JP2014143383A - Surface position detector, exposure device, and method of manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface position detector in which a long optical path is not required even in the case of oblique incidence where the angle of incidence is large, and a prism used for bending a light beam can be arranged without separating excessively from a detected surface in the height direction.SOLUTION: In a surface position detector including a projection optical system, a reception optical system and a photoelectric conversion element, and detecting positional deviation of the detected surface from a reference surface, at least one of the projection optical system and reception optical system has a reflection member. The reflection member includes a first reflection face arranged closest to a detected region, and a second reflection face arranged farthest from the detected region. When an axis extending in the normal direction of the reference surface is a first axis, a first extension surface extending the first reflection face to the reference surface side crosses the first axis at a first angle. The angle formed by the detection light progressing on the second reflection face on the side opposite to the first reflection face and the detection light is smaller than the angle formed by the detection light progressing between the detected region and the first reflection face and the first axis.

Description

  The present invention relates to a surface position detection apparatus, an exposure apparatus, and a device manufacturing method for detecting a surface position of a surface to be measured.

  2. Description of the Related Art Conventionally, a semiconductor exposure apparatus (hereinafter referred to as an exposure apparatus) that projects and exposes a predetermined mask pattern formed on a mask onto a photosensitive substrate via a projection optical system is known. In this exposure apparatus, it is necessary to position the exposed surface (surface) of the photosensitive substrate within the range of the depth of focus of the projection optical system. That is, it is necessary to align the surface of the photosensitive substrate with high accuracy with respect to the image plane (imaging plane) of the projection optical system.

  As an apparatus for detecting the surface position in the optical axis direction (herein referred to as the height direction) of the photosensitive substrate surface of the projection optical system, for example, there is an oblique incidence type surface position detection apparatus (for example, Patent Document 1). reference.). In this oblique incidence type surface position detection device, a pattern (predetermined pattern) used for surface position detection from an oblique direction with respect to the photosensitive substrate surface as the surface to be detected by bending the light source light beam for detection by a pentaprism. The primary image is projected. Then, the position information of the secondary image of the predetermined pattern formed by the light reflected by the test surface is detected, and the surface position of the photosensitive substrate surface is detected based on this position information.

US Pat. No. 6,897,462

  In order to improve the position detection accuracy of the test surface, it is preferable to increase the incident angle of the light beam obliquely incident on the test surface from the light projecting optical system. Specifically, the detection accuracy is higher when the incident angle of oblique incidence is closer to 90 °. On the other hand, in order to use the pentaprism for bending the incident light beam, it is necessary to separate the pentaprism from the surface to be measured to a certain extent in consideration of the size of the pentaprism itself.

  Then, in the oblique incident light projection optical system, when the incident light beam is bent using the pentaprism, the light from the pentaprism arranged at a certain distance in the height direction from the test surface is reflected by the test surface. It is necessary to set the optical path length between the test surface and the pentaprism to such an extent that it can be obliquely incident on the surface. The same applies to the light receiving optical system. That is, in an obliquely incident light receiving optical system that obliquely receives reflected light (detection light) from the test surface, when the reflected light beam is bent using a pentaprism, it is spaced apart from the test surface by a certain amount in the height direction. It is necessary to set the optical path length between the test surface and the pentaprism so that the reflected light from the test surface can be incident on the pentaprism arranged in the above state.

  The present invention has been made in view of the above circumstances. In an optical system in which a light beam is bent and incident obliquely by a prism, a pentaprism is used as the prism without reducing the incident angle on the test surface. It is an exemplary problem to provide a surface position detection apparatus, an exposure apparatus, and a device manufacturing method that can shorten the optical path length between the prism and the test surface as compared with the case.

  The surface position detection apparatus according to the first aspect receives a light projecting optical system that projects detection light from an oblique direction to a detection area on the surface to be detected, and detection light reflected from the detection area from the oblique direction. And a photoelectric conversion element that photoelectrically converts detection light via the light reception optical system, and detects a positional deviation of the test surface with respect to the reference surface based on an output from the photoelectric conversion element. At least one of the light projecting optical system and the light receiving optical system has a reflecting member that is disposed in the optical path of the detection light and has an even number of reflecting surfaces. The reflecting member includes a first reflecting surface disposed closest to the detection area along the optical path of the detection light inside the reflection member, and a side farthest from the detection area along the optical path of the detection light inside the reflection member. And a second reflecting surface disposed on the surface. When the first axis is the axis extending in the normal direction of the reference surface, the first extended surface obtained by extending the first reflecting surface to the reference surface side intersects the first axis passing through the detection region at a first angle. . With respect to the optical path of the detection light passing through a predetermined point on the detection area, the front and back of the second reflection surface are larger than the angle formed between the detection light traveling between the detection area and the first reflection surface and the first axis. The angle formed by the first axis and the detection light traveling in the optical path opposite to the first reflecting surface is smaller.

  In the surface position detecting device, the reflecting member may include a prism member, and the first reflecting surface and the second reflecting surface may be inner reflecting surfaces.

  In the surface position detection apparatus, the prism member includes a first surface that is a refractive surface disposed at a position closest to the detection area with respect to the optical path of the detection light inside the prism, and a detection area with respect to the optical path of the detection light inside the prism. And a second surface which is a refracting surface disposed at a position farthest from the head.

  In the surface position detection device, the angle formed between the normal direction of the first surface and the direction of the optical axis on the reference surface side of the first surface may be within ± 5 °. The normal direction of the first surface may be the direction of the optical axis on the reference surface side of the first surface.

  In the surface position detection device, an angle formed between the normal direction of the second surface and the direction of the optical axis on the second surface side may be within ± 5 °. The normal direction of the second surface may be the direction of the optical axis on the second surface side.

  In the surface position detection device, the second reflection surface may be disposed on the same surface as the first surface.

  In the surface position detection device, the position where the first extended surface and the second extended surface obtained by extending the second reflective surface to the reference surface side may be on the reference surface side of the second reflective surface.

  In the surface position detection device, the reflecting member may include a plurality of prism members, and the first reflecting surface and the second reflecting surface may be an inner surface reflecting surface of one of the plurality of prism members.

  In the surface position detection device, the plurality of prism members are a first prism member having an inner surface reflection surface, and a first surface that is a refractive surface disposed at a position closest to the detection region with respect to an optical path of detection light inside the prism. The surface of the first prism member having the second reflecting surface may be located between the first surface and the first reflecting surface.

  In the surface position detection device, the second extension surface obtained by extending the second reflection surface to the reference surface side and the first extension surface may intersect at a second angle.

In the surface position detection device, the second extension surface extending the second reflection surface toward the reference surface side and the third extension surface extending the first reflection surface are between the first reflection surface and the second reflection surface. You may cross at.
The surface position detection apparatus according to the second aspect includes a light projecting optical system that projects detection light from an oblique direction to a detection area on the detection surface, and the detection light reflected by the detection area in an oblique direction. And a photoelectric conversion element that photoelectrically converts detection light via the light reception optical system, and based on the output from the photoelectric conversion element, the position of the test surface relative to the reference surface It is the surface position detection apparatus which detects. At least one of the light projecting optical system and the light receiving optical system includes a reflecting member that is disposed in the optical path of the detection light and includes an even number of reflecting surfaces. The reflecting member includes a first reflecting surface disposed closest to the detection area along the optical path of the detection light inside the reflecting member, and the optical path of the detection light most inside the reflecting member. A second reflecting surface disposed on a side far from the detection area. And the position where the 1st extended surface which extended the 1st reflective surface to the reference plane side and the 2nd extended surface which extended the 2nd reflective surface to the reference surface side crosses the 2nd reflective surface The first reflecting surface is located between the second reflecting surface and a position at which the normal line of the first reflecting surface intersects the reference surface.

  The surface position detection apparatus according to the third aspect receives a light projecting optical system that projects detection light from an oblique direction with respect to a detection area on the surface to be detected, and detection light reflected from the detection area from the oblique direction. And a photoelectric conversion element that photoelectrically converts detection light via the light reception optical system, and detects a positional deviation of the test surface with respect to the reference surface based on an output from the photoelectric conversion element. At least one of the light projecting optical system and the light receiving optical system includes a prism that is disposed in the optical path of the detection light and has a plurality of internal reflection surfaces. The prism is a first reflecting surface having a first surface which is a refractive surface disposed at a position closest to the surface to be detected with respect to the optical path of the detection light inside the prism, and one inner surface reflecting surface among the plurality of inner surface reflecting surfaces. And a second reflecting surface having one inner reflecting surface among the plurality of inner reflecting surfaces, and a second surface that is a refractive surface disposed at a position farthest from the test surface with respect to the optical path of the detection light. doing. The second reflecting surface is disposed between the first reflecting surface and the second surface with respect to the optical path of the detection light. When the deflection angle of the detection light traveling on the optical path outside the prism of the optical paths before and after the second surface with respect to the detection light traveling on the optical path outside the prism among the optical paths before and after the first surface is ψ, 45 ° < The condition of ψ <89 ° is satisfied.

  In the prism of the surface position detection device, the second reflecting surface may be disposed on the same surface as the first surface.

  In the surface position detection device, the angle formed between the normal direction of the first surface and the optical axis of the detection light outside the prism passing through the first surface may be within ± 5 °. The normal direction of the first surface may be the optical axis direction of the detection light outside the prism that passes through the first surface.

