JP2014074746A - Optical wiring component, photo-electric consolidation member, and electric apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical wiring component excellent in mechanical characteristic, and a photo-electric consolidation member and an electric apparatus that are reliable and have the optical wiring component.SOLUTION: An optical wiring component 1 comprises: an optical waveguide (optical wiring) 2, having a long layer form, which is able to transmit an optical signal; and a support part 3 provided so as to cover the side faces and upper and lower faces of the optical waveguide 2. The support part 3 is provided in contact with the optical waveguide 2, and is made of a composite material composed of a plurality of base material fibers, and resin binding the base material fibers. The support part 3 is configured so as to surround the entire part of the optical waveguide 2 when cut in a direction orthogonal to the longitudinal direction of the optical waveguide 2. It is preferable that the base material fibers are organic fibers oriented randomly in the support part 3. Such a support part 3 is preferably formed by a sheet making method.

Description

  The present invention relates to an optical wiring component, an opto-electric hybrid member, and an electronic device.

  An optical communication technique for transferring data using an optical carrier wave has been developed. In recent years, optical wiring such as an optical waveguide and an optical fiber is becoming widespread as a means for guiding the optical carrier wave from one point to another point. Each of these optical wirings has a linear core part and a cladding part provided so as to cover the periphery thereof. The core portion is made of a material that is substantially transparent to the optical carrier wave, and the cladding portion is made of a material having a refractive index lower than that of the core portion.

  Of the optical wiring, the optical fiber is mainly suitable for long-distance optical communication and is often used to construct a backbone network. On the other hand, the optical waveguide is often used for construction of an optical circuit in a local network or equipment.

  By the way, in the operation of laying these optical wirings in various places, it is indispensable to bend the optical wirings or to press them against a support member or the like. At that time, a certain load is applied to the optical wirings. As a result, unintentionally bending with an excessive curvature or applying an excessive load may cause a reduction in transmission efficiency.

  Therefore, Patent Document 1 includes an optical wiring member including a base material, a resin layer that is provided on one side surface of the optical waveguide, and a reinforcing layer that is formed of a conductive material provided on the resin layer side. It is disclosed. Accordingly, it is disclosed that the optical wiring is reinforced and deformation of the resin layer serving as the optical waveguide is suppressed.

  However, Patent Document 1 describes that the conductive material constituting the reinforcing layer is a conductive film such as a metal or a conductive polymer, or a non-conductive film such as glass. For this reason, the reinforcing effect that these films provide for the optical wiring used in the above applications is not sufficient, and for example, when the optical wiring is twisted or when the bending operation is repeated, etc. Is feared to cause a decrease in durability.

JP 2010-266598 A

  An object of the present invention is to provide an optical wiring component excellent in mechanical characteristics, a highly reliable opto-electric hybrid member and an electronic apparatus including the optical wiring component.

Such an object is achieved by the present inventions (1) to (11) below.
(1) An optical wiring component comprising: an optical wiring; and a support portion provided in contact with the optical wiring and including a base fiber.

  (2) The optical wiring according to (1), wherein the support portion includes a portion configured to contact two opposite sides of the optical wiring when cut so as to be orthogonal to a longitudinal direction of the optical wiring. parts.

  (3) The optical wiring component according to (1), wherein the support portion includes a portion configured to surround at least a part of the optical wiring when cut so as to be orthogonal to a longitudinal direction of the optical wiring. .

  (4) The optical wiring component according to (3), wherein the support portion includes a portion configured to surround the entire optical wiring when cut so as to be orthogonal to the longitudinal direction of the optical wiring.

  (5) The optical wiring component according to any one of (1) to (4), wherein the support portion further includes a resin.

  (6) The optical wiring component according to any one of (1) to (5), wherein the plurality of substrate fibers are randomly oriented in the support portion.

  (7) The optical wiring component according to any one of (1) to (6), wherein the base fiber is an organic fiber.

  (8) The optical wiring component according to any one of (1) to (7), wherein the support portion is formed by a papermaking method.

  (9) The optical wiring component according to any one of (1) to (8), wherein the optical wiring is mainly composed of a resin material.

  (10) An opto-electric hybrid member comprising: the optical wiring component according to any one of (1) to (9) above; and a conductor layer provided on the support portion.

  (11) An electronic apparatus comprising the optical wiring component according to any one of (1) to (9).

According to the present invention, an optical wiring component having excellent mechanical characteristics can be obtained.
In addition, according to the present invention, a highly opto-electric hybrid member and electronic device that are particularly reliable in optical communication can be obtained.

It is a perspective view which permeate | transmits and shows 1st Embodiment of the optical wiring component of this invention. It is the sectional view on the AA line shown in FIG. It is a longitudinal cross-sectional view which shows 2nd Embodiment of the optical wiring component of this invention. It is a longitudinal cross-sectional view which shows 3rd Embodiment of the optical wiring component of this invention. It is a longitudinal cross-sectional view which shows 4th Embodiment of the optical wiring component of this invention. It is a figure for demonstrating the manufacturing method of the optical wiring component shown in FIG. It is a figure for demonstrating the manufacturing method of the optical wiring component shown in FIG. It is a longitudinal cross-sectional view which shows 1st Embodiment of the opto-electric hybrid member of this invention. It is a longitudinal cross-sectional view which shows 2nd Embodiment of the opto-electric hybrid member of this invention. It is a longitudinal cross-sectional view which shows 3rd Embodiment of the opto-electric hybrid member of this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an optical wiring component, an opto-electric hybrid member and an electronic apparatus according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<Optical wiring parts>
<< First Embodiment >>
First, a first embodiment of the optical wiring component of the present invention will be described.

  FIG. 1 is a partially transparent perspective view showing a first embodiment of an optical wiring component of the present invention, and FIG. 2 is a cross-sectional view taken along line AA shown in FIG. In the following description, the upper side in FIGS. 1 and 2 is referred to as “upper” and the lower side is referred to as “lower”.

  An optical wiring component 1 shown in FIG. 1 has a long and layered optical waveguide (optical wiring) 2 capable of transmitting an optical signal, and a support portion provided so as to cover a side surface and upper and lower surfaces of the optical waveguide 2. 3 is provided. Among these, the optical waveguide 2 can be replaced by a member having a light guide, for example, an optical fiber. On the other hand, the support part 3 is provided in contact with the optical waveguide 2 and includes a base fiber.

  By providing such a support portion 3, the optical waveguide 2 can be reliably reinforced. Thereby, mechanical characteristics such as bending resistance and compressive strength of the optical wiring component 1 can be further improved, and the optical waveguide 2 is bent even when the optical wiring component 1 is bent slightly or a large load is applied. And disconnection can be prevented. As a result, a decrease in transmission efficiency in the optical waveguide 2 can be prevented.

  Moreover, since the support part 3 contains the base fiber, mechanical properties such as tensile strength and toughness in the optical wiring component 1 can be enhanced. This disperses the stress applied to the support part 3 by the base fiber contained in the support part 3 and prevents a large stress from being concentrated locally on the optical waveguide 2 disposed inside the support part 3. This is probably because of this. For this reason, for example, even when the operation of twisting or bending the optical wiring component 1 is repeated, the support portion 3 can protect the optical waveguide 2 and the optical wiring 2 can be prevented from being bent or torn.

