JP2014102388A - Light source device - Google Patents

Light source device Download PDF

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JP2014102388A
JP2014102388A JP2012254443A JP2012254443A JP2014102388A JP 2014102388 A JP2014102388 A JP 2014102388A JP 2012254443 A JP2012254443 A JP 2012254443A JP 2012254443 A JP2012254443 A JP 2012254443A JP 2014102388 A JP2014102388 A JP 2014102388A
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light
emitting element
incident end
light emitting
source device
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Satoru Horioka
悟 堀岡
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Nikkiso Co Ltd
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Nikkiso Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a light source device improved in an optical coupling efficiency between a light-emitting element and a light guide part with a simpler structure.SOLUTION: A light source device 100 comprises: a light-emitting element 12 including a light-extracting surface 14a; a light guide part 40 including an incident end face 56 facing the light-extracting surface 14a and receiving light emitted by the light-emitting element 12, and an emission end face 58 emitting light received by the incident end face 56; and an optical coupling part 70 including liquid in contact with both the light-extracting surface 14a and the incident end face 56. The liquid is held in a region between the light-extracting surface 14a and the incident end face 56 by a surface tension acting between the light-extracting surface 14a and the incident end face 56. The light-emitting element 12 is a light-emitting diode emitting UV light, and the optical coupling part 70 is fluorine-based oil. The light source device 100 further comprises a heat radiation part 30 dissipating heat generated by light emission of the light-emitting element 12.

Description

本発明は、光源装置に関し、特に、導光部との光結合構造を有する光源装置に関する。   The present invention relates to a light source device, and more particularly to a light source device having an optical coupling structure with a light guide unit.

光源装置として、ＬＥＤ（Light Emitting Diode）やＬＤ（Laser Diode）などの発光素子から出力される光を、光ファイバの一端から入射し、光ファイバにより導光された光を出射させる装置がある。このような光ファイバを利用した光源装置は、光ファイバの出射端の位置を変えるだけで光の照射位置を変えられることから、例えば、スポット照射用の光源として用いられる。   As a light source device, there is a device that makes light output from a light emitting element such as an LED (Light Emitting Diode) or an LD (Laser Diode) enter from one end of an optical fiber and emit light guided by the optical fiber. Such a light source device using an optical fiber can be used, for example, as a light source for spot irradiation, because the irradiation position of light can be changed only by changing the position of the emission end of the optical fiber.

発光素子から出力される光を効率的に光ファイバの出射端へ導くためには、入射端における光結合効率を上げることが重要である。発光素子から出力される光を効率的に光ファイバのコア部へカップリングさせる技術として、発光素子と光ファイバの入射端面の間を所定の屈折率を有する樹脂材料で充填するとともに、光ファイバと発光素子の光軸とが一致するように固定する光結合機構が挙げられる（特許文献１、２参照）。   In order to efficiently guide the light output from the light emitting element to the exit end of the optical fiber, it is important to increase the optical coupling efficiency at the entrance end. As a technique for efficiently coupling the light output from the light emitting element to the core portion of the optical fiber, the gap between the light emitting element and the incident end face of the optical fiber is filled with a resin material having a predetermined refractive index, and the optical fiber Examples thereof include an optical coupling mechanism that fixes the light emitting elements so that the optical axes thereof coincide with each other (see Patent Documents 1 and 2).

特開２０１０−２８６７７８号公報JP 2010-286778 A 特開２０１１−４８３７１号公報JP 2011-48371 A

光ファイバを利用した光源装置の場合、用途に応じて材質や直径などが異なる光ファイバに取り替えて使用することがある。このとき、光源装置に用いる光ファイバが容易に脱着可能であるとともに、より簡素な構造で光ファイバと発光素子との結合効率を高められることが望ましい。   In the case of a light source device using an optical fiber, it may be used by replacing it with an optical fiber having a different material or diameter depending on the application. At this time, it is desirable that the optical fiber used for the light source device can be easily detached and the coupling efficiency between the optical fiber and the light emitting element can be increased with a simpler structure.

本発明はこうした課題に鑑みてなされたものであり、より簡素な構造で、発光素子と導光部との間の光結合効率を高めた光源装置の提供にある。   The present invention has been made in view of these problems, and provides a light source device that has a simpler structure and has improved optical coupling efficiency between a light emitting element and a light guide.

上記課題を解決するために、本発明のある態様の光源装置は、光取出面を有する発光素子と、光取出面に対向し発光素子が発する光が入射する入射端面と、入射端面から入射した光が出射される出射端面と、を有する導光部と、光取出面および入射端面の双方に接触する液体を含む光結合部と、を備える。   In order to solve the above-described problems, a light source device according to an aspect of the present invention includes a light emitting element having a light extraction surface, an incident end surface that is opposed to the light extraction surface and on which light emitted from the light emitting element is incident, and is incident from the incident end surface And a light coupling unit including a liquid that comes into contact with both the light extraction surface and the incident end surface.

