JP2014130188A - Exposure apparatus and exposure method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure apparatus and an exposure method each capable of alleviating an operator's burden and of improving the productivity.SOLUTION: In the provided exposure apparatus 41, a mask provided with a light-shielding pattern having a predetermined shape is passed through a light irradiation region of a light source 43 in a state of having been positioned on the photosensitive material layer of a base material to be exposed 22 such that the photosensitive material layer is exposed via the mask while the base material to be exposed 22 is being conveyed. It accordingly becomes unnecessary for the exposure apparatus 41 to execute, every time light is irradiated from the light source 43, an operation of exchanging the base material to be exposed 22 within the light irradiation range, and it becomes possible to alleviate an operator's burden commensurately, to continuously irradiate the base material to be exposed 22 with light without interrupting the light irradiation by virtue of the absence of the exchanging operation, and, as a result, to improve the productivity as well.

Description

  The present invention relates to an exposure apparatus and an exposure method, and is suitable for use in, for example, manufacturing a large-area microchannel device having a hollow channel space between a first substrate and a second substrate.

  In recent years, attention has been focused on MEMS (Micro Electro Mechanical Systems) that uses a semiconductor microfabrication technique to fabricate a microdevice having a mechanical function and an electrical function. As an application of such MEMS technology, flow structures, pumps, valves, mixers, and other microstructures are integrated on several centimeter square substrates, and fluids are sent and mixed to analyze fluids. ΜTAS (Micro Total Analysis Systems) is known. Furthermore, in recent years, an electrode-embedded microchannel device in which an electrode is provided in the channel space is also being considered for higher functionality of the device, and a method for manufacturing this type of electrode-embedded microchannel device Research is also underway. Here, as a conventional method of manufacturing a microchannel device, for example, a microchannel device is manufactured by joining a concave substrate formed with a concave groove to be a channel or a chamber and a flat cover substrate. Manufacturing methods are known (see, for example, Patent Document 1 and Non-Patent Document 1).

  Here, when forming a concave substrate constituting such a microchannel device, first, a photosensitive material layer is formed on the substrate with a photocurable resin, and a concave groove is formed in the photosensitive material layer. A mask having a light shielding pattern that shields light from the region to be formed is positioned on the photosensitive material layer. Next, after the substrate is placed immediately below the UV lamp, the photosensitive material layer in a region other than the region where the concave groove is formed is photocured by irradiating UV from the UV lamp. Next, by removing the mask and the non-cured photosensitive material layer shielded from UV light, a concave groove can be formed on the surface of the photosensitive material layer.

JP 2010-82540 A

Shinohara et al., “Studies on low-temperature direct bonding of VUV / O3-, VUV-, and O2 plasma-pretreated poly-methylmethacrylate”, Journal of Micromechanics and Microengineering 21 (2011): 085028 (9pp)

  However, in such a manufacturing method, when a plurality of substrates are manufactured, the substrate is placed directly under the UV lamp, removed after UV irradiation, and another substrate is newly placed directly under the UV lamp. There was a problem that the work of replacing the parts became necessary and the burden on the operator was heavy. In addition, this manufacturing method has a problem in that the productivity is also lowered because the UV irradiation needs to be interrupted each time such a substrate replacement operation is performed.

  Accordingly, the present invention has been made in consideration of the above points, and an object thereof is to propose an exposure apparatus and an exposure method capable of reducing the burden on the operator and improving the productivity.

  In order to solve this problem, the exposure apparatus according to claim 1 and the exposure method according to claim 7 irradiate the surface of the photosensitive material layer of the substrate to be exposed, which has been transported by the transport means, with a light source. In addition, the substrate to be exposed is passed through the light irradiation region of the light source while the mask provided with the light shielding pattern having a predetermined shape is positioned on the surface of the photosensitive material layer of the substrate to be exposed. The photosensitive material layer is exposed through the mask while transporting the film.

  According to the exposure apparatus of the first aspect of the present invention and the exposure method of the seventh aspect of the present invention, the light irradiation means remains in a state where the mask provided with the light shielding pattern is positioned on the surface of the photosensitive material layer of the substrate to be exposed. By passing through the light irradiation area, it is not necessary to replace the substrate to be exposed in the conventional light irradiation range, so that it is possible to save time and trouble in manufacturing and to continue without interrupting the light irradiation. Light irradiation is possible, and productivity can be improved.

It is the schematic which shows the whole structure of a light-emitting device. It is a sectional side view which shows the detailed structure of a microchannel device. It is the schematic where it uses for description of the light emission principle. It is a disassembled block diagram which shows the detailed structure of a microchannel device. It is the schematic where it uses for description of the manufacturing method of a 1st board | substrate. It is the schematic used for description of the manufacturing method of a 1st board | substrate, and the schematic used for description of the manufacturing method of a 1st board | substrate and a 2nd board | substrate. It is the schematic where it uses for description of the joining method of a 1st board | substrate and a 2nd board | substrate. It is a photograph which shows the structure of the microchannel device actually produced. It is the schematic which shows the structure of the exposure apparatus by this invention. It is the schematic which shows the structure of a fixed body. It is a disassembled block diagram which shows the structure of a fixed body. 10 is a photograph showing a configuration of a first substrate manufactured by the exposure apparatus shown in FIG. 9. It is the schematic which shows the structure of the exposure apparatus provided with the mask conveyance means. It is the schematic which shows the structure of the photolithography system using the exposure apparatus of this invention. It is the schematic which shows the structure of the exposure apparatus by other embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(1) Microchannel device manufactured using the exposure apparatus of the present invention, and optical device using the same