Hereinafter, the configuration of each part will be described in detail.
(Optical wiring)
As described above, the optical waveguide 2 can be replaced by a member having a light guide such as an optical fiber, but an optical waveguide is preferably used from the viewpoint of transmission efficiency and ease of handling. Further, since the optical waveguide 2 can be easily manufactured in a layered manner, for example, when the support portion 3 is manufactured by a papermaking method, the side surface and the upper and lower surfaces of the optical waveguide 2 can be efficiently covered with the support portion 3. Useful in that it can.

  An optical waveguide 2 shown in FIG. 1 is formed by laminating a clad layer 21, a core layer 23, and a clad layer 22 in this order from below. Among them, the core layer 23 includes a plurality of long (two in FIG. 1) core portions 241 and 242 and a plurality of long (three in FIG. 1) side clad portions 251. , 252 and 253 are formed, and these are alternately arranged in the width direction of the optical waveguide 2. As a result, the core parts 241 and 242 are surrounded by the clad parts (side clad parts 251 252 253 and the clad layers 21 and 22), and light can be confined and transmitted in the core parts 241 and 242.

  The core portions 241 and 242 and the side clad portions 251, 252 and 253 have different refractive indexes, and the refractive indexes of the core portions 241 and 242 are set to be larger than the refractive index of the clad portion.

  Further, the width and height of the core portions 241 and 242 (thickness of the core layer 23) are not particularly limited, but are preferably about 1 to 200 μm, more preferably about 5 to 100 μm, respectively. More preferably, it is about ~ 70 μm.

  On the other hand, when the plurality of core parts 241 and 242 are formed in parallel as shown in FIG. 1, the width of the side cladding parts 251, 252 and 253 parallel to the core parts 241 and 242 is about 5 to 250 μm. It is preferably about 10 to 200 μm, more preferably about 10 to 120 μm.

  The constituent material (main material) of the core layer 23 as described above is, for example, acrylic resin, methacrylic resin, polycarbonate, polystyrene, cyclic ether resin such as epoxy resin or oxetane resin, polyamide, polyimide, poly Benzoxazole, polysilane, polysilazane, silicone resin, fluorine resin, polyurethane, polyolefin resin, polybutadiene, polyisoprene, polychloroprene, polyester such as PET and PBT, polyethylene succinate, polysulfone, polyether, benzocyclo Various resin materials such as cyclic olefin resins such as butene resin and norbornene resin can be used. Note that the resin material may be a composite material in which materials having different compositions are combined. By comprising such a resin material, the optical waveguide 2 has sufficient flexibility. For this reason, the optical wiring component 1 which can be laid in the curved state or can be incorporated in the device is obtained.

On the other hand, the cladding layers 21 and 22 are located below and above the core layer 23.
The average thickness of the clad layers 21 and 22 is preferably about 0.05 to 1.5 times the average thickness of the core layer 23, and more preferably about 0.1 to 1.25 times. Specifically, the average thickness of the cladding layers 21 and 22 is preferably about 1 to 200 μm, more preferably about 3 to 100 μm, and further preferably about 5 to 60 μm. Thereby, the function as a clad part is ensured while preventing the optical waveguide 2 from becoming thicker than necessary.

  Further, as the constituent material of the cladding layers 21 and 22, for example, the same material as the constituent material of the core layer 23 described above can be used.

  The width of the optical waveguide 2 is not particularly limited, but is preferably about 1 to 200 mm, and more preferably about 2 to 100 mm.

  Further, the length of the optical waveguide 2 is appropriately set according to the application and is not particularly limited, but is preferably about 20 to 1000 mm, and more preferably about 50 to 500 mm as an example.

  Moreover, the number of the core parts 241 and 242 formed in the optical waveguide 2 is not particularly limited, but is preferably about 1 to 100. If the number of core portions 241 and 242 is large, the optical waveguide 2 may be multilayered as necessary. Specifically, the optical waveguide 2 shown in FIGS. 1 and 2 can be multilayered by alternately stacking core layers and cladding layers.

  A support film 26 is provided on the lower surface of the optical waveguide 2 shown in FIG. 1, and a cover film 27 is provided on the upper surface.

  Examples of the constituent material of the support film 26 and the cover film 27 include various resin materials such as polyethylene terephthalate (PET), polyolefin such as polyethylene and polypropylene, polyimide, and polyamide.

  Moreover, the average thickness of the support film 26 and the cover film 27 is not particularly limited, but is preferably about 5 to 500 μm, and more preferably about 10 to 400 μm.

  The support film 26 and the cover film 27 are provided as necessary, and may be omitted.

  Further, the optical waveguide 2 may be formed with a mirror (optical path conversion unit) that converts the optical path of the cores 241 and 242 as necessary.

(Support part)
The support part 3 is a part including base fiber and is provided so as to be in contact with the optical waveguide 2.

  The support part 3 according to the present embodiment is composed of a composite material composed of a plurality of base fibers, a resin that binds the base fibers, and other additives.

  By configuring the support portion 3 with such a composite material, it is possible to improve mechanical properties such as flex resistance, compressive strength, tensile strength, and toughness of the support portion 3 by using a plurality of base fibers. it can. This is because the base fiber has particularly excellent mechanical properties in the length direction, and it is considered that the mechanical properties of the entire support portion 3 are improved by including a plurality of such base fibers. It is done. In addition, since the base fibers are bound to each other by the resin, the stress applied to the support portion 3 is dispersed in the plurality of base fibers through the binding portions, and as a result, the stress is large locally in the optical waveguide 2. Stress concentration can be prevented.

  The support portion 3 shown in FIG. 1 is provided so as to cover the side surface and the upper and lower surfaces over the entire length of the optical waveguide 2 with respect to the long and layered optical waveguide 2. That is, the support portion 3 has a cylindrical shape, and the optical waveguide 2 is inserted through the support portion 3. The support portion 3 and the optical waveguide 2 are in contact with each other, whereby the optical waveguide 2 is reinforced.

  Therefore, when the support part 3 shown in FIG. 1 is cut so as to be orthogonal to the longitudinal direction of the optical waveguide 2, the support part 3 includes a portion configured to surround the entire optical waveguide 2 as shown in FIG. 2. become. The support portion 3 having such a configuration can more reliably protect the optical waveguide 2 against loads applied to the optical wiring component 1 from all directions. For example, when the optical wiring component 1 is bent, the direction of the force applied to the support portion 3 is different between the inside and the outside of the bending portion, but the support portion 3 is integrally formed as shown in FIG. The influence on the optical waveguide 2 can be minimized.

  Although the average thickness of the support part 3 provided in the upper surface and lower surface of the optical waveguide 2 is not specifically limited, It is preferable that it is about 10 micrometers-30 mm, and it is more preferable that it is about 20 micrometers-20 mm. By setting the average thickness of the support portion 3 within the above range, the optical waveguide 2 can be sufficiently reinforced, and the optical wiring component 1 can be prevented from being significantly enlarged or damaged in flexibility. it can.

((Base fiber))
The base fiber is not particularly limited. For example, natural fibers such as wood fiber, cotton, hemp, wool, regenerated fiber such as rayon fiber, semi-synthetic fiber such as cellulose fiber, polyamide fiber, aramid fiber, Various organic fibers such as polyimide fibers, polyvinyl alcohol fibers, polyester fibers, acrylic fibers, polyparaphenylene benzoxazole fibers, polyethylene fibers, polypropylene fibers, polyacrylonitrile fibers, and ethylene vinyl alcohol fibers, carbon fibers, glass fibers Various types of metal fibers such as non-metallic inorganic fibers such as ceramic fibers, aluminum, silver, copper, magnesium, iron, chromium, nickel, titanium, zinc, tin, molybdenum, tungsten, or alloys containing these metals Inorganic fibers, etc. Be used one out alone, it may be a combination of two or more.

