JP2014080652A - Plating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To optimize, by forming, on both surfaces of a belt-shaped member, portions to which no plating layers are applied and portions to which plating layers are applied, contact conditions of the belt-shaped member with a first masking component and a second masking component.SOLUTION: The provided plating apparatus forms, while a hoop material 11 is being conveyed along the longitudinal direction thereof, portions to which no plating layers are applied and portions to which plating layers are applied on both surfaces of the hoop material 11 and includes a shield plate 33 contacted with one surface of the hoop material 11 so as to form thereon a portion to which no plating layer is applied, another shield plate 33 contacted with the other surface of the hoop material 11 so as to form thereon a portion to which no plating layer is applied and configured so as to sandwich, together with the former shield plate 33, the hoop material 11 from both sides of the thickness direction thereof, shield bar receivers 35 respectively for supporting the two shield plates 33 independently in mobile fashions along the thickness direction of the hoop material 11, and springs 39 respectively for impressing, onto the two shield plates 33 independently, forces along approaching directions of the two shield plates 33 toward the hoop material 11.

Description

  The present invention relates to a plating apparatus for plating a strip-shaped member such as a hoop material that forms an electronic component.

  Conventionally, in order to mass-produce electronic parts such as transistors, ICs and switches, connectors, and steel plate materials that require surface treatment, a strip member called a hoop material is plated. An example of a plating apparatus that forms a portion on which the plating layer is applied and a portion on which the plating layer is not applied on the surface of the belt-like member among the plating apparatuses that perform plating on the surface of such a belt-like member is described in Patent Document 1. Has been.

  The plating apparatus described in Patent Document 1 has a plating tank, and a blowing device is provided in the plating tank. A positive electrode is provided in the plating tank, and a gap is formed in the positive electrode. The blowing device takes in the plating solution in the plating tank and blows out the plating solution toward the gap between the positive electrodes. A shielding plate is provided on the positive electrode, and an opening is formed in the shielding plate.

  On the other hand, a hoop material (strip-shaped member) serving as a negative electrode is held substantially horizontally above the plating tank. The lower surface of the hoop material is covered with a mask. Of the lower surface of the hoop material, portions not covered by the mask are first exposed portions and second exposed portions. The first exposed portion of the hoop material is located directly above the opening of the shielding plate, and the second exposed portion of the hoop material is located directly above the shielding plate.

  When a voltage is applied between the positive electrode and the hoop material and the plating solution is blown out from the blowing device, the plating solution passes directly through the gap between the positive electrode and the opening of the shielding plate. And blown out. Then, the plating solution directly contacts the first exposed portion and the second exposed portion that are not covered with the mask on the lower surface of the hoop material, and a plated layer is formed. On the other hand, no plating layer is formed on the lower surface of the hoop material that is covered with the mask. Here, the first exposed portion is located immediately above the opening of the shielding plate, and the second exposed portion is located directly above the shielding plate. For this reason, the flow rate of the plating solution reaching the first exposed portion is larger than the flow rate of the plating solution reaching the second exposed portion, and the thickness of the plating layer formed on the first exposed portion is the second exposed portion. It becomes thicker than the thickness of the plating layer formed on the part.

JP 2006-299321 A

  The plating apparatus described in Patent Document 1 is an apparatus that performs a plating process in a state in which the hoop material is held in a substantially horizontal direction, that is, in a state in which the thickness direction of the hoop material is substantially in the vertical direction. By the way, the hoop material is supported vertically so that the thickness direction of the hoop material is substantially in the horizontal direction, and plating is performed on both surfaces while conveying the hoop material in the longitudinal direction. . Thus, in a plating apparatus that performs plating treatment on both surfaces of the hoop material, when forming a portion not to be plated and a portion to be plated on each of both surfaces of the hoop material, It is necessary to provide a first masking member and a second masking member that are in separate contact with each other.

  However, in the case of a hoop material formed by connecting two members in the longitudinal direction, there is a step at the connection portion between the two members. This step appears as a step in the thickness direction of the hoop material. Then, there is a problem that the contact state of the first masking member and the second masking member with the hoop material becomes inappropriate.

  An object of the present invention is to make the contact state of the first masking member and the second masking member with respect to the belt-like member appropriate when forming a portion where the plating layer is not applied on both sides of the belt-like member and a portion where the plating layer is applied. An object of the present invention is to provide a plating apparatus capable of performing the following.

  The present invention is a plating apparatus for forming a portion on which a plating layer is applied and a portion on which a plating layer is not applied on both surfaces of a belt-like member conveyed in the longitudinal direction, in order to form a portion on which the plating layer is not applied A first masking member that contacts one surface of the band-shaped member; and a second masking member that contacts the other surface of the band-shaped member to form a portion where the plating layer is not applied, and the first masking member. And a first support for movably supporting the first masking member and the second masking member independently in the thickness direction of the belt-shaped member. A mechanism and a force in a direction to bring the first masking member and the second masking member closer to the belt-like member are applied to the first masking member and the second masking member. Wherein the Re and a first elastic member for applying alone.

  According to one aspect of the present invention, when the strip member is transported in a state where the thickness direction of the strip member is a horizontal direction, a portion where the plating layer is applied to both surfaces of the strip member and a plating layer are not applied. And forming a portion.

  According to another aspect of the present invention, a pair of positioning members that contact both edges in the width direction of the band-shaped member to position the band-shaped member in the width direction, and one of the pair of positioning members is connected to the band-shaped member. A second support mechanism that is movably supported in the width direction; and a second elastic member that applies a force in a direction approaching the belt-shaped member to the positioning member that is movably supported by the second support mechanism. It is characterized by that.