(1-1) Configuration of Optical Device First, the microchannel device manufactured using the exposure apparatus of the present invention (described later with reference to FIG. 9) will be described, and then the exposure apparatus of the present invention will be described. . Here, in FIG. 1, reference numeral 1 denotes a light emitting device using a microchannel device 2, and the light emitting device 1 has a configuration in which a power source 5 is connected to the microchannel device 2 via a wiring 4. In FIG. 1, for convenience of explanation, the power source 5 is connected to only one first electrode 11 and one second electrode 18 via the wiring 4. The two electrodes 18 are also connected to a power source via wiring.

  Here, in the case of this embodiment, the entire microchannel device 2 is formed in a soft film shape, and a channel space 14 is formed therein. The width and depth of the channel space 14 are selected to be about 10 to 2000 [μm], and the thickness (distance between electrodes) is selected to be about 1 to 100 [μm], and the whole is formed in a micro size. The microchannel device 2 has a configuration in which a first substrate 7 provided with a plurality of first electrodes 11 and a second substrate 8 provided with a plurality of second electrodes 18 are joined. A hollow flow path space 14 is formed between the first substrate 7 and the second substrate 8. Here, in the microchannel device 2, the first substrate 7 has a configuration in which the photosensitive channel forming layer 12 is provided on the support substrate 10, and the photosensitive channel forming layer 12 includes the channel space 14. The channel space 14 is surrounded by the support substrate 10, the photosensitive channel forming layer 12, and the second substrate 8.

  In the case of this embodiment, in the microchannel device 2, a plurality of channel spaces 14 having the same configuration are formed so as to run in parallel in the longitudinal direction. Each of the luminescent liquids is configured to flow.

  Each flow path space 14 has an inlet 2a formed at one end and an outlet 2b formed at the other end. For example, a tube member (not shown) is connected to each of the inlet 2a and the outlet 2b. Can be done. When the luminescent liquid is supplied to the channel space 14 from the inlet 2a at one end by the upstream tube member, the microchannel device 2 passes through the channel space 14 and flows at the other end. The luminescent liquid flows out from the outlet 2b to the tube member on the downstream side, and different luminescent liquids can flow into the respective flow path spaces 14. Incidentally, the above-mentioned luminescent liquid refers to a form in which, for example, a luminescent compound is added to various solvents, liquid semiconductors, ionic liquids or mixed solutions thereof.

  In the microchannel device 2, the support substrate 10 constituting the first substrate 7 and the second substrate 8 are made of a transparent soft member such as polyester (PET (polyethylene terephthalate), PEN (polyethylene naphthalate)) or the like in a film form. Is formed. In the microchannel device 2, the plurality of first electrodes 11 and second electrodes 18 each having a belt shape are composed of soft transparent electrodes such as ITO, IZO, and ZnO, and the photosensitive channel forming layer 12 is soft. Since it is formed of a photosensitive resin, it has a flexible structure that bends in response to an external force as shown in FIG. 2 showing a side cross-sectional configuration of the AA ′ portion of FIG. .

  A first self-assembled monomolecular film is selectively formed on the bonding surface 20a of the photosensitive flow path forming layer 12 facing the second substrate 8 except for a flow path groove serving as a flow path space 14 on the first substrate 7. 21a is formed. Further, on the second substrate 8, a second self-assembled monolayer 21 b is formed on the bonding facing surface 20 b facing the first substrate 7. As a result, the first substrate 7 is connected to the terminal functional group of the first self-assembled monolayer 21a on the bonding surface 20a, and the terminal functional group of the second self-assembled monolayer 21b on the bonding facing surface 20b of the second substrate 8. And the second substrate 8 can be bonded.

  The first self-assembled monolayer 21a is preferably composed of a self-assembled monomolecule having an epoxy at the terminal functional group, such as 3-glycidyloxypropyltrimethoxysilane (GOPTS, GPTS, GPTMS). , 3-glycidoxypropyltriethoxysilane (GPTES), 3-glycidoxypropylmethyldiethoxysilane (GPMDES), 3-glycidoxypropylmethyldimethoxysilane, and the like.

On the other hand, the second self-assembled monolayer 21b that binds to the terminal functional group of the first self-assembled monolayer 21a may be composed of a self-assembled monomolecule having —NH ₂ as the terminal functional group. Preferably, for example, 3-aminopropyltriethoxysilane (APTES), 3-aminopropyltrimethoxysilane (APTMS), N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropyltriethoxysilane, and the like.

  Here, FIG. 3 is a schematic diagram for explaining the light emission principle when, for example, a liquid semiconductor is used as the luminescent liquid L. In this case, in the microchannel device 2, as shown in FIG. 3, a voltage is applied to the first electrode 11 and the second electrode 18 by the power source 5 (FIG. 1). In this state, the first electrode 11 and the second electrode When the luminescent liquid L flows into the flow path space 14 between the electrodes 18, holes are injected from the first electrode 11 into the luminescent liquid L, and electrons are injected from the second electrode 18 into the luminescent liquid L. Can be introduced. Thereby, in the microchannel device 2, the holes and electrons in the luminescent liquid L are recombined with each other, and the excitons generated thereby can emit light when returning to the ground state.

