JP2013065646A - System and method for manufacturing light emitting element, and system and method for manufacturing light emitting element package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a system and method for manufacturing a light emitting element, capable of improving production yield and area productivity by making light emission characteristics uniform; and a system and method for manufacturing a light emitting element package including the light emitting element mounted on a substrate.SOLUTION: A light emitting element package includes an LED element having a top face coated with a resin including a phosphor. When, in manufacturing the light emitting element package, resin supply for discharging a resin to supply to an LED element which is taken out from an LED wafer to be rearranged in a predetermined alignment on an element holding face is performed, a translucent member to which the resin is supplied on trial for use in measurement of light emission characteristics is irradiated with excitation light from a light source to measure light emission characteristics of light emitted from the resin, and a proper resin supply amount is corrected on the basis of the measurement result and previously specified light emission characteristics to derive the proper resin supply amount of a resin to be supplied to the LED element for actual production.

Description

  The present invention relates to a light emitting element obtained by coating an LED element with a resin containing a phosphor, a light emitting element manufacturing system and a manufacturing method for manufacturing a light emitting element package configured by mounting the light emitting element on a substrate, and a light emitting element package. The present invention relates to a manufacturing system and a manufacturing method.

  In recent years, LEDs (light emitting diodes) having excellent characteristics of low power consumption and long life have been widely used as light sources for various lighting devices. Since the basic light emitted from the LED element is currently limited to three colors of red, green, and blue, in order to obtain white light suitable for general lighting applications, the above three basic lights are added. A method of obtaining white light by color mixing, a method of obtaining pseudo white light by combining a blue LED and a phosphor emitting yellow fluorescence having a complementary color relationship with blue are used. In recent years, the latter method has been widely used, and an illumination device using an LED package in which a blue LED and a YAG phosphor are combined has been used for a backlight of a liquid crystal panel (for example, a patent). Reference 1).

  In this patent document example, after mounting an LED element on the bottom surface of a concave mounting portion having a reflective surface formed on a side wall, YAG phosphor particles are placed in a mounting portion in which YAG phosphor particles are dispersed in the mounting portion. An LED package is configured by injecting dispersed silicone resin, epoxy resin, or the like to form a resin packaging portion. And, for the purpose of uniforming the height of the resin packaging part in the mounting part after the resin injection, a residual resin storage part for discharging and storing the surplus resin injected more than a specified amount from the mounting part is formed. An example is given. As a result, even when the discharge amount from the dispenser varies at the time of resin injection, a resin packaging portion having a certain resin amount and a specified height is formed on the LED element.

JP 2007-66969 A

  However, in the above-described prior art examples, there is a problem that the light emission characteristics of the LED package as a product vary due to variations in light emission wavelengths of individual LED elements. In other words, the LED element has undergone a manufacturing process in which a plurality of elements are formed on the wafer at the same time, and due to various error factors in this manufacturing process, such as non-uniform composition during film formation on the wafer, the wafer state Inevitably, variations in emission wavelength occur in the LED elements divided into individual pieces. And in the above-mentioned example, since the height of the resin wrapping part covering the LED element is set uniformly, the variation in the emission wavelength in the individual LED element is directly reflected in the variation in the emission characteristic of the LED package as a product. As a result, the number of defective products deviating from the acceptable quality range has been inevitably increased.

  Further, in the following description, including the above-described example, since the application of the resin containing the phosphor is performed after the individual LED elements are mounted on the package substrate, the resin application form is a resin discharge for each package substrate. I was trying to do it. For this reason, in the resin coating device, the assembly of package substrates will be the target of work, the area occupied by the device will increase, the area productivity will decrease, and it will take time to move the nozzle for resin coating, resulting in production efficiency. It was a result that caused the decline of.

  Accordingly, the present invention provides a light emitting device manufacturing system and manufacturing method capable of improving the production yield and area productivity by making the light emitting characteristics uniform, and a light emitting device package manufacturing system configured by mounting the light emitting device on a substrate. And it aims at providing a manufacturing method.

  The light emitting device manufacturing system of the present invention is a light emitting device manufacturing system for manufacturing a light emitting device in which an upper surface of an LED device is coated with a resin containing a phosphor, and a plurality of the LED devices are formed into a dicing sheet. A dicing device that divides the LED wafer in a state of being attached for each LED element, and individually measures the light emission characteristics of the LED elements that are divided into pieces while being attached to the dicing sheet. An element characteristic measuring unit for obtaining element characteristic information indicating the light emission characteristic of the LED element, a map in which element position information indicating the position of the divided LED element on the LED wafer and the element characteristic information on the LED element are associated with each other A map data creation unit that creates data for each LED wafer, and a predetermined element based on the map data on the element holding surface of the LED element Resin information that provides information as the resin supply information, in which the element rearrangement unit that rearranges the array and the appropriate resin supply amount of the resin for obtaining the LED element having the prescribed light emission characteristics and the element characteristic information are associated with each other Based on element arrangement information indicating the arrangement of the LED elements after rearrangement by the element rearrangement unit and the resin supply information, the resin having an appropriate resin supply amount for providing a predetermined light emission characteristic, A resin supply device that supplies the LED elements held on the element holding surface, and a curing device that cures the resin supplied to the LED elements. The resin supply device can vary the supply amount of the resin. A resin supply unit that discharges and supplies the resin to an arbitrary supply target position, and a measurement supply process that controls the resin supply unit to supply the resin to the translucent member for light emission characteristic measurement. In addition, the supply control unit that executes the supply process for production to be supplied to the LED element for actual production, the light source unit that emits the excitation light that excites the phosphor, and the resin is trial-supplied in the supply process for measurement. The translucent member mounting portion on which the translucent member is placed, and the light emission characteristics of the light emitted by the resin by irradiating the resin supplied to the translucent member with the excitation light emitted from the light source unit By correcting the appropriate resin supply amount on the basis of the light emission characteristic measurement unit to be measured, the measurement result of the light emission characteristic measurement unit, and the light emission characteristic defined in advance, for the actual production to be supplied to the LED element A supply amount deriving processing unit for deriving an appropriate resin supply amount, and a production supply process for supplying the LED with the appropriate resin supply amount to the LED element by instructing the derived control resin supply amount to the supply control unit. And a production execution processing unit for executing the processing.

  The light emitting device manufacturing method of the present invention is a light emitting device manufacturing method for manufacturing a light emitting device in which an upper surface of an LED device is coated with a resin containing a phosphor, and a plurality of the LED devices are formed into a dicing sheet. A dicing step of dividing the LED wafer in the stuck state for each LED element, and individually measuring the light emission characteristics of the LED elements divided into pieces while being stuck to the dicing sheet, A map in which element characteristic measurement step for obtaining element characteristic information indicating the light emission characteristic of the LED element, element position information indicating the position of the divided LED element on the LED wafer, and the element characteristic information for the LED element are associated with each other. A map data creation step for creating data for each LED wafer, and a predetermined holding based on the map data on the element holding surface of the LED element Resin information for obtaining, as resin supply information, an element rearrangement step that rearranges the elements in a row, and information that associates the appropriate resin supply amount of the resin and the element characteristic information for obtaining an LED element having a prescribed light emission characteristic Based on the element arrangement information indicating the arrangement of the LED elements after rearrangement by the element rearrangement process and the resin supply information, the resin with an appropriate resin supply amount for providing a predetermined light emission characteristic, A resin supply step for supplying each LED element held on the element holding surface; and a curing step for curing the resin supplied to the LED element. The resin supply step further varies the supply amount of the resin. A measurement supplying step for supplying the resin to the translucent member as a light emission characteristic measurement by a resin supply unit that discharges the liquid to the translucent member; By irradiating the resin supplied to the translucent member with the translucent member mounting step for mounting on the mounting unit and the excitation light emitted from the light source unit that emits the excitation light for exciting the phosphor. A light emission characteristic measuring step for measuring light emission characteristics of light emitted by the resin, and correcting the appropriate resin supply amount based on a measurement result in the light emission characteristic measurement step and a predetermined light emission characteristic, thereby allowing the LED element to A supply amount deriving processing step for deriving an appropriate resin supply amount for actual production to be supplied, and instructing the derived appropriate resin supply amount to a supply control unit that controls the resin supply unit A production execution step for executing a production supply process for supplying a supply amount of resin to the LED element.

  The light emitting device package manufacturing system of the present invention is a light emitting device package manufacturing system for manufacturing a light emitting device package configured by mounting on a substrate a light emitting device in which an upper surface of an LED device is previously coated with a resin containing a phosphor. In addition, a dicing apparatus that divides the LED wafer in a state where a plurality of the LED elements are formed and adhered to the dicing sheet for each LED element, and the LED wafer that is adhered and held on the dicing sheet is divided into pieces. An element characteristic measurement unit that individually measures the light emission characteristics of the LED elements and obtains element characteristic information indicating the light emission characteristics of each LED element; element position information indicating the position of the divided LED elements on the LED wafer; Map data for creating, for each LED wafer, map data associated with the element characteristic information of the LED element An appropriate resin supply amount of the resin for obtaining an LED element having a predetermined light emitting characteristic, and an element rearrangement part that rearranges the LED element in a predetermined arrangement based on the map data on the element holding surface. Based on the resin supply information, resin information providing means for providing information associating the element characteristic information with the element characteristic information, element arrangement information indicating the arrangement of the LED elements rearranged by the element rearrangement unit, and the resin supply information A resin supply device that supplies an appropriate resin supply amount of the resin for providing the prescribed light emission characteristics to each LED element held on the element holding surface; and the resin supplied to the LED element is cured. A curing device that completes the light emitting element, and a component mounting device that mounts the light emitting element on a substrate, wherein the resin supply device discharges the resin in a variable amount so as to arbitrarily discharge the resin. By supplying a resin supply unit to be supplied to the supply target position and controlling the resin supply unit, the resin is supplied to the translucent member as a test light emission characteristic measurement and supplied to the LED element for actual production. A supply control unit that executes a supply process for production, a light source unit that emits excitation light that excites the phosphor, and a translucent member on which the resin is trial-supplied in the measurement supply process. An optical member mounting unit; an emission characteristic measuring unit that measures an emission characteristic of light emitted by the resin by irradiating the resin supplied to the translucent member with excitation light emitted from the light source unit; By correcting the appropriate resin supply amount based on the measurement result of the characteristic measurement unit and the predetermined light emission characteristics, a supply amount guide for deriving an appropriate resin supply amount for actual production to be supplied to the LED element is obtained. An output processing unit, and a production execution processing unit for executing a production supply process for supplying the resin of the appropriate resin supply amount to the LED element by instructing the derived control resin supply amount to the supply control unit. Prepared.

