JP2014090108A - Surface-mount component mounting machine, and component identification method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the following problem: as to surface-mount components, although differences are produced in component dimensions and accuracy of finishing depending on a multivendor environment and production lots, a component library can resister only one component library with respect to one kind of surface-mount component in a present surface-mount component mounting machine, therefore, the component dimension and a component identification method has to be determined on one kind of the surface-mount component, and when the surface-mount component mounting machine implements component identification, it is determined that the component cannot be mounted during component identification, and the stop time of a production line increases thereby.SOLUTION: As to a component library used in a surface-mount component mounting machine, not only one component library but also a plurality of the component libraries can be registered with respect to one kind of component. A plurality of component dimensions and component identification methods can be set respectively for a component having large dimensional variations attendant on the multivendor environment of the surface-mount components.

Description

  The present invention relates to a surface mounting component mounting machine and a component identification method, and more particularly to a surface mounting component mounting machine and a component identification method corresponding to a multi-vendor.

  The flow of the surface mounting process will be described with reference to FIG. In FIG. 1, the surface mounting process includes a solder printing process (S1), a surface mounting component mounting process (S2), and a reflow soldering process (S3). In the solder paste printing process, the solder paste is printed on a printed board using a solder paste printer. In the surface mounting component mounting step, the surface mounting component is mounted at a designated position on the printed board using a surface mounting component mounting machine. In the reflow soldering process, the printed circuit board that has been mounted is heated using a reflow soldering apparatus, and the solder paste printed on the printed circuit board is melted and solidified.

  With reference to FIG. 2, the structure of the surface mounting component mounting machine used in the surface mounting component mounting step will be described. In FIG. 2, the surface mount component mounting machine 100 includes a transport rail 110, a component supply unit 120, a component suction unit 130, and a component identification unit 140. The transport rail 110 carries in the printed circuit board 200. The component supply unit 120 arranges surface mount components. The component adsorption unit 130 adsorbs the surface-mounted components and assembles them on the printed board 200. The component identification unit 140 acquires dimensional information of the surface-mounted component sucked by the component suction unit 130.

  The surface mount component mounting machine 100 carries the printed circuit board 200 into the surface mount component mounting machine 100 using the transport rail 110. The component adsorption unit 130 moves to the component supply unit 120 and adsorbs the surface mounted components. The component suction unit 130 passes through the upper part of the component identification unit 140 in a state where the surface mount component is sucked. The component identification unit 140 acquires dimensional information of the sucked surface mount component and performs component identification. What is used for component identification is information (hereinafter referred to as a component library) in which dimension information of a surface-mounted component, a component identification method, and the like are input. The surface mount component mounting machine 100 compares the component library with the dimension information of the surface mount component, and determines whether the dimension of the identified surface mount component is the same. At the same time, the component suction unit 130 moves to the designated coordinate position on the printed circuit board 200 and mounts the surface mount component.

  With reference to FIG. 3, the surface mounting component mounting process of the surface mounting component mounting machine will be described. In FIG. 3, in the surface mounting component mounting, the component suction unit 130 of the surface mounting component mounting machine 100 first sucks the surface mounting component (S4). The surface mounting component mounting machine 100 takes in the component library of the surface mounting components sucked from the component library database 3 (S5). The component of the surface mount component that the component identification unit 140 of the surface mount component mounting machine 100 has picked up is identified, and the surface mount component mounting device 100 performs component identification with the component dimension information and component identification of the captured component library. The dimension information is compared (S6). If the component dimension information at the time of component identification matches the component dimension information in the registered component library, the surface mount component mounting machine 100 determines that the surface mount component identified by the component can be mounted, and designates the specified coordinate position on the printed circuit board. The surface mounting component is mounted (S7), and the process ends.

  If the part dimension information at the time of part identification and the part dimension information in the registered part library do not match, the surface mount component mounting machine 100 determines that the surface mount part identified by the part cannot be mounted, and collects the surface mount part (S8). ). The surface mounting component mounting machine 100 stops the component mounting operation in order to issue an alarm that the surface mounting component has been collected (S9), and ends.

  With reference to FIG. 4A, a configuration of a transistor component having four terminals will be described. In FIG. 4A, the transistor component 40 is a component having a rectangular mold portion 41 and four leads 42 extending from the mold portion 41.