  Among these, organic fibers are preferably used, and among them, polyamide fibers, aramid fibers, polyimide fibers, polyparaphenylene benzoxazole fibers and the like are more preferably used. These fibers can impart excellent flexibility to the optical wiring component 1 and can further increase the bending strength of the optical wiring component 1. On the other hand, carbon fiber, glass fiber, ceramic fiber, metal fiber and the like are also preferably used. Since these fibers can further increase the bending elastic modulus of the optical wiring component 1, they are useful when manufacturing the optical wiring component 1 that is difficult to bend, for example.

  Examples of the base fiber include Kevlar (registered trademark), which is an aramid fiber manufactured by Toray DuPont Co., Ltd., Technora (registered trademark), an aramid fiber manufactured by Teijin Techno Products Co., Ltd. Kuraray polyvinyl alcohol fiber, vinylon, Toyobo Co., Ltd. polyparaphenylene benzoxazole fiber, Zylon (registered trademark), Nittobo glass fiber, Electrochemical Industry Co., Ltd. alumina fiber Commercial products such as Denka Arsen can also be used.

  The shape of the base fiber is not particularly limited, and can be appropriately selected according to the mechanical properties required for the support portion 3, and examples thereof include chopped strands, cut fibers, and milled fibers. Further, those beaten by mechanical shearing force such as a beater or a homogenizer, or those fibrillated are preferably used. By performing such a treatment, the surface area of the base fiber is increased, and the contact area between the base fiber and the optical waveguide 2 and between the base fibers and between the base fiber and the resin can be increased. it can. Thereby, the effect that the support part 3 reinforces and protects the optical waveguide 2 is further enhanced.

  The average fiber length of the base fiber is not particularly limited, and can be appropriately set according to the mechanical properties required for the support portion 3, but is preferably 300 μm to 10 mm, for example, 500 μm to 7 mm. It is more preferable that it is 700 μm to 5 mm. By setting the average fiber length of the base fibers within the above range, the base fibers are appropriately dispersed and the base fibers are appropriately entangled to sufficiently reinforce the optical waveguide 2 and mechanically. The isotropy in the increase in characteristics can be further increased. That is, when the average fiber length of the base fiber is less than the lower limit, the fiber length is too short, and depending on the fiber diameter and content of the base fiber, the base fibers are difficult to be entangled with each other, and the fiber is unique to the fiber. There is a possibility that the reinforcing action is hardly exhibited. On the other hand, when the average fiber length of the base fiber exceeds the upper limit, the fiber length is too long, so that the molding processability may be lowered depending on the shape of the support 3 or the mechanical properties of the support 3 may be different. There is a risk that it will occur.

  The average fiber diameter of the base fiber is not particularly limited, and can be appropriately set according to the mechanical characteristics required for the support portion 3, but is preferably 0.5 to 30 μm, for example, More preferably, it is 20 micrometers, and it is still more preferable that it is 3-15 micrometers. If the fiber diameter of the base fiber is within the above range, sufficient tensile strength and uniform dispersibility are imparted to the support portion 3. Moreover, the unevenness | corrugation of moderate height arises on the surface of the support part 3, and the adhesiveness of the optical waveguide 2 and the support part 3 is improved more, and the reinforcement effect | action is increased, suppressing the transmission efficiency of the optical waveguide 2 falling. Can be made. In addition, when the fiber diameter of a base fiber is less than the said lower limit, there exists a possibility that a reinforcement effect may fall depending on the constituent material of a base fiber. On the other hand, when the fiber diameter of the base fiber exceeds the upper limit, depending on the shape of the support 3, the molding processability may be reduced, or the dispersibility of the base fiber may be reduced, resulting in non-uniform mechanical properties. There is a fear.

  The content of the base fiber in the support part 3 is appropriately set according to the balance between the mechanical properties required for the support part 3 and the shape and formability of the support part 3, but is, for example, 1 to 90% by mass. It is preferably 3 to 85% by mass, more preferably 5 to 80% by mass, and particularly preferably 10 to 70% by mass. If the content of the base fiber in the support part 3 is within the above range, the support part 3 can have both sufficient tensile strength and high formability. That is, when the content of the base fiber is lower than the lower limit, depending on the length and diameter of the base fiber and the constituent material, the reinforcing action may be insufficient, while the content of the base fiber is the upper limit. When exceeding a value, there exists a possibility that shaping | molding workability may fall depending on the shaping | molding shape of the support part 3. FIG.

  The base fiber and the optical waveguide 2 may be subjected to various surface treatments in advance. Examples of the surface treatment include an ultraviolet irradiation treatment, an electron beam irradiation treatment, a plasma irradiation treatment, and a surface layer forming treatment. By performing such surface treatment, the adhesion and affinity between the base fiber and the optical waveguide 2, between the base fiber and the resin, and between the base fibers can be further increased.

  Among these, examples of the constituent material for the surface layer include various coupling agents such as a silane coupling agent, a cyanate coupling agent, and an aluminate coupling agent, various surfactants, and various oil agents.

  Moreover, it is preferable that the base fiber is oriented randomly in the support portion 3. Thereby, the support part 3 becomes a thing with especially high isotropy in a mechanical characteristic. As a result, the support portion 3 can protect the optical waveguide 2 from loads applied to the optical wiring component 1 from all directions.

  Whether or not the base fibers are randomly oriented is evaluated by, for example, performing structural analysis on the support portion 3 using a diffraction method such as a laser diffraction method, an X-ray diffraction method, or an electron beam diffraction method. can do. Further, the orientation state can be quantitatively evaluated by an evaluation device such as a fiber orientation meter (for example, BM9FS1 manufactured by Yokogawa Electric Corporation). In that case, the orientation index may be 0.2 or less.

((resin))
The resin is not particularly limited, and may be a thermoplastic resin or a thermosetting resin. In the support part 3, the resin further enhances the adhesion to the optical waveguide 2 and binds the base fibers to make the reinforcing action of the optical waveguide 2 by the support part 3 more remarkable.

  Specifically, for example, acrylonitrile-styrene copolymer (AS) resin, acrylonitrile-butadiene-styrene copolymer (ABS) resin, polycarbonate, polystyrene, polyvinyl chloride, polyester resin, polyamide, polyphenylene sulfide (PPS) Examples thereof include thermoplastic resins such as resins, acrylic resins, polyethylene, polypropylene, and fluororesins, and thermosetting resins such as phenol resins, epoxy resins, unsaturated polyester resins, melamine resins, and polyurethanes. From these resins, it may be appropriately selected and used according to the required characteristics, and one kind may be used alone, or two or more kinds may be used in combination.

  Of these, a thermosetting resin is preferably used when emphasizing mechanical properties and chemical resistance, and a thermoplastic resin is preferred when emphasizing moldability and transparency of the support portion 3. Is preferably used.