  The light emitting device package manufacturing method of the present invention is a light emitting device package manufacturing method for manufacturing a light emitting device package configured by mounting a light emitting device in which an upper surface of an LED device is previously coated with a resin containing a phosphor on a substrate. A dicing step of dividing the LED wafer in a state in which a plurality of the LED elements are formed and adhered to the dicing sheet, and the LED wafer is divided into pieces in a state of being adhered and held on the dicing sheet. An element characteristic measuring step for individually measuring the light emission characteristics of the LED elements to obtain element characteristic information indicating the light emission characteristics of each LED element; element position information indicating a position of the divided LED elements on the LED wafer; Map data creation process for creating, for each LED wafer, map data associated with the element characteristic information of the LED element And an element rearrangement step of rearranging the LED elements on the element holding surface in a predetermined arrangement based on the map data, an appropriate resin supply amount of the resin for obtaining an LED element having a prescribed light emission characteristic, and the Based on the resin information acquisition step for obtaining information corresponding to the element characteristic information as the resin supply information, the element arrangement information indicating the arrangement of the LED elements after the rearrangement in the element rearrangement step, and the resin supply information. A resin supply step of supplying the resin with an appropriate resin supply amount for providing the light emission characteristics to each LED element held on the element holding surface, and a curing step of curing the resin supplied to the LED element And a component mounting step of mounting the light emitting element on a substrate, and the resin supply step includes a resin supply unit that variably discharges the supply amount of the resin. A measurement supply step for supplying fat to the light transmissive member as a light emission characteristic measurement; a light transmissive member placement step for placing the light transmissive member on which the resin is trial-fed on the light transmissive member placement portion; and A light emission characteristic measuring step for measuring the light emission characteristic of the light emitted by the resin by irradiating the resin supplied to the light transmitting member with the excitation light emitted from the light source unit that emits the excitation light for exciting the phosphor; Supply for deriving an appropriate resin supply amount for actual production to be supplied to the LED element by correcting the appropriate resin supply amount based on a measurement result in the light emission characteristic measurement step and a predetermined light emission characteristic A quantity deriving process step and a production of supplying the resin of the proper resin supply amount to the LED element by instructing the derived control resin supply amount to the supply control unit that controls the resin supply unit. A production execution step for executing the supply process.

  According to the present invention, in the manufacture of a light-emitting element in which the upper surface of an LED element is coated with a resin containing a phosphor, resin is applied to the LED elements taken out from the LED wafer and rearranged in a predetermined arrangement on the element holding surface. When supplying resin to be discharged and supplied, the light-emitting characteristics of the light emitted from the resin are measured by irradiating the light-transmitting member, which has been trial-supplied with the resin for light emission characteristics measurement, from the light source unit, and the measurement result and the pre-defined The emission wavelength of individual LED elements varies by deriving the appropriate resin supply amount to be supplied to the LED element for actual production by correcting the appropriate resin supply quantity based on the emitted light emission characteristics Even in this case, the light emitting characteristics of the light emitting element can be made uniform to improve the production yield and the area productivity.

The block diagram which shows the structure of the manufacturing system of the light emitting element of one embodiment of this invention. Structure explanatory drawing of the LED wafer used as the object of the manufacturing system of the light emitting element of one embodiment of the present invention Functional explanatory drawing of the dicing apparatus and the element characteristic measuring apparatus in the light emitting element manufacturing system of one embodiment of this invention Explanatory drawing of the map data used in the manufacturing system of the light emitting element of one embodiment of this invention Explanatory drawing of the resin supply information used in the manufacturing system of the light emitting element of one embodiment of this invention Functional explanatory drawing of the element rearrangement apparatus in the light emitting element manufacturing system of one embodiment of this invention Structure explanatory drawing of the resin supply apparatus in the manufacturing system of the light emitting element of one embodiment of this invention Functional explanatory drawing of the resin supply apparatus in the manufacturing system of the light emitting element of one embodiment of this invention Explanatory drawing of the light emission characteristic test | inspection function with which the resin supply apparatus in the manufacturing system of the light emitting element of one embodiment of this invention was equipped. Explanatory drawing of the light emission characteristic test | inspection function with which the resin supply apparatus in the manufacturing system of the light emitting element of one embodiment of this invention was equipped. Functional explanatory diagram of the curing device and the sorting device in the light emitting element manufacturing system of one embodiment of the present invention The block diagram which shows the structure of the control system of the manufacturing system of the light emitting element of one embodiment of this invention The block diagram which shows the structure of the manufacturing system of the light emitting element package of one embodiment of this invention Structure explanatory drawing of the light emitting element package manufactured by the manufacturing system of the light emitting element package of one embodiment of this invention Explanatory drawing of a structure and function of the component mounting apparatus in the manufacturing system of the light emitting element package of one embodiment of this invention FIG. 4 is a flowchart of manufacturing a light emitting device package by the light emitting device package manufacturing system according to the embodiment of the present invention. FIG. 3 is a flow chart of threshold data creation processing for non-defective product determination in the light emitting device package manufacturing system according to the embodiment of the present invention. Explanatory drawing of the threshold value data for good quality determination in the light emitting element package manufacturing system of one embodiment of the present invention Chromaticity diagram for explaining threshold data for non-defective product determination in a light emitting device package manufacturing system according to an embodiment of the present invention FIG. 3 is a flowchart of a resin supply work process in a light emitting element package manufacturing process by the light emitting element package manufacturing system according to the embodiment of the present invention. Explanatory drawing of the resin supply work process in the light emitting element package manufacturing process by the light emitting element package manufacturing system of one embodiment of this invention Process explanatory drawing which shows the light emitting element package manufacturing process by the light emitting element package manufacturing system of one embodiment of this invention Process explanatory drawing which shows the light emitting element package manufacturing process by the light emitting element package manufacturing system of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, with reference to FIG. 1, the structure of the manufacturing system 1 of a light emitting element is demonstrated. The light-emitting element manufacturing system 1 manufactures a light-emitting element for white illumination, in which the upper surface of an LED element that emits blue light is coated with a resin containing a phosphor that emits yellow excitation light that is complementary to blue. It has a function. In the present embodiment, as shown in FIG. 1, the dicing device M1, the element characteristic measuring device M2, the element rearranging device M3, the resin supply device M4, the curing device M5, and the sorting device M6 are connected by the LAN system 2. These devices are connected and controlled by the management computer 3 in an integrated manner.

  The dicing apparatus M1 divides the LED wafer in a state where a plurality of LED elements are formed and adhered to the dicing sheet for each LED element. The element characteristic measuring device M2 is an element characteristic measuring unit that individually measures the light emission characteristic of the LED element in a half-cut state in which only the semiconductor layer is divided into pieces while being stuck to the dicing sheet. While obtaining element characteristic information indicating the light emission characteristic of the LED element, map data that associates element position information indicating the position of the divided LED element on the LED wafer and element characteristic information about the LED element is created for each LED wafer. Perform the process.

  The element rearrangement device M3 is an element rearrangement unit, and performs an element rearrangement process in which LED elements are taken out from the LED wafer and rearranged in a predetermined arrangement on the element holding surface based on the map data. The resin supply device M4 has element arrangement information indicating the arrangement of the LED elements after rearrangement by the element rearrangement device M3 and resin supply information transmitted from the management computer 3 via the LAN system 2, that is, prescribed light emission characteristics. Based on the information that matches the appropriate resin supply amount of the resin containing the phosphor for obtaining the LED element and the element characteristic information, the element holding the resin of the appropriate resin supply amount for providing the prescribed light emission characteristics It supplies to each LED element hold | maintained on the surface.

  The curing device M5 cures the resin by heating the LED element supplied with the resin. Thereby, the light emitting element of the structure which covered the LED element with the resin film of resin containing fluorescent substance is formed. The curing device M5 may be configured to accelerate curing by irradiating UV (ultraviolet light) instead of heat curing the resin, or may be allowed to stand for natural curing. Sorting device M6 measures again the light emission characteristics of the plurality of light emitting elements held on the element holding surface, ranks the plurality of light emitting elements for each predetermined characteristic range based on the measurement results, and sorts them into element holding sheets. Transfer.

  Although FIG. 1 shows an example in which a manufacturing line is configured by arranging each of the dicing apparatus M1 to the sorting apparatus M6 in series, the light emitting element manufacturing system 1 does not necessarily adopt such a line configuration. However, as long as the information transmission described in the following description is appropriately performed, the configuration may be such that each process operation is sequentially executed by each of the distributed devices.

  Here, with reference to FIG. 2, the LED wafer 10 and the LED element 5 used as the operation | work object in the manufacturing system 1 of a light emitting element are demonstrated. As shown in FIG. 2A, a plurality of LED elements 5 are formed in a lattice arrangement on the LED wafer 10, and a dicing sheet 10 a is attached to the lower surface of the LED wafer 10. A scribe line 10b that partitions each LED element 5 is set on the LED wafer 10, and each LED element 5 is held by the dicing sheet 10a by cutting the LED wafer 10 along the scribe line 10b. An aggregate of the LED elements 5 in a wafer state is formed. In the dicing process to the element rearrangement process in the light emitting element manufacturing system 1, each operation and conveyance are performed while the LED wafer 10 is held by the wafer holder 4 (see FIG. 6).

  As shown in FIG. 2A, the LED element 5 is configured by stacking an N-type semiconductor 5b and a P-type semiconductor 5c on a sapphire substrate 5a, and further covering the surface of the P-type semiconductor 5c with a transparent electrode 5d. An N-type part electrode 6a and a P-type part electrode 6b for external connection are formed on the N-type semiconductor 5b and the P-type semiconductor 5c, respectively. The LED element 5 is a blue LED, and is combined with a resin 8 (see FIG. 7B) containing a fluorescent substance that emits yellow fluorescence that is complementary to blue, thereby obtaining pseudo white light. . In the present embodiment, as described above, the resin 8 is supplied to the LED element 5 in the wafer state by the resin supply device M4.

  The LED element 5 is divided into individual pieces from the wafer state due to various error factors in the manufacturing process, for example, non-uniform composition during film formation on the wafer. It is inevitable that variations occur in the case. If such an LED element 5 is used as it is as a light emitting element for illumination, the light emission characteristics as a product will vary. In the present embodiment, in order to prevent such quality defects caused by variations in the light emission characteristics, the light emission characteristics of the plurality of LED elements 5 are measured by the element characteristic measuring device M2 in the wafer state, and each LED element 5 Element characteristic information corresponding to the data indicating the light emission characteristics of the LED elements 5 is created, and an appropriate amount of resin 8 corresponding to the light emission characteristics of each LED element 5 is supplied in resin supply. In order to supply an appropriate amount of resin 8, resin supply information described later is prepared in advance.

  Hereinafter, the configuration and function of each device constituting the light emitting element manufacturing system 1 will be described in the order of steps. First, the LED wafer 10 is sent to the dicing apparatus M1 as shown in FIG. Then, by forming a dicing groove 10c reaching the dicing sheet 10a along the scribe line 10b on the LED wafer 10 by the laser cutting machine 7, the LED wafer 10 is made of the transparent electrode 5d, the P-type semiconductor 5c, and the N-type semiconductor. 5b, the sapphire substrate 5a is divided into the LED elements 5 stacked for each piece. Various methods can be used as the dicing method. For example, a method of mechanically cutting with a dicing saw, or a thickness region to be removed by laser light is stopped by the transparent electrode 5d, the P-type semiconductor 5c, and the N-type semiconductor 5b, and the sapphire substrate 5a is embrittled formed by laser light. The LED element 5 may be obtained by dividing the region by flaking that breaks the region.