  In the surface position detection device, an angle formed between the normal direction of the second surface and the optical axis of the detection light outside the prism passing through the second surface may be within ± 5 °. The normal direction of the second surface may be the optical axis direction of the detection light outside the prism that passes through the second surface.

  When the angle formed by the first surface and the first reflecting surface in the prism of the surface position detecting device is β [deg], and the angle formed by the second reflecting surface and the second surface is α [deg], In practice, α = 2β, 0 ° <β <45 ° may be satisfied.

  In the surface position detection apparatus, the light projecting optical system and the light receiving optical system may be used as a pair of light projecting / receiving optical systems, and a plurality of pairs of light projecting / receiving optical systems having different positions of the detection area on the test surface may be provided. Good.

  The exposure apparatus according to the fourth aspect is an exposure apparatus that exposes a predetermined pattern onto a substrate. Based on the above-described surface position detection device for detecting the surface position of the exposed surface of the substrate as the surface position of the surface to be detected, and the detection result of the surface position detection device, the surface to be exposed of the substrate relative to the reference surface And an aligning portion for aligning.

  The exposure apparatus may further include a projection optical system that projects a predetermined pattern onto the substrate, and the alignment unit may align the exposed surface of the substrate with respect to the image plane of the projection optical system. .

  A device manufacturing method according to a fifth embodiment uses the exposure apparatus described above to expose a predetermined pattern on a substrate, develop the substrate on which the predetermined pattern is transferred, and form a mask corresponding to the predetermined pattern Forming a layer on the surface of the substrate, and processing the surface of the substrate through a mask layer.

  Further objects and other features of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  In an optical system in which a light beam is bent and incident obliquely by a prism, the optical path length between the prism and the test surface can be shortened rather than using a pentaprism as the prism without reducing the incident angle to the test surface. Can do. Further, the incident angle to the test surface can be increased without increasing the optical path length between the prism and the test surface, compared to the case where a pentaprism is used as the prism for bending the light beam.

It is a schematic block diagram of the exposure apparatus provided with the surface position detection apparatus which concerns on Embodiment 1. FIG. It is a schematic block diagram of one surface position detection apparatus in the surface position detection apparatus of Embodiment 1. It is a figure which shows schematically the several light projection slit of the light projection pattern provided in the output surface of the light projection slit prism. It is a figure which shows schematically the some light reception slit of the light reception pattern provided in the entrance plane of the light reception slit prism. 1 is a schematic configuration diagram of a light projection prism according to Embodiment 1. FIG. It is a top view of a wafer surface, and is a figure showing an inspection field. It is a flowchart which shows the manufacturing process of a semiconductor device. It is a flowchart which shows the manufacturing process of a liquid crystal device. 6 is a schematic configuration diagram of a light projection prism according to Embodiment 2. FIG. A is a schematic configuration diagram of a specific example 1 of the light projecting prism according to the second embodiment. B: It is a schematic block diagram of the specific example 2 of the light projection prism which concerns on Embodiment 2. FIG. FIG. 10 is a schematic configuration diagram of a specific example 3 of the light projecting prism according to the second embodiment. 6 is a schematic configuration diagram of a light projection prism according to Embodiment 3. FIG. It is a schematic block diagram of the surface position detection apparatus which concerns on Embodiment 4.

[Embodiment 1]
Hereinafter, Embodiment 1 will be described with reference to the accompanying drawings. FIG. 1 is a schematic block diagram of an exposure apparatus EXP provided with a surface position detection apparatus according to the first embodiment. In the first embodiment, the surface position detection device according to the first embodiment is applied to the detection of the surface position of the photosensitive substrate on which a predetermined pattern (mask pattern) is projected and exposed in the exposure apparatus EXP. In the first embodiment, the exposure apparatus EXP has a plurality of surface position detection apparatuses 1 to 5 arranged in parallel. In FIG. 1, in order to facilitate understanding, when the wafer stage is located at the loading position (wafer stage position for placing the wafer W) LP, or when it is located at the exposure position EP. The case where the wafer stage is located at the unloading position (position where the wafer stage has moved after detecting the surface position at the exposure position EP) UP is also shown by displaying the wafer stage with a one-dot chain line.

  In FIG. 1, the z-axis is set in the normal direction of the image plane of the projection optical system PL (that is, the direction of the optical axis of the projection optical system; hereinafter also referred to as the height direction), and in the image plane of the projection optical system PL (that is, The x axis is set in the plane perpendicular to the optical axis), and the y axis is set perpendicular to the x axis in the image plane of the projection optical system PL. This orthogonal coordinate system (x, y, z) is a local coordinate system for the surface position detection devices 1 to 5 shown in the figure, and the z coordinate is identical to the Z coordinate of the global coordinate system (X, Y, Z) for the exposure device EXP. I'm doing it.

  That is, the xy plane coincides with the XY plane, the x coordinate corresponds to the X coordinate, and the y coordinate corresponds to the Y coordinate. Specifically, as shown in FIG. 1, the + x direction forms an acute angle θ with the + X direction, and the + y direction forms an acute angle θ with the + Y direction. FIG. 1 shows the x coordinate, y coordinate, and z coordinate of the local coordinate system, and the X coordinate, Y coordinate, and Z coordinate of the overall coordinate system. Hereinafter, for simplicity of explanation, the plurality of surface position detection devices 1 to 5 have the same configuration.

  The exposure apparatus EXP shown in FIG. 1 includes an illumination system IL that illuminates a mask (reticle) M on which a mask pattern is formed by illumination light (exposure light) emitted from an exposure light source (not shown). . The mask M is held parallel to the XY plane on the mask stage MS. The mask stage MS can be moved two-dimensionally along the XY plane by the action of the drive system MD, and its position coordinates are measured and controlled by the mask stage position measuring unit MP. Yes.

  The light transmitted through the mask M forms an image of the mask pattern of the mask M on the surface (exposed surface, test surface) Wa of the wafer W, which is a photosensitive substrate, via the projection optical system PL. Wafer W is held in parallel with the XY plane on wafer stage WST by a wafer holder (not shown) provided on wafer table WTB mounted on wafer stage WST. Wafer stage WST is operated by the action of drive system VH in accordance with an instruction from control unit CR, and moves along an XY plane parallel to the image plane of projection optical system PL. Wafer stage WST is operated by the action of drive system VD in accordance with an instruction from control unit CR, and adjusts the focus position (position in the Z direction) and tilt angle (tilt of the surface of wafer W with respect to the XY plane). To do.

  Real time position of wafer table WTB in X direction, Y direction, and rotation direction around Z axis, and in turn, position of photosensitive substrate in X direction, Y direction, and rotation direction around Z axis The measurement unit WP that performs measurement outputs the measurement result to the control unit CR.

  The measurement unit WP is provided on the wafer table WTB, and has a scale SCA having grid lines with a predetermined pitch along each of the four sides of the wafer table WTB, and position information (about the Z axis around the XY plane) of the scale. And an encoder system (ENh1 to ENh6) for measuring the rotation direction (including the θz direction). This encoder system uses a scale SCA to measure the position (XY position) of wafer stage WST (wafer table WTB) in the XY axis direction, and the height position (Z position) of scale SCA in the Z axis direction. ) Units ENh1 to ENh6 including Z sensors to be measured are provided.

Wafer stage WST is operated by the action of drive system HD in accordance with an instruction from control unit CR, and adjusts the position of wafer W in the X direction, the Y direction, and the rotational direction around the Z axis.

  In order to satisfactorily transfer the circuit pattern (predetermined pattern, mask pattern) provided on the pattern surface of the mask M to each exposure area on the surface Wa of the wafer W, projection optics is used for each exposure to each exposure area. It is necessary to align the current exposure region within the range of the depth of focus centering on the imaging plane by the system PL. For this purpose, after accurately detecting the position of each point in the current exposure region along the Z direction, that is, the surface position of the current exposure region, the leveling of wafer stage WST (wafer W of wafer W) is detected based on the detection result. It is necessary to adjust the tilt angle; level out) and move in the Z direction, thereby leveling the wafer W and moving in the Z direction. Therefore, the exposure apparatus of FIG. 1 includes surface position detection devices 1 to 5 for detecting the surface position in the height direction (Z direction) of the exposure region.

  In the surface position detection devices 1 to 5 in the exposure apparatus EXP of FIG. 1, the wafer stage WST on which the wafer W is placed is set to the loading position LP that is the position on which the wafer W is placed. After the wafer W is placed on the wafer table WTB at the loading position LP, the wafer stage WST moves to the exposure position EP where the wafer W is exposed along the XY plane which is the moving surface. The surface position detection devices 1 to 5 detect the surface position in the height direction of the surface Wa of the wafer W while the wafer W moves from the loading position LP to the exposure position EP.

  Here, the measurement result of the XY position of the wafer table WTB by the measurement unit WP, and consequently the XY position of the wafer W, and the detection result of the position in the height direction of the surface Wa of the wafer W by the surface position measurement devices 1 to 5 are used. Thus, the distribution of the surface position in the height direction on the entire surface Wa of the wafer W can be detected. Focus mapping can be performed based on the distribution data of the surface position.

