JP2014116514A - Light emitting element package and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting element package capable of improving heat radiation performance, and to provide a lighting device.SOLUTION: A light emitting element package 1-1 includes: a box 10 having a metal base 12, a metal lid 11 which faces the metal base, and a translucent frame part 15 having translucency; a light emitting element 30 mounted on the metal base and radiating a laser beam L; and a light guide member 15b integrally formed with the translucent frame part. The light guide member protrudes toward the interior of the body. A tip 15c of the light guide member faces an outgoing part 30c which emits the laser beam of the light emitting element.

Description

  Embodiments described herein relate generally to a light emitting device package and a lighting device.

  Conventionally, there is a light emitting element package (see, for example, Patent Document 1). The light emitting device package is configured by mounting various light emitting devices such as a semiconductor laser in a box made of metal, resin, ceramic, or the like.

JP 2010-251686A

  In a lighting device having a light emitting element package and a light emitting element package, it is desirable that heat generated in the light emitting element can be efficiently dissipated.

  An object of the present invention is to provide a light emitting device package and a lighting device that can improve heat dissipation.

  The light emitting device package of the embodiment includes a box having a metal base, a metal lid facing the metal base, a translucent frame having translucency, and a light emission mounted on the metal base and emitting laser light. An element and a light guide member formed integrally with the translucent frame portion are provided. The light guide member protrudes toward the inside of the box, and the tip of the light guide member faces the emitting portion that emits the laser light of the light emitting element.

  According to the present invention, the heat dissipation of the light emitting device package can be improved.

FIG. 1 is a diagram illustrating a lighting device according to the first embodiment. FIG. 2 is a diagram illustrating an illumination device according to a modification of the first embodiment. FIG. 3 is a diagram illustrating an illumination device according to the second embodiment. FIG. 4 is a diagram showing an example of a light emitting device package that radiates heat from both the metal lid and the metal base. FIG. 5 is a diagram illustrating an example of a conventional light emitting device package.

  Hereinafter, a light emitting device package and a lighting device according to an embodiment will be described in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art or those that are substantially the same.

  A light emitting device package 1-1 according to an embodiment described below includes a metal base 12, a metal lid 11 facing the metal base 12, and a translucent frame portion 15 having translucency, The light-emitting element 30 that is mounted on the metal base 12 and emits the laser light L and the light guide member 15b that is formed integrally with the translucent frame portion 15 are configured. The tip 15c of the light guide member 15b faces the emitting portion 30c that emits the laser light L of the light emitting element 30.

  The light emitting device package 1-1 according to the embodiment described below includes a submount 20, and the light emitting device 30 is mounted on the metal base 12 via the submount 20. The metal base 12 is a flat plate.

  The light emitting device package 1-2 according to the embodiment described below includes an outer light guide member 15d that is formed integrally with the translucent frame portion 15 and protrudes toward the outside of the box body 10, and includes a light emitting device. Laser light L emitted by 30 is emitted through the light guide member 15b and the outer light guide member 15d.

  Further, the light emitting element package 2-1 according to the embodiment described below includes a metal base 12, a metal lid 11 facing the metal base 12, and a light emitting frame portion 16, and a metal base 12. A light-emitting element 30 that is mounted and emits laser light L, and a light guide member 17; the light output frame portion 16 has a through hole 16a; the light guide member 17 is inserted into the through hole 16a; and It is supported by the light output frame portion 16 and protrudes toward the inside of the box body 10, and the tip 17 a of the light guide member 17 faces the emission portion 30 c that emits the laser light L of the light emitting element 30.

  Moreover, the light guide member 17 of the light emitting element package 2-1 according to the embodiment described below further protrudes from the light output frame portion 16 toward the outside of the box body 10.

  Moreover, the illuminating device 1 which concerns on embodiment described below is comprised including the light emitting element package and the fluorescent substance 40, and fluorescent substance by the laser beam L which a light emitting element package radiates | emits via a light guide member. Light 40.

[First Embodiment]
The first embodiment will be described with reference to FIGS. 1 and 5. The present embodiment relates to a light emitting device package and a lighting device. FIG. 1 is a diagram illustrating a lighting device according to the first embodiment.

