JP2014123651A - Wiring board, touch panel sensor sheet, electrode substrate for solar battery, and wiring board manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board improved for practical use, the wiring board having a wiring structure including a conductive part as a ground which is coated with a line-shaped conductive pattern containing a conductive polymer and laminated.SOLUTION: A wiring board 1 includes: a base material 100; a ground conductive part 2 disposed on one surface side of the base material; and a line-shaped conductive pattern 3 whose one end of line is laminated on the ground conductive part 2. The line-shaped conductive pattern 3 is coated with a translucency conductive polymer, and there is a coating object residual area with smaller density of the conductive polymer comparing to the line-shaped conductive pattern 3 on the outer periphery of the line-shaped conductive pattern 3 of the flat surface of the base material 100. With regard to a distance (W1) between outer edges, facing each other, of the coating object residual area 4 that straddles the line-shaped conductive pattern 3 in the width direction, the proportion of width (W2) of one side for the coating object residual area 4 contained in the outer edges should be 20% or less.

Description

  The present invention relates to a wiring board that forms a conductive pattern on the surface of a base material, a touch panel sensor sheet including the wiring board, a solar cell electrode substrate including the wiring board, and a wiring board manufacturing method.

  In recent years, with the spread of portable devices typified by smartphones and the like, for example, the demand for touch panels as disclosed in Patent Document 1 has increased rapidly. According to the capacitive touch panel described in Patent Document 1, a so-called multi-touch function that allows a display screen to be slid by a movement of two or more fingers, and can be freely enlarged or reduced, etc. Is realized. There are various types of capacitive touch panels. For example, X and Y axis sensor patterns are formed on both sides of a transparent substrate such as an organic film or glass, and both substrates are formed after X and Y axis sensor patterns are formed on two transparent substrates. And X and Y axis sensor patterns are formed on one side of a transparent substrate. Among these, for the sensor sheet in which the X and Y axis sensor patterns are configured on one side of the transparent substrate, the crossing portions of the X and Y axis transparent sensor patterns are insulated with a transparent insulating material so that they do not short-circuit each other. Is done. At this time, it is common that either the X-axis or the Y-axis is formed as an independent pattern. The independent patterns are bridged by a conductive pattern formed of a transparent conductive material and become conductive.

  Patent Document 2 discloses an example of a wiring board having a plurality of transparent wiring layers on a transparent film. Specifically, predetermined portions of the transparent conductive film formed on the transparent polyimide film are electrically connected by a jumper connection portion formed by a printing method such as an inkjet method using PEDOT (polyethylene dioxydithiophene) ink. An example of a printed wiring board is disclosed. When forming the jumper connection portion, it is recommended to preliminarily heat the transparent polyimide film to 40 ° C. to 60 ° C. in order to prevent ink bleeding from spreading.

  As exemplified by the use of PEDOT in Patent Document 2, in recent years, as a transparent conductive material, the use of a transparent conductive polymer material instead of a metal material has been studied. For example, Patent Document 3 proposes a material containing PEDOT as the conductive polymer material. It has been proposed to use a paste containing PEDOT as a screen printing paste and to use it for the production of electrodes such as liquid crystal displays or as a base for metal electrodeposition in the circuit board industry. When preparing a printing material containing a conductive polymer resin such as PEDOT, an additive such as an alcohol attribute organic solvent is generally used together with an aqueous dispersion solvent. The additive such as the alcohol attribute organic solvent contributes to an increase in the affinity between the printing ink and the surface on which the printing ink containing the transparent conductive polymer resin is applied. Further, by dispersing the transparent conductive polymer in the aqueous dispersion solvent, the transparent conductive polymer can be applied and formed in a desired line shape by a printing technique such as screen printing.

JP 2011-054122 A Japanese Patent Application Laid-Open No. 2011-243928 Special table 2002-500408 gazette

  However, a printing material containing a transparent conductive polymer (hereinafter also simply referred to as “conductive polymer”) including a paste containing PEDOT (hereinafter also referred to as “PEDOT paste”) is used as a part of the solvent. Since adjustment is performed using water, the surface tension is large, and it is difficult to adjust the printability with the surface of the underlayer. In particular, when there are a plurality of regions made of different materials such as an insulating layer and a conductive layer on the surface of the printing substrate, it is difficult to adjust the appropriate printability between the PEDOT paste and each region. As a result, for example, there is a possibility that a part of the line pattern coated and formed with the PEDOT paste may be short-circuited with a region where bleeding is not planned or adjacent line patterns are short-circuited.

  As described above, the present invention relates to a wiring board having a wiring structure in which a conductive line pattern is applied and formed on a conductive portion as a base using a printing material containing a conductive polymer, and both can be conducted with sufficient electric resistance. Further improvements were required for practical use.

The present invention has been made in view of the above-described problems. That is, the present invention relates to a wiring board including a wiring structure in which a conductive part is used as a base and a line-like conductive pattern containing a conductive polymer is laminated on the conductive part by coating, and provides an improved wiring board for practical use. To do.
Moreover, this invention provides a touch-panel sensor sheet | seat provided with the said wiring board, and the electrode substrate for solar cells.
The wiring board manufacturing method of the present invention provides a manufacturing method of a wiring board including a wiring structure in which a conductive part is used as a base and a line-like conductive pattern containing a conductive polymer is laminated thereon by coating formation. It is. More specifically, the present invention provides a wiring board manufacturing method capable of manufacturing a wiring board improved in practical use in which a base conductive portion and a line-shaped conductive pattern are electrically connected.

  The wiring board of the present invention includes a base material, a base conductive portion provided on one side of the base material, and a line-shaped conductive pattern laminated on the base conductive portion, and the line-shaped conductive pattern Is formed by coating a transparent conductive polymer, and on the plane of the base material, on the outer periphery of the line-shaped conductive pattern, the remaining region of the coated material in which the density of the conductive polymer is smaller than that of the line-shaped conductive pattern. The ratio of the width dimension on one side of the remaining coating area included between the outer edges to the distance between the outer edges of the remaining coating area facing the line-shaped conductive pattern across the width direction is , 20% or less.

  The touch panel sensor sheet of the present invention includes the wiring board of the present invention. Moreover, the electrode substrate for solar cells of the present invention includes the wiring substrate of the present invention.

  The wiring board manufacturing method of the present invention uses a roll-shaped film base material, performs a conductive part forming step of forming a base conductive part on the surface of the film base material, and then contains a transparent conductive polymer. A coating material is applied and formed in a desired pattern, thereby forming a wiring substrate precursor by forming a line-shaped conductive pattern laminated on the base conductive portion, and then performing the wiring substrate precursor manufacturing process, Carrying out a drying step for drying the coating material in the wiring substrate precursor, and at least the wiring substrate precursor manufacturing step and the drying step, the unwinding step and the winding step of the film base material It is characterized by being continuously carried out in a roll-to-roll process.

