JP2014075546A - Resin application device and resin application method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin application device and a resin application method capable of various adjustment of luminescent color in LED package manufacturing and capable of achieving satisfactory productivity.SOLUTION: The resin application device used for manufacturing LED package includes: a resin application section; and an application control section controlling the same. The resin application section is provided with a first nozzle that discharges a first resin and a second nozzle that discharges a second resin. The application control section performs a first control in which a curable first resin is discharged from the first nozzle to apply the first resin on the LED element mounted on the board and a second control in which, after performing the first control, before the applied first resin is cured, a curable second resin is discharged from the second nozzle to apply the second resin over the applied first resin on a resin application area. Either one of the first resin and the second resin includes a first fluorescent substance.

Description

  The present invention includes an LED element mounted on a substrate, a first resin layer covering the LED element, and a second resin layer covering the first resin layer, and one of the first resin layer and the second resin layer. The present invention relates to a resin coating apparatus and a resin coating method used for manufacturing an LED package containing a first phosphor.

  In recent years, LEDs (light emitting diodes) having excellent characteristics of low power consumption and long life have been widely used as light sources for various lighting devices. The basic light emitted by the LED elements is currently limited to three, red, green and blue. As a method for obtaining white light suitable for general illumination applications, a method of obtaining white light by adding and mixing the above three basic lights, or yellow fluorescence that is complementary to blue LED and blue is used. There is a method of obtaining pseudo white light by combining with a phosphor that emits light. In recent years, the latter method has been widely used, and an illumination device using an LED package in which a blue LED and a YAG phosphor are combined is used for a backlight of a liquid crystal panel or the like (Patent Document 1). reference).

  In Patent Document 1, an LED element is mounted on the bottom surface of a concave mounting portion having a reflecting surface formed on a side wall, and then a silicone resin or an epoxy resin in which YAG phosphor particles are dispersed is injected into the mounting portion. The LED package is formed by forming the resin packaging part. And, for the purpose of uniforming the height of the resin packaging part in the mounting part after the resin injection, a residual resin storage part for discharging and storing the surplus resin injected more than a specified amount from the mounting part is formed. doing. As a result, even when the discharge amount from the dispenser varies at the time of resin injection, a resin packaging portion having a specified height and having a certain resin amount is formed on the LED element.

  However, the above-described prior art has a problem in that the light emission characteristics of the LED package as a product vary due to variations in light emission wavelengths of individual LED elements. In other words, the LED element has undergone a manufacturing process in which a plurality of elements are collectively formed on the wafer, and due to various error factors in this manufacturing process, such as non-uniform composition during film formation on the wafer, It is inevitable that a variation in emission wavelength occurs in the LED element divided into individual pieces from the wafer state. And in the above-mentioned technique, since the height of the resin packaging part which covers an LED element is set uniformly, the dispersion | variation in the light emission wavelength in an individual LED element is the dispersion | variation in the light emission characteristic of the LED package as a product as it is. It is reflected in. As a result, the number of defective products that deviate from the acceptable quality range has been increased.

  Thus, in the LED package manufacturing system, a technique has been proposed for making the light emission characteristics of the LED package uniform and improving the production yield even when the light emission wavelengths of the individual LED elements vary (Patent Document 2). reference).

  In Patent Document 2, a light-transmitting member on which a resin containing a phosphor is applied for light emission characteristic measurement is placed on a light-transmitting member mounting portion provided with a light source portion, and excitation light emitted from the light source portion is used. The resin applied to the translucent member is irradiated and the light emission characteristic of the light emitted from the resin is measured by the light emission characteristic measurement unit. Then, a deviation between the measurement result and a predetermined light emission characteristic is obtained, and an appropriate amount of resin to be applied to the LED element for actual production is derived based on the deviation.

JP 2007-66969 A JP 2012-094675 A

  Conventionally, since the resin applied on the LED is limited to one type, it is sufficient to test-apply one type of resin including a phosphor to the light-transmitting member for light emission characteristic measurement. However, when only one type of resin is used, the range in which the emission color can be adjusted is limited, and it is difficult to realize various illumination lights required for various illuminations.

  On the other hand, when two or more types of resins are used, it is necessary to apply two or more types of resins to the translucent member even when performing trial application. However, in actual production, for example, after applying the first resin containing the first phosphor on the LED, the first resin is once cured, and then the second resin is applied on the cured first resin. A second resin containing a phosphor is applied. For this reason, it is desirable to cure the first resin once and then apply the second resin onto the cured first resin in order to accurately derive the appropriate resin application amount even when performing the trial application. it is conceivable that. In that case, in trial application and actual production, the operation of curing the first resin and then applying the second resin onto the cured first resin is repeated, greatly reducing the productivity of the LED package. become.

  Accordingly, an object of the present invention is to provide a resin coating apparatus and a resin coating method for enabling various color tone adjustments of emission colors and realizing excellent productivity in the manufacture of LED packages.

  One aspect of the present invention includes a substrate, an LED element mounted on the substrate, a first resin layer covering the LED element, and a second resin layer covering the first resin layer, the first resin A resin coating apparatus used for manufacturing an LED package in which a first phosphor is included in any one of the first resin layer and the second resin layer, wherein the first curable first resin layer is formed. A resin application part having a first nozzle that discharges a resin, a second nozzle that discharges a curable second resin for forming the second resin layer, and a predetermined value by controlling the resin application part. An application control unit that selectively applies the first resin and the second resin to the resin application unit with respect to the application target, and the application control unit removes the first resin from the first nozzle. The LED element mounted on the substrate by discharging The first control to apply the first resin to the first, after the first control, the second resin is discharged from the second nozzle without curing the applied first resin, The present invention relates to a resin coating apparatus that performs second control for coating the second resin on the coated first resin with respect to the resin coating unit.

  Another aspect of the present invention includes a substrate, an LED element mounted on the substrate, a first resin layer covering the LED element, and a second resin layer covering the first resin layer, A resin coating method used for manufacturing an LED package in which a first phosphor is included in either one resin layer or the second resin layer, and (a) for an LED element mounted on the substrate A step of applying a curable first resin for forming the first resin layer, and (b) after the step (a), the applied first resin is not cured, And a step of applying a curable second resin for forming the second resin layer on one resin.

  According to the resin coating apparatus and the resin coating method of the present invention, in the manufacture of an LED package, it is possible to adjust the color tone of various emission colors and realize excellent productivity.

It is a block diagram which shows the structure of the LED package manufacturing system which concerns on one Embodiment of this invention. It is a structure explanatory view of the LED package manufactured by the LED package manufacturing system concerning one embodiment of the present invention. It is explanatory drawing of the supply form and element characteristic information of the LED element used in the LED package manufacturing system which concerns on one Embodiment of this invention. It is explanatory drawing of the resin application | coating information used in the LED package manufacturing system which concerns on one Embodiment of this invention. It is explanatory drawing of chromaticity adjustment of the LED package manufactured by the LED package manufacturing system which concerns on one Embodiment of this invention. It is explanatory drawing of a structure and function of the component mounting apparatus in the LED package manufacturing system which concerns on one Embodiment of this invention. It is explanatory drawing of the map data used in the LED package manufacturing system which concerns on one Embodiment of this invention. It is explanatory drawing of a structure and function of the resin coating apparatus which concerns on one Embodiment of this invention. It is explanatory drawing of the light emission characteristic test | inspection function with which the resin coating apparatus which concerns on one Embodiment of this invention was equipped. It is explanatory drawing of a structure and function of the resin coating apparatus which concerns on one Embodiment of this invention. It is explanatory drawing of the light emission characteristic test | inspection function with which the resin coating apparatus which concerns on one Embodiment of this invention was equipped. It is a block diagram which shows the structure of the control system of the LED package manufacturing system which concerns on one Embodiment of this invention. It is a flowchart of LED package manufacture by the LED package manufacturing system which concerns on one Embodiment of this invention. It is a flowchart of the threshold value data creation process for non-defective product determination in the LED package manufacturing system according to an embodiment of the present invention. It is explanatory drawing of the threshold value data for good quality determination in the LED package manufacturing system which concerns on one Embodiment of this invention. It is a chromaticity diagram explaining threshold data for non-defective product determination in the LED package manufacturing system according to an embodiment of the present invention. It is a flowchart of the resin application | coating operation process in the LED package manufacturing process by the LED package manufacturing system which concerns on one Embodiment of this invention. It is explanatory drawing of the resin application | coating operation process in the LED package manufacturing process by the LED package manufacturing system which concerns on one Embodiment of this invention. It is process explanatory drawing which shows the LED package manufacturing process by the LED package manufacturing system which concerns on one Embodiment of this invention. It is process explanatory drawing which shows the LED package manufacturing process by the LED package manufacturing system which concerns on one Embodiment of this invention.

  The resin coating apparatus of the present invention is a resin coating apparatus that applies a first resin and a second resin so as to cover LED elements mounted on a substrate. The manufactured LED package includes a substrate, an LED element mounted on the substrate, a first resin layer covering the LED element, and a second resin layer covering the first resin layer. One of the first resin layer and the second resin layer contains the first phosphor. The LED element is, for example, an LED element that emits blue, and the first phosphor is, for example, a phosphor that emits yellow having a color-catching relationship with blue. However, the first phosphor does not need to be a single phosphor, and may be a hybrid phosphor that is a mixed system of two or more phosphors. The LED package may have a third resin layer that covers the second resin layer, and may further have a fourth or more resin layer. More specifically, for example, the third resin layer may be formed as a clear coating.

  Here, the resin coating apparatus includes a resin coating unit and a coating control unit that controls the resin coating unit. A first nozzle that discharges a curable first resin for forming a first resin layer and a second nozzle that discharges a curable second resin for forming a second resin layer in the resin application portion And are provided. The application control unit controls the resin application unit to selectively apply the first resin and the second resin to the resin application unit with respect to a predetermined application target.

  Specifically, the application control unit causes the first resin to be discharged from the first nozzle, thereby applying the first resin to the LED element mounted on the substrate, and after the first control, Without curing the applied first resin, the second resin is discharged from the second nozzle, and thereby the second control of applying the second resin on the applied first resin is performed on the resin application portion. Against.

  As described above, after the first control, the second control is performed without curing the applied first resin, and then the first resin and the second resin are simultaneously cured by heating, The number of curing processes can be reduced. Therefore, even when a plurality of resins are applied to the LED element, the LED package can be efficiently produced.

  The first resin layer is formed at a position closer to the LED element than the second resin layer. The second resin layer is formed so as to cover the first resin layer. Although the first resin layer may be formed thin, the first resin layer is usually formed to be thicker and have a larger volume than the second resin layer.