  The light emitting element package 1-1 shown in FIG. 1 is a so-called Box-package. FIG. 1 shows a cross-sectional view of the light emitting device package 1-1. The box 10 includes a metal lid 11, a metal base 12, a metal frame 13, a glass frame 14, and a translucent frame portion 15. The box 10 has a rectangular parallelepiped shape or a cubic shape, for example. The metal lid 11 and the metal base 12 are each made of metal having conductivity and are flat plates. The metal lid 11 functions as a p-pole, and the metal base 12 functions as an n-pole. One surface of the metal lid 11 and one surface of the metal base 12 face each other. In this specification, the direction in which the metal lid 11 and the metal base 12 face each other is referred to as the “thickness direction” of the light emitting element package 1-1. The direction from the metal base 12 toward the metal lid 11 in the thickness direction is referred to as “top side”, and the direction from the metal lid 11 toward the metal base 12 is referred to as “bottom side”. In FIG. 1, the metal lid 11 is located on the upper side and the metal base 12 is located on the lower side, but the vertical relationship in the state where the metal lid 11 is mounted on the lighting device 1 is not limited to this.

  The metal lid 11 and the metal base 12 are connected by a metal frame 13, a glass frame 14, and a translucent frame portion 15. The metal frame 13 is a metal frame having conductivity and is connected to the metal lid 11. The glass frame 14 is a glass frame and is connected to the metal base 12. The translucent frame portion 15 is a translucent frame, and is made of, for example, glass. The translucent frame portion 15 may be formed integrally with the glass frame 14 or may be a member different from the glass frame 14. The translucent frame portion 15 is connected to the metal base 12. The top ends of the glass frame 14 and the translucent frame 15 are connected to the bottom end of the metal frame 13. That is, the metal frame 13, the glass frame 14, and the translucent frame portion 15 constitute the four side walls of the box 10. The three side walls of the box 10 are composed of a metal frame 13 and a glass frame 14, and the other one side wall, the side wall located on the right side in FIG. 1, is the metal frame 13 and the translucent frame portion 15. It consists of

  A submount 20 is connected to the inner side surface 12 a of the metal base 12. The submount 20 is a flat plate member made of ceramic or the like. The submount 20 is formed of an insulating material and has a conductive layer 20a on the top surface. In the submount 20, the bottom side surface 20 b opposite to the conductive layer 20 a is fixed to the metal base 12. The conductive layer 20 a is connected to the metal base 12 through the bonding wire 22.

  The light emitting element 30 is, for example, a semiconductor laser element (laser diode) whose main component is a compound semiconductor or the like, and emits laser light L by laser oscillation. The light emitting element 30 has electrodes on the front surface 30a and the back surface 30b, respectively. The back surface 30 b of the light emitting element 30 is bonded to the conductive layer 20 a of the submount 20. The electrode on the back surface 30 b of the light emitting element 30 is connected to the metal base 12 as the n-pole through the conductive layer 20 a of the submount 20 and the bonding wire 22. Further, the electrode on the surface 30 a of the light emitting element 30 is connected to the metal frame 13 through the bonding wire 21. The metal frame 13 has a protruding portion 13a protruding toward the inside of the box body 10, and a bonding wire 21 is connected to the protruding portion 13a. Therefore, the electrode on the surface 30 a is connected to the metal lid 11 as the p-pole via the bonding wire 21 and the metal frame 13.

  When a voltage is applied from the electrodes on both sides, the light emitting element 30 emits the laser light L from the emitting portion 30c on one end face. In the present specification, the direction in which the laser light L travels in the optical axis direction of the laser light L, in other words, the direction orthogonal to the end face of the light emitting element 30 having the light emitting portion 30c is referred to as “light emitting direction”. The heat generated in the light emitting element 30 is transmitted to the metal base 12 through the submount 20 and radiated from the outer surface 12 b of the metal base 12.

  Here, in the conventional light emitting device package, the heat radiation is increased in order to suppress the so-called “vignetting” in which the laser light L emitted from the light emitting device 30 hits the metal base 12 or the like and does not come out of the box 10. It was difficult. FIG. 5 is a diagram illustrating an example of a conventional light emitting device package. In the light emitting device package 100 shown in FIG. 5, an offset portion 113 is provided on the metal base 112. The laser light L emitted from the light emitting element 30 includes not only light traveling in the emission direction orthogonal to the emission part 30c but also light traveling in a direction inclined with respect to the emission direction. In order to prevent such oblique light from hitting the inner side surface 112a of the metal base 112, an offset portion 113 is provided so as to separate the emitting portion 30c and the inner side surface 112a in the thickness direction.

  The offset portion 113 is a protruding portion that protrudes from the inner side surface 112a toward the top side. The top side surface 113a of the offset portion 113 is located on the top side with respect to the inner side surface 112a of the metal base 112, in other words, the surface connected to the translucent frame portion 115 of the metal base 112. The submount 20 is connected to the top side surface 113 a of the offset portion 113. By adjusting the amount of protrusion (offset amount) of the offset portion 113 to the top side, vignetting is suppressed.

