JP2014112132A - Ic tag having binding band - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC tag having a binding band, in which a binding band and an RFID tag (IC tag) are integrated, that is, a binding band is provided with a tag part, allowing easy and inexpensive manufacture of the IC tag having a binding band in which the tag part is hard to be removed and which is easy to handle, and enabling communication even if an object to be bound is metallic.SOLUTION: An IC tag having a binding band includes: a binding band having a thin, elongated and flexible band part (1) and a binding part (2) provided on one end side of the band part and to which the other end side of the band part is fixed; and an inlay (5) being a component equipped with an antenna part arranged on the other end side of the binding part and configured to communicate information with an IC chip storing information. The inlay is embedded inside the insulation resin forming the binding band by insert molding.

Description

  The present invention relates to an IC tag in which a tag portion is provided on a binding band, and more particularly to an IC tag with a binding band that is difficult to remove and can be easily handled.

In the logistics industry, metal circulation logistics materials are often used, and IC tags are often used as a management method.
IC tags used in RFID systems that communicate using radio waves are susceptible to metal interference. For metal circulation materials, special IC tags using special structures and materials are used, or dedicated attachments are used. Parts were needed. However, the IC tag that can be used for metal has a problem that the price is higher than that of a general IC tag, and a load is imposed on attachment by a stopper or adhesive. In addition, when a dedicated mounting part is used, there is a problem in that an additional cost for manufacturing the part is required.

  In an RFID system, data is stored in an IC tag affixed to a product or the like, and the identification and information of the product or the like are automatically recognized and managed by updating with an RFID reader / writer or reader wirelessly. . This RFID system is being widely adopted in manufacturing, sales, distribution, or lending services, etc. to detect the location of an IC tag-attached object or a person, information such as an ID, and manage the movement of the information. The IC (RFID) tag has an arbitrary shape such as a label type, a coin type, a sheet type, and a stick type, and is used according to the application.

The RFID tag as described above needs to be attached to a corresponding product, and various types of attachment structures have been developed. Conventionally, for example, Patent Document 1 includes a data carrier that enables a large amount of information to be recorded by attaching a data carrier corresponding to an RFID tag to a binding band (bundling band) for bundling and fixing cables. Bundling bands have been proposed.
This bundled band with a data carrier is configured by providing a bundled band formed by forming a bundling portion at the end of a flexible elongated band, and a holding body for holding a rod-shaped data carrier. The band and the holding body are integrally formed of resin, and the data carrier is inserted and held in the holding body.

However, the bundled band has a disadvantage that a large gap is likely to occur during attachment because the tag is fixed to the bundling portion. In addition, the RFID tag is inserted into a cylindrical holding part integrally formed with the band and fixed or sealed with an adhesive or resin, so if there is a dimensional error between the tag and the holding part, vibration will occur. Due to this, there was a case where the rattling of the tag occurred in the holding part.
Further, in an environment where there is a temperature change, rattling of the tag also occurs in the holding unit due to a difference in thermal expansion between the tag and the holding unit. Furthermore, since the case-shaped holding portion, the portion where the tag is attached becomes large, making it difficult to save space and reduce size.

  With respect to this problem, in Patent Document 2, a band part (22) that is elongated and has flexibility and a bundling part (23) that is provided on one end side of the band part and to which the other end side of the band part is fixed. A binding band (24) comprising: a rod-shaped RFID tag body (25) disposed in close contact with the band portion; and the RFID tag body covered with the band portion in close contact with each other to be in a contracted state There has been proposed a tag (21) with a fixture including a heat-shrinkable tube (26), wherein the RFID tag main body is spaced apart from the binding portion (see FIG. 8).

In this tag with an attachment, since the RFID tag is attached using a heat shrinkable tube, the RFID tag is disposed in the middle of the band. Therefore, when the object to be bound is a metal, there arises a problem that the RFID tag cannot communicate.
In addition, there is another problem that it takes time to attach the RFID tag using the heat shrinkable tube.

  Further, in Patent Document 3, a tag band in which an RFID tag and a binding band are integrated in a tag band in which an RFID tag and a binding band head are integrated is as follows. Proposed.

  That is, the tag band (31) is an RFID including, for example, an IC chip (32) in which information data related to a distribution product is recorded and an antenna (33) for exchanging (communication) information data with an external device. It is comprised from resin (36) couple | bonded in order to make a tag (34) and a binding band (35) the same goods (integrate) (refer FIG. 7).

However, in the resin (36), in order to firmly connect the binding band (35) and the RFID tag (34), it is not essential that the resin is used. For example, as shown in FIG. It does not define anything related to the join method.
Here, the specific method of this integration is not described, and it can be read from the description attached to the existing binding band, but the IC tag is firmly integrated into the existing binding band without using a special method. It is difficult to realize.