  Next, such a microchannel device 2 will be briefly described with reference to exploded views shown in FIGS. 4A and 4B. As described above, the microchannel device 2 has a configuration in which the support substrate 10, the photosensitive channel formation layer 12, and the second substrate 8 are laminated in order from the bottom, and has a belt shape on one surface of the support substrate 10. The plurality of first electrodes 11 may be arranged so as to run side by side, and the groove forming through holes 15 of the photosensitive flow path forming layer 12 may be stacked so as to face the first electrodes 11. As a result, the first electrode 11 is exposed in the groove forming through hole 15 of the photosensitive flow path forming layer 12 on the support substrate 10, and the groove forming through hole 15 and the first electrode 11 form a flow groove having a concave cross section. Can be formed.

  The four-sided photosensitive flow path forming layer 12 is provided with circular enlarged diameter regions 15a and 15b communicating with the inflow port 2a and the outflow port 2b, respectively, at both ends of the groove-forming through hole 15 formed in a band shape. The diameter-enlarged regions 15a and 15b can also be arranged to face the first electrode 11 on the support substrate 10.

  When the second substrate 8 is joined to the first substrate 7 to close the opening of the flow channel groove, a part of the second electrode 18 can be exposed in the flow channel groove of the first substrate 7. . Thus, in the microchannel device 2, a hollow channel space 14 in which, for example, the first electrode 11 and a part of the second electrode 18 face each other can be formed between the first substrate 7 and the second substrate 8. The second substrate 8 is positioned on the photosensitive flow path forming layer 12 such that the plurality of inlets 2a and outlets 2b penetrating through the thickness overlap the enlarged diameter regions 15a and 15b of the photosensitive flow path forming layer 12, The photosensitive flow path forming layer 12 can be bonded.

  In this microchannel device 2, as shown in FIG. 2, the first self-assembled monolayer 21a selectively formed only on the bonding surface 20a excluding the channel groove of the first substrate 7, The terminal functional groups of the second substrate 8 and the second self-assembled monomolecular film 21b on the bonding facing surface 20b are bonded to each other so that the first substrate 7 and the second substrate 8 are firmly bonded. The channel groove does not bond to the second substrate 8 and has a configuration that can surely form the hollow channel space 14.

(1-2) Manufacturing Method of Microchannel Device Next, a manufacturing method of such a microchannel device 2 will be briefly described below. First, a film-like support substrate 10 having an electrode layer formed on the surface is prepared, and the electrode layer on the support substrate 10 is etched with a resin mask pattern, and as shown in FIG. A first electrode 11 having a predetermined shape is formed. Next, the support substrate 10 on which the first electrode 11 is formed is irradiated with O ₂ plasma P to improve the deposition property of the negative photosensitive resin on the support substrate 10. Next, a photocurable photosensitive resin is spin-coated on the support substrate 10 on which the first electrode 11 is formed, and the photocurable photosensitive resin is heated and pre-baked. As shown in FIG. An exposed substrate 22 having a photosensitive material layer 12a having a predetermined thickness is formed thereon.

  Next, as shown in FIG. 5C, a mask 23 in which a light shielding pattern layer 25 having a predetermined light shielding pattern is provided on a substrate 24 is prepared, and the light shielding of the mask 23 is performed on the photosensitive material layer 12a of the substrate 22 to be exposed. The pattern layer 25 is positioned. In this state, the exposure apparatus (described later) of the present invention is used to expose a predetermined region of the photosensitive material layer 12a of the substrate 22 to be exposed at a predetermined temperature while being blocked by the mask 23. Thereafter, the mask 23 is removed from the substrate 22 to be exposed, baked, developed with a developing solution, and after removal of the uncured region, post-baking is further performed at a predetermined temperature, as shown in FIG. 5D. The photocurable photosensitive resin on one electrode 11 is removed, and a photosensitive flow path forming layer 12 in which a groove forming through hole 15 is formed is formed on the support substrate 10.

  Incidentally, since the photosensitive channel forming layer 12 can easily change the height and width of the channel groove according to the exposure amount by the exposure device, it is preferably formed of the above-described negative photosensitive resin, for example, manufactured by Microchem. (Nippon Kayaku) SU-8 series, KMPR series, Tokyo Ohka Kogyo TMMR S2000, Toray Photo Nice (photosensitive polyimide), etc. are used.

  Next, as shown in FIG. 6A, a dummy member 27 made of, for example, a dummy resin (TSMR: manufactured by Tokyo Ohka Kogyo Co., Ltd.) or the like is injected into the groove forming through hole 15 of the photosensitive flow path forming layer 12 and baked at a predetermined temperature. . In this way, the entire inside of the channel groove is covered with the dummy member 27, and the first electrode 11 in the channel groove is not exposed to the outside.