上記態様の光源装置によれば、光取出面および入射端面の双方に接触する液体があることで、その間が空気である場合と比較して光取出面および入射端面における屈折率差を低減させ、発光素子と導光部との間の光結合効率を向上させることができる。したがって、液体による光結合部を設けた簡素な構造により、光結合効率を高めることができる。また、光取出面と入射端面との間が液体により光結合されているため、光ファイバを容易に脱着することもできる。   According to the light source device of the above aspect, because there is a liquid in contact with both the light extraction surface and the incident end surface, the difference in refractive index between the light extraction surface and the incident end surface is reduced as compared with the case where the space is air. The optical coupling efficiency between the light emitting element and the light guide unit can be improved. Therefore, the light coupling efficiency can be increased by a simple structure provided with the liquid light coupling portion. Further, since the light extraction surface and the incident end surface are optically coupled by the liquid, the optical fiber can be easily detached.

上記態様の光源装置において、液体は、光取出面および入射端面との間に作用する表面張力により、当該光取出面と当該入射端面との間の領域に保持されてもよい。   In the light source device of the above aspect, the liquid may be held in a region between the light extraction surface and the incident end surface by surface tension acting between the light extraction surface and the incident end surface.

上記態様の光源装置において、液体は、常圧での沸点が１００℃を超える有機化合物を含んでもよい。   In the light source device of the above aspect, the liquid may include an organic compound having a boiling point of greater than 100 ° C. at normal pressure.

上記態様の光源装置において、発光素子は、紫外光を発する発光ダイオードであり、液体は、フッ素系オイルであってもよい。   In the light source device of the above aspect, the light emitting element may be a light emitting diode that emits ultraviolet light, and the liquid may be fluorine oil.

上記態様の光源装置において、発光素子が発光する際に発する熱を放熱させる放熱部をさらに備えてもよい。   The light source device of the above aspect may further include a heat radiating portion that radiates heat generated when the light emitting element emits light.

本発明の光源装置によれば、より簡素な構造で、発光素子と導光部との間の光結合効率を高めることができる。   According to the light source device of the present invention, the optical coupling efficiency between the light emitting element and the light guide unit can be increased with a simpler structure.

実施形態に係る光源装置を示す図である。It is a figure which shows the light source device which concerns on embodiment. 図１の光結合部の周辺を示す拡大図である。It is an enlarged view which shows the periphery of the optical coupling part of FIG. 光結合部による光結合効率の向上を示す図である。It is a figure which shows the improvement of the optical coupling efficiency by an optical coupling part.

以下、本発明の実施の形態を図面を参照して説明する。なお、すべての図面において、同様な構成要素には同様の符号を付し、適宜説明を省略する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

図１は、実施形態に係る光源装置１００を示す。光源装置１００は、発光素子１２が発する光を光結合部７０を介して光ファイバ５０の入射端面５６から入射させ、反対側の出射端面５８から出射させる。光源装置１００は、光ファイバの出射端の位置を変えるだけで光の照射位置を変えられることができ、スポット照射用の光源として用いることができる。発光素子１２として紫外光を発光するＬＥＤを利用することで、光源装置１００は、紫外光による殺菌処理や、紫外光硬化樹脂の樹脂硬化などの紫外光光源として用いることができる。   FIG. 1 shows a light source device 100 according to an embodiment. The light source device 100 causes the light emitted from the light emitting element 12 to enter from the incident end face 56 of the optical fiber 50 via the optical coupling portion 70 and to emit from the opposite exit end face 58. The light source device 100 can change the light irradiation position simply by changing the position of the emission end of the optical fiber, and can be used as a light source for spot irradiation. By using an LED that emits ultraviolet light as the light emitting element 12, the light source device 100 can be used as an ultraviolet light source such as sterilization treatment by ultraviolet light or resin curing of an ultraviolet light curable resin.

光源装置１００は、発光部１０と、放熱部３０と、導光部４０と、光結合部７０と、制御部８０を備える。制御部８０は、発光部１０及び放熱部３０と電気的に接続されており、これらの動作を制御する。   The light source device 100 includes a light emitting unit 10, a heat radiating unit 30, a light guide unit 40, an optical coupling unit 70, and a control unit 80. The control unit 80 is electrically connected to the light emitting unit 10 and the heat radiating unit 30 and controls these operations.

