces La, Lb and the third and fourth side faces Le, Lf (ends on the second side face Ld side). Part). The first and second signal terminal electrodes 1 and 2 face each other in the facing direction of the first and second side faces Lc and Ld.

  The first ground terminal electrode 3 is disposed on the third side face Le side of the element body L. The first ground terminal electrode 3 traverses substantially the center in the facing direction of the first and second side faces Lc, Ld of the third side face Le along the facing direction of the first and second main faces La, Lb. Covered. The first grounding terminal electrode 3 further covers part of the end portions on the third side face Le side of the first and second main faces La and Lb.

  The second ground terminal electrode 4 is disposed on the fourth side face Lf side of the element body L. The second ground terminal electrode 4 traverses substantially the center in the facing direction of the first and second side faces Lc, Ld of the fourth side face Lf along the facing direction of the first and second main faces La, Lb. Covered. The second grounding terminal electrode 4 further covers part of the end portions on the fourth side face Lf side of the first and second main faces La and Lb. The first and second grounding terminal electrodes 3 and 4 face each other in the facing direction of the third and fourth side faces Le and Lf.

  The first and second signal terminal electrodes 1 and 2 and the first and second ground terminal electrodes 3 and 4 apply, for example, a conductive paste containing conductive metal powder and glass frit to the outer surface of the element body L. And then baking. If necessary, a plating layer may be formed on the baked terminal electrode. The signal terminal electrodes 1 and 2 and the ground terminal electrodes 3 and 4 are formed on the outer surface of the element body L so as to be electrically insulated from each other.

  In the multilayer feedthrough capacitor C1, the first main surface La or the second main surface Lb is preferably mounted on the electronic device as a mounting surface for the electronic device (for example, a circuit board, an electronic component, etc.). When the multilayer feedthrough capacitor C1 is mounted so that the second main surface Lb of the element body L faces the circuit board, the first and second signal terminal electrodes 1 and 2 are formed on the board and connected to the signal wiring. The first and second grounding terminal electrodes 3 and 4 are connected to the ground electrode formed on the substrate and connected to the ground wiring.

As shown in FIG. 2, the element body L is configured by laminating a plurality of insulator layers 10 in the facing direction of the first and second main surfaces La and Lb. That is, in the element body L, the opposing direction of the first and second main surfaces La and Lb coincides with the stacking direction of the plurality of insulator layers 10. Each insulator layer 10 is a sintered body of a ceramic green sheet containing, for example, dielectric ceramic (dielectric ceramic such as BaTiO ₃ series, Ba (Ti, Zr) O ₃ series, or (Ba, Ca) TiO ₃ series). Consists of In the actual element body L, it is integrated so that the boundary between each insulator layer 10 cannot be visually recognized.

  As shown in FIG. 2, the multilayer feedthrough capacitor C1 includes a plurality of signal internal electrodes 11 and a plurality of ground internal electrodes 13 as a plurality of internal electrodes. The signal internal electrode 11 and the ground internal electrode 13 are made of a conductive material (for example, Ni or Cu) that is normally used as an internal electrode of a laminated electric element. The signal internal electrode 11 and the ground internal electrode 13 are configured as a sintered body of a conductive paste containing the conductive material.

  The signal internal electrode 11 and the ground internal electrode 13 are arranged at different positions (layers) in the facing direction of the first and second main surfaces La and Lb (the stacking direction of the plurality of insulator layers 10). That is, the signal internal electrode 11 and the ground internal electrode 13 are alternately arranged in the element body L so as to face each other with a gap in the facing direction of the first and second main faces La and Lb. Yes. In the present embodiment, for example, the number of signal internal electrodes 11 (the number of stacked layers) is about 5 to 50 layers, and the number of ground internal electrodes 13 (the number of stacked layers) is about 5 to 50 layers.

  As shown in FIG. 3A, the signal internal electrode 11 has a main electrode portion 11a and a pair of lead electrode portions 11b and 11c. The lead electrode portion 11b extends from the main electrode portion 11a so as to be exposed at the first side face Lc. The extraction electrode part 11c extends from the main electrode part 11a so as to be exposed at the second side face Ld. The main electrode portion 11a and the extraction electrode portions 11b and 11c are integrally formed.

  The main electrode portion 11a has a rectangular shape in which the opposing direction of the first and second side faces Lc, Ld is the long side direction and the opposing direction of the third and fourth side faces Le, Lf is the short side direction. The lead electrode portion 11b extends from the end portion on the first side face Lc side of the main electrode portion 11a to the first side face Lc with the same width as the main electrode portion 11a. The lead electrode portion 11b has an end exposed at the first side face Lc, and is connected to the first signal terminal electrode 1 at the exposed end. The extraction electrode part 11c extends from the end part on the second side face Ld side of the main electrode part 11a to the second side face Ld with the same width as the main electrode part 11a. The lead electrode portion 11c has an end exposed at the second side face Ld and is connected to the second signal terminal electrode 2 at the exposed end.