  Next, the LED wafer 10 after dicing is sent to the element characteristic measuring device M2 as shown in FIG. 3B, where the element characteristic indicating the light emission characteristic of the LED element 5 is measured. That is, the spectroscope 11a is positioned directly above the LED element 5 to be measured among the plurality of LED elements 5 in a wafer state that is adhered and held on the dicing sheet 10a, and the probe of the power supply device 9 is set to N of the LED element 5. The N-type semiconductor 5b and the P-type semiconductor 5c are energized to emit light in contact with the mold-type electrode 6a and the P-type electrode 6b. Subsequently, the light is spectrally analyzed to measure predetermined items such as emission wavelength and emission intensity, and the measurement result is processed by the characteristic measurement processing unit 11 to obtain element characteristic information indicating the emission characteristic of the LED element 5. It is done. And this element characteristic measurement is sequentially performed about all the LED elements 5 which comprise the LED wafer 10. FIG.

  Next, element characteristic information will be described with reference to FIG. FIG. 4A shows a standard distribution of emission wavelengths prepared as reference data in advance for the LED element 5 to be measured. Then, by dividing the wavelength range corresponding to the standard range in this distribution into a plurality of wavelength ranges, the plurality of LED elements 5 to be measured are ranked according to the emission wavelength. Here, Bin codes [1], [2], [3], [4], [5] are assigned in order from the low wavelength side corresponding to each of the ranks set by dividing the wavelength range into five. ] Is given. And according to the measurement result by the element characteristic measuring apparatus M2, a Bin code | cord | chord is provided with respect to each LED element 5, and it memorize | stores in the memory | storage part 71 (FIG. 12) as element characteristic information 12.

  FIG. 4B shows map data 18 in which element position information indicating the positions of the divided LED elements 5 on the LED wafer 10 and element characteristic information 12 about the LED elements 5 are associated with each other. Here, the X cell coordinates 18X and the Y cell coordinates 18Y in the matrix arrangement of the LED elements 5 on the LED wafer 10 are used as the element position information. That is, the map data 18 includes Bin codes [1], [2], which are assigned to the individual LED elements 5 specified by the element position information according to the measurement results of the element characteristic measuring device M2. [3], [4], and [5] are associated with each other, and the map data 18 for each individual LED wafer 10 can be read by designating the wafer 1D18a.

  Next, resin supply information prepared in advance corresponding to the element characteristic information 12 will be described with reference to FIG. In a light-emitting element configured to obtain white light by combining a blue LED and a YAG phosphor, additive color mixing of blue light emitted from the LED element 5 and yellow light emitted by the phosphor being excited by the blue light Therefore, the amount of the phosphor particles in the resin film covering the upper surface of the LED element 5 is an important factor in securing the normal light emission characteristics of the light emitting element of the product.

  As described above, there are variations classified by the Bin codes [1], [2], [3], [4], and [5] in the emission wavelengths of the plurality of LED elements 5 that are simultaneously operated. Therefore, the appropriate amount of the phosphor particles in the resin 8 supplied to cover the LED element 5 differs depending on the Bin codes [1], [2], [3], [4], and [5]. It will be a thing. In the resin supply information 19 prepared in the present embodiment, as shown in FIG. 5, the appropriate resin supply amount for each Bin classification of the resin 8 in which YAG phosphor particles are contained in a silicone resin or an epoxy resin, It is defined in advance according to the Bin code section 17 in units of nl (nanoliter). That is, when the LED 8 is covered and the resin 8 is accurately supplied by the appropriate resin supply amount indicated by the resin supply information 19, the amount of the phosphor particles in the resin covering the LED element 5 becomes an appropriate phosphor particle supply amount. Thus, the regular emission wavelength required for the finished product after the resin 8 is thermally cured is ensured.

  Here, as shown in the phosphor concentration column 16, there are a plurality of phosphor concentrations indicating the concentration of the phosphor particles in the resin 8 (here, D1 (5%), D2 (10%), D3 (15%)). 3), and an appropriate resin supply amount is also used depending on the phosphor concentration of the resin 8 to be used. That is, when the resin 8 having the phosphor concentration D1 is supplied, the appropriate resin supply amounts VA0, VB0, and VC0 for the bin codes [1], [2], [3], [4], and [5], respectively. , VD0, VE0 (appropriate resin supply amount 15 (1)) of resin 8 is supplied. Similarly, when the resin 8 having the phosphor concentration D2 is supplied, the appropriate resin supply amounts VF0, VG0, VG0, Bin code [1], [2], [3], [4], and [5], respectively. Resin 8 of VH0, VJ0, VK0 (appropriate resin supply amount 15 (2)) is supplied. When the resin 8 having the phosphor concentration D3 is supplied, the appropriate resin supply amounts VL0, VM0, VN0, and Bin codes [1], [2], [3], [4], and [5], respectively. Resin 8 of VP0, VR0 (appropriate resin supply amount 15 (3)) is supplied. In order to ensure quality, the appropriate resin supply amount is set for each of the plurality of different phosphor concentrations as described above in order to ensure quality by supplying the resin 8 having the optimum phosphor concentration according to the degree of variation in the emission wavelength. This is because it is more preferable.

  Next, the function of the element rearrangement device M3 and the element arrangement information generated by the element rearrangement device M3 will be described with reference to FIG. As shown in FIG. 6A, the element rearrangement device M3 takes out the LED element 5 after measuring the light emission characteristics from the LED wafer 10 held by the wafer holder 4 by the element transfer mechanism 94 (see FIG. 12). The element holding surface 20a formed on the upper surface of the element holding member 20 has a function of rearranging in a predetermined arrangement based on the map data 18 and preset arrangement pattern data 91a (see FIG. 12). .

  In the present embodiment, the supply of the resin 8 to the LED element 5 is performed in a state where the LED element 5 is taken out from the LED wafer 10 and held on the element holding surface 20 a of the element holding member 20. Thereby, in the wafer state, the LED elements 5 whose positions are fixed can be rearranged in a desirable arrangement for efficiently performing the resin supply operation by the resin supply device M4 and can be held by the element holding member 20. . FIG. 6A shows an example in which only one element holding member 20 is associated with one LED wafer 10, but a plurality of element holding members 20 are associated with each other as necessary. Also good.

  The element array information 118 shown in FIG. 6B indicates the element array rearranged according to one pattern example of the array pattern data 91a. In the element array information 118, the LED elements 5 transferred to the respective array positions corresponding to the X cell coordinates 118X and the Y cell coordinates 118Y that specify the array positions of the LED elements 5 set in the element holding member 20 are used. The type of Bin code is defined. That is, in the pattern example shown here, only one LED element 5 corresponding to the same Bin code (here, [1]) is arranged on one element holding member 20. The setting of the arrangement pattern is arbitrary, and a plurality of types of Bin codes may be combined with the same element holding member 20. In addition to the combination of Bin codes, the arrangement direction and arrangement pitch of the resin supply device M4 It can be set arbitrarily according to the characteristics.

  Next, the configuration and function of the resin supply device M4 will be described with reference to FIGS. The resin supply device M4 is a resin having an appropriate resin supply amount for providing prescribed light emission characteristics based on the element arrangement information 118 indicating the arrangement of the LED elements 5 after the rearrangement by the element rearrangement device M3 and the resin supply information 19. 8 is supplied to each LED element 5 held on the element holding surface 20 a of the element holding member 20. As shown in the plan view of FIG. 7A, the resin supply device M4 is connected to the transport mechanism 31 that transports the element holding member 20 that holds the LED element 5 to be worked. The resin supply unit A shown in FIG.

  In the present embodiment, a resin discharge device that discharges the resin 8 by an ink jet method is used as the resin supply unit A. That is, the print head 32 is provided in the resin supply unit A with the longitudinal direction directed in the X direction (conveying direction in the conveying mechanism 31). As shown in FIG. 8, the print head 32 has a built-in print nozzle unit 32 a that discharges and supplies fine droplets 8 a of the resin 8 freely in a downward discharge amount. By driving, the print head 32 moves in the Y direction above the element holding member 20 in which the LED elements 5 are arranged (arrow a), and the print nozzle unit 32a moves in the X direction within the print head 32 (arrow). b). By controlling the print head drive unit 35 by the supply control unit 36, the print nozzle unit 32a is moved to an arbitrary position in the X direction and the Y direction, and the ejection amount of the fine droplets 8a from the print nozzle unit 32a is controlled. be able to.

  On the side of the print head 32, a measurement head 30 including a camera 34a and a height measurement unit 33a is disposed so as to be movable in the XY directions (arrow c). The measurement head 30 is moved above the element holding member 20 in which the LED elements 5 are arranged, and the image obtained by imaging the element holding member 20 with the camera 34a is subjected to recognition processing by the position recognition unit 34, thereby holding the element. The position of the individual LED element 5 on the member 20 is recognized. The position recognition result is transmitted to the supply control unit 36.

  The height of the measurement target surface is measured by aligning the height measurement unit 33a with the measurement target surface and performing a distance measuring operation using laser light. Here, the upper surface of the LED element 5 before the fine droplet 8a is supplied by the printing nozzle unit 32a is the measurement target surface, and the height measurement result by the height measurement unit 33 is transmitted to the supply control unit 36. The When supplying the fine droplets 8 a by the printing nozzle unit 32 a, the supply control unit 36 measures the height of the upper surface of the LED element 5 by the height measuring unit 33. As the supply control unit 36 controls the print head 32 in this way, the fine droplets 8a are ejected from the print nozzle unit 32a and are arranged on the element holding member 20, as shown in FIG. An appropriate amount of resin 8 specified by the resin supply information 19 is supplied to the upper surface of the LED element 5. That is, the resin supply unit A has a function of discharging the resin 8 in a variable supply amount and supplying the resin 8 to an arbitrary supply target position.

  A test supply / measurement unit 40 is disposed on the side of the transport mechanism 31 so as to be positioned within the movement range of the print head 32. The trial supply / measurement unit 40 tests whether the supply amount of the resin 8 is appropriate prior to the actual production supply operation for supplying the resin 8 to each LED element 5 arranged on the element holding member 20. It has a function of determining by measuring the light emission characteristics of the supplied resin 8. That is, the light emission characteristic when the light emitted from the measurement light source unit 45 is irradiated to the translucent member 43 to which the resin 8 has been trial-supplied by the resin supply unit A is the light emission provided with the spectroscope 42 and the light emission characteristic measurement processing unit 39. By measuring with the characteristic measuring unit and comparing the measurement result with a preset threshold value, the suitability of the preset resin supply amount defined by the resin supply information 19 shown in FIG. 5 is determined.