  The first phosphor is, for example, a phosphor that emits yellow fluorescence. The phosphor that emits yellow fluorescence may be contained in either the first resin layer or the second resin layer, but is usually contained in the thicker and larger volume of the first resin layer.

  On the other hand, the second phosphor layer can contain a second phosphor different in kind from the first phosphor. The second phosphor is, for example, a phosphor that emits red or green fluorescence. As described above, by using a plurality of phosphors, various color tone adjustments of the emission color can be performed. For example, by including the second phosphor in a small amount in the thin second resin layer, it is possible to perform fine adjustment that slightly changes the color tone of the white light according to the application. The second phosphor does not need to be a single phosphor, and may be a hybrid phosphor that is a mixed system of two or more phosphors.

If both the first phosphor and the second phosphor are included in one type of resin, the first phosphor and the second phosphor have different specific gravities. The distribution state of the phosphor changes with time. On the other hand, according to the above configuration, the first phosphor and the second phosphor in the entire resin layer are compared with the case where one kind of resin containing both the first phosphor and the second phosphor is applied to the LED element. It becomes easy to control the distribution state.
In the case of manufacturing an LED package having n or more (3 ≦ n) resin layers, the resin coating apparatus uses the k-th resin layer for forming the k-th resin layer (k is an integer of 3 or more and n or less). You may have the kth nozzle which discharges resin (3 <= k). The application control unit may perform k-th control for applying the k-th resin to the (k−1) -th resin. In this case, after the second control, if necessary, the k-th control may be performed until k = n, and then all the resins may be simultaneously cured by heating or the like.

  The viscosity of the second resin is preferably set lower than that of the first resin. The second resin is applied on the first resin applied to the LED element without curing the first resin. Therefore, when the viscosity of the second resin is larger than that of the first resin, the interface between the first resin and the second resin tends to be a complicated shape. On the other hand, by making the viscosity of the first resin larger than that of the second resin, the second resin can be applied without greatly disturbing the liquid level of the first resin. Thereby, the distribution state of the 1st fluorescent substance and the 2nd fluorescent substance in the whole resin layer is stabilized. Similarly, when forming a resin layer of n layers or more (3 ≦ n), it is desirable that the viscosity of the resin to be applied later is lower than the viscosity of the previously applied resin.

In a more preferred embodiment, the ratio of the viscosity C ₁ of the first resin and the viscosity C ₂ of the second resin: C ₁ / C ₂ is adjusted to more than 1.1. Thereby, the interface of 1st resin and 2nd resin tends to become a flat shape. Thereby, it becomes easier to control the distribution state of the first phosphor and the second phosphor in the entire resin layer. In addition, the viscosity of 1st resin and 2nd resin is a viscosity measured using an E-type viscosity meter in the state which maintained the temperature of 1st resin and 2nd resin at 25 degreeC.

  In the above configuration, the resin application unit includes at least a first resin discharge mechanism that controls the discharge amount of the first resin from the first nozzle and a second that controls the discharge amount of the second resin from the second nozzle. A resin discharge mechanism. Then, the application control unit sets the first resin discharge mechanism and the second resin discharge mechanism so that the discharge amount of the first resin from the first nozzle is larger than the discharge amount of the second resin from the second nozzle. Control.

  The first nozzle that discharges the first resin is preferably a nozzle that has a larger discharge amount than the second nozzle that discharges the second resin. Thereby, even if the viscosity of the first resin is high, the first resin can be applied thickly in a short time. Such a first nozzle includes, for example, a screw-type first resin discharge mechanism. The first nozzle is, for example, a screw-type dispensing nozzle for quantitative discharge.

  The second nozzle that discharges the second resin is preferably a nozzle that can discharge a small amount of the second resin and can accurately control the discharge amount. Thereby, it becomes easy to supply a small amount of the second phosphor to the LED element with high accuracy. Such a second nozzle includes, for example, a jet-type second resin discharge mechanism. The second nozzle is, for example, a jet-type droplet discharge dispense nozzle.

  Next, the resin coating method of the present invention is a method used for manufacturing an LED package having the above-described configuration. (A) To form a first resin layer on an LED element mounted on a substrate. And (b) after the step (a), the second resin layer is formed on the first resin without curing the applied first resin. And applying a curable second resin. Furthermore, you may perform the process of apply | coating resin for forming the resin layer of the 3rd layer or more as needed. Then, you may have the process of hardening all resin simultaneously by heating etc. This method can be easily carried out by using the above resin coating apparatus.

Next, an embodiment of the present invention will be described with reference to the drawings. First, the configuration of the LED package manufacturing system 1 will be described with reference to FIG.
The LED package manufacturing system 1 has a function of manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor. In the present embodiment, as shown in FIG. 1, the component mounting apparatus M1, the curing apparatus M2, the wire bonding apparatus M3, the resin coating apparatus M4, the curing apparatus M5, and the individual piece cutting apparatus M6 are connected by the LAN system 2. The management computer 3 controls these devices in an integrated manner.

  The component mounting apparatus M1 mounts the LED element 5 on the substrate 4 (see FIG. 2) serving as the base of the LED package by bonding with a resin adhesive. The curing device M2 cures the resin adhesive used for bonding at the time of mounting by heating the substrate 4 after the LED element 5 is mounted. The wire bonding apparatus M3 connects the electrode of the substrate 4 and the electrode of the LED element 5 with a bonding wire. The resin coating apparatus M4 applies a curable first resin containing a first phosphor and a curable second resin containing a second phosphor to each LED element 5 on the substrate 4 after wire bonding. The application of the second resin is performed without curing the first resin. The curing device M5 heats the substrate 4 after applying the first resin and the second resin. Thereby, the first resin and the second resin applied to cover the LED element 5 are cured. The piece cutting device M6 cuts the substrate 4 after the resin is cured into each individual LED element 5 and divides it into individual LED packages. Thereby, the LED package divided | segmented into the piece is completed.

  FIG. 1 shows an example in which a production line is configured by arranging each device from the component mounting device M1 to the piece cutting device M6 in series. However, the LED package manufacturing system 1 does not necessarily need to adopt such a line configuration. As long as the information transmission described below is appropriately executed, each process work may be sequentially executed by each of the distributed devices. Further, before and after the wire bonding apparatus M3, plasma processing apparatuses that perform plasma processing for the purpose of cleaning the electrodes prior to wire bonding may be arranged. Further, after wire bonding, a plasma processing apparatus for performing plasma processing for the purpose of surface modification for improving the adhesion of the resin prior to resin application may be interposed.

  Next, with reference to FIG. 2 and FIG. 3, the substrate 4, the LED element 5, and the LED package 50 as a finished product, which are work targets in the LED package manufacturing system 1, will be described. As shown in FIG. 2A, the substrate 4 is a multiple-type substrate in which a plurality of individual substrates 4a serving as a base of one LED package 50 are formed in a finished product. Each individual substrate 4a is formed with one LED mounting portion 4b on which the LED element 5 is mounted. For each individual substrate 4a, the LED element 5 is mounted in the LED mounting portion 4b, and then the resin 8 (first resin 8A and second resin 8B) is applied so as to cover the LED element 5 in the LED mounting portion 4b. Then, after the resin 8 is cured, the process-completed substrate 4 is cut for each individual substrate 4a. Thereby, the LED package 50 shown in FIG. 2B is completed.

  The LED package 50 has a function of irradiating white light used as a light source of various illumination devices. Here, pseudo white light is obtained by combining the LED element 5 which is a blue LED and the first resin 8A including a first phosphor emitting yellow fluorescence which is complementary to blue. . Further, in the present embodiment, in addition to the first resin 8A, in order to adjust the white light to a desired color tone, the second resin 8B including the second phosphor that emits red or green fluorescence is added by a predetermined amount. It is applied on one resin 8A. Thereby, in addition to simple white light, warm-colored or cold-colored white light can be generated according to the use and preference of illumination.

  As shown in FIG. 2B, the individual substrate 4a is provided with a cavity-shaped reflecting portion 4c having, for example, a circular or elliptical annular bank so as to form the LED mounting portion 4b. The N-type part electrode 6a and the P-type part electrode 6b of the LED element 5 mounted inside the reflection part 4c are connected to the wiring layers 4e and 4d formed on the upper surface of the individual substrate 4a by bonding wires 7, respectively. The The first resin 8 </ b> A and the second resin 8 </ b> B are sequentially applied to the inner side of the reflecting portion 4 c with a predetermined thickness so as to cover the LED element 5 in this state. Then, the blue light emitted from the LED element 5 passes through the first resin layer 8a formed by the first resin 8A and the second resin layer 8b formed by the second resin 8B. The yellow light emitted from the first phosphor contained in 8a and the red or green emitted from the second phosphor contained in the second resin layer 8b are mixed and irradiated as white light. In the following description, when “resin 8” is simply described, it means the generic name of the first resin 8A and the second resin 8B or the entire resin layer.

  As shown in FIG. 3A, the LED element 5 is configured by laminating an N-type semiconductor 5b and a P-type semiconductor 5c on a sapphire substrate 5a, and further covering the surface of the P-type semiconductor 5c with a transparent electrode 5d. ing. An N-type part electrode 6a and a P-type part electrode 6b for external connection are formed on the N-type semiconductor 5b and the P-type semiconductor 5c, respectively. As shown in FIG. 3B, the LED elements 5 are taken out from the LED wafer 10 that is stuck and held on the holding sheet 10 a in a state of being divided into pieces after being formed in a lump. Due to various error factors in the manufacturing process of the LED element 5, for example, non-uniformity of the composition at the time of film formation on the wafer, the LED element 5 divided into pieces from the wafer state has emission characteristics such as emission wavelength. Variations are inevitable. If such an LED element 5 is mounted on the substrate 4 as it is, the emission characteristics of the LED package 50 as a product will vary.

  In order to prevent quality defects due to such variations in light emission characteristics, in this embodiment, the light emission characteristics of a plurality of LED elements 5 manufactured in the same manufacturing process are measured in advance. And the element characteristic information which matched each LED element 5 and the data which show the light emission characteristic of the said LED element 5 is produced. By utilizing this, it is possible to apply an appropriate amount of the resin 8 according to the light emission characteristics of each LED element 5 in applying the resin 8. However, in order to apply an appropriate amount of the resin 8, resin application information to be described later is prepared in advance.