発光部１０は、発光素子１２と、支持基板２２と、保持部材２４を備える。発光素子１２は、支持基板２２に固定され、制御部８０から供給される電力により光を発する。発光素子１２は、中心波長又はピーク波長が約２００ｎｍ〜３６０ｎｍの波長帯域に含まれる紫外光を照射するＬＥＤチップであり、半導体層として窒化アルミニウムガリウム（ＡｌＧａＮ）が用いられる。発光素子１２が発する紫外光は、支持基板２２に固定される側とは反対側の光取出面１４ａから出射される。   The light emitting unit 10 includes a light emitting element 12, a support substrate 22, and a holding member 24. The light emitting element 12 is fixed to the support substrate 22 and emits light by electric power supplied from the control unit 80. The light emitting element 12 is an LED chip that irradiates ultraviolet light included in a wavelength band having a center wavelength or peak wavelength of about 200 nm to 360 nm, and aluminum gallium nitride (AlGaN) is used as a semiconductor layer. The ultraviolet light emitted from the light emitting element 12 is emitted from the light extraction surface 14 a opposite to the side fixed to the support substrate 22.

図２は、光結合部７０の周辺を示す拡大図である。本図に示すように、発光素子１２は、ベース基板１４と、第１半導体層１６と、発光層１７と、第２半導体層１８と、第１電極２０と、第２電極２１を備える。発光素子１２は、支持基板２２側に設けられる第１電極２０及び第２電極２１を介して電流が供給されることにより発光層１７が発光し、発した光はベース基板１４の光取出面１４ａから出射される。   FIG. 2 is an enlarged view showing the periphery of the optical coupling unit 70. As shown in the figure, the light emitting element 12 includes a base substrate 14, a first semiconductor layer 16, a light emitting layer 17, a second semiconductor layer 18, a first electrode 20, and a second electrode 21. In the light emitting element 12, the light emitting layer 17 emits light when current is supplied through the first electrode 20 and the second electrode 21 provided on the support substrate 22 side, and the emitted light is emitted from the light extraction surface 14 a of the base substrate 14. It is emitted from.

ベース基板１４は、第１半導体層１６、発光層１７及び第２半導体層１８を支持する基板層であり、発光層１７が発光する光が出射される光取出面１４ａを有する。ベース基板１４は、サファイア（Ａｌ２Ｏ３）結晶基板であり、光取出面１４ａと反対側の面に第１半導体層１６、発光層１７、第２半導体層１８が順に成膜される。なお、ベース基板１４と第１半導体層１６の間に窒化アルミニウム（ＡｌＮ）を含むバッファ層等が設けられてもよい。 The base substrate 14 is a substrate layer that supports the first semiconductor layer 16, the light emitting layer 17, and the second semiconductor layer 18, and has a light extraction surface 14 a from which light emitted from the light emitting layer 17 is emitted. The base substrate 14 is a sapphire (Al 2 O 3 ) crystal substrate, and a first semiconductor layer 16, a light emitting layer 17, and a second semiconductor layer 18 are sequentially formed on a surface opposite to the light extraction surface 14 a. Note that a buffer layer or the like containing aluminum nitride (AlN) may be provided between the base substrate 14 and the first semiconductor layer 16.

第１半導体層１６、発光層１７及び第２半導体層１８は、ＡｌＧａＮ系の半導体層であり、第１半導体層１６をｎ型半導体、第２半導体層１８をｐ型半導体とし、その間に発光層１７を形成することで量子井戸構造やダブルへテロ構造等が形成される。第１半導体層１６と第２半導体層１８にはそれぞれ電極が接合されており、第１半導体層１６にはカソードとなる第１電極２０、第２半導体層１８にはアノードとなる第２電極２１が接合される。第１電極２０と第２電極２１は、支持基板２２に固定され、支持基板２２を介して制御部８０と電気的に接続される。   The first semiconductor layer 16, the light emitting layer 17, and the second semiconductor layer 18 are AlGaN-based semiconductor layers, and the first semiconductor layer 16 is an n-type semiconductor, the second semiconductor layer 18 is a p-type semiconductor, and the light emitting layer therebetween. By forming 17, a quantum well structure, a double hetero structure, or the like is formed. Electrodes are joined to the first semiconductor layer 16 and the second semiconductor layer 18 respectively. The first semiconductor layer 16 has a first electrode 20 serving as a cathode, and the second semiconductor layer 18 has a second electrode 21 serving as an anode. Are joined. The first electrode 20 and the second electrode 21 are fixed to the support substrate 22 and electrically connected to the control unit 80 via the support substrate 22.