  With reference to FIG. 4B, the parts library setting items will be described. 4B, the component library 30 includes a component library 31, an identification target 32, lead / electrode dimensions (vertical) 33, lead / electrode dimensions (horizontal) 34, illuminance 35, and external dimensions (vertical) 36. , And an external dimension (horizontal) 37.

  The component library 31 is a name of the direction-mounted component. The identification target 32 sets a location where the component identification of the transistor component 40 is performed. The lead / electrode dimension (vertical) 33 sets the vertical dimension of the lead 42 or electrode of the transistor component 40. The lead / electrode dimension (horizontal) 34 sets the lateral dimension of the lead 42 or electrode of the transistor component. The illuminance 35 sets the amount of light applied to the transistor component 40 during component identification. The external dimension (vertical) 36 sets the vertical dimension of the mold part 41 of the transistor component 40. The external dimension (horizontal) 37 sets the horizontal dimension of the mold part 41 of the transistor component 40. In FIG. 4B, since the identification target 32 is “lead”, the outer dimension (vertical) 36 and the outer dimension (horizontal) 37 do not have values.

  In recent years, in order to reduce product costs, multi-vendor purchases in which one type of surface mount component is purchased from a plurality of component vendors have become common. Even multi-vendor parts are purchased using one type of purchase specification, so basically parts with the same part dimensions are purchased. In general, a purchase specification sheet describes a part dimension tolerance or a required part dimension tolerance from a purchaser. Therefore, if they are within the dimensional tolerances of those parts, they are treated as the same part.

  The multi-vendor component will be described with reference to FIG. Here, FIG. 5A is a front view of the transistor component of the component vendor A. FIG. FIG. 5B is a partially enlarged front view of the transistor component of the component vendor A. Further, FIG. 5C is a front view of the transistor component of the component vendor B. FIG. 5D is a partially enlarged front view of the transistor component of the component vendor A.

  A multi-vendor component is a component having the same performance and function purchased from a plurality of component vendors A and B for one type of component. However, multi-vendor parts have different equipment and production processes owned by each vendor. For this reason, the parts produced by each vendor are not necessarily the same mold part and lead dimensions.

  Specifically, the transistor component 60 of the component vendor B has a smaller vertical dimension of the mold portion 61 than the mold portion 51 of the transistor component 50 of the component vendor A. In the transistor component 60 of the component vendor B, the longitudinal dimension of the lead 62 is longer than the lead 52 of the transistor component 50 of the component vendor A. When the multi-vendor component creates a component library using the transistor component 50 of the component vendor A due to the difference in component dimensions, the surface mount component mounting machine 100 uses the transistor component 60 of the component vendor B as a different surface mount component. Identify.

  As a result, the surface mount component mounting machine 100 determines that the surface mount component identified by the component cannot be mounted, and collects the surface mount component. Thereafter, the surface mount component mounting machine 100 stops the component mounting operation.

  With reference to FIG. 6, the carrier tape in which the surface mount components are packed will be described. In FIG. 6, the surface mount component 80 is composed of a body 81 and leads 82. The surface mount component 80 is continuously packed in the carrier tape 7 and delivered from the vendor. When the surface mounting component mounting machine 100 sucks the surface mounting component 80, an angular deviation θ in the horizontal plane is generated with respect to the suction surface of the surface mounting component 60 due to a gap between the surface mounting component 80 of the carrier tape 7 and the carrier tape 7. Adsorb as it is. If the surface mounting component mounting machine 100 performs component identification while the angle deviation θ is generated, the angle deviation θ may be corrected or the angle deviation θ may not be corrected depending on the accuracy of the dimension information of the registered component library. is there.

  The reason will be described with reference to FIGS. Here, FIG. 7 is a diagram for explaining angle correction when the component dimension information of the component library is created with the typical value of the surface-mounted component. On the other hand, FIG. 8 is a diagram for explaining a case where the maximum value of the part dimension tolerance is input to the part dimension information of the part library.

  FIG. 7A shows a state in which the sucked surface mount component 80 is compared with the component library 9 created in the same shape as the component dimensions of the surface mount component. When the component library 9 has the same shape as the component size of the surface-mounted component 80, the surface-mounted component mounting machine 100 can identify the angle deviation θ in the horizontal plane with respect to the suction surface of the surface-mounted component generated during component suction at the time of component identification. It is. Therefore, the surface mounting component mounting machine 100 mounts the surface mounting component 80 on the pad 11 on the printed circuit board after correcting the angular deviation θ during component mounting as shown in FIG. 7B.