  First, element characteristic information will be described. As shown in FIG. 3C, the LED element 5 taken out from the LED wafer 10 has an element ID for identifying the individual element (here, the individual LED element 5 with the serial number (i) in the LED wafer 10). Is identified). After that, it is sequentially inserted into the light emission characteristic measuring device 11. As the element ID, other data formats may be used as long as the information can individually identify the LED elements 5. For example, you may make it use the matrix coordinate which shows the arrangement | sequence of the LED element 5 in the LED wafer 10 as it is. By using the element ID of such a format, the LED element 5 can be supplied in the state of the LED wafer 10 in the component mounting apparatus M1 described later.

  In the light emission characteristic measuring apparatus 11, electric power is actually supplied to each LED element 5 through a probe to actually emit light, and the light is subjected to spectral analysis to measure a predetermined item such as a light emission wavelength and light emission intensity. For the LED element 5 to be measured, a standard distribution of emission wavelengths is prepared as reference data in advance. Further, by dividing the wavelength range corresponding to the standard range in the distribution into a plurality of wavelength ranges, the plurality of LED elements 5 to be measured are ranked according to the emission wavelength. Here, by dividing the wavelength range into five, the Bin codes [1], [2], [3], [4], [ 5]. Then, element characteristic information 12 having a data structure in which the Bin code 12b is associated with the element ID 12a is created.

  That is, the element characteristic information 12 is information obtained by separately measuring the light emission characteristics including the light emission wavelengths of the plurality of LED elements 5 in advance. The element characteristic information 12 is prepared in advance by an LED element manufacturer or the like and transmitted to the LED package manufacturing system 1. As a transmission form of the element characteristic information 12, it may be transmitted in a form recorded on a single storage medium, or may be transmitted to the management computer 3 via the LAN system 2. In any case, the transmitted element characteristic information 12 is stored in the management computer 3 and provided to the component mounting apparatus M1 as necessary.

  The plurality of LED elements 5 for which the light emission characteristic measurement is completed in this way are sorted for each characteristic rank as shown in FIG. 3D, and are sorted into five types according to each characteristic rank. Attached individually to the sheet 13a. Thereby, five types of LED sheets 13A, 13B, in which the LED elements 5 corresponding to the Bin codes [1], [2], [3], [4], and [5] are bonded and held on the adhesive sheet 13a, 13C, 13D, and 13E are created. When these LED elements 5 are mounted on the individual board 4a of the board 4, the LED elements 5 are component mounting devices in the form of LED sheets 13A, 13B, 13C, 13D, and 13E that have already been ranked in this way. Supplied to M1. At this time, the LED elements 5 corresponding to any of the Bin codes [1], [2], [3], [4], and [5] are held in the LED sheets 13A, 13B, 13C, 13D, and 13E, respectively. Whether the information is present is provided from the management computer 3 as part of the element characteristic information 12.

  Next, resin application information prepared in advance corresponding to the element characteristic information 12 described above will be described with reference to FIGS. Here, a case where white light having a desired color tone is obtained by combining a blue LED, a first phosphor that emits yellow light, and a second phosphor that emits red light or green light will be described. In the LED package 50 having such a configuration, the blue light emitted from the LED element 5 and the addition of yellow light and red or green light emitted from the first phosphor and the second phosphor excited by the blue light, respectively. Mixing takes place. For this reason, the amount of the particles of the first phosphor and the second phosphor in the concave LED mounting portion 4b on which the LED element 5 is mounted is important for ensuring the normal light emission characteristics of the LED package 50 of the product. It becomes an element.

  As described above, there are variations classified by the Bin codes [1], [2], [3], [4], and [5] in the emission wavelengths of the plurality of LED elements 5 that are simultaneously operated. . Therefore, the appropriate amount of phosphor particles in the resin 8 applied to cover the LED element 5 differs depending on the Bin codes [1], [2], [3], [4], [5]. It becomes. In the resin application information 14 prepared in the present embodiment, as shown in FIG. 4, the first resin 8A containing the first phosphor and the second resin 8B containing the second phosphor are classified according to the Bin code classification. The appropriate resin application amount is specified in advance in units of nl (nanoliter) according to the Bin code category 17. Note that a thermosetting resin such as a silicone resin or an epoxy resin is preferably used as the base resin of the first resin 8A and the second resin 8B. When the first resin 8 </ b> A and the second resin 8 </ b> B are accurately applied so as to cover the LED element 5 by the appropriate resin application amount indicated in the resin application information 14, the phosphor particles in the resin covering the LED element 5 The amount is also an appropriate supply amount. Thereby, the regular light emission wavelength calculated | required by the finished product after the resin 8 thermosets is ensured.

  Here, Bin codes [1], [2], [3], [4], [5] are used for each combination in which the concentration of the first phosphor and the amount of the second phosphor particles are changed in plural ways. Depending on each, different appropriate resin coating amounts are made to correspond. That is, the resin application information 14 is configured in the form of a plurality of data tables. In the component ratio of the phosphor in the resin 8, the ratio of the first phosphor that mainly emits white light is larger than the ratio of the second phosphor. Therefore, a data table is created for each of a plurality of specific values when the amount of particles of the second phosphor, which is a trace component, is fixed to a specific value. The amount of particles of the second phosphor is defined by the concentration (%) of the second phosphor and the resin application amount of the second resin 8B containing the second phosphor.

  Specifically, as shown in FIG. 4, when the specific value of the second phosphor particle amount is fixed in a plurality of ways of Q1, Q2, and Q3, and the second phosphor particle amount is Q1, Q2, and Q3, respectively. The proper resin application amounts 15 (1), 15 (2), and 15 (3) are defined. The appropriate resin application amount 15 (1) corresponds to the phosphor concentration column 16 (1). And with respect to one specific value Q1 of the amount of particles of the second phosphor, there are a plurality of first phosphor concentrations indicating the concentration of the phosphor particles in the first resin 8A (here, D11 (5%), D12). (10%) and D13 (15%)). Further, different numerical values are used as the appropriate resin application amount of the first resin 8A according to the respective first phosphor concentrations.

  For example, when the first resin 8A having the phosphor concentration D11 is applied, the appropriate resin application amounts VA0 and VB0 for the Bin codes [1], [2], [3], [4], and [5], respectively. , VC0, VD0, VE0 (appropriate resin application amount 15 (11)) of the first resin 8A is applied. Similarly, when a resin having a phosphor concentration D12 is applied, the appropriate resin application amounts VF0, VG0, VH0 for the Bin codes [1], [2], [3], [4], and [5], respectively. , VJ0, VK0 (appropriate resin application amount 15 (12)) of the first resin 8A is applied. Further, when the first resin 8A having the phosphor concentration D13 is applied, the appropriate resin application amounts VL0 and VM0 for the Bin codes [1], [2], [3], [4], and [5], respectively. , VN0, VP0, VR0 (appropriate resin application amount 15 (13)) of the first resin 8A is applied. The appropriate resin coating amount is set for each of the plurality of first phosphor concentrations different from each other as described above. It is necessary to apply a resin having an optimal phosphor concentration according to the degree of variation in emission wavelength. It is because it is more preferable above.

  Similarly, when the specific value of the second phosphor particle amount is Q2 or Q3, the phosphor concentration column 16 (2) or 16 with respect to the appropriate resin coating amount 15 (2) or 15 (3). Corresponding to (3). Thus, the color tone of the illumination light emitted from the LED package 50 can be adjusted by changing the particle amount of the second phosphor in the resin 8.

  In the chromaticity diagram of FIG. 5, the broken line L1 indicates the color tone when only the phosphor that emits yellow excitation light is used, and the chromaticity range corresponding to the white portion at the center is used as the standard white light range. It is done. On the other hand, when a phosphor emitting red excitation light is added as the second phosphor, the color tone changes to a warm reddish white along the broken line L2. Moreover, illumination light closer to red is obtained as the addition ratio increases. On the other hand, when a phosphor that emits green excitation light is added as the second phosphor, the color tone changes to a cool greenish white along the broken line L3. As described above, by using a plurality of resins each containing different types of phosphors as the resin 8 covering the LED element 5, the color tone of the emission color of the LED package 50 can be variously adjusted.

  When applying the resin application information 14 shown in FIG. 4, first, the amount of the second phosphor particles corresponding to a desired color tone is estimated. Then, the second phosphor particle amount that most closely approximates this estimated value is selected from Q1, Q2, and Q3, and a data table corresponding to the selected second phosphor particle amount is used. For example, when the second phosphor particle amount Q1 is selected, the first phosphor concentration column 16 (1) and the appropriate resin coating amount 15 (1) are used.

  Next, the configuration and function of the component mounting apparatus M1 will be described with reference to FIG. As shown in the plan view of FIG. 6A, the component mounting apparatus M1 includes a board transfer mechanism 21 that transfers the work target board 4 supplied from the upstream side in the board transfer direction (arrow a). In order from the upstream side, the substrate transport mechanism 21 is provided with an adhesive application part A shown in section AA in FIG. 6B and a component mounting part B shown in section BB in FIG. It is installed. The adhesive application unit A is disposed on the side of the substrate transport mechanism 21 and supplies the resin adhesive 23 in the form of a coating film having a predetermined film thickness, and the substrate transport mechanism 21 and the adhesive supply unit 22. Is provided with an adhesive transfer mechanism 24 that is movable in the horizontal direction (arrow b). Further, the component mounting portion B is disposed on the side of the board transport mechanism 21, and includes a component supply mechanism 25 and a board transport mechanism 21 that hold the LED sheets 13A, 13B, 13C, 13D, and 13E shown in FIG. A component mounting mechanism 26 that is movable in the horizontal direction (arrow c) above the component supply mechanism 25 is provided.

  As shown in FIG. 6B, the substrate 4 carried into the substrate transport mechanism 21 is positioned by the adhesive application portion A, and is bonded to the LED mounting portion 4b formed on each individual substrate 4a. The agent 23 is applied. That is, first, the adhesive transfer mechanism 24 is moved above the adhesive supply unit 22 so that the transfer pin 24a is brought into contact with the coating film of the resin adhesive 23 formed on the transfer surface 22a, and the resin adhesive 23 is adhered. Next, the adhesive transfer mechanism 24 is moved above the substrate 4 and the transfer pin 24a is lowered to the LED mounting portion 4b (arrow d), whereby the resin adhesive 23 attached to the transfer pin 24a is moved to the LED mounting portion. It is supplied by transfer to the element mounting position in 4b.