  According to the present invention, the first masking member and the second masking member are separately in contact with the surface of the strip member, and the first masking member and the second masking member are brought close to the strip member by the force of the first elastic member. . Therefore, the contact state of the 1st masking member and the 2nd masking member with respect to a strip | belt-shaped member can be made appropriate.

  According to one aspect of the present invention, the belt-shaped member can be conveyed and the plating layer can be formed on both surfaces of the belt-shaped member with the thickness direction of the belt-shaped member being in a state along the horizontal direction.

  According to the other aspect of the present invention, even when the belt-like members having different widths are conveyed, the belt-like members can be prevented from moving in the width direction.

It is a typical front view of the plating apparatus of this invention. It is a typical top view of the plating apparatus of this invention. It is a typical side view of the plating apparatus of this invention. It is a partial side sectional view of the plating apparatus of the present invention. It is a front view of the partial plating shielding part which is a part of plating apparatus of this invention. It is a top view of the partial plating shielding part which is a part of plating apparatus of this invention. It is a plane sectional view of the partial plating shielding part of Drawing 5 and Drawing 6. It is side surface sectional drawing which shows the principal part of the partial plating shielding part of FIG. 5, FIG. It is side surface sectional drawing which shows the principal part of the partial plating shielding part of FIG. 5, FIG. (A), (B) is a top view of the state which contacted the shielding board on both surfaces of the hoop material. It is a partial perspective view of the hoop material which performs a plating process with the plating apparatus of this invention. It is a typical top view which shows other embodiment of the plating apparatus of this invention. It is typical side surface sectional drawing of the plating apparatus shown by FIG. FIG. 13 is a partial side cross-sectional view of the plating apparatus shown in FIG. 12. FIG. 13 is a partial side cross-sectional view of the plating apparatus shown in FIG. 12. It is a partial front view of the shielding board of the plating apparatus shown by FIG. It is a partial perspective view of the hoop material which performs a plating process with the plating apparatus shown by FIG.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. 1 and 2 show a plating apparatus (electroplating apparatus) 10 according to a first embodiment of the present invention. The plating apparatus 10 is an apparatus that performs plating on both surfaces of the hoop material 11 conveyed in the longitudinal direction. A degreasing processing unit, a water washing processing unit, a chemical polishing processing unit, and the like are provided in series upstream of the plating apparatus 10 in the conveying direction of the hoop material 11. Further, a hot water washing processing unit, a drying processing unit, and the like are provided in series downstream of the plating apparatus 10 in the conveying direction of the hoop material 11. In FIG. 1 and FIG. 2, these processing units are omitted. In the present embodiment, the conveyance direction of the hoop material 11 mainly means a conveyance direction in a horizontal plane or a conveyance direction along the horizontal direction.

  The hoop material 11 is made of a metal material, for example, a thin plate such as a nickel alloy, a copper alloy, an iron-based alloy, stainless steel, or titanium. When the target component is a transistor, lead portions (not shown) corresponding to the terminals of the transistor are formed in advance on the hoop material 11 by pressing or etching. Further, a transistor (not shown) is mounted on the hoop material 11. Further, depending on the target component, a flat hoop material 11 whose surface is not subjected to any processing is used. Furthermore, the target components include electronic components such as ICs and switches, connectors, functional materials and the like in addition to transistors. The plating apparatus 10 is an apparatus that partially performs various types of plating, for example, silver plating, nickel plating, copper plating, gold plating, tin plating, etc. on both surfaces of the hoop material 11.

  The plating apparatus 10 includes a plating tank 12. As shown in FIG. 3, the plating tank 12 has a bottom plate 13 provided in a substantially horizontal direction. The planar shape of the bottom plate 13 is rectangular, and the large side plates 14 a and 14 b are connected to the two long sides of the bottom plate 13, respectively. The two large side plates 14a and 14b are parallel to each other, and the two large side plates 14a and 14b are set up in a substantially vertical direction. Small side plates 15 a and 15 b are connected to the two short sides of the bottom plate 13, respectively. The two small side plates are parallel to each other, and the two small side plates 15a and 15b are erected substantially vertically. The ends of the two small side plates 15a and 15b are connected to the two large side plates 14a and 14b.

  A high partition plate 16 and low partition plates 17a, 17b, 17c, and 17d are provided in a rectangular interior A surrounded by the two large side plates 14a and 14b and the two small side plates 15a and 15b. The high partition plate 16 is provided in parallel with the two large side plates 14a and 14b, and both ends in the longitudinal direction of the high partition plate 16 are connected to the two small side plates 15a and 15b. Two low partition plates 17a and 17b are provided between the high partition plate 16 and one large side plate 14a. The two low partition plates 17a and 17b are provided in parallel with the two large side plates 14a and 14b, and both ends in the longitudinal direction of the low partition plates 17a and 17b are connected to the two small side plates 15a and 15b. . Further, two low partition plates 17c and 17d are provided between the high partition plate 16 and the other large side plate 14b.

  The two low partition plates 17c and 17d are provided in parallel with the two large side plates 14a and 14b, and both ends in the longitudinal direction of the low partition plates 17c and 17d are connected to the two small side plates 15a and 15b. . The four low partition plates 17a, 17b, 17c, and 17d are all the same height, and the four low partition plates 17a, 17b, 17c, and 17d are higher in height than the high partition plate 16. Low. A plurality of slits 18 are provided in each of the two small side plates 15a and 15b. FIG. 3 shows an example in which four slits 18 are provided in each of the two small side plates 15a and 15b. The slits 18 provided in the two small side plates 15a and 15b are both cut out linearly from the upper ends of the small side plates 15a and 15b downward.