  According to the wiring board of the present invention, a conductive property between the underlying conductive portion and the line-shaped conductive pattern including the conductive polymer is sufficiently achieved, and a coating with a low content density of the conductive polymer is provided around the line-shaped conductive pattern. Since the work remaining area exists, a short circuit with the surroundings is substantially prevented. Therefore, the wiring board of the present invention can be provided as an improved wiring board for practical use.

  And if it is a touchscreen sensor sheet and solar cell electrode board provided with the wiring board of the said invention, the outstanding property of the said wiring board can be enjoyed as desirable electrical reliability.

  The wiring board manufacturing method of the present invention relates to the manufacture of a wiring board having a base conductive portion and a line-shaped conductive pattern containing a conductive polymer, and can easily manufacture a wiring board having high electrical reliability with respect to the conductivity between the two. is there.

(A) is a top view which shows an example of the wiring board concerning 1st embodiment of this invention, (b) is an enlarged view of the area | region A in (a). (A) And (b) is a conceptual explanatory view in the II-II section concerning a first embodiment. (A) is an upper surface schematic diagram of the touch-panel sensor sheet concerning 2nd embodiment of this invention, (b) is an enlarged view of the area | region B in (a). It is IV-IV sectional drawing concerning 2nd embodiment. It is a table | surface figure which shows the result of the Example of this invention. It is a top view of the screen printing plate used for the present Example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same constituent elements are denoted by the same reference numerals, and redundant description is omitted as appropriate. In the present embodiment, there are cases where the vertical direction is defined and described, but this is for the purpose of explaining the relative relationship of the components for convenience, and does not necessarily mean the vertical direction of the gravity.

[First embodiment]
An example of the first embodiment of the wiring board of the present invention will be described with reference to FIG. Fig.1 (a) is a top view of the wiring board 1 of 1st embodiment of this invention. FIG. 1B is an enlarged view of the region A in FIG. The wiring board 1 includes a base material 100, a plurality of base conductive portions 2 provided on one surface side of the base material 100, and a line-shaped conductive pattern 3 in which one end of a line is stacked on the base conductive portion 2. . A plurality of line-shaped conductive patterns 3 are provided in parallel, and the other end extends to the outer edge of the substrate. The line-shaped conductive pattern 3 is formed by applying a conductive polymer. When the wiring substrate 1 is enlarged and observed as shown in FIG. 1B, the coating material remaining region 4 exists on the outer periphery of the line-shaped conductive pattern 3 on the plane of the base material 100. The coated material remaining area 4 is an area where the density of the conductive polymer is smaller than that of the line-shaped conductive pattern 3. In the present invention, “the density of the conductive polymer in the remaining area of the coated product is small” includes the case where the conductive polymer is substantially absent and the density is zero.
The wiring board 1 is arranged on one side of the remaining coating material region 4 included between the outer edges with respect to the distance (W1) between the outer edges of the remaining coating material region 4 across the line-shaped conductive pattern 3 across the width direction. The ratio of the width (W2) dimension is in the range of 20% or less. The ratio is calculated from the following formula (1). The ratio is more preferably 15% or less, and particularly preferably 10% or less. When the ratio is in the preferred range, a sufficient electrical resistance for conduction is exhibited in the wiring structure including the base conductive portion 2 and the line-shaped conductive pattern 3 laminated thereon. On the other hand, the lower limit of the range of the ratio is not particularly limited. However, from the viewpoint of surely obtaining the advantageous effect of preventing short circuit due to the presence of the coating material remaining region 4, the lower limit is at least 0.01% or more, more preferably 0.1% or more, It is preferably 1% or more, particularly preferably 5% or more.
(Equation 1)
Ratio = W2 / (W1 / 2) × 100 (1)

  As described above, the outer periphery of the line-shaped conductive pattern 3 is surrounded by the coating material remaining region 4. The density of the conductive polymer contained in the coated material remaining region 4 is smaller than that of the line-shaped conductive pattern 3. Therefore, it is difficult for the current that conducts the line-shaped conductive pattern 3 to flow to the other line-shaped conductive pattern 3 that is adjacent to the coating remaining region 4 and the adjacent line-shaped conductive patterns 3 are effectively prevented from being short-circuited. .

The wiring substrate 1 includes an aspect in which the ratio of the conductive polymer per unit area is 30% or less in the coated material remaining region 4. Furthermore, the ratio of the conductive polymer per unit area is preferably 20% or less, more preferably 10% or less, particularly preferably 5% or less, and a place where it is substantially 0%. May be included. In the said range, the electroconductivity in the coating material residual area | region 4 is not shown substantially. By having such a non-conductive region on the outer periphery, the line-shaped conductive pattern 3 is favorably prevented from being short-circuited with other adjacent line-shaped conductive patterns 3.
Moreover, the wiring board 1 includes an embodiment in which the ratio of the conductive polymer per unit area is 70% or more in the line-shaped conductive pattern 3. Further, the ratio of the conductive polymer per unit area is preferably 80% or more, more preferably 90% or more, particularly preferably 95% or more, and a place where the ratio is substantially 100%. May be included. When the ratio of the conductive polymer in the line-shaped conductive pattern 3 is in the above range, the substantial conductivity of the line-shaped conductive pattern 3 can be ensured.
In addition, the wiring board 1 has both a desirable ratio range of the conductive polymer per unit area in the remaining coating material region 4 and a desirable ratio range of the conductive polymer per unit area in the line-shaped conductive pattern 3. Therefore, the intended object of the present invention can be sufficiently achieved by including a reliable conductive region and a reliable non-conductive region.

  The density of the conductive polymer or the ratio per unit area of the conductive polymer in the line-shaped conductive pattern 3 and the coated material remaining region 4 is obtained by observing the wiring substrate 1 with a microscope and analyzing the microscope observation image by image processing. be able to. For example, the abundance ratio and density of the conductive polymer can be obtained by analyzing the density above a predetermined threshold for confirming the presence of the conductive polymer. Alternatively, a conductive polymer or a micelle containing the same can be specified by luminance and color and analyzed from image data.

The present inventors diligently studied on a wiring in which a line-shaped conductive pattern 3 containing a conductive polymer is laminated on the base conductive portion 2 on the base material 100 by coating formation. As a result, new knowledge was obtained about the behavior of the conductive polymer coated on the base conductive portion 2 and the effect on the electrical reliability of the wiring. And the main structure of this invention was discovered from the said knowledge, and it enabled it to provide the wiring board improved toward practical use.
That is, the present inventors apply a water-dispersible conductive polymer-containing material in a line shape under various conditions to form a coated portion, and dry the coated portion. A line-shaped conductive pattern was formed. The formed line-shaped conductive pattern was observed with a microscope. At this time, PEDOT was selected as the test material as the conductive polymer. As a result, it was found that under appropriate conditions, a region surrounding the outer periphery of the line-shaped conductive pattern, which is distinguished from the line-shaped conductive pattern, is formed.