  Therefore, by attaching an RFID tag to the binding band, forgery can be prevented by making it impossible to reuse, for example, an RFID tag containing production area information data even if the binding band is changed to another alternative. There are still challenges in terms of easily realizing the effect.

JP 2004-112886 A JP 2008-33706 A JP 2008-292639 A

  As described above, the problem to be solved in the present invention is that it is difficult to remove the tag part and handle the IC tag in which the binding band and the RFID tag (IC tag) are integrated, and the tag part is provided in the binding band. It is an object to provide an IC tag with a binding band that can easily and inexpensively manufacture an IC tag with a binding band and can communicate even if the binding object is a metal.

The invention according to claim 1 of the present invention for solving the above-mentioned problems is
An elongated and flexible band part, a bundling part provided on one end side of the band part and fixed to the other end side of the band part, and a bundling part end opposite to the band part An IC tag with a binding band configured to include a tag portion, and at least a part of the IC tag with a binding band formed by injection molding of an insulating resin,
The tag part is configured by incorporating an inlay into the insulating resin by insert molding the inlay into the insulating resin,
The inlay includes an IC chip and an antenna unit.
This is an IC tag with a binding band.

  The invention according to claim 2 of the present invention is characterized in that the band insertion portion of the bundling portion has a height of 3.5 mm or more and a thickness of 1 mm or more around the insertion portion. It is an IC tag with a binding band of description.

  The invention according to claim 3 of the present invention is the IC tag with a binding band according to claim 1 or 2, wherein an electronic component other than an IC chip for an IC tag is incorporated.

  According to a fourth aspect of the present invention, the IC tag IC chip part is in the tag part, and a part of the circuit from the IC tag IC chip is formed in the band part. The IC tag with a binding band according to any one of items 1 to 3.

  The invention according to claim 5 of the present invention is characterized in that the substrate of the inlay incorporated in the binding band is a polyimide film, and the IC chip for IC tag and the antenna are mounted by solder connection. 5. An IC tag with a binding band according to any one of items 1 to 4.

Bundling that the IC chip for tags, antennas, etc. are integrally formed on the tag part of the IC tag with a binding band by integral molding by insert molding so that the IC chip etc. cannot be easily removed and used secondary It can be an IC tag with a band.
By integrally molding the inlay into an insulating resin for forming a binding band by insert molding, an IC tag with a binding band that can be easily manufactured in a simple process and can be handled easily.

  Further, since the tag part of the IC tag with a binding band is on the opposite side away from the band part via the binding part, the antenna on the inlay arranged in the tag part even when installed on a metal pipe or the like Since the distance from the metal pipe surface can be kept in a state, communication is possible. For this reason, it becomes possible to use it for various objects including metal such as logistics equipment such as metal basket cars.

  Furthermore, when the band is inserted, the band insertion part of the binding part to be locked is 3.5 mm or more in height with a locking part corresponding to the protruding part such as a claw on the surface of the band and a recessed part such as a groove. By providing a thickness of 1 mm or more around the insertion portion, the binding band does not rotate when attached to the square member, and the reading position can be fixed and stable communication can be ensured.

  As an electronic component other than the IC chip for the IC tag, for example, an IC tag with a binding band in which a microcomputer, a battery, a sensor component, and the like are incorporated can further enhance the function. The sensor parts are arranged in the tag part or the band part. When the sensor parts are provided in the band part, they are closer to the object to be bound and the relative movement is reduced, so that more stable sensing is possible. When the sensor component is arranged in the tag portion, the instability due to shaking becomes large.

Further, it is possible to prevent unauthorized use by disconnecting the circuit when the band is cut by extending the wiring of the circuit from the tag part to the band part.
If all the antennas of a tag are arranged in the tag and another circuit is arranged in the band part, the tag can be used even if the band part is cut, but it can be understood that it has been cut.

Furthermore, when a sensor is provided at the end of the circuit wiring extending from the tag part to the band part,
Since the IC chip is outside the band part and the circuit is also wired inside the band, various functions can be mounted in addition to the sensor for detecting disconnection.
For example, sensors that detect the number of pulls, temperature sensors, acceleration sensors, and so on. Alternatively, by extending the antenna to the band, the tag can no longer be used when the band is cut, preventing unauthorized use and reuse.