  The first signal terminal electrode 1 is formed so as to cover all the portions exposed to the first side face Lc of the extraction electrode portion 11b, and the extraction electrode portion 11b is physically and electrically connected to the first signal terminal electrode 1. Connected. As a result, each signal internal electrode 11 is connected to the first signal terminal electrode 1. The second signal terminal electrode 2 is formed so as to cover all the portions exposed to the second side face Ld of the extraction electrode portion 11c, and the extraction electrode portion 11c is physically and electrically connected to the second signal terminal electrode 2. Connected. Thereby, each signal internal electrode 11 is connected to the second signal terminal electrode 2.

  As shown in FIG. 3B, the grounding internal electrode 13 has a main electrode portion 13a and a pair of lead electrode portions 13b and 13c. The extraction electrode portion 13b extends from the main electrode portion 13a so as to be exposed at the third side face Le. The extraction electrode portion 13c extends from the main electrode portion 13a so as to be exposed at the fourth side face Lf. The main electrode portion 13a and the extraction electrode portions 13b and 13c are integrally formed. The main electrode portion 13a faces the signal internal electrode 11 (main electrode portion 11a).

  The main electrode portion 13a has a rectangular shape in which the opposing direction of the third and fourth side faces Le and Lf is the long side direction and the opposing direction of the first and second side faces Lc and Ld is the short side direction. The extraction electrode portion 13b extends from the end portion of the main electrode portion 13a on the third side surface Le side to the third side surface Le with the same width as the main electrode portion 13a. The lead electrode part 13b has an end exposed at the third side face Le, and is connected to the first ground terminal electrode 3 at the exposed end. The lead electrode portion 13c extends from the end portion on the fourth side face Lf side of the main electrode portion 13a to the fourth side face Lf with the same width as the main electrode portion 13a. The lead electrode portion 13c has an end exposed at the fourth side face Lf, and is connected to the second grounding terminal electrode 4 at the exposed end portion.

  The first ground terminal electrode 3 is formed so as to cover all the exposed portions of the third side surface Le of the lead electrode portion 13b. The lead electrode portion 13b is physically and electrically connected to the first ground terminal electrode 3. Connected. As a result, each grounding internal electrode 13 is connected to the first grounding terminal electrode 3. The second grounding terminal electrode 4 is formed so as to cover all the portions exposed to the fourth side face Lf of the extraction electrode portion 13c. The extraction electrode portion 13c is physically and electrically connected to the second grounding terminal electrode 4. Connected. As a result, each grounding internal electrode 13 is connected to the second grounding terminal electrode 4.

  Each grounding inner electrode 13 has a width w1 in the facing direction of the first and second side faces Lc, Ld and the facing direction of the first and second side faces Lc, Ld of the first and second grounding terminal electrodes 3, 4. It is set narrower than the width w2. In the present embodiment, the width w1 is set to be equal to or less than half of the width w2. When the chip size of the multilayer feedthrough capacitor C1 is “1005” type, for example, the width w2 is set to about 100 to 300 μm, and the width w1 is set to about 50 to 150 μm. When the chip size of the multilayer feedthrough capacitor C1 is a “1608” type, for example, the width w2 is set to about 100 to 450 μm, and the width w1 is set to about 50 to 200 μm.

  As described above, in this embodiment, since the width w1 of each grounding internal electrode 13 is narrower than the width w2 of the first and second grounding terminal electrodes 3 and 4, one signal internal electrode 11 and one signal internal electrode 11 The capacitance formed with the grounding internal electrode 13 is relatively small. Therefore, in the multilayer feedthrough capacitor C1, it is necessary to increase the number of layers of the signal internal electrode 11 and the ground internal electrode 13 in order to ensure a desired capacitance. Thus, by increasing the number of stacked signal internal electrodes 11, the direct current resistance can be reduced in the multilayer feedthrough capacitor C1.

  In the multilayer feedthrough capacitor C1, since the width w1 of the grounding internal electrode 13 is narrow, even if the position of the signal internal electrode 11 and the grounding internal electrode 13 is shifted due to the stacking shift, the signal internal electrode 11 The area where the grounding internal electrode 13 overlaps is difficult to change. Therefore, in the multilayer feedthrough capacitor C1, variations in capacitance can be reduced.

  If the width w1 of each grounding internal electrode 13 is set to be less than or equal to half the width w2 of the first and second grounding terminal electrodes 3 and 4, the position of each grounding internal electrode 13 due to stacking deviation. Even in the case of misalignment, it is possible to prevent the grounding internal electrode 13 from protruding from the width w2 of the first and second grounding terminal electrodes 3 and 4 to be exposed.