  A rectangular space A surrounded by the two large side plates 14a, 14b and the two small side plates 15a, 15b is partitioned into four rows A1, A2, A3, A4. The first row interior A1 is formed between the large side plate 14a and the low partition plate 17a, and the second row space A2 is formed between the low partition plate 17b and the high partition plate 16. . The space A3 in the third row is formed between the high partition plate 16 and the low partition plate 17c, and the space A4 in the fourth row is formed between the low partition plate 17d and the large side plate 14b. . In the horizontal plane, the interiors A1, A2, A3, A4 are arranged in parallel to each other. Further, slits 18 are arranged at both ends of each of the internal parts A1, A2, A3, A4 in the conveying direction of the hoop material 11. Two sets of plating solution jets 19a and 19b are provided in the interiors A1, A2, A3 and A4, respectively. One plating solution jet portion 19b is arranged downstream of the other plating solution jet portion 19a in the conveying direction of the hoop material 11. In any of the insides A1, A2, A3, and A4, the configuration of the plating solution jet portion 19a is the same as the configuration of the plating solution jet portion 19b.

  Hereinafter, the structure of the plating solution jet portion 19b will be described as an example. As shown in FIGS. 4 and 5, the plating solution jet 19 b includes a nozzle base 20 and a fixed base 21. The nozzle base 20 is made of a resin material or the like, and a supply path 22 for supplying a plating solution is provided on the upper surface of the nozzle base 20. Further, the nozzle base 20 is fixed to the bottom plate 13 via a plurality of leg portions 23, in the example of FIG. 1, two leg portions 23. The two leg portions 23 are provided at different positions in the conveying direction of the hoop material 11. Thereby, the nozzle base 20 is supported substantially horizontally. The fixing base 21 is fixed to the upper surface of the nozzle base 20. In the horizontal plane, the outer peripheral shape of the fixing base 21 is substantially the same as the outer peripheral shape of the nozzle base 20, and the supply path 22 is covered with the fixing base 21.

  A plurality of sets of two hoop guides 24 are provided on the fixed base 21. In the example of FIG. 1, three sets of hoop guides 24 are provided in the plating solution jet part 19a. The two hoop guides 24 are mechanisms for guiding the hoop material 11 to be conveyed. The two hoop guides 24 are attached to the mount 24a so as to be rotatable about an axis in the vertical direction. Further, the mount 24a is fixed to the fixed base 21 with bolts 24b. The two hoop guides 24 are provided so as to sandwich the conveyance path B of the hoop material 11. The plating apparatus 10 in the present embodiment supports the hoop material 11 in a state where the thickness direction of the hoop material 11 is substantially horizontal, and performs plating treatment on both surfaces of the hoop material 11 while conveying the hoop material 11 in the length direction. It is a device that applies. Further, a gap that exceeds twice the thickness of the hoop material 11 is provided between the two hoop guides 24. The technical meaning of the gap provided between the two hoop guides 24 will be described later. The three sets of hoop guides 24 are arranged at different positions in the conveying direction of the hoop material 11.

  A plurality of injection nozzles 25 are provided on the upper surface of the fixed base 21 as shown in FIGS. The plurality of injection nozzles 25 protrude upward from the upper surface of the fixed base 21. The plurality of injection nozzles 25 are respectively provided on both sides of the conveyance path B of the hoop material 11. The plurality of injection nozzles 25 are provided at predetermined intervals along the conveyance direction of the hoop material 11 in a horizontal plane. In the example of FIG. 6, four injection nozzles 25 are provided in two rows along the conveyance path B along the conveyance direction of the hoop material 11. Specifically, eight injection nozzles 25 are provided between the two hoop guides 24 positioned upstream in the conveyance direction of the hoop material 11 and the two hoop guides 24 positioned in the middle in the conveyance direction. Has been placed. Further, eight injection nozzles 25 are arranged between the two hoop guides 24 located in the middle in the conveyance direction of the hoop material 11 and the two hoop guides 24 located most downstream in the conveyance direction. . Each injection nozzle 25 is provided with an injection port (not shown) for injecting a plating solution toward the conveyance path B of the hoop material 11. Each injection nozzle 25 is provided with a passage (not shown) that connects the injection port and the supply passage 22.

  In the plating solution jet part 19a, a plurality of sets, in the example of FIGS. 1 and 2, two sets of partial plating shielding parts 26 are provided. The two sets of partial plating shielding portions 26 are arranged at different positions in the conveying direction of the hoop material 11. Since the two sets of partial plating shielding portions 26 have the same structure, the structure of one partial plating shielding portion 26 will be described for convenience.

  The partial plating shielding part 26 has an upper base 27 and a lower base 28. The upper base 27 is disposed above the lower base 28 in the height direction (vertical direction). Further, the upper base 27 and the lower base 28 are flat plate-like members arranged along a substantially horizontal direction. As a material constituting the upper base 27 and the lower base 28, a resin material such as PVC (polyvinyl chloride) can be used. A plurality of cutouts 27 a are provided on the long side of the upper base 27. The plurality of notches 27a is a structure for securing a space in which the plurality of injection nozzles 25 are arranged.

  On the other hand, as shown in FIG. 7, a plurality of notches 31 are provided on the two long sides of the lower base 28, that is, on both sides of the conveyance path B of the hoop material 11. The plurality of notches 31 are structures for inserting the adjustment bolts 29, and the same number of notches 31 as the number of the adjustment bolts 29 are provided. In the conveying direction of the hoop material 11, the width of the notch 31 is larger than the outer diameter of the adjusting bolt 29 and smaller than the outer diameter of the nut 30. An adjustment bolt 29 is inserted into each of the plurality of notches 31. The lower base 28 comes into contact with the nuts 30 attached to the eight adjusting bolts 29, and the lower base 28 is supported by the eight adjusting bolts 29 in a substantially horizontal state. Further, a plurality of cutouts 32 different from the cutouts 31 are provided on the long side of the lower base 28. The plurality of notches 32 are structures for securing a space for arranging the plurality of injection nozzles 25. Four cutouts 32 are provided on one long side of the lower base 28, and four cutouts 32 are provided on the other long side. The eight injection nozzles 25 are inserted into the eight notches 32 separately.