  Next, the substrate 4 after application of the adhesive is conveyed downstream and positioned by the component mounting portion B as shown in FIG. And LED element 5 is mounted for each LED mounting part 4b after adhesive supply. First, the component mounting mechanism 26 is moved above the component supply mechanism 25, and the mounting nozzle 26a is lowered with respect to any of the LED sheets 13A, 13B, 13C, 13D, and 13E held by the component supply mechanism 25, and mounted. The LED element 5 is held and taken out by the nozzle 26a. Next, by moving the component mounting mechanism 26 above the LED mounting portion 4b of the substrate 4 and lowering the mounting nozzle 26a (arrow e), the LED element 5 held by the mounting nozzle 26a is moved into the LED mounting portion 4b. It is mounted at the element mounting position where the adhesive is applied.

  Mounting of the LED element 5 on the substrate 4 (component mounting operation) by the component mounting apparatus M1 is executed in accordance with a device mounting program created in advance. The order of individual mounting operations by the component mounting mechanism 26 is set in the element mounting program. That is, in the individual mounting operation, the order in which the LED element 5 is taken out from any of the LED sheets 13A, 13B, 13C, 13D, and 13E and mounted on the plurality of individual substrates 4a of the substrate 4 is set in advance. Yes.

  When performing the component mounting work, mounting position information 71a (see FIG. 12) is extracted from a predetermined storage unit 71. Then, from the work execution history, it is recorded in the mounting position information 71a which of the plurality of individual substrates 4a of the substrate 4 is mounted on the individual substrate 4a. Then, data associating the mounting position information 71a and the element characteristic information 12 is created as map data 18 as shown in FIG. 7 by the map creation processing unit 74 (see FIG. 12). As described above, the element characteristic information 12 indicates that the LED element 5 mounted on each individual substrate 4a has any characteristic rank (Bin code [1], [2], [3], [4], [ 5]).

  In FIG. 7, the position of each of the plurality of individual substrates 4a of the substrate 4 is specified by a combination of matrix coordinates 19X and 19Y indicating positions in the X direction and Y direction, respectively. A Bin code to which the LED element 5 mounted at the position belongs is associated with an individual cell of the matrix specified by the matrix coordinates 19X and 19Y. Thereby, the map data 18 in which the mounting position information 71a indicating the position of the LED element 5 mounted by the component mounting apparatus M1 on the substrate 4 and the element characteristic information 12 about the LED element 5 are associated is created.

  That is, the component mounting apparatus M1 includes a map creation processing unit 74 as map data creation means for creating map data 18 in which mounting position information and element characteristic information 12 are associated. The map data 18 is created for each substrate 4. The created map data 18 is transmitted as feedforward data to the resin coating apparatus M4 described below via the LAN system 2.

  Next, with reference to FIG. 8, FIG. 9, the structure and function of the resin coating apparatus M4 are demonstrated. The resin coating device M4 has a function of coating the first resin 8A and the second resin 8B so as to cover the plurality of LED elements 5 mounted on the substrate 4 by the component mounting device M1. As shown in the plan view of FIG. 8 (a), the resin coating apparatus M4 transfers the work target (coating target) substrate 4 supplied from the upstream side to the substrate transport mechanism 31 that transports the substrate 4 in the substrate transport direction (arrow f). FIG. 8B shows a configuration in which a resin coating portion C shown in a CC cross section is disposed. The resin application part C is provided with a dispenser 33A that discharges the first resin 8A from the first nozzle 33a and a dispenser 33B that discharges the second resin 8B from the second nozzle 33b. 32. In the resin discharge head 32, the dispensers 33A and 33B are individually movable up and down.

  As described above, in the component ratio of the phosphor in the resin 8, the ratio of the first phosphor that emits yellow light is larger than the ratio of the second phosphor, and thus the first fluorescence applied to the LED element. The amount of the first resin 8A including the body is larger than that of the second resin 8B including the second phosphor. Therefore, it is preferable that the first nozzle 33a that discharges the first resin 8A is a nozzle that is capable of quantitative discharge and has a large discharge amount. Here, it is preferable that the first resin 8A having a large coating amount is applied to the LED element earlier than the second resin 8B having a small coating amount. This is because the external force received by the interface between the first resin and the second resin is smaller when the second resin 8B having a smaller coating amount is applied later, and the interface tends to be flat. The external force received by the interface becomes smaller as the viscosity of the first resin 8A is higher and the viscosity of the second resin 8B is lower. From the above, the first nozzle 33a is, for example, a screw type or screw pump type dispensing nozzle so that the first resin 8A can be applied thickly in a short time even if the viscosity of the first resin 8A is high. Preferably there is.

  On the other hand, the second nozzle 33b that discharges the second resin 8B can discharge a small amount of the second resin 8B having a low viscosity as a droplet, and can accurately control the discharge amount. It is preferable that From the above, it is preferable that the second nozzle 33b is, for example, a jet type dispensing nozzle.

  As described above, the resin application part C has the hybrid resin discharge head 32 in which the screw-type dispense nozzle that discharges the first resin 8A and the jet-type dispense nozzle that discharges the second resin 8B are combined. It is possible to achieve both improvement in productivity and yield and precise control of the resin coating amount.

  The resin application unit C is controlled by the application control unit 36 and has a function of selectively applying the first resin 8A and the second resin 8B to a predetermined application target. Specifically, as shown in FIG. 8B, the resin discharge head 32 is driven by a nozzle moving mechanism 34. The nozzle moving mechanism 34 is controlled by the application control unit 36 and performs a moving operation and an elevating operation in the horizontal direction (arrow g shown in FIG. 8A). The syringes attached to the dispensers 33A and 33B of the resin discharge head 32 contain the first resin 8A and the second resin 8B, respectively. First, the application control unit 36 discharges the first resin 8A from the first nozzle 33a, thereby performing first control for applying the first resin 8A to the LED elements 5 mounted on the substrate. Then, after the first control, the second resin 8B is discharged from the second nozzle 33b without curing the applied first resin 8A, whereby the second resin 8B is applied onto the applied first resin 8A. The second control to apply the is performed.

  In the first control, for example, the screw-type first resin discharge mechanism 35A rotates the screw by a predetermined number of rotations with respect to the dispenser 33A having the first nozzle 33a, whereby a predetermined amount of the first resin 8A is obtained. It is applied to the LED element 5. On the other hand, in the second control, for example, an electrical control command is given to the jet-type second resin discharge mechanism 35B built in the dispenser 33B having the second nozzle 33b, thereby driving the discharge mechanism, Two resins 8B are applied on the first resin 8A. The operations of the first resin discharge mechanism 35A and the second resin discharge mechanism 35A are controlled by the application control unit 36. Accordingly, the first resin 8A and the second resin 8B are sequentially applied to the LED mounting portion 4b formed on the substrate 4. At this time, by controlling the first resin discharge mechanism 35A and the second resin discharge mechanism 35B by the application control unit 36, the discharge amounts of the first resin 8A and the second resin 8B can be arbitrarily controlled. That is, the resin application part C is configured to apply the first resin 8A and the second resin 8B to an arbitrary application target by discharging the application amount in a variable manner.

  In addition to the above, the first resin discharge mechanism 35A and the second resin discharge mechanism 35B can employ various liquid discharge methods such as a plunger method using a mechanical cylinder and a screw pump method.

  A test hitting / measurement unit 40 is disposed on the side of the substrate transport mechanism 31 so as to be positioned within the movement range of the resin discharge head 32. Prior to the actual production coating operation in which the test resin / measurement unit 40 applies the first resin 8A and the second resin 8B to the LED mounting portion 4b of the substrate 4, the application amounts of the first resin 8A and the second resin 8B are appropriate. Or not by measuring the light emission characteristics of the test-applied resin 8. In the trial hitting / measurement unit 40, the light emission characteristics when the light emitted from the measurement light source unit 45 is irradiated on the light transmitting member 43 on which the first resin 8A and the second resin 8B are test-applied by the resin application part C, It is measured by a light emission characteristic measurement unit including a spectroscope 42 and a light emission characteristic measurement processing unit 39. Then, by comparing the measurement result with a preset threshold value, it is determined whether the preset resin application amount specified by the resin application information 14 shown in FIG. 4 is appropriate. In the present embodiment, the light emission characteristics are measured after trial application of two types of the first resin 8A and the second resin 8B having different fluorescent colors. However, the first resin 8A and the second resin 8B are respectively measured. You may make it determine the suitability of the resin application quantity by measuring the light emission characteristic individually as an object.

  The composition and properties of the first resin 8A and the second resin 8B containing the phosphor particles are not necessarily stable. It is inevitable that the concentration of the phosphor and the viscosity of the resin vary with time. For this reason, even if the appropriate resin application amount is set in advance by the resin application information 14 and the first resin 8A and the second resin 8B are discharged with the discharge parameters corresponding to the appropriate resin application amount, the resin application amount itself is already set. May vary from the appropriate value. Further, even if the resin coating amount itself is appropriate, the supply amount of the phosphor particles to be originally supplied varies depending on the concentration change of the phosphor.

  In order to eliminate such inconvenience, in the present embodiment, trial coating for inspecting whether or not an appropriate supply amount of phosphor particles is supplied at a predetermined interval is executed by the resin coating apparatus M4. . Further, by measuring the light emission characteristics for the test-coated resin, the supply amount of the phosphor particles is stabilized in accordance with the light emission characteristics that should originally exist. And the resin application part C with which the resin application apparatus M4 shown in this embodiment is equipped is a measurement application process for applying the resin 8 to the translucent member 43 for the above-mentioned light emission characteristic measurement, and a substrate for actual production. 4 has a function of executing a production coating process to be applied to the LED element 5 mounted in the state 4. Both the coating process for measurement and the coating process for production are executed when the coating control unit 36 controls the resin coating unit C.

  A detailed configuration of the trial hitting / measurement unit 40 will be described with reference to FIG. As shown in FIG. 9A, the translucent member 43 is supplied from a state of being wound around the supply reel 47 and is sent along the upper surface of the trial hitting stage 40a. Is wound around a collection reel 48 driven by a take-up motor 49. As a mechanism for collecting the translucent member 43, various methods such as a method of feeding the translucent member 43 into the collection box by a feeding mechanism in addition to the method of collecting the translucent member by winding it on the collection reel 48 are adopted. Can do.

  The irradiation unit 46 has a function of irradiating the translucent member 43 with the measurement light emitted from the light source unit 45. The measurement light emitted from the light source unit 45 is guided by a fiber cable to the light focusing tool 46b in the light shielding box 46a having a simple dark box function. The light source unit 45 has a function of emitting excitation light that excites the phosphor contained in the resin 8. In the present embodiment, the light source unit 45 is disposed above the translucent member mounting unit 41. And it is the form which irradiates with respect to the translucent member 43 from upper direction through the light converging tool 46b.

