JP2014092403A - Humidity sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a humidity sensor device that is able to improve responsiveness and humidity detection accuracy without using moisture permeable filter.SOLUTION: A humidity sensor device (10) comprises: a humidity sensor (20) having a sensing part (22) in which a pair of electrodes (24) are formed on one face (21a) of a substrate (21) so as to be opposite to each other and a humidity sensitive film (26) is arranged so as to cover an area between the electrodes; a package (30) having an opening (35) on one face opposite to a bottom internal face (33a) and accommodating the humidity sensor; and a lid member (40) for covering the opening in a state where the humidity sensor is accommodated in the package. A back face (21b) of the substrate is directly or indirectly fixed to the bottom internal face of the package. The lid member has a first vent hole (43) only in a non-overlap area (42) in a face orthogonal to the thickness direction of the substrate.

Description

  The present invention relates to a humidity sensor device in which a capacitive humidity sensor is housed in a package.

  Conventionally, it has been provided with a sensing unit comprising a pair of electrodes formed on the same surface of a substrate so as to face each other and a moisture-sensitive film disposed so as to cover the electrodes and the humidity of the atmosphere A capacitance-type humidity sensor that detects a change as a change in capacitance is known.

  There is also known a humidity sensor device in which the humidity sensor is housed in a package and the opening of the package is covered with a moisture permeable filter made of a porous resin film. As the porous resin film, for example, porous polytetrafluoroethylene (PTFE) described in Patent Document 1 can be employed. When such a moisture permeable filter is used, it is possible to prevent foreign substances other than moisture from entering the package while ensuring air permeability for the humidity sensor accommodated in the package.

JP 2011-151225 A

  By the way, since a moisture permeable filter is expensive, when a moisture permeable filter is employ | adopted, the cost of a humidity sensor apparatus will become high. Therefore, instead of the moisture permeable filter, a configuration in which the opening of the package is covered with a lid member formed by processing a vent hole in a base material made of metal or resin can be considered. According to this, air permeability can be ensured by the air holes, and the responsiveness of the humidity sensor can be improved.

  However, if a vent hole is simply provided in the lid member, foreign matter may enter the package through the vent hole and adhere to the moisture sensitive film. When foreign matter adheres to the moisture sensitive film, the relative dielectric constant of the foreign matter affects the capacitance of the capacitor formed between the pair of electrodes, and the humidity detection accuracy is reduced.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a humidity sensor device that can improve responsiveness and humidity detection accuracy without using a moisture permeable filter.

  In order to achieve the above object, a humidity sensor device according to the present invention has a pair of electrodes (24) formed on one surface (21a) of the substrate (21) so as to face each other. And a sensing unit (22) in which a moisture sensitive film (26) is disposed so as to cover between the electrode (24) and the electrode (24), and a humidity sensor that detects a change in humidity of the atmosphere as a change in capacitance (20), a package (30) which has an opening (35) on one surface facing the bottom inner surface (33a) and accommodates the humidity sensor (20), and the humidity sensor (20) is accommodated in the package (30). And a lid member (40) that covers the opening (35). The humidity sensor (20) has a back surface (21b) opposite to the one surface (21a) directly on the bottom inner surface (33a) of the package (30) so that the sensing portion (22) faces the opening (35). Alternatively, the lid member (40) is indirectly fixed, and the cover member (40) has an overlap region (41) and a non-overlap region (with the sensing part (22)) in a plane orthogonal to the plate thickness direction of the substrate (21). 42), only the non-overlapping region (42) has the first vent hole (43).

  According to this, since the cover member (40) is used, it is not necessary to use an expensive moisture permeable filter. In addition, since the lid member (40) has the first ventilation hole (43), the air permeability in the package (30) can be improved, and as a result, the responsiveness of the humidity sensor (20) can be improved. Further, since the first vent hole (43) is provided only in the non-overlapping region (42), the sensing part (22) is not located directly below the first vent hole (43). Therefore, even if foreign matter enters the package (30) through the first ventilation hole (43), the foreign matter is unlikely to adhere to the moisture sensitive film (26) of the sensing unit (22). Thereby, it can suppress that the dielectric constant of a foreign material influences the electrostatic capacitance of the capacitor | condenser formed between a pair of electrodes (24). That is, the humidity detection accuracy can be improved.