  The focus mapping will be briefly described. Control unit CR manages the position of wafer stage WST in the XY plane using measurement unit WP. Then, when the wafer W moves from the loading position LP toward the exposure position EP, the surface position measuring apparatus 1 until the measurement beam of the surface position measuring apparatuses 1 to 5 and, consequently, the measurement range starts to be applied to the wafer W. Operate ~ 5 and Z sensor together.

  The wafer table measured by the Z sensor at a predetermined sampling interval while the wafer position WST is traveling in the + Y direction while the surface position measuring devices 1 to 5 and the Z sensor are simultaneously operated. The position information regarding the Z-axis direction of the surface of the WTB and the position information (surface position information) regarding the Z-axis direction of the surface Wa of the wafer W at a plurality of detection points measured by the surface position measuring devices 1 to 5 are fetched. The acquired surface position information and the measured value by the encoder head at each sampling are associated with each other and sequentially stored in a memory (not shown).

  When the measurement beam of the surface position measuring devices 1 to 5 is not applied to the wafer W, the control unit CR ends the above sampling and simultaneously acquires the surface position information for each detection point of the surface position measuring devices 1 to 5. The measurement result by the Z sensor is converted into surface position data with reference.

  Thus, by obtaining conversion data in advance, for example, at the time of exposure, the controller CR measures the surface of the wafer table WTB with the Z sensor, the Z position of the wafer table WTB, and Y A predetermined calculation is performed using the rotation (rolling) amount θy about the axis and the rotation (pitching) amount θx about the X axis. From this calculation, a straight line connecting the detection points of the Z sensors in the units ENh5 and ENh6 and passing through the exposure center of the projection optical system PL is obtained. By using this straight line and the converted surface position data, surface position control (focus / leveling control) of the upper surface of the wafer W can be performed without actually acquiring surface position information of the surface Wa of the wafer W.

  Thereby, even when the surface position measuring devices 1 to 5 are arranged at positions away from the projection optical system PL, the circuit pattern provided on the pattern surface of the mask M is exposed to each exposure on the surface Wa of the wafer W. It is possible to transfer well to the area.

  Thereafter, as described above, the wafer W is two-dimensionally exposed or scanned in a two-dimensional manner within a plane (XY plane) orthogonal to the optical axis of the projection optical system PL while performing focus leveling control of the surface Wa of the wafer W. As a result, the mask pattern of the mask M is exposed in each exposure region of the surface Wa of the wafer W. When performing scanning exposure, for example, the Y direction can be the scanning direction. Hereinafter, the surface position detection device will be described in detail with reference to FIG. FIG. 2 is a schematic configuration diagram of one surface position detection device 1 among the plurality of surface position detection devices 1 to 5 included in the exposure apparatus EXP. FIG. 2 shows a local coordinate system (x, y, z) is adopted.

  As described above, the surface position detection devices 1 to 5 detect the surface position of the surface Wa of the wafer W while the wafer W moves from the loading position LP to the exposure position EP. However, in order to facilitate understanding of the configuration and operation of the first embodiment by introducing a reference plane and axis, in FIG. 2, the projection optical system PL is virtually indicated by a two-dot chain line, and the wafer W It is assumed that the surface Wa is located at or near the image plane of the virtual projection optical system PL. Then, the image plane of the projection optical system PL is set as a principal plane (reference plane) along the XY plane, and the optical axis of the projection optical system PL is set as a reference optical axis (first axis) AX extending in the Z direction. The form 1 will be described.

  The surface position detection apparatus 1 according to the first embodiment includes a light projecting optical system 100 and a light receiving optical system 200. In the light projecting optical system 100, detection light is supplied from the light source LS via the light guide 11. In general, the surface of the wafer W, which is the test surface, is covered with a thin film such as a resist. Therefore, in order to reduce the influence of interference by this thin film, a light source (for example, a wavelength width of 600 to 900 nm) that supplies light having a wide wavelength width (for example, illumination light having a wavelength width of 600 to 900 nm) as the light source LS. A halogen lamp that supplies illumination light, a xenon light source that supplies illumination light having a wide band similar to this, a light emitting diode, or the like can also be used.

  The light that has passed through the light guide 11 enters the projection slit prism 13 through a condenser lens or the like (not shown). The light projection slit prism 13 deflects the light from the light guide 11 toward the subsequent light projection second objective lens 14 by refraction. On the exit surface 13a of the light projection slit prism 13, for example, a light projection pattern (first pattern) P1 as shown in FIG. 3 is arranged. The light projection pattern P1 has a plurality of light projection slits Sm. The x1 and y1 directions in FIG. 3 correspond to the x and y directions on the reference plane.

  The light projection slit Sm is, for example, a rectangular (slit-shaped) light transmission portion that is elongated in the y1 direction, and a region other than the light projection slit Sm is a light shielding portion. As shown in FIG. 3, the plurality of light projecting slits Sm are configured in three rows in the y1 direction.

  In each row, the plurality of light projecting slits Sm are arranged at a predetermined pitch along the x1 direction. Further, the group of light projecting slits Sm in each row are displaced from each other along the x1 direction. Various modifications can be made with respect to the shape, number, arrangement, etc. of the projection slits.

  The light that has passed through the light projection slit Sm enters the light projection prism (reflecting member) 17 via the light projection second objective lens 14, the diaphragm 15, and the light projection first objective lens 16. The projection second objective lens 14 and the projection first objective lens 16 form an intermediate image of the plurality of projection slits Sm on the surface Wa of the wafer W.

  More specifically, the light from the light guide 11 is converted into parallel light by a condenser lens or the like and reaches the light projection slit Sm. Thereafter, the light is converged by the projection second objective lens 14 and condensed at the position of the diaphragm 15. The light (detection light) that has passed through the aperture 15 is converted into parallel light again by the light projection first objective lens 16, deflected by the light projection prism 17, and reaches the test surface Wa. A projection image of the light projection slit Sm is formed in the detection area Wa1 on the test surface Wa. Here, the emission surface 13a and the reference surface are in a shine-proof relationship.

  The projection prism 17 has an acute deflection angle, and the optical axis PX of the projection first objective lens 16 in the projection optical system 100 includes the reference plane SP (the image plane (main surface) of the projection optical system PL). It is a virtual plane and is inclined so as to move away from the optical axis AX as the distance from the plane on which the mask pattern image from the projection optical system PL is formed (see FIG. 5). The detection light is projected in an oblique direction from the light projecting prism 17 to the surface Wa. For example, the projection direction of the detection light (incident angle with respect to the optical axis PL) is set in a range of 80 ° to less than 90 °. The light projection prism 17 is incident on the light (projection light) from the light projection first objective lens 16 and internally reflected several times, and then exits toward the detection area Wa1 on the test surface Wa. Details will be described later.

  The projection image (also referred to as detection light or reflected light) of the light projection slit Sm reflected by the test surface Wa is received by the light receiving optical system 200. The reflected light is incident on the light receiving prism (reflecting member) 27, deflected, and reaches the light receiving first objective lens 26. The reflected light that has passed through the light receiving first objective lens 26 passes through the diaphragm 25 and enters the light receiving second objective lens 24, and then enters the incident surface 23 a of the light receiving slit prism 23.

  More specifically, the reflected light reflected by the test surface Wa is deflected by the light receiving prism 27, converged by the light receiving first objective lens 26, and condensed at the position of the diaphragm 25. Thereafter, the light is converted into parallel light by the light receiving second objective lens 24 and is incident on the light receiving slit prism 23. The reflected light deflected by the light receiving slit prism 23 is received by the optical sensor (detecting element) 21 by a relay lens or the like (not shown). Here, the reference surface and the incident surface 23a have a Scheimpflug relationship.

  The detection result of the optical sensor 21 is sent to the control unit CR via a signal processing unit (not shown). The control unit CR sends a drive signal to the drive system VD according to the detection result of the optical sensor 21. The position of wafer stage WST driven by drive system VD is measured by measurement unit WP. The control unit CR, drive system VD, and wafer stage WST constitute an alignment unit. The alignment unit may include a measurement unit WP.

  Since the deflection angle of the light receiving prism 27 is an obtuse angle, the optical axis RX of the light receiving first objective lens 26 in the light receiving optical system 200 is inclined so as to move away from the optical axis AX as the distance from the reference plane SP increases. The reflected light is reflected in an oblique direction in the detection area Wa <b> 1 and enters the light receiving prism 27. For example, the reflection direction of the reflected light (the emission angle with respect to the optical axis PL) is set in a range of 80 ° or more and less than 90 °. The test surface Wa is a plane that is substantially orthogonal to the optical axis PL. Therefore, the incident angle of the detection light from the light projecting prism 17 to the detection area Wa1 is substantially equal to the emission angle of the reflected light from the detection surface Wa to the light receiving prism 27. The light receiving prism 27 receives light (reflected light) from the detection area Wa1 and internally reflects it several times and then emits it toward the light receiving first objective lens 26. Details will be described later.

  As shown in FIG. 4, a light receiving pattern P2 is formed on the incident surface 23a. The x2 and y2 directions in FIG. 4 correspond to the x and y directions on the reference plane. The light receiving pattern P2 has a plurality of light receiving slits St. The light receiving slit St is, for example, a rectangular (slit-shaped) light transmitting portion that is elongated in the y2 direction, and the region other than the light receiving slit St is a light shielding portion, similarly to the light projecting slit Sm. As shown in FIG. 4, the plurality of light receiving slits St has a three-row configuration in the y2 direction.