  Here, as the translucent member 43, a flat sheet-like member made of transparent resin is used as a tape material having a predetermined width, or an emboss corresponding to the shape of the LED mounting portion 4b of the LED package 50 on the lower surface of the similar tape material. An embossed type or the like in which the portion 43a is protruded is used. In the process in which the translucent member 43 is sent over the test hitting / measurement unit 40, the first resin 8 </ b> A and the second resin 8 </ b> B are test-applied to the translucent member 43 by the resin discharge head 32. In this trial application, a predetermined amount of the first resin 8A and the second resin 8B are discharged to the translucent member 43 by the application nozzles 33a and 33b with respect to the translucent member 43 whose lower surface is supported by the test strike stage 40a. Is done by doing.

First, as shown in FIG. 9 (b-1), the first resin having a preset appropriate discharge amount defined by the resin application information 14 by the dispenser 33A on the embossed type portion 43a of the embossed type translucent member 43. Test application 8A. Next, a predetermined appropriate application amount of the second resin 8B specified by the resin application information 14 is trial-applied to another emboss type part 43a of the emboss type translucent member 43. That is, the emission colors of the first resin 8A and the second resin 8B are managed separately. On the other hand, as shown in FIG. 9 (b-2), the second resin 8B may be applied so as to overlap the first resin 8A of the embossed portion 43a to which the first resin 8A is applied. In that case, it is desirable that the size of the embossed portion 43a of the translucent member 43 be matched with the cavity shape of the reflecting portion 4c included in the individual substrate 4a (FIG. 2) of the LED package that is actually produced.
Note that, as will be described later, the first resin 8A or the second resin 8B applied at the trial hitting stage 40a, or a laminate of the first resin 8A and the second resin 8B (hereinafter also simply referred to as the resin 8). Is a trial application for empirically determining whether or not the phosphor supply amount is appropriate for the target LED element 5. For this reason, when the resin 8 is continuously applied to a plurality of points on the light transmitting member 43 by the same trial application operation by the resin discharge head 32, the correlation between the measured value of the light emission characteristic and the application amount is known. Based on the data, the application amount is varied in stages and applied.

  After the trial application of the resin 8 in this manner, the white light emitted by the light source unit 45 is irradiated from above through the light focusing tool 46b to the light transmitting member 43 guided into the light shielding box 46a. To do. And the light which permeate | transmitted the resin 8 apply | coated to the translucent member 43 is arrange | positioned under the translucent member mounting part 41 through the light transmissive opening part 41a provided in the translucent member mounting part 41. The integrated sphere 44 receives the light. FIG. 9C shows the structure of the translucent member mounting portion 41 and the integrating sphere 44. The translucent member mounting portion 41 has a structure in which an upper guide member 41 c having a function of guiding both end surfaces of the translucent member 43 is mounted on the upper surface of the lower support member 41 b that supports the lower surface of the translucent member 43. Yes.

  The translucent member placement section 41 guides the translucent member 43 during conveyance in the test hitting / measurement unit 40, and places the translucent member 43 on which the resin 8 has been trial-applied in the measurement application process. It has a function to hold. The integrating sphere 44 has a function of condensing the transmitted light that has been irradiated from the light focusing tool 46 b (arrow h) and transmitted through the resin 8 and led to the spectroscope 42. The integrating sphere 44 has a spherical reflection surface 44c having a spherical shape inside. The transmitted light (arrow i) that has entered through the opening 44a located immediately below the light transmission opening 41a enters the reflection space 44b from the opening 44a provided at the top of the integrating sphere 44, and is reflected by a spherical reflecting surface. In the process of repeating the total reflection by 44c (arrow j), it is taken out as measurement light (arrow k) from the output unit 44d and received by the spectroscope 42.

  In the above-described configuration, the white light emitted by the LED package used for the light source unit 45 is applied to the resin 8 that has been trial-applied to the translucent member 43. In this process, the blue light component contained in the white light excites the phosphor in the resin 8 to emit yellow light, red light or green light. Then, white light in which yellow light and blue light are added and mixed is irradiated upward from the resin 8 and received by the spectroscope 42 via the integrating sphere 44 described above.

  The received white light is analyzed by the light emission characteristic measurement processing unit 39 to measure the light emission characteristic, as shown in FIG. 8B. Here, the light emission characteristics such as the color tone rank of white light and the luminous flux are inspected, and a deviation from the prescribed light emission characteristics is detected as the inspection result. The integrating sphere 44, the spectroscope 42, and the light emission characteristic measurement processing unit 39 emit the excitation light (blue light extracted by the white LED here) emitted from the light source unit 45 on the resin 8 applied to the translucent member 43 from above. By irradiating, the light emitted from the resin 8 is received from below the translucent member 43 to constitute a light emission characteristic measuring unit that measures the light emission characteristic of the light emitted from the resin 8. In the present embodiment, the light emission characteristic measurement unit is configured by disposing the integrating sphere 44 below the translucent member 43 so as to receive light emitted from the resin 8 through the opening 44 a of the integrating sphere 44. It is configured.

  By configuring the light emission characteristic measuring unit as described above, the following effects can be obtained. That is, in the application shape of the resin 8 that is trial-applied to the light transmissive member 43 shown in FIG. 9B, the lower surface side is always in contact with the upper surface of the light transmissive member 43 or the bottom surface of the embossed portion 43a. The lower surface of 8 is always at a reference height defined by the translucent member 43. Therefore, the height difference between the lower surface of the resin 8 and the opening 44a of the integrating sphere 44 is always kept constant. On the other hand, the same liquid surface shape and height are not necessarily realized on the upper surface of the resin 8 due to disturbances such as application conditions by the application nozzle 33a. The distance between the upper surface of the resin 8 and the light focusing tool 46b varies.

  Here, considering the degree of stability when the irradiation light irradiated on the upper surface of the resin 8 is compared with the transmitted light from the lower surface of the resin 8, the irradiation light irradiated on the resin 8 is light focused. Since the irradiation is performed through the tool 46b, the degree of focusing is high, and the influence of the variation in the distance between the upper surface of the resin 8 and the light focusing tool 46b on the light transmission can be ignored. On the other hand, the transmitted light that has passed through the resin 8 is excitation light in which the phosphor is excited inside the resin 8, and thus the degree of scattering is high, and the distance between the lower surface of the resin 8 and the opening 44a. The influence on the degree of light taken in by the integrating sphere 44 cannot be ignored.

  In the trial hitting / measurement unit 40 shown in the present embodiment, the light emitted from the resin 8 is transmitted by irradiating the resin 8 with the excitation light emitted from the light source unit 45 from above as in the above-described configuration. Since the configuration in which light is received by the integrating sphere 44 from below the optical member 43 is employed, it is possible to determine stable light emission characteristics. Further, by using the integrating sphere 44, it is not necessary to separately provide a dark room structure in the light receiving portion, and the apparatus can be made compact and the equipment cost can be reduced.

  As shown in FIG. 8B, the measurement result of the light emission characteristic measurement processing unit 39 is sent to the coating amount derivation processing unit 38. The application amount derivation processing unit 38 obtains a deviation between the measurement result of the light emission characteristic measurement processing unit 39 and a predetermined light emission characteristic, and based on this deviation, the resin 8 to be applied to the LED element 5 for actual production. A process for deriving an appropriate resin coating amount is performed. The new appropriate discharge amount derived by the application amount derivation processing unit 38 is sent to the production execution processing unit 37, and the production execution processing unit 37 commands the newly derived appropriate resin application amount to the application control unit 36. Thereby, the application control unit 36 controls the resin application unit including the nozzle moving mechanism 34 and the resin discharge mechanism 35 to apply the appropriate amount of resin 8 to the LED element 5 mounted on the substrate 4. The application process is executed by the resin discharge head 32.

  In the production coating process, first, the resin 8 having an appropriate resin coating amount defined in the resin coating information 14 is actually applied to the light projecting member, and light emission characteristics are measured in a state where the resin 8 is uncured. And based on the obtained measurement result, the non-defective range of the luminescent property measurement value when the luminescent property is measured for the resin 8 applied in the production coating is set. This non-defective product range is used as a threshold value for quality determination in production coating (see threshold data 81a shown in FIG. 12).

  That is, in the LED package manufacturing system shown in the present embodiment, the resin 8 applied to the LED element 5 is cured as a pre-defined light emission characteristic that is a basis for setting a threshold value for quality determination in production application. The normal light emission characteristics required for the finished product are used such that the light emission characteristics are biased by the difference in the light emission characteristics due to the resin 8 being in an uncured state. Thereby, control of the resin application amount in the resin application process to the LED element 5 can be performed based on the normal light emission characteristics of the finished product.

  In the present embodiment, the LED package 50 that emits white light is used as the light source unit 45. Thereby, the light emission characteristic measurement of the resin 8 applied by trial can be performed by the light having the same characteristic as the excitation light emitted in the finished LED package 50, and a more reliable test result can be obtained. . It is not always necessary to use the same LED package as that used for the finished product. For light emission characteristics measurement, a light source device that can stably emit blue light having a constant wavelength (for example, a blue LED that emits blue light or a blue laser light source) is used as a light source unit for inspection. be able to. By using an LED package that emits white light using a blue LED, there is an advantage that a stable quality light source device can be selected at low cost. Here, blue light having a predetermined wavelength may be extracted using a band-pass filter.

  Instead of the trial placement / measurement unit 40 having the above-described configuration, a trial placement / measurement unit 140 having the configuration shown in FIGS. 10 and 11 may be used. That is, as shown in FIGS. 10 and 11, the test hitting / measuring unit 140 has an external structure in which a cover portion 140b is disposed above an elongated horizontal base portion 140a. The cover part 140b is provided with an opening part 140c, and the opening part 140c can be freely opened and closed by a sliding slide window 140d for application (arrow l). Inside the trial hitting / measurement unit 140, a trial hitting stage 145a for supporting the translucent member 43 from the lower surface side, a translucent member mounting portion 141 on which the translucent member 43 is placed, and a translucent member mounting portion 141. A spectroscope 42 is provided above.

  The translucent member mounting portion 141 includes a light source device that emits excitation light that excites the phosphor, similarly to the light source unit 45 illustrated in FIG. 9. The member 43 is irradiated with excitation light from the lower surface side of the light source device. Similarly to the example shown in FIG. 9, the translucent member 43 is supplied from the state wound on the supply reel 47 and is sent along the upper surface of the test strike stage 145a (arrow m), and then the translucent member is mounted. It is wound around a collection reel 48 that is driven by a winding motor 49 via a space between the mounting portion 141 and the spectroscope 42.