  Next, with reference to FIG. 4, the structure of the modification of the grounding internal electrode 13 is demonstrated. FIG. 4 is a plan view showing a modification of the grounding internal electrode.

  In this modification, the width w1a of the main electrode portion 13a in the facing direction of the first and second side surfaces Lc, Ld is the width of the extraction electrode portions 13b, 13c in the facing direction of the first and second side surfaces Lc, Ld. It is set narrower than w1b. The width w1a of the main electrode portion 13a and the width w1b of the extraction electrode portions 13b and 13c are set narrower than the width w2 of the first and second ground terminal electrodes 3 and 4. In this modification, the widths w1a and w1b are set to be equal to or less than half of the width w2.

  Since the width w1a of the main electrode portion 13a is narrower than the width w1b of the extraction electrode portions 13b and 13c, the capacitance formed by one signal internal electrode 11 and one ground internal electrode 13 is much smaller. . Therefore, in order to secure a desired capacitance, it is necessary to further increase the number of laminations of the signal internal electrode 11 and the grounding internal electrode 13, and the number of laminations of the signal internal electrode 11 is further increased. Thus, the direct current resistance can be further reduced. Since the width w1b of the extraction electrode portions 13b and 13c is wider than the width w1a of the main electrode portion 13a, the connectivity between the grounding internal electrode 13 and the first and second grounding terminal electrodes 3 and 4 can be ensured.

  Next, with reference to FIG. 5, the structure of the modification of the grounding internal electrode 13 is demonstrated. FIG. 5 is a plan view showing a modification of the grounding internal electrode.

In the present modification, not only the grounding internal electrode 13 (see FIG. 5A) shown in FIG. 3B but also the main electrode portion 13a includes the third and third grounding internal electrodes 13 as shown in FIG. A plurality of grounding internal electrodes 13 having electrode portions 13a ₁ extending in the opposing direction of the four side surfaces Le and Lf, and electrode portions 13a ₂ connecting the electrode portions 13a ₁ and the extraction electrode portions 13b and 13c ( 5 (b) to 5 (e) are provided. The electrode portion 13a ₂ extends in the opposing direction of the first and second side faces Lc, Ld.

Electrode portion 13a ₁ of the main electrode portion 13a of each ground internal electrodes 13, first and second major surface La, viewed from the opposing direction of Lb, are positioned so as not to overlap each other. The electrode portion 13a ₁ of the main electrode portion 13a in each grounding internal electrode 13 is the first and second main electrodes 13a _{1 of the} grounding internal electrode 13 that does not have the electrode portion 13a ₁ and the electrode portion 13a _2. They are positioned so as not to overlap each other when viewed from the opposing direction of the surfaces La and Lb.

Since the electrode portion 13a ₁ of the main electrode portion 13a is positioned so as not to overlap each other when viewed from the opposing direction of the first and second main surfaces La and Lb, the level difference caused by the thickness of the electrode portion 13a ₁ is dispersed. Thus, deformation of the element body L can be suppressed. Therefore, generation of internal structural defects can be suppressed. The electrode portion 13a ₁ is the same as the main electrode portion 13a of the grounding internal electrode 13 that does not have the electrode portion 13a ₁ and the electrode portion 13a ₂ as viewed from the opposing direction of the first and second main surfaces La and Lb. since is positioned so as not to overlap, the step formed by the main electrode portion 13a and the electrode portions 13a ₁ of the thickness is more further dispersed, it is possible to further suppress deformation of the body L.

  Next, with reference to FIG. 6, the structure of the modification of the grounding internal electrode 13 is demonstrated. FIG. 6 is a plan view showing a modification of the grounding internal electrode.

In the present modification, not only the grounding internal electrode 13 shown in FIG. 3B (see FIG. 6A) but also the main electrode portion 13a are arranged on the same plane as the plurality of grounding internal electrodes 13. A plurality of grounding internal electrodes 13 (see FIGS. 6B to 6D) branched into a plurality are provided. Each grounding inner electrode 13 the main electrode portion 13a is branched, the third and fourth side Le, the plurality of electrode portions 13a ₁ extending in the opposing direction of Lf, the electrode portions 13a ₁ and the extraction electrode portion 13b, 13c And an electrode portion 13a2 for connecting the _two .

Electrode portion 13a ₁ of the main electrode portion 13a of each ground internal electrodes 13, first and second major surface La, viewed from the opposing direction of Lb, are positioned so as not to overlap each other. The electrode portion 13a ₁ of the main electrode portion 13a in each grounding internal electrode 13 is the first and second main electrodes 13a _{1 of the} grounding internal electrode 13 that does not have the electrode portion 13a ₁ and the electrode portion 13a _2. They are positioned so as not to overlap each other when viewed from the opposing direction of the surfaces La and Lb.