  It has been found that the area of the region may increase with time after application of the conductive polymer-containing material. Further, as a result of image processing analysis, it was confirmed that the density of the conductive polymer in the region was significantly smaller than the density of the conductive polymer contained in the line-shaped conductive pattern. From this result, this area is a coating mark generated in the process of drying the coating part formed by applying the conductive polymer-containing material, and there is mainly a high affinity member on the substrate surface. It was recognized that this was a “coating residual region”.

  The reason why the remaining region of the coating material is formed around the line-shaped conductive pattern is not clear, but the present inventors presume as follows. That is, when the solvent contained in the coating portion evaporates, the conductive polymers are likely to aggregate with each other and show “retreat behavior” toward the inner side from the outer edge of the coating portion. On the other hand, some of the additives with good base material adhesion, such as alcohol attributed organic solvents, contained in the coating part maintain the state of being in close contact with the base material surface, so that the remaining part of the coated material is formed. I think that the. FIG. 2 is a schematic explanatory view based on the inventor's guess, and FIG. 2 (a) is an explanatory view conceptually showing the II-II cross-sectional view of FIG. 1 (b). FIG. 2 is an explanatory diagram conceptually showing a cross-sectional view taken along the line II-II in FIG. 1B when “retreat behavior” is exceeded. The coated part had a width indicated by W1 in FIG. 2A, and the conductive polymer 5 aggregated away from the outer edge of the coated part while agglomerating, and addition of good adhesion to the substrate was made on the trace of withdrawal. It is presumed that the agent remains and the coated material remaining region 4 is formed.

However, when the “retreat behavior” is exceeded and the width W2 of the remaining coating material region 4 is significantly increased, the electrical resistance in the base conductive portion 2 and the line-shaped conductive pattern 3 increases, and the conductivity deteriorates. Confirmed to do. Then, the present inventors diligently studied and one of the remaining coating areas 4 included between the outer edges with respect to the distance W1 between the outer edges of the remaining coating areas 4 across the line-shaped conductive pattern 3 across the width direction. The side width dimension W2 was specified to be 20% or less. In other words, the ratio of the distance W1 and the width dimension W2 is suppressed within an appropriate range, thereby substantially preventing the “retreat behavior” from being exceeded, thereby ensuring sufficient conductivity of the line-shaped conductive pattern 3.
Although the clear reason why the electrical resistance in the base conductive portion 2 and the line-shaped conductive pattern 3 increases when the “retreat behavior” is exceeded is unknown, the present inventors presume as follows. That is, when the “retreating behavior” is exceeded, as shown in FIG. 2B, the adhesion between the additive having good substrate adhesion and the substrate further proceeds, and the coating residue region base layer 4a is formed. It was speculated that As a result, it is presumed that the additive and the conductive polymer 5 are two-layered, and conduction between the line-shaped conductive pattern 3 and the base conductive portion 2 is hindered.
In the wiring substrate 1 of the present invention as described above, in the laminated portion formed by laminating the base conductive portion 2 and the line-shaped conductive pattern 3, the electrical connection in the thickness direction of the laminated portion is connected to the base conductive portion 2 and the line. It can be realized only by the conductive pattern 3. However, the present invention does not exclude an aspect in which an auxiliary conductive pattern is provided so as to cover the laminated portion.

Hereinafter, the configuration of the wiring board 1 will be described in detail.
As the base material 100, any material that can be used as the base material of the wiring board 1 may be selected. In particular, it is preferable that the substrate 100 has transparency because the wiring board 1 can be used for a light-transmitting device or a display device. As the substrate 100, a film material such as a highly transparent PET (Polyethylene terephthalate) film, a polycarbonate film, a transparent polyimide film, or a thinly formed film glass is preferably used. By selecting a flexible material as the base material 100, it can be used as a flexible substrate. The thickness of the base material 100 is not particularly limited as long as desired characteristics such as strength and flexibility of the wiring board 1 are exhibited. A coat layer may be formed on the surface of the base material 100 to improve adhesion to the base conductive portion 2 and the line-shaped conductive pattern 3 and coating uniformity.

  The base conductive part 2 is formed from a conductive material. In particular, when the base conductive portion 2 is provided at a position visible to the user, it is preferably formed of a transparent conductive member. Examples include metal oxide materials represented by ITO (tin-doped indium oxide), ATO (antimony-doped tin oxide) or FTO (fluorine-doped tin oxide), and PEDOT (polyethylenedioxythiophene), polypyrrole or polyaniline. Examples thereof include transparent conductive polymer materials, conductive nanowire materials, and the like. Examples of the conductive nanowire material include silver, metal alloy, and carbon. In addition, when the base conductive portion 2 is formed in a region where visibility is not required, the base conductive portion 2 is made of a copper foil, a silver paste or a cured copper paste, or the like as a non-transparent conductive material. It may be formed.

  When the base conductive part 2 includes conductive nanowires, an advantageous effect of high flexibility is exhibited as compared with a wiring board including the base conductive part 2 made of a metal material such as ITO.

  As the conductive polymer constituting the line-shaped conductive pattern 3, an aqueous dispersible and transparent conductive polymer is selected. As an example, PEDOT, polyaniline or polypyrrole can be exemplified. PEDOT is particularly preferably used from the viewpoint of molding stability of the line-shaped conductive pattern 3 and the coated material remaining area 4. PEDOT generally refers to PEDOT mixed with PSS (polystyrene sulfonic acid) and can also be expressed as PEDOT / PSS. In the present specification, the abbreviation of this blend may be simply referred to as PEDOT or PEDOT ink or PEDOT paste. Moreover, PEDOT which is a conductive polymer contained in the line-shaped conductive pattern 3 and the coated material remaining region 4 may be in any form such as PEDOT alone or micelle particles made of PEDOT and PSS.