  Furthermore, a further feature of the present invention is that the lid member (40) has a plurality of first ventilation holes (43). According to this, it becomes easy to produce a flow in a package (30), and air permeability improves. Thereby, the responsiveness of a humidity sensor (20) can further be improved.

  A further feature of the present invention is that a plurality of first vent holes (43) are provided so as to sandwich the overlap region (41) in a plane perpendicular to the plate thickness direction. According to this, the outside air introduced into the package (30) through the first ventilation hole (43) flows on the sensing part (22), and the responsiveness can be further improved.

  A further feature of the present invention is that the first vent hole (43) also serves as an identification mark. According to this, it is not necessary to separately provide an identification mark by printing or the like. Thereby, cost can be reduced.

  Further, according to a further feature of the present invention, the lid member (40) has a second ventilation hole (45) whose opening area perpendicular to the plate thickness direction is smaller than the first ventilation hole (43), and the first ventilation hole. The combination of (43) and the second ventilation hole (45) is to form a mark.

  As described above, if the mark is formed by the combination of the two types of vent holes (43, 45), more types of marks can be handled. Further, since the second ventilation hole (45) is provided in addition to the first ventilation hole (43), the air permeability can be further improved.

It is a top view which shows schematic structure of the humidity sensor apparatus which concerns on 1st Embodiment. It is sectional drawing which follows the II-II line of FIG. It is the top view which expanded the sensing part periphery in a humidity sensor. For convenience, the electrodes are shown by solid lines. For convenience, the electrodes are hatched. It is sectional drawing which follows the IV-IV line of FIG. It is a top view which shows schematic structure of the humidity sensor apparatus which concerns on 2nd Embodiment. It is sectional drawing which follows the VI-VI line of FIG. It is a top view which shows schematic structure of the humidity sensor apparatus which concerns on 3rd Embodiment. It is sectional drawing which follows the VIII-VIII line of FIG. It is sectional drawing which shows a 1st modification. It is a top view which shows schematic structure of the humidity sensor apparatus which concerns on 4th Embodiment. It is a top view which shows the 2nd modification. It is a top view which shows schematic structure of the humidity sensor apparatus which concerns on 5th Embodiment. It is a top view which shows schematic structure of the humidity sensor apparatus which concerns on 6th Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same reference numerals are given to the same or equivalent parts. In addition, the thickness direction of the substrate constituting the humidity sensor is hereinafter simply referred to as the thickness direction.

(First embodiment)
First, with reference to FIGS. 1-4, schematic structure of the humidity sensor apparatus 10 which concerns on this embodiment is demonstrated.

  As shown in FIGS. 1 and 2, the humidity sensor device 10 includes a humidity sensor 20, a package 30 that houses the humidity sensor 20, and a lid member 40 that covers the package 30.

  As shown in FIG. 2, the humidity sensor 20 (humidity sensor chip) includes a substrate 21 and a sensing unit 22 formed on one surface 21 a of the substrate 21, and changes in the humidity of the atmosphere as capacitance changes. It is to detect. As such a humidity sensor 20, the thing of a known structure is employable.

  As shown in FIGS. 3 and 4, the substrate 21 can employ an N-type silicon substrate as a semiconductor substrate. The sensing unit 22 is formed by forming various films, electrodes, and the like on the one surface 21 a of the substrate 21. Specifically, for example, a silicon oxide film is formed as the insulating film 23 on the one surface 21 a of the substrate 21, and a pair of electrodes 24 is formed on the insulating film 23. A pair of electrodes 24 are arranged opposite to each other. Although the shape of the electrode 24 is not particularly limited, in the present embodiment, as shown in FIG. 3, the electrode 24 has a comb shape, and the comb teeth portions are engaged with each other and face each other. When such a comb-like electrode 24 is used, the facing area between the electrodes 24 can be increased while minimizing the arrangement area of the electrodes 24, and the capacitance between the electrodes 24 can be increased.

  On the insulating film 23, for example, a silicon nitride film is formed as the protective film 25 so as to cover the space between the electrodes 24. The protective film 25 protects the electrode 24 from corrosion, and may be unnecessary when the electrode 24 is formed using a corrosion-resistant material. A moisture sensitive film 26 made of polyimide, for example, is formed so as to cover the space between the pair of electrodes 24 and the electrodes 24.