  The composition and properties of the resin 8 containing the phosphor particles are not necessarily stable, and even if an appropriate resin supply amount is set in advance in the resin supply information 19, the concentration of the phosphor and the resin viscosity over time. Inevitable fluctuations. For this reason, even if the resin 8 is discharged with the discharge parameters corresponding to the preset appropriate resin supply amount, the resin supply amount itself varies from the preset appropriate value, or the resin supply amount itself is appropriate. However, the amount of the phosphor particles to be originally supplied varies depending on the concentration change.

  In order to eliminate such inconvenience, in the present embodiment, trial supply for inspecting whether or not an appropriate supply amount of phosphor particles is supplied at a predetermined interval is executed by the resin supply device M4. In addition, by measuring the emission characteristics of the resin supplied as a trial, the supply amount of the phosphor particles is stabilized in accordance with the emission characteristics that should be originally provided. The resin supply unit A provided in the resin supply device M4 shown in the present embodiment includes a measurement supply process for supplying the resin 8 to the translucent member 43 for the above-described light emission characteristic measurement, and an element for actual production. It has a function of executing together with the supply process for production to be supplied to the plurality of rearranged LED elements 5 rearranged on the element holding surface 20a of the holding member 20. These measurement supply process and production supply process are both executed by the supply control unit 36 controlling the resin supply unit A.

  The detailed configuration of the trial supply / measurement unit 40 will be described with reference to FIG. As shown in FIG. 9A, the translucent member 43 is wound and supplied on the supply reel 47 and fed along the upper surface of the trial supply stage 40a, and then irradiated with the translucent member mounting portion 41. It is wound around a collection reel 48 driven by a take-up motor 49 via a portion 46. As a mechanism for collecting the translucent member 43, various methods such as a method of feeding the translucent member 43 into the collection box by a feeding mechanism in addition to the method of collecting the translucent member by winding it on the collection reel 48 are adopted. Can do.

  The irradiation unit 46 has a function of irradiating the translucent member 43 with measurement light emitted from the light source unit 45, and the measurement light emitted from the light source unit 45 is contained in a light shielding box 46a having a simple dark box function. A light focusing tool 46b guided by a fiber cable is provided. The light source unit 45 has a function of emitting excitation light that excites the phosphor contained in the resin 8. In the present embodiment, the light source unit 45 is disposed above the translucent member mounting unit 41 and transmits measurement light. The light member 43 is irradiated from above via the light focusing tool 46b.

  Here, as the translucent member 43, a flat sheet-like member made of a transparent resin is used as a tape material having a predetermined width, or an embossed type in which an embossed portion 43a is provided on the lower surface of a similar tape material. (See FIG. 9B). In the process in which the translucent member 43 is sent on the trial supply / measurement unit 40, the resin 8 is trial-supplied to the translucent member 43 by the print head 32. In this trial supply, as shown in FIG. 9 (b), the lower surface side is supported by the trial supply stage 40a. As shown in FIG. This is performed by discharging and printing on the translucent member 43.

  FIGS. 9B and 9A show a state in which the preset appropriate discharge amount of the resin 8 specified by the resin supply information 19 is supplied to the translucent member 43 made of the tape material described above. FIGS. 9B and 9B show a state in which the resin 8 having a preset appropriate discharge amount is similarly supplied into the embossed portion 43a of the embossed type translucent member 43 described above. Note that, as will be described later, the resin 8 supplied at the test supply stage 40a is used for empirical determination for empirically determining whether or not the phosphor supply amount is appropriate for the target LED element 5. Therefore, when the resin 8 is continuously supplied onto the transparent member 43 at a plurality of points by the same trial supply operation by the print head 32, a known relationship indicating the correlation between the measured emission characteristic value and the supply amount is known. Based on the data, the supply amount is changed in stages.

  In this way, the white light emitted from the light source unit 45 is irradiated from above through the light focusing tool 46b to the light transmitting member 43 guided into the light shielding box 46a after the resin 8 is trial-supplied. The light transmitted through the resin 8 supplied to the translucent member 43 is disposed below the translucent member mounting portion 41 via the light transmitting opening 41 a provided in the translucent member mounting portion 41. The light is received by the integrating sphere 44. FIG. 9C shows the structure of the translucent member mounting portion 41 and the integrating sphere 44. The translucent member mounting portion 41 has a structure in which an upper guide member 41 c having a function of guiding both end surfaces of the translucent member 43 is mounted on the upper surface of the lower support member 41 b that supports the lower surface of the translucent member 43. Yes.

  The translucent member placement section 41 guides the translucent member 43 during transport in the trial supply / measurement unit 40, and places the translucent member 43, to which the resin 8 has been trial-supplied in the measurement supply process, to hold the position. It has a function to do. The integrating sphere 44 has a function of collecting the transmitted light that has been irradiated from the light focusing tool 46 b (arrow h) and transmitted through the resin 8 and led to the spectroscope 42. That is, the integrating sphere 44 has a spherical spherical reflecting surface 44 c inside, and transmitted light (arrow i) incident from the opening 44 a located immediately below the light transmitting opening 41 a is the top of the integrating sphere 44. In the process of entering into the reflection space 44b from the opening 44a provided in the light source and repeating the total reflection (arrow j) by the spherical reflecting surface 44c, it is taken out as measurement light (arrow k) from the output part 44d and is sent by the spectroscope 42. Received light.

  In the above-described configuration, the white light emitted by the light emitting element package used in the light source unit 45 is applied to the resin 8 that has been trial-supplied to the translucent member 43. In this process, the blue light component contained in the white light excites the phosphor in the resin 8 to emit yellow light. White light obtained by adding and mixing yellow light and blue light is irradiated upward from the resin 8 and is received by the spectroscope 42 via the integrating sphere 44 described above.

  The received white light is analyzed by the light emission characteristic measurement processing unit 39 (FIG. 7B), and the light emission characteristic is measured. Here, the light emission characteristics such as the color tone rank of white light and the luminous flux are inspected, and a deviation from the prescribed light emission characteristics is detected as the inspection result. The integrating sphere 44, the spectroscope 42, and the light emission characteristic measurement processing unit 39 emit excitation light emitted from the light source unit 45 to the resin 8 supplied to the translucent member 43 (here, white light emitted from the white LED). ) From above, the light emitted from the resin 8 is received from below the translucent member 43, and a light emission characteristic measuring unit for measuring the light emission characteristic of the light emitted from the resin 8 is configured. In the present embodiment, the light emission characteristic measuring unit is configured by disposing the integrating sphere 44 below the translucent member 43, and configured to receive light emitted from the resin 8 through the opening 44a of the integrating sphere 44. Has been.

  By configuring the light emission characteristic measuring unit as described above, the following effects can be obtained. That is, in the supply shape of the resin 8 that is trial-supplied to the translucent member 43 shown in FIG. 9B, the lower surface side is always in contact with the upper surface of the translucent member 43 or the bottom surface of the embossed portion 43a. The lower surface of 8 is always at a reference height defined by the translucent member 43. Therefore, the height difference between the lower surface of the resin 8 and the opening 44a of the integrating sphere 44 is always kept constant. On the other hand, the upper surface of the resin 8 does not necessarily realize the same liquid surface shape and height due to disturbances such as the supply conditions by the printing nozzle unit 32a, and the upper surface of the resin 8 and the light focusing tool 46b are not necessarily realized. The interval between them will vary.

  Here, considering the degree of stability when the irradiation light irradiated on the upper surface of the resin 8 is compared with the transmitted light from the lower surface of the resin 8, the irradiation light irradiated on the resin 8 is the light focusing tool 46b. Therefore, the degree of focusing is high, and the influence of the variation in the distance between the upper surface of the resin 8 and the light focusing tool 46b on the light transmission can be ignored. On the other hand, the transmitted light that has passed through the resin 8 is excitation light in which the phosphor is excited inside the resin 8, so that the degree of scattering is high, and the distance between the lower surface of the resin 8 and the opening 44 a varies. Has an influence on the degree of light being taken in by the integrating sphere 44.

  In the trial supply / measurement unit 40 shown in the present embodiment, the light emitted from the resin 8 is transmitted by irradiating the resin 8 with the excitation light emitted from the light source unit 45 as described above. Since the configuration in which light is received by the integrating sphere 44 from below the optical member 43 is employed, it is possible to determine stable light emission characteristics. Further, by using the integrating sphere 44, it is not necessary to separately provide a dark room structure in the light receiving portion, so that the apparatus can be made compact and the equipment cost can be reduced.

  As shown in FIG. 7B, the measurement result of the light emission characteristic measurement processing unit 39 is sent to the supply amount derivation processing unit 38, and the supply amount derivation processing unit 38 defines the measurement result of the light emission characteristic measurement processing unit 39 in advance. Based on the light emission characteristics, the appropriate resin supply amount of the resin 8 is corrected, and processing for deriving the appropriate resin supply amount of the resin 8 to be supplied to the LED element 5 for actual production is performed. The new appropriate discharge amount derived by the supply amount deriving processing unit 38 is sent to the production execution processing unit 37, and the production execution processing unit 37 commands the newly derived appropriate resin supply amount to the supply control unit 36. Accordingly, the supply control unit 36 controls the print head 32 to cause the print head 32 to execute a production supply process for supplying the resin 8 having an appropriate resin supply amount to the LED elements 5 mounted on the substrate 14.

  In this production supply process, first, an appropriate amount of resin 8 specified by the resin supply information 19 is actually supplied, and the light emission characteristics are measured while the resin 8 is uncured. Then, based on the obtained measurement results, a non-defective range of emission characteristic measurement values when the emission characteristics are measured for the resin 8 supplied in the production supply is set, and the non-defective range is determined for the quality determination in the supply for production. It is used as a threshold value (see threshold value data 81a shown in FIG. 12).

  That is, in the resin supply method in the light emitting element manufacturing system shown in the present embodiment, a white LED is used as the light source unit 45 for measuring the light emission characteristics, and a pre-specified condition is used as a basis for setting a good / bad determination threshold in production supply. As the light emission characteristics, the normal light emission characteristics required for the finished product in which the resin 8 supplied to the LED element 5 is cured are biased by the difference in the light emission characteristics due to the resin 8 being in an uncured state. Emission characteristics are used. Thereby, it is possible to control the resin supply amount in the process of supplying the resin to the LED element 5 based on the normal light emission characteristics of the finished product.

  In the present embodiment, a light emitting element package 50 (see FIG. 14) that emits white light is used as the light source unit 45. As a result, the emission characteristics of the resin 8 that has been trial-supplied can be measured with light having the same characteristics as the excitation light emitted from the finished light emitting device package 50, and a more reliable test result can be obtained. it can. Note that it is not always necessary to use the same light emitting element package 50 as that used for the finished product. For light emission characteristics measurement, a light source device that can stably emit blue light having a constant wavelength (for example, a blue LED that emits blue light or a blue laser light source) is used as a light source unit for inspection. be able to. However, by using the light emitting element package 50 that emits white light using a blue LED, there is an advantage that a light source device with stable quality can be selected at low cost. Here, blue light having a predetermined wavelength may be extracted using a band-pass filter.