  The light receiving slit St is formed so that the image of the light projecting slit Sm is formed in the light receiving slit St when the test surface Wa is at the reference surface position. Depending on the light projecting / receiving magnification of the light projecting optical system 100 and the light receiving optical system 200, the light receiving slit St and the light projecting slit Sm may be similar. For example, in the first embodiment, the light projecting optical system 100 and the light receiving optical system 200 have the same magnification relationship, and the size of the light receiving slit St is the same size as the light projecting slit Sm.

  When the test surface Wa is at the reference surface position, all of the light that has passed through the light projecting slit Sm passes through the light receiving slit St and is detected by the optical sensor 21 via the light receiving slit prism 23. . That is, when the test surface Wa is at the reference surface position, the amount of light detected by the optical sensor 21 is maximized.

  When the surface position of the test surface Wa is shifted in the Z direction from the reference surface position, the projected image position of the light projection slit Sm formed on the test surface Wa is shifted in the x direction. Thereby, the image position of the light projection slit Sm formed on the incident surface 23a of the light receiving slit prism 23 is shifted in the x2 direction from the position of the light receiving slit St. A part of the image of the light projection slit Sm is vignetted on the incident surface 23a, and the amount of light passing through the light receiving slit St is reduced. As a result, the amount of light detected by the optical sensor 21 is also reduced.

  As the amount of deviation of the surface position of the surface Wa from the reference surface position in the Z direction increases, the amount of light detected by the optical sensor 21 decreases. Therefore, based on the amount of light detected by the optical sensor 21, the surface position of the test surface Wa, that is, the amount of deviation of the test surface Wa from the reference surface can be detected.

Specifically, for example, if the drive system VD is driven and controlled so that the amount of light detected by the optical sensor 21 is maximized, the surface Wa can be matched with the reference surface. Here, according to the depth of field of the projection optical system PL, a certain threshold may be set for the amount of light detected by the optical sensor 21, and an allowable value within a certain range including the maximum amount of light may be set.
As described above, in the present embodiment, the light projecting optical system 100 includes the both-side telecentric imaging optical system including the light projecting first objective lens 16 and the light projecting second objective lens, and the light receiving optical system 200 receives the light. A bilateral telecentric imaging optical system including a first objective lens 26 and a light-receiving second objective lens 24 is provided. The light projecting prism 17 and the light receiving prism 27 are both disposed between the image forming optical system of the light projecting optical system 100 and the image forming optical system of the light receiving optical system 200.

  FIG. 5 is a schematic configuration diagram of the light projecting prism 17 according to the first embodiment. The light projection prism 17 is used in the light projection optical system 100 of the surface position detection device 1. 5 shows the xz plane along the y direction as in FIG. 2, and shows the optical path of the projection light (detection light) R in the light projecting prism 17.

  In FIG. 5, the reference plane SP is indicated by a two-dot chain line, and the detection area Wa <b> 1 is indicated by a thick solid line. The detection area Wa1 is a detection area of the wafer W by the surface position detection device 1, and is an area where an intermediate image of the projection pattern P1 is formed. Therefore, the detection area Wa1 is located in the vicinity of the optical axis AX of the virtual projection optical system PL.

  The reference plane SP is a virtual plane including the image plane (main surface) of the projection optical system PL, and is a plane on which a mask pattern image from the projection optical system PL is formed. The surface position of the reference surface SP is a surface position where the test surface Wa should be originally positioned, and is a target value of the surface position of the test surface Wa. For ease of understanding, in FIG. 5, description will be made assuming that the test surface Wa is on the reference surface SP.

  The light projecting prism 17 has a first reflecting surface 17a, a second reflecting surface 17b, a first surface 17c, and a second surface 17d, and has a substantially rectangular cross section in the xz plane. The light projecting prism 17 has a quadrangular prism shape extending in the same cross section in the y direction. Of course, the xz cross-sectional shape of the light projection prism 17 is not limited to a quadrangle. As long as the optical functions described below are exhibited, various shapes having a curved surface in part, such as a pentagon, a hexagon, and the like can be considered. Each ridge line portion of the projection prism 17 may be chamfered or may have a rounded shape (R shape). In the following description, the y direction is not taken into consideration, and the description is within the xz cross section.

  The definition of each part name will be described with reference to FIG. The light projecting prism 17 has an even-numbered surface (two surfaces in the first embodiment). The first reflection surface 17 a is a reflection surface that is disposed closest to the detection area Wa <b> 1 along the optical path of the detection light R inside the light projection prism 17. The second reflecting surface 17b is a reflecting surface disposed on the side farthest from the detection area Wa1 along the optical path of the detection light R inside the light projecting prism 17. In the first embodiment, both the first reflecting surface 17a and the second reflecting surface 17b are inner surface reflecting surfaces.

  The first surface 17c is a refracting surface disposed at a position closest to the detection area Wa1 with respect to the optical path of the detection light R inside the light projection prism 17. In the light projection prism 17, the first surface 17c is an emission surface, and the detection light R is emitted from the first surface 17c toward the detection area Wa1. The second surface 17d is a refracting surface disposed at a position farthest from the detection region Wa1 with respect to the optical path of the detection light R inside the light projection prism 17. In the light projection prism 17, the second surface 17d is an incident surface, and the detection light R enters the light projection prism 17 from the second surface 17d.

  In the first embodiment, the second reflecting surface 17b and the first surface 17c are arranged on the same surface. In other words, the second reflecting surface 17b is also used as the first surface 17c. In the vicinity of the second reflecting surface 17b, for example, a metal reflecting film may be formed on the light projecting prism 17 in order to improve the inner surface reflectance. Of course, when the optical path of the detection light R on the second reflecting surface 17b is an optical path that is totally reflected in the relationship between the refractive index of the light projecting prism 17 and the refractive index of the ambient atmosphere of the light projecting prism 17, the metal reflective film The formation of may be unnecessary. Even on the same surface, the reflection film is not formed in the vicinity of the first surface 17c because the transmittance of the detection light R needs to be improved.

  The optical axis AX is the optical axis of the projection optical system PL, and is theoretically orthogonal to the reference plane SP. In effect, the optical axis AX is the first axis. The first extended surface 17e is a surface obtained by extending the first reflective surface 17a to the reference surface SP side, and is indicated by a two-dot chain line in FIG. The second extended surface 17f is a surface obtained by extending the second reflecting surface 17b to the reference surface SP side, and is indicated by a two-dot chain line in FIG. 5 like the first extended surface 17e.

  The first extension surface 17e intersects the optical axis (first axis) AX at the first angle φ1 on the reference surface AP side, that is, on the lower side of the light projection prism 17. That is, the first reflecting surface 17a is inclined so as to approach the optical axis AX on the lower side.

  The angle δ1 is an incident angle of the detection light R to the detection area Wa1. In other words, the incident angle δ1 is equal to the detection light R and the optical axis AX that travel between the detection area Wa1 and the first reflection surface 17a (substantially between the detection area Wa1 and the first surface 17c). Is the angle between

  The angle δ2 is defined as an angle formed by the detection light R and the optical axis AX that travels in the optical path opposite to the first reflective surface 17a among the optical paths before and after the second reflective surface 17b. The side opposite to the first reflecting surface 17a of the second reflecting surface 17b can mean the side farther from the detection area Wa1 than the second reflecting surface 17b in the optical path of the detection light R. In FIG. It can mean the second surface 17d side. That is, the angle δ2 is an angle formed between the detection light R traveling between the second surface 17d and the second reflection surface 17b and the optical axis AX.

  Here, in the light projection prism 17 in the surface position detection device 1, the relation of δ1> δ2 is established. That is, the angle δ2 formed by the detection light R toward the second reflecting surface 17b and the optical axis AX is smaller than the angle δ1 formed by the detection light R directed toward the detection area Wa1 and the optical axis AX. Therefore, when the reference plane SP is used as a reference, the light projecting prism 17 deflects the detection light R incident at a relatively steep inclination to make it gentle, and guides it to the detection area Wa1.

  Assuming that the second deflection angle when the detection light R toward the second reflecting surface 17b is deflected by the light projection prism 17 and becomes the detection light R toward the detection area Wa1, ψa, the angles δ1, δ2, and the second The relationship of δ1 = δ2 + ψa is established between the deflection angles ψa. Since the second deflection angle ψa is a positive value, δ1> δ2.

  The second angle β is an intersection angle between the first extended surface 17e and the second extended surface 17f. In the first embodiment, the intersection position Q of the first extension surface 17e and the second extension surface 17f is on the reference surface SP side of the second reflection surface 17b, that is, on the reference surface SP side with respect to the light projecting prism 17. . Further, the intersection position of the first extension surface 17e and the second extension surface 17f is located between the first reflection surface 17a and the second reflection surface 17b. Therefore, the first reflecting surface 17a and the second reflecting surface 17b of the light projecting prism 17 have a shape that is recessed toward the reference surface SP side. In the light projecting prism 17, 0 ° <β <45 ° is set.

  In the first embodiment, the first reflecting surface 17a and the second reflecting surface 17b (that is, the same surface as the first surface 17c) are cut substantially parallel to the reference surface SP in the vicinity of the reference surface SP. Has a bottom surface 17g substantially parallel to the reference surface SP. The light projecting prism 17 can be arranged without being far away from the reference plane SP, and even when the incident angle δ1 of the detection light R to the detection area Wa1 is obliquely incident, a long optical path length is not required.