  The conveying path B of the hoop material 11 is formed between the upper base 27 and the lower base 28 and between the eight injection nozzles 25 in a straight line and substantially horizontally. The hoop material 11 is plated on both surfaces of the hoop material 11 in the process of being transported through the transport path B with the thickness direction thereof being substantially horizontal. Further, when performing plating treatment on both surfaces of the hoop material 11, the plating apparatus 10 can form a portion on which the plating layer is applied and a portion on which the plating layer is not applied on both surfaces of the hoop material 11. Specifically, on both surfaces of the hoop material 11, a portion where the plating layer is applied and a portion where the plating layer is not applied can be formed separately in the width direction of the hoop material 11. For this reason, the partial plating shielding part 26 is provided with a shielding plate 33 that makes separate contact with both surfaces of the hoop material 11, and a plating layer is formed on the surface of the hoop material 11 where the shielding plate 33 is in contact. Not.

  As shown in FIGS. 7, 8, and 9, two shielding plates 33 are provided and are formed in a long shape along the conveying direction of the hoop material 11. The two shielding plates 33 have a substantially rectangular cross-sectional shape in a plane perpendicular to the conveying direction of the hoop material 11. The two shielding plates 33 have the same thickness in the height direction, and the thickness is constant in the conveying direction of the hoop material 11. Further, the two shielding plates 33 are provided on both sides of the conveyance path B of the hoop material 11 in a substantially horizontal plane. Of the two shielding plates 33, chamfering is applied to the corner portion located at the upstream end in the conveyance direction of the hoop material 11 and closer to the conveyance path B. Further, as the material constituting the shielding plate 33, a resin excellent in chemical resistance, wear resistance, and sliding characteristics can be used.

  Further, a support unit 34 that supports the two shielding plates 33 is provided. A plurality of support units 34 are provided along the conveying direction of the hoop material 11, and five support units 34 are provided in the examples of FIGS. Of the five support units 34, the two support units 34 are arranged between the injection nozzles 25 in the conveying direction of the hoop material 11. The remaining one support unit 34 is provided between the injection nozzle 25 located on the most upstream side and the upstream end of the upper base 27. Further, the remaining one support unit 34 is provided between the injection nozzle 25 located on the most downstream side and the downstream end of the upper base 27. Since the structure of each support unit 34 is the same, the structure of one support unit 34 will be described. As shown in FIG. 8, the support unit 34 includes two shielding bar receivers 35 interposed between the upper base 27 and the lower base 28. The two shielding bar receivers 35 are provided on both sides of the conveyance path B of the hoop material 11. The two shielding bar receivers 35 are separately fixed to the lower base 28 by bolts 36. As a material constituting the two shielding bar receivers 35, a resin excellent in chemical resistance, wear resistance, and sliding characteristics can be used.

  Further, the tip of the shaft 37 is fixed to each of the two shielding bar receivers 35. The two shafts 37 are attached along a vertical axis, and the two shafts 37 have a head portion 37a. On the other hand, the upper base 27 is provided with two shaft holes 27b penetrating in the vertical direction, and two shafts 37 are inserted into the shaft holes 27b. The inner diameter of the shaft hole 27 b is larger than the outer diameter of the shaft 37, and the upper base 27 can move along the two shafts 37. That is, the upper base 27 is movable in the vertical direction with respect to the two shielding bar receivers 35. A spring (compression spring) 38 is attached to the two shafts 37. The spring 38 is interposed between the head 37 a and the upper base 27, and the upper base 27 is pushed toward the two shielding bar receivers 35 by the force of the spring 38.

  As described above, in the partial plating shielding part 26, the shielding bar receiver 35 is fixed to the lower base 28, and the upper base 27 is attached to the shielding bar receiver 35. The lower base 28 is supported by eight adjustment bolts 29. That is, the partial plating shielding part 26 is positioned in the direction along the conveyance path B and the direction intersecting the conveyance path B by the eight adjusting bolts 29 with respect to the fixed base 21 in the horizontal plane. .

  Further, a groove 35a is provided on the side surface of the two shielding bar receivers 35 on the conveyance path B side along the conveyance direction of the hoop material 11, and a part of the shielding plate 33 in the width direction is inserted into the groove 35a. Has been. That is, the two shielding bar receivers 35 support the shielding plate 33 so as to be movable independently. Further, the two shielding bar receivers 35 are provided with holes 35b that open to the grooves 35a, and springs (compression springs) 39 are provided in the holes 35b. The two shielding plates 33 are pushed toward the conveyance path B by the force of the spring 39. For this reason, when the hoop material 11 does not exist in the conveyance path B, the two shielding plates 33 come into contact with each other. When the hoop material 11 exists in the conveyance path B, the two shielding plates 33 are separately pressed against both surfaces of the hoop material 11.