((Other additives))
The support part 3 may contain other additives. Examples of additives include powdery substances having ion exchange capacity, heat conductive fibers, electromagnetic wave shielding fibers, inorganic powders, metal powders, stabilizers such as antioxidants and UV absorbers, mold release agents, plasticizers, and the like. Agents, flame retardants, resin curing catalysts and accelerators, pigments, paper strength improvers such as dry paper strength improvers, wet paper strength improvers, yield improvers, drainage improvers, size fixers, antifoaming agents Rosin sizing agent for acidic papermaking, rosin sizing agent for neutral papermaking, alkyl ketene dimer sizing agent, alkenyl succinic anhydride sizing agent, special modified rosin sizing agent, sizing agent Examples include a coagulant such as aluminum chloride and polyaluminum chloride, and one or more kinds can be used depending on production conditions and required characteristics.

  Among these, the support part 3 can be manufactured by adding the powdery substance which has ion exchange ability, with the base fiber maintained in the state with the long fiber length. For this reason, the base fiber can surely exhibit the reinforcing action as described above.

  Examples of the powdery substance having ion exchange ability include at least one intercalation compound selected from clay minerals, scaly silica fine particles, hydrotalcites, fluorine teniolite, and swellable synthetic mica.

  Among these, the clay mineral is not particularly limited as long as it has ion exchange ability, and examples thereof include smectite, halloysite, kanemite, kenyanite, zirconium phosphate, and titanium phosphate. The hydrotalcite is not particularly limited as long as it has ion exchange capacity, and examples thereof include hydrotalcite and hydrotalcite-like substances. The fluorine teniolite is not particularly limited as long as it has ion exchange ability, and examples thereof include lithium-type fluorine teniolite and sodium-type fluorine teniolite. The swellable synthetic mica is not particularly limited as long as it has ion exchange ability, and examples thereof include sodium tetrasilicon fluorine mica and lithium tetrasilicon fluorine mica. These intercalation compounds may be natural products or those synthesized, and may be used alone or in combination of two or more. Among these, clay minerals are more preferable, and smectite is more preferable in that it exists from natural products to synthetic products and has a wide range of selection.

  The smectite is not particularly limited as long as it has ion exchange ability, and examples thereof include montmorillonite, beidellite, nontronite, saponite, hectorite, soconite, stevensite and the like. Montmorillonite is a hydrated silicate of aluminum, but may be bentonite containing montmorillonite as a main component and minerals such as quartz, mica, feldspar, and zeolite. Synthetic smectite with few impurities is preferable when used for applications such as coloring and impurities.

  In addition, as a commercial item of the powdery substance having ion exchange capacity, for example, Kunipia (bentonite) manufactured by Kunimine Industry Co., Ltd., Smecton SA (synthetic saponite), Sunlabry (scaly silica manufactured by AGC S-Itech Co., Ltd.) Fine particles), Somasif (swelling synthetic mica) manufactured by Co-op Chemical Co., Ltd., Lucentite (synthetic smectite), Hydrotalcite STABIACE HT-1 (hydrotalcite) manufactured by Sakai Chemical Industry Co., Ltd., and the like.

  The content of the powdery substance having ion exchange capacity is preferably 0.1% by mass or more and 30% by mass or less, more preferably 2% by mass or more and 20% by mass or less of the entire support part 3. If it is in the said range, the effect which improves the fixability of the structural material from which a property differs like base fiber and resin can be acquired. In addition, it is preferable to adjust content of the powdery substance which has an ion exchange capacity according to the ratio of the base fiber and resin in a constituent material, the kind and quantity, etc. of a polymer flocculant.

  Moreover, as a heat conductive fiber, if it is a fiber which has heat dissipation, it will not specifically limit, For example, a metal fiber, carbon fiber, etc. are mentioned. Among these, metal fibers and pitch-based carbon fibers are preferably used from the viewpoint of the heat dissipation effect.

  The metal fiber may be a metal fiber composed of a single metal element or an alloy fiber composed of a plurality of metals, but examples of the metal element constituting the metal fiber include aluminum, Silver, copper, iron, etc. are mentioned.

  In addition, as a commercial item of heat conductive fiber, for example, Nippon Seisen Co., Ltd. and Bekaert Japan Co., Ltd. stainless fiber, Niji Co., Ltd. copper fiber, aluminum fiber, brass fiber, steel fiber, titanium Examples thereof include fibers and phosphor bronze fibers. These metal fibers may be used individually by 1 type, or may use 2 or more types together. Of these, copper fiber, aluminum fiber, and brass fiber are particularly preferable.

  The electromagnetic wave shielding fiber is not particularly limited as long as it is a fiber having an effect of shielding electromagnetic waves. For example, metal fibers, carbon fibers, metal-coated organic fibers, metal-coated carbon fibers, and the like are used. Can be mentioned. Among these, metal fibers are preferably used from the viewpoint that the electromagnetic wave shielding effect and cost are low.

  The metal fiber may be a metal fiber composed of a single metal element or an alloy fiber composed of a plurality of metals, but examples of the metal element constituting the metal fiber include iron, Silver, nickel, aluminum, copper, etc. are mentioned.

  Examples of the inorganic powder include oxides such as titanium oxide, alumina, silica, zirconia, and magnesium oxide, nitrides such as boron nitride, aluminum nitride, and silicon nitride, barium sulfate, iron sulfate, and copper sulfate. Sulfides such as, hydroxides such as aluminum hydroxide and magnesium hydroxide, minerals such as kaolinite, talc, natural mica and synthetic mica, and carbides such as silicon carbide. In addition, these inorganic powders may be used as they are, but those subjected to the various surface treatments described above according to necessary characteristics may be used.

  The total content of these additives is preferably 0.1% by mass or more and 30% by mass or less, and more preferably 2% by mass or more and 20% by mass or less of the entire support part 3.

  The support part 3 may be a single layer as shown in FIG. 2 or may be a plurality of layers. In that case, the type, content, blending ratio, and the like of the base fiber and the resin included in each layer may be the same or different. In the latter case, each layer has different characteristics and functions, and the performance of the optical wiring component 1 can be further enhanced. For example, among the plurality of layers, the inner layer is configured to have excellent reinforcing action as in the support portion 3 according to the first embodiment, while the outer layer is configured to have excellent thermal conductivity. As a result, the thermal conductivity (heat dissipation) can be improved while enhancing the mechanical characteristics of the optical wiring component 1. As a result, for example, when an opto-electric hybrid member is produced using the optical wiring component 1, heat from the electric element can be efficiently radiated in the outer layer.

  Furthermore, the support part 3 may differ from other parts in the kind, content, compounding ratio, etc. of the base fiber or resin contained in a part of each layer regardless of a single layer or a plurality of layers. Thereby, different characteristics and functions can coexist in the layer, and the performance of the optical wiring component 1 can be further enhanced. For example, a part of one layer shall have electromagnetic wave permeability, and the other part shall have a reinforcing action and have an electromagnetic wave shielding property, like the support part 3 according to the first embodiment. be able to.

  In addition, in order to form such a support part 3, a molded object is first obtained by making a paper by the method mentioned later about the said one part. Next, the support body 3 including the part and the other part can be formed by making the molded body together with the optical waveguide 2 by a method as described later.

<< Second Embodiment >>
Next, a second embodiment of the optical wiring component of the present invention will be described.

  FIG. 3 is a longitudinal sectional view showing a second embodiment of the optical wiring component of the present invention. In the following description, the upper side in FIG. 3 is referred to as “upper” and the lower side is referred to as “lower”.

  Hereinafter, although 2nd Embodiment is described, it demonstrates centering around difference with 1st Embodiment, The description is abbreviate | omitted about the same matter. In FIG. 3, the same components as those of the first embodiment are denoted by the same reference numerals as those described above, and detailed description thereof is omitted.