Next, separately from this, a film-shaped second substrate 8 in which a second electrode 18 having a predetermined shape is provided on the bonding facing surface 20b and a through-hole-like inlet 2a and outlet 2b are formed at predetermined positions is provided. Prepare (FIG. 4A). Next, as shown in FIG. 6B, O ₂ with respect to the bonding surface 20a provided with the dummy member 27 of the first substrate 7 and the bonding facing surface 20b provided with the second electrode 18 of the second substrate 8. Irradiate plasma P to introduce oxygen-containing groups (carboxyl group, ketone, hydroxyl group, etc.) on the dummy member 27 and the bonding surface 20a of the first substrate 7 and the bonding facing surface 20b of the second substrate 8, respectively. Hydrophilize.

  Next, the first substrate 7 is immersed in the first self-assembled monomolecular formation solution (first SAM formation solution), and, for example, 3-glycidyloxy is formed on the bonding surface 20a of the first substrate 7 and the dummy member 27. A first self-assembled monolayer 21a having a terminal functional group made of epoxy such as propyltrimethoxysilane (GOPTS) is formed. Next, the first substrate 7 is rinsed with a removing liquid such as acetone, and the residual self-assembled monomolecules not attached to the bonding surface 20a and the dummy member 27 in the groove-forming through-hole 15 are removed. In this way, as shown in FIG. 6C, on the first substrate 7, the first electrode 11 is exposed at the bottom of the flow channel groove (groove forming through hole 15), and the joint surface 20a excluding the flow channel groove. The first self-assembled monolayer 21a is selectively formed only on the first layer.

  On the other hand, the second substrate 8 is immersed in a second self-assembled monomolecular formation solution (second SAM formation solution), and as shown in FIG. 6C, on the bonding facing surface 20b of the second substrate 8, for example, 3- A second self-assembled monolayer 21b whose terminal functional group is an amino group, such as aminopropyltriethoxysilane (APTES), is formed. Next, the second substrate 8 is rinsed with ethanol or the like to remove residual self-assembled monomolecules that are not attached to the bonding facing surface 20b. In this manner, the second self-assembled monolayer 21b is formed on the entire surface of the second substrate 8 including the exposed second electrode 18 and the bonding facing surface 20b other than the second electrode 18.

  Finally, as shown in FIG. 7A, the first substrate 7 whose surface 20a is modified by the first self-assembled monolayer 21a and the bonding facing surface 20b by the second self-assembled monolayer 21b. A load (pressure 1.5 [MPa]) is applied to the first substrate 7 and the second substrate 8 while making contact with the surface-modified second substrate 8 and heating with the heater 33 in this state (for example, 140 [° C.]). In addition, as shown in FIG. 7B, the terminal functional group of the first self-assembled monolayer 21a and the end functional group of the second self-assembled monolayer 21b are bonded by an epoxy-amino reaction.

  Thus, by such a manufacturing method, the bonding surface 20a excluding the flow channel groove where the first self-assembled monolayer 21a of the first substrate 7 is not formed and the bonding facing surface 20b of the second substrate 8 are formed. It is possible to manufacture the microchannel device 2 in which the hollow channel space 14 can be surely formed without the entire channel groove being bonded to the second substrate 8 while being firmly bonded.

  FIG. 8A shows that the first substrate 7 and the second substrate 8 of 102 mm in length and width made of PET are manufactured and bonded according to the above-mentioned “(1-2) Manufacturing method of microchannel device”. 2 is a photograph of the microchannel device 2 manufactured in the above. In such a microchannel device 2, a hollow channel space 14 can be formed inside, and as shown in FIG. 12B, the first substrate 7 and the second substrate 8 are not peeled even when bent by hand. The first substrate 7 and the second substrate 8 can be bonded with a moderate strength.

(2) Exposure Apparatus According to the Present Invention Next, the exposure apparatus of the present invention used when manufacturing the above-described microchannel device 2 will be described below. In FIG. 9, reference numeral 41 denotes an exposure apparatus according to the present invention, which is used, for example, when forming a channel groove of the first substrate 7 constituting the microchannel device 2 (FIG. 1) described above. In practice, this exposure apparatus 41 includes a transporting means 42 for transporting a fixed body 50 (described later in FIGS. 9 and 10) on which the substrate 22 to be exposed is installed, and a fixed body transported by the transporting means 42. A light source 43 that irradiates light L1 such as UV to 50, and a shield 44 that surrounds the periphery of the light source 43 so that light L1 is irradiated only to the fixed body 50 placed on the belt 48 of the transport means 42 And. In FIG. 9, z indicates a vertical direction perpendicular to the width direction y of the moving surface 48 a of the belt 48 and the conveyance direction x of the fixed body 50.

  In the transport means 42, an endless belt 48 is driven by a plurality of rollers 47 arranged along the transport direction x, and the moving surface 48a of the belt 48 can move in the transport direction x. In practice, the belt 48 is disposed immediately below the light source 43 so that the moving surface 48a can pass through the light irradiation range of the light source 43. As a result, the conveying means 42 allows the fixed body 50 to pass downstream as it is exposed to the photosensitive material layer of the substrate 22 to be exposed that is placed on the fixed body 50 by passing the light irradiation range of the light source 43. The fixed body 50 is transported to the side, and is transported to a next process device (not shown) disposed on the downstream side (left side).

  Here, the light source 43 is, for example, a UV lamp, and can irradiate the light L1 toward the moving surface 48a of the belt 48 to form a light irradiation range of a predetermined size on the moving surface 48a. In the case of this embodiment, the light source 43 extends in the width direction y of the moving surface 48a of the transport means 42, and can uniformly irradiate the light L1 over the entire width of the moving surface 48a, in the transport direction x. The flowing exposed substrate 22 can be uniformly exposed.