  In the sensing unit 22 configured as described above, a capacitor is formed by the pair of electrodes 24. Further, a moisture sensitive film 26 is mainly interposed between the electrodes 24 as a dielectric. Although the relative dielectric constant of the moisture sensitive film 26 does not change according to the relative humidity, the relative dielectric constant of the entire moisture sensitive film 26 including moisture changes depending on the amount of moisture adsorbed. For this reason, the electrostatic capacitance of a capacitor | condenser changes according to relative humidity. 3 and 4 is a so-called detection electrode, and in addition to the electrode 24, a pair of reference electrodes may be provided. Since such a configuration is also well known, a detailed description is omitted.

  The package 30 is a box-shaped member that houses the humidity sensor 20. In the present embodiment, a package 30 formed by laminating ceramic sheets 31 in multiple layers is employed. In addition, a metal ring 32 is provided as the uppermost layer, and this ring 32 is brazed to the ceramic sheet 31.

  The package 30 includes a bottom 33 and a side wall 34 that rises from the periphery of the bottom 33. And it has the opening part 35 in the one surface which is surrounded by the peripheral part 34 and opposes the bottom inner surface 33a. In the present embodiment, the bottom inner surface 33a is substantially rectangular, and the opening 35 is also substantially rectangular.

  The humidity sensor 20 is fixed to the bottom inner surface 33 a of the package 30. As shown in FIG. 2, in the humidity sensor 20, the back surface 21b opposite to the one surface 21a of the substrate 21 is bonded and fixed to the bottom inner surface 33a so that the sensing unit 22 faces the opening 35. Thus, the back surface 21b of the substrate 21b is not limited to the example of being directly fixed to the bottom inner surface 33a, but may be indirectly fixed. For example, a circuit chip corresponding to the humidity sensor 20 may be interposed between the bottom inner surface 33a.

  The lid member 40 covers the opening 35 of the package 30 and is formed using resin, metal, or the like. In addition, as a method of fixing the lid member 40 to the package 30, any method can be used as long as the space between the package 30 and the package 30 can be watertight. In the present embodiment, a metal lid member 40 is employed, and the lid member 40 is welded to the ring 32 on the entire circumference.

  Further, as shown in FIG. 1, the lid member 40 includes an overlap region 41 that overlaps the sensing unit 22 and a non-overlap that is a region excluding the overlap region 41 in a plane orthogonal to the plate thickness direction. A region 42 is provided. In FIG. 1, the overlap region 41 is a region surrounded by a broken line. Of the overlap region 41 and the non-overlap region 42, only the non-overlap region 42 has the first vent hole 43. In the present embodiment, one first vent hole 43 is provided in the lid member 40, and the first vent hole 43 is provided in a non-overlap region 42 and a region that does not overlap the substrate 21. ing. Moreover, the opening shape of the 1st ventilation hole 43 is a substantially perfect circle shape.

  The first vent hole 43 penetrates the lid member 40 in the thickness direction, and communicates the external atmosphere with the package 30 and the internal atmosphere of the lid member 40. Further, the first vent hole 43 is ventilated and has a size that prevents moisture (water droplets) from entering, for example, the maximum length in the direction orthogonal to the plate thickness direction is about 200 μm to 300 μm. The first vent holes 43 can be formed by, for example, punching (pressing), etching, or laser processing. In the case where the resin lid member 40 is employed, the first vent holes 43 can be formed collectively when the lid member 40 is molded.

  Next, the effect of the humidity sensor apparatus 10 in this embodiment is demonstrated.

  The humidity sensor device 10 of the present embodiment covers the opening 35 of the package 30 using the lid member 40 instead of the moisture permeable filter. For this reason, since it is not necessary to use an expensive moisture permeable filter, the cost of the humidity sensor apparatus 10 can be reduced.

  Further, since the lid member 40 has the first ventilation holes 43, the air permeability in the package 30 can be improved. Thereby, since the followability with respect to the external atmosphere of an internal atmosphere improves, the responsiveness of the humidity sensor 20 can be improved.

  Further, the first vent holes 43 are provided only in the non-overlap region 42. For this reason, the sensing unit 22 is not located directly below the first ventilation hole 43. Therefore, even if foreign matter enters the package 30 through the first vent hole 43, the foreign matter is less likely to adhere to the moisture sensitive film 26 than the configuration having the first vent hole 43 in the overlap region 41. Thereby, it can suppress that the dielectric constant of a foreign material influences the electrostatic capacitance of the capacitor | condenser formed between a pair of electrodes 24. FIG. That is, the humidity detection accuracy of the humidity sensor 20 can be improved.