  FIG. 3 is a view showing a cut surface when the optical wiring component 1 is cut along a direction orthogonal to the longitudinal direction of the optical waveguide 2, as in FIG. 2. The optical wiring component 1 shown in FIG. 3 includes a support portion 31 configured to continuously surround both side surfaces and the lower surface of the optical waveguide 2. This support part 31 has the same configuration as the support part 3 according to the first embodiment.

  On the other hand, a support portion 32 is provided so as to cover the upper surface of the optical waveguide 2. The support part 32 may have the same configuration as the support part 3 according to the first embodiment, or may have other configurations. That is, the support portion 32 may be a substrate such as various insulating substrates or electrical wiring substrates. Among these, examples of the constituent material of the insulating substrate include various resin materials such as polyimide resins, polyamide resins, epoxy resins, various vinyl resins, and polyester resins such as polyethylene terephthalate resins. In addition, as an insulating substrate, paper, glass cloth, resin film, etc. are used as a base material, and this base material includes phenolic resin, polyester resin, epoxy resin, cyanate resin, polyimide resin, fluorine resin, etc. What is impregnated with a resin material, specifically, insulating substrates used for composite copper-clad laminates such as glass cloth / epoxy copper-clad laminates, glass nonwoven fabrics / epoxy copper-clad laminates, and polyetherimide Examples thereof include heat-resistant and thermoplastic organic rigid substrates such as resin substrates, polyetherketone resin substrates, and polysulfone resin substrates, and ceramic rigid substrates such as alumina substrates, aluminum nitride substrates, and silicon carbide substrates.

  In such a second embodiment, the same operation and effect as in the first embodiment can be obtained. Moreover, when both the support part 31 and the support part 32 have the structure similar to the support part 3 which concerns on 1st Embodiment, the kind of substrate fiber and resin contained in each, content, compounding ratio, etc. May be different from each other. Thereby, the support part 31 and the support part 32 have different characteristics and functions, respectively, and the performance of the optical wiring component 1 can be further enhanced. For example, the support part 31 has a configuration excellent in reinforcing action as in the support part 3 according to the first embodiment, while the support part 32 has a configuration excellent in thermal conductivity. While improving the mechanical characteristics, thermal conductivity (heat dissipation) can also be improved. As a result, for example, when an opto-electric hybrid member is produced using the optical wiring component 1, the heat from the electric element can be efficiently radiated by the support portion 32.

  In addition, when the support part 32 has the structure similar to the support part 3 which concerns on 1st Embodiment, the support part 31 may have another structure. Specifically, the constituent material of the support portion 31 can be widely selected from resin materials, metal materials, ceramic materials, and the like.

«Third embodiment»
Next, a third embodiment of the optical wiring component of the present invention will be described.

  FIG. 4 is a longitudinal sectional view showing a third embodiment of the optical wiring component of the present invention. In the following description, the upper side in FIG. 4 is referred to as “upper” and the lower side is referred to as “lower”.

  Hereinafter, the third embodiment will be described, but the description will focus on the differences from the first embodiment, and the description of the same matters will be omitted. In FIG. 4, the same components as those of the first embodiment are denoted by the same reference numerals as those described above, and detailed description thereof is omitted.

  The optical wiring component 1 shown in FIG. 4 is configured to continuously surround both the side surface and the upper surface of the support portion 31 configured to continuously surround both the side surface and the lower surface of the optical waveguide 2. The support part 32 is provided. Each of these support portions 31 and 32 may have the same configuration as the support portion 3 according to the first embodiment, and either one has another configuration as described in the second embodiment. You may do it.

  In the third embodiment, the same operation and effect as those in the first and second embodiments can be obtained. Moreover, since both the support part 31 and the support part 32 are comprised so that at least three sides of the optical waveguide 2 may be enclosed, the adhesiveness of the support parts 31 and 32 and the optical waveguide 2 improves especially, and the reinforcement effect | action is further strengthened. can do. Further, even when the support portions 31 and 32 have functions other than the reinforcing action, there is an advantage that the reinforcing action is hardly lowered.

<< Fourth Embodiment >>
Next, a fourth embodiment of the optical wiring component of the present invention will be described.

  FIG. 5 is a longitudinal sectional view showing a fourth embodiment of the optical wiring component of the present invention. In the following description, the upper side in FIG. 5 is referred to as “upper” and the lower side is referred to as “lower”.

  Hereinafter, although the fourth embodiment will be described, the description will focus on the differences from the first embodiment, and description of similar matters will be omitted. In FIG. 5, the same components as those of the first embodiment are denoted by the same reference numerals as those described above, and detailed description thereof is omitted.

  The optical wiring component 1 shown in FIG. 5 is configured to cover the upper surface of the optical waveguide 2, the support portion 31 configured to cover the lower surface, the support portion 32 configured to cover both side surfaces, and the upper surface. And a supporting portion 33. These support portions 31, 32, and 33 may each have the same configuration as the support portion 3 according to the first embodiment, and any two of the other configurations as described in the second embodiment. You may have.

  Also in the fourth embodiment, the same operations and effects as in the first and second embodiments can be obtained. Further, the support portion 32 has the same configuration as the support portion 3 according to the first embodiment, and the support portions 31 and 33 have other configurations as described in the second embodiment. The support portion 32 has a function of reinforcing the optical waveguide 2 and bonding the support portions 31 and 32. On the other hand, by appropriately selecting the constituent material of the support portions 31 and 33, the optical wiring component 1 can have other functions. Properties and functions can be imparted with a good balance. That is, the fourth embodiment can easily and surely make the optical wiring component 1 multifunctional.

<Optical wiring component manufacturing method>
Next, a method for manufacturing the optical wiring component 1 shown in FIG. 1 will be described.

  6 and 7 are views for explaining a method of manufacturing the optical wiring component shown in FIG. In the following description, the upper side in FIGS. 6 and 7 is referred to as “upper” and the lower side is referred to as “lower”.

  The manufacturing method of the optical wiring component 1 includes: [1] a first step of storing a slurry composition 30 in which a base fiber, a resin, and other additives are dispersed in a dispersion medium in a container 9; [2 ] A second step of arranging the optical waveguide 2 so as to contact the stored slurry composition 30; [3] a third step of discharging at least a part of the dispersion medium in the slurry composition 30 to the outside of the container 9; [4] A fourth step of drying the residue remaining in the container 9. Hereinafter, each process will be described sequentially.

  [1] First, raw materials such as base fiber, resin, and other additives are dispersed in a dispersion medium. Thereby, the slurry composition 30 is prepared. The method for dispersing the raw material in the dispersion medium is not particularly limited, and examples thereof include a method of stirring with a disperser, a homogenizer, or the like.

  The dispersion medium is not particularly limited, but it is difficult to volatilize during the process, it is easy to perform the dedispersion medium, and from the viewpoint of consuming a lot of energy to perform the dedispersion medium if the boiling point is too high, etc. Those having a boiling point of 50 ° C. or higher and 200 ° C. or lower are preferably used. Specifically, for example, water, alcohols such as ethanol, 1-propanol, 1-butanol and ethylene glycol, ketones such as acetone, methyl ethyl ketone, 2-heptanone and cyclohexanone, ethyl acetate, butyl acetate and aceto Examples thereof include esters such as methyl acetate and methyl acetoacetate, ethers such as tetrahydrofuran, isopropyl ether, dioxane and furfural. These dispersion media may be used alone or in combination of two or more. Of these, water is particularly preferably used because it is easily available and inexpensive, has a low environmental load, is highly safe and easy to handle.