  The shield 44 is formed in a box shape by a wall portion 44a and a top portion 44b made of a member that does not transmit light L1, and the light source 43 is arranged in an internal space surrounded by the wall portion 44a and the top portion 44b. obtain. The shield 44 is disposed with a predetermined gap G1 between the moving surface 48a of the belt 48, and the fixed body 50 placed on the moving surface 48a of the belt 48 is disposed so as to be able to pass through the gap G1. ing. Further, this shield 44 has an opening only at the bottom 44c facing the moving surface 48a, and shields the light L1 irradiated from the light source 43 to the periphery at the wall 44a and the top 44b, while the bottom 44c Only the moving surface 48a of the belt 48 can be irradiated with the light L1.

  Here, the exposure apparatus 41 can adjust the exposure time for the substrate 22 to be exposed by adjusting the moving speed of the belt 48 of the conveying means 42. That is, when the moving speed of the moving surface 48a is slowed, the exposure time for the substrate 22 to be exposed can be increased by the amount of time that remains in the light irradiation range of the substrate 22 to be exposed. On the other hand, when the moving speed of the moving surface 48a is increased, the exposure time for the substrate 22 to be exposed can be shortened by the amount of time that remains in the light irradiation range of the substrate 22 to be exposed. In the case of this embodiment, the conveying means 42 can move the belt at 1 to 12 [m / min] and pass the light irradiation range. Further, in the exposure apparatus 41, the exposure amount can be similarly adjusted by changing the output of the light source 43 or the distance between the belt 48 and the light source 43.

  Next, the fixed body 50 placed on the moving surface 48a of the belt 48 will be described below. FIG. 10 is a side sectional view of the fixed body 50 in a state where the substrate 22 to be exposed is installed, and FIG. 11 is an exploded configuration diagram of the fixed body 50. As shown in FIGS. 10 and 11, the fixed body 50 is composed of a base 53, for example, a silicon rubber, and the like, and an elastic body 52 installed on the base 53 and placed on the elastic body 52. The mask 23 is disposed on the surface 52a of the elastic body 52 so as to cover the substrate 22 to be exposed. The base 53 is made of, for example, stainless steel, and is formed in a flat plate shape that can be placed on the moving surface 48a of the belt 48 and on which the elastic body 52 can be placed.

  The elastic body 52 has, for example, a quadrilateral shape having a predetermined thickness, and when an external force is applied to the surface 52a, the surface shape can be deformed according to the external force. In the case of this embodiment, since the elastic body 52 is formed of silicon rubber, the surface 52a has adhesiveness, and the light shielding pattern layer 25 of the mask 23 is pressed against the surface 52a. 25 can be glued to the surface 52a and positioned.

  After the substrate 22 to be exposed is placed on the surface 52a of the elastic body 52, the fixed body 50 has the mask 23 placed on the surface of the elastic body 52 so as to cover the substrate 22 to be exposed as shown in FIG. The mask 23 is mounted on the surface 52a by being pressed against the surface 52a and by the adhesiveness of the surface 52a of the elastic body 52. Here, the mask 23 has a configuration in which a light shielding pattern layer 25 made of a silver salt emulsion on which a light shielding pattern is formed is provided on one surface of a substrate 24 made of a flexible member such as polyester. The fixed body 50 pushes the exposed substrate 22 into the elastic body 52 by the pressing force generated by bonding the mask 23 to the surface 52a of the elastic body 52, and covers the recessed space 55 formed by the deformation of the elastic body 52. An exposure substrate 22 can be accommodated.

  Here, even if the elastic body 52 pushes up the exposed base material 22 due to the elastic force, the mask 23 is curved, and the substrate 24 and the light shielding pattern layer 25 are bent, and the surface 52a of the elastic body 52 around the exposed base material 22 is shielded from light. The state where the pattern layer 25 is adhered can be maintained. In this way, the fixed body 50 receives the elastic force generated by the depression of the elastic body 52 by the mask 23 via the exposed substrate 22, so that the exposed substrate 22 is interposed between the elastic body 52 and the mask 23. It is made so that it can be fixed to.

  Incidentally, in the case of this embodiment, the mask 23 has the light-shielding pattern opposed to each first electrode 11 on the support substrate 10, and the light L1 is applied to the photosensitive material layer 12a in the region not opposed to the first electrode 11. It can arrange | position so that it can irradiate. As a result, the substrate 22 to be exposed faces the first electrode 11 by photocuring the photosensitive material layer 12a in the region not facing the first electrode 11 and developing it in the developing device in the next process. The photosensitive material layer 12a in the region can be removed, and a channel groove can be formed on the first electrode 11 so as to expose the first electrode 11 as shown in FIG. 5D.

  Incidentally, the developing device (not shown) in the next step forms a groove that is not photocured by baking the exposed substrate 22 exposed by removing the mask 23 from the elastic body 52 and developing it with a developer. After removing the through-hole region and forming the groove-forming through-hole 15 in the photosensitive material layer 12a, post-baking is further performed at a predetermined temperature to form a channel groove in which the first electrode 11 is exposed at the bottom of the groove-forming through-hole 15. The provided photosensitive flow path forming layer 12 is formed on the support substrate 10.