図１に戻り、支持基板２２は、矩形の板状部材であり、発光素子１２を支持するとともに、発光素子１２が発光する際に生じる熱を放熱部３０に伝達する。支持基板２２は、例えば、樹脂やセラミックスなどを基材とするプリント基板であり、発光素子１２の第１電極２０及び第２電極２１と制御部８０を接続するための配線部を有する。支持基板２２の表面２２ａには、中心部に発光素子１２が密着して固定され、周辺部に導光部４０を保持する保持部材２４が固定される。また裏面２２ｂには、放熱部３０が密着して固定される。   Returning to FIG. 1, the support substrate 22 is a rectangular plate-like member, supports the light emitting element 12, and transmits heat generated when the light emitting element 12 emits light to the heat radiating unit 30. The support substrate 22 is, for example, a printed circuit board that uses a resin, ceramics, or the like as a base material, and includes a wiring unit for connecting the first electrode 20 and the second electrode 21 of the light emitting element 12 and the control unit 80. On the surface 22 a of the support substrate 22, the light emitting element 12 is fixed in close contact with the central portion, and the holding member 24 that holds the light guide portion 40 is fixed on the peripheral portion. In addition, the heat radiating portion 30 is fixed in close contact with the back surface 22b.

保持部材２４は、発光素子１２と導光部４０が所定の位置関係を維持した状態で導光部４０を着脱可能に保持する部材である。保持部材２４は、凹部２６を有する略直方体であり、アルミニウムなどの金属や樹脂等で成形される。凹部２６の底部には、保持部材２４を貫通する円筒形状の取付孔２８が設けられており、後述するファイバコネクタ４２が取付孔２８に挿入されることにより導光部４０が保持される。   The holding member 24 is a member that detachably holds the light guide unit 40 in a state where the light emitting element 12 and the light guide unit 40 maintain a predetermined positional relationship. The holding member 24 is a substantially rectangular parallelepiped having a recess 26, and is formed of a metal such as aluminum, a resin, or the like. A cylindrical attachment hole 28 penetrating the holding member 24 is provided at the bottom of the recess 26, and a light guide 40 is held by inserting a fiber connector 42 described later into the attachment hole 28.

保持部材２４は、凹部２６が支持基板２２上の発光素子１２を覆うように支持基板２２に固定される。このとき取付孔２８は、取付孔２８に導光部４０を挿入すると、導光部４０の入射端面５６が発光素子１２の光取出面１４ａと対向する位置関係となるように設けられる。これにより保持部材２４は、発光素子１２の光取出面１４ａと導光部４０の入射端面５６が所定の間隔をおいて対向した状態で導光部４０を保持する。このときの光取出面１４ａと入射端面５６の所定の間隔は、例えば０．１〜１ｍｍ程度である。このとき、保持部材２４は、光取出面１４ａと入射端面５６が略平行となる位置関係で保持するが、これらの面が厳密な意味で平行となるように保持する必要はない。   The holding member 24 is fixed to the support substrate 22 such that the recess 26 covers the light emitting element 12 on the support substrate 22. At this time, when the light guide 40 is inserted into the mounting hole 28, the attachment hole 28 is provided so that the incident end face 56 of the light guide 40 faces the light extraction surface 14 a of the light emitting element 12. Accordingly, the holding member 24 holds the light guide unit 40 in a state where the light extraction surface 14a of the light emitting element 12 and the incident end surface 56 of the light guide unit 40 face each other with a predetermined interval. The predetermined space | interval of the light extraction surface 14a and the incident end surface 56 at this time is about 0.1-1 mm, for example. At this time, the holding member 24 holds the light extraction surface 14a and the incident end surface 56 in a positional relationship in which the light extraction surface 14a and the incident end surface 56 are substantially parallel to each other, but it is not necessary to hold these surfaces in a strict sense.

放熱部３０は、ペルチェ素子３２と、ヒートシンク３４と、放熱ファン３６を備える。ペルチェ素子３２は、支持基板２２に密着して固定され、所定の直流電流を流すことで一方の面が吸熱し、他方の面が発熱する。ペルチェ素子３２は、吸熱する面が支持基板２２の裏面２２ｂ側、放熱する面がヒートシンク３４側となるように設けられる。これにより、支持基板２２を介して発光素子１２の放熱をする。ヒートシンク３４は、ペルチェ素子３２の発熱面に密着して固定され、ペルチェ素子３２が発する熱を放熱する。放熱ファン３６は、ヒートシンク３４に当たる空気の流れを発生させ、ヒートシンク３４の放熱を促す。なお、ペルチェ素子３２及び放熱ファン３６は、制御部８０によりその動作が制御される。   The heat dissipation unit 30 includes a Peltier element 32, a heat sink 34, and a heat dissipation fan 36. The Peltier element 32 is fixed in close contact with the support substrate 22, and when a predetermined direct current flows, one surface absorbs heat and the other surface generates heat. The Peltier element 32 is provided such that the surface that absorbs heat is on the back surface 22b side of the support substrate 22 and the surface that dissipates heat is on the heat sink 34 side. Thereby, the light emitting element 12 is radiated through the support substrate 22. The heat sink 34 is fixed in close contact with the heat generating surface of the Peltier element 32 and radiates heat generated by the Peltier element 32. The heat radiating fan 36 generates a flow of air that strikes the heat sink 34 and promotes heat dissipation of the heat sink 34. The operations of the Peltier element 32 and the heat radiating fan 36 are controlled by the control unit 80.