The coating material containing a water-based dispersible and transparent conductive polymer used for forming the line-shaped conductive pattern 3 is obtained by dispersing the above-described conductive polymer in a dispersion solvent containing water. Examples of solvents other than water contained in the dispersion solvent include alcohols having good miscibility with water, such as methanol, ethanol, isopropanol, propanol, butanol, glycols such as ethylene glycol, propylene glycol, glycol acetate, butyrate glycol, and the like. Methoxypropyl acetate; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and diacetone alcohol; and amides such as N, N-dimethylacetamide, N, N-dimethylformamide, N-methylpyrrolidone and N-methylcaprolactam Can be mentioned.
By containing an organic solvent having an alcohol attribute typified by ethylene glycol or the like, the affinity of the coating material for the resin film substrate or the base conductive portion can be improved. The coating material includes an ink-like material and a paste-like material.
The dispersion solvent may further contain additives such as a thickener, a preservative, and a surfactant for adjusting the coating material. For example, the line-shaped conductive pattern 3 can be formed by screen printing by appropriately adjusting the concentration of the coating material to form a paste. Therefore, when the line-shaped conductive pattern 3 in the present invention is formed by screen printing, a thickener for adjusting the viscosity of the paste-like coating material to 100 centipoise or more, more preferably 1000 centipoise or more is contained. It is common. Examples of the thickener include, but are not limited to, polyolefin resin, talc, silica, fatty acid amide wax and the like.

  It is presumed that at least one of the dispersion solvent other than water and any additive other than the water adheres to the base conductive part as the coating surface as an additive having good substrate adhesion, and forms the coated material remaining region 4. Is done. In particular, since the thickener has high adhesion to the substrate surface, it may remain at a high ratio in the coated material remaining area 4. In addition, as above-mentioned that a small amount of conductive polymer may remain | survive with the additive with favorable base-material adhesiveness in the coating material residual area | region 4. Also in the line-shaped conductive pattern 3, in addition to many conductive polymers, at least one of a dispersion solvent other than water and any additive is inherent.

  As a method for forming the line-shaped conductive pattern 3 using the coating material described above, a conventionally known coating method may be appropriately selected. For example, examples of the coating method include ink jet, die coating, gravure coating, roll coating, and screen printing. Above all, screen printing is a very general method, and the discharge pattern of the coating paste can be adjusted by designing the screen printing plate with a desired pattern. preferable.

  The coated material remaining area 4 is formed at almost the same time as the line-shaped conductive pattern 3 is formed or continuously after the line-shaped conductive pattern 3 is formed. The formation method of the coating material residual area | region 4 is not specifically limited. By appropriately adjusting any one or combination of conductive polymer content concentration, solvent viscosity, environmental temperature and humidity at the time of coating, and drying conditions after coating, the desired coated material A remaining region 4 can be formed. In a simple manner, it is easy to form a desired coated material remaining region 4 by applying the coating material and then relaxing the drying conditions. Specific drying conditions after coating are adjusted by a preliminary test.

[Second Embodiment]
As a second embodiment of the present invention, an example in which the wiring board of the present invention is used for a touch panel sensor sheet will be described. FIG. 3A is a schematic top view of a touch panel sensor sheet 250 including the wiring board 21 of the present invention. FIG. 3B is an enlarged view of the region B shown in FIG. FIG. 4 is a schematic cross-sectional view of the touch panel sensor sheet 250 cut in the Y-axis direction, and corresponds to a cross-sectional view taken along line IV-IV in FIG. In FIG. 3B, the jumper pattern 23 is hatched for explanation.
The touch panel sensor sheet 250 includes a lead wire 260 that is drawn from the first electrode 300 and the second electrode 330 by wires, and an external connection lead electrode 270 that is connected to the lead wire 260.
The first electrode 300 has a plurality of first electrode patterns 310 that are repeatedly arranged in a first direction (X-axis direction). The second electrode 330 includes a plurality of second electrode patterns 22 that are disposed apart from the first electrode 300 in a second direction (Y-axis direction) that intersects the first direction. The first electrode 300 and the second electrode 330 are formed on the surface of the transparent substrate 30. The first electrode 300 according to the present embodiment includes a plurality of rectangular (rhombus) first electrode patterns 310 that are continuously connected by a boundary portion 312 having a narrower width than the first electrode pattern 310. The first electrodes 300 of the book are arranged in parallel.

The second electrode 330 is a set of a plurality of rectangular (rhombus) second electrode patterns 22 that are discretely arranged in the Y-axis direction. The second electrode patterns 22 adjacent in the Y-axis direction are electrically and physically connected by the jumper pattern 23 to form the second electrode 330. A plurality of second electrodes 330 are arranged in parallel in the X-axis direction.
The insulating pattern 340 covers the boundary portion 312 between the adjacent first electrode patterns 310. And the jumper pattern 23 is comprised so that the adjacent 2nd electrode pattern 22 may be bridged and connected physically and electrically. The insulating pattern 340 insulates the jumper pattern 23 and the first electrode 300 from each other. A protective film (not shown) may be formed on the jumper pattern 23 by coating.

  The wiring board 21 constituting the touch panel sensor sheet 250 of the present embodiment includes a transparent base material 30, a second electrode pattern 22 that is patterned independently of each other, a jumper pattern 23, and a coating material remaining area 24 that surrounds the outer periphery of the jumper pattern 23. including. That is, in the present embodiment, the second electrode pattern 22 corresponds to the base conductive portion. Similarly, in the present embodiment, the jumper pattern 23 corresponds to a line-shaped conductive pattern. As described above, the wiring board of the present invention can be applied to a complicated wiring structure such as the touch panel sensor sheet 250. For the same reason as the short circuit prevention effect of the line-shaped conductive pattern in the present invention described in the first embodiment, the short circuit prevention effect between the jumper pattern 23 and the surrounding wiring structure (for example, the first electrode 300) is expected. The

  The wiring board 21 further includes an insulating pattern 340 for preventing a short circuit between the first electrode 300 and the first electrode 300 and the second electrode 330, which is a configuration necessary for the touch panel sensor sheet 250. The transparent substrate 30 is made of a visible light transmissive resin material or film glass. The first electrode 300 and the second electrode 330 are provided on one side of the transparent substrate 30, that is, on the same side. The jumper pattern 23 is formed so as to straddle the first electrode 300 and the insulating pattern 340 and span between the adjacent second electrode patterns 22. At this time, the jumper pattern 23 comes into contact with the second electrode pattern 22 and the insulating pattern 340 having different physical properties. However, since the coating material remaining region 24 is formed on the outer periphery with a width within an appropriate range, the jumper pattern 23 is satisfactorily prevented from being short-circuited to the surroundings and is sufficiently connected to the second electrode pattern 22. Can be provided.

  Next, details of the jumper pattern 23 will be described. As described above, the line-shaped conductive pattern 3 of the present invention is formed by coating a conductive polymer. Here, the jumper pattern 23 includes a conductive polymer high density region 25 (hereinafter also simply referred to as “high density region 25”) and a conductive polymer low density region 26 (hereinafter also simply referred to as “low density region 26”). Are repeatedly present in the extension direction of the jumper pattern 23 (that is, the Y-axis direction). The high-density region 25 and the low-density region 26 can be confirmed from the shading of the shadow indicating the presence of the conductive polymer by observing the jumper pattern 23 with a microscope.