  However, the provision of the offset portion 113 increases the distance between the light emitting element 30 and the outer surface 112b, which is the heat radiating surface of the metal base 112, and increases the thermal resistance, thereby degrading heat dissipation. Further, the provision of the offset portion 113 increases the size of the box 101 in the thickness direction, and there is a problem that it is difficult to reduce the size of the light emitting element package 100.

  As shown in FIG. 1, the light emitting element package 1-1 according to the present embodiment includes a light guide member 15b. The light guide member 15 b is formed integrally with the translucent frame portion 15. The translucent frame portion 15 and the light guide member 15b have translucency and transmit the laser light L. The light guide member 15b is formed by cutting, for example. The light guide member 15 b protrudes toward the inside of the box body 10. The light guide member 15 b protrudes in the direction opposite to the emission direction from the translucent frame portion 15 toward the emission portion 30 c of the light emitting element 30. The tip 15c of the light guide member 15b faces the emitting portion 30c of the light emitting element 30 in the optical axis direction of the laser light L. The central axis of the light guide member 15b is preferably on the optical axis of the laser light L. The tip 15c of the light guide member 15b is a surface orthogonal to the emission direction. The laser light L emitted from the light emitting element 30 enters the light guide member 15b from the tip 15c.

  The light guide member 15b is a rod-shaped member, and is formed, for example, in a circular cross section. The laser light L travels by being totally reflected inside the light guide member 15b. The refractive index of the light guide member 15b is 1 or more. The refractive index of the shaft core portion of the light guide member 15b is preferably higher than the refractive index of the outer peripheral portion. The light guide member 15b is configured such that laser light L having an angle with respect to the optical axis (see θ in FIG. 5) within a predetermined range can be incident from the tip 15c. For example, the size of the gap in the emission direction between the tip 15c and the emitting portion 30c and the outer diameter of the tip 15c are determined so that laser light L having an angle θ with respect to the optical axis within a predetermined range is incident on the light guide member 15b. ing.

  The laser light L emitted from the light emitting element 30 enters the light guide member 15b from the tip 15c, travels by being totally reflected in the light guide member 15b, and is transmitted from the outer surface 15a of the translucent frame portion 15 to the box 10. Radiated to the outside. The laser light L emitted from the light emitting element package 1-1 strikes the phosphor 40 and excites the phosphor 40 to emit light. The laser light L emitted from the outer surface 15a may be guided to the phosphor 40 by an optical fiber or the like.

  According to the light emitting device package 1-1 of the present embodiment, the laser light L emitted from the light emitting device 30 is prevented from diffusing and hitting the metal base 12 or the like. Therefore, it is possible to reduce the offset amount of the offset (see reference numeral 113 in FIG. 5) for suppressing so-called vignetting, or to make the offset unnecessary. Therefore, the distance between the back surface 30b of the light emitting element 30 and the outer surface 12b of the metal base 12 can be reduced, the thermal resistance can be reduced, and the heat dissipation of the light emitting element package 1-1 can be enhanced. By reducing the temperature of the light emitting element 30 during driving, it is possible to expect an effect of improving efficiency and extending the life of the light emitting element 30. In the light emitting device package 1-1 of this embodiment, the metal base 12 is not provided with an offset, and the metal base 12 has a flat plate shape in which a portion connected to the submount 20 does not protrude. Since it is not necessary to provide an offset, it is possible to reduce the size of the light emitting element package 1-1 in the thickness direction and reduce the size.

  Further, according to the light emitting element package 1-1 of the present embodiment, since the laser light L is totally reflected in the light guide member 15b and proceeds, the diffusion of the laser light L is suppressed and the light transmissive frame portion 15 is reached. Can be made.

[Modification of First Embodiment]
A modification of the first embodiment will be described. FIG. 2 is a diagram illustrating an illumination device according to a modification of the first embodiment. The light emitting device package 1-2 shown in FIG. 2 is different from the light emitting device package 1-1 of the first embodiment in that an outer light guide member 15d is provided.

  The light emitting element package 1-2 includes an outer light guide member 15d that is formed integrally with the translucent frame 15 and protrudes toward the outside of the box 10. Laser light L emitted from the light emitting element 30 is emitted through the light guide member 15b and the outer light guide member 15d. The outer light guide member 15d transmits the laser light L similarly to the light guide member 15b. The outer light guide member 15d is a rod-like member, and is formed, for example, in a circular cross section. The outer light guide member 15d desirably has a refractive index of 1 or more, like the light guide member 15b. In the outer light guide member 15d, it is preferable that the refractive index of the axial portion is higher than the refractive index of the outer peripheral portion.