  In a state where the application sliding window 140d is slid and opened, the upper surface of the test strike stage 145a is exposed upward, and the resin discharge head 32 applies the resin 8 by trial application to the translucent member 43 placed on the upper surface. It becomes possible. In this trial application, as shown in FIG. 9B, the resin 8 having a prescribed application amount is applied to the translucent member 43 whose lower surface side is supported by the trial strike stage 145a. It is performed by discharging to 43.

  In FIG. 11B, the translucent member 43 on which the resin 8 has been trial-applied is moved by the trial hitting stage 145a so that the resin 8 is positioned above the translucent member mounting portion 141, and the cover portion 140b is further moved. A state in which a darkroom for measuring light emission characteristics is formed between the base 140a and the base 140a is shown. An LED package 50 that emits white light is used as the light source device for the translucent member mounting portion 141. In the LED package 50, the wiring layers 4e and 4d connected to the LED element 5 are connected to the power supply device 142. By turning on the power supply device 142, the LED element 5 is supplied with power for light emission. Thereby, the LED package 50 emits white light.

  Then, after the white light passes through the resin 8, the phosphor in the resin 8 is excited by the blue light included in the white light in the process of irradiating the resin 8 that has been trial-applied to the translucent member 43 to emit light. White light in which yellow light and blue light are additively mixed is irradiated upward from the resin 8. A spectroscope 42 is disposed above the trial hitting / measurement unit 140. The white light emitted from the resin 8 is received by the spectroscope 42. The received white light is analyzed by the light emission characteristic measurement processing unit 39 and the light emission characteristic is measured. Here, the light emission characteristics such as the color tone rank of white light and the luminous flux are inspected, and a deviation from the prescribed light emission characteristics is detected as the inspection result. That is, the light emission characteristic measurement processing unit 39 measures the light emission characteristic of the light emitted by the resin 8 by irradiating the resin 8 applied to the translucent member 43 with the excitation light emitted from the LED element 5 that is the light source part. To do. Then, the measurement result of the light emission characteristic measurement processing unit 39 is sent to the coating amount derivation processing unit 38, and the same processing as in the example shown in FIG. 8 is executed.

  Next, the configuration of the control system of the LED package manufacturing system 1 will be described with reference to FIG. Here, among the components of each device constituting the LED package manufacturing system 1, in the management computer 3, the component mounting device M1, and the resin coating device M4, the element characteristic information 12, the resin coating information 14, the map data 18, and the above-mentioned The component related to transmission / reception of threshold value data 81a and an update process is shown.

  In FIG. 12, the management computer 3 includes a system control unit 60, a storage unit 61, and a communication unit 62. The system control unit 60 controls the LED package manufacturing work by the LED package manufacturing system 1 in an integrated manner. In addition to programs and data necessary for control processing by the system control unit 60, the storage unit 61 stores element characteristic information 12, resin application information 14, and map data 18 and threshold data 81a as necessary. ing. The communication unit 62 is connected to other devices via the LAN system 2 and exchanges control signals and data. The element characteristic information 12 and the resin application information 14 are transmitted from the outside via the LAN system 2 and the communication unit 62 or via a single storage medium such as a CD ROM, a USB memory storage, an SD card, and the like. Remembered.

  The component mounting apparatus M1 includes a mounting control unit 70, a storage unit 71, a communication unit 72, a mechanism driving unit 73, and a map creation processing unit 74. The mounting control unit 70 controls each unit described below based on various programs and data stored in the storage unit 71 in order to execute a component mounting operation by the component mounting apparatus M1. The storage unit 71 stores mounting position information 71 a and element characteristic information 12 in addition to programs and data necessary for control processing by the mounting control unit 70. The mounting position information 71 a is created from execution history data of mounting operation control by the mounting control unit 70. The element characteristic information 12 is transmitted from the management computer 3 via the LAN system 2. The communication unit 72 is connected to other devices via the LAN system 2 and exchanges control signals and data.

  The mechanism driving unit 73 is controlled by the mounting control unit 70 to drive the component supply mechanism 25 and the component mounting mechanism 26. As a result, the LED elements 5 are mounted on the individual substrates 4 a of the substrate 4. The map creation processing unit 74 (map data creation means) is stored in the storage unit 71, and the mounting position information 71a indicating the position of the LED element 5 mounted by the component mounting apparatus M1 on the substrate 4, and the LED element 5 A process of creating the map data 18 associated with the element characteristic information 12 for each substrate 4 is performed. That is, the map data creating means is provided in the component mounting apparatus M1, and the map data 18 is transmitted from the component mounting apparatus M1 to the resin coating apparatus M4. The map data 18 may be transmitted from the component mounting apparatus M1 to the resin coating apparatus M4 via the management computer 3. In this case, the map data 18 is also stored in the storage unit 61 of the management computer 3 as shown in FIG.

  The resin coating apparatus M4 includes a coating control unit 36, a storage unit 81, a communication unit 82, a production execution processing unit 37, a coating amount derivation processing unit 38, and a light emission characteristic measurement processing unit 39. The application controller 36 controls the nozzle moving mechanism 34, the first resin discharge mechanism 35 </ b> A, the second resin discharge mechanism 35 </ b> B, and the test hitting / measurement unit 40 that constitute the resin application part C. Thereby, the process which performs the application | coating process for a measurement which apply | coats the 1st resin 8A and the 2nd resin 8B to the translucent member 43 for light emission characteristic measurement, and the LED element 5 for actual production is performed. I do. Here, in the measurement application process, the application control unit 36 uses the application nozzles 33a and 33b of the dispensers 33A and 33B, and the first resin 8A including the first phosphor and the second phosphor 8A, and the second resin The two resins 8B are sequentially applied to different embossed portions 43a of the same translucent member 43 for light emission characteristic measurement.

  The storage unit 81 stores the resin application information 14, the map data 18, the threshold data 81a, and the actual production application amount 81b, in addition to the programs and data necessary for the control process by the application control unit 36. The resin application information 14 is transmitted from the management computer 3 via the LAN system 2. Similarly, the map data 18 is transmitted from the component mounting apparatus M1 via the LAN system 2. The communication unit 82 is connected to other devices via the LAN system 2 and exchanges control signals and data.

  The light emission characteristic measurement processing unit 39 irradiates the resin 8 (the first resin 8A and the second resin 8B) that has been trial-applied to the translucent member 43 with the excitation light emitted from the light source unit 45, thereby applying these resins. A process for measuring light emission characteristics as an object is performed. The application amount derivation processing unit 38 obtains a deviation between the measurement result of the light emission characteristic measurement processing unit 39 and a predetermined light emission characteristic. And based on this deviation, the calculation process which derives | leads-out the appropriate resin application amount of 1st resin 8A and 2nd resin 8B which should be apply | coated to LED element 5 for actual production is performed. Then, the production execution processing unit 37 instructs the application control unit 36 of appropriate resin application amounts for the first resin 8A and the second resin 8B derived by the application amount derivation processing unit 38, so that the dispensers 33A and 33B With each coating nozzle 33a, a production coating process for sequentially coating the same LED element 5 with the first resin 8A and the second resin 8B of the appropriate resin coating amount is executed.

  In the configuration shown in FIG. 12, a processing function other than the function for executing the work operation unique to each apparatus, for example, the function of the map creation processing unit 74 provided in the component mounting apparatus M1, and the resin coating apparatus M4 are provided. The function of the applied amount derivation processing unit 38 is not necessarily attached to the apparatus. For example, the functions of the map creation processing unit 74 and the application amount derivation processing unit 38 are covered by the arithmetic processing function of the system control unit 60 of the management computer 3 and necessary signal exchange is performed via the LAN system 2. You may comprise.

  In the configuration of the LED package manufacturing system 1 described above, the component mounting apparatus M1 and the resin coating apparatus M4 are both connected to the LAN system 2. Then, the management computer 3 and the LAN system 2 in which the element characteristic information 12 is stored in the storage unit 61 uses the information obtained by individually measuring the emission characteristics including the emission wavelengths of the plurality of LED elements 5 in advance. This is element characteristic information providing means provided to the component mounting apparatus M1 as information 12. Similarly, the management computer 3 and the LAN system 2 in which the resin application information 14 is stored in the storage unit 61, the appropriate resin application amount of the resin 8 and the element characteristic information for obtaining the LED package 50 having the prescribed light emission characteristics, Is a resin information providing means for providing information corresponding to the information to the resin coating apparatus M4 as resin coating information.

  That is, the element characteristic information providing means for providing the element characteristic information 12 to the component mounting apparatus M1 and the resin information providing means for providing the resin coating information 14 to the resin coating apparatus M4 are the storage unit 61 of the management computer 3 which is an external storage means. The element characteristic information and the resin application information read out are transmitted to the component mounting apparatus M1 and the resin application apparatus M4 via the LAN system 2, respectively.

  Next, the LED package manufacturing process executed by the LED package manufacturing system 1 will be described along the flow of FIG. 13 with reference to the drawings. First, element characteristic information 12 and resin application information 14 are acquired (ST1). That is, the first resin 8A and the second resin 8A for obtaining the LED package 50 having the element characteristic information 12 obtained by individually measuring the emission characteristics including the emission wavelengths of the plurality of LED elements 5 in advance and the prescribed emission characteristics. The resin application information 14 that associates the appropriate resin application amount of the resin 8B with the element characteristic information 12 is acquired from the external device via the LAN system 2 or via a storage medium. At this time, the second phosphor particle amount corresponding to the color tone required for the LED package 50 to be manufactured is first selected, and a data table corresponding to the selected second phosphor particle amount is acquired.

  Thereafter, the board 4 to be mounted is carried into the component mounting apparatus M1 (ST2). Then, as shown in FIG. 19A, the resin adhesive 23 is supplied to the element mounting position in the LED mounting portion 4b by moving the transfer pin 24a of the adhesive transfer mechanism 24 up and down (arrow n). After that, as shown in FIG. 19B, the LED element 5 held by the mounting nozzle 26a of the component mounting mechanism 26 is lowered (arrow o), and is inserted into the LED mounting portion 4b of the substrate 4 through the resin adhesive 23. Mount (ST3). Then, the map creation processing unit 74 creates the map data 18 that associates the mounting position information 71a and the element characteristic information 12 of each LED element 5 with respect to the board 4 from the execution data of the component mounting work ( ST4). Next, the map data 18 is transmitted from the component mounting apparatus M1 to the resin coating apparatus M4, and the resin coating information 14 is transmitted from the management computer 3 to the resin coating apparatus M4 (ST5). Thereby, it will be in the state which can perform the resin application | coating operation | work by the resin application | coating apparatus M4.