  FIG. 8A shows a state in which the sucked surface mount component 80 is compared with the component library 12 created with the maximum component dimension tolerance of the surface mount component. When the maximum value of the component dimension tolerance of the surface mount component is input to the component library 12, the surface mount component mounting machine 100 is located in a horizontal plane with respect to the suction surface of the surface mount component generated during component suction at the time of component identification. The angle deviation θ cannot be identified. For this reason, the surface mounting component mounting machine 100 is mounted on the pad 10 on the printed circuit board without correcting the angular deviation θ at the time of component suction as shown in FIG. 8B.

  As a result, in the case of a surface-mounted component where the distance between the electrodes or leads 82 of the surface-mounted component is short, an angular deviation θ in the horizontal direction remains with respect to the suction surface of the surface-mounted component when mounted. In addition, a solder short circuit occurs when the electrodes of the surface mount component and the leads 82 come into contact with a pad 11 different from the pad 11 to be originally mounted.

  With reference to FIG. 9, an on-board power source that is an unstable component identification will be described. 9A is a plan view of the on-board power supply 400, FIG. 9B is a front view of the on-board power supply 400 viewed from the longitudinal direction, and FIG. 9C is an on-board power supply 400. FIG. 9D is a bottom view of the on-board power supply 400. FIG. In the front view and the side view, some parts are omitted for the sake of simplicity.

  The on-board power supply 400 is already mounted with several surface-mounted components such as a transistor 122, a chip 123, and a coil 124 on both sides of the printed circuit board 121. These are small module type surface mount components that adjust the voltage flowing through the printed circuit board. Consider a case where the on-board power source 400 is used as a daughter board and is surface-mounted on a printed circuit board 200 as a motherboard.

  In general, the surface mounting component mounting machine 100 performs component identification from the lower surface of the surface mounting component. For this reason, there is reflection of light from the leads 125 of the surface-mounted components already mounted on the lower surface of the on-board power supply 400, the electrode portion 126, and the printed board 121. If the component dimension information at the time of component identification by reflection does not match the component dimension information of the registered component library, the surface mount component mounting machine 100 determines that the surface mount component identified by the component cannot be mounted and collects the surface mount component. To do. Then, the surface mounting component mounting machine 100 stops the component mounting operation in order to give an alarm that the surface mounting component has been collected.

  There exists patent document 1 as background art. According to Patent Document 1, the line setup system includes a component library storing a component shape data name corresponding to a component number and a database including the component shape, and registers the component by reading the delivery number printed on the component. Then, the multi-vendor parts are distinguished, the part numbers are confirmed, and the installation program is created.

  The method for distinguishing multi-vendor parts in Patent Document 1 is a method for creating multi-vendor parts for each vendor and corresponding to multi-vendor parts by switching the parts library itself when the parts vendor is switched.

  Patent Document 1 is effective in a low-volume, high-volume production factory that purchases one type of component in large quantities because there are few switching of component vendors. However, in a high-mix low-volume production plant where the number of parts used and the number of purchases are small, one part is used in multiple production facilities, so if that part is a multi-vendor part, the part used during production It is difficult to figure out where the vendor is. Therefore, even if a surface mount component of a certain component vendor is registered in advance, the pre-registered surface mount component cannot always be used. For this reason, the parts library is changed during production, and the production line stop time increases.

JP 2004-039881 A

  For surface mount components, differences in component dimensions and finished dimensional accuracy occur due to multi-vendor production and production lots. In a conventional surface mount component mounting machine, only one library can be registered for one type of surface mount component. For this reason, it is necessary to perform one part dimension and one part identification method. If the component dimension information at the time of component identification on the surface mount component mounting machine does not match the component dimension information in the registered component library, the surface mount component mounter determines that the identified surface mount component cannot be mounted. Recover. The surface mounting component mounting machine stops the component mounting operation in order to give an alarm that the surface mounting component has been collected. Since the surface mount component determined to be unmountable is collected after the surface mount component mounting machine is stopped once, the stop time of the production line increases.