  Further, a roller receiver 40 is fixed to the lower surface of the lower base 28, and a roller shaft 41 is sandwiched between the roller receiver 40 and the lower base 28. The roller shaft 41 is provided around a substantially horizontal axis, and the axis of the roller shaft 41 is substantially perpendicular to the transport path B in a horizontal plane. A roller 42 is rotatably attached to the roller shaft 41. The roller 42 is provided below the conveyance path B. Furthermore, a roller receiver 43 is fixed to the upper surface of the upper base 27, and a roller shaft 44 is sandwiched between the roller receiver 43 and the upper base 27. The roller shaft 44 is provided with a substantially horizontal axis as a center, and the axis of the roller shaft 44 is substantially perpendicular to the conveyance path in a horizontal plane. A roller 45 is rotatably attached to the roller shaft 44. The roller 45 is provided above the transport path B. The roller 42 fixed to the lower base 28 does not move in the vertical direction, but the roller 45 fixed to the upper base 27 moves together with the upper base 27 when the upper base 27 moves in the vertical direction with respect to the lower base 28. Move up and down. That is, the vertical interval formed between the roller 42 and the roller 45 is variable. As a material constituting the rollers 42 and 45, a resin excellent in chemical resistance, wear resistance, and sliding characteristics can be used.

  Further, a position restriction pin (not shown) is provided between the upper base 27 and the lower base 28 of the support unit 34 disposed in the center in the conveying direction of the hoop material 11. The position regulating pin positions the two shielding plates 33 in the direction along the conveying direction of the hoop material 11. The position restricting pins are provided on both sides of the shielding bar receiver 35 in the conveying direction of the hoop material 11. The hoop material 11 is provided with a notch, a hole, a groove, and the like, and the hoop material 11 is positioned in the direction along the conveyance path B when the position regulating pin is hooked on the hoop material 11.

  On the other hand, as shown in FIG. 5, guide plates 46 are respectively provided between the support units 34 on the lower surface of the upper base 27. Each guide plate 46 is fixed to the upper base 27, and each guide plate 46 has a long shape along the transport path B. Further, as shown in FIG. 9, a groove 46 a is provided on the surface of the guide plate 46 on the conveyance path B side. The groove 46 a is provided in parallel with the transport path B.

  On the other hand, a guide plate 47 is provided between the support units 34 on the upper surface of the lower base 28. Each guide plate 47 is fixed to the lower base 28, and each guide plate 47 has a long shape along the transport path B. A groove 47 a is provided on the surface of each guide plate 47 on the conveyance path B side. The groove 47a is provided in parallel with the transport path B. The conveyance path B is disposed between the groove 46a and the groove 47a. As a material constituting the guide plates 46 and 47, a resin excellent in chemical resistance, wear resistance, and sliding characteristics can be used.

  Further, anodes 48 are provided on both sides of the plating solution jet part 19a in the conveying direction of the hoop material 11, respectively. The two anodes 48 are arranged in parallel with the conveyance path B of the hoop material 11. The metal put into the anode 48 varies depending on the type of plating. Silver or silver lump is put in silver plating, nickel is put in nickel plating, copper is put in copper plating, tin and silver are put in tin / silver plating, and tin is put in tin / bismuth plating. In these types of plating, an anode basket is used as the anode 48. In contrast, in gold plating, an anode basket is not used as the anode 48, but an insoluble anode is used.

  The two anodes 48 are respectively connected to the positive poles of a power source (not shown). A conveyance roller (not shown) for carrying the hoop material 11 into the plating apparatus 10 and a conveyance roller (not shown) for carrying the hoop material 11 out of the plating apparatus 10 are provided. The transport rollers are respectively connected to the negative pole of the power source.

  Next, a process of performing plating processing on both surfaces of the hoop material 11 by the plating apparatus 10 will be described. The hoop material 11 is carried into the plating apparatus 10 via a degreasing processing unit, a water washing processing unit, a chemical polishing processing unit, and the like. In the present embodiment, four hoop materials 11 that are physically separate are carried in parallel to the plating apparatus 10 and passed through the four slits 18 so that the four hoop materials 11 are arranged in four rows. It can be carried in parallel to A1, A2, A3 and A4. Then, the hoop material 11 first passes between the two hoop guides 24 of the plating solution jet part 19a, and is carried along the conveyance path B to the partial plating shielding part 26 arranged on the upstream side. . In a stage before the tip of the hoop material 11 enters between the shielding plates 33, the shielding plates 33 are in contact with each other by the force of the spring 39. When the tip of the hoop material 11 bites between the shielding plates 33, the two shielding plates 33 move against the force of the spring 39 due to the moving force of the hoop material 11, and between the shielding plates 33. The hoop material 11 enters and the hoop material 11 is transported downstream in the transport direction. For this reason, as shown in FIG. 10A, one shielding plate 33 contacts one surface of the hoop material 11, and the other shielding plate 33 contacts the other surface of the hoop material 11.

  The hoop material 11 that has passed through the partial plating shielding part provided upstream is conveyed to the partial plating shielding part provided downstream in the plating solution jet part 19a, and between the two shielding plates 33 in the same manner as described above. The hoop material 11 enters. Then, the hoop material 11 that has passed through the plating solution jet part 19a passes between the two hoop guides 24 located in the middle in the conveying direction of the hoop material 11, and is carried into the plating solution jet part 19b. Also in the plating solution jet part 19b, the same action as that of the plating solution jet part 19b occurs, and the hoop material 11 that has passed through the plating solution jet part 19b has two hoop guides located at the most downstream in the conveying direction of the hoop material 11. It passes between 24 and will be carried out of the plating apparatus 10.

  When the hoop material 11 passes through the plating solution jets 19a and 19b, the plating solution is injected from the injection port of the plating injection nozzle 25. Further, since the anode 48 is connected to the positive electrode and the conveying roller is connected to the negative electrode, when the hoop material 11 passes through the plating tank 12, the metal of the anode 48 becomes ions in the plating solution. Get in. Metal ions in the plating solution are deposited as metal atoms on the surface of the hoop material 11, and a plating layer is formed on the front and back surfaces of the hoop material 11.