  Next, the substrate 4 after component mounting is sent to the curing device M2, where it is heated, whereby the resin adhesive 23 is thermally cured to become a resin adhesive 23a as shown in FIG. 19 (c). The LED element 5 is fixed to the individual substrate 4a. Next, the substrate 4 after resin curing is sent to the wire bonding apparatus M3. Then, as shown in FIG. 19 (d), the wiring layers 4 e and 4 d of the individual substrate 4 a are connected to the N-type part electrode 6 a and the P-type part electrode 6 b of the LED element 5 by bonding wires 7, respectively.

  Next, threshold data creation processing for non-defective product determination is executed (ST6). This process is executed in order to set a pass / fail judgment threshold value in production coating (see threshold value data 81a shown in FIG. 12). The threshold data creation process is repeatedly executed for each of the production coatings corresponding to the Bin codes [1], [2], [3], [4], and [5]. Details of the threshold data creation processing will be described with reference to FIGS.

  In FIG. 14, first, the first resin 8A including the first phosphor at the genuine concentration specified in the data table corresponding to the second phosphor particle amount selected in the resin application information 14, the selected second phosphor. A second resin 8B containing a particle amount at a concentration that can be supplied is prepared (ST11).

  Then, after the syringe containing the first resin 8A and the second resin 8B is set on the resin discharge head 32, the resin discharge head 32 is moved to the test hit stage 40a of the test hit / measurement unit 40, and the first resin 8A and the second resin 8B are sequentially applied to the different embossed portions 43a of the translucent member 43 at the specified application amount (appropriate resin application amount) shown in the resin application information 14 (ST12). Here, the prescribed coating amount of the second resin 8B is calculated from the selected second phosphor particle amount and the phosphor concentration of the prepared second resin 8B.

  Next, the resin 8 applied to the translucent member 43 is moved onto the translucent member mounting portion 41 to cause the LED element 5 to emit light, and the light emission characteristics in the uncured state of the resin 8 are measured as described above. (ST13). Then, based on the light emission characteristic measurement value 39a which is a measurement result of the light emission characteristic measured by the light emission characteristic measurement unit, a non-defective product determination range of the measurement value for determining the light emission characteristic as a good product is set (ST14). The set non-defective product determination range is stored as threshold data 81a in the storage unit 81, and is transferred to the management computer 3 and stored in the storage unit 61 (ST15).

  FIG. 15 shows threshold data created in this way, that is, measurement of light emission characteristics obtained in the uncured state of the resin after applying the first resin 8A and the second resin 8B containing a genuine amount of phosphor. Non-defective product judgment range (threshold value) for determining values (light emitting characteristic measured values obtained from the light emitting characteristic measured values of the first resin 8A and the second resin 8B individually measured) and the light emitting characteristics are determined to be good products ). FIGS. 15A, 15B, and 15C show Bin codes [1], [2], and [3] when the phosphor concentrations in the first resin 8A are 5%, 10%, and 15%, respectively. ], Threshold values corresponding to [4] and [5] are shown.

  For example, as shown in FIG. 15A, when the phosphor concentration of the first resin 8A is 5%, the application amount shown in the appropriate resin application amount 15 (11) corresponds to each of the Bin codes 12b. ing. In addition, after the first resin 8A and the second resin 8B are applied in the respective application amounts, the light emission characteristics of the light emitted from the first resin 8A and the second resin 8B are irradiated by irradiating the LED element 5 with blue light. The light emission characteristic measurement value 39a (1) shows a result obtained by measuring the light emission characteristic by the light emission characteristic measurement unit. Then, threshold data 81a (1) is set based on the respective emission characteristic measurement values 39a (1). For example, corresponding to the Bin code [1], the measurement result of measuring the light emission characteristics of the resin 8 obtained by applying the first resin 8A with the appropriate resin application amount VA0 is the chromaticity on the chromaticity table shown in FIG. It is represented by coordinates ZA0 (XA0, YA0). A predetermined range (for example, ± 10%) about the X coordinate and the Y coordinate on the chromaticity table with the chromaticity coordinate ZA0 as the center is set as a non-defective product determination range (threshold value). Similarly, for the appropriate resin coating amounts corresponding to the other Bin codes [2] to [5], a non-defective product determination range (threshold value) is set based on the light emission characteristic measurement result (chromaticity table shown in FIG. 16). (See chromaticity coordinates ZB0-ZE0 above). Here, the predetermined range set as the threshold is appropriately set according to the accuracy level of the light emission characteristics required for the LED package 50 as a product.

  FIGS. 15B and 15C show the measured emission characteristics and the non-defective product determination range (threshold value) when the phosphor concentration of the first resin 8A is 10% and 15%, respectively. Yes. In FIGS. 15B and 15C, the appropriate resin application amount 15 (12) and the appropriate resin application amount 15 (13) are the appropriate resin application amounts when the phosphor concentrations are 10% and 15%, respectively. Show. The light emission characteristic measurement value 39a (2) and the light emission characteristic measurement value 39a (3) indicate the light emission specific measurement values when the phosphor concentrations are 10% and 15%, respectively. Further, the threshold value data 81a (2) and the threshold value data 81a (3) indicate a non-defective product determination range (threshold value) in each case. The threshold data created in this way is selectively used according to the Bin code 12b to which the target LED element 5 belongs in the production application work.

  The threshold data creation process shown in (ST6) may be executed as an off-line operation by a single inspection device provided separately from the LED package manufacturing system 1. In that case, the threshold data 81a may be stored in the management computer 3 in advance and transmitted to the resin coating apparatus M4 via the LAN system 2 for use.

  The substrate 4 after the wire bonding is transferred to the resin coating apparatus M4 (ST7). Then, as shown in FIG. 20A, the first resin 8A is discharged from the application nozzle 33a of the dispenser 33A into the LED mounting portion 4b surrounded by the reflecting portion 4c, and the first resin is applied to the LED element 5. Apply 8A. Next, as shown in FIG. 20B, the second resin 8B is discharged from the application nozzle 33b of the dispenser 33B onto the first resin 8A without curing the first resin 8A. Here, based on the map data 18, the threshold data 81a, and the resin application information 14, an operation of applying a prescribed amount of the first resin 8A and the second resin 8B so as to cover the LED element 5 is performed (ST8). ). Details of the resin application work process will be described with reference to FIGS. 17 and 18.

  First, at the start of the resin coating operation, the resin container is exchanged as necessary (ST21). That is, the syringe attached to the dispensers 33A and 33B of the resin discharge head 32 is replaced with one containing the first resin 8A and the second resin 8B having a phosphor concentration selected according to the characteristics of the LED element 5.

  Next, the first resin 8A and the second resin 8B are trial-applied to the translucent member 43 for measurement of light emission characteristics by the resin application part C (measurement application process) (ST22). That is, in the measurement application step, the test application / measurement unit 40 uses the first application nozzle 33a and the second nozzle 33b to test the first resin 8A and the second resin 8b containing different types of phosphors. Test application is performed on different embossed portions 43a of the same translucent member 43 drawn to the stage 40a. Here, the first resin 8A of the appropriate resin application amount (VA0 to VE0) for each Bin code 12b specified in FIG. 4 and the above-mentioned specified amount of the second resin 8B are applied.

  At this time, even if an appropriate resin application amount (VA0 to VE0) and a discharge operation parameter corresponding to the above-mentioned specified amount are instructed to the resin discharge mechanism 35, the resin is discharged from the application nozzle 33a of the dispensers 33A and 33B, and the light transmitting member The actual resin application amount applied to 43 is not necessarily the above-mentioned appropriate resin application amount and the above-mentioned prescribed amount due to changes in the properties of the first resin 8A and the second resin 8B over time. As shown in FIG. 18A, the actual resin application amount of the first resin 8A is VA1 to VE1, which is somewhat different from VA0 to VE0.

  Next, in the trial hitting / measurement unit 40, the translucent member 43 is sent, so that the translucent member 43 on which the first resin 8 </ b> A and the second resin 8 </ b> B are trial-applied is sent and placed on the translucent member mounting portion 41. (Translucent member placement step). And the excitation light which excites fluorescent substance is light-emitted from the light source part 45 arrange | positioned above the translucent member mounting part 41 (excitation light emission process). Then, by irradiating the first resin 8A or the second resin 8B, which is trial-coated on the translucent member 43, from above, the excitation light is emitted from the lower side of the translucent member 43 to the integrating sphere 44. Is received by the spectroscope 42. Then, the light emission characteristic measurement processing unit 39 measures the light emission characteristic of this light (light emission characteristic measurement step) (ST23).

  As a result, as shown in FIG. 18B, a light emission characteristic measurement value represented by the chromaticity coordinate Z (see FIG. 16) is obtained. This measurement result is not necessarily based on the above-described error in the coating amount and the change in the concentration of the phosphor particles in the resin 8, and so on, and the standard color at the time of proper resin coating shown in FIG. It does not coincide with the degree coordinates ZA0 to ZE0. For this reason, the deviation (ΔXA,) indicating the separation in the X and Y coordinates between the obtained chromaticity coordinates ZA1 to ZE1 and the standard chromaticity coordinates ZA0 to ZE0 at the time of proper resin application shown in FIG. ΔYA) to (ΔXE, ΔYE) are obtained. Then, the necessity of correction for obtaining the desired light emission characteristics is determined.

  Here, it is determined whether or not the measurement result is within a threshold value (ST24). As shown in FIG. 18C, the deviations (ΔXA, ΔYA) to (ΔXE, ΔYE) are compared with ZA0 to ZE0 by comparing the deviation obtained in (ST23) with a threshold value. Judge whether it is within the range of ± 10%. Here, if the deviation is within the threshold value, the discharge operation parameters corresponding to the preset appropriate resin application amounts VA0 to VE0 are maintained as they are. On the other hand, when the deviation exceeds the threshold value, the application amount is corrected (ST25). That is, the deviation between the measurement result in the light emission characteristic measurement step and the light emission characteristic defined in advance is obtained, and as shown in FIG. 18 (d), the actual value to be applied to the LED element 5 based on the obtained deviation. A process for deriving a new appropriate resin application amount (VA2 to VE2) for production is executed by the application amount deriving processing unit 38 (application amount deriving process step).

