JP2014093457A5 - - Google Patents

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Publication number
JP2014093457A5
JP2014093457A5 JP2012243793A JP2012243793A JP2014093457A5 JP 2014093457 A5 JP2014093457 A5 JP 2014093457A5 JP 2012243793 A JP2012243793 A JP 2012243793A JP 2012243793 A JP2012243793 A JP 2012243793A JP 2014093457 A5 JP2014093457 A5 JP 2014093457A5
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JP
Japan
Prior art keywords
etching solution
iodide
iodine
evaluating
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012243793A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014093457A (ja
JP6011930B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012243793A priority Critical patent/JP6011930B2/ja
Priority claimed from JP2012243793A external-priority patent/JP6011930B2/ja
Priority to PCT/JP2013/077069 priority patent/WO2014069156A1/ja
Priority to TW102137056A priority patent/TW201426890A/zh
Publication of JP2014093457A publication Critical patent/JP2014093457A/ja
Publication of JP2014093457A5 publication Critical patent/JP2014093457A5/ja
Application granted granted Critical
Publication of JP6011930B2 publication Critical patent/JP6011930B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012243793A 2012-11-05 2012-11-05 シリコンウェーハの評価方法及びそのエッチング液 Active JP6011930B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012243793A JP6011930B2 (ja) 2012-11-05 2012-11-05 シリコンウェーハの評価方法及びそのエッチング液
PCT/JP2013/077069 WO2014069156A1 (ja) 2012-11-05 2013-10-04 シリコンウェーハの評価方法及びそのエッチング液
TW102137056A TW201426890A (zh) 2012-11-05 2013-10-15 矽晶圓之評價方法及其蝕刻液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012243793A JP6011930B2 (ja) 2012-11-05 2012-11-05 シリコンウェーハの評価方法及びそのエッチング液

Publications (3)

Publication Number Publication Date
JP2014093457A JP2014093457A (ja) 2014-05-19
JP2014093457A5 true JP2014093457A5 (ko) 2014-12-04
JP6011930B2 JP6011930B2 (ja) 2016-10-25

Family

ID=50627072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012243793A Active JP6011930B2 (ja) 2012-11-05 2012-11-05 シリコンウェーハの評価方法及びそのエッチング液

Country Status (3)

Country Link
JP (1) JP6011930B2 (ko)
TW (1) TW201426890A (ko)
WO (1) WO2014069156A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6179530B2 (ja) 2015-01-23 2017-08-16 信越半導体株式会社 貼り合わせｓｏｉウェーハの製造方法
CN111662717B (zh) * 2020-07-14 2021-08-31 北京航空航天大学宁波创新研究院 一种硒化铋材料的金相腐蚀液以及金相显示方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3629694B2 (ja) * 1998-02-19 2005-03-16 信越半導体株式会社 シリコンウェーハの評価方法
JP3692812B2 (ja) * 1998-06-04 2005-09-07 信越半導体株式会社 窒素ドープした低欠陥シリコン単結晶ウエーハおよびその製造方法
JP3651440B2 (ja) * 2002-01-16 2005-05-25 信越半導体株式会社 シリコンウェーハの評価方法及びそのエッチング液

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