  The jumper pattern 23 including the high density region 25 and the low density region 26 can be formed as follows. That is, a screen printing plate having a pattern in which through holes are formed at predetermined positions corresponding to the high density region 25 is prepared, and screen printing is performed using a conductive polymer-containing paste. Thereby, a paste is discharged to a base material in the shape of a dot. At this time, by adjusting the viscosity of the paste to an appropriate range, a part of the dot-like paste discharged from the screen printing plate onto the substrate is leveled around. The space between the dots is filled with the paste. As a result, the area where the paste is ejected in the form of dots becomes the high density area 25, and the low density area 26 can be formed around the high density area 25.

  FIG. 3B shows a mode in which the high-density region 25 extends in two rows in the Y-axis direction. However, the high-density region 25 extends in a single row, or in a zigzag manner. It may be. The arrangement pattern of the high-density region 25 can be changed by the pattern design of the screen printing plate.

  The jumper pattern 23 formed by the above method is formed as a fine line with suppressed bleeding compared to a line formed using a screen printing plate having a pattern in which the shape of the jumper pattern itself is one through hole. can do. However, the low density region 26 has a problem that an increase in electrical resistance is feared because the conductive polymer is present in a smaller proportion than the high density region 25. That is, when the jumper pattern 23 is formed without any consideration, the coating material remaining area 24 and the low density area 26 are divided into two layers, similar to the content shown in FIG. There is a high possibility that the electrical connection with the electrode pattern 22 becomes defective. On the other hand, the jumper pattern 23 has a width dimension W2 on one side of the coating material remaining region 24 included between the outer edges with respect to the distance W1 between the outer edges of the coating material remaining region 24 which faces the jumper pattern 23 in the width direction. However, it is 20% or less. Therefore, the low density region 26 and the second electrode pattern 22 are unlikely to have a problem related to poor electrical connection, and an electrical resistance sufficient for conduction as a whole can be exhibited.

  The thickness of the line pattern of the present invention is not particularly limited, and the thickness of the jumper pattern 23 is not limited. However, it is desirable to reduce the thickness within a range where the desired performance is sufficiently exhibited. From this viewpoint, the average thickness of the jumper pattern 23 can be 300 nm or less. By suppressing the average thickness to a small value, there are effects such as downsizing of the wiring board and cost reduction by reducing the amount of materials used. Moreover, if it is the desirable thickness range mentioned above, the sufficiently high jumper pattern 23 can be obtained, which contributes to invisibility of the jumper pattern 23 when the wiring board 21 is viewed from the top. Further, similarly to the reason why the problem relating to poor electrical connection is unlikely to occur in the low-density region 26 described above, the problem related to poor electrical connection is unlikely to occur even in the jumper pattern 23 having a small average thickness, which is sufficient for conduction. Can be shown. In addition, the average thickness of the line-shaped pattern in the present invention is an average value of the thickness actually measured at any 10 points of the line-shaped pattern. However, when the high-density region 25 and the low-density region 26 are included as in the jumper pattern 23, the thicknesses are respectively determined at 10 locations recognized as the high-density region 25 and 10 locations recognized as the low-density region 26. It is desirable to actually measure and average them.

  From another viewpoint, the high density region 25 and the low density region 26 in the jumper pattern 23 can be understood as a thick portion and a thin portion, respectively. That is, the jumper pattern 23 that is a line-shaped conductive pattern may repeatedly include a thick portion and a thin portion in the extending direction. The maximum thickness of the thick part may be 200 nm or more, and the minimum thickness of the thin part may be less than 200 nm. The jumper pattern 23 including the thick part and the thin part can be manufactured by the same method as the jumper pattern 23 including the high density region 25 and the low density region 26. The wiring board 21 including the jumper pattern 23 including the thick part and the thin part is formed as a fine line-like line in which bleeding is suppressed, similarly to the jumper pattern 23 including the high density area 25 and the low density area 26. Can do. In addition, the jumper pattern 23 including the thick part and the thin part is less likely to cause a problem related to poor electrical connection, and can exhibit an electrical resistance sufficient for conduction.

  Since the transparent base material 30 can be appropriately selected and used as the member used for the base material 100 described above, description thereof is omitted here.

  As an example, the insulating pattern 340 is made into an ink or paste from a highly transparent resin material, printed in a desired pattern shape by a technique such as inkjet printing or screen printing, and then dried through a heating process or an ultraviolet irradiation process. To obtain.

  The first electrode pattern 310 and the second electrode pattern 22 are transparent and conductive patterns, and when the human fingers are close to or in contact with each other, the capacitance of the capacitance that locally changes at that location A sensor function for detecting a value and specifying a position is provided.

  The first electrode pattern 310 and the second electrode pattern 22 are made of a transparent and conductive metal material or resin material. Specific examples are the same as the materials exemplified with respect to the above-described underlying conductive portion 2, and thus description thereof is omitted here.

  FIG. 4 schematically shows an example in which the first electrode pattern 310 and the second electrode pattern 22 are composed of conductive nanowires 27. When the conductive nanowire 27 is used instead of using a metal material such as ITO, there is an advantage that the flexibility of the wiring board 21 can be improved and the resistance can be reduced. Therefore, the wiring substrate 21 using the conductive nanowires 27 can be suitably mounted not only on the mobile terminal device but also on a larger touch panel sensor sheet.

  Here, the electrical contact between the second electrode pattern 22 and the jumper pattern 23 is due to the contact between the conductive nanowire 27 exposed on the upper surface of the second electrode pattern 22 and the jumper pattern 23. For this reason, it is desirable that the second electrode pattern 22 and the jumper pattern 23 are in a laminated state in which they are sufficiently in contact with each other. On the other hand, the present invention prevents the excess of the “retraction behavior” of the conductive polymer constituting the jumper pattern 23 by suppressing the ratio of the distance W1 and the width dimension W2 to an appropriate range. And sufficient conductivity between the second electrode pattern 22 can be secured. In other words, according to the wiring board of the present invention, a combination of the jumper pattern 23 including the conductive polymer and the second electrode pattern 22 including the conductive nanowire 27 exhibits desirable electrical resistance and good flexibility. A substrate 21 can be provided.

  The lead wiring 260 is a wiring for transmitting a position detection signal output from the first electrode 300 and the second electrode 330 to an external substrate or a circuit. The lead-out wiring 260 is formed by patterning a sputtered metal foil by a photolithography technique, or by patterning a conductive paste or ink by a printing means such as screen printing, gravure printing, or flexographic printing. Is done.