  The arrangement of the first vent holes 43 is not limited to the above example. Any non-overlapping region 42 may be used. Further, the shape of the first vent hole 43 is not limited to a perfect circle.

(Second Embodiment)
In the present embodiment, description of portions common to the humidity sensor device 10 shown in the above embodiment is omitted.

  The first feature of the present embodiment is that the lid member 40 has a plurality of first ventilation holes 43 as shown in FIGS. 5 and 6. The second feature is that a plurality of first vent holes 43 are provided so as to sandwich the overlap region 41 in a plane orthogonal to the plate thickness direction. Other points are the same as in the first embodiment.

  As shown in FIG. 5, the lid member 40 has a first vent hole 43 having the same shape on both sides of the overlap region 41 in the left-right direction (hereinafter, referred to as a first direction) of the paper surface orthogonal to the plate thickness direction. Are arranged in a grid pattern. On both sides, the first vent holes 43 are arranged in 9 rows × 3 columns, and the arrangement area is in a second direction (vertical direction in FIG. 5) perpendicular to both the plate thickness direction and the first direction. , Straddling the overlap region 41. In addition, as shown in FIG. 6, some of the plurality of first ventilation holes 43 are provided in an overlap region with the substrate 21 in a plane orthogonal to the plate thickness direction.

  Since the humidity sensor device 10 configured as described above has a plurality of the first ventilation holes 43, as shown by solid line arrows in FIG. 6, a flow easily occurs in the package 30 and air permeability is improved. Thereby, the responsiveness of the humidity sensor 20 can further be improved.

  In particular, since the plurality of first ventilation holes 43 are provided so as to sandwich the overlap region 41 therebetween, the outside air introduced into the package 30 via the first ventilation holes 43 is directly above the sensing unit 22. Flowing. Thereby, the responsiveness of the humidity sensor 20 can further be improved.

  The number and arrangement of the plurality of first vent holes 43 are not limited to the above example. The first vent holes 43 may be arranged so as to satisfy only the first feature. For example, two first vent holes 43 may be provided in the lid member 40 so that an imaginary straight line connecting the first vent holes 43 does not overlap the overlap region 41. Further, in the second direction, the first ventilation hole 43 may be arranged so as to sandwich the overlap region 41. Furthermore, the first ventilation holes 43 may be arranged so as to be sandwiched diagonally with respect to the overlap region 41 having a planar rectangle.

(Third embodiment)
In the present embodiment, description of portions common to the humidity sensor device 10 shown in the above embodiment is omitted.

  As shown in FIGS. 7 and 8, the feature of the present embodiment is that the lid member 40 has a louver portion 44 in which at least the peripheral edge of the first vent hole 43 rises in the plate thickness direction. Other points are the same as in the second embodiment.

  Also in this embodiment, the lid member 40 has a plurality of first ventilation holes 43 as in the second embodiment. The plurality of first vent holes 43 are provided so as to sandwich the overlap region 41 in the plane orthogonal to the plate thickness direction. Specifically, as shown in FIG. 7, the first vent holes 43 having the same shape are arranged in 7 rows × 2 columns on both sides of the overlap region 41 in the first direction. Further, the arrangement region straddles the overlap region 41 in the second direction. Further, as shown in FIG. 8, some of the plurality of first ventilation holes 43 are provided in an overlap region with the substrate 21 in a plane orthogonal to the plate thickness direction.

  The louver portion 44 is provided for all the first vent holes 43. Specifically, a U-shaped cut is made in the lid member 40, and the louver portion 44 is integrally provided to the lid member 40 by bending the cut portion in the plate thickness direction. As shown in FIG. 8, in this embodiment, all the louver portions 44 are bent to the opposite side to the bottom inner surface 33 a and protrude outward from the lid member 40.

  In the humidity sensor device 10 configured as described above, since the louver part 44 is provided at the edge of the first vent hole 43, outside air is introduced into the package 30 along the louver part 44, and along the louver part 44. Thus, the inside air of the package 30 is easily discharged to the outside. That is, the air permeability is further improved. Thereby, the responsiveness of the humidity sensor 20 can further be improved.