  Moreover, you may make it add a polymer flocculent to the slurry composition 30 as needed. By adding the polymer flocculant, the raw material can be aggregated in a floc form, so that the mixing ratio of the raw material, for example, the mixing ratio of the base fiber and the resin can be set in a wider range than before. Become. Thereby, characteristics required for the optical wiring component 1, for example, mechanical characteristics of the support part 3, moldability of the support part 3, weight reduction of the optical wiring part 1, thermal conductivity of the support part 3, electromagnetic wave shield of the support part 3 Various characteristics such as the characteristics can be selected relatively freely, and the optical wiring component 1 with higher performance can be obtained.

  Examples of the polymer flocculant include a cationic polymer flocculant, an anionic polymer flocculant, a nonionic polymer flocculant, and an amphoteric polymer flocculant. Specific examples include cationic polyacrylamide, anionic polyacrylamide, Hoffman polyacrylamide, mannic polyacrylamide, amphoteric copolymerized polyacrylamide, cationized starch, amphoteric starch, and polyethylene oxide. These polymer flocculants may be used alone or in combination of two or more. Further, as the polymer flocculant, the polymer structure, molecular weight, functional group amount such as hydroxyl group and ionic group, etc. can be used without particular limitation depending on the required properties.

  Examples of the polymer flocculant include polyethylene oxide manufactured by Wako Pure Chemical Industries, Ltd., Kanto Chemical Co., Ltd., Sumitomo Seika Co., Ltd., and cationic PAM manufactured by Harima Kasei Co., Ltd. Fix, Hermide B-15 which is an anionic PAM, Hermide RB-300 which is an amphoteric PAM, SC-5 which is a cationized starch manufactured by Sanwa Starch Co., Ltd. are available as commercial products. It is not limited.

  The amount of the polymer flocculant added is not particularly limited, but is preferably 100 ppm by mass or more and 1% by mass or less based on the weight of the constituent material. More preferably, it is 500 mass ppm or more and 0.5 mass%. Thereby, raw materials can be aggregated with good yield. In addition, if the addition amount of the polymer flocculant is smaller than the above lower limit value, the yield may be lowered.

  The resin may be in any form, but those in a solid state or emulsion are preferably used, but those having an average particle size of 500 μm or less are more preferably used, and the average particle size More preferably, particles having a particle size of about 1 nm to 300 μm are used. Thereby, while ensuring dispersibility to a dispersion medium fully, when performing a dedispersion medium with respect to the slurry composition 30, it can prevent discharging | emitting resin with a dispersion medium. In addition, when a polymer flocculant is added to the slurry composition 30, in the presence of a powdery substance having ion exchange capacity, the resin and the base fiber easily form an agglomerated state, and the yield is improved. When the average particle size is larger than the above upper limit, it is difficult to form an aggregated state even if a polymer flocculant is added, and the yield may be reduced. In addition, the average particle diameter of resin can be calculated | required as 50% particle diameter of mass reference | standard using laser diffraction type particle size distribution analyzers, such as SALD-7000 by Shimadzu Corporation.

  The slurry composition 30 thus prepared is stored in the container 9. Although the container 9 will not be specifically limited if the slurry composition 30 can be stored, From the viewpoint that the discharge process of the dispersion medium mentioned later can be performed efficiently, the container for various paper machines is used preferably. Specific examples include containers for wet papermaking machines such as a round netting machine, a circular netting machine, and a long netting machine.

  FIG. 6 is a diagram schematically illustrating an example of a papermaking machine. The papermaking machine shown in FIG. 6 includes a container 9 that stores the slurry composition 30, and the bottom of the papermaking machine is composed of a net 91. The mesh-like body 91 has a large number of pores having a size that allows the dispersion medium in the slurry composition 30 to pass therethrough selectively and does not pass through the dispersoid such as the base fiber and the resin. The dispersoid will be filtered out from inside. Examples of such a net-like body 91 include a metal or resin net, a punching sheet, a woven fabric, and a non-woven fabric.

  [2] Next, as shown in FIG. 6A, the optical waveguide 2 is immersed in the slurry composition 30 stored in the container 9. Thereby, the side surface and the upper and lower surfaces of the optical waveguide 2 are covered with the slurry composition 30.

  In the present embodiment, the case where the slurry composition 30 is first stored in the container 9 and then the optical waveguide 2 is immersed is described. However, this order is not particularly limited, and for example, the optical waveguide is contained in the container 9. 2, the slurry composition 30 may be supplied into the container 9. Furthermore, the optical waveguide 2 is placed on the slurry composition 30 stored in the container 9, and the slurry composition 30 is further removed. May be added.

  Moreover, it can replace with the one part slurry composition 30, and can also obtain the support part 3 in which one part was comprised by this board | substrate by arrange | positioning various board | substrates. According to this method, the optical wiring component 1 shown in FIGS. 3 to 5 can also be efficiently manufactured.

  [3] Next, at least a part of the dispersion medium in the slurry composition 30 stored in the container 9 is discharged out of the container 9. Thereby, the residue mainly composed of dispersoids remains in the container 9. The method for selectively removing the dispersoid from the slurry composition 30 in this way is called a papermaking method. According to the paper making method, even if the slurry composition 30 contains a dispersoid that is relatively large and has a large shape anisotropy like a base fiber, the dispersoid is selected in a state where the dispersoid is uniformly dispersed. Can be taken out. For this reason, the support part 3 excellent in the mechanical characteristics in which the base fiber is uniformly dispersed can be efficiently produced. In addition, according to the papermaking method, the base fiber can be particularly randomly oriented, so that the isotropy of the mechanical properties of the support portion 3 can be particularly enhanced.

  In the case of FIG. 6 (b), the dispersion medium in the slurry composition 30 is selectively discharged through the net 91 provided at the bottom of the container 9. As a result, in the container 9, a residue 3 ′ mainly composed of a dispersoid and the optical waveguide 2 covered therewith remain. At this time, if a pressure difference is formed between regions sandwiching the mesh body 91 by depressurizing the space below the mesh body 91 or pressurizing the inside of the container 9, the dispersion medium can be efficiently discharged. Can be done well.

  These steps are preferably performed by a papermaking method, but after the slurry composition 30 is supplied by other methods such as a casting apparatus, a coater apparatus, a screen printing machine, etc., solid-liquid separation such as centrifugation is performed. It is also possible to substitute by a method of performing a dedispersion medium by a method.

  [4] Next, the remaining residue 3 ′ is taken out from the container 9. And the optical wiring component 1 is obtained by drying the residue 3 '.

  The drying method of the residue 3 ′ is not particularly limited, and natural drying may be used, but forced drying such as heating, infrared irradiation, reduced pressure, and air drying may be used. This drying may be performed in the container 9.

  Moreover, you may make it perform a shaping | molding process with respect to the obtained dry body as needed. Specifically, the dry body can be formed into a desired shape by pressing the mold against the dry body using a press. As a result, the optical wiring component 1 having a desired shape can be obtained.

  In the molding process, the residue 3 ′ may be heated so as to serve as a drying process.