The angle α is an angle formed between the second surface 17d and the second reflecting surface. As will be described later, in the first embodiment, the incident angle of the detection light R on the second surface 17d is 0 °, and the emission angle of the detection light R from the first surface 17c is 0 °, so α = 2β relationship.
In the present embodiment, the first reflecting surface 17a is located between the position where the normal line of the first reflecting surface 17a intersects the reference surface SP and the second reflecting surface 17b. And the 2nd reflective surface 17b is located between the position where the normal line of the 2nd reflective surface 17b cross | intersects the reference plane SP, and the 1st reflective surface 17a.

  Next, the arrangement of the light projection prism 17 will be described along the order of travel of the optical path of the detection light R.

  The detection light R is incident on the second surface 17d at an angle δ2 with respect to the optical axis AX. The incident angle of the detection light R on the second surface 17d, that is, the angle formed by the normal direction of the second surface 17d and the direction of the optical axis on the second surface 17d side is set to 0 °. However, this angle may be set within a range of about ± 5 °. Here, the direction of the optical axis on the second surface 17d side is the optical axis direction of the detection light R incident on the second surface 17d, and is outside the light projecting prism 17 (that is, before entering the second surface 17d). ) In the optical axis direction.

  When the incident angle on the second surface 17d is 0 °, the traveling directions of the detection light R inside and outside the projection prism on the second surface 17d are the same, and both are 0 °. In this case, the first deflection angle (deflection angle) ψ of the detection light R incident on the second surface 17d by the light projection prism 17 is directed to the detection light R toward the second reflection surface 17b (inside the light projection prism 17). It becomes equal to the second deflection angle ψa of the detection light R toward the detection region Wa1.

  The first deflection angle ψ is defined as an angle formed by the traveling direction of the detection light R passing through the second surface 17d with respect to the traveling direction of the detection light R emitted through the first surface 17c and emitted to the outside of the projection prism 17. be able to. The first deflection angle ψ is set in a range of 45 ° <ψ <89 °. The first deflection angle related to the light receiving prism 27 may be defined as an angle formed by the traveling direction of the detection light emitted from the second surface with respect to the traveling direction of the detection light incident on the first surface.

  The detection light R traveling from the second surface 17d into the projection prism 17 is reflected by the second reflecting surface 17b. A metal reflecting film may be formed on the second reflecting surface 17b, and the detection light R is substantially totally reflected by the second reflecting surface 17b. The detection light R internally reflected by the second reflecting surface 17b is directed to the first reflecting surface 17a and is reflected again by the first reflecting surface 17a. That is, with respect to the optical path of the detection light R, the second reflecting surface 17b is disposed between the first reflecting surface 17a and the second surface 17d.

  Similar to the second reflecting surface 17b, a metal reflecting film may be formed on the first reflecting surface 17a, and the detection light R is substantially totally reflected. The detection light R that is internally reflected by the first reflecting surface 17a travels toward the first surface 17c. The detection light R passes through the first surface 17c, travels to the outside of the projection prism 17, and travels toward the detection area Wa1.

  The exit angle of the detection light R from the first surface 17c, that is, the angle formed between the normal direction of the first surface 17c and the direction of the optical axis on the reference surface SP side is set to 0 °. However, this angle may be set within a range of about ± 5 °. Here, the direction of the optical axis on the reference surface SP side is the optical axis direction of the detection light R emitted from the first surface 17c, and is outside the projection prism 17 (that is, after emitted from the first surface 17c). Means the direction of the optical axis.

  When the exit angle from the first surface 17c is 0 °, the traveling directions of the detection light R inside and outside the light projection prism on the first surface 17c are the same, and both are 0 °. The detection light R outside the light projecting prism 17 on the first surface 17c is directed obliquely toward the detection area Wa1. The detection light R is reflected in the detection area Wa1 and enters the light receiving prism 27 from the first surface of the light receiving prism 27 in the light receiving optical system 200 (an incident surface in the light receiving prism 27).

  As described above, in the light projecting optical system 100 of the surface position detection apparatus 1, the light projecting prism 17 is disposed in the optical path of the detection light R. As a result, the detection light R that travels at an inclination that approaches the optical axis AX as it approaches the reference plane SP is deflected at the first deflection angle ψ, and is passed through the prism 17 by the inclination of the detection light R before passing through the prism 17. Can also be incident obliquely on the detection area Wa1 as a gentle inclination. In other words, the incident angle of the detection light R after passing through the prism 17 with respect to the reference surface SP can be made larger than the incident angle of the detection light R before passing through the prism 17 with respect to the reference surface SP. Since the bottom surface 17g of the projection prism 17 can be disposed close to the reference plane SP, the optical path length of the detection light R is set while setting the oblique incidence angle δ1 to a large value (that is, a value close to 90 °). It can be shortened.

  In addition, although the light projection prism 17 in the light projection optical system 100 of the surface position detection device 1 has been described as described above, the light reception prism 27 of the light reception optical system 200 can also have the same configuration as the light projection prism 17. A description of the light receiving prism 27 is omitted. In this case, each of the light projecting prism 17 and the light receiving prism 27, the light projecting first objective lens 16 and the light receiving first objective lens 26, the aperture 15 and the aperture 25, and the light projecting second objective lens 14 and the light receiving second objective lens 24, respectively. The configuration and arrangement can be the same. In this case, the light projecting / receiving optical system of the surface position detection device 1 may be an equal magnification system.

  In the light receiving prism 27, the first surface is an incident surface for the detection light (reflected light) R, and the second surface is an emission surface for the detection light R. The detection light R that has entered the light receiving prism 27 from the first surface is internally reflected by the first reflecting surface, is internally reflected by the second reflecting surface, and then exits from the second surface toward the light receiving first objective lens 26. .

  Of course, a prism as shown in FIG. 5 can be used only for the light projection prism 17, and other deflecting elements (prisms or mirrors of different forms) can be used as the light receiving prism 27. Such a prism can be used as the light receiving prism. 27, and other light deflecting elements (different types of prisms or mirrors) can be used as the projection prism 17. In any of the above relational expressions, the variable angle unit is [deg].

  The exposure apparatus EXP according to the first embodiment includes five surface position detection apparatuses 1 to 5. Since the configuration and operation of the projection optical system 100 described above are the same for the other surface position detection devices 2 to 5, description thereof will also be omitted.

  FIG. 6 shows respective detection areas Wa1 to Wa5 of the surface position detection devices 1 to 5 on the wafer W. FIG. 6 is a plan view of the surface of the wafer W. FIG. In FIG. 6, the left-right direction in the figure is shown as the X direction, and the up-down direction is shown as the Y direction.

  The surface position detection apparatus 1 projects an intermediate image of the light projection pattern P1 onto the detection area Wa1 on the detection surface Wa of the wafer W. Therefore, the surface position detection apparatus 1 can detect whether or not the surface position in the detection area Wa1 is deviated from the reference surface SP and the amount of deviation. When the inspection area on the wafer W only needs to be the detection area Wa1, the exposure apparatus EXP only needs to have one surface position detection apparatus 1.

  However, when it is desired to widen the inspection area on the wafer W, for example, when the entire surface of the wafer W is larger than the detection area Wa1, the plurality of detection areas Wa1 to 1 are detected by the plurality of surface position detection devices 1 to 5. Wa5 is set on the wafer W. As shown in FIG. 6, the xy coordinates of the surface position detection devices 1 to 5 are shifted from the XY coordinates of the projection optical system PL by an angle θ, and the surface position detection devices 1 to 5 are arranged side by side along the X direction. The detection areas Wa1 to Wa5 extending along the x direction are arranged along the X direction, and a large inspection area TA as a whole can be set on the wafer W.

  Note that the surface position detection apparatus according to the first embodiment is a scanning stepper type exposure apparatus that performs exposure while changing the positional relationship between the wafer W and the projection pattern in the form in which the mask pattern of the reticle M is projected and exposed. However, the present invention can also be applied to a step-and-repeat type static (collective exposure) exposure apparatus that performs exposure while the positional relationship between the wafer W and the projection pattern is stationary. Further, the present invention can be applied to a step-and-stitch reduction projection exposure apparatus that synthesizes a shot area and a shot area.

  The surface position detection apparatus described above can also be applied to a multistage exposure apparatus including a plurality of wafer stages. In addition to the wafer stage, the first embodiment can be applied to an exposure apparatus including a measurement stage including a measurement member (for example, a reference mark and / or a sensor).

  The exposure apparatus EXP may be a dry type exposure apparatus that exposes the wafer W without passing through liquid (water), or an immersion space that includes an optical path of illumination light between the projection optical system and the wafer W. And an exposure apparatus that exposes the wafer W with illumination light through the projection optical system and the liquid in the immersion space.

  The projection optical system of the exposure apparatus EXP is not limited to an equal magnification system, and may be a reduction system or an enlargement system. The projection optical system may be not only a refractive system but also a reflective system or a catadioptric system. This projected image may be an inverted image or an erect image. In the first embodiment, a so-called polarization illumination method can be applied.

  In the first embodiment described above, the present invention is applied to the detection of the surface position of the wafer W as the photosensitive substrate. However, the present invention is not limited to this. The present invention can also be applied. In the first embodiment described above, the present invention is applied to the detection of the surface position of the photosensitive substrate in the exposure apparatus. However, the present invention is not limited to this. The present invention can also be applied to the detection of the surface position of the inspection surface.