  Instead of the trial supply / measurement unit 40 having the above-described configuration, a trial supply / measurement unit 140 having the configuration shown in FIG. 10 may be used. That is, as shown in FIG. 10A, the test supply / measurement unit 140 has an external structure in which a cover portion 140b is disposed above an elongated horizontal base portion 140a. The cover 140b is provided with an opening 140c. The opening 140c can be opened and closed by a sliding slide window 140d that can be slid (arrow l). Inside the trial supply / measurement unit 140, a trial supply stage 145a for supporting the translucent member 43 from the lower surface side, a translucent member mounting unit 141 on which the translucent member 43 is mounted, and a translucent member mounting unit 141. A spectroscope 42 is provided above.

  The translucent member mounting unit 141 includes a light source device that emits excitation light that excites the phosphor, similarly to the light source unit 45 illustrated in FIG. 7. The member 43 is irradiated with excitation light from the lower surface side of the light source device. Similarly to the example shown in FIG. 9, the translucent member 43 is wound and supplied on the supply reel 47 and supplied along the upper surface of the test supply stage 145a (arrow m), and then the translucent member mounting portion. It is wound up on a collection reel 48 driven by a winding motor 49 via between 141 and the spectroscope 42.

  In a state where the supply sliding window 140d is slid and opened, the upper surface of the test supply stage 145a is exposed upward, and the resin 8 is supplied to the light transmitting member 43 placed on the upper surface by the print head 32 as a test. It becomes possible. This trial supply is performed by ejecting a specified supply amount of fine droplets 8a to the translucent member 43 whose lower surface is supported by the trial supply stage 145a by the print nozzle unit 32a.

  In FIG. 10B, the translucent member 43 to which the resin 8 has been trial-supplied at the trial supply stage 145a is moved to position the resin 8 above the translucent member mounting portion 141, and the cover portion 140b is further moved. A state in which a darkroom for measuring light emission characteristics is formed between the base 140a and the base 140a is shown. A light emitting element package 50 that emits white light is used as the light source device for the translucent member mounting portion 141. The wiring layers 14e and 14d connected to the LED element 5 in the light emitting element package 50 are connected to the power supply device 142. When the power supply device 142 is turned on, the LED element 5 is supplied with power for light emission. Accordingly, the light emitting device package 50 emits white light.

  Then, in the process in which the white light passes through the resin 8 and is irradiated to the resin 8 that is trial-supplied to the translucent member 43, the phosphor in the resin 8 is excited by the blue light contained in the white light and emitted yellow. White light in which light and blue light are added and mixed is irradiated upward from the resin 8. A spectroscope 42 is arranged above the trial supply / measurement unit 140, and the white light emitted from the resin 8 is received by the spectroscope 42, and the received white light is analyzed by the emission characteristic measurement processing unit 39. The emission characteristics are measured. Here, the light emission characteristics such as the color tone rank of white light and the luminous flux are inspected, and a deviation from the prescribed light emission characteristics is detected as the inspection result. That is, the light emission characteristic measurement processing unit 39 measures the light emission characteristic of the light emitted from the resin 8 by irradiating the resin 8 supplied to the light transmitting member 43 with the excitation light emitted from the LED element 5 as the light source unit. . Then, the measurement result of the light emission characteristic measurement processing unit 39 is sent to the supply amount derivation processing unit 38, and the same processing as in the example shown in FIG. 7 is executed.

  The LED element 5 thus supplied with the resin is sent to the curing device M5 while being held by the element holding member 20. Then, as shown in FIG. 11A, the resin 8 is cured by heating each LED element 5. As a result, the upper surface of the LED element 5 is covered with the resin film 8 * obtained by curing the resin 8 containing the phosphor, thereby forming the light emitting element 5 *. Thereafter, the element holding member 20 holding the light emitting element 5 * is sent to the sorting device M6, where the light emission characteristics of the plurality of light emitting elements 5 * are measured again. Based on the measurement results, as shown in FIG. 11B, the plurality of light emitting elements 5 * held by the element holding member 20 are ranked for each predetermined characteristic range, and a plurality of element holding sheets 13A, Separately transferred to 13B, 13C. The necessity of the sorting device M6 in the light emitting element manufacturing system 1 is determined in consideration of the accuracy of the light emission characteristics required for the finished product, the accuracy of the resin supply amount correction by the resin supply device M4, and the like. It is not necessarily an essential process.

  Next, the configuration of the control system of the light emitting device manufacturing system 1 will be described with reference to FIG. Here, among the components of each device constituting the light emitting element manufacturing system 1, in the management computer 3, the element characteristic measuring device M2, the element rearrangement device M3, and the resin supply device M4, the element characteristic information 12, the resin supply The components related to the transmission / reception and update processing of the information 19, the map data 18, the element array information 118, and the threshold data 81a are shown.

  In FIG. 12, the management computer 3 includes a system control unit 60, a storage unit 61, and a communication unit 62. The system control unit 60 controls the light emitting device package manufacturing work by the light emitting device manufacturing system 1 in an integrated manner. In the storage unit 61, in addition to programs and data necessary for control processing by the system control unit 60, element characteristic information 12, resin supply information 19, and map data 18, threshold value data 81a, element arrangement as necessary. Information 118 is stored. The communication unit 62 is connected to other devices via the LAN system 2 and exchanges control signals and data. The resin supply information 19 is transmitted from the outside via the LAN system 2 and the communication unit 62 or via a single storage medium such as a CD ROM, USB memory storage, SD card, etc., and stored in the storage unit 61.

  The element characteristic measuring apparatus M2 includes a measurement control unit 70, a storage unit 71, a communication unit 72, a characteristic measurement processing unit 11, and a map creation processing unit 74. The measurement control unit 70 controls each unit described below based on various programs and data stored in the storage unit 71 in order to execute the element characteristic measurement work by the element characteristic measurement device M2. The storage unit 71 stores element position information 71 a and element characteristic information 12 in addition to programs and data necessary for control processing by the measurement control unit 70. The element position information 71 a is data indicating the arrangement position of the LED elements 5 on the LED wafer 10. The element characteristic information 12 is data of a measurement result obtained by the characteristic measurement processing unit 11.

  The communication unit 72 is connected to other devices via the LAN system 2 and exchanges control signals and data. The map creation processing unit 74 (map data creation unit) creates, for each LED wafer 10, map data 18 that associates the element position information 71 a stored in the storage unit 71 with the element characteristic information 12 about the LED element 5. Perform the process. The generated map data 18 is transmitted as feedforward data to the element rearrangement device M3 via the LAN system 2. The map data 18 may be transmitted from the element characteristic measurement device M2 to the element rearrangement device M3 via the management computer 3. In this case, the map data 18 is also stored in the storage unit 61 of the management computer 3 as shown in FIG.

  The element rearrangement device M3 includes a rearrangement control unit 93, a storage unit 91, an element transfer mechanism 94, and a communication unit 92. The rearrangement control unit 93 controls the element transfer mechanism 94 to execute an element rearrangement process in which the LED elements 5 are taken out from the LED wafer 10 and rearranged on the element holding member 20. At this time, the array pattern data 91a and the map data 18 stored in the storage unit 91 are referred to. In the element rearrangement process, the element arrangement information 118 shown in FIG. 6B is created by the rearrangement control unit 93 and stored in the storage unit 91.

  The resin supply device M4 includes a supply control unit 36, a storage unit 81, a communication unit 82, a production execution processing unit 37, a supply amount derivation processing unit 38, and a light emission characteristic measurement processing unit 39. The supply control unit 36 controls the print head drive unit 35, the position recognition unit 34, the height measurement unit 33, and the trial supply / measurement unit 40 that constitute the resin supply unit A, so that the resin 8 is used for light emission characteristic measurement. A measurement supply process for trial supply to the translucent member 43 and a production supply process for supplying to the LED element 5 for actual production are performed.

  The storage unit 81 stores the resin supply information 19, element arrangement information 118, threshold data 81 a, and actual production supply amount 81 b, in addition to programs and data necessary for control processing by the supply control unit 36. The resin supply information 19 is transmitted from the management computer 3 via the LAN system 2, and the element arrangement information 118 is similarly transmitted from the element rearrangement device M3 via the LAN system 2. The communication unit 82 is connected to other devices via the LAN system 2 and exchanges control signals and data.

  The light emission characteristic measurement processing unit 39 performs a process of measuring the light emission characteristic of light emitted from the resin by irradiating the resin 8 supplied to the translucent member 43 with the excitation light emitted from the light source unit 45. The supply amount derivation processing unit 38 should be supplied to the LED element 5 for actual production by correcting the appropriate resin supply amount based on the measurement result of the light emission characteristic measurement processing unit 39 and the predetermined light emission characteristics. An arithmetic process for deriving an appropriate resin supply amount of the resin 8 is performed. Then, the production execution processing unit 37 instructs the supply control unit 36 to supply the appropriate resin supply amount derived by the supply amount deriving processing unit 38, thereby supplying the LED element 5 with the resin having the appropriate resin supply amount. Execute the process.

  In the configuration shown in FIG. 12, the processing function other than the function for executing the work operation unique to each device, for example, the function of the map creation processing unit 74 provided in the element characteristic measuring device M2, the resin supply device M4 The function of the supply amount derivation processing unit 38 provided is not necessarily attached to the apparatus. For example, the functions of the map creation processing unit 74 and the supply amount derivation processing unit 38 are covered by the arithmetic processing function of the system control unit 60 of the management computer 3, and necessary signal exchange is performed via the LAN system 2. It may be configured.

  In the configuration of the light emitting element manufacturing system 1 described above, the element characteristic measurement device M2, the element rearrangement device M3, and the resin supply device M4 are all connected to the LAN system 2. Then, the management computer 3 and the LAN system 2 in which the resin supply information 19 is stored in the storage unit 61 associate the appropriate resin supply amount of the resin 8 and the element characteristic information for obtaining the light emitting element having the prescribed light emission characteristic. This information serves as a resin information providing means for providing the information as resin supply information 19 to the resin supply device M4.

  Next, a configuration of a light emitting device package manufacturing system 101 for manufacturing a light emitting device package using the light emitting devices manufactured by the light emitting device manufacturing system 1 will be described with reference to FIG. The light emitting element package manufacturing system 101 is similar to the light emitting element manufacturing system 1 having the configuration shown in FIG. 1 except that a component mounting apparatus M7, a curing apparatus M8, a wire bonding apparatus M9, a resin coating apparatus M10, a curing apparatus M11, and an individual piece cutting apparatus. The configuration is a combination of M12.

  The component mounting apparatus M7 mounts the light emitting element 5 * manufactured by the light emitting element manufacturing system 1 on the substrate 14 (see FIG. 14) serving as the base of the light emitting element package by bonding with a resin adhesive. The curing device M8 cures the resin adhesive used for bonding during mounting by heating the substrate 14 on which the light emitting element 5 * is mounted. The wire bonding apparatus M9 connects the electrode of the substrate 14 and the electrode of the light emitting element 5 * by a bonding wire. The resin coating device M10 applies a transparent resin for sealing for each light emitting element 5 * on the substrate 14 after wire bonding. The curing device M11 cures the resin applied to cover the light emitting element 5 * by heating the substrate 14 after the application of the transparent resin. The piece cutting device M12 cuts the substrate 14 after the resin is cured into each individual light emitting element 5 * and divides it into individual light emitting element packages. Thereby, the light emitting device package divided into individual pieces is completed.