  The heating temperature in the drying process and the heating temperature in the molding process are appropriately adjusted according to the physical properties of the resin. For example, by heating at a temperature equal to or higher than the melting temperature of the resin, the resin in the residue 3 ′ is melted and then solidified (cured). 2 can be more reliably achieved. The resin melting temperature refers to the glass transition temperature or melting point. As an example, the heating temperature is preferably about 140 to 350 ° C., more preferably about 150 to 300 ° C.

  In addition to the molding process by the press as described above, for example, compression molding, calender roll molding, SMC method, injection molding, matched die method, metal, resin, woven fabric, nonwoven fabric, metal foil, metal paste, etc. The dried body may be molded by various molding methods such as lamination molding.

  Further, the residue 3 ′ taken out from the container 9 is again immersed in the slurry composition 30 stored in the container 9 as described in the steps [2] and [3], and then the dispersion medium is removed from the container 9. You may make it perform the process discharged | emitted. Thereby, the dispersoid of the slurry composition 30 can be adhered so that the residue 3 'may be covered. As a result, the support part 3 having a multilayer structure can be formed.

  As mentioned above, although the manufacturing method of the optical wiring component 1 was demonstrated, the form of the container 9 which stores the slurry composition 30 is not limited to what is shown in FIG. The container 9 ′ shown in FIG. 7 is the same as the container 9 shown in FIG. 6 except that the bottom part is composed of the mesh body 91 and the ceiling part is composed of the mesh body 92.

  The mesh 92 provided in the container 9 'is configured to be freely movable up and down in FIG. For this reason, after storing the slurry composition 30 on the mesh body 91 and arranging the optical waveguide 2, the mesh body 92 is lowered to sandwich the slurry composition 30 between the mesh body 91 and the mesh body 92, and the slurry The dispersion medium can be squeezed out of the composition 30. As a result, the dispersion medium can be discharged more efficiently.

  Further, by providing the mesh body 92, the upper surface of the residue is formed by the mesh body 92. For this reason, the container 9 'is useful in that the optical wiring component 1 having superior flatness and smoothness on the upper surface as compared with the one manufactured with the container 9 shown in FIG. 6 can be obtained.

  Furthermore, in the container 9 ′ shown in FIG. 7, the slurry composition 30 that is located above the optical waveguide 2 and from which the dispersion medium is difficult to be discharged from the network 91 can be efficiently discharged from the network 92. . Thereby, since the discharge speed can be made uniform, it is possible to finally obtain the support part 3 having a uniform base fiber concentration.

<Opto-electric hybrid material>
<< First Embodiment >>
Next, a first embodiment of the opto-electric hybrid member of the present invention will be described.

  FIG. 8 is a longitudinal sectional view showing a first embodiment of the opto-electric hybrid member of the present invention. In the following description, the upper side in FIG. 8 is referred to as “upper” and the lower side is referred to as “lower”. In FIG. 8, the longitudinal direction of the optical waveguide 2 is the left-right direction.

  An opto-electric hybrid board (optical opto-electric hybrid member of the present invention) 10 shown in FIG. 8 is provided on the optical wiring component (optical wiring component of the present invention) 1 shown in FIGS. And a conductor layer 4. The conductor layer 4 is formed by depositing, for example, a metal material or a metal oxide material by various vapor deposition methods, printing methods, coating methods, etc., and the constituent materials thereof are copper, aluminum, nickel, chromium, zinc, tin, Examples thereof include conductive materials such as simple metals such as gold and silver, and alloys containing these metal elements. Further, the conductor layer 4 is patterned so that an electric circuit is constructed.

  The optical element 5 is placed on the optical wiring component 1 so as to be electrically connected to the conductor layer 4. Further, a mirror 28 is formed in the optical waveguide 2 shown in FIG. 8 in accordance with the position of the optical element 5. Thereby, the core part in the optical waveguide 2 and the optical element 5 are optically connected via the mirror 28.

  Examples of the optical element 5 include a light emitting element such as a surface emitting laser (VCSEL), a laser diode (LD), a light emitting diode (LED), and an organic EL element, and a light receiving element such as a photodiode (PD, APD).

  Further, the optical wiring component 1 shown in FIG. 8 includes an electric element 6 placed so as to be electrically connected to the conductor layer 4. By mounting such an electric element 6, the driving of the optical element 5 can be controlled, and the opto-electric hybrid board 10 can be formed into an optical module.

  Examples of the electric element 6 include a driver IC, a transimpedance amplifier (TIA), a limiting amplifier (LA), or a combination IC, LSI, and MPU that combine these elements.

  In such an opto-electric hybrid board 10, since the optical waveguide 2 is reinforced by the support portion 3, even when the optical element 5 or the electric element 6 is mounted, the mechanical and thermal influences on the optical waveguide 2. And it becomes difficult. For this reason, there is an advantage that the transmission efficiency of the optical waveguide 2 can be stably maintained and a larger optical element 5 or electrical element 6 can be mounted.

  In addition, when the light transmittance of the support part 3 is low, you may make it form a through-hole (optical via) in the part corresponding to an optical path among the support parts 3 as needed. In that case, a lens may be provided in the through hole as necessary. On the other hand, when the light transmittance of the support portion 3 is high, the lens shape may be formed in a portion corresponding to the optical path on the upper surface of the support portion 3. Thereby, the optical coupling efficiency between the optical element 5 and the mirror 28 can be improved. In forming the lens shape, for example, a method of pressing the mold and transferring the shape is used.

  Further, an electrical connector 41 is provided on the support portion 3 shown in FIG. 8 and is electrically connected to the conductor layer 4. By providing such an electrical connector 41, it is possible to connect an external electrical circuit and the electrical circuit in the opto-electric hybrid board 10. The electrical connector may be a connector conforming to various connector standards or a general-purpose product, and examples thereof include a board-to-board connector, an FPC / FFC connector, a ZIF connector, and a NON-ZIF connector.

  The opto-electric hybrid board 10 may include an optical connector as necessary. By providing such an optical connector, an external optical circuit and the optical waveguide 2 can be optically connected. The optical connector may be a connector that conforms to various connector standards or a general-purpose product. And the like.

  The electrical connector 41 and the optical connector are appropriately selected according to the specifications of the external circuit. Therefore, the opto-electric hybrid board 10 may include only the electrical connector 41, only the optical connector, or both. Further, they may be directly connected by wire or wireless without using a connector or the like.

<< Second Embodiment >>
Next, a second embodiment of the opto-electric hybrid member of the present invention will be described.

  FIG. 9 is a longitudinal sectional view showing a second embodiment of the opto-electric hybrid member of the present invention. In the following description, the upper side in FIG. 9 is referred to as “upper” and the lower side is referred to as “lower”.

  Hereinafter, although 2nd Embodiment is described, it demonstrates centering around difference with 1st Embodiment, The description is abbreviate | omitted about the same matter. In FIG. 9, the same components as those of the first embodiment are denoted by the same reference numerals as those described above, and detailed description thereof is omitted.

  The opto-electric hybrid board 10 shown in FIG. 9 includes the optical waveguide 2, a support portion 3 provided so as to cover the upper surface and side surfaces thereof, and an electric wiring board 8 provided on the lower surface of the optical waveguide 2. It is. A portion of the support portion 3 provided so as to cover the side surface of the optical waveguide 2 is also in contact with the upper surface of the electrical wiring substrate 8. A through hole is provided so as to penetrate the support portion 3 and the optical waveguide 2, and a through wiring 29 is provided in the through hole. By the through wiring 29, the conductor layer 4 provided on the support portion 3 and the electric wiring 81 provided in the electric wiring substrate 8 are electrically connected.