  Multiple component libraries can be registered for a single type of surface mount component for the component library used on the surface mount component mounting machine. Make it possible to set each dimension and part identification method.

  The above-described problems include a conveyance rail that conveys a printed circuit board, a component supply unit that arranges a plurality of surface-mounted components, a component adsorption unit that assembles the first surface-mounted component adsorbed by the component supply unit, and a component A component identification unit that acquires dimensional information from the first surface-mounted component conveyed by the suction unit, and includes a plurality of libraries for each of a plurality of vendors that supply the first surface-mounted component. However, when it matches one of the plurality of libraries, it can be solved by a surface mounting component mounting machine that determines that the component is correct and assembles the first surface mounting component on the printed circuit board.

  In addition, a conveyance rail that conveys the printed circuit board, a component supply unit that arranges a plurality of surface mount components, a component adsorption unit that assembles the first surface mount component adsorbed by the component supply unit to the printed circuit board, and a component adsorption unit A component identification method in a surface mounting component mounting machine configured to include a component identification unit that obtains dimensional information from a first surface mounting component to be conveyed, wherein the surface mounting component mounting machine includes: A component that includes a plurality of libraries for each of a plurality of vendors that supply mounting components, and determines that the component is the correct component when the dimensional information matches any of the plurality of libraries, and assembles the first surface mounting component on the printed circuit board. This can be achieved by the identification method.

  Since a plurality of component libraries are set for one type of component, when component vendor switching occurs during production, it is possible to immediately respond to component vendor switching without changing the component library.

It is a flowchart of a surface mounting process. It is a top view of a surface mounting component mounting machine. It is a surface mounting component mounting flow. It is a top view of surface mount components. It is a figure explaining a component library. It is the top view and front view of a multi-vendor part. It is a top view explaining the packing state of surface mount components. It is a figure explaining the angle correction | amendment at the time of producing the component dimension information of a component library with the typical value of a surface mounted component. It is a figure explaining component identification and component mounting using the library of the maximum value of component dimension tolerance. It is a 4th page figure of an on-board power supply. It is a flowchart of surface mounting component mounting. It is a figure explaining a component library. It is a flowchart of other surface mount component mounting. It is a figure explaining another parts library. It is a flowchart of the usage rate calculation of a component library. It is a figure explaining other parts library. It is a flowchart of use date management of a parts library.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings using examples. The same reference numerals are assigned to substantially the same parts, and the description will not be repeated.

  With reference to FIG. 10, a surface mounting component mounting process when a plurality of component libraries are registered for one component will be described. In addition, the structure of the surface mounting component mounting machine 500 demonstrated in an Example is the same as that of FIG.

  In FIG. 10, the surface mount component mounting machine 500 sucks the surface mount component from the component supply unit 120 (S10). The surface mounting component mounting machine 500 takes in the component library of the surface mounting components sucked from the component library database 300 (S11). The surface mount component mounting machine 500 performs component identification of the adsorbed surface mount component by the component identification unit 140 (S12). The surface mount component mounting machine 500 compares the component dimension information of the component library fetched in step 11 with the component dimension information when the component identification is performed in step 12, and the dimension information of the surface mount component matches. (S13). If the component dimension information at the time of component identification matches the component dimension information in the registered component library, the surface mount component mounting machine 500 determines that the surface mount component identified by the component can be mounted, and designates the specified coordinate position on the printed circuit board. The surface mounting component is mounted (S14), and the process ends.

  If the part dimension information at the time of part identification and the part dimension information of the registered part library do not match, the surface mount component mounting machine 500 determines whether there is a next candidate part library in the part library fetched from the part library database 300. (S15). When the next candidate component library is registered in the component library, the surface mount component mounting machine 500 determines again whether or not they match using the next candidate component library (S13). If the next candidate component library is not registered in the component library, the surface mount component mounting machine 500 determines that the surface mount component identified by the component cannot be mounted, and collects the surface mount component (S16). The surface mounting component mounting machine 500 stops the component mounting operation to issue an alarm that the surface mounting component has been collected (S17), and ends.

  With reference to FIG. 11, the part library 350 acquired from the part library database 300 by taking in the part library information (S11) of FIG. 10 will be described. The component library 350 is a library for registering a plurality of child components for one parent component.