導光部４０は、ファイバコネクタ４２と光ファイバ５０を備える。ファイバコネクタ４２は、挿入部４４と、係止部４６と、挿通孔４８を備える。挿入部４４は、取付孔２８の形状に対応した円柱形状の部材であり、導光部４０を発光部１０に取り付ける際に取付孔２８に挿入される。係止部４６は、取付孔２８に挿入部４４を挿入した状態で保持部材２４に係止される。挿通孔４８は、円柱形状の挿入部４４の軸方向にファイバコネクタ４２を貫通して設けられ、光ファイバ５０が挿通される。挿通孔４８は、挿通される光ファイバ５０を入射端面５６が挿通孔４８から所定の長さだけ飛び出した位置で固定する。この固定位置は、ファイバコネクタ４２を取付孔２８に挿入したときに入射端面５６と光取出面１４ａとが所定の間隔となる位置である。   The light guide 40 includes a fiber connector 42 and an optical fiber 50. The fiber connector 42 includes an insertion portion 44, a locking portion 46, and an insertion hole 48. The insertion portion 44 is a cylindrical member corresponding to the shape of the attachment hole 28, and is inserted into the attachment hole 28 when attaching the light guide portion 40 to the light emitting portion 10. The locking portion 46 is locked to the holding member 24 in a state where the insertion portion 44 is inserted into the mounting hole 28. The insertion hole 48 is provided through the fiber connector 42 in the axial direction of the cylindrical insertion portion 44, and the optical fiber 50 is inserted therethrough. The insertion hole 48 fixes the optical fiber 50 to be inserted at a position where the incident end face 56 protrudes from the insertion hole 48 by a predetermined length. This fixed position is a position where the incident end face 56 and the light extraction surface 14a are at a predetermined interval when the fiber connector 42 is inserted into the mounting hole 28.

光ファイバ５０は、入射端面５６から入射した光を反対側の出射端面５８から出射する導光部材であり、図２に示すようにコア部５２とクラッド部５４を有する。光ファイバ５０は、ファイバコネクタ４２および保持部材２４により、入射端面５６が光取出面１４ａと所定の間隔で対向する位置で固定される。なお、光ファイバ５０は、発光素子１２が発する紫外光の透過率が高い石英（ＳｉＯ２）を材質とするものが望ましい。 The optical fiber 50 is a light guide member that emits light incident from the incident end face 56 from the opposite exit end face 58, and has a core portion 52 and a clad portion 54 as shown in FIG. The optical fiber 50 is fixed by the fiber connector 42 and the holding member 24 at a position where the incident end face 56 faces the light extraction surface 14a at a predetermined interval. The optical fiber 50 is preferably made of quartz (SiO 2 ) having a high transmittance for ultraviolet light emitted from the light emitting element 12.

光結合部７０は、光取出面１４ａと入射端面５６の間の領域に設けられる液体であり、光取出面１４ａおよび入射端面５６における屈折率差を緩和するために設けられる。光結合部７０として用いられる液体は、光取出面１４ａおよび入射端面５６との間に作用する表面張力により、光取出面１４ａと入射端面５６との間の領域に保持される。光結合部７０は、入射端面５６に微量の液体を付着させた導光部４０を発光部１０に装着することにより形成することができる。ファイバコネクタ４２を取付孔２８に挿入すると、入射端面５６と光取出面１４ａの間隔が０．１〜１ｍｍ程度となるため、入射端面５６に表面張力で付着した液体が光取出面１４ａにも接触することとなり光結合部７０が形成される。   The optical coupling unit 70 is a liquid provided in a region between the light extraction surface 14 a and the incident end surface 56, and is provided to alleviate the refractive index difference between the light extraction surface 14 a and the incident end surface 56. The liquid used as the optical coupling portion 70 is held in a region between the light extraction surface 14 a and the incident end surface 56 due to surface tension acting between the light extraction surface 14 a and the incident end surface 56. The optical coupling unit 70 can be formed by mounting the light guide unit 40 with a small amount of liquid attached to the incident end face 56 to the light emitting unit 10. When the fiber connector 42 is inserted into the mounting hole 28, the distance between the incident end face 56 and the light extraction surface 14a is about 0.1 to 1 mm, so that the liquid adhering to the incident end face 56 due to surface tension also contacts the light extraction surface 14a. As a result, the optical coupling portion 70 is formed.