  The insulating pattern 340 electrically insulates the jumper pattern 23 and the first electrode pattern 310 that is the base thereof. The insulating pattern 340 has a line shape wider than the boundary portion 312. The insulating pattern 340 of the present embodiment is formed so as to run over the adjacent edge between the adjacent second electrode patterns 22. The insulating pattern 340 can be formed using an insulating material that is highly transparent and sufficiently exhibits electrical reliability typified by insulating properties. As the insulating material, for example, a heat curing / drying type or UV curing type resin material is preferably used.

  In FIG. 3B, the jumper pattern 23 has a single line shape. However, the jumper pattern 23 is not limited to this, and may be configured as a plurality of parallel line shapes.

  If it is the touch panel sensor sheet 250 of this invention provided with the wiring board 21 demonstrated above, the outstanding property of the wiring board 21 can be enjoyed as desirable electrical reliability. In particular, by selecting a combination of the jumper pattern 23 including a conductive polymer and the second electrode pattern 22 including a conductive nanowire, the touch panel sensor sheet 250 can be made flexible.

  As a modified example of the second embodiment, the lead wiring 260 is formed as the base conductive portion in the present invention, and the other members are stacked on the lead wiring 260 so as to be electrically connected as the line-shaped conductive pattern of the present invention. The wiring board may be formed by forming The other member corresponds to at least an end portion of the first electrode pattern and / or the second electrode pattern, or a third member that electrically connects the end portion and the lead wiring 260.

  The wiring board of the present invention can also be applied to a touch panel sensor sheet having a configuration different from that of the touch panel sensor sheet 250. For example, the wiring board of the present invention can also be applied to a touch panel sensor sheet in which only a corresponding portion of the second electrode pattern connected by a jumper pattern has a through-hole structure and an insulating pattern for insulating other portions is provided. .

[Third embodiment]
The wiring board of the present invention can be used for various devices and structures other than the touch panel sensor sheet. For example, as a third embodiment, a solar cell electrode substrate including the wiring substrate of the present invention can be exemplified.

  For example, in order from the first substrate, a solar cell including a first electrode layer, an oxide semiconductor layer, a second electrode layer, and a second substrate, a solar cell including at least the first substrate and the first electrode layer. The wiring board of the present invention can be provided as an electrode substrate for use. Specifically, a transparent electrode layer corresponding to the base conductive portion of the present invention is formed on the first substrate, and a conductive polymer layer corresponding to the line-shaped conductive pattern of the present invention is formed on the transparent electrode layer. can do.

  Alternatively, in a solar cell electrode substrate including at least the first base material and the first electrode layer, a transparent electrode layer corresponding to the base conductive portion of the present invention is formed on the first base material, and the transparent electrode layer In addition, a lead layer corresponding to the line-shaped conductive pattern of the present invention can be formed. The lead layer is a layer for collecting electrons that have moved from the second electrode layer to the first electrode layer and outputting them in parallel electrically. On the first electrode layer, a grid, mesh, stripe It may be a pattern such as a shape. Considering the purpose of providing the lead layer, the lead layer is preferably composed of a conductive polymer having higher conductivity than the conductive material constituting the transparent electrode layer.

  If it is an electrode substrate for solar cells provided with the wiring board of this invention, the solar cell comprised using this can enjoy the outstanding property of a wiring board as desirable electrical reliability.

  The above description relates to the basic structure of the wiring board of the present invention, and the present invention provides a combination of the base conductive portion and the line-shaped conductive pattern laminated on the base material at any location on the base material. Including various wiring boards.

[Fourth embodiment]
Next, as a suitable manufacturing method for providing the wiring board of the present invention, a manufacturing method employing a roll-to-roll process including a film base unwinding step and a winding step will be described.

  In this method, a roll-shaped film base material is used, and a conductive part forming step for forming a base conductive part on the surface of the film base material is performed, and then a coating material containing a transparent conductive polymer is desired. The wiring board precursor manufacturing process for forming a wiring board precursor by forming a line-shaped conductive pattern to be laminated on the base conductive portion is performed by coating with the pattern, and then in the wiring board precursor A roll-to-roll process including performing a drying process for drying the coating material, and including at least the wiring board precursor manufacturing process and the drying process, the unwinding process and the winding process of the film base material Are carried out continuously.

  Generally, the roll-to-roll process has better production efficiency than the single wafer method. Therefore, adopting a roll-to-roll process in this method is preferable from the viewpoint of improving production efficiency. In particular, in this method, when a roll-shaped film substrate is used, a line-shaped conductive pattern is formed of a conductive polymer, and a base conductive portion is formed of a conductive nanowire, a flexible flexible wiring board is appropriately rolled. It can be manufactured by a to-roll process. In the roll-to-roll process, when the one unwinding step and the winding step are set as one set, the method performs at least the wiring board precursor manufacturing step and the drying step in the one set. However, steps other than the wiring board precursor manufacturing step and the drying step may also be performed in the roll-to-roll process in the same set or in another set.

  The conductive part forming step, the wiring board precursor manufacturing step, and the drying step are performed in a route for transporting the film base material by a roll-to-roll process. Especially the said wiring board precursor manufacturing process and the said drying process are implemented sequentially and sequentially with respect to the surface of the said film base material in the said 1 set. Thereby, it is possible to adjust appropriately the drying conditions of the coating material contained in the said linear conductive pattern, and formation of a coating material residual area | region on the outer periphery of a linear conductive pattern is easy. That is, when a wiring board is manufactured by a single wafer manufacturing method, it is common to dry a heating board by heating a specified number of boards together. Therefore, with respect to all the substrates, it is difficult to unify the holding time from the coating completion time in the wiring substrate precursor manufacturing process to the drying process, and it may be difficult to unify the drying conditions. However, it is possible to unify the drying conditions for a plurality of wiring boards formed on the film substrate surface by continuously performing the wiring board precursor manufacturing process and the drying process in the one set of roll-to-roll processes. it can.

  The conductive part forming step carried out in the path for transporting the film base material in the roll-to-roll process can be carried out in accordance with the material and method for forming the base conductive part 2 or the second electrode pattern 22 described above. it can. Similarly, the wiring board precursor manufacturing process can be performed according to the material and method for forming the line-shaped conductive pattern 3 or the second electrode pattern 22. Although the said drying process is not specifically limited, The retraction behavior of a conductive polymer and formation of a coating material residual area | region may be observed in advance for every manufacturing condition, and a drying method and drying conditions may be determined.

In this method, the coating formation can be performed by a screen printing method. At this time, a screen printing plate used in the screen printing method is one in which a line pattern is opened by a plurality of dot-like through holes discretely drilled in a line or a plurality of lines. Can be used. The wiring board of the present invention can be manufactured by forming the line-shaped conductive pattern by leveling and connecting the pastes discharged onto the film substrate through the screen printing plate.
According to this manufacturing method, it is possible to form a thin line-shaped conductive pattern without short-circuiting.