  The electrical wiring substrate 8 includes an insulating substrate 80 and an electrical wiring 81 provided thereon, and a multilayer substrate such as a build-up substrate is also used as necessary.

  Further, the electrical wiring board 8 and the optical wiring component 1 may be bonded with an adhesive, a pressure-sensitive adhesive, an adhesive sheet, a pressure-sensitive adhesive sheet, or the like, and are in close contact with each other due to the adhesion that occurs when the support portion 3 is formed. It may be. In this case, when the slurry composition 30 is made, the electrical wiring board 8 is placed in the container 9 together with the optical waveguide 2 and the paper composition is made, whereby the laminated structure of the electrical wiring board 8 and the optical wiring component 1 shown in FIG. It can be formed in a lump.

  In such an opto-electric hybrid board 10, the same operation and effect as in the first embodiment can be obtained, the difference in mechanical characteristics between the electric wiring board 8 and the optical wiring component 1 is reduced, and the gap between them is peeled off. The effect that it becomes difficult to do is also acquired.

  Further, the electric element 6 may be mounted not on the support portion 3 but on, for example, an electric wiring substrate 8 extended outward from the optical waveguide 2.

  Further, the through wiring 29 may be provided immediately below the terminals of the optical element 5 and the electric element 6. In this case, since the terminals of the optical element 5 and the electric element 6 may be placed on the upper end surface of the through wiring 29, the conductor layer 4 provided on the support portion 3 can be omitted.

«Third embodiment»
Next, a third embodiment of the opto-electric hybrid member according to the present invention will be described.

  FIG. 10 is a longitudinal sectional view showing a third embodiment of the opto-electric hybrid member of the present invention. In the following description, the upper side in FIG. 10 is referred to as “upper” and the lower side is referred to as “lower”.

  Hereinafter, the third embodiment will be described, but the description will focus on the differences from the first and second embodiments, and description of similar matters will be omitted. In FIG. 10, the same components as those in the first and second embodiments are denoted by the same reference numerals as those described above, and detailed description thereof is omitted.

  The opto-electric hybrid board 10 shown in FIG. 10 is the same as that of the first embodiment except that the conductor layer 4 is provided not on the upper surface of the support portion 3 but on the upper surface of the optical waveguide 2. Moreover, the support part 3 is provided so that it may cover other than the electric connector 41 periphery. Therefore, the support portion 3 integrally covers the optical element 5 and the electric element 6 together with the optical waveguide 2 and the like.

  By providing such a support portion 3, the optical element 5 and the electric element 6 are reliably protected in a state where they are mounted on the respective mounting portions. As a result, the weather resistance of the opto-electric hybrid board 10 can be further improved. Further, by appropriately selecting the configuration of the support portion 3, the thermal conductivity of the support portion 3 can be increased, and heat from the optical element 5 and the electric element 6 can be efficiently radiated through the support portion 3.

  In addition, when the optical element 5 and the electric element 6 are subjected to, for example, the papermaking method as described above, by covering the optical element 5 and the electric element 6 with a sealing material such as an underfill material as necessary, Even if these are immersed in the slurry composition 30, the optical element 5 and the electric element 6 can be protected from the dispersion medium.

<Electronic equipment>
Since the optical wiring component of the present invention as described above has excellent mechanical characteristics, it has excellent durability even when it is repeatedly bent, strongly pressed against other members, or twisted. It will be a thing. For this reason, a highly reliable optical module and electronic device can be obtained. In addition, since such an optical wiring component can perform high-quality optical communication even in a curved state, it is possible to save space and reduce the size of the electronic device.

  Examples of the electronic device including the optical wiring component of the present invention include electronic devices such as a mobile phone, a game machine, a router device, a WDM device, a personal computer, a television, and a home server. In any of these electronic devices, it is necessary to transmit a large amount of data at high speed between an arithmetic device such as an LSI and a storage device such as a RAM. Therefore, by providing such an optical device with the optical wiring component of the present invention, problems such as noise and signal deterioration peculiar to electric wiring are solved while ensuring the reliability of communication, and the performance is dramatically improved. Improvement can be expected.

  In addition, the amount of heat generated in the optical wiring portion is greatly reduced as compared with the electrical wiring. For this reason, the electric power required for cooling can be reduced and the power consumption of the whole electronic device can be reduced.

  As mentioned above, although this invention was demonstrated based on embodiment of illustration, this invention is not limited to these.

  For example, the optical wiring component of the present invention only needs to be in contact with a support part including a base fiber, and for example, the support part is in contact with a part in the longitudinal direction of the optical wiring, The support part may not be in contact.

  In FIG. 1, the support portion is configured so that the end face of the optical waveguide is exposed. However, the support portion may be provided so as to cover the entire surface including the end face of the optical waveguide. In this case, if necessary, the support portion can be cut and used so that the end face of the optical waveguide is exposed. As a result, the support portion has not only a reinforcing action but also a protective action for protecting the end face of the optical waveguide from dirt and scratches.

  Further, when the optical waveguide is disposed in the container, a cap may be attached to the end face so that the slurry composition does not adhere to the end face of the optical waveguide, or the end face may be brought into close contact with the inner wall surface of the container.

  Furthermore, the support part may be provided so that an arbitrary component is included or a part thereof is included. For example, the optical connector can be attached to the optical waveguide without using an adhesive or the like by arranging the optical connector so that a part of the optical connector is embedded in the support portion.

DESCRIPTION OF SYMBOLS 1 Optical wiring component 10 Opto-electric hybrid board 2 Optical waveguide 21, 22 Clad layer 23 Core layers 241, 242 Core part 251, 252, 253 Side clad part 26 Support film 27 Cover film 28 Mirror 29 Through wiring 3, 31, 32, 33 Support part 30 Slurry composition 3 'Residue 4 Conductor layer 41 Electrical connector 5 Optical element 6 Electrical element 8 Electrical wiring board 80 Insulating board 81 Electrical wiring 9, 9' Container 91, 92 Network

Claims (11)

  An optical wiring component comprising: an optical wiring; and a support portion provided in contact with the optical wiring and including a base fiber.   2. The optical wiring component according to claim 1, wherein the support portion includes a portion configured to contact two opposite sides of the optical wiring when cut so as to be orthogonal to a longitudinal direction of the optical wiring.   The optical wiring component according to claim 1, wherein the support portion includes a part configured to surround at least a part of the optical wiring when cut so as to be orthogonal to a longitudinal direction of the optical wiring.   The optical wiring component according to claim 3, wherein the support portion includes a portion configured to surround the entire optical wiring when cut so as to be orthogonal to a longitudinal direction of the optical wiring.   The optical wiring component according to claim 1, wherein the support portion further includes a resin.   The optical wiring component according to any one of claims 1 to 5, wherein the plurality of substrate fibers are randomly oriented in the support portion.   The optical wiring component according to any one of claims 1 to 6, wherein the base fiber is an organic fiber.   The optical wiring component according to claim 1, wherein the support portion is formed by a papermaking method.   The optical wiring component according to any one of claims 1 to 8, wherein the optical wiring is mainly composed of a resin material.   An optical / electrical hybrid member comprising: the optical wiring component according to claim 1; and a conductor layer provided on the support portion.   An electronic apparatus comprising the optical wiring component according to claim 1.

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