  Next, a device manufacturing method using the exposure apparatus EXP according to the first embodiment will be described. FIG. 7 is a flowchart showing a semiconductor device manufacturing process. As shown in FIG. 7, in the semiconductor device manufacturing process, a metal film is vapor-deposited on a wafer W to be a semiconductor device substrate (step S40), and a photoresist, which is a photosensitive material, is applied on the vapor-deposited metal film. (Step S42). Subsequently, using the above-described exposure apparatus EXP, the second pattern formed on the mask (reticle) M is transferred to each shot area on the wafer W (step S44: exposure process), and the transfer of the wafer W after the transfer is completed. Development, that is, development of the photoresist having the second pattern transferred thereon is performed (step S46: development step).

  Thereafter, using the resist pattern generated on the surface of the wafer W in step S46 as a mask, processing such as etching is performed on the surface of the wafer W (step S48: processing step). Here, the resist pattern is a photoresist layer in which unevenness having a shape corresponding to the second pattern transferred by the above-described exposure apparatus EXP is generated, and the recess penetrates the photoresist layer. is there. In step S48, the surface of the wafer W is processed through this resist pattern. The processing performed in step S48 includes at least one of etching of the surface of the wafer W and film formation of a metal film, for example. In step S44, the exposure apparatus EXP described above transfers the second pattern using the wafer W coated with the photoresist as the photosensitive substrate.

  FIG. 8 is a flowchart showing a manufacturing process of a liquid crystal device such as a liquid crystal display element. As shown in FIG. 8, in the manufacturing process of the liquid crystal device, a pattern formation process (step S50), a color filter formation process (step S52), a cell assembly process (step S54), and a module assembly process (step S56) are sequentially performed. In the pattern forming process of step S50, a predetermined mask pattern (second pattern) such as a circuit pattern and an electrode pattern is formed on the glass substrate coated with a photoresist as the plate P using the above-described exposure apparatus EXP. In this pattern formation step, an exposure step of transferring the pattern to the photoresist layer using the above-described exposure apparatus EXP, development of the plate P on which the pattern is transferred, that is, development of the photoresist layer on the glass substrate, A development step for generating a photoresist layer having a shape corresponding to the second pattern and a processing step for processing the surface of the glass substrate through the developed photoresist layer are included.

  In the color filter forming step of step S52, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or three of R, G, and B are arranged. A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning direction. In the cell assembly process in step S54, a liquid crystal panel (liquid crystal cell) is assembled using the glass substrate on which the second pattern is formed in step S50 and the color filter formed in step S52. Specifically, for example, a liquid crystal panel is formed by injecting liquid crystal between a glass substrate and a color filter. In the module assembling process in step S56, various components such as an electric circuit and a backlight for performing the display operation of the liquid crystal panel are attached to the liquid crystal panel assembled in step S54.

  The present invention is not limited to the application to an exposure apparatus for manufacturing a semiconductor device. For example, a liquid crystal display element formed on a square glass plate, an exposure apparatus for a display apparatus such as a plasma display, an imaging element ( CCDs, etc.), micromachines, thin film magnetic heads, DNA chips and other various devices can be widely applied to exposure apparatuses. Furthermore, the present invention can also be applied to an exposure process (exposure apparatus) when manufacturing a mask (photomask, reticle, etc.) on which mask patterns of various devices are formed using a photolithography process.

[Embodiment 2]
FIG. 9 is a schematic configuration diagram of the light projecting prism 217 according to the second embodiment. FIG. 9 shows the xz plane along the y direction as in FIG. 5, and shows the optical path of the detection light R in the light projecting prism 217. In the light projection prism 217, the same reference numerals are given to the same components as those of the light projection prism 17, and the description thereof is omitted.

  In the light projection prism 217, the second reflecting surface 217b and the first surface 217c are not arranged in the same plane. As shown in FIG. 9, the second reflecting surface 217b and the first surface 217c are adjacent surfaces joined at the apex angle K, and are surfaces having different inclinations.

  The normal direction of the first surface 217c is set within ± 5 ° with respect to the traveling direction of the detection light R on the reference surface SP side (outside of the light projecting prism 217) on the first surface 217c. The normal direction of the first surface 217c may be 0 ° with respect to the traveling direction of the detection light R on the reference surface SP side in the first surface 217c. Since the second reflecting surface 217b is set at an inclination angle different from that of the first surface 217c, the traveling direction PX of the detection light R from the projection first objective lens 16 (the optical axis PX of the projection first objective lens 16). Can be incident on the light projecting prism 217 substantially perpendicular to the reference plane SP. The incident angle of the detection light R on the second surface 217d of the light projection prism 217 may be set within ± 5 °. Moreover, you may set to 0 degree. Accordingly, the second surface 217d is substantially parallel to the reference surface SP.

  Also in the projection prism 217, the first extended surface 217e intersects the optical axis AX at the first angle φ1. The angle δ2 formed by the detection light R traveling between the second surface 217d and the second reflection surface 217b and the optical axis AX is smaller than the incident angle δ1 of the detection light R on the detection region Wa1, and δ1 > Δ2. In the second embodiment, the angle δ2≈0 °, in other words, the detection light traveling in the optical path on the side opposite to the second reflecting surface 217b among the optical paths before and after the second surface 217d is parallel to the first axis. Progressing.

  The second extended surface 217f and the first extended surface 217e intersect at a second angle β between the first reflective surface 217a and the second reflective surface 217b. This intersection position Q is on the reference surface SP side of the second reflecting surface 217b. The first deflection angle ψ of the detection light R by the light projection prism 217 (that is, the detection light R outside the light projection prism 217 passing through the second surface 217d with respect to the detection light R outside the light projection prism 217 passing through the first surface 217c) As in the case of the first embodiment, the angle may be set in the range of 45 ° <ψ <89 °. When the incident angle on the second surface 217d is 0 °, the traveling directions of the detection light R inside and outside the projection prism on the second surface 217d are the same, and both are 0 °. In this case, also in the second embodiment, the first deflection angle ψ and the second deflection angle ψa are equal.

  As a specific example of the light projecting prism according to the second embodiment, for example, the one shown in FIGS. 10A and 10B can be considered. FIG. 10A is a schematic configuration diagram of a specific example 1 of the light projecting prism 217 according to the second embodiment. FIG. 10B is a schematic configuration diagram of a specific example 2 of the light projecting prism 217 according to the second embodiment.

  10A, a rectangular prism member 218 having a first reflecting surface 217a, a second reflecting surface 217b, and a second surface 217d is joined to a triangular prism member 219 having a first surface 217c. Configured. The projection prism 217 having a complicated shape is configured by joining a prism member 218 and a prism member 219 having a relatively simple shape. The first reflecting surface 217 a and the second reflecting surface 217 b are inner surface reflecting surfaces of one prism member 218. Therefore, even if the relative position between the prism member 218 and the prism member 219 changes slightly, the influence on the optical path of the detection light R is small.

  Below the second reflecting surface 217b of the prism member 218 (on the reference surface SP side) is a bonding surface 218a. The prism member 219 is bonded to the bonding surface 218 a by the adhesive 220. The detection light R reflected by the first reflection surface 217a travels toward the prism member 219 as it is without being substantially affected by the bonding surface 218a, and exits from the first surface 217c toward the detection area Wa1. It is like that. In this case, it is preferable that the refractive index of the adhesive 220 and the refractive index of the constituent materials of the prism members 218 and 219 are substantially the same.

  FIG. 10B is a configuration example in which the second reflecting surface 217b is disposed in the bonding surface 218a. The detection light R that has entered the projection prism 217 from the second surface 217d is internally reflected by the joining surface 218a as the second reflecting surface 217b, and then internally reflected by the first reflecting surface 217a and passes through the joining surface 218a. The light is emitted from the first surface 217c toward the detection area Wa1.

  In this specific example 2, no metal reflective film is formed on the joint surface 218a as the second reflective surface 217b. As the adhesive 220 for joining the prism member 218 and the prism member 219, an adhesive having a refractive index smaller than that of the constituent material of the prism member 218 is used. Since the refractive index of the adhesive 220 is smaller than the refractive index of the constituent material of the prism member 218, the critical angle θc when the detection light R is internally reflected on the second reflecting surface 217b can be reduced. By setting the incident angle when the detection light R from the second surface 217d is incident on the bonding surface 218a to be equal to or larger than the critical angle θc, the detection light R can be totally reflected by the bonding surface 218a. By setting the incident angle when the detection light R from the first reflection surface 217a is incident on the bonding surface 218a to an angle as close to 0 ° as possible (for example, within ± 5 °), most of the detection light R is mostly bonded. It can pass without being reflected by 218a.

  As described above, in the second specific example, since the second reflecting surface 217b is disposed in the bonding surface 218a, the size of the prism member 218 can be reduced. As a result, the size of the projection prism 217 as a whole can be reduced, which can contribute to space saving.

  FIG. 11 is a schematic configuration diagram of a specific example 3 of the light projecting prism 217 according to the second embodiment. In FIG. 11, a substantially triangular prism member 221 having a second reflecting surface 217b and a second surface 217d and a substantially rectangular prism member 222 having a first reflecting surface 217a and a first surface 217c are formed on the bonding surface 218a. The projection prism 217 is configured by being joined.