The main electrode portion 13a, because it is split into a plurality in the same plane, at each ground internal electrodes 13, as one of the electrode portions 13a ₁ is disconnected, the conductive state at the remaining electrode portions 13a ₁ Can be secured. Therefore, it is possible to prevent the capacitance from deviating from a desired value.

  Next, the configuration of the multilayer feedthrough capacitor according to the modification of the present embodiment will be described with reference to FIGS. FIG. 7 is an exploded perspective view showing the configuration of the element body in the multilayer feedthrough capacitor according to the modification of the present embodiment. FIG. 8 is a plan view showing the grounding internal electrode and the dummy electrode.

  The multilayer feedthrough capacitor according to this modification is similar to the multilayer feedthrough capacitor C1 of the embodiment described above, and the element body L, and first and second signal terminal electrodes (not shown) disposed on the outer surface of the element body L. And first and second grounding terminal electrodes (not shown).

  The multilayer feedthrough capacitor of this modification includes a plurality of dummy electrodes 15 and 16 as shown in FIG. As shown in FIG. 8, the dummy electrodes 15 and 16 sandwich the grounding internal electrode 13 on the same surface as each grounding internal electrode 13 in the facing direction of the first and second side faces Lc and Ld, and are used for grounding. It is arranged so as to be separated from the internal electrode 13. The dummy electrodes 15 and 16 are made of a conductive material (for example, Ni or Cu) that is normally used as an internal electrode of a laminated electric element, like the signal internal electrode 11 and the ground internal electrode 13. The dummy electrodes 15 and 16 are configured as a sintered body of a conductive paste containing the conductive material.

  One end of the dummy electrode 15 is exposed to the first side face Lc. The other end of the dummy electrode 15 is separated from the main electrode portion 13a of the grounding internal electrode 13 in the opposing direction of the first and second side faces Lc and Ld. The first signal terminal electrode 1 is formed so as to cover all portions exposed to the first side face Lc of the dummy electrode 15, and the dummy electrode 15 is connected to the first signal terminal electrode 1.

  One end of the dummy electrode 16 is exposed to the second side face Ld. The other end of the dummy electrode 16 is separated from the main electrode portion 13a of the grounding internal electrode 13 in the facing direction of the first and second side faces Lc and Ld. The second signal terminal electrode 2 is formed so as to cover all portions exposed to the second side face Ld of the dummy electrode 16, and the dummy electrode 16 is connected to the second signal terminal electrode 2.

  The distance D1 between the dummy electrode 15 and the dummy electrode 16 in the opposing direction of the first and second side faces Lc, Ld, that is, the first and second side faces Lc between the other end of the dummy electrode 15 and the dummy electrode 16 and the other end. , Ld in the facing direction is set to be narrower than the width w2 of the first and second ground terminal electrodes 3, 4. Thereby, generation | occurrence | production of the level | step difference by the thickness of the internal electrode 13 for grounding is suppressed, and the deformation | transformation of the element | base_body L can be suppressed. Therefore, in the multilayer feedthrough capacitor of this modification, the occurrence of internal structural defects can be suppressed.

  In this modification, not only the signal internal electrode 11 but also the dummy electrode 15 is connected to the first signal terminal electrode 1. Therefore, the adhesion between the element body L and the first signal terminal electrode 1 can be improved. Not only the signal internal electrode 11 but also the dummy electrode 16 is connected to the second signal terminal electrode 2. Therefore, the adhesion between the element body L and the second signal terminal electrode 2 can be improved.

  Next, with reference to FIG. 9, the structure of the modification of the grounding internal electrode 13 and the dummy electrodes 15 and 16 is demonstrated. FIG. 9 is a plan view showing a modification of the grounding internal electrode and the dummy electrode.

  In the grounding internal electrode 13, the width w1a of the main electrode portion 13a is set narrower than the width w1b of the extraction electrode portions 13b and 13c, as in the modification shown in FIG. Also in this modification, the widths w1a and w1b are set to be equal to or less than half of the width w2. The distance D1 between the dummy electrode 15 and the dummy electrode 16 is set to be narrower than the width w1b of the extraction electrode portions 13b and 13c.

  In the present modification, as in the modification shown in FIG. 4, the connectivity between the grounding internal electrode 13 and the first and second grounding terminal electrodes 3 and 4 is secured, and the DC resistance is reduced. It will be further planned. Further, the occurrence of a step due to the thickness of the grounding internal electrode 13 (main electrode portion 13a) is further suppressed, and the deformation of the element body L can be further suppressed.

  Next, the configuration of the multilayer feedthrough capacitor C2 according to the modification of the present embodiment will be described with reference to FIGS. FIG. 10 is a perspective view showing a multilayer feedthrough capacitor according to a modification of the present embodiment. FIG. 11 is an exploded perspective view showing the configuration of the element body.

