JP2014113658A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device in which a chuck table is easily positioned.SOLUTION: A cutting device 1 includes a chuck table 10, cutting means 20 of cutting a workpiece held on the chuck table 10, and guide light irradiation means 30. The chuck table 10 is held detachably by a chuck table base 15 while fitted to the chuck table base 15. The guide light irradiation means 30 irradiates the chuck table 10 held by the chuck table base 15 with guide light. The chuck table 10 has a mark M to be irradiated with the guide light in the center of its top surface 12a. The mark M is aligned with the guide light when the chuck table 10 is fitted to the chuck table base 15 and the chuck table 10 is thereby guided to a position for fitting to the chuck table base 15.

Description

  The present invention relates to a processing apparatus having a chuck table.

  A dicing saw, a grinder, a laser processing apparatus, and the like perform various types of processing by holding a workpiece such as a wafer on a chuck table. The chuck table is appropriately replaced in accordance with the size of the workpiece and processing conditions (for example, see Patent Document 1).

JP 2008-078424 A

  In recent years, when the diameter of workpieces such as wafers has increased and the chuck table has become larger, the entire chuck table cannot be captured visually at a glance, and the center of the chuck table and the center of the chuck table base are aligned sensuously. Therefore, it is difficult to place the chuck table on the chuck table base. Further, as the diameter of a workpiece such as a wafer increases, the weight of the chuck table also increases, so that the fine adjustment operation itself for positioning the chuck table with respect to the chuck table base becomes difficult.

  The present invention has been made in view of the above, and an object of the present invention is to provide a processing apparatus that enables easy alignment of a chuck table.

  In order to solve the above-described problems and achieve the object, a processing apparatus according to the present invention holds a workpiece on a holding surface and engages the chuck with a chuck table base on a surface opposite to the holding surface. A processing apparatus comprising: a chuck table detachably held on a table base; and a processing means for processing the workpiece held on the chuck table, the chuck held on the chuck table base Guide light irradiating means for irradiating guide light, which is visible light, at a predetermined position of the table, and the chuck table is a mark means at a position where the guide light is irradiated when held on the chuck table base When the chuck table is fitted to the chuck table base, the mark means of the chuck table is matched with the guide light so that the chuck table is Characterized in that it is guided to the table base and the fitting is positioned.

  In the processing apparatus of the present invention, it is preferable that the guide light is applied to a rotation center of the chuck table mounted on the chuck table base.

  Therefore, in the processing apparatus according to the present invention, the guide light applied to the chuck table when mounted on the chuck table base is matched with the mark means provided at the position where the guide light of the chuck table is illuminated. The chuck table can be guided to a position where it is fitted to the chuck table base. Therefore, the chuck table can be easily aligned.

FIG. 1 is a perspective view illustrating an outline of a configuration example of a cutting apparatus according to the first embodiment. FIG. 2 is a perspective view schematically illustrating a chuck table and guide light irradiation means of the cutting apparatus according to the first embodiment. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a perspective view illustrating a state in which the chuck table of the cutting apparatus according to the first embodiment is attached to the chuck table base. FIG. 5 is a cross-sectional view illustrating a state in which the chuck table of the cutting apparatus according to the second embodiment is attached to the chuck table base. FIG. 6 is a perspective view illustrating a state in which the chuck table of the cutting apparatus according to the third embodiment is attached to the chuck table base.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
A cutting apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view illustrating an outline of a configuration example of a cutting apparatus according to the first embodiment. FIG. 2 is a perspective view schematically illustrating a chuck table and guide light irradiation means of the cutting apparatus according to the first embodiment. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a perspective view illustrating a state in which the chuck table of the cutting apparatus according to the first embodiment is attached to the chuck table base.