Schematic of an example of an IC tag with a binding band of the present invention. (A) A binding band in which an inlay is built into an insulating resin by insert molding (cross-sectional schematic diagram before insert molding). (B) A binding band in which the inlay is built into the insulating resin by insert molding (cross-sectional schematic diagram after insert molding). Schematic of an example of an IC tag with a binding band of the present invention. (A) Enlarged cross-sectional view after insert molding. (B) Upper surface enlarged view after insert molding. Schematic of an example of an IC tag with a binding band of the present invention. Schematic of an example of an IC tag with a binding band of the present invention. Example of incorporating electronic components other than IC chip for IC tag (A). Schematic of an example of an IC tag with a binding band of the present invention. Example of incorporating electronic components other than IC chip for IC tag (B: Example of IC tag with sensor). The example from the schematic IC chip of an example of an IC tag with a binding band of the present invention. Schematic of an example of a conventional IC tag with a binding band Schematic of an example of a conventional IC tag with a binding band

An example of an embodiment of an IC tag with a binding band of the present invention will be described below with reference to the drawings as necessary.
FIG. 1 is a schematic view of an example of an IC tag with a binding band of the present invention, and FIG. 1A is a schematic cross-sectional view of a binding band in which an inlay is built into an insulating resin by insert molding before insert molding. (B) is a schematic sectional view after insert molding. 2A and 2B are schematic views of an example of an IC tag with a binding band according to the present invention. FIG. 2A is an enlarged cross-sectional view after insert molding, and FIG. 2B is an enlarged top view after insert molding. FIG. 3 is a schematic view of an example of an IC tag with a binding band according to the present invention.

  The IC tag with a binding band of the present invention is elongated and has a flexible band part (1), and is provided on one end side of the band part (1), and the other end side of the band part (1) is fixed. And an antenna part (8) for exchanging information with an IC tag IC chip (7) for holding information provided on the other end of the binding part (2). An IC tag with a binding band, wherein the inlay (5) includes a tag portion (3) incorporated by insert molding into an insulating resin forming a binding band.

1A includes a band part (1), a binding part (2), and a tag part (3) formed by primary molding such as injection molding of an insulating resin of an IC tag with a binding band of the present invention. The cross-sectional schematic before the binding band base material, the IC chip for IC tag (7), and the inlay (5) provided with the antenna portion (8) are incorporated into the insulating resin by insert molding is shown.
FIG. 1 (B) includes the above-described binding band base material including a band portion (1), a binding portion (2), and a tag portion (3), an IC tag IC chip (7), and an antenna portion (8). Moreover, the cross-sectional schematic which became the IC tag with a binding band by incorporating the above-mentioned inlay (5) by insert molding (secondary molding) is shown.

  The binding band base material is formed of a band-shaped synthetic resin material (polyethylene, polystyrene, polyamide, etc.) having elasticity having a predetermined length and width according to the application. This band equipment can be locked and fixed when inserted into the bundling part (2) between the tip part and the taper part provided in a slightly bent state on the other end side. And a hook portion.

The bundling portion (2) has a substantially rectangular shape formed so as to protrude to the front surface side of the band portion (1), and is formed with a bundling portion hole (4) that is inserted and locked from the back side of the band portion. ing. A locking claw or the like is formed in the binding portion hole (4).
On the surface side of the band portion (1), there are formed a plurality of locking projections extending linearly in the width direction and arranged in the longitudinal direction. These locking protrusions are locked by the locking claw when the band (1) is inserted into the bundling hole (4) so that it cannot move in the direction opposite to the insertion direction. 1) is fixed to the binding part (2).

  FIG. 2A shows an enlarged cross-sectional view of the IC tag with a binding band of the present invention. The inlay (5) is formed by being sealed in the region of the tag portion (3) by insert molding of an insulating resin to constitute an IC tag with a binding band. The height (d) of the band insertion portion of the binding portion around the binding portion hole (4) shown in FIG. 2A and the binding portion hole peripheral width (W1), (W2) shown in FIG. ) Is preferably 3.5 mm or more, 1 mm or more, and 1 mm or more. Within this size range, the binding band does not rotate when attached to the square bar, and the reading position can be fixed to ensure stable communication.

  FIG. 3 shows a schematic view of an example of an IC tag with a binding band according to the present invention as viewed from the upper surface. The IC tag with a binding band according to this embodiment includes a band part (1) that is elongated and has flexibility, and is provided on one end side of the band part (1), and the other end side of the band part (1) is A binding part (2) fixed in the binding part hole (4) and an IC tag IC chip (7) for holding information provided on the other end side of the binding part (2) are mounted to exchange information. An inlay (5), which is a component including a base material (6) on which an antenna portion (8) is formed, includes a tag portion (3) that is built into an insulating resin forming a binding band by insert molding. It is an IC tag with a binding band.

  The inlay (5) shown in FIG. 3 is obtained by etching or punching a conductive foil formed in an insulating sheet made of an insulating resin such as polyethylene terephthalate (PET) or polyimide in a predetermined pattern, or an insulating sheet. A resonant circuit composed of the antenna (8) and the capacitor is formed by screen printing or vapor-depositing a conductive material in a predetermined pattern. Next, it can be formed by mounting an IC tag IC chip (7) on this resonant circuit.