  The multilayer feedthrough capacitor C2 according to this modification is similar to the multilayer feedthrough capacitor C1 described above, the element body L, the first and second signal terminal electrodes 1 and 2, and the first and second ground terminal electrodes 3. , 4 are provided. In the element body L, the first and second side surfaces Lc, Ld extend in the long side direction of the first and second main surfaces La, Lb so as to connect the first and second main surfaces La, Lb. . The third and fourth side surfaces Le and Lf extend in the short side direction of the first and second main surfaces La and Lb so as to connect the first and second main surfaces La and Lb.

  As shown in FIG. 12A, the signal internal electrode 11 includes a main electrode portion 11a and a pair of lead electrode portions 11b and 11c. The main electrode portion 11a has a rectangular shape in which the opposing direction of the first and second side faces Lc, Ld is the short side direction and the opposing direction of the third and fourth side faces Le, Lf is the long side direction. Accordingly, the signal internal electrode 11 is set such that the width in the facing direction of the third and fourth side faces Le and Lf is wider than the width in the facing direction of the first and second side faces Lc and Ld.

  As shown in FIG. 12B, the grounding internal electrode 13 has a main electrode portion 13a and a pair of lead electrode portions 13b and 13c. The main electrode portion 13a has a rectangular shape in which the opposing direction of the third and fourth side faces Le and Lf is the long side direction and the opposing direction of the first and second side faces Lc and Ld is the short side direction.

  In the present modification, the DC resistance per signal internal electrode 11 is lowered, and the DC resistance of the entire multilayer feedthrough capacitor C2 can be further reduced.

  Next, with reference to FIG. 13, the structure of the modification of the grounding internal electrode 13 is demonstrated. FIG. 13 is a plan view showing a modification of the grounding internal electrode.

  In the grounding internal electrode 13 in this modification, the width w1a of the main electrode portion 13a is set to be narrower than the width w1b of the extraction electrode portions 13b and 13c, as in the case of the grounding internal electrode 13 shown in FIG. . The width w1a of the main electrode portion 13a and the width w1b of the extraction electrode portions 13b and 13c are set narrower than the width w2 of the first and second ground terminal electrodes 3 and 4.

  In this modified example, as in the modified example shown in FIG. 4, the connectivity between the grounding internal electrode 13 and the first and second grounding terminal electrodes 3 and 4 is ensured, and the DC resistance is reduced. Will be further promoted.

  Next, with reference to FIG. 14, the structure of the modification of the grounding internal electrode 13 is demonstrated. FIG. 14 is a plan view showing a modification of the grounding internal electrode.

In the present modification, as in the modification shown in FIG. 5, only the grounding internal electrodes 13 (see FIG. 14A) shown in FIG. no main electrode portion 13a, the electrode portions 13a _1, and the electrode portions 13a _2, a plurality of grounding internal electrode 13 has a (see FIG. 14 (b) ~ (e) ) are provided. Electrode portion 13a ₁ of each ground internal electrodes 13, first and second major surface La, viewed from the opposing direction of Lb, are positioned so as not to overlap each other. Electrode portion 13a ₁ of each ground internal electrodes 13, with the main electrode portion 13a of the grounding inner electrode 13 having no electrode portions 13a ₁ and the electrode portion 13a _2, first and second major surface La, the Lb They are positioned so as not to overlap each other when viewed from the opposite direction.

Also in this modified example, as in the modified example shown in FIG. 5, the level difference caused by the thickness of the electrode portion 13 a ₁ is dispersed, so that the deformation of the element body L can be suppressed and the occurrence of internal structural defects is suppressed. can do. Also, step formed by the main electrode portion 13a and the electrode portions 13a ₁ of the thickness is more further dispersed, it is possible to further suppress deformation of the body L.

  Next, with reference to FIG. 15, the structure of the modification of the grounding internal electrode 13 is demonstrated. FIG. 15 is a plan view showing a modification of the grounding internal electrode.

  In the present modification, as in the modification shown in FIG. 5, only the grounding internal electrodes 13 (see FIG. 15A) shown in FIG. Instead, the main electrode portion 13a is provided with a plurality of grounding internal electrodes 13 (see FIGS. 15B to 15D) that are branched into a plurality of portions in the same plane.

Each grounding inner electrode 13 the main electrode portion 13a is branched includes a plurality of electrode portions 13a _1, and the electrode portions 13a _2, a. Electrode portion 13a ₁ of each ground internal electrodes 13, first and second major surface La, viewed from the opposing direction of Lb, are positioned so as not to overlap each other. Electrode portion 13a ₁ of each ground internal electrodes 13, with the main electrode portion 13a of the grounding inner electrode 13 having no electrode portions 13a ₁ and the electrode portion 13a _2, first and second major surface La, the Lb They are positioned so as not to overlap each other when viewed from the opposite direction.

Also in this modified example, as in the modified example shown in FIG. 6, even if any electrode portion 13 a ₁ is disconnected in each grounding internal electrode 13, a conductive state is secured in the remaining electrode portion 13 a ₁ . can do. Therefore, it is possible to prevent the capacitance from deviating from a desired value.