  In the configuration of the third specific example, the bonding surface 218a is arranged so as to be substantially orthogonal to the optical path of the detection light R reflected by the second reflection surface 217b and traveling toward the first reflection surface 217a. Therefore, the influence on the detection light R by the joint surface 218a can be suppressed small. In the configuration of the third specific example, at the design stage of the light projecting prism 217, the joint between the second reflecting surface 217b and the first surface 217c without affecting the angle of the second reflecting surface 217b or the first surface 217c. It is easy to adjust the position of the vertex angle K which is. Therefore, there is an advantage that the inclination angle of the joint surface 218a can be easily adjusted according to the optical path of the detection light R.

[Embodiment 3]
FIG. 12 is a schematic configuration diagram of a light projecting prism 317 according to the third embodiment. FIG. 12 shows the xz plane along the y direction as in FIG. 5, and shows the optical path of the detection light R in the light projecting prism 317. In the light projection prism 317, the same components as those of the light projection prism 17 are denoted by the same reference numerals, and description thereof is omitted.

  The light projecting prism 317 has a substantially parallelogram shape. In the third embodiment, the optical axis PX of the projection first objective lens 16 is inclined so as to approach the optical axis AX as the distance from the reference plane SP increases. The detection light R from the projection first objective lens 16 enters the projection prism 317 from the second surface 317d, is internally reflected by the second reflecting surface 317b, is internally reflected by the first reflecting surface 317a, and is first reflected. The light is emitted from the surface 317c and travels toward the detection area Wa1.

  The incident angle of the detection light R on the second surface 317d may be within ± 5 ° or 0 °. The emission angle of the detection light R from the first surface 317c may be within ± 5 ° or 0 °.

  Also in the projection prism 317, the first extension surface 317e intersects the optical axis AX at the first angle φ1. The angle δ2 formed by the detection light R traveling between the second surface 317d and the second reflection surface 317b and the optical axis AX is smaller than the incident angle δ1 of the detection light R on the detection region Wa1, and δ1 > Δ2. In the third embodiment, since the optical axis PX is inclined so as to approach the optical axis AX as the distance from the reference plane SP increases, the angle δ2 is conceptually a negative value.

  In the projection prism 317, the third extension surface 317h and the first extension surface 317e obtained by extending the first reflection surface 317a are between the first reflection surface 317a and the second reflection surface 317b at a second angle β. Crossed. This intersection position Q is on the reference plane SP side of the second reflecting surface 317b. The first deflection angle ψ of the detection light R by the light projection prism 317 (that is, the detection light R outside the light projection prism 317 passing through the second surface 317d with respect to the detection light R outside the light projection prism 317 passing through the first surface 317c) Is set in a range of 45 ° <ψ <89 ° as in the case of the first embodiment. When the incident angle on the second surface 317d is 0 °, the optical axis directions of the detection light R inside and outside the light projecting prism on the second surface 317d are the same, and both are 0 °. In this case, also in the third embodiment, the first deflection angle ψ and the second deflection angle ψa are equal.

[Embodiment 4]
FIG. 13 is a schematic configuration diagram of the surface position detection apparatus 1 according to the fourth embodiment. The surface position detection apparatus 1 includes a light projecting optical system 100 and a light receiving optical system 200 as a pair of light projecting / receiving optical systems. In the first embodiment, an example in which prisms having the same configuration are used for the light projecting prism 17 and the light receiving prism 27 has been described (see FIG. 2). However, different prisms may be used depending on the arrangement space of the light projecting optical system 100 and the light receiving optical system 200.

  In the fourth embodiment shown in FIG. 13, the light projecting prism 317 described in the third embodiment is used for the light projecting optical system 100, and the light receiving prism 27 described in the first embodiment is used for the light receiving optical system 200. By using the projection prism 317, it is possible to set the optical axis PX that is inclined so as to approach the optical axis AX as the distance from the reference plane SP increases. By using the light receiving prism 27, it is possible to set the optical axis RX that is inclined so as to be separated from the optical axis AX as the distance from the reference plane SP increases.

  With this configuration, the optical axis PX of the light projecting optical system 100 and the optical axis RX of the light receiving optical system 200 can be arranged asymmetrically with respect to the optical axis AX. In the exposure apparatus EXP, when the light projecting optical system 100 and the light receiving optical system 200 cannot be symmetrically arranged from the viewpoint of the arrangement space, the space is effectively utilized by using different light projecting prisms and light receiving prisms. be able to.

  It should be noted that whether to use the prism according to any of the above embodiments in combination with the light projecting prism and the light receiving prism can be determined according to the circumstances of the arrangement space. Even when the prisms according to the same embodiment are used for both the light projecting prism and the light receiving prism, two types having different inclination angles of the surfaces constituting the prism may be used for each.

  In any of the above embodiments, it is needless to say that the same configuration as that of the light projecting prism can be applied to the light receiving prism.

The manufacturing method described with reference to FIGS. 7 and 8 is not limited only to the exposure apparatus EXP according to the first embodiment, but also to an exposure apparatus provided with the surface position detection apparatus according to the above-described second to fourth embodiments. Applicable.
Further, the surface position detection apparatus according to the present embodiment includes, for example, U.S. Patent Publication Nos. 2009/0208875, 2009/0323036, 2010/0062351, 2010/0245829, 2011/0071784, 2012/2012. 0008150, U.S. Pat. Nos. 7,982,884, 8,111,406, 8,223,345, and International Position No. 2012/177663, etc. Can also be used.
The above surface position detection apparatus can also be applied to a surface position detection apparatus of an immersion type exposure apparatus disclosed in, for example, US Patent Publication No. 2011/0096315.
Further, the above surface position detection device is used in combination with a surface position detection device with a reduced error caused by the reflection surface disclosed in, for example, US Patent Publication No. 2009/0116039 and US Patent No. 8,149,382. You can also
In the above-described embodiment, a light transmission mask (reticle) in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. Instead of this reticle, For example, as disclosed in US Pat. No. 6,778,257, an electronic mask (variable shaping mask, which forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed, as disclosed in US Pat. No. 6,778,257. For example, a non-light emitting image display element (spatial light modulator) including a DMD (Digital Micro-mirror Device) may be used. When such a variable molding mask is used, a stage on which a substrate such as a wafer or a glass plate is mounted is scanned with respect to the variable molding mask, and the surface position of this substrate is measured using a surface position detection system. Thus, an effect equivalent to that of the above embodiment can be obtained.
Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that forms a line-and-space pattern on a wafer W by forming interference fringes on the wafer W. The above embodiment can also be applied.
Further, as disclosed in, for example, US Pat. No. 6,611,316, two reticle patterns are synthesized on a wafer via a projection optical system, and 1 on the wafer by one scan exposure. The above embodiment can also be applied to an exposure apparatus that performs double exposure of two shot areas almost simultaneously.
In the above embodiment, the object on which the pattern is to be formed (the object to be exposed to which the energy beam is irradiated) is not limited to the wafer, but may be another object such as a glass plate, a ceramic substrate, a film member, or a mask blank. good.
The use of the exposure apparatus is not limited to the exposure apparatus for semiconductor manufacturing, but for example, an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern to a square glass plate, an organic EL, a thin film magnetic head, an image sensor (CCD, etc.), micromachines, DNA chips and the like can also be widely applied to exposure apparatuses. Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates or silicon wafers, etc. The above embodiment can also be applied to an exposure apparatus that transfers a circuit pattern.
Further, the surface position detection apparatus and the exposure apparatus according to the above-described embodiment maintain various mechanical subsystems including the respective constituent elements recited in the claims of the present application with predetermined mechanical accuracy, electrical accuracy, and optical accuracy. As such, it is manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.
It should be noted that all publications relating to the exposure apparatus and the like cited in the above description, international publication, US patent application specification and US patent specification disclosure are incorporated herein by reference.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these, A various deformation | transformation and change are possible within the range of the summary.

Surface position detection device: 1-5 Projection optical system: 100
Light guide: 11 Emitting slit prism: 13
Emitting surface: 13a Projecting second objective lens: 14
Aperture: 15 First projection lens: 16
Emitting prism (reflective member): 17, 217, 317
First reflective surface: 17a, 217a, 317a Second reflective surface: 17b, 217b, 317b
First surface: 17c, 217c, 317c Second surface: 17d, 217d, 317d
First extension surface: 17e, 217e, 317e Second extension surface: 17f, 217f, 317f
Bottom: 17g Third extension surface: 317h
Light receiving optical system: 200 Optical sensor (detection element): 21
Receiving slit prism: 23 Incident surface: 23a
Light receiving second objective lens: 24 Aperture: 25
Light receiving first objective lens: 26 Light receiving prism (reflecting member): 27
Prism member: 218, 219, 221, 222
Bonding surface: 218a Adhesive: 220
Optical axis (first axis): AX Optical axis: PX, RX
Control unit: CR Exposure position: EP
Exposure device: EXP Drive system: HD
Illumination system: IL Unit: ENh1 to ENh6
Vertical angle: K Loading position: LP
Light source: LS Mask (reticle): M
Drive system: MD Mask stage position measurement unit: MP
Mask stage: MS Projection pattern (first pattern): P1
Light receiving pattern: P2 Projection optical system: PL
Crossing position: Q Detection light (projection light, reflected light): R
Scale: SCA Projection slit: Sm
Receiving slit: St Reference plane: SP
Inspection area: TA Unloading position: UP
Drive system: VD Wafer: W
Surface (exposed surface, test surface): Wa Detected region: Wa1-Wa5
Measuring unit: WP Wafer stage: WST
Wafer table: WTB Acute angle: θ
Critical angle: θc Amount of rotation about X axis: θx
Rotation amount around Y axis: θy Rotation direction around Z axis: θz
First angle: φ1 Incident angle: δ1
First deflection angle (deflection angle): ψ Second deflection angle: ψa
Angle: α Second angle: β