  11, the component library 350 includes a child component ID 351, an identification target 352, lead / electrode dimensions (vertical) 353, lead / electrode dimensions (horizontal) 354, illuminance 355, and external dimensions (vertical) 356. , And external dimensions (horizontal) 357. The component library 350 is a library of child components for the parent component ID: 600.

  In order to register a plurality of child component libraries for one type of surface mount component (parent), the component library 350 handles the component library to be used as a table. Since the component library 350 corresponds to multi-vendor components and components with large component dimensional tolerances, a plurality of component libraries are registered for one type of surface mount component. Therefore, a part library corresponding to each part vendor or part dimension tolerance can be registered.

  First, the component library creator registers the parent component ID used in the component library database 300 for one type of surface mount component. The component library creator prepares a surface mount component 50 of component vendor A and a surface mount component 60 of component vendor B to be registered next, and creates a child component ID and a component library. For the surface-mounted component 50 of the component vendor A and the surface-mounted component 60 of the component vendor B, the component library creator associates the parent component ID registered first with the parent-child relationship.

  Specifically, when 600 is registered as the parent component ID for one type of surface mount component, the child component ID of the surface mount component 50 of the component vendor A is 600-A. On the other hand, the child component ID of the surface mount component 60 of the component vendor B is 600-B.

  The child component IDs 600-A and 600-B are component libraries when the surface mount component identification target is a lead. The child component IDs 600-C and 600-D are component libraries when the surface mount component identification target is a mold part.

  According to the present embodiment, the surface mount component mounting machine compares the component dimension information by a plurality of component libraries with the component dimension information at the time of component identification for one type of surface mount component, It is determined whether or not the dimension information of the mounted parts matches. Accordingly, the surface mount component mounting machine can produce the multi-vendor component without determining that the multi-vendor component cannot be mounted at the time of component identification. For this reason, the collection | recovery of surface mounting components and the stop time of a surface mounting component mounting machine can be reduced.

  In the second embodiment, the component library information used by the surface mount component mounting machine for component identification is accumulated in the component library database as usage rate information indicating the usage frequency of the component library based on the past mounting results, and the accumulated information is stored. A method of assigning a priority order for component identification to the component library based on the usage rate information will be described.

  With reference to FIG. 12, the process which added the usage information output (S25) of the component library to the process of surface mounting component mounting of Example 1 is demonstrated. In FIG. 12, the surface mount component mounting machine 500 sucks the surface mount component from the component supply unit 120 (S20). The surface mount component mounting machine 500 takes in the component library of the surface mount components sucked from the component library database 310 (S21). Then, the component identification of the surface mounted component adsorbed by the component identification unit installed in the surface mounted component mounting machine is performed (S22). In the surface mounting component mounting, the component dimension information of the component library fetched in step 21 is compared with the component dimension information when the step 22 component identification is performed, and it is determined whether or not the dimension information of the surface mounting component matches. (S23). If the component dimension information at the time of component identification matches the component dimension information in the registered component library, the surface mount component mounting machine 500 determines that the surface mount component identified by the component can be mounted, and designates the specified coordinate position on the printed circuit board. A surface-mounted component is mounted (S24). The surface mount component mounting machine 500 outputs the usage information to the component library database 310 (S25) and ends.

  If the part dimension information at the time of part identification does not match the part dimension information of the registered part library in step 23, the surface mount component mounting machine 500 determines whether there is a next candidate part library in the part library fetched from the part library database 310. Is determined (S26). When the next candidate component library is registered in the component library, the surface mount component mounting machine 500 determines again whether or not they match using the next candidate component library (S23). If the next candidate component library is not registered in the component library in step 26, the surface mount component mounting machine 500 determines that the surface mount component identified by the component cannot be mounted, and collects the surface mount component (S27). The surface mount component mounting machine 500 is. The component mounting operation is stopped in order to issue an alarm that the surface mount component has been collected (S23), and the process ends.

  The component library 360 recorded in the component library database 310 will be described with reference to FIG. Here, FIG. 13A is a component library to which information on the usage rate of child components and priority are given. FIG. 13B is a component library in which the usage rate and priority assigned in FIG. In FIG. 13, the component library 360 includes a child component ID 361, a use count 362, a use rate 363, and a priority 364.