  FIG. 13 shows an example in which the production line is configured by arranging the components mounting device M7 to the piece cutting device M12 in series. However, the light emitting element package manufacturing system 101 is not necessarily limited to this. It is not necessary to adopt a line configuration, and a configuration in which each process operation is sequentially executed by each of the devices arranged in a distributed manner may be employed. Also, a plasma processing apparatus that performs plasma processing for electrode cleaning prior to wire bonding before and after the wire bonding apparatus M9, and a surface modification for improving resin adhesion prior to resin application after wire bonding. You may make it interpose the plasma processing apparatus which performs the plasma processing for the purpose of quality.

  Here, with reference to FIG. 14, the substrate 14, the light emitting element 5 *, and the light emitting element package 50 as a finished product, which are work targets in the light emitting element package manufacturing system 101, will be described. As shown in FIG. 14A, the substrate 14 is a multiple substrate in which a plurality of individual substrates 14a serving as a base of one light emitting device package 50 in a finished product are formed. Each of the LED mounting portions 14b on which the light emitting elements 5 * are mounted is formed. For each individual substrate 14a, the light emitting element 5 * is mounted in the LED mounting portion 14b, and then the LED mounting portion 14b is covered with a transparent resin 28 for covering and covering the light emitting element 5 *. After the curing, the substrate 14 that has been processed is cut into individual substrates 14a, whereby the light emitting device package 50 shown in FIG. 14B is completed.

  As shown in FIG. 14 (b), the individual substrate 14a is provided with a cavity-shaped reflecting portion 14c having, for example, a circular or elliptical annular bank that forms the LED mounting portion 14b. The N-type part electrode 6a and the P-type part electrode 6b of the light emitting element 5 * mounted inside the reflecting part 14c are connected to the wiring layers 14e and 14d formed on the upper surface of the individual substrate 14a by bonding wires 27, respectively. Is done. The resin 28 covers the light emitting element 5 * in this state and is applied to the inside of the reflecting portion 14c with a predetermined thickness, and the white light emitted from the light emitting element 5 * is irradiated through the transparent resin 28.

  Next, the configuration and function of the component mounting apparatus M7 will be described with reference to FIG. As shown in the plan view of FIG. 15A, the component mounting apparatus M7 includes a substrate transport mechanism 21 that transports the work target substrate 14 supplied from the upstream side in the substrate transport direction (arrow a). In order from the upstream side, the substrate transport mechanism 21 is provided with an adhesive supply section B shown in the section BB in FIG. 15B and a component mounting section C shown in the section CC in FIG. It is installed. The adhesive supply unit B is disposed on the side of the substrate transport mechanism 21 and supplies the resin adhesive 23 in the form of a coating film having a predetermined film thickness, and the substrate transport mechanism 21 and the adhesive supply unit 22. Is provided with an adhesive transfer mechanism 24 that is movable in the horizontal direction (arrow b). Further, the component mounting portion C is disposed on the side of the board transport mechanism 21, and the parts supply mechanism 25 and the board transport mechanism 21 for holding the element holding sheets 13A, 13B, 13C,... Shown in FIG. A component mounting mechanism 26 that is movable in the horizontal direction (arrow c) above the mechanism 25 is provided.

  As shown in FIG. 15B, the substrate 14 carried into the substrate transport mechanism 21 is positioned by the adhesive supply unit B, and is bonded to the LED mounting unit 14b formed on each individual substrate 14a. The agent 23 is supplied. That is, first, the adhesive transfer mechanism 24 is moved above the adhesive supply unit 22 so that the transfer pin 24a is brought into contact with the coating film of the resin adhesive 23 formed on the transfer surface 22a, and the resin adhesive 23 is adhered. Next, the adhesive transfer mechanism 24 is moved above the substrate 14 and the transfer pin 24a is lowered to the LED mounting portion 14b (arrow d), whereby the resin adhesive 23 attached to the transfer pin 24a is moved into the LED mounting portion 14b. Supplied by transfer to the element mounting position.

  Next, the substrate 14 after the supply of the adhesive is transported to the downstream side, positioned at the component mounting portion C as shown in FIG. 15C, and the LED mounting portion 14b after the supply of the adhesive is targeted. Implementation of 5 * is performed. That is, first, the component mounting mechanism 26 is moved above the component supply mechanism 25, and the mounting nozzle 26a is lowered with respect to one of the element holding sheets 13A, 13B, 13C,. The light emitting element 5 * is held and taken out by 26a. Next, the component mounting mechanism 26 is moved above the LED mounting portion 14b of the substrate 14 to lower the mounting nozzle 26a (arrow e), whereby the light emitting element 5 * held by the mounting nozzle 26a is bonded within the LED mounting portion 14b. It is mounted at the element mounting position where the agent is supplied.

  Next, a light emitting device package manufacturing process executed by the light emitting device package manufacturing system 101 will be described along the flow of FIG. 16 with reference to the drawings. Here, a light emitting device package 50 is manufactured, which is configured by mounting on the substrate 14 a light emitting device 5 * obtained by previously covering the upper surface of the LED device 5 with a resin 8 containing a phosphor.

  First, the LED wafer 10 to be worked is carried into the dicing apparatus M1, and as shown in FIG. 3 (a), the LED wafer 10 in a state where a plurality of LED elements 5 are formed and adhered to the dicing sheet 10a is LED. Each element 5 is divided (ST1) (dicing step). Thereafter, the LED wafer 10 is carried into the element characteristic measuring apparatus M2, and the element characteristic is measured as shown in FIG. That is, the light emission characteristics of the LED elements 5 divided into pieces while being stuck to the dicing sheet 10a are individually measured to obtain element characteristic information indicating the light emission characteristics of each LED element 5 (ST2) (element Characteristic measurement step).

  Next, the map data 18 is created by the map creation processing unit 74 of the element characteristic measuring apparatus M2. That is, the map data 18 (see FIG. 4) in which the element position information indicating the position of the LED element 5 divided into pieces on the LED wafer 10 and the element characteristic information about the LED element 5 are associated is shown for each LED wafer 10. Create (ST3) (map data creation step). Next, the LED wafer 10 is transferred to the element rearrangement device M3, where the LED elements 5 are taken out from the LED wafer 10 and rearranged in a predetermined arrangement on the element holding surface 20a based on the arrangement pattern data 91a and the map data 18. (ST4) (Element rearrangement step). Then, the LAN system 2 is used as the resin supply information 19 (see FIG. 5), which is obtained by associating the appropriate resin supply amount of the resin 8 for obtaining the light emitting element 5 * having the prescribed light emission characteristics with the element characteristic information. Through the management computer 3 (ST5) (resin information acquisition step).

  Next, threshold data creation processing for non-defective product determination is executed (ST6). This process is executed to set a pass / fail judgment threshold value in production supply (see threshold value data 81a shown in FIG. 12). Bin codes [1], [2], [3 ], [4], and [5] are repeatedly executed for each of the production supplies. Details of the threshold data creation processing will be described with reference to FIGS. 17, 18, and 19. FIG. In FIG. 17, first, a resin 8 containing a phosphor specified in the resin supply information 19 at a genuine concentration is prepared (ST21).

  After the resin 8 is set on the print head 32, the print nozzle unit 32a is moved to the test supply stage 40a of the test supply / measurement unit 40, and the resin 8 is supplied to the specified supply amount (appropriate resin supply amount) shown in the resin supply information 19. ) To the translucent member 43 (ST22). Next, the resin 8 supplied to the translucent member 43 is moved onto the translucent member mounting portion 41, the LED element 5 is caused to emit light, and the light emission characteristic in the uncured state of the resin 8 is measured by the light emission characteristic measuring unit having the above-described configuration. Measure (ST23). Then, based on the light emission characteristic measurement value 39a, which is a measurement result of the light emission characteristic measured by the light emission characteristic measurement unit, a non-defective product determination range of the measurement value for determining the light emission characteristic is determined to be non-defective (ST24). The non-defective product determination range is stored as threshold data 81a in the storage unit 81, transferred to the management computer 3 and stored in the storage unit 61 (ST25).

  FIG. 18 shows that the threshold data created in this way, that is, the measured emission characteristics and emission characteristics obtained in the uncured state of the resin 8 after supplying the resin 8 containing the phosphor with the genuine content are non-defective products. The non-defective product judgment range (threshold value) of the measured value for judgment is shown. 18A, 18B, and 18C, the phosphor concentration in the resin 8 is 5%, respectively. The threshold values corresponding to the Bin codes [1], [2], [3], [4], and [5] in the case of 10% and 15% are shown.

  For example, as shown in FIG. 18A, when the phosphor concentration of the resin 8 is 5%, the supply amount shown in each of the appropriate resin supply amounts 15 (1) corresponds to each of the Bin codes 12b. The light emission characteristic measurement unit 39 measured the light emission characteristic of the light emitted from the resin 8 by irradiating the resin 8 supplied at the respective supply amounts with the blue light of the LED element 5. ). Then, threshold data 81a (1) is set based on the respective emission characteristic measurement values 39a (1).

For example, the measurement result of measuring the light emission characteristics of the resin 8 object supplied with the appropriate resin supply amount VA0 corresponding to the Bin code [1] is the chromaticity coordinate ZA0 (X _A0 , Y _A0 on the chromaticity table shown in FIG. ). With this chromaticity coordinate ZA0 as the center, a predetermined range (for example, ± 10%) for the X coordinate and Y coordinate on the chromaticity table is set as a non-defective product determination range (threshold value). Similarly, for the appropriate resin supply amounts corresponding to the other Bin codes [2] to [5], a non-defective product determination range (threshold value) is set based on the light emission characteristic measurement results (chromaticity table shown in FIG. 19). (See chromaticity coordinates ZB0-ZE0 above). Here, the predetermined range set as the threshold value is appropriately set according to the accuracy level of the light emission characteristics required for the light emitting element package 50 as a product.

  18B and 18C show the emission characteristic measurement values and the non-defective product determination range (threshold value) when the phosphor concentrations of the resin 8 are 10% and 15%, respectively. In FIGS. 18B and 18C, the proper resin supply amount 15 (2) and the proper resin supply amount 15 (3) indicate the proper resin supply amounts when the phosphor concentrations are 10% and 15%, respectively. The emission characteristic measurement value 39a (2) and the emission characteristic measurement value 39a (3) are emission specific measurement values when the phosphor concentrations are 10% and 15%, respectively, and threshold data 81a ( 2) The threshold value data 81a (3) indicates a non-defective product determination range (threshold value) in each case.

  The threshold data created in this way is selectively used according to the Bin code 12b to which the target LED element 5 belongs in the production supply operation. The threshold data creation process shown in (ST6) is executed as an off-line operation by a single inspection device provided separately from the light emitting element package manufacturing system 101, and is previously stored in the management computer 3 as threshold data 81a. The stored data may be transmitted to the resin supply device M4 via the LAN system 2 and used.