  A cutting apparatus 1 (corresponding to a processing apparatus) according to Embodiment 1 includes at least a cutting means 20 (corresponding to a processing means) having a cutting blade 21 and a chuck table 10 holding a workpiece (not shown). The workpiece is cut (corresponding to machining) by moving these relative to each other. As shown in FIG. 1, the cutting apparatus 1 includes the cutting means 20, the chuck table 10, and guide light irradiation means 30 (corresponding to guide means) that emits guide light GL (shown by a one-dot chain line in FIG. 2 and the like) ) And control means. Further, the cutting apparatus 1 includes an X-axis moving means (not shown) for cutting and feeding the chuck table 10 in the X-axis direction, and a Y-axis moving means (for moving the chuck table 10 and the cutting means 20 relative to each other in the Y-axis direction). And Z-axis moving means (not shown) for relatively moving the chuck table 10 and the cutting means 20 in the Z-axis direction.

  Here, the workpiece is a plate-like workpiece to be machined by the cutting apparatus 1. In the first embodiment, a disk-like semiconductor wafer having a plurality of devices partitioned by division lines that are orthogonal to each other, It is an optical device wafer. The workpiece is divided into individual devices by causing the cutting apparatus 1 to relatively move the chuck table 10 and the cutting means 20 having the cutting blade 21 to perform cutting on the planned dividing line. In the present invention, the workpiece may be a resin package substrate, a glass plate, or a polycrystalline silicon substrate having a plurality of devices partitioned by the division lines.

  As shown in FIG. 1, the cutting means 20 is disposed in the cutting region PR (corresponding to the processing region) of the apparatus body 2 and supplies the cutting fluid to the workpiece held on the chuck table 10 while cutting the cutting region. Cutting is performed in PR. The cutting means 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving means with respect to the workpiece held on the chuck table 10, and is also provided to be movable in the Z-axis direction by the Z-axis moving means. ing. The cutting means 20 is an ultra-thin cutting grindstone having a substantially ring shape and is rotated by a spindle (not shown) to cut a workpiece, and a workpiece held by the chuck table 10. A cutting fluid nozzle 22 for supplying a cutting fluid to the workpiece is included.

  The chuck table 10 holds the workpiece by transferring the workpiece before cutting by a conveying means (not shown) in the carry-in / out region TR of the apparatus main body 2. As shown in FIGS. 2 and 3, the chuck table 10 includes a table main body 11 formed in a thick disc shape and made of a metal such as stainless steel, and provided at the center of the upper surface of the table main body 11 and porous ceramic. And a suction portion 12 that sucks and holds a workpiece on a surface 12a (corresponding to a holding surface). As shown in FIG. 4, a circular fitting recess 13 is provided in the center of the bottom surface 11 a (corresponding to the surface opposite to the holding surface) of the table body 11, and the fitting recess 13 is provided in the table body 11. A suction path 14 is provided that communicates with the suction portion 12.

  The chuck table 10 is installed in the apparatus main body 2 by fitting with the chuck table base 15 at the bottom surface 11 a of the table main body 11. The chuck table 10 is detachably held on the chuck table base 15.

  The chuck table base 15 is provided so as to be movable in the X-axis direction with respect to the apparatus main body 2 by the X-axis moving means, and the workpiece held by the chuck table 10 is transferred into the loading / unloading region TR and the cutting region PR. It is conveyed over. Further, the chuck table base 15 is rotatably provided around a central axis (parallel to the Z axis) by a rotation drive source (not shown), and the workpiece held on the chuck table 10 is cut into the cutting region PR. In FIG. In the apparatus main body 2, an openable / closable shutter 3 that partitions the carry-in / out area TR and the cutting area PR is provided.

  As shown in FIGS. 3 and 4, the chuck table base 15 is formed in a cylindrical shape and is made of a metal such as stainless steel. An annular suction groove 16 and an annular seal member 17 (corresponding to a fitting convex portion) are provided on the upper surface 15a of the chuck table base 15 on which the chuck table 10 is placed. The suction groove 16 has an inner diameter larger than the outer diameter of the seal member 17, and the suction groove 16 and the seal member 17 are arranged coaxially. The seal member 17 is made of a synthetic resin having elasticity. When the outer diameter of the seal member 17 is formed to be equal to the inner diameter of the fitting recess 13, and the chuck table 10 is placed on the upper surface 15 a of the chuck table base 15, the seal member 17 is placed in the fitting recess 13. Invade and mate. The seal member 17 is fitted into the fitting recess 13, and the chuck table 10 is fitted to the chuck table base 15. When the seal member 17 is fitted into the fitting recess 13, the space inside the seal member 17 communicates with the suction path 14.