  When comparing all the component libraries registered by the surface mount component mounting machine 500 with the acquired information at the time of component identification, the mounting time per type of the surface mount component is delayed in proportion to the number of registered component libraries. Therefore, the surface mount component mounting machine 500 needs to not only support multi-vendor components but also minimize the influence on the time for mounting the surface mount components.

  In order to minimize the influence of the surface mounting component mounting machine 500 on the time for mounting the surface mounting component, it is necessary to minimize the number of times the surface mounting component and the component library are compared during component identification. Therefore, the component library information used by the surface mount component mounting machine 500 for component identification is accumulated in the component library database 310 as usage rate information representing the frequency of use of the component library based on past mounting results, and the accumulated use is stored. Based on the rate information, a priority 364 at the time of component identification is given to the component library 360.

  The component library information used by the surface mount component mounting machine for component identification is accumulated in the component library database as usage rate information indicating the usage frequency of the component library based on past mounting results, and the accumulated usage rate information Based on this, a priority is given to the order of the libraries referred to the parts library when identifying the parts.

  Specifically, as shown in FIG. 13A, there is a track record of mounting one type of surface mount component on the printed circuit board 100 times in the past, the component library 600-A is 50 times, and the component library 600-B is 20 times. If the component library 600-C is 10 times, the usage rate of each component library is 50% for the component library 600-A, 20% for the component library 600-B, and 10% for the component library 600-C. . Therefore, the priority order of the component library used by the surface mount component mounting machine for component identification is number 1 for the component library 600-A, number 2 for the component library 600-B, and number 3 for the component library 600-C.

  Thereafter, as shown in FIG. 13B, there is a track record of mounting on the printed circuit board 200 times in the past, the component library 600-A is 60 times, the component library 600-B is 100 times, and the component library 600-C is 10 times. In the case of the number of times, the usage rate of each component library is 50% for the component library 600-A, 30% for the component library 600-B, and 10% for the component library 600-C. Accordingly, the priority order of the component library used by the surface mount component mounting machine for component identification is changed to No. 1 for the component library 600-B, No. 2 for the component library 600-A, and No. 3 for the component library 600-C.

  With reference to FIG. 14, the process by which the surface mount component mounting machine determines the priority will be described. In FIG. 14, the surface-mounted component mounting machine 500 takes in the usage information of the component library into the component library database after mounting the surface-mounted component (S30). The surface mount component mounting machine 500 adds the usage record information to the component library used at the time of component mounting (S31). The surface mount component mounting machine 500 calculates the usage rate of the component library based on the usage record of the component library (S32). The surface mount component mounting machine 500 compares the calculated usage rate with the usage rate of the unused component library (S33), and confirms whether there is a change in the order of the usage rates (S34). When the order of usage rate changes, the surface mount component mounting machine 500 changes the priority of the component library at the time of component identification (S35) and ends. When there is no change in the usage rate in step 34, the surface mount component mounting machine 500 ends the usage rate calculation of the component library.

  According to the present embodiment, the surface mount component mounting machine accumulates the information of the component library used in the component identification in the component library database as usage rate information indicating the frequency of use of the component library based on the past mounting results, Since a priority order is assigned to the component library based on the accumulated usage rate information, the priority order of the component library is always arranged in order of frequency of use.

  Accordingly, it is possible to minimize the number of component libraries that the surface mount component mounting machine compares at the time of component identification.

  In the third embodiment, a description will be given of a change in priority order when identifying a plurality of registered component libraries, in particular, mounting of a surface mount component related to a surface mount component to which the same component can be continuously supplied. The surface mounting component mounting flow is as shown in FIG.

  The component library 370 recorded in the component library database 310 will be described with reference to FIG. Here, FIG. 15A shows a component library to which information on the usage rate of child components, usage date and time, and priority are given. FIG. 13B is a component library in which the use date and priority assigned in FIG. In FIG. 15, the component library 370 includes a child component ID 371, a usage count 372, a usage rate 373, a usage date 374, and a priority 375.

  In FIG. 15A, the priority 375 of the parts library is given in the order of the child part IDs 371 used later, not the order in which the usage rate 373 is high. This is because the library of the child part ID 600-C was used 20 times after the state of FIG. 15A, so that the usage rate 373 is not the highest as shown in FIG. 15B. This library can be understood because the priority 375 is “1”.