光結合部７０は、光取出面１４ａを有するベース基板１４と光ファイバ５０のコア部５２の屈折率値に近い値の屈折率を有する液体を用いることが望ましく、接触する発光素子１２が発光時に熱を発生することから、この熱により容易に揮発しない液体であることが望ましい。このような条件を満たす液体として、常圧での沸点が１００℃を超える有機化合物が挙げられ、例えば、屈折率が約１．４〜１．６のシリコンオイルを用いればよい。また、光結合部７０は、発光素子１２から出射される紫外光の減衰を抑えるため、紫外光の透過率が高い液体であることが特に望ましく、屈折率が約１．４〜１．６のフッ素系オイルを用いることが好適である。   The optical coupling unit 70 desirably uses a liquid having a refractive index close to the refractive index value of the base substrate 14 having the light extraction surface 14a and the core 52 of the optical fiber 50. Since it generates heat, it is desirable that the liquid is not easily volatilized by this heat. Examples of the liquid satisfying such conditions include organic compounds having a boiling point of 100 ° C. at normal pressure. For example, silicon oil having a refractive index of about 1.4 to 1.6 may be used. The optical coupling unit 70 is particularly preferably a liquid having a high transmittance of ultraviolet light in order to suppress attenuation of ultraviolet light emitted from the light emitting element 12, and has a refractive index of about 1.4 to 1.6. It is preferable to use a fluorinated oil.

図３は、光結合部７０による光結合効率の向上を示す図である。本図のＡは、光結合部７０を設けない場合の実験結果であり、Ｂは、光結合部７０を設けた場合の実験結果を示す。本実験では、中心波長が２６０ｎｍである紫外光を発する発光素子１２を用い、光結合部７０に用いる液体として、シリコン封止材（信越化学製、ＫＥＲ−２６００−Ａ）を用いた。本図の横軸は、発光素子１２に流す電流値を示し、本図の縦軸は、光ファイバ５０の出射端面５８から出射される紫外光を積分球を利用して測定した光強度を示す。   FIG. 3 is a diagram illustrating the improvement of the optical coupling efficiency by the optical coupling unit 70. A of this figure is an experimental result when not providing the optical coupling part 70, B shows the experimental result when the optical coupling part 70 is provided. In this experiment, a light emitting element 12 that emits ultraviolet light having a central wavelength of 260 nm was used, and a silicon sealing material (manufactured by Shin-Etsu Chemical Co., Ltd., KER-2600-A) was used as the liquid used for the optical coupling portion 70. The horizontal axis of this figure shows the value of current flowing through the light emitting element 12, and the vertical axis of this figure shows the light intensity measured by using an integrating sphere for the ultraviolet light emitted from the emission end face 58 of the optical fiber 50. .

図３に示すように、光結合部７０を設けることにより、出射端面５８から出射される紫外光の光強度が約１．４倍になることがわかった。このことから、液体の光結合部７０を設けることにより、発光素子１２と光ファイバ５０の光結合効率を向上させることができることが示された。光結合部７０は、導光部４０を装着する際に所定の液体を入射端面５６に付着させるだけで形成することができるため、特に特別な構成を追加する必要はなく、簡素な構成で光結合効率を向上させることができる。   As shown in FIG. 3, it was found that the light intensity of the ultraviolet light emitted from the emission end face 58 is increased by about 1.4 times by providing the optical coupling portion 70. From this, it was shown that the optical coupling efficiency between the light emitting element 12 and the optical fiber 50 can be improved by providing the liquid optical coupling unit 70. Since the optical coupling unit 70 can be formed by simply attaching a predetermined liquid to the incident end face 56 when the light guide unit 40 is mounted, it is not necessary to add a special configuration, and the optical coupling unit 70 can be configured with a simple configuration. Coupling efficiency can be improved.

また、シリコンオイルやフッ素系オイルなど、沸点が比較的高い液体を用いることにより、連続して光源装置１００を使用する場合においても、液体が揮発して光結合部７０が損なわれる可能性を低減させることができる。発光素子１２の表面温度は、連続使用することにより１００℃程度まで上昇することもあり、光結合部７０に水などの沸点の低い液体を用いた場合には液体が蒸発して光結合部７０が失われ、光結合効率が低下してしまうおそれがあるためである。   Further, by using a liquid having a relatively high boiling point such as silicon oil or fluorine-based oil, even when the light source device 100 is continuously used, the possibility that the liquid is volatilized and the optical coupling unit 70 is damaged is reduced. Can be made. The surface temperature of the light emitting element 12 may rise to about 100 ° C. by continuous use. When a liquid having a low boiling point such as water is used for the optical coupling unit 70, the liquid evaporates and the optical coupling unit 70. This is because the light coupling efficiency may be reduced.