  Next, the configuration of the multilayer feedthrough capacitor according to the modification of the present embodiment will be described with reference to FIGS. FIG. 16 is an exploded perspective view showing the configuration of the element body in the multilayer feedthrough capacitor according to the modification of the present embodiment. FIG. 17 is a plan view showing the grounding internal electrode and the dummy electrode.

  The multilayer feedthrough capacitor according to this modification is similar to the multilayer feedthrough capacitor C2 of the above-described embodiment, and the element body L and first and second signal terminal electrodes (not shown) arranged on the outer surface of the element body L. And first and second grounding terminal electrodes (not shown).

  The multilayer feedthrough capacitor of this modification includes a plurality of dummy electrodes 15 and 16, as shown in FIG. As shown in FIG. 17, the dummy electrodes 15 and 16 are arranged on the same surface as the grounding internal electrodes 13 in the same manner as the dummy electrodes 15 and 16 shown in FIG. The second side surfaces Lc and Ld are disposed so as to be opposed to each other and separated from the grounding internal electrode 13.

  Also in this modified example, the distance D1 between the dummy electrode 15 and the dummy electrode 16 is larger than the width w2 of the first and second grounding terminal electrodes 3 and 4 as in the modified example shown in FIGS. Since it is set narrowly, the generation | occurrence | production of the level | step difference by the thickness of the internal electrode 13 for grounding is suppressed, and a deformation | transformation of the element | base_body L can be suppressed. Therefore, in the multilayer feedthrough capacitor of this modification, the occurrence of internal structural defects can be suppressed. In addition, the adhesion between the element body L and the first signal terminal electrode 1 can be enhanced, and the adhesion between the element body L and the second signal terminal electrode 2 can be enhanced.

  Next, with reference to FIG. 18, the structure of the modification of the grounding internal electrode 13 and the dummy electrodes 15 and 16 is demonstrated. FIG. 18 is a plan view showing a modification of the grounding internal electrode and the dummy electrode.

  The distance D1 between the dummy electrode 15 and the dummy electrode 16 is set narrower than the width w1b of the extraction electrode portions 13b and 13c, as in the modification shown in FIG. Therefore, the DC resistance can be further reduced while the connectivity between the grounding internal electrode 13 and the first and second grounding terminal electrodes 3 and 4 is ensured. Further, the occurrence of a step due to the thickness of the grounding internal electrode 13 (main electrode portion 13a) is further suppressed, and the deformation of the element body L can be further suppressed.

  Next, the configuration of the multilayer feedthrough capacitor array C3 according to the modification of the present embodiment will be described with reference to FIGS. FIG. 19 is a perspective view showing a multilayer feedthrough capacitor array according to a modification of the present embodiment. FIG. 20 is an exploded perspective view showing the configuration of the element body.

  The multilayer feedthrough capacitor array C3 according to this modification includes an element body L, a plurality of first and second signal terminal electrodes 1 and 2, and first and second ground terminal electrodes 3 and 4, respectively. ing. In the element body L, the first and second side surfaces Lc, Ld extend in the long side direction of the first and second main surfaces La, Lb so as to connect the first and second main surfaces La, Lb. . The third and fourth side surfaces Le and Lf extend in the short side direction of the first and second main surfaces La and Lb so as to connect the first and second main surfaces La and Lb. In this modification, the multilayer feedthrough capacitor array C3 includes two first and second signal terminal electrodes 1 and 2, respectively.

  Each first signal terminal electrode 1 is arranged on the first side face Lc side of the element body L. Each first signal terminal electrode 1 is formed over the first and second main surfaces La and Lb so as to cover a part of the first side surface Lc along the opposing direction of the first and second main surfaces La and Lb. Has been. The two first signal terminal electrodes 1 are positioned so as to be separated from each other in the facing direction of the third and fourth side faces Le and Lf.

  Each of the second signal terminal electrodes 2 is disposed on the second side face Ld side of the element body L. Each of the second signal terminal electrodes 2 is formed over the first and second main faces La and Lb so as to cover a part of the second side face Ld along the opposing direction of the first and second main faces La and Lb. Has been. The two second signal terminal electrodes 2 are positioned so as to be separated from each other in the facing direction of the third and fourth side faces Le and Lf.

  The multilayer feedthrough capacitor array C3 includes a plurality of signal internal electrodes 11 on the same plane as shown in FIG. In this modification, the multilayer feedthrough capacitor array C3 includes two signal internal electrodes 11 in the same plane corresponding to the number of first and second signal terminal electrodes 1 and 2, respectively. The signal internal electrode 11 has a main electrode portion 11a and a pair of lead electrode portions 11b and 11c. The main electrode portion 11a has a rectangular shape in which the opposing direction of the first and second side faces Lc, Ld is the long side direction and the opposing direction of the third and fourth side faces Le, Lf is the short side direction. The width of the main electrode portion 11a in the opposing direction of the third and fourth side surfaces Le and Lf is set wider than the width of the extraction electrode portions 11b and 11c in the opposing direction of the third and fourth side surfaces Le and Lf. Yes.