  In the present embodiment, an example in which the louver portion 44 is provided at the edge of all the first vent holes 43 is shown. However, among the plurality of first vent holes 43, a part of the first vent holes 43 is provided. Alternatively, the louver portion 44 may be provided. Further, when the lid member 40 has only one first vent hole 43, a louver portion 44 may be provided for the first vent hole 43. Further, in the configuration in which the lid member 40 has a second ventilation hole 45 to be described later together with the first ventilation hole 43 as a ventilation hole, a louver portion 44 is provided for the first ventilation hole 43 and the second ventilation hole 45. Also good.

  Moreover, the formation method of the louver part 44 is not limited to cutting and bending. For example, a burr generated when the first vent hole 43 is formed by punching may be used as the louver portion 44.

(First modification)
In the said embodiment, the example which all the louver parts 44 protrude outside from the cover member 40 was shown. However, for example, as shown in FIG. 9, a part of the louver portions 44a may protrude outward, and a part of the louver portions 44b may protrude inward (bottom inner surface 33a side).

(Fourth embodiment)
In the present embodiment, description of portions common to the humidity sensor device 10 shown in the above embodiment is omitted.

  As shown in FIG. 10, the feature of this embodiment resides in that the first vent hole 43 also serves as an identification mark. In FIG. 10, one first vent hole 43 is provided in the lid member 40 as in the first embodiment. The shape of the first vent hole 43 is selected from a plurality of types so as to form a desired mark. For example, the production month can be identified by the shape of the first vent hole 43. Other points are the same as in the first embodiment.

  In the humidity sensor device 10 configured as described above, it is not necessary to separately provide an identification mark by printing or the like, and thus the cost of the humidity sensor device 10 can be reduced.

(Second modification)
In the above embodiment, the case where an identification mark is formed by one first vent hole 43 is shown, but an identification mark may be formed by a plurality of first vent holes 43. For example, in the example shown in FIG. 11, numerals are formed as identification marks by the plurality of first vent holes 43. Specifically, “0” is formed on the left side of the overlap area 41 and “1” is formed on the right side of the page. Further, not only numbers but also letters and patterns such as alphabets can be used as identification marks.

(Fifth embodiment)
In the present embodiment, description of portions common to the humidity sensor device 10 shown in the above embodiment is omitted.

  As shown in FIG. 12, the present embodiment is characterized in that the lid member 40 serves as a ventilation hole, together with the first ventilation hole 43, and the second passage having a smaller opening area perpendicular to the plate thickness direction than the first ventilation hole 43. It has pores 45. A mark is formed by a combination of the first vent hole 43 and the second vent hole 45. Other points are the same as in the fourth embodiment (second modification).

  The second vent hole 45 is also sized so that it can be ventilated and moisture (water droplets) cannot easily enter, and is smaller than the first vent hole 43. Specifically, for example, the maximum length in the direction orthogonal to the plate thickness direction is about 50 μm to 100 μm. Thus, the second vent hole 45 has a smaller opening area than the first vent hole 43. Such second vent holes 45 can also be formed by, for example, punching (pressing), etching, or laser processing.

  In the example shown in FIG. 12, a binary number is formed by two vent holes arranged in the first direction. For example, the first vent hole 43 corresponds to “0”, the second vent hole 45 corresponds to “1”, and the two first vent holes 43 indicate “00”.

  In the humidity sensor device 10 configured as described above, a mark can be formed by a combination of two types of vent holes 43 and 45. Therefore, more types of marks can be handled. Further, since the second ventilation holes 45 are provided in addition to the first ventilation holes 43, the number of the first ventilation holes 43 is the same, and the air permeability is further improved as compared with the configuration having only the first ventilation holes 43. be able to.

  The mark formed by the combination of the two types of vent holes 43 and 45 is not limited to the above example. In addition to the numbers described above, letters such as alphabets and patterns can also be formed. It is also possible to form a two-dimensional code or bar code. Further, for example, a character can be formed by the first vent hole 43 and a second vent hole 45 can be provided around the first vent hole 43 to highlight the character (see the sixth embodiment described later).

  In addition, an example in which a mark is formed by a plurality of first vent holes 43 and a plurality of second vent holes 45 is shown, but a mark is formed by one first vent hole 43 and one second vent hole 45. Alternatively, the mark may be formed by a plurality of first vent holes 43 and one second vent hole 45.

(Sixth embodiment)
In the present embodiment, description of portions common to the humidity sensor device 10 shown in the above embodiment is omitted.