また、放熱部３０を設けることで発光時の発光素子１２の温度を下げ、光結合部７０の液体が揮発してしまうことを防ぐことができる。なお、放熱部３０として、ペルチェ素子３２、ヒートシンク３４、放熱ファン３６を組み合わせた構成を示したが、これらのいずれか一つまたは二つを組み合わせた構成を放熱部３０として用いてもよいし、その他、水冷方式による冷却手段を設けてもよい。   Further, by providing the heat radiating part 30, the temperature of the light emitting element 12 during light emission can be lowered, and the liquid in the optical coupling part 70 can be prevented from volatilizing. In addition, although the structure which combined the Peltier device 32, the heat sink 34, and the heat radiating fan 36 was shown as the heat radiating part 30, you may use the structure which combined these any one or two as the heat radiating part 30, In addition, a water cooling method may be provided.

また、光取出面１４ａや入射端面５６が鏡面のように平坦でない場合には、それらの表面の凹凸により光が散乱して光結合効率が低下してしまうが、光結合部７０として液体を用いることで、凹凸に液体を入り込ませて凹凸による散乱を防ぐことができる。光結合効率を高めるためとはいえ、光取出面１４ａや入射端面５６を鏡面研磨することは手間がかかることから、鏡面研磨を施す替わりに液体の光結合部７０を用いることで、手軽に光結合効率を向上させることができる。   In addition, when the light extraction surface 14a and the incident end surface 56 are not flat like a mirror surface, light is scattered by the unevenness of the surfaces and the light coupling efficiency is lowered, but a liquid is used as the light coupling portion 70. In this way, liquid can enter the unevenness to prevent scattering due to the unevenness. Even though the optical coupling efficiency is increased, mirror polishing of the light extraction surface 14a and the incident end surface 56 is time-consuming. Therefore, by using the liquid optical coupling unit 70 instead of performing the mirror polishing, light can be easily obtained. Coupling efficiency can be improved.

また、光取出面１４ａと入射端面５６が略平行に対向しない位置関係のとき、光結合部７０がない場合には、発光素子１２から出射される光の一部は入射端面５６に到達せず、光ファイバ５０に効率的に結合されないこととなる。一方、光結合部７０が設けられると光結合部７０と周りの空気層との境界により光が反射することで、発光素子１２から出射された光は光結合部７０の内部に閉じ込められ効率的に入射端面５６に入射させることができる。なお、光取出面１４ａの中心位置と入射端面５６に垂直な中心軸とが交わらず、いわゆる軸ずれとなっている位置関係においても、光結合部７０が設けられることで発光素子１２が発する光が光結合部７０の内部に閉じ込められることにより、発光素子１２と導光部４０の光結合効率を向上させることができる。   Further, when the light extraction surface 14 a and the incident end surface 56 are not in a substantially parallel relationship, a part of the light emitted from the light emitting element 12 does not reach the incident end surface 56 when there is no optical coupling portion 70. Therefore, the optical fiber 50 is not efficiently coupled. On the other hand, when the optical coupling unit 70 is provided, light is reflected by the boundary between the optical coupling unit 70 and the surrounding air layer, so that the light emitted from the light emitting element 12 is confined in the optical coupling unit 70 and efficiently. To the incident end face 56. Note that the light emitted from the light emitting element 12 is provided by providing the optical coupling portion 70 even in a positional relationship in which the center position of the light extraction surface 14a does not intersect with the central axis perpendicular to the incident end surface 56 and is a so-called axis shift. Is confined inside the optical coupling unit 70, the optical coupling efficiency between the light emitting element 12 and the light guide unit 40 can be improved.

本発明は、上述の各実施の形態に限定されるものではなく、当業者の知識に基づいて各種の設計変更等の変形を加えることも可能であり、そのような変形が加えられた実施の形態も本発明の範囲に含まれうるものである。   The present invention is not limited to the above-described embodiments, and various modifications such as design changes can be added based on the knowledge of those skilled in the art. The form can also be included in the scope of the present invention.

光源装置１００として、紫外光を発する発光素子１２を用いた場合を示したが、用いる発光素子はこれに限られず、可視光や赤外光を発する発光素子を用いてもよい。この場合、発光素子が発する光の波長に応じて、その波長の透過率が高い液体を適宜選択することが望ましい。   Although the case where the light emitting element 12 that emits ultraviolet light is used as the light source device 100 is shown, the light emitting element to be used is not limited to this, and a light emitting element that emits visible light or infrared light may be used. In this case, according to the wavelength of light emitted from the light emitting element, it is desirable to appropriately select a liquid having a high transmittance at that wavelength.