  In this modification, the light guide member 15b and the outer light guide member 15d are arranged coaxially. A part of the laser light L that travels in the light guide member 15b and enters the light-transmitting frame portion 15 enters the outer light guide member 15d, travels in the outer light guide member 15d, and reaches the tip 15e of the outer light guide member 15d. Radiated from. According to the light emitting device package 1-2 of this modification, since the laser light L is totally reflected and travels inside the outer light guide member 15d, diffusion of the laser light L is suppressed and the laser light L is guided to the phosphor 40. be able to.

[Second Embodiment]
A second embodiment will be described with reference to FIG. About 2nd Embodiment and subsequent embodiment, the component which has the same function as what was demonstrated in the said 1st Embodiment is attached | subjected to the same code | symbol, and the overlapping description is abbreviate | omitted. FIG. 3 is a diagram illustrating an illumination device according to the second embodiment. The light emitting element package 2-1 according to the present embodiment is different from the light emitting element packages 1-1 and 1-2 in that the light guide member 17 is a member different from the light output frame portion 16. .

  The light emission frame portion 16 is a plate-like member and has translucency. The light outgoing frame portion 16 has a through hole 16 a that communicates the inside and the outside of the box 10. The light guide member 17 is a rod-shaped member having translucency, and transmits the laser light L. The cross-sectional shape of the light guide member 17 is, for example, a circle. The refractive index of the light guide member 17 is 1 or more, and the refractive index of the shaft core portion is higher than the refractive index of the outer peripheral portion. The light guide member 17 is supported by the light output frame portion 16 via the holder 18. The holder 18 is made of metal such as Kovar or nickel formed by electroforming, for example, and has a cylindrical main body 18a and a flange portion 18b. The flange portion 18b is provided at one end of the main body 18a in the axial direction. The holder 18 has a through hole 18c penetrating the main body 18a and the flange portion 18b in the axial direction. The light guide member 17 is inserted into the through hole 18 c of the holder 18 and fixed to the holder 18. The space between the holder 18 and the light guide member 17 is hermetically sealed. The light guide member 17 protrudes on both sides in the axial direction with respect to the holder 18.

  The holder 18 has a main body 18 a inserted from the outside of the box 10 into the through hole 16 a of the light output frame portion 16, and the light exit frame portion 16 is in contact with the outer surface 16 b of the light output frame portion 16. It is fixed. The space between the holder 18 and the light output frame portion 16 is hermetically sealed. The light guide member 17 has a tip 17 a on one end side that protrudes toward the inside of the box 10 from the inner side surface 16 c of the light output frame portion 16. The distal end 17 a of the light guide member 17 faces the emitting portion 30 c of the light emitting element 30 in the optical axis direction of the laser light L. The central axis of the light guide member 17 is preferably on the optical axis of the laser light L. The tip 17a is a surface orthogonal to the optical axis direction. In addition, the light guide member 17 has a distal end 17 b on the other end side that protrudes toward the outside of the box body 10 from the outer surface 16 b of the light output frame portion 16. The light guide member 17 is configured such that laser light L having an angle with respect to the optical axis within a predetermined range can be incident from the tip 17a.

  The laser light L emitted from the light emitting element 30 enters the light guide member 17 from the tip 17a, proceeds while being totally reflected in the light guide member 17, and is emitted from the tip 17b protruding to the outside of the box body 10. The laser light L emitted from the tip 17b hits the phosphor 40 and excites the phosphor 40 to emit light. The laser light L emitted from the tip 17b may be guided to the phosphor 40 by an optical fiber or the like.

  The light emitting element package 2-1 according to the second embodiment has the effect of reducing the offset amount or making the offset unnecessary, and the heat dissipation of the light emitting element 30 as in the light emitting element packages 1-1 and 1-2. The effect which raises the property can be expected.

  The light emitting element package 2-1 according to the second embodiment can guide the laser light L to the outside of the box 10 while suppressing diffusion of the laser light L emitted from the light emitting element 30. Therefore, it is easy to send the laser light L to a place away from the light emitting element package 2-1. The light emitting element package 2-1 according to the second embodiment has an advantage that the light output frame portion 16 and the light guide member 17 are easy to process because the light output frame portion 16 and the light guide member 17 are separate members. Have. For example, a general-purpose optical fiber may be used as the light guide member 17. Further, the processing for the light output frame portion 16 may be an easy drilling process.