Claims (30)

A light projecting optical system for projecting detection light from an oblique direction with respect to a detection area on the test surface;
A light receiving optical system that receives the detection light reflected by the detection region from an oblique direction;
A photoelectric conversion element that photoelectrically converts detection light via the light receiving optical system,
A surface position detecting device for detecting a position shift of the test surface with respect to a reference surface based on an output from the photoelectric conversion element,
At least one of the light projecting optical system and the light receiving optical system has a reflecting member that is disposed in the optical path of the detection light and has an even number of reflecting surfaces,
The reflecting member is
A first reflecting surface disposed closest to the detected region along the optical path of the detection light inside the reflecting member;
A second reflecting surface disposed on the side farthest from the detection area along the optical path of the detection light inside the reflection member,
When an axis extending in the normal direction of the reference surface is a first axis, a first extended surface obtained by extending the first reflecting surface to the reference surface side is the first axis passing through the detection area and the first axis. Intersect at an angle,
With respect to the optical path of the detection light passing through a predetermined point on the detection area, the angle between the detection light traveling between the detection area and the first reflecting surface and the first axis is greater than the angle between the detection light and the first axis. A surface position detection device in which an angle formed between the detection light traveling in the optical path opposite to the first reflection surface and the first axis among the optical paths before and after the second reflection surface is smaller. The reflecting member includes a prism member,
The surface position detection device according to claim 1, wherein the first reflection surface and the second reflection surface are inner surface reflection surfaces. The prism member includes a first surface that is a refractive surface disposed at a position closest to the detected region with respect to an optical path of the detection light inside the prism, and an optical path of the detection light inside the prism from the detected region. The surface position detection apparatus according to claim 2, further comprising a second surface that is a refractive surface disposed at a farthest position. The surface position detection apparatus according to claim 3, wherein an angle formed between a normal direction of the first surface and an optical axis direction of the first surface on the reference surface side is within ± 5 °. The surface position detection apparatus according to claim 4, wherein the normal direction of the first surface is a direction of an optical axis of the first surface on the reference surface side. The surface position according to any one of claims 3 to 5, wherein an angle formed by a normal direction of the second surface and an optical axis direction on the second surface side is within ± 5 °. Detection device. The surface position detection apparatus according to claim 6, wherein a normal direction of the second surface is a direction of an optical axis on the second surface side. The surface position detection device according to claim 3, wherein the second reflecting surface is disposed on the same surface as the first surface. 9. The detection light traveling in an optical path on the opposite side of the second reflecting surface among the optical paths before and after the second surface travels in parallel with the first axis. The surface position detection apparatus described in 1. 9. The position at which the first extension surface and a second extension surface obtained by extending the second reflection surface toward the reference surface intersect each other on the reference surface side of the second reflection surface. 9. The surface position detection apparatus of any one of these. The reflecting member includes a plurality of prism members,
The surface position detection device according to claim 10, wherein the first reflection surface and the second reflection surface are inner surface reflection surfaces of one prism member of the plurality of prism members. The plurality of prism members include a first prism member having the inner surface reflection surface, and a first surface which is a refractive surface disposed at a position closest to the detection area with respect to an optical path of detection light inside the prism. Two prism members,
The surface position detection device according to claim 11, wherein a surface of the first prism member having the second reflection surface is located between the first surface and the first reflection surface. The second extension surface obtained by extending the second reflection surface toward the reference surface side and the first extension surface intersect each other at a second angle. Surface position detection device. A second extended surface obtained by extending the second reflective surface toward the reference surface and a third extended surface obtained by extending the first reflective surface intersect between the first reflective surface and the second reflective surface. The surface position detection device according to any one of claims 1 to 8. A light projecting optical system for projecting detection light from an oblique direction with respect to a detection area on the test surface;
A light receiving optical system that receives the detection light reflected by the detection region from an oblique direction;
A photoelectric conversion element that photoelectrically converts detection light via the light receiving optical system,
A surface position detecting device for detecting a position shift of the test surface with respect to a reference surface based on an output from the photoelectric conversion element,
At least one of the light projecting optical system and the light receiving optical system has a reflecting member that is disposed in the optical path of the detection light and has an even number of reflecting surfaces,
The reflecting member is
A first reflecting surface disposed closest to the detected region along the optical path of the detection light inside the reflecting member;
A second reflecting surface disposed on the side farthest from the detection area along the optical path of the detection light inside the reflection member,
The position where the first extended surface that extends the first reflective surface toward the reference surface and the second extended surface that extends the second reflective surface toward the reference surface intersect with each other on the second reflective surface. On the reference plane side,
The surface position detection apparatus in which the first reflection surface is located between a position where a normal line of the first reflection surface intersects the reference surface and the second reflection surface. The surface position detection device according to claim 15, wherein the second reflection surface is positioned between a position where a normal line of the second reflection surface intersects the reference surface and the first reflection surface. A light projecting optical system for projecting detection light from an oblique direction with respect to a detection area on the test surface;
A light receiving optical system that receives the detection light reflected by the detection region from an oblique direction;
A photoelectric conversion element that photoelectrically converts detection light via the light receiving optical system,
A surface position detecting device for detecting a position shift of the test surface with respect to a reference surface based on an output from the photoelectric conversion element,
At least one of the light projecting optical system and the light receiving optical system has a prism that is disposed in the optical path of the detection light and has a plurality of internal reflection surfaces,
The prism is
A first surface which is a refractive surface disposed at a position closest to the test surface with respect to the optical path of the detection light inside the prism;
A first reflecting surface having one inner reflecting surface of the plurality of inner reflecting surfaces;
A second reflecting surface having one inner reflecting surface of the plurality of inner reflecting surfaces;
A second surface that is a refractive surface disposed at a position farthest from the test surface with respect to the optical path of the detection light,
The second reflecting surface is disposed between the first reflecting surface and the second surface with respect to the optical path of the detection light,
When the deflection angle of the detection light traveling on the optical path outside the prism among the optical paths before and after the second surface with respect to the detection light traveling on the optical path outside the prism among the optical paths before and after the first surface is ψ ,
A surface position detection device that satisfies the following conditions.
45 ° <ψ <89 ° In the prism,
The surface position detection device according to claim 17, wherein the second reflection surface is disposed on the same surface as the first surface. 19. The surface according to claim 17, wherein an angle formed between a normal direction of the first surface and an optical axis of detection light outside the prism that passes through the first surface is within ± 5 °. Position detection device. The surface position detection device according to claim 19, wherein the normal direction of the first surface is an optical axis direction of detection light outside the prism that passes through the first surface. 21. The angle formed by the normal direction of the second surface and the optical axis of detection light outside the prism that passes through the second surface is within ± 5 °. The surface position detection device according to item. The surface position detection device according to claim 21, wherein the normal direction of the second surface is an optical axis direction of detection light outside the prism that passes through the second surface. When the angle formed by the first surface and the first reflecting surface of the prism is β [deg] and the angle formed by the second surface and the second reflecting surface is α [deg], The surface position detection device according to any one of claims 17 to 22, wherein the following conditional expression is satisfied.
α = 2β
0 ° <β <45 ° The detection light that travels in the optical path on the opposite side of the second reflecting surface among the optical paths before and after the second surface travels in parallel with the first axis. The surface position detection apparatus described in 1. Each of the light projecting optical system and the light receiving optical system has an imaging optical system that forms an image of an object,
The surface according to any one of claims 1 to 24, wherein the reflecting member is disposed between an imaging optical system of the light projecting optical system and an imaging optical system of the light receiving optical system. Position detection device. 26. The surface position detection device according to claim 25, wherein the imaging optical system of the light projecting optical system and the imaging optical system of the light receiving optical system are optical systems in which the test surface side is telecentric. The light projecting optical system and the light receiving optical system as a pair of light projecting / receiving optical systems,
27. The surface position detection device according to claim 1, comprising a plurality of pairs of the light projecting / receiving optical systems having different positions of the detection area on the test surface. In an exposure apparatus that exposes a predetermined pattern on a substrate,
The surface position detection device according to any one of claims 1 to 27 for detecting a surface position of an exposed surface of the substrate as a surface position of the test surface;
An exposure apparatus comprising: an alignment unit configured to align an exposed surface of the substrate with respect to the reference surface based on a detection result of the surface position detection device. A projection optical system for projecting the predetermined pattern onto the substrate;
The exposure apparatus according to claim 28, wherein the alignment unit aligns the exposed surface of the substrate with respect to an image plane of the projection optical system. Using the exposure apparatus according to claim 27 or claim 28, exposing the predetermined pattern onto a substrate;
Developing the substrate to which the predetermined pattern is transferred, and forming a mask layer having a shape corresponding to the predetermined pattern on the surface of the substrate;
Processing the surface of the substrate through the mask layer.

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