１２…発光素子、１４ａ…光取出面、２２ａ…表面、３０…放熱部、４０…導光部、５６…入射端面、５８…出射端面、７０…光結合部、１００…光源装置。   DESCRIPTION OF SYMBOLS 12 ... Light emitting element, 14a ... Light extraction surface, 22a ... Surface, 30 ... Radiation part, 40 ... Light guide part, 56 ... Incident end face, 58 ... Outlet end face, 70 ... Optical coupling part, 100 ... Light source device.

Claims (5)

光取出面を有する発光素子と、
前記光取出面に対向し前記発光素子が発する光が入射する入射端面と、前記入射端面から入射した光が出射される出射端面と、を有する導光部と、
前記光取出面および前記入射端面の双方に接触する液体を含む光結合部と、
を備えることを特徴とする光源装置。 A light emitting device having a light extraction surface;
A light guide unit having an incident end surface facing the light extraction surface and receiving light emitted from the light emitting element; and an exit end surface from which light incident from the incident end surface is emitted;
An optical coupling portion including a liquid that contacts both the light extraction surface and the incident end surface;
A light source device comprising: 前記液体は、前記光取出面および前記入射端面との間に作用する表面張力により、当該光取出面と当該入射端面との間の領域に保持されることを特徴とする請求項１に記載の光源装置。   2. The liquid according to claim 1, wherein the liquid is held in a region between the light extraction surface and the incident end surface by surface tension acting between the light extraction surface and the incident end surface. Light source device. 前記液体は、常圧での沸点が１００℃を超える有機化合物を含むことを特徴とする請求項１または２に記載の光源装置。   The light source device according to claim 1, wherein the liquid contains an organic compound having a boiling point of 100 ° C. at normal pressure. 前記発光素子は、紫外光を発する発光ダイオードであり、
前記液体は、フッ素系オイルであることを特徴とする請求項１から３のいずれかに記載の光源装置。 The light emitting element is a light emitting diode emitting ultraviolet light,
The light source device according to claim 1, wherein the liquid is a fluorinated oil. 前記発光素子が発光する際に発する熱を放熱させる放熱部をさらに備えることを特徴とする請求項１から４のいずれかに記載の光源装置。   5. The light source device according to claim 1, further comprising a heat radiating portion that radiates heat generated when the light emitting element emits light.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110067947A (en) * 2019-05-14 2019-07-30 深圳和而泰智能控制股份有限公司 Light emitting device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6354111U (en) * 1986-09-29 1988-04-12
JPH08201857A (en) * 1995-01-24 1996-08-09 Hitachi Cable Ltd Magnetically driven waveguide type photo-switch and its manufacture
US5631987A (en) * 1995-06-07 1997-05-20 Reliaspeed, Inc. Low cost, mode-field matched, high performance laser transmitter optical subassembly
JP2000214353A (en) * 1999-01-26 2000-08-04 Nec Corp Light receiving device having low reflection characteristic
JP2003124520A (en) * 2001-10-17 2003-04-25 Nippon Computer Network Kk Photopolymerization radiation device
JP2005203765A (en) * 2003-12-17 2005-07-28 Showa Denko Kk Semiconductor light emitting element of gallium nitride compound and its negative electrode
JP2005252334A (en) * 2004-03-01 2005-09-15 Matsushita Electric Ind Co Ltd Optical transmission module and mobile information apparatus employing the same
JP2006146053A (en) * 2004-11-24 2006-06-08 Tomoegawa Paper Co Ltd Optical connector and manufacturing method therefor
JP2007093647A (en) * 2005-09-27 2007-04-12 Tomoegawa Paper Co Ltd Optical connecting structure and method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6354111U (en) * 1986-09-29 1988-04-12
JPH08201857A (en) * 1995-01-24 1996-08-09 Hitachi Cable Ltd Magnetically driven waveguide type photo-switch and its manufacture
US5631987A (en) * 1995-06-07 1997-05-20 Reliaspeed, Inc. Low cost, mode-field matched, high performance laser transmitter optical subassembly
JP2000214353A (en) * 1999-01-26 2000-08-04 Nec Corp Light receiving device having low reflection characteristic
JP2003124520A (en) * 2001-10-17 2003-04-25 Nippon Computer Network Kk Photopolymerization radiation device
JP2005203765A (en) * 2003-12-17 2005-07-28 Showa Denko Kk Semiconductor light emitting element of gallium nitride compound and its negative electrode
JP2005252334A (en) * 2004-03-01 2005-09-15 Matsushita Electric Ind Co Ltd Optical transmission module and mobile information apparatus employing the same
JP2006146053A (en) * 2004-11-24 2006-06-08 Tomoegawa Paper Co Ltd Optical connector and manufacturing method therefor
JP2007093647A (en) * 2005-09-27 2007-04-12 Tomoegawa Paper Co Ltd Optical connecting structure and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110067947A (en) * 2019-05-14 2019-07-30 深圳和而泰智能控制股份有限公司 Light emitting device

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