  Further, when the hoop material 11 is transported along the transport path B, the two shielding plates 33 are in contact with both surfaces of the hoop material 11 separately. For this reason, a plating layer is formed on a portion 11a of the surface of the hoop material 11 where the shielding plate 33 does not contact as shown in FIG. On the other hand, no plating layer is formed on the portion 11b with which the shielding plate 33 contacts, or even if a plating layer is formed, the thickness is thinner than the portion 11a. That is, the shielding plate 33 functions as masking that covers a part of the surface of the hoop material 11. Further, the thickness of the plating layer formed on the portion 11 a of the hoop material 11 is determined by the current value of the power supplied from the power source and the conveyance speed of the hoop material 11. The conveyance speed of the hoop material 11 can be adjusted by controlling the rotation speed of the electric motor that rotates the conveyance roller.

  Further, guide plates 46 and 47 are provided above and below the hoop material 11. When an electric current flows through the hoop material 11 and an electric field is formed, the guide plates 46 and 47 shield the electric field. Therefore, it can suppress that the film thickness of the plating layer formed in the edge of the hoop material 11 becomes thick. In addition, the guide plates 46 and 47 also serve to regulate the movement of the hoop material 11 in the width direction.

  By the way, the hoop material 11 is not necessarily a single metal member. That is, the hoop material 11 may be configured by connecting the ends in the longitudinal direction of the two members. For example, as shown in FIG. 10B, two members 11c and 11d may be fastened, connected by rivets, welding, staples, or the like to form one hoop material 11. That is, the members 11c and 11d are partially overlapped with each other, the thickness of the hoop material 11 is twice that of the other portions, and the step 49 is formed.

  In this way, when the hoop material 11 having the step 49 is conveyed to the partial plating shielding portion 26 and the connecting portion of the members 11c and 11d enters between the two shielding plates 33, the two shielding plates 33 are springs. It moves in the direction away from the force of 39. That is, the interval between the two shielding plates 33 is widened. Note that when the connecting portion of the members 11c and 11d passes between the two shielding plates 33, the distance between the two shielding plates 33 is restored to the original state by the force of the spring 39. Further, since the two shielding plates 33 are positioned in the conveying direction of the hoop material 11 by the position restriction pins, the two shielding plates 33 are hooped by the frictional force between the hoop material 11 and the two shielding plates 33. It can prevent moving to the conveyance direction of the material 11. FIG.

  As described above, in the partial plating shielding part 26, even if the step 49 exists in the hoop material 11, the two shielding plates 33 move in the thickness direction of the hoop material 11, or two shieldings occur. The plate 33 bends in the width direction. That is, the shape of the two shielding plates 33 can be made to follow the surface shape of the hoop material 11 in the horizontal plane. For this reason, the contact state of the two shielding plates 33 with respect to the surface of the hoop material 11, specifically, the contact pressure changes significantly, or the hoop material 11 is caught by the two shielding plates 33, causing a conveyance failure. Can be prevented in advance.

  Therefore, the thickness of the plating layer formed on the surface of the hoop material 11 can be set to a target thickness, and the surface of the hoop material 11 can be prevented from being damaged or deformed. Further, since the gap amount between the two hoop guides 24 exceeds the thickness of the hoop material 11, the connecting portion of the members 11 c and 11 d passes between the two hoop guides 24. Is possible.

  Further, while the hoop material 11 is transported along the transport path B, the rollers 42 and 45 are separately brought into contact with both edges of the hoop material 11 as shown in FIG. 8 so that the hoop material 11 moves in the height direction. Is regulated. Further, the upper base 27 is movable in the vertical direction with respect to the shielding bar receiver 35. For this reason, when the hoop material 11 having a different width is carried in, the roller 45 and the upper base 27 can move up and down integrally. Therefore, the hoop material 11 can be positioned in the height direction when the front and back surfaces of the hoop material 11 having different widths are plated.

  The relationship between the configuration described in the first embodiment of the present invention and the configuration of the present invention will be described. The hoop material 11 corresponds to a belt-shaped member of the present invention, and the shielding plate 33 is the first masking of the present invention. The shield bar receiver 35 corresponds to the first support mechanism of the present invention, the spring 39 corresponds to the first elastic member of the present invention, and the rollers 42 and 45 correspond to the present invention. The upper base 27 and the roller receiver 43 correspond to the second support mechanism of the present invention, the spring 38 corresponds to the second elastic member of the present invention, and the portion 11a The portion 11b corresponds to the “portion where the plating layer is not applied”, and the portion 11b corresponds to the “portion where the plating layer is applied” in the present invention.

  Next, 2nd Embodiment of the plating apparatus of this invention is described based on FIGS. In the conveyance direction of the hoop material 11, a degreasing treatment unit, a water washing treatment unit, a chemical polishing treatment unit, and the like are provided in series upstream of the plating apparatus 50. Further, a hot water washing processing unit, a drying processing unit, and the like are provided in series downstream of the plating apparatus 50 in the conveying direction of the hoop material 11. In FIG. 12, these processing units are omitted. The plating apparatus 50 has a plating tank 51, and the plating tank 51 has a bottom plate 52. The bottom plate 52 has a rectangular planar shape, and large side plates 53 and 54 are continuously provided on the long side of the bottom plate 52. Small side plates 55 and 56 are continuously provided on the short side of the bottom plate 52. A support plate 57 is provided in the interior D surrounded by the large side plates 53 and 54 and the small side plates 55 and 56. A supply path 58 a for supplying a plating solution is formed between the support plate 57 and the bottom plate 52. A plurality of spray nozzles 58 are provided on the support plate 57. In FIG. 12, the injection nozzles 58 are provided in two rows along the conveying direction of the hoop material 11. Three spray nozzles 58 are arranged in a line.