  Further, in the chuck table base 15, as shown in FIG. 3, a table suction path 18 for connecting the suction groove 16 and a vacuum suction source (not shown), the inside of the seal member 17, and a vacuum suction (not shown). A workpiece suction path 19 for connecting the source is provided.

  The chuck table 10 is placed on the surface 12 a of the suction portion 12 by being sucked from a vacuum suction source through the suction path 14, the space inside the seal member 17, and the workpiece suction path 19. Suck and hold the workpiece. Further, the chuck table 10 is sucked and held on the chuck table base 15 by being sucked from the vacuum suction source via the table suction suction path 18 and fixed.

  Further, when the chuck table 10 is held on the chuck table base 15 located in the carry-in / out region TR, a mark M (corresponding to the mark means) is provided at a position where the guide light GL is irradiated from the guide light irradiation means 30. Have. In the first embodiment, the mark M is provided at the center of the surface 12 a of the suction portion 12 of the chuck table 10, that is, at the rotation center of the chuck table 10, and has a circular planar shape. The mark M is obtained by marking such that a part of the surface 12a of the suction portion 12 of the chuck table 10 is colored. The color and shape of the mark M may be changed as appropriate.

  The guide light irradiation means 30 irradiates guide light GL, which is visible light, to the center (corresponding to a predetermined position) of the surface 12 a of the suction portion 12 of the chuck table 10 held on the chuck table base 15. That is, the guide light GL is applied to the rotation center of the chuck table 10 mounted on the chuck table base 15. In the first embodiment, the guide light irradiation means 30 is attached to the apparatus main body 2, is held by the chuck table base 15, and is located above the chuck table 10 positioned in the loading / unloading region TR and along the Z-axis direction. Are arranged at positions facing the mark M. In the first embodiment, the diameter of the spot irradiated by the guide light irradiation unit 30 is substantially equal to the diameter of the mark M. The guide light irradiation means 30 may irradiate the guide light GL of various wavelengths as long as it is visible light and does not remove a part of the surface 12a of the suction portion 12 of the chuck table 10. The guide light irradiation means 30 preferably irradiates an eye safe laser as the guide light GL.

  The control means controls the above-described components constituting the cutting device 1 to cause the cutting device 1 to perform a machining operation on the workpiece. The control means is composed mainly of an arithmetic processing unit composed of, for example, a CPU, a microprocessor (not shown) provided with a ROM, a RAM, etc., and a display means (not shown) for displaying the state of the machining operation or an operator It is connected to an operating means (not shown) used when registering processing content information and the like.

  Next, the machining operation of the cutting device 1 according to the first embodiment will be described. When the operator registers the machining content information in the control means and receives an instruction to start the machining operation from the operator, the cutting device 1 starts the machining operation. In the machining operation, the control unit conveys the workpiece before cutting to the chuck table 10 by the conveyance unit, and sucks and holds the workpiece on the chuck table 10.

  Next, the control means moves the chuck table 10 from the loading / unloading area TR toward the cutting area PR by the X-axis movement means, performs alignment based on the information of the image captured by the imaging means, Based on the information, the workpiece is cut along the division line while supplying the cutting fluid, and the workpiece is divided. When cutting is performed on all the division lines, the control unit moves the chuck table 10 from the cutting region PR toward the carry-in / out region TR by the X-axis moving unit.

  Then, when the chuck table 10 is located in the carry-in / out area TR, the control means stops the X-axis moving means, stops the suction of the chuck table 10, and then loads the workpiece after cutting by the carrying means. After taking out from the chuck table 10 of the TR, the workpiece before cutting is placed on the chuck table 10.