  Here, FIG. 12 is a photograph of the first substrate 7 after the channel grooves are formed in the photosensitive material layer 12a on the support substrate 10 and developed using the exposure apparatus 41 described above. . In this case, a support substrate 10 of 102 [mm] in width and width made of PET is prepared, and eight first electrodes 11 are produced on the support substrate 10 with a width of 2 [mm] and a pitch of 8 [mm], and then supported. A photosensitive material layer 12a was formed with a film thickness of 6 [μm] on a substrate 10 with a photocurable resin for permanent film (SU-83005 (MicroChem)) to produce a substrate 22 to be exposed. Then, after the substrate 22 to be exposed was placed on the fixed body 50 described above, the exposure was performed while moving the belt 48 of the exposure apparatus 41 described above at 11.0 [m / min]. The exposure apparatus 41 selects the distance between the substrate 22 to be exposed and the light source 43 (UV lamp) as 12 [cm], and the central irradiation of UV (365 [nm]) emitted from the UV lamp as the light source 43. The exposure was performed so that the amount was about 200 [mW / cm 2].

  At this time, as the mask 23, a mask made by TOPRO that shields the light L1 is used, and a strip-like linear portion having a width of 250 [μm], 500 [μm], 750 [μm], and 1000 [μm] is 8 [mm The light-shielding pattern having a circular portion with a diameter of 1.5 [mm] at both ends of each linear portion was formed. After exposing the substrate 22 to be exposed using such a mask 23 by the above-described exposure apparatus 41, the mask 23 is removed, the substrate 23 is baked, developed with a developer, and a photocuring type for a permanent film in a light-shielded region. After removing the resin to form the groove-forming through-hole 15, the substrate was further post-baked at a predetermined temperature to produce the first substrate 7. As shown in FIG. 12, a photosensitive flow path forming layer 12 having eight groove forming through holes 15 corresponding to the light shielding pattern could be formed on the first substrate 7. Further, when the groove-forming through hole 15 having a flow path width of 250 [μm] was enlarged and examined, a flow path groove having an enlarged diameter region 15a and a straight portion was formed, and the light shielding pattern was transferred very neatly. It was confirmed that it was made.

  Further, by using such an exposure apparatus 41, it is possible to continuously expose the substrate 22 to be exposed, and the work time for forming the flow channel groove on the large area PET is the conventional substrate-fixed exposure method. It was confirmed that the process can be performed in a shorter time than (a method of replacing the exposed substrate with the light irradiation range each time after exposure). Therefore, it has been confirmed that such an exposure apparatus 41 can improve the productivity as compared with the prior art.

  In the above-described configuration, in this exposure apparatus 41, the mask 23 provided with the light-shielding pattern having a predetermined shape is positioned by the photosensitive material layer 12a of the substrate 22 to be exposed by the conveying means 42. By passing through the light irradiation region, the photosensitive material layer 12a was exposed through the mask while conveying the substrate 22 to be exposed. As a result, in the exposure apparatus 41, it is not necessary to replace the substrate 22 to be exposed within the light irradiation range each time light is irradiated by the light source 43, and accordingly, the burden on the operator can be reduced and there is no replacement work. The light irradiation can be continuously performed on the substrate 22 without being interrupted each time, and thus the productivity can be improved.

  In the case of this embodiment, in the exposure apparatus 41, the substrate 22 to be exposed is fixed by the fixed body 50, and the fixed body 50 is placed on the moving surface 48a of the belt 48, thereby The exposed substrate 22 was exposed. In the fixed body 50, the exposed substrate 22 is placed on the elastic body 52, the exposed substrate 22 is covered with a mask 23, and the mask 23 is detachably adhered to the surface 52a of the elastic body 52. did. Thereby, in the fixed body 50, the exposed substrate 22 is pressed against the mask 23 by the elastic force of the elastic body 52, and the exposed substrate 22 can be fixed between the elastic body 52 and the mask 23 without being displaced. .

  In the case of this embodiment, the fixed body 50 is simply formed by pressing the mask 23 against the surface 52a of the elastic body 52 because the elastic body 52 is formed of an adhesive rubber member such as silicon rubber. The mask 23 can be adhered to the surface 52a of the elastic body 52 by the adhesiveness of the elastic body 52. As a result, the fixing member 50 does not require an attachment member for attaching the mask 23 to the elastic body 52, so that the fixing member 50 can have a simple structure and can reduce the burden of attachment work for attaching the mask 23 to the elastic body 52.

(3) Other Embodiments (3-1) Exposure Apparatus Comprising Mask Conveying Means Note that the present invention is not limited to this embodiment, and various modifications may be made within the scope of the present invention. In the above-described embodiment, the case where the exposure apparatus 41 that transports the fixed body 50 with the substrate 22 to be exposed fixed between the elastic body 52 and the mask 23 by the transport means 42 is described. The present invention is not limited to this, and exposure in which only the substrate 22 to be exposed is transported by the transport means 42 without using the fixed body 50 as shown in FIG. Apparatus 60 may be applied.