  Furthermore, a partial plating shielding part 59 is provided in the interior D. When the plating treatment is performed on the front and back surfaces of the hoop material 11, the partial plating shielding portion 59 forms a portion where a plating layer is applied and a portion where no plating layer is applied on both surfaces of the hoop material 11. The partial plating shielding part 59 has an upper base 60 and a lower base 61. The lower base 61 is fixed to the support plate 57, and the lower base 61 is a plate member that is elongated in the conveying direction of the hoop material 11. The upper base 60 is provided above the lower base 61, and the conveyance path B of the hoop material 11 is formed between the upper base 60 and the lower base 61.

  A support unit 62 is provided on the upper base 60 and the lower base 61. A plurality of support units 62 are provided along the conveyance direction of the hoop material 11, and the support units 62 are provided at four locations in FIG. The support unit 62 includes two shielding bar receivers 63 interposed between the upper base 60 and the lower base 61. The shielding bar receiver 63 is made of the same material as the shielding bar receiver 35. In the horizontal plane, the two shielding bar receivers 63 are arranged on both sides of the conveyance path B of the hoop material 11. The two shielding bar receivers 63 are fixed to the upper base 60 by bolts 66. An insertion pin 67 is fixed to the two shielding bar receivers 63, and the insertion pin 67 is inserted into the shaft hole 61 a of the lower base 61. That is, the two shielding bar receivers 63 are positioned by the insertion pins 67 in the horizontal plane.

  Further, grooves 64 are provided on the opposing surfaces of the two shielding bar receivers 63 along the transport direction. A plurality of grooves 64 are provided along the height direction of the shielding bar receiver 63, and four in the example of FIG. Further, two rows of four shielding plates 65 are provided on both sides of the transport path B. Four rows of shielding plates 65 are arranged side by side in the height direction. The shielding plate 65 is made of the same material as the shielding plate 33 described above. The shielding plate 65 is formed in an elongated shape along the conveying direction of the hoop material 11, and has a thick portion 65a and a thin portion 65b as shown in FIG. The thin portion 65b has a smaller thickness in the height direction than the thick portion 65a. Moreover, the thick part 65a and the thin part 65b are provided alternately. A thin portion 65 b of the shielding plate 65 is inserted into each groove 64. Further, a thick portion 65 a of the shielding plate 65 is disposed between the shielding bar receivers 63 in the conveying direction of the hoop material 11. That is, the four shielding plates 65 are supported by one shielding bar receiver 63, and the four shielding plates 65 are supported by the other shielding bar receiver 63.

  As described above, each shielding plate 65 is horizontally supported by the four shielding bar receivers 63 provided along the transport direction. Each shielding plate 65 is movable in the left-right direction in FIG. 15 while being supported by the shielding bar receiver 63. That is, the shielding plate 65 can move in a direction perpendicular to the transport path B in a horizontal plane. Further, the shielding bar receiver 63 is disposed in a notch portion between the thick portion 65a and the thin portion 65b in the conveying direction of the hoop material 11. The shielding plate 65 is caught by the shielding bar receiver 63 and is positioned in the direction along the conveyance path B.

  Further, the shielding bar receiver 63 is provided with holes 68 that are continuous with the four grooves 64. Each hole 68 is provided with a spring 69. The force of the spring 69 is applied to the shielding plate 65, and the shielding plate 65 is pushed toward the conveyance path B.

  Further, a roller receiver 70 is fixed to the lower surface of the lower base 61, and a roller shaft 71 is sandwiched between the roller receiver 70 and the lower base 61. The roller shaft 71 is provided with a substantially horizontal axis as a center, and the axis of the roller shaft 71 is substantially perpendicular to the conveying direction of the hoop material 11 in a horizontal plane. A roller 72 is rotatably attached to the roller shaft 71. The roller 72 is provided below the conveyance path B. Furthermore, a roller receiver 73 is fixed to the upper surface of the upper base 60, and a roller shaft 74 is sandwiched between the roller receiver 73 and the upper base 60. The roller shaft 74 is provided with a substantially horizontal axis as a center, and the axis of the roller shaft 74 is substantially perpendicular to the conveying direction of the hoop material 11 in a horizontal plane. A roller 75 is rotatably attached to the roller shaft 74. The roller 75 is provided above the transport path B. A part of the rollers 72 and 75 is disposed between the two shielding bar receivers 63. The roller 75 is disposed above the thin portion 65b of the shielding plate 65 disposed on the top. The roller 72 is arrange | positioned under the thin part 65b of the shielding board 65 arrange | positioned at the lowest. The rollers 72 and 75 are made of the same material as the rollers 42 and 45.

  Furthermore, the anode 76 is provided in two places in the space D inside the plating tank 51. The metal used for the anode 76 is the same as in the first embodiment. A partial plating shield 59 is provided between the two anodes 76 in the horizontal plane. Furthermore, a conveyance roller (not shown) for carrying the hoop material 11 into the plating apparatus 50 and a conveyance roller (not shown) for carrying the hoop material 11 from the plating apparatus 50 are provided. Each transport roller is connected to the negative pole of the power source, and the current of the power source flows to the hoop material 11 via the transport roller.