  As shown in FIG. 13, the feature of the present embodiment is that the lid member 40 has a plurality of second ventilation holes 45, and at least a part of the plurality of second ventilation holes 45 is provided in the overlap region 41. It is in. Other points are the same as in the fifth embodiment.

  In the example shown in FIG. 13, as in FIG. 11, numerals are formed as identification marks by the plurality of first vent holes 43. Specifically, “0” is formed on the left side of the overlap area 41 and “1” is formed on the right side of the page. Further, all the air holes 43 and 45 are arranged in a lattice pattern in almost the entire area of the lid member 40. The second ventilation hole 45 is provided in the periphery of the first ventilation hole 43 and is also provided in the overlap region 41. And the character by the 1st ventilation hole 43 is highlighted by the difference in the magnitude | size of the 1st ventilation hole 43 and the 2nd ventilation hole 45. FIG.

  According to this, since the second vent hole 45 having an opening area smaller than that of the first vent hole 43 is provided in the overlap region 41, the moisture sensitive film is compared with the configuration in which the first vent hole 43 is provided in the overlap region 41. It is difficult for foreign matter to adhere to No. 26. Even if a foreign substance adheres, the maximum value of the foreign substance is smaller than that of the first vent hole 43, and thus the influence on the capacitance is small. Accordingly, it is possible to suppress a decrease in humidity detection accuracy while providing a vent hole in the overlap region 41.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. Moreover, it is possible to carry out by combining the modes of the respective embodiments.

  The substrate 21 is not limited to a semiconductor substrate. In addition, an insulator such as glass can be used. In this case, the insulating film 23 between the electrode 24 and the substrate 21 can be dispensed with.

DESCRIPTION OF SYMBOLS 10 ... Humidity sensor apparatus, 20 ... Humidity sensor, 21 ... Substrate, 21a ... One side, 21b ... Back side, 22 ... Sensing part, 23 ... Insulating film, 24 ... -Electrode, 25 ... protective film, 26 ... moisture sensitive film, 30 ... package, 31 ... ceramic sheet, 32 ... ring, 33 ... bottom, 33a ... bottom inner surface, 34 ... side wall, 35 ... opening, 40 ... lid member, 41 ... overlap region, 42 ... non-overlap region, 43 ... first vent, 44 ... -Louver part, 45 ... second vent hole,

Claims (7)

A pair of electrodes (24) is formed on one surface (21a) of the substrate (21) so as to face the substrate (21), and covers between the electrodes (24) and the electrodes (24). A humidity sensor (20) having a sensing section (22) in which a moisture sensitive film (26) is disposed, and detecting a change in humidity of the atmosphere as a change in capacitance;
A package (30) having an opening (35) on one surface facing the bottom inner surface (33a) and containing the humidity sensor (20);
A lid member (40) that covers the opening (35) in a state where the humidity sensor (20) is housed in the package (30);
In the humidity sensor (20), the back surface (21b) opposite to the one surface (21a) is the bottom inner surface (33a) of the package (30) so that the sensing portion (22) faces the opening (35). Fixed directly or indirectly to
The lid member (40) includes, among the overlap region (41) and the non-overlap region (42) with the sensing unit (22), in a plane orthogonal to the thickness direction of the substrate (21). A humidity sensor device having a first air hole (43) only in a non-overlap region (42).   The humidity sensor device according to claim 1, wherein the lid member (40) has a plurality of the first vent holes (43).   The humidity sensor device according to claim 2, wherein the plurality of first ventilation holes (43) are provided so as to sandwich the overlap region (41) therebetween.   The humidity sensor device according to any one of claims 1 to 3, wherein the first vent hole (43) also serves as an identification mark. The lid member (40) has a second vent hole (45) whose opening area perpendicular to the plate thickness direction is smaller than the first vent hole (43),
The humidity sensor device according to claim 4, wherein the mark is formed by a combination of the first vent hole (43) and the second vent hole (45). The lid member (40) has a plurality of the second vent holes (45),
The humidity sensor device according to claim 5, wherein at least a part of the plurality of second ventilation holes (45) is provided in the overlap region (41).   The said cover member (40) has a louver part (44) by which the periphery of the said 1st ventilation hole (43) rises in the said plate | board thickness direction at least, The any one of Claims 1-6 characterized by the above-mentioned. The humidity sensor device described in 1.

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