  In this case, the exposure apparatus 60 is provided with a mask conveying means 61 so as to face the belt 48 of the conveying means 42, and the exposed substrate 22 conveyed by the belt 48 is exposed to the mask conveying means 61. The mask 23 provided on the surface of the belt 64 with the mask can be positioned. In practice, the mask conveying means 61 has a first roller 62a and a second roller 62b arranged along the conveying direction x, and an endless masked belt 64 is formed by the first roller 62a and the second roller 62b. When driven, the moving surface 64a of the masked belt 64 can move in the transport direction x.

  The mask conveying means 61 has a light source 43 disposed between the first roller 62a and the second roller 62b so that the belt 64 with mask and the belt 48 of the conveying means 42 can pass directly under the light source 43. Yes. Thereby, the exposed substrate 22 is placed on the moving surface 48a of the belt 48 so that the mask is positioned by the belt 64 with the mask and can pass through the light irradiation range of the light source 43 in this state. Has been made.

  In practice, the belt 64 with a mask has a soft film-like mask (not shown) having a light shielding pattern layer on which a light shielding pattern is formed on the moving surface 64a, and on the moving surface 48a of the conveying means 42. The mask can be positioned with respect to the substrate 22 to be exposed. The belt 64 with the mask is configured such that the mask rotates together with the belt member between the first roller 62a and the second roller 62b so that the same mask can be repeatedly used for the exposed substrate 22 conveyed by the conveying means 42. Has been made. In addition, the mask provided in the belt 64 with a mask may be one, and plural may be sufficient as it.

  In practice, the belt 64 with the mask is arranged such that the first roller 62a and the second roller 62b are arranged at a predetermined distance, and the conveying means 42 before the substrate 22 to be exposed passes through the light irradiation range of the light source 43. The mask is positioned in advance on the exposed base material 22 flowing in the above manner, and the light irradiation range of the light source 43 can be passed with the mask positioned on the exposed base material 22. In this way, the exposure apparatus 60 allows the light irradiation range to pass through with the mask positioned on the substrate 22 to be exposed, while exposing the photosensitive material layer of the substrate 22 to be exposed through the mask while downstream. It will be transported to.

  When the exposed substrate is discharged from the gap G1 with the conveying means 42, the mask conveying means 61 moves the mask to the exposed substrate 22 as the masked belt 64 rotates and rises along the first roller 62a. And only the substrate 22 to be exposed is carried out to the next process apparatus (not shown) provided on the downstream side (left side). When positioning the mask on the substrate 22 to be exposed, the mask transport unit 61 may temporarily stop and position the belt 48 of the transport unit 42 and the belt 64 with the mask. The belt 48 and the masked belt 64 may be positioned while being moved.

  In the above configuration, the exposure apparatus 60 also allows the mask provided with the light-shielding pattern having a predetermined shape to pass through the light irradiation region of the light source 43 while being positioned on the photosensitive material layer of the substrate 22 to be exposed. Thus, the photosensitive material layer can be exposed through the mask while conveying the substrate 81 to be exposed. Therefore, in this exposure apparatus 60 as well, in the same manner as in the above-described embodiment, it is not necessary to replace the exposed substrate 22 in the light irradiation range each time the light source 43 is irradiated with light. In addition, since there is no replacement work, light irradiation is not interrupted each time, and light irradiation can be continuously performed on the substrate 22 to be exposed, and thus productivity can be improved.

  In the above-described embodiment, the case where the mask conveying unit 61 is positioned so that the mask is brought into contact with the photosensitive material layer of the substrate 22 to be exposed has been described, but the present invention is not limited thereto. In order to prevent the mask from coming into contact with the photosensitive material layer of the substrate 22 to be exposed, a mask conveying means that positions the mask with a predetermined gap between the photosensitive material layer may be applied.

  Moreover, in such an exposure apparatus 60, since it is not necessary to install the to-be-exposed base material 22 in the fixed body 50 (FIG. 10 and FIG. 11) mentioned above, it is continuous with each apparatus used in another process. Processing operations may be possible. Here, FIG. 14 shows a photolithography system 66 provided with an exposure apparatus 60. The photolithography system 66 includes, for example, a cleaning device 67a, a photoresist coating device 67b, a pre-baking device 67c, an exposure device 60 of the present invention, a post-exposure baking device 67d, a developing cleaning device 67e, and a drying device 67f in order from the upstream side. It has a configuration arranged continuously.

  The various apparatuses provided in the photolithography system 66 are apparatuses used in general photolithography. For example, the cleaning apparatus 67a is for cleaning the substrate 22a, and a photoresist coating apparatus 67b. Is for coating a photosensitive material to be a photosensitive material layer on the surface of the base material 22a, and the pre-baking device 67c is for pre-baking the photosensitive material of the base material 22a to form a photosensitive material layer. Further, the post-exposure baking device 67d is for baking the exposed base material 22a, and the development cleaning device 67e is for developing and cleaning the base material 22a to form a photosensitive flow path forming layer on the surface of the base material 22a. The drying device 67f is for drying the substrate 22a. Incidentally, the mask transport means 61 in the exposure apparatus 60 of the present invention shown in FIG. 14 is of a type that positions the mask without contacting the surface of the substrate 22a (substrate to be exposed).

  Such a photolithography system 66 is transported by the cleaning device 67a, the photoresist coating device 67b, the pre-baking device 67c, the exposure device 60 of the present invention, the post-exposure baking device 67d, the developing cleaning device 67e, and the drying device 67f. 42 so that the base material 22a can be transported as it is from the upstream device to the downstream device by the transport means 42 without having to transfer the base material 22a between the devices. Has been made.