  During production, the information on the part library used for part identification is not based on the usage rate indicating the frequency of use of the part library based on past mounting results, but the priority order of the part library used for the latest part identification is always the highest priority. By doing so, it is possible to follow the switching of the component vendors of reel components for which the same component can be continuously supplied.

  With reference to FIG. 16, a process for managing the use date and time of the parts library will be described. In FIG. 16, the surface mount component mounting machine 500 takes in the usage information of the component library after mounting the surface mount component (S40). The surface mount component mounting machine 500 acquires the use date and time for the component library used during component mounting (S41). The surface mount component mounting machine 500 compares the acquired use date with the use date and time of the component library that has not been used (S42), and checks whether there is a change in the order of these use dates (S43). If the order of use date / time changes, the surface mount component mounting machine 500 changes the priority of the component library at the time of component identification (S44), and ends. If there is no change in the use date in step 43, the surface mount component mounting machine 500 ends the management of the use date of the component library.

  According to this embodiment, the priority order at the time of component identification of a plurality of registered component libraries is changed, especially for surface mount components that can be continuously supplied with the same component, the component library information used for component identification is based on past mounting results. Regardless of the usage rate indicating the usage frequency of the part library, the priority order of the part library used in the latest part identification is always given the highest priority. By doing so, when a component vendor is switched during production, it immediately follows the surface mount component of the switched component vendor. Therefore, the number of component libraries to be compared at the time of component identification can be reduced.

  According to the above-described embodiment, it is possible to set a plurality of component libraries for one type of component. Therefore, when a component vendor is switched during production, the component library is not changed. It becomes possible to respond to switching of component vendors immediately during production.

  Furthermore, by providing a priority when identifying parts in the parts library, the time required for identifying the parts is equivalent to that when one kind of parts is identified using one part library. It becomes possible to identify the surface mount component in the time required for the identification.

  In addition, since it is not necessary to change the parts library when parts are replenished, production line stop time can be reduced. Furthermore, multi-vendor surface mount components can be easily handled. In addition, the cost of products can be reduced because inexpensive parts having large dimensional variations can be used.

  7 ... Carrier tape, 9 ... Parts library created in the same shape as transistor parts, 10 ... Transistor parts after mounting, 11 ... Pads, 12 ... Parts library created with maximum value of part dimensional tolerance, 30 ... Parts library database, 40 ... Transistor component consisting of 4 terminals, 50... Transistor component consisting of 4 terminals of component vendor A, 60... Transistor component consisting of 4 terminals of component vendor B, 80. Component mounting machine, 110 ... Conveying rail, 120 ... Part supply unit, 130 ... Part suction unit, 140 ... Part identification unit, 200 ... Printed circuit board, 300 ... Part library database, 310 ... Part library database, 320 ... Part library database, 400 ... On-board power supply, 500 ... Surface Instrumentation component mounting machine.

Claims (4)

A conveyance rail for conveying a printed circuit board, a component supply unit for arranging a plurality of surface mount components, a component adsorption unit for assembling the first surface mount component adsorbed by the component supply unit to the printed circuit board, and the component adsorption unit A component identification unit that acquires dimensional information from the first surface-mounted component that is conveyed by,
A plurality of libraries for each of a plurality of vendors supplying the first surface mount component, and when the dimensional information matches any of the plurality of libraries, the first surface is determined to be a correct component; A surface mount component mounting machine, wherein a mount component is assembled to the printed circuit board. The surface mount component mounting machine according to claim 1,
Each of the plurality of libraries includes usage rate information, and is compared with the dimensional information in descending order of the usage rate. The surface mount component mounting machine according to claim 1,
Each of the plurality of libraries includes usage date information, and is compared with the dimension information in order of the usage date. A conveyance rail for conveying a printed circuit board, a component supply unit for arranging a plurality of surface mount components, a component adsorption unit for assembling the first surface mount component adsorbed by the component supply unit to the printed circuit board, and the component adsorption unit A component identification method in a surface mount component mounting machine configured to include a component identification unit that acquires dimensional information from the first surface mount component conveyed by
The surface mount component mounting machine includes a plurality of libraries for a plurality of vendors that supply the first surface mount component,
When the dimensional information matches any of the plurality of libraries, it is determined that the component is a correct component, and the first surface mount component is assembled to the printed circuit board.

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