  In the light emitting element package 2-1 of the present embodiment, the light output frame portion 16 has a light transmitting property and transmits the laser light L. Instead, the light output frame portion 16 has a light transmitting property. It may be a light-shielding material having no properties. The laser light L can be guided to the outside of the box 10 by the light guide member 17.

[Modifications of the above embodiments]
A modification of the first embodiment and the second embodiment will be described. In the light emitting element packages 1-1, 1-2, and 2-1 of the above embodiments and modifications, the heat generated in the light emitting element 30 is radiated through the metal base 12, but instead, the light emitting element The heat generated at 30 may be dissipated through both the metal lid 11 and the metal base 12. FIG. 4 is a diagram showing an example of a light emitting device package that radiates heat from both the metal lid and the metal base. In FIG. 4, in the light emitting device package 1-1 according to the first embodiment, the configuration is changed so that the heat generated in the light emitting device 30 is dissipated through both the metal lid 51 and the metal base 52. is there.

  The box 50 of the light emitting device package 3-1 shown in FIG. 4 can dissipate heat from both the metal lid 51 and the metal base 52. The metal lid 51 and the metal base 52 are connected by a glass frame 53 and a translucent frame portion 54. The top side surface 60 a of the submount 60 is connected to the inner side surface 51 b of the metal lid 51. The surface 30 a of the light emitting element 30 is bonded to the bottom side surface 60 b of the submount 60. The submount 60 has conductivity, and the electrode on the surface 30 a of the light emitting element 30 is electrically connected to the metal lid 51 as a p-pole via the submount 60. The submount 20 connected to the inner side surface 52a of the metal base 52 has conductivity. The back surface 30 b of the light emitting element 30 is bonded to the top side surface 20 a of the submount 20. The electrode on the back surface 30 b of the light emitting element 30 is electrically connected to the metal base 52 as the n-pole via the submount 20.

  The translucent frame portion 54 is provided with a light guide member 54b. The light guide member 54b can be the same as the light guide member 15b of the first embodiment. The laser light L enters the light guide member 54b from the tip 54a and is emitted from the outer surface 54c of the translucent frame portion 54. Heat generated in the light emitting element 30 is transmitted to the metal base 52 through the submount 20 and is radiated from the outer surface 52b. The heat generated in the light emitting element 30 is transmitted to the metal lid 51 through the submount 60 and is radiated from the outer surface 51a.

  According to the light emitting element package 3-1 according to this modification, heat can be radiated from both the top and bottom surfaces 51a and 52b, and the heat dissipation is excellent. Note that the structure for dissipating heat from both the top and bottom sides may be applied to the light emitting device package 1-2 according to the modification of the first embodiment and the light emitting device package 2-1 according to the second embodiment. Good.

  The contents disclosed in each of the above embodiments and modifications can be executed in appropriate combination.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

1-1, 1-2, 2-1, 3-1 Light-emitting element package 1 Illumination device 10 Box 11 Metal lid 12 Metal base 15 Translucent frame portion 15b Light guide member 15c Tip 16 Light exit frame portion 16a Through-hole 17 Light guide member 18 Holder 20 Submount 30 Light emitting element 30c Emission part 40 Phosphor

Claims (6)

A box having a metal base, a metal lid facing the metal base, and a translucent frame having translucency;
A light emitting device mounted on the metal base and emitting laser light;
A light guide member formed integrally with the translucent frame portion;
The light guide member protrudes toward the inside of the box,
A light emitting element package, wherein a tip of the light guide member is opposed to an emission part that emits laser light of the light emitting element. A box having a metal base, a metal lid facing the metal base, and a frame;
A light emitting device mounted on the metal base and emitting laser light;
A light guide member;
With
The frame portion has a through hole;
The light guide member is inserted into the through hole and supported by the frame portion and protrudes toward the inside of the box,
A light emitting element package, wherein a tip of the light guide member is opposed to an emission part that emits laser light of the light emitting element. Furthermore, an outer light guide member that is integrally formed with the translucent frame and protrudes toward the outside of the box,
The light emitting element package according to claim 1, wherein the laser light emitted from the light emitting element is emitted through the light guide member and the outer light guide member. The light emitting element package according to claim 2, wherein the light guide member further protrudes from the frame portion toward the outside of the box. In addition, with a submount,
The light emitting element is mounted on the metal base via the submount,
The light emitting device package according to claim 1, wherein the metal base is a flat plate. The light emitting device package according to any one of claims 1 to 5,
A phosphor,
An illuminating device that causes the phosphor to emit light by laser light emitted from the light emitting element package through the light guide member.

Images