  As shown in FIG. 21B, the grounding internal electrode 13 has a plurality of main electrode portions 13a, a pair of lead electrode portions 13b and 13c, and a connection portion 13d. In this modification, the grounding internal electrode 13 has two main electrode portions 13a corresponding to the number of signal internal electrodes 11 located in the same plane. The main electrode portion 13a has a rectangular shape in which the opposing direction of the third and fourth side faces Le and Lf is the long side direction and the opposing direction of the first and second side faces Lc and Ld is the short side direction. The connecting portion 13d is connected to two main electrode portions 13a that are adjacent to each other in the facing direction of the third and fourth side surfaces Le and Lf.

  Also in this modified example, the DC resistance is reduced in the multilayer feedthrough capacitor array C3 as in the above-described embodiment.

  Next, with reference to FIG. 22, the structure of the modification of the grounding internal electrode 13 is demonstrated. FIG. 22 is a plan view showing a modification of the grounding internal electrode.

  In the modification shown in FIG. 22A, the width w1a of the main electrode portion 13a is set to be narrower than the width w1b of the extraction electrode portions 13b and 13c, like the grounding internal electrode 13 shown in FIG. ing. The width w1a of the main electrode portion 13a and the width w1b of the extraction electrode portions 13b and 13c are set narrower than the width w2 of the first and second ground terminal electrodes 3 and 4. In this modification, the width of the connecting portion 13d in the opposing direction of the first and second side faces Lc, Ld and the part of the extraction electrode parts 13b, 13c in the opposing direction of the first and second side faces Lc, Ld. The width is set to be equal to the width w1a.

  Also in this modified example, as in the modified example shown in FIGS. 4 and 13, the connectivity between the grounding internal electrode 13 and the first and second grounding terminal electrodes 3, 4 is secured, and then the direct current is changed. The resistance is further reduced.

  In the modification shown in FIG. 22B, the width in the facing direction of the first and second side faces Lc, Ld of the connecting portion 13d is set to be equal to the width w1b. The extraction electrode portions 13b and 13c are set to the same width w1b throughout.

  In the modification shown in FIG. 22 (c), the width in the facing direction of the first and second side faces Lc, Ld of the connecting portion 13d and the first and second side faces of a part of the extraction electrode portions 13b, 13c. The width in the opposing direction of Lc and Ld is set to be equal to or greater than the width w1b. In this modification, the width of the connecting portion 13d in the opposing direction of the first and second side faces Lc, Ld and the part of the extraction electrode parts 13b, 13c in the opposing direction of the first and second side faces Lc, Ld. The width is set substantially equal to the width in the facing direction of the first and second side faces Lc and Ld of the main electrode portion 11a. That is, in the grounding internal electrode 13, the first and second side faces Lc, Ld in the region that does not overlap with the signal inner electrode 11 as viewed from the opposing direction of the first and second main surfaces La, Lb are more than the remaining regions. It is made wide in the facing direction.

  According to this modification, generation of a step due to the thickness of the signal internal electrode 11 is suppressed, and deformation of the element body L can be suppressed. Therefore, generation of internal structural defects can be suppressed.

  The preferred embodiments of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

  The number of the signal internal electrodes 11 and the ground internal electrodes 13, that is, the number of stacked layers is not limited to the above-described number, and can be set as appropriate according to the desired capacitance.

  The number of the first and second signal terminal electrodes 1 and 2 in the multilayer feedthrough capacitor array C3 is not limited to the number described above, and may be three or more. The number of signal internal electrodes 11 located in the same plane may be three or more corresponding to the numbers of the first and second signal terminal electrodes 1 and 2.

  The multilayer feedthrough capacitors C1 and C2 and the multilayer feedthrough capacitor array C3 include two ground terminal electrodes (first ground terminal electrode 3 and second ground terminal electrode 4). The number of ground terminal electrodes is as follows. It is not limited to this. For example, the multilayer feedthrough capacitors C1 and C2 and the multilayer feedthrough capacitor array C3 include ground terminal electrodes for only one of the first ground terminal electrode 3 and the second ground terminal electrode 4 as ground terminal electrodes. It may be.