  Next, an exchange operation for exchanging the chuck table 10 of the cutting apparatus 1 according to the first embodiment will be described. When there is an instruction to start the exchange operation from the operator, the exchange operation is started. In the exchange operation, when the chuck table 10 is located in the cutting region PR, the control unit causes the X-axis moving unit to move the chuck table 10 toward the loading / unloading region TR so that the chuck table 10 is loaded / unloading region. When located at TR, the X-axis moving means is stopped. When the chuck table 10 is positioned in the carry-in / out region TR, the control means stops the vacuum suction source and releases the fixation of the chuck table 10 to the chuck table base 15. Further, the control means irradiates the guide light GL from the guide light irradiation means 30. In the first embodiment, the operator removes the chuck table 10 from the chuck table base 15 by extending his / her hand from the maintenance space K on the front side in FIG.

  Next, when fitting the new chuck table 10 to the chuck table base 15, the operator inserts the new chuck table 10 between the chuck table base 15 and the guide light irradiation means 30. Then, as shown in FIG. 4, the guide light GL is irradiated on the surface 12a of the chuck table 10, and a spot of the guide light GL is formed. Then, the operator moves the chuck table 10 so that the mark M on the surface 12a of the chuck table 10 matches the guide light GL. Then, the operator places the chuck table 10 on the chuck table base 15. Then, the chuck table 10 is moved to a position where the chuck table 10 is fitted to the chuck table base 15 due to its own weight or the like, that is, a position where the seal member 17 enters and fits into the fitting recess 13. Guided. Then, the seal member 17 enters and fits into the fitting recess 13, and the chuck table 10 is fitted to the chuck table base 15. Thus, by making the mark M of the chuck table 10 coincide with the guide light GL, the chuck table 10 is guided to a position where it is fitted to the chuck table base 15 by the operator. When the operator gives an instruction to end the replacement operation, the control means operates the vacuum suction source to fix the chuck table 10 to the chuck table base 15 and guide light GL from the guide light irradiation means 30. Stop irradiation.

  As described above, according to the cutting device 1 according to the first embodiment, when the chuck table 10 is fitted to the chuck table base 15 in the carry-in / out region TR, the mark M is provided at the position where the guide light GL is irradiated. doing. For this purpose, when the chuck table 10 is fitted to the chuck table base 15, the guide light GL irradiated to the chuck table 10 and the mark M of the chuck table 10 are matched with each other so that the chuck table 10 is moved to the chuck table 10. The guide can be guided to a position where it is fitted to the base 15, and the chuck table 10 can be easily fitted to the chuck table base 15.

  Therefore, according to the cutting apparatus 1, even when the diameter of the workpiece is increased, the alignment of the chuck table 10 can be easily performed by matching the guide light GL with the mark M. The cutting apparatus 1 according to Embodiment 1 is particularly effective for easily aligning the chuck table 10 that holds a workpiece having an outer diameter of 450 mm or more.

  Moreover, according to the cutting apparatus 1 which concerns on Embodiment 1, the guide light irradiation means 30 is arrange | positioned in the position facing the mark M in the Z-axis direction. Therefore, even if the chuck table 10 is positioned at any height between the guide light irradiation means 30 and the chuck table base 15, the chuck table 10 is made to match the guide light GL and the mark M, thereby It is possible to guide to a position where the base 15 is fitted.

[Embodiment 2]
Next, the cutting device which concerns on Embodiment 2 of this invention is demonstrated based on drawing. FIG. 5 is a cross-sectional view illustrating a state in which the chuck table of the cutting apparatus according to the second embodiment is attached to the chuck table base. In FIG. 5, the same parts as those of the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.

  In the second embodiment, as shown in FIG. 5, the guide light irradiation means 30 emits the guide light GL from the diagonally upper side of the chuck table 10 fitted to the chuck table base 15 positioned in the carry-in / out area TR. Is disposed at a position where the mark M is irradiated. In the second embodiment, the guide light irradiation means 30 is disposed at a position where the guide light GL is irradiated from obliquely above the chuck table 10 from the back side to the front side of the maintenance space K. Thus, the guide light GL irradiated by the guide light irradiation means 30 intersects the Z-axis direction. Also in the second embodiment, as in the first embodiment, the mark M is provided at the center of the surface 12a of the suction portion 12 of the chuck table 10 and has a circular planar shape.