  The present invention is not limited to the above-described embodiment, and includes various modifications and improvements as long as the object of the present invention is achieved.

Example 1
Hereinafter, the present invention will be described in more detail using examples relating to the manufacture of a touch panel sensor sheet including the wiring board of the present invention. In the example described below, each component was formed following the pattern of the first electrode pattern 310, the second electrode pattern 22, and the insulating pattern 340 shown in FIG.

  A roll of a transparent conductive film in which a commercially available silver nanowire material was coated on the entire surface of one side of a PET film as a transparent substrate was prepared. In this example, using a roll of transparent conductive film, all the steps were performed with the above-mentioned one set of roll-to-roll process.

  In the transparent conductive film, a dry film was laminated on the surface coated with silver nanowires. The laminated dry film was subjected to pattern exposure of the first electrode pattern and the second electrode pattern, and pattern development was performed using a developer so as to leave the exposed pattern. Pattern development was carried out by spraying a development surface with an aqueous sodium carbonate solution adjusted to a low concentration. Then, the etching process for removing the unnecessary location in the said transparent conductive film was performed. Furthermore, a caustic soda aqueous solution adjusted to a low concentration is sprayed on the development surface, the dry film on the pattern surface is removed, and the first electrode pattern and the second electrode pattern which is the base conductive portion are formed on one side. A sensor pattern substrate was obtained.

  In the transparent sensor pattern substrate, a transparent insulating pattern was formed at a location where the first electrode pattern and the second electrode pattern intersect. The insulating pattern was formed by screen printing using a screen printing plate having a desired pattern by preparing a highly transparent acrylic resin material-containing paste. The thickness of the insulating pattern was designed to satisfy the external visibility of the touch panel sensor sheet by setting it to 5 μm or less when dried.

  Next, a jumper pattern (corresponding to a line-shaped conductive pattern) on the transparent substrate and straddling the insulating pattern and bridging adjacent second electrode patterns was formed by a screen printing method. For the screen printing method, the following screen printing plate and PEDOT paste were used.

(Screen printing version)
The screen printing plate was designed so that the target finish dimensions of the jumper pattern were 200 μm in width, 800 μm in length, and about 300 nm or less in thickness, and the jumper pattern was made highly transparent. Specifically, a metal mask having a thickness Tm = 20 μm was used as the screen printing plate. A metal squeegee was used for the squeegee. In the screen printing plate, the through-hole pattern 400 of the screen printing plate for one jumper pattern is designed as shown in FIG. That is, in the metal mask, the eight through holes 420 shown in FIG. 6 were provided, the dot diameter Dd was 100 μm, the line pitch Pd was 130 μm, and the width pitch Pw was 60 μm.

(PEDOT paste)
As the ink, a PEDOT paste in which a polyolefin resin as a thickener and ethylene glycol as another additive were mixed with an aqueous dispersion of a PEDOT-PSS mixture was used. The viscosity of the PEDOT paste was adjusted to be 1000 cP when the shear rate was 100 s ⁻¹ and 5500 cP when the shear rate was 10 s ⁻¹ . In addition, all the said viscosity was measured using the rheometer in the measurement environment of 25 degreeC.

Subsequently, the resin film surface on which the jumper pattern was formed as described above was sequentially conveyed to and passed through the drying zone. At this time, the time from the end of jumper pattern formation until entering the drying zone (hereinafter referred to as air passage time) was set to 30 seconds, and the drying zone was set under the condition of passing a temperature environment of 130 ° C. for 300 seconds.
The wiring board obtained as described above was taken as Example 1.

(Examples 2 and 3 and Comparative Examples 1 and 2)
A wiring board was manufactured in the same manner as in Example 1 except that the air passage time was changed to the time shown in the result chart shown in FIG.
In addition, in Examples 1 to 3 and Comparative Examples 1 and 2 described above, 13 samples were manufactured.

(Microscopic observation)
(I) A scanning microscope was used to observe the jumper pattern on the wiring board and the coating material remaining area formed on the outer periphery of the jumper pattern in the range of 500 times to 1500 times.
(Ii) Further, the distance W1 between the outer edges of the remaining area of the coated material facing across the width direction of the jumper pattern and the width dimension W2 on one side of the remaining area of the coated material included between the outer edges are measured, W1 The ratio of W2 to was calculated by the following formula 2. The measurement was performed one by one in one jumper pattern arbitrarily selected from each sample, and the average value of the obtained ratios is shown in FIG.
(Formula 2) Ratio (%) = W2 / (W1 ÷ 2) × 100
(Iii) For each example, an arbitrary one location was selected from each sample, and the ratio of the amount of PEDOT / PSS per unit area in the jumper pattern and the coating material remaining area was analyzed by image processing for a total of 13 locations.

As a result of (i), the shade of shade indicating the presence of PEDOT / PSS was confirmed in the jumper pattern in each example and each comparative example. The dark shadow area is confirmed by the same pattern as the eight through holes in the screen printing plate, and the high density area and the low density area of PEDOT / PSS are repeated in the extension direction of the jumper pattern by this method. Was confirmed.
As a result of (ii), in Examples 1 to 3, the ratio was within 20%. Together with the result of measuring the electrical resistance of the Y electrode described later, it was confirmed that the above-mentioned ratio is within 20%, so that the behavior of PEDOT / PSS retreat after screen printing is suppressed to an appropriate range.
As a result of (iii), the ratio of the amount per unit area of PEDOT / PSS present in the jumper pattern to the amount per unit area of PEDOT / PSS present in the remaining region of the coating is 30:70 to 0: It was confirmed that it was included in the range of 100. As a result, it was confirmed that the remaining region of the coated product was a non-conductive region that was clearly distinguished from the jumper pattern.

(Measurement of electric resistance of Y electrode)
About each Example and each comparative example, the terminal of the tester which measures an electrical resistance was applied to the both ends of Y electrode, and the electrical resistance was measured. Two arbitrary Y electrodes were selected for each sample, and a total of 26 Y electrodes were measured. The line resistance value obtained by the measurement is a threshold value of a predetermined target resistance value, which is shown as an electric resistance value in FIG. Specifically, the average threshold value of the 26 electric resistance values and the variance from the minimum value to the maximum value of the threshold value are shown.

  As a result, it was found that any of the examples in which the behavior of the PEDOT / PSS retraction was suppressed to an appropriate range has a small dispersion of the electric resistance value, and sufficient electric resistance characteristics appropriate for practical use can be obtained. It was. In particular, in Examples 1 and 2, it was confirmed that the average value of the electric resistance value was small, and resistance dispersion was hardly confirmed, and excellent electric characteristics were exhibited. On the other hand, the comparative example had a large average electric resistance value and a wide dispersion range, and was not practically usable.