DESCRIPTION OF SYMBOLS 1 ... Terminal electrode for 1st signals, 2 ... Terminal electrode for 2nd signals, 3 ... Terminal electrode for 1st grounding, 4 ... Terminal electrode for 2nd grounding, 11 ... Internal electrode for signals, 11a ... Main electrode part, 11b , 11c... Extraction electrode portion, 13... Ground electrode, 13a. Main electrode portion, 13b and 13c... Extraction electrode portion, 15 and 16... Dummy electrode, C1 and C2. D1... Spacing between the first and second side faces of the plurality of dummy electrodes, L... Element body, La... First main face, Lb... Second main face, Lc ... first side face, Ld. , Le ... third side surface, Lf ... fourth side surface, w1 ... width in the opposing direction of the first and second side surfaces of the grounding internal electrode, w1a ... in the opposing direction of the first and second side surfaces of the main electrode portion. Width, w1b ... Width in the opposing direction of the first and second side surfaces of the extraction electrode part, w2 ... First and second First and width in the opposing direction of the second side of the ground terminal electrode.

Claims (11)

First and second main surfaces having substantially rectangular shapes opposed to each other, and first and second main surfaces extending in the first side direction of the first and second main surfaces so as to connect the first and second main surfaces and facing each other. A first and second side surface; and a third and a fourth side surface extending in a second side direction orthogonal to the first side direction so as to connect the first and second main surfaces and facing each other. Body,
A plurality of signal terminal electrodes disposed on the first and second side surfaces of the element body;
A grounding terminal electrode disposed on at least one of the third and fourth side surfaces of the element body; and
A plurality of signal internal electrodes and ground internal electrodes, which are alternately arranged in the element body in the opposing direction of the first and second main surfaces,
Each of the signal internal electrodes is connected to the plurality of signal terminal electrodes,
Each of the grounding internal electrodes is connected to the grounding terminal electrode, and the width in the facing direction of the first and second side surfaces is in the facing direction of the first and second side surfaces of the grounding terminal electrode. A multilayer feedthrough capacitor characterized by being narrower than the width of the capacitor.   The width in the opposing direction of the first and second side surfaces of the grounding internal electrode is less than or equal to half of the width in the opposing direction of the first and second side surfaces of the grounding terminal electrode. The multilayer feedthrough capacitor according to claim 1. The grounding internal electrode has a main electrode part facing the signal internal electrode, and an extraction electrode part extending from the main electrode part and connected to the grounding terminal electrode,
The width in the opposing direction of the first and second side surfaces of the main electrode portion is narrower than the width in the opposing direction of the first and second side surfaces of the extraction electrode portion. 3. A multilayer feedthrough capacitor according to 1 or 2. The main electrode portion has an electrode portion extending in the opposing direction of the third and fourth side surfaces,
The electrode portion of the main electrode portion in each grounding internal electrode is positioned so as not to overlap each other when viewed from the opposing direction of the first and second main surfaces. The multilayer feedthrough capacitor described.   5. The multilayer feedthrough capacitor according to claim 3, wherein the main electrode portion has an electrode portion branched into a plurality in the same plane. A plurality of dummy electrodes are further provided on the same surface as each of the grounding internal electrodes so as to sandwich the grounding internal electrode in the opposing direction of the first and second side surfaces and to be separated from the grounding internal electrode. ,
3. The multilayer feedthrough capacitor according to claim 1, wherein each of the dummy electrodes is connected to the corresponding signal terminal electrode.   An interval between the plurality of dummy electrodes in the facing direction of the first and second side surfaces is narrower than the width in the facing direction of the first and second side surfaces of the ground terminal electrode. Item 7. The multilayer feedthrough capacitor according to Item 6. The grounding internal electrode has a main electrode part facing the signal internal electrode, and an extraction electrode part extending from the main electrode part and connected to the grounding terminal electrode,
The width in the facing direction of the first and second side surfaces of the main electrode portion is narrower than the width in the facing direction of the first and second side surfaces of the extraction electrode portion,
The interval between the first and second side surfaces of the plurality of dummy electrodes in the opposing direction is narrower than the width of the extraction electrode portion in the opposing direction of the first and second side surfaces. 8. The multilayer feedthrough capacitor according to 7. The first and second main surfaces have a substantially rectangular shape with the first side as a long side and the second side as a short side,
Each of the signal internal electrodes has a width in a facing direction of the third and fourth side surfaces wider than a width in a facing direction of the first and second side surfaces. A multilayer feedthrough capacitor according to claim 1. A plurality of the signal terminal electrodes are arranged on the first side surface side and the second side surface side, respectively.
A plurality of the signal internal electrodes are disposed in the same plane,
Each said signal internal electrode located in the same plane is connected to the said different signal terminal electrode in said 1st side surface side and 2nd side surface side, The any one of Claims 1-9 characterized by the above-mentioned. A multilayer feedthrough capacitor according to claim 1.   Each of the grounding internal electrodes has a region that does not overlap the signal internal electrode wider in the opposing direction of the first and second side surfaces than the remaining region when viewed from the opposing direction of the first and second main surfaces. The multilayer feedthrough capacitor according to claim 10, wherein

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