  In practice, in this photolithography system 66, a plurality of rollers 47 are arranged from an upstream cleaning device 67a arranged along the transport direction x to a downstream drying device 67f, and a belt 48 is attached to these rollers 47. The base material 22a can be continuously conveyed from the upstream cleaning device 67a to the downstream dry device 67f by being hung and placing the base material 22a on the moving surface of the belt 48. As described above, in the exposure apparatus 60 of the present invention, it may be possible to perform continuous processing work with each apparatus used in other steps.

(3-2) Exposure apparatus provided with base material transport means for transporting a soft film-like base material In FIG. 15, in which parts corresponding to those in FIG. An exposure apparatus is shown, and the exposure apparatus 70 includes a substrate conveying means 73 that conveys a film-like exposed substrate 81, and the exposed substrate 81 conveyed by the substrate conveying means 73 is converted into a mask conveying means 61. It is characterized in that the configuration of the conveying means 71 is modified so as to be close to.

  The substrate conveying means 73 sends the film-shaped exposed substrate 81 delivered from the supply reel 78a to the take-up reel 78b via the substrate guide rollers 79a and 79b, and the take-up reel 78b The exposure base material 81 is wound up. The substrate conveying means 73 passes the exposed substrate 81 through the gap G1 between the mask conveying means 61 and the conveying means 71 between the substrate guide rollers 79a and 79b, and the mask conveying means 61 exposes the mask. The photosensitive material layer of the substrate 81 can be positioned and exposed.

  In the conveying means 71, a mask conveying means 61 is disposed above the first roller 74a and the second roller 74b, and a plurality of guide rollers 75 are disposed between the first roller 74a and the second roller 74b. . In the case of this embodiment, the guide roller 75 is smaller in diameter than the first roller 74a and the second roller 74b, and is arranged close to the masked belt 64 along the masked belt 64 of the mask conveying means 61. The gap G1 is formed between the belt 64 with the mask and the belt 76. Thus, the guide roller 75 allows the exposed substrate 81 to be close to the masked belt 64 of the mask conveying means 61 so that the mask of the masked belt 64 can be positioned on the exposed substrate 81.

  In the above configuration, the exposure apparatus 70 also allows the mask provided with the light-shielding pattern having a predetermined shape to pass through the light irradiation region of the light source 43 while being positioned on the photosensitive material layer of the substrate 81 to be exposed. Thus, the photosensitive material layer can be exposed through the mask while conveying the substrate 81 to be exposed. As a result, even with this type of exposure apparatus 70, it is not necessary to replace the exposed substrate 81 in the light irradiation range each time light is irradiated by the light source 43, and the burden on the operator can be reduced accordingly. Since there is no work, the light irradiation is not interrupted each time and the substrate 81 to be exposed can be continuously irradiated with light, thus improving the productivity.

  In the above-described embodiment, the case where a photosensitive material layer made of a photocurable resin that is photocured by irradiating light is applied as the photosensitive material layer. In addition to the above, a photosensitive material layer made of a light softening resin that softens when irradiated with light may be applied. When the light softening resin is applied, the light shielding pattern layer of the mask may be a flow path. It can be a light shielding pattern in which light is irradiated only to the photosensitive material layer on the first electrode 11 forming the groove.

41,60,70 Exposure equipment
22 Exposed substrate
23 Mask
42,71 Transport means
43 Light source

Claims (7)

A light source for irradiating light to the photosensitive material layer of the substrate to be exposed that has been transported by the transport means;
The conveying means is
While passing the light-exposed area of the light source while the mask provided with the light-shielding pattern having a predetermined shape is positioned on the photosensitive material layer of the substrate to be exposed, while transporting the substrate to be exposed An exposure apparatus that exposes the photosensitive material layer through the mask. The conveying means is
The exposure apparatus according to claim 1, further comprising a moving surface on which the substrate to be exposed with the mask positioned on the surface of the photosensitive material layer is placed and passes through a light irradiation range of the light source. The conveying means is
The substrate to be exposed is placed on an elastic body, the photosensitive material layer is covered with the mask, and a fixed body in which the substrate to be exposed is sandwiched between the elastic body and the mask is conveyed. An exposure apparatus according to claim 1 or 2. The mask is positioned with respect to the photosensitive material layer of the substrate to be exposed that is disposed opposite to the moving surface and is placed on the moving surface, and the mask is moved in accordance with the movement of the substrate to be exposed. The exposure apparatus according to claim 2, further comprising a mask transport unit. The exposed substrate comprises a film-like member,
The exposure apparatus according to claim 4, further comprising a substrate transport unit that transports the substrate to be exposed so as to pass between the transport unit and the mask transport unit in the light irradiation range. The exposure apparatus according to any one of claims 1 to 5, wherein the photosensitive material layer of the substrate to be exposed is made of a photocurable resin or a photosoftening resin. The photosensitive material layer of the substrate to be exposed is irradiated with light by a light source and a mask provided with a light-shielding pattern having a predetermined shape is applied to the surface of the photosensitive material layer of the substrate to be exposed conveyed by the conveying means. An exposure method comprising exposing the photosensitive material layer through the mask while transporting the exposed substrate by passing the light irradiation region of the light source while being positioned on the surface.