  Next, a process of performing plating treatment on both surfaces of the hoop material 11 by the plating apparatus 50 will be described. At the stage before the tip of the hoop material 11 enters between the shielding plates 65 provided on both sides of the conveyance path B, the shielding plates 65 are in contact with each other by the force of the spring 69. When the tip of the hoop material 11 bites between the shielding plates 65, the shielding plate 65 moves in the horizontal direction against the force of the spring 69 by the moving force of the hoop material 11, and moves between the shielding plates 65. The hoop material 11 enters and the hoop material 11 is conveyed downstream along the conveyance path B. Then, the shielding plate 65 is in contact with both surfaces of the hoop material 11 as shown in FIG. More specifically, in the direction along the conveyance path B, the thick portions 65a of the shielding plate 65 are in contact with both surfaces of the hoop material 11 between the shielding bar receivers 63 as shown in FIG.

  On the other hand, in the direction along the transport path B, the thin portion 65b of the shielding plate 65 contacts both surfaces of the hoop material 11 as shown in FIG. When the hoop material 11 passes through the partial plating shielding part 59, the plating solution is sprayed from the spray port of the plating spray nozzle 58. Further, the anode 76 is connected to the positive electrode, and the conveying roller is connected to the negative electrode, so that a current flows through the hoop material 11. For this reason, when the hoop material 11 passes through the inside D of the plating tank 51, the metal is electrochemically deposited on the front and back surfaces of the hoop material 11 to form a plating layer.

  Further, when the hoop material 11 is transported along the transport path B, the two shielding plates 65 come into contact with both surfaces of the hoop material 11 separately. For this reason, a plating layer is formed on a portion 11a of the surface of the hoop material 11 where the shielding plate 65 does not contact as shown in FIG. On the other hand, the plating layer is not formed on the portion 11b with which the shielding plate 65 contacts, or even if the plating layer is formed, the thickness is thinner than the portion 11a. That is, the shielding plate 65 functions as masking that covers a part of the surface of the hoop material 11. In the partial plating shielding part 59, four shielding plates 65 are provided in the height direction. For this reason, three plating layers are formed along the width direction of the hoop material 11.

  Furthermore, also in the plating apparatus 50 of the second embodiment, as shown in FIG. 10B, two members 11c and 11d are connected to form one hoop material 11, and a hoop material in which a step 49 is formed. When 11 is conveyed to the partial plating shielding part 59, the two shielding plates 65 move in a direction away from the force of the spring 69. That is, the interval between the two shielding plates 65 is widened. When the connecting portion of the members 11c and 11d passes between the two shielding plates 65, the distance between the two shielding plates 65 is restored to the original state by the force of the spring 69. Therefore, also in the plating apparatus 50 of the second embodiment, the same effect as that of the plating apparatus 10 of the first embodiment can be obtained.

  The relationship between the configuration described in the second embodiment of the present invention and the configuration of the present invention will be described. The hoop material 11 corresponds to a belt-shaped member of the present invention, and the shielding plate 65 is the first masking of the present invention. The shield bar receiver 63 corresponds to the first support mechanism of the present invention, the spring 69 corresponds to the first elastic member of the present invention, and the rollers 72 and 75 correspond to the present invention. The portion 11a corresponds to the “portion where the plating layer is not applied” of the present invention, and the portion 11b corresponds to the “portion where the plating layer is applied” of the present invention.

  It goes without saying that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention. For example, the plating apparatus 10 of FIG. 2 has a configuration in which the hoop materials 11 are conveyed in four rows, but the plating solution treatments arranged in parallel so that the hoop materials are conveyed in three rows or less or five rows or more. It is also possible to increase or decrease the number of copies. Furthermore, in the plating apparatus 10 of FIG. 2, the number of plating solution processing units and the number of partial plating shielding units arranged in series can be arbitrarily changed. Further, in the plating apparatus 50 shown in FIG. 12, a plurality of partial plating shielding portions 59 can be arranged in parallel in the interior D of the plating tank 51. It is also possible to place a plurality of partial plating shielding portions 59 in series in the interior D of the plating tank 51. The plating apparatus of the present invention is not limited to performing a single type of plating, but includes a configuration in which copper plating or nickel plating is applied as a base, and silver plating or gold plating is applied thereon. That is, the same processing unit includes a plurality of types of processing. The first elastic member and the second elastic member can use a rubber-like elastic body instead of the spring.

DESCRIPTION OF SYMBOLS 10,50 Plating apparatus 11 Hoop material 11a, 11b Portion 33, 65 Shield plate 35, 63 Shield bar receiver 39, 69 Spring

Claims (3)

A plating apparatus for forming a portion on which a plating layer is applied and a portion on which a plating layer is not applied on both surfaces of a belt-shaped member conveyed in the longitudinal direction,
A first masking member that is in contact with one surface of the belt-like member to form a portion that is not subjected to the plating layer;
Second masking arranged to be in contact with the other surface of the band-shaped member and to sandwich the band-shaped member from both sides in the thickness direction together with the first masking member in order to form a portion where the plating layer is not applied. Members,
A first support mechanism for supporting the first masking member and the second masking member movably independently in the thickness direction of the belt-shaped member;
A first elastic member that independently applies a force in a direction to bring the first masking member and the second masking member closer to the belt-like member to the first masking member and the second masking member, respectively. Features plating equipment. The plating apparatus according to claim 1,
When the belt-like member is being transported in a state where the thickness direction of the belt-like member is a horizontal direction, a portion where the plating layer is applied and a portion where the plating layer is not applied are formed on both surfaces of the belt-like member. Features plating equipment. The plating apparatus according to claim 1 or 2,
A pair of positioning members that contact both edges in the width direction of the band-shaped member and position the band-shaped member in the width direction;
A second support mechanism for supporting one of the pair of positioning members so as to be movable in the width direction of the belt-shaped member;
A plating apparatus comprising: a second elastic member that applies a force in a direction approaching the belt-like member to the positioning member that is movably supported by the second support mechanism.

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