  Also in the second embodiment, when fitting the chuck table 10 to the chuck table base 15, the operator matches the mark M on the surface 12 a of the chuck table 10 with the guide light GL so that the chuck table 10 is moved to the chuck table 10. It is placed on the base 15 and the chuck table 10 is fitted to the chuck table base 15.

  According to the cutting device 1 according to the second embodiment, the chuck table 10 can be easily aligned even when the diameter of the workpiece is increased, as in the first embodiment. This is effective for easily aligning the chuck table 10 holding a workpiece of 450 mm or more.

  Further, according to the cutting apparatus 1 according to the second embodiment, the guide light irradiation means 30 is disposed at a position where the guide light GL is irradiated from obliquely above the chuck table 10 from the rear side to the front side of the maintenance space K. ing. For this reason, it is possible to prevent the guide light GL from being blocked by an operator who replaces the chuck table 10.

[Embodiment 3]
Next, the cutting device which concerns on Embodiment 3 of this invention is demonstrated based on drawing. FIG. 6 is a perspective view illustrating a state in which the chuck table of the cutting apparatus according to the third embodiment is attached to the chuck table base. In FIG. 6, the same parts as those of the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.

  In the third embodiment, as shown in FIG. 6, two or more guide light irradiation means 30 are provided, and the mark M is the guide light from the guide light irradiation means 30 on the outer edge portion of the table body 11 of the chuck table 10. Two, that is, a plurality of GLs are provided at positions where the GLs are respectively irradiated. The two marks M are equal in distance from the center of the surface 12a of the suction portion 12 of the chuck table 10. When the chuck table 10 is fitted to the chuck table base 15, the guide light irradiation means 30 is disposed at a position facing the mark M in the Z-axis direction.

  Also in the third embodiment, when the chuck table 10 is fitted to the chuck table base 15, the operator matches the mark M on the outer edge of the table body 11 of the chuck table 10 with the guide light GL, and 10 is placed on the chuck table base 15, and the chuck table 10 is fitted to the chuck table base 15.

  According to the cutting device 1 according to the third embodiment, as in the first embodiment, the chuck table 10 can be easily aligned even when the diameter of the workpiece is increased. This is effective for easily aligning the chuck table 10 holding a workpiece of 450 mm or more. Furthermore, according to the cutting device 1 according to the third embodiment, as in the first embodiment, even if the chuck table 10 is positioned at any height between the guide light irradiation means 30 and the chuck table base 15, the guide By matching the light GL with the mark M, the chuck table 10 can be guided to a position where the chuck table 10 is fitted to the chuck table base 15. This is also very effective when the mounting direction of the chuck table 10 is determined.

  In the first to third embodiments described above, the cutting apparatus 1 includes the chuck table 10 and the cutting means 20. However, the processing apparatus of the present invention includes a cassette elevator that accommodates a workpiece before and after processing, temporary placement means for temporarily placing the workpiece before and after processing, and cleaning that cleans the workpiece after processing. Means and the like may be further provided. Moreover, in this invention, it can apply not only to the cutting device 1, but various processing apparatuses, such as a laser processing apparatus, a grinding apparatus, and a polishing apparatus, for example.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.

1 Cutting equipment (processing equipment)
10 Chuck table 11a Bottom surface (surface opposite to the holding surface)
12a Surface (holding surface)
15 chuck table base 20 cutting means (processing means)
30 Guide light irradiation means (guide means)
GL guide light M Marking (marking means)

Claims (2)

A chuck table that holds a workpiece on a holding surface and is detachably held on the chuck table base while being fitted to the chuck table base on a surface opposite to the holding surface;
A processing device comprising processing means for processing the workpiece held on the chuck table,
A guide light irradiation means for irradiating a predetermined position of the chuck table held by the chuck table base with guide light that is visible light;
The chuck table has mark means at a position where the guide light is irradiated when held on the chuck table base.
When the chuck table is fitted to the chuck table base, the mark means of the chuck table is matched with the guide light to guide the chuck table to a position where the chuck table is fitted to the chuck table base. Processing equipment.   The processing apparatus according to claim 1, wherein the guide light is applied to a rotation center of the chuck table mounted on the chuck table base.

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