Thus, the IC tag cannot be taken out by incorporating the inlet into the resin by insert molding.
In addition, since the tag portion of the IC tag is on the side away from the band portion, even when installed on a metal pipe or the like, communication is possible because the antenna is away from the metal, so that it can be used with a metal basket.

As an example of an IC tag with a binding band of the present invention, in FIG. 4, an electronic component (9) other than an IC tag for an IC tag is built in a tag part (3), and a circuit (10 ) Is extended.
As described above, the wiring of the circuit (10) is extended from the tag part (3) to the band part (1), thereby making it possible to prevent unauthorized use by disconnecting when the band is cut.
All tag antennas should be placed in the tag (3) and another circuit (10) placed in the band part (1) so that the tag can be used even if the band part is cut, but that the tag has been cut off. I can do it.

In FIG. 5, as an example of the IC tag with a binding band of the present invention, a microcomputer (11), a battery (14), a sensor component (12), etc. are incorporated as electronic components other than the IC tag IC chip (7). The case of an IC tag with a binding band is shown.
The sensor part (12) is arranged in the band part (1) and is closer to the object to be bound than the case where it is provided in the tag part (3), and the relative movement is reduced, so that more stable sensing is possible. Become. When the sensor component is arranged in the tag portion, the instability due to shaking becomes large.

  Further, as shown in FIG. 6, it is possible to prevent unauthorized use by disconnecting the band (1) by cutting the wiring of the circuit (13) from the tag (3) to the band (1). It becomes. As in the case of FIG. 5, if the tag antennas are all placed in the tag and another circuit is placed in the band part, the tag can be used even if the band part is cut, but it can be understood that it has been cut. I can do it.

Further, as shown in FIG. 5, when the sensor (12) is provided at the tip of the circuit wiring extending from the tag part (3) to the band part (1), the IC tag IC chip (7) is attached to the outside of the band part (1). Since the circuit is also wired in the band, the sensor (12) can be equipped with various functions in addition to the sensor for detecting disconnection.
For example, a sensor that detects the number of pulls, a temperature sensor, an acceleration sensor, and the like. Alternatively, although not shown, the tag antenna (8) is extended to the band part (1) so that the tag can no longer be used when the band is cut, thereby preventing unauthorized use and reuse. is there.

  As described above, according to the IC tag with a binding band of the present invention, it is difficult to remove the tag portion or the like regarding the IC tag in which the binding band and the RFID tag (IC tag) are integrated and the tag portion is provided in the binding band. In addition, it is possible to easily and inexpensively manufacture an IC tag with a binding band that is easy to handle, and to provide an IC tag with a binding band that can communicate even if the binding object is a metal.

  The present invention can be used not only for logistics management in a wide range including metal, which has been difficult with conventional pasting-type tags such as use for metal car carts, but also for simple electronic seals and sensors. As a tag, it can also be applied in the field of high security tags, and can be expanded to other general-purpose products.

DESCRIPTION OF SYMBOLS 1 ... Band part 2 ... Bundling part 3 ... Tag part 4 ... Bundling part hole 5 ... Inlay 6 ... Base material 7 ... IC tag IC chip 8 ... Antenna 9 ... Electronic component 10 ... Circuit 11 ... Microcomputer 12 ... Sensor component 13 ... Circuit 14 ... Battery 21 ... Fixed tag 22 ... Band part 23 ... Bundling part 24 ... Bundling band 25 ... RFID tag body 26 ... Heat-shrinkable tube 31 ... Tag band 32 ... IC chip 33 ... Antenna 34 ... RFID tag 35 ... Bundling Band 36 ... Resin d ... Band insertion part height W1 of the binding part ... Binding part hole peripheral width W2 ... Binding part hole peripheral width

Claims (5)

An elongated and flexible band part, a bundling part provided on one end side of the band part and fixed to the other end side of the band part, and a bundling part end opposite to the band part An IC tag with a binding band configured to include a tag portion, and at least a part of the IC tag with a binding band formed by injection molding of an insulating resin,
The tag part is configured by incorporating an inlay into the insulating resin by insert molding the inlay into the insulating resin,
The inlay includes an IC chip and an antenna unit.
An IC tag with a binding band characterized by the above.   The IC tag with a binding band according to claim 1, wherein the band insertion portion of the binding portion has a height of 3.5 mm or more and a thickness of 1 mm or more around the insertion portion.   The IC tag with a binding band according to claim 1 or 2, wherein an electronic component other than the IC chip for the IC tag is incorporated.   The binding band according to any one of claims 1 to 3, wherein an IC chip for an IC tag is in a tag portion, and a part of a circuit from the IC tag for IC tag is formed in the band portion. IC tag with.   The IC with a binding band according to any one of claims 1 to 4, wherein the base material of the inlay incorporated in the binding band is a polyimide film, and the mounting of the IC chip and the antenna is a solder connection. tag.