  Here, the corrected appropriate resin coating amounts (VA2 to VE2) are updated values obtained by adding correction amounts corresponding to the respective deviations to the preset appropriate resin coating amounts VA0 to VE0. The relationship between the deviation and the correction amount is recorded in the resin application information 14 as known accompanying data in advance. Then, the processes (ST22), (ST23), (ST24), and (ST25) are repeatedly executed based on the corrected appropriate resin application amounts (VA2 to VE2), and the measurement result is defined in advance in (ST24). By confirming that the deviation from the light emission characteristics is within the threshold value, the appropriate resin coating amount for actual production is determined. That is, in the above-described resin coating method, the appropriate resin coating amount is determined by repeatedly performing the measurement coating step, the translucent member placement step, the excitation light emission step, the light emission characteristic measurement step, and the coating amount derivation step. To be derived. Then, the determined appropriate resin application amount is stored in the storage unit 81 as the actual production application amount 81b.

  In the above-described example, in the application amount derivation, the second resin 8B is fixed to a specified value defined by the resin application information 14, and an updated value obtained by adding a correction amount to only the first resin 8A is derived. Is shown. At this time, only when the correction for the first resin 8A is not enough to keep the deviation within the threshold value, the second resin 8B is applied to the application amount derivation process for the first resin 8A. A similar coating amount derivation process is executed. That is, in the application amount derivation process step, a process for deriving an appropriate resin application amount for each of the plurality of resins 8 (first resin 8A and second resin 8B) is performed.

  After that, the process moves to the next step, and discarding is executed (ST26). Here, by discharging a predetermined amount of the resin 8 from the application nozzles 33a and 33b, the resin flow state in the resin discharge path is improved, and the dispensers 33A and 33B, the first resin discharge mechanism 35A, and the second resin discharge mechanism are improved. The operation of 35B is stabilized. In FIG. 17, the processing of (ST27), (ST28), (ST29), and (ST30) indicated by the broken line frame is the same as the processing content shown in (ST22), (ST23), (ST24), and (ST25). It is the same, and is executed when it is necessary to carefully check that the desired light emission characteristics are completely ensured. Therefore, it is not necessarily an essential action item.

  In this way, when the appropriate resin coating amount that gives the desired light emission characteristics is determined, the production coating is executed (ST31). That is, the appropriate resin application amount for the plurality of resins 8 (first resin 8A, second resin 8B) derived by the application amount derivation processing unit 38 and stored as the actual production application amount 81b is determined as the first resin discharge mechanism 35A. The production execution processing unit 37 instructs the application control unit 36 that controls the second resin discharge mechanism 35B. Thus, a production coating process for sequentially coating the same LED element 5 mounted on the substrate 4 with the first resin 8A and the second resin 8B having appropriate resin coating amounts is executed (production execution step).

  In the process of repeatedly executing the production application process, the number of applications by the dispensers 33A and 33B is counted, and it is monitored whether or not the predetermined number of applications has passed (ST32). Until the predetermined number of times is reached, it is determined that the properties of the first resin 8A and the second resin 8B and changes in the phosphor concentration are small, and the production coating is executed while maintaining the same actual production coating amount 81b ( Repeat ST31). If the predetermined number of times has been confirmed in (ST32), it is determined that there is a possibility that the properties of the first resin 8A and the second resin 8B and the phosphor concentration have changed, and (ST22) Returning, the same measurement of the light emission characteristics and the coating amount correction process based on the measurement result are repeatedly executed.

  In this way, when the resin coating for one substrate 4 is completed, the substrate 4 is sent to the curing device M5, and the resin 8 is cured by being heated by the curing device M5 (ST9). As a result, as shown in FIG. 20 (d), the resin 8 applied to cover the LED element 5 is thermoset to become the resin 8a, and is fixed in the LED mounting portion 4b. Next, the substrate 4 after the resin curing is sent to the individual piece cutting device M6, where the substrate 4 is cut into individual piece substrates 4a, and as shown in FIG. (ST10). Thereby, the LED package 50 is completed.

  As described above, the resin coating apparatus M4 shown in the embodiment includes the resin coating unit and the coating control unit that controls the resin coating unit, and the resin coating unit is provided with the first resin layer. A first nozzle that discharges a curable first resin and a second nozzle that discharges a curable second resin for forming a second resin layer are provided, and the application control unit is a resin application unit By controlling the above, the first resin and the second resin are selectively applied to the resin application portion with respect to a predetermined application target. And the application | coating control part discharged 1st resin from the 1st nozzle, and was apply | coated after 1st control and 1st control which apply | coat 1st resin with respect to the LED element mounted in the board | substrate by this A configuration in which the second resin is discharged from the second nozzle without curing the first resin, and thereby the second control of applying the second resin on the applied first resin is performed on the resin application portion. It has become. According to the above configuration, it is possible to provide a manufacturing system and a manufacturing method of an LED package that can adjust various color tones of light emission colors and are excellent in productivity.

  More specifically, the resin coating apparatus M4 is configured to arbitrarily discharge a first resin 8A and a second resin 8B each including different types of first phosphor and second phosphor, by arbitrarily dispensing the coating amount. By controlling the resin application part C having the first application nozzle 33a and the second application nozzle 33b applied to the position, and the resin application part C, the first resin 8A and the second resin 8B are used for measuring the light emission characteristics. An application control unit 36 for executing a measurement application process for trial application to the member 43 and a production application process for application to the LED element 5 for actual production, a light source unit 45 for emitting excitation light for exciting the phosphor, and measurement In the coating process, the translucent member mounting portion 41 on which the translucent member 43 on which the first resin 8A and the second resin 8B are trial-coated is placed, and the excitation light emitted from the light source unit 45 is transmitted through the translucent member 43. Irradiate the resin 8 applied to The light emission characteristic measurement unit for measuring the light emission characteristic of the light emitted by the resin 8 and the deviation between the measurement result of the light emission characteristic measurement unit and the predetermined light emission characteristic are obtained, and the appropriate resin coating amount is determined based on this deviation. By correcting the application amount derivation processing unit 38 for deriving the appropriate resin application amount for actual production to be applied to the LED element 5, and by instructing the application control unit 36 on the derived appropriate resin application amount, The production execution processing unit 37 is configured to execute a production application process for applying an appropriate resin application amount of resin to the LED element 5.

  According to the specific configuration, in the resin coating used for manufacturing the LED package 50 in which the LED element 5 is covered with a resin containing a phosphor, the first resin 8A and the second resin each containing a different type of phosphor. 8B is sequentially trial-coated on the same translucent member 43, the light emission characteristics are measured for the first resin 8A and the second resin 8B that have been trial-coated, and the actual light emission characteristics are measured based on the measurement results of the light emission characteristics. By deriving the appropriate resin application amounts of the first resin 8A and the second resin 8B to be applied to the LED element 5, and by instructing the application control unit 36 of the derived appropriate resin application amounts, the first application nozzle The first resin 8A can be sequentially applied to the same LED element 5 by the first resin 8A through the second application nozzle 33b. Thereby, even when the emission wavelengths of the individual LED elements 5 vary, the emission characteristics of the LED package 50 are made uniform, the production yield is improved, and the emission color that is difficult with only a single type of resin is achieved. Various color tone adjustments can be made.

  In the above embodiment, two types of first resin 8A and second resin 8B containing different types of phosphors are sequentially applied by two dispensers 33A and 33B. However, there are two types of resins. It is not limited. That is, the present invention can be applied even when three or more kinds of resins are applied depending on the degree of chromaticity adjustment.

  The present invention is useful in the field of manufacturing an LED package having a configuration in which an LED element is covered with a plurality of resins containing different phosphors.

  1: LED package manufacturing system, 2: LAN system, 4: board, 4a: individual board, 4b: LED mounting part, 4c: reflection part, 5: LED element, 8: resin, 8A: first resin, 8B: Second resin, 12: element characteristic information, 13A, 13B, 13C, 13D, 13E: LED sheet, 14: resin application information, 18: map data, 23: resin adhesive, 24: adhesive transfer mechanism, 25: parts Supply mechanism, 26: component mounting mechanism, 32: resin ejection head, 33A, 33B: dispenser, 33a, 33b: coating nozzle, 35A, 35B: resin ejection mechanism, 40,140: trial strike / measurement unit, 40a: trial strike Stage, 41, 141: Translucent member placement unit, 42: Spectroscope, 43: Translucent member, 44: Integrating sphere, 46: Irradiation unit, 50: LED package

Claims (9)

A first resin layer and a second resin layer, each comprising: a substrate; an LED element mounted on the substrate; a first resin layer covering the LED element; and a second resin layer covering the first resin layer. A resin coating device used for manufacturing an LED package in which one of the first phosphors is included,
A resin having a first nozzle for discharging a curable first resin for forming the first resin layer, and a second nozzle for discharging a curable second resin for forming the second resin layer. An application part;
An application control unit that controls the resin application unit to selectively apply the first resin and the second resin to the resin application unit with respect to a predetermined application target;
The application control unit
A first control for discharging the first resin from the first nozzle, thereby applying the first resin to the LED elements mounted on the substrate;
After the first control, the second resin is discharged from the second nozzle without curing the applied first resin, whereby the second resin is applied onto the applied first resin. A resin coating apparatus that performs second control on the resin coating unit.   The resin coating apparatus according to claim 1, wherein the viscosity of the second resin is set lower than the viscosity of the first resin. The resin application part controls the discharge amount of the first resin from the first nozzle, and the second resin discharge mechanism controls the discharge amount of the second resin from the second nozzle. And having
The application control unit includes the first resin discharge mechanism and the first resin so that the discharge amount of the first resin from the first nozzle is larger than the discharge amount of the second resin from the second nozzle. The resin coating apparatus according to claim 1 or 2, which controls a two-resin discharge mechanism.   The discharge amount of the first resin from the first nozzle is controlled by the screw-type first resin discharge mechanism, and the discharge amount of the second resin from the second nozzle is the jet-type second resin. The resin coating apparatus according to claim 3, which is controlled by a discharge mechanism.   The first phosphor of the first resin is included in the first resin, and a second phosphor of a different type from the first phosphor is included in the second resin. The resin coating apparatus of any one of Claims. A first resin layer and a second resin layer, each comprising: a substrate; an LED element mounted on the substrate; a first resin layer covering the LED element; and a second resin layer covering the first resin layer. A resin coating method used for manufacturing an LED package in which any one of the first phosphor is included,
(A) Applying a curable first resin for forming the first resin layer to the LED element mounted on the substrate;
(B) After the step (a), the curable second resin for forming the second resin layer is applied on the first resin without curing the applied first resin. And a resin coating method.   The resin coating method according to claim 6, wherein the viscosity of the second resin is set lower than the viscosity of the first resin.   The resin according to claim 6 or 7, wherein the first resin contains the first phosphor, and the second resin contains a second phosphor of a different type from the first phosphor. Application method.   (D) After the step (c), the first resin and the second resin are simultaneously cured to form the first resin layer and the second resin layer. The resin coating method according to claim 8.

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