  After the resin can be supplied in this manner, the element holding member 20 holding the LED element 5 is conveyed to the resin supply device M4 (ST7). Then, based on the resin supply information 19 and the rearranged element arrangement information 118, each resin held in the element holding surface 20a of the element holding member 20 is supplied with an appropriate resin supply amount of resin 8 for providing specified light emission characteristics. Supply to the LED element 5 (ST8) (resin supply process). Details of this resin supply work process will be described with reference to FIGS.

  First, at the start of the resin supply operation, the resin container is exchanged as necessary (ST31). That is, the resin cartridge mounted on the print head 32 is replaced with one containing a resin 8 having a phosphor concentration selected according to the characteristics of the LED element 5. Next, the resin 8 is supplied to the translucent member 43 for measurement of light emission characteristics by the resin supply unit A that discharges the resin 8 in a variable amount (measurement supply step) (ST32). That is, the appropriate resin supply amount (VA0) for each Bin code 12b defined by the resin supply information 19 shown in FIG. 5 is placed on the translucent member 43 drawn to the test supply stage 40a by the test supply / measurement unit 40. -VE0) resin 8 is supplied. At this time, even if the ejection operation parameter corresponding to the appropriate resin supply amount (VA0 to VE0) is commanded to the print head 32, the actual resin supply amount discharged from the print nozzle unit 32a and supplied to the translucent member 43 is resin. However, the actual resin supply amount is VA1 to VE1, which is slightly different from VA0 to VE0, as shown in FIG. 20 (a).

  Next, by transmitting the translucent member 43 in the trial supply / measurement unit 40, the translucent member 43 on which the resin 8 has been trial-supplied is sent and placed on the translucent member mounting portion 41 (translucent member mounting step). . And the excitation light which excites fluorescent substance is light-emitted from the light source part 45 arrange | positioned above the translucent member mounting part 41. FIG. The excitation light is irradiated onto the resin 8 supplied to the translucent member 43 from above, so that the light emitted by the resin 8 is received by the spectroscope 42 from below the translucent member 43 via the integrating sphere 44, The light emission characteristic measurement processing unit 39 measures the light emission characteristic (light emission characteristic measurement step) (ST33).

As a result, as shown in FIG. 21B, a light emission characteristic measurement value represented by the chromaticity coordinate Z (see FIG. 19) is obtained. This measurement result is not necessarily based on the above-described error in the supply amount and the change in the concentration of the phosphor particles in the resin 8, for example, the light emission characteristics defined in advance, that is, the standard color when supplying the appropriate resin shown in FIG. It does not coincide with the degree coordinates ZA0 to ZE0. For this reason, the deviation (ΔX _A) indicating the separation in the X and Y coordinates between the obtained chromaticity coordinates ZA1 to ZE1 and the standard chromaticity coordinates ZA0 to ZE0 at the time of supplying the appropriate resin shown in FIG. , ΔY _A ) to (ΔX _E , ΔY _E ) are determined to determine whether correction is necessary to obtain desired light emission characteristics.

Here, it is determined whether or not the measurement result is within the threshold value (ST34), and the deviation obtained in (ST33) is compared with the threshold value as shown in FIG. 21 (c). Thus, it is determined whether the deviations (ΔX _A , ΔY _A ) to (ΔX _E , ΔY _E ) are within ± 10% of ZA0 to ZE0. If the deviation is within the threshold value, the discharge operation parameters corresponding to the preset appropriate resin supply amounts VA0 to VE0 are maintained as they are. On the other hand, when the deviation exceeds the threshold value, the supply amount is corrected (ST35).

  That is, the deviation between the measurement result in the light emission characteristic measuring step and the predetermined light emission characteristic is obtained, and as shown in FIG. 20 (d), the actual production to be supplied to the LED element 5 based on the obtained deviation. The process of deriving the new appropriate resin supply amount (VA2 to VE2) is executed by the supply amount deriving processing unit 38 (supply amount deriving process step). In other words, a new appropriate resin supply amount for actual production is derived by correcting the appropriate resin supply amount based on the measurement result in the light emission characteristic measurement step and the predetermined light emission characteristic.

  Here, the corrected appropriate resin supply amounts (VA2 to VE2) are updated values obtained by adding correction amounts corresponding to the respective deviations to the preset appropriate resin supply amounts VA0 to VE0. The relationship between the deviation and the correction amount is recorded in advance in the resin supply information 19 as known accompanying data. Then, based on the corrected proper resin supply amount (VA2 to VE2), the processes of (ST32), (ST33), (ST34), and (ST35) are repeatedly executed, and the measurement result is defined in advance in (ST34). By confirming that the deviation from the light emission characteristic is within the threshold value, the appropriate resin supply amount for actual production is determined. That is, in the above-described resin supply method, the appropriate resin supply amount is determined by repeatedly executing the measurement supply step, the translucent member placement step, the excitation light emission step, the light emission characteristic measurement step, and the supply amount derivation step. I try to derive. The determined proper resin supply amount is stored in the storage unit 81 as the actual production supply amount 81b.

  After that, the process moves to the next step, and discarding is executed (ST36). Here, by discharging a predetermined amount of the resin 8 from the print nozzle unit 32a, the resin flow state in the resin discharge path is improved, and the operation of the print head 32 is stabilized. Note that the processing of (S37), (ST38), (ST39), and (ST40) indicated by the broken line frame in FIG. 20 is the same as the processing content shown in (ST32), (ST33), (ST34), and (ST35). It is executed when it is necessary to carefully check that the desired light emission characteristics are completely secured, and is not necessarily an essential execution item.

  If the proper resin supply amount that gives the desired light emission characteristics is determined in this way, supply for production is executed (ST41). That is, the production execution processing unit 37 instructs the supply control unit 36 that controls the print head 32 to supply the appropriate resin supply amount derived by the supply amount derivation processing unit 38 and stored as the actual production supply amount 81b. A production supply process for individually supplying the resin 8 having the appropriate resin supply amount to the LED elements 5 in the wafer state is executed (production execution step).

  In the process of repeatedly executing this production supply process, the number of times of supply by the print head 32 is counted, and it is monitored whether or not the number of times of supply has passed a predetermined number of times (ST42). That is, until the predetermined number of times is reached, it is determined that changes in the properties of the resin 8 and the phosphor concentration are small, and the production supply execution (ST41) is repeated while maintaining the same actual production supply amount 81b. If the predetermined number of times has been confirmed in (ST42), it is determined that there is a possibility that the property of the resin 8 or the phosphor concentration has changed, and the process returns to (ST32), and the same measurement of light emission characteristics is performed thereafter. The supply amount correction process based on the measurement result is repeatedly executed.

  Next, returning to the flow of FIG. 16, the element holding member 20 holding the LED element 5 is transported to the curing device M <b> 5, and as shown in FIG. 11A, the LED element 5 supplied with the resin 8 is heated here. By doing so, the resin 8 is cured (ST8) (curing step). Thereby, the upper surface of the LED element 5 is covered with the resin film 8 * obtained by thermosetting the resin 8. In the curing step, instead of curing the resin 8 by heating, a method of accelerating curing by irradiating UV (ultraviolet light) or a method of allowing it to stand for natural curing may be used. After that, the element holding member 20 holding the light emitting element 5 * is transported to the sorting device M6, where the light emission characteristics of each light emitting element 5 * are inspected, and as shown in FIG. Based on the above, sorting for separating the light emitting elements 5 * into the element holding sheets 13A, 13B,... Is performed (ST10).

  Thereafter, the light emitting element 5 * manufactured in this way is mounted on the substrate 14 (ST11) (component mounting process). That is, the light emitting elements 5 * sorted according to the light emission characteristics are sent to the component mounting apparatus M7 in a state of being attached to the element holding sheets 13A, 13B,. Then, as shown in FIG. 22A, the resin adhesive 23 is supplied to the element mounting position in the LED mounting portion 14b by moving the transfer pin 24a of the adhesive transfer mechanism 24 up and down (arrow n). 22 (b), the light emitting element 5 * held by the mounting nozzle 26a of the component mounting mechanism 26 is lowered (arrow o) and mounted in the LED mounting portion 14b of the substrate 14 via the resin adhesive 23. .

  Next, the substrate 14 after component mounting is sent to the curing device M8, where it is heated, whereby the resin adhesive 23 is thermally cured to become a resin adhesive 23 * as shown in FIG. The light emitting element 5 * is fixed to the individual substrate 14a. Next, the substrate 14 after resin curing is sent to the wire bonding apparatus M9, and as shown in FIG. 22 (d), the wiring layers 14e and 14d of the individual substrate 14a are respectively connected to the N-type electrode 6a of the light emitting element 5 *, The P-type part electrode 6 b is connected to the bonding wire 27.

  Thereafter, the substrate 14 after wire bonding is transferred to the resin coating apparatus M10 and resin sealing is performed (ST12). That is, as shown in FIG. 23A, the transparent resin 28 for sealing is discharged from the discharge nozzle 90 while covering the light emitting element 5 * inside the LED mounting portion 14b surrounded by the reflection portion 14c. When the resin supply for one substrate 14 is thus completed, the substrate 14 is sent to the curing device M11, and the resin 28 is cured by heating the substrate 14. As a result, as shown in FIG. 23C, the resin 28 supplied to cover the light emitting element 5 * is thermoset to become a solid resin 28 *, which is in a fixed state in the LED mounting portion 14b. Seal 5 *.

  Next, the substrate 14 after the resin curing is sent to the individual piece cutting device M12, where the substrate 14 is cut into individual piece substrates 14a, whereby individual light emitting element packages are obtained as shown in FIG. It is divided into 50 (ST13). Thereby, the light emitting element package 50 in which the light emitting element 5 * formed by covering the LED element 5 with the resin 8 is mounted on the individual substrate 14a is completed.

  As described above, in the light-emitting element manufacturing system 1 and the light-emitting element package manufacturing system 101 shown in the present embodiment, the light-emitting element 5 * formed by coating the upper surface of the LED element 5 with the resin 8 containing a phosphor. During manufacturing, when the resin 8 is discharged and supplied to the LED elements 5 taken out from the LED wafer 10 and rearranged in a predetermined arrangement on the element holding surface 20a of the element holding member 20, the resin 8 is measured for light emission characteristics. The light-emitting characteristic of the light emitted from the resin 8 is measured by irradiating the light-transmitting member 43, which is supplied as a trial, with the excitation light from the light source unit 45, and an appropriate resin supply is performed based on the measurement result and the predetermined light-emitting characteristics. By correcting the amount, an appropriate resin supply amount of the resin 8 to be supplied to the LED element for actual production is derived. As a result, even when the emission wavelengths of the individual LED elements 5 vary, the light emission characteristics of the light emitting elements 5 * can be made uniform to improve the production yield.