The above embodiment includes the following technical idea.
(1) A substrate, a base conductive part provided on one surface side of the base, and a line-shaped conductive pattern laminated on the base conductive part, wherein the line-shaped conductive pattern is transparent The conductive polymer is coated, and on the plane of the base material, there is a coating residual region having a smaller density of the conductive polymer than the line-shaped conductive pattern on the outer periphery of the line-shaped conductive pattern, The ratio of the width dimension on one side of the coating material remaining area included between the outer edges to the distance between the outer edges of the coating material remaining area facing the line-shaped conductive pattern across the width direction is 20% or less. A wiring board characterized in that:
(2) The wiring board according to (1), wherein a ratio of the conductive polymer per unit area is 30% or less in the coated material remaining region;
(3) The wiring board according to (1) or (2), wherein in the line-shaped conductive pattern, a ratio of the conductive polymer per unit area is 70% or more;
(4) The wiring board according to any one of (1) to (3), wherein the conductive polymer includes PEDOT;
(5) The wiring board according to any one of (1) to (4), wherein the base conductive portion includes conductive nanowires;
(6) The line-shaped conductive pattern is formed by repeating a high-density conductive polymer region and a low-density conductive polymer region in the extending direction of the line-shaped conductive pattern. The wiring board according to any one of the above;
(7) The wiring board according to any one of (1) to (6), wherein the base conductive portion is an electrode pattern constituting an electrode;
(8) The wiring board according to (7), wherein the plurality of electrode patterns are provided independently of each other, and the line-shaped conductive pattern is bridged between the adjacent electrode patterns;
(9) The wiring substrate according to any one of (1) to (8), wherein the line-shaped conductive pattern has an average thickness of 300 nm or less;
(10) The line-shaped conductive pattern is repeatedly provided with a thick part and a thin part in the extending direction, the maximum thickness of the thick part is 200 nm or more, and the minimum thickness of the thin part is less than 200 nm ( 9) the wiring board according to
(11) A touch panel sensor sheet comprising the wiring board according to any one of (1) to (10) above;
(12) A solar cell electrode substrate comprising the wiring substrate according to any one of (1) to (10) above;
(13) Conducting a conductive part forming step of forming a base conductive part on the surface of the film base using a roll-shaped film base, and then applying a coating material containing a transparent conductive polymer A wiring substrate precursor manufacturing process is performed by forming a line-shaped conductive pattern to be laminated on the base conductive portion by coating with a pattern to manufacture a wiring substrate precursor, and then the wiring substrate precursor in the wiring substrate precursor A roll toe comprising: performing a drying process for drying the coating material, and at least performing the wiring board precursor manufacturing process and the drying process including an unwinding process and a winding process of the film base material A wiring board manufacturing method characterized by being continuously performed in a roll process;
(14) The coating formation is performed by a screen printing method, and the screen printing plate used in the screen printing method has a plurality of dot-like shapes that are discretely perforated in a line or a plurality of lines. The line pattern is formed by opening through a through hole, and the line-shaped conductive pattern is formed by leveling and connecting the pastes discharged on the film substrate through the screen printing plate to each other. (13) The wiring board manufacturing method according to (13).

1: wiring substrate, 2: underlying conductive portion, 3: line-shaped conductive pattern, 4: remaining coating region, 4a: remaining coating region underlying layer, 5: conductive polymer, 21: wiring substrate, 22: first Two electrode pattern, 23: Jumper pattern, 24: Residual area of coating material, 25: High density area of conductive polymer, 26: Low density area of conductive polymer, 27: Conductive nanowire, 30: Transparent substrate, 100: Base Material: 250: Touch panel sensor sheet, 260: Lead wiring, 270: Extraction electrode, 300: First electrode, 310: First electrode pattern, 312: Boundary part, 320: Second electrode, 330: Second electrode, 340: Insulating pattern, 400: Through-hole pattern of screen printing plate, 420: Through-hole

Claims (14)

A substrate;
A base conductive part provided on one surface side of the base material and a line-shaped conductive pattern laminated on the base conductive part,
The line-shaped conductive pattern is coated with a transparent conductive polymer,
On the plane of the substrate, on the outer periphery of the line-shaped conductive pattern, there is a remaining coating region where the density of the conductive polymer is smaller than that of the line-shaped conductive pattern,
The ratio of the width dimension on one side of the coating material remaining area included between the outer edges to the distance between the outer edges of the coating material remaining area facing the line-shaped conductive pattern across the width direction is 20% or less. A wiring board characterized by the above. The wiring board according to claim 1, wherein a ratio of the conductive polymer per unit area is 30% or less in the remaining region of the coated material. The wiring board according to claim 1 or 2, wherein a ratio of the conductive polymer per unit area in the line-shaped conductive pattern is 70% or more. The wiring board according to claim 1, wherein the conductive polymer includes PEDOT. The wiring substrate according to claim 1, wherein the base conductive portion includes a conductive nanowire. 6. The line-shaped conductive pattern is configured by repeating a high-density conductive polymer region and a low-density conductive polymer region in an extending direction of the line-shaped conductive pattern. Wiring board. The wiring substrate according to claim 1, wherein the base conductive portion is an electrode pattern constituting an electrode. The wiring board according to claim 7, wherein the plurality of electrode patterns are provided independently of each other, and the line-shaped conductive patterns are bridged between the adjacent electrode patterns. The wiring board according to claim 1, wherein the line-shaped conductive pattern has an average thickness of 300 nm or less. The line-shaped conductive pattern includes a thick part and a thin part repeatedly in an extending direction, wherein the maximum thickness of the thick part is 200 nm or more and the minimum thickness of the thin part is less than 200 nm. Wiring board. A touch panel sensor sheet comprising the wiring board according to any one of claims 1 to 10. 11. A solar cell electrode substrate comprising the wiring substrate according to any one of claims 1 to 10. Using a roll-shaped film base material, a conductive part forming step for forming a base conductive part on the surface of the film base material is performed, and then a coating material containing a transparent conductive polymer is applied in a desired pattern. Forming a line-shaped conductive pattern to be laminated on the base conductive part by performing a process, and performing a wiring board precursor manufacturing process for manufacturing a wiring board precursor, and then the coating material in the wiring board precursor In a roll-to-roll process in which at least the wiring board precursor manufacturing step and the drying step are performed including an unwinding step and a winding step of the film base material. A method for manufacturing a wiring board, which is performed continuously. The coating formation is performed by a screen printing method,
The screen printing plate used in the screen printing method is formed by opening a line pattern with a plurality of dot-like through holes discretely perforated in a line or a plurality of lines,
The wiring board manufacturing method according to claim 13, wherein the line-shaped conductive patterns are formed by leveling and connecting pastes discharged on the film base via the screen printing plate to each other.

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