  In addition, since the resin 8 is supplied from the LED wafer 10 and rearranged in a predetermined arrangement on the element holding surface 20a of the element holding member 20, the resin supply target area is set as the target. It is possible to localize. As a result, compared to the conventional method of supplying resin after mounting on a substrate composed of a plurality of individual substrates, the exclusive area of the resin supply equipment can be reduced, and the area productivity of the manufacturing equipment can be improved. it can. Furthermore, in the wafer state, the LED elements 5 whose positions are fixed can be rearranged in a desired arrangement for resin supply, and the resin supply operation by the resin supply device M4 can be executed efficiently.

  The light emitting device manufacturing system and manufacturing method and the light emitting device package manufacturing system and manufacturing method configured by mounting the light emitting device on a substrate, even when the light emitting wavelengths of individual LED devices vary. The light emitting device package has the effect that the light emitting characteristics of the light emitting device package can be made uniform, the production yield can be improved and the area productivity of the manufacturing equipment can be improved, and the LED device is covered with a resin containing a phosphor. It can be used in the field of manufacturing device packages.

DESCRIPTION OF SYMBOLS 1 Light emitting element manufacturing system 2 LAN system 5 LED element 5 * Light emitting element 8 Resin 10 LED wafer 10a Dicing sheet 12 Element characteristic information 14 Substrate 14a Single piece substrate 14b LED mounting part 14c Reflector 18 Map data 19 Resin supply information 20 Element Holding member 20a Element holding surface 23 Resin adhesive 24 Adhesive transfer mechanism 25 Component supply mechanism 26 Component mounting mechanism 28 Resin 32 Print head 32a Print nozzle unit 40, 140 Test supply / measurement unit 40a Test supply stage 41, 141 Translucent member Placement part 42 Spectroscope 43 Translucent member 44 Integrating sphere 46 Irradiation part 50 Light emitting element package 101 Light emitting element package manufacturing system 118 Element arrangement information

Claims (6)

A light-emitting element manufacturing system for manufacturing a light-emitting element formed by coating the upper surface of an LED element with a resin containing a phosphor,
A dicing apparatus that divides the LED wafer in a state in which a plurality of the LED elements are built and adhered to a dicing sheet for each LED element;
An element characteristic measurement unit that individually measures the light emission characteristics of the LED elements divided into pieces in a state of being stuck and held on the dicing sheet, and obtains element characteristic information indicating the light emission characteristics of each LED element;
A map data creation unit that creates, for each LED wafer, map data that associates element position information indicating the position of the divided LED elements on the LED wafer and the element characteristic information on the LED elements;
An element rearrangement unit for rearranging the LED elements on an element holding surface in a predetermined arrangement based on the map data;
Resin information providing means for providing, as resin supply information, information corresponding to an appropriate resin supply amount of the resin for obtaining an LED element having a prescribed light emission characteristic and the element characteristic information;
Based on the element arrangement information indicating the arrangement of the LED elements rearranged by the element rearrangement unit and the resin supply information, the resin having an appropriate resin supply amount for providing a predetermined light emission characteristic is provided on the element holding surface. A resin supply device for supplying each LED element held;
A curing device for curing the resin supplied to the LED element,
The resin supply device includes a resin supply unit that discharges the resin in a variable amount and supplies the resin to an arbitrary supply target position;
By controlling the resin supply unit, a supply control unit that executes a supply process for measurement for supplying the resin to the translucent member for light emission characteristic measurement and a supply process for production for supplying to the LED element for actual production When,
A light source unit that emits excitation light that excites the phosphor, and a translucent member mounting unit on which the translucent member on which the resin has been trial-supplied in the measurement supply process is mounted,
A light emission characteristic measuring unit that measures the light emission characteristic of the light emitted by the resin by irradiating the resin supplied to the translucent member with the excitation light emitted from the light source unit;
Supply for deriving an appropriate resin supply amount for actual production to be supplied to the LED element by correcting the appropriate resin supply amount based on a measurement result of the light emission characteristic measuring unit and a predetermined light emission characteristic A quantity derivation processing unit;
And a production execution processing unit that executes a supply process for production for supplying the resin of the proper resin supply amount to the LED element by instructing the derived appropriate resin supply amount to the supply control unit. A light emitting device manufacturing system.   The light emitting element manufacturing system according to claim 1, wherein the resin supply unit is a resin discharge device that discharges the resin by an ink jet method. A method of manufacturing a light-emitting element for manufacturing a light-emitting element formed by coating the upper surface of an LED element with a resin containing a phosphor,
A dicing step of dividing the LED wafer in a state where a plurality of the LED elements are built and attached to the dicing sheet for each LED element;
An element characteristic measurement step for obtaining element characteristic information indicating the light emission characteristics of each LED element by separately measuring the light emission characteristics of the LED elements divided into pieces in a state of being stuck and held on the dicing sheet;
A map data creation step for creating map data for each LED wafer, associating element position information indicating the position of the divided LED elements on the LED wafer and the element characteristic information on the LED elements;
An element rearrangement step of rearranging the LED elements on the element holding surface in a predetermined arrangement based on the map data;
A resin information obtaining step for obtaining, as resin supply information, information corresponding to an appropriate resin supply amount of the resin for obtaining an LED element having prescribed light emission characteristics and the element characteristic information;
Based on the element arrangement information indicating the arrangement of the LED elements after rearrangement in the element rearrangement step and the resin supply information, the resin having an appropriate resin supply amount for providing a predetermined light emission characteristic is provided on the element holding surface. A resin supply step for supplying each LED element held;
Curing the resin supplied to the LED element,
Furthermore, the resin supply step includes a measurement supply step for supplying the resin to the light-transmissive member as a light emission characteristic measurement by a resin supply unit that discharges the resin in a variable amount.
A translucent member placement step of placing the translucent member on which the resin has been trial-supplied on the translucent member placement section;
A light emission characteristic measuring step for measuring the light emission characteristic of light emitted from the resin by irradiating the resin supplied to the translucent member with the excitation light emitted from the light source unit that emits the excitation light for exciting the phosphor; ,
Supply for deriving an appropriate resin supply amount for actual production to be supplied to the LED element by correcting the appropriate resin supply amount based on a measurement result in the light emission characteristic measurement step and a predetermined light emission characteristic An amount derivation process step and an instruction for the derived appropriate resin supply amount to a supply control unit that controls the resin supply unit, thereby executing a production supply process for supplying the resin of the appropriate resin supply amount to the LED element. A method for manufacturing a light emitting device, comprising: a production execution step.   The method for manufacturing a light emitting element according to claim 3, wherein in the resin supplying step, the resin is ejected by an ink jet method. A light-emitting element package manufacturing system for manufacturing a light-emitting element package configured by mounting a light-emitting element formed by previously covering the upper surface of an LED element with a resin containing a phosphor on a substrate,
A dicing apparatus that divides the LED wafer in a state in which a plurality of the LED elements are built and adhered to a dicing sheet for each LED element;
An element characteristic measurement unit that individually measures the light emission characteristics of the LED elements divided into pieces in a state of being stuck and held on the dicing sheet, and obtains element characteristic information indicating the light emission characteristics of each LED element;
A map data creation unit that creates, for each LED wafer, map data in which element position information indicating the position of the divided LED elements in the LED wafer and the element characteristic information about the LED elements are associated;
An element rearrangement unit for rearranging the LED elements on an element holding surface in a predetermined arrangement based on the map data;
Resin information providing means for providing, as resin supply information, information corresponding to an appropriate resin supply amount of the resin for obtaining an LED element having a prescribed light emission characteristic and the element characteristic information;
Based on the element arrangement information indicating the arrangement of the LED elements rearranged by the element rearrangement unit and the resin supply information, the resin having an appropriate resin supply amount for providing a predetermined light emission characteristic is provided on the element holding surface. A resin supply device for supplying each LED element held;
A curing device for completing the light emitting element by curing the resin supplied to the LED element;
A component mounting apparatus for mounting the light emitting element on a substrate;
The resin supply device includes a resin supply unit that discharges the resin in a variable amount and supplies the resin to an arbitrary supply target position;
By controlling the resin supply unit, a supply control unit that executes a supply process for measurement for supplying the resin to the translucent member for light emission characteristic measurement and a supply process for production for supplying to the LED element for actual production When,
A light source unit that emits excitation light that excites the phosphor, and a translucent member mounting unit on which the translucent member on which the resin has been trial-supplied in the measurement supply process is mounted,
A light emission characteristic measuring unit that measures the light emission characteristic of the light emitted by the resin by irradiating the resin supplied to the translucent member with the excitation light emitted from the light source unit;
Supply for deriving an appropriate resin supply amount for actual production to be supplied to the LED element by correcting the appropriate resin supply amount based on a measurement result of the light emission characteristic measuring unit and a predetermined light emission characteristic A quantity derivation processing unit;
And a production execution processing unit that executes a supply process for production for supplying the resin of the proper resin supply amount to the LED element by instructing the derived appropriate resin supply amount to the supply control unit. A light emitting device package manufacturing system. A light-emitting element package manufacturing method for manufacturing a light-emitting element package configured by mounting a light-emitting element, in which a top surface of an LED element is pre-coated with a resin containing a phosphor, on a substrate,
A dicing step of dividing the LED wafer in a state where a plurality of the LED elements are built and attached to the dicing sheet for each LED element;
An element characteristic measurement step for obtaining element characteristic information indicating the light emission characteristics of each LED element by separately measuring the light emission characteristics of the LED elements divided into pieces in a state of being stuck and held on the dicing sheet;
A map data creation step for creating map data for each LED wafer, associating element position information indicating the position of the divided LED elements on the LED wafer and the element characteristic information on the LED elements;
An element rearrangement step of rearranging the LED elements on the element holding surface in a predetermined arrangement based on the map data;
A resin information obtaining step for obtaining, as resin supply information, information corresponding to an appropriate resin supply amount of the resin for obtaining an LED element having prescribed light emission characteristics and the element characteristic information;
Based on the element arrangement information indicating the arrangement of the LED elements after rearrangement in the element rearrangement step and the resin supply information, the resin having an appropriate resin supply amount for providing a predetermined light emission characteristic is provided on the element holding surface. A resin supply step for supplying each LED element held;
A curing step of curing the resin supplied to the LED element;
A component mounting step of mounting the light emitting element on a substrate,
Furthermore, the resin supply step includes a measurement supply step for supplying the resin to the light-transmissive member as a light emission characteristic measurement by a resin supply unit that discharges the resin in a variable amount.
A translucent member placement step of placing the translucent member on which the resin has been trial-supplied on the translucent member placement section;
A light emission characteristic measuring step for measuring the light emission characteristic of light emitted from the resin by irradiating the resin supplied to the translucent member with the excitation light emitted from the light source unit that emits the excitation light for exciting the phosphor; ,
Supply for deriving an appropriate resin supply amount for actual production to be supplied to the LED element by correcting the appropriate resin supply amount based on a measurement result in the light emission characteristic measurement step and a predetermined light emission characteristic A quantity derivation processing step;
A production execution step of executing a production supply process for supplying the resin of the proper resin supply amount to the LED element by instructing the derived control resin supply amount to a supply control unit that controls the resin supply unit. A method for manufacturing a light emitting device package, comprising:

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